Headphone wearing induction circuit, headphone and electronic equipment

Abstract

The present application belongs to the field of circuit technology and provides an earphone wearing sensing circuit, a headset and an electronic device, wherein the earphone wearing sensing circuit includes a reference sensor, a primary sensor, a protection sensor and a sensing signal processing module, wherein the reference sensor is used to provide a first reference capacitance signal and a second reference capacitance signal and send them to the sensing signal processing module, the primary sensor is used to provide a first capacitance sensing signal and a second capacitance sensing signal and send them to the sensing signal processing module, the protection sensor is used to shield the interference of the signal generated by the speaker on the primary sensor, and the sensing signal processing module is used to determine the wearing state of the headset, thereby solving the problem that the existing headset cannot accurately detect the wearing state of the headset after being turned on in the wearing state.

Description

Technical Field

[0001] The present application belongs to the field of circuit technology, and in particular relates to an earphone wearing sensing circuit, a headset, and an electronic device. Background Art

[0002] Currently, more and more headsets are becoming smaller and more functional. To maximize power conservation and extend standby time, headsets can be equipped with a wear detection function. When no headset is detected, it can enter a low-power mode to reduce current consumption, maximize usage time, and enhance the user experience.

[0003] However, most headphones currently on the market use a single copper sheet to implement a capacitive-triggered wearing sensing function, which has a weak sensing effect. Moreover, a single copper sheet can only generate one capacitive sensing signal. Therefore, it can only be determined whether the headphones are being worn correctly by the change in the capacitive sensing signal from when the headphones are not being worn to when they are being worn. Therefore, existing headphones cannot accurately detect the wearing status of the headphones after being turned on while being worn. Summary of the Invention

[0004] The purpose of this application is to provide an earphone wearing sensing circuit, a headset and an electronic device, aiming to solve the problem that the existing headset cannot accurately detect the wearing status of the headset after being turned on in the wearing state.

[0005] A first aspect of an embodiment of the present application provides an earphone wearing sensing circuit, which is applied to an earphone. The earphone wearing sensing circuit includes:

[0006] a reference sensor, connected to the sensing signal processing module, configured to provide a first reference capacitance signal and a second reference capacitance signal, and transmit the first reference capacitance signal and the second reference capacitance signal to the sensing signal processing module; wherein the first reference capacitance signal is a reference capacitance signal when the earphone is worn, and the second reference capacitance signal is a reference capacitance signal when the earphone is not worn;

[0007] a primary sensor connected to the sensing signal processing module, configured to provide a first capacitance sensing signal and a second capacitance sensing signal, and transmit the first capacitance sensing signal and the second capacitance sensing signal to the sensing signal processing module; wherein the first capacitance sensing signal is a capacitance sensing signal detected by the primary sensor when the earphone is worn, and the second capacitance sensing signal is a capacitance sensing signal detected by the primary sensor when the earphone is not worn;

[0008] A protection sensor is provided between the primary sensor and the speaker of the headset, and is used to shield the signal generated by the speaker from interfering with the primary sensor;

[0009] The sensing signal processing module is configured to generate an earphone wearing detection signal according to a first capacitance difference between the first reference capacitance signal and the first capacitance sensing signal, and a second capacitance difference between the second reference capacitance signal and the second capacitance sensing signal.

[0010] In one embodiment, when the sensing signal processing module detects that the first capacitance difference is greater than the second capacitance difference, it generates a first detection signal and sends it to the control module to determine that the earphone is in a worn state; when the first capacitance difference is less than the second capacitance difference, it generates a second detection signal and sends it to the control module to determine that the earphone is not in a worn state.

[0011] In one embodiment, the area of the guard sensor is greater than or equal to the area of the primary sensor, so as to isolate the primary sensor from the influence of the external environment.

[0012] In one embodiment, the guard sensor completely covers the primary sensor.

[0013] In one embodiment, the primary sensor and the protection sensor are both inductive copper sheets.

[0014] In one embodiment, the reference sensor is a flexible printed circuit board.

[0015] In one embodiment, the flexible circuit board is arranged on the inner edge of the earphone to reduce the influence of temperature and humidity on the flexible circuit board.

[0016] In one embodiment, the sensing signal processing module includes: a sensing signal processing chip, a first resistor, a second resistor, a third resistor, and a fourth resistor; wherein,

[0017] The first resistor is connected between the sensing signal processing chip and the primary sensor through a first communication port, the second resistor is connected between the sensing signal processing chip and the guard sensor through a second communication port, the third resistor is connected between the sensing signal processing chip and the reference sensor through a third communication port, and the fourth resistor is connected between the sensing signal processing chip and the reference sensor through a fourth communication port.

[0018] A second aspect of the embodiments of the present application provides a headset, comprising the headset wearing sensing circuit as described in any one of the above items.

[0019] A third aspect of an embodiment of the present application provides an electronic device, comprising: a control module; and an earphone wearing sensing circuit as described in any one of the above items, wherein the earphone wearing sensing circuit is connected to the control module and is used to provide the earphone wearing detection signal to the control module to determine the wearing status of the earphone.

[0020] An embodiment of the present application provides an earphone wearing sensing circuit, which is applied to an earphone. The earphone wearing sensing circuit includes a reference sensor, a primary sensor, a protection sensor, and a sensing signal processing module. The reference sensor is connected to the sensing signal processing module to provide a first reference capacitance signal and a second reference capacitance signal, and sends the signals to the sensing signal processing module. The primary sensor is connected to the sensing signal processing module to provide a first capacitance sensing signal and a second capacitance sensing signal, and sends the signals to the sensing signal processing module. The protection sensor is arranged between the primary sensor and the speaker of the earphone to shield the interference of the signal generated by the speaker on the primary sensor. The sensing signal processing module is used to determine the wearing state of the earphone based on a first capacitance difference between the first reference capacitance signal and the first capacitance sensing signal, and a second capacitance difference between the second reference capacitance signal and the second capacitance sensing signal. This solves the problem that existing headphones cannot accurately detect the wearing state of the headphones after being turned on while being worn. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the position of an earphone wearing sensing circuit provided in one embodiment of the present application;

[0022] Figure 2 An exploded diagram of an earphone wearing sensing circuit in an earphone according to one embodiment of the present application;

[0023] Figure 3 A schematic diagram of the structure of an earphone wearing sensing circuit provided in one embodiment of the present application;

[0024] Figure 4 A schematic diagram of the structure of an earphone wearing sensing circuit provided in another embodiment of the present application;

[0025] Figure 5 A schematic diagram of the structure of an earphone wearing sensing circuit provided in another embodiment of the present application;

[0026] Figure 6 A schematic diagram of the specific structure of an earphone wearing sensing circuit provided in one embodiment of the present application;

[0027] Figure 7 A schematic diagram of the structure of a headset provided in one embodiment of the present application. DETAILED DESCRIPTION

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0029] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0030] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0032] Most existing headphones use a copper sheet to implement capacitive triggering wearing sensing function, but the sensing effect is weak, and a copper sheet can only generate one capacitive sensing signal. The only way to determine whether the headphones are worn correctly is to use the change in the capacitive sensing signal from when the headphones are not worn to when they are worn.

[0033] Furthermore, existing headphones cannot detect the sensor status when they are worn on the head and turned on. When the headphones are worn on the head and turned on, there is no change in capacitance, and the sensing chip cannot accurately identify whether they are being worn. Existing headphones are easily affected by human body temperature and the external environment, and cannot accurately detect the wearing status after being worn on the head.

[0034] In order to solve the above technical problems, the embodiment of the present application provides an earphone wearing sensing circuit, which is applied to earphones. Figure 1 、 Figure 2 As shown, the earphone wearing sensing circuit includes a reference sensor 10 , a primary sensor 20 , a guard sensor 30 and a sensing signal processing module 40 .

[0035] Specifically, the reference sensor 10 is connected to the sensing signal processing module 40 and is arranged on the inner side of the earphone housing 01, and is used to provide a first reference capacitance signal and a second reference capacitance signal, and send the first reference capacitance signal and the second reference capacitance signal to the sensing signal processing module 40, wherein the first reference capacitance signal is a reference capacitance signal when the earphone is worn, and the second reference capacitance signal is a reference capacitance signal when the earphone is not worn.

[0036] In this embodiment, the reference sensor 10 detects a reference capacitance signal when the earphone is worn on the head and sends it to the sensing signal processing module 40 as a first reference capacitance signal. The reference sensor 10 detects a reference capacitance signal when the earphone is not worn on the head and sends it to the sensing signal processing module 40 as a second reference capacitance signal. Specifically, when the earphone is worn or when the earphone is close to the ear, the amount of charge carried by the capacitor on the reference sensor 10 changes, generating different capacitance values. The signal change of the capacitance value is then sent to the reference sensor 10 to generate a corresponding reference capacitance signal. The reference sensor 10 then detects a reference capacitance signal when the earphone is worn on the head and sends it to the sensing signal processing module 40 as a first reference capacitance signal. The reference sensor 10 detects a reference capacitance signal when the earphone is not worn on the head and sends it to the sensing signal processing module 40 as a second reference capacitance signal.

[0037] For further reference, Figure 1 、 Figure 2 As shown, the primary sensor 20 is connected to the sensing signal processing module 40 and is arranged on the inner side of the earphone housing 01, and is used to provide a first capacitance sensing signal and a second capacitance sensing signal, and send the first capacitance sensing signal and the second capacitance sensing signal to the sensing signal processing module 40, wherein the first capacitance sensing signal is the capacitance sensing signal detected by the primary sensor 20 when the earphone is worn, and the second capacitance sensing signal is the capacitance sensing signal detected by the primary sensor 20 when the earphone is not worn.

[0038] In this embodiment, when the earphones are worn on the head, the primary sensor 20 sends a capacitive sensing signal of the primary sensor 20 as a first capacitive sensing signal to the sensing signal processing module 40. When the earphones are not worn on the head, the primary sensor 20 sends the capacitive sensing signal of the primary sensor 20 as a second capacitive sensing signal to the sensing signal processing module 40. Specifically, when the earphones are worn or when the earphones are close to the ears, the amount of charge carried by the capacitor on the primary sensor 20 changes, resulting in different capacitive sensing values and generating corresponding capacitive sensing signals. The primary sensor 20 detects the capacitive sensing signal when the earphones are worn on the head and sends it as the first capacitive sensing signal to the sensing signal processing module 40. The primary sensor 20 detects the corresponding capacitive sensing signal when the earphones are not worn on the head and sends it as the second capacitive sensing signal to the sensing signal processing module 40.

[0039] For further reference, Figure 1 、 Figure 2 As shown, the protection sensor 30 is disposed between the primary sensor 20 and the speaker 70 of the earphone, and is disposed inside the earphone housing 01 , for shielding the signal generated by the speaker 70 from interfering with the primary sensor 20 .

[0040] In this embodiment, the speaker 70 in the earphone generates electromagnetic signals when playing audio. These electromagnetic signals may interfere with the primary sensor 20 and affect the accuracy of the primary sensor 20 in detecting the capacitive sensing signal. Therefore, the protection sensor 30 is disposed between the primary sensor 20 and the speaker 70 of the earphone to shield the primary sensor 20 from interference from the signal generated by the speaker 70.

[0041] For further reference, Figure 2 As shown, the sensing signal processing module 40 is used to determine the wearing state of the earphone according to a first capacitance difference between the first reference capacitance signal and the first capacitance sensing signal, and a second capacitance difference between the second reference capacitance signal and the second capacitance sensing signal.

[0042] In this embodiment, when the earphones are worn on the head, the primary sensor 20 sends the detected capacitance sensing signal as a first capacitance sensing signal to the sensing signal processing module 40, and sends the reference capacitance signal detected by the reference sensor 10 as a first reference capacitance signal to the sensing signal processing module 40. When the earphones are not worn on the head, the primary sensor 20 sends the corresponding capacitance sensing signal as a second capacitance sensing signal to the sensing signal processing module 40, and the reference sensor 10 sends the corresponding reference capacitance signal as a second reference capacitance signal to the sensing signal processing module 40. The sensing signal processing module 40 determines the wearing state of the earphones based on a first capacitance difference between the first reference capacitance signal and the first capacitance sensing signal, and a second capacitance difference between the second reference capacitance signal and the second capacitance sensing signal. This solves the problem that existing headphones are easily affected by human body temperature and the external environment, and cannot accurately detect the wearing state after being worn on the head.

[0043] In one embodiment, when the sensing signal processing module detects that the first capacitance difference is greater than the second capacitance difference, it generates a first detection signal and sends it to the control module to determine that the earphone is in a worn state. When the first capacitance difference is less than the second capacitance difference, it generates a second detection signal and sends it to the control module to determine that the earphone is not in a worn state.

[0044] In this embodiment, after the sensing signal processing module 40 receives the first reference capacitance signal and the second reference capacitance signal detected by the reference sensor 10, and the first capacitance sensing signal and the second capacitance sensing signal detected by the primary sensor 20, a subtractor in the sensing signal processing module 40 calculates the difference between the first reference capacitance signal and the first capacitance sensing signal as a first capacitance difference, and the difference between the second reference capacitance signal and the second capacitance sensing signal as a second capacitance difference. The first capacitance difference and the second capacitance difference are compared by a comparison operator in the sensing signal processing module 40. When the first capacitance difference is greater than the second capacitance difference, the headset is in a worn state, and a first detection signal is generated to the control module. When the first capacitance difference is less than the second capacitance difference, the headset is not in a worn state, and a second detection signal is generated to the control module. This solves the problem that existing headphones cannot accurately detect the wearing state after being turned on while being worn.

[0045] In one embodiment, reference Figure 4 As shown, the headphone wearing sensing circuit also includes a power interface 50, which is used to connect to a power source to provide power to the reference sensor 10, the primary sensor 20, the protection sensor 30 and the sensing signal processing module 40, thereby ensuring that the reference sensor 10, the primary sensor 20, the protection sensor 30 and the sensing signal processing module 40 operate normally.

[0046] In one embodiment, reference Figure 4 As shown, the headphone wearing sensing circuit also includes a reset interface 60, which is used to provide a reset signal to the sensing signal processing module 40. When the sensing signal processing module 40 freezes or freezes, the sensing signal processing module 40 is reset to ensure that the reference sensor 10, the primary sensor 20, the protection sensor 30 and the sensing signal processing module 40 work normally.

[0047] In one embodiment, reference Figure 1 、 Figure 2 、 Figure 7 As shown, the area of the protection sensor 30 is greater than or equal to the area of the primary sensor 20 , and is used to isolate the primary sensor 20 from the influence of the external environment.

[0048] Specifically, in this embodiment, the primary sensor 20 is mainly used to detect a first capacitive sensing signal when the earphones are worn and a second capacitive sensing signal when the earphones are not worn. The detection accuracy of the primary sensor 20 is crucial for the sensing signal processing module 40 to finally determine the wearing status of the earphones. In addition, the primary sensor 20 is easily affected by the external environment, such as sound, electromagnetic waves, temperature, and humidity. These factors may cause the capacitance value of the primary sensor 20 to be inaccurate, affecting the measurement accuracy of the primary sensor 20 and, in turn, affecting the determination of the wearing status of the earphones by the sensing signal processing module 40. By setting the area of the guard sensor 30 to be greater than or equal to the area of the primary sensor 20, the guard sensor 30 is isolated from the influence of the external environment on the primary sensor 20, thereby greatly improving the measurement accuracy of the primary sensor 20 and solving the problem that the headphones are easily affected by human body temperature and the external environment.

[0049] In one embodiment, reference Figure 1 、 Figure 2 、 Figure 7 As shown, the guard sensor 30 completely covers the primary sensor 20 .

[0050] In this embodiment, the primary sensor 20 is easily affected by the external environment, such as sound, electromagnetic waves, temperature, and humidity. This can cause the capacitance value of the primary sensor 20 to be inaccurate. Sometimes, the interference is even greater than the measured capacitance value itself, affecting the measurement accuracy of the primary sensor 20 and, in turn, affecting the sensing signal processing module 40's determination of the headphone wearing status. By providing the guard sensor 30 to completely cover the primary sensor 20, the external environmental interference on the primary sensor 20 is reduced, thereby greatly improving the measurement accuracy of the primary sensor 20.

[0051] In one embodiment, reference Figure 1 、 Figure 7 As shown, the protection sensor 30 is located on the bottom surface of the primary sensor 20 and is completely in contact with it. This can block electromagnetic fields from the bottom surface, such as the electromagnetic field generated by the PCB after power is applied. Specifically, the electromagnetic field generated by the PCB after power is applied can reduce the signal quality transmitted by the primary sensor 20, interfere with or even damage circuits or devices, and prevent the primary sensor 20 from accurately measuring the first and second capacitive sensing signals. This in turn affects the accuracy of the sensing signal processing module 40 in determining the wearing status of the earphone. The protection sensor 30 is located on the bottom surface of the primary sensor 20 and is completely in contact with it. This can block electromagnetic interference, improve the signal quality transmitted by the primary sensor 20, and reduce interference with circuits or devices.

[0052] In one embodiment, the primary sensor 20 and the protection sensor 30 are both inductive copper sheets.

[0053] Specifically, in this embodiment, the primary sensor 20 and the protection sensor 30 are both sensing copper sheets. The sensors are devices or apparatuses that can sense the specified measured quantity and convert it into a usable signal according to a certain rule. They are usually composed of sensitive elements and conversion elements. Among them, the primary sensor 20 and the protection sensor 30 are both sensing copper sheets. The sensing copper sheets have good electrical conductivity, thermal conductivity, corrosion resistance and processing properties, which can make the measurement results of the primary sensor 20 more accurate. During the manufacturing process, it is more conducive to its processing and manufacturing, so that the protection sensor 30 can better protect the primary sensor 20 from being infected by the external environment, solving the problem that the existing headphones cannot accurately detect the wearing status after being worn on the head.

[0054] In one embodiment, reference Figure 6 As shown, the reference sensor 10 is a flexible printed circuit board.

[0055] In this embodiment, a flexible printed circuit (FPC) has excellent properties such as light weight, thin thickness, and free bendability and foldability. With the rapid development of the electronics industry, circuit board design is increasingly tending towards high precision and high density. Traditional manual inspection methods can no longer meet production needs. A flexible printed circuit board is made of polyester film or polyimide as a substrate and is highly reliable and extremely flexible. It allows a large number of precision components to be stacked in a narrow and limited space, thus forming a flexible circuit. This circuit can be bent and folded at will, is lightweight, compact, has good heat dissipation, and is easy to install.

[0056] In one embodiment, the flexible circuit board has high density, small size, and light weight. Due to the high-density assembly and the reduced number of connections between components (including spare parts), reliability is increased. It has a certain high-speed transmission circuit, can set the circuit and electromagnetic shielding layer, and can also install a metal core layer to meet special thermal insulation and other functions and requirements. By setting the reference sensor 10 as a flexible circuit board, the measurement results of the reference sensor 10 can be made more accurate, and it is more conducive to its processing and manufacturing during the manufacturing process. Applying it to the reference sensor 10 of the headset increases the accuracy of headset detection, solving the problem of inaccurate detection of existing headphones and the inability to accurately detect the wearing status after wearing them on the head.

[0057] In one embodiment, reference Figure 1 、 Figure 7 As shown, the flexible circuit board is arranged on the inner edge of the earphone to reduce the impact of temperature and humidity on the flexible circuit board.

[0058] Specifically, the reference sensor 10 is a flexible circuit board and is arranged on the inner edge of the earphone, wherein the reference sensing module is arranged on the outside of the earphone away from the head, reducing the impact of temperature and humidity on the flexible circuit board, and thereby reducing the impact of temperature and humidity on the first reference capacitance value and the second reference capacitance value, thereby improving the accuracy of the subtraction operator in the sensing signal processing module 40 in calculating the difference between the first reference capacitance signal and the first capacitance sensing signal, and improving the accuracy of the difference between the second reference capacitance signal and the second capacitance sensing signal. By improving the accuracy of the comparison operator in the sensing signal processing module 40 in comparing the size of the first capacitance difference and the second capacitance difference, it is accurately determined whether the earphone is in a wearing state or a not-worn state, and a first detection signal and a second detection signal are generated and sent to the control module, thereby solving the problem that the existing headphone cannot accurately detect the wearing state after being worn on the head.

[0059] In one embodiment, reference Figure 6 As shown, the sensing signal processing module 40 includes: a sensing signal processing chip 41 , a first resistor R1 , a second resistor R2 , a third resistor R3 and a fourth resistor R4 .

[0060] Specifically, refer to Figure 6 As shown, the first resistor R1 is connected between the sensing signal processing chip 41 and the primary sensor 20 via the first communication port, the second resistor R2 is connected between the sensing signal processing chip 41 and the guard sensor 30 via the second communication port, the third resistor R3 is connected between the sensing signal processing chip 41 and the reference sensor 10 via the third communication port, and the fourth resistor R4 is connected between the sensing signal processing chip 41 and the reference sensor 10 via the fourth communication port.

[0061] In this embodiment, reference Figure 6As shown, a first resistor R1 is connected between the sensing signal processing chip 41 and the primary sensor 20 through the first communication port, wherein the main function of the first resistor R1 is current limiting. The first resistor R1 is connected in series in the circuit to limit the magnitude of the branch current between the sensing signal processing chip 41 and the primary sensor 20 to prevent excessive current from burning the components connected in series. At the same time, the current limiting resistor can also play a voltage dividing role. A second resistor R2 is connected between the sensing signal processing chip 41 and the protection sensor 30 through the second communication port, wherein the main function of the second resistor R2 is current limiting. The second resistor R2 is connected in series in the circuit to limit the magnitude of the branch current between the sensing signal processing chip 41 and the protection sensor 30 to prevent excessive current from burning the components connected in series. At the same time, the current limiting resistor can also play a voltage dividing role. The communication port connects a third resistor R3 between the sensing signal processing chip 41 and the reference sensor 10. The third resistor R3 primarily functions as a current limiter. The third resistor R3 is connected in series in the circuit to limit the current in the branch between the sensing signal processing chip 41 and the primary sensor 20 to prevent excessive current from damaging the series-connected components. The current-limiting resistor also serves as a voltage divider. A fourth resistor R4 is connected between the sensing signal processing chip 41 and the reference sensor 10 via the fourth communication port. The fourth resistor R4 primarily functions as a current limiter. The fourth resistor R4 is connected in series in the circuit to limit the current in the branch between the sensing signal processing chip 41 and the primary sensor 20 to prevent excessive current from damaging the series-connected components. The current-limiting resistor also serves as a voltage divider, extending the life of the headphones.

[0062] In one embodiment, reference Figure 6 As shown, the sensing signal processing module 40 further includes at least one first capacitor C1 and at least one second capacitor C2.

[0063] Specifically, a first end of at least one first capacitor C1 and a first end of a first resistor R1 are commonly connected to the primary inductor 20, a second end of the at least one first capacitor C1 is grounded, a first end of at least one second capacitor C2 and a first end of a third resistor R3 are commonly connected to the reference inductor 10, and a second end of the at least one second capacitor C2 is grounded. The at least one first capacitor C1 is used to filter out interference signals from the corresponding first and second capacitance sensing signals detected by the primary inductor 20. As the frequency increases, the capacitive reactance decreases, allowing the signal to directly enter the ground, thereby filtering out high-frequency signals. The at least one second capacitor C2 is used to filter out interference signals from the corresponding first and second reference capacitance sensing signals detected by the reference inductor 10. As the frequency increases, the capacitive reactance decreases, allowing the signal to directly enter the ground, thereby filtering out high-frequency signals. This solves the problem of existing headphones being easily affected by human body temperature and the external environment, and being unable to accurately detect the wearing status after being worn on the head.

[0064] In one embodiment, reference Figure 5 、 Figure 6 As shown, the headphone wearing sensing circuit also includes at least one third capacitor C3, wherein at least one third capacitor C3 is connected to the sensing signal processing module 40, and is used to filter out interference signals in the headphone wearing sensing circuit. Specifically, at least one third capacitor C3 can filter out the interference signal of the first capacitance difference and the second capacitance difference after being processed by the sensing signal processing module 40, so that the sensing signal processing module 40 can more accurately judge the wearing status of the headphone, thereby solving the problem that the existing headphone is easily affected by human body temperature and the external environment, and cannot accurately detect the wearing status after being worn on the head.

[0065] In one embodiment, the guard sensor 30 and the primary sensor 20 generate a stable capacitance. The initial capacitance value of the headset when not worn is greater than 3pF, which can effectively resist external interference and solve the problem of existing headphones being easily affected by human body temperature and the external environment.

[0066] In one embodiment, reference Figure 5 、 Figure 6 As shown, one GPIO (P1.7) is connected to the copper sheet of the protection sensor 30 through POGOPIN, one GPIO (P2.0) is connected to the copper sheet of the primary sensor 20 through POGOPIN, and two GPIOs (P0.1, P2.7) are connected to the FPC copper sheet of the reference sensor 10 through the J55 connector to correctly identify the sensing state and wearing state of the headset.

[0067] In one embodiment, the earphone wearing sensing circuit is applied to the earphone, and the earphone can be put on the head and turned on for use, and the sensing chip can accurately identify whether the earphone is worn, solving the industry problem of capacitive wearing sensing of the earphone.

[0068] In one embodiment, reference Figure 6As shown, a communication interface GPIO (P0.1) of the reference sensor 10 is connected to a communication interface GPIO (P2.0) of the primary sensor 20 to implement transmission of corresponding capacitance signals measured between the reference sensor 10 and the primary sensor 20. For example, the reference sensor 10 compares a first reference capacitance signal measured when the earphone is worn with a first capacitance sensing signal measured by the primary sensor 20 when the earphone is worn to verify whether the first capacitance sensing signal measured by the primary sensor 20 when the earphone is worn is correct. The reference sensor 10 compares a second reference capacitance signal measured when the earphone is not worn with a second capacitance sensing signal measured by the primary sensor 20 when the earphone is worn to verify whether the second capacitance sensing signal measured by the primary sensor 20 when the earphone is worn is correct.

[0069] In one embodiment, reference Figure 6 As shown, a communication interface GPIO (P2.7) of the reference sensor 10 is connected to a communication interface GPIO (P1.7) of the protection sensor 30 to implement the transmission of the corresponding capacitance signal measured between the reference sensor 10 and the primary sensor 20. This allows the protection sensor 30 to better protect the measurement results of the primary sensor 20 and isolate the primary sensor 20 from the influence of the external environment. This allows the sensing signal processing module 40 to accurately determine whether the headset is in a wearing state or not. The sensing signal processing module 40 then generates a first detection signal and a second detection signal to the control module, solving the problem that existing headphones cannot accurately detect the wearing state after being worn on the head.

[0070] An embodiment of the present application further provides a headset, comprising a headset wearing sensing circuit as described in any one of the above items.

[0071] An embodiment of the present application also provides an electronic device, comprising: a control module; and an earphone wearing sensing circuit as described in any one of the above items, wherein the earphone wearing sensing circuit is connected to the control module and is used to provide the earphone wearing detection signal to the control module to determine the wearing status of the earphone.

[0072] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0073] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0074] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0075] In the embodiments provided in this application, it should be understood that the disclosed devices / terminal equipment and methods can be implemented in other ways. For example, the device / terminal equipment embodiments described above are merely illustrative. For example, the division of the modules or units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0076] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0077] In addition, the functional units in the various embodiments of the present application may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0078] If the integrated module / unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application can implement all or part of the processes in the above-mentioned embodiment method by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, it can implement the steps of each of the above-mentioned method embodiments. The computer program includes computer program code, which can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium can include: any entity or device capable of carrying the computer program code, recording medium, USB flash drive, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media does not include electric carrier signals and telecommunication signals.

[0079] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. An earphone wearing induction circuit, used in earphones, characterized in that: The earphone wearing sensing circuit includes: a reference sensor, connected to the sensing signal processing module, configured to provide a first reference capacitance signal and a second reference capacitance signal, and transmit the first reference capacitance signal and the second reference capacitance signal to the sensing signal processing module; wherein the first reference capacitance signal is a reference capacitance signal when the earphone is worn, and the second reference capacitance signal is a reference capacitance signal when the earphone is not worn; a primary sensor connected to the sensing signal processing module, configured to provide a first capacitance sensing signal and a second capacitance sensing signal, and transmit the first capacitance sensing signal and the second capacitance sensing signal to the sensing signal processing module; wherein the first capacitance sensing signal is a capacitance sensing signal detected by the primary sensor when the earphone is worn, and the second capacitance sensing signal is a capacitance sensing signal detected by the primary sensor when the earphone is not worn; A protection sensor is provided between the primary sensor and the speaker of the headset, and is used to shield the signal generated by the speaker from interfering with the primary sensor; a sensing signal processing module, configured to generate a headphone wearing detection signal according to a first capacitance difference between the first reference capacitance signal and the first capacitance sensing signal, and a second capacitance difference between the second reference capacitance signal and the second capacitance sensing signal; When the sensing signal processing module detects that the first capacitance difference is greater than the second capacitance difference, the sensing signal processing module generates a first detection signal and sends it to the control module to determine that the earphone is in a worn state. When the first capacitance difference is less than the second capacitance difference, the sensing signal processing module generates a second detection signal and sends it to the control module to determine that the earphone is not in a worn state.

2. The earphone wearing sensing circuit according to claim 1, wherein: The area of the protection sensor is greater than or equal to the area of the primary sensor, and is used to isolate the primary sensor from the influence of the external environment.

3. The earphone wearing sensing circuit according to claim 2, wherein: The guard sensor completely covers the primary sensor.

4. The earphone wearing sensing circuit according to claim 1, wherein: The primary sensor and the protection sensor are both inductive copper sheets.

5. The earphone wearing sensing circuit according to claim 1, wherein: The reference sensor is a flexible printed circuit board.

6. The earphone wearing sensing circuit according to claim 5, wherein: The flexible circuit board is arranged on the inner edge of the earphone to reduce the influence of temperature and humidity on the flexible circuit board.

7. The earphone wearing sensing circuit according to claim 1, wherein: The sensing signal processing module includes: a sensing signal processing chip, a first resistor, a second resistor, a third resistor and a fourth resistor; wherein, The first resistor is connected between the sensing signal processing chip and the primary sensor through a first communication port, the second resistor is connected between the sensing signal processing chip and the guard sensor through a second communication port, the third resistor is connected between the sensing signal processing chip and the reference sensor through a third communication port, and the fourth resistor is connected between the sensing signal processing chip and the reference sensor through a fourth communication port.

8. A headset, characterized in that: The invention comprises the earphone wearing sensing circuit according to any one of claims 1 to 7.

9. An electronic device, characterized in that: include: Control module; And the headphone wearing sensing circuit according to any one of claims 1 to 7, wherein the headphone wearing sensing circuit is connected to the control module and is used to provide the headphone wearing detection signal to the control module to determine the wearing status of the headphone.

Images