A detection system and a detection method

Abstract

The present invention discloses a detection system and detection method, which includes a detection device, a carrying device and a transfer device, wherein the detection device is used to detect the first surface or the second surface of the object to be detected, and the optical axis of the detection device is perpendicular to the first surface or the second surface of the object to be detected; the carrying device is placed in a detection cavity, and is used to carry the first surface of the object to be detected or to carry the edge area of the object to be detected; the transfer device is used to move the object to be detected to or from the carrying device, and is configured to place the first surface or the second surface of the object to be detected in a state to be detected. Through the detection system with optimized functional structure, it is possible to complete the detection of two surfaces of the device to be detected in one detection cavity, which can greatly reduce the detection time while effectively reducing the detection cost.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor testing equipment, and in particular to a detection system and a detection method. Background Art

[0002] A typical manufacturing process requires defect inspection on both the front and back sides of wafers. This typically involves two inspection chambers: one for front-side inspection and the other for back-side inspection. Specifically, separate loading devices are installed in the front and back inspection chambers, respectively, to support the wafers' back and front sides. A robotic arm is used to transport and flip the wafers. Due to limitations in its structural principles, this approach results in high inspection costs and long inspection cycles.

[0003] In view of this, it is urgent to optimize the structure of the existing detection system to effectively reduce the detection cost and time. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention provides a detection system and a detection method. Through the detection system with optimized functional structure, the detection of two surfaces of the object to be tested can be completed in one detection chamber, which can greatly reduce the detection time while effectively reducing the detection cost.

[0005] The detection system provided by the present invention includes a detection device, a carrying device and a transfer device, wherein the detection device is used to detect the first surface or the second surface of the object to be detected, and the optical axis of the detection device is perpendicular to the first surface or the second surface of the object to be detected; the carrying device is placed in the detection cavity, and is used to carry the first surface of the object to be detected or to carry the edge area of the object to be detected; the transfer device is used to move the object to be detected to the carrying device or to move it away from the carrying device, and is configured to put the first surface or the second surface of the object to be detected in a state to be detected.

[0006] Preferably, the carrying device includes a vacuum adsorption surface and a supporting surface, the vacuum adsorption surface is used to adsorb the first surface of the object to be measured, and the supporting surface is used to carry the edge area of the object to be measured; multiple supporting components are used to drive the object to be measured to the plane where the vacuum adsorption surface is located or to the plane where the supporting surface is located.

[0007] Preferably, the transfer device includes a manipulator and a flipping mechanism, wherein the manipulator is used to grab or release the object to be measured, and the flipping mechanism is used to flip the object to be measured.

[0008] Preferably, the flipping mechanism is configured to be located beside the detection cavity or integrated into the manipulator.

[0009] Preferably, a moving platform is provided in the detection cavity, and the carrying device is provided on the moving platform to drive the carrying device to move. The displacement trajectory of the carrying device is formed by a combination of lateral displacement, longitudinal displacement and / or rotation around the center of rotation in the horizontal plane.

[0010] Preferably, the detection device includes a defect detection module and an automatic focusing module; the defect detection module includes a light source, a lens and a camera, the optical axis of the defect detection module is perpendicular to the surface of the object to be measured, and the automatic focusing module is used to obtain the distance between the defect detection module and the surface of the object to be measured, and to make the focus of the defect detection module located on the surface of the object to be measured.

[0011] Preferably, the multiple support components include: a positioning block and / or a supporting block, the positioning block is configured to move in a direction perpendicular to the vacuum adsorption surface, the positioning block includes a first supporting surface and a positioning portion located above the first supporting surface, and the positioning portion can form a restriction on the position of the device to be tested in the horizontal plane; the supporting block is configured to move in a direction perpendicular to the vacuum adsorption surface, and the supporting block includes a second supporting surface.

[0012] Preferably, the clamping assembly also includes a clamping drive part: the clamping drive part is used to drive the clamping part to move radially along the vacuum adsorption surface, provide a clamping driving force for the clamping part, and is configured such that: under the action of the clamping driving force, the clamping force formed by the clamping part and the positioning part is applied to the object to be measured.

[0013] Preferably, the clamping drive part is a clamping cylinder, and the output end of the clamping cylinder is transmission-connected to the main body of the clamping assembly; the clamping parts are provided in two, and relative to the symmetrical center line perpendicular to the connecting line of the pivot centers of the two, the two clamping parts are mirror-set and respectively pivotally connected to the main body of the clamping assembly, and can switch between the clamping working position and the loosening working position around the pivot center, and are configured as follows: the clamping part located in the clamping working position, and the clamping force formed by the positioning part is applied to the object to be measured; the clamping part located in the loosening working position is separated from the object to be measured; wherein, each of the clamping parts has a clamping end formed by bending outward from the main body, and the end adapted to the outer periphery of the device to be tested is an outward convex arc surface; an elastic part is provided between the two clamping parts, and is configured as follows: during the process of the two clamping parts switching to the clamping working position, the elastic part deforms and stores elastic deformation energy.

[0014] Preferably, it also includes a lifting component, which includes a lifting platform. The multiple support components are all arranged on the lifting platform, and the lifting platform moves in a direction perpendicular to the vacuum adsorption surface; the lifting drive unit can provide the lifting driving force of the lifting platform.

[0015] Preferably, the object to be measured includes a patterned wafer, the first surface of the object to be measured is a non-processed surface of the object to be measured, and the second surface of the object to be measured is a processed surface to be measured.

[0016] The present invention also provides a detection method, which is implemented based on the detection system as described above, and the detection method includes: causing the carrying device to carry the first surface of the object to be tested, and causing the detection device to perform a first detection process on the second surface of the object to be tested; after the first detection process is completed, causing the transfer device to switch the first surface of the object to be tested to a state to be tested; causing the carrying device to carry the edge area of the object to be tested, and causing the detection device to perform a second detection process on the first surface of the object to be tested.

[0017] Preferably, it includes: before performing the first detection process, the multiple support components are raised to the working position, and the object to be measured is set on the multiple support components; the multiple support components are lowered to be flush with or lower than the vacuum adsorption surface, and the object to be measured is placed on the vacuum adsorption surface, so that the vacuum adsorption surface adsorbs the first surface of the object to be measured; after the first detection process is completed, the multiple support components drive the object to be measured to rise to the plane where the carrying surface is located.

[0018] Preferably, the step of causing the transfer device to switch the first surface of the object to be tested to a state to be tested includes: causing the transfer device to move the object to be tested from the carrying surface, causing the transfer device to flip the object to be tested, and placing the flipped object to be tested in the carrying surface, so that the first surface of the object to be tested is in a state to be tested.

[0019] With respect to the prior art, the present invention takes a different approach and optimizes the design of the detection system for the object to be tested. Its carrying device has a fixed implementation method of two detection states of the object to be tested, and with the assistance of the cooperation and linkage of the transfer device and the detection device, the entire process of front detection and back detection of the complete object to be tested can be realized. Taking the object to be tested as a wafer as an example, the detection device can detect the first surface or the second surface of the object to be tested, and the carrying device is placed in the detection cavity, for carrying the first surface of the object to be tested or for carrying the edge area of the object to be tested; its transfer device is used to move the object to be tested to or from the carrying device, and is configured to put the first surface or the second surface of the object to be tested in a state to be tested. That is to say, a first detection state for detecting the second surface of the wafer and a second detection state for detecting the first surface of the wafer are respectively constituted, that is, the second surface of the wafer faces the detection device, and the detection device performs a first detection on the second surface of the wafer, or the first surface of the wafer faces the detection device, and the detection device performs a second detection on the first surface of the wafer. Compared with the prior art, this solution has the following beneficial technical effects:

[0020] First, this solution can selectively meet the functional requirements of the wafer in two inspection states, and use a transfer device to place the front or back of the wafer under test in the inspection state separately, thereby completing the inspection of both surfaces of the wafer under test within a single inspection chamber. This avoids the high inspection cost of using corresponding carriers in two inspection chambers. At the same time, the application of this solution can also reduce the auxiliary man-hours required to transfer the test object between inspection chambers, greatly shortening the inspection time and further reducing the inspection cost.

[0021] Secondly, in the preferred embodiment of the present invention, the back side of the wafer to be tested is adsorbed by the vacuum adsorption surface to perform a first state detection; at the same time, the edge of the wafer to be tested is supported by the support surface, and the wafer to be tested is driven to the plane where the vacuum adsorption surface is located or to the plane where the support surface is located through multiple support components; thus, in addition to satisfying the detection function of the two surfaces of the wafer to be tested, it will not affect the morphology of the front side of the wafer to be tested.

[0022] Again, in another preferred embodiment of the present invention, multiple support components include positioning blocks and / or supporting blocks, and the positioning block includes a first supporting surface and a positioning portion located above the first supporting surface. The positioning portion can form a restriction on the position of the device to be tested in the horizontal plane to form a reliable clamping positioning for the back side detection state; at the same time, the first supporting surface below the positioning portion is configured to support the back side of the wafer together with the second supporting surface of the supporting portion to switch to the working position, and has the function of supporting the wafer, which can more smoothly push the wafer to the detection state and ensure the detection accuracy.

[0023] Finally, in another preferred embodiment of the present invention, the clamping parts are mirror-imaged into two, which can be switched between the clamping working position and the loosening working position around the pivot center respectively. The clamping parts have clamping ends formed by bending outward from the main body, and the ends adapted to the outer periphery of the device to be connected are convex arc surfaces; thus, in the process of the clamping parts pressing against the edge of the wafer for clamping, they rotate around their pivot center respectively and are tangent to the wafer through the two clamping end arcs, and the elastic parts absorb energy during the process to maintain a flexible clamping force on the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic diagram of the detection system in a specific embodiment;

[0025] Figure 2 A schematic diagram of the carrying device in a first detection state;

[0026] Figure 3 is a schematic diagram of the carrying device in the second detection state in a specific embodiment;

[0027] Figure 4 It is a top view of the carrying device described in the specific embodiment;

[0028] Figure 5 This is a top view of the carrying device described in the specific embodiment without the vacuum suction cup;

[0029] Figure 6 for Figure 4 Part B shows an enlarged view of the positional relationship between the carrier block and the wafer;

[0030] Figure 7 for Figure 4 An enlarged view of the positional relationship between the positioning block and the wafer shown in Part C;

[0031] Figure 8 is a schematic diagram of the clamping assembly in the loose working position;

[0032] Figure 9 is a schematic diagram of the clamping assembly in the clamping working position;

[0033] Figure 10 A schematic diagram showing the principle of a defect detection module of the detection device is shown.

[0034] In the picture:

[0035] Carrying device 10, manipulator 20, detection chamber 30, detection device 40, motion stage 50, turning mechanism 60, calibration stage 70;

[0036] Vacuum suction cup 1, clamping assembly 2, clamping part 21, clamping end 211, clamping cylinder 22, elastic member 23, carrying block 3, second supporting surface 31, positioning block 4, positioning part 41, first supporting surface 42, lifting component 5, lifting platform 51, lifting cylinder 52, limit block 6, rotation drive mechanism 7, light source 401, lens 402, camera 403, spectrometer assembly 404. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] Without loss of generality, this embodiment is based on Figure 1 The detection system shown in FIG is used as the main body for description, wherein the detection device 40, the carrying device 10, and the moving stage 50 are placed in a detection chamber 30, and the manipulator 20 is placed outside the detection chamber 30. It should be understood that the specific structure of the detection chamber 30 and the specific functional configuration of the detection device 40 and the moving stage 50 do not constitute a substantial limitation on the technical solution claimed in this application.

[0039] See Figure 1 , which is a top view of the detection system described in this embodiment. To clearly describe the working principle of the carrier device, this solution uses wafer A as the object to be tested for detailed description. Wafer A is a patterned wafer, that is, the first surface of the wafer includes a plurality of chip patterns. It is understood that the object to be tested can be a different product form having two surfaces to be tested, such as but not limited to a wafer.

[0040] The inspection system includes an inspection device 40 for inspecting the first or second surface of the object to be inspected, respectively. The optical axis of the inspection device 40 is perpendicular to the first or second surface of the object to be inspected. Optical inspection is preferably employed to inspect the second (front) surface of wafer A for defects in the patterned circuits, and to inspect the first (back) surface of wafer A for defects such as scratches and dents.

[0041] The carrying device 10 for carrying and fixing the wafer A to be tested can be set on the moving table 50 in the detection chamber 30, and is used to carry the first surface of the object to be tested or to carry the edge area of the object to be tested. The transfer device is used to move the object to be tested to the carrying device or move it away from the carrying device, and is configured to put the first surface or the second surface of the object to be tested into a state to be tested. During the actual detection process, the moving table 50 can drive the carrying device 10 to move based on the detection principle, and then complete the optical detection of the second surface (front) or the first surface (back) through high-speed movement in conjunction with the detection device 40. It can be understood that for different wafers A to be tested, the above-mentioned displacement trajectory is also different; for example, but not limited to Figure 1As shown by the middle arrow, its displacement trajectory is formed by a combination of lateral displacement in the horizontal plane, longitudinal displacement and / or rotation around the center of rotation.

[0042] Of course, based on different objects to be tested, the lens of the detection device 40 can be coordinated to move in a direction perpendicular to the adsorption surface of the object to be tested.

[0043] The carrier device 10 in this solution can provide two detection states. The transfer device is used to move the object to be tested to or from the carrier device 10, and is configured to place the first surface or the second surface of the object to be tested in the state to be tested. Figure 2 and Figure 3 ,in, Figure 2 is a schematic diagram of the carrying device in the first detection state, Figure 3 Schematic diagram of the carrying device in the second detection state.

[0044] Furthermore, the carrying device 10 may include a vacuum adsorption surface and a supporting surface, wherein the vacuum adsorption surface is formed on the vacuum suction cup 1, which is used to adsorb the first surface of the object to be measured, and the supporting surface is used to support the edge area of the object to be measured; multiple supporting components are used to drive the object to be measured to the plane where the vacuum adsorption surface is located or to the plane where the supporting surface is located, providing position guarantees for the two surfaces of the wafer A to be measured.

[0045] In order to more reliably fix the wafer A to be tested in the working position to be tested, the carrier device 10 may further include a clamping assembly 2, which includes a clamping portion 21 that radially abuts against the edge of the object to be tested; the clamping portion 21 is located above the outer side of the vacuum adsorption surface and is vertically spaced at a predetermined distance from the upper surface of the vacuum adsorption surface. It should be noted that in order to make full use of the vertical space in the detection chamber, the clamping portion 21 of the clamping assembly 2 can be located above the outer side of the vacuum suction cup 1 and be vertically spaced at a predetermined distance from the upper surface of the vacuum suction cup 1 to ensure that it is completely offset from the vacuum suction cup 1 in the first detection state, thereby facilitating the pick-up and placement operations of the wafer to be tested.

[0046] Specifically, multiple support components include a positioning block 4 and / or a supporting block 3, wherein the positioning block 4 can be configured to move in a direction perpendicular to the vacuum adsorption surface, the positioning block 4 includes a first supporting surface 42 and a positioning portion 41 located above the first supporting surface 42, and the positioning portion 41 can form a restriction on the position of the device to be tested in the horizontal plane; wherein the supporting block 3 can be configured to move in a direction perpendicular to the vacuum adsorption surface, and the supporting block includes a second supporting surface 31.

[0047] Among them, the vacuum chuck 1 is used to fix the wafer A on Figure 2The first detection state is shown. Specifically, the first surface (back side) of wafer A is placed on the vacuum suction cup 1. In the vacuum state, the vacuum portion on the upper surface of the vacuum suction cup 1 can be used to adsorb the first surface (back side) of wafer A, that is, wafer A is fixed in the first detection state by the vacuum suction cup 1. The vacuum portion can be a vacuum groove or a vacuum portion, for example but not limited to a sealed airway form or a microporous ceramic form. At this time, the front side (second surface) of wafer A can be inspected. In the first detection state, the clamping assembly 2 and the carrier block 3 are both in a non-working state.

[0048] Specifically, the clamping assembly 2 is fixed relative to the vacuum suction cup 1, and the carrier block 3 can be switched between the working position and the non-working position in the vertical direction. Here, the "working position" and "non-working position" are defined based on whether the carrier block 3 participates in fixing the object to be measured. The carrier block 3 in the "working position" participates in fixing the object to be measured, while in the "non-working position" it does not participate in fixing the object to be measured. It is configured so that when it is in the non-working position, the second supporting surface 31 of the carrier block 3 is not higher than the upper surface of the vacuum suction cup 1, such as Figure 2 As shown, in this state, the vacuum chuck 1 can provide the adsorption and fixing function of the first detection state; when the second supporting surface 31 supports the front side (second surface) of the wafer A and switches to the working position, as shown Figure 3 As shown, the clamping portion 21 of the side clamping assembly 2 applies a clamping force to the wafer to secure the object under test in the second inspection state. At this time, the reverse side (first surface) of the wafer A can be inspected. In the second inspection state, the vacuum chuck 1 and the related components that establish the vacuum are in a non-operating state.

[0049] This solution can selectively achieve adsorption and fixation of the back side of the wafer or clamping and fixation of the edge of the wafer by setting a vacuum suction cup 1 and a clamping part 21. Wafer A is located in two fixed positions to be inspected at different heights in a detection chamber. A single carrying device can meet the functional requirements of separately inspecting the front and back sides of the wafer, thereby providing good technical support for completing the inspection of the two surfaces of the object to be tested.

[0050] like Figure 1 As shown, the test state of the wafer A to be tested is operated by the transfer device, that is, the wafer A to be tested is taken and placed on the carrier device 10 according to the two test states to meet the functional requirements of front and back side testing.

[0051] The transfer device may further include a robot 20 and a flipping mechanism 60. The robot 20 is used to grab or release the wafer A to be tested, and correspondingly, the flipping mechanism 60 is used to flip the wafer A to be tested. As shown in the figure, the flipping mechanism 60 is located next to the robot 20. During operation, after completing the second surface (front side) inspection of wafer A, the robot 20 grabs wafer A on the carrier 10 and places it on the flipping mechanism 60. After the flipping mechanism 60 completes the flipping of the wafer A to be tested, the robot 20 grabs wafer A on the flipping mechanism 60 and places it on the carrier 10 for reverse side inspection of wafer A.

[0052] Here, the robot arm 20 may adopt a self-friction circumscribed circular bump structure to reliably fix the wafer A. In addition, the flip mechanism 60 is not limited to the preferred implementation shown in the figure.

[0053] For example, the flipping mechanism can also be integrated into the robot 20 (not shown in the figure). The characteristic of this method is that there is no need to configure an independent flipping mechanism. After completing the inspection of the second surface (front side) of wafer A, the robot 20 grabs the wafer A on the carrier 10. During the operation of the flipping mechanism, wafer A is always clamped by the robot 20. After completing the flipping of the wafer A to be tested, the robot 20 places it on the carrier 10 for inspection of the back side of wafer A.

[0054] Furthermore, when the clamping assembly 2 clamps the wafer A, in order to avoid affecting the integrity and cleanliness of the front surface, a positioning block 4 adapted to the clamping portion 21 can be added. Figure 2 and Figure 3 The positioning block 4, having a positioning portion 41, can also be switched vertically between an operating position and a non-operating position. The positioning block 4 is configured such that when in the non-operating position, the positioning portion 41 of the positioning block 4 is no higher than the upper surface of the vacuum chuck 1. When in the operating position, the positioning portion 41 of the positioning block 4 can restrict the position of the wafer A in the horizontal plane, thereby reliably clamping and positioning the wafer A when it is switched to the second detection state. The design of the positioning portion 41 provides a good technical guarantee for simplifying the force-applying structure of the clamping assembly 2.

[0055] In addition, the positioning block 4 body below the positioning portion 41 has a first supporting surface 42, which is configured to support the front side (second surface) of the wafer A together with the second supporting surface 31 and switch to Figure 3 That is, in the height direction, the first supporting surface 42 of the positioning block 4 is flush with the second supporting surface 31 of the supporting block 30. In this way, the positioning block 4 also supports the wafer A, and can more smoothly push the wafer to the second detection state, ensuring detection accuracy.

[0056] Of course, in the second detection state, in order to minimize the possible impact of the support on the surface of the wafer A, as a preferred embodiment, the carrier block 3 can be configured below the edge of the wafer A. Please refer to Figure 4 and Figure 5 , both figures are top views of the carrying device, where Figure 5 The top view shown is after removing the vacuum chuck.

[0057] As shown in the figure, the supporting block 3 and the positioning block 4 are both located radially outside the vacuum chuck 1. The radially inner portion of the first supporting surface 42 is used to support the edge of the wafer A without directly contacting the front center area of the wafer A. Please refer to Figure 5. Figure 4 An enlarged view of the positional relationship between the support block and the wafer is shown in Part B of FIG. It is understandable that, based on the actual size of the wafer to be tested and the size matching of the support block 30, the entire first support surface 42 can also be used to support the edge of the wafer A, rather than being limited to the portion shown in the figure. As long as the functional requirements of supporting the edge of the wafer A can be met without directly contacting the central area of the front surface, the protection is sought in this application.

[0058] Similarly, the positioning block 4 having a supporting function can also be arranged below the edge of the wafer A. Please refer to Figure 7 , Figure 7 for Figure 4 An enlarged view of the positional relationship between the positioning block and the wafer is shown in section C of FIG. The positioning portion 41 is radially aligned with the edge of wafer A. A portion of the first supporting surface 42 radially inward of the positioning portion 41 is used to simultaneously support the edge of wafer A, and similarly does not directly contact the front center area of wafer A.

[0059] As shown in the figure, the clamping assembly 2 is located on one side of the vacuum chuck 1, and the positioning portion 41 adapted to clamp and position the same is located on the radially opposite side of the clamping assembly 2. Thus, when the clamping portion 21 applies a clamping force to the wafer in a generally radial direction, the positioning portion 41 of the positioning block 4 abuts against the edge of the wafer A to form the above-mentioned positioning. In this solution, the specific number and corresponding positions of the positioning blocks 4 can be set as needed, for example, but not limited to, two in the preferred example of this solution. Figure 4 As shown, relative to the radial force direction of the clamping portion 21, the two positioning blocks 4 are symmetrically arranged on both sides to form a stable clamping and positioning relationship, and the structure is simple and reliable. Among them, the bearing blocks 3 of this solution are also set to two, such as Figure 4 As shown, relative to the positioning block 4, the carrier block 3 is located on the side near the clamping assembly 2, and the supporting parts are roughly evenly arranged along the circumference of the wafer A to ensure that the wafer to be tested maintains a horizontal posture. Of course, the carrier block 3 can also be configured as a plurality of other types and arranged evenly around the circumference.

[0060] Theoretically, the clamping force provided by the clamping assembly 2 can be applied radially or vertically, for example but not limited to the preferred example shown in the figure, where the clamping force is applied to the wafer substantially radially.

[0061] The clamping assembly 2 may further include a clamping drive unit (22) capable of providing a clamping drive force to the clamping unit 21. Specifically, under the action of the clamping drive force, the clamping unit 21 and the positioning unit 41 exert a clamping force on the object to be measured, the wafer A. The clamping drive unit for providing the above-mentioned clamping drive force is preferably a clamping cylinder 22, the output end of which is transmission-connected to the body of the clamping assembly 21 to drive its linear displacement. In addition, the clamping drive unit may also be configured as a hydraulic cylinder or a linear motor as needed.

[0062] In order to obtain a flexible clamping method and meet the clamping force requirements of different test objects such as ordinary wafers, thin wafers and TAIKO wafers, the clamping component 2 can be further optimized. Figure 8 and Figure 9 ,in, Figure 8 is a schematic diagram of the clamping assembly in the loose working position. Figure 9 Schematic diagram of the clamping assembly in the clamping working position.

[0063] Preferably, the clamping portion 21 is pivotally connected to the body of the clamping assembly 2 and can be switched between a clamping position and a loosening position around the pivot center, and is configured as follows: Figure 9 The clamping force formed by the clamping portion 21 of the clamping work position and the positioning portion 41 of the positioning block 4 is applied to the wafer A to be tested; Figure 8 As shown, the clamping portion 21 of the working position is released and separated from the wafer A to be tested. Therefore, through this switching stroke, technical guarantee is provided for adapting to different objects to be tested.

[0064] As shown in the figure, there are two clamping parts 21. The two clamping parts 21 are mirror-imaged relative to a symmetry center line perpendicular to the connecting line of the pivot centers of the two, that is, symmetrically arranged relative to the radial clamping force direction. Each clamping part 21 has a clamping end 211 formed by bending outward from the main body, and the end adapted to the outer periphery of the wafer A to be clamped is an outward convex arc surface. In the process of pressing against the edge of the wafer to be clamped, the clamping parts 21 rotate around their respective pivot centers and are tangent to the wafer through the two clamping end arcs. At the same time, an elastic member 23 is provided between the two clamping parts 21 and is configured so that: in the process of switching the two clamping parts 21 from the loosening working position to the clamping working position, the elastic member deforms and stores elastic deformation energy. During the process, the elastic member 23 absorbs energy to maintain a flexible clamping force on the wafer A, thereby achieving safe and stable bearing and fixation of various types of wafers.

[0065] In addition, the elastic member 23 is preferably in the form of a tension spring. By replacing springs with different wire diameters, the clamping force of the clamping part 21 on the outer edge of the wafer A can be adjusted while the force of the clamping cylinder 22 remains unchanged.

[0066] In this solution, multiple supporting components such as the carrier block 3 and the positioning block 4 can be switched between the working position and the non-working position along the vertical direction. In particular, the positioning block 4 has the function of supporting the wafer to be tested, and the synchronization of the displacement of the two can be further optimized. Figure 2 and Figure 3 As shown, the supporting block 3 and the positioning block 4 are both arranged on the lifting platform 51 of the lifting component 5, and the lifting platform 51 moves in a direction perpendicular to the vacuum adsorption surface, and drives the synchronous switching between the working position and the non-working position, wherein the lifting driving force of the lifting platform 51 is provided by the lifting driving part (52), and similarly, the lifting driving part can be a lifting cylinder 52, or can be driven by a hydraulic cylinder or a motor.

[0067] Furthermore, a limit block 6 is provided on the lifting platform 51, please refer to Figure 2 and Figure 3 , and configured as follows: the lifting platform 51 drives the bearing block 3 and the positioning block 4 to switch to Figure 3 In the working position shown, at least two of the limit blocks 6 are pressed against the lower surface of the vacuum chuck 1 to limit the position. The limit blocks 6 are evenly distributed so that the lifting platform 51 in the second detection state is in a horizontal posture, thereby ensuring that the supported wafer to be tested remains in the ideal state to be tested, providing a good technical guarantee for obtaining good detection accuracy. Figure 5 As shown, four limit blocks 6 are evenly distributed on the lifting platform 51 in the circumferential direction. It can be understood that at least two limit blocks 6 can achieve the balanced load sharing function requirement, and are not limited to the preferred exemplary description shown in the figure.

[0068] In this solution, the inspection system is also equipped with a calibration table 70 for pre-checking the position of the wafer A to be tested. This mainly involves calibrating the relative position and angular accuracy to ensure that the robot 20 accurately grasps the wafer to be tested. In other words, the wafer to be tested is first placed on the calibration table 70 for position calibration before entering the inspection process.

[0069] In addition, the detection device 40 includes a defect detection module and an automatic focusing module; the defect detection module includes a light source 401, a lens 402 and a camera 403, wherein a light path guide is constructed by a spectroscopic component 404, and the optical axis of the defect detection module is perpendicular to the surface of the object to be tested, so as to scan and obtain the surface conditions of both sides of the object to be tested respectively. Since the first surface is the non-processed surface of the object to be tested, and the second surface is the processed surface of the object to be tested, that is, the first surface and the second surface are different, and the second surface contains a number of chip patterns, when the optical axis of the defect detection module is perpendicular to the surface of the object to be tested, the defect detection module can detect the first surface and the second surface respectively, and has universality. Among them, the automatic focusing module is used to obtain the distance between the defect detection module and the surface of the object to be tested, adjust the focal length of the lens, and make the focus of the defect detection module located on the surface of the object to be tested, so as to adapt to different devices to be tested. Please refer to Figure 10 , which shows a schematic diagram of the principle of the defect detection module of the detection device. It should be noted that the specific functional structure of the detection device 40 is not the core invention of this application. Ordinary technicians in this field can implement it based on existing technology, so it will not be repeated here.

[0070] In addition to the aforementioned detection system, this embodiment also provides a detection method based on the aforementioned detection system.

[0071] The detection method specifically includes: causing the carrying device to carry the first surface of the object to be tested, and causing the detection device to perform a first detection process on the second surface of the object to be tested; after the first detection process is completed, causing the transfer device to switch the first surface of the object to be tested to a test state; causing the carrying device to carry the edge area of the object to be tested, and causing the detection device to perform a second detection process on the first surface of the object to be tested.

[0072] Furthermore, before performing the first detection process, the method includes raising the multiple support assemblies to a working position and placing the object to be tested on the multiple support assemblies; lowering the multiple support assemblies until they are flush with or lower than the vacuum adsorption surface, placing the object to be tested on the vacuum adsorption surface, and allowing the vacuum adsorption surface to adsorb the first surface of the object to be tested;

[0073] After the first detection process is completed, the plurality of support components are used to drive the object to be detected to rise to the plane where the carrying surface is located.

[0074] Furthermore, after the first detection process is completed, the step of switching the transfer device to the test state through the first surface of the object to be tested includes: causing the transfer device to move the object to be tested from the carrying surface, causing the transfer device to flip the object to be tested, and placing the flipped object to be tested in the carrying surface, so that the first surface of the object to be tested is in the test state.

[0075] Specifically, in the first detection state, the carrier block 3 is raised to the working position, and the object to be measured is set on the second supporting surface 31 of the carrier block 3; the carrier block 3 is lowered to the non-working position, and the object to be measured is placed on the vacuum suction cup 1, and the first surface (back) of the object to be measured is fixed by establishing vacuum adsorption, and the second surface (front) of the device to be measured is measured; in the second detection state, the carrier block 3 is raised to the working position, and the object to be measured is set on the second supporting surface 31 of the carrier block 3; the clamping part 21 of the clamping assembly 2 clamps and fixes the object to be measured, and the first surface (back) of the device to be measured is measured.

[0076] Furthermore, in the first detection state, the clamping portion 21 is located in the loosening working position; in the second detection state, the clamping portion 21 is switched to the clamping working position.

[0077] Before the optical inspection begins, the high-speed motion platform is rotated by the rotary drive mechanism, and the first surface (back side) of the wafer A to be tested is placed face down on the carrier device. In the first inspection state, it is fixed by the vacuum suction cup 1, and the second surface (front side) of the wafer A can be inspected; next, the vacuum pump is disconnected, and the wafer A to be tested is flipped 180 degrees by the robot 60, and the second surface (front side) of the wafer A to be tested is placed face down on the carrier device. In the second inspection state, the edge of the second surface (front side) of the wafer A is jointly supported by the carrier block 3 and the positioning block 4, and moved up to the working position and the outer edge of the wafer A is jointly positioned and clamped by the clamping component 20 and the positioning block 4, so that the back side of the wafer A can be inspected.

[0078] After the optical inspection is completed, the robot lifts up and removes the wafer, and the rotary drive mechanism rotates the corresponding associated components back to zero position, thereby completing high-speed, fully automatic optical inspection in one inspection chamber.

[0079] The following table shows the matching relationship between each detection process and the status of the main functional parts of this detection method:

[0080] Robot Lifting unit Clamping part Vacuum suction cup Detection device 1 Prepare wafer decline open closure closure 2 Enter the detection chamber rising open closure closure 3 Release wafer rising open closure closure 4 Exit the detection chamber decline open Open Positive detection 5 Enter the detection chamber rising open closure closure 6 Flip wafer rising open closure closure 7 Release wafer rising open closure closure 8 Exit the detection chamber rising Clamping closure Backside detection 9 Remove the wafer decline open closure closure

[0081] In the description of the present invention, it should be understood that the terms "center", "radial", "vertical", "horizontal", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limiting the protection content of the present invention.

[0082] The above are only preferred embodiments of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A wafer inspection system, characterized in that: include: A detection device, used to detect a first surface and a second surface of the object to be detected, wherein an optical axis of the detection device is perpendicular to the first surface and the second surface of the object to be detected; A carrying device placed in the detection cavity, used to carry the first surface of the object to be tested or the edge area of the object to be tested; A transfer device, used to move the object to be tested to or from the carrying device, and configured to place the first surface or the second surface of the object to be tested in a state to be tested; Wherein, the carrying device includes: A vacuum adsorption surface and a supporting surface, wherein the vacuum adsorption surface is formed on the vacuum suction cup and is used to adsorb the first surface of the object to be tested, so that the detection device performs a first detection process on the second surface of the object to be tested; the supporting surface is used to support the edge area of the object to be tested, so that the detection device performs a second detection process on the first surface of the object to be tested; A plurality of supporting components, wherein the plurality of supporting components are used to move the object to be measured to the plane where the vacuum adsorption surface is located or to the plane where the supporting surface is located; The multiple support components include: a positioning block and a supporting block, the positioning block and the supporting block are respectively configured to move in a direction perpendicular to the vacuum adsorption surface to switch between a working position and a non-working position; the positioning block includes a first supporting surface and a positioning portion located above the first supporting surface, the positioning portion forms a restriction on the position of the device to be tested in a horizontal plane, and the supporting block includes a second supporting surface; the first supporting surface and the second supporting surface form the supporting surface, and when the supporting block is in the working position, the second supporting surface is higher than the upper surface of the vacuum suction cup.

2. The wafer inspection system according to claim 1, wherein: The transfer device includes a manipulator and a flipping mechanism. The manipulator is used to grab or release the object to be measured, and the flipping mechanism is used to flip the object to be measured.

3. The wafer inspection system according to claim 2, wherein: The flipping mechanism is configured to be located beside the detection cavity or integrated into the manipulator.

4. The wafer inspection system according to any one of claims 1 to 3, characterized in that: A moving platform is provided in the detection cavity, and the carrying device is provided on the moving platform to drive the carrying device to move. The displacement trajectory of the carrying device is formed by a combination of lateral displacement, longitudinal displacement and / or rotation around the center of rotation in the horizontal plane.

5. The wafer inspection system according to claim 1, wherein: The detection device includes a defect detection module and an automatic focusing module; the defect detection module includes a light source, a lens and a camera, the optical axis of the defect detection module is perpendicular to the surface of the object to be measured, and the automatic focusing module is used to obtain the distance between the defect detection module and the surface of the object to be measured, and to make the focus of the defect detection module located on the surface of the object to be measured.

6. The wafer inspection system according to claim 1, wherein: The carrying device further comprises a clamping assembly, wherein the clamping assembly comprises a clamping portion and a clamping drive portion: the clamping portion is configured to radially abut against the edge of the object to be measured; The clamping driving portion is used to drive the clamping portion to move radially along the vacuum adsorption surface, provide a clamping driving force for the clamping portion, and is configured such that: under the action of the clamping driving force, the clamping force formed by the clamping portion and the positioning portion is applied to the object to be measured.

7. The wafer inspection system according to claim 6, wherein: The clamping drive part is a clamping cylinder, and the output end of the clamping cylinder is in transmission connection with the body of the clamping assembly; the clamping parts are provided in two, and relative to a symmetrical center line perpendicular to a connecting line of the pivotal centers of the two, the two clamping parts are mirror-imaged and respectively pivotally connected to the body of the clamping assembly, and can be switched between a clamping working position and a loosening working position around the pivot center, and are configured as follows: the clamping part located in the clamping working position exerts the clamping force formed by the positioning part on the object to be measured; the clamping part located in the loosening working position is separated from the object to be measured; Among them, each of the clamping parts has a clamping end formed by bending outward from the main body, and the end adapted to the outer periphery of the device to be mounted is an outward convex arc surface; an elastic part is arranged between the two clamping parts, and is configured as follows: when the two clamping parts are switched to the clamping working position, the elastic part deforms and stores elastic deformation energy.

8. The wafer inspection system according to claim 1, wherein: It also includes a lifting component, the lifting component including: A lifting platform, wherein the plurality of supporting components are arranged on the lifting platform and are moved by the lifting platform in a direction perpendicular to the vacuum adsorption surface; The lifting drive unit can provide the lifting driving force of the lifting platform.

9. The wafer inspection system according to claim 1, wherein: The object to be measured includes a patterned wafer, the first surface of the object to be measured is a non-processed surface of the object to be measured, and the second surface of the object to be measured is a processed surface to be measured.

10. A wafer detection method, characterized in that: Based on the detection system according to any one of claims 1 to 9, the detection method comprises: causing a carrying device to carry a first surface of an object to be detected, and causing the detection device to perform a first detection process on a second surface of the object to be detected; After the first detection process is completed, the transfer device switches the first surface of the object to be detected to a detection state; The carrying device carries the edge area of the object to be tested, and the detection device performs a second detection process on the first surface of the object to be tested; Before performing the first detection process, the method includes raising the multiple support assemblies to a working position and placing the object to be tested on the multiple support assemblies; lowering the multiple support assemblies until they are flush with or lower than the vacuum adsorption surface, placing the object to be tested on the vacuum adsorption surface, and allowing the vacuum adsorption surface to adsorb the first surface of the object to be tested; After the first detection process is completed, the plurality of support components are used to drive the object to be detected to rise to the plane where the support surface is located.

11. The wafer detection method according to claim 10, characterized in that: The step of causing the transfer device to switch the first surface of the object to be tested to a state to be tested includes: The transfer device moves the object to be measured from the support surface, flips the object to be measured, and places the flipped object to be measured on the support surface, so that the first surface of the object to be measured is in a state to be measured.

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