Resin leakage prevention component, resin leakage prevention component supply mechanism, resin molding device and resin molded product manufacturing method

Abstract

The subject of the present invention is to provide a resin leakage prevention component that can prevent resin leakage without using a release film. The solution is a resin leakage prevention component 401, which is a resin leakage prevention component 401 used for a molding die 1000 for compression molding, characterized in that the molding die 1000 has a lower mold 200 and an upper mold 100, the lower mold 200 has a bottom part 202 and a side part 201, the space surrounded by the side part 201 and the bottom part 202 forms a mold cavity 204, the mold cavity 204 can accommodate a resin material 20a, the side part 201 can move up and down relative to the bottom part 202, and the resin leakage prevention component 401 is arranged on the peripheral portion of the upper surface of the bottom part 202 and arranged along the inner peripheral surface of the side part 201, so as to seal the gap between the side part 201 and the bottom part 202, and prevent the resin from leaking from the mold cavity 204 to the gap.

Description

Technical Field

[0001] The present invention relates to a resin leakage preventing component, a resin leakage preventing component supply mechanism, a resin molding device and a method for manufacturing a resin molded product. Background Art

[0002] In the production of resin molded products, compression molding (press molding) using a molding die is used (Patent Document 1, etc.).

[0003] Prior art literature

[0004] Patent Document 1: Japanese Patent Application Publication No. 09-239787 Summary of the invention

[0005] Problem that the invention aims to solve

[0006] During compression molding, resin may enter the gap between the molding dies (resin leakage). Once the resin leakage occurs, problems may arise, such as the need for frequent cleaning to remove the resin that has entered the gap between the molding dies. In order to prevent the resin leakage, a release film may be used to cover the mold surface of the molding die.

[0007] However, when using a mold release film, there may be problems such as the mold release film cannot be stretched and set tightly to fit the mold surface of the molding die without wrinkles, the mold release film may tear after stretching, and wrinkles may be formed on the mold release film during mold closing and embed into the packaging surface (the surface of the resin molded product). These problems may occur especially when the mold cavity of the molding die is deep.

[0008] Therefore, an object of the present invention is to provide a resin leakage preventing member, a resin leakage preventing member supply mechanism, a resin molding apparatus, and a method for manufacturing a resin molded product, which can prevent resin leakage without using a mold release film.

[0009] Problem Solution

[0010] In order to achieve the above-mentioned object, the resin leakage prevention member of the present invention

[0011] It is a component used to prevent resin leakage in compression molding dies.

[0012] Features

[0013] The molding die comprises a lower die and an upper die.

[0014] The lower mold has a side part and a bottom part,

[0015] A mold cavity is formed by the space enclosed by the side member and the bottom member.

[0016] The mold cavity can contain resin material.

[0017] The side member can move up and down relative to the bottom member,

[0018] The resin leakage prevention member is arranged on the peripheral edge of the bottom member and along the inner peripheral surface of the side member, thereby sealing the gap between the side member and the bottom member to prevent resin from leaking from the cavity into the gap.

[0019] The resin leakage preventing member supplying mechanism of the present invention is a resin leakage preventing member supplying mechanism characterized by supplying the resin leakage preventing member of the present invention to the molding die.

[0020] The resin molding device of the present invention is characterized in that

[0021] A molding die for compression molding and a resin leakage prevention member supply mechanism according to the present invention are provided.

[0022] The molding die comprises a lower die and an upper die.

[0023] The lower mold has a side part and a bottom part,

[0024] A mold cavity is formed by the space enclosed by the side member and the bottom member.

[0025] The mold cavity can contain resin material.

[0026] The side member is movable up and down relative to the bottom member.

[0027] The method for producing a resin molded product of the present invention is a method for producing a resin molded product using a compression molding die and the resin leakage prevention member of the present invention.

[0028] Features

[0029] The molding die comprises a lower die and an upper die.

[0030] The lower mold has a side part and a bottom part,

[0031] A mold cavity is formed by the space enclosed by the side member and the bottom member.

[0032] The mold cavity can contain resin material.

[0033] The side member can move up and down relative to the bottom member,

[0034] The method for producing the resin molded product comprises:

[0035] a step of arranging a resin leakage prevention component, wherein the resin leakage prevention component is arranged along the inner peripheral surface of the side component to seal the gap between the side component and the bottom component to prevent the resin from leaking from the cavity into the gap;

[0036] a resin material supplying step, after the resin leakage preventing member arranging step, supplying the resin material into the cavity,

[0037] The resin molding step is to perform resin molding by compression molding using the molding die after the resin material supplying step.

[0038] Effects of the Invention

[0039] According to the present invention, a resin leakage preventing member, a resin leakage preventing member supply mechanism, a resin molding device, and a method for manufacturing a resin molded product that can prevent resin leakage without using a mold release film can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] [ Figure 1 ] Figure 1 The present invention is a cross-sectional view showing steps of an example of a method for producing a resin molded product using the resin leakage prevention member of the present invention and the resin molding apparatus using the member.

[0041] [ Figure 2 ] Figure 2 It is shown Figure 1 A plan view of an example of a lower mold and a resin leakage prevention component.

[0042] [ Figure 3 ] Figure 3 This is a cross-sectional view showing another example of a method for producing a resin molded product using the resin leakage prevention member of the present invention and the resin molding apparatus using the same.

[0043] [ Figure 4 ] Figure 4 (a) is shown Figure 3 A plan view of an example of a lower mold and a resin leakage prevention component. Figure 4 (b) is shown Figure 3 A plan view of another example of the lower mold and the resin leakage prevention component.

[0044] [ Figure 5 ] Figure 5 This is a process cross-sectional view showing another example of the resin leakage preventing member of the present invention and a method for producing a resin molded product using the resin leakage preventing member in a resin molding apparatus.

[0045] [ Figure 6 ] Figure 6 It is a plan view schematically illustrating the overall structure of the resin molding device of the present invention.

[0046] [ Figure 7 ] Figure 7 This is a process cross-sectional view showing an example of a method for producing a resin molded product using a release film in a resin molding apparatus. DETAILED DESCRIPTION

[0047] Next, the present invention will be described in further detail with reference to examples. However, the present invention is not limited to the following description.

[0048] The resin leakage prevention component of the present invention can be formed of at least one material selected from the group consisting of paper, resin, and rubber. The above materials can be used as composite materials by combining multiple types, or can be surface-treated materials (laminated materials, coating materials, coating materials, coating materials, impregnated materials, etc.) obtained by surface-treating the above materials.

[0049] The material of the resin leakage preventing member of the present invention may be, for example, a shrinkable material.

[0050] The resin leakage preventing member of the present invention can be divided into a plurality of parts, for example, and the plurality of parts can be stacked and used.

[0051] The resin leakage prevention component of the present invention can be used in the form of a sheet or a film. In general, a thicker one is called a "sheet" and a thinner one is called a "film". The thickness of the resin leakage prevention component of the present invention is not particularly limited.

[0052] The resin leakage prevention component of the present invention may be, for example, a component having a recess formed on the upper peripheral portion of the bottom component and inserted into the recess for use. In this specification, "on the peripheral portion of the bottom component" not only refers to the case where the component contacts the upper surface of the peripheral portion of the bottom component, but also includes the case where the component is located above the upper surface of the peripheral portion of the bottom component (the case where the component does not contact the upper surface of the peripheral portion of the bottom component). The case where the resin leakage prevention component of the present invention contacts the upper surface of the peripheral portion of the bottom component is, for example, a case where the resin leakage prevention component of the present invention is placed on the upper surface of the peripheral portion of the bottom component. The case where the resin leakage prevention component of the present invention is located above the upper surface of the peripheral portion of the bottom component (the case where the component does not contact the upper surface of the peripheral portion of the bottom component) is, for example, a case where a recess is formed on the peripheral portion of the upper end of the bottom component and the component is inserted into the recess for use.

[0053] Furthermore, the resin leakage preventing member of the present invention is a resin leakage preventing member used for a molding die for compression molding, and the molding die has an upper mold and a lower mold, as described above.

[0054] In the present invention, the resin molding method is as described above, and compression molding (press molding) is used.

[0055] In the present invention, the "molding die" is, for example, a metal die, but is not limited thereto, and may be, for example, a ceramic die.

[0056] In the present invention, there is no particular limitation on the resin molded product, and for example, it may be a resin molded product that has only been resin molded, or it may be a resin molded product in which components such as chips are resin-encapsulated. In the present invention, the resin molded product may be, for example, an electronic component, etc. There is no particular limitation on the electronic component, and it may be any component, for example, it may be any electronic component in which any component such as chips and leads are resin-encapsulated. There is no particular limitation on the type and form of the chip, and for example, it may be at least one of the various forms described above (including flip chips).

[0057] In the present invention, the resin material before molding and the resin after molding are not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin. In addition, it may be a composite material partially containing a thermosetting resin or a thermoplastic resin. In the present invention, the form of the resin material before molding may include, for example, a granular resin, a liquid resin, a sheet resin, a plate resin, a powdered resin, etc. In addition, in the present invention, the liquid resin may be a resin that is liquid at room temperature, and also includes a molten resin that is heated and melted into a liquid state.

[0058] In addition, usually "electronic components" refer to chips before resin encapsulation and chips after resin encapsulation. However, in the present invention, when it is simply referred to as "electronic components", unless otherwise specified, it refers to electronic components after the chips are resin encapsulated (electronic components as finished products). In the present invention, "chips" refer to chips before resin encapsulation, specifically, chips such as ICs, LED chips, semiconductor chips, and semiconductor elements for power control. In the present invention, in order to distinguish chips before resin encapsulation from electronic components after resin encapsulation, they are referred to as "chips" for convenience. However, the "chips" in the present invention are not particularly limited as long as they are chips before resin encapsulation, and they do not have to be in chip form.

[0059] In the present invention, "flip chip" refers to an IC chip or a chip form having a protruding electrode called a bump on the electrode (pad) on the surface of the IC chip. The chip is bonded to the wiring part of a printed circuit board or the like facing downward (face down). The flip chip is used as a chip or one of the bonding methods for wireless bonding, for example.

[0060] In the present invention, the molding object of resin molding is not particularly limited, for example, it can be a substrate. In addition, in the present invention, for example, a component (such as a chip, a flip chip, etc.) mounted on a substrate (molding object) can be resin encapsulated (resin molded) to manufacture a resin molded product. In the present invention, there is no special restriction on the substrate (also called an interposer) as the molding object of resin molding, for example, a lead frame, a wiring substrate, a wafer, a glass epoxy substrate, a ceramic substrate, a resin substrate, a metal substrate, etc. can be exemplified. The substrate can be, for example, a mounting substrate on one or both sides of which a chip is mounted. There is no special restriction on the mounting method of the chip, for example, wire bonding, flip chip bonding, etc. can be exemplified. In the present invention, for example, an electronic component in which a chip is resin-encapsulated can be manufactured by resin encapsulating the mounting substrate. In addition, there is no special restriction on the use of the substrate encapsulated by the resin encapsulation device of the present invention, for example, a substrate for LED, a high-frequency module substrate for a mobile communication terminal, a module substrate for power control, a substrate for mechanical control, etc. can be exemplified.

[0061] The following will describe specific embodiments of the present invention based on the accompanying drawings. For the convenience of description, each drawing will be appropriately omitted, exaggerated, etc. and schematically described.

[0062] [Example 1]

[0063] In this embodiment, an example of a resin molding apparatus and a method for manufacturing a resin molded product according to the present invention will be described.

[0064] Figure 1 The step cross-sectional views of (a) and (b) show an example of a method for manufacturing a resin molded product using a resin leakage prevention member of the present invention and a resin molding device using the same. Figure 1 As shown in (a), the molding die 1000 includes an upper die 100 and a lower die 200. The lower die 200 includes a side member 201 and a bottom member 202. The side member 201 is arranged so as to surround the bottom member 202. A cavity 204 is formed by the space enclosed by the side member 201 and the bottom member 202. As shown in the figure, the cavity 204 can contain a resin material 20a. In addition, the resin material 20a is Figure 1 However, in the present invention, the form of the resin material before molding is not particularly limited, and for example, as described above, it may be a granular resin, or a liquid resin, a sheet resin, a plate resin, a powdered resin, etc.

[0065] The side member 201 and the bottom member 202 are arranged on the lower mold base member 300. The bottom member 202 is directly fixed to the upper surface of the lower mold base member 300. The side member 201 is mounted on the upper surface of the lower mold base member 300 through the elastic member 203. The side member 201 can move up and down by the extension and contraction of the elastic member 203. A clamping mechanism (not shown) is provided below the lower mold base member 300, and the lower mold base member 300 can be raised and lowered by the clamping mechanism.

[0066] As shown in the figure, the upper mold 100 has a substrate (molding object) 10 mounted on its lower surface. The upper mold 100 includes an upper mold base member (not shown) fixed thereto.

[0067] Resin leakage prevention component 401 Figure 2 As shown, it has a shape obtained by digging out a rectangle having a width d narrower than each side of the rectangle from a rectangle having approximately the same size as the mold cavity when viewed from above, as shown in FIG. Figure 1 , Figure 2 As shown, it is placed on the peripheral edge of the upper surface of the bottom member 202 and arranged along the inner peripheral surface of the side member 201. In addition, the resin leakage prevention member 401 in this embodiment is divided into a plurality of ( Figure 1 There are 7 components, such as Figure 1 As shown in the cross-sectional view of FIG. 4 , these multiple components are stacked for use. In addition, the number of multiple components in the resin leakage prevention component 401 is Figure 1 The number of the resin leakage preventing member 401 is 7, but it is not limited thereto and can be set appropriately. The gap between the side member 201 and the bottom member 202 can be sealed by the resin leakage preventing member 401. Thus, the resin can be prevented from leaking from the cavity 204 to the gap between the side member 201 and the bottom member 202. The material of the resin leakage preventing member 401 is not particularly limited, and for example, as described above, it can be paper, resin, rubber, etc., or a composite material of the above materials, a surface treatment material (laminated material, coating material, coating material, coating material, impregnated material, etc.), etc.

[0068] Figure 2 Shown as Figure 1 (a) is a plan view showing a state in which the resin leakage prevention member 401 is arranged along the inner peripheral surface of the side member 201. Figure 2 In the figure, the upper mold 100, the substrate 10 and the resin material 20a are not shown. As shown in the figure, by arranging the resin leakage prevention member 401 along the inner peripheral surface of the side member 201, the gap between the side member 201 and the bottom member 202 is sealed. Figure 2In the embodiment, the upper surface of the bottom member 202 is not covered by the resin leakage preventing member 401 except for the peripheral portion. However, in order to prevent dirt, reduce the demolding force (improve demolding ease), etc., the upper surface of the bottom member 202 other than the peripheral portion (the cavity plane portion) may be covered with a cover. The cover is not particularly limited, and may be formed of the same material as the resin leakage preventing member 401, for example.

[0069] The resin molding apparatus of this embodiment has a resin leakage preventing member supply mechanism (not shown) in addition to the molding die 1000. The resin leakage preventing member supply mechanism can supply the resin leakage preventing member 401 to the molding die 1000.

[0070] The method for manufacturing a resin molded product using the molding die 1000 and the resin leakage prevention member 401 can be carried out, for example, in the following manner. Figure 1 (a) and Figure 2 As shown, the resin leakage preventing component 401 is placed on the peripheral portion of the upper surface of the bottom component 202 and arranged along the inner circumference of the side component 201, thereby blocking the gap between the side component 201 and the bottom component 202. In this way, the resin supplied to the cavity 204 can be prevented from invading the gap between the side component 201 and the bottom component 202 from the cavity 204 (resin leakage preventing component arrangement step). There is no particular limitation on the method of performing the resin leakage preventing component arrangement step. For example, the resin leakage preventing component 401 can be transported to the position of the cavity 204 by the above-mentioned resin leakage preventing component supply mechanism (not shown), and then arranged along the inner circumference of the side component 201. After the resin leakage preventing component arrangement step, as shown in Figure 1 As shown in (a), the resin material 20a is supplied into the cavity 204 (resin material supplying step). There is no particular limitation on the method of performing the resin material supplying step. For example, the resin material 20a may be transported to the position of the resin material 20a by a resin material transporting mechanism (not shown), and then the resin material 20a is supplied into the cavity 204. Further, after the resin material supplying step, resin molding is performed by compression molding using the molding die 1000 (resin molding step). There is no particular limitation on the method of performing the resin molding step. For example, it may be the same as or based on a method of performing resin molding by general compression molding. Specifically, the resin molding step may be performed, for example, in the following manner. First, the upper mold 100 and the lower mold 200 are heated, and the heat is used to melt the resin material 20a to form a molten resin 20b. The upper mold 100 and the lower mold 200 may also be preheated before performing the resin material supplying step (i.e., before supplying the resin material 20a into the cavity 204). Next, as Figure 1As shown in (b), the lower mold base member 300 is raised in the direction of arrow X1 by the mold clamping mechanism (not shown), so that the upper mold 100 and the lower mold 200 are clamped. Thus, first, the substrate 10 held in the upper mold 100 and the side member 201 are in contact, and the mold is further clamped, so that the elastic member 203 of the side member 201 contracts ( Figure 1 (b)). By the above-mentioned mold clamping, as shown in the figure, the resin leakage prevention member 401 sandwiched between the substrate 10 and the bottom member 202 is pushed by the bottom member 202 and shrinks. At this time, even if the molten resin 20b wants to flow into the gap between the side member 201 and the bottom member 202 from the cavity 204 as shown by the arrow 501, because there is a resin leakage prevention member 401 that is shrunk and tight at the height from the upper surface of the gap to the lower surface of the substrate on the inner peripheral surface of the cavity 204, as shown by the X mark 502, the molten resin 20b cannot flow into the gap (resin leakage). Because the resin leakage prevention member 401 that is tight by shrinkage seals the gap between the side member 201 and the bottom member 202. Then, the molten resin 20b is hardened (cured), and after it becomes a cured resin, the lower mold 200 is lowered, the mold is opened, and the resin molded product in which the substrate 10 is encapsulated by the cured resin is taken out from the molding mold 1000. After that, the resin leakage prevention component 401 attached to the side of the solidified resin portion in the resin molded product is removed. At this time, the solidified resin that contacts the resin leakage prevention component 401 can be removed by cutting, cutting, etc. The above method can be used to perform resin molding and manufacture resin molded products. In addition, there is no particular limitation on the method of solidifying the molten resin 20b. For example, when the molten resin 20b is a thermosetting resin, it can be solidified by heating. When the molten resin 20b is a thermoplastic resin, it can be solidified by cooling or natural cooling. In addition, in Figure 1 In the embodiment, nothing is arranged on the surface of the substrate 10, but for example, a chip etc. may be arranged on the lower surface of the substrate 10. Then, the chip etc. may be resin-encapsulated (resin-molded) in a resin-molding step to manufacture an electronic component (resin-molded product) in which the chip is resin-encapsulated.

[0071] In addition, in the lower mold 200, the depth of the mold cavity 204 before mold closing (the elastic member 203 is not contracted) is not particularly limited, and can be, for example, 1 mm or more, 3 mm or more, 5 mm or more, or 10 mm or more, and can be, for example, 30 mm or less, 20 mm or less, 10 mm or less, 5 mm or less, or 3 mm or less. Figure 1(b) The depth of the mold cavity 204 is not particularly limited, and can be, for example, more than 1 mm, more than 3 mm, more than 5 mm, more than 10 mm, or more than 15 mm, and can be, for example, less than 20 mm, less than 10 mm, less than 5 mm, less than 3 mm, or less than 1 mm. The depth of the mold cavity 204 after the mold is closed is substantially equal to the resin thickness (encapsulation thickness) of the resin molded product after molding.

[0072] The width d of the resin leakage prevention component 401 can be appropriately set according to the size of the gap between the side component and the bottom component and the type of resin material, and there is no special limitation. However, for example, it can be greater than 0.01 mm, greater than 0.05 mm, greater than 0.1 mm, greater than 0.5 mm, or greater than 1 mm, for example, it can be less than 2 mm, less than 1 mm, less than 0.5 mm, less than 0.1 mm, or less than 0.05 mm, for example, it can be about 1 to 2 mm.

[0073] The overall height of the resin leakage prevention component 401 can be appropriately set according to the material of the resin leakage prevention component and the type of resin material, for example, it can be the same as or higher than the depth of the cavity 204 before mold closing. In addition, the thickness (height) of the individual components in the resin leakage prevention component 401 is not particularly limited, for example, it can be more than 1 mm, more than 3 mm, more than 5 mm, or more than 10 mm, for example, it can be less than 30 mm, less than 20 mm, less than 10 mm, less than 5 mm, or less than 3 mm, for example, it can be about 1 to 2 mm. For example, when the depth of the cavity 204 before mold closing is 5 mm, 5 pieces of 1 mm thick components can be stacked. In addition, the resin leakage prevention component 401 preferably shrinks as the depth of the cavity 204 before mold closing changes during mold closing.

[0074] in addition, Figure 7 An example using a release film will be described. Figure 7 The molding die 1000 and Figure 1 As shown in the figure, the mold release film 11 can be adsorbed on the mold surface of the lower mold 200 for use. The adsorption method is, for example, Figure 7 As shown by arrow A1, the mold release film 11 can be sucked from the gap formed between the side member 201 and the bottom member 202 or the suction hole (not shown) of the lower mold by a suction mechanism (not shown, such as a vacuum pump, etc.), so that the mold release film 11 is adsorbed on the mold surface of the lower mold 200. As a result, the mold release film 11 covers the mold surface of the lower mold 200, which can prevent the resin from flowing into the gap between the side member 201 and the bottom member 202 (resin leakage). In addition, the mold release property can be improved.

[0075] As described above, when using a release film, there may be problems such as the release film cannot be stretched and tensioned to fit the mold surface of the molding die without wrinkles, the release film after stretching may tear, and the release film after stretching may produce wrinkles when the mold is closed and embed into the packaging surface (the surface of the resin molded product). The above problems may occur especially when the mold cavity of the molding die is deep. However, if the resin leakage prevention component of the present invention is used instead of the release film, resin leakage can be prevented without using the release film, thereby solving these problems. In addition, if the resin leakage prevention component of the present invention is used, because resin leakage can be prevented, for example, the problem of frequent cleaning to remove resin that enters the gap of the molding die can be solved.

[0076] The resin leakage prevention member of the present invention may be a reusable member, or may be a disposable consumable member. From the viewpoint of the work efficiency of manufacturing the resin molded product, etc., a disposable consumable member is preferred.

[0077] The resin leakage prevention component of the present invention, for example, is different from a release film, and does not need to be stretched by being attached to the mold surface of the molding die, so it does not need to have the same elasticity and softness as a release film. Therefore, the resin leakage prevention component of the present invention, for example, can use a material that is cheaper than a release film, which can reduce the cost of manufacturing a resin molded product. In addition, the resin leakage prevention component of the present invention, for example, does not need to be stretched like a release film, and there will be no problem of tearing of the resin leakage prevention component after stretching, and wrinkles will be generated in the resin leakage prevention component during mold closing, and the packaging surface (the surface of the resin molded product) will not be embedded.

[0078] In addition, the resin leakage prevention component of the present invention can also be used by suction from the gap of the molding die, for example, similarly to the mold release film. However, if the width d of the resin leakage prevention component of the present invention is sufficiently wide compared to the gap width between the side component and the bottom component, resin leakage can be prevented even if suction is not performed and the component is only placed on the peripheral portion of the upper surface of the bottom component. Therefore, if the resin leakage prevention component of the present invention is used, the suction step can be omitted, unlike the mold release film, thereby improving the manufacturing efficiency of the resin molded product and simplifying the structure of the resin molding device (omitting the mold release film suction mechanism).

[0079] The molding die for compression molding used in the present invention is not particularly limited, and for example, the same molding die as that for general compression molding can be used. In addition, the resin molding device of the present invention can be the same as a general resin molding device for compression molding, except that it has a resin leakage prevention component supply mechanism. General resin molding devices for compression molding are, for example, devices described in Japanese Patent Application Laid-Open No. 2017-035832.

[0080] [Example 2]

[0081] In this embodiment, another example of the resin molding apparatus and the method for manufacturing a resin molded product according to the present invention will be described.

[0082] Figure 3 The step cross-sectional views of (a) and (b) show an example of a method for producing a resin-molded product using the resin-leakage prevention member of the present invention and a resin-molded product using the same in a resin-molding apparatus.

[0083] Figure 3 (a) and (b) are the same as those of the embodiment except that the resin leakage preventing member 401 is replaced with the resin leakage preventing member 402. Figure 1 (a) and (b) are the same. As shown in the figure, the resin leakage prevention component 402 is a sheet, which is placed upright on the peripheral portion of the upper surface of the bottom component 202 (standing against the peripheral portion) for use. That is, the sheet-like resin leakage prevention component 402 is used to spread over the entire side of the cavity. Thus, as shown in the figure, the resin leakage prevention component 402 is configured along the inner peripheral surface of the side component 201, and can seal the gap between the side component 201 and the bottom component 202. The material of the resin leakage prevention component 402 is not particularly limited, for example, as mentioned above, it can be paper, resin, rubber, etc., or it can be a composite material of the above materials, a surface treatment material (laminated material, coating material, coating material, coating material, impregnated material, etc.). The size (width and height) of the resin leakage prevention component 402 is also not particularly limited, for example, it can be the same as the resin leakage prevention component 401 of Example 1.

[0084] Figure 4 (a) and (b) show the Figure 3 (a) is a plan view showing a state in which the resin leakage prevention member 402 is arranged along the inner peripheral surface of the side member 201. Figure 4 In (a) and (b), the upper mold 100, the substrate 10, and the resin material 20a are not shown. As shown in the figure, the resin leakage prevention component 402 is arranged along the inner peripheral surface of the side component 201, thereby sealing the gap between the side component 201 and the bottom component 202. The upper surface of the bottom component 202 is not covered by the resin leakage prevention component 402 except for the peripheral edge. Figure 4 In (a) and (b), 402a shows a joint of the sheet-like resin leakage preventing member 402. Figure 4 (a) is an example in which the ends of the sheet-like resin leakage prevention member 402 are connected to each other as seams (the seam 402a is an example), Figure 4(b) is an example of overlapping the ends of the sheet-like resin leakage preventing member 402 as a seam (an example in which the seams 402a are multiple). In addition, a sheet-like additional resin leakage preventing member may be overlapped at the seam portion, and its size is such that the seam portion of the ends of the sheet-like resin leakage preventing member 402 is covered with a predetermined width (an example in which the seams 402a are multiple). The seam 402a may be compressed or bonded with tape, adhesive, etc. so as not to form a gap.

[0085] The method for manufacturing a resin molded product using the molding die 1000 and the resin leakage preventing member 402 may be the same as the method for manufacturing in Example 1 except that the resin leakage preventing member 402 is used instead of the resin leakage preventing member 401. Figure 3 As shown in the step cross-sectional views of (a) and (b), the resin leakage preventing member 402 can be contracted between the substrate 10 and the bottom surface member 202 similarly to the resin leakage preventing member 401 .

[0086] [Example 3]

[0087] In this embodiment, another example of the resin molding apparatus and the method for manufacturing a resin molded product according to the present invention will be described.

[0088] Figure 5 The step cross-sectional views of (a) and (b) show an example of a resin leakage prevention component of the present invention and a method for manufacturing a resin molded product using the same in a resin molding device. As shown in the figure, the resin molding device 1000 is the same as the resin molding device 1000 of Examples 1 and 2, except that a recess is formed in the peripheral portion of the upper end of the bottom component 202, and the resin leakage prevention component 403 is inserted into the recess for use when the resin leakage prevention component is set or when the mold is closed. That is, the resin leakage prevention component 403 is placed on the peripheral portion of the upper surface of the bottom component 202 and inserted into the recess in the peripheral portion of the upper end of the bottom component 202 for use. The resin leakage prevention component 403 is Figure 5 In (a) and (b), the same sheet-shaped resin leakage preventing member as the resin leakage preventing member 402 of Example 2 is used. However, the resin leakage preventing member 403 is not limited thereto, and may be, for example, a laminated body similar to the resin leakage preventing member 401 of Example 1. The material of the resin leakage preventing member 403 is also not particularly limited, and may be, for example, the same as the resin leakage preventing member of Example 1 or 2.

[0089] The method for manufacturing a resin molded product using the molding die 1000 and the resin leakage prevention member 403 can be carried out in the same manner as in Examples 1 and 2, for example. Figure 5As shown in the step cross-sectional views of (a) and (b), in this embodiment, the resin leakage prevention member 403 can be lowered along the recessed portion of the peripheral portion of the upper end of the bottom member 202 instead of being contracted between the substrate 10 and the bottom member 202.

[0090] The compression molding die used in the present invention is as described above, and there are no special restrictions, and it can be the same as a general compression molding die. For example, as described in this embodiment, a recess can be formed on the peripheral portion of the upper end of the bottom part, and a resin leakage prevention part can be inserted into the recess for use.

[0091] Although Embodiments 1 to 3 are described above, the present invention is not limited thereto. For example, two or more methods in Embodiments 1 to 3 may be used in combination.

[0092] [Example 4]

[0093] In this embodiment, an example of the overall structure of the resin molding apparatus of the present invention and a method for manufacturing a resin molded product using the same will be described.

[0094] Reference Figure 6 , an example of a resin molding method using the resin molding device 1 is described. In the resin molding device 1, a granular resin 20a (see Figure 1 (a) Figure 3 (a) and Figure 5 (a) First, in the substrate supply and storage module 41, the pre-package substrate 10 (substrate 10, see Figure 1 , Figure 3 , Figure 5 ) to the substrate loading section 50. Next, the substrate conveying mechanism 51 is moved from the predetermined position S1 to the -Y direction to receive the pre-packaged substrate 10 from the substrate loading section 50. The substrate conveying mechanism 51 returns to the predetermined position S1. Next, in the three molding modules 42A to 42C provided in the present resin molding device 1, for example, the substrate conveying mechanism 51 is moved to the +X direction to the predetermined position P1 of the molding module 42B. Next, in the molding module 42B, the substrate conveying mechanism 51 is moved to the -Y direction to the predetermined position C1 on the lower mold 200 and stops. Next, the substrate conveying mechanism 51 is raised to fix the pre-packaged substrate 10 on the upper mold 100. Thereafter, the substrate conveying mechanism 51 returns to the predetermined position S1 of the substrate supply and storage module 41.

[0095] Next, the material conveying mechanism 56 receives the resin leakage preventing member 401 having a predetermined shape contained in the resin leakage preventing member supplying mechanism 53, conveys it to the lower mold 200 of the molding die of the molding module 42B, and sets it in the lower mold 200. At this time, the predetermined shape is as described above. Figure 1 (a) Figure 3 (a) Figure 5 As shown in (a), the shape can cover the peripheral edge of the upper surface of the bottom member 202 and the entire side surface of the cavity 204. In addition, the resin leakage prevention member 401 of Example 1 is divided into a plurality of parts, and the plurality of parts can be transported and installed one by one.

[0096] Next, the XY table 52 is moved from the predetermined position T1 in the -Y direction, and the XY table 52 is stopped at a predetermined position below the resin material containing frame 54. The resin material containing frame 54 is placed on the XY table 52. The XY table 52 on which the resin material containing frame 54 is placed is moved in the +X direction, and the resin material containing frame 54 is stopped at a predetermined position below the resin material feeding mechanism 55. As the XY table 52 moves in the X and Y directions, a predetermined amount of resin material 20a (see FIG. 20 ) is supplied from the resin material feeding mechanism 55 to the resin material containing frame 54. Figure 1 (a) Figure 3 (a) Figure 5 (a)) The XY stage 52 on which the resin material containing frame 54 is placed returns to a predetermined position T1.

[0097] Next, the material conveying mechanism 56 moves from the predetermined position M1 in the -Y direction to receive the resin material containing mechanism 54 placed on the XY table 52. The material conveying mechanism 56 returns to the predetermined position M1. Next, the material conveying mechanism 56 is moved in the -X direction to the predetermined position P1 of the molding module 42B. Next, in the molding module 42B, the material conveying mechanism 56 is moved in the -Y direction to stop at the predetermined position C1 on the lower mold 200. The material conveying mechanism 56 is lowered to supply the resin material 20a to the cavity 204. After the supply is completed, the material conveying mechanism 56 returns to the predetermined position M1.

[0098] Next, in the molding module 42B, the lower mold 200 is raised by the mold clamping mechanism 60, and the upper mold 100 and the lower mold 200 are clamped. After a predetermined time, the upper mold 100 and the lower mold 200 are opened. Next, the substrate conveying mechanism 51 is moved from the predetermined position S1 of the substrate supply and storage module 41 to the predetermined position C1 on the lower mold 200 to receive the packaged substrate (resin molded product) 10a. Next, the substrate conveying mechanism 51 is moved to transfer the packaged substrate 10a to the substrate loading section 50. The packaged substrate 10a is stored in the packaged substrate storage section 45 from the substrate loading section 50. At this stage, the resin encapsulation (resin molding) is completed.

[0099] In this embodiment, three molding modules 42A, 42B, and 42C are installed in parallel along the X direction between the substrate supply and storage module 41 and the material supply module 43. However, the number of molding modules is not limited to 3 and is arbitrary. In addition, the substrate supply and storage module 41 and the material supply module 43 can be set as one module, and one molding module 42A can be installed in parallel along the X direction for the module. Thus, the molding modules 42A, 42B, ... can be increased or decreased. Thus, since the configuration of the resin molding device 1 can be optimized according to the production type and production volume, the productivity can be improved.

[0100] In the present embodiment, the resin leakage preventing component supply mechanism 53 for supplying the resin leakage preventing component 401 is provided in the material supply module 43. However, the present invention is not limited thereto, and the resin leakage preventing component supply mechanism 53 for supplying the resin leakage preventing component 401 may be newly provided as a resin leakage preventing component supply module instead of being provided in the material supply module 43. In this case, the resin leakage preventing component supply module may be installed between the molding module 42C and the material supply module 43, or installed beside the material supply module 43 on the opposite side of the molding module 42C, thereby forming the resin molding device 1 by only additionally installing the resin leakage preventing component supply module on the existing device.

[0101] In addition, in this embodiment, the resin leakage prevention member is shown as Example 1 ( Figure 1 ) of the resin leakage preventing component 401. However, the resin leakage preventing component is not limited thereto and is arbitrary, for example, it may be the resin leakage preventing component of Example 2 ( Figure 3 ) of the resin leakage prevention member 402, or Example 3 ( Figure 5 ) resin leakage prevention component 403, etc.

[0102] Furthermore, the present invention is not limited to the above-mentioned embodiments, and any and appropriate combinations, changes and selections can be made as needed without departing from the scope of the present invention. For example, in the above-mentioned embodiments, the shapes of the molding object and the mold cavity are rectangular, but the present invention can also be applied when the shapes of the molding object and the mold cavity are circular.

[0103] This application claims the benefit of priority based on Japanese patent application No. 2020-143050 filed on August 26, 2020, the disclosure of which is incorporated herein in its entirety.

[0104] Description of Reference Numerals

[0105] 1 Resin molding device

[0106] 10. Substrate before packaging (substrate)

[0107] 1 0a Packaged substrate (resin molded product)

[0108] 11 Release film

[0109] 20a Resin material

[0110] 20b Molten resin

[0111] 41 Substrate supply and storage module

[0112] 42A, 42B, 42C Forming Modules

[0113] 43 Material supply module

[0114] 44 Pre-package substrate supply unit

[0115] 45 Packaged substrate storage area

[0116] 50 substrate placement section

[0117] 51 Substrate transport mechanism

[0118] 52 XY table

[0119] 53 Resin leakage prevention parts supply mechanism

[0120] 54 Resin material receiving mechanism

[0121] 55 Resin material feeding mechanism

[0122] 56 Material transport mechanism

[0123] 60 Clamping mechanism

[0124] 100 upper mold

[0125] 200 Lower die

[0126] 201 Side parts

[0127] 202 Bottom parts

[0128] 203 Elastic components

[0129] 204 Cavity

[0130] 300 Lower mold base parts

[0131] 401, 402, 403 Resin leakage prevention parts

[0132] 501 Arrow

[0133] 502 X Mark

[0134] 1000 Forming die

[0135] d: Width of the resin leakage prevention component

Claims

1. A resin leakage prevention component, which is a resin leakage prevention component used for a molding die for compression molding, Features The molding die comprises a lower die and an upper die. The lower mold has a side part and a bottom part, A cavity is formed by the space enclosed by the side member and the bottom member, and the cavity can contain a resin material. The side member can move up and down relative to the bottom member, The overall height of the resin leakage prevention member is equal to or higher than the depth of the cavity before mold closing. The resin leakage prevention member is arranged on the peripheral edge of the bottom member along the inner peripheral surface of the side member, so as to seal the gap between the side member and the bottom member and prevent the resin from leaking from the cavity into the gap. The resin leakage preventing member is divided into a plurality of parts, and the plurality of parts are stacked for use.

2. The resin leakage preventing member according to claim 1, wherein The resin leakage preventing member is formed of at least one material selected from paper, resin, and rubber.

3. The resin leakage preventing member according to claim 1 or 2, wherein The resin leakage preventing member is formed of a shrinkable material.

4. The resin leakage preventing member according to claim 1 or 2, wherein The resin leakage preventing member is in the form of a sheet or a film.

5. The resin leakage preventing member according to claim 1 or 2, wherein A recess is formed at the peripheral edge of the upper end of the bottom member, and the resin leakage prevention member is inserted into the recess for use.

6. A resin leakage prevention component supply mechanism, characterized in that The resin leakage preventing member according to any one of claims 1 to 5 is supplied to the molding die.

7. A resin molding device, characterized in that A molding die for compression molding and a resin leakage prevention member supply mechanism according to claim 6, The molding die comprises a lower die and an upper die. The lower mold has a side part and a bottom part, A cavity is formed by the space enclosed by the side member and the bottom member, and the cavity can contain a resin material. The side member is movable up and down relative to the bottom member.

8. A method for producing a resin molded product, which is a method for producing a resin molded product using a compression molding die and the resin leakage prevention member according to any one of claims 1 to 5, characterized in that The molding die comprises a lower die and an upper die. The lower mold has a side part and a bottom part, A cavity is formed by the space enclosed by the side member and the bottom member, and the cavity can contain a resin material. The side member can move up and down relative to the bottom member, The method for producing the resin molded article comprises a step of arranging a resin leakage prevention component, wherein the resin leakage prevention component is arranged along the inner peripheral surface of the side component to seal the gap between the side component and the bottom component to prevent the resin from leaking from the cavity into the gap; a resin material supplying step, after the resin leakage preventing member arranging step, supplying the resin material into the cavity, The resin molding step is to perform resin molding by compression molding using the molding die after the resin material supplying step.

Images