Die Bonding Head Angle Correction Mechanism and Die Bonding Equipment

Abstract

The present invention discloses a die bonding head angle correction mechanism and a die bonding device, which relate to the field of semiconductor devices. Among them, the die bonding head angle correction mechanism includes: an adsorption mechanism, a first driving module, and a control mechanism. The adsorption mechanism is provided with a rotating shaft, and one end of the rotating shaft is used for adsorbing wafers. The first driving module is connected to the adsorption mechanism, and the first driving module is used to drive the rotating shaft to rotate to a preset angle so as to correct the angle of the wafers. The control mechanism is electrically connected to the adsorption mechanism and the first driving module respectively. After one end of the rotating shaft of the adsorption mechanism adsorbs the wafers, the rotating shaft of the adsorption mechanism is controlled to rotate through the mutual cooperation of the control mechanism and the first driving module, so as to correct the angle of the wafers. This die bonding head angle correction mechanism can save material and assembly costs and further improve the efficiency of die bonding head angle correction.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to a die bonder head angle correction mechanism and a die bonder. Background Art

[0002] The die bonder is a key equipment in the LED packaging production line. The die bonding process is as follows: the dispensing device first dispenses glue at the die bonding station of the substrate, then the swing arm (also called the crystal picking arm) picks up the wafer from the wafer ring, and then transfers it to the die bonding station where the glue has been dispensed. When all the qualified wafers on the wafer ring are picked up, the wafer ring is removed from the wafer table, and a new wafer ring is placed again, the angle is calibrated, and then the die bonding starts.

[0003] Currently, for the LED wafer angle correction mechanism, the wafer is picked up from the wafer ring and horizontally placed on the upper surface of the ceramic vacuum platform. Under the effective positioning of the vacuum adsorption and fixation of the ceramic vacuum platform and the precise control of the motor rotation by the cooperation of the induction sheet and the inductor, the rotation angle of the ceramic vacuum platform is precisely controlled, thereby correcting the wafer angle. After the correction is completed, the corrected wafer is sucked by the crystal picking arm and then transferred to the die bonding station. However, the correction process of this angle correction mechanism is cumbersome, such a configuration will lead to an increase in production costs and low correction efficiency. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present invention provides a die bonder head angle correction mechanism and a die bonder, which can save material and assembly costs and further improve the efficiency of die bonder head angle correction.

[0005] According to an embodiment of the present invention, the die bonder head angle correction mechanism includes:

[0006] An adsorption mechanism, the adsorption mechanism is provided with a rotating shaft, and one end of the rotating shaft is used for adsorbing the wafer;

[0007] A first driving module, connected to the adsorption mechanism, the first driving module is used to drive the rotating shaft to rotate to a preset angle so as to correct the angle of the wafer;

[0008] A control mechanism, electrically connected to the adsorption mechanism and the first driving module respectively.

[0009] According to the die bonder head angle correction mechanism of the embodiment of the present invention, it has at least the following beneficial effects: after one end of the rotating shaft of the adsorption mechanism adsorbs the wafer, the control mechanism and the first driving module cooperate with each other to control the rotation of the rotating shaft of the adsorption mechanism, thereby correcting the wafer angle. This die bonder head angle correction mechanism can save material and assembly costs and further improve the efficiency of die bonder head angle correction.

[0010] According to some embodiments of the present invention, the adsorption mechanism includes a bearing mounting seat, at least one first bearing, a bearing fixing piece, and a nut. At least one of the first bearings is disposed within the bearing mounting seat. The rotating shaft passes through the bearing mounting seat, and at least one of the first bearings, the bearing fixing piece, and the nut are sequentially sleeved on the rotating shaft.

[0011] According to some embodiments of the present invention, the die bonding head angle correction mechanism further includes a vertical driving device and a mounting seat. The first driving module is disposed on the mounting seat. The adsorption mechanism and the vertical driving device are respectively connected to the mounting seat. The vertical driving device is configured to drive the adsorption mechanism and the first driving module to move up and down.

[0012] According to some embodiments of the present invention, the adsorption mechanism further includes: a first sensing component. The first sensing component includes a home position sensor, a first sensing piece, and a first fixing seat. The home position sensor is connected to the mounting seat. The first sensing piece and the first fixing seat are sequentially sleeved on the other end of the rotating shaft. The first sensing piece can be correspondingly arranged with the home position sensor so that the home position sensor can obtain the home position of the rotating shaft. The home position sensor is electrically connected to the control mechanism.

[0013] According to some embodiments of the present invention, the vertical driving device includes a crank-slider mechanism and a second driving module. One end of the crank-slider mechanism is connected to the mounting seat, and the other end is connected to the second driving module. The second driving module is configured to drive the crank-slider mechanism to move up and down to drive the mounting seat to move up and down.

[0014] According to some embodiments of the present invention, the die bonding head angle correction mechanism further includes a second sensing component. The mounting seat includes a cross rail, a first rail mounting seat, a second rail mounting seat, and a base. The cross rail is located between the first rail mounting seat and the second rail mounting seat and is respectively fixedly connected to the first rail mounting seat and the second rail mounting seat. The second rail mounting seat and the first driving module are both disposed on the base. One end of the second rail mounting seat is connected to the crank-slider mechanism. The adsorption mechanism is connected to the first rail mounting seat. The second sensing component is electrically connected to the control mechanism. When the second driving module is configured to drive the crank-slider mechanism to move downward to a preset position, one end of the rotating shaft is used to adsorb the wafer, and the first rail mounting seat moves relative to the second rail mounting seat. The second sensing component can detect the preset movement position of the first rail mounting seat so that the control mechanism controls the second driving module to drive the crank-slider mechanism to move upward.

[0015] According to some embodiments of the present invention, the second sensing assembly includes a first sensor, a second sensing sheet, at least one buffer member, and a fixing plate. The fixing plate is disposed on the second rail mounting seat, and one side of the fixing plate is fixedly connected to the crank-slider mechanism, and the other side is fixedly connected to the second sensing sheet. The first sensor is connected to the first rail mounting seat. A first groove corresponding to the buffer member is provided on the first rail mounting seat. One end of the buffer member is disposed in the first groove, and the other end abuts against the fixing plate. When the first rail mounting seat moves relative to the second rail mounting seat, the buffer member is compressed so that the first sensor can be correspondingly disposed with the second sensing sheet.

[0016] According to some embodiments of the present invention, the die bonder head angle correction mechanism further includes a transmission device. One end of the transmission device is connected to the first driving module, and the other end is connected to the rotating shaft. The transmission device is used to drive the rotating shaft to rotate.

[0017] According to some embodiments of the present invention, the die bonder head angle correction mechanism includes a driving module fixing seat. The driving module fixing seat is disposed on the base. The first driving module is disposed on the driving module fixing seat, and the driving shaft of the first driving module penetrates through the driving module fixing seat and the base. The driving shaft is drivingly connected to one end of the transmission device.

[0018] The die bonder according to the second aspect embodiment of the present invention includes the die bonder head angle correction mechanism according to the first aspect embodiment of the present invention above, and further includes a lateral driving device. The lateral driving device is used to drive the die bonder head angle correction mechanism to move laterally.

[0019] The die bonder according to the embodiment of the present invention has at least the following beneficial effects: By adopting the above-mentioned die bonder head angle correction mechanism, after one end of the rotating shaft of the adsorption mechanism adsorbs the wafer, the die bonder head angle correction mechanism is moved by the lateral driving device, and the rotation of the rotating shaft of the adsorption mechanism can be controlled by the mutual cooperation of the control mechanism and the first driving module while moving to correct the wafer angle. After the correction is completed, the wafer is transferred to the die bonding station. This kind of die bonder can not only save materials and assembly costs, but also further improve the efficiency of die bonder head angle correction.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings are used to provide a further understanding of the technical solutions of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solutions of the present invention and do not constitute a limitation to the technical solutions of the invention.

[0022] Figure 1 It is a side view of the die bonding head angle correction mechanism provided by an embodiment of the present invention;

[0023] Figure 2 It is a schematic structural diagram of the die bonding head angle correction mechanism provided by an embodiment of the present invention;

[0024] Figure 3 It is a specific schematic diagram of the rotating shaft and the components sleeved thereon according to an embodiment of the present invention;

[0025] Figure 4 It is a specific schematic diagram of the cross guide rail and its mounting seat according to an embodiment of the present invention.

[0026] Reference numerals:

[0027] Die bonding head angle correction mechanism 10, second driving module 100, support plate 110;

[0028] Third induction piece 120, third induction piece fixing seat 121, second sensor 122;

[0029] Linear guide rail 130, slider 131, eccentric block 132, first arm body 133, second arm body 134;

[0030] Cross guide rail 140, first guide rail mounting seat 141, second guide rail mounting seat 142;

[0031] First sensor 150, second induction piece 151, fixing plate 152, buffer 153;

[0032] Base 160;

[0033] First driving module 200;

[0034] First induction piece 210, first fixing seat 211, origin sensor 212;

[0035] Bearing mounting seat 220, first bearing 221, bearing fixing piece 222, nut 223;

[0036] Driving pulley 230, driven pulley 231, synchronous belt 232;

[0037] Rotating shaft 240, suction attachment 241;

[0038] Driving module fixing seat 250. Detailed implementation manners

[0039] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where like or similar reference numerals denote like or similar elements or elements having like or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0040] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. In addition, features defined as "first", "second" may explicitly or implicitly include one or more of such features.

[0041] In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more. In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the term "connection" should be understood in a broad sense. For example, it may be a fixed connection or a movable connection, or a detachable connection or an inseparable connection, or an integral connection; it may be a mechanical connection, an electrical connection or a connection capable of mutual communication; it may be directly connected or indirectly connected through an intermediate medium, and may be the communication inside two elements, indirect communication or the interaction relationship between two elements.

[0042] In the description of the present invention, unless otherwise clearly defined, words such as "arrangement", "installation", "connection", etc. should be understood in a broad sense. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0043] The die bonder is a key device in the LED packaging production line. The die bonding process is as follows: The dispensing device first dispenses glue at the die bonding station of the substrate, and then the swing arm (also called the crystal picking arm) picks up the wafer from the wafer ring and transfers it to the die bonding station where glue has been dispensed. When all the qualified wafers on the wafer ring have been picked up, the wafer ring is removed from the wafer table, and a new wafer ring is placed on it. After aligning the angle, the die bonding starts again.

[0044] Currently, for the LED chip angle correction mechanism, the chip is taken out from the chip ring and horizontally placed on the upper surface of the ceramic vacuum platform. Under the effective positioning of the vacuum adsorption and fixation of the ceramic vacuum platform, and with the cooperation of the induction sheet and the inductor, the rotation of the motor is precisely controlled, and then the rotation angle of the ceramic vacuum platform is precisely controlled to correct the chip angle. After the correction is completed, the corrected chip is sucked by the chip picking arm and then transferred to the die bonding station. However, the correction process of this angle correction mechanism is cumbersome, such a configuration will lead to an increase in production costs and low correction efficiency.

[0045] Therefore, the present invention proposes a die bonding head angle correction mechanism 10 and a die bonding device, which can save material and assembly costs and further improve the efficiency of die bonding head angle correction.

[0046] The following refers to Figures 1 to 3 Describe the die bonding head angle correction mechanism 10 according to an embodiment of the present invention.

[0047] Refer to Figure 1 , the die bonding head angle correction mechanism 10 includes: an adsorption mechanism, a first driving module 200 and a control mechanism. The adsorption mechanism is provided with a rotating shaft 240, and one end of the rotating shaft 240 is used for adsorbing the chip; the first driving module 200 is connected to the adsorption mechanism, and the first driving module 200 is used to drive the rotating shaft 240 to rotate to a preset angle so as to correct the angle of the chip; the control mechanism is electrically connected to the adsorption mechanism and the first driving module 200 respectively. After one end of the rotating shaft of the adsorption mechanism adsorbs the chip, the rotation of the rotating shaft of the adsorption mechanism is controlled through the mutual cooperation of the control mechanism and the first driving module 200 to correct the chip angle. This die bonding head angle correction mechanism 10 can save material and assembly costs and further improve the efficiency of die bonding head angle correction.

[0048] In an embodiment of the present invention, the end of the rotating shaft 240 for adsorbing the chip is provided with an adsorbing member 241, and above the rotating shaft 240 is provided a rotating air pipe joint for accessing vacuum gas to provide vacuum suction for the adsorbing member 241. The rotating air pipe joint is electrically connected to the control mechanism; in some embodiments, the end of the rotating shaft 240 for adsorbing the chip is provided with a magnetic attraction structure for adsorbing the chip; in other embodiments, the end of the rotating shaft 240 for adsorbing the chip is provided with a suction cup for adsorbing the chip; in this regard, it is not limited to this embodiment.

[0049] It should be noted that the preset angle is the angle capable of correcting the adsorbed chip.

[0050] It should be noted that the first driving module 200 can be a pneumatic motor or an electric motor, or other driving modules. In this regard, the embodiments of the present invention do not make limitations here.

[0051] Refer to Figure 1 AndFigure 3 It can be understood that the adsorption mechanism includes a bearing mounting seat 220, at least one first bearing 221, a bearing fixing piece 222 and a nut 223. At least one first bearing 221 is arranged in the bearing mounting seat 220. The rotating shaft 240 passes through the bearing mounting seat 220, and at least one first bearing 221, the bearing fixing piece 222 and the nut 223 are sequentially sleeved on the rotating shaft 240. The bearing mounting seat 220 is used for mounting the bearing, i.e., the first bearing 221, and the bearing fixing piece 222 and the nut 223 are used for fixing the bearing. By arranging the bearing, the control mechanism and the first driving module 200 cooperate with each other, so that the rotating shaft 240 rotates, and further corrects the angle of the wafer.

[0052] In this embodiment, there are two first bearings 221, and both of the two first bearings 221 are arranged in the bearing mounting seat 220 and are sequentially sleeved on the rotating shaft 240. In some embodiments, the number of the first bearings 221 can be one or other numbers, and is not limited to this embodiment.

[0053] It should be noted that both the bearing fixing piece 222 and the nut 223 are sleeved on the rotating shaft 240. The bearing fixing piece 222 is arranged on the bearing mounting seat 220, and the nut 223 is arranged on the bearing fixing piece 222.

[0054] It can be understood that the die head angle correction mechanism 10 further includes a vertical driving device and a mounting seat. The first driving module 200 is arranged on the mounting seat. The adsorption mechanism and the vertical driving device are respectively connected to the mounting seat, and the vertical driving device is used for driving the adsorption mechanism and the first driving module 200 to move up and down. By driving the adsorption mechanism to move downward through the vertical driving device, one end of the rotating shaft 240 adsorbs the wafer. After adsorbing the wafer, the adsorption mechanism is driven to move upward through the vertical driving device, and then the rotating shaft 240 is driven to rotate through the first driving module 200 to correct the angle of the wafer.

[0055] Refer to Figure 2 It can be understood that the adsorption mechanism further includes: a first sensing component, and the first sensing component includes an origin sensor 212, a first sensing piece 210 and a first fixing seat 211. The origin sensor 212 is connected to the mounting seat, and the first sensing piece 210 and the first fixing seat 211 are sequentially sleeved on the other end of the rotating shaft 240. The first sensing piece 210 can be correspondingly arranged with the origin sensor 212, so that the origin sensor 212 can obtain the origin position of the rotating shaft 240. The origin sensor 212 is electrically connected to the control mechanism. Through the first sensing piece 210 and the origin sensor 212, the rotating shaft 240 can return to the origin position before or after each wafer correction.

[0056] In this embodiment, the first induction sheet 210 is semi-circular. Both the first induction sheet 210 and the first fixing base 211 are provided with through holes corresponding to the rotating shaft 240, so that the first fixing base 211 and the first induction sheet 210 are sleeved on the driving shaft of the second driving module 100 in sequence. The first fixing base 211 and the first induction sheet 210 are both sleeved on the rotating shaft 240. The first fixing base 211 is arranged on the nut 223, and the first induction sheet 210 is arranged on the first fixing base 211. It should be noted that the first induction sheet 210 can also be of other shapes, not limited to this embodiment.

[0057] In some embodiments, after one end of the rotating shaft 240 adsorbs the wafer, the first driving module 200 drives the rotating shaft 240 to rotate, so that the first induction sheet 210 can be correspondingly arranged with the origin sensor 212. At this time, the origin sensor 212 senses the first induction sheet 210, thereby obtaining the origin position of the rotating shaft 240. It can be understood that when the origin sensor 212 senses the first induction sheet 210, the current position corresponding to the rotating shaft 240 can be defined as the origin position, so that after one end of the rotating shaft 240 adsorbs the wafer, it can be further rotated to the origin position, and then the angle correction of the wafer is realized.

[0058] In some other embodiments, first, the first driving module 200 drives the rotating shaft 240 to rotate, so that the first induction sheet 210 can be correspondingly arranged with the origin sensor 212. At this time, the origin sensor 212 senses the first induction sheet 210, thereby obtaining the origin position of the rotating shaft 240. When the rotating shaft 240 is at the origin position, then control one end of the rotating shaft 240 to adsorb the wafer. With such a setting, it is convenient for the die bonding head angle correction mechanism 10 to accurately control the rotation of the rotating shaft 240 through the preset origin position during the process of adsorbing the wafer, so as to ensure the accuracy of the wafer angle correction.

[0059] It can be understood that the vertical driving device includes a crank-slider mechanism and the second driving module 100. One end of the crank-slider mechanism is connected to the mounting seat, and the other end is connected to the second driving module 100. The second driving module 100 is used to drive the crank-slider mechanism to move up and down, so as to drive the mounting seat to move up and down. Since the adsorption mechanism and the first driving module 200 are both connected to the mounting seat, driving the crank-slider mechanism to move up and down by the second driving module 100 can drive the mounting seat, the first driving module 200 and the adsorption mechanism to move up and down as a whole, so as to drive one end of the rotating shaft 240 in the adsorption mechanism to move up and down, so as to realize the adsorption or placement of the wafer.

[0060] Refer to Figure 1 and Figure 2, in this embodiment, the crank-slider mechanism includes a support plate 110, an eccentric block 132, a slider 131, a first arm body 133, a second arm body 134, a second bearing, a third bearing, and a linear guide 130. The support plate 110 is provided with a circular hole corresponding to the drive shaft of the second drive module 100. The second drive module 100 is fixedly connected to the support plate 110, and the drive shaft of the second drive module 100 passes through the circular hole. The drive shaft of the second drive module 100 is fixedly passed through the eccentric block 132. One side of the second arm body 134 is fixedly provided with a slider 131. The side of the support plate 110 facing the second arm body 134 is fixedly provided with a linear guide 130, and the slider 131 is slidably arranged on the linear guide 130. One end of the first arm body 133 is movably connected to one end of the second arm body 134 through a second bearing, and the other end of the first arm body 133 is movably connected to the eccentric block 132 through a third bearing. The second arm body 134 is also fixedly connected to the mounting seat.

[0061] Referring to Figure 1 and Figure 2 , in this embodiment, it further includes a third sensing component, and the third sensing component is electrically connected to the control mechanism.

[0062] The third sensing component includes a third sensing piece 120, a third sensing piece fixing seat 121, and a second sensor 122. The third sensing piece fixing seat 121 is fixedly sleeved on the drive shaft of the second drive module 100, and the third sensing piece 120 is connected to the third sensing piece fixing seat 121. The second sensor 122 is fixedly connected to the support plate 110, and the second sensor 122 can be correspondingly arranged with the third sensing piece 120 so that the second sensor 122 obtains the moving position of the crank-slider mechanism. The second sensor 122 is electrically connected to the control mechanism. The third sensing piece 120 is semicircular, and both the third sensing piece 120 and the third sensing piece fixing seat 121 are provided with through holes corresponding to the drive shaft of the second drive module 100, so that the third sensing piece fixing seat 121 and the third sensing piece 120 are sequentially sleeved on the drive shaft of the second drive module 100.

[0063] In some embodiments, the crank-slider mechanism includes a crank and a rocker. When the second drive module 100 drives the crank-slider mechanism to move up and down, it can be the crank that is active, or it can be the rocker that is active.

[0064] It should be noted that the second drive module 100 can be a pneumatic motor or an electric motor, or it can be other drive devices. The embodiments of the present invention do not make any limitations here.

[0065] Referring to Figure 1 and Figure 4, it can be understood that the die bonding head angle correction mechanism 10 further includes a second sensing component. The mounting seat includes a cross rail 140, a first rail mounting seat 141, a second rail mounting seat 142, and a base 160; the cross rail 140 is located between the first rail mounting seat 141 and the second rail mounting seat 142 and is fixedly connected to the first rail mounting seat 141 and the second rail mounting seat 142 respectively. The second rail mounting seat 142 and the first driving module 200 are both arranged on the base 160. One end of the second rail mounting seat 142 is connected to the crank-slider mechanism, and the adsorption mechanism is connected to the first rail mounting seat 141; the second sensing component is electrically connected to the control mechanism. When the second driving module 100 is used to drive the crank-slider mechanism to move downward to a preset position, one end of the rotating shaft 240 is used to adsorb the wafer, and the first rail mounting seat 141 moves relative to the second rail mounting seat 142. The second sensing component can detect the preset movement position of the first rail mounting seat 141, so that the control mechanism controls the second driving module 100 to drive the crank-slider mechanism to move upward. The cross rail 140, the first rail mounting seat 141, and the second rail mounting seat 142 are provided so that, in cooperation with the second sensing component, when one end of the rotating shaft 240 adsorbs the wafer, it plays a role in protecting the wafer.

[0066] It should be noted that through the control of the control mechanism, the second driving module 100 can be controlled to drive the crank-slider mechanism to move up and down, and when the second sensing component can detect the preset movement position of the first rail mounting seat 141, the control mechanism controls the second driving module 100 to drive the crank-slider mechanism to move upward.

[0067] In this embodiment, the bearing mounting seat 220 is fixedly connected to the first rail mounting seat 141. When one end of the rotating shaft 240 is used to adsorb the wafer, since the second driving module 100 drives the crank-slider mechanism to move downward to a preset position at this time, the preset position can be the lowest point position corresponding to the downward movement. By adsorbing the wafer, a downward pressure is generated on the wafer, and then an upward thrust is generated on the entire adsorption mechanism relative to the wafer. Since a cross rail 140 is provided between the first rail mounting seat 141 and the second rail mounting seat 142, and the bearing mounting seat 220 in the adsorption mechanism is fixedly connected to the first rail mounting seat 141, the generated thrust pushes the adsorption mechanism to move upward, and the first rail mounting seat 141 also gradually moves upward relative to the second rail mounting seat 142, so that the second sensing component can detect the preset movement position of the first rail mounting seat 141, that is, the preset rising position of this embodiment. When the first rail mounting seat 141 reaches the preset movement position, the second sensing component sends a detection signal to the control mechanism. After receiving the detection signal, the control mechanism controls the second driving module 100 to drive the crank-slider mechanism to move upward. Thus, the adsorption of the wafer is completed, playing a role in protecting the wafer.

[0068] It should be noted that the preset position is the lowest position that the crank-slider mechanism can reach when moving vertically; the preset motion position is the motion position when the first guide rail mounting seat 141 moves relative to the second guide rail mounting seat 142 so that the second sensing component can detect it.

[0069] Referring to Figure 1 and Figure 2 , it can be understood that the second sensing component includes a first sensor 150, a second sensing piece 151, at least one buffer 153 and a fixing plate 152. The fixing plate 152 is arranged on the second guide rail mounting seat 142, and one side of the fixing plate 152 is fixedly connected to the crank-slider mechanism, and the other side is fixedly connected to the second sensing piece 151. The first sensor 150 is connected to the first guide rail mounting seat 141. A first groove corresponding to the buffer 153 is provided on the first guide rail mounting seat 141. One end of the buffer 153 is arranged in the first groove, and the other end abuts against the fixing plate 152. When the first guide rail mounting seat 141 moves relative to the second guide rail mounting seat 142, the buffer 153 is compressed so that the first sensor 150 can be correspondingly arranged with the second sensing piece 151.

[0070] When the first guide rail mounting seat 141 of this embodiment moves relative to the second guide rail mounting seat 142, the buffer 153 will be subjected to a compressive force. When the first guide rail mounting seat 141 moves to the preset motion position, the first sensor 150 on the first guide rail mounting seat 141 at this time can sense the second sensing piece 151, so that the control mechanism controls the second driving module 100 to drive the crank-slider mechanism to move upward. By providing the buffer 153, when one end of the rotating shaft 240 adsorbs the wafer, there is a buffering force on the adsorption of the wafer, thereby protecting the wafer from being crushed and preventing the first guide rail mounting seat 141 from damaging the fixing plate 152. It can be understood that this embodiment can adsorb the wafer by means of vacuum adsorption so that one end of the rotating shaft 240 adsorbs the wafer.

[0071] It should be noted that in this embodiment, the second sensing piece 151 is rectangular, and the second sensing piece 151 can also be of other shapes, not limited to this embodiment.

[0072] It should be noted that the buffer 153 can be a spring, a buffer rubber, or other buffer objects with buffering functions; the fixing plate 152 is used to fix and limit the buffer 153.

[0073] It should be noted that when the number of the buffer members 153 is multiple, the first guide rail mounting seat 141 is respectively provided with first grooves corresponding to the multiple buffer members 153 one by one. One ends of the multiple buffer members 153 are all arranged in the corresponding first grooves, and the other ends are all abutted against the fixing plate 152. In this embodiment, the buffer members 153 are springs, and there are two springs. The first guide rail mounting seat 141 is respectively provided with two first grooves corresponding to the two springs. One ends of the two springs are all arranged in the first grooves, and the other ends are all abutted against the fixing plate 152.

[0074] It can be understood that the die bonder head angle correction mechanism 10 further includes a transmission device. One end of the transmission device is connected to the first driving module 200, and the other end is connected to the rotating shaft 240. The transmission device is used to drive the rotating shaft 240 to rotate. The first driving module 200 drives the rotating shaft 240 to rotate through the transmission device to correct the angle of the wafer.

[0075] Refer to Figure 1 , in this embodiment, the transmission device includes a driving wheel 230, a driven wheel 231 and a synchronous belt 232. The driving wheel 230 is sleeved on the driving shaft of the first driving module 200 and is located at the lower end of the base 160. The driven wheel 231 is sleeved on one end of the rotating shaft 240. The synchronous belt 232 is sleeved on the driving wheel 230 and the driven wheel 231. The driving wheel 230 is driven to rotate by the first driving module 200, such as a motor. The driving wheel 230 drives the driven wheel 231 to rotate through the synchronous belt 232, thereby driving the rotating shaft 240 to rotate to correct the angle of the wafer.

[0076] It should be noted that the first driving module 200 can also directly drive the rotating shaft 240 to rotate, or drive the rotating shaft 240 to rotate in a way of being driven by gears, that is, drive the rotating shaft 240 to rotate through gear meshing. It can also be other ways for the first driving module 200 to drive the rotating shaft 240 to rotate, which is not limited to this embodiment and will not be elaborated here.

[0077] Refer to Figure 1 , it can be understood that the die bonder head angle correction mechanism 10 includes a driving module fixing seat 250. The driving module fixing seat 250 is arranged on the base 160. The first driving module 200 is arranged on the driving module fixing seat 250, and the driving shaft of the first driving module 200 passes through the driving module fixing seat 250 and the base 160. The driving shaft is drivingly connected to one end of the transmission device. The driving module fixing seat 250 is used to install and fix the first driving module 200.

[0078] It should be noted that through holes corresponding to the driving shaft of the first driving module 200 are provided on both the base 160 and the driving module fixing seat 250, so that the driving shaft of the first driving module 200 passes through the driving module fixing seat 250 and the base 160.

[0079] Another embodiment of the present invention further provides a die bonding device, which includes a die bonding head angle correction mechanism 10 as in any of the above embodiments, and further includes a lateral driving device for driving the die bonding head angle correction mechanism 10 to move laterally.

[0080] By adopting the die bonding head angle correction mechanism 10, after one end of the rotating shaft 240 of the adsorption mechanism adsorbs the wafer, the die bonding head angle correction mechanism 10 is moved by the lateral driving device, and while moving, the rotation of the rotating shaft 240 of the adsorption mechanism is controlled through the cooperation of the control mechanism and the first driving module 200 to correct the wafer angle. After the correction is completed, the wafer is transferred to the die bonding station. The lateral driving device can drive the die bonding head angle correction mechanism 10 to move horizontally back and forth, thereby realizing the functions of adsorbing, angle correcting and placing the wafer.

[0081] This die bonding device can not only save material and assembly costs, but also further improve the efficiency of die bonding head angle correction.

[0082] In another embodiment, a vision detection mechanism can also be provided. For example, the vision detection mechanism is a camera. The vision detection mechanism is electrically connected to the total control device in the die bonding device. After one end of the rotating shaft 240 of the adsorption mechanism adsorbs the wafer, the origin position of the rotating shaft 240 is obtained through the origin sensor 212 in the first sensing component, that is, the rotating shaft 240 is controlled to return to the origin position. Then, the lateral driving device drives the die bonding head angle correction mechanism 10 to move laterally so that one end of the rotating shaft 240 is located above the vision detection mechanism. The vision detection mechanism is used to obtain the image information corresponding to the wafer adsorbed on one end of the rotating shaft 240 and send the image information to the total control device. After receiving the image information, the total control device processes the image information to obtain the angle information corresponding to the current wafer adsorbed by the rotating shaft 240, and then according to the target angle and this angle information, obtains the preset angle corresponding to the wafer, that is, this preset angle is the angle to be corrected corresponding to the wafer. The total control device sends the preset angle to the control mechanism, and the control mechanism then controls the first driving module 200 to drive the rotating shaft 240 to rotate to this preset angle, thereby correcting the angle of the wafer.

[0083] It can be understood that the lateral driving device is electrically connected to the total control device.

[0084] In one embodiment, the control mechanism in the die bonding head angle correction mechanism 10 can also be the total control device of the die bonding device, which is not specifically limited herein.

[0085] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0086] The above is the preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can still be made, and these improvements and refinements are also regarded as the protection scope of the present invention.

[0087] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention, and the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A die bonding head angle correction mechanism, characterized in that, Including: An adsorption mechanism, the adsorption mechanism is provided with a rotating shaft, and one end of the rotating shaft is used for adsorbing a wafer; A first driving module, connected to the adsorption mechanism, the first driving module is used to drive the rotating shaft to rotate to a preset angle so as to correct the angle of the wafer; A control mechanism, electrically connected to the adsorption mechanism and the first driving module respectively; The die bonder head angle correction mechanism further includes a vertical driving device and a mounting seat, the first driving module is arranged on the mounting seat, the adsorption mechanism and the vertical driving device are respectively connected to the mounting seat, the vertical driving device is electrically connected to the control mechanism, and the vertical driving device is used to drive the adsorption mechanism and the first driving module to move up and down; The adsorption mechanism includes: a first sensing component, the first sensing component includes an origin sensor, a first sensing piece and a first fixing seat, the origin sensor is connected to the mounting seat, the first sensing piece and the first fixing seat are sequentially sleeved on the other end of the rotating shaft, the first sensing piece can be correspondingly arranged with the origin sensor so that the origin sensor can obtain the origin position of the rotating shaft, and the origin sensor is electrically connected to the control mechanism; The vertical driving device includes a crank-slider mechanism and a second driving module, one end of the crank-slider mechanism is connected to the mounting seat, and the other end is connected to the second driving module, and the second driving module is used to drive the crank-slider mechanism to move up and down to drive the mounting seat to move up and down.

2. The die bonding head angle correction mechanism according to claim 1, characterized in that, The adsorption mechanism includes a bearing mounting seat, at least one first bearing, a bearing fixing piece and a nut, at least one of the first bearings is arranged in the bearing mounting seat, the rotating shaft passes through the bearing mounting seat, and at least one of the first bearings, the bearing fixing piece and the nut are sequentially sleeved on the rotating shaft.

3. The die bonder head angle correction mechanism according to claim 1, characterized in that, The die bonder head angle correction mechanism further includes a second sensing component, the mounting seat includes a cross rail, a first rail mounting seat, a second rail mounting seat and a base; the cross rail is located between the first rail mounting seat and the second rail mounting seat and is respectively fixedly connected to the first rail mounting seat and the second rail mounting seat, the second rail mounting seat and the first driving module are both arranged on the base, one end of the second rail mounting seat is connected to the crank-slider mechanism, and the adsorption mechanism is connected to the first rail mounting seat; the second sensing component is electrically connected to the control mechanism, when the second driving module is used to drive the crank-slider mechanism to move downward to a preset position, one end of the rotating shaft is used for adsorbing the wafer, and the first rail mounting seat moves relative to the second rail mounting seat, and the second sensing component can detect the preset movement position of the first rail mounting seat so that the control mechanism controls the second driving module to drive the crank-slider mechanism to move upward.

4. The die bonding head angle correction mechanism according to claim 3, wherein, The second sensing component includes a first sensor, a second sensing piece, at least one buffer member, and a fixing plate. The fixing plate is disposed on the second guide rail mounting seat, and one side of the fixing plate is fixedly connected to the crank-slider mechanism, and the other side is fixedly connected to the second sensing piece. The first sensor is connected to the first guide rail mounting seat. A first groove corresponding to the buffer member is provided on the first guide rail mounting seat. One end of the buffer member is disposed in the first groove, and the other end abuts against the fixing plate. When the first guide rail mounting seat moves relative to the second guide rail mounting seat, the buffer member is compressed so that the first sensor can be correspondingly arranged with the second sensing piece.

5. The die bonding head angle correction mechanism according to claim 3, characterized in that, The die bonder head angle correction mechanism further includes a transmission device. One end of the transmission device is connected to the first driving module, and the other end is connected to the rotating shaft. The transmission device is used to drive the rotating shaft to rotate.

6. The die bonding head angle correction mechanism according to claim 5, characterized in that, The die bonder head angle correction mechanism includes a driving module fixing seat. The driving module fixing seat is disposed on the base. The first driving module is disposed on the driving module fixing seat, and a driving shaft of the first driving module penetrates through the driving module fixing seat and the base. The driving shaft is drivingly connected to one end of the transmission device.

7. A die bonding device, characterized in that, Comprising: A lateral driving device; The die bonder head angle correction mechanism according to any one of claims 1 to 6, wherein the lateral driving device is used to drive the die bonder head angle correction mechanism to move laterally.

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