Semiconductor process equipment and process chamber

Abstract

The present invention discloses a semiconductor process equipment and a process chamber thereof. The disclosed process chamber includes a chamber body, a heating base, an ejector pin, an ejector pin support and an adjusting member, wherein: the ejector pin support is arranged between the bottom wall of the chamber body and the heating base; the heating base is provided with an avoidance hole, the adjusting member is connected between the ejector pin support and the chamber body, and is used to adjust the position of the ejector pin support relative to the chamber body; in a first state, the connecting end of the ejector pin passes through the avoidance hole and is supported on the ejector pin support; in a second state, the ejector pin is separated from the avoidance hole and the ejector pin support respectively, and the adjusting member can be exposed through the avoidance hole. The above scheme can solve the problem that when the semiconductor sheet does not meet the parallelism requirement, the adjustment of the ejector pin support is time-consuming and labor-intensive, and the reliability is poor.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a semiconductor process equipment and a process chamber thereof. Background Art

[0002] Semiconductor process equipment is equipment for processing semiconductor sheets (such as wafers). Semiconductor sheets need to be processed in the process chamber of the semiconductor process equipment. The process chamber includes a chamber body, a heating base, a ejector support and an ejector. One end of the ejector passes through the heating base and is supported on the ejector support, and the other end of the ejector is used to support the semiconductor sheet. Removing the semiconductor sheet from the ejector or placing it on the ejector needs to be achieved by a robot. In order for the robot to safely and accurately grasp the semiconductor sheet, the semiconductor sheet placed on the ejector needs to meet a certain level.

[0003] The semiconductor sheet is placed on the ejector pins, and the ejector pins are supported on the ejector pin support members. Due to errors in manufacturing and installation, the semiconductor sheet placed on the ejector pins may not meet the horizontality requirements. When adjusting the horizontality of the semiconductor sheet placed on the ejector pins, it is necessary to adjust the position of the ejector pin support member supporting the ejector pin relative to the chamber body. Since the ejector pin support member is located between the heating base and the bottom wall of the chamber body, when adjusting the ejector pin support member, it is necessary to first disassemble the heating base and then expose the adjustment member for adjusting the ejector pin support member before adjusting it. Since the heating base has many connections with other components of the semiconductor process equipment and is heavy, it is time-consuming and labor-intensive to adjust the ejector pin support member, and there is also a problem of poor reliability. Summary of the invention

[0004] The invention discloses a semiconductor process equipment and a process chamber thereof, so as to solve the problem that when a semiconductor sheet does not meet the parallelism requirement, adjusting a pin support is time-consuming, labor-intensive and has poor reliability.

[0005] In order to solve the above-mentioned technical problems, the present invention is achieved as follows:

[0006] In a first aspect, the present application discloses a process chamber of a semiconductor process equipment, comprising a chamber body, a heating base, an ejector pin, an ejector pin support member, and an adjusting member, wherein:

[0007] The ejector pin support is disposed between the bottom wall of the chamber body and the heating base;

[0008] The heating base is provided with an avoidance hole, and the adjustment member is connected between the ejector support member and the chamber body and is used to adjust the position of the ejector support member relative to the chamber body;

[0009] In the first state, the connecting end of the ejector pin passes through the avoidance hole and is supported on the ejector pin support member;

[0010] In the second state, the ejector pin is separated from the avoidance hole and the ejector pin supporting member respectively, and the adjusting member can be exposed through the avoidance hole.

[0011] In a second aspect, the present application further discloses a semiconductor process equipment, including a robot and the process chamber described in the first aspect;

[0012] The robot is used to grab the semiconductor sheet (910) placed on the ejector pin, or to place the semiconductor sheet on the ejector pin.

[0013] The technical solution adopted by the present invention can achieve the following technical effects:

[0014] The process chamber disclosed in the embodiment of the present application cooperates with the avoidance hole provided on the heating base through the adjustment piece connected between the ejector support piece and the chamber body, so that in the second state, the adjustment piece can be exposed through the avoidance hole, so that the special tool for adjusting the adjustment piece can adjust the adjustment piece through the avoidance hole, and then the adjustment piece can adjust the position of the ejector support piece relative to the chamber body, so that the horizontality of the semiconductor sheet supported on the ejector meets the requirements, effectively avoiding the problem of disassembling the heating base for horizontality adjustment when the semiconductor sheet does not meet the parallelism requirements, and also avoiding the time-consuming, labor-consuming and reliability problems when disassembling the heating base; in the first state, the ejector can be supported on the ejector support piece through the avoidance hole, so that the avoidance hole can be used for the ejector to pass through, and can also be used for the special tool used in conjunction with the adjustment piece to pass through, which can effectively reduce the number of avoidance holes opened on the heating base, thereby avoiding the problem of insufficient heating surface of the heating base caused by too many avoidance holes. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional diagram of a semiconductor process equipment disclosed in an embodiment of the present invention;

[0016] Figure 2 A three-dimensional diagram of a process chamber disclosed in an embodiment of the present invention;

[0017] Figure 3 A schematic diagram of the structure of a semiconductor process equipment disclosed in an embodiment of the present invention at a first viewing angle;

[0018] Figure 4 A schematic structural diagram of a process chamber disclosed in an embodiment of the present invention at a first viewing angle;

[0019] Figure 5 A partial enlarged view of the process chamber in the first state according to an embodiment of the present invention;

[0020] Figure 6A partial enlarged view of the process chamber in the second state according to an embodiment of the present invention;

[0021] Figure 7 A schematic diagram of the coordination between a first slider, a second slider, a first slideway, a second slideway, an elastic member and an ejector pin in a first state disclosed in an embodiment of the present invention;

[0022] Figure 8 A schematic diagram of the positions of a first sliding block, a first slideway, and a second slideway disclosed in an embodiment of the present invention;

[0023] Fig. 9 It is a schematic structural diagram of a first sliding block disclosed in an embodiment of the present invention.

[0024] Description of reference numerals:

[0025] 100-process chamber,

[0026] 200-chamber body,

[0027] 300-heating base, 310-avoidance hole,

[0028] 400-thimble,

[0029] 500-thimble support, 510-support body, 511-adjusting hole, 512-first slideway, 513-limiting member, 520-first slider, 521 first guide slope, 522-protruding structure, 523-slider body, 524-limiting surface,

[0030] 600-Adjustment parts,

[0031] 700-second slider, 710-second guide slope, 720-second slideway,

[0032] 800-elastic parts,

[0033] 910-semiconductor sheet, 920-manipulator. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0035] The technical solutions disclosed in various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0036] Please refer to Figures 1 to 9 The embodiment of the present invention discloses a process chamber 100 of a semiconductor process equipment. The disclosed semiconductor process equipment may be a process equipment for processing semiconductor sheets (such as wafers), and the process chamber 100 may be a place for processing semiconductor sheets 910. The disclosed process chamber 100 includes a chamber body 200, a heating base 300, an ejector pin 400, an ejector pin support 500, and an adjusting member 600.

[0037] The chamber body 200 is the installation base for other components of the process chamber 100. The ejector support 500, the adjustment member 600 and the heating base 300 are all arranged in the chamber body 200. The heating base 300 is a component for heating the semiconductor sheet 910. The heating base 300 is provided with an escape hole 310. The escape hole 310 can be used for the ejector 400 to pass through the heating base 300 and be supported on the ejector support 500. The escape hole 310 can also be used for a special tool for adjusting the adjustment member 600 to pass through and be used in conjunction with the adjustment member 600.

[0038] The ejector pin support 500 is disposed between the bottom wall of the chamber body 200 and the heating base 300 . The ejector pin support 500 may be disposed on the bottom wall of the chamber body 200 , and the ejector pin support 500 is used to support the ejector pins 400 , and the ejector pins 400 are used to support the semiconductor sheet 910 .

[0039] The adjusting member 600 is connected between the ejector pin support member 500 and the chamber body 200, and is used to adjust the position of the ejector pin support member 500 relative to the chamber body 200. The adjusting member 600 is used to adjust the position of the ejector pin support member 500 relative to the chamber body 200 to adjust the position of the ejector pin supported on the ejector pin support member 500, thereby adjusting the levelness of the semiconductor sheet 910 when the semiconductor sheet 910 is placed on the ejector pin 400.

[0040] Specifically, the adjusting member 600 can be connected between the ejector support member 500 and the bottom wall of the chamber body 200 to adjust the distance between different areas of the ejector support member 500 and the bottom wall of the chamber body 200; the adjusting member 600 can also be connected between the ejector support member 500 and the side wall of the chamber body 200, and the side wall of the chamber body 200 can be provided with a plurality of vertically arranged grooves, and the adjusting member 600 can be engaged with the grooves. The adjustment area of ​​the ejector support member 500 can be moved in the vertical direction by cooperating with the different vertically arranged grooves.

[0041] In a specific implementation process, if the semiconductor sheet 910 does not meet the horizontality, it is necessary to adjust the position of the ejector support 500 relative to the chamber body 200 through the adjusting member 600, so that when the ejector 400 supports the semiconductor sheet 910, the semiconductor sheet 910 can meet the horizontality requirement. When the semiconductor sheet 910 meets the horizontality requirement, the ejector support 500 may not be in a horizontal state. Of course, when the ejector 400, the ejector support 500 and the chamber body 200 meet the process requirements, the ejector support 500 can be horizontally arranged on the chamber body 200, such as the bottom wall of the chamber body 200. At this time, it is only necessary to adjust the horizontality of the ejector support 500 through the adjusting member 600 to meet the horizontality of the semiconductor sheet 910. The adjusting member 600 can be adjusted by a special tool through the avoidance hole 310.

[0042] In the first state, the connection end of the ejector pin 400 passes through the avoidance hole 310 and is supported on the ejector pin support 500. The connection end of the ejector pin 400 is an end for contacting the ejector pin support 500, and the end of the ejector pin 400 opposite to the connection end is an end supporting the semiconductor sheet 910. The connection end of the ejector pin 400 and the end opposite to the connection end are respectively located on both sides of the heating base 300. The heating base 300 supports the semiconductor sheet 910 and heats it.

[0043] In the second state, the ejector pin 400 is separated from the avoidance hole 310 and the ejector pin support member 500, respectively, and the adjusting member 600 can be exposed through the avoidance hole 310. Specifically, the ejector pin 400 can be pulled out from the avoidance hole 310, and the avoidance hole 310 is no longer blocked by the ejector pin 400, so that the adjusting member 600 can be exposed through the avoidance hole 310, and then the adjusting member 600 can be adjusted through the avoidance hole 310 by a special tool, so that the adjusting member 600 adjusts the position of the ejector pin support member 500 relative to the chamber body 200.

[0044] In a specific implementation process, the ejector pin support 500 is disposed between the bottom wall of the chamber body 200 and the heating base 300, the heating base 300 is provided with an avoidance hole 310, and the adjustment member 600 is connected between the ejector pin support 500 and the chamber body 200. In a first state, the connection end of the ejector pin 400 passes through the avoidance hole 310 and is supported on the ejector pin support 500. In a second state, the ejector pin 400 is separated from the avoidance hole 310 and the ejector pin support 500, respectively, and the adjustment member 600 can be exposed through the avoidance hole 310, so that the adjustment member 600 can be directly adjusted through the avoidance hole 310, so that the adjustment member 600 adjusts the position of the ejector pin support 500 relative to the chamber body 200, so that when the ejector pin 400 supports the semiconductor sheet 910, the horizontality of the semiconductor sheet 910 meets the requirements.

[0045] The process chamber 100 disclosed in the embodiment of the present application cooperates with the adjustment member 600 connected between the ejector support member 500 and the chamber body 200 and the avoidance hole 310 opened on the heating base 300, so that in the second state, the adjustment member 600 can be exposed through the avoidance hole 310, so that the special tool for adjusting the adjustment member 600 can adjust the adjustment member 600 through the avoidance hole, and then the adjustment member 600 can adjust the position of the ejector support member 500 relative to the chamber body 200, so that the horizontality of the semiconductor sheet supported on the ejector meets the requirements, and effectively avoids the semiconductor sheet not meeting the requirements. When parallelism is required, the heating base 300 needs to be disassembled for horizontal adjustment, and the problem of time-consuming, labor-intensive, and reliability problems when disassembling the heating base 300 is avoided; in the first state, the ejector pin 400 can be supported on the ejector pin support member 500 through the avoidance hole 310, so that the avoidance hole 310 can be used for the ejector pin 400 to pass through, and can also be used for the special tool used in conjunction with the adjustment member 600 to pass through, which can effectively reduce the number of avoidance holes 310 opened on the heating base 300, thereby avoiding the problem of insufficient heating surface of the heating base 300 caused by too many avoidance holes 310.

[0046] In the specific working process, in the first state, the semiconductor sheet 910 needs to be placed on the ejector pin 400 to measure the level. When the semiconductor sheet 910 does not meet the level requirement, the semiconductor sheet 910 needs to be removed, the ejector pin 400 is removed, and the adjustment member 600 is adjusted through the avoidance hole 310 to adjust the position of the ejector pin support member 500 relative to the chamber body 200. After the adjustment is completed, the ejector pin 400 is passed through the avoidance hole 310 and supported on the ejector pin support member 500, and then the semiconductor sheet 910 is placed on the ejector pin 400 to measure the level of the semiconductor sheet 910 until the level of the semiconductor sheet 910 meets the requirement.

[0047] In an optional embodiment, the ejector support member 500 is provided with an adjustment hole 511 corresponding to the avoidance hole 310, and the adjustment member 600 can pass through the adjustment hole 511 to be supported on the bottom wall of the chamber body 200. The adjustment hole 511 can be set through the ejector support member 500, and the adjustment member 600 can pass through the adjustment hole 511 so that part of the adjustment member 600 is located in the adjustment hole 511 and part of the adjustment member 600 passes through the adjustment hole 511 and is supported on the bottom wall of the chamber body 200. When the adjustment member 600 is adjusted by a special tool, the adjustment member 600 can move along the axial direction of the adjustment hole 511, thereby changing the distance at which the adjustment member 600 is supported on the bottom wall of the chamber body 200. In the second state, the adjusting member 600 can be exposed through the adjusting hole 511 and the avoidance hole 310, so that a special tool for adjusting the adjusting member 600 can adjust the adjusting member 600 through the avoidance hole 310 and the adjusting hole 511, so that the adjusting member 600 can adjust the position of the ejector support member 500 relative to the chamber body 200.

[0048] By providing the adjustment hole 511 on the ejector support 500, the adjustment member 600 can be supported on the bottom wall of the chamber body 200 through the adjustment hole 511, so that in the second state, the adjustment member 600 can be exposed through the adjustment hole 511 and the avoidance hole 310, and the distance between the ejector support 500 and the bottom wall of the chamber body 200 can be adjusted by adjusting the adjustment member 600, so that in the first state, the horizontality of the semiconductor sheet 910 meets the requirements; the provision of the adjustment hole 511 is relatively simple, and while ensuring the adjustment function of the adjustment member 600, the economy during production is improved, and the adjustment hole 511 also provides a basis for the installation of the adjustment member 600.

[0049] Specifically, the end of the adjusting member 600 away from the bottom wall of the chamber body 200 may be located inside the adjusting hole 511 and not extend out of the adjusting hole 511. Of course, the end of the adjusting member 600 away from the bottom wall of the chamber body 200 may also extend out of the adjusting hole 511. The adjusting member 600 may be adjusted by a special tool to allow the adjusting member 600 to move inside the adjusting hole 511. The adjusting member 600 and the adjusting hole 511 may be threadedly matched; the adjusting member 600 may also be slidably matched inside the adjusting hole 511, for example, a plurality of bosses may be provided on the adjusting member 600 in the circumferential direction, and a plurality of surrounding grooves may be provided on the inner circumference of the adjusting hole 511, and the bosses and the grooves cooperate with each other to limit the relative position between the adjusting member 600 and the adjusting hole 511, and under the action of the special tool, the bosses and the grooves may produce elastic deformation, and the bosses may slide into adjacent grooves to adjust the position of the adjusting member 600 in the adjusting hole 511.

[0050] In an optional embodiment, the ejector support 500 may include a support body 510 and a first slider 520, and the first slider 520 may be slidably connected to the support body 510. Specifically, the support body 510 may be provided with a slide groove, and the first slider 520 may be arranged in the slide groove. Of course, the support body 510 may also be provided with a slide rail, and the first slider 520 may be provided with a sliding portion slidably connected to the slide rail. The adjustment hole 511 may be provided in the support body 510, and may be arranged opposite to the avoidance hole 310, and of course, may not be arranged opposite to the avoidance hole 310. In the first state, the first slider 520 may cover the adjustment hole 511, and the ejector 400 may be supported on the first slider 520. In the second state, the first slider 520 may move to a position to avoid the adjustment hole 511.

[0051] By setting the ejector support 500 as the supporting body 510 and the first slider 520, the first slider 520 is slidably connected to the supporting body 510, so that in the first state, the first slider 520 can slide to a position covering the adjustment hole 511, and then the ejector 400 can be detachably connected to the first slider 520, which can effectively increase the support area of ​​the ejector 400 supported on the ejector 400 support plate, thereby improving the support stability, and also avoids the ejector 400 directly supporting on the edge of the adjustment hole 511 to cause the support to be unstable, and also avoids the ejector 400 being damaged due to the small support area of ​​the ejector 400 supported on the edge of the adjustment hole 511; in the second state, the first slider 520 can avoid the adjustment hole 511, so that the adjustment member 600 can be exposed through the adjustment hole 511 and the avoidance hole 310, thereby realizing the adjustment of the adjustment member 600 through the avoidance hole 310 and the adjustment hole 511.

[0052] When the adjustment hole 511 and the avoidance hole 310 are arranged relative to each other, in the second state, the adjustment member 600 can be directly exposed at a position relative to the avoidance hole 310, thereby making it simpler and more efficient to adjust the adjustment member 600 through the avoidance hole 310 and the adjustment hole 511, and the special tools used in conjunction with the adjustment member 600 are also relatively easier to design in structure, thereby effectively improving the economy.

[0053] Specifically, the adjustment hole 511 may not be arranged opposite to the avoidance hole 310, and a special tool may be inserted from the avoidance hole 310, and then the adjustment member 600 may be adjusted through the adjustment hole 511. When the adjustment member 600 extends out of the adjustment hole 511 and the opening opposite to the heating base 300, the first slider 520 may be provided with a groove, and when the first slider 520 covers the adjustment hole 511, the adjustment member 600 may move in the groove to prevent the adjustment member 600 from blocking the movement of the first slider 520.

[0054] In an optional embodiment, the first slider 520 may include a first guide slope 521. The process chamber 100 may include a second slider 700, the second slider 700 may include a second guide slope 710, and the first guide slope 521 may be used for sliding cooperation with the second guide slope 710. In the second state, the second slider 700 may drive the first slider 520 to move to a position avoiding the adjustment hole 511 through the sliding cooperation between the first guide slope 521 and the second guide slope 710.

[0055] Through the sliding cooperation between the first guide bevel 521 of the first slider 520 and the second guide bevel 710 of the second slider 700, the moving direction of the second slider 700 can be different from the moving direction of the first slider 520, and the force different from the moving direction of the first slider 520 can be converted into a force that can drive the first slider 520 along the moving direction; at the same time, the sliding cooperation between the first guide bevel 521 and the second guide bevel 710 also makes the movement of the first slider 520 smoother, thereby improving the overall stability of the process chamber 100.

[0056] Specifically, the second slider 700 can be connected to the driving mechanism, and the driving mechanism can be arranged in the chamber body 200. The driving mechanism drives the second slider 700 to move, so that the second slider 700 can drive the first slider 520 to move through the sliding cooperation between the first guide slope 521 and the second guide slope 710. The driving mechanism can be a driving motor, a hydraulic telescopic part or a pneumatic telescopic part, etc., and no specific limitation is made here. Of course, the second slider 700 can also be connected to other movable parts in the process chamber 100, such as the heating base 300, and the second slider 700 can be driven to move through the movement of other parts, so that the second slider 700 can drive the first slider 520 to move through the sliding cooperation between the first guide slope 521 and the second guide slope 710.

[0057] The heating base 300 in the process chamber 100 can move along the direction close to or away from the support body 510 along the support shaft supporting the heating base 300. In order to better utilize the movable characteristic of the heating base 300, in an optional embodiment, the end of the second slider 700 that is away from the second guide slope 710 can be a driving end. The heating base 300 is movably arranged on the chamber body 200 to switch between the first position and the second position. In the first state, when the heating base 300 is in the first position, the heating base 300 is separated from the driving end. In the second state, the heating base 300 moves to the second position in the direction where the support body 510 is located. When the heating base 300 moves to the second position, it can contact with the driving end to drive the second slider 700 to move, so that the second slider 700 drives the first slider 520 to move to the position of avoiding the adjustment hole 511 through the sliding cooperation between the first guide slope 521 and the second guide slope 710.

[0058] By setting the end of the second slider 700 that faces away from the second guide slope 710 as the driving end, the heating base 300 is movably arranged on the chamber body 200, so that in the first state, the heating base 300 is not connected to the driving end, the second slider 700 cannot obtain the driving force, and the first slider 520 and the second slider 700 do not have relative displacement so that the first slider 520 covers the adjustment hole 511; in the second state, the heating base 300 moves from the first position to the second position. During the movement of the heating base 300, the heating base 300 can contact the driving end to drive the second slider 700 to move, so that the second slider 700 can drive the first slider 520 to move to a position to avoid the adjustment hole 511 through the sliding cooperation between the first guide slope 521 and the second guide slope 710, so that there is no need to set a separate driving mechanism to drive the second slider 700 to move, thereby effectively reducing the parts of the process chamber 100 and improving the economy.

[0059] In an optional embodiment, the ejector support 500 may include a first slide 512 and a second slide 720. The first slide 512 may be a groove provided in the support body 510. The second slide 720 may be provided in the support body 510 and located on a side where the opening of the first slide 512 is located. The first slider 520 may be slidably provided in the first slide 512, the second slider 700 may be slidably provided in the second slide 720, and the adjustment hole 511 may be provided in the bottom wall of the first slide 512.

[0060] By setting the first slide 512 and the second slide 720, the first slider 520 can be slidably set in the first slide 512, and the second slider 700 can be slidably set in the second slide 720, so that the sliding of the first slider 520 and the second slider 700 is more stable and the moving direction is more precise, and also provides an installation basis for the first slider 520 and the second slider 700.

[0061] Specifically, the second slideway 720 may be perpendicular to the plane where the opening of the first slideway 512 of the support body 510 is located, and is disposed on the support panel of the support body 510 on both sides of the opening of the first slideway 512. The second slideway 720 may extend in a direction away from the first slideway 512.

[0062] Further, the support body 510 may include a stopper 513, and the stopper 513 may cover a portion of the opening of the first slideway 512. The first slider 520 may include a slider body 523 and a protruding structure 522, and the slider body 523 may include a stopper surface 524, and when the slider body 523 is located in the first slideway 512, the stopper surface 524 may be flush with the plane where the opening of the first slideway 512 is located. The protruding structure 522 may be provided on the stopper surface 524, and a first guide inclined surface 521 is provided on a side of the protruding structure 522 away from the stopper surface 524. When the slider body 523 slides along the first slideway 512, the stopper 513 is limitedly matched with at least a portion of the stopper surface 524 to limit the movement of the first slider 520 in the extension direction along the first slideway 512.

[0063] By setting the limiter 513, the limiter 513 can limit the first slider 520 to move only along the extension direction of the first slide 512 and will not escape from the opening of the first slide 512, and also prevent the first slider 520 from flipping, thereby effectively ensuring the stability and reliability of the first slider 520 sliding along the first slide 512.

[0064] In a specific implementation process, the limit member 513 can be set in a partial opening of the first slide 512. In the first state and the second state, the limit member 513 can cooperate with at least a portion of the limit surface 524. The first slider 520 can also move in the first slide 512 to a position where the limit member 513 does not cover the first slider 520, so as to facilitate the installation and removal of the first slider 520 in the first slide 512.

[0065] In an optional embodiment, the adjusting member 600 may be an adjusting screw, and the adjusting hole 511 may be an adjusting threaded hole, and the adjusting screw and the adjusting threaded hole are threadedly matched. The adjusting screw is easily available on the market, and the adjusting threaded hole is relatively easier to manufacture, thereby effectively improving the overall economic efficiency. At the same time, the threaded match between the adjusting screw and the adjusting threaded hole is relatively more precise during adjustment, and the relative position is more stable when not adjusted, which can effectively improve the overall stability of the process chamber 100.

[0066] In an optional embodiment, the ejector support 500 may further include an elastic member 800, which may be connected between the support body 510 and the first slider 520. In the first state, the elastic member 800 may drive the first slider 520 to move to a position covering the adjustment hole 511; in the second state, the first slider 520 may move to a position avoiding the hole 511, so that the elastic member 800 is in an elastic deformation state.

[0067] By setting the elastic member 800, in the second state, the elastic member 800 is in an elastic deformation state, and the elastic member 800 can store elastic potential energy. In the first state, the first slider 520 can be driven to move to a position covering the adjustment hole 511 under the action of the elastic force of the elastic member 800 to restore the elastic deformation, thereby making it easier to drive the first slider 520 to move to cover the adjustment hole 511, and can also avoid the unreliable situation of forgetting to make the first slider 520 cover the adjustment hole 511 during manual operation.

[0068] In a specific implementation process, the adjusting member 600 may be one, and the part of the ejector support member 500 away from the adjusting member 600 may be directly arranged on the bottom wall of the chamber body 200, or may be supported by a non-adjustable supporting structure. The ejector support member 500 may also be adjusted by adjusting this one adjusting member 600, but such adjustment is relatively not very precise. In order to improve the accuracy of the adjustment, in an optional embodiment, there may be multiple adjusting members 600, and multiple adjusting members 600 are all connected between the ejector support member 500 and the chamber body 200, and the multiple adjusting members 600 are arranged at intervals, and the heating base 300 is provided with multiple avoidance holes 310, and the multiple avoidance holes 310 are arranged one-to-one with the multiple adjusting members 600.

[0069] By providing a plurality of adjusting members 600 , the ejector support member 500 can be adjusted in all directions through the cooperation of the plurality of adjusting members 600 , thereby effectively improving the adjustment capability of the ejector support member 500 , thereby achieving more precise adjustment of the levelness of the semiconductor sheet 910 .

[0070] Based on the process chamber 100 disclosed in the above embodiment, the present application further discloses a semiconductor process equipment, which includes a robot 920 and the process chamber 100 in any of the above embodiments. The robot 920 can be used to grab the semiconductor sheet 910 placed on the ejector pin 400, or place the semiconductor sheet 910 on the ejector pin 400, and the robot 920 can also be used to remove the semiconductor sheet 910 from the ejector pin 400.

[0071] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0072] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A process chamber (100) of a semiconductor process equipment, characterized in that: The invention comprises a chamber body (200), a heating base (300), an ejector pin (400), an ejector pin support member (500) and an adjusting member (600), wherein: The ejector pin support (500) is disposed between the bottom wall of the chamber body (200) and the heating base (300); The heating base (300) is provided with an avoidance hole (310); the adjustment member (600) is connected between the ejector pin support member (500) and the chamber body (200) and is used to adjust the position of the ejector pin support member (500) relative to the chamber body (200); In a first state, the connection end of the ejector pin (400) passes through the avoidance hole (310) and is supported on the ejector pin support member (500); In the second state, the ejector pin (400) is separated from the avoidance hole (310) and the ejector pin support member (500) respectively, and the adjustment member (600) can be exposed through the avoidance hole (310).

2. The process chamber (100) according to claim 1, characterized in that: The ejector support member (500) is provided with an adjustment hole (511) corresponding to the avoidance hole (310), and the adjustment member (600) passes through the adjustment hole (511) and is supported on the bottom wall of the chamber body (200); In the second state, the adjusting member (600) can be exposed through the adjusting hole (511) and the avoiding hole (310).

3. The process chamber (100) according to claim 2, characterized in that: The ejector support (500) comprises a support body (510) and a first slider (520), wherein the first slider (520) is slidably connected to the support body (510); In the first state, the first slider (520) covers the adjustment hole (511), and the ejector pin (400) is supported on the first slider (520); In the second state, the first sliding block (520) avoids the adjustment hole (511).

4. The process chamber (100) according to claim 3, characterized in that: The first slider (520) comprises a first guiding inclined surface (521), the process chamber (100) comprises a second slider (700), the second slider (700) comprises a second guiding inclined surface (710), and the first guiding inclined surface (521) is used for slidingly cooperating with the second guiding inclined surface (710); In the second state, the second sliding block (700) drives the first sliding block (520) to move to a position avoiding the adjustment hole (511) through the sliding cooperation between the first guiding inclined surface (521) and the second guiding inclined surface (710).

5. The process chamber (100) according to claim 4, characterized in that: The end of the second slider (700) that faces away from the second guide slope (710) is a driving end, and the heating base (300) is movably arranged on the chamber body (200) to switch between a first position and a second position; In the first state, when the heating base (300) is in the first position, the heating base (300) is separated from the driving end; In the second state, the heating base (300) moves to the second position in the direction of the supporting body (510). When the heating base (300) moves to the second position, it can contact the driving end to drive the second slider (700) to move, so that the second slider (700) drives the first slider (520) to move to a position avoiding the adjustment hole (511) through the sliding cooperation between the first guide bevel (521) and the second guide bevel (710).

6. The process chamber (100) according to claim 4, characterized in that: The ejector support member (500) includes a first slideway (512) and a second slideway (720), wherein the first slideway (512) is a groove opened on the support body (510), and the second slideway (720) is arranged on the support body (510) and is located on the side where the opening of the first slideway (512) is located, the first slider (520) is slidably arranged on the first slideway (512), the second slider (700) is slidably arranged on the second slideway (720), and the adjustment hole (511) is arranged on the bottom wall of the first slideway (512).

7. The process chamber (100) according to claim 6, characterized in that: The support body (510) comprises a limiting member (513), the limiting member (513) covers a portion of the opening of the first slideway (512), the first slider (520) comprises a slider body (523) and a protruding structure (522), the slider body (523) comprises a limiting surface (524), the protruding structure (522) is arranged on the limiting surface (524), and the first guiding inclined surface (521) is arranged on a side of the protruding structure (522) away from the limiting surface (524); When the slider body (523) slides along the first slideway (512), the limiting member (513) cooperates with at least a portion of the limiting surface (524) to limit the movement of the first slider (520) in the extension direction of the first slideway (512).

8. The process chamber (100) according to claim 2, characterized in that: The adjusting member (600) is an adjusting screw, the adjusting hole (511) is an adjusting threaded hole, and the adjusting screw is threadably matched with the adjusting threaded hole.

9. The process chamber (100) according to any one of claims 3 to 7, characterized in that: The ejector support member (500) comprises an elastic member (800), and the elastic member (800) is connected between the support body (510) and the first sliding block (520); In the first state, the elastic member (800) drives the first sliding block (520) to move to a position covering the adjustment hole (511); In the second state, the first sliding block (520) moves to a position avoiding the adjustment hole (511), so that the elastic member (800) is in an elastically deformed state.

10. The process chamber (100) according to claim 1, characterized in that: There are a plurality of adjusting members (600), each of which is connected between the ejector pin support member (500) and the chamber body (200), and the plurality of adjusting members (600) are arranged at intervals, and the heating base (300) is provided with a plurality of avoidance holes (310), and the plurality of avoidance holes (310) are arranged in a one-to-one correspondence with the plurality of adjusting members (600).

11. A semiconductor process equipment, comprising a robot (920) and a process chamber (100) according to any one of claims 1 to 10; The robot (920) is used to grab the semiconductor sheet (910) placed on the ejector pin (400), or to place the semiconductor sheet (910) on the ejector pin.

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