Display panel and display device

Abstract

The application discloses a display panel and a display device, and belongs to the technical field of display. The display panel comprises a substrate substrate; a first conductive structure on the substrate substrate; an insulating structure layer on the substrate substrate provided with the first conductive structure, the insulating structure layer has a first area and a second area, the thickness of the first area is smaller than the thickness of the second area, and the insulating structure layer in the first area has a through hole; a second conductive structure is located in the first area and is electrically connected with the first conductive structure through the through hole. By arranging the insulating structure layer with the first area being thin and the second area being thick, and electrically connecting the first conductive structure through the through hole in the first area, the structure of the second conductive structure is relatively flat under the structure, and there is no large bending structure, thereby solving the problem of low yield of the display panel in the related art. The yield of the display panel is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND

[0002] The display panel is a kind of device with display function, and the inside of the display panel usually has various conductive structures located in different layers, and in some positions, it is necessary to realize the electrical connection of the conductive structures of different layers.

[0003] In a display panel, a first conductive structure, a planar layer and a second conductive structure are sequentially formed on a substrate, the planar layer has a via hole, the second conductive structure is arranged on the via hole, and the second conductive structure is electrically connected with the first conductive structure through the via hole.

[0004] However, the second conductive structure arranged on the via hole of the planar layer will form a larger bending structure at the via hole of the planar layer due to the thickness of the planar layer, which may cause the yield of the display panel to be lower. SUMMARY

[0005] Embodiments of the present application provide a display panel and a display device. The technical solutions are as follows:

[0006] According to a first aspect of the present application, a display panel is provided, comprising:

[0007] a substrate;

[0008] a first conductive structure located on the substrate;

[0009] an insulating structure layer located on the substrate provided with the first conductive structure, the insulating structure layer has a first area and a second area, the second area surrounds the first area, the thickness of the insulating structure layer in the first area is less than the thickness of the insulating structure layer in the second area, and the insulating structure layer in the first area has a through hole, and the orthographic projection of the first conductive structure on the substrate and the orthographic projection of the through hole on the substrate have an overlapping area;

[0010] a second conductive structure located on the side of the insulating structure layer away from the substrate, the second conductive structure is located in the first area and is electrically connected with the first conductive structure through the through hole.

[0011] Optionally, the edge of the second conductive structure and the edge of the first area have a spacing.

[0012] Optionally, the insulating structure layer includes an insulating layer and a first planar layer on a side of the insulating layer distal to the substrate, the via is in the insulating layer, the first planar layer has an opening in the first region, and a footprint of the via on the substrate is in the opening on the substrate.

[0013] Optionally, the first planar layer is in the second region, a distance between an edge of the second conductive structure and an edge of the opening is greater than or equal to 0.6 microns, and a thickness of the second conductive structure is less than a thickness of the first planar layer.

[0014] Optionally, the first planar layer is in the second region, a distance between an edge of the second conductive structure and an edge of the opening is greater than or equal to 0.6 microns, and a thickness of the second conductive structure is less than a thickness of the first planar layer.

[0015] Optionally, the first planar layer is in the second region, a distance between an edge of the second conductive structure and an edge of the opening is greater than or equal to 0.6 microns, and a thickness of the second conductive structure is less than a thickness of the first planar layer.

[0016] Optionally, the first conductive structure and the second conductive structure are metal conductive structures.

[0017] Optionally, a material of the insulating structure layer includes silicon nitride.

[0018] Optionally, the display panel further includes a second planar layer on the substrate provided with the second conductive structure.

[0019] A transparent conductive trace on a side of the second planar layer distal to the substrate.

[0020] Optionally, the display panel further includes a transparent conductive trace and a plurality of pixel units, the pixel units include pixel circuits and light emitting elements, the pixel circuits are configured to drive the light emitting elements, and the plurality of pixel units include first pixel units and second pixel units.

[0021] The substrate includes a first display area and a second display area, the pixel circuits and the light emitting elements of the first pixel units are in the first display area, the pixel circuits of the second pixel units are in the first display area, the light emitting elements of the second pixel units are in the second display area, and the light emitting elements of the second pixel units are electrically connected to the pixel circuits of the second pixel units through the transparent conductive trace.

[0022] Optionally, the second display area is a light-transmitting display area.

[0023] Optionally, the orthogonal projection of the pixel circuit of the first pixel unit on the substrate and the orthogonal projection of the light emitting element of the first pixel unit on the substrate at least partially overlap, and the orthogonal projection of the pixel circuit of the second pixel unit on the substrate and the orthogonal projection of the light emitting element of the second pixel unit on the substrate do not overlap.

[0024] Optionally, the orthogonal projection of the transparent conductive trace on the substrate and the orthogonal projection of the pixel circuit of the first pixel unit on the substrate at least partially overlap.

[0025] Optionally, the first conductive structure, the second conductive structure and the via are located in the first display area.

[0026] According to another aspect of the embodiments of the present application, a display device is provided, which comprises the display panel described above.

[0027] The technical solutions provided by the embodiments of the present application have at least the following beneficial effects:

[0028] By arranging the insulating structure layer with the first area being relatively thin and the second area being relatively thick, and arranging the second conductive structure in the first area, the second conductive structure is electrically connected to the first conductive structure through the via in the first area of the insulating structure layer. In this structure, the structure of the second conductive structure is relatively flat and does not have a large bending structure. The problem that the second conductive structure forms a large bending structure at the via of the planar layer in the related art, which may cause a low yield of the display panel, is solved. The effect of improving the yield of the display panel is achieved. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort.

[0030] Figure 1 is a structural schematic diagram of a display panel;

[0031] Figure 2 is a structural schematic diagram of a display panel according to an embodiment of the present application;

[0032] Figure 3 is a top view of a display panel according to an embodiment of the present application;

[0033] Figure 4 is a schematic diagram of a partial structure of a display panel according to an embodiment of the present application;

[0034] Figure 5 is another structural schematic diagram of a display panel provided by an embodiment of the present application;

[0035] Figure 6 is another structural schematic diagram of a display panel provided by an embodiment of the present application;

[0036] Figure 7 is a method flow chart of a manufacturing method of a display panel provided by an embodiment of the present application;

[0037] Figure 8 is a method flow chart of another manufacturing method of a display panel provided by an embodiment of the present application;

[0038] Figure 9 is a structural schematic diagram of a substrate provided by an embodiment of the present application; Figure 8

[0039] Figure 10 is a method flow chart of another manufacturing method of a display panel provided by an embodiment of the present application;

[0040] Figure 11 is a structural schematic diagram of a substrate provided by an embodiment of the present application; Figure 10

[0041] Figure 12 is a structural schematic diagram of a display device provided by an embodiment of the present application.

[0042] The specific embodiments of the present application have been shown in the above-mentioned drawings, and will be described in more detail hereinafter. The drawings and the written description are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of the present application more clear, the embodiments of the present application will be described in more detail below with reference to the drawings.

[0044] Figure 1 is a structural schematic diagram of a display panel, which comprises a substrate 11 and a first conductive structure 12, a planar layer 13 and a second conductive structure 14 formed on the substrate in sequence, the planar layer 13 has a via hole k, and the second conductive structure 14 is arranged on the via hole and is electrically connected with the first conductive structure 12 through the via hole k.

[0045] ​​However, the second conductive structure 14 on the via k of the flat layer 13 will form a large bending structure at the via k of the flat layer 13 due to the thickness of the flat layer 13 (the thickness of the flat layer can reach tens of thousands of angstroms), which can easily break, resulting in a low yield of the display panel.

[0046] In addition, the second conductive structure 14 is in a downwardly concave bowl shape, when the second conductive structure 14 is made of a metal material, considering the strong light reflection ability of the metal material, the second conductive structure 14 in this shape will converge the light from above and reflect it upwards, which can cause the photoresist 16 of the structure 15 above the second conductive structure 14 to be exposed to the converged light, resulting in overexposure of the photoresist 16, and then the photoresist 16 is difficult to effectively protect the structure 15, which can cause problems such as open circuit, affecting the yield of the display panel.

[0047] For example, the structure 15 above the second conductive structure 14 can be a transparent conductive trace, for example, an Indium Tin Oxide (ITO) trace. Such a trace is more prone to breakage under the condition of overexposure of the photoresist, and the transparent conductive trace is widely arranged in the display panel, so that the risk of breakage of the display panel is greatly increased, resulting in a low yield of the display panel.

[0048] Embodiments of the present application provide a display panel, a manufacturing method of the display panel, and a display device, which can solve some problems in the above-mentioned technologies.

[0049] Figure 2 is a structural schematic diagram of a display panel according to an embodiment of the present application, which comprises a substrate 21, a first conductive structure 22 on the substrate 21, and an insulating structure layer 23 on the substrate 21 provided with the first conductive structure 22.

[0050] The insulating structure layer 23 has a first region q1 and a second region q2 surrounding the first region q1, the thickness h1 of the insulating structure layer 23 in the first region q1 is less than the thickness h2 of the insulating structure layer 23 in the second region q2, the insulating structure layer 23 in the first region q1 has a via k2, and the orthographic projection of the first conductive structure 22 on the substrate 21 and the orthographic projection of the via k2 on the substrate 21 have an overlapping region.

[0051] The second conductive structure 24 is on the side of the insulating structure layer 23 away from the substrate, the second conductive structure 24 is in the first region q1 and is electrically connected to the first conductive structure 22 through the via k2.

[0052] In summary, the display panel provided by the embodiment of the present application sets the insulating structure layer with a first area with a relatively small thickness and a second area with a relatively large thickness, and the second conductive structure is located in the first area with a relatively small thickness. The second conductive structure is electrically connected to the first conductive structure through the through hole of the insulating structure layer in the first area. In this structure, the structure of the second conductive structure is relatively flat and does not have a large bending structure. This solves the problem in the related art that the second conductive structure forms a large bending structure at the via of the planar layer, which may cause a low yield of the display panel. The effect of improving the yield of the display panel is achieved.

[0053] In addition, in the display panel provided by the embodiment of the present application, the insulating structure layer with two thicknesses is set, and the second conductive structure is arranged in the area with a relatively small thickness. The substrate substrate with the second conductive structure has a high flatness as a whole, which is beneficial to the formation of the subsequent film layer structure.

[0054] For reference Figure 3 , Figure 3 is a top view of a display panel provided by an embodiment of the present application. The display panel further includes a conductive line L1 and a plurality of pixel units. The pixel unit includes a pixel circuit and a light emitting element. The pixel circuit is configured to drive the light emitting element. The plurality of pixel units include a first pixel unit p1 and a second pixel unit p2.

[0055] The display panel includes a display area R0 and a peripheral area R3. The peripheral area R3 is a non-display area. The display area R0 includes a first display area R1 and a second display area R2. For example, a hardware such as a photosensitive sensor (e.g., a camera) is arranged at a position corresponding to the second display area R2 on one side of the display panel. For example, the second display area R2 is a light-transmitting display area, and the first display area R1 is a display area. For example, the first display area R1 is not light-transmitting and is only used for display. The first display area R1 and the second display area R2 jointly constitute the area of the display screen of the display panel.

[0056] For example Figure 3As shown, the display panel includes a substrate 21 and a pixel unit on the substrate 21. The pixel unit includes a first pixel unit p1 and a second pixel unit p2. The pixel circuit f1 (may be referred to as a first pixel circuit) and the light emitting element e1 (may be referred to as a first light emitting element) of the first pixel unit p1 are both located in the first display area R1. The pixel circuit f2 (may be referred to as a second pixel circuit) of the second pixel unit p2 is located in the first display area R1, and the light emitting element e2 (may be referred to as a second light emitting element) is located in the second display area R2. The second light emitting element e2 of the second pixel unit p2 is electrically connected to the pixel circuit f2 of the second pixel unit p2 through the conductive wire L1. The pixel circuit can include a driving structure and a connection element CE0 for connecting to the first electrode (anode) of the light emitting element. For example, the first pixel circuit f1 can be referred to as an in-situ pixel circuit, and the second pixel circuit f2 can be referred to as a non-in-situ pixel circuit. The first pixel circuit f1 and the second pixel circuit f2 are both driving circuits. As shown in the figure, Figure 3 As shown, in the second display area R2, the light transmissive sub-area is between the adjacent second light emitting elements e2, and the area where the second light emitting element e2 is located is a display sub-area.

[0057] For example, as shown in the figure, Figure 3 The display panel includes a plurality of first pixel circuits f1, a plurality of second pixel circuits f2 and a plurality of first light emitting elements e1 in the first display area R1, and a plurality of second light emitting elements e2 in the second display area R2. For example, the plurality of second pixel circuits f2 can be distributed between the plurality of first pixel circuits f1.

[0058] In order to improve the light transmittance of the second display area R2, only light emitting elements can be arranged in the second display area R2, and the pixel circuit for driving the light emitting elements in the second display area R2 is arranged in the first display area R1. That is, the light transmittance of the second display area R2 is improved by arranging the light emitting elements and the pixel circuit separately. That is, in the second display area R2, no pixel circuit is arranged.

[0059] For example, as shown in the figure, Figure 3 At least one first pixel circuit f1 in the plurality of first pixel circuits f1 can be connected to at least one first light emitting element e1 in the plurality of first light emitting elements e1, and the orthographic projection of the at least one first pixel circuit f1 on the substrate 21 can at least partially overlap with the orthographic projection of the at least one first light emitting element e1 on the substrate 21. The at least one first pixel circuit f1 can be used to provide a driving signal for the connected first light emitting element e1 to drive the first light emitting element e1 to emit light.

[0060] Figure 3Taking the second pixel circuit f2, which drives the second light-emitting element e2 to emit light, as located in the first display area R1 as an example, the display panel in this case can adopt a driving circuit compression scheme. In the driving circuit compression scheme, the size of the driving circuit in the first direction X is reduced, so that the first pixel circuit f1 and the second pixel circuit f2 can be placed in the first direction X, and the second pixel circuit f2 can be distributed among the first pixel circuit f1. For example, if the first direction X is the row direction, the second pixel circuit f2 is arranged at intervals among the first pixel circuit f1 in the same row of pixel circuits. Of course, in other embodiments, the second pixel circuit f2 can also be located in the peripheral area R3, thereby forming an external driving circuit scheme.

[0061] For example, such as Figure 3 As shown, the first display area R1 can be located on at least one side of the second display area R2. For example, in some embodiments, the first display area R1 surrounds the second display area R2. That is, the second display area R2 can be surrounded by the first display area R1. The second display area R2 can also be disposed in other locations, and the location of the second display area R2 can be determined as needed. For example, the second display area R2 can be located at the top center of the substrate 21, or at the upper left corner or upper right corner of the substrate 21.

[0062] For example, such as Figure 3 As shown, at least one of the plurality of second pixel circuits f2 can be connected to at least one of the plurality of second light-emitting elements e2 via a conductive line L1. This at least one second pixel circuit f2 can be used to provide a driving signal to the connected second light-emitting element e2 to drive the second light-emitting element e2 to emit light. Figure 3 As shown, since the second light-emitting element e2 and the second pixel circuit f2 are located in different regions, there is no overlap between the orthographic projection of at least one second pixel circuit f2 on the substrate 21 and the orthographic projection of at least one second light-emitting element e2 on the substrate 21.

[0063] For example, in this embodiment, the second display area R2 is a light-transmitting display area. The first display area R1 can be a non-light-transmitting display area. Thus, the display panel provided in this embodiment does not require hole-punching; the necessary hardware structures, such as the photosensor, can be directly placed on one side of the display panel at the position corresponding to the second display area R2, laying a solid foundation for the realization of a true full-screen display. Furthermore, since the second display area R2 only includes light-emitting elements and not pixel circuits, its light transmittance is improved, resulting in a better display effect.

[0064] Optionally, the orthographic projection of the pixel circuit f1 of the first pixel unit p1 onto the substrate 21 and the orthographic projection of the light-emitting element e1 of the first pixel unit p1 onto the substrate 21 overlap at least partially, while the orthographic projection of the pixel circuit f2 of the second pixel unit p2 onto the substrate 21 and the orthographic projection of the light-emitting element e2 of the second pixel unit p2 onto the substrate 21 do not overlap.

[0065] Optionally, the conductive line L1 is a transparent conductive trace, and the orthographic projection of the conductive line L1 on the substrate 21 at least partially overlaps with the orthographic projection of the pixel circuit f1 of the first pixel unit p1 on the substrate 21.

[0066] In one exemplary embodiment, the first conductive structure, the second conductive structure, and the through hole are located in the first display area, that is, the electrical connection structure of the first conductive structure and the second conductive structure provided in the embodiments of this application can be located in the non-transparent display area.

[0067] Figure 4 This is a schematic diagram of a partial structure of a display panel provided in an embodiment of this application. For example... Figure 4 As shown, the conductive lines L1 include multiple lines, including multiple first conductive lines L11 located in the first transparent conductive layer LY01 and multiple second conductive lines L12 located in the second transparent conductive layer LY02. An insulating layer may be disposed between the first transparent conductive layer LY01 and the second transparent conductive layer LY02. In other embodiments, three or more transparent conductive layers may be included to provide more conductive lines. An insulating layer is disposed between adjacent transparent conductive layers.

[0068] In related technologies, after the exposure process, the photoresist in the transparent conductive film may break or thin, leading to broken or thinned conductive lines after development and etching, resulting in dark spots in the display. Optical microscopy confirmed that the location of the broken or thinned conductive lines is where the conductive lines cross the first via V1 of the first planarization layer. Further focused ion beam (FIB) analysis of the cross-section at the first via V1 of the first planarization layer revealed that the conductive lines crossing the first via V1 all have a bowl-shaped conductive structure below the location of the broken or thinned conductive lines. However, the embodiments of this application can solve this problem.

[0069] Figure 4 The first light-emitting element e1 shown is represented by the first electrode of the first light-emitting element e1. Figure 4 Alternating rows of first and second pixel circuits are shown. Multiple rows of first pixel circuits can be arranged between adjacent rows of second pixel circuits.

[0070] Figure 4A second via V2 is also shown, which includes either a via V21 or a via V22. Either the via V21 or the via V22 is a via that penetrates at least one insulating layer. As shown, a first pole of the first light emitting element e1 is connected to the connection element CE0 via the via V21. As shown, Figure 4 a first pole of the first light emitting element e1 is connected to the connection element CE0 via the via V21. As shown, Figure 4 a first pole of the first light emitting element e1 is connected to the connection element CE0 via the via V21. As shown, Figure 3 and Figure 4 ), the connection element CE0 connected to the conductive line L1 can be referred to as a second connection element (see Figure 3 and Figure 4 ). For example, the connection element CE0 connected to the pixel circuit of the first pixel unit can be referred to as a first connection element CEa (see Figure 3 and Figure 4 ), and the connection element CE0 connected to the pixel circuit of the second pixel unit can be referred to as a second connection element CEb (see Figure 3 and Figure 4 ).

[0071] The drawings of the embodiments of the present disclosure show a first direction X and a second direction Y. The main surface of the substrate 21 is a surface on which various components are disposed, and the first direction X and the second direction Y are directions parallel to the main surface of the substrate 21. For example, the first direction X and the second direction Y intersect. Further for example, the first direction X is perpendicular to the second direction Y.

[0072] In an exemplary embodiment, please refer to Figure 2 , there is a spacing d between the edge of the second conductive structure 24 and the edge of the first region q1. Since there can be some errors in the formation of various structures in the display panel, setting a spacing between the edge of the second conductive structure 24 and the edge of the second region q2 can reduce the possibility of the edge of the second conductive structure 24 overlapping the edge of the second region q2.

[0073] It should be noted that the size of this spacing d can be the same or different at different positions, which is not limited in the embodiments of the present application.

[0074] In an exemplary embodiment, the minimum distance d between the edge of the second conductive structure 24 and the edge of the first region q1 is greater than or equal to the accuracy of a photolithography machine used to form the second conductive structure. In this structure, the edge of the second conductive structure 24 can be prevented from being on the edge of the second region q2 due to the accuracy of the photolithography machine. For example, the minimum distance d between the edge of the second conductive structure 24 and the edge of the second region q2 is greater than or equal to 0.6 μm (micrometer).

[0075] Optionally, the thickness of the insulating structure layer in the first region is in a range of 500 angstroms to 1000 angstroms. The thickness is much smaller than the thickness of the planar layer, and a large bending structure of the second conductive structure at the through hole in the first region can be avoided. The material of the insulating structure layer includes silicon nitride.

[0076] In the display panel provided by the embodiments of the present application, the insulating structure layer has two regions with different thicknesses. The structure of the insulating structure layer with the structure can include at least the following two structures:

[0077] Firstly, the insulating structure layer is combined by multiple structures, for example, a relatively thin film layer and a relatively thick film layer with an opening.

[0078] Secondly, the insulating structure layer is a one-piece film layer structure.

[0079] The two structures will be described below.

[0080] Please refer to Figure 5 which is a structure diagram of another display panel provided by the embodiments of the present application. The display panel is adjusted on the basis of the display panel shown in Figure 2 .

[0081] The insulating structure layer 23 includes the insulating layer 231 and the first planar layer 232 on the side of the insulating layer 231 away from the substrate 21. The through hole k2 is on the insulating layer 231, and the first planar layer 232 has an opening k3 in the first region q2. The orthogonal projection of the through hole k2 on the substrate 21 is in the orthogonal projection of the opening k3 on the substrate 21. Thus, the insulating structure layer 23 is combined by the laminated insulating layer 231 and the first planar layer 232 with the opening k3.

[0082] In an exemplary embodiment, the thickness of the insulating layer 231 can be relatively thin, for example, in a range of 500 angstroms to 1000 angstroms. Compared with the thickness of the planar layer of ten thousand angstroms, the thickness of the insulating layer 231 is much smaller than the thickness of the planar layer. Thus, the second conductive structure 22 on the through hole k2 on the insulating layer 231 is relatively flat, and does not have a large bending structure and a large depression. Thus, the risk of breakage is relatively small.

[0083] In addition, the second conductive structure 22 is relatively flat, and thus does not converge light, thereby not affecting the yield of the display panel.

[0084] The first flat layer 232 is located in the second region q2, and the second conductive structure 22 has a spacing d between the edge of the second conductive structure 22 and the edge of the opening k3, and the thickness of the second conductive structure 22 is less than the thickness of the first flat layer 232. In this structure, the risk of the edge of the second conductive structure 22 being on the first flat layer 232 is small, and the height of the second conductive structure 22 does not affect the first flat layer 232.

[0085] Optionally, the material of the insulating layer 231 includes silicon nitride. Silicon nitride is a material with good insulating properties. Of course, the insulating layer 231 can also include other materials, such as silicon oxide, silicon oxynitride, etc., and the embodiments of the present application do not limit this. The insulating layer 231 can also be a passivation layer in the display panel, which protects the structure in the display panel. For example, to avoid the external moisture from corroding the internal structure of the display panel.

[0086] In an exemplary embodiment, the display panel further includes a second flat layer 25 located on the substrate 21 provided with the second conductive structure 24. The material of the second flat layer 25 can include resin glue.

[0087] The display panel further includes a transparent conductive trace 26 located on the side of the second flat layer 25 away from the substrate 21.

[0088] Optionally, the second conductive structure 24 can be a metal conductive structure, and an exemplary second conductive structure 24 can be a three-layer composite structure of titanium, aluminum, and titanium. The titanium metal layer has a relatively high refractive index (about 2.4), and the refractive index of the second flat layer 25 above the second conductive structure 24 is generally low (such as resin glue about 1.5), which is greatly different from the refractive index of the second conductive structure 24. Light will be reflected at the interface between the second flat layer 25 and the second conductive structure 24. If the second conductive structure 24 is in a bowl shape, the converged light beam will seriously affect the formation of the other film layers above (will cause the photoresist used in the formation of the other film layers above to be overexposed). However, in the display panel provided by the embodiments of the present application, the second conductive structure 24 is relatively flat, and thus does not converge light, thereby not affecting the formation of the other film layers above. The material and structure of the first conductive structure can refer to the second conductive structure, and the embodiments of the present application will not be described here.

[0089] In an example embodiment, the display panel provided by the embodiments of the present application is a display panel with a light-transmissive display area having a certain light transmittance, which is used to realize a full display with camera (FDC) function.

[0090] In the embodiments of the present application, the first conductive structure 22 and the second conductive structure 24 can both be source-drain metal patterns. For example, the first conductive structure 22 is a first source-drain metal pattern, and the second conductive structure is a second source-drain metal pattern.

[0091] In summary, the display panel provided by the embodiments of the present application sets the insulating structure layer with a relatively thin first area and a relatively thick second area, and the second conductive structure is located in the relatively thin first area. The second conductive structure is electrically connected to the first conductive structure through the via hole of the insulating structure layer in the first area. In this structure, the structure of the second conductive structure is relatively flat and does not have a large bending structure. This solves the problem in the related art that the second conductive structure forms a large bending structure at the via hole of the planarization layer, which may cause the yield of the display panel to be low. The effect of improving the yield of the display panel is achieved.

[0092] In addition, in the display panel provided by the embodiments of the present application, the insulating structure layer is set to have two thicknesses, and the second conductive structure is set in the area with a relatively thin thickness. This makes the overall flatness of the substrate with the second conductive structure higher, which is beneficial to the formation of subsequent film layer structures.

[0093] Please refer to Figure 6 which is a structural schematic diagram of another display panel provided by the embodiments of the present application. The display panel in Figure 2 is adjusted based on the display panel shown in

[0094] The insulating structure layer 23 is an integral film layer structure, and the first area q1, the second area q2, and the via hole k2 (the via hole k2 can be considered as having a thickness of 0) with different thicknesses can be formed by a gray mask process.

[0095] Optionally, the thickness of the insulating structure layer in the first area ranges from 500 angstroms to 1000 angstroms. This thickness is much smaller than the thickness of the planarization layer, which can avoid the second conductive structure from forming a large bending structure at the via hole in the first area. The material of the insulating structure layer 23 includes silicon nitride. Of course, the insulating structure layer 23 can also include other materials, such as silicon oxide, silicon oxynitride, etc., which are not limited by the embodiments of the present application. The insulating structure layer 23 can also be a passivation layer in the display panel, which is used to protect the structures in the display panel. For example, to avoid the external moisture from corroding the internal structures of the display panel.

[0096] In an example embodiment, the display panel further comprises a second planar layer 25 disposed on the substrate 21 with the second conductive structure 24. The material of the second planar layer 25 can include resin glue.

[0097] The display panel further comprises a transparent conductive trace 26 disposed on a side of the second planar layer 25 away from the substrate 21.

[0098] Optionally, the second conductive structure 24 can be a metal conductive structure. For example, the second conductive structure 24 can be a three-layer composite structure of titanium, aluminum, and titanium. The material and structure of the first conductive structure can refer to the second conductive structure, which will not be described here.

[0099] In an example embodiment, the display panel provided by the present application is a display panel with a light-transmissive display area having a certain light transmittance for realizing an under-screen camera function.

[0100] In the present application, the first conductive structure 22 and the second conductive structure 24 can both be source-drain metal patterns. For example, the first conductive structure 22 is a first source-drain metal pattern, and the second conductive structure is a second source-drain metal pattern.

[0101] In summary, the display panel provided by the present application has the following advantages. By providing an insulating structure layer with a first area having a relatively small thickness and a second area having a relatively large thickness, and by disposing the second conductive structure in the first area having a relatively small thickness and electrically connecting the second conductive structure to the first conductive structure through the via in the insulating structure layer in the first area, the structure of the second conductive structure is relatively flat and does not have a large bending structure. This solves the problem in the related art that the second conductive structure forms a large bending structure at the via of the planar layer, which can result in a low yield of the display panel. The yield of the display panel is improved.

[0102] In addition, in the display panel provided by the present application, the insulating structure layer has two thicknesses, and the second conductive structure is disposed in the area having a relatively small thickness. This makes the substrate with the second conductive structure have a high flatness as a whole, which is beneficial to the formation of subsequent film structures.

[0103] Figure 7 FIG. 1 is a method flowchart of a method for manufacturing a display panel provided by an example embodiment of the present application. The method comprises the following steps:

[0104] Step 701. Forming a first conductive structure on a substrate.

[0105] Step 702. Form an insulating structure layer on the substrate base plate with the first conductive structure, the insulating structure layer has a first region and a second region, the second region surrounds the first region, the thickness of the insulating structure layer in the first region is less than the thickness of the insulating structure layer in the second region, the first region has a via hole, and the orthographic projection of the first conductive structure on the substrate base plate and the orthographic projection of the via hole on the substrate base plate have an overlapping region.

[0106] Step 703. Form a second conductive structure on the substrate base plate with the insulating structure layer, the second conductive structure is located in the first region and is electrically connected to the first conductive structure through the via hole.

[0107] In summary, the manufacturing method of the display panel provided in the embodiments of the present application forms an insulating structure layer with a first region of a relatively small thickness and a second region of a relatively large thickness, and the second conductive structure is located in the first region of the relatively small thickness and is electrically connected to the first conductive structure through the via hole in the first region of the insulating structure layer. In this structure, the structure of the second conductive structure is relatively flat and does not have a large bending structure, thereby solving the problem in the related art that the second conductive structure forms a large bending structure at the via hole of the planarization layer, which may cause a low yield of the display panel. The effect of improving the yield of the display panel is achieved.

[0108] In addition, in the display panel provided in the embodiments of the present application, the insulating structure layer has two thicknesses, and the second conductive structure is formed in the region with a relatively small thickness, so that the substrate base plate with the second conductive structure has a relatively high flatness, which is beneficial to the formation of subsequent film layer structures.

[0109] As described in the above embodiments, in the display panel provided in the embodiments of the present application, the insulating structure layer has two regions with different thicknesses. The insulating structure layer with this structure has at least two structures, and the formation methods of the two structures are described below.

[0110] Figure 8 FIG. 1 is a method flow chart of another manufacturing method of a display panel provided in the embodiments of the present application. The method includes the following steps:

[0111] Step 801. Form a first conductive structure on a substrate base plate.

[0112] The first conductive material layer can be first formed on the substrate base plate, and then the first conductive material layer is processed into the first conductive structure through a patterning process.

[0113] In the embodiments of the present application, the patterning process can include processes such as coating photoresist, exposure, development, etching, and stripping photoresist.

[0114] The first conductive structure 24 can be a metal conductive structure. For example, the first conductive structure can be a three-layer composite structure of titanium, aluminum and titanium.

[0115] Step 802. Form an insulating layer on the substrate with the first conductive structure, the insulating layer having a via.

[0116] The insulating layer can be formed on the substrate with the first conductive structure, and then the via can be formed on the insulating layer by a patterning process, so that the first conductive structure is exposed at the via. The material of the insulating layer includes silicon nitride. Of course, the insulating layer can also include other materials, such as silicon oxide, silicon oxynitride, etc., and the embodiments of the present application do not limit this. The insulating layer can also be a passivation layer in the display panel, which can protect the structures in the display panel. For example, to avoid the external moisture from corroding the internal structures of the display panel.

[0117] Step 803. Form a first planar layer on the substrate with the insulating layer, the first planar layer having an opening in the first region.

[0118] Similarly, the planar material layer can be formed on the substrate with the insulating layer, and then the opening can be formed in the planar layer in the first region by a patterning process. The first region can be a region for subsequently arranging the second conductive structure, and the via on the insulating layer is also located in the first region.

[0119] At the end of step 803, the structure of the substrate can be as shown in Figure 9 The first conductive structure 22, the insulating layer 231 and the first planar layer 232 are sequentially formed on the substrate 21. The opening k3 of the first planar layer 232 is located in the first region q1.

[0120] Step 804. Form a second conductive structure on the substrate with the first planar layer, the second conductive structure being located in the first region and electrically connected to the first conductive structure through the via.

[0121] The second conductive material layer can be formed on the substrate with the first planar layer, and then the second conductive material layer can be processed into the second conductive structure by a patterning process.

[0122] The edge of the second conductive structure and the edge of the second region have a spacing. Since there can be some errors in the formation of various structures in the display panel, setting a spacing between the edge of the second conductive structure and the edge of the first region can reduce the possibility that the edge of the second conductive structure is on the second region.

[0123] It should be noted that the size of the spacing can be the same or different at different positions, and the embodiments of the present application do not limit this.

[0124] In an exemplary embodiment, the minimum distance between the edge of the second conductive structure and the edge of the first region is greater than or equal to the accuracy of a photolithography machine used to form the second conductive structure. In this structure, the edge of the second conductive structure 24 can be prevented from being on the second region due to the accuracy of the photolithography machine. For example, the minimum distance d between the edge of the second conductive structure 24 and the edge of the first region q2 is greater than or equal to 0.6 μm.

[0125] A second planar layer and a transparent conductive trace can then be sequentially formed on the substrate on which the second conductive structure is formed, and the structure can be as shown in Figure 5 Embodiments of the present application will not be described here.

[0126] In summary, the manufacturing method of the display panel provided by the embodiments of the present application forms an insulating structure layer having a first region with a relatively small thickness and a second region with a relatively large thickness, and the second conductive structure is located in the first region. The second conductive structure is electrically connected to the first conductive structure through the via in the first region of the insulating structure layer. In this structure, the second conductive structure is relatively flat and does not have a large bending structure. This solves the problem in the related art that the second conductive structure forms a large bending structure at the via of the planar layer, which can cause the yield of the display panel to be low. The yield of the display panel is improved.

[0127] In addition, in the display panel provided by the embodiments of the present application, the insulating structure layer having two thicknesses is formed, and the second conductive structure is formed in the region with a relatively small thickness. The substrate on which the second conductive structure is arranged has a high overall flatness, which is beneficial to the formation of subsequent film layer structures.

[0128] Figure 10 is a method flowchart of another manufacturing method of a display panel provided by the embodiments of the present application. The method includes the following steps:

[0129] Step 901. Form a first conductive structure on a substrate.

[0130] This step can refer to step 801 in the embodiment shown in Figure 9 Embodiments of the present application will not be described here.

[0131] Step 902. Form an insulating structure layer by a gray-tone mask process.

[0132] The insulating structure layer has a first region and a second region, the second region surrounds the first region, the thickness of the insulating structure layer in the first region is smaller than that in the second region, the first region has a via, and the orthographic projection of the first conductive structure on the substrate overlaps the orthographic projection of the via on the substrate.

[0133] The gray-tone mask process is a process of using a gray-tone mask plate as a mask for exposure, different regions of the gray-tone mask plate can have different light transmittances, and a structure with different thicknesses in different regions can be formed based on the gray-tone mask process. For example, as shown in Figure 11 is a structural diagram of the substrate at the end of step 902. The thickness h2 of the second region q2 of the insulating structure layer 23 is greater than the thickness h1 of the first region q1, and the first region q1 has a via k2.

[0134] Step 903. Form a second conductive structure on the substrate with the insulating structure layer, the second conductive structure is located in the first region and is electrically connected to the first conductive structure through the via.

[0135] The formation of the second conductive structure can refer to step 804, and the embodiments of the present application will not be repeated here.

[0136] After step 903, a second planar layer and a transparent conductive trace can be sequentially formed on the substrate with the second conductive structure, and the structure can be as shown in Figure 6 , and the embodiments of the present application will not be repeated here.

[0137] In summary, the manufacturing method of the display panel provided by the embodiments of the present application forms an insulating structure layer with a relatively thin first region and a relatively thick second region, and the second conductive structure is located in the relatively thin first region, and the second conductive structure is electrically connected to the first conductive structure through the via in the first region. With such a structure, the structure of the second conductive structure is relatively flat and does not have a large bending structure, solving the problem in the related art that the second conductive structure forms a large bending structure at the via of the planar layer, which can cause the yield of the display panel to be low. The effect of improving the yield of the display panel is achieved.

[0138] In addition, in the display panel provided by the embodiments of the present application, the insulating structure layer with two thicknesses is formed, and the second conductive structure is formed in the region with a relatively thin thickness, so that the overall flatness of the substrate with the second conductive structure is high, which is beneficial to the formation of subsequent film structures.

[0139] In addition, as shown in Figure 12 is a structural diagram of a display device provided by an embodiment of the present application. The display device can include any of the display panels 20 provided by the above embodiments. The display device can also include an image acquisition component 30. The display panel 20 has a light-transmitting display area t1, and the image acquisition component can be located on the back of the light-transmitting display area t1 of the display panel (i.e., the display panel) to realize the under-screen camera function.

[0140] It is to be understood that the sizes of the layers and regions shown in the drawings have been exaggerated for clarity. It will be further understood that when a layer or element is referred to as being "on" another layer or element, it can be directly on the other layer or element or intervening layers can also be present. Similarly, when a layer or element is referred to as being "beneath" another layer or element, it can be directly beneath the other layer or element or one or more intervening layers or elements can also be present. In addition, it will be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer or element between the two layers or elements or one or more intervening layers or elements can also be present. Like reference numerals refer to like elements throughout.

[0141] In this application, the terms "first", "second", etc. are used only to describe different instances, and do not imply or suggest relative importance.

[0142] The above description is only optional embodiments of the present application, and is not used to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate substrate; the substrate substrate comprises a first display area and a second display area; a first conductive structure on the substrate substrate; an insulating structure layer on the substrate substrate provided with the first conductive structure, the insulating structure layer has a first area and a second area surrounding the first area, the thickness of the insulating structure layer in the first area is less than that in the second area, and a through hole is formed in the insulating structure layer in the first area, and the first conductive structure on the substrate substrate and the through hole on the substrate substrate have an overlapping area in the orthogonal projection; a second conductive structure on the side of the insulating structure layer away from the substrate substrate, the second conductive structure is located in the first area and is electrically connected with the first conductive structure through the through hole; a second planar layer on the side of the second conductive structure away from the substrate substrate; a transparent conductive trace on the side of the second planar layer away from the substrate substrate, the transparent conductive trace is used for connecting a light emitting element and a pixel circuit in a second pixel unit, the pixel circuit of the second pixel unit is located in the first display area, and the light emitting element of the second pixel unit is located in the second display area; wherein the orthogonal projection of the transparent conductive trace on the substrate and the orthogonal projection of the second conductive structure on the substrate are overlapped.

2. The display panel of claim 1, wherein, The edge of the second conductive structure and the edge of the first area have a spacing.

3. The display panel of claim 1, wherein, The insulating structure layer comprises an insulating layer and a first planar layer on the side of the insulating layer away from the substrate substrate, the through hole is located in the insulating layer, the first planar layer has an opening in the first area, and the orthogonal projection of the through hole on the substrate substrate is located in the orthogonal projection of the opening on the substrate substrate.

4. The display panel of claim 3, wherein, The first planar layer is located in the second area, the edge of the second conductive structure and the edge of the opening have a spacing, and the thickness of the second conductive structure is less than the thickness of the first planar layer.

5. The display panel of claim 2, wherein, The minimum spacing between the edge of the second conductive structure and the edge of the first area is greater than or equal to 0.6 microns.

6. The display panel of any of claims 1-5, wherein, The thickness of the insulating structure layer in the first area ranges from 500 angstroms to 1000 angstroms.

7. The display panel according to any one of claims 1-5, wherein, The first conductive structure and the second conductive structure are metal conductive structures.

8. The display panel of claim 1, wherein, The material of the insulating structure layer comprises silicon nitride.

9. The display panel according to any one of claims 1-5, wherein, The display panel further comprises a transparent conductive trace and a plurality of pixel units, the pixel units comprise pixel circuits and light emitting elements, the pixel circuits are configured to drive the light emitting elements, the plurality of pixel units comprise a first pixel unit and a second pixel unit, and the pixel circuits and the light emitting elements of the first pixel unit are both located in the first display area.

10. The display panel of claim 9, wherein, The second display area is a light transmission display area.

11. The display panel of claim 9, wherein, A normal projection of the pixel circuit of the first pixel unit on the substrate and a normal projection of the light emitting element of the first pixel unit on the substrate at least partially overlap, and a normal projection of the pixel circuit of the second pixel unit on the substrate and a normal projection of the light emitting element of the second pixel unit on the substrate do not overlap.

12. The display panel of claim 11, wherein, A normal projection of the transparent conductive trace on the substrate and a normal projection of the pixel circuit of the first pixel unit on the substrate at least partially overlap.

13. The display panel of claim 9, wherein, The first conductive structure, the second conductive structure and the via are located in the first display area.

14. A display device comprising: The display device comprises the display panel of any one of claims 1-13.

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