Component mounting support device and component mounting system

Abstract

The component mounting support device comprises a component information storage unit, a substrate information storage unit and a substitute component extraction unit. The component information storage unit stores information of at least one substitute component in association with a designated component mounted on a substrate. The substrate information storage unit stores requirement conditions required for each type of substrate on which the designated component is mounted. When the designated component is insufficient, the substitute component extraction unit extracts the substitute component that can be mounted on the substrate based on the requirement conditions stored in the substrate information storage unit.

Description

Technical Field

[0001] The present disclosure relates to a component mounting support device and a component mounting system that support a component mounting operation of mounting a component on a substrate. Background Art

[0002] The component mounting device mounts a plurality of types of components on a substrate to produce a mounting substrate. The component mounting device mounts the type of component specified at a given mounting position on the substrate according to a pre-made installation program including information such as the type of component to be mounted on the substrate and the mounting position. In the case of universal components such as resistors and capacitors, the same type of components are sometimes supplied from multiple component manufacturers. In a production factory for mounting substrates, the same type of universal components are sometimes purchased from multiple component manufacturers and stored, and are appropriately switched according to the inventory number and the like and used in the production of mounting substrates. In such a case, universal components from different component manufacturers are managed by changing the component name. Moreover, when the component manufacturer of the universal component to be mounted on the substrate is changed, the component name of the corresponding component in the installation program is changed.

[0003] Changing the installation program is a complicated task, so a method for easily performing component replacement has been proposed (for example, see Patent Document 1). In the method described in Patent Document 1, information associating component names of components that can replace each component is prepared in advance, and the component name of the installation program is changed based on the number of components used and the number of components in stock, thereby automatically replacing the component.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2007-311546 Summary of the invention

[0007] The component mounting support device of the present disclosure includes a component information storage unit, a substrate information storage unit, and a substitute component extraction unit.

[0008] The component information storage unit stores information of at least one substitute component in association with a designated component mounted on a substrate.

[0009] The board information storage unit stores requirement conditions required for each type of board on which a designated component is mounted.

[0010] The substitute component extracting unit extracts a substitute component that can be mounted on the substrate based on the requirement conditions stored in the substrate information storing unit when the designated component is insufficient.

[0011] A component mounting support device according to another aspect of the present disclosure includes a board information storage unit and a substitute component extraction unit.

[0012] The board information storage unit stores information on mountable substitute components for each type of board on which a designated component is mounted.

[0013] The substitute component extracting unit extracts a substitute component that can be mounted on the board based on the substitute component information stored in the board information storing unit when the designated component is insufficient.

[0014] A component mounting system of the present disclosure includes at least one component mounting device, a component information storage section, a substrate information storage section, and a substitute component extraction section.

[0015] The component mounting device mounts components on the substrate.

[0016] The component information storage unit stores information of at least one substitute component in association with a designated component mounted on a substrate.

[0017] The board information storage unit stores requirement conditions required for each type of board on which a designated component is mounted.

[0018] The substitute component extracting unit extracts a substitute component that can be mounted on the substrate based on the requirement conditions stored in the substrate information storing unit when the designated component is insufficient.

[0019] A component mounting system according to another aspect of the present disclosure includes: at least one component mounting device; a substrate information storage unit; and a substitute component extraction unit.

[0020] The component mounting device mounts components on the substrate.

[0021] The board information storage unit stores information on mountable substitute components for each type of board on which a designated component is mounted.

[0022] The substitute component extracting unit extracts a substitute component that can be mounted on the board based on the substitute component information stored in the board information storing unit when the designated component is insufficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural diagram for explaining a component mounting system according to an embodiment.

[0024] Figure 2 It is a structural explanatory diagram of the component mounting device according to the embodiment.

[0025] Figure 3A It is a diagram showing an example of a mounting substrate produced in the component mounting system according to the embodiment.

[0026] Figure 3B It is a diagram showing an example of a mounting substrate produced in the component mounting system according to the embodiment.

[0027] Figure 4 It is a block diagram showing the structure of the component mounting system according to the embodiment.

[0028] Figure 5 This is a diagram showing an example of component information used in the management computer (component installation support device) according to the embodiment.

[0029] Fig. 6A This is a diagram showing an example of board information with requirement conditions used in the management computer (component mounting support device) according to the embodiment.

[0030] Figure 6B This is a diagram showing an example of substrate information with requirement conditions used in the management computer (component mounting support device) according to the embodiment.

[0031] Fig. 7A This is a diagram showing an example of board information with replacement information used in the management computer (component mounting support device) according to the embodiment.

[0032] Figure 7B This is a diagram showing an example of board information with replacement information used in the management computer (component mounting support device) according to the embodiment.

[0033] Figure 8 This is a diagram showing an example of a substitute component selection screen displayed on a display unit included in the management computer (component installation support device) according to the embodiment.

[0034] Fig. 9 It is a diagram showing an example of a substitute parts supply support screen displayed on a mobile terminal included in the parts mounting system according to the embodiment.

[0035] Fig.10 It is a flowchart of the component mounting method of the embodiment. DETAILED DESCRIPTION

[0036] Even if the mounting substrate is installed with the same type of components, there are cases where the components that can be used are limited according to the requirements such as the purpose and quality of the mounting substrate, or the spacing between the mounted components and surrounding components. However, in the prior art including Patent Document 1, the replacement components are determined without considering the requirements of the mounting substrate to be produced. Therefore, it is not limited to satisfying the requirements of the mounting substrate after the component is changed. In addition, if the installation program is pre-made according to each component that can be replaced in order to satisfy the requirements of the mounting substrate, the production time is huge. Therefore, in order to easily change the replacement components while satisfying the requirements of the mounting substrate, there is room for further improvement.

[0037] Hereinafter, the embodiments of the present disclosure will be described in detail using the accompanying drawings. The structures, shapes, etc. described below are examples for explanation and can be appropriately changed according to the specifications of the component installation system, component installation device, and management computer. Hereinafter, the same reference numerals are given to corresponding elements in all the accompanying drawings, and repeated descriptions are omitted. Figure 2 In the following description, the X direction ( Figure 2 The left and right direction in the substrate transport direction), the Y direction orthogonal to the substrate transport direction ( Figure 2 up and down directions in the image).

[0038] First, refer to Figure 1 , the structure of the component mounting system 1 is explained. The component mounting system 1 has the function of mounting components on a substrate to produce a mounting substrate. The component mounting system 1 is composed of a plurality of component mounting devices M1 to M3 connected together. The component mounting devices M1 to M3 are connected to a management computer 3 via a communication network 2. In addition to centrally managing the production of mounting substrates realized by the component mounting system 1, the management computer 3 also creates various parameters used in the component mounting devices M1 to M3. In addition, the component mounting devices of the component mounting system 1 are not limited to three, but may be one, two, or more than four. That is, the component mounting system 1 has at least one component mounting device for mounting components on a substrate.

[0039] exist Figure 1 In the embodiment, the component mounting system 1 includes a portable terminal T used by an operator. The portable terminal T includes a terminal-side communication unit Ta that wirelessly communicates with the management computer 3 to transmit and receive information, and a touch panel Tb that has a display function and an input function. The portable terminal T receives and processes various information transmitted from the management computer 3 and displays it on the touch panel Tb. In addition, the portable terminal T transmits various information input from the touch panel Tb to the management computer 3.

[0040] Next, refer to Figure 2 , the structure of the component mounting devices M1 to M3 is described. The component mounting devices M1 to M3 have the same structure, so the component mounting device M1 is described here. In the component mounting device M1, a substrate conveying mechanism 5 is provided in the center of the base 4 along the X direction. The substrate conveying mechanism 5 conveys the substrate B brought in from the upstream side in the X direction, positions and holds it in the mounting operation position of the mounting head. In addition, the substrate conveying mechanism 5 carries out the substrate B on which the component mounting operation has been completed to the downstream side. Component supply parts 6 are provided on both sides (front and back) of the substrate conveying mechanism 5.

[0041] The component supplying parts 6 on both sides are provided with a plurality of tape feeders 7 arranged in parallel along the X direction. The tape feeders 7 feed the carrier tape having pockets for storing components from the outside of the component supplying part 6 in a pitch-feeding direction toward the substrate conveying mechanism 5 (tape feeding direction), thereby supplying the components to the component taking-out position where the mounting head picks up the components.

[0042] exist Figure 2 In the figure, a Y-axis table 8 having a linear drive mechanism is arranged at both ends of the upper surface of the base 4 in the X direction. On the Y-axis table 8, a beam 9 having a linear mechanism is connected so as to be movable in the Y direction. A mounting head 10 is mounted on the beam 9 so as to be movable in the X direction. The mounting head 10 has a plurality of suction units (not shown) that hold and lift the components and can rotate around a vertical axis (Z axis). A suction nozzle (not shown) that is attached to the lower end of each suction unit for suction and holding is installed.

[0043] The Y-axis table 8 and the crossbeam 9 constitute a mounting head moving mechanism that moves the mounting head 10 in the horizontal direction (X direction, Y direction). The mounting head moving mechanism and the mounting head 10 constitute a component mounting mechanism 11, which performs a component mounting operation of taking out a component from the component supply unit 6 and mounting it at the mounting position of the substrate B. In the component mounting operation, the mounting head 10 moves to the upper side of the component supply unit 6, picks up a given component with a suction nozzle, moves to the upper side of the substrate B, rotates in a given direction, and repeatedly performs a series of turns to mount it at the mounting position.

[0044] exist Figure 2 In the figure, a head camera 12 is mounted on the beam 9, which is located on the lower surface side of the beam 9 and moves integrally with the mounting head 10. As the mounting head 10 moves, the head camera 12 moves above the substrate B positioned at the mounting operation position of the substrate transport mechanism 5, and photographs a substrate mark (not shown) provided on the substrate B to identify the position of the substrate B.

[0045] A component recognition camera 13 is provided between the component supply unit 6 and the substrate transport mechanism 5. When the mounting head 10 that has taken out a component from the component supply unit 6 is located above the component recognition camera 13, the component recognition camera 13 photographs the component held by the suction nozzle from below. In the component mounting operation of the mounting head 10 on the substrate B, the mounting position is corrected in consideration of the recognition result of the substrate B obtained by the head camera 12 and the recognition result of the component obtained by the component recognition camera 13.

[0046] exist Figure 2In the embodiment, a device touch panel 14 operated by an operator is provided on the front surface of the component mounting device M1 at a position where the operator performs the operation. Various information is displayed on the display portion of the device touch panel 14. In addition, the operator uses operation buttons displayed on the display portion of the device touch panel 14 to input data and operate the component mounting device M1.

[0047] Next, refer to Figure 3A , 3B , an example of a mounting substrate produced by the component mounting system 1 is described. Figure 3A The substrate B1 and Figure 3B The substrate B2 shown has the same electrical function but different size. On the substrate B1, a large component D1 and four small components D2 to D5 are mounted at mounting positions P1 to P5, respectively. On the substrate B2, a large component D6 and four small components D7 to D10 are mounted at mounting positions P6 to P10, respectively. The size of the substrate B2 is smaller than that of the substrate B1, and the intervals between components D6 to D10 are also narrower than those between components D1 to D5. That is, the substrate B1 is a low-cost mounting substrate, and the substrate B2 is a high-density mounting substrate.

[0048] Next, refer to Figure 4 , the structure of the component installation system 1 is explained. The management computer 3 has a processing unit 20, a component information storage unit 27 as a storage device, a substrate information storage unit 28, a production information storage unit 29, an input unit 30, a display unit 31 and a wireless communication unit 32. The processing unit 20 is a data processing device such as a CPU (Central Processing Unit), and has a component inventory number acquisition unit 21, a substitute component extraction unit 22, a substitute component determination unit 23, a display processing unit 24, a replenishment position determination unit 25 and a sending processing unit 26 as an internal processing unit. In addition, the management computer 3 does not need to be composed of one computer, but can also be composed of multiple devices. For example, all or part of the storage device can also be set in the cloud via a server.

[0049] The input unit 30 is an input device such as a keyboard, a touch panel, or a mouse, and is used when inputting operation commands and data. The display unit 31 is a display device such as a liquid crystal panel, and displays various data stored in each storage unit. In addition, the display unit 31 displays various information such as an operation screen used for the operation performed by the input unit 30. The wireless communication unit 32 is a wireless communication processing device, and transmits and receives data and the like to and from the portable terminal T by wireless.

[0050] exist Figure 4 In the component information storage unit 27, component information 27a and the like are stored. Figure 5, an example of component information 27a is described. Component information 27a includes "component number" 40, "electrical characteristics (type)" 41, "electrical characteristics (characteristics)" 42, "component size" 43, "electrical characteristic grade" 44, "shape grade" 45, "cost grade" 46, "manufacturer number" 47 and "alternative component number" 48. "Component number" 40 is information that determines the type of component D. "Electrical characteristics (type)" 41 is information that determines the type of electrical characteristics of component D. In this example, "MPU" means a microprocessor, "resistance" means a resistor, and "capacitance" means a capacitor. Here, component D is, for example, Figure 3A , 3B A general term for components D1 to D10, etc.

[0051] "Electrical characteristics (characteristics)" 42 indicates the value (center value) of the electrical characteristics of component D. "Component size" 43 is information that determines the shape and size of component D. For example, component number 40 "E002" is a 10kΩ resistor, and component size 43 "0603" indicates a chip component with a length of 0.6mm and a width of 0.3mm. In addition, component numbers 40 "E001" and "E006" indicate microprocessors "MPU1" with the same electrical characteristics (characteristics) 42, and component size 43 "QFP20*20" indicates a QFP package (Quad Flat Package) of 20mm×20mm as "BGA20*20" is a BGA (Ball Grid Array) package of 20mm×20mm.

[0052] exist Figure 5 In the figure, the "electrical characteristic grade" 44 indicates the accuracy of the electrical characteristics of component D in three levels A to C, and "A" indicates higher accuracy. The "shape grade" 45 indicates the deviation (error) of the outer shape of component D in three levels A to C, and "A" indicates smaller deviation. The "cost grade" 46 indicates the price of component D in three levels A to C, and "A" indicates lower price. In addition, the electrical characteristic grade 44, shape grade 45, and cost grade 46 are not limited to three levels, but can also be five levels. Alternatively, it can be displayed as a numerical value (ratio, absolute value range) instead of a level.

[0053] The "manufacturer number" 47 is information that specifies the component manufacturer that manufactured the component D. The "substitute component number" 48 indicates the component number 40 of the component D that can replace the component D of the component number 40. That is, the component D indicated by the substitute component number 48 is the component D that has the same electrical characteristics (type) 41, electrical characteristics (characteristics) 42, and component size 43 as the component D of the component number 40. If there is no substitute component, "-" is displayed in the "substitute component number" 48.

[0054] For example, in the case of a 10 kΩ resistor whose part number 40 is "E002", three parts D, "E007", "E011" and "E012", are shown as alternative part numbers 48 for part D whose part size 43 is "0603". The manufacturer number 47 of part D whose part number 40 is "E007" is "F004". The manufacturer number 47 of part D whose part number 40 is "E011" is "F006". The part number 40 is "E012" and the manufacturer number 47 is "F007". As described above, when there is an alternative part for part D (specified part) mounted on substrate B, the part information storage unit 27 stores part information 27a that associates information of at least one alternative part (alternative part number 48) with the specified part.

[0055] exist Figure 4 In the substrate information storage unit 28, substrate information 28a with required conditions, substrate information 28b with alternative information, and the like are stored. Here, an example of the substrate information 28a with required conditions will be described with reference to FIG. Fig. 6A yes Figure 3A The example of the substrate information 28a with the required conditions for the substrate B1 shown is as follows: Figure 6B yes Figure 3B An example of substrate information 28a with requirement conditions for substrate B2 is shown. The substrate information 28a with requirement conditions includes "substrate name" 50, "requirement condition" 51, "mounting position coordinates" 52, and "specified component number" 53. "Substrate name" 50 is information that determines the type of mounting substrate to be produced.

[0056] "Required conditions" 51 indicate the conditions required for the mounting substrate. In this example, the required condition 51 for the mounting substrate with the substrate name 50 "B1" is "low price", and the required condition 51 for the mounting substrate with the substrate name 50 "B2" is "high density mounting". "Mounting position coordinates" 52 indicate the mounting position P of the substrate B on which the component D is mounted in XY coordinates, expressed as "X coordinate" 52x and "Y coordinate" 52y. "Specified component number" 53 is information that determines the type of component D to be mounted at the mounting position P, and is related to Figure 5 The part number 40 included in the part information 27a shown is associated.

[0057] For example, in the designated component number 53, the component D1 having the component number 40 of "E001" is designated as the component D to be mounted at the mounting position P1 (X1, Y1) of the mounting substrate having the substrate name 50 of "B1". As described above, the substrate information storage unit 28 stores the substrate information 28a with the required conditions including the required condition 51 required for the substrate B for each type (substrate name 50) of the substrate B on which the designated component determined by the designated component number 53 is mounted.

[0058] Next, an example of the substrate information 28b with alternative information will be described with reference to FIG. 7 . Fig. 7A yes Figure 3A The substrate information 28b with the replacement information of the substrate B1 is shown. Figure 7B yes Figure 3B The substrate information 28b with replacement information of the substrate B2 shown in FIG. The substrate information 28b with replacement information includes "substrate name" 50, "mounting position coordinates" 52, "specified component number" 53, and "substrate number" 54. "Substrate name" 50, "mounting position coordinates" 52, and "specified component number" 53 are the same as the substrate information 28a with requirement conditions described above, and their description is omitted.

[0059] The "substitutable component number" 54 indicates the component number 40 of the substitute component that can be substituted when the component D of the designated component number 53 is out of stock, etc. That is, the component D indicated by the substitute component number 54 is a component D that has the same electrical characteristics (type) 41, electrical characteristics (characteristics) 42, and component size 43 as the component D of the designated component number 53, and the electrical characteristic grade 44, shape grade 45, and cost grade 46 that meet the requirement 51 of the substrate B.

[0060] Thus, the substrate information storage unit 28 stores the substrate information 28b with the substitute information including the information (substrate- ...

[0061] exist Figure 4In the production information storage unit 29, component configuration information 29a, component inventory information 29b, and the like are stored. The component configuration information 29a is information that associates the mounting position (slot) of the tape feeder 7 in the component supply unit 6 of the component mounting devices M1 to M3 provided in the component mounting system 1 with the type of component D supplied from the mounted tape feeder 7. The component configuration information 29a includes information corresponding to the current state of the component mounting devices M1 to M3, information corresponding to the state of the component mounting devices M1 to M3 after the plan adjustment operation for the production of the next mounting substrate, and the like.

[0062] The parts inventory number acquisition unit 21 acquires the remaining number of parts D supplied by the parts mounting devices M1 to M3, and stores it in the production information storage unit 29 as the parts inventory information 29b associated with the type (part number 40) of the parts D. In addition, the parts inventory number acquisition unit 21 also acquires the number of parts D existing in the parts storage cabinet, the planned workbench, etc., which are provided in the production factory of the mounting substrate where the parts mounting devices M1 to M3 are installed, and stores it in the production information storage unit 29 as the parts inventory information 29b associated with the type (part number 40) of the parts D. That is, the parts inventory number acquisition unit 21 acquires the inventory number of parts D in the production factory.

[0063] The component inventory number acquisition unit 21 acquires the inventory number of the component D at a given time (e.g., a fixed interval such as a 5-minute interval, each time the mounting of the component D on a substrate B is completed, etc.). Thus, the component inventory information 29b is updated with the latest inventory number of the component D currently used in the production of the mounting substrate and the component D that can be used in the production factory.

[0064] exist Figure 4 In the case where it is known that a designated component is not available in the production of the mounting substrate, when the designated component is insufficient, or when it is known that the designated component is insufficient in the plan adjustment for producing a new mounting substrate, the substitute component extraction unit 22 extracts a substitute component that is a substitute for the designated component. Specifically, the substitute component extraction unit 22 extracts the substitute component based on the component information 27a, the substrate information 28a with the required condition, and the required condition 51.

[0065] For example, in Figure 6B In the case where the substrate name 50 shown is a substrate "B2", candidates for the replacement component of the designated component (E007) mounted at the mounting position P7 are Figure 5The three components E002, E011, and E012 are shown in the substitute component number 48 whose component number 40 is "E007" in the component information 27a. The requirement 51 of the substrate whose substrate name 50 is "B2" is "high-density mounting". Therefore, the substitute component extraction unit 22 extracts the component whose component number 40 is "E012" and whose shape grade 45 of the required component (E007) is "A" or above as a substitute component. That is, the substitute component extraction unit 22 (substitute component extraction means) extracts substitute components that can be mounted on the substrate B2 based on the requirement 51 stored in the substrate information storage unit 28 when no component is specified.

[0066] In addition, the substitute component extraction unit 22 extracts substitute components based on the substrate information 28b with substitute information. Fig. 6A In the case of a substrate whose substrate name 50 is "B1", the substitute component extraction unit 22 extracts two components E007 and E012 shown in the component number 54 as substitute components for the designated component (E002) mounted at the mounting position P2. That is, the substitute component extraction unit 22 (substitute component extraction means) extracts substitute components that can be mounted on the substrate B1 based on the substitute component information (substitute component number 54) stored in the substrate information storage unit 28 when there is no designated component. When there are multiple substitute component candidates, the substitute component extraction unit 22 extracts two or more substitute components.

[0067] exist Figure 4 In the embodiment, the substitute component determination unit 23 (substitute component determination means) determines one substitute component among the multiple substitute components that can be installed when the substitute component extraction unit 22 (replacement component extraction means) extracts multiple substitute components that can be installed. The substitute component determination unit 23 includes: a determination condition storage unit 23a that stores determination conditions for determining substitute components; and a determination unit 23b that determines one substitute component based on the determination conditions stored in the determination condition storage unit 23a. The determination conditions are set to "prioritize cost", "prioritize inventory", "prioritize quality" and the like for each type of substrate (substrate name 50).

[0068] For example, as substitute parts for the designated part (E002) whose board name 50 is "B1", two substitute parts E007 and E012 are extracted by the substitute part extracting unit 22, and "cost priority" is set as the determination condition. In this case, since the cost level 46 of the substitute part (E007) is "B" and the cost level 46 of the substitute part (E012) is "C", the determination unit 23b determines E007, which is cheaper, as the substitute part.

[0069] Furthermore, when "stock priority" is set as the determination condition, the substitute component determination unit 23 determines the substitute component based on the stock quantity of the component D included in the component stock information 29b. For example, when the substitute component extraction unit 22 extracts two substitute components, the stock quantity of the substitute component (E007) is 100 and the stock quantity of the substitute component (E012) is 1000. When the number of the required designated component (E002) is 300, the substitute component determination unit 23 determines the substitute component (E012) with the required stock as the substitute component. In addition, when determining the substitute component based on the stock quantity of the component D, the expiration date of the component D, the number of days that have passed since the storage of the component D, etc. may be considered.

[0070] exist Figure 4 In the embodiment, the display processing unit 24 displays identification information of a plurality of replaceable components on the display unit 31, and displays a replaceable component selection screen for the operator to select a replaceable component. Figure 8 , an example of the substitute component selection screen 60 displayed on the display unit 31 is described. In the substitute component selection screen 60, a "substrate name" display box 61, a "specified component number" display box 62, a "specified component information" display box 63, a "substrate component information" display box 64, and an "OK" button 65 are displayed. The "substrate name" display box 61 displays the substrate name 50 (B1). The "specified component number" display box 62 displays the specified component number 53 (E002).

[0071] exist Figure 8 In the "specified component information" display box 63, the electrical characteristic level 44 (B), shape level 45 (B), cost level 46 (A), and manufacturer number 47 (F002) of the specified component are displayed. In the "substitute component information" display box 64, the component number 40 (E007, E012), electrical characteristic level 44 (B, A), shape level 45 (A, A), cost level 46 (B, C), manufacturer number 47 (F004, F007), and "select" radio button 64a of the substitute component are displayed. The electrical characteristic level 44, shape level 45, cost level 46, and manufacturer number 47 displayed in the "substitute component information" display box 64 are identification information for identifying the substitute component. In addition, the name of the component manufacturer may be displayed instead of the manufacturer number 47 of the substitute component.

[0072] The operator uses the input unit 30 to select one of the multiple "Select" radio buttons 64a displayed in the "Alternative component information" display box 64 to select an alternative component (here, E007). Thereafter, when the operator uses the input unit 30 to operate the "Confirm" button 65, the information of the selected alternative component is sent to the display processing unit 24. That is, the display processing unit 24 and the display unit 31 constitute an identification information prompting unit that prompts identification information of multiple alternative components that can be installed. In addition, the display processing unit 24, the input unit 30, and the display unit 31 constitute a selection acceptance unit that selects an alternative component from the identification information prompted by the identification information prompting unit. Then, the alternative component determination unit 23 determines the one alternative component selected by the operator as the alternative component.

[0073] exist Figure 4 In the above, the replenishment position determination unit 25 determines the replenishment position of the substitute component determined by the substitute component determination unit 23 based on the component configuration information 29a. That is, the replenishment position determination unit 25 determines which position of the component supply unit 6 of which component mounting device M1 to M3 the substitute component is to be replenished. At this time, the replenishment position determination unit 25 also determines the replenishment method of the substitute component. For example, when the substitute component is supplied to the tape feeder 7 after the specified component is supplied, the replenishment position determination unit 25 determines the replenishment method so that the carrier tape of the substitute component is joined (splicing) with the end of the carrier tape of the specified component supplied by the tape feeder 7.

[0074] The transmission processing unit 26 displays information including the substitute component information determined by the substitute component determination unit 23 and the replenishment location and replenishment method of the substitute component determined by the replenishment location determination unit 25 on the touch panel Tb of the portable terminal T via the wireless communication unit 32 as a substitute component replenishment support screen. Fig. 9 , an example of a substitute component supply support screen 70 displayed on the touch panel Tb of the portable terminal T used by the operator is described. The substitute component supply support screen 70 displays a "substrate name" display frame 71, a "substrate component number" display frame 72, a "substrate component supply operation information" display frame 73, and an "understand" button 74. The "substrate name" display frame 71 displays the substrate name 50 (B1). The "substrate component number" display frame 72 displays the component number 40 (E007) of the substitute component (information of the substitute component).

[0075] exist Fig. 9In the "substitute component replenishment operation information" display box 73, information supporting the substitute component replenishment operation performed by the operator is displayed in text. In this example, the operation of the substitute component at the storage position and the operation at the replenishment position are displayed. That is, as the operation at the storage position, it is indicated to "take out the substitute component from shelf number 3 of the second storage cabinet." In addition, as the operation at the replenishment position, it is indicated to "install the tape feeder in the fifteenth slot on the front side of the second component installation device to replenish the substitute component." That is, the replenishment position determination unit 25 determines the fifteenth slot on the front side of the second component installation device with an empty slot as the replenishment position for the substitute component.

[0076] When the operator operates the touch panel Tb to operate the "Know" button 74, the meaning is transmitted to the transmission processing unit 26, and the touch panel Tb shifts to the next screen. In this way, the replenishment position determination unit 25 (replenishment position determination unit) determines the replenishment position of the replacement component mounted on the substrate B based on the information (component configuration information 29a) related to the configuration of the components supplied to the component mounting devices M1 to M3 that mount the components D on the substrate B. The transmission processing unit 26 and the wireless communication unit 32 constitute a transmission unit that transmits the replenishment position together with the information of the replacement component mounted on the substrate B.

[0077] exist Figure 4 In the case where the replenishment position determination unit 25 determines the position where the replacement component can be installed in the component mounting devices M1 to M3 as the replenishment position, the transmission processing unit 26 sends a command to the component mounting devices M1 to M3 including the replenishment position to install the replacement component instead of the designated component. That is, when the designated component to be mounted on the substrate B is exhausted, a command is sent to the component mounting devices M1 to M3 where the replacement component can be installed to install the replacement component at the mounting position P of the designated component on the substrate B.

[0078] In this way, the component mounting system 1 including at least one component mounting device M1 to M3 for mounting the component D on the substrate B and the management computer 3 (component mounting support device) has a component mounting device M1 to M3 capable of mounting a substitute component determined by the substitute component determination unit 23, and the component mounting device M1 to M3 mounts the substitute component on the substrate B. Thus, the component D (specified component) whose designation has been completed can be easily changed to a substitute component that meets the requirements of the mounting substrate.

[0079] Next, refer to Fig.10, the component mounting method in the component mounting system 1 is described. In the component mounting system 1, a component mounting operation (ST1: component mounting operation process) of mounting a designated component on the substrate B is performed. When the production of all the mounting substrates is not completed (NO in ST2), it is determined whether there are insufficient designated components (ST3). When there are no insufficient designated components (NO in ST3), the component mounting operation process (ST1) is returned to continue the component mounting operation. When there are insufficient designated components (YES in ST3), the substitute component extraction unit 22 extracts a substitute component that can be mounted on the substrate B (ST4). When multiple substitute components are extracted (YES in ST5), the substitute component determination unit 23 determines one of the multiple substitute components as the substitute component (ST6).

[0080] When a replacement component is determined (NO in ST5, ST6), the supply position determination unit 25 determines the supply position of the replacement component (ST7). When the determined supply position is already in a state where the replacement component can be supplied (YES in ST8), the transmission processing unit 26 sends a command to the component mounting device M1 to M3 to install the replacement component (ST9), and returns to the component mounting operation process (ST1) to continue the component mounting operation. When the determined supply position is not in a state where the replacement component can be supplied (NO in ST8), the transmission processing unit 26 sends information instructing the replenishment operation to the portable terminal T used by the operator (ST10), and returns to the component mounting operation process (ST1) to continue the component mounting operation.

[0081] As described above, the management computer 3 of the present embodiment is a component mounting support device including the component information storage unit 27, the substrate information storage unit 28, and the substitute component extraction unit 22 (substitute component extraction means).

[0082] The component information storage unit 27 stores information of at least one substitute component in association with a designated component to be mounted on the substrate B.

[0083] The board information storage unit 28 stores the requirement conditions 51 required for the board B for each type of the board B on which the designated component is mounted.

[0084] The substitute component extracting unit 22 (substitute component extracting means) extracts substitute components that can be mounted on the substrate B based on the requirement conditions 51 stored in the substrate information storage unit 28 when there is no designated component (when there is insufficient).

[0085] Thus, the designated component D (designated component) can be easily changed to a replacement component that meets the required condition 51 of the mounting substrate.

[0086] According to the present disclosure, it is possible to easily replace a component that is designated to be finished with a replacement component that meets the requirements of the mounting substrate.

[0087] Industrial Applicability

[0088] The component mounting support device and component mounting system disclosed in the present invention have the effect of being able to easily replace a designated finished component with a replacement component that meets the requirements of the mounting substrate, and are useful in the field of mounting components on substrates.

[0089] -Explanation of symbols-

[0090] 1 Component mounting system

[0091] 2 Communication Network

[0092] 3 Management computer (component installation support device)

[0093] 4 abutments

[0094] 5. Substrate transport mechanism

[0095] 6. Parts Supply Department

[0096] 7 Belt Feeder

[0097] 8 Y-axis table

[0098] 9 Beam

[0099] 10 Mounting head

[0100] 11 Component installation mechanism

[0101] 12 cameras

[0102] 13 Parts recognition camera

[0103] 14. Device touch panel

[0104] 20 Processing Department

[0105] 21 Parts inventory acquisition unit

[0106] 22 Replacement parts extraction department

[0107] 23 Alternative parts determination department

[0108] 23a Determine the condition storage unit

[0109] 23b Determination

[0110] 24 Display processing unit

[0111] 25 Supply Position Determination Unit

[0112] 26 Sending Processing Department

[0113] 27 Component information storage unit

[0114] 27a Component Information

[0115] 28. Substrate information storage unit

[0116] 28a Substrate information

[0117] 28b Substrate Information

[0118] 29 Production Information Storage Department

[0119] 29a Component configuration information

[0120] 29b Parts Stock Information

[0121] 30 Input section

[0122] 31 Display

[0123] 32 Wireless Communications Department

[0124] 40 Part Number

[0125] 43 Component size

[0126] 44 Electrical Grade

[0127] 45 Shape Grade

[0128] 46 Cost Level

[0129] 48 Replacement Part Number

[0130] 50 Board name

[0131] 51 Requirements

[0132] 53 Specify part number

[0133] 54 can replace part number

[0134] 60 Replacement parts selection screen

[0135] 61~64 Display frame

[0136] 64a Radio button

[0137] 65 Button

[0138] 70 Replacement parts supply support screen

[0139] 71~73 Display frame

[0140] 74 Buttons

[0141] B substrate

[0142] B1 base plate

[0143] B2 substrate

[0144] D Part

[0145] D1 Components

[0146] D2 Parts

[0147] D6 Parts

[0148] D7 Parts

[0149] M1~M3 component mounting device

[0150] P Installation position

[0151] P1~P10 Installation position

[0152] T Portable Terminal

[0153] Ta terminal side communication unit

[0154] Tb touch panel.

Claims

1. A component installation support device, comprising: a component information storage unit that stores information of at least one replacement component in association with a designated component mounted on the substrate; a substrate information storage unit that stores requirement conditions required for the substrate for each type of the substrate on which the designated component is mounted; and The substitute component extracting unit extracts the substitute component that can be mounted on the substrate based on the requirement condition stored in the substrate information storing unit when the designated component is insufficient.

2. The component mounting support device according to claim 1, wherein: The component mounting support device further includes a substitute component specifying unit that specifies one substitute component among the plurality of substitute components that can be mounted, when the substitute component extracting unit extracts a plurality of substitute components that can be mounted.

3. The component mounting support device according to claim 2, wherein: The alternative component determination unit includes: a determination condition storage unit storing a determination condition for determining the replacement component; and The determination unit determines the one substitute component based on the determination condition stored in the determination condition storage unit.

4. The component mounting support device according to claim 2, wherein: The component installation support device further comprises: an identification information prompting unit for prompting identification information of the plurality of installable replacement parts; and The selection accepting unit selects the one replacement component from the identification information presented by the identification information presenting unit, The substitute component specifying unit specifies the one substitute component selected by the selection accepting unit.

5. The component mounting support device according to claim 2, wherein: The component installation support device further includes a component inventory number acquisition unit for acquiring the inventory number of components. The substitute component identification unit identifies the one substitute component based on the acquired inventory quantity of the component.

6. A component installation support device, comprising: a substrate information storage unit for storing information on replaceable components that can be mounted for each type of substrate on which a designated component is mounted; a substitute component extracting unit that extracts the substitute component that can be mounted on the substrate based on the substitute component information stored in the substrate information storing unit when the designated component is insufficient; an identification information presenting unit for presenting identification information of the plurality of installable substitute components when the substitute component extracting unit extracts a plurality of installable substitute components; a selection accepting unit for selecting a replacement component from the identification information presented by the identification information presenting unit; and The substitute component specifying unit specifies one substitute component selected by the selection accepting unit from among the plurality of installable substitute components.

7. The component mounting support device according to claim 1 or claim 6, wherein: The component mounting support device further includes a transmission unit configured to transmit information on the replacement component mounted on the substrate.

8. The component mounting support device according to claim 7, wherein: The component mounting support device further includes a replenishment position determination unit that determines a replenishment position of the replacement component mounted on the substrate based on information related to the arrangement of components supplied to a component mounting device that mounts the component on the substrate. The transmitting unit transmits the replenishment position together with information on the replacement component mounted on the substrate.

9. A component mounting system comprising: at least one component mounting device for mounting the component on the substrate; a component information storage unit that stores information of at least one replacement component in association with a designated component mounted on the substrate; a substrate information storage unit for storing requirement conditions required for the substrate for each type of the substrate on which the designated component is mounted; and The substitute component extracting unit extracts the substitute component that can be mounted on the substrate based on the requirement condition stored in the substrate information storing unit when the designated component is insufficient.

10. The component mounting system according to claim 9, wherein: The component mounting system further includes a substitute component specifying unit that specifies, when a plurality of mountable substitute components are extracted by the substitute component extracting unit, one of the plurality of mountable substitute components.

11. A component mounting system comprising: at least one component mounting device for mounting the component on the substrate; a substrate information storage unit for storing information on replaceable components that can be mounted for each type of the substrate on which the designated component is mounted; a substitute component extracting unit that extracts the substitute component that can be mounted on the substrate based on the substitute component information stored in the substrate information storing unit when the designated component is insufficient; an identification information presenting unit for presenting identification information of the plurality of installable substitute components when the substitute component extracting unit extracts a plurality of installable substitute components; a selection accepting unit for selecting a replacement component from the identification information presented by the identification information presenting unit; and The substitute component specifying unit specifies one substitute component selected by the selection accepting unit from among the plurality of installable substitute components.

12. The component mounting system according to claim 10 or claim 11, wherein: When there is the component mounting device capable of mounting the determined one substitute component, the component mounting device mounts the one substitute component on the substrate.

Images