Packaged electronic device with integrated antenna and locking structure

Abstract

Packaged electronic device with integrated antenna and locking structure. A packaged electronic device includes an integrated antenna as part of a conductive lead frame. The conductive lead frame includes a die pad having an elongated conductive beam structure configured as a transmission line; and a ground plane structure disposed around the die pad. The ground plane includes a gap in which the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the lead frame are configured with conductive connection structures to function as ground pins, feed pins and / or waveguides. In an alternative embodiment, a portion of the integrated antenna is embedded within the body of the packaged electronic device and is partially exposed.

Description

[0001] This application is a divisional application of the invention entitled “Packaged electronic device with integrated antenna and locking structure” filed on July 7, 2016, with application number 201610534682.3. Technical Field

[0002] The present invention relates generally to electronic devices and, more particularly, to packaged electronic structures and methods of forming electronic structures.

[0003] Cross-references to related applications:

[0004] This application claims priority to U.S. patent application Ser. No. 14 / 931,750, filed Nov. 3, 2015, and entitled “Packaged Electronic Device with Integrated Antenna and Locking Structure,” the contents of which are hereby incorporated by reference in their entirety. Background Art

[0005] The market for wireless and portable handheld communications applications is an example of a market that continues to grow and evolve, with an increasing effort to integrate more electronic functionality into smaller, lighter, thinner, and lower-cost solutions. One of the ongoing challenges for these applications is improving and integrating effective antennas into various product platforms. Several approaches have been developed and implemented in a variety of form factors, but they generally use more traditional antenna designs, such as discrete foil strips and individual retractable dipole antennas located inside or outside the product, as well as combinations thereof. Such antennas include slot antennas, inverted-F antennas ("IFAs"), planar inverted-F antennas ("PIFAs"), and various microstrip antenna (also known as "patch" antenna) configurations.

[0006] Antennas used in wireless applications have been incorporated into the product's housing as separate, discrete components, using materials such as conductive tape, incorporated into the product's housing using carbon-based materials to form an appropriate antenna array, or incorporated as a separate, discrete component electrically connected to the device's RF section. Other approaches have incorporated the antenna as a separate component on the system's printed circuit board ("PCB"), utilizing the characteristics of the PCB and other antenna components in the application to perform the antenna's function.

[0007] Each of these previous approaches increases the cost of the device. Furthermore, these previous approaches are difficult to design, consume energy due to inefficient operation, increase the size of the application, and limit the absolute size and / or form factor of the application. Furthermore, each solution or technology is specific to the device for which it is designed, which minimizes design reuse and increases the complexity of the device design cycle, further increasing costs and increasing product time to market.

[0008] Another ongoing challenge for electronic packaged devices is delamination of the mold compound ("EMC") in substrate-based packaged electronic devices (e.g., leadframe-packaged electronic devices). Delamination is often encountered during reliability stress testing, thus limiting the use of these package types in certain applications and markets. Delamination exceeding acceptable industry standard limits (such as those defined in JEDEC standards) is typically defined as a reliability risk and causes the device to fail reliability qualification testing. In the past, typical corrective action has been to change the device's bill of materials and / or redesign components at the packaging level, such as the substrate.

[0009] The automotive industry has proposed redefining the acceptable limit for delamination at the packaging level to essentially zero. This desired goal is being actively pursued by the entire integrated circuit packaging and assembly industry. The solutions currently pursued and proposed have focused primarily on changes in the structure of the mold compound and the die attach material. Furthermore, a lot of development has been applied to the treatment of the substrate surface in the form of roughening techniques, both of which can be applied chemically and mechanically. Generally in this approach, a roughening process has been applied to the surface of a substrate and has been combined with selected modified mold compounds and die attach materials. This approach has been shown to provide some improvement in the adhesion between the mold compound and the substrate, thereby reducing delamination. Another approach has been to include protrusions or half-etched portions in the substrate and / or leads, which serve to increase the surface area for attachment to the mold compound. These features have also been used to provide stability to the leads.

[0010] However, existing solutions have not provided satisfactory results for larger body devices (e.g., devices having die pads larger than 4 millimeters (mm) by 4 mm), devices having long tie bar configurations (e.g., tie bars having a length greater than approximately 3 mm), or devices having highly utilized die-to-die attach pad wire bonds (commonly known as down-bonding), and combinations thereof.

[0011] Therefore, what is needed are structures and methods that provide improved antenna designs to, among other things, support industry demand for increased electronic functionality within smaller, lighter, thinner, and lower-cost solutions. Furthermore, it would be advantageous if such structures and methods were cost-effective by utilizing, for example, existing assembly processes and techniques. Furthermore, structures and methods are needed for reducing delamination in electronic packages, including packaging structures such as those disclosed below. Furthermore, it would be advantageous if such structures and methods reduced stress within the packaging structure to further improve reliability. Summary of the Invention

[0012] Generally speaking, embodiments of the present invention relate to a packaged electronic device with an integrated antenna, comprising a substrate including a first conductive die attach pad; and a first conductive lead spaced apart from a first side of the first conductive die attach pad. An electronic device is electrically connected to the first conductive lead, and a package body encapsulates the electronic device and further encapsulates at least a portion of the first conductive die attach pad and at least a portion of the first lead. In several embodiments, the integrated antenna comprises an antenna structure including the first conductive die attach pad and one or more of a second conductive lead; and an elongated conductive beam structure disposed proximate the first side of the first conductive die attach pad, the elongated conductive beam structure being electrically coupled to the first conductive die attach pad and one or more of the electronic device, wherein the package body encapsulates at least a portion of the elongated conductive beam structure. In one embodiment, the elongated conductive beam structure is configured to have a length greater than the length of the conductive leads. In one embodiment, the elongated conductive beam structure has a length that is at least 4 times the length of the conductive leads.

[0013] In another embodiment, a packaged electronic device structure with an integrated antenna includes a first die pad having a first major surface and a second major surface opposite the first major surface. A plurality of conductive leads (i.e., more than one lead) are spaced apart from an edge section of a periphery of the die pad. An electronic device is electrically connected to the plurality of conductive leads. A package body encapsulates the electronic device, at least a portion of the conductive leads, and at least a portion of the first die pad. An antenna structure is at least partially embedded within the package body, wherein the antenna structure includes a conductive structure configured to resonate in response to an electrical signal. Non-limiting examples of conductive structures configured to resonate in response to an electrical signal according to the present disclosure include uniquely configured die attach pads, elongated conductive beam structures, helical antenna structures, slot structures within a conductive pad or elongated conductive beam structure, conductive loop structures, waveguides, conductive post structures, and combinations thereof.

[0014] In another embodiment, a packaged electronic device structure with an integrated antenna includes a conductive leadframe, the conductive leadframe comprising a die pad having a first major surface and a second major surface opposite the first major surface; a plurality of conductive leads disposed spaced from an edge section of a periphery of the die pad; and a tie bar attached to the die pad. An electronic device is electrically connected to the plurality of conductive leads, and a molded package body encapsulates the electronic device, at least a portion of each conductive lead, and at least a portion of the die pad. An antenna structure is at least partially encapsulated within the molded package body, wherein the antenna structure includes a conductive structure configured to resonate in response to an electrical signal, the conductive structure including the die pad and one or more of a slot disposed within the die pad, another conductive pad, a conductive post structure, an elongated conductive structure, and an elongated conductive beam structure having a slot, wherein the respective conductive pad has an aperture disposed between major surfaces of the respective conductive pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a top view illustrating an electronic device with an integrated antenna according to one embodiment of the present invention;

[0016] Figure 2 yes Figure 1 Electronic devices along the Figure 1 The cross-sectional view taken along reference line 2-2 is also in accordance with an embodiment of the present invention further incorporating components of a lower level;

[0017] Figure 3 is a diagram illustrating an alternative embodiment according to the present invention. Figure 2 A partial cross-sectional view of a portion of an electronic device;

[0018] Figure 4 is a top view illustrating an electronic device with an integrated antenna according to another embodiment of the present invention;

[0019] Figure 5 According to an embodiment of the present invention Figure 4 The electronic device is further combined with the next level of components along the cross-sectional view of the reference line 5-5;

[0020] Figure 6 is a partial cross-sectional view illustrating an electronic device having an integrated antenna according to another embodiment of the present invention;

[0021] Figure 7 is a partial cross-sectional view illustrating an electronic device having an integrated antenna according to another embodiment of the present invention;

[0022] Figure 8 is a partial cross-sectional view illustrating an electronic device having an integrated antenna according to another embodiment of the present invention;

[0023] Figure 9 is a top view illustrating an electronic device with an integrated antenna according to another embodiment of the present invention;

[0024] Figure 10 is a top view illustrating an electronic device with an integrated antenna according to another embodiment of the present invention;

[0025] Figure 11 is a partial top view illustrating an electronic device having an integrated antenna according to one embodiment of the present invention;

[0026] Figure 12 is a partial top view illustrating an electronic device with an integrated antenna according to another embodiment of the present invention;

[0027] Figure 13 is a partial top view illustrating an electronic device with an integrated antenna according to another embodiment of the present invention;

[0028] Figure 14 is a partial top view illustrating an electronic device with an integrated antenna according to another embodiment of the present invention;

[0029] Figure 15 is a partial cross-sectional view illustrating an antenna structure for integration into a packaged electronic device according to the present invention;

[0030] Figure 16It is a depiction Figure 15 A bottom view of an embodiment of the present invention;

[0031] Figure 17 is a top view illustrating an electronic device with an integrated antenna according to one embodiment of the present invention;

[0032] Figure 18 is a top view illustrating an electronic device with an integrated antenna according to another embodiment of the present invention;

[0033] Figure 19 is a top view illustrating an electronic device with an integrated antenna according to one embodiment of the present invention;

[0034] Figure 20 is a partial top view illustrating an alternative embodiment of a slot antenna according to an embodiment of the present invention;

[0035] Figure 21 is a top view illustrating an electronic device with an integrated antenna according to one embodiment of the present invention;

[0036] Figures 22A to 22F is a diagram illustrating a method for Figure 21 A top view of an alternative slot configuration of an embodiment of FIG.

[0037] Figure 23 is a top view illustrating an electronic device with an integrated antenna according to one embodiment of the present invention;

[0038] Figure 24 It is a description of the present invention Figure 23 a partial top view of a portion of an electronic device after additional fabrication;

[0039] Figure 25 is a top view illustrating an electronic device with an integrated antenna according to one embodiment of the present invention;

[0040] Figure 26 is a top view illustrating an electronic device with an integrated antenna according to another embodiment of the present invention;

[0041] Figure 27 is a partial top view illustrating an electronic device having an integrated antenna according to one embodiment of the present invention;

[0042] Figure 28 is a partial top view illustrating an electronic device with an integrated antenna according to another embodiment of the present invention;

[0043] Figure 29is a partial top view illustrating an electronic device with an integrated antenna according to another embodiment of the present invention;

[0044] Figure 30 is a top view illustrating an electronic device with an integrated antenna according to one embodiment of the present invention;

[0045] Figure 31 is a top view illustrating an electronic device with an integrated antenna according to another embodiment of the present invention;

[0046] Figure 32 is a top view illustrating an electronic device with an integrated antenna according to one embodiment of the present invention;

[0047] Figure 33 It is a depiction Figure 32 Another top view of the electronic device;

[0048] Figure 34 is a top view illustrating an electronic device with an integrated antenna according to one embodiment of the present invention;

[0049] Figure 35 It is a depiction Figure 34 A cross-sectional view of the electronic device taken along reference line 35-35;

[0050] Figure 36 is a cross-sectional view illustrating an electronic device having an integrated antenna according to an embodiment of the present invention;

[0051] Figure 37 is a partial cross-sectional view illustrating an embedded antenna according to an embodiment of the present invention; and

[0052] Figure 38 is a partially cutaway top perspective view illustrating a packaged electronic device with an integrated antenna according to another embodiment of the present invention;

[0053] Figure 39 is a bottom view illustrating a substrate structure according to an embodiment of the present invention;

[0054] Figure 40 yes Figure 39 A cross-sectional view of a substrate structure;

[0055] Figure 41 is a partial bottom view depicting a portion of a substrate structure according to another embodiment of the present invention;

[0056] Figure 42 is a partial bottom view depicting a portion of a substrate structure according to another embodiment of the present invention;

[0057] Figure 43 is a partial bottom view illustrating a portion of a substrate structure according to another embodiment of the present invention; and

[0058] Figure 44 is a partial bottom view illustrating a portion of a substrate structure according to another embodiment of the present invention.

[0059] For simplicity and clarity of illustration, the components in the drawings are not necessarily drawn to scale, and the same component symbols in different figures represent the same components. In addition, descriptions and details of well-known steps and components are omitted for simplicity of illustration. Those skilled in the art will recognize that the words "during," "simultaneously," and "while" as used herein with respect to circuit operation are not definitive terms indicating that an action occurs immediately after an initial action, but rather that there may be some small but reasonable delay between reactions initiated by the initial action, such as various transmission delays. Furthermore, the term "simultaneously" indicates that an action occurs within at least a portion of a duration of the initial action. The use of the words "about," "approximately," or "substantially" indicates that a value of a component having a parameter is expected to be close to a stated value or position. However, as is well known in the art, there are always minor variations that prevent the value or position from being exactly as stated. The terms first, second, third, and the like in the claims and / or in the detailed description of the drawings (as used as part of a name of a component) are used to distinguish between similar components and are not necessarily used to describe a sequence in time, space, ranking, or in any other manner. It will be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments described herein are capable of operation in other sequences than those described or depicted herein. Furthermore, it will be understood that In cases where a layer or region is described herein as being formed or disposed on a second layer or another region, the first layer may be formed or disposed directly above the second layer, or there may be intervening layers between the first and second layers. Furthermore, as used herein, the term "formed on" is used synonymously with "located on" or "disposed on" and is not intended to be limiting with respect to any particular process. Furthermore, the term "primary surface," when used in conjunction with a semiconductor region, wafer, or substrate, refers to the surface of the semiconductor region, wafer, or substrate that forms an interface with another material (e.g., a dielectric, an insulator, a conductor, or a polycrystalline semiconductor). The primary surface may have a surface topography that varies in the x, y, and z directions. DETAILED DESCRIPTION

[0060] In some applications, electronic devices such as semiconductor dies are enclosed in a plastic package that provides protection from harsh environments and enables electrical interconnection between the semiconductor die and underlying components such as a printed circuit board (PCB) or motherboard. The components of such a package typically include a conductive substrate such as a metal leadframe, an integrated circuit or semiconductor die, a bonding material for attaching the semiconductor die to the leadframe, interconnect structures that electrically connect pads on the semiconductor die to individual leads of the leadframe, and a rigid plastic encapsulating material that covers the other components and forms the exterior of the semiconductor package, often referred to as the package body.

[0061] The leadframe is the central support structure of the package and is typically manufactured by chemically etching or mechanically stamping a metal strip. A portion of the leadframe is internal to the package, completely surrounded by the plastic encapsulation material or package body. Other portions of the leadframe's leads may extend from the package body or be partially exposed for electrical connection to another component.

[0062] This description is directed to electronic packaging structures having integrated antenna structures and, in some embodiments, electronic components such as semiconductor components and / or passive components. Examples of semiconductor packages related to the present invention include but are not limited to The present invention relates to a multi-module package ("MLF"), including a dual-row MLF-type package ("DR-MLF"); a quad flat no-lead package ("QFN"); a small outline no-lead package ("SON"); a dual-flat no-lead package ("DFN"); a quad flat package ("QFP"); a thin substrate chip scale package ("tsCSP"); an advanced QFN package ("aQFN"); and a grid array package ("GQFN"). For example, the aforementioned packages are related because they include a conductive substrate, such as a lead frame with a die attach structure or pad, which may be exposed or encapsulated, and they include material properties that support antenna designs according to embodiments of the present invention. For example, these packages include conductive materials such as copper, nickel, gold, silver, palladium, iron, and others in the composition of the incorporated lead frame, and these packages include insulating materials such as epoxy molding compound.

[0063] Additionally, several types of antenna designs may be configured within a packaged substrate design according to the present embodiments. These include, but are not limited to, loop antennas, broadband dipoles, monopole antennas, folded dipole antennas, microstrip or patch antennas, planar inverted-F antennas ("PIFA"), inverted-F antennas ("IFA"), Vivaldi antennas, slotted waveguide antennas, variations of half-wave and quarter-wave antennas. These designs may be configured to utilize appropriately configured and oriented die attach pads, lead fingers, tie bars, and additional conductive components to form antennas configured for applications including, but not limited to, wireless handheld devices requiring an RF signal to be transmitted and / or received, such as, but not limited to, smartphones, two-way communication devices, PC tablets, RF tags, sensors, and Wi-Fi devices, the Internet of Things ("IoT"), home security, remote control devices, and others. Several of these designs are described below, but those skilled in the art will recognize that the present invention is relevant to any antenna design enabled by the components and features described herein. Furthermore, those skilled in the art will recognize that while the following description focuses on various leadless leadframe-based embodiments, the same principles of implementation can be applied to leaded leadframe packages.

[0064] Although this description tends to use a leadframe-type substrate, it is understood that the present disclosure is also applicable to other types of substrates, including but not limited to build-up substrates and other substrates known to those skilled in the art. Furthermore, throughout this description, reference is made to an electronic component 23, electronic device 23, or electronic chip 23, which can be a semiconductor integrated circuit ("IC") such as a mixed-signal IC, a microcontroller, a power semiconductor device such as an RF power transistor, other types of logic and / or analog devices, or integrated functions, integrated passive functions, application-specific integrated circuits ("ASICs"), and other types of similar semiconductor devices known to those skilled in the art. The electronic component 23 can provide control, monitoring, filtering, amplification, power supply, and other functions for the integrated antenna described below, or the electronic component 23 can be isolated and / or independent of the functions required to control, monitor, power, or interact or electrically communicate with the integrated antenna. However, in some embodiments, according to the present disclosure, the electronic component 23 preferably electrically communicates with the integrated antenna device to provide a space-efficient packaged device.

[0065] Figure 11 is a top view of a packaged electronic device 10 or electronic device 10 having an integrated antenna 11 according to a first embodiment. In this embodiment, the integrated antenna 11 is an embodiment configured as a microstrip or patch antenna in a QFN or MLF type package. The electronic device 10 includes a substrate 12 or a conductive substrate 12, such as a conductive lead frame 12 or lead frame 12. In one embodiment, the lead frame 12 includes a generally quadrilateral (e.g., square) die pad 13 or die pad 13 defining four peripheral edge segments and a plurality of first conductive leads 14 or leads 14, the leads 14 being separable into four (4) groups, wherein the leads 14 of each group are spaced apart from the die pad 13 and extend generally perpendicularly from a corresponding one of the peripheral segments of the die pad 13. It is understood that the lead frame 12 may include more or fewer leads than depicted in this embodiment.

[0066] According to this embodiment, leadframe 12 further includes a ground plane structure 16. In this embodiment, ground plane structure 16 has a frame-like or ring-like structure that substantially surrounds die pad 13 and is disposed between die pad 13 and leads 14. In one embodiment, ground plane structure 16 includes a gap or space 17 disposed within or on a side of ground plane structure 16. In one embodiment, ground plane structure 16 may include one or more conductive fingers 19 extending generally perpendicularly from a side surface of ground plane structure 16 toward die pad 13. As will be explained later, conductive fingers 19 may be disposed at default locations on one or more associated die pads 13 to provide various antenna configurations according to this embodiment. In some embodiments, ground plane structure 16 may be connected to leadframe 12 as part of a tie bar arrangement (not shown), and this connection to the tie bar arrangement may be separated after the molded package body 26 is formed.

[0067] According to the present embodiment, an elongated conductive beam structure 21, an elongated conductive body 21, or a conductive transmission line 21 is configured to be connected to one of the peripheral edge sections of the die pad 13 and to extend approximately vertically from the peripheral edge section toward an external edge 22 of the electronic device 10. In a preferred embodiment, the elongated conductive beam structure 21 is configured to extend from a center line of the die pad 13 and extend to the external edge 22 through the gap 17 of the ground plane structure 16. In one embodiment, the die pad 13 and the elongated conductive beam structure 21 have a thickness different from that of the lead 14 and the ground plane structure 16. More specifically, the die pad 13 and the elongated conductive beam structure 21 can be partially etched from their respective lower surfaces so that the lower surfaces are on a plane different from the lower surfaces of the lead 14 and the ground plane structure 16. This is in Figure 1 1. This is indicated by dense hatching sloping downward from right to left. In some embodiments, portion 140 of lead 14 is also partially etched to provide a locking mechanism or structure to package body 26. It is understood that in other embodiments, ground plane structure 16 may also be partially etched to provide a locking mechanism or structure.

[0068] The electronic device 10 further includes one or more electronic components 23 (such as semiconductor devices 23) disposed on a surface of the die pad 13. Figure 1 , the electronic component 23 is depicted as a dotted line so as not to obstruct the etched horizontal oblique hatching used to depict the portion of the die pad 13. In some embodiments, the electronic component 23 includes a bonding pad 24 covering a surface of the electronic component 23 for electrically connecting the electronic component 23 to the lead 14, the die pad 13, and / or the ground plane structure 16. For example, the bonding pad 24 is electrically connected to the lead 14 using a conductive structure 27, such as a wire bond 27, a conductive clip, or other conductive structure known to those skilled in the art.

[0069] Electronic device 10 further includes an encapsulating material applied to the electronic components, the conductive structures, portions of the leads 14, portions of the ground plane structure 16, the die pad 13, and the elongated conductive beam structure 21 to form a package body 26. In this embodiment, the lower and outer end surfaces of the leads 14 are exposed in package body 26; the lower surface of the ground plane structure 16 is exposed in the lower surface of package body 26; and one end portion of the elongated conductive beam structure 21 is exposed in a side surface of package body 26. In some embodiments, package body 26 comprises an insulating material, such as an epoxy molding compound ("EMC"), or other materials known to those skilled in the art. In some embodiments, package body 26 is formed using overmolding techniques. In other embodiments, injection molding techniques are used to form package body 26.

[0070] According to the present embodiment, the integrated antenna 11 includes an elongated conductive beam structure 21, a ground plane structure 16, and a die pad 13. More specifically, in one embodiment, the integrated antenna 11 is configured as a quarter-wave (λ / 4) type antenna structure that is contained within the package body 26 along with the leads 14 and the electronic components 23. In one embodiment, the lead frame 12 can be etched or stamped to provide an assembly of the electronic device 10 with the integrated antenna 11. According to the present invention, the etching process used to form the lead frame 12 is conveniently provided or enables enhanced flexibility in the design of the lead frame 12 and the integration of the antenna design. In addition, it is understood that a combination of etching and stamping techniques can be utilized in embodiments in which the die pad is configured to be non-exposed through one or more surfaces of the package body 26.

[0071] Figure 2 The electronic device 10 having an integrated antenna 11 is arranged along the Figure 1 Cross-sectional view taken along reference line 2-2 in FIG. Figure 2 1 is a further illustration of an example of a conductive structure, such as a wire bond 27 electrically connecting a pad 24 covering a surface of an electronic component 23 to a lead 14 . Figure 2 The electronic device 10 is also depicted as being further integrated with a next-level component, such as a printed circuit board 20. In one embodiment, the printed circuit board 20 includes a plurality of conductive traces, such as a conductive ground plane 31 and contacts 32 and 33.

[0072] In one embodiment, the conductive ground plane 31 is electrically connected to the ground plane structure 16 to supplement the ground plane structure for the antenna structure 11. In one embodiment, the elongated conductive beam structure 21 can be electrically connected to the contact 33 using a conductive connection structure such as a wire bond 27. In an alternative embodiment, the elongated conductive beam structure 21' can be configured to have a full-thickness distal portion that can be directly attached to the contact 33 using, for example, a solder layer 34 or a conductive adhesive layer 34, as in Figure 3 The one painted in.

[0073] As in Figure 2 As shown in the figure, the die pad 13 is not soldered or electrically connected to the printed circuit board 20, but is separated from the printed circuit board 20 by the package body 26. Advantageously, in this embodiment, the ground plane structure 16, which is provided as a ring-shaped structure, helps to fix the electronic device 10 to the printed circuit board 20, and by extending the ground plane along the side surface of the die pad 13, the performance of the integrated antenna 11 is further improved.

[0074] According to this embodiment, the integrated antenna 11 is configured as a patch or microstrip antenna, wherein the die pad 13 provides the patch antenna portion, and the elongated conductive beam structure 21 provides a transmission line that feeds or supplies the patch antenna portion. Thus, the die pad 13 has a length 36 and a width 37 and is enclosed (at least partially) within a dielectric material (i.e., the package body 26) having a thickness 38 and a selected dielectric constant. In this embodiment, the dielectric material used for the package body 26 can be selected to provide a dielectric constant that optimizes the impedance for a selected design. In a preferred embodiment, the die pad 13, the ground plane structure 16, and the elongated conductive beam structure 21 comprise a highly conductive metal, such as copper, a copper alloy, or the like.

[0075] In one embodiment, integrated antenna 11 has a length 36 equal to half a wavelength as determined by the dielectric medium selected for package body 26. In one embodiment, the operating frequency of integrated antenna 11 is determined by length 36 as a function of width 37. More specifically, width 37 is a factor that determines the input impedance of integrated antenna 11. For example, by increasing width 37, the impedance of integrated antenna 11 can be reduced. In other embodiments, depending on the interplay of the dielectric constant of the dielectric or insulating material used for package body 26, a length 36 that is less than width 37 tends to increase the bandwidth of integrated antenna 11. For example, a square die pad 13 will have an input impedance of approximately 300 ohms.

[0076] In a field such as standard wireless handheld applications, mobile phone transceiver applications, In embodiments of applications such as wireless communication, RF tag applications, or other wireless or quasi-wireless applications, lead frame 12 can have a thickness of approximately 200 microns (approximately 8 mils). It has been found that in these types of applications, a thickness of approximately 0.05 of a wavelength provides acceptable operation of integrated antenna 11. It has further been observed that this embodiment of integrated antenna 11 has a directivity of approximately 5-7 dB, and the electric fields are appropriately linearly polarized and in the horizontal direction, with the width 37 of die pad 13 being equal to its length 36 and equal to 0.5λ.

[0077] According to this embodiment, it was further observed that the bandwidth of the integrated antenna 11 is generally small, with a typical value of approximately 3%. For example, a typical design of the integrated antenna 11 configured to operate at 100 MHz will resonate at approximately 96 MHz. It is believed that this loss is a result of the fringing electric field around the structure of the integrated antenna 11, which is a cause of the resonance of the integrated antenna 11.

[0078] The integrated antenna 11 design, as well as other patch antenna designs described below, generally behaves like an open transmission line, and therefore the voltage reflection coefficient can be assumed to be approximately -1. Therefore, the voltage associated with the antenna feed will be in antiphase with the current path in the antenna circuit. Consequently, the voltage is at a maximum at the farthest end of the die pad 13 (i.e., further from the end of the elongated conductive beam structure 21). At the opposite end of the die pad 13 (approximately λ / 2), the voltage is at a minimum.

[0079] Figure 41 is a top view of a packaged electronic device 40 or electronic device 40 having an integrated antenna 41 according to a second embodiment. In this embodiment, the integrated antenna 41 is another embodiment of a microstrip or patch antenna. The electronic device 40 is similar to the electronic device 10, and the integrated antenna 41 is similar to the integrated antenna 11, so only the differences in these structures will be described below. In this embodiment, the electronic device 40 includes a die pad 43 or die pad 43 having a reduced thickness edge portion 430. In one embodiment, the edge portion 430 extends along each peripheral edge segment of the die pad 43. In addition, the electronic device 40 includes an elongated conductive beam structure 21', an elongated conductive body 21', or a conductive transmission line 21', which is configured to connect to one of the peripheral edge segments of the die pad 43 and extend generally perpendicularly from the peripheral edge segment toward an outer edge 22 of the electronic device 40. Furthermore, in electronic device 40, ground plane structure 46 is configured as part of a tie bar structure that initially functions to support die pad 43 using portion 49 during assembly, and then is used as a ground plane after portion 49 is actually separated from die pad 43, such as after package body 26 is formed. In addition, the remaining portion of portion 49 can be utilized as conductive fingers 19 (as in Figure 1 ), as part of the antenna structure 41.

[0080] Figure 5 The electronic device 40 is further combined with a printed circuit board 50 along Figure 4 In this embodiment, the printed circuit board 50 includes an insulating ground plane structure 56 embedded therein, and the ground plane structure 56 is electrically connected to the ground plane structure 46 through the contact 51. Figure 5 As shown, a portion of the lower surface of the die pad 43 is exposed through the lower surface of the package body 26 and can be attached to the printed circuit board 50 using, for example, an insulating adhesive or other material as known to those skilled in the art. The elongated conductive beam structure 21' is electrically connected to the contact 53 using, for example, a conductive adhesive or other material as known to those skilled in the art. Furthermore, the lead 14 can be electrically connected to the contact 52 in a similar manner. In an alternative embodiment, the die pad 43 can be grounded to another contact pad disposed adjacent thereto on the printed circuit board 50 for applications requiring a grounded patch and / or for improved heat transfer.

[0081] Figure 6FIG2 depicts a packaged electronic device 60 or a partial cross-sectional view of an electronic device 60 having an integrated antenna 61 according to another embodiment. The electronic device 60 is similar to the electronic devices 10 and 40 , and only the differences are described herein. In this embodiment, the electronic device 60 includes a die pad 63 or die pad 63; and an elongated conductive beam structure 64, an elongated conductive body 64, or a conductive transmission line 64, which is configured to connect to a peripheral edge section of the die pad 63. In one embodiment, the elongated conductive beam structure 64 extends generally perpendicularly from the peripheral edge section of the die pad 63 toward an outer edge 22 of the electronic device 60. According to this embodiment, the elongated conductive beam structure 64 is configured in a down-set configuration such that the elongated conductive beam structure 64 is exposed through the same surface of the package body 26 as the ground plane structure 66. Furthermore, the die pad 63 is exposed through an opposite surface of the package body 26 as an example of a top exposed pad ("TEP") configuration. In this embodiment, the integrated antenna 61 can be configured as a microstrip or a patch antenna and includes the die pad 63, the elongated conductive beam structure 64, and the ground plane structure 66.

[0082] Figure 7 1 depicts a packaged electronic device 70 or a partial cross-sectional view of electronic device 70 having an integrated antenna 71 according to another embodiment. Electronic device 70 is similar to electronic device 60, and only the differences are described herein. In this embodiment, electronic device 70 includes a die pad 73 or die pad 73; and an elongated conductive beam structure 74, an elongated conductive body 74, or a conductive transmission line 74 configured to connect to one of a peripheral edge section of die pad 73. In one embodiment, elongated conductive beam structure 74 extends substantially perpendicularly from the peripheral edge section of die pad 73 toward an exterior edge 22 of electronic device 70. In this embodiment, die pad 73 and elongated conductive beam structure 74 are exposed through the same surface of package body 26. Furthermore, ground plane structure 76 is exposed through an opposite surface of package body 26. Electronic device 70 is another example of a top-exposed pad configuration. In this embodiment, the integrated antenna 71 may be configured as a microstrip or a patch antenna and includes a die pad 73 , an elongated conductive beam structure 74 , and a ground plane layer 76 .

[0083] Figure 88 is a partial cross-sectional view of a packaged electronic device 80 or electronic device 80 having an integrated antenna 81 according to another embodiment. The electronic device 80 is similar to the electronic device 60 and only the differences are described herein. In this embodiment, the electronic device 80 includes a die pad 83 or die pad 83; and a tie bar 85 attached to the die pad 83. In one embodiment, the tie bar 85 is arranged in a downwardly disposed configuration and is exposed in the same surface of the package body 26 as the leads 14. The die pad 83 is exposed through an opposite surface of the package body 26. The electronic component 23 is attached to the die pad 83 on a side opposite the side of the die pad 83 that is exposed through the package body 26. In the present embodiment, the connecting rod 85 is not severed from the die pad 83 and is further configured in the electronic device 80 as an elongated conductive beam structure 84, an elongated conductive body 84, a conductive column structure 84, or a conductive transmission line 84, which is configured to be connected to one of the peripheral edge segments of the die pad 83 and extends toward an external edge 22 of the electronic device 80. According to the present embodiment, the die pad 83 and the elongated conductive beam structure 84 are exposed through opposite surfaces of the package body 26. In one embodiment, the elongated conductive beam structure 84 extends from a corner of the die pad 83. The electronic device 80 is another example of a top-exposed pad configuration. In the present embodiment, the integrated antenna 81 can be configured as a microstrip or patch antenna, wherein in a combination of a printed circuit board, for example, Figure 5 In the printed circuit board 50 depicted in FIG, a separate ground plane is disposed, for example, outside the electronic device 80. According to this embodiment, the exposed die pad configuration (including but not limited to Figure 5 、 6 , 7 and 8) can make it easy to ground the die pad to a printed circuit board according to specific application requirements.

[0084] The quarter-wavelength patch antenna is similar in configuration and design to the previously described microstrip or patch antennas 11 , 41 , 61 , 71 and 81 . Figure 9FIG2 is a top view of a packaged electronic device 90 or electronic device 90 having an integrated antenna 91 configured as a quarter-wave antenna, according to one embodiment. Electronic device 90 is similar to electronic devices 10 and 40, and only the differences will be described below. According to this embodiment, integrated antenna 91 is configured such that a distal end 130 or end 130 of die pad 13 (i.e., the end disposed opposite elongated conductive beam structure 21) is shorted to ground plane structure 16. In this embodiment, ground plane structure 16 is otherwise physically separated from die pad 13 by package body 26. In one embodiment, a conductive finger 191 extending from ground plane structure 16 toward die pad 13 and a conductive connection structure 92, such as a shorting wire 92, electrically connect die pad 13 to ground plane structure 16. According to this embodiment, because the die pad 13 (or the patch portion of the integrated antenna 91) is shorted to the ground plane structure 16 at the distal end 130, the current in the distal end 130 of the integrated antenna 91 is not forced to zero, as is the case with the previously described integrated microstrip antenna design. According to this embodiment, the integrated antenna 91 includes the die pad 13, the ground plane structure 16, the elongated conductive beam structure 21, and the shorting pin 92.

[0085] The configuration according to this embodiment produces a current-voltage distribution similar to that of a half-wave patch antenna. However, a functional difference of this embodiment is that the fringing electric fields responsible for the radiation of integrated antenna 91 are short-circuited at the distal end 130 (i.e., the end opposite transmission line 21) of die pad 13 (i.e., the patch), so that only the electric fields closest to elongated conductive beam structure 21 radiate or are active. Furthermore, the gain is reduced in electronic device 90; however, it was unexpectedly discovered that integrated antenna 91 maintains the same fundamental operational properties as exhibited in a half-wave patch design while reducing the antenna size by at least 50% (λ / 4, i.e., one-quarter wave). In alternative embodiments of electronic device 90, die pad 13 may have a bottom-exposed configuration (e.g., similar to electronic device 40), a non-exposed configuration (e.g., similar to electronic device 10), and / or a top-exposed configuration (e.g., similar to electronic devices 60 or 70).

[0086] Figure 10FIG2 depicts a packaged electronic device 100 or a top view of electronic device 100 having an integrated antenna 101 configured as a half-wavelength antenna, according to one embodiment. The half-wavelength patch antenna is a variation of the quarter-wavelength patch antenna. Electronic device 100 is similar to electronic devices 10, 40, and 90, and only the differences will be described below. According to this embodiment, integrated antenna 101 is configured such that an adjacent side 131 of die pad 13 (i.e., the side of the adjacent die pad 13 configured to connect to the elongated conductive beam structure 21; or the feed or source end of the adjacent patch portion of integrated antenna structure 101) is shorted to ground plane structure 16. In this embodiment, ground plane structure 16 is otherwise physically separated from die pad 13 by package body 26.

[0087] In one embodiment, a conductive finger 192 extending from the ground plane structure 16 toward the die pad 13 and a conductive connection structure 93, such as a shorting pin 93, electrically connect the die pad 13 to the ground plane structure 16. According to this embodiment, the grounding pin 93 is configured to introduce a parallel inductance into the impedance of the integrated antenna 101, which is a result of the patch antenna design and the frequency of the application. More specifically, the resulting parallel inductance shifts the resonant frequency of the integrated antenna 101. According to this embodiment, by varying the position of the shorting pin 93 along with the admittance and reactance of the integrated antenna 101, the resonant frequency can be modified and optimized (i.e., tuned) for a specific application. The integrated antenna 101, configured as a half-wavelength antenna, can be utilized in applications including, but not limited to, those requiring operation at frequencies greater than or equal to approximately 1 GHz. According to this embodiment, the integrated antenna 101 includes the die pad 13, the ground plane structure 16, the elongated conductive beam structure 21, and the shorting pin 93. In alternative embodiments of electronic device 100 , die pad 13 may have a bottom-exposed configuration (e.g., similar to electronic device 40 ), may be non-exposed (e.g., similar to electronic device 10 ), and / or may be top-exposed (e.g., similar to electronic devices 60 or 70 ).

[0088] Figure 11A top view of a packaged electronic device 110 or a portion of an electronic device 110 with an integrated antenna 111 is shown, depicting a first embodiment of a planar inverted-F antenna ("PIFA") configuration. The PIFA is another type of planar antenna that can be used in a variety of applications, including, for example, mobile wireless handsets such as cell phones, tablet computers, Wi-Fi cards, RF tags, and others. PIFAs are thin, omnidirectional, configurable in many different form factors, and resonant at a quarter wavelength (λ / 4). Thus, according to this embodiment, a PIFA can be made small, configured in a variety of form factors, and integrated into or within a packaged electronic device according to the present disclosure.

[0089] According to this embodiment, the electronic device 110 includes a conductive substrate 12, such as a lead frame 12, having a die attach pad 113, a die pad 113, or a die pad 113; an elongated conductive body 121, an elongated conductive beam structure 121, a conductive fused lead structure 121, or an elongated ground return portion 121; and a plurality of leads 114. In one embodiment, the elongated ground return portion 121 is configured as a U-shaped member, wherein an open portion of the U-shape is disposed away from the die pad 113. It is understood that the electronic device 110 may include additional leads 114, including additional leads disposed proximate to other peripheral side surfaces of the die pad 113.

[0090] In one embodiment, the die pad 113 is configured similarly to Figure 3 In one embodiment, the die pad 113 includes a rim portion 430 that is reduced in thickness, and in one embodiment, extends around the outer side surface of the die pad 113. The reduced thickness is Figure 11 , depicted by dense hatching sloping downward from right to left. According to this embodiment, die pad 113 is configured as a patch portion or patch structure for integrated antenna 111. More specifically, die pad 113 has a width 37 and a height 36 selected, for example, for a quarter wavelength.

[0091] In this embodiment, the elongated conductive ground return portion 121 has a length greater than or equal to the height 36 of the die pad 113 and partially encloses the lead 114 on a side 115 of the electronic device 110. The elongated conductive ground return portion 121 includes a partially etched portion 1210 similar to the edge portion 430 of the die pad 113. The elongated ground return portion 121 includes a first bonding portion 1211 at one end and a second bonding portion 1212 at an opposite end. The first bonding portion 1211 and the second bonding portion 1212 can have a full thickness to facilitate attachment to a subsequent component, such as a printed circuit board. The integrated antenna 111 also includes a conductive connection structure 116, conductive pin 116, or shorting pin 116 that electrically connects the elongated conductive ground return portion 121 to one end of the die pad 113. The integrated antenna 111 further includes a conductive connection structure 117 , conductive pin 117 , feed pin 117 , or probe feed pin 117 , which electrically connects the die pad 113 to one of the leads 114 , designated as a probe feed lead 1140 or feed lead 1140 .

[0092] According to this embodiment, the integrated antenna 111 is configured to resonate at a quarter wavelength by providing a shorting pin 116 at one end of the die pad 113. In one embodiment, the shorting pin 116 is provided at an end of the die pad 113 opposite the end adjacent to the first bonding portion 1211 of the die pad 113. The probe feed pin 117 is positioned between an open end 1213 of the elongated ground return portion 121 and the end shorted by the shorting pin 116. According to this embodiment, the input impedance of the integrated antenna 111 is determined (at least in part) by the placement of the shorting pin 116. For example, the closer the probe feed lead 1140 is to the shorting pin 116, the lower the input impedance will be. The variation in input impedance will be described in a later embodiment. By way of further example, if the desired input impedance is to be increased for tuning purposes, this can be accomplished, for example, by placing the probe lead 1140 further apart from the shorting pin 116.

[0093] In one embodiment, leads 114 are similar to leads 14 and may be configured with partially etched portions 140 to provide a locking mechanism for package body 26. Electronic device 110 is further depicted as having electronic component 23, which is further depicted as having pads 24 disposed on a surface of electronic component 23. Electronic device 110 is also depicted as having package body 26, which, as previously described, may have preselected material characteristics. In one embodiment, the die pad 113, leads 114, and the lower surfaces of portions 1211 and 1212 of the elongated group loop portion 121 are exposed through the surface of package body 26. According to this embodiment, package body 26 encapsulates, completely covers, or encloses shorting pins 116 and probe feed pins 117, which can enhance electric field effects and facilitate frequency tuning. Although not depicted, the electrical component 23 may be electrically connected to the lead 1140 , other leads, and / or the die pad 113 using conductive connection structures such as wire bonds 27 or other conductive structures known to those skilled in the art.

[0094] Figure 12 FIG2 is a top view of a packaged electronic device 120 or a portion of an electronic device 120 having an integrated antenna 126 according to another embodiment of a PIFA configuration. The electronic device 120 is similar to the electronic device 110, and only the differences will be described below. According to this embodiment, the electronic device 120 includes an elongated conductive body 122, an elongated conductive beam structure 122, or an elongated ground return portion 122 that extends only partially along a peripheral side surface of the die pad 113. In one embodiment, compared to the embodiment of FIG2 , FIG2 is a top view of a packaged electronic device 120 or a portion of an electronic device 120 having an integrated antenna 126 according to another embodiment of a PIFA configuration. Figure 11, the elongated ground return portion 121 is configured as a smaller or tighter group loop. In one embodiment, the elongated ground return portion 122 is configured as a U-shaped member, wherein the open portion is located opposite the die pad 113. In some embodiments, the elongated ground return portion 122 only at least partially encloses (e.g., partially encloses on one or more sides) or partially contains the probe feed lead 1140, while other leads 114 are not enclosed or surrounded by the elongated ground return portion 122. In other embodiments, the elongated ground return portion 122 may at least partially enclose one or more leads 114, while other leads 114 within the electronic device 120 may be located outside of the elongated ground return portion 122. According to the present embodiment, the elongated conductive beam structure 122 is configured to have two opposite ends that terminate in conductive lead structures 1211 and 1212 disposed along an edge of the package body 26. In the present embodiment, the integrated antenna 126 includes the die pad 113, the elongated ground return portion 122, the shorting pin 116, the probe feed pin, and the probe feed lead 1140. According to the present embodiment, the integrated antenna 126 is suitable for use in smaller body packages and for applications or designs where the input impedance is expected to be minimized (by design or operation).

[0095] In an alternative embodiment of a PIFA configuration according to the present invention, it may be desirable to load the PIFA antenna. This may be useful when the antenna assembly is very small and not necessarily resonant. According to one embodiment, the PIFA configuration can be loaded by adding a passive device, such as a capacitor, to cancel or counteract the inductance of the antenna structure. Figure 13 1 is a top view of a packaged electronic device 130 or a portion of an electronic device 130 having an integrated antenna 131. The electronic device 130 is similar to the electronic device 110, and only the differences will be described below. In this embodiment, a passive component 133 (e.g., a capacitor 133 or a loading capacitor 133) is configured to be electrically connected to the elongated ground return portion 121 and the die pad 113. According to a preferred embodiment, the capacitor 133 is configured to be remote from (i.e., not adjacent to) the probe feed pin 117. In one embodiment, as approximately Figure 13 As depicted in , capacitor 133 is disposed proximate to the open end 1213 of the elongated ground loop portion 121 .

[0096] According to this embodiment, the distance at which capacitor 133 is positioned within electronic device 130 can be determined by the frequency of operation, the dimensions of the chip capacitor, the characteristics of elongated ground return portion 121 (e.g., material thickness and width), and the routing used in the design. Furthermore, the value of capacitor 133 can be determined based on the dimensions of package body 26 and die pad 113. The material used for package body 26 also affects the value of capacitor 133, particularly in small body devices. In one embodiment, the value of capacitor 133 can be in a range from 2 picofarads to approximately 100 picofarads. It should be noted that in some embodiments, if the capacitance value is too large, it can reduce the effective radiation of the integrated antenna and affect its efficiency. According to one embodiment, integrated antenna 131 includes die pad 113, elongated ground return portion 121, shorting pin 116, probe feed pin 117, probe feed lead 1140, and passive component 133. According to this embodiment, the elongated conductive beam structure 121 is configured to have two opposite ends that terminate in conductive lead structures 1211 and 1212 disposed along an edge of the package body 26 .

[0097] Figure 14 FIG2 depicts a packaged electronic device 140 or a partial top view of an electronic device 140 having an integrated antenna 141 according to another embodiment. Electronic device 140 is similar to electronic devices 120 and 130 , and only the differences will be described below. According to this embodiment, electronic device 140 further includes a passive component 133 (e.g., capacitor 133 or loading capacitor 133 ) configured to electrically connect a lead 1141 to die pad 113 . In one embodiment, lead 1141 is disposed proximate an end of die pad 113 opposite the end of die pad 113 where probe feed pin 117 is disposed. According to this embodiment, integrated antenna 141 includes die pad 113, an elongated ground return structure 122 , a shorting pin 116 , a probe feed pin 117 , a probe feed lead 1140 , a passive component 133 , and a lead 1141 electrically connected to passive component 133 . According to this embodiment, the elongated conductive beam structure 122 is configured to have two opposite ends that terminate in conductive lead structures 1211 and 1212 disposed along an edge of the package body 26 .

[0098] Figure 15FIG2 is a partial cross-sectional view illustrating an antenna structure 151 suitable for integration into a packaged electronic device. The antenna structure 151 includes a substrate 153 or a build-up substrate 153, such as a multi-layer build-up substrate 153. In this embodiment, the antenna structure 151 is configured as a PIFA structure for integration into a packaged electronic device (e.g., one or more semiconductor components and / or one or more passive components and a package body, such as a molded package body). In one embodiment, the build-up substrate 153 includes multiple conductive layers, such as conductive traces 154 separated by insulating material 156 or one or more insulating layers 156. In one embodiment, the conductive traces 154 can be electrically interconnected using, for example, conductive through-via structures 157. Conductive structures 158, such as solder structures 158, are disposed on one side of the substrate 153, and a conductive patch layer 159 is disposed on an opposite side of the substrate 153.

[0099] According to this embodiment, the solder structure 158 includes a plurality of ground structures 1581 electrically connected to an embedded ground plane 161 disposed within the substrate 153. In one embodiment, the ground structures 1581 are electrically connected to the embedded ground plane 161 using ground pins 162 or conductive ground vias 162 extending into the substrate 153 to the embedded ground plane 161. In one embodiment, the solder structure 158 further includes signal structures 1582 electrically connected to the conductive traces 154 within the substrate 153. In one embodiment, the signal structures 1582 are electrically connected to the conductive traces 154 using conductive vias 157. In one embodiment, the patch layer 159 is electrically connected to or electrically shorted to the embedded ground plane 161 using a conductive via 163 or conductive pin 163. The solder structure 158 further includes a feed structure 1583 or a source structure 1583, which is electrically connected to the patch layer 159 using a conductive through hole 164 or a conductive pin 164. According to this embodiment, the conductive pin 164 extends through the substrate 153 and, for example, through an opening 165 or a gap 165 in the embedded ground plane 161.

[0100] Figure 161 is a bottom view of antenna structure 151, which includes a ground structure 1581, a signal structure 1582, and a feed structure 1583 disposed below or overlapping patch layer 159 (depicted in dashed lines). In one embodiment, feed structure 1583 and ground structure 1581 can be positioned symmetrically with respect to the center of the package body. In other embodiments, feed structure 1583 and ground structure 1581 can be positioned elsewhere on and / or within substrate 153 based on design requirements. Furthermore, antenna structure 151 can be tuned, for example, using one or more passive components, to achieve a desired efficiency and performance.

[0101] Figure 17 is a top view of a packaged electronic device 170 or electronic device 170 having an integrated antenna 171 according to an embodiment of an inverted-F antenna ("IFA"). According to this embodiment, the electronic device 170 includes a substrate 172 or conductive substrate 172, such as a conductive lead frame 172 or lead frame 172. In one embodiment, the lead frame 172 includes a generally rectangular die pad 173 or die pad 173 defining four peripheral edge segments, and a plurality of first leads 174 or leads 174. In one embodiment, the leads 174 can be separated into four (4) groups, wherein the leads 174 of each group are spaced apart from the die pad 173 and extend generally perpendicularly from a corresponding one of the peripheral edge segments of the die pad 173. It is understood that the lead frame 172 can include more or fewer leads than depicted in this embodiment, such as including additional rows of leads.

[0102] According to this embodiment, die pad 173 is configured to receive electronic component 23 as part of electronic package 170 and is configured as a ground plane structure for integrated antenna 171. According to this embodiment, integrated antenna 171 further includes an elongated conductive beam structure 176, an elongated conductive body 176, a conductive arm 176, a conductive transmission line 176, or a planar rectangular conductive element 176. In one embodiment, conductive arm 176 can be attached to die pad 173 using an elongated conductive beam structure 177 or a conductive shorting arm 177. It is understood that conductive arm 176 and conductive shorting arm 177 can be collectively referred to as an elongated conductive beam structure having two portions oriented perpendicular to each other. In one embodiment, conductive shorting arm 177 is attached to and integrated with die pad 173 and extends outwardly from one of the peripheral edge sections of die pad 173, generally perpendicularly and proximate a corner. More specifically, the die pad 173 , the conductive shorting arm 177 , and the conductive arm 176 form a single body.

[0103] In one embodiment, conductive arm 176 extends generally perpendicularly from an end portion of conductive shorting arm 177 and further extends generally parallel to the same peripheral edge section of die pad 173 where conductive arm 176 is attached to die pad 173. In one embodiment, integrated antenna 171 further includes a conductive feed 178 or conductive feed lead 178 extending generally perpendicularly from conductive arm 176 and outwardly toward an outer edge of package body 26. A gap 179 is defined between conductive arm 176 and an adjacent peripheral edge section of die pad 173. In one embodiment, gap 179 is filled with an insulating material, such as a molding compound used to form package body 26.

[0104] Note that in some embodiments, it is preferred that the conductive feed lead 178 be positioned closer to the conductive shorting arm 177 relative to the distal end of the conductive arm 176. More specifically, according to this embodiment, the position of the conductive feed lead 178 is selected so that the capacitance between the distal end of the conductive arm 177 and the conductive feed lead 178, as well as the inductance between the conductive shorting arm 177 and the conductive feed lead 178, are substantially negated. With the capacitance and inductance canceled or their effects reduced, only the radiation resistance remains in the integrated antenna 171.

[0105] Due to its small size (e.g., λ / 4), the integrated antenna 171 with the IFA configuration can be utilized in a variety of applications, such as wireless handheld devices. The integrated antenna 171 includes a conductive arm 176 disposed above or spaced apart from a die pad 173, which is configured as the ground plane; a conductive shorting arm 177 grounding the conductive arm 176 to the die pad 173; and a conductive feed 178 electrically connected to the conductive arm 176. In some embodiments, the conductive arm 176 has a length corresponding to approximately one-quarter of a wavelength. The IFA configuration is a variation of a monopole configuration, in which the top section (i.e., the conductive upper arm 176) is folded downward to be parallel to the ground plane (i.e., the die pad 173). This is accomplished, for example, to reduce the height of the integrated antenna 171 while maintaining a resonant line length. In some embodiments, the conductive upper arm 176 may introduce capacitance to the input impedance of the integrated antenna 171, which may be compensated by the conductive shorting arm 177. The conductive shorting arm 177 may be formed in different configurations depending on the application; one such variation of the configuration would be to incorporate Figure 18 To describe it.

[0106] In this embodiment, the polarization of integrated antenna 171 is vertical, and the radiation pattern is generally annular, with the axis of the annulus oriented in a direction generally parallel to conductive feed 178. In one embodiment, for optimal radiation, die pad 173 is configured to have a width 1730 at least as wide as the length 1760 of conductive arm 176; and die pad 173 should be at least λ / 4 in height 1731. If the height 1731 of die pad 173 is smaller, bandwidth and efficiency will be reduced. The height 1770 of conductive shorting arm 177 is configured to be a small fraction of the wavelength of integrated antenna 171. However, the effective radiation and impedance properties of integrated antenna 171 have been found not to be a strong function of height 1770.

[0107] In some embodiments of the electronic device 170, the die pad 173 is disposed above the plane (λ / 4) of the conductive feed leads 178. In other words, in some embodiments, the die pad 173 and the conductive feed leads 178 are disposed on different, but substantially parallel planes. For example, the electronic device 170 can be configured as a packaged device with a top-exposed pad, similar to the embodiment of FIG. Figure 6 or configured to have an offset non-exposed die pad configuration similar to that in Figure 2 1 , wherein the conductive feed leads 178 are offset upward or downward relative to the die pad 173. For example, the densely hatched area represents the die pad 173, and at least the conductive feed leads 178 are disposed on different horizontal planes.

[0108] In one embodiment, the electronic device 170 further includes a plurality of tie bars 1701 extending approximately diagonally from a corner portion of the die pad 173 toward a corner portion of the package body 26. In one embodiment, the tie bar 1702 extends from one corner of the conductive shorting arm 177 toward another corner portion of the package body 26. The conductive connection structure 27, such as a wire bond 27, electrically connects the pad 24 on the electronic component 23 to the lead 174, and in some embodiments, to the die pad 173. According to this embodiment, a conductive feed lead 178 is disposed between a pair of leads 174 and is configured to electrically connect the integrated antenna 171 to an external feed source. Advantageously, similar to the leads 174, the conductive feed lead 178 is configured within the lead frame 172 to terminate at an edge or side of the package body 26.

[0109] Figure 18FIG2 is a top view of a packaged electronic device 180 or electronic device 180 having an integrated antenna 181, depicting another embodiment of an antenna configured in an IFA. Electronic device 180 is similar to electronic device 170, and only the differences will be described below. Specifically, integrated antenna 181 includes a die pad 173; an elongated conductive beam structure 186, an elongated conductive body 186, a conductive arm 186, a conductive transmission line 186, or a planar rectangular conductive element 186; and a conductive feed 188 or conductive feed lead 188 extending generally perpendicularly and outwardly from conductive arm 186 toward an outer edge of package body 26. Rather than a shorting arm, integrated antenna 181 includes one or more conductive connection structures 187, such as wire bonds 187 or clips 187, that electrically short conductive arm 186 to die pad 173. In a preferred embodiment, wire bonds 187 comprise gold wire having a diameter greater than or equal to approximately 20 microns (greater than or equal to approximately 0.8 mils).

[0110] Figure 19 is a top view of a packaged electronic device 190 or electronic device 190 having an integrated antenna 191 according to an embodiment of an integrated slot antenna. According to this embodiment, the electronic device 190 includes a substrate or conductive substrate 192, such as a conductive lead frame 192 or lead frame 192. In one embodiment, the lead frame 192 includes a generally rectangular die pad 193, die pad 193, or first die pad 193 defining four peripheral edge segments; and a plurality of leads 194 or leads 194. In one embodiment, the leads 194 can be separated into two (2) groups, wherein the leads 194 of each group are spaced apart from the die pad 193 and extend generally perpendicularly from a corresponding one of the opposite peripheral edge segments of the die pad 193. It is understood that the lead frame 192 can include more or fewer leads than depicted in this embodiment.

[0111] According to the present embodiment, leadframe 192 further includes an elongated conductive beam structure 196, an elongated conductive body 196, a conductive plate 196, a conductive pad 196, or a conductive land 196, including a slot 197, a rectangular opening 197, or a hole 197 extending through conductive pad 196. In a preferred embodiment, slot 197 is located substantially centrally within conductive pad 196, such that the ends and sides of slot 197 are spaced substantially equal or uniformly from the edges of conductive pad 196. In one embodiment, conductive pad 196 has a generally rectangular shape defining four peripheral edge segments, including a peripheral edge segment adjacent to but spaced apart from die pad 193 to provide a gap therebetween. In some embodiments, leadframe 192 further includes one or more tie bars 198 extending from portions of, for example, die pad 193 and conductive pad 196 toward a side surface of package body 26. In one embodiment, a feed or feed structure 199 electrically connects the electronic component 23 (which is attached to the first die pad 193) to the conductive pad 196. According to this embodiment, the integrated antenna 191 includes a conductive pad 196 with a slot 197 in a slot antenna configuration and a feed structure 199. The slot 197 includes a length 1970 and a height 1971.

[0112] Slot antennas are commonly used at frequencies between about 300 MHz and about 20 GHz. In this embodiment, electronic components 23, such as semiconductor chips 23, are attached to die pads 193, which are isolated from conductive pads 196 used to form the slot antenna. In one embodiment, feed 199 is positioned off-center relative to slot 197. To resonate slot antenna 191, feed conductor 199 is positioned as in FIG. Figure 19 The position depicted in FIG. 1 becomes a primary consideration. More specifically, it is preferred that feed 199 not be located at or near either end of slot 197, or centered on any side of slot 197. To enable radiation from the antenna assembly, in some embodiments, feed 199 may be positioned between the center and one end of slot 197. According to this embodiment, the selected position is a function of the impedance of integrated antenna 191 relative to the operating frequency. More specifically, if the antenna impedance to the left of feed 199 is >λ / 4, feed 199 behaves as an inductor; and to the right of feed 199, feed 199 exhibits the characteristics of a capacitor. When feed 199 is positioned and applied according to applicable design requirements, the inductance and capacitance should substantially cancel. This leaves only the radiation resistance to consider relative to the power required to resonate integrated antenna 191.

[0113] Typically, slot antennas are designed so that the impedance is approximately 50Ω. In some embodiments, this is considered the optimal impedance for efficient radiation of the antenna, but in practice it can be a challenge to achieve in every situation or application. In cases where the slot antenna is configured using a substrate type device such as a lead frame QFM or QFP, the positioning of the feed may also affect the bandwidth performance of the antenna. In most designs, the center frequency performance of the slot antenna is expected to be approximately 7% of the designed operating frequency. For example, for an operating center frequency of 1 GHz (for example, For a common operating frequency of many wireless devices (such as RF tags), the slot radiation was observed to be approximately 1 GHz ± 3.5%.

[0114] In some embodiments, slot 197 is free of material (i.e., material is not present). In other embodiments, slot 197 may be filled with air or an inert gas. Considering an overmolded packaging level integration, slot 197 may be filled with EMC. Since the dielectric constants of the EMC and air are substantially the same, it has been observed that the integrated antenna 191 will still resonate. If keeping slot 197 free of EMC is desirable or relevant to the application due to frequency requirements, bandwidth requirements, and / or packaging level implementation limitations, this can be achieved by utilizing a film-assisted molding ("FAM") molding process.

[0115] In one embodiment of electronic device 190, package body 26 may be configured as an overmolded package. In one embodiment, the mold compound selected for package body 26 may have a dielectric constant greater than that of air, and within typical variations in the assembly steps for die attach and wire bonding, both of which affect the precise placement of feed 199, the bandwidth performance of integrated antenna 191 is observed to be within 10% of the desired center operating frequency. For example, if the desired target frequency is 1 GHz, the slot radiation or bandwidth may be 1 GHz ± 5%.

[0116] According to this embodiment, the slot for the integrated antenna 191 can be of any size and shape, as long as the slot 197 is surrounded by a continuous metal plane or ground. In addition, the feed (i.e., feed 199) can be configured to effectively form the desired electric field, thereby causing the resonance of the slot. For example, Figure 20is a top view depicting an alternative embodiment of slot 197 designed with a curved shape to increase the interior area of the slot while maintaining a length 1970 and height 1971 that fits within the available area of electronic package 190. The shape of slot 197 is configured such that the perimeter of the shape is equal to a selected wavelength, but the shape does not have to be symmetrical or have a specific size or specific relative shape.

[0117] Figure 21 FIG2 depicts a packaged electronic device 210 or a top view of the electronic device 210 having an integrated antenna 211 configured as another embodiment of a slot antenna. In this embodiment, the electronic device 210 is a device configured as a QFN or QFP package. The electronic device 210 includes a substrate 212, a conductive substrate 212, such as a conductive lead frame 212 or a lead frame 212. In one embodiment, the lead frame 212 includes a generally quadrilateral die pad 213 and a plurality of leads 214 spaced apart from the die pad 213. According to this embodiment, the lead frame 212 further includes an elongated conductive beam structure 216 or an elongated conductive body 216 disposed between the leads 214 and the die pad 213, which in one embodiment completely surrounds the die pad 213. According to this embodiment, the elongated conductive beam structure 216 is configured in an annular shape and includes a slot 297, which may also completely surround the die pad 213. In one embodiment, a conductive feedthrough 299 electrically connects the electronic component 23 to the elongated conductive beam structure 216. In one embodiment, the conductive feedthrough 299 is connected to an interior or inner portion of the elongated conductive beam structure 216.

[0118] The package body 26 encapsulates various components, and thus some components, such as the die pad 213 and the elongated conductive beam structure 216, may not be exposed through one or more surfaces of the package body 26. In other embodiments, the die pad 213 and / or the elongated conductive beam structure 216 may be exposed through one or more surfaces of the package body 26. According to this embodiment, the slot 297 may be configured in various shapes and / or lengths, with the perimeter length being adjusted to the desired wavelength for the selected application. Figures 22A-22F 29 are examples depicting configurations 2971 to 2976 of different shapes, respectively, which are suitable for alternative slots for the elongated conductive beam structure 216 .

[0119] Figure 23FIG2 is a top view of a packaged electronic device 230 or electronic device 230 having an integrated antenna 231 configured as an alternative embodiment of a slot antenna. The electronic device 230 includes a substrate 232 and a conductive substrate 232, such as a conductive lead frame 232 or lead frame 232. In one embodiment, the lead frame 232 includes a generally rectangular die pad 233 and a plurality of leads 234 spaced apart from the die pad 233. According to this embodiment, the die pad 233 is further configured with a slot 237, which is disposed between the electronic component 23 and a set of leads 234 and a side of the package body 26. The length and height of the slot 237 are determined as previously described so that its perimeter corresponds to the desired wavelength of the integrated antenna 231. According to this embodiment, the integrated antenna 231 further includes a waveguide 239 . The waveguide 239 electrically connects a pad 24 on the electronic component 23 to one of the leads 234 .

[0120] According to this embodiment, waveguide 239 traverses, overlaps, or extends across a portion of slot 237, and some embodiments include a wire bond, such as a gold, silver, or copper wire bond. Furthermore, waveguide 239 has a diameter selected to have a reduced resistance relative to the desired operating frequency of integrated antenna 231. It has been observed that if the resistance of waveguide 239 is too large, the combination of the capacitance from package body 26 and the wire resistance may have an inductive effect, which reduces the radiation efficiency of integrated antenna 231. However, if the resistance is too low, the bandwidth of integrated antenna 231 may be limited, and the operating frequency may be difficult to stabilize. According to some embodiments, the diameter of waveguide 239 may be between approximately 20 microns and approximately 26 microns (approximately 0.8 mil to approximately 1 mil). According to this embodiment, as described in the previous slot antenna embodiment, waveguide 239 is preferably positioned off-center from slot 237. In one embodiment, the waveguide 239 is disposed between the center and one end of the slot 237 .

[0121] According to this embodiment, the height of the wire bonding loop of the waveguide 239 can be determined through design simulation. In one embodiment, a target maximum wire bonding loop height of λ / 4 at the apex of the wire loop is observed to provide better radiation and enable the slot 237 to resonate. In certain embodiments, the thickness of the lead frame 232 is selected to support better resonant characteristics and is further determined in combination with the size of the slot 237 and the apex height of the waveguide 239. The material selected for the package body 26 may have an impact on the overall performance of the integrated antenna 231, such as if the slot 237 is filled with molding compound during the molding process. In certain embodiments where the capacitive effect of the molding compound does not adversely affect the resonant characteristics of the integrated antenna 231, FAM molding technology may be utilized to keep the slot 237 free of molding compound. However, according to an embodiment utilizing the waveguide 239, as in Figure 24 As shown in FIG, utilizing the FAM method will open the slot 237, which only partially allows the waveguide 239 to be encapsulated within the package body 26. Figure 24 As shown in FIG, the package body 26 includes a bridge portion 261 that spans the slot 237 and encapsulates the waveguide 239. Figure 23 As indicated by the dense hatching in FIG. 2 , a portion of the die pad 233 may be reduced in thickness.

[0122] Figure 25 FIG2 is a top view of a packaged electronic device 250 or electronic device 250 having an integrated antenna 251 in a first embodiment of a Vivaldi antenna configuration. The electronic device 250 includes a substrate 252, a conductive substrate 252, such as a conductive lead frame 252, or a lead frame 252. In one embodiment, the lead frame 252 includes a generally quadrilateral die pad 253 and a plurality of leads 254 spaced apart from the die pad 253. In one embodiment, the die pad 253 is further configured with one or more tie bars 198, as shown in FIG2. Figure 25 As depicted in FIG, the die pad 253 may extend from a corner portion of the die pad 253 toward a corner portion of the package body 26.

[0123] According to this embodiment, the integrated antenna 251 is configured as a Vivaldi antenna, which is a type of planar antenna having a wideband in its operation. Generally speaking, the integrated antenna 251 is configured to have an antenna feed 259 that is electrically connected to the electronic component 23 and the die pad 253. According to this embodiment, the die pad 253 is further configured to have a slot 257 that is arranged to extend inward from an edge section of the periphery of the die pad 253. In one embodiment, as approximately Figure 25As depicted, slot 257 is located substantially at the center of a peripheral edge segment. Slot 257 is configured to provide integrated antenna 251 with a low resonant component and a wide high-frequency resonant component. According to this embodiment, slot 257 is configured to have a curved shape consistent with the resonance of integrated antenna 251 and a slot width 2571 proximate to the edge of die pad 253. According to this embodiment, the resonant frequency of integrated antenna 251 is controlled by the placement of a conductive feedthrough 259. For example, the closer feedthrough 259 is positioned to the outer edge of slot 257, the higher the resonant frequency. In some embodiments, the area within slot 257 may be filled with molding compound as part of package body 26. In other embodiments, the area within slot 257 may be voided or free of molding compound (indicated by dotted void or recess 255) in a reduced capacitance configuration. In one embodiment, FAM process technology may be utilized to provide void 255. The integrated antenna 251 further includes a ground pin 258 or a ground trace 258 configured to electrically connect the die pad 253 to ground.

[0124] Figure 26 FIG2 is a top view of a packaged electronic device 260 or electronic device 260 having an integrated antenna 261 according to another embodiment of a Vivaldi antenna. Electronic device 260 is similar to electronic device 250, and only the differences will be described below. According to this embodiment, integrated antenna 261 further includes a second conductive feed 2590 that electrically connects die pad 253 to one of leads 254. In some embodiments, second feed 2590 can be fed from or into a lower-level component, such as a printed circuit board.

[0125] Figure 27 is a top view of a packaged electronic device 270 or a portion of an electronic device 270 with an integrated antenna 271 in a first embodiment of a folded dipole antenna. According to this embodiment, the folded dipole antenna described below is configured such that the ends of the antenna structure are folded back in a manner that grounds the feed or input adjacent thereto, thereby forming a loop. The loop comprising the closed-loop structure of the antenna design is configured similarly to parallel shorted transmission lines, each having a length of half the total antenna length, wherein each transmission line is separated by a feed positioned approximately midway within the antenna loop. According to certain embodiments, the length of the folded dipole antenna is significantly greater than its width. Due to the folded design, currents in the antenna reinforce each other rather than cancel each other out.

[0126] The folded dipole antenna is resonant and radiates better at odd integer multiples of half a wavelength (e.g., -0.5λ, 1.5λ, 2.5λ, etc.). This is dependent on the location of the feed, and is, for example, the case when the feed is located at the center of the loop. Furthermore, the folded dipole antenna can be tuned to resonate at even multiples of half a wavelength (e.g., -1.0λ, 2.0λ, 3.0λ, etc.). This can be achieved, for example, by positioning the feed offset from the center point of the loop (e.g., closer to one of the folded ends of the loop). In this way, the folded dipole can be expanded to radiate over a wider bandwidth, enhancing the usefulness of the antenna design, improving efficiency, and increasing utility.

[0127] The electronic device 270 includes a conductive substrate 272, such as a conductive lead frame 272 or lead frame 272. In one embodiment, the lead frame 272 includes a die pad 273 and a plurality of leads 274 (only one set of leads 274 is depicted) disposed along a peripheral edge of the die pad 273. Depending on the embodiment, the lead frame 272 further includes a split loop structure 276, a two-piece elongated conductive body 276 or elongated conductive beam structure 276 having a ground portion 2760 and a feed portion 2761 separated by a gap or void 2762. According to one embodiment, the remaining portion 2763 of the split loop structure 276 (shown in dashed outline) may be disposed on a subsequent component, such as a printed circuit board 2764. The integrated antenna 271 further includes a feed or source 279, which, in one embodiment, electrically connects the feed portion 2761 to the electronic component 23, and a ground pin 278 or ground conductor 278, which electrically connects the electronic component 23 to the ground portion 2760. In an alternative embodiment, the feed portion 2761 can be electrically connected to another feed source via a printed circuit board 2764. According to this embodiment, the elongated conductive beam structures 2760 and 2761 are configured to have two opposing ends that terminate in a conductive lead structure disposed along an edge of the package body 26.

[0128] Figure 28FIG2 is a top view of a packaged electronic device 280 or a portion of an electronic device 280 having an integrated antenna 281 according to a second embodiment of a folded dipole antenna. The electronic device 280 is similar to the electronic device 270, and only the differences will be described below. In this embodiment, the integrated antenna 281 includes a separate loop structure 286 or an elongated conductive beam structure 286 configured as a fully integrated dipole antenna 281 encapsulated within the package body 26. In one embodiment, the separate loop structure 286 includes a feed 2741 or a feed lead 2741, which can be fed from the electronic component 23 via an optional wire bond 279 or fed from outside the electronic component 280; and a ground feed 2742, which can be fed via an optional wire bond 278 or connected to ground from outside the electronic device 280. According to this embodiment, two of the leads 274 of the electronic device 280 (i.e., leads 2741 and 2742) serve as a feed and a ground, respectively, for the integrated antenna 281. According to this embodiment, the elongated conductive beam structure 286 is configured to have two opposite ends that terminate in the conductive lead structures 2741 and 2742 disposed along an edge of the package body 26.

[0129] Figure 29 FIG2 is a top view of a packaged electronic device 290 or a portion of electronic device 290 having an integrated antenna 291 according to another embodiment of a folded dipole antenna. Electronic device 290 is similar to electronic device 270, and only the differences will be discussed below. In this embodiment, integrated antenna 291 includes an elongated conductive beam structure 296 that forms part of the loop for the folded dipole antenna. More specifically, integrated antenna 291 has offset feed 2741 or feed lead 2741 and ground lead 2742 for tuning purposes. In one embodiment, the separate loop configuration can utilize portions 2963 and 2965 within a printed circuit board 2964 to, for example, extend performance and improve the radiation and resonant characteristics of integrated antenna 291. According to this embodiment, the elongated conductive beam structure 296 is configured to have two opposite ends that terminate in conductive lead structures 2742 and 2743 disposed along an edge of the package body 26 .

[0130] Figure 30FIG3 depicts a packaged electronic device 300 or a top view of an electronic device 300 having an integrated antenna 301 according to another embodiment. In this embodiment, the integrated antenna 301 is configured as a helical antenna embodiment. The electronic device 300 includes a substrate 302, a conductive substrate 302, such as a conductive lead frame 302 or a lead frame 302. In one embodiment, the lead frame 302 includes a first die pad 3031 or a first die pad 3031; a second die pad 3032 or a second die pad 3032; and a plurality of leads 304 spaced apart from at least the first die pad 3031. It is understood that the electronic device 300 may have more or fewer leads 304 than depicted. In this embodiment, electronic component 23 is attached to first die pad 3031, and conductive connection structures 27, such as wire bonds 27, may be utilized to electrically connect pads 24 on electronic component 23 to leads 304. In one embodiment of electronic device 300, electronic component 23 is configured as a controller die, which may include, for example, logic, analog, and power functions. According to this embodiment, electronic device 300 further includes a spiral antenna device 323 attached to a second die pad 3032, which is spaced apart from first die pad 3031 to isolate spiral antenna device 323 from electronic component 23. According to one embodiment, spiral antenna device 323 may be fabricated as a separate component, such as an integrated passive device ("IPD").

[0131] In some embodiments, the helical antenna device 323 is configured with a metallized back surface for improved operational performance, thereby enhancing the bottom-plane grounding of the helical antenna device 323. Furthermore, the separate die pads 3031 and 3032 according to this embodiment provide an advantage in that the helical antenna device 323 can be configured in a variety of sizes and shapes depending on the application without affecting the size and performance of the electronic component 23 and without requiring expensive shielding techniques for the electronic component 23. According to this embodiment, the electronic component 23 is configured with a balun device 2301 electrically connected to one end of the helical antenna device using a feed 309 or feed conductor 309. The opposite end of the helical antenna device 323 is electrically connected to a second die pad 3032 using a ground pin 308 or ground conductor 308. Similar to other devices described herein, the lead frame 302 may include one or more tie bars 198. It is understood that the helical antenna assembly 323 may have other shapes including an octagonal helical shape, a hexagonal helical shape, a square helical shape, a circular shape, and other shapes known to those skilled in the art.

[0132] In one embodiment, the helical antenna device 323 can be formed using semiconductor deposition (e.g., electroplating) and patterning techniques (e.g., lithography and etching techniques). The integrated antenna 301 is suitable for applications where a broadband antenna or an antenna operating within a broadband frequency spectrum is required. In some embodiments, the integrated antenna 301 is suitable for applications having an operating frequency between about 1 GHz and about 18 GHz. Examples of such applications include, but are not limited to, GPS, Zigbee, Z-Wave, RF tags, Internet of Things, or similar applications known to those having ordinary skill in the technology.

[0133] Figure 31 FIG3 is a top view of a packaged electronic device 310 or electronic device 310 having an integrated antenna 311 according to another embodiment. In this embodiment, the integrated antenna 311 is configured as another spiral antenna embodiment. Electronic device 310 is similar to electronic device 300, and only the differences are described herein. In electronic device 310, lead frame 312 has a different die pad 3033 sized to accommodate a discrete balun device 2032 and a spiral antenna device 323. In this embodiment, feed wire 309 electrically connects electronic component 23 to balun device 2032, and a conductive structure 315, such as a wire bond 315, electrically connects balun device 2031 to one end of spiral antenna device 323.

[0134] In an alternative embodiment, a balun device can be integrated within the helical antenna device 323, reducing the die count in the electronic device 310 and reducing the system design complexity and overall system cost. Operational performance benefits may also be derived from this configuration. As a standalone balun or integrated into the helical antenna die and located on an isolation die pad, it can provide additional benefits by reducing signal loss, noise injection, and antenna impedance. This approach can provide improved performance, reduced power consumption, easier tuning, and improved overall system cost for certain applications.

[0135] Figure 32FIG3 depicts a packaged electronic device 320 or a top view of an electronic device 320 having an integrated antenna 321 according to another embodiment. According to this embodiment, the integrated antenna 321 is another embodiment of a helical antenna. The electronic device 320 includes a substrate 322, a conductive substrate 322, and a conductive leadframe 322. In one embodiment, the leadframe 322 includes a die pad 323, a plurality of leads 324 spaced apart from at least some of the peripheral side surfaces of the die pad 323, and one or more tie bars 328. It is understood that the electronic device 320 may have more or fewer leads than depicted. In this embodiment, the integrated antenna 321 includes an elongated conductive beam structure or body having a helical shape and is disposed in the electronic package 320 spaced apart from the die pad 323. In one embodiment, the integrated antenna 321 is formed in the lead frame 322 in the desired shape using etching and / or stamping techniques. In one embodiment, the electronic device 320 includes a top exposed pad structure, wherein the antenna 321 is formed in the desired shape using etching and / or stamping techniques. Figure 33 As depicted in FIG, a surface of the die pad 323 is exposed through a main surface of the package body 26. Figure 33 is a top view of electronic package 320. In one embodiment, similar to die pad 323, integrated antenna 321 is further exposed through the same major surface of package body 26. In other embodiments, die pad 323 may be encapsulated by package body 26 (i.e., not exposed in a major surface of package body 26) or exposed in a major surface of package body 26 opposite the major surface from which integrated antenna 321 is exposed. In other embodiments, the major surface of integrated antenna 321 may be completely encapsulated by package body 26 (i.e., not exposed in a major surface of package body 26).

[0136] In this embodiment, electronic component 23 (shown in dashed outline) is attached to a surface of die pad 323 and is encapsulated by package body 26 (i.e., not exposed therein). Electronic component 23 can be electrically connected to leads 324 and / or to integrated antenna 321 using conductive structures 27, as in previous embodiments. In alternative embodiments, electrical connection to integrated antenna 321 can be made via a lower-level component, such as a printed circuit board. In one embodiment, after the molding step to form package body 26, a removal step (e.g., a grinding step and / or an etching step) can be used to remove portions of the molding compound to expose a surface of die pad 323 and one or more surfaces of integrated antenna 321. As in previous embodiments, the material used to form leadframe 322, the dimensions of leadframe 322, and the material properties of package body 26 are selected based on the specific antenna requirements.

[0137] Figure 34 FIG2 is a top view of a packaged electronic device 340 or electronic device 340 with an integrated antenna 341 according to another embodiment. According to this embodiment, the integrated antenna 341 comprises a first elongated conductive beam structure 3411 or a first elongated conductive body 3411 disposed on an outer surface of the package body 26. As will be described in Figure 35 As further explained in FIG. 3 , the electronic device 340 includes a plurality of leads 344 and an electronic device 23, both of which are arranged in a top view. Figure 34 , depicted in dashed lines. In one embodiment, the first elongated conductive body 3411 can be formed by depositing a conductive layer covering a major surface of the package body 26. In another embodiment, the first elongated conductive body 3411 can be a metal foil, a metal film, or a metal structure attached or disposed on an outer surface of the package body 26. In one embodiment, the conductive layer can be a metal such as copper, a copper alloy, gold, multiple layers of metal, or other antenna materials known to those skilled in the art. Masking and etching techniques can then be used to pattern the first elongated conductive body 3411 into a desired pattern to provide the first elongated conductive body 3411. In one embodiment, the first elongated conductive body 3411 can be configured to have the shape of a patch antenna, a helical antenna, other antenna shapes as described herein, or other similar shapes known to those skilled in the art. In other embodiments, a shielding layer is deposited and the first elongated conductive body 3411 is formed on the portion of the package body 26 not covered by the shielding layer. The shielding layer can then be removed or, in an alternative embodiment, left in place and used as an insulating layer.

[0138] Figure 35 The electronic device 340 is along the Figure 34 35 - 35 in FIG. The electronic device 340 further includes a substrate 342 or a conductive substrate 342, such as a conductive lead frame 342 or lead frame 342. In one embodiment, the lead frame 342 includes a die pad 343 or die pad 343; a plurality of leads 344 spaced apart from the die pad 343; and a second elongated conductive beam structure 3412, a second elongated conductive body 3412, or a conductive antenna post structure 3412. In one embodiment, the conductive antenna post structure 3412 includes a lead portion 3444 on the same plane as the lead 344; a contact portion 3414 for electrically connecting to the first elongated conductive body 3411; and a connecting portion 3416 extending between the lead portion 3444 and the contact portion 3414. In one embodiment, the conductive antenna post structure 3412 is exposed in at least two surfaces of the package body 26, including the main surface 2600 where the first elongated conductive body 3411 is disposed.

[0139] In one embodiment, the conductive antenna post structure 3412 can be configured as a transmission line for the integrated antenna 341 and can be used to electrically connect the integrated antenna 341 to a lower-level component, such as a printed circuit board, or to the electronic component 23. In one embodiment, the electronic component 23 is attached to the die pad 323 and electrically connected to the leads 344 using a conductive connection structure 27, such as a wire bond 27. In one embodiment, the lead portion 3444, the die pad 323, and the lower surface of the leads 344 are exposed in a lower surface of the package body 26. According to this embodiment, the integrated antenna 341 includes a first elongated conductive body 3411 and a conductive antenna post structure 3412. In some embodiments, a protective layer can be provided to cover the first elongated conductive body 3411.

[0140] Figure 36 FIG2 is a cross-sectional view of a packaged electronic device 360 or electronic device 360 having an integrated antenna 341 according to another embodiment. Electronic device 360 is similar to electronic device 340 , and only the differences are described herein. According to this embodiment, electronic device 360 is configured with a top-exposed pad configuration, wherein die pad 363 is disposed adjacent to major surface 2600 of package body 26 , and leads 344 are disposed on an opposite major surface of package body 26 .

[0141] Figure 37is a partial cross-sectional view of package body 26 in an alternative embodiment, illustrating an embodiment in which first elongated conductive body 3411 is embedded within package body 26. In one embodiment, the external, exposed surface of first elongated conductive body 3411 is substantially planar, or substantially flush with major surface 2600 of package body 26. In one embodiment, after package body 26 is formed, the desired pattern for integrated antenna 341 can be etched into package body 26, and the etched pattern can then be filled with a conductive material to form first elongated conductive body 3411. In one embodiment, planarization techniques can be utilized to remove portions of the conductive material to provide a coplanar configuration between package body 26 and first elongated conductive body portion 3411. The first elongated conductive body 3411 can be directly connected to a conductive pillar 3412 within the package body 26 or through a contact portion 3414 exposed in the major surface 2600 of the package body 26 , with a conductive bridge 3417 electrically connecting the two structures.

[0142] Figure 38 FIG2 is a perspective view of a packaged electronic device 380 or a partially cutaway top view of an electronic device 380 having an integrated antenna 381 according to another embodiment. In this embodiment, the integrated antenna 381 is configured in a helical antenna shape and is an example embodiment of an integrated antenna embedded in a molded package body, such as the package body 26. In one embodiment, the electronic device 380 includes a substrate, such as a conductive substrate 382, a conductive lead frame 382, or a lead frame 382. In one embodiment, the lead frame 382 includes a die pad 383 or a die pad 383; a plurality of leads 384 spaced apart from the die pad 383; and one or more conductive post structures 386 extending from a major surface of the package body 26 to an opposite major surface and may be integral with the die pad 383. According to this embodiment, the conductive pillar structure 386 is configured to support the die pad 383 (e.g., during assembly) and provide electrical communication with the integrated antenna 381. In one embodiment, the electronic device 380 further includes an electronic component 23 attached to a surface of the die pad 383 opposite the lead 384. As previously described, the electronic component 23 can be electrically connected to the lead 384 using a conductive connection structure 27, such as a wire bond 27.

[0143] In one embodiment, an insulating layer (not shown) may be disposed on a major surface of die pad 383, and antenna portion 3811 or helical antenna portion 3811 may be formed on the insulating layer using, for example, deposition, masking, and etching techniques. After package body 26 is formed, a portion of package body 26 may be removed to form major surface 2600, with a portion of antenna portion 3811 exposed in major surface 2600. For example, grinding, polishing, and / or etching techniques may be used to remove the portion of package body 26. According to this embodiment, integrated antenna 381 may include antenna portion 3811, one or more conductive pillar structures 386, and die pad 383.

[0144] In an alternative embodiment, a second die pad may be utilized to support electronic component 23 on the same major surface of package body 26 as leads 384. In one embodiment, antenna portion 3811 is exposed on major surface 2600 of package body 26, and the second die pad may be exposed on the opposite major surface of package body 26. In another embodiment, antenna portion 3811 may be formed after package body 26 is formed by removing portions of package body 26 in a desired trench pattern and then filling the trench pattern with a conductive material to form antenna portion 3811. Removal techniques, such as grinding and / or etching, may be utilized to remove portions of the conductive material so that, in one embodiment, the upper surface of antenna portion 3811 and surface 2600 of package body 26 are substantially coplanar or flush with each other. In one embodiment, antenna portion 3811 is formed to electrically connect to one or more conductive pillars 386.

[0145] Now go to Figures 39-44 Various embodiments of substrate structures are described that have locking features configured to improve adhesion between a molding material, such as an epoxy molding compound, and the substrate structure. In the following description, the substrate structures are depicted and described using a conductive leadframe substrate structure, but it is understood that the features and components described are relevant to other types of substrate structures and are not limited to leadframe-type substrates. The following embodiments can be utilized in conjunction with any of the integrated antenna structures described herein, or can be utilized in packaged electronic devices that do not include an integrated antenna.

[0146] According to this embodiment, the locking features are disposed completely through selected portions of the lead frame (i.e., extending from one surface to the other to allow the molding material to flow through these areas). In a preferred embodiment, the locking features are disposed in portions of the substrate structure that are reduced in thickness relative to other portions of the substrate structure. In some embodiments, the portions having reduced thickness are prepared using a removal technique, such as an etching technique.

[0147] Depending on the embodiment, the locking features can vary in size, shape, number, spacing, and location within a particular substrate structure. These variables can depend on several design constraints, including, but not limited to, the presence of an underlying bond, the ratio of semiconductor chip size to die attach pad size, the size of the package body, the substrate material type and thickness, lead pitch, tie bar design and location, and the properties of the molding compound used for molding. For example, the filler size in a molding compound is selected so that the molding compound can flow through the locking features during molding, which will at least partially determine how robust the interface between the molding compound and the substrate structure will be.

[0148] Figure 39 FIG. 1 is a bottom view illustrating a substrate structure 390 , such as a lead frame 390 , according to a first embodiment. Figure 40 FIG. 3 is a cross-sectional view of a lead frame 390 incorporated into an electronic package 400. In one embodiment, the lead frame 390 includes a generally quadrilateral (e.g., square) die pad 391 or die land 391 defining four peripheral edge segments. Figure 40 When viewed in cross section as depicted in FIG, the die pad 391 defines opposing substantially planar upper and lower surfaces 3910 and 3911, respectively. Figure 40 As can be clearly seen in FIG, the die pad 391 does not have a uniform thickness. Instead, a peripheral portion of the lower surface 3911 is partially removed or partially etched (e.g., half etched) to define an etched portion 3912. The etched portion 3912 is further Figure 39 In some embodiments, the etched portion 3912 , which is recessed relative to the remainder of the lower surface 3911 of the die pad 391 , extends completely around an edge section of the periphery of the die pad 391 .

[0149] In one embodiment, the lead frame 390 further includes a plurality of tie bars 392 integrally connected to the die pad 391. In one embodiment, the lead frame 390 includes four tie bars 392 extending approximately diagonally from respective corner areas of the four corner areas defined by the die pad 391 to a dam bar (not shown), the tie bars 392 being effective to support the die pad 391 during manufacture of the electronic package device 400. In some embodiments, the tie bars 392 are of a reduced thickness similar to the etched portion 3912. The lead frame 390 further includes a plurality of leads 393 disposed to be spaced apart from the die pad 391, and in one embodiment, includes four groups disposed along each of the four peripheral edge sections of the die pad 391. In some embodiments, the thickness of each lead 393 is not uniform, wherein a peripheral portion 3931 is half-etched. In some embodiments, as in Figure 40 As depicted, the upper surface of lead 393 may include a wire bond pad or portion 3932.

[0150] According to this embodiment, leadframe 390 further includes a plurality of locking features 394 disposed in selected portions of leadframe 390. In one embodiment, locking features 394 include slots 3941, or locking slots 3941, disposed in etched portions 3912 of die pad 391; and circular holes 3942, or locking holes 3942, disposed proximate where tie bars 392 intersect, meet, or intersect with die pad 391. According to this embodiment, slots 3941 and circular holes 3942 are disposed completely through respective locations within leadframe 390. In some embodiments, slots 3941 include elongated rectangular shapes spaced along edge sections of the periphery of die pad 391. In one embodiment, at least four slots 3941 are disposed along each periphery of die pad 391, and at least one circular hole 3942 is disposed proximate each corner portion of die pad 391. According to this embodiment, groove 3941 and circular hole 3942 are sized to allow filler within the selected molding compound used to form package body 26 to be filled therein and to allow the molding compound to flow therethrough during the molding process. This configuration provides enhanced adhesion between lead frame 391 and package body 26.

[0151] Packaged electronic device 400 further includes electronic component 23 attached to upper surface 3910 of die pad 391 using, for example, an attachment layer 401. Conductive connection structures 27, such as wire bonds 27, electrically connect pads 24 on an upper surface of electronic component 23 to wire bond portions 3932 on leads 393. Package body 26 encapsulates electronic component 23, conductive connection structures 27, portions of leads 393, and portions of die pad 391. In one embodiment, an outer surface 3916 of die pad 391 and portions of leads 393 are exposed through the lower surface of package body 26. According to this embodiment, etched portion 3912 having grooves 3942 and circular holes 3943 and tie bars 392 are encapsulated within package body 26.

[0152] Figure 41 FIG2 is a bottom view of a portion of a substrate structure 410 or lead frame 410 according to another embodiment. Lead frame 410 is similar to lead frame 390, and only the differences will be described below. According to this embodiment, lead frame 410 further includes additional locking features, including a plurality of tie bar slots 3946 disposed within one or more tie bar 392 and one or more tie bar circular holes 3947. In a preferred embodiment, each tie bar 392 is configured with a tie bar slot 3946 and one or more tie bar circular holes 3947. In one embodiment, a first tie bar slot 3946A is disposed adjacent to circular hole 3943, and a first tie bar circular hole 3947A is disposed between a distal end of the tie bar 392 and the first tie bar slot 3946A. In one embodiment, a second connecting rod slot 3946B is disposed between the distal end and the circular hole 3947A of the first connecting rod. In one embodiment, a second connecting rod circular hole 3947B is disposed between the distal end and the second connecting rod slot 3946B. In one embodiment, a third connecting rod slot 3946C is disposed between the distal end and the circular hole 3947B of the second connecting rod. In one embodiment, the second connecting rod slot 3946B may be longer than one or more of the first connecting rod slot 3946A and the third connecting rod slot 3946C. It is understood that in other embodiments, more or fewer connecting rod circular holes and / or connecting rod slots may be utilized, and different connecting rod slot shapes may also be used.

[0153] Figure 421 is a partial bottom view depicting a substrate structure 420 or lead frame 420 according to another embodiment. Lead frame 420 is similar to lead frames 390 and 410, and only the differences will be described below. According to this embodiment, lead frame 410 includes a Y-shaped slot structure 3948, which is disposed in a portion of lead frame 410 where tie bar 392 intersects a corner portion of die pad 391. According to this embodiment, Y-shaped slot structure 3948 is disposed within etched portion 3912 of die pad 391 and along a portion of a half-etched portion of tie bar 392. In one embodiment, two slots 3948A and 3948B are configured to extend completely through etched portion 3912, and a third slot 3948C is configured to extend completely through tie bar 392. In other words, the V-shaped portion defined by grooves 3948A and 3948B of Y-groove structure 3948 is primarily located within etched portion 3912, and the I-shaped portion defined by groove 3948C of Y-groove structure 3948 is primarily located within tie bar 392. In certain embodiments, tie bar 392 may include one or more tie bar grooves 3946 and one or more tie bar circular holes 3947. In a preferred embodiment, each corner portion of die pad 391 and each tie bar 392 are similarly configured. According to this embodiment, Y-groove structure 3948 advantageously provides enhanced adhesion between package body 26 and lead frame 420. It is also configured to interlock tie bar 392 and etched portion 3912 to provide improved stability and strength in high-stress areas, particularly in large body devices. This particular embodiment is advantageous, for example, in packaged devices utilizing thicker leadframes (e.g., ≥ approximately 200 microns (≥ 8 mils)) and in applications utilizing such packaged devices (e.g., high-heat devices). The Y-groove structure 3948 reduces the amount of metal mass in the corner portions of the die pad 391, which reduces the coefficient of thermal expansion ("CTE"). This, along with the interlocking of the mold compound with the tie bar / die pad area, reduces warping that may occur during molding or post-molding curing processes.

[0154] Figure 43FIG2 is a partial bottom view illustrating a substrate structure 430 or lead frame 430 according to another embodiment. Lead frame 430 is similar to lead frames 390, 410, and 420, and only the differences will be described below. Furthermore, it is understood that the features of lead frame 430 can be utilized in conjunction with the other embodiments described herein and other embodiments. Lead frame 430 includes a nonlinearly shaped edge 431 applied to the etched portion 3912 of die pad 391 and tie bars 392. In one embodiment, edge 431 includes a wavy edge, including a serrated edge, a serrated edge, a rounded edge, or an edge configured to increase the surface area of the edge portions of die pad 391 and tie bars 392. This increase in surface area improves the adhesion of the molding compound to lead frame 430. The nonlinearly shaped edge 431 can be utilized alone or in combination with one or more of the locking features described herein. Furthermore, the edge 431 may be disposed on an edge segment that is less than the entire periphery of the die pad 391. In one embodiment, the etched portion 3912 may further include one or more circular holes 3949, i.e., locking features disposed completely through the etched portion 3912 and disposed at selected locations on the etched portion 3912. In one embodiment, the circular hole 3949 may be disposed between two grooves 3946, or between a Y-shaped groove structure 3948 and a groove 3946.

[0155] Figure 44 FIG2 is a partial bottom view of a substrate structure 440 or lead frame 440 according to another embodiment. Lead frame 440 is similar to lead frames 390, 410, 420, and 430, and only the differences will be described below. According to this embodiment, lead frame 440 includes edges 441 and 442 that are nonlinear to provide an offset slotted tab locking structure 443. In one embodiment, edge 442 has a different shape or edge profile than edge 441. In one embodiment, locking structure 443 includes a plurality of tabs 443A, 443B, and 443C that are offset from one another in a non-continuous manner. The size and shape of tabs 443A, 443B, and 443C can vary. In one embodiment, each tab includes a slot 444 that is disposed completely through its respective slot. In some embodiments, when Y-shaped slot structure 3948 is also included, slot 444 is disposed substantially perpendicular to slot 3948C. In another embodiment, locking structures 443 may be further provided along an edge section of the periphery of die pad 391. Similar to edge 431, locking structures 443 are configured to increase the surface area of lead frame 440, thereby improving adhesion between lead frame 440 and the molding compound used to form package 26.

[0156] From all of the foregoing, one skilled in the art can determine that, according to one embodiment, a packaged electronic device includes a leadframe having a die pad, at least one tie bar integral with the die pad, and a plurality of leads spaced apart from the die pad. An electronic component is electrically connected to the leads. The die pad includes an etched portion around at least a portion of a peripheral edge section. A first plurality of locking features are configured to extend through the etched portion. A molded package body encapsulates the electronic component and portions of the leadframe and is disposed within the locking features.

[0157] In one embodiment, the first plurality of locking features comprises a nonlinear edge that is positioned around at least a portion of the etched portion. In another embodiment, the first plurality of locking features comprises slots. In another embodiment, the first plurality of locking features comprises circular holes. In another embodiment, the first plurality of locking features may comprise tabs offset from the slots. In another embodiment, the second plurality of locking features is positioned to extend through the connecting rod. In one embodiment, the second plurality of locking features comprises a nonlinear edge that is positioned along an edge portion of the connecting rod. In another embodiment, the second plurality of locking features comprises slots. In another embodiment, the second plurality of locking features comprises circular holes. In another embodiment, the second plurality of locking features may comprise tabs offset from the slots.

[0158] In particular, the aforementioned locking features, including locking feature 431, result in the packaged electronic device meeting Moisture Sensitivity Level 1 ("MSL 1") requirements. This is advantageous because passing MSL 1 testing allows manufacturers to eliminate costly preventative treatments, such as bake-out processes and dry-pack storage. This also eliminates the need to monitor the shelf life of packaged electronic components utilizing embodiments herein, even after the dry pack has been opened. In contrast, a packaged electronic device that does not pass MSL 1 requirements must undergo an additional bake-out process after a certain amount of use.

[0159] From the foregoing, one skilled in the art can discern that, according to one embodiment, a method for manufacturing an electronic package having an integrated antenna includes providing a conductive substrate comprising: a first conductive die attach pad; a first conductive lead spaced from a first side of the first conductive die attach pad; and an elongated conductive beam structure disposed proximate the first side of the first conductive die attach pad, the elongated conductive beam structure electrically coupling the first conductive die attach pad and one or more electronic devices, wherein the elongated conductive beam structure, the first conductive die attach pad, and one or more of a second conductive lead are configured as an antenna structure. The method includes coupling an electronic device to the first conductive lead; and forming a package body that encapsulates the electronic device and at least a portion of the first conductive die attach pad, at least a portion of the first lead, and at least a portion of the elongated conductive beam structure.

[0160] From all of the foregoing, one skilled in the art can determine that according to another embodiment, in a packaged electronic device having an integrated antenna, the conductive ground plane structure can be exposed in a major surface of the package body, and the first conductive die attach pad is exposed in an opposite major surface of the package body. In another embodiment, the conductive ground plane structure can be electrically connected to the first conductive die attach pad along a second side of the first conductive die attach pad. In yet another embodiment, the packaged electronic device may further include a third conductive lead electrically coupled to the first conductive die attach pad using a passive device. In another embodiment, the elongated conductive beam structure can be electrically connected to the first conductive die attach pad using a passive structure proximate a first end of the elongated conductive beam structure and electrically connected to the first conductive die attach pad using a conductive connection structure proximate an opposite end.

[0161] From all of the foregoing, a person skilled in the art can determine that according to another embodiment, in a packaged electronic device having an integrated antenna, the antenna structure may further include a conductive shorting arm structure, which is a portion of the conductive die attach pad that electrically connects one end of the elongated conductive beam structure to the conductive die attach pad; the second conductive lead can be connected to the elongated conductive beam structure on a side of the elongated conductive beam structure opposite to the conductive die attach pad; the first conductive die attach pad can be configured as a ground plane structure; the elongated conductive beam structure has a first length; the first conductive die pad has a first width greater than or equal to the first length; and the antenna structure is configured as an inverted-F antenna structure.

[0162] From all of the foregoing, one skilled in the art can determine that according to another embodiment, in a packaged electronic device having an integrated antenna, the substrate may include an etched portion having a reduced thickness; the packaged electronic device further includes a locking feature that is configured to extend through the etched portion; and the locking feature includes one or more of a nonlinear edge, a groove, a circular hole, a Y-shaped slot structure, or an offset slotted tab structure.

[0163] From the foregoing, one skilled in the art can discern that, according to another embodiment, in a packaged electronic device having an integrated antenna, the antenna structure may include an elongated conductive beam portion extending from a peripheral edge section of a first die pad; and a ground plane spaced apart from the die pad, wherein the antenna structure is configured as a patch antenna. In yet another embodiment, the antenna structure may further include a second die pad spaced apart from the first die pad, the second die pad having a slot disposed within and extending through the second die pad; and a conductive connection structure electrically connecting the electronic device to the second die pad, wherein the conductive connection structure is disposed between an end of the slot and a central portion of the slot. In another embodiment, the antenna may further include a waveguide electrically coupled to the electronic device and a conductive lead, wherein: the waveguide overlaps the slot; the package body encapsulates the waveguide; and a portion of the slot is free of the package body.

[0164] From the foregoing, one skilled in the art can discern that, according to yet another embodiment, in a packaged electronic device having an integrated antenna, the antenna structure may include an elongated conductive beam structure disposed between a peripheral edge section of a first die pad and a first edge of the package body; a conductive shorting arm structure electrically connecting one end of the elongated conductive beam structure to a corner of the first die pad; and a conductive lead connected to the elongated conductive beam structure on a side of the elongated conductive beam structure opposite the first die attach pad and terminating along the first edge of the package body, wherein: the first conductive die attach pad is configured as a ground plane structure; and the antenna structure is configured as an inverted-F antenna structure. In another embodiment, the antenna structure may include an elongated conductive beam structure at least partially exposed in a major surface of the package body; and a conductive post structure embedded within the package body and electrically coupled to one end of the elongated conductive beam structure. In another embodiment, the antenna structure may include a second die pad spaced apart from the first die pad, the second die pad being configured to have a structure that resonates in response to a feed signal.

[0165] In view of all of the foregoing, it is apparent that novel packaged electronic devices with integrated antenna structures have been disclosed. Among other features, the electronic devices include a conductive leadframe that uniquely incorporates one or more of the features described herein, including but not limited to transmission line components, ground plane components, ground ring components, patch components, ground components, feed components, waveguide components, elongated conductive beam components, conductive post components, slot components, conductive spiral components, tuning components, isolation components, embedded package body components, and other components into the proposed integrated antenna structure. Certain of these components are advantageously contained within the conductive leadframe structure along with other leadframe components to simplify integration. The components described herein and their embodiments uniquely enable an integrated antenna structure within an electronic device package, providing the unexpected advantages of locating the antenna close to the electronic chip, thereby improving performance, enabling optimal resonance, reducing signal loss, and thereby improving radiation, reducing noise injection, lowering operating impedance, and reducing power consumption. Furthermore, it was unexpectedly discovered that the capacitance of the molded material used for the package body can be used in a manner that loads an antenna component. Furthermore, the structure described herein utilizes available manufacturing processes, which saves capital investment and other manufacturing costs. Finally, the integrated antenna embodiments described herein provide increased functionality within a small coverage area and eliminate the need for an external, discrete antenna in certain applications, supporting current and future user requirements.

[0166] In further consideration of the foregoing, it is apparent that novel locking structures have been disclosed that include, among other features, slotted, rounded, flat, and irregular edge locking structures disposed in selected portions of a leadframe assembly to improve adhesion of the molding compound to the leadframe, to reduce undesirable movement of the leadframe assembly, and to reduce warpage of the leadframe assembly.

[0167] Although the subject matter of the present invention has been described using specific preferred and exemplary embodiments, the preceding figures and description thereof depict only typical embodiments of the subject matter and, therefore, are not to be considered limiting of its scope. It is apparent that many alternatives and variations will be apparent to those skilled in the art. For example, the structures and components described herein may be utilized with substrates including build-up substrates and other substrates having a die attach pad and utilizing a molded body structure. Although the present description primarily utilizes a QFN / MLF or QFP leadframe substrate in the described embodiments, it is understood that the disclosed components and concepts may be applied to other leadframe devices having a die attach pad. These other embodiments include, but are not limited to, DFN, SOC, SOIC, QFP, aQFN, tsCSP, GQFN, DR-MLF, and other types of electronic packages.

[0168] As reflected in the following claims, the present invention may feature less than all of the features of a single previously disclosed embodiment. Therefore, the claims set forth below are hereby expressly incorporated into this detailed description of the drawings, with each claim standing on its own as a separate embodiment of the present invention. Furthermore, although some embodiments described herein include some features included in other embodiments and not others, as those skilled in the art will appreciate, combinations of features from different embodiments are intended to be within the scope of the present invention and to form different embodiments.

Claims

1. A packaged electronic device with an integrated antenna, characterized in that include: Lead frame, including: First die pad, a second die pad spaced apart from the first die pad, and a plurality of conductive leads; a first electronic component coupled to the first die pad and electrically coupled to the plurality of conductive leads; a second electronic component having a first major surface and an opposing second major surface, wherein: The second major surface is coupled to the second die pad, and The second electronic component includes an antenna proximate to the first major surface, and The first electronic component is electrically coupled to the antenna; and A package body covers the first electronic component, the second electronic component, and at least a portion of the lead frame.

2. The electronic device according to claim 1, wherein: The second electronic component includes a semiconductor-integrated passive device.

3. The electronic device according to claim 1, wherein: The antenna includes a helical antenna having a first end and an opposing second end, the first end electrically coupled to the first electronic component and the second end electrically coupled to the second die pad.

4. The electronic device according to claim 1, wherein: The second electronic component includes a conductive ground plane layer over the second major surface and interposed between the second electronic component and the second die pad.

5. The electronic device according to claim 1, wherein: include: A balun device is electrically coupled between the first electronic component and the second electronic component.

6. The electronic device according to claim 5, wherein: The balun arrangement is provided as part of the first electronic component.

7. The electronic device according to claim 5, wherein: The balun device is disposed on the second die pad.

8. The electronic device according to claim 1, wherein: include: A grounding structure electrically couples the antenna and the second die pad.

9. The electronic device according to claim 1, wherein: The antenna includes a plated antenna.

10. The electronic device according to claim 1, wherein: The package body is laterally inserted between the first die pad and the second die pad.

11. The electronic device according to claim 1, wherein: The antenna is embedded in the packaging body.

12. A packaged electronic device with an integrated antenna, characterized in that include: Lead frame, including: First die pad, a second die pad spaced apart from the first die pad, and a plurality of conductive leads; a first electronic component coupled to the first die pad and electrically coupled to the plurality of conductive leads; a second electronic component having a first major surface and an opposing second major surface, wherein: The second major surface is coupled to the second die pad, and the second electronic component comprising an antenna proximate the first major surface, The antenna comprises a semiconductor-integrated passive device; and The first electronic component is electrically coupled to the antenna; and A package body covers the first electronic component, the second electronic component, and at least a portion of the lead frame.

13. The electronic device according to claim 12, wherein: the antenna comprising a helical antenna having a first end and an opposing second end, the first end being electrically coupled to the first electronic component and the second end being electrically coupled to the second die pad; and The antenna is embedded in the packaging body.

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