Test equipment

Abstract

The present invention provides a testing device. The testing device comprises a base plate, a first circuit board, a reinforcement, a second circuit board and a testing card. A first circuit board is arranged on the base plate; a reinforcement is arranged on the base plate and is located at the center of the base plate and passes through the first circuit board; a second circuit board is arranged at the center of the reinforcement; a part of a testing card is located below the reinforcement and another part passes through the base plate, the first circuit board, the reinforcement and the second circuit board; wherein the base plate, the reinforcement and the second circuit board are integrally formed, and the base plate carries the first circuit board.

Description

Technical Field

[0001] The present invention relates to a testing device, and in particular to a testing device. Background Art

[0002] Generally speaking, the electronic properties of semiconductor components (e.g., integrated circuit chips) on a wafer must be tested first to determine whether the integrated circuit chips function well. Good integrated circuit chips will be selected for subsequent packaging processes, while defective products will be discarded to avoid additional packaging costs. The packaged integrated circuit chips must undergo another electrical test to screen out defective packaging products, thereby improving the final product yield. In other words, the integrated circuit chips must undergo several electrical tests during the manufacturing process.

[0003] Please refer to Figure 1 The test system 10' of the prior art is used to test a device under test 31' (such as a semiconductor device, an integrated circuit chip). The test system 10' comprises a housing 11' (defining a test chamber 13'), a bracket 17' located in the housing 11', a base 30' located on the bracket 17' and accommodating the device under test 31', a head plate 15' (having an opening 19') located on the housing 11', and a test card 40' located on the head plate 15'. The device under test 31' is placed on the base 30' having a heater 33'.

[0004] The test card 40' comprises a circuit board 41', a support 45' disposed on the circuit board 41', and a plurality of probes 43' fixed on the support 45' by epoxy resin 47'. The circuit board 41' has a first surface 42A' and a second surface 42B', and the front end of the probe 43' can form an electrical connection with the device under test 31' facing the second surface 42B'. The rear end of the probe 43' is electrically connected to the wire 53' on the first surface 42A' of the circuit board 42' via the conductive channel 51' inside the circuit board 41'.

[0005] When testing, the base 30' rises so that the front end of the probe 43' forms electrical contact with the pad 35' of the device under test 31', thereby establishing an electrical path between the test card 40' and the device under test 31'. During the test, the test signal is transmitted to the device under test 31' via the probe 43' of the test card 40', and the response signal of the device under test 31' is transmitted to the outside of the test card 40' via the probe 43' for analysis, thereby achieving electrical testing of the device under test 31'.

[0006] However, since the circuit board 41' is directly connected to the probe 43' of the test card 40' and the circuit board 41' is used as a carrier, the larger the volume of the circuit board 41' is at different temperatures, the more variation will be generated, thereby causing the connection between the circuit board 41' and the test card 40' to be easily affected by temperature changes, resulting in distortion or error in the test results; in other words, the temperature change of the test chamber 13' is large, the deformation of the circuit board 41' is large, and the displacement of the tip of the probe 43' is large, resulting in deviation from the pad 35' of the device under test 31', resulting in distortion or error in the test results.

[0007] The above “prior art” description only provides background technology, does not admit that the above “prior art” description discloses the embodiments of the present invention, does not constitute the prior art of the present invention, and any description of the above “prior art” should not be regarded as any part of the present invention. Summary of the invention

[0008] An object of the present invention is to provide a testing device to solve at least one of the above problems.

[0009] An embodiment of the present invention provides a test device. The test device includes a base plate, a first circuit board, a reinforcement, a second circuit board and a test card. A first circuit board is arranged on the base plate; a reinforcement is arranged on the base plate and is located at the center of the base plate and passes through the first circuit board; a second circuit board is arranged at the center of the reinforcement; a part of a test card is located under the reinforcement, and the other part passes through the base plate, the first circuit board, the reinforcement and the second circuit board.

[0010] In some embodiments of the present invention, the bottom plate is circular, a first concave portion is formed in the center of the bottom plate for accommodating the reinforcement member, and a first through hole is formed in the center of the first concave portion.

[0011] In some embodiments of the present invention, a second through hole is formed at the center of the first circuit board, and the second through hole is arranged corresponding to the first concave portion of the bottom plate.

[0012] In some embodiments of the present invention, a second concave portion is concavely formed at the center of the reinforcing member for accommodating the second circuit board, and a third through hole is formed through the center of the second concave portion.

[0013] In some embodiments of the present invention, a fourth through hole is formed at the center of the second circuit board, and the fourth through hole, the third through hole, the second through hole and the first through hole are interconnected for the other part of the test card to pass through.

[0014] In some embodiments of the present invention, the test card has a main body and a plurality of probes, the main body is located below the reinforcement, and the plurality of probes are arranged through the bottom plate, the first circuit board, the reinforcement, and the second circuit board.

[0015] In some embodiments of the present invention, the first through hole of the bottom plate is in a square shape with rounded corners.

[0016] In some embodiments of the present invention, a convex portion is convexly provided downwardly at the center of the reinforcement member, and the convex portion is disposed corresponding to the first through hole passing through the bottom plate.

[0017] In some embodiments of the present invention, the protruding portion has a profile corresponding to a profile of the first through hole of the bottom plate.

[0018] In some embodiments of the present invention, the surface of the first circuit board has a first circuit pattern, the surface of the second circuit board has a second circuit pattern, and the first circuit pattern and the second circuit pattern are electrically connected to each other through a plurality of bonding wires.

[0019] In some embodiments of the present invention, the test card has a main body and a plurality of probes, the main body is located below the reinforcement, the plurality of probes pass through the first through hole of the base plate, the second through hole of the first circuit board, the third through hole of the reinforcement, and the fourth through hole of the second circuit board, and are electrically connected to the second circuit pattern of the second circuit board.

[0020] In some embodiments of the present invention, the surface of the base plate has a first positioning mark, and the surface of the reinforcement has a third positioning mark. When the reinforcement is assembled on the base plate, the third positioning mark of the reinforcement is aligned with the first positioning mark of the base plate.

[0021] In some embodiments of the present invention, the second circuit board has a second positioning mark, and when the first circuit board is disposed on the bottom plate, the second positioning mark of the first circuit board is aligned with the third positioning mark of the reinforcement.

[0022] In some embodiments of the present invention, the bottom plate, the reinforcement member and the second circuit board are integrally formed.

[0023] According to some embodiments of the present invention, a test device is provided. The test device has a base plate, a first circuit board, a reinforcement, a second circuit board and a test card, wherein the base plate, the reinforcement and the second circuit board can be integrally formed, and the base plate carries the first circuit board. As a result of this architecture, the first circuit board can be prevented from being directly connected to the multiple probes of the test card, and the first circuit board can be carried by the base plate, so that when at different temperatures, the temperature change of the materials of the base plate, the reinforcement and the second circuit board is close to the temperature change of the test card, and the multiple probes of the test card are not directly connected to the first circuit board, so that the change between the first circuit board and the multiple probes of the test card is reduced, thereby avoiding distortion or error of the test results and improving the yield.

[0024] The above has been a fairly broad overview of the technical features and advantages of the present invention, so that the detailed description of the present invention below can be better understood. Other technical features and advantages that constitute the claims of the present invention will be described below. It should be understood by those skilled in the art to which the present invention belongs that the concepts and specific embodiments disclosed below can be used to modify or design other structures or processes to achieve the same purpose as the present invention. It should also be understood by those skilled in the art to which the present invention belongs that such equivalent constructions cannot depart from the spirit and scope of the present invention as defined by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] A more complete understanding of the disclosure of the present invention may be obtained by referring to the detailed description and claims in conjunction with the accompanying drawings, in which like reference numerals refer to like elements.

[0026] Figure 1 A test system of the prior art is illustrated as an example.

[0027] Figure 2 It is a schematic exploded top view of a testing device according to some embodiments of the present invention.

[0028] Figure 3 FIG. 4 is an exploded bottom view of the testing device according to some embodiments of the present invention.

[0029] Figure 4 FIG. 4 is a schematic diagram of the assembly of the testing device according to some embodiments of the present invention.

[0030] Figure 5 FIG. 4 is a schematic cross-sectional view of half of a testing device according to an embodiment of the present invention.

[0031] Figure 6 FIG. 4 is a schematic cross-sectional view of three quarters of a testing device according to an embodiment of the present invention.

[0032] The reference numerals are as follows:

[0033] 1: Base plate

[0034] 2: First circuit board

[0035] 3: Reinforcement

[0036] 4: Second circuit board

[0037] 5: Test Card

[0038] 10': Test system

[0039] 11: First concave portion

[0040] 11': Shell

[0041] 12: First through hole

[0042] 13: First positioning mark

[0043] 13': Test room

[0044] 15': Headboard

[0045] 17': Bracket

[0046] 19': Opening

[0047] 21: Second through hole

[0048] 22: First circuit pattern

[0049] 23: Second positioning mark

[0050] 30': Base

[0051] 31: Second concave portion

[0052] 31': Component under test

[0053] 32: The third through hole

[0054] 33:Protruding joint

[0055] 33': Heater

[0056] 34: Third positioning mark

[0057] 40': Test Card

[0058] 41: Fourth through hole

[0059] 41': Circuit board

[0060] 42: Second circuit pattern

[0061] 42A': first surface

[0062] 42B': Second surface

[0063] 43': Probe

[0064] 45': Support

[0065] 47': Epoxy resin

[0066] 51: Ontology part

[0067] 51': Conductive channel

[0068] 52: Probe

[0069] 53': Wire

[0070] 100:Testing device DETAILED DESCRIPTION

[0071] Specific examples of components and configurations are described below to simplify embodiments of the present invention. Of course, these embodiments are intended to be illustrative only and are not intended to limit the scope of the present invention. For example, in the description, a first component is formed on a second component, which may include embodiments in which the first and second components are in direct contact, and may also include embodiments in which additional components are formed between the first and second components so that the first and second components do not directly contact. In addition, embodiments of the present invention may repeat reference numerals and / or letters in many examples. The purpose of these repetitions is to simplify and clarify, and unless otherwise specified in the text, they do not themselves represent a specific relationship between the various embodiments and / or configurations discussed.

[0072] Furthermore, the present invention may use spatially corresponding terms, such as "below", "below", "lower", "above", "higher" and the like, to describe the relationship of one element or feature to another element or feature in the drawings. Spatially corresponding terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be oriented (rotated 90 degrees or at other orientations) and the spatially corresponding descriptors used in the present invention may be interpreted accordingly. It is understood that when one feature is formed on another feature or substrate, other features may be present therebetween. Furthermore, the present invention may use spatially corresponding terms, such as "below", "below", "lower", "above", "higher" and the like, to describe the relationship of one element or feature to another element or feature in the drawings. Spatially corresponding terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be oriented (rotated 90 degrees or at other orientations) and the spatially corresponding descriptors used in the present invention may be interpreted accordingly.

[0073] The testing device 100 disclosed in the present invention can be applied in Figure 1 In the test system 10' shown in FIG. 1 , the test device 100 disclosed in the present invention can replace Figure 1The test card 40' in the following is a detailed description of the test device 100 of the present invention. If necessary, it can be used with Figure 1 Supplementary explanation of some components.

[0074] Figure 2 It is a schematic exploded top view of a testing device according to some embodiments of the present invention. Figure 3 FIG. 4 is an exploded bottom view of the testing device according to some embodiments of the present invention. Figure 4 FIG. 4 is a schematic diagram of the assembly of the testing device according to some embodiments of the present invention. Figure 5 FIG. 4 is a schematic cross-sectional view of half of a testing device according to an embodiment of the present invention. Figure 6 FIG. 4 is a schematic cross-sectional view of three quarters of a testing device according to an embodiment of the present invention.

[0075] Please refer to Figures 2 to 6 As shown, the testing device 100 of the present invention includes a base plate 1, a first circuit board 2, a reinforcement member 3, a second circuit board 4 and a testing card 5; wherein a portion of the testing card 5 is located below the reinforcement member 3, and another portion of the testing card 5 is arranged through the base plate 1, the first circuit board 2, the reinforcement member 3 and the second circuit board 4.

[0076] Please refer to Figure 2 and Figure 3 In some embodiments of the present invention, the bottom plate 1 is substantially circular, and a first recessed portion 11 is recessed in the center of the bottom plate 1 for accommodating the reinforcement member 3 , and a first through hole 12 is formed in the center of the first recessed portion 11 .

[0077] Please refer to Figures 2 to 6 As shown, the first circuit board 2 is disposed on the bottom plate 1. In some embodiments of the present invention, a second through hole 21 is formed at the center of the first circuit board 2, and the second through hole is disposed corresponding to the first concave portion 11 of the bottom plate 1. Figure 2 As shown, in some embodiments of the present invention, the surface of the first circuit board 2 has a first circuit pattern 22 .

[0078] Please refer to Figures 2 to 6 As shown, the reinforcing member 3 is arranged on the bottom plate 1 and is located at the center of the bottom plate 1 and is arranged through the first circuit board 2. Figure 2 and Figure 3 As shown, in some embodiments of the present invention, a second concave portion 31 is concavely formed at the center of the reinforcement member 3 for accommodating the second circuit board 4 , and a third through hole 32 is formed at the center of the second concave portion 31 .

[0079] Please refer to Figures 2 to 6As shown, in some embodiments of the present invention, a convex portion 33 is convexly provided downward at the center of the reinforcement member 3, and the convex portion 33 is provided corresponding to the first through hole 12 passing through the bottom plate 1. In some embodiments of the present invention, the first through hole 12 of the bottom plate 1 is substantially in the shape of a square with rounded corners, and the convex portion 33 has a contour corresponding to the contour of the first through hole 12 of the bottom plate 1. In other words, the contour of the convex portion 33 is a square with rounded corners.

[0080] Please refer to Figures 2 to 3 As shown, in some embodiments of the present invention, the second circuit board 4 is arranged at the center of the reinforcement 3. In some embodiments of the present invention, a fourth through hole 41 is formed in the center of the second circuit board 4, and the fourth through hole 41 of the second circuit board 4, the third through hole 32 of the reinforcement 3, the second through hole 21 of the first circuit board 2 and the first through hole 12 of the bottom plate 1 are interconnected so that the other part of the test card 5 can pass through. Please refer to Figure 2 and Figure 3 As shown, in some embodiments of the present invention, the surface of the second circuit board 4 has a second circuit pattern 42. The first circuit pattern 22 of the first circuit board 2 and the second circuit pattern 42 of the second circuit board 4 are electrically connected to each other through a plurality of bonding wires (not shown).

[0081] Please refer to Figures 2 to 6 As shown, in some embodiments of the present invention, the test card 5 has a main body 51 and a plurality of probes 52. The main body 51 may have a circuit board (not shown). The main body 51 is located below the reinforcement 3, and the plurality of probes 52 are arranged through the first through hole 12 of the base plate 1, the second through hole 21 of the first circuit board 2, the third through hole 32 of the reinforcement 3, and the fourth through hole 41 of the second circuit board 4, and are electrically connected to the second circuit pattern 42 of the second circuit board 4.

[0082] Please refer to Figure 2 and Figure 4 As shown, in some embodiments of the present invention, the surface of the bottom plate 1 has a first positioning mark 13, for example Figure 2 The triangle arrow shown in FIG. 1 shows a third positioning mark 34 on the surface of the reinforcement member 3, for example Figure 2 When the reinforcing member 3 is assembled on the bottom plate 1, the third positioning mark 34 of the reinforcing member 3 is aligned with the first positioning mark 13 of the bottom plate 1. In some embodiments of the present invention, the second circuit board 2 has a second positioning mark 23, for example Figure 2 When the first circuit board 2 is disposed on the base plate 1 , the second positioning mark 23 of the first circuit board 2 is aligned with the third positioning mark 34 of the reinforcing member 3 .

[0083] In addition, please refer to Figures 4 to 6 As shown, in some embodiments of the present invention, the base plate 1, the reinforcement member 3 and the second circuit board 4 are integrally formed.

[0084] Combined with the above structure, please refer to Figure 1 Combined with the present invention Figures 2 to 6 As shown, when testing, the base rises so that the front end of the probe 52 of the present invention forms electrical contact with the pad of the component under test, thereby establishing an electrical path between the test card 50 and the component under test. During the test, the test signal is transmitted to the component under test via the probe 52 of the test card 50, and the response signal of the component under test is transmitted to the outside of the test card 50 via the probe 52 for analysis, thereby realizing the electrical test of the component under test.

[0085] Through the above structure, the testing device 100 of the present invention has a base plate 1, a first circuit board 2, a reinforcement 3, a second circuit board 4 and a testing card 5, wherein the base plate 1, the reinforcement 3 and the second circuit board 4 can be integrally formed, and the base plate 1 supports the first circuit board 2. As a result of this structure, it is possible to avoid that when the volume of the first circuit board 2 is larger, the variation will be greater, thereby causing the connection between the first circuit board 2 and the test card 5 to be easily affected by the temperature change, resulting in distortion or error of the test result; in other words, due to the large temperature change in the test chamber, the deformation of the first circuit board 2 is large, and the displacement of the tip of the probe 52 is large. By directly supporting the first circuit board 2 through the bottom plate 1, the first circuit board 2 is not directly connected to the test card 5, which can avoid the pad 35' deviating from the DUT 31', thereby causing distortion or error of the test result; therefore, when at different temperatures, the temperature variation of the materials of the bottom plate 1, the reinforcement 3 and the second circuit board 4 is close to the temperature variation of the test card 5, and the multiple probes 52 of the test card 5 are not directly connected to the first circuit board 2, so that the variation between the first circuit board 2 and the multiple probes 52 of the test card 5 is reduced, thereby avoiding distortion or error of the test result and improving the yield.

[0086] Furthermore, the first through hole 12 through the bottom plate 1 is generally in the shape of a square with rounded corners, and the convex portion 33 has a contour corresponding to the contour of the first through hole 12 of the bottom plate 1. In other words, the contour of the convex portion 33 is in the shape of a square with rounded corners; the surface of the bottom plate 1 has a first positioning mark 13, such as Figure 1 The triangle arrow shown in FIG. 1 shows a third positioning mark 34 on the surface of the reinforcement member 3, for example Figure 1 As shown by the triangle arrow, when the reinforcement member 3 is assembled on the base plate 1, the third positioning mark 34 is aligned with the first positioning mark 13; and the second circuit board 2 has a second positioning mark 23, for example Figure 1As shown by the triangular arrow, when the first circuit board 2 is arranged on the base plate 1, the second positioning mark 23 of the first circuit board 2 is aligned with the third positioning mark 34 of the reinforcement member 3, thereby avoiding assembly errors and achieving a fool-proof effect.

[0087] An embodiment of the present invention provides a test device. The test device includes a bottom plate; a first circuit board disposed on the bottom plate; a reinforcing member disposed on the bottom plate and located at the center of the bottom plate and passing through the first circuit board; a second circuit board disposed at the center of the reinforcing member; and a test card, a portion of which is located below the reinforcing member and another portion of which passes through the bottom plate, the first circuit board, the reinforcing member, and the second circuit board.

[0088] Although the present invention and its advantages have been described in detail, it should be understood that various changes, substitutions and replacements can be made without departing from the spirit and scope of the present invention defined by the claims. For example, many of the above processes can be implemented in different ways, and other processes or combinations thereof can be used to replace many of the above processes.

[0089] Furthermore, the scope of the present invention is not limited to the specific embodiments of the processes, machines, manufactures, compositions of matter, means, methods and steps described in the specification. Those skilled in the art can understand from the disclosure of the present invention that existing or future developed processes, machines, manufactures, compositions of matter, means, methods, or steps that have the same functions or achieve substantially the same results as the corresponding embodiments described herein can be used in accordance with the present invention. Accordingly, such processes, machines, manufactures, compositions of matter, means, methods, or steps are included in the claims of the present invention.

Claims

1. A testing device, comprising: a bottom plate; A first circuit board, disposed on the bottom plate; A reinforcing member is disposed on the bottom plate and is located at the center of the bottom plate and is disposed through the first circuit board; a second circuit board disposed at the center of the reinforcement member; as well as A test card includes a body and a plurality of probes, wherein the body is located below the reinforcing member, and the plurality of probes are arranged through the bottom plate, the first circuit board, the reinforcing member, and the second circuit board. The front ends of the plurality of probes are used to form electrical contact with a component to be tested, and the first circuit board is located between the front ends of the plurality of probes and the body.

2. The testing device as claimed in claim 1, wherein the bottom plate is circular, a first concave portion is concavely formed in the center of the bottom plate for accommodating the reinforcement member, and a first through hole is formed in the center of the first concave portion. 3 . The testing device as claimed in claim 2 , wherein a second through hole is formed at the center of the first circuit board, and the second through hole is arranged corresponding to the first concave portion of the bottom plate. 4 . The testing device as claimed in claim 3 , wherein a second concave portion is concavely formed at the center of the reinforcing member for accommodating the second circuit board, and a third through hole is formed through the center of the second concave portion.

5. The testing device as claimed in claim 4, wherein a fourth through hole is formed at the center of the second circuit board, and the fourth through hole, the third through hole, the second through hole and the first through hole are interconnected to allow the plurality of probes of the testing card to pass through. The testing device as claimed in claim 1 , wherein the plurality of probes are electrically connected to the second circuit board. 7 . The testing device as claimed in claim 5 , wherein the first through hole of the bottom plate is in a square shape with rounded corners. 8 . The testing device as claimed in claim 7 , wherein a convex portion is protruded downward at the center of the reinforcement member, and the convex portion is disposed corresponding to the first through hole passing through the bottom plate. 9 . The testing device as claimed in claim 8 , wherein the protruding portion has a contour corresponding to a contour of the first through hole of the bottom plate.

10. The testing device as claimed in claim 5, wherein a surface of the first circuit board has a first circuit pattern, a surface of the second circuit board has a second circuit pattern, and the first circuit pattern and the second circuit pattern are electrically connected to each other through a plurality of bonding wires.

11. The testing device as described in claim 10, wherein the plurality of probes are arranged through the first through hole of the base plate, the second through hole of the first circuit board, the third through hole of the reinforcement and the fourth through hole of the second circuit board, and are electrically connected to the second circuit pattern of the second circuit board.

12. The testing device as claimed in claim 5, wherein the surface of the base plate has a first positioning mark, and the surface of the reinforcement has a third positioning mark, and when the reinforcement is assembled on the base plate, the third positioning mark of the reinforcement is aligned with the first positioning mark of the base plate.

13. The testing device as claimed in claim 12, wherein the second circuit board has a second positioning mark, and when the first circuit board is disposed on the bottom plate, the second positioning mark of the first circuit board is aligned with the third positioning mark of the reinforcement. 14 . The testing device as claimed in claim 1 , wherein the base plate, the reinforcement member and the second circuit board are integrally formed.

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