Robot for simultaneous substrate transfer

Abstract

An exemplary substrate processing system may include a transfer area housing defining a transfer area fluidically coupled to a plurality of processing areas. A sidewall of the transfer area housing may define sealable access for providing and receiving substrates. The system may include a plurality of substrate supports disposed within the transfer area. The system may also include a transfer apparatus having a central hub, the central hub including a first shaft and a second shaft rotatable counter to the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub and radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled to the eccentric hub. The end effector may include a plurality of arms, the plurality of arms having a number of arms equal to the number of substrate supports in the plurality of substrate supports.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Patent Application No. 62 / 873,458, filed on July 12, 2019, which is hereby incorporated by reference in its entirety for all purposes.

[0003] The present technology is related to the following applications, all filed concurrently on July 12, 2019, entitled “ROBOTFOR SIMULTANEOUS SUBSTRATE TRANSFER” (U.S. Provisional Application No. 62,873,400), “ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER” (U.S. Provisional Application No. 62 / 873,432), “ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER” (U.S. Provisional Application No. 62 / 873,480), “MULTI-LIDSTRUCTURE FOR SEMICONDUCTOR PROCESSING SYSTEMS” (U.S. Provisional Application No. 62 / 873,518), and “HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS” (U.S. Provisional Application No. 62 / 873,519). AND METHODS (High Density Substrate Processing Systems and Methods)" (U.S. Provisional Application No. 62 / 873,503). Each of these applications is incorporated herein by reference in its entirety for all purposes. Technical Field

[0004] The present technology relates to semiconductor processes and equipment, and more particularly, to substrate processing systems. Background Art

[0005] Semiconductor processing systems often utilize cluster tools to integrate many process chambers together. This configuration can facilitate the execution of several sequential processing operations without removing the substrate from the controlled processing environment, or it can allow similar processes to be performed on multiple substrates at once in a variety of chambers. These chambers may include, for example, degas chambers, pretreatment chambers, transfer chambers, chemical vapor deposition chambers, physical vapor deposition chambers, etching chambers, metrology chambers, and other chambers. The combination of chambers in a cluster tool, as well as the operating conditions and parameters under which these chambers are run, are selected to fabricate specific structures using specific process recipes and process flows.

[0006] Cluster tools typically process many substrates by passing them continuously through a series of chambers and process operations. The process recipes and sequences are typically programmed into a microprocessor controller that directs, controls, and monitors the processing of each substrate through the cluster tool. Once an entire wafer cassette has been successfully processed through a cluster tool, the cassette can be transferred to another cluster tool or a stand-alone tool (such as a chemical mechanical polisher) for further processing.

[0007] Robots are often used to transport wafers through various process and holding chambers. The time required for each process and handling operation directly impacts substrate throughput per unit time. Substrate throughput in a cluster tool can be directly related to the speed of the substrate handling robots located in the transfer chambers. As process chamber configurations evolve, existing wafer transport systems may become insufficient.

[0008] Therefore, there is a need for improved systems and methods that can be used to efficiently guide substrates in a cluster tool environment. These and other needs are addressed by the present technology. Summary of the Invention

[0009] An exemplary substrate processing system may include a transfer zone housing defining a transfer zone fluidically coupled to a plurality of processing zones. A sidewall of the transfer zone housing may define sealable access for providing and receiving substrates. The system may include a plurality of substrate supports disposed within the transfer zone. The system may also include a transfer apparatus. The transfer apparatus may include a central hub including a first axis and a second axis extending about and concentric with the first axis. The second axis may rotate counter-rotatably with the first axis. The central hub may feature a central axis. The transfer apparatus may include an eccentric hub extending at least partially through the central hub. The eccentric hub may be radially offset from a central axis of the central hub. The eccentric hub may be coupled to the first axis of the central hub. The transfer apparatus may also include an end effector coupled to the eccentric hub. The end effector may include a plurality of arms, the plurality of arms having a number of arms equal to the number of substrate supports in the plurality of substrate supports.

[0010] In some embodiments, the plurality of substrate supports may include at least four substrate supports. One or more coupling members may couple the eccentric hub to the first axis of the central hub. The one or more coupling members may include one or more belts extending around the first axis or the eccentric hub or a plurality of gears coupled between the first axis and the eccentric hub. The end effector may also include a plurality of end pieces configured to support the substrate. Each end piece may extend vertically to a similar plane extending orthogonally to the central hub. Each arm may include a first end piece and a second end piece of the plurality of end pieces. The first end piece and the second end piece are configured to support the substrate during movement of the end effector. Each first end piece and each second end piece may define a recessed ledge and a shelf. The central hub is vertically translatable along the central axis of the central hub.

[0011] Some embodiments of the present technology may also include a method for transferring a substrate. The method may include receiving a substrate at a first substrate support within a transfer region of a substrate processing system. The substrate processing system may include a transfer apparatus located within the transfer region. The transfer apparatus may include a central hub including a first axis and a second axis extending about and concentric with the first axis. The transfer apparatus may include an eccentric hub extending at least partially through the central hub. The eccentric hub may be radially offset from a central axis of the central hub. The eccentric hub may be coupled to the first axis of the central hub. The transfer apparatus may include an end effector coupled to the eccentric hub, and the end effector may include a plurality of arms. The method may include engaging the substrate with an arm of the plurality of arms. The method may include rotating the second shaft in a first direction about a central axis of the central hub. The method may include rotating the first shaft in the first direction about a central axis of the central hub at a fixed ratio to the second shaft to radially reposition the substrate along the central axis within the transfer region. The method may include delivering the substrate to the second substrate support within the transfer region of the substrate processing system.

[0012] In some embodiments, the method may include translating the transfer apparatus by further rotating the first shaft about the central axis in a first direction or a second direction opposite the first direction at a rate that increases from a fixed ratio, such that the substrate is laterally repositioned along a radius extending from the central axis within the transfer region. The method may include subsequently engaging the substrate and lifting the substrate from the first substrate support by vertically translating the transfer apparatus within the transfer region of the substrate processing system. The method may also include subsequently engaging the substrate such that the first substrate support is recessed from the substrate. Each arm of the end effector may include a first end member and a second end member. Each first end member and each second end member may define a recessed ledge and a shelf. Engaging the substrate may include rotating the arm across the substrate to position the substrate between the arm and a shelf of the first end member and a shelf of the second end member. The substrate processing system may include at least four substrates, and engaging the substrate may include engaging the at least four substrates with the end effector individually or simultaneously. The method may also include transferring the substrate to an alignment hub located between the first substrate support and the second substrate support before transferring the substrate to the second substrate support.

[0013] Some embodiments of the present technology may encompass a substrate processing system comprising: a transfer zone housing defining a transfer zone fluidically coupled to a plurality of processing zones. Sidewalls of the transfer zone housing define sealable access for providing and receiving substrates. The transfer zone may include a plurality of substrate supports disposed within the transfer zone. The system may include a transfer apparatus positioned within the transfer zone. The transfer apparatus may include a central hub comprising a first axis and a second axis, the second axis extending about the first axis. The second axis may rotate counter-rotatably with respect to the first axis. The central hub may feature a central axis. The transfer apparatus may include an eccentric hub extending at least partially through the central hub. The eccentric hub may be radially offset from a central axis of the central hub. The eccentric hub may be coupled to the first axis of the central hub via one or more couplings. The transfer apparatus may also include an end effector coupled to the eccentric hub. The end effector may include a plurality of arms, the plurality of arms having a number of arms equal to the number of substrate supports in the plurality of substrate supports.

[0014] In some embodiments, the end effector may further include a plurality of end pieces configured to support a substrate. Each end piece extends vertically to a similar plane extending orthogonally to the central hub. Each arm may include a first end piece and a second end piece of the plurality of end pieces. The first end piece and the second end piece are configured to support the substrate during movement of the end effector. The central hub is vertically translatable along a central axis of the central hub.

[0015] Such techniques offer numerous advantages over conventional systems and techniques. For example, the transport system can provide lateral transport capabilities in addition to rotational movement for substrate transfer. Furthermore, the transport system can accommodate transfer areas of substrate processing chambers having multiple rows of substrates. These and other embodiments and their numerous advantages and features are described in greater detail in conjunction with the following description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] A further understanding of the nature and advantages of the disclosed technology may be realized by reference to the remaining portions of the specification and drawings.

[0017] Figure 1A A schematic top plan view of one embodiment of an exemplary processing system in accordance with some embodiments of the present technology is shown.

[0018] Figure 1B A schematic partial cross-sectional view of an exemplary chamber system according to some embodiments of the present technology is shown.

[0019] Figure 2 A schematic isometric view of a transfer portion of an exemplary substrate processing system is shown, in accordance with some embodiments of the present technology.

[0020] Figure 3A A schematic cross-sectional view of an exemplary conveying apparatus according to some embodiments of the present technology is shown.

[0021] Figures 3B to 3F Schematic top plan views of exemplary conveyor equipment components are shown in accordance with some embodiments of the present technology.

[0022] Figure 4A A schematic cross-sectional view of an exemplary conveying apparatus according to some embodiments of the present technology is shown.

[0023] Figure 4B A schematic cross-sectional view of an exemplary conveying apparatus according to some embodiments of the present technology is shown.

[0024] Figure 4C A schematic cross-sectional view of an exemplary conveying apparatus according to some embodiments of the present technology is shown.

[0025] Figure 4D A schematic cross-sectional view of an exemplary conveying apparatus according to some embodiments of the present technology is shown.

[0026] Figure 5 Exemplary operations in a method of transferring a substrate according to some embodiments of the present technology are shown.

[0027] Figures 6A to 6F A schematic top plan view of a substrate being conveyed is shown in accordance with some embodiments of the present technology.

[0028] 7A to 7B A schematic diagram of a substrate being translated is shown in accordance with some embodiments of the present technology.

[0029] Figure 8 A schematic cross-sectional elevation view of a transfer portion of an exemplary substrate processing system is shown in accordance with some embodiments of the present technology.

[0030] Some of the drawings are included as schematic diagrams. It should be understood that the drawings are for illustrative purposes only and should not be considered to be to scale or proportion unless specifically indicated to be to scale or proportion. Furthermore, the drawings are provided as illustrations to aid understanding and may not include all aspects or information compared to actual representations, and may include exaggerated material for illustrative purposes.

[0031] In the drawings, similar components and / or features may have the same reference label. In addition, various components of the same type may be distinguished by following the reference label with a letter that distinguishes between the similar components. If only the first reference label is used in the specification, the description applies to any similar component having the same first reference label, regardless of the letter. DETAILED DESCRIPTION

[0032] Substrate processing may include time-intensive operations for adding, removing, or otherwise modifying materials on a wafer or semiconductor substrate. Efficient movement of substrates can reduce queue times and increase substrate throughput. To improve the number of substrates processed in a cluster tool, additional chambers can be incorporated into the mainframe. Although transfer robots and process chambers can be continuously added by lengthening the tool, doing so can be spatially inefficient as the cluster tool footprint increases. Therefore, the present technology may include cluster tools with an increased number of process chambers within a limited footprint. To accommodate the limited footprint for the transfer robot, the present technology may increase the number of process chambers laterally outward from the robot. For example, some conventional cluster tools may include one or two process chambers positioned around a centrally located portion of the transfer robot to maximize the number of chambers radially around the robot. The present technology may extend this concept by incorporating additional chambers laterally outward as another column or group of chambers. For example, the present technology may be applied with a cluster tool that includes three, four, five, six, or more processing chambers that are accessible at each of one or more robotic access locations.

[0033] However, as additional process positions are added, accessing these positions from a central robot may no longer be feasible without additional transfer functionality at each position. Some conventional techniques may include a wafer carrier on which the substrate is held during transfer. However, the wafer carrier may cause thermal unevenness and particle contamination on the substrate. The present technology overcomes these problems by combining a transfer portion that is vertically aligned with the processing chamber area and a carousel or transfer device that can operate in conjunction with the central robot to access the additional wafer positions. In some embodiments, the present technology may not use a conventional wafer carrier and may transfer a particular wafer from one substrate support to a different substrate support within the transfer area. Although the remainder of the disclosure will conventionally identify specific structures for which the present structure and method can be used (such as a four-position transfer area), it will be readily understood that the system and method are equally applicable to any number of structures and devices that may benefit from the explained transfer functionality. Therefore, the present technology should not be considered limited to use with any specific structure. Furthermore, while an exemplary tool system will be described to provide a basis for the present technology, it will be understood that the present technology may be incorporated into any number of semiconductor processing chambers and tools that may benefit from some or all of the operations and systems to be described.

[0034] Figure 1A A top view of one embodiment of a substrate processing tool or processing system 100, including deposition, etching, baking, and curing chambers, according to some embodiments of the present technology, is shown. In the figure, a set of front-opening standard chambers 102 provide substrates of various sizes, which are received by robots 104a and 104b and placed in a load lock or low-pressure holding area 106 before being transported to one of the substrate processing areas 108, located in chamber systems or quad sections 109a-c, each of which can be a substrate processing system having a transfer area fluidically coupled to multiple processing areas 108. Although a quad system is shown, it should be understood that platforms incorporating single chambers, dual chambers, and other multi-chamber systems are also encompassed by the present technology. A second robot 110, housed in a transfer chamber 112, can be used to transfer substrate wafers from the holding area 106 to the quad sections 109 and back, and the second robot 110 can be housed in the transfer chamber, to which each of the quad sections or processing systems can be connected. Each substrate processing region 108 may be configured to perform a number of substrate processing operations, including any number of deposition processes, including cyclic layer deposition, atomic layer deposition, chemical vapor deposition, physical vapor deposition, as well as etching, pre-cleaning, annealing, plasma processing, degassing, orientation, and other substrate processes.

[0035] Each quadrant 109 may include a transfer area that can receive substrates from and transfer the substrates to the second robotic arm 110. The transfer area of ​​the chamber system can be aligned with the transfer chamber having the second robotic arm 110. In some embodiments, the transfer area can be laterally accessible to the robot. In subsequent operations, components of the transfer area can vertically translate the substrate into the covered processing area 108. Similarly, the transfer area can also be operable to rotate the substrate between positions within each transfer area. The substrate processing area 108 can include any number of system components for depositing, annealing, curing, and / or etching material films on substrates or wafers. In one configuration, two sets of processing areas (such as the processing areas in quadrants 109a and 109b) can be used to deposit material on a substrate, and a third set of processing chambers (such as the processing chambers or areas in quadrant 109c) can be used to cure, anneal, or process the deposited film. In another configuration, all three sets of chambers (such as all twelve chambers shown) can be configured to both deposit and / or cure a film on a substrate.

[0036] As shown, the second robot 110 may include two arms for simultaneously transferring and / or retrieving multiple substrates. For example, each quadrant 109 may include two access points 107 along a surface of the transfer area housing, and the two access points 107 may be laterally aligned with the second robot. An access port may be defined along a surface adjacent to the transfer chamber 112. In some embodiments, such as shown, the first access port may be aligned with a first substrate support among the plurality of substrate supports in the quadrant. Additionally, the second access port may be aligned with a second substrate support among the plurality of substrate supports in the quadrant. In some embodiments, the first substrate support may be adjacent to the second substrate support, and the two substrate supports may define a first column of substrate supports. As shown in the illustrated configuration, the second column of substrate supports may be located behind the first column of substrate supports, laterally outward from the transfer chamber 112. The two arms of the second robot 110 may be spaced apart to allow both arms to simultaneously access the quadrant or chamber system to transfer or retrieve one or two substrates to a substrate support in the transfer area.

[0037] Any one or more of the transfer areas described may be combined with additional chambers separate from the manufacturing systems shown in the various embodiments. It will be appreciated that the processing system 100 also contemplates additional configurations of chambers for deposition, etching, annealing, and curing of material films. Furthermore, any number of other processing systems may be utilized with the present technology, which may be combined with a transfer system for performing any specific operation such as substrate movement. In some embodiments, a processing system that can provide access to multiple processing chamber areas while maintaining a vacuum environment in each portion (such as the holding and transfer areas described) may allow operations to be performed in multiple chambers while maintaining a specific vacuum environment between separate processes.

[0038] Figure 1B A schematic cross-sectional elevation view of one embodiment of an exemplary processing tool, such as a through-chamber system, is shown in accordance with some embodiments of the present technology. Figure 1B A cross-sectional view through any two adjacent processing zones 108 in any of the four sections 109 may be shown. The elevation view may illustrate the configuration or fluid coupling of one or more processing zones 108 with the transfer zone 120. For example, the continuous transfer zone 120 may be defined by a transfer zone housing 125. The housing may define an open interior space within which a plurality of substrate supports 130 may be disposed. For example, as shown in FIG. 1A , an exemplary processing system may include four or more substrate supports 130 distributed within the housing about the transfer zone. As shown, the substrate supports may be pedestals, although many other configurations may be used. In some embodiments, the pedestals may be vertically translatable between the transfer zone 120 and a processing zone overlying the transfer zone. The substrate supports may be vertically translatable along a central axis of the substrate supports along a path between a first position and a second position within the chamber system. Thus, in some embodiments, each substrate support 130 may be axially aligned with the overlying processing zone 108 defined by one or more chamber components.

[0039] The open transfer area can provide a transfer device 135, such as a carousel, with the ability to engage and, for example, rotate, between substrate supports. The transfer device 135 can rotate about a central axis. This allows a substrate to be positioned for processing within any processing area 108 within the processing system. The transfer device 135 can include one or more end effectors that can engage the substrate from above, below, or at the outer edge of the substrate to move around the substrate support. The transfer device can receive a substrate from a transfer chamber robot (e.g., the second robot arm 110 described previously). The transfer device can then rotate the substrate to replace the substrate support to facilitate the transfer of additional substrates.

[0040] Once positioned and awaiting processing, the conveyor apparatus can position an end effector or arm between the substrate supports, which can allow the substrate supports to be lifted over the conveyor apparatus 135 and transported into the processing zone 108, which can be vertically offset from the transport zone. For example, and as shown, substrate support 130a can transport a substrate into processing zone 108a, while substrate support 130b can transport a substrate into processing zone 108b. This can occur with two other substrate supports and processing zones, as well as with additional substrate supports and processing zones in embodiments that include additional processing zones. In such a configuration, when operatively engaged to process substrates (such as in the second position), the substrate supports can at least partially define the processing zone 108 from below, and the processing zones can be axially aligned with the associated substrate supports. The processing zones can be defined from above by the faceplate 140 and other cover stack components. In some embodiments, each processing zone can have a separate cover stack component, although in some embodiments, the components can accommodate multiple processing zones 108. Based on this configuration, in some embodiments, each processing region 108 can be fluidly coupled to the transfer region while being fluidly isolated from above from every other processing region within the chamber system or quad.

[0041] In some embodiments, faceplate 140 can operate as an electrode for the system to generate a localized plasma within processing region 108. As shown, each processing region can utilize or incorporate a separate faceplate. For example, faceplate 140a can be included to delimit processing region 108a from above, and faceplate 140b can be included to delimit processing region 108b from above. In some embodiments, the substrate support can operate as a counter-electrode for generating a capacitively coupled plasma between the faceplate and substrate support. Depending on the spatial geometry, pump bushing 145 can at least partially radially or laterally delimit processing region 108. Similarly, a separate pump bushing can be used for each processing region. For example, pump bushing 145a can at least partially radially delimit processing region 108a, while pump bushing 145b can at least partially radially delimit processing region 108b. In some embodiments, baffles 150 can be positioned between cover 155 and faceplate 140, and similarly, separate baffles can be included to facilitate fluid distribution within each processing region. For example, baffle 150a may be included to distribute toward processing region 108a, and baffle 150b may be included to distribute toward processing region 108b.

[0042] The lid 155 can be a separate component for each processing zone, or it can include one or more common aspects. In some embodiments, such as shown, the lid 155 can be a single component that defines a plurality of apertures 160 for delivering fluid to each processing zone. For example, the lid 155 can define a first aperture 160a for delivering fluid to processing zone 108a, and the lid 155 can define a second aperture 160b for delivering fluid to processing zone 108b. When additional apertures are included, additional processing zones within each section can define additional apertures. In some embodiments, each of the four sections 109 or multiple processing zone sections, which can accommodate more or fewer than four substrates, can include one or more remote plasma units 165 for delivering plasma effluent to the processing chamber. In some embodiments, a separate plasma unit can be incorporated for each chamber processing zone, although in some embodiments, fewer remote plasma units can be used. For example, as shown, a single remote plasma unit 165 can be used for multiple chambers, such as two, three, four, or more chambers, up to all chambers of a particular four section. In embodiments of the present technology, conduits may extend from the remote plasma unit 165 to each aperture 160 for conveying plasma effluent for processing or cleaning.

[0043] As indicated, the processing system 100, or more specifically, a four-section or chamber system in conjunction with the system 100 or other processing systems, may include a transfer section positioned below the illustrated processing chamber area. Figure 2 A schematic isometric view of a transfer portion 200 of an exemplary substrate processing system is shown, in accordance with some embodiments of the present technology. Figure 2 Other aspects or variations of the above-described transfer region 120 may be shown and may include any of the components or features described. The illustrated system may include a transfer region housing 205 defining a transfer region in which a plurality of components may be included. The transfer region may also be at least partially defined from above by a process chamber or process region fluidically coupled to the transfer region, such as a Figure 1A109 of the transfer area housing. The sidewalls of the transfer area housing may define one or more access locations 207 through which substrates may be delivered and retrieved, such as by the second robotic arm 110 as described above. The access locations 207 may be slit valves or other sealable access locations, which in some embodiments include doors or other sealing mechanisms to provide an airtight environment within the transfer area housing 205. Although shown with two such access locations 207, it should be understood that in some embodiments, only a single access location 207 may be included, as well as access locations on multiple sides of the transfer area housing. It should also be understood that the transfer portion 200 may be sized to accommodate any substrate size, including 200 mm, 300 mm, 450 mm, or larger or smaller substrates, including substrates characterized by any number of geometries or shapes.

[0044] Within the transfer area housing 205 may be a plurality of substrate supports 210a-210d spatially positioned about the transfer area. While four substrate supports are shown, it should be understood that embodiments of the present technology similarly encompass any number of substrate supports. For example, greater than or approximately three, four, five, six, eight, or more substrate supports may be accommodated in the transfer area according to embodiments of the present technology. The second robotic arm 110 may deliver a substrate to one or both of the substrate supports 210a or 210b through the access port 207. Similarly, the second robotic arm 110 may retrieve the substrate from these locations. Lift pins 212 may protrude from the substrate supports and may allow robotic access to the substrate below. In some embodiments, the lift pins may be fixed to the substrate supports, or fixed to locations where the substrate supports may be recessed below them, or the lift pins may additionally be raised or lowered by the substrate supports. The substrate supports may be vertically translatable and, in some embodiments, may extend into a processing chamber area of ​​the substrate processing system, such as a processing chamber area located above the transfer area housing 205.

[0045] The transfer area housing 205 can provide access to an alignment system 215, which can include an aligner that can extend through an aperture in the transfer area housing, as shown, and can operate in conjunction with a laser, camera, or other monitoring device that protrudes through or is transmitted through an adjacent aperture to determine whether a substrate being translated is properly aligned. The transfer area housing 205 can also include a transfer apparatus 220 that can operate in a variety of ways to position and move substrates between various substrate supports. While exemplary operation will be described below, in one exemplary embodiment, the transfer apparatus 220 can move substrates from substrate supports 210a and 210b to substrate supports 210c and 210d, which can allow additional substrates to be transferred to the transfer chamber.

[0046] The transfer apparatus 220 may include a central hub 225 that may include one or more shafts extending into the transfer chamber. The transfer apparatus may further include an eccentric hub 230 that extends at least partially through the central hub 225. The eccentric hub may be radially offset from the central shaft by the central hub and may rotate independently of the central hub. These separate rotations and offsets of the eccentric hub 230 may facilitate translation in multiple directions, including rotational and lateral, as will be explained further below. Coupled to the eccentric hub 230 is an end effector 235. The end effector 235 may include a plurality of arms 237 extending radially or laterally outward from a central or eccentric hub. Although illustrated as a central body from which the arms extend, the end effector may further include separate arms, each coupled to the eccentric hub 230. Any number of arms may be included in embodiments of the present technology. In some embodiments, the number of arms 237 may be similar to or equal to the number of substrate supports included in the chamber. Thus, as shown, for four substrate supports, the transport apparatus 220 may include four arms extending from the end effector. The arms may be characterized by any number of shapes and profiles, such as a straight profile or an arched profile, and by any number of distal profiles including hooks, loops, forks, or other designs for supporting and / or providing access to a substrate.

[0047] The end effector 235 may additionally include a plurality of end pieces 240, as will be further described below, and may be configured to support a substrate. The end piece 240 may be coupled to an arm of the plurality of arms 237. Each arm of the end effector may include any number of end pieces, such as two, three, four, or more end pieces, and the end pieces may be positioned on or coupled to these arms to allow the arms of the end effector to swing under or over a substrate without contacting them and then placing the substrate for movement within the transfer area. The end pieces will be described in more detail below and may be used to contact the substrate during transfer or movement. The end pieces and the end effector may be made of, or may include, a variety of materials including conductive and / or insulating materials. In some embodiments, the material may be coated or plated to withstand contact with precursors or other chemicals that may enter the transfer chamber from the cover processing chamber.

[0048] In addition, materials can be provided or selected to withstand other environmental characteristics, such as temperature. In some embodiments, the substrate support can be operated to heat a substrate disposed on the support. The substrate support can be configured to increase the surface or substrate temperature to a temperature greater than or about 100°C, greater than or about 200°C, greater than or about 300°C, greater than or about 400°C, greater than or about 500°C, greater than or about 600°C, greater than or about 700°C, greater than or about 800°C, or higher. During operation, any of these temperatures can be maintained, and thus components of the conveyor apparatus 220 may be exposed to any of these specified or covered temperatures. Therefore, in some embodiments, any material can be selected to accommodate these temperature ranges, and can include materials such as ceramics and metals that are characterized by relatively low coefficients of thermal expansion or other beneficial properties. The component coupling can also be adapted for operation in high temperature and / or corrosive environments. For example, where the end effector and the end piece are each ceramic, the coupling may include a press fit, a snap fit, or other fittings that may not include additional material (such as bolts) that may expand and contract with temperature and may cause cracking of the ceramic. In some embodiments, the end piece may be continuous with the end effector and may be integrally formed with the end effector. Any number of other materials may be used that may facilitate operation or resistance during operation and are similarly encompassed by the present technology.

[0049] The bottom of the transfer area housing 205 can additionally define a space 250 within which the end effector can be recessed when not in use. As shown, the space 250 can be defined between substrate supports and can be shaped to define the contours of the end effector 235 or a component of the end effector. For example, a recess can be defined within the space to accommodate an end piece, which can extend beneath the arm 237 of the end effector 235. Furthermore, in some embodiments, the space 250 can extend around the alignment system 215, which can allow the end effector 235 to be used to cover components of the alignment system in some embodiments, such as during substrate processing, to protect the aligner and other alignment components from process effluent within the processing system.

[0050] The transfer apparatus 220 may include a number of components and configurations that may facilitate movement of the end effectors and / or eccentric hubs independent of the central hub, as will be further described below. Figure 3A A schematic cross-sectional view of an exemplary conveyor apparatus 220 according to some embodiments of the present technology is shown, however it should be understood that any other configuration providing the independent rotational movement to be mentioned is similarly encompassed by the present technology.

[0051] The central hub 225 may include a first shaft 310 and a second shaft 320, and in some embodiments, the second shaft may be axially aligned with the first shaft 310. For example, the first shaft 310 and the second shaft 320 may be concentric with a central axis extending vertically through the central hub. In some embodiments, the first shaft 310 may extend through the second shaft 320 or on all sides of the second shaft 320. Figure 3A As shown, the first shaft 310 and the second shaft 320 can be coaxial, although the two shafts can be coupled to separate motors or drive systems. As shown, the first shaft 310 can be coupled to a first drive system 312, which can include a motor and can allow rotation about a central axis. This rotation can cause the connecting member 330 to rotate in a first direction or a second direction opposite to the first direction. Movement of the connecting member can cause the eccentric hub 230 to rotate about a central axis passing through the eccentric hub in the first direction or the second direction opposite to the first direction. Similarly, the second shaft 320 can be coupled to a second drive system 314, which can independently allow the central hub 225 to rotate about the central axis in the first direction or the second direction.

[0052] As will be described further below, the eccentric hub 230 can rotate about the central axis of the central hub 225 and can be operated by controlled rotation of the first and second shafts to produce linear or substantially linear motion of the end effector 235. In some embodiments, a vertical translation drive 325 can be included that allows the transport apparatus to translate vertically along the central axis. In some embodiments, this can facilitate lifting the substrate from the substrate support or lift pins, although in some embodiments, the lift pins and / or substrate support can be used to raise and lower the substrate, and the transport apparatus 220 may not include a vertical drive mechanism.

[0053] The eccentric hub may be at least partially disposed within the central hub 225 and may extend through the central hub 225 housing to couple with the end effector 235, or may include an extended post or connector to couple with the end effector 235. The eccentric hub 230 may be at least partially separate from the central hub 225, which may facilitate rotation of the eccentric hub independent of the rotation of the central hub 225. The eccentric hub 230 may be directly or indirectly coupled to the first shaft 310 of the central hub and may allow the eccentric hub 230 to rotate when the first shaft 310 rotates. The eccentric hub 230 may be positioned offset from the central axis of the central hub and may be radially offset from the central axis. The eccentric hub may be characterized as follows: a corresponding eccentric hub shaft extends through the eccentric hub 230 and defines the rotational axis of the eccentric hub and, in some embodiments, the end effector. Furthermore, the end effector 235 may be centrally coupled to the eccentric hub 230, or the central axis of the end effector may be offset from the central axis passing through the eccentric hub. For example, the end effector 235 can be axially aligned with the central axis of the central hub 225, or can be offset from each of the central hub and the eccentric hub. In some embodiments, these offsets can affect the outer radius of the sweep path of the end effector.

[0054] As previously described, the eccentric hub 230 may not be directly coupled to the central hub 225, or may be rotatably coupled via a housing. This facilitates independent rotation between the eccentric hub and the central hub, and can result in multiple rotational positions for the conveyor 220, which can cooperate to provide lateral movement in addition to rotational movement. A first shaft 310 can extend within the central hub 225 and provide a certain amount of access for coupling the coupling 330 about the first axis. As shown, a coupling can couple the eccentric hub 230 to the first shaft 310 within the central hub housing. Thus, when the first shaft 310 is rotated by the first drive system 312, the coupling coupling the shaft to the eccentric hub can similarly rotate the hub about an eccentric axis that is radially offset from the central axis of the conveyor or central hub, as described above. As the eccentric hub rotates with the rotation of the first shaft 310, the end effector 235 can also rotate in a direction corresponding to or associated with the direction of rotation of the first shaft 310 and / or the eccentric hub 230.

[0055] Figures 3B to 3F Schematic top plan views of exemplary components of a delivery device 220 according to some embodiments of the present technology are shown. Although only some aspects of the delivery device as previously described may be shown, it should be understood that these figures are not intended to be limiting and may include any components, materials, or features of the aforementioned delivery device 220. In addition, the figures may show linkages included in any previously described delivery device or embodiment of the present technology.

[0056] As shown, the transfer apparatus 220 may include a central hub 225. Although the central hub 225 may include a covering cover portion as previously shown, the cover is not shown in the figures to facilitate viewing of exemplary couplings encompassed by the present technology. A first shaft 310 may extend within the central hub 225 and may be coupled to the eccentric hub 230, as previously described. In one embodiment, a coupling 330a is shown, in which one or more belts may be used for coupling and may extend around the eccentric hub 230 and the first shaft 310 in a variety of ways. The one or more belts may extend within grooves or channels defined in each of the eccentric hub and the first shaft.

[0057] Additionally, twisted straps may be incorporated to allow for counter-rotation between components. Single or multiple straps may be used in various embodiments, although additional link systems may be similarly employed. For example, Figure 3C As shown, a gear set can be used to drive the eccentric hub, as shown. For example, the first shaft 310 can define a plurality of gear teeth along an area extending within the central hub 225. The gear teeth can be interconnected with the teeth of a linkage gear 330b, such as a pinion gear, which can be connected to or extend around the eccentric hub 230 of the conveyor device. Additional gears can also be incorporated in any number of configurations to facilitate rotation of the eccentric hub from the rotation of the first shaft 310. For example, as shown in Figure 3D, the pinion gear can be fixedly coupled to the first shaft 310 and can be seated within the inner radius of the planet gear 330c. The planet gear 330c can be coupled to the eccentric hub 230 or serve as the eccentric hub 230, and the eccentric hub 230 can rotate as the planet gear moves.

[0058] Figures 3E to 3F An additional coupling according to some embodiments of the present technology is shown, in which a half-pulley can be incorporated to reduce the offset of the eccentric hub. As shown, the first shaft 310 can extend upwardly through the central hub 225. The first shaft 310 can be characterized by a half-pulley at the distal end of the first shaft near the end effector 235. The half-pulley can be coupled to the half-pulley 330d of the eccentric hub 230. As shown, the eccentric hub 230 can extend at least partially around the first shaft 310 and can include a protruding half-pulley to couple with the half-pulley at the distal end of the first shaft. In some embodiments, one or more belts 335 or other coupling materials can be used to connect the eccentric hub half-pulley and the half-pulley of the first shaft 310. Figures 3B to 3F Three possible linkage systems encompassed by the present technology are shown, and these examples are not intended to be limiting.

[0059] Any number of other system component couplings configured to provide the described operations are similarly encompassed by the present technology. Furthermore, because the linkage connection may include multiple gears, twisted belts, and other components that can cause the eccentric hub 230 to rotate in a direction similar to or different from the first shaft 310, it should be understood that such effects can be taken into account throughout any of the embodiments described herein. For example, a first direction of shaft rotation can cause the associated eccentric hub to rotate in either direction, and thus, when describing a first and second direction, any direction can actually be included to accommodate the movement shown or described, and this can be interpreted as including any type of actual linkage coupling in any single exemplary embodiment.

[0060] Figure 4A A schematic cross-sectional view of another exemplary delivery apparatus 400 is shown, which may include any of the components, materials, or characteristics described above, in accordance with some embodiments of the present technology. Figure 4A A pulley system may be shown that can be used to independently rotate an eccentric hub that can be coupled to the end effector 235, as previously described. The conveyor 400 may include a central hub 425 having a housing in which a plurality of pulley components may be housed. As previously described, the central hub 425 may include a first shaft 310 and a second shaft 320 that can be rotated with a separate drive system, as previously described.

[0061] The first shaft 310 can be coupled to the eccentric hub 430 via a set of pulleys and linkages, allowing the eccentric hub 430 to be radially offset from the first shaft 310. The second shaft 320 can be coupled to the central hub 425, and rotation of the central hub can cause all components to rotate together, which can rotationally translate a substrate positioned on the arm of the end effector 235. In some embodiments, rotation of the first shaft 310 separately from the second shaft 320 can provide additional translational movement that can be used to provide lateral translation of the substrate.

[0062] The first pulley 410a can be coupled about the first shaft 310 and coupled to the second pulley 410b with a first coupling 415a. The second pulley 410b can be laterally offset from the first pulley 410a and housed by the housing of the central hub 425. The second pulley 410b can include a fixed coupling 420, such as an additional shaft, connecting the second pulley to a third pulley 410c, which can be vertically offset from the second pulley 410b. The third pulley 410c can be coupled to a fourth pulley 410d with a second coupling 415b. The fourth pulley 410d can be coupled about an eccentric shaft in the eccentric hub 430, which can be offset from the first shaft 310 to provide a second axis of eccentric movement for the end effector 235. The pulleys 410 may be similarly or differently sized, and the linkages 415 may include any number or combination of linkages discussed above, or otherwise understood to be encompassed by the present technology, to allow rotation or operation of the pulley system.

[0063] Figure 4B A schematic cross-sectional view of an exemplary delivery apparatus 440 is shown, which may include any of the components, materials, or characteristics described above, and may include variations or modifications of aspects of the delivery apparatus 400 described above, in accordance with some embodiments of the present technology. Figure 4B A portion of a pulley system and a swing arm can be shown, which can be used to independently rotate an eccentric hub, which can be coupled to the end effector 235, as previously described. A conveyor 440 can include a central hub 442 having a housing in which a plurality of pulley assemblies can be housed. As previously described, the central hub 442 can include a first shaft 310 and a second shaft 320, which can be rotated with a separate drive system, as previously described.

[0064] In some embodiments, the first shaft 310 can be coupled to an eccentric hub 449 with a set of pulleys and linkages, allowing the eccentric hub 449 to be radially offset from the first shaft 310 and to swing across a central axis passing through the first shaft 310. The second shaft 320 can be coupled to a central hub 442, and rotation of the central hub 442 can cause all components to rotate together, which can rotationally translate a substrate positioned on the arm of the end effector 235. In some embodiments, rotation of the first shaft 310 separately from the second shaft 320 can provide additional translational movement that can be used to provide lateral translation of the substrate.

[0065] The first pulley 444a can be coupled about the first axis 310 and coupled to the second pulley 444b by a coupling 445. As previously described, the second pulley 444b can be laterally offset from the first pulley 444a and can be received by the housing of the central hub 442. The second pulley 444b can be coupled to a swing arm 446, which can be vertically offset from the second pulley 444b. The swing arm 446 can extend rearwardly within the housing of the central hub 442 toward the first pulley 444a. The swing arm 446 can be offset from the first axis 310 to provide a second axis of eccentric movement of the end effector 235. Although in some embodiments, rotation of the swing arm 446 from the second pulley 444b can drive the swing arm 446 along an arcuate path within the housing, thereby providing movement of the eccentric hub 449 and the end effector 235. This movement can be coordinated with rotation of the second axis 320 and components to provide lateral movement of the end effector 235, as previously described. The eccentric hub 449 can be fixedly coupled to the swing arm 446, or in some embodiments can be an extension of the swing arm 446. In some embodiments, a gap 448 or path can be defined within the housing to accommodate the movement of the eccentric hub 449 from the swinging motion of the swing arm 446. Likewise, the pulley 444 can be sized similarly or differently, and the linkage 445 can include any number or combination of linkages discussed above, or linkages otherwise encompassed by the present technology to allow rotation or operation of the pulley system.

[0066] Figure 4C A schematic cross-sectional view of an exemplary delivery apparatus 450 according to some embodiments of the present technology may be shown, which may include any of the components, materials, or characteristics described above, and may include variations or modifications of aspects of the delivery apparatus 400 described above. Figure 4C An additional offset transfer device may be shown that can be coupled to the end effector 235 as previously described and provide linear translation of the end effector in addition to the rotational movement as previously described. The transfer device 450 may include a central hub 452 having a plurality of arms 454 that provide linear stability during movement. As previously described, the central hub 452 may include a first shaft 310 and a second shaft 320 that can rotate with separate drive systems, as described above.

[0067] The first shaft 310 can be coupled to a flexible drive 456 at a proximal end of the first shaft 310 relative to the end effector 235 coupled to the distal end of the first shaft 310. The flexible drive 456 can be driven to bend the first shaft 310 outward from the central axis through the conveyor. The second shaft 320 can include an enlarged opening through which the first shaft 310 can extend, and the first shaft 310 can be radially tilted within the opening, which can provide linear extension of the end effector 235. By positioning the flexible drive 456 along the length of the first shaft 310, the flexible drive 456 can drive the first shaft 310 a shorter distance farther from the end effector at opposite ends of the first shaft, providing increased linear translation of the substrate in an eccentric manner. For example, if the flexible drive 456 is located near the end effector 235, driving or bending the first shaft 310 will only translate the end effector slightly, such as by a ratio slightly greater than 1:1. However, as shown, when the flexible drive 456 is located farther from the end effector 235, a relatively small offset bend can produce greater than or about twice the distance of travel from the central axis of the end of the first shaft 310 to which the end effector 235 can be coupled, and can produce greater than or about three times the distance of travel, greater than or about four times the distance of travel, greater than or about five times the distance of travel, greater than or about six times the distance of travel, greater than or about seven times the distance of travel, greater than or about eight times the distance of travel, greater than or about nine times the distance of travel, greater than or about ten times the distance of travel, or more. The flexible drive 456 can bend in any direction from the central axis.

[0068] When the first shaft 310 is driven by the flexure drive 456, the tilt that can advantageously provide lateral translation of the end effector 235 can similarly provide tilt on the wafer if not compensated. In some embodiments, the arms 454 of the central hub 452 can provide a compensating force or tilt in the opposite direction of the tilt produced by the flexure drive 456. Thus, in some embodiments, the arms 454 can maintain the substrate on the end effector 235 or substantially parallel to the surface of the substrate support, and can reduce or limit the amount of tilt during lateral adjustment of the substrate position. For example, while the first shaft 310 can tilt within the wheel of the central hub 452, the arms 454 can flex to compensate for this tilt, thereby maintaining the flatness of the central hub 452, which can keep the substrate substantially parallel to the substrate support. In some embodiments, the arm 454 can compensate for greater than or about 90% of the tilt caused by movement of the flexible drive 456, and can compensate for greater than or about 91% of the tilt, greater than or about 92% of the tilt, greater than or about 93% of the tilt, greater than or about 94% of the tilt, greater than or about 95% of the tilt, greater than or about 96% of the tilt, greater than or about 97% of the tilt, greater than or about 98% of the tilt, greater than or about 99% of the tilt, or in some embodiments, can fully compensate for the tilt of the first axis 310 produced by the flexible drive 456.

[0069] Figure 4D A schematic cross-sectional view of an exemplary delivery apparatus 460 is shown, which may include any of the components, materials, or characteristics described above, and may include variations or modifications of aspects of the delivery apparatus 400 described above, in accordance with some embodiments of the present technology. Figure 4D Additional exemplary devices may be shown that, in some embodiments, provide linear translation of a substrate located on or associated with a conveyor device. A conveyor device 460 may include an end effector 235 having an arm 462 coupled to a flexure 464. In some embodiments, the number of flexures 464 may be equal to the number of arms 462, providing independent movement of each arm 462. While some previously mentioned configurations may provide for deflection of the entire end effector, the conveyor device 460 may operate only the flexure 464 to linearly move the associated arm 462. Thus, in some embodiments, only a single rotatable shaft 465 may be coupled to the end effector 235. The shaft 465 may allow wiring to extend through the shaft, which may then be coupled to the flexure 464, thereby enabling operation. In some embodiments, the flexure may be operable to linearly extend along an axis in one or both directions, such as by arching, through the associated arm 462, thereby extending or retracting the associated arm 462 and substrate by a certain distance to facilitate placement of the substrate. The flexure can be any type of flexing or deforming material, and in some embodiments can be a linear flexure. The flexure drive can also be any drive, and in some embodiments can be, for example, a piezoelectric drive motor. When energized, the piezoelectric or other drive can cause deformation in or within the flexure, resulting in outward or inward bending, which can cause linear movement of the coupling arm.

[0070] Figure 5 5 illustrates exemplary operations in a method 500 for transferring a substrate according to some embodiments of the present technology. The method 500 may be performed in one or more semiconductor processing systems having a transfer region, which may be incorporated into, for example, the processing system 100 (such as the transfer portion 200). The method may include a number of optional operations as shown, which may or may not be specifically associated with some embodiments of the method according to the present technology. The method 500 describes Figures 6A to 6F 6 is a schematic diagram illustrating a method 500. The operations schematically illustrated in FIG6 will be described in conjunction with the operations of method 500. It should be understood that FIG6 is merely a partial schematic diagram with limited detail, and that in some embodiments, the system may include more or fewer substrate supports and other components, as well as alternative structural aspects that may still benefit from any aspect of the present technology.

[0071] Figure 6AA transfer section 600 of a substrate processing system as previously described may be shown and may include any of the features and aspects of the transfer section 200 described above, including any drive components previously discussed in FIG. 3 or FIG. 4 , as well as any other drive components that will be understood to be similarly encompassed by the present technology. Furthermore, the system may be shown with a substrate 601 disposed within the transfer section 600, such as, for example, on a substrate support 610 as shown. The figure may illustrate a configuration of the present technology for subsequent initial operations of method 500, which may include, at operation 505, receiving a substrate at a first substrate support 610a, such as by a robot from a transfer chamber through an access port as previously described. The robot may transport one, two, or more substrates to a substrate support within the transfer area housing 605 proximate to the access port or slit valve. A transfer apparatus 620 may rotate one or more substrates to an opposing substrate support and may transport additional substrates. It should be understood that the same process may be performed with any number of substrates, including transporting one substrate at a time into the processing chamber, as shown. FIG. 6A may illustrate that after the substrate has been positioned within the transfer chamber, a transfer apparatus 620 may be positioned over the substrate 601 to receive the substrate for transfer to a second substrate support.

[0072] The transfer process may involve rotating the transfer apparatus in a variety of ways. Method 500 may include engaging the substrate 601 at operation 510. Engaging may occur simultaneously or separately until one or more substrates have been transferred from the substrate support 610 (including the lift pins 612 of the substrate support) to the arm 637 of the transfer apparatus 620. Depending on whether the transfer apparatus has vertical movement capabilities, engaging and moving may or may not include raising or lowering one or both of the substrate or the transfer apparatus. Once the substrate has been engaged by the transfer apparatus, the complete transfer of the one or more substrates can be completed between the substrate support and the transfer apparatus. For example, in some embodiments, the transfer apparatus may lift the substrate from the substrate support, or may lift the lift pins on which the substrate may be located. For example, this can be performed by vertically translating the transfer apparatus. In some embodiments, the substrate support may be recessed away from the one or more substrates to complete the transfer.

[0073] In some embodiments of the present technology, engagement of the substrate can occur as a passive engagement, where the transport apparatus 620 can provide a shelf on which the substrate 601 can be placed. For example, and as previously described, each arm 637 of the end effector 635 on the transport apparatus 620 can include multiple end pieces coupled to the end effector and can include one or more first end pieces 640 and one or more second end pieces 642. The end pieces can be positioned across one another to maintain a distance spanned by the arm 637 without any extensions or end pieces, and can facilitate sweeping the arm across the substrate in either direction to position the end piece proximate to the substrate and facilitate transfer of the substrate from the substrate support or lift pins to the transport apparatus.

[0074] Figure 6B A diagram showing a bonding that can be performed by the present technology is shown. Figure 6A As shown, the arm 637 of the transport apparatus 620 can be swept across a substrate 601 positioned on lift pins 612. End pieces 640, 642 can be aligned across the substrate to engage the substrate, which can then be lowered onto the end piece for transport. Alternatively or simultaneously, the end pieces 640, 642 can be raised to engage the substrate and lift it from the substrate support or lift pins. In some embodiments, when transporting multiple substrates, staggered lift pins, as described below, can be used to allow for individual engagement and transport of the substrates.

[0075] As shown, a first end piece 640 can be coupled to the arm 637 at a distal end away from the central hub, and the first end piece 640 can face away from the central hub. In addition, one or more second end pieces 642 can be coupled to the arm 637 and can face away from the central hub or toward the first end piece. The second end piece 642 can be positioned along the arm at a distance from the first end piece 640 that is greater than the diameter of the substrate to be joined. Figure 6B As shown, a support surface is provided on which a substrate can be placed. Each of the first end piece 640 and the second end piece 642 can define a recessed ledge including a shelf portion extending toward the substrate to be supported. The first end piece 640 can define a shelf 641 extending toward the associated second end piece 642, and the second end piece 642 can define a shelf 643 extending toward the associated first end piece 640. Together, the shelves can create a wafer support surface around two or more outer or radial edges of the substrate 601. Although in some embodiments, the first and second end pieces can be different components or can extend longer arched portions, the first and second end pieces can extend vertically through the central axis of the central hub to similar horizontal planes to create a substantially flat surface for the substrate support. In addition, each end piece is characterized by an arched profile as shown, which in some embodiments can accommodate the arched edges of the substrate.

[0076] After completing the transfer to the transfer apparatus 620, the substrates may be rotated between substrate supports for further processing in different processing areas or delivered to substrate supports accessible by a transfer robot, such as the second robotic arm 110 described above. Translation of one or more substrates may occur by causing one or more rotations about a first axis and a second axis, which may cause rotation of the arm and housing, such as Figure 6C shown.

[0077] The transport apparatus 620 can facilitate both rotational translation of the substrate and substantially linear or lateral translation of the substrate by manipulating the rotation of the central hub and the eccentric hub in one or more manners. Figure 6CAs shown, the central hub 625 and the eccentric hub 630 can be rotated together in either direction at a fixed rotational ratio, which can rotate the end effector 635 and any engaged substrate. This can occur by rotating the second shaft at a fixed rotational ratio at operation 515 and the first shaft at operation 520 together, or by rotating the second shaft and locking the first shaft to the second shaft, which can also rotate the first shaft in the same direction as the second shaft and radially reposition the substrate 601 about the central axis within the transfer region of the chamber at operation 525.

[0078] Additionally, operations 515-525 may include lateral adjustments to the substrate to reposition the substrate to improve centering of the substrate on the substrate support. Figure 6D As shown, when the first shaft to which the eccentric hub 630 is coupled is further rotated, such as at a faster speed than the second shaft to which the central hub 625 is coupled, the eccentric hub can rotate about the central axis of the central hub 625, which can laterally adjust the position of the substrate 601. The eccentric hub can further rotate in a first direction or relative to the central hub in a second direction opposite to the first direction of rotation of the central hub. When the rotation of the eccentric hub, which can be coupled to the end effector, is coordinated with a correction rotation (such as a smaller rotation relative to the rotation of the eccentric hub), a substantially linear translation of the substrate along a radius from the central axis of the central hub can be performed, as shown. When used in conjunction with rotational translation, linear translation can allow for both movement between substrate supports for multiple substrates and centering of substrates on the substrate supports. When staggered lift pins are incorporated into the system, as further described below, each substrate can be individually centered before being transferred to the substrate support.

[0079] As previously mentioned, a substrate processing system according to embodiments of the present technology may have a monitoring and alignment system including an alignment hub 650 positioned between each pair of substrate supports, such as Figure 6E 654. The transfer area housing 605 may be provided with a plurality of support arms 652, 654. The plurality of support arms 652, 654 may be provided with a plurality of support arms 652, 654. The plurality of support arms 652, 654 may be provided with a plurality of support arms 652, 654. The plurality of support arms 652, 654 may be provided with a plurality of support arms 652, 654. The plurality of support arms 652, 654 may be provided with a plurality of support arms 652, 654. The plurality of support arms 652, 654 may be provided with a plurality of support arms 652, 654. The plurality of support arms 652, 654 may be provided with a plurality of support arms 652, 654. The plurality of support arms 652, 654 may be provided with a plurality of support arms 652, 654. The plurality of support arms 652, 654 may be provided with a plurality of support arms 652, 654. The plurality of support arms 652, 654 may be provided with a plurality of support arms 652, 654.

[0080] In some embodiments, a selective alignment operation may be performed on each substrate at optional operation 530. Figure 6F As shown, the substrate can be transferred to the alignment hub 650, which can be facilitated by the profile of the arm 637 or the end effector 635 and the vertical length of the end pieces 640, 642. As shown, the end pieces 640, 642 can extend a vertical distance from the arm 637, which allows the substrate to be lifted between the shelf portion and the arm for alignment. Thus, the end effector can be held in place during the alignment operation. In different embodiments, the alignment hub 650 can be raised to transfer the substrate, or the substrate can be lowered to the alignment hub 650. In any case, depending on how many substrates are to be translated, one or more aligners can accommodate the substrate and support the substrate between the end piece and the arm of the end effector. Alignment adjustments can be performed and the transfer device can reengage the substrate.

[0081] Additionally, in some embodiments, the end effector can be laterally adjusted during alignment to perform centering operations. For example, once transferred to the alignment hub 650, the transfer equipment can be adjusted to accommodate offset errors. In some embodiments, the alignment hubs can be vertically offset from each other to accommodate unusual drops and pickups of substrates for alignment and centering. Thus, in some embodiments, the vertical distance between the shelf of the end effector end piece and the surface of the arm from which the end piece extends can accommodate staggered heights between the highest and lowest alignment hub positions during alignment operations or transfers. This can accommodate any number of substrates and, in some embodiments, can facilitate centering during wafer pickup, although in some embodiments, centering can also be performed prior to transfer of each substrate.

[0082] After the alignment operation, or if alignment is not performed, the transport apparatus can continue to rotate the substrate toward the second substrate support to which the substrate is to be transferred. Once the substrate is placed on the second substrate support within the transfer area, the substrate can be transferred to the support or associated lift pins at operation 535 by reversing the previously performed engagement process. Once transferred, the transport apparatus can separate the substrate from the transport apparatus. Again, the substrate and / or substrate support can be lowered by the transport apparatus, or lift pins of the substrate support can engage the substrate to receive the substrate from the transport apparatus. The end effector can then be rotated away from the substrate, which can then continue to be processed or transferred from the transfer area.

[0083] 7A to 7BA schematic diagram illustrating a substrate being laterally translated using a transfer apparatus 700 in accordance with some embodiments of the present technology. The transfer apparatus 700 is included as a simplified illustration of the operation of one possible embodiment of an eccentric drive system of the present technology and is not intended to limit the present technology. The transfer apparatus 700 may illustrate any transfer apparatus discussed elsewhere and may include any components as previously discussed. Although the transfer apparatus 700 is shown with a single substrate, it should be understood that any number of substrates may be coupled to the end effector, as previously described.

[0084] like Figure 7A As shown, the base plate 701 can be coupled to an end effector 735, which can be coupled to an eccentric hub 730, which can cooperate with the central hub 725. When the central hub 725 and the eccentric hub 730 rotate at a fixed rotational ratio, such as to maintain the position of the eccentric hub 730 relative to the central hub 725 relative to the base plate 701, the base plate 701 can rotate about the central axis of the central hub 725, such as around a transfer area, as previously described.

[0085] When the eccentric hub 730 rotates at a faster or slower rotation rate or ratio relative to the central hub 725, the eccentric hub 730 may rotate about the central axis along the eccentric axis. Figure 7B The eccentric hub is shown rotated to the opposite side of the central axis, which produces a lateral translation of the substrate equal to twice the eccentric offset distance between the central axis of the eccentric hub and the central axis of the central hub. When the central hub performs a corrective rotation during the transfer of the eccentric hub, the rotational position of the substrate 701 can be maintained, and any distance along this eccentric length can be linearly accommodated with reduced eccentric movement.

[0086] Figure 8 A schematic cross-sectional elevation view of an exemplary transfer region of a substrate processing system 800 is shown, in accordance with some embodiments of the present technology. Figure 8 A staggered lift pin configuration as previously described is shown and can be included in any transfer chamber or substrate processing system described previously. For example, any of the previously described lift pins can include staggered height lift pins as shown. The substrate processing system 800 can include any of the components, configurations, and features of any of the previously described embodiments, and similarly, any of the previously described systems can include the illustrated lift pin configuration. The system 800 can include a plurality of substrates 801 positioned on respective sets of lift pins 805 within a chamber, and can further include a transfer apparatus 820 that can include features of any of the previously described transfer apparatuses, including an arm 835 extending from the transfer apparatus.

[0087] Lift pins 805 may be a group of pins extending from substrate support 810 to provide access for transporting or retrieving substrates 801, and each group may include any number of pins to accommodate the substrates. As shown, lift pin groups 805 are staggered at four different heights, which may allow for individual transport and retrieval of substrates. For example, lift pins 805a may extend a first vertical length above the substrate support. Lift pins 805b may extend a second vertical length above substrate support 810b, shown in cross-section, and may conceal the substrate support from which lift pins 805a extend, although the substrate support may be aligned. As shown, the second vertical length may be less than the first vertical length.

[0088] Additionally, lift pins 805c can extend a third vertical length from substrate support 810c, and the third vertical length can be less than the second vertical length. Finally, lift pins 805d can extend a fourth vertical length from the associated substrate support, which can be concealed by and aligned with substrate support 810c. The fourth vertical length can be less than the third vertical length. By staggering the heights of the lift pin groups, each substrate can be individually adjusted before transporting or retrieving it. For example, when arranged on associated lift pins, substrate 801a can be accessed above substrate 801b, substrate 801b can be accessed above substrate 801c, and substrate 801c can be accessed above substrate 801d.

[0089] The present technology includes substrate processing systems that can accommodate additional substrate supports that, as previously described, may not be accessible by a centrally located transfer robot. By incorporating transfer apparatus according to embodiments of the present technology, multiple substrate supports can be utilized and accessed during substrate processing. When the transfer apparatus includes an eccentric drive operating in conjunction with a central rotary drive, lateral translation can be provided in addition to rotational translation. Furthermore, when utilizing end effectors according to some embodiments of the present technology, movements to engage, transfer, and disengage a substrate can all be performed along the outer edge of the substrate, which can help avoid lift pins along the interior of the substrate support.

[0090] In the foregoing description, for purposes of explanation, numerous details have been set forth in order to provide an understanding of various embodiments of the present technology. However, it will be apparent to one skilled in the art that certain embodiments may be practiced without some of these details or with additional details.

[0091] Several embodiments have been disclosed, and those skilled in the art will recognize that various modifications, alternative configurations, and equivalents may be used without departing from the spirit of the embodiments. In addition, many well-known processes and components have not been described to avoid unnecessarily obscuring the present technology. Therefore, the above description should not be considered to limit the scope of the present technology. In addition, methods or processes may be described as sequential or step-by-step, but it should be understood that the operations may be performed simultaneously or in an order different from that listed.

[0092] Where a range of values ​​is provided, it is understood that, unless the context clearly indicates otherwise, each intermediate value between the upper and lower limits of the range, to the smallest fraction of the unit of the lower limit, is also explicitly disclosed. Any narrower range between any described value or undescribed intermediate value within the described range and any other described or intermediate value within the described range is encompassed. The upper and lower limits of these smaller ranges may independently be included in or excluded from the range, and each range in which one, none, or both of the limits are included in the smaller range is also encompassed within the present technology, for any explicitly excluded limits within the described range. Where the range includes one or both of the limits, ranges excluding one or both of those included limits are also encompassed.

[0093] As used herein and in the appended claims, the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, reference to "a substrate" includes a plurality of such substrates, and reference to "the arm" includes one or more arms and equivalents thereof known to those skilled in the art, and so forth.

[0094] Furthermore, when used in this specification and the appended claims, the terms “comprise(s),” “comprising,” “contain(s),” “containing,” “include(s),” and “including” are intended to specify the presence of stated features, integers, components, or operations, but they do not preclude the presence or addition of one or more other features, integers, components, operations, acts, or groups.

Claims

1. A substrate processing system, comprising: a transfer area housing defining a transfer area fluidly coupled to the plurality of processing areas, wherein sidewalls of the transfer area housing define sealable access for providing and receiving substrates; a plurality of substrate supports disposed within the transfer area; and A transmission device, comprising: a central hub comprising a first shaft and a second shaft extending about and concentric with the first shaft, wherein the second shaft is counter-rotatable with respect to the first shaft, and wherein the central hub features a central axis, wherein each of the plurality of substrate supports is in a fixed horizontal position relative to the central hub, an eccentric hub extending at least partially through the central hub, wherein the eccentric hub is radially offset from the central axis of the central hub, and wherein the eccentric hub is coupled to the first axis of the central hub, and An end effector is coupled to the eccentric hub, the end effector comprising a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports.

2. The substrate processing system of claim 1 , wherein one or more linkages couple the eccentric hub to the first shaft of the central hub, and wherein the one or more linkages comprise one or more belts extending around the first shaft or the eccentric hub or a plurality of gears coupled between the first shaft and the eccentric hub.

3. The substrate processing system of claim 1, wherein the end effector further comprises a plurality of end pieces configured to support a substrate.

4. The substrate processing system of claim 3, wherein each end piece extends vertically to a similar plane extending orthogonally to the central hub.

5. The substrate processing system of claim 3, wherein each arm comprises a first end piece and a second end piece of the plurality of end pieces, the first end piece and the second end piece being configured to support a substrate during movement of the end effector.

6. The substrate processing system of claim 3, wherein each first end piece and each second end piece defines a recessed ledge and a shelf.

7. The substrate processing system of claim 1, wherein the central hub is vertically translatable along a central axis of the central hub.

8. A method for transferring a substrate, the method comprising: A substrate is received at a first substrate support within a transfer area of ​​a substrate processing system, the substrate processing system including a transfer apparatus within the transfer area, the transfer apparatus comprising: a central hub including a first shaft and a second shaft extending about and concentric with the first shaft, an eccentric hub extending at least partially through the central hub, wherein the eccentric hub is radially offset from a central axis of the central hub, and wherein the eccentric hub is coupled to the first shaft of the central hub, and an end effector coupled to the eccentric hub, the end effector comprising a plurality of arms; engaging the substrate with an arm of the plurality of arms; rotating the second shaft in a first direction about a central axis of the central hub; rotating the first shaft in the first direction about the central axis of the central hub at a fixed ratio to the second shaft to radially reposition the substrate along the central axis within the transfer area; and The substrate is transported to a second substrate support within the transfer region of the substrate processing system, wherein each of the first substrate support and the second substrate support is in a fixed horizontal position relative to the central hub.

9. The method of transferring a substrate according to claim 8, further comprising: The transfer apparatus is translated by further rotating the first shaft about the central axis in the first direction or a second direction opposite the first direction at a rate that increases from the fixed ratio to laterally reposition the substrate along a radius extending from the central axis within the transfer area.

10. The method of transferring a substrate according to claim 8, further comprising: The substrate is then engaged and lifted from the first substrate support by vertically translating the transfer apparatus within the transfer region of the substrate processing system.

11. The method of transferring a substrate according to claim 8, further comprising: The substrate is then engaged such that the first substrate support is recessed from the substrate.

12. The method for transferring a substrate according to claim 8, wherein: Each arm of the end effector includes a first end piece and a second end piece, and wherein each first end piece and each second end piece define a recessed ledge and a shelf, and wherein engaging the substrate includes: rotating the arm across the substrate to position the substrate between the arm and the shelf of the first end piece and the shelf of the second end piece.

13. The method of transferring a substrate according to claim 8, further comprising: Prior to transferring the substrate to the second substrate support, the substrate is transferred to an alignment hub located between the first substrate support and the second substrate support.

14. A substrate processing system comprising: a transfer area housing defining a transfer area fluidly coupled to the plurality of processing areas, wherein sidewalls of the transfer area housing define sealable access for providing and receiving substrates; a plurality of substrate supports disposed within the transfer area; and A conveying device, the conveying device is located in the conveying area, and the conveying device includes: a central hub comprising a first shaft and a second shaft extending about the first shaft, wherein the second shaft is counter-rotatable with respect to the first shaft, and wherein the central hub features a central axis, wherein each of the plurality of substrate supports is in a fixed horizontal position relative to the central hub, an eccentric hub extending at least partially through the central hub, wherein the eccentric hub is radially offset from the central axis of the central hub, and wherein the eccentric hub is coupled to the first axis of the central hub with one or more linkages, and An end effector is coupled to the eccentric hub, the end effector comprising a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports.

15. The substrate processing system of claim 14 , wherein the end effector further comprises a plurality of end pieces configured to support a substrate, wherein each end piece extends vertically to a similar plane extending orthogonally to the central hub, and wherein each arm comprises a first end piece and a second end piece of the plurality of end pieces, the first end piece and the second end piece configured to support a substrate during movement of the end effector.

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