Wafer repair method, device, equipment and storage medium

Abstract

The present disclosure provides a wafer repair method, system, device, equipment and storage medium, which relate to the field of semiconductor equipment. The method comprises: a laser machine obtains test data for repairing a predetermined wafer; the laser machine sends the test data to a processing server so that the processing server converts the test data into repair data in a predetermined format; the laser machine obtains the repair data in the predetermined format to repair the predetermined wafer. The method effectively improves the efficiency and effect of the laser machine repairing the wafer.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor equipment, and in particular, to a wafer repair method, system, device, equipment and readable storage medium. Background Art

[0002] As integrated circuits continue to develop towards smaller form factors, more devices will be integrated on the chip. The chip manufacturing process mainly includes chip design, wafer manufacturing, packaging, wafer testing and other steps. In the manufacturing process of some dynamic random access memory (DRAM) or static random access memory (SRAM) products, a repair step is set after the wafer test so that when the normal circuit in the chip cannot be enabled, the backup circuit is turned on to enable the chip to work normally. The existing wafer repair process generally uses laser repair (i.e. laser repair) or fuse circuit for repair. Laser repair is to use a laser machine to laser repair the wafer according to the wafer test data. However, the existing laser machine has limited storage space and is prone to laser repair errors, which reduces the efficiency and effect of repair.

[0003] As mentioned above, how to improve the repair efficiency and effect of laser machines has become an urgent problem to be solved.

[0004] The above information disclosed in this Background section is only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute the prior art that is already known to one of ordinary skill in the art. Summary of the invention

[0005] The purpose of the present disclosure is to provide a wafer repair method, system, device, equipment and readable storage medium, which can at least to some extent overcome the problems of low repair efficiency and poor effect caused by limited storage space of laser machines in related technologies and easy occurrence of laser repair errors.

[0006] Other features and advantages of the present disclosure will become apparent from the following detailed description, or may be learned in part by the practice of the present disclosure.

[0007] According to one aspect of the present disclosure, a wafer repair method is provided, including: a laser machine obtains test data for repairing a predetermined wafer; the laser machine sends the test data to a processing server so that the processing server converts the test data into repair data in a predetermined format; the laser machine obtains the repair data in the predetermined format to repair the predetermined wafer.

[0008] According to an embodiment of the present disclosure, the laser machine sends the test data to a processing server so that the processing server converts the test data into repair data in a predetermined format, including: the laser machine remotely calls a conversion program in the processing server through a conversion instruction so that the processing server executes the conversion program to obtain the test data; the laser machine remotely calls the conversion program through the conversion instruction so that the processing server executes the conversion program to convert the test data into repair data in the predetermined format.

[0009] According to one embodiment of the present disclosure, the laser machine obtains the repair data in the predetermined format to repair the predetermined wafer, including: transmitting the repair data in the predetermined format to the laser machine in a binary format, and the repair data in the predetermined format is stored in the processing server; the laser machine repairs the predetermined wafer according to the repair data in the predetermined format.

[0010] According to an embodiment of the present disclosure, the method further includes: the laser machine acquiring identification information of the predetermined wafer; and the laser machine downloading the test data from a file server according to the identification information.

[0011] According to an embodiment of the present disclosure, after the laser machine sends the test data to a processing server so that the processing server converts the test data into repair data in a predetermined format, the method further includes: deleting the test data stored in the laser machine.

[0012] According to an embodiment of the present disclosure, the transmission speed of the memory of the processing server is higher than the transmission speed of the memory of the laser machine.

[0013] According to an embodiment of the present disclosure, the system environment of the laser machine is different from the system environment of the processing server.

[0014] According to another aspect of the present disclosure, a wafer repair method is provided, including: a processing server obtains test data sent by a laser machine for repairing a predetermined wafer; the processing server converts the test data into repair data in a predetermined format; the processing server sends the repair data in the predetermined format to the laser machine so that the laser machine repairs the predetermined wafer.

[0015] According to another aspect of the present disclosure, a wafer repair system is provided, including a laser machine and a processing server, wherein the laser machine is connected to the processing server, wherein: the laser machine is used to obtain test data for repairing a predetermined wafer; send the test data to the processing server; obtain repair data in a predetermined format; repair the predetermined wafer; the processing server is used to obtain the test data; and convert the test data into repair data in the predetermined format.

[0016] According to an embodiment of the present disclosure, there are multiple laser machines, and the multiple laser machines are respectively connected to the processing server via a local area network.

[0017] According to another aspect of the present disclosure, a wafer repair device is provided, including: a data acquisition module, used for a laser machine to acquire test data for repairing a predetermined wafer; a data sending module, used for the laser machine to send the test data to a processing server so that the processing server converts the test data into repair data in a predetermined format; and a wafer repair module, used for the laser machine to obtain the repair data in the predetermined format to repair the predetermined wafer.

[0018] According to one embodiment of the present disclosure, the device further includes: a data processing module, which is used for the laser machine to remotely call the conversion program in the processing server through the conversion instruction so that the processing server executes the conversion program to obtain the test data; the data processing module is also used for the laser machine to remotely call the conversion program through the conversion instruction so that the processing server executes the conversion program to convert the test data into the repair data in the predetermined format.

[0019] According to one embodiment of the present disclosure, the device also includes: a data transmission module, which is used to transmit the repair data in the predetermined format to the laser machine in a binary format, and the repair data in the predetermined format is stored in the processing server; the wafer repair module is also used by the laser machine to repair the predetermined wafer according to the repair data in the predetermined format.

[0020] According to an embodiment of the present disclosure, the data acquisition module is also used by the laser machine to acquire identification information of the predetermined wafer; the data acquisition module is also used by the laser machine to download the test data from a file server according to the identification information.

[0021] According to an embodiment of the present disclosure, the device further includes: a data deletion module, configured to delete the test data stored in the laser machine.

[0022] According to an embodiment of the present disclosure, the transmission speed of the memory of the processing server is higher than the transmission speed of the memory of the laser machine.

[0023] According to an embodiment of the present disclosure, the system environment of the laser machine is different from the system environment of the processing server.

[0024] According to another aspect of the present disclosure, a device is provided, comprising: a memory, a processor, and executable instructions stored in the memory and executable in the processor, wherein the processor implements any of the above methods when executing the executable instructions.

[0025] According to another aspect of the present disclosure, a computer-readable storage medium is provided, on which computer-executable instructions are stored, and when the executable instructions are executed by a processor, any of the above methods is implemented.

[0026] The wafer repair method provided by the embodiment of the present disclosure obtains test data for repairing a predetermined wafer through a laser machine and then sends the test data to a processing server so that the processing server converts the test data into repair data in a predetermined format. The laser machine obtains the repair data in the predetermined format to repair the predetermined wafer, thereby effectively improving the efficiency and effect of the laser machine in repairing the wafer.

[0027] It is to be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other objects, features and advantages of the present disclosure will become more apparent by describing in detail example embodiments thereof with reference to the attached drawings.

[0029] Figure 1 A schematic diagram showing a wafer post-test repair process in the related art.

[0030] Figure 2A A schematic structural diagram of a wafer repair system in an embodiment of the present disclosure is shown.

[0031] Figure 2B A schematic diagram of a wafer repair process is shown according to an exemplary embodiment.

[0032] Figure 3A A flow chart of a wafer repair method in an embodiment of the present disclosure is shown.

[0033] Figure 3B An example diagram of a test data file in an embodiment of the present disclosure is shown.

[0034] Figure 4 A flow chart of another wafer repair method in an embodiment of the present disclosure is shown.

[0035] Figure 5 A block diagram of a wafer repair device in an embodiment of the present disclosure is shown.

[0036] Figure 6 A block diagram of another wafer repair device in an embodiment of the present disclosure is shown.

[0037] Figure 7 A schematic structural diagram of an electronic device in an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0038] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that the disclosure will be more comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The accompanying drawings are only schematic illustrations of the disclosure and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and thus their repeated description will be omitted.

[0039] In addition, the described features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced while omitting one or more of the specific details, or other methods, devices, steps, etc. may be adopted. In other cases, well-known structures, methods, devices, implementations or operations are not shown or described in detail to avoid obscuring various aspects of the present disclosure.

[0040] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. The symbol " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0041] In this disclosure, unless otherwise clearly specified and limited, terms such as "connection" should be understood in a broad sense, for example, it can be an electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this disclosure can be understood according to specific circumstances.

[0042] The wafer test and repair process in the related art is as follows: Figure 1As shown, wafer 1002 generates wafer test data after wafer testing (S102), and laser machine 1004 obtains the wafer test data, converts the wafer test data into repair data in a format (S104) recognizable by laser machine 1004, and then performs laser repair on the wafer (S106).

[0043] As mentioned above, the storage space of the laser machine in the related art is limited, and it cannot be expanded due to the characteristics of the machine. The time for format conversion after obtaining the wafer test data is long, resulting in low utilization of the laser machine. And when the test data is large, the machine is prone to downtime, resulting in errors in the laser repair of the wafer, resulting in wafer loss.

[0044] Therefore, the present disclosure provides a wafer repair method, which obtains test data for repairing a predetermined wafer through a laser machine and sends the test data to a processing server so that the processing server converts the test data into repair data in a predetermined format. The laser machine obtains the repair data in the predetermined format to repair the predetermined wafer, thereby effectively improving the efficiency and effect of the laser machine in repairing the wafer.

[0045] Figure 2A According to an exemplary embodiment, a wafer repair system is shown, which includes a laser machine 202 and a processing server 204 , wherein the laser machine 202 is connected to the processing server 204 via a network 206 .

[0046] After the laser machine 202 obtains the test data for repairing the predetermined wafer, it sends the test data to the processing server 204. After the processing server 204 converts the test data into repair data in a predetermined format, the laser machine 202 obtains the repair data in the predetermined format from the processing server 204. Then, the laser machine 202 repairs the predetermined wafer according to the repair data. The model of the laser machine is not limited.

[0047] There may be multiple laser machines 202, and the multiple laser machines 202 may be connected to the processing server 204 through the local area network 206. For example, the processing server 204 may be configured in a wafer manufacturing clean room workshop, and the processing server 204 and the multiple laser machines 202 may be connected to the network 206. The remote processing server 204 may be configured with, for example, 16G memory, 100G hard disk, and 4-core CPU processor.

[0048] The wafer repair system may also include, for example, a terminal device 208 connected to the processing server 204 via the network 206 , for configuring and deploying the processing server 204 .

[0049] According to the wafer repair system provided by the embodiment of the present disclosure, after the laser machine obtains the wafer test data, the format is converted through the processing server, so that the memory of the laser machine does not need to be used for processing data conversion, thereby improving the utilization rate of the machine.

[0050] Figure 2B According to an exemplary embodiment, a schematic diagram of a wafer repair process is shown. Figure 2B As shown, after the wafer 2002 undergoes wafer testing (S202), the server 2003 obtains the wafer testing data and converts it into repair data in a format (S204) that can be recognized by the laser machine 2004, and remotely copies the repair data (S206) to the laser machine 2004, and then the laser machine 2004 performs laser repair on the wafer (S208). The server 2003 can be a file server.

[0051] Figure 3A FIG. 1 is a flow chart of a wafer repair method according to an exemplary embodiment. Figure 3A The method shown can be applied to the laser machine 202 of the above system, for example.

[0052] refer to Figure 3A , the method 30 provided in the embodiment of the present disclosure may include the following steps.

[0053] In step S302, the laser machine obtains test data for repairing a predetermined wafer. Wafer testing is to perform a probe test on each die on the wafer to test its electrical characteristics. Unqualified die will be marked and their location on the wafer will be recorded and saved in the test data.

[0054] In some embodiments, for example, the test data content may include a test program version, a wafer lot number, etc. Based on this information, the test data of the corresponding wafer can be found in the corresponding storage location. The test data is generated by the test system and can be stored in a file transfer protocol (FTP) server, such as Figure 3B As shown, for example, it is saved in FTP in JavaScript Object Notation (JSON) format for capture by the conversion program.

[0055] In step S304, the laser machine sends the test data to the processing server so that the processing server converts the test data into repair data in a predetermined format. The laser machine can call the processing server through a conversion command to obtain the test data from FTP through a conversion program, and then the processing server continues to execute the conversion program to convert the test data into repair data in a predetermined format.

[0056] In some embodiments, for example, the data generated during wafer testing may be an asc format file, including wafer information, location information that needs to be repaired, etc.; after conversion, the data that can be recognized by the laser machine may be a rep format file, in which the location information that needs to be repaired is converted into decimal laser fuse coordinates, such as "x=2, y=11", so that the laser machine can perform laser repair operations.

[0057] In some embodiments, for example, during the conversion process, the conversion program can provide real-time feedback on the conversion progress on the interface, and when it reaches 100%, it means the conversion is complete. It can also record the specific time of file conversion, the total time spent on the conversion, etc.

[0058] In step S306, the laser machine obtains the repair data in a predetermined format to repair the predetermined wafer. The laser machine can perform laser repair operations according to the laser fuse coordinates to repair the wafer with the predetermined mark. The laser machine does not need to perform file conversion operations, and its memory is only used for repair operations, which can improve the efficiency of the machine's laser repair work.

[0059] According to the wafer repair method provided by the embodiment of the present disclosure, after the laser machine obtains the test data for repairing the predetermined wafer, the test data is sent to the processing server so that the processing server converts the test data into repair data in a predetermined format. The laser machine obtains the repair data in the predetermined format to repair the predetermined wafer, so that the laser machine does not need to perform data conversion operations, thereby improving the utilization rate of the machine and effectively improving the efficiency and effect of the laser machine in repairing the wafer.

[0060] Figure 4 FIG. 1 is a flow chart of another wafer repair method according to an exemplary embodiment. Figure 4 The method shown can be applied to the laser machine 202 of the above system, for example.

[0061] refer to Figure 4 , the method 40 provided in the embodiment of the present disclosure may include the following steps.

[0062] In step S4022, the laser machine obtains the identification information of the scheduled wafers. The scheduled batch of wafers can be reserved for the laser machine, and the laser machine can download the corresponding test data from the FTP server according to the identification information of the reserved wafers.

[0063] In step S4024, the laser machine downloads the test data from the file server according to the identification information. The laser machine can download the test data to the local laser machine for subsequent format conversion.

[0064] In some embodiments, the process of downloading test data by the laser machine includes initializing the input and output folders before downloading, deleting the original test files recorded, and then connecting to the FTP server by determining the IP address, and then reading the test data and downloading it. Specifically, the test data can be downloaded based on wafer information such as batch information according to the corresponding program to complete the step of downloading test data by the laser machine. In addition, the number of wafers in a batch can be multiple, so the test data of multiple wafers can be downloaded in one program call process.

[0065] In step S4042, the laser machine remotely calls the conversion program in the processing server through the conversion instruction so that the processing server executes the conversion program to obtain the test data. The system environment of the laser machine is different from the system environment of the processing server. The conversion instruction can remotely call the conversion program to transmit the test data to the remote processing server and perform the conversion action remotely. The method of transmitting the test data to the remote processing server includes copying the test data to the processing server, and the local laser machine saves the test data; in addition, it also includes transmitting the test data to the processing server, and the local laser machine no longer saves the test data. The latter can effectively reduce the used space of the laser machine and effectively improve the utilization rate of the machine storage space.

[0066] In some embodiments, for example, the operating system of the laser machine is White Box (currently there is no such system product on the market, which makes it impossible to simply expand the memory capacity of the machine), and the conversion command "runlr" can be executed on the operating system; the remote processing server can be a Linux system, so the conversion command needs to be compatible with dual systems, and Java 5.0 software is used for programming in different environments to implement the remote conversion program on the processing server such as the Linux system on the White Box call. The remote processing server deploys the conversion program "rconv", and the language of the remote conversion program is not limited and can be developed accordingly according to the operating system of the remote processing server.

[0067] In step S4043, the test data stored in the laser machine is deleted. After the processing server obtains the test data through the conversion program, the laser machine can delete the test data stored in the laser machine to expand the storage space of the laser machine and improve the machine utilization rate.

[0068] In step S4044, the laser machine remotely calls the conversion program through the conversion instruction so that the processing server executes the conversion program to convert the test data into repair data in a predetermined format.

[0069] In some embodiments, for example, the transmission speed of the memory of the processing server is higher than the transmission speed of the memory of the laser machine. The memory model of the laser machine operating system is DDR2, and the memory cannot be expanded locally. The memory model of the processing server can be DDR4. By remotely calling the conversion program of the processing server in the conversion instruction of the laser machine operating system, the interaction between different memory models can be realized. It can be connected through the Ethernet interface through the provided fixed IP port and gateway. The DDR4 memory size of the processing server can be above 16G, such as 32G, 64G, etc. The conversion program is developed on this server and the conversion action is executed. The conversion program can be automatically executed after being called, and the total conversion time of a batch of 25 wafer product test data can be 85s.

[0070] In some embodiments, for example, the transmission speed of the memory of the processing server is the same as the transmission speed of the memory of the laser machine, and the format conversion of the test data is performed by remotely calling the server instead of converting it locally on the laser machine to improve machine utilization.

[0071] In some embodiments, for example, the process of failed conversion can be recorded accordingly, and the corresponding wafer can be detained through the production system, and the wafer detention record can be fed back to the user so that the user can re-perform the production operation to avoid erroneous operation during the production process. If the laser machine alarms due to conversion failure or other reasons in the middle of the operation and needs to be re-operated, when re-converting the data, it will check whether there are any files from the previous operation in the local directory of the laser machine. The conversion program will clear the remaining data and perform the second conversion operation. For example, the batch data folder, wafer data folder, repair data folder, etc. can be initialized in sequence, and the files of the previous operation are cleared before the second conversion operation. In step S4062, the processing server uses a binary format to transmit the repair data in a predetermined format to the laser machine, and the repair data in a predetermined format is stored in the processing server. After the processing server completes the conversion, the repair data can be transmitted to the local laser machine. The copying and transmission of data are automatically executed, and no additional time is required, and the central processing unit of the laser machine is not occupied.

[0072] In some embodiments, for example, the converted file is copied from the Linux environment of the processing server to the laser machine through a conversion program, and the copied data is transmitted in binary format. This can avoid data loss caused by copying data in different system environments, ensure that the data is correctly transmitted to the laser machine end, and avoid laser operation errors.

[0073] In some embodiments, for example, the patch data document after format conversion may record file identification information, conversion completion time, etc., and the converted file may be in rep format.

[0074] In some embodiments, for example, the remote processing server can establish a backup system to save the converted data into a backup folder for subsequent historical data query. For example, the backup folder can include a subfolder, which can further include multiple subfolders, etc., which are converted repair data of multiple wafers. The hard disk of the remote processing server can retain data for a long time, which is convenient for subsequent tracking and analysis.

[0075] In step S4064, the laser machine is used to repair the predetermined wafer according to the repair data in the predetermined format. The test data is converted through the remote processing server, and the processing resources of the laser machine are not occupied.

[0076] In some embodiments, for example, the size of the test data of each wafer of a DDR4 product is about 60M, the memory of the laser machine is 1G, and in the related art, the file conversion is performed locally on the laser machine. The conversion time of the test data of each wafer is about 5 minutes, and the conversion time of each batch of wafers (such as 25 pieces) is about 25*5=125 minutes. Therefore, 125 minutes of file conversion time is required before performing the laser repair operation. Through the method provided by the embodiment of the present disclosure, the laser machine calls the conversion program to perform conversion through the processing server. The conversion time for each piece is about 3 seconds. In the case of 25 wafers per batch, the conversion time for each batch is 25x3=75 seconds. It takes about 20 seconds to remotely copy data from the processing server to the local laser machine, which is no more than 2 minutes in total. The operation waiting time for each batch is reduced by about 112 minutes, the machine utilization rate is improved, and the test data conversion is avoided. It occupies the memory space of the laser machine, resulting in reduced machine processing capacity, downtime and increased data error rate, thereby reducing losses such as wafer scrapping caused by laser repair errors, improving wafer yield, and reducing wafer manufacturing costs.

[0077] In some embodiments, for example, the laser repair process may be recorded in a document, which may include wafer identification information, wafer model, batch information, processing time, etc., and may also record whether any abnormalities occur during the wafer laser repair process.

[0078] Figure 5 FIG. 1 is a block diagram of a wafer repair device according to an exemplary embodiment. Figure 5 The device shown can be applied to the laser machine 202 mentioned above, for example.

[0079] refer to Figure 5 The device 50 provided in the embodiment of the present disclosure may include a data acquisition module 502 , a data sending module 504 and a wafer repair module 506 .

[0080] The data acquisition module 502 may be used by the laser machine to acquire test data for repairing a predetermined wafer.

[0081] The data sending module 504 can be used for the laser machine to send the test data to the processing server so that the processing server converts the test data into repair data in a predetermined format.

[0082] The wafer repair module 506 may be used by a laser machine to obtain repair data in a predetermined format to repair a predetermined wafer.

[0083] Figure 6 FIG. 1 is a block diagram of another wafer repair device according to an exemplary embodiment. Figure 6 The device shown can be applied to the laser machine 202 mentioned above, for example.

[0084] refer to Figure 6 The device 60 provided in the embodiment of the present disclosure may include a data acquisition module 602, a data processing module 603, a data sending module 604, a data deletion module 6042, a data transmission module 605 and a wafer repair module 606.

[0085] The data acquisition module 602 may be used for the laser machine to acquire identification information of a predetermined wafer.

[0086] The data acquisition module 602 can also be used for the laser machine to download test data from the file server according to the identification information.

[0087] The data processing module 603 can be used for the laser machine to remotely call the conversion program in the processing server through the conversion command so that the processing server executes the conversion program to obtain test data. The transmission speed of the memory of the processing server is higher than the transmission speed of the memory of the laser machine. The system environment of the laser machine is different from the system environment of the processing server.

[0088] The data processing module 603 can also be used for the laser machine to remotely call the conversion program through the conversion instruction so that the processing server executes the conversion program to convert the test data into the repair data of the predetermined format.

[0089] The data sending module 604 can be used for the laser machine to send the test data to the processing server so that the processing server converts the test data into repair data in a predetermined format.

[0090] The data deletion module 6042 may be used to delete the test data stored in the laser machine.

[0091] The data transmission module 605 may be used to transmit the repair data in a predetermined format to the laser machine in a binary format, and the repair data in the predetermined format is stored in the processing server.

[0092] The wafer repair module 606 may be used by a laser machine to obtain repair data in a predetermined format to repair a predetermined wafer.

[0093] The wafer repair module 606 can also be used by the laser machine to repair a predetermined wafer according to the repair data in a predetermined format.

[0094] The specific implementation of each module in the device provided by the embodiment of the present disclosure can refer to the content of the above method, which will not be repeated here.

[0095] Figure 7 The following is a schematic diagram showing the structure of an electronic device in an embodiment of the present disclosure. It should be noted that: Figure 7 The device shown is only an example of a computer system, which should not bring any limitation to the functions and scope of use of the embodiments of the present disclosure.

[0096] like Figure 7 As shown, the device 700 includes a central processing unit (CPU) 701, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 702 or a program loaded from a storage portion 708 into a random access memory (RAM) 703. In the RAM 703, various programs and data required for the operation of the device 700 are also stored. The CPU 701, the ROM 702, and the RAM 703 are connected to each other via a bus 704. An input / output (I / O) interface 705 is also connected to the bus 704.

[0097] The following components are connected to the I / O interface 705: an input section 706 including a keyboard, a mouse, etc.; an output section 707 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 708 including a hard disk, etc.; and a communication section 709 including a network interface card such as a LAN card, a modem, etc. The communication section 709 performs communication processing via a network such as the Internet. A drive 710 is also connected to the I / O interface 705 as needed. A removable medium 711, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 710 as needed, so that a computer program read therefrom is installed into the storage section 708 as needed.

[0098] In particular, according to an embodiment of the present disclosure, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present disclosure includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program contains a program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication part 709, and / or installed from a removable medium 711. When the computer program is executed by a central processing unit (CPU) 701, the above-mentioned functions defined in the system of the present disclosure are executed.

[0099] It should be noted that the computer-readable medium shown in the present disclosure may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present disclosure, a computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device. In the present disclosure, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, in which a computer-readable program code is carried. This propagated data signal may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, which may send, propagate or transmit a program for use by or in conjunction with an instruction execution system, apparatus or device. The program code contained on the computer-readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, optical cable, RF, etc., or any suitable combination of the above.

[0100] The flow charts and block diagrams in the accompanying drawings illustrate the possible architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present disclosure. In this regard, each box in the flow chart or block diagram can represent a module, a program segment, or a part of a code, and the above-mentioned module, program segment, or a part of a code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flow chart, and the combination of the boxes in the block diagram or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0101] The modules involved in the embodiments described in the present disclosure may be implemented by software or hardware. The modules described may also be set in a processor, for example, it may be described as: a processor includes a data acquisition module, a data transmission module and a wafer repair module. The names of these modules do not constitute a limitation on the modules themselves in some cases, for example, the data acquisition module may also be described as a "module for downloading test data from a connected file server".

[0102] As another aspect, the present disclosure further provides a computer-readable medium, which may be included in the device described in the above embodiment; or may exist independently without being assembled into the device. The above computer-readable medium carries one or more programs, and when the above one or more programs are executed by a device, the device includes: the laser machine obtains test data for repairing a predetermined wafer; the laser machine sends the test data to a processing server so that the processing server converts the test data into repair data in a predetermined format; the laser machine obtains the repair data in a predetermined format to repair the predetermined wafer.

[0103] The exemplary embodiments of the present disclosure are specifically shown and described above. It should be understood that the present disclosure is not limited to the detailed structures, configurations or implementations described herein; on the contrary, the present disclosure is intended to cover various modifications and equivalent configurations included in the spirit and scope of the appended claims.

Claims

1. A wafer repair method, characterized in that: include: The laser machine obtains test data for repairing the scheduled wafer; The laser machine remotely calls the conversion program in the processing server through the conversion instruction, so that the processing server executes the conversion program to obtain the test data; The laser machine remotely calls the conversion program through the conversion instruction to enable the processing server to execute the conversion program to convert the test data into repair data in a predetermined format; The laser machine obtains the repair data in the predetermined format to repair the predetermined wafer.

2. The method according to claim 1, characterized in that The laser machine obtains the repair data in the predetermined format to repair the predetermined wafer, including: The repair data in the predetermined format is transmitted to the laser machine in a binary format, and the repair data in the predetermined format is stored in the processing server; The laser machine repairs the predetermined wafer according to the repair data in the predetermined format.

3. The method according to claim 1, characterized in that Also includes: The laser machine obtains identification information of the predetermined wafer; The laser machine downloads the test data from the file server according to the identification information.

4. The method according to claim 1, characterized in that After the laser machine sends the test data to the processing server so that the processing server converts the test data into repair data in a predetermined format, the method further includes: Delete the test data stored in the laser machine.

5. The method according to any one of claims 1 to 4, characterized in that: The transmission speed of the memory of the processing server is higher than the transmission speed of the memory of the laser machine.

6. The method according to any one of claims 1 to 4, characterized in that: The system environment of the laser machine is different from the system environment of the processing server.

7. A wafer repair method, characterized in that: include: The processing server executes a conversion program remotely called by the laser machine through a conversion instruction to obtain test data sent by the laser machine for repairing a predetermined wafer; The processing server executes the conversion program to convert the test data into repair data in a predetermined format; The processing server sends the repair data in the predetermined format to the laser machine so that the laser machine repairs the predetermined wafer.

8. A wafer repair system, characterized in that: It includes a laser machine and a processing server, wherein the laser machine is connected to the processing server, wherein: The laser machine is used to obtain test data for repairing a predetermined wafer; remotely call a conversion program in a processing server through a conversion instruction so that the processing server executes the conversion program to obtain the test data; remotely call the conversion program through the conversion instruction so that the processing server executes the conversion program to convert the test data into repair data in a predetermined format; obtain the repair data in the predetermined format; and repair the predetermined wafer; The processing server is used to execute the conversion program remotely called by the laser machine through the conversion instruction to obtain the test data; and execute the conversion program to convert the test data into the repair data in the predetermined format.

9. The system according to claim 8, characterized in that There are multiple laser machines, and the multiple laser machines are connected to the processing server respectively through a local area network.

10. A wafer repair device, characterized in that: include: A data acquisition module is used for the laser machine to acquire test data for repairing a predetermined wafer; A data sending module, used for the laser machine to remotely call the conversion program in the processing server through the conversion instruction so that the processing server executes the conversion program to obtain the test data; The data sending module is also used for the laser machine to remotely call the conversion program through the conversion instruction so that the processing server executes the conversion program to convert the test data into repair data in a predetermined format; The wafer repair module is used for the laser machine to obtain the repair data in the predetermined format to repair the predetermined wafer.

11. A wafer repair device, comprising: A memory, a processor, and executable instructions stored in the memory and executable in the processor, wherein the processor implements the method according to any one of claims 1 to 7 when executing the executable instructions.

12. A computer-readable storage medium having computer-executable instructions stored thereon, characterized in that: When the executable instructions are executed by a processor, the method according to any one of claims 1 to 7 is implemented.

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