A device and method for slicing solar cells

Abstract

The present invention discloses a cell slicing device and method. The cell slicing device includes a moving carrier mechanism and a laser cutting mechanism; the moving carrier mechanism is reciprocally movably arranged, and at least two adsorption partitions are arranged on the bearing surface; the laser cutting mechanism includes at least two grooving and self-breaking devices, the grooving and self-breaking devices are arranged in sequence along the moving direction, the grooving positions of the grooving and self-breaking devices correspond to a section of area passing through the gaps between the adsorption partitions, and each grooving position is located on a different extension line. The cell slicing method includes: placing the cell on the moving carrier mechanism, with the slicing lines to be processed corresponding to the gaps between the adsorption partitions respectively; controlling the adsorption partition during any slicing operation to adsorb one of the cell areas on both sides of the slicing line to be processed on the cell; moving the moving carrier mechanism past the grooving and self-breaking devices to groove and split the cell along the corresponding slicing line on the cell, and the cell is divided into cell slices along the slicing line under the action of its own stress. The present invention can realize more than two slicing operations at the same station.

Description

Technical Field

[0001] The present invention belongs to the field of photovoltaic cell production, and particularly relates to a device and method for slicing cell wafers more than twice. Background Art

[0002] Currently, with the refined production and processing of cell wafers, the slicing of cell wafers is increasing, and the slices are getting smaller and smaller. According to the current production devices and methods, separate operations for slicing cell wafers multiple times are required, resulting in low production efficiency. Moreover, multiple movements are needed, significantly increasing production costs and being unfavorable for modern assembly line operations. Summary of the Invention

[0003] A main object of the present invention is to provide a device and method for slicing cell wafers, which can perform slicing operations on cell wafers more than twice, complete slicing of cell wafers more than twice at the same station, improve work efficiency, and reduce production costs.

[0004] To achieve the above-mentioned invention object, the present invention adopts the following technical solutions:

[0005] As one aspect of the present invention, a device for slicing cell wafers is provided. The device for slicing cell wafers includes: a moving and carrying mechanism and a laser cutting mechanism;

[0006] The moving and carrying mechanism is reciprocally movable and includes a carrying surface for carrying cell wafers, and at least two separately controlled adsorption zones are provided on the carrying surface;

[0007] The laser cutting mechanism includes at least two grooving and self-breaking devices, and the at least two grooving and self-breaking devices are arranged in sequence along the moving direction of the moving and carrying mechanism. Moreover, the grooving position of any one of the grooving and self-breaking devices corresponds to a section of area passing through the gap between two adsorption zones, and the grooving positions of each grooving and self-breaking device are located on different extension lines.

[0008] In the present invention, the grooving position of any one of the grooving and self-breaking devices corresponds to a section of area passing through the gap between two adsorption zones, and the grooving positions of each grooving and self-breaking device are located on different extension lines. During the movement of the moving and carrying mechanism, through different adsorption operations and in cooperation with the actions of the grooving and self-breaking devices, slicing operations more than twice are realized, improving work efficiency and reducing production costs.

[0009] As an embodiment of the present invention, the moving and carrying mechanism further includes a shaping module, and the shaping module is arranged adjacent to the carrying surface and includes at least two-direction pushing and pulling structures.

[0010] As an embodiment of the present invention, the pushing and pulling structure includes at least one of a first pushing and pulling structure and a second pushing and pulling structure;

[0011] The first pushing and pulling structure includes an adsorber, which can telescopically pass through the adsorption partition and move under the drive of a power device;

[0012] The second pushing and pulling structure includes a push plate, which is arranged near the edge of the bearing surface and moves under the drive of a power device.

[0013] In an embodiment of the present invention, the moving bearing mechanisms are arranged in pairs. The moving bearing mechanisms arranged in pairs share a moving guide rail, and there is a height difference between the moving bearing mechanisms arranged in pairs during the common movement process.

[0014] In an embodiment of the present invention, the adsorption partition includes holes arranged in an array, and the holes are communicated with an adsorption device.

[0015] In an embodiment of the present invention, the bearing surface includes two or more adjacent planes, and the two or more adjacent planes are respectively located on independently arranged bearing blocks.

[0016] In an embodiment of the present invention, the number of grooving self-breaking devices is N, and N is greater than or equal to 2. They are arranged in groups along the advancing direction of the moving bearing mechanism in slices, and the number of the Nth group of grooving self-breaking devices is 2 to the power of (N - 1).

[0017] In another aspect of the present invention, there is provided a method for slicing solar cells. The method for slicing solar cells uses any one of the above-mentioned solar cell slicing devices, and includes the following steps:

[0018] Place the solar cell on the moving bearing mechanism, and the slicing lines to be sliced of the solar cell are respectively located between the respective adsorption partitions of the moving bearing mechanism;

[0019] For any slicing, control the adsorption of some adsorption partitions on the moving bearing mechanism, so that one of the regions on both sides of the slicing line of the solar cell corresponding to the grooving self-breaking device of this slicing is adsorbed;

[0020] Control the moving bearing mechanism to move past the grooving self-breaking device. During the movement, use the grooving self-breaking device to groove and crack along the corresponding slicing line on the solar cell, and the solar cell is divided into solar cell slices under its own stress along the slicing line.

[0021] In the present invention, for any slicing operation, the adsorption operation of the corresponding adsorption zone is controlled so that one of the cell regions on both sides of the slicing line corresponding to the grooving self-breaking device of the current slicing operation on the cell is adsorbed. The grooving self-breaking device is used to groove and break the cell along the corresponding slicing line on the cell. Under the action of its own stress, during the movement of the cell, in cooperation with the action of the grooving self-breaking device, more than two slicing operations are achieved, improving the working efficiency and reducing the production cost.

[0022] As an embodiment of the present invention, the cell slicing method further includes:

[0023] When a slicing operation is completed and the next slicing operation is required, the adsorption of some adsorption zones on the moving carrier mechanism is adjusted so that one of the cell regions on both sides of the slicing line corresponding to the grooving self-breaking device of the next slicing operation on the cell is adsorbed.

[0024] As an embodiment of the present invention, the cell slicing method further includes:

[0025] When a slicing operation is completed and the next slicing operation is required, the unadsorbed slices formed by the last slicing operation are regularized;

[0026] After the regularization is completed, the step of adjusting the adsorption of some adsorption zones on the moving carrier mechanism is executed. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0028] Figure 1 It is a three-dimensional structure schematic diagram of the cell detection and slicing device.

[0029] Figure 2 It is a top view structure schematic diagram of the cell detection and slicing device.

[0030] Figure 3 It is a three-dimensional structure schematic diagram of the moving carrier mechanism in the cell detection and slicing device.

[0031] Figure 4 It is a front view structure schematic diagram of the moving carrier mechanism in the cell detection and slicing device.

[0032] Figure 5 It is a top view structure schematic diagram of the moving carrier mechanism in the cell detection and slicing device.

[0033] The reference numerals are described as follows:

[0034] 1. Conveying mechanism; 2. Detection mechanism; 3. Handling mechanism; 4. Mobile bearing mechanism; 40. Bracket; 401. Track; 41. First bearing device; 411. First driver; 412. First connector; 413. First bearing surface; 4131. First adsorption surface; 4132. Second adsorption surface; 42. Second bearing device; 421. Second driver; 422. Second connector; 423. Second bearing surface; 4231. Third adsorption surface; 4232. Fourth adsorption surface; 51. First slotting self-breaking device; 52. Second slotting self-breaking device; 53. Third slotting self-breaking device; 6. Unloading mechanism; 7. Loading gripper. DETAILED DESCRIPTION

[0035] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0036] In the following description of different examples of the present invention, reference is made to the accompanying drawings, which form a part of the present invention and in which different exemplary structures, systems and steps that can implement multiple aspects of the present invention are shown by way of example. It should be understood that other specific schemes of components, structures, exemplary devices, systems and steps can be used, and structural and functional modifications can be made without departing from the scope of the present invention. Moreover, although the terms "top", "bottom", "front", "rear", "side", etc. may be used in this specification to describe different exemplary features and elements of the present invention, these terms are used herein only for convenience, such as the direction of the examples described in the accompanying drawings. Nothing in this specification should be construed as requiring a specific three-dimensional orientation of the structure to fall within the scope of the present invention.

[0037] Figure 1 It is a schematic diagram of the three-dimensional structure of the battery cell detection and separation device. Figure 2 This is a schematic diagram of the top view of the battery cell detection and separation device.

[0038] like Figure 1 and Figure 2 As shown, the battery cell slicing device disclosed in this embodiment of the present invention includes: a conveying mechanism 1, a detection mechanism 2, a handling mechanism 3, a mobile supporting mechanism 4, a first laser cutting mechanism 51, a second laser cutting mechanism 52, a unloading mechanism 6 and a loading gripper 7.

[0039] The conveying mechanism 1 is used to convey solar cells. The loading gripper 7 grabs the solar cells from the conveying mechanism 1 and transfers them to the detection mechanism 2. The detection mechanism 2 detects the solar cells. The handling mechanism 3 is used to transfer the detected solar cells to the moving carrier mechanism 4. The first laser cutting mechanism 51 and the second laser cutting mechanism 52 are used to slot the solar cells on the moving carrier mechanism 4. The unloading mechanism 6 unloads the sliced solar cell slices after slicing is completed.

[0040] In other embodiments of the present invention, the conveying mechanism 1, the detection mechanism 2, the handling mechanism 3, the unloading mechanism 6 and the loading gripper 7 are not necessary, or other structural forms can be adopted to achieve the same.

[0041] Figure 3 It is a schematic three-dimensional structure diagram of the moving carrier mechanism in the solar cell detection and slicing device. Figure 4 It is a schematic front view structure diagram of the moving carrier mechanism in the solar cell detection and slicing device. Figure 5 It is a schematic top view structure diagram of the moving carrier mechanism in the solar cell detection and slicing device.

[0042] As Figures 3 to 5 shown, the moving carrier mechanism in the solar cell detection and slicing device of this embodiment includes: a bracket 40, a first carrier 41 and a second carrier 42. Among them, the bracket 40 is used to support the first carrier 41 and the second carrier 42, and a track 401 is provided on its upper part, and the track 401 facilitates guiding the movement of the first carrier 41 and the second carrier 42.

[0043] In this embodiment, the first carrier 41 includes a first driver 411, a first connector 412 and a first carrier surface 413. Among them, the first driver 411 provides power for the first carrier 41 and can be a motor. The first connector 412 is used to support the first carrier surface 413 and is in transmission cooperation with the first driver 411, which can be the cooperation of a lead screw and a nut, or other transmission forms. The first carrier surface 413 includes a first adsorption surface 4131 and a second adsorption surface 4132. The first adsorption surface 4131 and the second adsorption surface 4132 each include at least one adsorption zone, and these two adsorption zones are each independently controlled to turn on and off their connection with the adsorption device to form an adsorption effect and a non-adsorption effect on this adsorption surface. In other embodiments, it can also be three adsorption zones, four adsorption zones, six adsorption zones, eight adsorption zones, which are determined according to actual needs.

[0044] In one embodiment, the first adsorption surface 4131 and the second adsorption surface 4132 may each include only one adsorption partition, and each adsorption partition is only the size of a quarter of a cell. When cutting the cell, an adsorption partition on the first adsorption surface 4131 adsorbs the cell to position it, and the self - cutter cuts the cell; after the regularizing device regularizes and positions the cell cut off on the second adsorption surface 4132, an adsorption partition on the second adsorption surface 4132 adsorbs and positions the regularized cell, and the first adsorption partition 4131 and the second adsorption partition 4132 adsorb and position the cell and move it to the subsequent process, waiting for the subsequent process to cut.

[0045] In this embodiment, the second carrier 42 includes a second driver 421, a second connector 422, and a second bearing surface 423. Among them, the second driver 421 provides power for the second carrier 42 and can be a motor. The second connector 422 is used to support the second bearing surface 423 and is in transmission cooperation with the second driver 421, which can be the cooperation of a lead screw and a nut, or other transmission forms. The second bearing surface 423 includes a third adsorption surface 4231 and a fourth adsorption surface 4232, and the third adsorption surface 4231 and the fourth adsorption surface 4232 each include at least one adsorption partition, forming at least two adsorption partitions in total. These two adsorption partitions are both controlled separately to connect and disconnect with the adsorption device to form adsorption and non - adsorption effects on this adsorption surface. In other embodiments, it can also be three adsorption partitions, four adsorption partitions, six adsorption partitions, eight adsorption partitions, which are determined according to actual needs.

[0046] In this embodiment, the first carrier 41 and the second carrier 42 share a moving guide rail 401, and the first carrier 41 is higher than the second carrier 42 to facilitate their reciprocating insertion. In some embodiments, only one carrier can be used. In this embodiment, two carriers are used, and the efficiency can be doubled. In addition, the first carrier 41 can also be lower than the second carrier 42, as long as there is a height difference between the two to facilitate passing through each other without interference.

[0047] In this embodiment, the first carrier 41 and the second carrier 42 in the moving carrier mechanism 4 include a regularizing module (not shown in the figure). The regularizing module of the first carrier 41 abuts against the second adsorption surface 4132, and the regularizing module of the second carrier 42 abuts against the fourth adsorption surface 4232, and each includes at least a two - direction push - pull structure.

[0048] In this embodiment, each push - pull structure includes at least one of a first push - pull structure and a second push - pull structure. Among them, the first push - pull structure includes an adsorber, and the adsorber can telescopically pass through the adsorption partition and move under the drive of a power device; the second push - pull structure includes a push plate, and the push plate is arranged near the edge of the bearing surface and moves under the drive of a power device.

[0049] In this embodiment, each adsorption partition includes holes arranged in an array, and the holes are communicated with the adsorption device. The first adsorption surface 4131 and the second adsorption surface 4132 form an adjacent first bearing surface 413. In this embodiment, the first adsorption surface 4131 and the second adsorption surface 4132 are respectively located on two independently arranged bearing blocks. Similarly, the third adsorption surface 4231 and the fourth adsorption surface 4232 form an adjacent second bearing surface 423. In this embodiment, the third adsorption surface 4231 and the fourth adsorption surface 4232 are respectively located on two independently arranged bearing blocks.

[0050] In this embodiment, the laser cutting mechanism includes two groups of grooving self-breaking devices. The number of the first group of grooving self-breaking devices is one, which is the first grooving self-breaking device 51. The number of the second group of grooving self-breaking devices is two, which are the second grooving self-breaking device 52 and the third grooving self-breaking device 53 arranged in parallel. In other embodiments, it can also be that each group of grooving self-breaking devices is one, or the first group has one grooving self-breaking device, the second group has two grooving self-breaking devices, the third group has four grooving self-breaking devices, and the number of grooving self-breaking devices in the Nth group is 2 to the (N - 1)th power, which is determined according to the actual situation.

[0051] The grooving self-breaking devices of each group are arranged in sequence along the moving direction of the battery wafer, and the grooving position of any grooving self-breaking device corresponds to a section of the area passing through the gap between two adsorption partitions. The grooving positions of each grooving self-breaking device are located on different extension lines. In this way, each laser cutting mechanism can perform grooving operations on the moving battery wafer more than twice. In this embodiment, it is twice, and in other embodiments, it can also be three times or more.

[0052] In the present invention, the grooving position of any grooving self-breaking device corresponds to a section of the area passing through the gap between two adsorption partitions. The grooving positions of each grooving self-breaking device are located on different extension lines. During the movement of the moving bearing mechanism, through different adsorption operations and in cooperation with the actions of the grooving self-breaking devices, slicing is achieved through adsorption and the stress of the battery wafer, and the number of times is more than twice, improving work efficiency and reducing production costs.

[0053] In addition, the present invention also provides a method for slicing a battery wafer. The method for slicing a battery wafer uses the battery wafer slicing device as described in the above embodiment, and includes the following steps:

[0054] Place the battery wafer on the moving bearing mechanism, and the slicing lines to be sliced of the battery wafer are respectively located between the adsorption partitions of the moving bearing mechanism;

[0055] For any slicing, control the adsorption of some adsorption partitions on the moving bearing mechanism, so that one of the battery wafer areas on both sides of the slicing line corresponding to the grooving self-breaking device of this slicing on the battery wafer is adsorbed;

[0056] Control the movement of the moving carrier mechanism to pass through the grooving self-breaking device. During the movement, use the grooving self-breaking device to groove and break the slices along the corresponding slicing lines on the battery cell, and the battery cell is divided into battery sub-pieces along the slicing lines under its own stress.

[0057] In an embodiment of the present invention, the method for slicing the battery cell further includes:

[0058] When a slicing is completed and the next slicing is required, adjust the adsorption of some adsorption zones on the moving carrier mechanism so that one of the battery cell regions on both sides of the slicing line corresponding to the grooving self-breaking device for the next slicing on the battery cell is adsorbed.

[0059] In an embodiment of the present invention, the method for slicing the battery cell further includes:

[0060] When a slicing is completed and the next slicing is required, regularize the unadsorbed sub-pieces formed by the last slicing;

[0061] After the regularization is completed, execute the step of adjusting the adsorption of some adsorption zones on the moving carrier mechanism.

[0062] In the present invention, for any slicing, control the adsorption operation of the corresponding adsorption zone so that one of the battery cell regions on both sides of the slicing line corresponding to the grooving self-breaking device for this slicing on the battery cell is adsorbed. Use the grooving self-breaking device to groove and break the slices along the corresponding slicing lines on the battery cell, so that under its own stress, during the movement, cooperate with the action of the grooving self-breaking device to achieve more than two slicing operations, improve work efficiency, and reduce production costs.

[0063] Those of ordinary skill in the technical field to which the present invention pertains should understand that the specific structures and technological processes shown in the above specific implementation parts are merely exemplary and not restrictive. Moreover, those of ordinary skill in the technical field to which the present invention pertains can combine the various technical features shown above in various possible ways to form new technical solutions, or make other modifications, and all fall within the scope of the present invention.

Claims

1. A cell slicing device, characterized in that, The wafer slicing device for battery cells includes: a moving and carrying mechanism and a laser cutting mechanism; The moving and carrying mechanism is reciprocally movable, and includes a carrying surface for carrying the battery cells. At least two separately controlled adsorption zones are provided on the carrying surface. The moving and carrying mechanism further includes a rectifying module which is arranged in contact with the carrying surface and includes at least a pushing and pulling structure in two directions. The pushing and pulling structure includes at least one of a first pushing and pulling structure and a second pushing and pulling structure. The first pushing and pulling structure includes an adsorber which can telescopically pass through the adsorption zone and move under the drive of a power device. The second pushing and pulling structure includes a push plate which is arranged near the edge of the carrying surface and moves under the drive of a power device. The laser cutting mechanism includes at least two grooving and self-breaking devices which are arranged in sequence along the moving direction of the moving and carrying mechanism. The grooving position of any one of the grooving and self-breaking devices corresponds to a section of the area passing through the gap between two adsorption zones, and the grooving positions of each grooving and self-breaking device are located on different extension lines.

2. The cell slicing device according to claim 1, characterized in that, The moving and carrying mechanisms are arranged in pairs. The moving and carrying mechanisms arranged in pairs share a moving guide rail, and there is a height difference between the moving and carrying mechanisms arranged in pairs during the common movement process.

3. The cell slicing device according to claim 1, characterized in that, The adsorption zone includes holes arranged in an array, and the holes are communicated with an adsorption device.

4. The cell slicing device according to claim 3, wherein The carrying surface includes two or more connected planes, and the two or more connected planes are respectively located on independently arranged carrying blocks.

5. The cell slicing device according to claim 1, wherein The number of the grooving and self-breaking devices is N, and N is greater than or equal to 2. They are arranged in groups along the slicing forward direction of the moving and carrying mechanism, and the number of the Nth group of grooving and self-breaking devices is 2 to the power of (N - 1).

6. A method for slicing battery chips, characterized in that, The method for slicing battery cells uses the wafer slicing device for battery cells as described in any one of claims 1-5, and includes the following steps: Place the battery cell on the moving and carrying mechanism, and the slicing lines to be sliced of the battery cell respectively correspond to the areas between the respective adsorption zones of the moving and carrying mechanism. For any slicing, control the adsorption of some adsorption zones on the moving and carrying mechanism, so that one of the battery cell areas on both sides of the slicing line corresponding to the grooving and self-breaking device of this slicing on the battery cell is adsorbed. Control the moving and carrying mechanism to move past the grooving and self-breaking device. During the movement, use the grooving and self-breaking device to groove and break the slices along the corresponding slicing line on the battery cell, and the battery cell is divided into battery slices along the slicing line under the action of its own stress.

7. The method for slicing battery wafers according to claim 6, characterized in that, The method for slicing battery cells further includes: When a slicing is completed and the next slicing is required, adjust the adsorption of some adsorption zones on the moving and carrying mechanism, so that one of the battery cell areas on both sides of the slicing line corresponding to the grooving and self-breaking device of the next slicing on the battery cell is adsorbed.

8. The method for slicing battery chips according to claim 7, wherein, The method for slicing battery cells further includes: When a slicing is completed and the next slicing is required, rectify the unsorbed slices formed by the last slicing. After the rectification is completed, execute the step of adjusting the adsorption of some adsorption zones on the moving and carrying mechanism.

Images