A clip copper sheet and strip

Abstract

The present invention provides a clip copper sheet and strip, which relates to the technical field of power semiconductor device packaging and manufacturing. The invention solves the problem that the existing clip copper sheet has insufficient heat dissipation capacity in small packaging and that the adhesive solder paste easily generates too many bubbles due to the large bonding area, resulting in poor electrical performance and reliability of the product. The clip copper sheet includes: a heat dissipation frame, which is arranged around the chip bonding part, and one side of which is connected to the connecting part; wherein the height of the upper surface of the chip bonding part is lower than the height of the upper surface of the heat dissipation frame; a first U-shaped groove, which is arranged on the side of the heat dissipation frame away from the connecting part, extends into the chip bonding part, and extends to the BUS line of the S pole of the chip.

Description

Technical Field

[0001] The present invention relates to the technical field of power semiconductor device packaging and manufacturing, and more particularly to a clip copper sheet and strip. Background Art

[0002] Lead frames carry chips, connect internal chips to external circuit boards, and secure electronic components. Clip copper welding, a common method for connecting chips to frames, has replaced standard wire bonding between chips and pins to some extent, achieving unique package resistance values, higher current flow, and improved thermal conductivity.

[0003] In the PPAK3×3 power device package, heat dissipation is mainly carried out through the heat sink on the back of the frame. In the existing clip design, the chip bonding part is an integral plane, such as Figure 1 As shown, when the overall flat clip has a higher power output, in order to increase the heat dissipation channel and improve product performance, the flat clip needs to be improved.

[0004] Moreover, when the clip and chip are bonded together using solder paste, if the bonding area is too large, the clip can easily drift relative to the chip. Drift can lead to abnormalities such as poor electrical performance of the product. In addition, if the bonding area is too large, it will cause excessive bubbles in the adhesive solder paste, resulting in voids, affecting the electrical performance and reliability of the product. Summary of the Invention

[0005] The embodiments of the present invention provide a clip copper sheet and strip, which are used to solve the problem that the existing clip copper sheet has insufficient heat dissipation capacity when used in small packages, and that the adhesive solder paste easily generates excessive bubbles due to the large bonding area during bonding, resulting in poor electrical performance and reliability of the product.

[0006] An embodiment of the present invention provides a clip copper sheet, including:

[0007] a heat dissipation frame, which is arranged around the chip bonding portion and has one side connected to the connection portion; wherein the height of the upper surface of the chip bonding portion is lower than the height of the upper surface of the heat dissipation frame;

[0008] The first U-shaped groove is arranged on a side of the heat dissipation frame away from the connecting portion, extends into the chip bonding portion, and extends into the BUS line of the S pole of the chip.

[0009] Preferably, it also includes a pickup area and a pin bonding portion;

[0010] The pickup area is located on a side of the connecting portion away from the heat dissipation frame, and the side of the pickup area away from the connecting portion is sequentially connected to the pin bonding portion and the frame pin;

[0011] Wherein, the two sides of the pickup area adjacent to the connecting portion protrude to form a connecting rib cut-off point.

[0012] Preferably, it also includes bending at the upper portion of the pickup area, bending at the lower portion of the pickup area, and bending at the pin bonding portion;

[0013] The pickup area is connected to the connecting portion by bending the pickup area;

[0014] The pickup area is connected to the pin bonding portion by bending the pickup area downward and bending the pin bonding portion;

[0015] The upper surfaces of the pin bonding portion and the connecting portion have the same height, and the upper surface of the pickup area has a height higher than the upper surface of the connecting portion.

[0016] Preferably, it further includes a second U-shaped groove;

[0017] The second U-shaped groove is located at the center of the pin bonding portion, and the top end thereof extends to the pin bonding bending portion.

[0018] Preferably, the first U-shaped grooves include three, and the three first U-shaped grooves are all arranged on a side of the heat dissipation frame away from the connecting portion, extending into the chip bonding portion, and extending beyond the BUS line of the chip S pole.

[0019] An embodiment of the present invention provides a strip, including:

[0020] A strip upper frame and a strip lower frame, with a plurality of first rectangular holes arranged in a row between the strip upper frame and the strip lower frame;

[0021] The first rectangular hole is used to set the above-mentioned clip copper sheet;

[0022] The strip middle rib is located between the two rows of the first rectangular holes.

[0023] Preferably, it also includes clip connecting ribs and strip positioning holes;

[0024] The clip connecting ribs are located on both sides of the first rectangular hole and are respectively connected to the cut-off portions of the connecting ribs included in the clip copper sheet;

[0025] A plurality of the strip positioning holes are arranged in a row on the upper frame of the strip, each of the strip positioning holes is located directly above a clip connecting rib, and each of the strip positioning holes is located in the middle position of the width direction of the upper frame of the strip; a plurality of the strip positioning holes are arranged in a row on the lower frame of the strip, each of the strip positioning holes is located directly below a clip connecting rib, and each of the strip positioning holes is located in the middle position of the width direction of the lower frame of the strip.

[0026] Preferably, the copper clips provided in at least two adjacent first rectangular holes in a row of first rectangular holes are determined as a work station; or the copper clips provided in at least one first rectangular hole located side by side in at least two rows of first rectangular holes are determined as a work station;

[0027] Each of the workstations adjacent to the upper frame of the strip corresponds to a strip positioning hole, and the strip positioning hole is located directly above the clip connecting ribs on both sides of a first rectangular hole included in the workstation; each of the workstations adjacent to the lower frame of the strip corresponds to a strip positioning hole, and the strip positioning hole is located directly below the clip connecting ribs on both sides of a first rectangular hole included in the workstation;

[0028] When only one row of first rectangular holes is included between the strip upper frame and the strip lower frame, the strip positioning holes arranged on the strip upper frame are located directly above the strip positioning holes arranged on the strip lower frame.

[0029] Preferably, it further includes a second rectangular hole and a third rectangular hole;

[0030] The second rectangular hole and the strip positioning hole are arranged at intervals on the strip upper frame, and the second rectangular hole and the strip positioning hole are arranged at intervals on the strip lower frame;

[0031] A plurality of the third rectangular holes are arranged in a row on the middle rib of the strip.

[0032] Preferably, it also includes a graduation hole;

[0033] The indexing hole and the strip positioning hole are arranged at intervals on the lower frame of the strip, and are located directly below the clip connecting ribs on both sides of another first rectangular hole included in the work station.

[0034] An embodiment of the present invention provides a clip copper sheet and strip. The clip copper sheet includes: a heat dissipation frame, which is arranged around the chip bonding portion and has one side connected to the connecting portion; wherein the height of the upper surface of the chip bonding portion is lower than the height of the upper surface of the heat dissipation frame; and a first U-shaped groove, which is arranged on the side of the heat dissipation frame away from the connecting portion, extending into the chip bonding portion, and extending into the BUS line of the chip S pole. By providing the heat dissipation frame on the chip bonding portion, when there is a height difference between the heat dissipation frame and the chip bonding portion, the bonding area between the chip and the resin material can be increased, the shape and volume of the product can be increased, thereby reducing the amount of resin material used, and heat can be conducted and dissipated more quickly, which can meet the product's better heat dissipation and achieve better electrical performance. Furthermore, when the chip bonding portion and the solder paste are bonded, bubbles generated in the solder paste during the bonding process can be discharged along the edge of the first U-shaped groove, thereby significantly reducing the voids in the solder paste and further improving the product's electrical performance and reliability. The copper clip provided by the embodiment of the present invention solves the heat dissipation problem of the existing copper clip and the problem that the adhesive solder paste easily generates too many bubbles due to the large bonding area during bonding, resulting in poor electrical performance and reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0036] Figure 1 This is a schematic diagram of the traditional clip copper sheet structure;

[0037] Figure 2 A schematic diagram of the front structure of a clip copper sheet provided in an embodiment of the present invention;

[0038] Figure 3 A schematic diagram of the back structure of a clip copper sheet provided in an embodiment of the present invention;

[0039] Figure 4 A schematic diagram of the clip copper sheet connection structure provided in an embodiment of the present invention;

[0040] Figure 5 A schematic diagram of a two-row strip structure provided by an embodiment of the present invention;

[0041] Figure 6 A schematic diagram of a four-row strip structure provided by an embodiment of the present invention;

[0042] Figure 7 A schematic diagram of a rectangular hole strip structure provided by an embodiment of the present invention;

[0043] Among them, 1. heat dissipation frame; 2. chip bonding part; 3. first transition fillet; 4. first U-shaped groove; 5. pick-up area; 6. connecting rib cutting part; 7. connection part; 8. pin bonding part; 9. second U-shaped groove; 10. strip positioning hole; 11. strip upper frame; 12. strip lower frame; 13. first rectangular hole; 14. strip middle rib; 15. clip connecting rib; 16. frame pin; 17. frame carrier; 18. chip; 19. indexing hole; 20. work station; 21. upper bend in the pick-up area; 22. lower bend in the pick-up area; 23. bend in the pin bonding part; 24. second transition fillet; 25. third transition fillet; 26-1. first fillet of heat dissipation frame; 26-2. second fillet of heat dissipation frame; 26-3. third fillet of heat dissipation frame; 27. second rectangular hole; 28. third rectangular hole. DETAILED DESCRIPTION

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0045] Figure 2 A schematic diagram of the front structure of a clip copper sheet provided in an embodiment of the present invention; Figure 3 A schematic diagram of the back structure of a clip copper sheet provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the clip copper sheet connection structure provided by the embodiment of the present invention. Figures 1 to 4 As an example, the clip copper sheet provided by the embodiment of the present invention is described in detail.

[0046] like Figure 2 As shown, the clip copper sheet mainly includes a heat dissipation frame 1 and a chip bonding portion 2. Specifically, the heat dissipation frame 1 is arranged around the chip bonding portion 2, and one side thereof is connected to the connection portion 7. In order to ensure that the bonding area included in the chip bonding portion 2 is effective and reliable, preferably, the height of the upper surface of the heat dissipation frame 1 is higher than the height of the upper surface of the chip bonding portion 2, that is, a height difference is formed between the heat dissipation frame 1 and the chip bonding portion 2; further, when there is a height difference between the heat dissipation frame 1 and the chip bonding portion 2, the bonding area between the chip 18 and the resin material can be increased, the shape and volume of the product can be increased to reduce the resin material, and the heat can be conducted and dissipated more quickly, which can meet the better heat dissipation of the product and achieve better electrical performance.

[0047] In practical applications, the shape of the chip bonding portion 2 is determined by the region of the chip S pole. In the embodiment of the present invention, the specific shape of the chip bonding portion 2 is not specifically limited.

[0048] Furthermore, when the heat dissipation frame 1 and the chip bonding portion 2 form the chip connection portion 7, in order to avoid the bubbles generated by the solder paste when the chip bonding portion 2 is bonded to the solder paste and cause the formation of voids, preferably, a first U-shaped groove 4 is provided in the chip connection portion 7, such as Figure 2 and 3 As shown, the first U-shaped groove 4 is disposed on the side of the heat dissipation frame 1 away from the connection portion 7 and extends into the chip bonding portion 2, extending within the BUS line of the chip's S-pole. That is, the first U-shaped groove 4 is opened at the upper edge of the chip connection portion 7, and the length of the first U-shaped groove 4 covers and extends beyond the BUS line of the chip's S-pole. In this embodiment of the present invention, the width of the first U-shaped groove 4 is equal to the thickness of the clip material.

[0049] It should be noted that, within the BUS line of the S-pole of the chip, means that the extension length of the first U-shaped groove 4 passes through the position where the BUS line is set at the S-pole of the chip.

[0050] The clip copper sheet provided in the embodiment of the present invention, by setting a heat dissipation frame 1 on the chip bonding part 2, can increase the bonding area between the chip 18 and the resin material when there is a height difference between the heat dissipation frame 1 and the chip bonding part 2, increase the shape and volume of the product to reduce the resin material, and conduct and dissipate heat more quickly, which can meet the product's better heat dissipation and achieve better electrical performance; furthermore, when the chip bonding part 2 and the solder paste are bonded, the bubbles generated in the solder paste during the bonding process can be discharged along the edge of the first U-shaped groove 4, thereby greatly reducing the voids in the solder paste and further improving the product's electrical performance and reliability. The clip copper sheet provided in the embodiment of the present invention solves the problem that when existing clip copper sheets are bonded, the adhesive solder paste easily generates too many bubbles due to the large bonding area, resulting in poor electrical performance and reliability of the product.

[0051] It should be noted that the three corners of the heat dissipation frame 1 are respectively provided with a first heat dissipation frame rounded corner 26 - 1 , a second heat dissipation frame rounded corner 26 - 2 and a third heat dissipation frame rounded corner 26 - 3 .

[0052] Furthermore, the upper surface of the heat dissipation frame 1 where it connects to the chip bonding portion 2 has a first transition fillet 3, and the lower surface of the chip bonding portion 2 where it connects to the chip 18 has a third transition fillet 25. In practical applications, the first transition fillet 3 is naturally formed on the upper surface where the heat dissipation frame 1 connects to the chip bonding portion 2 through a stamping process. This third transition fillet 25 ensures a smooth transition between the clip and the chip 18, preventing the clip's edges from padding or scratching the chip 18.

[0053] Furthermore, the heat dissipation frame 1 and the connecting portion 7 are coupled to each other, and a second transition fillet 24 is provided at a right-angle position of the coupling.

[0054] For example, Figure 4 As shown, the chip bonding portion 2 is used to connect the chip 18, and the chip 18 is attached to the frame carrier 17. The heat dissipation frame 1 and the chip bonding portion 2 together constitute the chip connection part.

[0055] Furthermore, it also includes a pickup area 5 and a pin bonding portion 8. The side of the connection portion 7 away from the chip 18 bonding area is connected to the pickup area 5, and a pickup area upper bend 21 is provided between the connection portion 7 and the pickup area 5. Furthermore, the pickup area 5 and the side away from the connection portion 7 are sequentially connected to the pin bonding portion 8 and the frame pin 16. Specifically, a pickup area lower bend 22 and a pin bonding portion bend 23 are provided between the pickup area 5 and the pin bonding portion 8.

[0056] In an embodiment of the present invention, the upper surface of the pin bonding portion bend 23 and the upper surface of the connecting portion 7 have the same height. Since a lower bend 22 of the picking area is provided between the pin bonding portion bend 23 and the picking area 5, an upper bend 21 of the picking area is provided between the connecting portion 7 and the picking area 5, that is, the picking area 5 is arched by the upper bend 21 of the picking area and the lower bend 22 of the picking area, and the picking area 5 is the highest plane of the clip copper sheet product, thereby ensuring that the suction nozzle can pick up effectively.

[0057] In the embodiment of the present invention, the minimum area of ​​the pickup region 5 may be 0.7 mm*0.7 mm. Furthermore, protrusions are provided on both sides of the pickup region 5 adjacent to the connecting portion 7 to form a connecting rib cutting portion 6.

[0058] It should be noted that the pin bonding bend 23 is connected to the pin bonding portion 8, and the height difference formed by the pin bonding bend 23 ensures that the bonding area of ​​the pin connection portion 7 is effective and reliable. In this embodiment of the present invention, the pin bonding portion 8 has the pin bonding bend 23, and the pin bonding portion 8 and the pin bonding bend 23 together constitute the pin connection portion.

[0059] For example, Figure 3 As shown, since the pin bonding portion 8 and the frame pin 16 need to be bonded using solder paste, to prevent solder paste drift during bonding, a second U-shaped groove 9 is preferably provided at the center of the pin bonding portion 8, with its top end extending to the pin bonding bend. That is, the center of the second U-shaped groove 9 is located at the pin bonding portion bend 23. It should be noted that the groove width of the second U-shaped groove 9 is equal to the thickness of the clip material.

[0060] It should be noted that, in an embodiment of the present invention, the number of the first U-shaped grooves 4 arranged on the side of the heat dissipation frame 1 away from the connection part 7 can be three, that is, the three first U-shaped grooves 4 are evenly arranged on the side of the heat dissipation frame 1 away from the connection part 7, and the three first U-shaped grooves 4 all extend into the chip bonding part 2, and extend to the BUS line of the S pole of the chip.

[0061] The clip copper sheet provided in the embodiment of the present invention, the chip bonding part and the pin bonding part need to be fitted with the frame, the heat dissipation frame and the chip bonding part are connected to form a height difference, the chip bonding part is close to the chip, and the heat dissipation frame is raised to a certain height relative to the chip, which can increase the bonding area between the chip and the resin material, increase the shape and volume of the product to reduce the resin material, and conduct and dissipate heat more quickly, which can meet the better heat dissipation of the product and achieve better electrical performance; the connection part and the picking area are formed with a height difference by bending the picking area, and the picking area and the pin bonding part are formed with a height difference by bending the picking area and bending the pin bonding part, which can ensure that the suction nozzle picks up effectively; a first U-shaped groove is provided on the heat dissipation frame, and a second U-shaped groove is provided on the pin bonding part, which can discharge bubbles generated in the solder paste during the bonding process, thereby improving the electrical performance and poor reliability of the product.

[0062] An embodiment of the present invention also provides a strip, which includes an upper strip frame 11 and a lower strip frame 12, and a plurality of first rectangular holes 13 are arranged in rows between the upper strip frame 11 and the lower strip frame 12; the first rectangular holes 13 are used to set the clip copper sheet provided in the above embodiment; when the first rectangular holes 13 arranged between the upper strip frame 11 and the lower strip frame 12 are in multiple rows, a strip middle rib 14 is also included between two adjacent rows of first rectangular holes 13.

[0063] It should be noted that the strip provided in the embodiment of the present invention is a whole piece of copper material, which is punched and bent by a step-by-step punching die, ultimately retaining the strip frame, connecting ribs and clip copper sheet.

[0064] For example, Figure 5 As shown, the strip includes two rows of first rectangular holes 13, wherein the clip connecting ribs 15 are located on both sides of the first rectangular holes 13 and are respectively connected to the connecting rib cut-off portions 6 of the clip copper sheet.

[0065] Furthermore, a plurality of strip positioning holes 10 are arranged in a row on the strip upper frame 11, each strip positioning hole 10 is located directly above a clip connecting rib 15, and each strip positioning hole 10 is located in the middle of the width direction of the strip upper frame 11. Correspondingly, a plurality of strip positioning holes 10 are arranged in a row on the strip lower frame 12, each strip positioning hole 10 is located directly below a clip connecting rib 15, and each strip positioning hole 10 is located in the middle of the width direction of the strip lower frame 12.

[0066] It should be noted that the gap between the edge of the first rectangular hole 13 and the clip copper sheet disposed within the first rectangular hole 13 is greater than 0.5 mm. The width of the clip connecting rib 15 disposed within the first rectangular hole 13 is less than 5 mm, and the width of the strip upper frame 11 and the strip lower frame 12 is greater than 2.1 mm.

[0067] For example, Figure 6 As shown, in an embodiment of the present invention, the clip copper sheets set in multiple first rectangular holes 13 can also be combined to form a work station 20. Specifically, the clip copper sheets set in at least two adjacent first rectangular holes 13 in a row of first rectangular holes 13 are determined as the work station 20; or the clip copper sheets set in at least one first rectangular hole 13 located in a side-by-side position in at least two rows of first rectangular holes 13 are determined as the work station 20.

[0068] In practical applications, the workstations include 2 workstations, 3 workstations, 4 workstations, 6 workstations, 8 workstations, etc. Specifically, when the strip includes only one row of first rectangular holes 13, the copper clips set in two adjacent first rectangular holes 13 in the row of first rectangular holes 13 can be determined as 2 workstations, or 1 row and 2 columns can be used to represent 2 workstations; the copper clips set in three adjacent first rectangular holes 13 in the row of first rectangular holes 13 can be determined as 3 workstations, or 1 row and 3 columns can be used to represent 3 workstations; the copper clips set in four adjacent first rectangular holes 13 in the row of first rectangular holes 13 can be determined as 4 workstations, or 1 row and 4 columns can be used to represent 4 workstations.

[0069] When the strip includes two or more rows of first rectangular holes 13, the clip copper pieces set in two first rectangular holes 13 located in a side-by-side position in the two rows of first rectangular holes 13 can be determined as 2 workstations, or 2 rows and 1 column can be used to represent 2 workstations; the clip copper pieces set in two adjacent first rectangular holes 13 in the two rows of first rectangular holes 13 can be determined as 4 workstations, or 2 rows and 2 columns can be used to represent 4 workstations; the clip copper pieces set in two adjacent first rectangular holes 13 in the three rows of first rectangular holes 13 can be determined as 6 workstations, or 3 rows and 2 columns can be used to represent 6 workstations; the copper clips set in three adjacent first rectangular holes 13 in two rows of first rectangular holes 13 are determined as 6 workstations, and 2 rows and 3 columns can also be used to represent 6 workstations; the copper clips set in two adjacent first rectangular holes 13 in four rows of first rectangular holes 13 are determined as 8 workstations, and 4 rows and 2 columns can also be used to represent 8 workstations; the copper clips set in four adjacent first rectangular holes 13 in two rows of first rectangular holes 13 are determined as 8 workstations, and 2 rows and 4 columns can also be used to represent 8 workstations. In the embodiment of the present invention, the method for determining the workstation 20 is not specifically limited.

[0070] In an embodiment of the present invention, after the workstation 20 is determined on the strip, the strip positioning holes 10 set on the upper strip frame 11 and the lower strip frame 12 can be further determined based on the position of the determined workstation 20. Taking the clip copper sheets set in two adjacent first rectangular holes 13 in a row as a two-station as an example, the setting method of the strip positioning holes 10 is introduced. Specifically, each of the two workstations adjacent to the upper strip frame 11 corresponds to a strip positioning hole 10, and the strip positioning hole 10 is located directly above the clip connecting ribs 15 on both sides of a first rectangular hole 13 included in the workstation 20; correspondingly, each of the two workstations adjacent to the lower strip frame 12 corresponds to a strip positioning hole 10, and the strip positioning hole 10 is located directly below the clip connecting ribs 15 on both sides of a first rectangular hole 13 included in the workstation 20.

[0071] In actual application, when there is only one row of first rectangular holes 13 between the strip upper frame 11 and the strip lower frame 12, the strip positioning holes 10 set in the strip upper frame 11 are located directly above the strip positioning holes 10 set in the strip lower frame 12.

[0072] In the embodiment of the present invention, the distance between the strip positioning holes 10 can be adjusted to coordinately adjust the spacing in the row and column directions of the strip, that is, to adjust the spacing between the first rectangular holes 13 provided on the strip. Thus, the workstations 20 provided on the strip can be adjusted. For example, with two rows of strips, each column corresponds to a positioning hole, and two products are punched and picked up each time. By changing the positioning hole to one every four columns, eight products can be punched and picked up each time, significantly improving production efficiency and saving costs.

[0073] Furthermore, the strip also includes a second rectangular hole 27 and a third rectangular hole 28. The following describes the arrangement of the second rectangular holes 27 and the third rectangular holes 28, taking the example of a workstation 20 in which a copper clip is placed within two adjacent first rectangular holes 13 in a row. Specifically, the second rectangular holes 27 are spaced apart from the strip positioning holes 10 in the strip upper frame 11, the second rectangular holes 27 are spaced apart from the strip positioning holes 10 in the strip lower frame 12, and multiple third rectangular holes 28 are arranged in a row in the strip center rib 14.

[0074] Furthermore, it also includes a dividing hole 19, which is spaced apart from the strip positioning hole 10 and arranged on the strip lower frame 12, and is located directly below the clip connecting ribs 15 on both sides of another first rectangular hole 13 included in the work station 20.

[0075] In this embodiment of the present invention, the indexing holes 19, first rectangular hole 13, second rectangular hole 27, and third rectangular hole 28 all reduce stress concentration in the frame and minimize deformation of the clips in the corresponding locations during transportation. This saves strip material and reduces costs. Adding rectangular holes while ensuring strength maximizes material savings.

[0076] In summary, an embodiment of the present invention provides a clip copper sheet and strip, wherein the clip copper sheet includes: a heat dissipation frame, which is arranged around the chip bonding portion and one side of which is connected to the connecting portion; wherein the height of the upper surface of the chip bonding portion is lower than the height of the upper surface of the heat dissipation frame; and a first U-shaped groove, which is arranged on the side of the heat dissipation frame away from the connecting portion, extending into the chip bonding portion, and extending into the BUS line of the chip S pole. By providing a heat dissipation frame on the chip bonding portion, when there is a height difference between the heat dissipation frame and the chip bonding portion, the bonding area between the chip and the resin material can be increased, the shape and volume of the product can be increased, thereby reducing the amount of resin material used, and heat can be conducted and dissipated more quickly, which can meet better heat dissipation requirements of the product and achieve better electrical performance. Furthermore, when the chip bonding portion and the solder paste are bonded, bubbles generated in the solder paste during the bonding process can be discharged along the edge of the first U-shaped groove, thereby significantly reducing the voids in the solder paste and further improving the electrical performance and reliability of the product. The copper clip provided by the embodiment of the present invention solves the problem that when conventional copper clips are bonded, the adhesive solder paste easily generates excessive bubbles due to the large bonding area, resulting in poor electrical performance and reliability of the product.

[0077] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0078] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A copper sheet, characterized in that: include: a heat dissipation frame, which is arranged around the chip bonding portion and has one side connected to the connection portion; wherein the height of the upper surface of the chip bonding portion is lower than the height of the upper surface of the heat dissipation frame, and the shape of the chip bonding portion is determined by the area of ​​the chip S pole; The heat dissipation frame and the chip bonding portion constitute a chip connection portion, and the chip connection portion is provided with a first U-shaped groove, which is provided on a side of the heat dissipation frame away from the connection portion, and extends into the chip bonding portion and into the chip bus of the S pole of the chip; A first transition fillet is provided on the upper surface of the connection between the heat dissipation frame and the chip bonding portion, and a third transition fillet is provided on the lower surface of the chip bonding portion and the chip connection position, so that the copper sheet and the chip surface are smoothly transitioned through the third transition fillet; A pickup area and a pin bonding portion, wherein the pickup area is located on a side of the connecting portion away from the heat dissipation frame, and the side of the pickup area away from the connecting portion is sequentially connected to the pin bonding portion and the frame pin, wherein the two sides of the pickup area adjacent to the connecting portion protrude to form a connecting rib cutting portion; The pick-up area is bent upward, the pick-up area is bent downward, and the pin bonding portion is bent. The pick-up area is connected to the connecting portion via the pick-up area bend upward; the pick-up area is connected to the pin bonding portion via the pick-up area bend downward and the pin bonding portion bend. The upper surface of the bent pin bonding portion and the upper surface of the connecting portion have the same height, and the upper surface of the pick-up area is higher than the upper surface of the connecting portion. a second U-shaped groove, the second U-shaped groove being located at the center of the pin bonding portion, and the top end of the second U-shaped groove extending to the pin bonding bend portion; the groove width of the second U-shaped groove being equal to the thickness of the copper sheet material; The chip bonding portion is used to connect a chip, and the chip is adhered to the frame carrier.

2. The copper sheet according to claim 1, wherein The first U-shaped grooves include three, and the three first U-shaped grooves are all arranged on a side of the heat dissipation frame away from the connecting portion.

3. A strip, characterized in that: include: A strip upper frame and a strip lower frame, with a plurality of first rectangular holes arranged in a row between the strip upper frame and the strip lower frame; The copper sheet according to any one of claims 1 to 2 is arranged in the first rectangular hole; The strip middle rib is located between the two rows of the first rectangular holes.

4. The strip according to claim 3, characterized in that It also includes copper sheet connecting bars and strip positioning holes; The copper sheet connecting ribs are located on both sides of the first rectangular hole and are respectively connected to the cut-off portions of the connecting ribs included in the copper sheet; A plurality of the strip positioning holes are arranged in a row on the upper frame of the strip, each of the strip positioning holes is located directly above one of the copper sheet connecting ribs, and each of the strip positioning holes is located in the middle position of the width direction of the upper frame of the strip; a plurality of the strip positioning holes are arranged in a row on the lower frame of the strip, each of the strip positioning holes is located directly below one of the copper sheet connecting ribs, and each of the strip positioning holes is located in the middle position of the width direction of the lower frame of the strip.

5. The strip according to claim 3, characterized in that The copper sheets arranged in at least two adjacent first rectangular holes in a row of first rectangular holes are determined as a work station; or the copper sheets arranged in at least one first rectangular hole located side by side in at least two rows of first rectangular holes are determined as a work station; Each of the workstations adjacent to the upper frame of the strip corresponds to a strip positioning hole, and the strip positioning hole is located directly above the copper sheet connecting ribs on both sides of a first rectangular hole included in the workstation; each of the workstations adjacent to the lower frame of the strip corresponds to a strip positioning hole, and the strip positioning hole is located directly below the copper sheet connecting ribs on both sides of a first rectangular hole included in the workstation; When only one row of first rectangular holes is included between the strip upper frame and the strip lower frame, the strip positioning holes arranged on the strip upper frame are located directly above the strip positioning holes arranged on the strip lower frame.

6. The strip according to claim 5, characterized in that Also includes a second rectangular hole and a third rectangular hole; The second rectangular hole and the strip positioning hole are arranged at intervals on the strip upper frame, and the second rectangular hole and the strip positioning hole are arranged at intervals on the strip lower frame; A plurality of the third rectangular holes are arranged in a row on the middle rib of the strip.

7. The strip according to claim 5, characterized in that Also includes indexing holes; The indexing hole and the strip positioning hole are arranged at intervals on the lower frame of the strip, and are located directly below the copper sheet connecting ribs on both sides of another first rectangular hole included in the work station.

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