Radiation detector module, radiation detector, and radiation imaging device

Abstract

The present invention provides a radiation detector module, a radiation detector, and a radiation imaging device. A radiation detector and a radiation imaging device are provided that can increase the number of columns while suppressing the length in the body axis direction. The device comprises: a detector substrate (201) equipped with a scintillator (108), a photodiode (109), and an AD conversion chip (200); and a control substrate (202) that supplies power to the detector substrate and controls the AD conversion unit (AFE) of the detector substrate. By connecting two substrates with a stacking connector (203) to form a two-layer structure, a radiation detector is constructed that suppresses the length in the body axis direction.

Description

Technical Field

[0001] The present invention relates to a radiation detection technology, and more particularly to a radiation detector module, a radiation detector, a radiation detector system, or a radiation imaging device including the radiation detector. Background Art

[0002] In recent years, multi-slice radiation detectors, capable of imaging a wide range in a short period of time, have become mainstream. While increasing the number of columns in these multi-slice radiation detectors is desirable, this also presents a challenge in extracting analog signals from photodiodes. Therefore, Patent Document 1 discloses a technology that facilitates the connection of analog signal lines from the photodiodes to the AFE (Analog Front End) (Analog Front End) by mounting a scintillator, photodiodes, and A / D converter chips on the same substrate. This facilitates the connection of analog signal lines from the photodiodes to the A / D converter section, known as the AFE (Analog Front End), thereby increasing the number of columns.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2003-66149

[0006] In hospital facilities, the increasing size of X-ray CT (Computed Tomography) equipment, which serves as radiation imaging equipment, can pose challenges in CT room installation. In radiation detector modules, if the scintillator, photodiode, and AFE are mounted on the same substrate, and the AFE power supply and AFE control functions are also added to the same substrate, the substrate becomes larger, resulting in a significant increase in the length of the radiation detector along its axis. While efforts are underway to increase the number of columns in multi-slice radiation detectors capable of imaging a wide range in a short period of time, minimizing the length of the radiation detector along its axis has become a challenge. Summary of the Invention

[0007] An object of the present invention is to solve the above-mentioned problems and to provide a radiation detector module, a radiation detector, and a radiation imaging device capable of increasing the number of columns while suppressing the length in the body axis direction.

[0008] In order to achieve the above-mentioned purpose, the present invention provides a radiation detector module, a radiation detector, and a radiation imaging device, which are equipped with: a detector substrate, which is equipped with a scintillator that converts X-rays incident from the surface side into light, a photodiode that converts the converted light into an analog signal, and an AD conversion chip that amplifies the analog signal and converts it into a digital signal; and a control substrate that supplies power to the detector substrate and controls the AD conversion unit (AFE) of the AD conversion chip, and the two substrates are connected by a stacking connector to form a two-layer structure, and a supporting structure is provided between the substrates.

[0009] Effects of the Invention

[0010] According to the present invention, the number of rows of radiation detectors can be increased while suppressing the length in the body axis direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a diagram showing a gantry of a radiographic imaging device.

[0012] Figure 2A This is a diagram showing the configuration of a radiation detector module according to the first embodiment.

[0013] Figure 2B This is a diagram showing the configuration of a radiation detector module according to the first embodiment.

[0014] Figure 2C This is a diagram showing the configuration of a radiation detector module according to the first embodiment.

[0015] Figure 2D This is a diagram showing the configuration of a radiation detector module according to the first embodiment.

[0016] Figure 2E This is a diagram showing the configuration of a radiation detector module according to the first embodiment.

[0017] Figure 3A This is a diagram showing the configuration of a radiation detector module according to another modified example of the first embodiment.

[0018] Figure 3B This is a diagram showing the configuration of a radiation detector module according to another modified example of the first embodiment.

[0019] Figure 4A This is a diagram showing the configuration of a radiation detector module according to another modified example of the first embodiment.

[0020] Figure 4B This is a diagram showing the configuration of a radiation detector module according to another modified example of the first embodiment.

[0021] Figure 4CThis is a diagram showing the configuration of a radiation detector module according to another modified example of the first embodiment.

[0022] Figure 5A This is a diagram showing the configuration of a radiation detector module according to another modified example of the first embodiment.

[0023] Figure 5B This is a diagram showing the configuration of a radiation detector module according to another modified example of the first embodiment.

[0024] Figure 5C This is a diagram showing the configuration of a radiation detector module according to another modified example of the first embodiment.

[0025] Figure 5D This is a diagram showing the configuration of a radiation detector module according to another modified example of the first embodiment.

[0026] Figure 6A 1 is a diagram showing the structure of a radiation detector module according to Example 2, and is a diagram showing the positional tolerance of stacking connectors on a detector substrate.

[0027] Figure 6B This is a diagram showing the positional tolerance of the stacking connector on the control board according to the second embodiment.

[0028] Figure 6C This is a diagram showing the height tolerance of the support structure according to Example 2.

[0029] Figure 7 This is a diagram showing an example of arranging an AD conversion chip and a stack connector outside the X-ray irradiation field according to the third embodiment.

[0030] Figure 8A This is a diagram showing an example of an X-ray shielding material supporting a collimating plate according to the third embodiment.

[0031] Figure 8B This is a diagram showing an example in which the X-ray shield according to the third embodiment has grooves for supporting the collimating plates.

[0032] Figure 9 This is a diagram showing an example in which an X-ray shield is arranged between a detector substrate and a control substrate.

[0033] Figure 10A This is a diagram showing an example of fixing the detector substrate and the support structure according to the fourth embodiment.

[0034] Figure 10B This is a diagram showing an example of fixing the detector substrate and the support structure according to the fourth embodiment.

[0035] Figure 11AThis is a diagram showing an example of fixing the detector substrate and the X-ray shielding member according to the fourth embodiment.

[0036] Figure 11B This is a diagram showing an example of fixing the detector substrate and the X-ray shielding member according to the fourth embodiment.

[0037] Figure 11C This is a diagram showing an example of fixing the detector substrate and the X-ray shielding member according to the fourth embodiment.

[0038] Figure 11D This is a diagram showing an example of fixing the detector substrate and the X-ray shielding member according to the fourth embodiment.

[0039] Figure 11E This is a diagram showing an example of fixing the detector substrate and the X-ray shielding member according to the fourth embodiment.

[0040] Figure 12 This is a diagram showing an example in which a hardening type X-ray shielding material is embedded in the countersunk hole of the X-ray shielding material according to the fourth embodiment.

[0041] Figure 13 This is a diagram showing an example in which the support structure and the AD conversion chip according to the fifth embodiment are joined (coupled) via a heat conducting member.

[0042] Figure 14 This is a diagram showing an example of coupling a heat sink and a support structure according to the fifth embodiment.

[0043] Figure 15A This is a diagram showing a configuration example of a radiation detector module, a detector housing, and a cooling fan according to a fifth embodiment.

[0044] Figure 15B This is a diagram showing an example of fixing the detector housing and the support structure according to the fifth embodiment.

[0045] Figure 15C This is a diagram showing an example of fixing the detector housing and the support structure according to the fifth embodiment.

[0046] Description of Reference Signs

[0047] 100 X-ray sources

[0048] 101 Radiation Detector

[0049] 102 Signal Processing Department

[0050] 103 Image Generation Unit

[0051] 104 rotating disk

[0052] 105 bed platform

[0053] 106 Subjects

[0054] 107 Radiation Detector

[0055] 108 Scintillator

[0056] 109 Photodiode

[0057] 110 AFE

[0058] 111 Scanner

[0059] 200 AD conversion chip

[0060] 201 detector substrate

[0061] 202 control board

[0062] 203 stacking connector

[0063] 204 Supporting structures

[0064] 205, 1101 fixing screws

[0065] 206 screws

[0066] 207 analog signal

[0067] 500, 1100 through hole

[0068] 800, 900 X-ray shield

[0069] 801 Collimator Plate

[0070] 802 slots DETAILED DESCRIPTION

[0071] Hereinafter, embodiments of the present invention will be described in sequence with reference to the accompanying drawings.

[0072] The radiation imaging device according to the present invention is as follows Figure 1 As shown, the scanner includes an X-ray source 100 that emits X-rays; a radiation detector 101 that detects the emitted X-rays; a signal processing unit 102 that performs correction and other processing on the output signals detected by the radiation detector 101 and controls devices such as a scanner; and an image generation unit 103 that uses the corrected signals to generate an image of a subject 106. The X-ray source 100 and the radiation detector 101 are fixed to a rotating disk 104 so as to face each other and rotate around the subject 106 on a bed 105. The X-ray source 100, the radiation detector 101, and the rotating disk 104 are also referred to as a scanner 111.

[0073] The radiation detector 101 is equipped with multiple radiation detector modules 107, each mounted so as to face the focal direction (Y direction). The radiation detector modules 107 include a scintillator 108 that converts X-rays into light, a photodiode 109 that converts light into an analog electrical signal, and an AFE 110, which serves as an A / D converter and amplifies the analog electrical signal and converts it into a digital signal.

[0074] [Example 1]

[0075] Next use Figures 2A to 2E The radiation detector according to the first embodiment will be described.

[0076] According to the radiation detector of this embodiment, the radiation detector module 107 includes: a detector substrate 201, which is equipped with multiple scintillators 108 for converting X-rays into light, photodiodes 109 for converting light into analog electrical signals, and an AD conversion chip 200 for amplifying the analog electrical signals and converting them into digital signals; a control substrate 202, which provides power to and controls the AFE; a stacking connector 203, which connects the two substrates; and a supporting structure 204, which is used to fix the two substrates between the detector substrate 201 and the control substrate 202.

[0077] By dividing the radiation detector module 107 into a detector substrate 201 and a control substrate 202, and configuring these two substrates as a two-stage structure in the Y-axis direction, the length in the body axis direction (Z-direction) can be reduced. Furthermore, by using a metal with a high elastic modulus, such as aluminum, for the support structure 204 that secures the two substrates, the rigidity of the detector substrate 201 and the control substrate 202 can be increased. Furthermore, the support structure 204 absorbs heat generated from the detector substrates and dissipates it to the outside.

[0078] Here, the analog signal output from the photodiode 109 is converted into a digital signal by the AD conversion chip 200, and the digital signal is forwarded to the control substrate 202 through the stacking connector 203. Therefore, on the detector substrate 201, the AD conversion chip 200 is arranged between the photodiode 109 and the stacking connector 203, and the fixing screw 205 of the detector substrate can be on the outside of the photodiode.

[0079] For example, you can Figure 2A 、 Figure 2BAs shown, the arrangement along the Z-axis follows the order: fixing screw 205 - AD converter chip 200 - photodiode 109 - AD converter chip 200 - fixing screw 205. Alternatively, the arrangement can be: AD converter chip 200 - fixing screw 205 - photodiode 109 - fixing screw 205 - AD converter chip 200. The former arrangement eliminates the need for screw holes to obstruct the analog wiring area. The latter arrangement reduces the Z-axis dimension of the detector. Furthermore, the control board 202 is secured to the support structure 204 by screws 206.

[0080] Furthermore, if Figure 2B As shown, when the analog signal 207 from the photodiode 109 is taken out from both sides of the body axis direction (Z direction), the AD conversion chip 200 on the detector substrate 201 and the stacking connector 203 connecting the detector substrate 201 and the control substrate 202 are divided and configured in the body axis direction (Z direction).

[0081] But in Figure 2D 、 Figure 2E When the analog signal 207 from the photodiode is taken out from one side in the body axis direction (Z direction) as shown, it is not divided in the body axis direction (Z direction), and the AD conversion chip 200 on the detector substrate and the stacking connector 203 connecting the detector substrate 201 and the control substrate 202 are arranged on one side.

[0082] exist Figure 3A This figure shows an example in which the AD converter chip 200 is mounted on the back surface of the detector substrate 201. In the configuration of this figure, the front surface of the detector substrate 201 serves as the surface on which the photodiode 109 is mounted. In this case, the analog electrical signal output from the photodiode 109 is extracted from the back surface of the detector substrate 201 and connected to the AD converter chip 200.

[0083] In addition, you can also Figure 3B As shown, the AD converter chip 200 is placed on both the front and back surfaces of the detector substrate 201. By mounting the AD converter chip 200 on both the front and back surfaces of the detector substrate 201, it is possible to accommodate an increase in the number of photodiode channels 109, such as due to an increase in the number of columns. Similarly, in this case, the arrangement order in the Z-axis direction can be: fixing screw 205 - AD converter chip 200 - photodiode 109 - AD converter chip 200 - fixing screw 205, or alternatively, it can be: AD converter chip 200 - fixing screw 205 - photodiode 109 - fixing screw 205 - AD converter chip 200.

[0084] In addition, the orientation of the stacking connector 203 can also be changed. Figure 4A 、 Figure 4B、 Figure 4C This example shows a change in the orientation of stacking connector 203. Changing the orientation of stacking connector 203 also changes the shape of support structure 204. Similarly, in this case, the Z-axis arrangement order can be: fixing screw 205 - AD converter chip 200 - photodiode 109 - AD converter chip 200 - fixing screw 205, or AD converter chip 200 - fixing screw 205 - photodiode 109 - fixing screw 205 - AD converter chip 200.

[0085] In addition, you can Figures 5A to 5D As shown, support structure 204 includes through-holes 500 for inserting stacking connectors 203. Inserting stacking connectors 203 through through-holes 500 increases the contact area between detector substrate 201 and control substrate 203 and support structure 204, further enhancing the rigidity of both substrates. Similarly, in this case, the arrangement order in the Z-axis direction can be: fixing screw 205 - AD converter chip 200 - photodiode 109 - AD converter chip 200 - fixing screw 205, or AD converter chip 200 - fixing screw 205 - photodiode 109 - fixing screw 205 - AD converter chip 200.

[0086] [Example 2]

[0087] In the radiation detector of Example 2, a floating connector is used for the stacking connector 203 that connects the detector substrate 201 and the control substrate 202 in Example 1. A resin substrate is used for the control substrate 202, while a ceramic substrate is used for the detector substrate 201 to achieve higher wiring density and flatness of the photodiode mounting surface as the number of columns increases. However, ceramic substrates have large tolerances, and absorption is a problem.

[0088] use Figures 6A to 6C The radiation detector of this embodiment will be described. The detector substrate 201 is made of ceramics to increase the wiring density as the number of columns increases. However, ceramics have large tolerances, and absorption is a problem.

[0089] like Figure 6A as well as Figure 6B As shown, position tolerances (ΔX1, ΔZ1) and (ΔX2, ΔZ2) of the connector mounted on the detector substrate 201 and position tolerances (ΔX3, ΔZ3) and (ΔX4, ΔZ4) of the connector mounted on the control substrate 202 are generated.

[0090] In addition, Figure 6CAs shown, the height tolerance (ΔY) of support structure 204 is affected, resulting in a cumulative tolerance of (ΔX1 + ΔX3, ΔY, ΔZ1 + ΔZ3) and (ΔX2 + ΔX4, ΔY, ΔZ2 + ΔZ4). If these values ​​increase, there is a risk of connector contact failure. In this embodiment, a floating connector is used in the stacking connector that connects the detector board and the control board. This cumulative tolerance can be absorbed, reducing stress during connector mating.

[0091] [Example 3]

[0092] Example 3 is an embodiment of a structure for X-ray shielding of a radiation detector module. In a radiation detector module, the X-ray sensor unit needs to be arranged within the X-ray irradiation field, and on the other hand, each electrical component needs to be protected from component failure caused by X-ray irradiation. Therefore, Figure 7 As shown, in this embodiment, the scintillator 108 and the photodiode 109 on the X-ray sensor portion, i.e., the detector substrate 201, are arranged on the inner side of the X-ray irradiation field 700, and the stacking connector 203 and the AD conversion chip 200 are arranged on the outer side of the X-ray irradiation field, thereby preventing malfunction of electrical components caused by direct X-rays.

[0093] In addition, it is necessary to shield the X-rays that pass through the subject and scatter toward the electrical components. Figure 8A 2 shows an example in which an X-ray shield 800 is arranged between the photodiode 109 and the AD conversion chip 200 to protect the AD conversion chip 200 from scattered X-rays. Figure 8B This figure shows an example of an X-ray shield having grooves for supporting collimating plates. Here, X-ray shield 800 has multiple grooves 802 along the channel direction (X direction) to support collimating plates 801 disposed on scintillator 108, in order to reduce crosstalk caused by scattered radiation. Therefore, X-ray shield 800 is made of a metal such as brass, which has low X-ray transmittance and is easily machined.

[0094] Furthermore, it is necessary to prevent the X-rays that are not absorbed by the scintillator 108 on the detector substrate 201 from being transmitted and irradiating the control substrate 204. Figure 9 2 shows an example in which an X-ray shield 900 is arranged on the support structure 204 located between the detector substrate 201 and the control substrate 204. This can prevent malfunction of the control substrate 202 due to transmission of X-rays.

[0095] [Example 4]

[0096] In Example 4, the mounting structure and process of the detector substrate 201, the support structure 204, and the X-ray shield 800 are described. First, the detector substrate 201 and the support structure 204 are mounted. Although the detector substrate 201 is made of ceramic in order to achieve higher wiring density and flatness of the photodiode mounting surface accompanying the increase in the number of columns, ceramic substrates are hard and easily cracked. Figure 10A As shown in the figure, if the detector substrate 201 is warped and the flatness of the detector substrate 201 and the support structure 204 on the mounting surface is different, there is a possibility that the ceramic detector substrate 201 will be broken if it is fixed with the fixing screws 205. Figure 10B As shown, by reducing the contact area between the detector substrate 201 and the support structure 204 , cracking of the detector substrate 201 can be prevented even when the detector substrate 201 is warped.

[0097] Next, the X-ray shielding material 800 is mounted on the detector substrate 201. Figure 11A An example is shown in which the length of the detector substrate 201 in the body axis direction is suppressed and the detector substrate 201, the support structure 204, and the X-ray shield 800 are assembled. The support structure 204 has a through hole 1100 for fixing the X-ray shield 800, and the X-ray shield 800 is fixed to the detector substrate 201 using a fixing screw 1101 from the back side of the support structure 204. In order to fix the X-ray shield 800 from the back side of the support structure 204, it is necessary to assemble it before installing the control board. Here, in order to suppress the length in the body axis direction (Z direction), the fixing position of the detector substrate 201 and the support structure 204 based on the fixing screw 205 and the fixing position of the detector substrate 201 and the X-ray shield 800 based on the fixing screw 1101 become the same in the body axis direction (Z direction). Thus, as Figure 11B As shown, the X-ray shield 800 has a countersunk hole 1102 for avoiding interference with the fixing screw 205. As described above, in order to prevent the detector substrate 201 from breaking, the detector substrate 201 may be fixed as shown in FIG. Figure 11C As shown in FIG, the contact area between the detector substrate 201 and the X-ray shielding material 800 is minimized. In conjunction with this, the shape of the X-ray shielding material 800 is changed. Figure 11D 、 Figure 11E As shown, the fixing positions of the detector substrate 201 and the support structure 204 by the fixing screws 205 and the fixing positions of the detector substrate 201 and the X-ray shield 800 by the fixing screws 1101 can be opposite in the X direction. Furthermore, regarding the fixing positions of the two detector substrates 201 and the X-ray shield 800 arranged symmetrically in the body axis direction (Z direction), Figures 11B to 11E Can be mixed. In addition, Figure 12 As shown, by embedding a hardened X-ray shield 1200 in the countersunk hole 1102 of the X-ray shield 800 to avoid interference with the fixing screw 205, it is possible to block scattered X-rays from reaching the AD converter chip. Here, the hardened X-ray shield uses a structure in which powder of tungsten or the like is mixed with an adhesive.

[0098] [Example 5]

[0099] Regarding the fifth embodiment, the structure of the radiation detector module 107 and the structure of the radiation detector 101 will be described from the viewpoint of heat dissipation of the AD conversion chip 200. Figure 13 As shown, by bringing the AD converter chip 200 mounted on the back surface of the detector substrate 201 into thermal contact with the support structure 204 via the heat conductor 1300, the support structure 204 absorbs the heat from the AD converter chip 200 and dissipates it to the outside. Here, the support structure 204 is made of a metal such as aluminum that not only has high mechanical rigidity but also high thermal conductivity.

[0100] Furthermore, it can also Figure 14 As shown, the support structure 204 is connected to the heat sink 1400. By increasing the heat capacity and connecting the heat sink 1400 with a large surface area, the heat absorbed by the support structure 204 can be further dissipated to the outside.

[0101] In addition, if Figures 15A to 15C As shown, the radiation detector 101 has multiple radiation detector modules 107 mounted on a detector housing 1500. Here, the mounting surface of the detector modules 107 is the support structure 204. By attaching the support structure 204, which absorbs heat generated by the AD converter chip 200 on the detector substrate 201, to the temperature-controlled detector housing 1500, the heat dissipation effect of the AD converter chip 200 can be further enhanced. Furthermore, by directly connecting the AD converter chip 200 on the detector substrate surface to the detector housing 1500 via a heat conductor 1502, the AD converter chip 200 can be cooled. Furthermore, by installing multiple fans 1501 in the detector housing 1500, the detector housing 1500, the support structure 204, and the heat sink 1400 can be cooled, thereby cooling the AD converter chip 200 on the detector substrate. The cooling method here can be water cooling instead of air cooling.

[0102] The present invention is not limited to the embodiments described above, but further includes various variations. For example, the embodiments and variations described above are described in detail to facilitate understanding of the present invention, but are not necessarily limited to all the structures described. Furthermore, a portion of the structure of one embodiment can be replaced with the structure of another embodiment, and a portion of the structure of another embodiment can be added to the structure of another embodiment. Furthermore, with respect to portions of the structure of each embodiment, structures included in other embodiments can be added, deleted, or replaced.

Claims

1. A radiation detector module, characterized in that: have: a detector substrate having a scintillator on a first surface thereof for converting X-rays incident from the surface side into light, a photodiode for converting the converted light into an analog signal, and an AD conversion chip for amplifying the analog signal and converting it into a digital signal; and a control substrate for supplying power to the detector substrate and controlling the AFE (Analog Frequency Converter) of the A / D converter chip; The detector substrate and the control substrate are connected to each other by a stacking connector to form a two-level structure, a support structure for supporting the detector substrate and the control substrate is provided between the detector substrate and the control substrate, and the support structure is arranged in a depth direction between a second surface of the detector substrate opposite to the first surface and the first surface of the control substrate. The stacking connector is arranged between the second surface of the detector substrate and the first surface of the control substrate, and the stacking connector includes a first stacking connector and a second stacking connector. The AD conversion chip includes a first AD conversion chip and a second AD conversion chip, the first AD conversion chip being arranged between the first stacking connector and the scintillator in a direction orthogonal to the depth direction in a plan view, and the second AD conversion chip being arranged between the second stacking connector and the scintillator in a direction orthogonal to the depth direction in a plan view.

2. The radiation detector module according to claim 1, wherein A floating connector is used in the stacking connector that connects the detector substrate and the control substrate.

3. The radiation detector module according to claim 2, wherein: The support structure has a through hole through which a stack connector that connects the detector substrate and the control substrate passes.

4. The radiation detector module according to claim 3, wherein The scintillator and the photodiode are arranged in an X-ray irradiation field, and the AD conversion chip and the stack connector are arranged outside the X-ray irradiation field.

5. The radiation detector module according to claim 4, wherein: An X-ray shield is arranged between the photodiode and the AD conversion chip, and the X-ray shield has a function of mounting a collimator plate for removing scattered rays.

6. The radiation detector module according to claim 5, wherein: The mounting area of ​​the detector substrate and the support structure is reduced to prevent cracking of the detector substrate due to a difference in flatness between the detector substrate and the support structure.

7. The radiation detector module according to claim 6, wherein: The fixing position of the detector substrate and the support structure is the same as the fixing position of the detector substrate and the X-ray shield in the body axis direction.

8. The radiation detector module according to claim 7, wherein: A hardened X-ray shield is embedded in the countersunk hole of the X-ray shield to avoid interference between the detector substrate and the fixing screws of the support structure.

9. The radiation detector module according to claim 8, wherein The AD conversion chip is coupled to the support structure via a heat conducting member.

10. The radiation detector module according to claim 9, wherein A heat sink is incorporated into the support structure.

11. A radiation detector, characterized in that: The support structure is thermally coupled to a radiation detector housing portion for mounting a plurality of radiation detector modules according to claim 10 .

12. The radiation detector according to claim 11, wherein The AD conversion chip is coupled to the radiation detector housing via a thermally conductive member.

13. A radiation imaging device, characterized in that: have: A scanner having the radiation detector according to claim 12 therein; a signal processing unit for processing an output signal of the radiation detector; and An image generating section generates an image signal based on the output signal processed by the signal processing section.

14. The radiation imaging device according to claim 13, wherein The signal processing unit controls the scanner.

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