Chip device and method of manufacturing the same

Abstract

The application provides a chip device and a preparation method thereof. The method comprises the following steps: providing a substrate; mounting a support and a bare chip on the substrate; and mounting a heat dissipation cover to cover the outer side of the bare chip and the support. The application can reduce the production cost of the chip device.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a chip device and its fabrication method. Background Technology

[0002] With the rapid development of science and technology, chip packaging technology has been greatly improved.

[0003] In current chip packaging processes, to prevent substrate deformation or uneven stress distribution from reducing chip device reliability, a support frame is typically placed inside the heat sink cavity to reinforce the substrate during heat sink installation. However, this method requires the support frame to have the same flatness as the heat sink body, which increases the manufacturing difficulty of the heat sink and consequently raises the production cost of the chip device. Summary of the Invention

[0004] To address the aforementioned issues, the chip device and its fabrication method provided by this invention, by setting a support member on the substrate, not only strengthens the structure of the chip device but also reduces the processing difficulty of the heat sink, thereby reducing the production cost of the chip device.

[0005] In a first aspect, the present invention provides a method for fabricating a chip device, the method comprising:

[0006] Provide substrate;

[0007] Mount the support components and bare chips onto the substrate;

[0008] Install a heat sink so that it covers the outside of the bare chip and the support.

[0009] Optionally, before installing the heat sink to cover the outside of the bare chip and the support, the method further includes:

[0010] Passive components are attached to the substrate.

[0011] Optionally, mounting the support member and bare chip on the substrate includes:

[0012] The support is glued to the substrate.

[0013] Optionally, mounting the support member and bare chip on the substrate further includes:

[0014] The bare chip is reflow soldered onto the substrate.

[0015] Optionally, before installing the heat sink to cover the outside of the bare chip and the support, the method further includes:

[0016] Fill the bottom of the bare chip with adhesive.

[0017] Optionally, before installing the heat sink to cover the outside of the bare chip and the support, the method further includes:

[0018] A thermally conductive layer is attached to the surface of the bare chip so that the bare chip comes into contact with the heat sink through the thermally conductive layer.

[0019] In a second aspect, the present invention provides a chip device, comprising: a heat sink, a substrate, a bare chip, and a support member;

[0020] The heat sink, the bare chip, and the support are all fixedly disposed on the upper surface of the substrate, with the heat sink covering the outside of the bare chip and the support.

[0021] Optionally, the heat dissipation cover has a cavity on its surface facing the substrate;

[0022] The end of the bare chip that is away from the substrate is located inside the cavity;

[0023] The end of the support member that faces away from the substrate is located inside the cavity.

[0024] Optionally, a thermally conductive layer is provided on the outer side of the bare chip, and the bare chip contacts the heat sink through the thermally conductive layer.

[0025] Optionally, the surface of the support member is provided with protrusions, and the support member abuts against the heat dissipation cover through the protrusions.

[0026] The chip device and its fabrication method provided in this invention not only strengthen the structure of the chip device and improve its mechanical strength by setting a support member on the substrate, but also reduce the number of processing steps for the heat sink and lower the processing difficulty of the heat sink, thereby reducing the production cost of the chip device. In addition, by installing the support member on the substrate before installing the heat sink, the deformation of the substrate can be reduced, thereby improving the success rate of subsequent flip-chip and soldering processes, and thus improving the reliability of the chip device. Attached Figure Description

[0027] Figure 1 and Figure 2 These are structural diagrams of a chip device according to an embodiment of this application after the heat sink is removed and a support member of different shapes is installed.

[0028] Figures 3 to 6 This is a schematic structural diagram of a chip device according to an embodiment of this application at different fabrication stages.

[0029] Figure Labels

[0030] 1. Heat sink; 11. Cavity; 2. Passive component; 3. Substrate; 4. Bare chip; 5. Support component; 6. Thermal conductive layer. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] It should be noted that, in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0033] Example 1

[0034] This embodiment provides a chip device, combined with Figure 1 , Figure 2 and Figure 5 The chip components include: heat sink 1, passive components 2, substrate 3, bare chip 4, and support component 5.

[0035] Among them, the passive device 2, also known as a passive component, has the characteristics of not consuming electrical energy itself, or converting electrical energy into other forms of energy, and can work normally without an external power supply as long as an input signal is required. In this embodiment, the passive device 2 includes one or more of the following: resistor, capacitor, inductor, converter, inverter, matching network, resonator, filter, mixer, and switch.

[0036] The heat sink 1, the passive device 2, the bare chip 4, and the support member 5 are all disposed on the upper surface of the substrate 3. Solder balls are fixed on the lower surface of the substrate 3 to facilitate the mounting of the chip device. The upper surface of the substrate 3 includes a protective area. The support member 5 and the bare chip 4 are located within the protective area. The passive device 2 is located on the periphery of the protective area. There may be one or more bare chips 4. The support member 5 may be a block structure distributed around the periphery of the bare chip 4; or it may be a frame structure surrounding the periphery of the bare chip 4. By providing the support member 5, the deformation of the substrate 3 under rapid changes in ambient temperature can be effectively reduced, thereby reducing the risk of reliability failure caused by thermal mismatch between the packaging materials.

[0037] In this embodiment, there are six bare chips 4; the support member 5 is a frame structure disposed between the six bare chips 4; the protective area is used to distinguish the area for mounting the support member 5 and the bare chips 4 from the area for mounting the passive device 2. This embodiment does not specifically limit the shape and size of the protective area; the bottom of the support member 5 is bonded to the substrate 3 with adhesive; the bare chips 4 are connected to the substrate 3 by reflow soldering, and the bottom of the bare chips 4 is filled with chip encapsulation adhesive. Using adhesive to fix the support member 5 can reduce damage to the substrate 3.

[0038] A cavity 11 is formed on the lower surface of the heat sink 1. All passive devices 2, six bare chips 4, and corresponding support members 5 are located within the cavity 11. The lower surface of the heat sink 1 is sealed and fixedly connected to the substrate 3 by a sealant. The sealant material can be conductive or insulating, depending on the performance requirements of the chip devices. Specifically, the sealant material includes polymers, rubber, or metal resin adhesives, etc. This embodiment does not specifically limit the sealant. The coefficient of thermal expansion of the support member 5 is less than that of the substrate 3. In this embodiment, the coefficient of thermal expansion of the support member 5 differs from that of the substrate 3 by at least one order of magnitude. The material of the support member 5 includes copper, iron, aluminum, stainless steel, tungsten, molybdenum, or an organic resin with a low coefficient of thermal expansion.

[0039] Furthermore, a thermally conductive layer 6 is provided on the top of each of the six bare chips 4. In this embodiment, the thermally conductive layer 6 is soldered between the bare chip 4 and the heat sink 1 as a heat sink, so that the six bare chips 4 respectively contact the heat sink 1 through the corresponding thermally conductive layer 6. The materials of the thermally conductive layer 6 include indium, indium-silver alloy, silver, tin, tin-silver alloy, or tin-lead alloy, etc.; the material of the heat sink 1 is a metallic thermally conductive material, specifically including copper, iron, aluminum, stainless steel, tungsten, or molybdenum, etc. This embodiment does not specifically limit the materials of the thermally conductive layer 6 and the heat sink 1.

[0040] The support member 5 is clearance-fitted with the heat sink 1. In an optional embodiment, the upper surface of the support member 5 is provided with a protrusion. The support member 5 abuts against the heat sink 1 through the protrusion. The protrusion can be made of an elastic material or the same material as the support member 5. In this embodiment, the material of the protrusion is the same as the material of the support member 5; the protrusion and the support member 5 are integrally formed and fixedly connected. By providing the protrusion, the structural strength of the chip device structure can be further improved.

[0041] By setting the support member 5 on the substrate 3, the chip device not only strengthens the structure of the chip device and improves its mechanical strength, but also reduces the number of processing steps of the heat sink 1, reducing the processing difficulty of the heat sink 1 and thus reducing the production cost of the chip device. In addition, by installing the support member 5 on the substrate 3 before installing the heat sink 1, deformation of the chip device during production and use can be avoided, such as during processes like soldering reflow, ball reflow, and surface mount reflow, thereby improving the success rate of subsequent flip-chip and soldering processes and thus improving the reliability of the chip device.

[0042] Example 2

[0043] This embodiment provides a method for fabricating a chip device as described in Embodiment 1, combined with... Figure 3 , Figure 4 , Figure 5 and Figure 6 The method includes steps S101 to S108:

[0044] Step S101: Provide substrate 3.

[0045] Step S102: Attach passive device 2 to substrate 3.

[0046] Step S103: Attach the support member 5 to the substrate 3.

[0047] Step S104: Reflow solder the bare chip 4 onto the substrate 3.

[0048] Step S105: Attach the thermal conductive layer 6 to the top of the bare chip 4.

[0049] Step S106: Fill the bottom of the bare chip 4 with adhesive. The adhesive is a chip encapsulation adhesive.

[0050] Step S107: Install the heat sink 1 so that the heat sink 1 covers the outside of the bare chip 4 and the support member 5.

[0051] Step S108: Plant balls at the bottom of substrate 3.

[0052] The order of the above preparation steps can be adjusted without affecting the technical effect to be achieved by the present invention, and will not be described in detail in this embodiment.

[0053] This chip device fabrication method, by setting a support member 5 on the substrate 3, not only strengthens the structure of the chip device and improves its mechanical strength, but also reduces the number of processing steps for the heat sink 1, lowering the processing difficulty of the heat sink 1 and thus reducing the production cost of the chip device. In addition, by installing the support member 5 on the substrate 3 before installing the heat sink 1, the deformation of the substrate 3 can be reduced, thereby improving the success rate of subsequent flip-chip and soldering processes, and thus improving the reliability of the chip device.

[0054] In particular, for the aforementioned chip devices fabricated using MCM (Multi-chip Module) packaging technology, it is possible to increase the functional density of the chip devices while reducing their power consumption, thereby achieving high performance and multifunctionality. Furthermore, by adding a support component 5 before flip-chip reflow soldering, the deformation of the substrate 3 is reduced, thus improving the success rate of flip-chip reflow soldering; the total area of ​​its packaging structure can exceed 10000 mm². 2 The length of one side exceeds 120mm.

[0055] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for fabricating a chip device, characterized in that, The method includes: Provide substrate; Mount the support components and bare chips onto the substrate; The step of mounting the support member and the bare chip on the substrate includes: First, the support member is bonded to the substrate, and then the bare chip is soldered to the substrate using reflow soldering. Install a heat sink cover so that it covers the outside of the bare chip and the support member. The support member is in clearance fit with the heat sink cover. The surface of the support member facing the heat sink cover is provided with a protrusion. The support member abuts against the heat sink cover through the protrusion. The protrusion is made of an elastic material or the same material as the support member.

2. The chip device fabrication method according to claim 1, characterized in that, Before installing the heat sink to cover the outside of the bare chip and the support, the method further includes: Passive components are attached to the substrate.

3. The chip device fabrication method according to claim 1, characterized in that, Before installing the heat sink to cover the outside of the bare chip and the support, the method further includes: Fill the bottom of the bare chip with adhesive.

4. The chip device fabrication method according to claim 1, characterized in that, Before installing the heat sink to cover the outside of the bare chip and the support, the method further includes: A thermally conductive layer is attached to the surface of the bare chip so that the bare chip comes into contact with the heat sink through the thermally conductive layer.

5. A chip device, characterized in that, include: Heat sink, substrate, bare chip, and support components; The heat sink, the bare chip, and the support are all fixedly disposed on the upper surface of the substrate, with the heat sink covering the outside of the bare chip and the support; wherein, the bare chip is reflow soldered onto the substrate after the support is bonded to the substrate. The support member is fitted with the heat dissipation cover with a clearance. The surface of the support member facing the heat dissipation cover is provided with a protrusion. The support member abuts against the heat dissipation cover through the protrusion. The material of the protrusion is an elastic material or the same material as the support member.

6. The chip device according to claim 5, characterized in that, The heat dissipation cover has a cavity on its surface facing the substrate; The end of the bare chip that is away from the substrate is located inside the cavity; The end of the support member that faces away from the substrate is located inside the cavity.

7. The chip device according to claim 5, characterized in that, A thermally conductive layer is provided on the outer side of the bare chip, and the bare chip contacts the heat sink through the thermally conductive layer.

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