Ultrasonic inspection system

Abstract

This invention provides an ultrasonic inspection system capable of suppressing image quality degradation in ultrasonic images and enabling the reduction of the diameter of ultrasonic endoscopes. The ultrasonic inspection system comprises: an ultrasonic transducer array with multiple ultrasonic transducers arranged therein; a cable connected to the multiple ultrasonic transducers, having: a non-coaxial cable including a first cable bundle consisting of multiple signal lines and multiple ground lines, and a first shielding layer covering the first cable bundle; and an outer sheath covering a second cable bundle consisting of the multiple non-coaxial cables; a memory storing capacitance data representing the capacitance of each signal line included in the first cable bundle; and a processor periodically correcting the transmit / receive sensitivity of each ultrasonic transducer based on the capacitance data stored in the memory.

Description

Technical Field

[0001] This invention relates to an ultrasonic inspection system. Background Technology

[0002] In recent years, ultrasound examination systems have been used in medical settings. These systems irradiate ultrasound waves into the body of the examinee, receive the reflected waves, and visualize them to observe the internal condition.

[0003] Such an ultrasonic inspection system, for example as disclosed in Patent Document 1, includes an ultrasonic endoscope and a processor. The ultrasonic endoscope includes: a front end portion having a piezoelectric element constituting an ultrasonic transducer; a curved portion and a flexible portion connected to the base end of the front end portion; a plurality of coaxial cables inserted through the curved portion and the flexible portion; and a wiring board electrically connected to the piezoelectric element and the coaxial cables. The processor is electrically connected to the piezoelectric element and receives and transmits electric signals to the piezoelectric element.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2019-054962

[0005] Regarding coaxial cables, since the outer diameter of a signal line is encased in insulation and covered by a shield and outer sheath, the outer diameter of the coaxial cable is larger, making it difficult to reduce the diameter of the ultrasonic endoscope.

[0006] Therefore, the use of a non-coaxial cable to replace the coaxial cable was considered, thereby enabling a smaller diameter ultrasound endoscope. However, non-coaxial cables are prone to differences in electrostatic capacitance between multiple signal lines. These differences in electrostatic capacitance are related to differences in sensitivity; deviations in sensitivity between ultrasound transducers can potentially affect the image quality. Summary of the Invention

[0007] The present invention was made in view of this situation, and its object is to provide an ultrasonic examination system that can suppress the degradation of ultrasonic image quality and enable the reduction of the diameter of the ultrasonic endoscope.

[0008] Regarding the ultrasonic inspection system of the first method, it comprises: an ultrasonic transducer array having a plurality of ultrasonic transducers arranged therein; a cable connected to the plurality of ultrasonic transducers, having: a non-coaxial cable including a first cable bundle consisting of a plurality of signal lines and a plurality of ground lines, and a first shielding layer covering the first cable bundle; and an outer sheath covering a second cable bundle consisting of the plurality of non-coaxial cables; a memory storing electrostatic capacitance data representing the electrostatic capacitance of each signal line included in the first cable bundle; and a processor periodically correcting the transceiver sensitivity of each ultrasonic transducer based on the electrostatic capacitance data stored in the memory.

[0009] In the ultrasonic inspection system of the second method, the memory stores sensitivity data representing the sensitivity of the ultrasonic transducers, and the processor periodically corrects the transmit and receive sensitivity of each ultrasonic transducer based on the electrostatic capacitance data and sensitivity data stored in the memory.

[0010] In the ultrasonic inspection system of the third method, the processor uses a transmitted signal with a voltage higher than that of the ultrasonic transducer connected to the signal line with low electrostatic capacitance to drive the ultrasonic transducer connected to the signal line with high electrostatic capacitance.

[0011] In the fourth type of ultrasonic inspection system, the processor applies a higher gain value to the received signal from the ultrasonic transducer connected to a signal line with high electrostatic capacitance than to the received signal from the ultrasonic transducer connected to a signal line with low electrostatic capacitance.

[0012] In the fifth type of ultrasonic inspection system, the processor applies a higher attenuation value to the received signal from the ultrasonic transducer connected to a signal line with low electrostatic capacitance than to the received signal from the ultrasonic transducer connected to a signal line with high electrostatic capacitance.

[0013] In the ultrasonic inspection system of the sixth method, in the ultrasonic transducer array, the ultrasonic transducer connected to the signal line with low electrostatic capacitance is arranged on the central side, and the ultrasonic transducer connected to the signal line with high electrostatic capacitance is arranged on the end side.

[0014] In the ultrasonic inspection system of the seventh method, the processor sets the difference in electrostatic capacitance between the signal lines contained in each of the first cable bundles to less than 2dB.

[0015] Invention Effects

[0016] The ultrasonic inspection system according to the present invention can suppress the degradation of ultrasonic image quality and can achieve the reduction of the diameter of the ultrasonic endoscope. Attached Figure Description

[0017] Figure 1 This is a schematic structural diagram illustrating an example of the structure of an ultrasound examination system.

[0018] Figure 2 It means Figure 1 A magnified top view of the front end and surrounding area of ​​an ultrasonic endoscope.

[0019] Figure 3 It is along Figure 2 A sectional view cut along line III-III.

[0020] Figure 4 It is along Figure 3 The cross-sectional view shown is cut along line IV-IV.

[0021] Figure 5This is a diagram showing the connection structure between the substrate and the non-coaxial cable.

[0022] Figure 6 It is along Figure 5 A cross-sectional view of a non-coaxial cable cut along the VI-VI line.

[0023] Figure 7 It is along Figure 5 A cross-sectional view of the cable cut along line VII-VII.

[0024] Figure 8 It means Figure 1 The diagram shows a block diagram of the structure of an ultrasonic processor device.

[0025] Figure 9 It is a graph showing the relationship between the ultrasonic transducer and electrostatic capacitance, and between the ultrasonic transducer and the transceiver sensitivity.

[0026] Figure 10 This is a graph showing the relationship between the ultrasonic transducer and the transmit / receive sensitivity in the first mode.

[0027] Figure 11 This is a graph showing the relationship between the ultrasonic transducer and the transmit / receive sensitivity in the second method.

[0028] Figure 12 This is a graph showing the relationship between the ultrasonic transducer and the transceiver sensitivity in the third method.

[0029] Figure 13 (A) is a conceptual diagram of the scan lines corresponding to the ultrasonic transducers of the ultrasonic transducer array. Figure 13 (B) is a graph showing the relationship between the configured ultrasonic transducer and the electrostatic capacitance. Detailed Implementation

[0030] Hereinafter, with reference to the accompanying drawings, preferred embodiments of the ultrasonic endoscope according to the present invention will be described.

[0031] Figure 1 This is a schematic structural diagram of an example of an ultrasonic examination system 10 using an ultrasonic endoscope 12 according to an embodiment.

[0032] like Figure 1 As shown, the ultrasound examination system 10 includes: an ultrasound endoscope 12; an ultrasound processor 14 for generating ultrasound images; an endoscope processor 16 for generating endoscopic images; a light source 18 for supplying illumination light to the ultrasound endoscope 12 to illuminate the body cavity; and a display 20 for displaying the ultrasound images and endoscopic images. Furthermore, the ultrasound examination system 10 includes: a water tank 21a for storing cleaning water, etc.; and a suction pump 21b for suctioning material from the body cavity.

[0033] The ultrasonic endoscope 12 has: an insertion part 22, which is inserted into the body cavity of the subject; an operation part 24, which is connected to the base of the insertion part 22 and is used for operation by the surgeon; and a universal lanyard 26, one end of which is connected to the operation part 24.

[0034] The operation unit 24 is provided with the following in parallel: an air / water supply button 28a, which opens and closes the air / water supply line from the water tank 21a (not shown); and a suction button 28b, which opens and closes the suction line from the suction pump 21b (not shown). Furthermore, the operation unit 24 is provided with a pair of angle knobs 29, 29 and a treatment device insertion port 30.

[0035] At the other end of the universal plug rope 26 are provided: an ultrasonic connector 32a, connected to the ultrasonic processor device 14; an endoscope connector 32b, connected to the endoscope processor device 16; and a light source connector 32c, connected to the light source device 18. The ultrasonic endoscope 12 is detachably connected to the ultrasonic processor device 14, the endoscope processor device 16, and the light source device 18 via these connectors 32a, 32b, and 32c, respectively. Furthermore, connector 32c includes: an air / water supply hose 34a, connected to the water tank 21a; and a suction hose 34b, connected to the suction pump 21b.

[0036] The insertion part 22 has, in sequence from the front end side: a front end part 40 having an ultrasonic observation part 36 and an endoscope observation part 38; a curved part 42 connected to the base end side of the front end part 40; and a flexible part 43 connecting the base end side of the curved part 42 and the front end side of the operation part 24.

[0037] The bending portion 42 is remotely bent by rotating a pair of bend knobs 29, 29 provided on the operating part 24. As a result, the front end portion 40 can be oriented in the desired direction.

[0038] The ultrasonic processor device 14 generates and supplies ultrasonic transducer unit 46 (see reference) for use in the ultrasonic observation unit 36 ​​described later. Figure 2 The ultrasonic transducer array 50 generates ultrasonic signals. Furthermore, the ultrasonic processor device 14 uses the ultrasonic transducer array 50 to receive and acquire echo signals reflected from the observation part of the object from which the ultrasonic waves are emitted, and performs various signal processing on the acquired echo signals to generate an ultrasonic image displayed on the display 20.

[0039] The endoscope processor device 16 is located in the endoscope observation section 38. It receives and acquires the camera image signal from the observation object part illuminated by the illumination light from the light source device 18, and performs various signal processing and image processing on the acquired image signal to generate the endoscope image displayed on the display 20.

[0040] The ultrasonic processor device 14 and the endoscope processor device 16 are each composed of two separate devices (computers). However, this is not a limitation; both the ultrasonic processor device 14 and the endoscope processor 16 can be composed of a single device.

[0041] In order to acquire image signals by using the endoscope observation section 38 to photograph the observation area inside the body cavity, the light source device 18 generates illumination light, such as white light composed of three primary colors of light (red, green, and blue) or light of a specific wavelength, which propagates in the light guide (not shown) inside the ultrasonic endoscope 12 and is emitted from the endoscope observation section 38, thereby illuminating the observation area inside the body cavity.

[0042] The display 20 receives video signals generated by the ultrasound processor 14 and the endoscope processor 16 and displays ultrasound images and endoscope images. Regarding the display of these ultrasound images and endoscope images, it is also possible to appropriately switch to displaying only one image on the display 20, or to display both images simultaneously.

[0043] In this embodiment, ultrasound images and endoscopic images are displayed on a single display 20, but separate displays for displaying ultrasound images and endoscopic images may also be provided. Furthermore, in addition to display 20, ultrasound images and endoscopic images may also be displayed on a display of a terminal carried by the surgeon.

[0044] Next, refer to Figures 2 to 4 The structure of the front end 40 will be described.

[0045] Figure 2 It means Figure 1 An enlarged top view of the front end 40 and its surrounding area shown. Figure 3 It is along Figure 2 The sectional view shown by line III-III is a longitudinal sectional view cut along the centerline of the front end 40 in the direction of its longitudinal axis. Figure 4 It is along Figure 3 The sectional view shown along line IV-IV is a cross-sectional view taken along the center line of the arc structure of the ultrasonic transducer array 50 of the ultrasonic observation section 36 at the front end 40.

[0046] like Figure 2 and Figure 3 As shown, in the front end portion 40, an ultrasonic observation unit 36 ​​for acquiring ultrasonic images is mounted on the front end side, and an endoscopic observation unit 38 for acquiring endoscopic images is mounted on the base end side. Furthermore, a treatment device outlet 44 is provided on the front end portion 40 between the ultrasonic observation unit 36 ​​and the endoscopic observation unit 38.

[0047] The endoscope observation section 38 consists of an observation window 82, an objective lens 84, a solid-state imaging element 86, an illumination window 88, a cleaning nozzle 90, and a wiring cable 92.

[0048] The treatment device outlet 44 is connected to the treatment device channel 45 that penetrates the interior of the insertion part 22. Figure 1 The treatment device (not shown) inserted into the treatment device insertion port 30 is discharged into the body cavity through the treatment device channel 45 from the treatment device discharge port 44.

[0049] like Figures 2 to 4 As shown, the ultrasonic observation unit 36 ​​includes an ultrasonic transducer unit 46, an outer casing 41 that holds the ultrasonic transducer unit 46, and a cable 100 that is electrically connected to the ultrasonic transducer unit 46 via a substrate 60. The outer casing 41 is made of a rigid material such as rigid resin and forms part of the front end portion 40.

[0050] The ultrasonic transducer unit 46 includes: an ultrasonic transducer array 50 composed of a plurality of ultrasonic transducers 48; an electrode 52 disposed at the end side of the ultrasonic transducer array 50 in the width direction (orthogonal to the longitudinal axis direction of the insertion portion 22); a backing material layer 54 supporting each ultrasonic transducer 48 from the lower surface side; a substrate 60 disposed along the side of the backing material layer 54 in the width direction and connected to the electrode 52; and a filler layer 80 filling the internal space 55 between the outer component 41 and the backing material layer 54.

[0051] The structure of the substrate 60 is not particularly limited as long as it can electrically connect multiple ultrasonic transducers 48 and cables 100.

[0052] The substrate 60 is preferably made of a wiring substrate such as a printed wiring circuit board (also known as a PCB (Printed Circuit Board)) or a printed wiring board (also known as a PWB (Printed Wired Board)). The printed wiring circuit board is made of a flexible substrate (also known as a flexible printed circuit (FPC)) and a rigid substrate with high rigidity that is not flexible.

[0053] The ultrasonic transducer unit 46 has: an acoustic matching layer 76 stacked on the ultrasonic transducer array 50; and an acoustic lens 78 stacked on the acoustic matching layer 76. That is, the ultrasonic transducer unit 46 is configured as a laminate 47 having an acoustic lens 78, an acoustic matching layer 76, an ultrasonic transducer array 50, and a backing material layer 54.

[0054] The ultrasonic transducer array 50 is composed of a plurality of cuboid-shaped ultrasonic transducers 48 arranged outwards in a convex arc shape. For example, the ultrasonic transducer array 50 is an array of 48 to 192 channels composed of 48 to 192 ultrasonic transducers 48. Each of these ultrasonic transducers 48 has a piezoelectric element 49.

[0055] The ultrasonic transducer array 50 has electrodes 52. Electrodes 52 have individual electrodes 52a, independent for each ultrasonic transducer 48; and a transducer ground 52b, serving as a common electrode for all ultrasonic transducers 48. Figure 4 In this configuration, multiple individual electrodes 52a are disposed on the lower surface of the ends of multiple ultrasonic transducers 48, and transducer grounding 52b is disposed on the upper surface of the ends of the ultrasonic transducers 48.

[0056] The substrate 60 has 48 to 192 wirings (not shown) that are electrically connected to the individual electrodes 52a of 48 to 192 ultrasonic transducers 48 respectively, and a plurality of electrode pads 62 that are connected to the ultrasonic transducers 48 respectively via the wirings.

[0057] The ultrasonic transducer array 50, taking a plurality of ultrasonic transducers 48 as an example, has a structure in which they are arranged at a predetermined interval in a one-dimensional array. Each ultrasonic transducer 48 constituting the ultrasonic transducer array 50 is arranged at equal intervals in a convex curved shape along the axial direction of the front end portion 40 (the longitudinal direction of the insertion portion 22), according to the ultrasonic processor device 14 (reference...). Figure 1 The input drive signals drive the circuit sequentially. Thus, the circuit is arranged in a specific pattern. Figure 2 The range of the ultrasonic transducer 48 shown is used as the scanning range for convex electronic scanning.

[0058] The acoustic matching layer 76 is used to obtain acoustic impedance matching between the test subject and the ultrasonic transducer 48.

[0059] An acoustic lens 78 is used to converge the ultrasonic waves emitted from the ultrasonic transducer array 50 toward the object being observed. This acoustic lens 78 is formed, for example, of a silicone-based resin (millable silicone rubber, liquid silicone rubber, etc.), a butadiene-based resin, or a polyurethane-based resin. Furthermore, if necessary, powders such as titanium oxide, aluminum oxide, or silica are mixed into the acoustic lens 78. Thus, the acoustic lens 78 achieves acoustic impedance matching between the object being examined and the ultrasonic transducer 48 within the acoustic matching layer 76, and can improve the transmittance of the ultrasonic waves.

[0060] like Figure 3 and Figure 4As shown, the backing material layer 54 is disposed on the back side (lower surface) of the ultrasonic transducer array 50, which is inside the arrangement surface of the plurality of ultrasonic transducers 48. The backing material layer 54 is composed of a layer of components made of backing material. The backing material layer 54 mechanically and flexibly supports the ultrasonic transducer array 50 and has the function of attenuating ultrasonic waves propagating towards the backing material layer 54 from the ultrasonic signals oscillating from the plurality of ultrasonic transducers 48 or reflected from the object being observed. In addition, the backing material is made of a rigid material such as hard rubber, and ultrasonic attenuating materials (such as ferrite and ceramic) are added as needed.

[0061] The filler layer 80 fills the internal space 55 between the outer component 41 and the backing material layer 54, and serves to fix the substrate 60, the non-coaxial cable 110, and various wiring components. Furthermore, the filler layer 80 is preferably matched to the backing material layer 54 with a specified or higher acoustic impedance to avoid reflection of ultrasonic signals propagating from the ultrasonic transducer array 50 towards the backing material layer 54 at the boundary surface with the backing material layer 54. Moreover, to improve the efficiency of heat dissipation generated in the plurality of ultrasonic transducers 48, the filler layer 80 is preferably composed of a heat-dissipating component. When the filler layer 80 is heat-dissipating, heat dissipation efficiency can be improved because heat is received from the backing material layer 54, the substrate 60, and the non-coaxial cable 110.

[0062] According to the ultrasonic transducer unit 46 configured as described above, if each ultrasonic transducer 48 of the ultrasonic transducer array 50 is driven and a voltage is applied to the electrode 52 of the ultrasonic transducer 48, the piezoelectric element 49 vibrates and sequentially generates ultrasonic waves, which are then directed toward the observation area of ​​the subject. Then, multiple ultrasonic transducers 48 are sequentially driven by an electronic switch such as a multiplexer, thereby scanning the ultrasonic waves within a scanning range along the curved surface where the ultrasonic transducer array 50 is arranged, for example, within a range of approximately tens of millimeters from the center of curvature of the surface.

[0063] Furthermore, if an echo signal reflected from the observed object is received, the piezoelectric element 49 vibrates to generate a voltage, and outputs this voltage as an electrical signal corresponding to the received ultrasonic echo to the ultrasonic processor device 14. Then, after various signal processing is performed in the ultrasonic processor device 14, it is displayed on the display 20 as an ultrasonic image.

[0064] In the implementation, Figure 4 The substrate 60 shown has multiple electrode pads 62 electrically connected to multiple individual electrodes 52a at one end, and a ground electrode pad 64 electrically connected to the oscillator ground 52b. Additionally, in Figure 4 In the text, cable 100 is omitted.

[0065] Electrical bonding between the substrate 60 and the individual electrodes 52a can be established, for example, by using a conductive resin material. Examples of resin materials include materials in which fine conductive particles are mixed in a thermosetting resin and molded into a film-like ACF (Anisotropic Conductive Film) or ACP (Anisotropic Conductive Paste).

[0066] Other resin materials include, for example, resin materials in which conductive fillers such as metal particles are dispersed in adhesive resins such as epoxy or urethane, and after bonding, the fillers form conductive pathways. Examples of such resin materials include conductive pastes such as silver paste.

[0067] like Figure 3 As shown, the cable 100 includes a plurality of non-coaxial cables 110 and an outer sheath 102 covering the plurality of non-coaxial cables 110. The signal lines contained in the non-coaxial cables 110 are electrically bonded to the electrode pads 62 of the substrate 60.

[0068] Next, with reference to the accompanying drawings, the connection structure between the substrate 60 and the cable 100 will be described.

[0069] Figure 5 This is an enlarged view of the portion including the substrate 60 and the cable 100. Figure 6 It is a sectional view taken along line VI-VI. Figure 7 It is a sectional view taken along line VII-VII.

[0070] like Figure 5 As shown, the substrate 60 has a plurality of electrode pads 62 arranged along one side of the base end edge 60a, and a ground electrode pad 64 arranged between the plurality of electrode pads 62 and the edge 60a. The ground electrode pad 64 is arranged parallel to the edge 60a.

[0071] Cable 100 is positioned opposite edge 60a of substrate 60. Cable 100 includes a plurality of non-coaxial cables 110 and an outer sheath 102 covering the plurality of non-coaxial cables 110. Electrode pads 62 are electrically connected to signal lines 112 of the non-coaxial cables 110. The non-coaxial cables 110 are configured to be parallel to edges 60b and 60c, which are orthogonal to edge 60a. However, the positional relationship between substrate 60 and non-coaxial cables 110 is not particularly limited.

[0072] Next, the structure of the non-coaxial cable 110 will be described. For example... Figure 6As shown, the non-coaxial cable 110 has multiple signal lines 112 and multiple ground lines 114. The signal lines 112 are, for example, composed of a conductor 112a and an insulating layer 112b surrounding the conductor 112a. The conductor 112a is, for example, made of bare copper or a copper alloy wire. The bare wire is subjected to electroplating treatments such as tin plating or silver plating. The conductor 112a has a diameter of 0.03 mm to 0.04 mm.

[0073] The insulating layer 112b can be made of resin materials such as fluorinated ethylene propylene (FEP) or perfluoroalkoxy (PFA). The insulating layer 112b has a thickness of 0.015 mm to 0.025 mm.

[0074] The grounding wire 114 is made of a conductor with the same diameter as the signal wire 112. The grounding wire 114 is made of bare copper or copper alloy wire, or a stranded wire of multiple bare copper or copper alloy wires.

[0075] The first cable bundle 116 is formed by twisting together multiple signal lines 112 and multiple grounding lines 114.

[0076] The non-coaxial cable 110 has a first shielding layer 118 covering the periphery of the first cable bundle 116. The first shielding layer 118 may be composed of an insulating film made of a metal foil laminated with an adhesive. The insulating film is made of polyethylene terephthalate (PET) film. Furthermore, the metal foil is made of aluminum foil or copper foil.

[0077] The non-coaxial cable 110 is shielded by a first shielding layer 118, which consists of multiple signal lines 112 grouped together. The signal lines 112 are handled on a unit basis, namely the non-coaxial cable 110.

[0078] like Figure 6 As shown, in the non-coaxial cable 110 of the embodiment, the first cable bundle 116 is composed of seven strands: four signal wires 112 and three ground wires. One of the four signal wires 112 is positioned at the center. The remaining three signal wires 112 and three ground wires 114 are arranged adjacent to and around the central signal wire 112. However, the number of signal wires 112, the number of ground wires 114, and their arrangement in the first cable bundle 116 are not limited to... Figure 6 The structure.

[0079] Next, the structure of cable 100 will be described. For example... Figure 7 As shown, cable 100 includes multiple non-coaxial cables 110. The second cable bundle 104 is composed of multiple non-coaxial cables 110.

[0080] The outer sheath 102 covers the second cable bundle 104. The outer sheath 102 is made of extruded and coated fluorinated resin materials such as PFA, FEP, ethylene-tetrafluoroethylene copolymer (ETFE), and polyvinyl chloride (PVC). The outer sheath 102 can also be made of wound resin tape (PET tape). The covering of the second cable bundle 104 based on the outer sheath 102 includes both directly covering the outer side of the second cable bundle 104 and indirectly covering the outer side of the second cable bundle 104. Indirect covering includes configuring additional layers between the outer sheath 102 and the second cable bundle 104.

[0081] In this embodiment, the cable 100 has a resin layer 106 and a second shielding layer 108 sequentially arranged from the inside between the outer sheath 102 and the second cable bundle 104. The resin layer 106 covers the second cable bundle 104. The resin layer 106 can be made of, for example, the aforementioned fluorine-based resin material or resin tape.

[0082] The second shielding layer 108 can be constructed, for example, by braiding multiple bare wires. The bare wires are made of electroplated (tin-plated or silver-plated) copper wire or copper alloy wire, etc.

[0083] The cable 100 may have either resin layer 106 or second shielding layer 108, or it may have only resin layer 106 and second shielding layer 108, in addition to the structure described above.

[0084] The cable 100 of the embodiment includes 16 non-coaxial cables 110 and 64 signal lines 112. The number of non-coaxial cables 110 and signal lines 112 is not limited to this value.

[0085] As described above, the non-coaxial cables 110 included in cable 100 differ from existing coaxial cables in that each signal line 112 does not have a shielding layer or outer sheath. In particular, when cable 100 is composed of multiple non-coaxial cables 110, cable 100 can achieve a smaller diameter compared to existing coaxial cables. Furthermore, when the outer diameter is the same as that of a coaxial cable, cable 100 can have more signal lines 112 compared to existing coaxial cables.

[0086] Next, the connection structure between the substrate 60 and the non-coaxial cable 110 will be described in detail. For example... Figure 5 As shown, on the base side of the substrate 60, the resin layer 106 (not shown), the second shielding layer 108 (not shown), and the outer sheath 102 of the cable 100 are removed, exposing a plurality of non-coaxial cables 110. Furthermore, on the base side of the substrate 60, the first shielding layer 118 of each non-coaxial cable 110 is removed, exposing a first cable bundle 116.

[0087] The first shielding layer 118 is located on the substrate 60, and when viewed from a direction orthogonal to the main surface of the substrate 60 (hereinafter, viewed from above), the substrate 60 and the first shielding layer 118 overlap at least partially. The first cable bundle 116 is exposed only on the substrate 60, and the substrate 60 and the first cable bundle 116 overlap only on the substrate 60. A portion of the first cable bundle 116 may protrude from the substrate 60.

[0088] The substrate 60 and the first cable bundles 116 are fixed by the fixing part 130, and the relative positions of the substrate 60 and each of the first cable bundles 116 are fixed. As long as the relative positions of the substrate 60 and each of the first cable bundles 116 are fixed, the position and size of the fixing part 130 are not limited. The first cable bundles 116, which are composed of stranded wires of multiple signal lines 112 and multiple ground lines 114, are untied into individual signal lines 112 at the front end 116a. Each untied signal line 112 is electrically bonded to an electrode pad 62 disposed on the substrate 60. The front end 116a is the starting position for untiing into individual signal lines 112. In addition, for ease of understanding, the fixing part 130 is omitted in a portion of the first cable bundles 116.

[0089] In this embodiment, the substrate 60 and the first cable bundle 116 are fixed by the fixing part 130. Therefore, when stress is applied to the cable 100 or the non-coaxial cable 110, stress transmission to the junction of the electrode pad 62 and the signal line 112 is suppressed, and the breakage of the signal line 112 can be prevented.

[0090] The fixing part 130 is not particularly limited as long as it can fix the relative positional relationship between the substrate 60 and the first cable bundle 116. For example, any one or a combination of adhesive, solder and clamping components can be used. The fixing part 130 can fix the substrate 60 and the first cable bundle 116 individually, and can fix the substrate 60 and multiple first cable bundles 116 together.

[0091] The grounding wire 114 of each first cable bundle 116 is electrically connected to the grounding electrode pad 64 of the substrate 60. At least one grounding wire 114 included in each first cable bundle 116 is electrically connected to the grounding electrode pad 64. Multiple grounding wires 114 are in contact within the first cable bundles 116. Therefore, by electrically connecting at least one grounding wire 114 of each first cable bundle 116 to the grounding electrode pad 64, the grounding potential of the multiple first cable bundles 116 can be made to be the same. By reducing the number of grounding wires 114 electrically connected to the grounding electrode pad 64, the area occupied by the wiring can be reduced. As a result, a smaller diameter front end 40 can be achieved.

[0092] exist Figure 5In the illustrated connection structure, the electrode pads 62 corresponding to each non-coaxial cable 110 are centrally arranged. That is, the four electrode pads 62 electrically connected to the four signal lines 112 are centrally arranged on the substrate 60. The electrode pads 62 corresponding to the non-coaxial cables 110 are preferably arranged approximately along the extension direction of the non-coaxial cables 110. Furthermore, the signal lines 112 of each non-coaxial cable 110 are preferably not electrically connected to the electrode pads 62 corresponding to adjacent non-coaxial cables 110. This helps to suppress stress applied to the signal lines 112.

[0093] Figure 8 This is a block diagram showing the structure of an ultrasonic processor device. For example... Figure 8 As shown, the ultrasonic processor device 14 includes a multiplexer 140, a receiving circuit 142, a transmitting circuit 144, an A / D converter 146, an ASIC (Application Specific Integrated Circuit) 148, a movie memory 150, a CPU (Central Processing Unit) 152, and a DSC (Digital Scan Converter) 154.

[0094] The receiving circuit 142 and the transmitting circuit 144 are electrically connected to the ultrasonic transducer array 50 of the ultrasonic endoscope 12. The multiplexer 140 selects up to m drive target ultrasonic transducers from n ultrasonic transducers 48 and opens their channels.

[0095] The transmitting circuit 144 consists of an FPGA (Field Programmable Gate Array), a pulse generator (pulse generation circuit 158), and a SW (switch), and is connected to a MUX (multiplexer 140). Alternatively, an ASIC (Application-Specific Integrated Circuit) can be used instead of an FPGA.

[0096] The transmitting circuit 144 is a circuit that supplies an ultrasonic transmitting drive voltage to the ultrasonic transducer 48 selected by the multiplexer 140 according to a control signal transmitted from the CPU 152 for transmitting ultrasonic waves from the ultrasonic transducer unit 46. The drive voltage is a pulsed voltage signal (transmit signal) and is applied to the electrodes of the ultrasonic transducer 48 via the universal plug 26 and the cable 100. Specifically, the drive voltage is applied to the electrodes via the signal line 112 of the non-coaxial cable 110 of the cable 100.

[0097] The transmitting circuit 144 has a pulse generating circuit 158 ​​that generates a transmitting signal according to a control signal. Under the control of the CPU 152, the pulse generating circuit 158 ​​drives multiple ultrasonic transducers 48 to generate a transmitting signal that generates ultrasonic waves and supplies it to the multiple ultrasonic transducers 48.

[0098] Furthermore, when performing ultrasound diagnosis under the control of CPU 152, the transmitting circuit 144 uses pulse generating circuit 158 ​​to generate a transmitting signal with a driving voltage for performing ultrasound diagnosis.

[0099] The receiving circuit 142 is a circuit that receives the electrical signal, i.e., the received signal, output from the ultrasonic transducer 48 of the driven object that has received the ultrasonic wave (echo). The receiving circuit 142 includes an amplifier for amplifying the received signal and an attenuator for attenuating the received signal as needed. The gain value of the amplifier for amplifying the received signal is set via a control signal from the CPU 152. Furthermore, the attenuation value of the attenuator for attenuating the received signal is set via a control signal from the CPU 152.

[0100] Furthermore, the receiving circuit 142 amplifies the received signal from the ultrasonic transducer 48 according to the control signal transmitted from the CPU 152, and transmits the amplified signal to the A / D inverter 146. The A / D inverter 146 is connected to the receiving circuit 142, and converts the received signal from the receiving circuit 142 from an analog signal to a digital signal, and outputs the converted digital signal to the ASIC 148.

[0101] The ASIC148 is connected to the A / D inverter 146, such as... Figure 8 As shown, the system comprises a phase matching unit 160, a B-mode image generation unit 162, a PW-mode image generation unit 164, a CF-mode image generation unit 166, and a storage controller 151.

[0102] In this embodiment, the above functions are implemented by hardware circuits such as ASIC148 (specifically, the phase matching unit 160, B-mode image generation unit 162, PW-mode image generation unit 164, CF-mode image generation unit 166, and memory controller 151), but it is not limited to this. The above functions can also be implemented by linking the central processing unit (CPU) with software (computer programs) used to perform various data processing tasks.

[0103] The phase matching unit 160 performs a process of adding phase-matched data (the received signal digitized by the A / D inverter 146) after applying a delay time. This phase-matching process generates an ultrasonic echo signal with a reduced focal point.

[0104] The B-mode image generation unit 162, PW-mode image generation unit 164, and CF-mode image generation unit 166 generate ultrasonic images based on the electrical signals output by the driving ultrasonic transducer among the multiple ultrasonic transducers 48 when ultrasonic waves are received in the ultrasonic transducer unit 46 (strictly speaking, the acoustic signals generated by adding the received data in phase).

[0105] B (Brightness) mode converts the amplitude of ultrasound echoes into brightness to represent tomographic images. PW (Pulse Wave) mode displays the velocity of the ultrasound echo source (e.g., blood flow velocity) detected by the transmission and reception of pulse waves. CF (Color Flow) mode maps average blood flow velocity, blood flow variations, blood flow signal intensity, or hemodynamics to various colors and overlays them onto the B mode image.

[0106] The B-mode image generation unit 162 is an image generation unit that generates tomographic images of the patient's interior (within body cavities), i.e., B-mode images. The B-mode image generation unit 162 uses STC (Sensitivity Time Gain Control) to correct for attenuation caused by propagation distance in the sequentially generated acoustic signals based on the depth of the ultrasound reflection location. Furthermore, the B-mode image generation unit 162 performs envelope detection processing and Log (logarithmic) compression processing on the corrected acoustic signals to generate a B-mode image (image signal).

[0107] The PW mode image generation unit 164 is an image generation unit that generates an image displaying the velocity of blood flow in a specified direction. The PW mode image generation unit 164 performs a high-speed Fourier transform on multiple acoustic signals in the same direction from the acoustic signals sequentially generated by the phase matching unit 160, thereby extracting frequency components. Then, the PW mode image generation unit 164 calculates the velocity of blood flow based on the extracted frequency components and generates a PW mode image (image signal) displaying the calculated velocity of blood flow.

[0108] The CF mode image generation unit 166 is an image generation unit that generates an image displaying information about blood flow in a predetermined direction. The CF mode image generation unit 166 calculates the autocorrelation of multiple acoustic signals in the same direction among the acoustic signals sequentially generated by the phase matching unit 160, thereby generating an image signal displaying information related to blood flow. Then, based on the image signal, the CF mode image generation unit 166 generates a CF mode image (image signal) as a color image, which is a B-mode image signal generated by the B-mode image generation unit 162 superimposed with the blood flow-related information.

[0109] In addition, the above-mentioned ultrasound image generation mode is just one example. It can also include modes other than the three modes mentioned above, such as A (Amplitude) mode, M (Motion) mode and imaging mode, and can also include modes for acquiring Doppler images.

[0110] The storage controller 151 stores the image signals generated by the B-mode image generation unit 162, the PW-mode image generation unit 164, or the CF-mode image generation unit 166 in the movie memory 150.

[0111] The DSC154 is connected to the ASIC148 and converts the image signals generated by the B-mode image generation unit 162, the PW-mode image generation unit 164, or the CF-mode image generation unit 166 into image signals (raster conversion) according to the scanning method of conventional television signals. After performing various required image processing such as grayscale processing on the image signals, it outputs them to the display 20.

[0112] The movie memory 150 has the capacity to store one frame or several frames of image signal. The image signal generated by the ASIC 148 is output to the DSC 154, and is also stored in the movie memory 150 via the memory controller 151. In freeze mode, the memory controller 151 reads the image signal stored in the movie memory 150 and outputs it to the DSC 154. Thus, an ultrasonic image (still image) based on the image signal read from the movie memory 150 can be displayed on the display 20.

[0113] CPU152 functions as a control unit (control circuit) for controlling various parts of the ultrasonic processor device 14. It is connected to the receiving circuit 142, the transmitting circuit 144, the A / D inverter 146, and the ASIC 148, and controls these machines.

[0114] Furthermore, if the ultrasonic endoscope 12 is connected to the ultrasonic processor device 14 via the ultrasonic connector 32a, the CPU 152 automatically recognizes the ultrasonic endoscope 12 via PnP (Plug and Play) or other means.

[0115] The cable 100 used in the embodiment includes a plurality of non-coaxial cables 110. For example... Figure 6 As shown, the non-coaxial cable 110 differs from the coaxial cable in that it does not have a shielding layer for each signal line 112.

[0116] As a result, in the case of non-coaxial cable 110, signal line 112 may sometimes be affected by the magnitude of electrostatic capacitance due to its arrangement in the first cable bundle 116. For example, the electrostatic capacitance of signal line 112 located at the center of non-coaxial cable 110 is smaller than the electrostatic capacitance of the plurality of signal lines 112 located around it.

[0117] The electrostatic capacitance of signal line 112 affects the transmit and receive sensitivity of the electrically connected ultrasonic transducer 48. This difference in electrostatic capacitance (so-called bias) between signal lines 112 results in a difference in sensitivity, potentially leading to deterioration in the quality of the ultrasonic image (e.g., image non-uniformity). Here, receive sensitivity is defined as the ratio of the amplitude of the ultrasonic wave transmitted by the ultrasonic transducer 48 to the amplitude of the electrical signal received and output by the ultrasonic transducer 48.

[0118] Figure 9 (A) is a graph showing the relationship between ultrasonic transducers and electrostatic capacitance. The vertical axis represents electrostatic capacitance (pF), and the horizontal axis represents the component number of the ultrasonic transducer. The graph shows the electrostatic capacitance of the signal lines connected to each ultrasonic transducer. Additionally, the component number is an assignment used to identify each ultrasonic transducer. Figure 9 As shown in the diagram (A), the electrostatic capacitance of each signal line is not constant; there is a periodic difference in electrostatic capacitance between the signal lines, taking the first cable bundle as a unit. The square brackets in the diagram represent the signal lines included in each of the first cable bundles. Figure 10 , Figure 11 (The same applies).

[0119] Figure 9 (B) is a graph showing the relationship between the ultrasonic transducer and its transmit / receive sensitivity. The vertical axis represents the transmit / receive sensitivity (dB), and the horizontal axis represents the component number of the ultrasonic transducer. For example... Figure 9 As shown in the diagram (B), the transmit and receive sensitivities of each ultrasonic transducer are not constant due to the electrostatic capacitance of the signal lines. The transmit and receive sensitivities vary periodically among the multiple ultrasonic transducers, specifically within each first cable bundle. Figure 9 As shown in (B), with Figure 9 (A) Comparing the electrostatic capacitance, a smaller electrostatic capacitance of the signal line results in greater transceiver sensitivity, while a larger electrostatic capacitance results in less transceiver sensitivity. When there are differences in transceiver sensitivity among multiple ultrasonic transducers, the image quality of the ultrasonic wave may degrade.

[0120] In the ultrasonic inspection system 10 of this embodiment, the transmit and receive sensitivities of the ultrasonic transducers 48 are calibrated to reduce the difference in transmit and receive sensitivities among the plurality of ultrasonic transducers 48. For information on calibrating transmit and receive sensitivities, refer to... Figure 8 The diagram is used for illustration.

[0121] To calibrate the transceiver sensitivity, capacitance data representing the electrostatic capacitance of the signal lines 112 (not shown) included in the first cable bundle 116 is associated with the component number of the ultrasonic transducer 48 and stored in, for example, an endoscope-side memory 58, which serves as a memory. The capacitance data is obtained, for example, by measuring the capacitance of each signal line 112. The capacitance of each signal line 112 can be measured, for example, after the ultrasonic endoscope 12 is assembled but before shipment.

[0122] The relationship between the electrostatic capacitance of each signal line 112 of the first cable bundle 116 and the ultrasonic transducer 48 varies depending on the ultrasonic endoscope 12. Therefore, the electrostatic capacitance data is stored in the endoscope-side memory 58 provided by the ultrasonic endoscope 12. However, the memory storing the electrostatic capacitance data is not limited to the endoscope-side memory 58, and may also be a memory provided in the ultrasonic processor device 14. First, the electrostatic capacitance data of the ultrasonic endoscope 12 is stored in the memory provided in the ultrasonic processor device 14. If the ultrasonic processor device 14 recognizes the connection of the ultrasonic endoscope 12, it can also read the electrostatic capacitance data corresponding to the ultrasonic endoscope 12 used by the ultrasonic processor device 14.

[0123] If the ultrasonic endoscope 12 is connected to the ultrasonic processor device 14 via the ultrasonic connector 32a, the CPU 152 automatically recognizes the ultrasonic endoscope 12. The CPU 152 can access the electrostatic capacitance data stored in the endoscope-side memory 58 of the ultrasonic endoscope 12.

[0124] The CPU 152, acting as the processor, periodically corrects the transmit and receive sensitivities of each ultrasonic transducer 48 based on the electrostatic capacitance data stored in the endoscope-side memory 58, thereby reducing the difference in transmit and receive sensitivities among the ultrasonic transducers 48 compared to before correction. By periodically correcting the transmit and receive sensitivities and reducing the difference in transmit and receive sensitivities, the degradation of ultrasonic image quality can be suppressed.

[0125] Furthermore, an example of periodically correcting the transmit / receive sensitivity of each ultrasonic transducer 48 based on the electrostatic capacitance data of signal line 112 will be described. Moreover, it is preferable to correct the transmit / receive sensitivity caused by the difference in sensitivity between each ultrasonic transducer 48.

[0126] For example, in addition to the capacitance data of signal line 112, the endoscope-side memory 58 also stores the sensitivity of the ultrasonic transducer 48. The CPU 152 corrects the transmit / receive sensitivity of each ultrasonic transducer 48 based on the capacitance data and sensitivity data stored in the accessible endoscope-side memory 58, reducing the difference in transmit / receive sensitivity between the ultrasonic transducers 48 compared to before correction. By correcting the transmit / receive sensitivity based on the capacitance data and sensitivity data, and reducing the difference in transmit / receive sensitivity, the degradation of ultrasonic image quality can be suppressed.

[0127] In addition, the sensitivity of the ultrasonic transducer 48 can be obtained by measuring the ultrasonic transducer 48 and based on the characteristic data of the ultrasonic transducer 48.

[0128] Next, a preferred method for periodically correcting the transmit and receive sensitivity will be described. The first method is the case of using the transmit circuit 144. The CPU 152 drives the ultrasonic transducer 48, which is connected to the signal line 112 with high electrostatic capacitance, with a transmit signal that is higher than the voltage of the signal line 112 with low electrostatic capacitance.

[0129] First, the CPU 152 determines the ultrasonic transducer 48 connected to the signal line 112 with high electrostatic capacitance and the ultrasonic transducer 48 connected to the signal line 112 with low electrostatic capacitance based on the electrostatic capacitance data stored in the endoscope-side memory 58.

[0130] Under the control of CPU 152, pulse generation circuit 158 ​​generates a transmission signal with a voltage higher than that driving the transmission signal of ultrasonic transducer 48 connected to signal line 112 with high capacitance. Transmission circuit 144 supplies a transmission signal with a rated voltage to ultrasonic transducer 48 connected to signal line 112 with low capacitance, for example, and supplies a transmission signal with a voltage higher than the rated voltage to ultrasonic transducer 48 connected to signal line 112 with high capacitance, thereby driving multiple ultrasonic transducers 48. For example, if the driving voltage of the transmission signal of ultrasonic transducer 48 is 60V, the driving voltage of the transmission signal of ultrasonic transducer 48 connected to signal line 112 with high capacitance is set to 63V.

[0131] Figure 10 This is a graph showing the relationship between the corrected ultrasonic transducer and its transmit / receive sensitivity. By increasing the driving voltage of the transmitted signal of the ultrasonic transducer 48 connected to the signal line 112 with high electrostatic capacitance (increasing the transmitted signal), the transmit / receive sensitivity of the ultrasonic transducer 48 can be improved. As a result, compared with before correction, the difference in transmit / receive sensitivity between the individual ultrasonic transducers 48 can be reduced.

[0132] Next, a preferred second method for periodically correcting the transmit / receive sensitivity will be described. The second method utilizes the receiving circuit 142. The CPU 152 applies a higher gain value to the received signal from the ultrasonic transducer 48 connected to the signal line 112 with high electrostatic capacitance than to the received signal from the ultrasonic transducer 48 connected to the signal line 112 with low electrostatic capacitance.

[0133] First, the CPU 152 determines the ultrasonic transducer 48 connected to the signal line 112 with high electrostatic capacitance and the ultrasonic transducer 48 connected to the signal line 112 with low electrostatic capacitance based on the electrostatic capacitance data stored in the endoscope-side memory 58.

[0134] The amplifier of the receiving circuit 142, under the control of the CPU 152, sets a gain value higher than that set in the ultrasonic transducer 48 connected to the signal line 112 with high electrostatic capacitance than that set in the ultrasonic transducer 48 connected to the signal line 112 with low electrostatic capacitance.

[0135] The receiving circuit 142 applies a predetermined gain value to the ultrasonic transducer 48 connected to the signal line 112 with low electrostatic capacitance, and applies a gain value higher than the predetermined gain value to the ultrasonic transducer 48 connected to the signal line 112 with high electrostatic capacitance, thereby amplifying the received signal from the ultrasonic transducer 48.

[0136] Figure 11 This is a graph showing the relationship between the corrected ultrasonic transducer and its transmit / receive sensitivity. By increasing the gain value of the ultrasonic transducer 48 connected to the signal line 112 with high electrostatic capacitance (gaining the gain value), the transmit / receive sensitivity of the ultrasonic transducer 48 can be improved. As a result, compared with before correction, the difference in transmit / receive sensitivity between the individual ultrasonic transducers 48 can be reduced.

[0137] Next, a preferred third method for periodically correcting the transmit and receive sensitivity will be described. The third method utilizes the receiving circuit 142. The CPU 152 applies a higher attenuation value to the received signal from the ultrasonic transducer 48 connected to the signal line 112 with low electrostatic capacitance than to the received signal from the ultrasonic transducer 48 connected to the signal line 112 with high electrostatic capacitance.

[0138] First, the CPU 152 determines the ultrasonic transducer 48 connected to the signal line 112 with high electrostatic capacitance and the ultrasonic transducer 48 connected to the signal line 112 with low electrostatic capacitance based on the electrostatic capacitance data stored in the endoscope-side memory 58.

[0139] The attenuator of the receiving circuit 142, under the control of the CPU 152, sets a higher attenuation value for the ultrasonic transducer 48 connected to the signal line 112 with low electrostatic capacitance than the attenuation value set in the ultrasonic transducer 48 connected to the signal line 112 with high electrostatic capacitance.

[0140] The receiving circuit 142 applies a predetermined attenuation value to the ultrasonic transducer 48 connected to the signal line 112 with high electrostatic capacitance, and applies an attenuation value greater than the predetermined attenuation value to the ultrasonic transducer 48 connected to the signal line 112 with low electrostatic capacitance, thereby attenuating the received signal from the ultrasonic transducer 48.

[0141] Figure 12 This is a graph showing the relationship between the corrected ultrasonic transducer and its transmit / receive sensitivity. By increasing the attenuation value of the ultrasonic transducer 48 with low electrostatic capacitance (increasing the attenuation value), the transmit / receive sensitivity of the ultrasonic transducer 48 can be reduced. As a result, compared with before correction, the difference in transmit / receive sensitivity between the individual ultrasonic transducers 48 can be reduced.

[0142] Regarding the third method, the attenuation value can be determined when the ultrasonic endoscope 12 is shipped. For example, the signal line 112, the ultrasonic transducer 48, and the attenuation value are associated with the electrostatic capacitance of the signal line 112 and stored in the endoscope-side memory 58. Based on the stored ultrasonic transducer 48 and attenuation value, the attenuation value can be applied to the received signal.

[0143] Preferably, the difference in transmit and receive sensitivity between the ultrasonic transducers 48 is less than 2 dB. As long as it is within this range, the image quality degradation of the ultrasonic image can be prevented.

[0144] Next, a preferred configuration of the ultrasonic transducers 48 in the ultrasonic transducer array 50 will be described. Figure 13 (A) is a conceptual diagram of the scan lines corresponding to the ultrasonic transducers of the ultrasonic transducer array. Figure 13 (B) is a graph showing the relationship between the configured ultrasonic transducer and the electrostatic capacitance.

[0145] like Figure 13 As shown in (A), the ultrasonic transducer array 50 is composed of, for example, a plurality of ultrasonic transducers 48 numbered from element 1 to element n. Figure 13 (A) indicates the scan line corresponding to its component number. In the ultrasonic transducer array 50, the ultrasonic transducer 48 connected to the signal line 112 with low electrostatic capacitance is arranged on the central side. The ultrasonic transducer 48 connected to the signal line 112 with high electrostatic capacitance is arranged on the end sides located on both sides of the center.

[0146] like Figure 13 As shown in the diagram (B), the electrostatic capacitance of the ultrasonic transducer 48 disposed on the central side is lower than that of the ultrasonic transducer 48 disposed on the end side.

[0147] When generating ultrasound images in the ultrasonic endoscope 12, the ultrasound image generated by the ultrasonic transducer 48 at the center of the ultrasonic transducer array 50 becomes important. Therefore, by configuring the ultrasonic transducer 48 with high transmit and receive sensitivity at the center of the ultrasonic transducer array 50, even without calibration, a higher accuracy ultrasound image can be generated compared to an ultrasonic transducer 48 that requires calibration.

[0148] The present invention has been described above, but the present invention is not limited to the above examples. It is natural that various improvements or modifications can be made without departing from the spirit of the present invention.

[0149] Symbol Explanation

[0150] 10-Ultrasonic inspection system, 12-Ultrasonic endoscope, 14-Ultrasonic processor, 16-Endoscope processor, 18-Light source, 20-Display, 21a-Water tank, 21b-Suction pump, 22-Insertion part, 24-Operating part, 26-Universal plug rope, 28a-Air / water supply button, 28b-Suction button, 29-Angle button, 30-Dealing device insertion port, 32a-Connector, 32b-Connector, 32c-Connector, 34a-Air / water supply hose, 34b-Suction hose 36-Helmet, 38-Endoscopic viewing section, 40-Front end, 41-External component, 42-Bend, 43-Flexible section, 44-Device outlet, 45-Device channel, 46-Ultrasonic transducer unit, 47-Layer, 48-Ultrasonic transducer, 49-Piezoelectric element, 50-Ultrasonic transducer array, 52-Electrode, 52a-Individual electrode, 52b-Transducer grounding, 54-Backing material layer, 55-Internal space, 58-Endoscopic side memory, 60-Substrate, 60a-Edge. 60b-edge, 60c-edge, 62-electrode pad, 64-ground electrode pad, 76-acoustic matching layer, 78-acoustic lens, 80-filler layer, 82-observation window, 84-objective lens, 86-solid-state imaging element, 88-illumination window, 90-cleaning nozzle, 92-wiring cable, 100-cable, 102-outer sheath, 104-second cable bundle, 106-resin layer, 108-second shielding layer, 110-non-coaxial cable, 112-signal line, 112a-conductor, 112b-insulation layer, 114-grounding Wire, 116-First cable bundle, 116a-Front end, 118-First shielding layer, 130-Fixing part, 140-Multiplexer, 142-Receiving circuit, 144-Transmitting circuit, 146-A / D converter, 148-ASIC, 150-Movie memory, 151-Memory controller, 152-CPU, 154-DSC, 158-Pulse generation circuit, 160-Phase matching part, 162-B mode image generation part, 164-PW mode image generation part, 166-CF mode image generation part.

Claims

1. An ultrasonic examination system comprising: an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged; a cable connected to the plurality of ultrasonic transducers, the cable having a non-coaxial cable including a first cable bundle composed of a plurality of signal lines and a plurality of ground lines, and a first shielding layer covering the first cable bundle, and an outer skin covering a second cable bundle composed of a plurality of the non-coaxial cables; a memory storing electrostatic capacitance data representing an electrostatic capacitance of each of the signal lines included in the first cable bundle; and a processor that periodically corrects a transmission and reception sensitivity of each of the ultrasonic transducers based on the electrostatic capacitance data stored in the memory.

2. The ultrasonic examination system according to claim 1, wherein the memory stores sensitivity data representing a sensitivity of the ultrasonic transducers, and the processor periodically corrects the transmission and reception sensitivity of each of the ultrasonic transducers based on the electrostatic capacitance data and the sensitivity data stored in the memory.

3. The ultrasonic examination system according to claim 1 or 2, wherein the processor drives the ultrasonic transducer connected to the signal line having a high electrostatic capacitance with a transmission signal having a higher voltage than the ultrasonic transducer connected to the signal line having a low electrostatic capacitance.

4. The ultrasonic examination system according to claim 1 or 2, wherein the processor applies a gain value higher to a reception signal from the ultrasonic transducer connected to the signal line having a high electrostatic capacitance than to a reception signal from the ultrasonic transducer connected to the signal line having a low electrostatic capacitance.

5. The ultrasonic examination system according to claim 1 or 2, wherein the processor applies an attenuation value higher to a reception signal from the ultrasonic transducer connected to the signal line having a low electrostatic capacitance than to a reception signal from the ultrasonic transducer connected to the signal line having a high electrostatic capacitance.

6. The ultrasonic examination system according to claim 1 or 2, wherein in the ultrasonic transducer array, the ultrasonic transducer connected to the signal line having a low electrostatic capacitance is arranged on a central side, and the ultrasonic transducer connected to the signal line having a high electrostatic capacitance is arranged on an end side.

7. The ultrasonic examination system according to claim 1 or 2, wherein the processor sets a difference in electrostatic capacitance between each of the signal lines included in each of the first cable bundles to 2 dB or less. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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