Method for manufacturing a plate-shaped object and plate-shaped object

Abstract

Provided is a method of manufacturing a plate-shaped object and a plate-shaped object that have both strength and bendability in a hard plate-shaped object. A method of manufacturing a plate-shaped object that can be bent by an external force by processing a plate-shaped workpiece formed of a hard material using a pulsed laser beam having a wavelength that transmits the workpiece has a shield tunnel forming step of forming a plurality of shield tunnels in a first shield tunnel region having a first length in a first processing predetermined region that is linear and provided on one face of the workpiece, and an etching step of etching the shield tunnels using an etchant, in which a plurality of shield tunnels are formed in a second shield tunnel region having a second length in a second processing predetermined region that is linear and different from the extension line of the first processing predetermined region and adjacent to the first processing predetermined region on the one face.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a plate-shaped object that can be bent by external force by processing a plate-shaped workpiece formed of a hard material using a laser beam, and to a hard plate-shaped object formed of a hard material that can be bent by external force. Background Technology

[0002] In recent years, portable terminals with flexible displays have attracted much attention (see, for example, Patent Document 1). The front of such a flexible display is protected by covering it with a transparent rigid film or the like made of resin (see, for example, Patent Document 2).

[0003] However, resin-based hard films are prone to scratches and deterioration over time. To address this issue, one approach is to consider using a plate-like structure made of hard materials such as glass to protect the front surface.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2015-226204

[0005] Patent Document 2: Japanese Patent Application Publication No. 2019-206166

[0006] However, when glass sheets are formed to a thin enough thickness to bend, their strength is insufficient. Conversely, when glass sheets are formed to a thickness sufficient to ensure strength, it is difficult to bend them. Summary of the Invention

[0007] The present invention was made in view of this problem and aims to combine strength and flexibility in rigid plates.

[0008] According to one aspect of the present invention, a method for manufacturing a plate-like object is provided, wherein a plate-like workpiece formed of a hard material is processed using a pulsed laser beam having a wavelength that transmits through the workpiece, thereby manufacturing a plate-like object capable of being bent by external force. The method comprises the following steps: a shield tunnel forming step, wherein the workpiece is irradiated with the laser beam while the focal point of the laser beam is positioned inside the workpiece, thereby forming a plurality of shield tunnels in the workpiece, each of the plurality of shield tunnels comprising a fine hole formed along the thickness direction of the workpiece and a modified region surrounding the sides of the fine hole; and an etching step, wherein the plurality of shield tunnels are etched using an etchant. In this shield tunnel forming step, multiple shield tunnels are formed in a first shield tunnel region, which has a first length along a linear first processing predetermined area set on one face of the workpiece. In a second shield tunnel region, multiple shield tunnels are formed, which has a second length along a linear second processing predetermined area. The second processing predetermined area is set on one face in a region that is different from the extension line of the first processing predetermined area and adjacent to the first processing predetermined area. When the workpiece is viewed from the first processing predetermined area toward the second processing predetermined area, the second shield tunnel region partially overlaps with the first shield tunnel region.

[0009] Preferably, the shield tunnel forming step includes the following steps: a first shield tunnel forming step, in which the irradiated area and the non-irradiated area of ​​the laser beam are alternately formed, thereby forming a plurality of first shield tunnel areas separated by a first interval along the first processing predetermined area; and a second shield tunnel forming step, in which the irradiated area and the non-irradiated area are alternately formed, thereby forming a plurality of second shield tunnel areas separated by a second interval along the second processing predetermined area.

[0010] Preferably, the workpiece is made of glass.

[0011] The preferred method for manufacturing the plate-like object further includes a filling step: after the etching step, resin is filled into the space formed in the first shield tunnel region and the second shield tunnel region.

[0012] According to another aspect of the invention, a plate-like structure is provided, which is formed of a rigid material and is bendable by an external force, wherein the plate-like structure has: a first shield tunnel region having a plurality of shield tunnels, each of the plurality of shield tunnels comprising a fine hole formed along the thickness direction of the plate-like structure, the first shield tunnel region having a first length along a linear first processing predetermined region disposed on one face of the plate-like structure; and a second shield tunnel region having a plurality of shield tunnels, the second shield tunnel region having a second length along a linear second processing predetermined region, the second processing predetermined region being disposed on the one face in a region different from and adjacent to the extension line of the first processing predetermined region, wherein when the plate-like structure is viewed in a direction from the first processing predetermined region toward the second processing predetermined region, the first shield tunnel region and the second shield tunnel region partially overlap.

[0013] One aspect of the present invention provides a method for manufacturing a plate-like object, comprising a shield tunnel forming step. In the shield tunnel forming step, a plurality of shield tunnels are formed in a first shield tunnel region having a first length along a linear first predetermined processing area defined on a face of the workpiece. In a second shield tunnel region, a plurality of shield tunnels are formed along a linear second predetermined processing area having a second length, the second predetermined processing area being defined on a face in a region different from and adjacent to the extension line of the first predetermined processing area.

[0014] When viewing the workpiece in the direction from the first predetermined processing area to the second predetermined processing area, the first shield tunnel area and the second shield tunnel area partially overlap. Therefore, the plate-like material can deform along the direction from the first predetermined processing area to the second predetermined processing area. Furthermore, the thickness of the workpiece remains unchanged before and after the shield tunnel forming step. Thus, the plate-like material can possess both strength and flexibility. Attached Figure Description

[0015] Figure 1 This is a 3D view of a laser processing device.

[0016] Figure 2 This is a flowchart illustrating a method for manufacturing a plate-shaped object.

[0017] Figure 3 (A) is a partial cross-sectional side view of the workpiece before laser processing. Figure 3 (B) is a partial cross-sectional side view of the workpiece after laser processing.

[0018] Figure 4 (A) is a perspective view showing the structure of a shield tunnel. Figure 4(B) is a cross-sectional view of a portion of the workpiece, showing multiple shield tunnels.

[0019] Figure 5 (A) is a diagram illustrating the first shield tunnel formation step. Figure 5 (B) is a diagram showing the second shield tunnel formation step.

[0020] Figure 6 It is a top view of the workpiece after the shield tunnel formation process.

[0021] Figure 7 This is a diagram illustrating the etching process.

[0022] Figure 8 It is a cross-sectional view of a plate-like object filled with resin.

[0023] Figure 9 (A) is an overall image showing one side of the plate-like object. Figure 9 (B) is an image obtained by magnifying one corner of the plate-like object.

[0024] Figure 10 It is an image of a person bending a plate-like object using their hand.

[0025] Figure 11 This is an image showing the situation of a three-point bending test.

[0026] Figure 12 (A) is a graph showing the curve of the first experiment. Figure 12 (B) is a graph showing the curve of the second experiment. Figure 12 (C) is a graph showing the results of the third experiment.

[0027] Figure 13 (A) is a top view of the workpiece after the shield tunnel formation step in the second embodiment. Figure 13 (B) is a top view of the workpiece after the shield tunnel formation step in the third embodiment.

[0028] Label Explanation

[0029] 2: Laser processing device; 4: Chuck table; 4a: Holding surface; 6: Laser beam irradiation unit; 8: Housing; 10: Processing head; 11: Workpiece; 11a: One surface; 11b: Another surface; 11c: First predetermined processing area; 11d: Second predetermined processing area; 11e: Shield tunnel; 11g: Modified area; 11h: Fine hole; 12: Imaging unit; 13: Adhesive tape; 14: Container; 14a: Support component; 15: Frame; 16: Etching agent; 17: Workpiece unit; 19a: First shield tunnel area; 19b: First non-processing area; 21a: Second shield tunnel area; 21b: Second non-processing area; 20: Test device; 22: Support; 24: Pressure head; 23: Plate; 25: Resin; 27: Deflection; 29: Distance; L: Laser beam; L A L B : Length; L C Spacing; L D : Overlap length; P: Focus point; R A : Irradiation area; R B : Non-irradiated area; Φ A Φ B :diameter. Detailed Implementation

[0030] A first embodiment of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a perspective view of the laser processing device 2. Additionally, in the following text, the X-axis (processing feed direction), Y-axis (indexing feed direction), and Z-axis (height direction, vertical direction) are mutually perpendicular.

[0031] The laser processing apparatus 2 has a chuck table 4. An output shaft of a rotary drive source (not shown) such as an electric motor is connected below the chuck table 4. The output shaft is configured to be approximately parallel to the Z-axis direction, allowing the chuck table 4 to rotate around the output shaft when the rotary drive source is activated.

[0032] Below the rotary drive source is a ball screw-type Y-axis traversing unit (not shown) that moves the rotary drive source and the chuck table 4 in the Y-axis direction. This Y-axis traversing unit is mounted on a ball screw-type X-axis traversing unit (not shown).

[0033] The X-axis moving unit causes the Y-axis moving unit, the rotary drive source, and the chuck table 4 to move along the X-axis direction. The chuck table 4 has a disc-shaped frame (not shown) made of metal.

[0034] A disc-shaped recess is formed in the upper part of the frame, and a disc-shaped porous plate made of porous ceramic is fixed in the recess. The porous plate is connected to an attraction source (not shown) such as an injector through a flow path (not shown) formed inside the frame.

[0035] The negative pressure generated by the suction source is transmitted to the upper surface of the perforated plate through the flow path. The upper surface of the perforated plate and the upper surface of the frame are approximately flush, serving as a retaining surface 4a that is approximately parallel to the XY plane (see reference). Figure 3 (A) etc.) play a function.

[0036] The workpiece 11 is formed from a hard material that is transparent to visible light. In this embodiment, the workpiece 11 is formed from quartz glass. However, the workpiece 11 can be formed from various types of glass, including borosilicate glass, aluminosilicate glass, soda-lime glass, alkali-free glass, and other optical glasses.

[0037] In addition to glass, the workpiece 11 can also be formed from a crystalline material (crystal, sapphire, etc.) that is transparent to visible light wavelengths. The workpiece 11 is, for example, a rectangular plate with a long side of 40 mm, a short side of 10 mm, and a thickness of 1 mm. Furthermore, the thickness of the workpiece 11 is appropriately set according to the desired strength.

[0038] On one surface 11a of the workpiece 11, multiple predetermined processing areas in the form of lines (straight lines, curves, or line segments) are respectively set in a predetermined direction. In addition, each predetermined processing area can be preset in the design data read by the laser processing device 2, or it can be set imaginarily in the shooting field of the camera, etc.

[0039] In this embodiment, the multiple processing predetermined areas include a first processing predetermined area 11c and a second processing predetermined area 11d, which are respectively straight lines extending from one side of the long side of the workpiece 11 to the other side and along the short side (see reference). Figure 6 (etc.). The first processing predetermined area 11c and the second processing predetermined area 11d are set to be separated from each other by a predetermined distance in the long side direction of the workpiece 11.

[0040] That is, the second processing predetermined area 11d is not on the extension line of the first processing predetermined area 11c, but is adjacent to the first processing predetermined area 11c in a direction perpendicular to the first processing predetermined area 11c (see reference). Figure 6 (etc.). The distance (spacing) between the first processing predetermined area 11c and the second processing predetermined area 11d is set to a specified value of 10 μm or more and 1000 μm or less, for example.

[0041] When performing laser processing on the workpiece 11, as a preparation, an adhesive tape (scribing tape) 13 with a diameter larger than that of the workpiece 11 and formed of resin is attached to the other side 11b of the workpiece 11.

[0042] Additionally, a ring-shaped frame 15 made of metal is attached to the outer periphery of the adhesive tape 13. This forms a workpiece unit 17, in which the workpiece 11 is supported by the frame 15 via the adhesive tape 13.

[0043] A laser beam irradiation unit 6 is disposed above the holding surface 4a that attracts and holds the workpiece 11. The laser beam irradiation unit 6 has a cylindrical housing 8 disposed approximately parallel to the Y-axis direction.

[0044] A Z-axis moving unit (not shown) is connected to a portion of the housing 8. The height of the housing 8 is adjusted via the Z-axis moving unit. The laser beam irradiation unit 6 has a laser oscillator (not shown) that oscillates to produce laser light.

[0045] The laser oscillator, for example, comprises a rod-shaped laser medium formed of Nd:YAG or Nd:YVO4. The laser oscillator emits a pulsed laser beam having a wavelength (e.g., 1030 nm, 1064 nm, etc.) that penetrates the workpiece 11.

[0046] The laser beam is incident on an acousto-optic modulator (not shown; hereinafter abbreviated as AOM based on the initials of Acousto-Optic Modulator). The AOM blocks the laser beam from irradiating the workpiece 11 at predetermined time intervals, thereby allowing the irradiation period and non-irradiation period of the laser beam to be set alternately.

[0047] In this way, the irradiation period and the non-irradiation period of the laser beam are repeated alternately. The laser beam irradiates the holding surface 4a approximately perpendicularly from the condenser lens located in the processing head 10 at the front end of the laser beam irradiation unit 6.

[0048] like Figure 3 As shown in (A), the focal point P of the laser beam L irradiated from the processing head 10 is positioned at a predetermined depth of the workpiece 11. If the focal point P and the workpiece 11 held by the holding surface 4a are moved relative to each other in the X-axis direction, the workpiece 11 is processed along the moving path of the focal point P.

[0049] Based on the alternating irradiation and non-irradiation periods of the laser beam L, irradiation areas R are alternately formed on the workpiece 11 along the moving path of the focal point P. A Non-irradiated area R B (Refer to Figure 3 (B)

[0050] Irradiation area R A With non-irradiated area R B The ratio (i.e., R) A / R BFor example, it can be adjusted to a specified value of 1 or higher and 3 or lower. However, this ratio can be appropriately set by adjusting the action of AOM.

[0051] like Figure 1 As shown, an imaging unit 12 is arranged near the processing head 10. The imaging unit 12 includes an objective lens, an image sensor (neither shown), etc. The imaging unit 12, for example, takes an image of the workpiece 11 held on the holding surface 4a.

[0052] The images obtained by taking pictures are used to determine the first predetermined processing area 11c and the second predetermined processing area 11d, and the irradiation area R. A Non-irradiated area R B The determination of the laser beam L's irradiation position, the positioning of the workpiece 11, etc.

[0053] The laser processing apparatus 2 has a control unit (not shown) that controls the movements of the X-axis moving unit, Y-axis moving unit, rotary drive source, chuck table 4, Z-axis moving unit, laser oscillator, AOM, and imaging unit 12.

[0054] The control unit may be composed of, for example, a computer, which includes: a processor (processing device) represented by a CPU (Central Processing Unit); main storage devices such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), and ROM (Read Only Memory); and auxiliary storage devices such as flash memory, hard disk drives, and solid-state drives.

[0055] The auxiliary storage device stores software containing a prescribed program. The control unit's functions are achieved by causing the processing device or similar equipment to operate according to this software. The control unit includes an input section (not shown) for inputting design data.

[0056] The design data is data showing the laser processing area of ​​the workpiece 11, and may be composed of, for example, CAD (Computer-Aided Design) data. The control unit controls the movement of the AOM, chuck table 4, etc., based on the design data input to the input unit, thereby performing laser processing on the workpiece 11.

[0057] Next, refer to Figures 2 to 7 A plate-shaped object 23 that can be bent by external force is manufactured by processing the workpiece 11 using a laser beam L (see reference). Figure 6 , Figure 7 The manufacturing method of (etc.) will be explained. Figure 2 This is a flowchart illustrating the manufacturing method of the plate-shaped object 23.

[0058] In this embodiment, the workpiece unit 17 is first held using the holding surface 4a (holding step S10) (see reference). Figure 3 (A)). Figure 3 (A) is a partial cross-sectional side view of the workpiece 11 before laser processing, taken with the side of the short side of the workpiece 11 being observed.

[0059] After step S10, the workpiece 11 is irradiated with a laser beam L, thereby forming multiple shield tunnels in the workpiece 11 (shield tunnel forming step S20). In shield tunnel forming step S20, the rotation angle of the chuck table 4 is first appropriately adjusted, and the focusing point P is positioned on the extension line of the predetermined processing area.

[0060] Furthermore, the Z-axis moving unit and other components are activated to position the focusing point P inside the workpiece 11. In this state, when the chuck table 4 moves along the X-axis, laser processing is performed on the workpiece 11 along the predetermined processing area.

[0061] Figure 3 (B) is a partial cross-sectional side view of the workpiece 11 after laser processing, taken with the side of the short side of the workpiece 11 as observed. In the irradiation area R... A Multiple shield tunnels 11e are formed in the middle, and the irradiation area R A This becomes the first shield tunnel area 19a. In contrast, in the non-irradiated area R... B No shield tunnel was formed in section 11e. Non-irradiated area R B It becomes the first non-processing area 19b.

[0062] Figure 4 (A) is a perspective view showing the structure of a shield tunnel 11e. Figure 4 (B) is a cross-sectional view of a portion of the workpiece 11, showing multiple shield tunnels 11e. Additionally, in Figure 4 (A) and Figure 4 In (B), a portion of the workpiece 11 is omitted in the thickness direction.

[0063] Each shield tunnel 11e has a fine hole 11h formed along the thickness direction of the workpiece 11. The fine hole 11h is a generally cylindrical, elongated space, for example, the diameter Φ of the fine hole 11h is... A Approximately 1 μm. The fine holes 11h typically penetrate the workpiece 11 in the thickness direction.

[0064] The shield tunnel 11e also has a modified region 11g formed around the sides of the orifice 11h. The modified region 11g is a generally cylindrical region, for example, the diameter Φ of the modified region 11g is... B It is a specified value of 5μm or more and 20μm or less.

[0065] The modified region 11g is a region whose structure, density, etc. have changed compared to the first unprocessed region 19b that is not irradiated by the laser beam L. For example, compared to the first unprocessed region 19b, the modified region 11g has weaker resistance to etchants.

[0066] Multiple shield tunnels 11e are formed along the first pre-defined processing area 11c. The modification areas 11g of two adjacent shield tunnels 11e are, for example, as shown in... Figure 4 They are interconnected as shown in (B), but the two modified regions 11g can also be separated from each other.

[0067] In the shield tunnel forming step S20, a laser beam L is irradiated along the first predetermined processing area 11c, thereby... Figure 5 As shown in (A), multiple first shield tunnel regions 19a are formed, separated by the first non-processing region 19b (first shield tunnel formation step S22).

[0068] Figure 5 (A) is a diagram showing the first shield tunnel forming step S22. In the first shield tunnel forming step S22, the formation of the first shield tunnel region 19a begins along the first processing predetermined region 11c, with a point on the long side of the workpiece 11 as the starting point.

[0069] The length L of the first shield tunnel region 19a along the first pre-processed region 11c (the first length) A The length L of the first non-processed area 19b along the first pre-processed area 11c (first interval) B The ratio (i.e., L) A / L B ) and (R A / R B )same.

[0070] After the first shield tunnel formation step S22, the chuck table is fed at a specified interval L by 4 indexing steps. C (Refer to Figure 5 (B)) Position the focal point P of the laser beam L in the second predetermined processing area 11d.

[0071] Furthermore, a laser beam L is irradiated along the second predetermined processing area 11d, thereby... Figure 5As shown in (B), multiple second shield tunnel regions 21a are formed by separating the second non-processing region 21b (second shield tunnel formation step S24).

[0072] Figure 5 (B) is a diagram showing step S24 of the second shield tunnel formation. Similar to the first shield tunnel region 19a, the second shield tunnel region 21a also has multiple shield tunnels 11e.

[0073] The length (second length) of the second shield tunnel region 21a along the second pre-processed region 11d. A The length L of the second non-processed area 21b along the second pre-processed area 11d (the second interval) B The ratio (L) A / L B ) and (R A / R B )same.

[0074] Furthermore, in this embodiment, the starting position of the formation of the second shield tunnel region 21a is offset from that of the first shield tunnel region 19a in the short side direction. Therefore, the second shield tunnel region 21a, located near the long side, is shorter than the first shield tunnel region 19a.

[0075] However, in this embodiment, the length of the second shield tunnel region 21a does not refer to the length of the second shield tunnel region 21a connected to the long side, but rather to the length of the second shield tunnel region 21a not connected to the long side.

[0076] By shifting the starting position of the formation of the second shield tunnel region 21a in the short side direction, such as... Figure 5 As shown in (B), when viewing the workpiece 11 in the direction from the first predetermined processing area 11c toward the second predetermined processing area 11d, a first shield tunnel area 19a and a second shield tunnel area 21a partially overlap (overlap length L). D ).

[0077] In this embodiment, the second shield tunnel region 21a is configured such that, in the direction from the first processing predetermined region 11c to the second processing predetermined region 11d, the center of the second shield tunnel region 21a in the length direction coincides with the center of the first non-processing region 19b in the length direction.

[0078] Furthermore, in this embodiment, the first shield tunnel region 19a is configured such that, in the direction from the first pre-processed processing region 11c to the second pre-processed processing region 11d, the center of the first shield tunnel region 19a in the length direction coincides with the center of the second non-processed region 21b in the length direction.

[0079] The laser processing conditions in the first shield tunnel forming step S22 and the second shield tunnel forming step S24 are set as follows, for example.

[0080] Laser oscillator: Nd:YAG pulsed laser

[0081] Wavelength: 1030nm

[0082] Pulse energy: 60μJ

[0083] Machining feed rate: 100 mm / s

[0084] By repeatedly performing the first shield tunnel forming step S22 and the second shield tunnel forming step S24, multiple first shield tunnel regions 19a and multiple second shield tunnel regions 21a are alternately formed along the long side direction of the workpiece 11.

[0085] Figure 6 This is a top view of the workpiece 11 (i.e., plate 23) after the shield tunnel formation step S20. After laser processing, the plate 23 is peeled off from the adhesive tape 13, and wet etching is performed on the plate 23 (etching step S30).

[0086] Figure 7 This diagram illustrates etching step S30. In etching step S30, a container 14, for example, that is resistant to corrosion of the etchant 16 is used. A support member 14a for mounting the plate-like object 23 is provided at a predetermined height from the bottom surface of the container 14.

[0087] In this embodiment, the support member 14a is a metal wire mesh made of corrosion-resistant metal. In the container 14, an etchant 16 in the form of a liquid such as hydrofluoric acid or potassium hydroxide aqueous solution is filled to a predetermined height to fully immerse the support member 14a.

[0088] An ultrasonic transducer (not shown) is fixed to the bottom surface of the outer side of the container 14. The ultrasonic transducer imparts ultrasonic vibrations to the workpiece 11 placed on the support member 14a. Alternatively, the etchant 16 may be stirred, shaken, vibrated, heated, etc., either in place of or in conjunction with the application of ultrasonic vibrations.

[0089] In etching step S30, the plate 23 is immersed in a container 14 filled with etchant 16, and the modified regions 11g of each shield tunnel 11e are at least partially removed by etching with etchant 16. However, the thickness of the plate 23 remains unchanged at this time.

[0090] Etching conditions are set as follows. However, the immersion time can be appropriately changed depending on the concentration and temperature of the etchant 16, the presence or absence of ultrasonic vibration, etc.

[0091] Etching agent: hydrofluoric acid

[0092] Concentration: 38%

[0093] Temperature: Room temperature

[0094] Soaking time: 10 minutes

[0095] Ultrasonic vibration: present

[0096] In etching step S30, the modified region 11g is at least partially removed. As a result, the diameter Φ of the fine pore 11h is... A Enlarging or narrowing the hole 11h through the workpiece 11 in the thickness direction improves the flexibility of the plate 23 compared to before etching.

[0097] Thus, in this embodiment, the thickness of the plate 23 can be made to ensure strength, and the plate 23 can deform along the direction from the first predetermined processing region 11c to the second predetermined processing region 11d. Therefore, both the strength and flexibility of the plate 23 can be achieved.

[0098] Furthermore, although the degree of flexibility is smaller compared to the plate-shaped object 23 after etching step S30, the plate-shaped object 23 before etching step S30 also has a certain degree of flexibility. Therefore, it can be said that the plate-shaped object 23 before etching step S30 can also possess both strength and flexibility.

[0099] After etching step S30, plate 23 is removed from container 14 and resin 25 is filled into the spaces such as the pores 11h formed in the first shield tunnel region 19a and the second shield tunnel region 21a (filling step S40).

[0100] However, the filling step S40 is not a necessary step and can be omitted. In the filling step S40, a jig having a holding surface corresponding to the shape of the curved plate 23 is first used to directly attract and hold the other side 11b of the plate 23. Next, resin 25 is applied to the first shield tunnel region 19a and the second shield tunnel region 21a for filling.

[0101] As resin 25, a transparent natural or synthetic resin having a refractive index close to that of quartz glass (a specified value of 1.40 or higher and 1.55 or lower) can be used. For example, transparent and flexible silicone rubber, silicone resin, etc. can be used as resin 25.

[0102] Figure 8 This is a cross-sectional view of a plate-shaped structure 23 filled with resin 25 in the first shield tunnel area 19a. Additionally, in Figure 8The image shows a cross-section along the long side of the plate 23. By filling it with resin 25, the plate 23 achieves both strength and flexibility, and also reduces or eliminates the stripe patterns corresponding to the first shield tunnel region 19a and the second shield tunnel region 21a (see reference). Figure 9 (A) Figure 9 (B) Figure 10 ).

[0103] Alternatively, if it is not necessary to maintain the plate 23 in a form that can be bent into any shape, but the shape of the plate 23 can be fixed in a predetermined shape after bending, a transparent but low-flexibility polymethyl methacrylate or the like can be used as the resin 25.

[0104] Figure 9 Image (A) is an overall image showing one side 11a of the plate-like structure 23 after etching step S30 and before filling step S40. Additionally, Figure 9 (B) is an image obtained by magnifying a corner of one face 11a of the plate 23 after etching step S30 and before filling step S40.

[0105] Figure 10 It is an image of the plate-shaped object 23 bent by human hand after etching step S30 and before filling step S40. Figure 9 (A) Figure 9 (B) and Figure 10 The plate-shaped object 23 shown is Figure 6 The plate-shaped object 23 described in the text corresponds to this.

[0106] In the first embodiment, the first shield tunnel region 19a and the second shield tunnel region 21a partially overlap along the long side of the plate 23. This allows the thickness of the plate 23 to be sufficient to ensure strength, and also allows the plate 23 to bend along its long side. Therefore, the plate 23 possesses both strength and flexibility.

[0107] Next, a three-point bending test will be described using the test apparatus 20 on the plate 23 after etching step S30 and before filling step S40. Figure 11 This is an image showing a three-point bending test used to measure the deflection 27 of the plate 23.

[0108] In the three-point bending test, a plate-shaped object 23 with a long side of 42 mm, a short side of 10 mm, and a thickness of 1 mm was used. In addition, within a width of 4 mm in the central part of the short side of the plate-shaped object 23, multiple first shield tunnel regions 19a and multiple second shield tunnel regions 21a were formed along the long side rather than along the short side of the plate-shaped object 23.

[0109] Within a 3mm radius on either side of the shorter side of the plate 23, neither the first shield tunnel region 19a nor the second shield tunnel region 21a is formed. The length L of the first shield tunnel region 19a and the second shield tunnel region 21a is... A The specified value is 3mm or more and 7mm or less, length L B The overlap ratio is adjusted based on a specified value of 1.5mm or more but less than 2.5mm. Spacing L C Adjustments are made within the range of 100μm and 300μm.

[0110] In the three-point bending test, the distance 29 between the support points 22 of the two parts is first set to 4.0 mm. The plate 23 is placed on the two support points with the other side 11b facing upwards and the center of the short side of the plate 23 located between the support points. Then, the other side 11b of the plate 23 is pressed using a pressure head 24 with a radius of 0.30 mm at the front end.

[0111] At this time, the pressing force of the pressure head 24 is set to 1N, and the deflection 27 (i.e., bending amount) of the plate 23 is measured when the pressing force of 1N and the restoring force of the plate 23 that has undergone elastic deformation reach a state of equilibrium. Figure 12 (A) is a graph showing the first experiment measuring the deflection 27 of the plate 23.

[0112] exist Figure 12 In (A), the horizontal axis represents the overlap rate (%), and the vertical axis represents the deflection amount 27 (mm). In the plate 23 used in the first experiment, the spacing L was... C For 300μm, make the overlap length L D With length L A The proportion (L) D / L A ×100 (overlap rate) is above 16% and below 37%.

[0113] In the plate 23 used in the second experiment, the spacing L was... C The thickness is 200 μm, so that the overlap rate is above 8% and below 40%. Figure 12 (B) is a graph showing the second experiment measuring the deflection 27 of the plate 23. The horizontal and vertical axes are parallel to each other. Figure 12 (A) is the same.

[0114] In the plate 23 used in the third experiment, the spacing L was... C The thickness is 100 μm, so that the overlap rate is above 16% and below 37%. Figure 12 (C) is a graph showing the curves of the third experiment measuring the deflection 27 of the plate 23. The horizontal and vertical axes are parallel to... Figure 12 (A) is the same.

[0115] like Figure 12 (A) to Figure 12 As shown in (C), there is a trend that the higher the overlap rate, the greater the deflection 27 of the plate 23. Additionally, the spacing L... C The smaller the value, the greater the deflection 27 of the plate-like object 23 tends to be.

[0116] Furthermore, when the first shield tunnel region 19a and the second shield tunnel region 21a reach the long sides that are opposite each other on a rectangular face 11a, the plate 23 is more likely to bend.

[0117] Next, the second embodiment will be described. In the second embodiment, the workpiece is not a rectangular plate but a disc. The first predetermined processing area 11c and the second predetermined processing area 11d are curved (more specifically, concentric circles of different diameters), alternately set from the center of one surface 11a outwards (see reference). Figure 13 (A)).

[0118] That is, the second processing predetermined region 11d is adjacent to the first processing predetermined region 11c in a direction from the center of a surface 11a toward the outer periphery of the surface 11a. Next, the processing steps of the second embodiment will be described.

[0119] In the second embodiment, in the holding step S10, the center of one surface 11a of the workpiece is aligned with the rotation center of the holding surface 4a, and the holding surface 4a is used to attract and hold the other surface 11b side.

[0120] Next, the shield tunnel forming step S20 is performed. In the shield tunnel forming step S20 of the second embodiment, the control unit also controls the operation of AOM, chuck worktable 4, etc., according to the input design data.

[0121] In the first shield tunnel forming step S22, while the laser beam L is irradiated with the focusing point P positioned outside the center of a surface 11a at a predetermined distance, the chuck table 4 is rotated one revolution.

[0122] Next, in the second shield tunnel forming step S24, the focusing points P are arranged according to the spacing L C With the chuck stage 4 rotated one revolution while being irradiated by the laser beam L in its external configuration, the focusing point P is then further aligned with the spacing L. C With the shield tunnel positioned on the outside, the first shield tunnel formation step S22 is performed again.

[0123] In this way, the first shield tunnel forming step S22 and the second shield tunnel forming step S24 are repeated alternately multiple times. Figure 13(A) is a top view of the workpiece (i.e., plate 23) after the shield tunnel forming step S20 of the second embodiment.

[0124] Etching step S30 can be performed after shield tunnel formation step S20. For example... Figure 13 As shown in (A), the first shield tunnel region 19a and the second shield tunnel region 21a partially overlap in the radial direction of the plate 23.

[0125] In the second embodiment, the thickness of the plate 23 can be made to ensure strength, and the plate 23 can be bent radially. More specifically, one side 11a of the plate 23 can be bent convexly from the outer periphery toward the center. In this way, the plate 23 can have both strength and flexibility.

[0126] Next, the third embodiment will be described. In the third embodiment, the workpiece is disc-shaped, but the first predetermined processing area 11c and the second predetermined processing area 11d are not curved but rather continuous line segments corresponding to the multiple sides of the polygon, which differs from the second embodiment (see [reference]). Figure 13 (B)

[0127] In the third embodiment, the second predetermined processing region 11d is adjacent to the first predetermined processing region 11c in a direction from the center of a surface 11a toward the outer periphery of the surface 11a. Next, the processing steps of the third embodiment will be described.

[0128] In the holding step S10, with the center of one surface 11a of the workpiece approximately aligned with the rotation center of the holding surface 4a, the holding surface 4a is used to attract and hold the other surface 11b. Next, the shield tunnel forming step S20 is performed.

[0129] In the initial first shield tunnel forming step S22, while the focusing point P is positioned outside the center of a surface 11a at a predetermined distance, the focusing point P is moved along the four sides of the first processing predetermined area 11c of the square (first square) while the laser beam L is irradiated.

[0130] In the next initial second shield tunnel forming step S24, while the focus point P is positioned outside the first square, the laser beam L is irradiated and the focus point P is moved along the four sides of the second processing predetermined area 11d of the second square, which is larger than the first square.

[0131] In the next second first shield tunnel forming step S22, while the focusing point P is positioned outside the second square, the laser beam L is irradiated and the focusing point P is moved along the eight sides of the first processing predetermined area 11c of the first regular octagon, which is larger than the second square.

[0132] In the next second shield tunnel forming step S24, while the focusing point P is positioned on the outer side of the first regular octagon, the laser beam L is irradiated and the focusing point P is moved along the eight sides of the second processing predetermined area 11d of the second regular octagon, which is larger than the first regular octagon.

[0133] Thus, the first shield tunnel forming step S22 and the second shield tunnel forming step S24 are performed alternately multiple times. Furthermore, the centers of the aforementioned quadrilaterals and octagons coincide.

[0134] Figure 13 (B) is a top view of the workpiece (i.e., plate 23) after the shield tunnel forming step S20 in the third embodiment. The etching step S30 can be performed on the plate 23 after the shield tunnel forming step S20.

[0135] like Figure 13 As shown in (B), in the third embodiment, the first shield tunnel region 19a and the second shield tunnel region 21a also partially overlap in the direction from the first processing predetermined region 11c toward the second processing predetermined region 11d.

[0136] In the third embodiment, the thickness of the plate 23 can be made to ensure strength, and the plate 23 can be bent radially. More specifically, one side 11a of the plate 23 can be bent convexly from the outer periphery toward the center. In this way, the plate 23 can have both strength and flexibility.

[0137] Furthermore, the shapes of the first processing predetermined area 11c and the second processing predetermined area 11d are not limited to squares or regular octagons, but can also be any polygon with four or more vertices. In addition, the structure and method of the above embodiments can be appropriately modified and implemented as long as they do not depart from the scope of the present invention.

[0138] For example, the shapes of the workpiece 11 and the plate 23 are not limited to rectangles or circles, but can also be triangles, other polygons, or various other shapes. In addition, the shapes of the first predetermined processing area 11c and the second predetermined processing area 11d can be appropriately changed depending on the bending method of the plate 23.

[0139] Furthermore, since fine holes 11h are formed in the shield tunnel area of ​​the plate 23, the plate 23 can also be used as a transparent chuck worktable with an uneven surface that maintains the curved shape. Additionally, the plate 23 can also be used as the suction section of a conveying device that attracts and holds the conveyed object.

Claims

1. A method for manufacturing a plate-shaped object, comprising processing a plate-shaped workpiece formed of a rigid material using a pulsed laser beam having a wavelength that transmits through the workpiece, thereby manufacturing a plate-shaped object capable of being bent by external force, characterized in that, The method for manufacturing this plate-shaped object includes the following steps: The shield tunnel forming step involves irradiating the workpiece with the laser beam focused at its focal point inside the workpiece, thereby forming multiple shield tunnels in the workpiece. Each of the multiple shield tunnels includes a fine hole formed along the thickness direction of the workpiece and a modified region surrounding the side of the fine hole. as well as The etching step involves using an etchant to etch the multiple shield tunnels. The shield tunnel formation process includes the following steps: In the first shield tunnel forming step, a first irradiated area and a first unirradiated area of ​​the laser beam are alternately formed, thereby forming a plurality of first shield tunnel areas that extend along a linear first predetermined processing area set on a plane of the workpiece at first intervals. In the second shield tunnel forming step, a second irradiated area and a second unirradiated area of ​​the laser beam are alternately formed, thereby forming a plurality of second shield tunnel areas that extend along a linear second predetermined processing area adjacent to the first predetermined processing area on a plane and are separated by a second interval. When the workpiece is viewed from the first predetermined processing area toward the second predetermined processing area, each of the second shield tunnel areas partially overlaps with two adjacent first shield tunnel areas in the plurality of first shield tunnel areas and completely overlaps with the first non-irradiated area between the two adjacent first shield tunnel areas.

2. The method for manufacturing a plate-like object according to claim 1, characterized in that, The workpiece is made of glass.

3. The method for manufacturing a plate-like object according to claim 1, characterized in that, The method for manufacturing the plate-like object also includes the following filling step: after the etching step, resin is filled into the space formed in the first shield tunnel region and the second shield tunnel region.

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