A high voltage MOS chip

Abstract

The present invention provides a high-voltage MOS patch. The high-voltage MOS patch comprises: a shell, wherein a first conductive connector, a second conductive connector and a third conductive connector are respectively arranged inside the shell, and a total of four groups of terminals are arranged on the first conductive connector, the second conductive connector and the third conductive connector; a chip, wherein the chip is arranged on the inner side of the shell, and the conductive end of the chip is electrically connected to the first conductive connector through a group of conductive members. The high-voltage MOS patch provided by the present invention has a shell that adopts a pinless design as a whole, and utilizes a semiconductor cutting and packaging process to weld the terminal part at the bottom of the shell as a conductive terminal to a PCB board for conducting a circuit, thereby saving a large amount of operability space of a small PCB board, making the installation and space utilization of a small PCB board more convenient, greatly reducing the body volume of the existing high-power MOS semiconductor package, and providing technical support for more advanced SMT processes.

Description

Technical Field

[0001] The invention relates to the technical field of high-voltage MOS patches, and in particular to a high-voltage MOS patch. Background Art

[0002] Semiconductor electronic components: field effect transistors, COOL MOS, three-terminal voltage regulators, fast recovery diodes and silicon carbide diodes. The products cover four major fields: industry, new energy, transportation, and green lighting. They include not only emerging energy sources such as photovoltaic inverters and drones, but also household items such as auto parts and LED lighting. High-voltage MOS patches need to be connected to PCB boards when in use. Due to the different sizes of PCB boards and the limitations of the installation environment, the installation of high-voltage MOS patches needs to be adjusted according to the requirements of the installation space.

[0003] High-voltage MOS patch products use an external pin connection design, which is large in size and occupies installation space, making it inconvenient to install small circuit boards, affecting the application of high-voltage MOS patches on small circuit boards.

[0004] Therefore, it is necessary to provide a high-voltage MOS patch to solve the above technical problems. Summary of the invention

[0005] The invention provides a high-voltage MOS patch, which solves the problem that the high-voltage MOS patch adopts an external pin connection design and has a large volume and occupies installation space.

[0006] In order to solve the above technical problems, the high-voltage MOS patch provided by the present invention includes: a shell, a first conductive connector, a second conductive connector and a third conductive connector are respectively arranged inside the shell, and a total of four groups of terminals are arranged on the first conductive connector, the second conductive connector and the third conductive connector; a chip, the chip is arranged on the inner side of the shell, the conductive end of the chip is electrically connected to the first conductive connector through a group of conductive parts, the conductive end of the chip is electrically connected to the second conductive connector through another group of conductive parts, and the conductive end of the chip is electrically connected to the third conductive connector through another ten groups of conductive ends; the shell and the chip are processed by using a semiconductor cutting and packaging process.

[0007] The whole shell adopts a pin-free design. By using the semiconductor cutting and packaging process, the terminal part at the bottom of the shell is used as a conductive terminal to weld the circuit between the PCB board. Under the premise of having the same high-voltage MOS function and performance, the interior of the shell saves a lot of operable space for small PCB boards, making the installation and space utilization of small PCB boards more convenient, greatly reducing the body volume of existing high-power MOS semiconductor packages, and providing technical support for more advanced SMT processes.

[0008] Preferably, the semiconductor cutting and packaging process includes a lead frame required for use in an etching process, the lead frame comprising a frame body, an upper surface of the frame body being provided with a mounting groove, a first indicator groove being provided on one side of an inner wall of the mounting groove, two indicator marks being provided on one side of the upper surface of the frame body, and a second indicator groove being provided on the other side of the inner wall of the mounting groove.

[0009] Preferably, the first indicating groove and the second indicating groove are symmetrically distributed, at least forty-two groups of etching grooves are arranged inside the installation groove, and the inner surface of the etching groove is matched with the surface of the shell.

[0010] One side of the first indicator groove corresponds to the terminal connection end of the shell. During installation, you only need to align the terminal end of the shell with the direction of the first indicator groove. The second indicator groove corresponds to the side in the opposite direction of the shell terminal, which is convenient for the shell on the frame to be installed in a specified direction. The indicator mark corresponds to the front side of the shell. During installation, the direction of the indicator mark corresponds to the front side of the shell facing upwards, so as to facilitate the operator to identify the direction of the front and back sides of the shell when installing.

[0011] Preferably, the first conductive connector, the second conductive connector and the third conductive connector are located on the same side and are distributed in parallel, the first conductive connector is provided with a group of terminals, the second conductive connector is provided with a group of terminals, and the third conductive connector is provided with two groups of terminals.

[0012] Preferably, when the high-voltage MOS patch and the PCB board are welded to conduct the circuit, a shell alignment device is required, and the alignment device includes an operating platform, a limiting groove is provided on the top of the operating platform, a support frame is fixedly connected to the top of the operating platform, an adjusting handwheel is provided above the support frame, an adjusting screw shaft is fixedly connected to the bottom of the adjusting handwheel, the bottom of the adjusting screw shaft is rotatably connected to a limiting frame, a connecting hole is provided on the limiting frame, at least two groups of limiting sliding shafts are fixedly connected to the top of the limiting frame, a PCB board body is provided inside the limiting groove, and the shell is provided on the welding surface of the PCB board body.

[0013] The PCB board body is prevented from horizontally moving and appearing. At the same time, the limit frame limits the shell to maintain the stability of the shell installed on the surface of the PCB board body, thereby ensuring the stability of the shell terminal and the connecting end of the PCB board body when being welded.

[0014] Preferably, the surface of the adjusting screw shaft is threadedly connected to the surface of the supporting frame, and the bottom end of the adjusting screw shaft passes through the supporting frame and extends to the bottom of the supporting frame.

[0015] Preferably, the interior of the connecting hole is communicated with the inner side of the limiting frame.

[0016] Preferably, the top end of the limiting sliding shaft passes through the bottom of the supporting frame and extends to the top of the supporting frame, and the surface of the limiting sliding shaft is slidably connected to the surface of the supporting frame.

[0017] Preferably, a moving motor is fixedly connected to the top of the limiting frame, and a moving roller is fixedly connected to the output end of the moving motor.

[0018] Preferably, the surface of the movable roller extends to the inner side of the limit frame through the connecting hole, and the surface of the limit frame is matched with the surface of the shell.

[0019] When the moving roller rotates forward, the moving roller drives the shell to move forward of the limit frame. When the moving roller rotates reversely, the moving roller drives the shell to move backward of the limit frame, thereby facilitating the adjustment of the longitudinal position of the shell after limiting, so as to adjust the optimal welding position of the shell and the PCB board body, and ensure the stability of the welding process of the shell and the PCB board body.

[0020] Compared with the related art, the high-voltage MOS patch provided by the present invention has the following beneficial effects:

[0021] The present invention provides a high-voltage MOS patch, wherein the entire shell adopts a pin-free design, and a semiconductor cutting and packaging process is utilized to weld a terminal portion at the bottom of the shell as a conductive terminal to a PCB board for conducting a circuit, thereby saving a large amount of operability space of a small PCB board, making the installation and space utilization of the small PCB board more convenient, greatly reducing the body volume of an existing high-power MOS semiconductor package, and providing technical support for a more advanced SMT process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of a high-voltage MOS patch in the prior art;

[0023] Figure 2 A schematic structural diagram of a first embodiment of a high-voltage MOS patch provided by the present invention;

[0024] Figure 3 for Figure 2 A schematic structural diagram of the shell portion shown;

[0025] Figure 4 A schematic structural diagram of a lead frame for a high-voltage MOS patch provided by the present invention;

[0026] Figure 5 for Figure 4 An enlarged schematic diagram of part A is shown;

[0027] Figure 6 for Figure 4 An enlarged schematic diagram of part B is shown;

[0028] Figure 7 for Figure 2 A schematic structural diagram of the wiring area of ​​the housing shown;

[0029] Figure 8 for Figure 4 The lead frame mounting direction identification diagram shown;

[0030] Fig. 9 A schematic structural diagram of a second embodiment of the high-voltage MOS patch provided by the present invention;

[0031] Fig.10 for Fig. 9 An enlarged schematic diagram of part C is shown.

[0032] Numbers in the figure: 1. box body, 11. pin, 2. shell, 21. first conductive connector, 22. second conductive connector, 23. third conductive connector, 3. chip, 4. frame, 41. mounting slot, 42. first indicator slot, 43. indicator mark, 44. second indicator slot, 5. operating platform, 51. limit slot, 6. support frame, 7. adjusting hand wheel, 71. adjusting screw shaft, 72. limit frame, 721. connecting hole, 73. limit sliding shaft, 8. PCB board body, 9. moving motor, 91. moving roller. DETAILED DESCRIPTION

[0033] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0034] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 ,in, Figure 1 It is a structural schematic diagram of a high-voltage MOS patch in the prior art; Figure 2 A schematic structural diagram of a first embodiment of a high-voltage MOS patch provided by the present invention; Figure 3 for Figure 2 A schematic structural diagram of the shell portion shown;

[0035] Figure 4 A schematic structural diagram of a lead frame for a high-voltage MOS patch provided by the present invention; Figure 5 for Figure 4 An enlarged schematic diagram of part A is shown; Figure 6 for Figure 4 An enlarged schematic diagram of part B is shown; Figure 7 for Figure 2 A schematic structural diagram of the wiring area of ​​the housing shown; Figure 8 for Figure 4 The lead frame mounting direction identification diagram shown. A high-voltage MOS patch includes: a shell 2, wherein the first conductive connector 21, the second conductive connector 22 and the third conductive connector 23 are respectively arranged inside the shell 2, and the first conductive connector 21, the second conductive connector 22 and the third conductive connector 23 are provided with a total of four groups of terminals; a chip 3, wherein the chip 3 is arranged on the inner side of the shell 2, the conductive end of the chip 3 is electrically connected to the first conductive connector 21 through a group of conductive parts, the conductive end of the chip 3 is electrically connected to the second conductive connector 22 through another group of conductive parts, and the conductive end of the chip 3 is electrically connected to the third conductive connector 23 through another ten groups of conductive ends; the shell 2 and the chip 3 are processed by a semiconductor cutting and packaging process.

[0036] The housing 2 as a whole adopts a pin-free design. By using the semiconductor cutting and packaging process, the terminal part at the bottom of the housing 2 is used as a conductive terminal to be welded to the PCB board to conduct the circuit. The interior of the housing 2 saves a large amount of operable space of a small PCB board while having the same high-voltage MOS function and performance, making the installation and space utilization of the small PCB board more convenient, greatly reducing the body volume of the existing high-power MOS semiconductor package, and providing technical support for more advanced SMT processes.

[0037] The semiconductor cutting and packaging process includes a lead frame required for use in an etching process, the lead frame includes a frame body 4, a mounting groove 41 is provided on the upper surface of the frame body 4, a first indicator groove 42 is provided on one side of the inner wall of the mounting groove 41, two indicator marks 43 are provided on one side of the upper surface of the frame body 4, and a second indicator groove 44 is provided on the other side of the inner wall of the mounting groove 41.

[0038] The housing 2 with a pinless design requires a specially designed corresponding lead frame. The new lead frame is in accordance with the special etching process used in the processing of the housing 2 and its shape meets the requirements of the semiconductor packaging cutting process.

[0039] The first indicating groove 42 and the second indicating groove 44 are symmetrically distributed, and at least forty-two groups of etching grooves are arranged inside the installation groove 41 , and the inner surface of the etching groove is adapted to the surface of the housing 2 .

[0040] One side of the first indicator groove 42 corresponds to the terminal connection end of the housing 2. When installing, you only need to align the terminal end of the housing 2 with the direction of the first indicator groove 42. The second indicator groove 44 corresponds to the side of the housing 2 in the opposite direction of the terminal, which facilitates the installation of the housing 2 on the frame 4 in a specified direction.

[0041] The indicator mark 43 corresponds to the front side of the housing 2 . When installing, the indicator mark 43 is oriented in a direction corresponding to the front side of the housing 2 facing upwards, so that the operator can easily identify the direction of the front and back sides of the housing 2 when installing.

[0042] The first conductive connector 21, the second conductive connector 22 and the third conductive connector 23 are located on the same side and are distributed in parallel. The first conductive connector 21 is provided with a group of terminals, the second conductive connector 22 is provided with a group of terminals, and the third conductive connector 23 is provided with two groups of terminals.

[0043] Compared with the related art, the high-voltage MOS patch provided by the present invention has the following beneficial effects:

[0044] The shell 2 as a whole adopts a pin-free design. By using the semiconductor cutting and packaging process, the terminal part at the bottom of the shell 2 is used as a conductive terminal to weld the circuit between the PCB board, saving a large amount of operable space of the small PCB board, making the installation and space utilization of the small PCB board more convenient, greatly reducing the body volume of the existing high-power MOS semiconductor package, and providing technical support for more advanced SMT processes.

[0045] Second embodiment:

[0046] See also Fig. 9 and Fig.10 Based on the high-voltage MOS patch provided by the first embodiment of the present application, the second embodiment of the present application provides another high-voltage MOS patch. The second embodiment is only a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0047] Specifically, the difference of the high-voltage MOS patch provided in the second embodiment of the present application is that when the high-voltage MOS patch is welded to the PCB board to conduct the circuit, an alignment device of the shell 2 is required, and the alignment device includes an operating platform 5, a limiting groove 51 is provided on the top of the operating platform 5, and a support frame 6 is fixedly connected to the top of the operating platform 5. An adjusting handwheel 7 is arranged above the support frame 6, and an adjusting screw shaft 71 is fixedly connected to the bottom of the adjusting handwheel 7, and the bottom of the adjusting screw shaft 71 is rotatably connected to a limiting frame 72, and a connecting hole 721 is provided on the limiting frame 72. At least two groups of limiting sliding shafts 73 are fixedly connected to the top of the limiting frame 72, and a PCB board body 8 is arranged inside the limiting groove 51, and the shell 2 is arranged on the welding surface of the PCB board body 8.

[0048] The adjusting hand wheel 7 can be used to drive the adjusting screw shaft 71 to rotate and adjust. Since the surface of the adjusting screw shaft 71 is threadedly connected to the surface of the support frame 6, when the adjusting screw shaft 71 rotates forward, the adjusting screw shaft 71 moves upward through the threaded structure, and when the adjusting screw shaft 71 is reversed, the adjusting screw shaft 71 moves downward through the threaded structure. When the adjusting screw shaft 71 moves, the limit frame 72 is simultaneously driven to move up and down for adjustment. When the limit frame 72 moves, it is limited by the sliding structure between the limit sliding shaft 73 and the support frame 6 to ensure the stability of the upper and lower movement of the limit frame 72 and avoid the limit frame 72 from rotating.

[0049] The limit frame 72 is located directly above the limit groove 51, and the PCB board body 8 is installed inside the limit groove 51, so that the PCB board body 8 is stably installed above the operating platform 5 to prevent the PCB board body 8 from horizontal movement and exposure. At the same time, the limit frame 72 limits the shell 2 to maintain the stability of the shell 2 installed on the surface of the PCB board body 8, thereby ensuring the stability of the terminals of the shell 2 and the connecting ends of the PCB board body 8 when being welded.

[0050] The surface of the adjusting screw shaft 71 is threadedly connected to the surface of the supporting frame 6 , and the bottom end of the adjusting screw shaft 71 passes through the supporting frame 6 and extends to the bottom of the supporting frame 6 .

[0051] The adjusting screw shaft 71 is conveniently adjusted up and down on the surface of the support frame 6 through a threaded connection structure. The bottom end of the adjusting screw shaft 71 is rotatably connected to the top of the limit frame 72, so that the adjusting screw shaft 71 can synchronously drive the limit frame 72 to move up and down for adjustment.

[0052] The interior of the connection hole 721 is communicated with the inner side of the limiting frame 72 .

[0053] The top end of the limiting sliding shaft 73 passes through the bottom of the supporting frame 6 and extends to the top of the supporting frame 6 , and the surface of the limiting sliding shaft 73 is slidably connected to the surface of the supporting frame 6 .

[0054] The limiting sliding shaft 73 and the supporting frame 6 are slidably limited to limit the limiting frame 72, so that the limiting frame 72 can only move up and down without rotating.

[0055] A moving motor 9 is fixedly connected to the top of the limiting frame 72 , and a moving roller 91 is fixedly connected to the output end of the moving motor 9 .

[0056] The surface of the moving roller 91 extends to the inner side of the limiting frame 72 through the connecting hole 721 , and the surface of the limiting frame 72 is matched with the surface of the housing 2 .

[0057] When the moving motor 9 is in use, it is connected to an external power supply. The moving roller 91 at the output end of the moving motor 9 adopts a rubber wheel structure. After the limit frame 72 moves downward and covers the surface of the shell 2, the surface of the moving roller 91 contacts the surface of the shell 2. When the longitudinal position of the shell 2 deviates and is misaligned with the surface of the PCB board body 8, the moving motor 9 is started, and the moving motor 9 drives the moving roller 91 to rotate synchronously. When the moving roller 91 rotates forward, the moving roller 91 drives the shell 2 to move forward of the limit frame 72. When the moving roller 91 rotates reversely, the moving roller 91 drives the shell 2 to move backward of the limit frame 72, thereby facilitating the adjustment of the longitudinal position of the shell 2 after limiting, so as to adjust the optimal welding position of the shell 2 and the PCB board body 8, and ensure the stability of the welding process of the shell 2 and the PCB board body 8.

[0058] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A high voltage MOS patch, characterized in that: include: A housing, wherein a first conductive connector, a second conductive connector and a third conductive connector are respectively disposed inside the housing, and a total of four groups of terminals are disposed on the first conductive connector, the second conductive connector and the third conductive connector; A chip, wherein the chip is disposed inside the housing, a conductive end of the chip is electrically connected to the first conductive connecting member through a group of conductive members, a conductive end of the chip is electrically connected to the second conductive connecting member through another group of conductive members, and a conductive end of the chip is electrically connected to the third conductive connecting member through another ten groups of conductive ends; The shell and the chip are processed by using a semiconductor cutting and packaging process; The semiconductor cutting and packaging process includes a lead frame required for use in an etching process, the lead frame includes a frame body, a mounting groove is provided on the upper surface of the frame body, a first indicator groove is provided on one side of the inner wall of the mounting groove, two indicator marks are provided on one side of the upper surface of the frame body, and a second indicator groove is provided on the other side of the inner wall of the mounting groove; The first indicator groove and the second indicator groove are symmetrically distributed, and at least forty-two groups of etching grooves are arranged inside the installation groove, and the inner surface of the etching groove is adapted to the surface of the shell; The first conductive connector, the second conductive connector and the third conductive connector are located on the same side and are distributed in parallel. The first conductive connector is provided with a group of terminals, the second conductive connector is provided with a group of terminals, and the third conductive connector is provided with two groups of terminals.

2. The high-voltage MOS patch according to claim 1, characterized in that: When the high-voltage MOS patch is welded to the PCB board for conducting the circuit, a shell alignment device needs to be used. The alignment device includes an operating platform, a limiting groove is provided on the top of the operating platform, a support frame is fixedly connected to the top of the operating platform, an adjusting handwheel is arranged above the support frame, an adjusting screw shaft is fixedly connected to the bottom of the adjusting handwheel, the bottom of the adjusting screw shaft is rotatably connected to a limiting frame, a connecting hole is provided on the limiting frame, at least two groups of limiting sliding shafts are fixedly connected to the top of the limiting frame, a PCB board body is arranged inside the limiting groove, and the shell is arranged on the welding surface of the PCB board body.

3. The high-voltage MOS patch according to claim 2, characterized in that: The surface of the adjusting screw shaft is threadedly connected to the surface of the supporting frame, and the bottom end of the adjusting screw shaft passes through the supporting frame and extends to the bottom of the supporting frame.

4. The high-voltage MOS patch according to claim 2, characterized in that: The interior of the connection hole is communicated with the inner side of the limiting frame.

5. The high-voltage MOS patch according to claim 2, characterized in that: The top end of the limiting sliding shaft passes through the bottom of the supporting frame and extends to the top of the supporting frame, and the surface of the limiting sliding shaft is slidably connected to the surface of the supporting frame.

6. The high-voltage MOS patch according to claim 2, characterized in that: The top of the limit frame is fixedly connected with a moving motor, and the output end of the moving motor is fixedly connected with a moving roller.

7. The high-voltage MOS patch according to claim 6, characterized in that: The surface of the movable roller extends to the inner side of the limiting frame through the connecting hole, and the surface of the limiting frame is matched with the surface of the shell.

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