Display device

Abstract

The present application can provide a display device capable of suppressing wire breakage in a high-temperature and low-temperature repeated environment. The display device is a display device that displays an image on a display region, and includes: an insulating substrate; a plurality of wirings provided on the insulating substrate and extending from the display region to a frame region outside the display region; a driver provided in the frame region and connected to the plurality of wirings; an organic protective film overlapping the plurality of wirings and provided from the display region to a region between the display region and the driver; an anisotropic conductive film overlapping the driver and covering an end portion of the organic protective film between the display region and the driver; and a moisture-proof resin film overlapping the anisotropic conductive film between the display region and the driver and covering the end portion of the organic protective film.

Description

Technical Field

[0001] The following disclosure relates to a display device. Background Technology

[0002] In the past, various display devices, such as liquid crystal displays and organic electroluminescent (EL) displays, have been widely used as devices for displaying images (moving images and still images).

[0003] For example, a liquid crystal display (LCD) device is a display device that utilizes liquid crystal components for display. A representative display method involves irradiating a liquid crystal panel with light from a backlight. The liquid crystal panel comprises: a TFT substrate equipped with thin-film transistors (TFTs), a counter substrate disposed opposite to the TFT substrate, and a liquid crystal layer sealed between the TFT substrate and the counter substrate. A voltage is applied to the liquid crystal molecules contained in the liquid crystal layer to change the orientation state of the liquid crystal molecules, thereby controlling the amount of light transmitted. Such LCD devices are characterized by their thinness, light weight, and low power consumption, and are used in a wide range of fields.

[0004] Furthermore, organic EL display devices include, for example, a TFT substrate on which a TFT is disposed; organic EL elements disposed on the TFT substrate and connected to the TFT; an adhesive layer disposed in a frame shape surrounding the organic EL elements; and a sealing substrate disposed to cover the organic EL elements. Organic EL display devices for full-color displays typically have red (R), green (G), and blue (B) organic EL elements as subpixels, these subpixels arranged in a matrix, with each subpixel of the three colors constituting a pixel. Furthermore, images are displayed by selectively emitting light from these organic EL elements at a desired brightness.

[0005] The TFT substrate includes: multiple gate lines extending parallel to each other, and multiple source lines extending parallel to each other in a direction intersecting with each gate line, separated by an insulating film. A TFT serving as a switching element is disposed at the intersection of each source line and each gate line. The liquid crystal display device controls this driving via a source driver electrically connected to the source lines and a gate driver electrically connected to the gate lines.

[0006] Drivers such as source drivers for driving liquid crystal display devices are composed of semiconductor chips. As a technology related to semiconductor chips, for example, Patent Document 1 discloses a structure in which, except for at least the ends of the upper surface of the semiconductor chip, the bonding wire portion is reinforced by covering it with an epoxy resin with a low coefficient of thermal expansion, and then sealed from above with an epoxy-based filler resin having a coefficient of linear expansion close to that of the solder.

[0007] Existing technical documents

[0008] Existing technical documents

[0009] Patent documents

[0010] Patent Document 1: Japanese Patent Application Publication No. 2005-311019 Summary of the Invention

[0011] The technical problem to be solved by the present invention

[0012] In automotive LCD devices, the overall heat generation increases due to both the increased heat from the driver caused by higher resolution and the increased heat from the light source caused by higher brightness (multiple lamps). Furthermore, automotive LCD devices require high performance in reliability testing, such as thermal cycle endurance (TCE) testing, which repeatedly exposes the device to high and low temperatures for over 1800 hours. This 1800-hour TCE test is based on a 15-year, 300,000 km, 8,000-hour driving history, and will continue to be a mandatory requirement for end-users. However, it is known that automotive LCD devices undergoing this TCE test experienced wire breakage after over 1200 hours, with cracks appearing in both the TFT substrate wiring and the protective layer covering the wiring.

[0013] Such cracks can also occur in organic EL displays, just as they do in liquid crystal displays. It is believed that these cracks are caused by the following reasons. Please provide examples of liquid crystal displays used in the comparison. Figure 15 This is a diagram of the bezel area of ​​a liquid crystal display device in a comparative manner, and is a cross-sectional schematic diagram showing a state in which cracks have formed on the moisture-proof resin film of the liquid crystal display device. Figure 16 yes Figure 15 An enlarged cross-sectional view of the area enclosed by the dashed line in the diagram. Figure 17 This is a photograph showing the state of a broken wiring in a liquid crystal display device with a comparison mode.

[0014] like Figure 15 As shown, the comparison-mode liquid crystal display device 1R includes a display area 10A for displaying images and a border area 10B disposed around the display area 10A. The liquid crystal display device 1R as... Figure 15As shown, the system includes: an insulating substrate 110; multiple source wirings 141 disposed on the insulating substrate 110 and extending from the display area 10A to a frame area 10B outside the display area 10A; a source driver 300 disposed in the frame area 10B and connected to the multiple source wirings 141; an organic protective film 160 overlapping the source wirings 141 and extending from the display area 10A to a region 10C between the display area 10A and the source driver 300; and a moisture-proof resin film 500 covering the end 161 of the organic protective film 160 between the display area 10A and the source driver 300. The inorganic film 150 and the organic protective film 160 covering the source wirings 141 are also referred to as protective layers.

[0015] In the comparative method, the moisture-proof resin film 500 hardens after being heated and oxidized, and is then exposed to low temperatures, such as... Figure 16 As shown, a crack 500X is generated in the moisture-proof resin film 500, applying large stress to the substrate. Consequently, the film beneath the moisture-proof resin film 500 is damaged from the surface inwards. As a result, it is believed that... Figure 16 The crack shown indicates that the source wiring 141 and the protective layer covering it were destroyed. Figure 17 The white arrow indicates a break in the source wiring.

[0016] In the aforementioned Patent Document 1, the filling resin is filled in such a way that it covers the entire internal components of the housing. This method has the following problems: it selectively promotes the deterioration of the filling resin in areas where the temperature rises, and when it cools and cracks, it causes significant stress on the substrate. Furthermore, compared to under certain temperature conditions, the cracking of the filling resin occurs particularly rapidly under repeated high and low temperature conditions, thus posing a reliability problem in practical use.

[0017] The present invention was made in view of the above-mentioned situation, and its purpose is to provide a display device that can suppress wire breakage under repeated high and low temperature environments.

[0018] Technical solutions for solving technical problems

[0019] The inventors have discovered that cracks 500X in the moisture-proof resin film 500 of the liquid crystal display device 1R described above occur when the following three conditions 1 to 3 are met.

[0020] (Condition 1) The structure of the moisture-proof resin film 500 covering the end 161 of the organic protective film 160 (e.g., an acrylic resin film).

[0021] (Condition 2) The source driver 300 and the light source of the liquid crystal display device 1R that accepts the comparison method are heated, and the moisture-proof resin film 500 is oxidized and deteriorated and hardened.

[0022] (Condition 3) The hardened moisture-proof resin film 500 generates thermal stress at low temperature.

[0023] Furthermore, the inventors discovered that by providing an anisotropic conductive film between the end of the organic protective film and the moisture-proof resin film, or by providing an epoxy resin film between the end of the acrylic resin film and the styrene-butadiene resin film, it is possible to avoid the above-mentioned condition (1) and suppress the occurrence of wire breakage. In addition, it was found that by ensuring that the moisture-proof resin film does not cover at least a portion of the top surface of the driver, it is possible to avoid the above-mentioned condition (2) and suppress the occurrence of wire breakage. Furthermore, it was found that by providing wiring around areas where thermal stress occurs in the moisture-proof resin film at low temperatures, it is possible to avoid providing wiring around areas where cracks occur due to the above-mentioned condition (3) and suppress the occurrence of wire breakage. Thus, it is conceivable that the above-mentioned problems can be successfully solved, and the present invention is achieved.

[0024] (1) One embodiment of the present invention is a display device for displaying images in a display area, comprising: an insulating substrate; a plurality of wirings disposed on the insulating substrate and extending from the display area to a frame area outside the display area; a driver disposed in the frame area and connected to the plurality of wirings; an organic protective film overlapping the plurality of wirings and disposed from the display area to a region between the display area and the driver; an anisotropic conductive film overlapping the driver and covering the end of the organic protective film between the display area and the driver; and a moisture-proof resin film overlapping the anisotropic conductive film between the display area and the driver and covering the end of the organic protective film.

[0025] (2) In addition, one embodiment of the present invention is based on the above (1) structure, wherein the organic protective film is an acrylic resin film, the anisotropic conductive film is an epoxy resin film, and the moisture-proof resin film is a styrene-butadiene resin film display device.

[0026] (3) Furthermore, in one embodiment of the present invention, based on the configuration described in (1) or (2) above, the moisture-proof resin film does not cover at least a portion of the top surface of the driver in a display device.

[0027] (4) Furthermore, one embodiment of the present invention is a display device in which the moisture-proof resin film does not cover more than 60% and less than 100% of the total area of ​​the top surface of the driver, based on the above-described (3) configuration.

[0028] (5) Furthermore, in one embodiment of the present invention, based on the configuration described in (3) or (4) above, the display device further includes a heat sink attached to the portion of the top surface of the driver that is not covered by the moisture-proof resin film.

[0029] (6) Furthermore, in one embodiment of the present invention, based on the configuration described in (1), (2), (3), (4) or (5) above, the plurality of wirings include a display device in which wirings are provided that bypass the oblique front region of the driver, i.e., the oblique front region that overlaps with the end of the organic protective film, and extend from the driver to the display area.

[0030] (7) Furthermore, in one embodiment of the present invention, based on the configuration described in (6) above, the driver is disposed along the display area, and the tilted front area is a display device in a direction orthogonal to the direction from the driver toward the display area, extending from a position 1.5 mm away from the driver to a position 2.5 mm away from the driver.

[0031] (8) Furthermore, in one embodiment of the present invention, based on the configuration described in (6) or (7) above, the driver is disposed along the display area, and the oblique front area is a display device in the direction from the driver toward the display area, from a position 0.5 mm away from the driver to a position 1.0 mm away from the driver.

[0032] (9) Furthermore, one embodiment of the present invention is based on the configuration described in (1), (2), (3), (4), (5), (6), (7), or (8) above, and further includes an inorganic film disposed between the plurality of wirings and the organic protective film, the inorganic film extending to the outer region of the end of the organic protective film.

[0033] (10) Furthermore, another embodiment of the present invention is a display device for displaying images in a display area, comprising: an insulating substrate; a plurality of wirings disposed on the insulating substrate and extending from the display area to a frame area outside the display area; a driver disposed in the frame area and connected to the plurality of wirings; an acrylic resin film overlapping the plurality of wirings and disposed from the display area to a region between the display area and the driver; an epoxy resin film covering the end of the acrylic resin film between the display area and the driver; and a styrene-butadiene resin film overlapping the epoxy resin film between the display area and the driver and covering the end of the acrylic resin film.

[0034] (11) Furthermore, one embodiment of the present invention provides a display device based on the configuration described in (10) above, wherein the styrene-butadiene resin film does not cover at least a portion of the top surface of the driver.

[0035] (12) Furthermore, one embodiment of the present invention is a display device in which the moisture-proof resin film does not cover more than 60% and less than 100% of the total area of ​​the top surface of the driver, based on the configuration described in (11) above.

[0036] (13) Furthermore, one embodiment of the present invention is based on the configuration described in (11) or (12) above, and further includes a heat sink, which is attached to the top surface of the driver on a portion of the display device not covered by the styrene-butadiene ester film.

[0037] (14) Furthermore, in one embodiment of the present invention, based on the configuration described in (10), (11), (12) or (13) above, the plurality of wirings include a display device in which wirings are provided that bypass the oblique front region of the driver and overlap with the end of the acrylic resin film and extend from the driver to the display area.

[0038] (15) Furthermore, in one embodiment of the present invention, based on the configuration described in (14) above, the driver is disposed along the display area, and the tilted front area is a display device in a direction orthogonal to the direction from the driver toward the display area, ranging from a position 1.5 mm away from the driver to a position 2.5 mm away from the driver.

[0039] (16) Furthermore, one embodiment of the present invention is based on the configuration described in (14) or (15) above, wherein the driver is disposed along the display area, and the oblique front area is a display device in the direction from the driver toward the display area, from a position 0.5 mm away from the driver to a position 1.0 mm away from the driver.

[0040] (17) Furthermore, one embodiment of the present invention is based on the configuration described in (10), (11), (12), (13), (14), (15), or (16) above, and further includes a display device in which an inorganic film is disposed between the plurality of wirings and the acrylic resin film, and the inorganic film extends to the outer region of the end of the acrylic resin film.

[0041] (18) Furthermore, another embodiment of the present invention is a display device for displaying images in a display area, comprising: an insulating substrate; a plurality of wirings disposed on the insulating substrate and extending from the display area to a frame area outside the display area; a driver disposed in the frame area and connected to the plurality of wirings; an organic protective film overlapping the plurality of wirings and disposed from the display area to a region between the display area and the driver; and a moisture-proof resin film covering the end of the organic protective film between the display area and the driver, but not covering at least a portion of the top surface of the driver.

[0042] (19) Furthermore, one embodiment of the present invention is a display device in which the moisture-proof resin film does not cover more than 60% and less than 100% of the total area of ​​the top surface of the driver, based on the configuration described in (18) above.

[0043] (20) Furthermore, in one embodiment of the present invention, based on the configuration described in (18) or (19) above, the display device further includes a heat sink attached to the top surface of the driver on the portion of the display device not covered by the moisture-proof resin film.

[0044] (21) Furthermore, one embodiment of the present invention is based on the configuration described in (18), (19) or (20) above, wherein the plurality of wirings include a display device in which wirings are provided to extend from the driver to the display area, passing around the oblique front region of the driver and overlapping the end of the organic protective film.

[0045] (22) Furthermore, in one embodiment of the present invention, based on the configuration described in (21) above, the driver is disposed along the display area, and the tilted front area is a display device in a direction orthogonal to the direction from the driver toward the display area, ranging from a position 1.5 mm away from the driver to a position 2.5 mm away from the driver.

[0046] (23) Furthermore, one embodiment of the present invention is based on the configuration described in (21) or (22) above, wherein the driver is disposed along the display area, and the oblique front area is a display device in the direction from the driver toward the display area, from a position 0.5 mm away from the driver to a position 1.0 mm away from the driver.

[0047] (24) Furthermore, one embodiment of the present invention is based on the configuration described in (18), (19), (20), (21), (22), or (23) above, and further includes a display device in which an inorganic film is disposed between the plurality of wirings and the organic protective film, and the inorganic film extends to the outer region of the end of the organic protective film.

[0048] (25) In addition, another embodiment of the present invention is a display device for displaying images in a display area, comprising: an insulating substrate; a plurality of wirings disposed on the insulating substrate and extending from the display area to a frame area outside the display area; a driver disposed in the frame area and connected to the plurality of wirings; an organic protective film overlapping the plurality of wirings and disposed from the display area to a region between the display area and the driver; and a moisture-proof resin film covering the end of the organic protective film between the display area and the driver. When the direction from the driver toward the display area is set to front, the plurality of wirings include wirings that bypass the front of the driver, i.e., the front region that overlaps with the end of the organic protective film, and extend from the driver toward the display area.

[0049] (26) Furthermore, in one embodiment of the present invention, based on the configuration described in (25) above, the driver is disposed along the display area, and the tilted front area is a display device in a direction orthogonal to the direction from the driver toward the display area, ranging from a position 1.5 mm away from the driver to a position 2.5 mm away from the driver.

[0050] (27) Furthermore, one embodiment of the present invention is based on the configuration described in (25) or (26) above, wherein the driver is disposed along the display area, and the oblique front area is a display device in the direction from the driver toward the display area, from a position 0.5 mm away from the driver to a position 1.0 mm away from the driver.

[0051] (28) Furthermore, one embodiment of the present invention is based on the configuration described in (25), (26) or (27) above, and further includes an inorganic film disposed between the plurality of wirings and the organic protective film, the inorganic film extending to the outer region of the end of the organic protective film.

[0052] (29) Furthermore, in one embodiment of the present invention, the display device is a liquid crystal display device based on the configuration described in (1), (2), (3), (4), (5), (6), (7), (8), (9), (10), (11), (12), (13), (14), (15), (16), (17), (18), (19), (20), (21), (22), (23), (24), (25), (26), (27), or (28) above.

[0053] (30) Furthermore, in one embodiment of the present invention, the display device is an organic electroluminescent display device based on the configuration described in (1), (2), (3), (4), (5), (6), (7), (8), (9), (10), (11), (12), (13), (14), (15), (16), (17), (18), (19), (20), (21), (22), (23), (24), (25), (26), (27), or (28) above.

[0054] Beneficial effects

[0055] According to the present invention, a display device is provided that can suppress the occurrence of line breaks under repeated high and low temperature environments. Attached Figure Description

[0056] Figure 1 This is a top view schematic diagram showing the liquid crystal display device according to Embodiment 1.

[0057] Figure 2 This is another top view schematic diagram showing the liquid crystal display device according to Embodiment 1.

[0058] Figure 3 This is a cross-sectional schematic diagram showing the protruding area of ​​the liquid crystal display device according to Embodiment 1.

[0059] Figure 4 This is an example of a photograph showing cracks that occur when a comparative liquid crystal display device is exposed to repeated low and high temperature environments.

[0060] Figure 5 Observed using a scanning electron microscope Figure 4 A photograph of the cross section along the X1-X2 line.

[0061] Figure 6AThis is a top view schematic diagram of a liquid crystal display device according to a variation of Embodiment 1.

[0062] Figure 6B This is a top view schematic diagram illustrating the configuration of the moisture-proof resin film and the source driver in the liquid crystal display device of Modification 1 of Embodiment 1.

[0063] Figure 6C This is a cross-sectional schematic diagram of a liquid crystal display device according to a variation of Embodiment 1.

[0064] Figure 7 This is a top view of the bezel area of ​​a liquid crystal display device according to a variation of Embodiment 1, Example 2.

[0065] Figure 8 This is an enlarged top view of the bezel area of ​​the liquid crystal display device in Modification 2 of Embodiment 1.

[0066] Figure 9 It is a map showing the location of line breakage in a durability thermal cycling test conducted on a liquid crystal display device using a comparative method, and a top view diagram that overlays the results of three liquid crystal display devices onto one liquid crystal display device.

[0067] Figure 10 This is a top view schematic diagram of the organic EL display device according to Embodiment 2.

[0068] Figure 11 This is a cross-sectional schematic diagram of the protruding area of ​​the organic EL display device according to Embodiment 2.

[0069] Figure 12 This is a cross-sectional schematic diagram of the protruding area of ​​the organic EL display device according to Embodiment 2.

[0070] Figure 13 This is a photograph showing the cracks in the liquid crystal display device of Example 1 that occurred during a durability thermal cycling test.

[0071] Figure 14 This is a diagram showing the temperature distribution of the source driver of the liquid crystal display device in Embodiment 2.

[0072] Figure 15 This is a diagram of the bezel area of ​​a liquid crystal display device in a comparative manner, and it is a cross-sectional schematic diagram showing a state in which cracks have formed on the moisture-proof resin film of the liquid crystal display device.

[0073] Figure 16 yes Figure 15 An enlarged cross-sectional view of the area enclosed by the dashed line.

[0074] Figure 17 This is a photograph showing the state of a broken wiring in a liquid crystal display device with a comparison mode. Detailed Implementation

[0075] The embodiments of the present invention will now be described. The present invention is not limited to the contents described in the following embodiments, and design changes can be appropriately made within the scope of satisfying the structure of the present invention. Furthermore, the various configurations described in the embodiments can be appropriately combined or modified without departing from the spirit of the present invention.

[0076] <Implementation Method 1>

[0077] In this embodiment, a liquid crystal display device is used as an example of the above-described display device for explanation. In this embodiment, an anisotropic conductive film is provided between the end of the organic protective film and the moisture-proof resin film to avoid the above-mentioned (condition 1) and suppress the occurrence of line breakage. Figure 1 This is a top view schematic diagram of the liquid crystal display device according to Embodiment 1. Figure 2 This is another top view schematic diagram of the liquid crystal display device according to Embodiment 1. Figure 3 This is a cross-sectional schematic diagram of the protruding area of ​​the liquid crystal display device according to Embodiment 1. Figure 3 yes Figure 2 A cross-sectional schematic diagram of line A1-A2. Figure 2 The parts outlined by dashed lines are covered by other layers. Furthermore, in... Figure 3 The structure around the source driver on the right is shown in detail, but the other source drivers have the same structure.

[0078] like Figures 1-3 As shown, the liquid crystal display device 1 of this embodiment includes: a display area 10A for displaying images, a border area 10B disposed around the display area 10A, and sequentially includes a thin film transistor (TFT) substrate 100, a liquid crystal layer, and a color filter (CF) substrate 200 from the back side to the viewing side.

[0079] In the liquid crystal display device 1, at one end side near its short side ( Figure 1 The lower side shown) and one end side in the long side direction ( Figure 1 The display area 10A is located at the position shown on the left. The bezel area 10B includes a protruding area 10B1 that is exposed without overlapping with the CF substrate 200 in the TFT substrate 100, and various drivers are mounted in the protruding area 10B1. A printed wiring board 900 is connected to the protruding area 10B1 via a flexible printed circuit board (FPC) 800.

[0080] The TFT substrate 100 includes: an insulating substrate 110; a base coating film 120 disposed on the insulating substrate 110; multiple gate wirings 142 disposed on the base coating film 120; a gate insulating film 130 disposed on the multiple gate wirings 142; multiple source wirings 141 serving as the multiple wirings disposed on the gate insulating film 130; an inorganic film 150 disposed on the multiple source wirings 141; and a source driver 300 serving as the driver, disposed in the bezel region 10B. The display area 10A is located on the protruding region 10B1 and connected to multiple source wirings 141; a gate driver 350 is located on the protruding region 10B1 in the frame region 10B and connected to multiple gate wirings 142; an organic protective film 160 is located on the inorganic film 150 and overlaps with the multiple source wirings 141, and extends from the display area 10A to the region 10C between the display area 10A and the source driver 300; an anisotropic conductive film (ACF) 400 is superimposed on the source driver 300 and covers the end 161 of the organic protective film 160 between the display area 10A and the source driver 300; and a moisture-proof resin film 500 is superimposed on the anisotropic conductive film 400 between the display area 10A and the source driver 300 and covers the end 161 of the organic protective film 160.

[0081] In order to improve the reliability of the liquid crystal display device 1 in this embodiment, a moisture-proof resin film 500 with moisture-proof / water-proof properties is provided to cover the entire protruding area 10B1. However, if the moisture-proof resin film 500 is further used to cover the parts of the substrate film disposed on the back side of the substrate film that have structural or physical property changes (e.g., parts where physical property changes such as the part where the organic protective film 160 changes to the inorganic film 150, and parts where the structure changes such as the end 161 of the organic protective film 160), there is a tendency for stress to concentrate at the parts of the substrate film where the structure or physical property changes when the moisture-proof resin film 500 hardens due to deterioration. Therefore, it is necessary to study a structure that does not directly apply stress to the substrate film.

[0082] Here, the cracks generated in the liquid crystal display device 1R in the comparison mode will be explained in more detail. Figure 4 This is an example of a photograph showing a crack that occurs when a comparative liquid crystal display device is exposed to repeated low and high temperature environments. Figure 5 Observed using a scanning electron microscope Figure 4 A photograph of the cross section along the X1-X2 line. Figure 4The solid arrow in the diagram indicates a broken source wiring 141, while the dashed arrow indicates the direction of observation under a scanning electron microscope. By exposing the comparative liquid crystal display device 1R to repeated low and high temperature environments, the very rigid inorganic film 150 is damaged due to cracks in the upper moisture-proof resin film 500, resulting in… Figure 4 and Figure 5 The crack shown is due to the deterioration of the upper moisture-proof resin film 500 due to high temperature. It is assumed that this is because the film was exposed to low temperature in a hardened state. When the moisture-proof resin film 500 cracks, the inorganic film 150 cracks due to the large stress applied to the base film. However, the high adhesion between the layers of the base film also contributes to the deeper propagation of the crack.

[0083] Therefore, in this embodiment, an anisotropic conductive film 400 covers the end 161 of the organic protective film 160 between the display area 10A and the source driver 300, and a moisture-proof resin film 500 is superimposed on the anisotropic conductive film 400 between the display area 10A and the source driver 300. Since the adhesion between the anisotropic conductive film 400 and the organic protective film 160 and / or the adhesion between the anisotropic conductive film 400 and the moisture-proof resin film 500 is lower than that between the organic protective film 160 and the moisture-proof resin film 500, inter-film peeling easily occurs between the end 161 of the organic protective film 160 and the moisture-proof resin film 500 when the anisotropic conductive film 400 is positioned between them. As a result, the propagation of cracks 500X in the moisture-proof resin film 500 to wiring (e.g., source wiring 141) disposed on the side of the insulating substrate 110 that is closer to the organic protective film 160 and the organic protective film 160 can be suppressed, and the breakage of source wiring 141 can be suppressed in the environment of repeated high and low temperature.

[0084] Thus, the following method is also called avoidance countermeasure 1: a method to suppress the occurrence of source wiring 141 breakage by covering the end 161 of the organic protective film 160 with an anisotropic conductive film 400 between the display area 10A and the source driver 300, and by overlapping a moisture-proof resin film 500 on the anisotropic conductive film 400 between the display area 10A and the source driver 300. Hereinafter, this embodiment will be described in detail.

[0085] like Figure 1 As shown, the TFT substrate 100 includes, in the display area 10A: a plurality of gate lines 142 extending parallel to each other on the insulating substrate 110 along the horizontal direction of the screen; and a plurality of source lines 141 extending parallel to each other in a direction (vertical direction of the screen) intersecting with each gate line 142 through an insulating film. The plurality of gate lines 142 and the plurality of source lines 141 are formed in a grid pattern to divide each pixel.

[0086] A TFT 143 serving as a switching element is disposed at the intersection of each source line 141 and each gate line 142. The TFT substrate 100 has a pixel electrode 144, which is disposed in each region surrounded by two adjacent source lines 141 and two adjacent gate lines 142, and is electrically connected to the corresponding source line 141 via the semiconductor layer of the TFT 143.

[0087] The CF substrate 200 includes an insulating substrate 210, a common electrode, a CF layer, and a black matrix layer. The CF layer of the CF substrate 200 is composed of a red filter, a green filter, and a blue filter. In each pixel, three image elements with red filters, green filters, and blue filters are arranged in a stripe pattern. By controlling the amount of light transmitted through the red, green, and blue filters, they are mixed to obtain the desired color in each pixel.

[0088] The black matrix layer of the CF substrate 200 is a light-shielding component arranged in a grid pattern, dividing the various color filters disposed on the filter layer. In this embodiment, a common electrode is disposed on the CF substrate 200, but the common electrode may also be disposed on the TFT substrate 100. When the common electrode is disposed on the TFT substrate 100, the common electrode is disposed on the viewing surface side or the back side of the pixel electrode 144 through an insulating film.

[0089] The aforementioned liquid crystal layer contains liquid crystal material. Applying a voltage to the liquid crystal layer causes a change in the orientation state of the liquid crystal molecules within the liquid crystal material, thereby controlling the amount of light transmitted. The dielectric anisotropy (Δε) of the liquid crystal molecules, defined by the following formula (L), can have positive or negative values. Liquid crystal molecules with positive dielectric anisotropy are also called positive liquid crystals, and liquid crystal molecules with negative dielectric anisotropy are also called negative liquid crystals. Furthermore, the direction of the long axis of the liquid crystal molecules is called the direction of the slow axis. In addition, the liquid crystal molecules are uniformly oriented in the state without applied voltage (no-voltage state), and the direction of the long axis of the liquid crystal molecules in the no-voltage state is also called the initial orientation direction of the liquid crystal molecules.

[0090] Δε = (dielectric constant along the long axis of the liquid crystal molecule) - (dielectric constant along the short axis of the liquid crystal molecule) (L)

[0091] Alignment films are disposed between the TFT substrate 100 and the liquid crystal layer and between the CF substrate 200 and the liquid crystal layer, respectively. The alignment films have the function of controlling the orientation of liquid crystal molecules contained in the liquid crystal layer.

[0092] The liquid crystal display device 1 of this embodiment includes: a source driver 300 electrically connected to a source wiring 141 in the bezel region 10B of the TFT substrate 100, particularly in the protruding region 10B1; a gate driver 350 electrically connected to a gate wiring 142; and a controller. The gate driver 350 sequentially supplies scan signals to the gate wiring 142 according to the control of the controller. When the TFT 143 is in a voltage-applied state by the scan signal, the source driver 300 provides a data signal to the source wiring 141 based on the control of the controller.

[0093] The pixel electrodes 144 are each set to a potential corresponding to the data signal supplied via the corresponding TFT 143, and an electric field is generated between the pixel electrodes 144 and the common electrode to control the orientation of liquid crystal molecules in the liquid crystal layer. Furthermore, in the liquid crystal display device 1, in each pixel, the orientation state of the liquid crystal molecules is changed according to the magnitude of the voltage applied to the liquid crystal layer, thereby adjusting the light transmittance in the liquid crystal layer to display an image.

[0094] Insulating substrates 110 and 210 are colorless and transparent substrates with insulating properties. Examples of insulating substrates 110 and 210 include glass substrates and plastic substrates. Materials for glass substrates include float glass and soda-lime glass. Materials for plastic substrates include polyethylene terephthalate, polybutylene terephthalate, polyethersulfone, polycarbonate, and alicyclic polyolefins. In this embodiment, a glass substrate is used as insulating substrate 110.

[0095] The base coating 120 is a colorless and transparent film disposed on the observation surface side of the insulating substrate 110. The gate insulating film 130 is a colorless and transparent film disposed on the observation surface side of the base coating 120. Inorganic insulating films can be used, for example, as the base coating 120 and the gate insulating film 130. For example, a silicon nitride (SiN)-containing insulating film can be used as the inorganic insulating film. x Insulating films made of inorganic materials such as silicon dioxide (SiO2) and silicon oxynitride (SiNO), and their laminated films.

[0096] Gate wiring 142 is disposed on insulating substrate 110, and more specifically, on viewing surface side of base coating film 120, extending horizontally from display area 10A to outer border region 10B of display area 10A, particularly to protruding region 10B1. Gate wiring 142 is radially disposed from the surface 370 of gate driver 350 disposed along display area 10A opposite to display area 10A toward display area 10A.

[0097] Source wiring 141 is disposed on insulating substrate 110, and more specifically, on the viewing surface side of gate insulating film 130, extending vertically from display area 10A to outer bezel area 10B of display area 10A, especially to protruding area 10B1. Source wiring 141 is radially disposed from the surface 320 of source driver 300 disposed along display area 10A opposite to display area 10A toward display area 10A.

[0098] The materials of the gate wiring 142 and the source wiring 141 are not particularly limited, but are preferably metals, and are preferably metal wirings. The gate wiring 142 and the source wiring 141 can be a single layer formed of the same material, or multiple layers can be stacked, with adjacent layers in the multilayer being formed of different materials. For example, wirings containing titanium (Ti), wirings containing copper (Cu), and wirings stacked from these materials can be used as the gate wiring 142 and the source wiring 141.

[0099] The gate wiring 142 and the source wiring 141 can be formed by depositing metals such as copper, titanium, aluminum, molybdenum, tungsten or their alloys in single or multiple layers using sputtering or other methods, and then patterning them using photolithography or other methods.

[0100] The inorganic membrane 150 is a colorless and transparent membrane, disposed between the source wiring 141 and the organic protective membrane 160, extending to the outer region 160A of the end 161 of the organic protective membrane 160. In this manner, since the inorganic membrane 150 is disposed below the end 161 of the organic protective membrane 160, the structure and physical properties around the end 161 of the organic protective membrane 160 change, and stress is more easily concentrated.

[0101] However, in this embodiment, an anisotropic conductive film 400 and a moisture-proof resin film 500 are provided. The anisotropic conductive film 400 overlaps with the source driver 300 and covers the end 161 of the organic protective film 160 between the display area 10A and the source driver 300. The moisture-proof resin film 500 covers the anisotropic conductive film 400 between the display area 10A and the source driver 300 and covers the end 161 of the organic protective film 160. This can suppress the propagation of cracks 500X in the moisture-proof resin film 500 to the layer on the insulating substrate 110 side compared to the organic protective film 160. Therefore, even when there is an inorganic film 150 provided between the source wiring 141 and the organic protective film 160 and extending to the outer region 160A of the end 161 of the organic protective film 160, the breakage of the source wiring 1 can be effectively suppressed in the environment of repeated high and low temperatures.

[0102] The inorganic film 150 extends from the display area 10A to the outer region 160A of the end 161 of the organic protective film 160, and is typically formed on the entire surface of the insulating substrate 110, except for the contact holes used to ensure electrical connection.

[0103] As an inorganic film 150, for example, silicon nitride (SiN) can be used. x Insulating films made of inorganic materials such as silicon oxide (SiO2) and silicon oxynitride (SiNO), and their laminated films (e.g., laminated films containing silicon oxide and silicon nitride).

[0104] The organic protective film 160 is a colorless and transparent film disposed on the inorganic film 150, which has the function of planarizing the surface of the TFT substrate 100. The organic protective film 160 overlaps with the source wiring 141 and is disposed from the display area 10A to the area between the display area 10A and the source driver 300. The end 161 of the organic protective film 160 is disposed opposite to the surface 320 of the source driver 300 relative to the display area 10A. The organic protective film 160 is generally formed on the entire surface of the display area 10A and the periphery of the display area 10A, except for the contact holes used to ensure electrical connection.

[0105] The organic protective film 160 is preferably an acrylic resin film (a film that mainly contains acrylic acid as a resin component).

[0106] The anisotropic conductive film 400 functions to electrically and mechanically connect the source driver 300 to the TFT substrate 100. The anisotropic conductive film 400 electrically connects the source driver 300 and mechanically connects it to the source wiring 141. The anisotropic conductive film 400 is a film that maintains insulation in the in-plane direction and may be conductive in the thickness direction. It is provided on each source driver 300, and each source wiring 141 is connected to a corresponding bump on the source driver 300.

[0107] An anisotropic conductive film 400 is superimposed on the source driver 300, and an organic protective film 160 is covered at the end 161 between the display area 10A and the source driver 300. By employing this method, inter-film peeling is easily achieved between the organic protective film 160 and the moisture-proof resin film 500. As a result, the propagation of cracks 500X in the moisture-proof resin film 500 to wiring (e.g., source wiring 141) disposed closer to the insulating substrate 110 than the organic protective film 160 and the organic protective film 160 can be suppressed, and breakage of the source wiring 141 can be suppressed under repeated high and low temperature environments.

[0108] An anisotropic conductive film 400 extends from the source driver 300 toward the display area 10A, covering the end 161 of the organic protective film 160. In this embodiment, since the anisotropic conductive film 400 used to mount the source driver 300 on the TFT substrate 100 extends toward the display area 10A and covers the end 161 of the organic protective film 160, it is not necessary to add other layers to cover the end 161, thus making it easier to suppress the occurrence of line breaks.

[0109] The direction from the source driver 300 toward the display area 10A (parallel to the vertical direction of the screen) is defined as direction 10Y, and the direction orthogonal to direction 10Y (parallel to the horizontal direction of the screen) is defined as direction 10X. Direction 10Y is considered the front. When defined in this way, the anisotropic conductive film 400 is preferably configured to cover the end 161 of the organic protective film 160 present in the obliquely front region 10D. The obliquely front region 10D is a place where thermal stress is concentrated, therefore, in particular, by covering the end 161 of the organic protective film 160 present in this region with the anisotropic conductive film 400, the occurrence of line breakage can be effectively suppressed.

[0110] In this embodiment, the width of the anisotropic conductive film 400 is increased due to its ease of modification. However, if design allows, the same effect as in this embodiment can be achieved by extending the organic protective film 160 to the vicinity of the source driver 300, bringing the end 161 of the organic protective film 160 close to the source driver 300, and covering the end 161 with the coverage area of ​​the anisotropic conductive film 400 generated when the source driver 300 is mounted on the insulating substrate 110. Furthermore, the anisotropic conductive film 400 covering the end 161 of the organic protective film 160 and the anisotropic conductive film 400 overlapping the source driver 300 can also be formed independently.

[0111] The anisotropic conductive film 400 is preferably an epoxy resin film (a film mainly containing epoxy compounds as resin components), and the epoxy resin film contains conductive particles.

[0112] The moisture-proof resin film 500 has the function of inhibiting moisture intrusion. In the bezel area 10B, the organic protective film 160, the anisotropic conductive film 400, and the source driver 300 are covered by the moisture-proof resin film 500 from the viewing surface side, thus inhibiting moisture intrusion into the liquid crystal display device 1. In this embodiment, the entire top surface 310 of the source driver 300 is covered by the moisture-proof resin film 500.

[0113] A moisture-proof resin film 500 overlaps with an anisotropic conductive film 400 between the display area 10A and the source driver 300, and covers the end 161 of the organic protective film 160. That is, the anisotropic conductive film 400 and the moisture-proof resin film 500 are sequentially disposed on the end 161 of the organic protective film 160 from the back side to the viewing side. By employing this method, inter-film peeling is easily achieved between the end 161 of the organic protective film 160 and the moisture-proof resin film 500. As a result, the propagation of cracks 500X in the moisture-proof resin film 500 to wiring (e.g., source wiring 141) disposed closer to the insulating substrate 110 than the organic protective film 160 and the organic protective film 160 can be suppressed, further suppressing the breakage of the source wiring 141 under repeated high and low temperature environments.

[0114] As the moisture-proof resin film 500, for example, a styrene copolymer-based resin film (a film mainly containing styrene copolymer as a resin component), an epoxy resin film (a film mainly containing epoxy compound as a resin component), or a polyurethane acrylate-based resin film (a film mainly containing polyurethane acrylate as a resin component) can be used. As the aforementioned styrene copolymer resin film, for example, a styrene-butadiene-based resin film (a film mainly containing styrene-butadiene as a resin component) can be used, and the moisture-proof resin film 500 is preferably a styrene-butadiene-based resin film. As the moisture-proof resin film 500, for example, TUFFY (trade name) manufactured by Hitachi Chemical Co., Ltd. can be used.

[0115] When the moisture-proof resin film 500 is a styrene-butadiene resin film, for example, its initial Young's modulus at -40°C (just after film formation) is 100 MPa or more and 120 MPa or less; its Young's modulus after maintaining at 100°C for 500 hours is 50 MPa or more and 60 MPa or less; and its Young's modulus after maintaining at 100°C for 1000 hours is 2000 MPa or more and 3000 MPa or less. Furthermore, the initial Young's modulus of the moisture-proof resin film 500 at 20°C is 10 MPa or more and 20 MPa or less; its Young's modulus after maintaining at 100°C for 500 hours is 10 MPa or more and 20 MPa or less; and its Young's modulus after maintaining at 100°C for 1000 hours is 2000 MPa or more and 3000 MPa or less. Furthermore, the initial Young's modulus of the moisture-proof resin film 500 at 80°C is 1 MPa or more and 10 MPa or less, the Young's modulus after being held at 100°C for 500 hours is 1 MPa or more and 10 MPa or less, and the Young's modulus after being held at 100°C for 1000 hours is 1500 MPa or more and 2500 MPa or less.

[0116] The moisture-proof resin film 500 has the following coefficients of linear expansion in the initial stage (just after film formation): for example, at -40°C, it has a coefficient of linear expansion of 150 ppm / °C or higher and 200 ppm / °C or lower; at 20°C, it has a coefficient of linear expansion of 200 ppm / °C or higher and 300 ppm / °C or lower; and at 80°C, it has a coefficient of linear expansion of 8500 ppm / °C or higher and 9500 ppm / °C or lower.

[0117] When the organic protective film 160 is an acrylic resin film and the moisture-proof resin film 500 is a styrene-butadiene resin film, the adhesion between the organic protective film 160 and the moisture-proof resin film 500 is high, and cracks 500X in the moisture-proof resin film 500 are more likely to propagate into the substrate layer containing the organic protective film 160. Here, the adhesion between the epoxy resin film and the acrylic resin film and / or the adhesion between the epoxy resin film and the styrene-butadiene resin film is lower than that between the acrylic resin film and the styrene-butadiene resin film. In this embodiment, by setting the anisotropic conductive film 400 as an epoxy resin film, the propagation of cracks 500X in the moisture-proof resin film 500 into the substrate layer can be effectively suppressed, and the breakage of the source wiring 141 under repeated high and low temperature environments can be effectively suppressed.

[0118] (Modification 1 of Implementation Method 1)

[0119] Figure 6A This is a top view schematic diagram of a liquid crystal display device according to a variation of Embodiment 1. Figure 6B This is a top view schematic diagram illustrating the configuration of the moisture-proof resin film and the source driver in the liquid crystal display device of Modification 1 of Embodiment 1. Figure 6C This is a cross-sectional schematic diagram of a liquid crystal display device according to a variation of Embodiment 1. Figure 6C yes Figure 6A A cross-sectional view along line B1-B2. In the above embodiment, the entire top surface 310 of the source driver 300 is covered by a moisture-proof resin film 500, but the moisture-proof resin film 500 provided in the liquid crystal display device 1 of this modified example is shown in Figure 1. As shown, at least a portion of the top surface 310 of the source driver 300 is not covered. More specifically, as Figure 6B As shown, the top surface 310 of the source driver 300 has a portion 311 that is not covered by the moisture-proof resin film 500.

[0120] In a liquid crystal display device, the moisture-proof resin film oxidizes, deteriorates, and hardens due to the heat generated by the source driver, resulting in cracks. However, as in this modified example, the moisture-proof resin film 500 does not cover at least a portion of the top surface 310 of the source driver 300, thereby suppressing the transfer of heat from the source driver 300 to the moisture-proof resin film 500 (for example, the temperature rise of the moisture-proof resin film 500 can be suppressed to about 5 degrees Celsius), and suppressing the formation of cracks 500X in the moisture-proof resin film 500. As a result, it is possible to further suppress the breakage of the source wiring 141 under repeated high and low temperature conditions. From the same point of view, it is preferable that the moisture-proof resin film 500 does not cover the entire top surface 310 of the source driver 300. Here, the top surface 310 of the source driver 300 is the surface of the source driver 300 opposite to the insulating substrate 110.

[0121] Therefore, the method of suppressing the occurrence of source wiring 141 disconnection by not covering at least a portion of the top surface 310 of the source driver 300 with the moisture-proof resin film 500 is referred to as avoidance countermeasure 2.

[0122] The moisture-proof resin film 500 not covering at least a portion of the top surface 310 of the source driver 300 means that the moisture-proof resin film 500 does not cover more than 60% of the total area of ​​the top surface 310 of the source driver 300. That is, it means that the area 311 not covered by the moisture-proof resin film 500 relative to the total area of ​​the top surface 310 of the source driver 300 is more than 60%. Preferably, the moisture-proof resin film 500 does not cover more than 60% and less than 100% of the entire area of ​​the top surface 310 of the source driver 300, and more preferably does not cover 100%.

[0123] The portion 311 not covered by the moisture-proof resin film 500 is preferably the central portion of the top surface 310 of the source driver 300 in the direction 10X, and is a region that accounts for more than 60% of the total area of ​​the top surface 310 of the source driver 300. By adopting this method, the breakage of the source wiring 141 can be more effectively suppressed.

[0124] As shown in the figure As shown, the liquid crystal display device 1 of this modified example also includes a heat sink 600 attached to the top surface 310 of the source driver 300, covering a portion 311 not covered by the moisture-proof resin film 500. By employing this method, heat generated from the source driver 300 can be dissipated through the heat sink 600 (for example, the temperature rise of the moisture-proof resin film 500 can be suppressed to approximately 5 degrees Celsius), further suppressing the formation of cracks 500X in the moisture-proof resin film 500. As a result, the occurrence of source wiring breakage 141 can be further suppressed under conditions of repeated high and low temperatures.

[0125] When a heat sink 600 is provided to improve heat dissipation efficiency, it is preferable that the source driver 300 is in direct contact with the heat sink 600 to achieve stable heat dissipation. It is speculated that when the portion of the source driver 300 in direct contact with the heat sink 600 includes the central portion of the top surface 310 of the source driver 300 and is more than 60% of the total area of ​​the top surface 310 of the source driver 300, performance similar to that when the entire top surface 310 of the source driver 300 is in direct contact with the heat sink 600 can be obtained (for example, the effect of suppressing the temperature rise of the moisture-proof resin film 500 to about 5 degrees Celsius).

[0126] Heat sink 600 is a heat dissipation component, a heat-conducting sheet made of an insulating resin material with high thermal conductivity. For example, a laminated heat sink of graphite and resin, referred to as a graphite sheet, can be used as heat sink 600. The thermal conductivity of heat sink 600 is, for example, 600 W / m·K or higher and 2000 W / m·K or lower.

[0127] One end 610 of the heat sink 600 contacts the top surface 310 of the source driver 300, and the other end 620 of the heat sink 600 contacts the metal base 700 housing the liquid crystal display device 1. The source driver 300 is thermally and mechanically connected to the metal base 700 via the heat sink 600. The heat generated by the source driver 300 is conducted to the metal base 700 through the heat sink 600 for heat dissipation.

[0128] (Modification 2 of Implementation Method 1)

[0129] Figure 7 This is a top view of the bezel area of ​​a liquid crystal display device according to a variation of Embodiment 1, Example 2. Figure 8 This is an enlarged top view of the bezel area of ​​the liquid crystal display device in Modification 2 of Embodiment 1. Figure 8 yes Figure 7 An enlarged view of the area enclosed by the dashed line. In the above embodiment, the source wiring 141 is arranged radially from the source driver 300 to the display area 10A, but in the liquid crystal display device 1 of this modified example, as... Figure 7 and Figure 8 As shown, when the direction 10Y (parallel to the vertical direction of the screen) from the source driver 300 toward the display area 10A is taken as the front, the multiple source wirings 141 include source wirings 141 (detour source wirings 1410), which bypass the oblique front region 10D located in the oblique front of the source driver 300 and overlapping with the end 161 of the organic protective film 160, and extend from the source driver 300 toward the display area 10A.

[0130] The oblique front region 10D is a location where the moisture-proof resin film 500 hardens due to heat and experiences thermal stress concentration at low temperatures. However, by bypassing this oblique front region 10D and providing the source wiring 141 (detour source wiring 1410), the breakage of the source wiring 141 under repeated high and low temperature conditions can be further suppressed. Therefore, it is preferable that the source wiring 141 is arranged with locally increased spacing in the oblique front region 10D in a manner that avoids the oblique front region 10D.

[0131] Thus, the method of suppressing the occurrence of source cable 141 disconnection by including multiple source cables 141 that bypass the oblique front area 10D and extend from the source driver 300 to the display area 10A (detour source cable 1410) will be referred to as avoidance countermeasure 3.

[0132] It can be seen that the moisture-proof resin film hardens at 500°C, and the magnitude of the thermal stress generated when it becomes low temperature is as follows: Figure 7 and Figure 8 As shown, it depends on the location. Figure 8 In the diagram, the area enclosed by the dashed line represents the stress concentration zone, and the area indicated by the single-dotted line represents the boundary that could become the initiation point of a crack. The obliquely forward region 10D enclosed by the solid-lined quadrilateral is the area where the formation of the source wiring 141 should be avoided, and the arrow of the single-dotted line indicates the circuitous path of the source wiring 141.

[0133] Locations where thermal stress is concentrated, such as Figure 7 and Figure 8 As shown, the source wiring 141 is not directed from the source driver 300 directly toward the display area 10A, but rather toward a slightly forward-sloping area 10D. Therefore, in this embodiment, the source wiring 141 is formed in a way that avoids this forward-sloping area 10D, thereby avoiding wire breakage caused by cracks due to thermal stress concentration.

[0134] Based on the criteria for crack formation on the moisture-proof resin film 500, the location where the cracks occur is defined as follows.

[0135] (1) Included in the area where the moisture-proof resin film 500 is provided.

[0136] (2) The hardened moisture-proof resin film 500 at low temperatures has areas of concentrated thermal stress.

[0137] (3) The boundary between the organic protective film 160 and the inorganic film 150 on the TFT substrate

[0138] If the source wiring 141 is formed in the region that satisfies the above (1) to (3), it will be directly affected by the cracks in the upper moisture-proof resin film 500, resulting in wire breakage. Therefore, by setting the wiring in a location that avoids meeting the requirements of the above (1) to (3), countermeasures can be taken to prevent reliability failures from becoming the cause of display defects. By setting the location that meets the requirements of the above (1) to (3) as the oblique front region (10D), the generation of cracks can be effectively suppressed.

[0139] Figure 9 This is a map showing the locations of line breaks during a durability thermal cycling test conducted on a comparative liquid crystal display device. It is a top-view schematic diagram overlaying the results of three liquid crystal display devices onto a single liquid crystal display device. In the comparative liquid crystal display device 1R, as... Figure 9 As shown, a printed wiring board (PWB) 900 is connected to the border area 10B via a flexible printed circuit board (FPC) 800.

[0140] Regarding the locations where line breaks occur during durability thermal cycling tests of liquid crystal display devices using a comparison method, if multiple (specifically three) position mappings are generated, then as follows: Figure 9 As shown, compared to the source driver 300 where the temperature rises, the region 10D in front of the source wiring 141 is concentrated from here.

[0141] Cracks 500X are generated in the moisture-proof resin film 500 due to deterioration, which exerts significant stress on the base film, resulting in wire breakage. If only the areas that promote the hardening of the moisture-proof resin film 500 are considered, then the area near the source driver 300 is where resin deterioration and hardening progress rapidly, similar to the area of ​​temperature rise. However, the damaged area of ​​the base wiring (source wiring 141 in this modified example) occurs at a location slightly further away than the aforementioned area. This is due to the effects of the durability thermal cycling test; the deterioration of the moisture-proof resin film 500 is accelerated at high temperatures, and the cracks themselves are caused by shrinkage at low temperatures. When stress simulations are performed at low temperatures incorporating the properties of each constituent material, the location of stress concentration coincides with the location of wire breakage.

[0142] Therefore, when the source wiring 141 takes this specific narrow area, that is, the direction from the source driver 300 toward the display area 10A as the front, the multiple source wirings 141 can avoid the effects of cracks caused by the hardening and deterioration of the moisture-proof resin film 500 by avoiding the oblique front area 10D located in the oblique front of the source driver 300 and overlapping with the end 161 of the organic protective film 160.

[0143] like Figure 8As shown, the oblique front region 10D is the region in direction 10X from a position 1.5mm away from the source driver 300 to a position 2.5mm away from the source driver. That is, in direction 10X, the end 300X on the oblique front region 10D side of the source driver 300 and the end 10DX1 on the source driver 300 side of the oblique front region 10D are 1.5mm apart, and the end 300X on the oblique front region 10D side of the source driver 300 and the end 10DX2 on the opposite side of the source driver 300 on the oblique front region 10D are 2.5mm apart. By adopting this method, the source wiring 141 can be arranged to avoid stress concentration areas, thus further suppressing the breakage of the source wiring 141 in environments with repeated high and low temperatures. Here, direction 10Y is the direction of the source driver 300 from the surface 320 opposite to the display area 10A toward the display area 10A.

[0144] like Figure 8 As shown, the oblique front region 10D is the region in direction 10Y that extends from a position 0.5 mm away from the source driver 300 to a position 1.0 mm away from the source driver. Specifically, in direction 10Y, the end 300Y on the oblique front region 10D side of the source driver 300 and the end 10DY1 on the source driver 300 side of the oblique front region 10D are 0.5 mm apart, and the end 300Y on the oblique front region 10D side of the source driver 300 and the end 10DY2 on the opposite side of the source driver 300 on the oblique front region 10D are 1.0 mm apart. By adopting this method, the source wiring 141 can be positioned to avoid stress concentration areas, thus further suppressing the breakage of the source wiring 141 under repeated high and low temperature environments.

[0145] (Modification 3 of Implementation Method 1)

[0146] As described in the above embodiments, by having an organic protective film 160, an anisotropic conductive film 400 covering the ends 161 of the organic protective film 160, and a moisture-proof resin film 500 overlapping with the anisotropic conductive film 400 and covering the ends 161 of the organic protective film 160, the propagation of cracks 500X in the moisture-proof resin film 500 to the substrate layer can be suppressed, and the breakage of the source wiring 141 can be suppressed. In particular, it is preferable to use an acrylic resin film as the organic protective film 160, an epoxy resin film as the anisotropic conductive film 400, and a styrene-butadiene resin film as the moisture-proof resin film 500.

[0147] As described above, when the portion where the organic protective film 160 is disposed is disposed of with a film similar to the acrylic resin film, the portion where the anisotropic conductive film 400 is disposed of with a film similar to the epoxy resin film, and the portion where the moisture-proof resin film 500 is disposed of with a film similar to the styrene-butadiene resin film, the same effect as in Embodiment 1 can be obtained. That is, by providing an acrylic resin film (which overlaps with the source wiring 141 and is disposed in the region 10C from the display region 10A to the region between the display region 10A and the source driver 300)... Figure 1 (corresponding to the organic protective film 160, etc.), the end of the acrylic resin film covering between the display area 10A and the source driver 300 (and) Figure 1 The epoxy resin film (corresponding to end 161) is a type of epoxy resin film. Figure 1 (corresponding to an anisotropic conductive film 400, etc.), a styrene-butadiene resin film overlapping with and covering the ends of the acrylic resin film between the display area 10A and the source driver 300. Figure 1 (e.g., moisture-proof resin film 500), which can suppress the occurrence of source wiring 141 breakage.

[0148] Therefore, the method of suppressing the breakage of the source wiring 141 by covering the end of the acrylic resin film with an epoxy resin film between the display area 10A and the source driver 300, and overlapping a styrene-butadiene resin film on the epoxy resin film between the display area 10A and the source driver 300, is referred to as avoidance countermeasure 4.

[0149] The avoidance strategies described above When used individually, these measures can suppress the occurrence of breakage in the source wiring 141. Alternatively, combining two or more avoidance measures can more effectively suppress breakage in the source wiring 141.

[0150] (Implementation Method 2)

[0151] In the above embodiments, the case where the display device is a liquid crystal display device was described, but in this embodiment, the case where the display device is an organic electroluminescent (EL) display device is described.

[0152] Figure 10 This is a top view schematic diagram showing the organic EL display device of Embodiment 2. Figure 11 as well as Figure 12 This is a cross-sectional schematic diagram of the protruding area of ​​the organic EL display device according to Embodiment 2. Figure 11 yes Figure 10 A schematic diagram of the cross-section of line C1-C2. Figure 12 yes Figure 10 A cross-sectional schematic diagram of the D1-D2 line shows the range of 1.5mm to 2.5mm away from the source driver 300 in the direction 10X. Figure 12 This is a cross-sectional view of the obliquely front region 10D. In organic EL display devices, there is a possibility that current supply lines or the like could become heat sources, but this is omitted in the description of this embodiment. Furthermore, similar to Embodiment 1, an inorganic film exists between the organic protective film 160 and the source wiring 141, but this is omitted in the description of this embodiment.

[0153] like Figures 10-12 The organic EL display device 2 of this embodiment shown includes: a TFT substrate 100 on which a TFT is disposed; an organic EL element disposed on the TFT substrate 100 and connected to the TFT; an adhesive layer disposed in a frame shape surrounding the organic EL element; and a sealing substrate 200E disposed to cover the organic EL element. The adhesive layer adheres the peripheral portions of the TFT substrate 100 and the peripheral portions of the sealing substrate 200E to each other. As the sealing substrate 200E, an insulating substrate such as a glass substrate or a plastic substrate with a thickness of 0.4 to 1.1 mm is used, for example.

[0154] An adhesive layer is used to bond the sealing substrate 200E and the TFT substrate 100 on which the organic EL element is stacked, thereby sealing the organic EL element between the pair of substrates 100 and 200E. This prevents oxygen and moisture from entering the organic EL element from the outside.

[0155] As a component of an organic EL element, the following can be used, for example. The layer structure shown.

[0156] (1) First electrode, light-emitting layer, second electrode

[0157] (2) First electrode, hole transport layer, light-emitting layer, electron transport layer, second electrode

[0158] (3) First electrode, hole transport layer, light-emitting layer, hole blocking layer, electron transport layer, second electrode

[0159] (4) First electrode, hole transport layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, second electrode

[0160] (5) First electrode, hole injection layer, hole transport layer, light-emitting layer, electron transport layer, electron injection layer, second electrode

[0161] (6) First electrode, hole injection layer, hole transport layer, light-emitting layer, hole blocking layer, electron transport layer, second electrode

[0162] (7) First electrode, hole injection layer, hole transport layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, second electrode

[0163] (8) First electrode, hole injection layer, hole transport layer, electron blocking layer (carrier blocking layer), light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, second electrode. Additionally, the hole injection layer and hole transport layer can be integrated. Furthermore, the electron transport layer and electron injection layer can also be integrated.

[0164] Furthermore, the structure of organic EL elements is not affected by the above. The layer structure is limited, and the desired layer configuration can be adopted according to the required characteristics of the organic EL element.

[0165] The organic EL display device 2 is an active matrix display device with RGB full-color display. Red (R), green (G), or blue (B) sub-pixels (dots) are arranged in regions divided by source and gate wiring. The sub-pixels are arranged in a matrix. Within each color sub-pixel, a corresponding organic EL element and a light-emitting area are formed.

[0166] The organic EL display device 2 includes a display area 10A for displaying images and a bezel area 10B disposed around the display area 10A. The bezel area 10B includes a protruding area 10B1 exposed without overlapping with the sealing substrate 200E in the TFT substrate 100, where various drivers are mounted. A printed wiring board 900 is connected to the protruding area 10B1 via a flexible printed circuit board (FPC) 800.

[0167] TFT substrate 100 includes: an insulating substrate 110; a base coating film disposed on the insulating substrate 110; multiple gate wirings disposed on the base coating film; a gate insulating film disposed on the multiple gate wirings; multiple source wirings 141 serving as the multiple wirings disposed on the gate insulating film; an inorganic film disposed on the multiple source wirings 141; a source driver 300 serving as the driver, disposed on a protruding region 10B1 in the frame region 10B and connected to the multiple source wirings 141; and a gate driver disposed on the protruding region 10B1 in the frame region 10B and connected to the multiple gate wirings 141. The device includes: an organic protective film 160 disposed on an inorganic film and overlapping multiple source wires 141, extending from the display area 10A to the region 10C between the display area 10A and the source driver 300C; an anisotropic conductive film 400 superimposed on the source driver 300, covering the end 161 of the organic protective film 160 between the display area 10A and the source driver 300; and a moisture-proof resin film 500 superimposed on the anisotropic conductive film 400 between the display area 10A and the source driver 300, covering the end 161 of the organic protective film 160.

[0168] In this embodiment, such as Figures 10-12 As shown, an anisotropic conductive film 400 covers the end 161 of the organic protective film 160 between the display area 10A and the source driver 300. A moisture-proof resin film 500 is superimposed on the anisotropic conductive film 400 between the display area 10A and the source driver 300. Because the adhesion between the anisotropic conductive film 400 and the organic protective film 160 and / or the adhesion between the anisotropic conductive film 400 and the moisture-proof resin film 500 is lower than that between the organic protective film 160 and the moisture-proof resin film 500, inter-film peeling easily occurs between the end 161 of the organic protective film 160 and the moisture-proof resin film 500 by placing the anisotropic conductive film 400 between them. As a result, the propagation of cracks 500X in the moisture-proof resin film 500 to wiring (e.g., source wiring 141) disposed on the side of the insulating substrate 110 that is closer to the organic protective film 160 and the organic protective film 160 can be suppressed, and the breakage of source wiring 141 can be suppressed in the environment of repeated high and low temperature.

[0169] Regarding organic EL display devices, each of the above avoidance measures 1 should be used individually. 4. This can suppress the occurrence of source wiring 141 disconnection. In addition, two or more avoidance measures can be used in combination, in which case the occurrence of source wiring 141 disconnection can be suppressed more effectively.

[0170] The present invention will be described in more detail below with reference to specific embodiments, but the present invention is not limited to these embodiments.

[0171] (Example 1)

[0172] Figure 13 This is a photograph showing the cracks in the liquid crystal display device of Example 1 that occurred during a durable thermal cycling test. The liquid crystal display device of Example 1 is the liquid crystal display device of Embodiment 1, which uses an acrylic resin film as an organic protective film 160, an epoxy resin film as an anisotropic conductive film 400, and a styrene-butadiene resin film as a moisture-proof resin film 500.

[0173] For the liquid crystal display device of Example 1, a durability thermal cycling test was conducted for 522 cycles (1849 hours) of operation at 85°C for 75 minutes followed by storage at -40°C for 75 minutes. A high-temperature durability thermal cycling test at 110°C was also performed to observe cracks in the liquid crystal display device of Example 1. The temperature varied at a rate of 4°C per minute.

[0174] Under these conditions, after approximately 350 hours, the moisture-proof resin film of the liquid crystal display device of Example 1 is cured, and the film is then cured by… Figure 13 The area surrounded by thick black lines shows the moisture-proof resin film peeling off and floating from the anisotropic conductive film, creating... Figure 13 The crack is indicated by the thick white dashed line. Furthermore, Figure 13 The dashed line within the area enclosed by the single-dotted line indicates the end of the organic protective film. The area enclosed by the single-dotted line is the step where the anisotropic conductive film crosses the substrate. Within the area enclosed by the single-dotted line, the anisotropic conductive film cannot completely cover the substrate; the portion of the anisotropic conductive film that floats up appears as a thin white line within the area enclosed by the single-dotted line.

[0175] In a liquid crystal display device without the anisotropic conductive film 400, several severe cracks leading to line breakage were observed. However, since the moisture-proof resin film in Example 1 is peeled off from the anisotropic conductive film, the cracks in the moisture-proof resin film do not affect the thin films and wiring (e.g., inorganic films, source wiring, etc.) on the TFT substrate located below the anisotropic conductive film. As can be seen from the above, enlarging the anisotropic conductive film and providing the anisotropic conductive film between the end of the organic protective film and the moisture-proof resin film is very effective.

[0176] (Example 2)

[0177] Figure 14This is a diagram showing the temperature distribution of the source driver in the liquid crystal display device of Example 2. The liquid crystal display device of Example 2 is a variation of Example 1 of Embodiment 1, using an acrylic resin film as the organic protective film 160, an epoxy resin film as the anisotropic conductive film 400, and a styrene-butadiene resin film as the moisture-proof resin film 500. Furthermore, the thickness of the liquid crystal panel portion of the liquid crystal display device of Example 2 is 0.2 mm.

[0178] The liquid crystal display device of Example 2 was driven with its source driver at an ambient temperature of 85°C for 1 hour. The backlight was then turned on, and the temperature distribution of the source driver was measured. Figure 14 The results are shown. Figure 14 As shown, the temperature rises significantly near the center of the source driver, and decreases towards the end. The top surface temperature of the source driver at the first point P1 near the center is 98.1°C, and the top surface temperature of the source driver at the second point P2 near the end is 92.7°C.

[0179] Because the temperature in the area near the center is high, with the highest temperature reaching -4 degrees Celsius, it is preferable not to cover this area with a moisture-proof resin film to improve heat dissipation. Figure 14 The results show that the region is the central part of the top surface 310 of the source driver 300 in the direction 10X, and is more than 60% of the total area of ​​the top surface 310 of the source driver 300.

[0180] Explanation of reference numerals in the attached figures

[0181] 1. 1R: Liquid Crystal Display Device

[0182] 2: Organic EL display device

[0183] 10A: Display area

[0184] 10B: Border Area

[0185] 10B1: Highlighting the Area

[0186] 10C: Middle area

[0187] 10D: Diagonally forward area

[0188] 10DX1, 10DX2, 10DY1, 10DY2, 300X, 300Y: End units

[0189] 10X: Orthogonal direction

[0190] 10Y: Direction towards the display area

[0191] 100:TFT substrate

[0192] 110, 210: Insulating substrate

[0193] 120: Primer film

[0194] 130: Gate insulating film

[0195] 141: Source wiring

[0196] 142: Gate wiring

[0197] 143:TFT

[0198] 144: Pixel Electrode

[0199] 150: Inorganic membrane

[0200] 161:End

[0201] 160: Organic protective film

[0202] 160A: Outer region

[0203] 200:CF substrate

[0204] 200E: Sealed substrate

[0205] 300: Source Driver

[0206] 310: Top surface

[0207] 311: Covered areas

[0208] 320, 370: Opposite surfaces

[0209] 350: Gate Driver

[0210] 400: Anisotropic conductive film

[0211] 500:Moisture-proof resin film

[0212] 500X: Crack

[0213] 600: Heatsink

[0214] 610: One end

[0215] 620: The other end

[0216] 700: Metal base plate

[0217] 800: Flexible Printed Substrate

[0218] 900: Printed Wiring Board

[0219] 1410: Detour source-pole wiring

[0220] P1: First point

[0221] P2: Second point

Claims

1. A display device which displays an image in a display region, characterized by comprising: Comprising: an insulating substrate; a plurality of wiring lines provided on the insulating substrate and extending from the display region to a frame region outside the display region; a driver provided in the frame region and connected to the plurality of wiring lines; an organic protective film overlapping the plurality of wiring lines and provided from the display region to a region between the display region and the driver; an anisotropic conductive film overlapping the driver and covering an end portion of the organic protective film between the display region and the driver; a moisture-proof resin film overlapping the anisotropic conductive film between the display region and the driver and covering the end portion of the organic protective film, the organic protective film is an acrylic resin film, the anisotropic conductive film is an epoxy resin film, the moisture-proof resin film is a styrene-butadiene resin film.

2. The display device according to claim 1, wherein the moisture-proof resin film does not cover at least a portion of a top surface of the driver.

3. The display device according to claim 2, wherein the moisture-proof resin film does not cover more than 60% and less than 100% of the entire area of the top surface of the driver.

4. The display device according to claim 2 or 3, further comprising a heat sink attached to a portion of the top surface of the driver not covered by the moisture-proof resin film.

5. The display device according to any one of claims 1 to 3, wherein when a direction from the driver toward the display region is set as a front direction, the plurality of wiring lines include wiring lines extending from the driver to the display region via a diagonally front region of the driver overlapping the end portion of the organic protective film, the driver is disposed along the display region, and the diagonally front region is a region from a position 1.5 mm apart from the driver to a position 2.5 mm apart from the driver in a direction orthogonal to the direction from the driver toward the display region.

6. The display device according to any one of claims 1 to 3, wherein when a direction from the driver toward the display region is set as a front direction, the plurality of wiring lines include wiring lines extending from the driver to the display region via a diagonally front region of the driver overlapping the end portion of the organic protective film, the driver is disposed along the display region, and the diagonally front region is a region from a position 0.5 mm apart from the driver to a position 1.0 mm apart from the driver in the direction from the driver toward the display region.

7. The display device according to any one of claims 1 to 3, further comprising an inorganic film provided between the plurality of wiring lines and the organic protective film, and the inorganic film extends to an outside region of the end portion of the organic protective film.

8. The display device according to any one of claims 1 to 3, wherein the display device is a liquid crystal display device.

9. The display device according to any one of claims 1 to 3, wherein the display device is an organic electroluminescence display device.

10. A display device which displays an image on a display region, characterized by comprising: including: an insulating substrate; a plurality of wiring lines provided on the insulating substrate and extending from the display region to a frame region outside the display region; a driver provided in the frame region and connected to the plurality of wiring lines; an organic protective film overlapping the plurality of wiring lines and provided from the display region to a region between the display region and the driver; a moisture-proof resin film covering an end portion of the organic protective film between the display region and the driver, when a direction from the driver toward the display region is set as a front direction, the plurality of wiring lines include wiring lines extending from the driver to the display region via a diagonal front direction of the driver, i.e., a diagonal front direction region overlapping the end portion of the organic protective film, the driver is provided along the display region, the diagonal front direction region is a region from a position 1.5 mm apart from the driver to a position 2.5 mm apart from the driver in a direction orthogonal to the direction from the driver toward the display region.

11. The display device according to claim 10, wherein further comprising an inorganic film provided between the plurality of wiring lines and the organic protective film, the inorganic film extends to an outside region of the end portion of the organic protective film.

12. The display device according to claim 10 or 11, wherein the display device is a liquid crystal display device.

13. The display device according to claim 10 or 11, wherein the display device is an organic electroluminescence display device.

14. A display device which displays an image on a display region, characterized by comprising: including: an insulating substrate; a plurality of wiring lines provided on the insulating substrate and extending from the display region to a frame region outside the display region; a driver provided in the frame region and connected to the plurality of wiring lines; an organic protective film overlapping the plurality of wiring lines and provided from the display region to a region between the display region and the driver; a moisture-proof resin film covering an end portion of the organic protective film between the display region and the driver, when a direction from the driver toward the display region is set as a front direction, the plurality of wiring lines include wiring lines extending from the driver to the display region via a diagonal front direction of the driver, i.e., a diagonal front direction region overlapping the end portion of the organic protective film, the driver is provided along the display region, the diagonal front direction region is a region from a position 0.5 mm apart from the driver to a position 1.0 mm apart from the driver in the direction from the driver toward the display region.

15. The display device according to claim 14, wherein further comprising an inorganic film provided between the plurality of wiring lines and the organic protective film, the inorganic film extends to an outside region of the end portion of the organic protective film.

16. The display device according to claim 14 or 15, wherein the display device is a liquid crystal display device.

17. The display device according to claim 14 or 15, wherein the display device is an organic electroluminescence display device.

Images