Ultrasonic bonding apparatus and method for ultrasonic bonding using ultrasonic bonding apparatus

Abstract

Disclosed are an ultrasonic joining apparatus and a method for ultrasonic joining, the ultrasonic joining apparatus including: a platform having an upper surface on a plane defined by a first direction and a second direction intersecting the first direction; a head portion spaced apart from the platform in a third direction intersecting the first direction and the second direction; a first ultrasonic generator vibrating in a direction parallel to the second direction; and a second ultrasonic generator vibrating in a direction parallel to the third direction, wherein each of the first ultrasonic generator and the second ultrasonic generator can be coupled to the platform or the head portion.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to and all benefits arising therefrom of Korean Patent Application No. 10-2020-0103385, filed on August 18, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to an ultrasonic bonding apparatus with improved bonding reliability and a method for ultrasonic bonding using the ultrasonic bonding apparatus. Background Technology

[0004] Display devices used in smartphones, televisions, monitors, etc., include various components such as display panels, touch sensors, and electronic components.

[0005] Electronic components can be bonded to the display panel using anisotropic conductive films or ultrasonic methods. The ultrasonic method involves bonding the components by bringing the terminals of each component in the display panel into contact with each other via ultrasonic vibration. Summary of the Invention

[0006] This disclosure provides an ultrasonic bonding apparatus with improved bonding reliability and a method for ultrasonic bonding using the ultrasonic bonding apparatus.

[0007] Embodiments of the present invention provide an ultrasonic bonding apparatus comprising: a platform including an upper surface on a plane defined by a first direction and a second direction intersecting the first direction; a head portion spaced apart from the platform in a third direction intersecting the first and second directions; a first ultrasonic generator vibrating in a direction parallel to the second direction; and a second ultrasonic generator vibrating in a direction parallel to the third direction, wherein each of the first and second ultrasonic generators is coupled to the platform or the head portion.

[0008] In this embodiment, the first ultrasonic generator and the second ultrasonic generator can vibrate simultaneously.

[0009] In one embodiment, the first and second ultrasonic generators can be connected to the head portion.

[0010] In one embodiment, a first ultrasonic generator can be connected to the head portion, and a second ultrasonic generator can be connected to the platform.

[0011] In one embodiment, the ultrasonic bonding device may further include a third ultrasonic generator coupled to the head portion, wherein the third ultrasonic generator may vibrate upward in a third direction.

[0012] In one embodiment, a first ultrasonic generator can be connected to a platform, and a second ultrasonic generator can be connected to the head portion.

[0013] In an embodiment, the ultrasonic bonding device may further include a pressing portion disposed on a first ultrasonic generator or a second ultrasonic generator, wherein the pressing portion can press the head portion upwards from a third party by means of the first ultrasonic generator or the second ultrasonic generator.

[0014] In one embodiment, the first ultrasonic generator may include: a first converter that converts an electrical signal into a first vibration that vibrates in a second direction; and a first amplifier that amplifies the amplitude of the first vibration.

[0015] In one embodiment, the second ultrasonic generator may include a second converter that converts an electrical signal into a second vibration that vibrates in a third direction; and a second amplifier that amplifies the amplitude of the second vibration.

[0016] In one embodiment, the head portion can provide at least one of a first vibration and a second vibration to a first object disposed on the platform and a second object fixed to the head portion.

[0017] In an implementation, each of the first and second vibrations may have a frequency in the range of about 40 kHz to about 60 kHz.

[0018] In an embodiment of the invention, a method for ultrasonic bonding includes: arranging a display panel on a platform, the platform including an upper surface on a plane defined by a first direction and a second direction intersecting the first direction; fixing an electronic component to a head portion spaced apart from the platform in a third direction intersecting the first and second directions, such that the display panel and the electronic component contact each other; and bonding the display panel and the electronic component together. In such an embodiment, bonding the display panel and the electronic component together includes: providing a first vibration to a contact surface between the display panel and the electronic component in a direction parallel to the second direction, and providing a second vibration to the contact surface in a direction parallel to the third direction.

[0019] In one implementation, the first vibration may be provided after the second vibration is provided.

[0020] In an implementation, providing the first vibration and providing the second vibration can be performed simultaneously.

[0021] In one embodiment, the first and second vibrations can be provided to the contact surface via the head portion.

[0022] In one embodiment, the first vibration can be provided to the contact surface via the head portion, and the second vibration can be provided to the contact surface via the platform.

[0023] In one embodiment, joining the display panel and electronic components to each other may further include providing a third vibration to a contact surface in a direction parallel to a third direction, wherein the third vibration may be provided to the contact surface through a head portion.

[0024] In one embodiment, the first vibration can be provided to the contact surface via the platform, and the second vibration can be provided to the contact surface via the head portion.

[0025] In one implementation, providing a second vibration may include: pushing an adhesive member disposed between the display panel and the electronic components away from overlapping with the contact surface.

[0026] In some embodiments, the adhesive component may include a non-conductive film. Attached Figure Description

[0027] The above and other features of the invention will become clearer from the description of embodiments of the invention in more detail with reference to the accompanying drawings, in which:

[0028] Figure 1 This is a perspective view of a display device according to an embodiment of the present invention;

[0029] Figure 2 This is an exploded perspective view of a display device according to an embodiment of the present invention;

[0030] Figure 3 This is a cross-sectional view of a display module according to an embodiment of the present invention;

[0031] Figure 4 This is a plan view of a display panel according to an embodiment of the present invention;

[0032] Figure 5 This is a cross-sectional view of a display panel according to an embodiment of the present invention;

[0033] Figure 6A It is according to an embodiment of the present invention. Figure 4 A magnified view of region AA;

[0034] Figure 6B It is along the embodiment of the present invention Figure 6A A sectional view taken by line I-I';

[0035] Figure 7 This is an exploded perspective view of a display device according to an embodiment of the present invention;

[0036] Figure 8 This is a plan view of an electronic component according to an embodiment of the present invention;

[0037] Figure 9The display device according to an embodiment of the present invention and along Figure 8 The sectional view corresponding to the section cut by line II-II';

[0038] Figure 10 An ultrasonic bonding device according to an embodiment of the present invention is shown;

[0039] Figure 11A This shows when a second vibration is provided. Figure 10 A cross-sectional view of area BB';

[0040] Figure 11B This shows when the first vibration is provided. Figure 10 A cross-sectional view of area BB'; and

[0041] Figures 12 to 14 This is a view illustrating an ultrasonic bonding device according to an alternative embodiment of the present invention. Detailed Implementation

[0042] The invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0043] It should be understood that when a component (or region, layer, part, etc.) is referred to as being "on," "connected to," or "attached to" another component, this means that the component can be directly placed on, directly connected to, or directly attached to the other component, or a third component can exist between them. Conversely, when a component is referred to as being "directly on," "directly connected to," or "directly attached to" another component, there is no intervening component.

[0044] The same reference numerals denote the same elements. Furthermore, in the accompanying drawings, the thickness, proportions, and dimensions of the elements are exaggerated in order to effectively depict the technical content.

[0045] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a,” “an,” “the,” and “at least one” do not indicate a limitation on quantity and are intended to include both the singular and the plural unless the context clearly indicates otherwise. For example, “an element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” should not be construed as limiting “a” or “an.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It should also be understood that, when used in this specification, the terms “comprises” and / or “comprising” or “includes” and / or “including” specify the presence of the stated features, areas, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, components, and / or groups thereof.

[0046] It should be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings herein, “first element,” “first component,” “first region,” “first layer,” or “first part” discussed below may be referred to as a second element, second component, second region, second layer, or second part.

[0047] Furthermore, relative terms such as “below” or “bottom” and “above” or “top” may be used herein to describe the relationship between one element and another as shown in the accompanying drawings. It should be understood that, in addition to the orientations depicted in the drawings, the relative terms are intended to encompass different orientations of the device. For example, if the device in one of the drawings is flipped, an element described as being “below” the other elements will be oriented “above” the other elements. Thus, the term “below” can encompass both “below” and “above” orientations, depending on the specific orientation of the drawing. Similarly, if the device in one of the drawings is flipped, an element described as being “below” or “under” the other elements will be oriented “above” the other elements. Thus, the term “below” or “under” can encompass both “above” and “below” orientations.

[0048] As used herein, “about” or “approximately” includes the stated value and means within an acceptable range of deviation from the particular value as determined by a person of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0049] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should also be understood that terms such as those defined in common dictionaries should be interpreted as having meanings consistent with their meanings in the relevant technical context and in the context of this disclosure, and should not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0050] Embodiments are described herein with reference to cross-sectional views as schematic illustrations of idealized embodiments. Thus, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but should include shape deviations due to, for example, manufacturing processes. For example, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, sharp corners shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shapes of the regions, nor are they intended to limit the scope of the present claims.

[0051] In the following, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0052] Figure 1 This is a perspective view of a display device according to an embodiment of the present invention.

[0053] refer to Figure 1 In one embodiment, the display device DD can be applied to a mobile phone terminal. In such an embodiment, although not shown, electronic modules, camera modules, power modules, etc., mounted on the motherboard, together with the display device DD, can be housed in a bracket, housing, etc., to form a mobile phone terminal. However, the embodiment of the display device DD according to the present invention is not limited to this. For example, the embodiment of the display device DD can be used not only in large electronic devices such as televisions and monitors, but also in small and medium-sized electronic devices such as tablet computers, car navigation systems, game consoles, and smartwatches.

[0054] The display device DD can display the image IM through the display surface DD-IS. In an implementation, such as... Figure 1As shown, the image IM can be an icon image. The display surface DD-IS can be parallel to the plane defined by the first direction DR1 and the second direction DR2. The normal direction of the display surface DD-IS (i.e., the thickness direction of the display device DD) can be represented by the third direction DR3. In this document, the term "when viewed in a plane or on a plane" can refer to the viewpoint viewed from the third direction DR3. The front (or upper) and rear (or lower) surfaces of the various layers or units described below are separated by the third direction DR3.

[0055] The display surface DD-IS may include a display area DD-DA for displaying an image IM and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA may be an area where the image IM is not displayed. The non-display area DD-NDA may surround the display area DD-DA. However, embodiments of the present invention are not limited thereto, and optionally, the non-display area DD-NDA may be adjacent to or omitted from any side of the display area DD-DA.

[0056] Figure 2 This is an exploded perspective view of a display device according to an embodiment of the present invention, and Figure 3 This is a cross-sectional view of a display module according to an embodiment of the present invention.

[0057] refer to Figure 2 and Figure 3 The implementation of the display device DD may include a window WM, a display module DM, an electronic component DC, a circuit board PB, and a housing component BC. The housing component BC can accommodate the display module DM to be connected to the window WM.

[0058] The window WM can be positioned at the top of the display module DM. The window WM allows the image provided by the display module DM to be transmitted to the outside. The window WM may include a transmissive area TA and a non-transmissive area NTA. The transmissive area TA can be connected to the display area DD-DA of the display device DD (see [link to display device DD]). Figure 1 The transmission region TA may overlap with the display region DD-DA (see [reference]). Figure 1 The shape corresponding to ) is displayed in the display area DD-DA of the display device DD (see DD-DA). Figure 1 The image IM in the window WM can be observed from the outside through the transmission area TA.

[0059] The non-transmissive region NTA can be compared with the non-display region DD-NDA of the display device DD (see...). Figure 1 The non-transmissive region NTA may overlap with the non-display region DD-NDA (see...). Figure 1The shape corresponds to the non-transmissive region NTA. The non-transmissive region NTA can be a region with a relatively lower light transmittance than the transmissive region TA. However, embodiments of the window WM of the present invention are not limited to this, and optionally, the non-transmissive region NTA can be omitted.

[0060] In embodiments, the window WM may include glass, sapphire, plastic, etc., or be formed from glass, sapphire, plastic, etc. In embodiments, the window WM may have a single-layer structure or a multi-layer structure. The window WM may include a printed layer overlapping the base layer and the non-transparent region NTA and disposed on the rear surface of the base layer. The printed layer may have a predetermined color. In one embodiment, for example, the printed layer may be set to black, or it may be set to a color other than black.

[0061] The display module DM can be positioned between the window WM and the receiving component BC. The display module DM may include a display panel DP and an input sensor ISU. The display panel DP can generate an image and project the generated image onto the window WM.

[0062] The display panel DP according to the present invention can be a light-emitting display panel, but is not particularly limited thereto. In one embodiment, for example, the display panel DP can be an organic light-emitting display panel, a quantum dot light-emitting display panel, a micron-sized light-emitting diode (“LED”) light-emitting display panel, or a nano-LED light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The light-emitting layer of a quantum dot light-emitting display panel may include quantum dots, quantum rods, etc. The light-emitting layer of a micron-sized LED light-emitting display panel may include micron-sized LEDs. The light-emitting layer of a nano-LED light-emitting display panel may include nano-sized LEDs. Hereinafter, for ease of description, an embodiment of the display panel DP as an organic light-emitting display panel will be described in detail. However, embodiments of the present invention are not limited thereto, and optionally, the display panel DP can be one of various other types of display panels.

[0063] In the implementation method, such as Figure 3 As shown, the display panel DP may include a base substrate SUB, a circuit element layer DP-CL, a display element layer DP-OLED, and an insulating layer TFL.

[0064] The display panel DP may include a display area DP-DA and a non-display area DP-NDA. The display area DP-DA of the display panel DP can be the same as the display area DD-DA of the display device DD (see [link to display panel DP]). Figure 1 The non-display area DP-NDA of the display panel DP may overlap with the non-display area DD-NDA of the display device DD (see...). Figure 1 () or the non-transmissive region NTA of window WM overlaps.

[0065] The base substrate (SUB) can be a glass substrate, a metal substrate, a polymer substrate, etc. However, the embodiments of the present invention are not limited to these, and the base substrate (SUB) may include an inorganic layer, an organic layer, or a composite material layer.

[0066] The DP-CL (Distributed Device Layer-Clearing) circuit element layer can be disposed on the base substrate SUB. The DP-CL may include an intermediate insulating layer and circuit elements. The intermediate insulating layer may include an intermediate inorganic film and an intermediate organic film. The circuit elements may include signal lines and pixel driving circuitry.

[0067] The DP-OLED display element layer can be disposed on the DP-CL circuit element layer. The DP-OLED display element layer can include multiple organic light-emitting diodes. The DP-OLED display element layer can also include organic films, such as pixel defining films.

[0068] An insulating layer TFL can cover the display element layer DP-OLED. The insulating layer TFL can be a thin-film encapsulation layer. The insulating layer TFL can protect the display element layer DP-OLED from foreign substances such as moisture, oxygen, and dust particles. In an alternative embodiment, the insulating layer TFL can be omitted, and an encapsulation substrate can be provided instead of the insulating layer TFL. In such an embodiment, the encapsulation substrate can face the base substrate SUB, and the circuit element layer DP-CL and the display element layer DP-OLED can be disposed between the encapsulation substrate and the base substrate SUB.

[0069] An input sensor (ISU) can be positioned between the window (WM) and the display panel (DP). The input sensor (ISU) can sense input applied from the outside. Input applied from the outside can be provided in various forms. In one embodiment, for example, the external input can take many forms, such as a part of the user's body, a stylus, light, heat, or pressure. In another embodiment, in addition to input from contact with a part of the user's body (such as the user's hand), spatial touch (e.g., hovering) near or adjacent to the user can also be a form of input.

[0070] The input sensor ISU can be directly mounted on the display panel DP. In this document, "component A is directly mounted on component B" indicates that no adhesive layer is present between component A and component B. In some embodiments, the input sensor ISU can be formed together with the display panel DP through a continuous process. However, embodiments of the invention are not limited to this, and optionally, the input sensor ISU can be a separate panel to be attached to the display panel DP via an adhesive layer. In another alternative embodiment, the input sensor ISU can be omitted.

[0071] In the implementation method, such as Figure 2 As shown, the electronic component DC can be connected to the non-display area DD-NDA (see...). Figure 1 The components overlap and are disposed on the display panel DP. In one embodiment, for example, the electronic component DC can transmit signals to the circuit element layer DP-CL of the display panel DP based on control signals transmitted from the circuit board PB. An embodiment of the electronic component DC according to the invention can be a driver chip DC.

[0072] According to embodiments of the present invention, the electronic component DC can be electrically bonded to the base substrate SUB using an ultrasonic bonding method. Embodiments of the display panel DP according to the present invention may include pads electrically connected to the display element layer DP-OLED, and the electronic component DC may include bumps electrically contacting the pads. In such embodiments, the pads of the display panel DP and the bumps of the electronic component DC may have a structure directly connected to each other, rather than a structure indirectly connected to each other through separate conductive materials. This structure will be described in detail later.

[0073] A circuit board PB can be disposed at one end of the base substrate SUB and electrically connected to the circuit element layer DP-CL. The circuit board PB can be rigid or flexible. In one embodiment, for example, if the circuit board PB is flexible, it can be configured as a flexible printed circuit board. The circuit board PB may include timing control circuitry for controlling the operation of the display panel DP. The timing control circuitry may be disposed as an integrated chip or mounted on the circuit board PB. In an embodiment, although not shown, the circuit board PB may include input sensing circuitry for controlling the input sensor ISU.

[0074] According to an embodiment of the present invention, the circuit board PB can be electrically bonded to the base substrate SUB of the display panel DP by an ultrasonic bonding method.

[0075] Figure 4 This is a plan view of a display panel according to an embodiment of the present invention.

[0076] refer to Figure 4 The implementation of the display panel DP may include a driving circuit GDC, multiple signal lines SGL, multiple pads DP-PD, multiple connection pads DP-CPD, and multiple pixels PX.

[0077] Multiple pixels (PXs) can be disposed within the display area DP-DA. Each pixel (PX) may include an organic light-emitting diode (OLED) and pixel driving circuitry connected to the OLED. The driving circuitry GDC, multiple signal lines SGL, multiple pads DP-PD, multiple connection pads DP-CPD, and the pixel driving circuitry may be included in the circuit element layer DP-CL (see [link to circuit element layer]). Figure 3 )middle.

[0078] In an implementation, the display panel DP can be referred to as the display substrate, and the display substrate may include a base substrate SUB, a plurality of pads DP-PD disposed on the base substrate SUB, and a plurality of connection pads DP-CPD.

[0079] The driving circuit GDC can sequentially output gate signals to multiple gate lines GL. The driving circuit GDC can also output another control signal to multiple pixels PX. The driving circuit GDC may include multiple thin-film transistors formed by the same process as the pixel driving circuit of the multiple pixels PX (e.g., low-temperature polycrystalline silicon (“LTPS”) process or low-temperature polycrystalline oxide (“LTPO”) process).

[0080] The multiple signal lines SGL may include multiple gate lines GL, multiple data lines DL, power lines PL, and control signal lines CSL. Each gate line GL can be connected to a corresponding pixel PX among the multiple pixels PX, and each data line DL can be connected to a corresponding pixel PX among the multiple pixels PX. The power line PL can be connected to multiple pixels PX. The control signal line CSL can provide control signals to the drive circuit GDC.

[0081] Multiple signal lines SGLs can be disposed in the display area DP-DA and the non-display area DP-NDA. Each signal line SGL may include a pad portion and a line portion. The line portion may overlap with the display area DP-DA and the non-display area DP-NDA. The pad portion may be connected to one end of the line portion. The pad portion may overlap with the non-display area DP-NDA. In an embodiment, the multiple signal lines SGLs may include line portions and pad portions, which are integrally formed with each other as a single unit, but are not limited thereto. Optionally, the line portion and the pad portion may be configured as separate components.

[0082] The non-display area DP-NDA may include the chip area NDA-CA and the connection pad area NDA-PA. The chip area NDA-CA overlaps with multiple pads DP-PD, and the connection pad area NDA-PA overlaps with multiple connection pads DP-CPD. The chip area NDA-CA may be the mounting electronic component DC (see [link to documentation]). Figure 2 The NDA-PA area, which is the area of ​​the bonding pads, can be part of the mounting circuit board PB.

[0083] The chip region NDA-CA may include a first pad region SA1 and a second pad region SA2 spaced apart from each other in the first direction DR1. Although not shown, the area between the first pad region SA1 and the second pad region SA2 can be defined as a non-pad region.

[0084] Multiple pads DP-PD can be electrically connected to the electronic component DC to transmit electrical signals received from the electronic component DC to multiple signal lines SGL. The multiple pads DP-PD may include multiple first pads DP-PD1 overlapping with a first pad region SA1 and multiple second pads DP-PD2 overlapping with a second pad region SA2.

[0085] Multiple first pads DP-PD1 can be arranged at a first interval on the second direction DR2. The multiple first pads DP-PD1 can be configured on the base substrate SUB to overlap with the first pad region SA1. The multiple first pads DP-PD1 can include multiple row pads divided on the first direction DR1. Multiple second pads DP-PD2 can be arranged at a second interval on the second direction DR2. The second interval may be different from the first interval. The multiple second pads DP-PD2 can be configured on the base substrate SUB to overlap with the second pad region SA2.

[0086] The plurality of first pads DP-PD1 may include first row pads and second row pads divided in the first direction DR1. The plurality of second pads DP-PD2 may be defined by a single row of pads. According to an embodiment of the present invention, the number of the plurality of first pads DP-PD1 depends on the number of the plurality of signal lines SGL, and the number of the plurality of first pads DP-PD1 may be greater than the number of the plurality of second pads DP-PD2.

[0087] Multiple first pads DP-PD1 can be connected to output pads, each of which is electrically connected to multiple signal lines SGL. Multiple first pads DP-PD1 can be connected to the pad portions of the multiple signal lines SGL described above. Multiple second pads DP-PD2 can be electrically connected to multiple connection pads DP-CPD.

[0088] Multiple connection pads DP-CPD can be arranged at regular intervals on the second direction DR2. The multiple connection pads DP-CPD can be positioned on the base substrate SUB to overlap with the connection pad region NDA-PA. Some of the multiple connection pads DP-CPD can be electrically connected to multiple second pads DP-PD2 disposed in the second pad region SA2, and the remaining connection pads DP-CPD can be electrically connected to corresponding signal lines in a plurality of signal lines SGL. In one embodiment, for example, one of the multiple connection pads DP-CPD can be connected to a control signal line CSL.

[0089] The circuit board PB may include multiple circuit pads PB-PD, each of which is electrically connected to multiple connection pads DP-CPD facing the third-party DR3. The multiple circuit pads PB-PD may be located in the circuit pad area NDA-PCA defined on the circuit board PB.

[0090] Figure 5 This is a cross-sectional view of a display panel according to an embodiment of the present invention.

[0091] refer to Figure 5 Display panel DP (see) Figure 4 The implementation of the [device name] may include multiple insulating layers, semiconductor patterns, conductive patterns, signal lines, etc. In such an implementation, the insulating layers, semiconductor layers, and conductive layers can be formed by methods such as coating or evaporation. Subsequently, the insulating layers, semiconductor layers, and conductive layers can be selectively patterned by photolithography. Through this process, semiconductor patterns, conductive patterns, signal lines, etc., can be formed including in the circuit element layer DP-CL and the display element layer DP-OLED. The base substrate SUB can be a base substrate supporting the circuit element layer DP-CL and the display element layer DP-OLED.

[0092] The base substrate SUB may include a synthetic resin layer. The synthetic resin layer may include a thermosetting resin. The base substrate SUB may have a multilayer structure. In one embodiment, for example, the base substrate SUB may include a first synthetic resin layer and silicon oxide (SiO2) disposed on the first synthetic resin layer. x The system comprises a first synthetic resin layer, an amorphous silicon (“a-Si”) layer disposed on a silicon oxide layer, and a second synthetic resin layer disposed on the a-Si layer. The silicon oxide layer and the a-Si layer may be referred to as base barrier layers. Each of the first and second synthetic resin layers may comprise a polyimide-based resin. In embodiments, each of the first and second synthetic resin layers may comprise at least one selected from acrylic acid-based resins, methacrylate-based resins, polyisoprene-based resins, vinyl-based resins, epoxy-based resins, urethane-based resins, cellulose-based resins, siloxane-based resins, polyamide-based resins, and dinaphthalene-based resins. Herein, "A"-based resins refer to resins containing a functional group of "A". In embodiments, for example, the base substrate SUB may comprise a glass substrate, an organic / inorganic composite substrate, etc.

[0093] An inorganic layer may be disposed on the upper surface of the base substrate SUB. The inorganic layer may include at least one selected from aluminum oxide, titanium oxide, silicon oxide, silicon nitride, zirconium oxide, and hafnium oxide. The inorganic layer may have a multilayer structure. The multilayer inorganic layer may include a barrier layer and / or a buffer layer. In one embodiment, for example, as... Figure 5 As shown, the display panel DP includes a buffer layer BFL.

[0094] The buffer layer (BFL) improves the adhesion between the base substrate (SUB) and the semiconductor pattern. The BFL can comprise a silicon oxide layer and a silicon nitride layer. The silicon oxide and silicon nitride layers can be stacked alternately on top of each other.

[0095] Semiconductor patterns can be disposed on the buffer layer BFL. The semiconductor pattern may include polycrystalline silicon. However, embodiments of the present invention are not limited thereto, and alternatively, the semiconductor pattern may include amorphous silicon or metal oxide.

[0096] Figure 5 Only a portion of the semiconductor pattern is shown, and the semiconductor pattern can also be disposed in another region of the pixel PX on a plane. The semiconductor pattern can be arranged on multiple pixels PX based on a specific pattern. Depending on whether doping is applied or not, the semiconductor pattern can have different electrical properties. The semiconductor pattern can include a first region with high conductivity and a second region with low conductivity. The first region can be doped with N-type or P-type dopant. A P-type transistor can include a region doped with P-type dopant, and an N-type transistor can include a region doped with N-type dopant. The second region can be an undoped region or can be doped at a lower concentration than the first region.

[0097] The first region has greater conductivity than the second region and can be used essentially as an electrode or signal line. The second region may substantially correspond to the active portion (or channel) of a transistor. In such an implementation, a portion of the semiconductor pattern may be the active portion of a transistor, another portion may be the source or drain portion of a transistor, and yet another portion may be a connection electrode or a connection signal line.

[0098] Pixels (reference) Figure 4 Each pixel (PX) in the diagram can have an equivalent circuit including seven transistors, a single capacitor, and a light-emitting element, and the equivalent circuit diagram of a pixel can be modified in various forms. For ease of explanation and description, Figure 5 Only two transistors T1 and T2 included in the pixel and the light-emitting element OLED are shown. The first transistor T1 may include a source portion S1, an active portion A1, a drain portion D1, and a gate portion G1. The second transistor T2 may include a source portion S2, an active portion A2, a drain portion D2, a gate portion G2, and an upper electrode UE.

[0099] The source portion S1, active portion A1, and drain portion D1 of the first transistor T1 can be defined or formed by a semiconductor pattern, and the source portion S2, active portion A2, and drain portion D2 of the second transistor T2 can be defined or formed by a semiconductor pattern. In cross-section, the source portions S1 and S2 and the drain portions D1 and D2 can extend from the active portions A1 and A2 in opposite directions. Figure 5A portion of the connection signal line SCL, formed by a semiconductor pattern, is shown. Although not shown separately, on a plane, the connection signal line SCL can be electrically connected to the drain portion D2 of the second transistor T2.

[0100] A first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 commonly overlaps with a plurality of pixels PX and covers a semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The first insulating layer 10 may include at least one selected from aluminum oxide, titanium oxide, silicon oxide, silicon nitride, zirconium oxide, and hafnium oxide. In an embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. In an embodiment, the insulating layer of the circuit element layer DP-CL, which will be described later, may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The inorganic layer may include at least one material selected from the materials described above.

[0101] Gate portions G1 and G2 may be disposed on the first insulating layer 10. Gate portions G1 and G2 may be part of a metal pattern. Gate portions G1 and G2 may overlap with active portions A1 and A2. In the process of doping semiconductor patterns, gate portions G1 and G2 may have the same pattern as the pattern in the mask.

[0102] A second insulating layer 20 may be disposed on the first insulating layer 10. The second insulating layer 20 may cover the gate portions G1 and G2. The second insulating layer 20 commonly overlaps with multiple pixels PX. The second insulating layer 20 may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. In an embodiment, the second insulating layer 20 may be a single-layer silicon oxide layer.

[0103] An upper electrode UE may be disposed on the second insulating layer 20. The upper electrode UE may overlap with the gate portion G2. The upper electrode UE may be defined by a portion of a metal pattern. In such an embodiment, the gate portion G2 and a portion of the upper electrode UE overlapping the gate portion G2 may define a capacitor, but are not limited thereto. Optionally, the upper electrode UE may be omitted.

[0104] A third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may cover the upper electrode UE. In an embodiment, the third insulating layer 30 may be a single layer of silicon oxide. A first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL through a contact hole CNT-1 defined to pass through the first insulating layer 10, the second insulating layer 20 and the third insulating layer 30.

[0105] A fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may cover the first connecting electrode CNE1. The fourth insulating layer 40 may be a single layer of silicon oxide.

[0106] A fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer. A second connecting electrode CNE2 may be disposed on the fifth insulating layer 50. The second connecting electrode CNE2 may be connected to the first connecting electrode CNE1 through a contact hole CNT-2 defined to pass through the fourth insulating layer 40 and the fifth insulating layer 50.

[0107] A sixth insulating layer 60 may be disposed on the fifth insulating layer 50. The sixth insulating layer 60 may cover the second connecting electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0108] A first electrode AE ​​may be disposed on the sixth insulating layer 60. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through a contact hole CNT-3 defined to pass through the sixth insulating layer 60.

[0109] An opening OP may be defined in the pixel-defining film (PDL). The opening OP of the pixel-defining film (PDL) may expose at least a portion of the first electrode AE.

[0110] The display area DP-DA may include a light-emitting area PXA and a light-blocking area NPXA adjacent to the light-emitting area PXA. The light-blocking area NPXA may surround the light-emitting area PXA. In an embodiment, the light-emitting area PXA is defined to correspond to a local area of ​​the first electrode AE ​​exposed through the opening OP.

[0111] A hole control layer (HCL) is commonly disposed in the light-emitting region (PXA) and the light-blocking region (NPXA). The hole control layer (HCL) may include a hole transport layer and may also include a hole injection layer. A light-emitting layer (EML) may be disposed on the hole control layer (HCL). The light-emitting layer (EML) may be disposed in the region corresponding to the opening (OP). In such an embodiment, the light-emitting layer (EML) may be formed individually in each pixel.

[0112] An electronic control layer (ECL) may be disposed on the emissive layer (EML). The ECL may include an electron transport layer and may also include an electron injection layer. A hole control layer (HCL) and the ECL may be commonly formed in multiple pixels using an aperture mask. A second electrode (CE) may be disposed on the ECL. The second electrode (CE) may have an integral shape. The second electrode (CE) may be commonly disposed in multiple pixels (PX).

[0113] The insulating layer TFL can be disposed on the second electrode CE. The insulating layer TFL may include multiple thin films. The insulating layer TFL may include, but is not limited to, inorganic layers, organic layers, and inorganic layers sequentially stacked on top of each other.

[0114] The inorganic layer protects the DP-OLED display element layer from moisture and oxygen, while the organic layer protects it from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxide nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include, but is not limited to, acrylic-based organic layers.

[0115] Figure 6A It is according to an embodiment of the present invention. Figure 4 A magnified view of region AA. Figure 6B It is along the embodiment of the present invention Figure 6A A sectional view taken from line I-I'.

[0116] refer to Figure 6A and Figure 6B Multiple data lines (DL) can include multiple line portions (DL-L) and multiple pad portions (DL-P). For ease of explanation and description, Figure 6A Only two data lines DL are shown. Multiple first pads DP-PD1 can each make electrical contact with multiple pad portions DL-P. The multiple pad portions DL-P can have a width wider than the multiple line portions DL-L (or a larger area over the same length in the first direction DR1). Figure 6A An embodiment is shown in which multiple pad portions DL-P each have a rectangular shape, but the shape of each of the multiple pad portions DL-P is not limited thereto.

[0117] In the implementation method, such as Figure 6B As shown, a pad portion DL-P of each of the plurality of data lines DL can be disposed on a first insulating layer 10. A second insulating layer 20 and a third insulating layer 30 can cover the pad portions DL-P of the plurality of data lines DL. A plurality of first pads DP-PD1 can be disposed on the second insulating layer 20 and the third insulating layer 30. A contact hole CNT exposing each of the plurality of pad portions DL-P can be defined in the second insulating layer 20 and the third insulating layer 30. The plurality of first pads DP-PD1 can make electrical contact with the plurality of pad portions DL-P through the contact holes CNT defined through the second insulating layer 20 and the third insulating layer 30.

[0118] Figure 7 This is an exploded perspective view of a display device according to an embodiment of the present invention, and Figure 8 This is a plan view of an electronic component according to an embodiment of the present invention.

[0119] refer to Figure 7 and Figure 8 The embodiment of the display device DD may further include a first adhesive member NF-D and a second adhesive member NF-P. The first adhesive member NF-D may be disposed between the electronic component DC and the base substrate SUB to bond the electronic component DC and the base substrate SUB. The second adhesive member NF-P may be disposed between the circuit board PB and the base substrate SUB to bond the circuit board PB and the base substrate SUB. On a planar surface, the first adhesive member NF-D may cover the electronic component DC.

[0120] The first adhesive member NF-D and the second adhesive member NF-P may each have non-conductive properties and may be film-type adhesive resins including a thermal initiator. In one embodiment, for example, the first adhesive member NF-D and the second adhesive member NF-P may each be a non-conductive film (“NCF”), but are not limited thereto. In an alternative embodiment, for example, the first adhesive member NF-D and the second adhesive member NF-P may be an anisotropic conductive film (“ACF”). The curing properties of the first adhesive member NF-D and the second adhesive member NF-P may vary depending on external heat.

[0121] The electronic component DC may include an upper surface DC-US and a lower surface DC-DS opposite to the upper surface DC-US and facing the first adhesive member NF-D. The electronic component DC may include a plurality of bumps DC-BP, each of the plurality of bumps DC-BP making an electrical contact with a corresponding one of a plurality of pads DP-PD disposed on the base substrate SUB.

[0122] In an embodiment, the electronic component DC may define a first bump region DCA1 facing a first pad region SA1 and a second bump region DCA2 facing a second pad region SA2. The plurality of bumps DC-BP may include a plurality of first bumps DC-BP1 disposed in the first bump region DCA1 and a plurality of second bumps DC-BP2 disposed in the second bump region DCA2.

[0123] Multiple first bumps DC-BP1 may include first row bumps and second row bumps corresponding to multiple first pads DP-PD1 arranged in two rows R1 and R2. Multiple second bumps DC-BP2 may include bumps corresponding to multiple second pads DP-PD2 arranged in a row. On the plane, the first bump region DCA1 may have a larger area than the second bump region DCA2.

[0124] The first interval DK1 between two adjacent first bumps DC-BP1 in the second direction DR2 can be smaller than the second interval DK2 between two adjacent second bumps DC-BP2 in the second direction DR2. In the second direction DR2, the second interval DK2 can be larger than the first interval DK1.

[0125] The number of multiple first bumps DC-BP1 is set to be greater than the number of multiple second bumps DC-BP2, and therefore, the second interval DK2 between the multiple second bumps DC-BP2 can be set to be greater than the first interval DK1 between the multiple first bumps DC-BP1.

[0126] In one implementation, on a plane, the area of ​​any one of the plurality of first bumps DC-BP1 and the area of ​​any one of the plurality of second bumps DC-BP2 can be different from each other. In one implementation, for example, the area of ​​each of the plurality of second bumps DC-BP2 can be larger than the area of ​​each of the plurality of first bumps DC-BP1.

[0127] The first spacing between two adjacent first pads DP-PD1 in the second direction DR2 can be smaller than the second spacing between two adjacent second pads DP-PD2 in the second direction DR2. In the second direction DR2, the second spacing can be larger than the first spacing.

[0128] Multiple first pads DP-PD1 face the third-party DR3 and are electrically contacted with multiple first bumps DC-BP1, and thus the spacing between two adjacent first pads DP-PD1 and the spacing between two adjacent first bumps DC-BP1 can substantially correspond to each other. Multiple second pads DP-PD2 face the third-party DR3 and are electrically contacted with multiple second bumps DC-BP2, and thus the spacing between two adjacent second pads DP-PD2 and the distance between two adjacent second bumps DC-BP2 can substantially correspond to each other.

[0129] When viewed in a plane, the area of ​​any one of the plurality of first pads DP-PD1 and the area of ​​any one of the plurality of second pads DP-PD2 may be different from each other. In one embodiment, for example, the area of ​​each of the plurality of second pads DP-PD2 may be larger than the area of ​​each of the plurality of first pads DP-PD1.

[0130] According to the present invention, a plurality of pads DP-PD and a plurality of bumps DC-BP are covered by a first adhesive member NF-D, and thus the plurality of bumps DC-BP and the plurality of pads DP-PD are isolated from external air. Therefore, oxidation of the plurality of bumps DC-BP and the plurality of pads DP-PD due to external air can be prevented.

[0131] Multiple circuit pads of circuit board PB-PD (see PB-PD) Figure 4 Multiple connection pads DP-CPD can be applied to the DR3 via a third party. Multiple circuit pads PB-PD (see...) Figure 4 It can make electrical contact with multiple connection pads DP-CPD individually.

[0132] According to an embodiment of the present invention, multiple circuit pads PB-PD (see Figure 4 The multiple connection pads DP-CPD are covered by the second adhesive member NF-P, and the multiple circuit pads PB-PD (see...) Figure 4 The DP-CPD and multiple connection pads can be isolated from the outside air. Therefore, multiple circuit pads PB-PD (see...) can be prevented from... Figure 4 The DP-CPD and multiple connection pads are oxidized due to external air.

[0133] Figure 9 The display device according to an embodiment of the present invention and its edge Figure 8 The sectional view corresponding to the section intercepted by line II-II'. Figure 9 In the figures, the same or similar reference numerals indicate the same references as above. Figures 5 to 8 The components described are the same or similar to the components, and any duplicate detailed descriptions will be omitted or simplified.

[0134] refer to Figure 9 In one embodiment, the electronic component DC may include a substrate DC-BS, a drive pad portion DC-P, and a pad insulating layer DC-IL. The drive pad portion DC-P may include a drive pad DC-PD and a first bump DC-BP1.

[0135] The upper surface of the substrate DC-BS may correspond to the upper surface DC-US of the electronic component DC. The lower surface of the pad insulating layer DC-IL facing the display panel DP may correspond to the lower surface DC-DS of the electronic component DC. The substrate DC-BS may include silicon material.

[0136] A drive pad DC-PD can be disposed on the lower surface of a substrate DC-BS. The drive pad DC-PD can be electrically connected to circuit elements of an electronic component DC. A pad insulating layer DC-IL can be disposed on the lower surface of the substrate DC-BS. A through-hole can be defined in the pad insulating layer DC-IL to expose a portion of the drive pad DC-PD. A first bump DC-BP1 can be directly disposed on the drive pad DC-PD.

[0137] In one embodiment, the first bump DC-BP1 can be electrically contacted with the first pad DP-PD1 via an ultrasonic bonding method. Frictional heat may be generated on the contact surface between the first bump DC-BP1 and the first pad DP-PD1 due to ultrasonic vibration. In such an embodiment, external pressure is applied to the upper surface of the substrate DC-BS, and therefore the contact surfaces between the first bump DC-BP1 and the first pad DP-PD1 can adhere (or weld) to each other through frictional heat.

[0138] Figure 10 An ultrasonic bonding device according to an embodiment of the present invention is shown.

[0139] refer to Figure 10 An embodiment of the ultrasonic bonding device UBA may include a platform ST, a head portion HD, a first ultrasonic generator UG1, a second ultrasonic generator UG2, and a pressing portion PS.

[0140] The platform ST can be defined by an upper surface ST-U defined by a first direction DR1 and a second direction DR2. The display module DM (see...) Figure 3 ) or display panel DP (see Figure 4 It can be mounted on the upper surface ST-U of the platform ST. The platform ST can hold the base substrate SUB.

[0141] In one implementation, for example, the platform ST can vacuum-adsorb the base substrate SUB.

[0142] The head portion HD can be mounted on the platform ST. The head portion HD can be spaced apart from the platform ST on a third-direction DR3. The head portion HD can define a lower surface HD-B facing the platform ST, with an upper surface ST-U. Electronic component DC (see...) Figure 7 The head portion HD can be disposed on the lower surface HD-B of the head portion HD. The head portion HD can fix the substrate DC-BS. In one embodiment, for example, the head portion HD can vacuum-adsorb the substrate DC-BS.

[0143] A first ultrasonic generator UG1 may be coupled to a head portion HD. In one embodiment, for example, the first ultrasonic generator UG1 may be coupled to a side surface of the head portion HD. The first ultrasonic generator UG1 may vibrate in a second direction DR2 to provide a first vibration VD1 to the contact surface CTA of the pads DP-PD and the bumps DC-BP. In one embodiment, for example, the first vibration VD1 may be provided to the contact surface CTA through the head portion HD. The first ultrasonic generator UG1 may include a first transducer CV1 and a first amplifier BO1.

[0144] The first transducer CV1 can be connected to a power source that provides an electrical signal. The first transducer CV1 can convert the electrical signal into a physical vibration. In one embodiment, for example, the first transducer CV1 may include, but is not limited to, a nickel resonator, a ferrite resonator, or a bolt-fastened Langevin type transducer (“BLT”) resonator comprising piezoelectric ceramic. The first transducer CV1 can form a first vibration VD1 that vibrates in a second direction DR2.

[0145] A first amplifier BO1 can be connected between the first converter CV1 and the head portion HD. The first amplifier BO1 can amplify the vibration generated from the first converter CV1. In one embodiment, for example, the first amplifier BO1 can amplify the amplitude of a first vibration VD1.

[0146] A second ultrasonic generator UG2 may be coupled to the head portion HD. In one embodiment, for example, the second ultrasonic generator UG2 may be coupled to the upper surface of the head portion HD. The second ultrasonic generator UG2 may vibrate on a third-direction DR3 to provide a second vibration VD2 to the contact surface CTA of the pads DP-PD and the bumps DC-BP. In one embodiment, for example, the second vibration VD2 may be provided to the contact surface CTA through the head portion HD. The second ultrasonic generator UG2 may include a second transducer CV2 and a second amplifier BO2.

[0147] The second converter CV2 can be connected to a power source that provides an electrical signal (which may be the same as or different from the electrical signal provided to the first converter CV1). The second converter CV2 can convert the electrical signal into physical vibration. In one embodiment, for example, the second converter CV2 may include, but is not limited to, a nickel resonator, a ferrite resonator, or a BLT resonator comprising piezoelectric ceramics. The second converter CV2 can form a second vibration VD2 that vibrates on a third-direction DR3.

[0148] The second amplifier BO2 can be connected between the second converter CV2 and the head portion HD. The second amplifier BO2 can amplify the vibration generated from the second converter CV2. In one embodiment, for example, the second amplifier BO2 can amplify the amplitude of the second vibration VD2.

[0149] The pressing part PS can be disposed on the first ultrasonic generator UG1, but is not limited thereto. In one embodiment, for example, the pressing part PS can be disposed on the second ultrasonic generator UG2. The pressing part PS can apply pressure PP to the third-party direction DR3. In one embodiment, for example, the pressing part PS can include a cylinder that moves on the third-party direction DR3.

[0150] The base substrate (SUB) can be set on the platform (ST). Multiple pads (DP-PD) can be set on the base substrate (SUB).

[0151] The substrate DC-BS can be positioned below the head portion HD. Multiple bumps DC-BP can be positioned below the substrate DC-BS.

[0152] The first adhesive component NF-D can be disposed between the base substrate SUB and the substrate DC-BS.

[0153] Figure 11A This shows when a second vibration is provided. Figure 10 A cross-sectional view of area BB', and Figure 11B This shows when the first vibration is provided. Figure 10 A cross-sectional view of region BB'. Figure 11A and Figure 11B In the figures, the same or similar reference numerals indicate the same references as above. Figure 9 The components described are the same or similar to the components, and any duplicate detailed descriptions will be omitted or simplified.

[0154] refer to Figure 10 , Figure 11A and Figure 11B In this embodiment, the head portion HD can be disposed on the substrate DC-BS. The pressing portion PS can apply pressure PP to the substrate DC-BS through the head portion HD.

[0155] The first vibration VD1 and the second vibration VD2 can be provided through the head portion HD to the contact surface CTA in which multiple pads DP-PD and multiple bumps DC-BP contact each other. The bumps DC-BP and pads DP-PD can make electrical contact due to the energy generated by the first vibration VD1 and the second vibration VD2 and the pressure PP applied to the upper part of the substrate DC-BS.

[0156] This energy can be proportional to the product of the pressure PP, the amplitude of the first vibration VD1 or the second vibration VD2, the frequency of the first vibration VD1 or the second vibration VD2, and the bonding time of the bump DC-BP and the pad DP-PD. The pressure PP can be controlled by the pressing part PS. The amplitude of the first vibration VD1 or the second vibration VD2 can be controlled by the first amplifier BO1 or the second amplifier BO2. The frequency of each of the first vibration VD1 and the second vibration VD2 can be a frequency corresponding to an ultrasonic wave. In one embodiment, for example, the frequency can be in the range of about 40 kHz to about 60 kHz.

[0157] The connection between the display panel (DP) and the electronic components (DC) may include providing a first vibration (VD1) to the contact surface (CTA) and a second vibration (VD2) to the contact surface (CTA). Figure 11A The process of providing the second vibration VD2 can be shown, and Figure 11B The process of providing the first vibration VD1 can be shown.

[0158] When the second vibration VD2 is provided, it applies vibration to the third-party DR3, and thus pushes the first adhesive member NF-D, disposed between the pads DP-PD and the bumps DC-BP, into the space between the base substrate SUB and the substrate DC-BS, overlapping with the non-pad areas between the multiple pads DP-PD or the multiple bumps DC-BP. When the second vibration VD2 is provided, the energy generated by it can be applied to the first adhesive member NF-D to increase its temperature. The first adhesive member NF-D with the increased temperature can have improved fluidity.

[0159] According to an embodiment of the present invention, the first adhesive member NF-D can be easily moved to the space between the base substrate SUB and the substrate DC-BS. Therefore, the chance of the first adhesive member NF-D being positioned between the pad DP-PD and the bump DC-BP can be reduced, and the reliability of the electrical contact between the pad DP-PD and the bump DC-BP can be improved.

[0160] When a first vibration VD1 is provided, the first vibration VD1 can be applied in a second direction DR2 to bond the pad DP-PD and the bump DC-BP. A conductive bonding layer (not shown) can be formed between the pad DP-PD and the bump DC-BP. In one embodiment, for example, a vibration having a frequency in the ultrasonic range is applied by an ultrasonic bonding device UBA, and thus the pad DP-PD and the bump DC-BP can be rapidly rubbed together. Therefore, frictional energy can be generated between the pad DP-PD and the bump DC-BP. The surface of each of the pad DP-PD and the bump DC-BP can be melted due to the frictional energy. A diffusion layer can be formed between the melted pad DP-PD and the bump DC-BP, and thus the first metal included in the pad DP-PD and the second metal included in the bump DC-BP can be mixed with each other to form a conductive bonding layer. The first metal and the second metal can be mixed and included in the conductive bonding layer.

[0161] When electronic components are mounted onto a display panel using adhesives such as ACF, short-circuit or open-circuit defects may occur. In this case, conductive particles included in the anisotropic conductive film may concentrate on the side surfaces of the bumps of the electronic component, causing short-circuit defects between adjacent bumps, or the conductive particles included in the anisotropic conductive film may not be properly positioned at the locations corresponding to the bumps, causing open-circuit defects. In an embodiment of the invention, the ultrasonic bonding apparatus UBA can mount the electronic component DC onto the display panel DP using an ultrasonic method. According to an embodiment of the invention, a first vibration VD1 and a second vibration VD2 can be applied to the contact surface CTA where the pad DP-PD and the bump DC-BP contact, and thus energy can be applied. Energy can be applied to the pad DP-PD and the bump DC-BP to form a conductive bonding layer. The conductive bonding layer can have a higher conductivity than when the first and second metals are directly bonded using an adhesive. In such an embodiment, the number of processes can be reduced, and therefore, the contact time can be reduced.

[0162] When bonding the display panel DP and the electronic component DC, the first vibration VD1 is provided after the second vibration VD2 is provided. The ultrasonic bonding apparatus UBA uses the second vibration VD2 to push the first adhesive member NF-D, which overlaps with the pad DP-PD and the bump DC-BP, away from overlapping with the pad DP-PD and the bump DC-BP. Therefore, ultrasonic bonding can be performed using the first vibration VD1 after ensuring that the contact surface CTA in which the pad DP-PD and the bump DC-BP are in contact.

[0163] When bonding the display panel DP and the electronic component DC, providing a second vibration VD2 and providing a first vibration VD1 can be performed simultaneously. The ultrasonic bonding device UBA simultaneously provides energy from each of the first vibration VD1 and the second vibration VD2 to the first adhesive member NF-D to rapidly increase the temperature of the first adhesive member NF-D. The first adhesive member NF-D can have improved fluidity. The first adhesive member NF-D can move to avoid overlapping with the pads DP-PD and DC-BP, and the pads DP-PD and DC-BP can be ultrasonically bonded. Therefore, processing time can be reduced, and thus contact time can be reduced.

[0164] Figure 12 An ultrasonic bonding device according to an alternative embodiment of the present invention is shown. Figure 12 In the figures, the same or similar reference numerals indicate the same references as above. Figure 10 The components described are the same or similar to the components, and any duplicate detailed descriptions will be omitted or simplified.

[0165] refer to Figure 12 An optional embodiment of the ultrasonic bonding device UBA-1 may include a platform ST, a head portion HD, a first ultrasonic generator UG1, a second ultrasonic generator UG2, and a pressing portion PS.

[0166] A first ultrasonic generator UG1 may be coupled to a head portion HD. In one embodiment, for example, the first ultrasonic generator UG1 may be coupled to a side surface of the head portion HD. The first ultrasonic generator UG1 may vibrate in a second direction DR2 to provide a first vibration VD1 to the contact surface CTA of the pads DP-PD and the bumps DC-BP. In one embodiment, for example, the first vibration VD1 may be provided to the contact surface CTA through the head portion HD.

[0167] A second ultrasonic generator UG2 can be coupled to the platform ST. In one embodiment, for example, the second ultrasonic generator UG2 can be coupled to the lower surface of the platform ST. The second ultrasonic generator UG2 can vibrate on a third-direction DR3 to provide a second vibration VD2 to the contact surface CTA of the pads DP-PD and the bumps DC-BP. In one embodiment, for example, the second vibration VD2 can be provided to the contact surface CTA via the platform ST. A second amplifier BO2 can be connected between the second converter CV2 and the platform ST.

[0168] Figure 13 An ultrasonic bonding device according to another alternative embodiment of the present invention is shown. Figure 13 In the figures, the same or similar reference numerals indicate the same references as above. Figure 10The components described are the same or similar to the components, and any duplicate detailed descriptions will be omitted or simplified.

[0169] refer to Figure 13 Another alternative embodiment of the ultrasonic bonding device UBA-2 may include a platform ST, a head portion HD, a first ultrasonic generator UG1, a second ultrasonic generator UG2, a third ultrasonic generator UG3, and a pressing portion PS.

[0170] A third ultrasonic generator UG3 may be coupled to the head portion HD. In one embodiment, for example, the third ultrasonic generator UG3 may be coupled to the upper surface of the head portion HD. The third ultrasonic generator UG3 may vibrate on a third direction DR3 to provide a third vibration VD3 to the contact surface CTA of the pads DP-PD and the bumps DC-BP. In one embodiment, for example, the third vibration VD3 may be provided to the contact surface CTA through the head portion HD. The third ultrasonic generator UG3 may include a third transducer CV3 and a third amplifier BO3.

[0171] The third converter CV3 can be connected to a power source that provides an electrical signal (which may be the same as or different from the electrical signal provided to the first converter CV1 and the electrical signal provided to the second converter CV2). The third converter CV3 can convert the electrical signal into physical vibration. In one embodiment, for example, the third converter CV3 may include a nickel resonator, a ferrite resonator, or a BLT resonator comprising piezoelectric ceramics, but the type of the third converter CV3 is not limited to these. The third converter CV3 can form a third vibration VD3 that vibrates on a third-direction DR3.

[0172] The third amplifier BO3 can be connected between the third converter CV3 and the head portion HD. The third amplifier BO3 can amplify the vibration generated from the third converter CV3. In one embodiment, for example, the third amplifier BO3 can amplify the amplitude of the third converter CV3.

[0173] Figure 14 An ultrasonic bonding device according to another alternative embodiment of the present invention is shown. Figure 14 In the figures, the same or similar reference numerals indicate the same references as above. Figure 10 The components described are the same or similar to the components, and any duplicate detailed descriptions will be omitted or simplified.

[0174] refer to Figure 14 Another alternative embodiment of the ultrasonic bonding device UBA-3 may include a platform ST, a head portion HD, a first ultrasonic generator UG, a second ultrasonic generator UG2, and a pressing portion PS.

[0175] A first ultrasonic generator UG1 can be coupled to a platform ST. In one embodiment, for example, the first ultrasonic generator UG1 can be coupled to the lower surface of the platform ST, but the engagement relationship of the first ultrasonic generator UG1 is not limited thereto. In one embodiment, for example, the first ultrasonic generator UG1 can be coupled to a side surface of the platform ST. The first ultrasonic generator UG1 can vibrate in a second direction DR2 to provide a first vibration VD1 to the contact surface CTA of the pads DP-PD and the bumps DC-BP. In one embodiment, for example, the first vibration VD1 can be provided to the contact surface CTA via the platform ST. A first amplifier BO1 can be connected between the first converter CV1 and the platform ST.

[0176] A second ultrasonic generator UG2 may be coupled to the head portion HD. In one embodiment, for example, the second ultrasonic generator UG2 may be coupled to the upper surface of the head portion HD. The second ultrasonic generator UG2 may vibrate on a third-direction DR3 to provide a second vibration VD2 to the contact surface CTA of the pads DP-PD and the bumps DC-BP. In one embodiment, for example, the second vibration VD2 may be provided to the contact surface CTA through the head portion HD.

[0177] According to an embodiment of the present invention, an ultrasonic bonding device including a first ultrasonic generator and a second ultrasonic generator can bond pads of a display panel and bumps of electronic components to each other. In such an embodiment, the first ultrasonic generator can vibrate in a second direction, and the second ultrasonic generator can vibrate in the thickness direction of the display panel. An adhesive member can be disposed between the pads and the bumps. A head portion can provide at least one of vibration selected from the second direction and vibration in the thickness direction to a base substrate disposed on a platform and a substrate fixed to the head portion. The second ultrasonic generator can vibrate in the thickness direction to move the adhesive member so that it does not overlap with the pads and bumps in a plane. Therefore, the reliability of the electrical contact between the pads and bumps can be improved.

[0178] According to an embodiment of the invention, a first ultrasonic vibration can vibrate in a first direction to ultrasonically bond the pads and bumps. The first metal of the pads and the second metal of the bumps are directly bonded to each other by ultrasonic bonding, thereby having higher conductivity than when bonding with adhesive. Therefore, the reliability of the electrical contact between the pads and bumps can be improved.

[0179] This invention should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the inventive concept to those skilled in the art.

[0180] Although the invention has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit or scope of the invention as defined by the appended claims.

Claims

1. An ultrasonic bonding device, comprising: The platform includes an upper surface on a plane defined by a first direction and a second direction intersecting the first direction; The head portion is spaced apart from the platform in a third direction intersecting the first and second directions; The first ultrasonic generator vibrates in a direction parallel to the second direction; The second ultrasonic generator vibrates in a direction parallel to the third direction; as well as The third ultrasonic generator vibrates in a direction parallel to the third direction. in, The first ultrasonic generator is connected to the head portion. The second ultrasonic generator is connected to the platform, and The third ultrasound generator is connected to the head portion.

2. The ultrasonic bonding device according to claim 1, wherein, The first ultrasonic generator and the second ultrasonic generator vibrate simultaneously.

3. The ultrasonic bonding device according to claim 1, further comprising: The pressing part is disposed on the first ultrasonic generator or the second ultrasonic generator, wherein the pressing part presses the head part upward on the third party through the first ultrasonic generator or the second ultrasonic generator.

4. The ultrasonic bonding device according to claim 1, wherein, The first ultrasonic generator includes: A first converter converts an electrical signal into a first vibration that vibrates in the second direction; and The first amplifier amplifies the amplitude of the first vibration.

5. The ultrasonic bonding device according to claim 4, wherein, The second ultrasonic generator includes: The second converter converts the electrical signal into a second vibration that vibrates upwards on the third party; and The second amplifier amplifies the amplitude of the second vibration.

6. The ultrasonic bonding device according to claim 5, wherein, The third ultrasonic generator includes: The third converter converts the electrical signal into a third vibration that vibrates upwards on the third side; and The third amplifier amplifies the amplitude of the third vibration.

7. The ultrasonic bonding device according to claim 6, wherein, The head portion provides the first vibration and the third vibration to a first object disposed on the platform and a second object fixed to the head portion.

8. The ultrasonic bonding device according to claim 7, wherein, Each of the first vibration, the second vibration, and the third vibration has a frequency in the range of 40 kHz to 60 kHz.

9. A method for ultrasonic bonding, the method comprising: A display panel is provided on a platform, the platform including an upper surface on a plane defined by a first direction and a second direction intersecting the first direction; The electronic components are secured to a head portion that is spaced apart from the platform in a third direction intersecting the first and second directions; Make the display panel and the electronic components come into contact with each other; as well as The display panel and the electronic components are joined together. The joining of the display panel and the electronic components to each other includes: Provide a first vibration to the contact surface between the display panel and the electronic component, vibrating in a direction parallel to the second direction; Provide the contact surface with a second vibration that vibrates in a direction parallel to the third direction; and A third vibration is provided to the contact surface in a direction parallel to the third direction. in, The first vibration is provided to the contact surface through the head portion. The second vibration is provided to the contact surface via the platform, and The third vibration is provided to the contact surface through the head portion.

10. The method according to claim 9, wherein, The first vibration is provided after the second vibration is provided.

11. The method according to claim 9, wherein, Providing the first vibration and providing the second vibration are performed simultaneously.

12. The method according to claim 9, wherein, Providing the second vibration includes: pushing the adhesive member disposed between the display panel and the electronic component away from overlapping the contact surface.

13. The method according to claim 12, wherein, The adhesive component includes a non-conductive film.

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