A semiconductor thermoelectric module, a cryogenic device and a control method

Abstract

The present invention provides a semiconductor cooling and heating component, a cryogenic device and a control method, which relate to the technical field of refrigeration equipment and solve the technical problem that it is difficult to form an obvious low-temperature area at the heat absorption end of a planar refrigeration sheet, affecting the refrigeration and dehumidification effect. The semiconductor cooling and heating component includes a semiconductor refrigeration sheet, a hot-end fin group and a cold-end fin group. The semiconductor refrigeration sheet has a non-planar structure, and the cold-end fin group and the hot-end fin group are respectively attached to both sides of the semiconductor refrigeration sheet; the cryogenic device includes a barrel body component, a base component and an upper end cover component arranged at both ends of the barrel body component, and a semiconductor cooling and heating component arranged inside the barrel body component. A air supply component communicated with the semiconductor cooling and heating component is arranged on the base component, a heat discharge port for discharging hot air is arranged on the barrel body component, and an air discharge port for discharging cold air or natural air is arranged on the upper end cover component. The present invention is used for the refrigeration demand on the desktop, and the cryogenic device integrates functions of air supply, cold air, freshness preservation and dehumidification.

Description

Technical Field

[0001] The present invention relates to the technical field of refrigeration equipment, and in particular, to a semiconductor cold and hot component, a cryogenic device and a control method. Background Art

[0002] The principle of semiconductor refrigeration refers to the phenomenon that after direct current passes through a semiconductor material, one end releases heat and the other end absorbs heat. On the premise of ensuring the refrigeration effect, a combination of fins and a fan is used to assist heat absorption and dissipation. The fins promote heat exchange between the cold and hot ends of the semiconductor, and the fan further strengthens this process. Since conventional semiconductor refrigeration uses a planar patch structure, and the cold and hot ends are attached to vertical aluminum fins to assist heat absorption and dissipation, it is difficult to form a relatively obvious low-temperature area at the heat absorption end of the conventional planar patch, thus affecting the refrigeration and dehumidification effects. Moreover, conventional desktop air conditioners or dehumidifiers and other devices have a single function and can only refrigerate or dehumidify, and it is difficult to fully meet the refrigeration needs of customers in all aspects. Summary of the Invention

[0003] The purpose of the present invention is to provide a semiconductor cold and hot component, a cryogenic device and a control method to solve the technical problem in the prior art that it is difficult to form an obvious low-temperature area at the heat absorption end of a planar refrigeration sheet, which affects the refrigeration and dehumidification effects.

[0004] To achieve the above purpose, the present invention provides the following technical solutions:

[0005] A semiconductor cold and hot component provided by the present invention includes a semiconductor refrigeration sheet, a hot-end fin group and a cold-end fin group. The semiconductor refrigeration sheet has a non-planar structure, and the cold-end fin group and the hot-end fin group are respectively attached to both sides of the semiconductor refrigeration sheet.

[0006] As a further improvement of the present invention, the semiconductor refrigeration sheet has a cylindrical structure, the cold-end fin group is arranged inside the semiconductor refrigeration sheet, and the hot-end fin group is arranged outside the semiconductor refrigeration sheet.

[0007] As a further improvement of the present invention, the cold-end fin group includes an outer cylinder, an inner cylinder and cold fins; the outer cylinder and the inner cylinder are concentric structures, and the cold fins are arranged between the outer cylinder and the inner cylinder and are spirally arranged along the height direction of the outer cylinder according to the right-hand helix or left-hand helix rule.

[0008] As a further improvement of the present invention, the cold fins are provided with water-drop holes.

[0009] As a further improvement of the present invention, a diversion groove extending along the length direction thereof is arranged on the inner side and / or the outer side of the cold fins.

[0010] As a further improvement of the present invention, all the cold fins have the same width along the radial direction of the outer cylinder.

[0011] As a further improvement of the present invention, the cold-end fin group further includes a water-receiving tray pedestal clamped at the bottoms of the outer cylinder and the inner cylinder. The upper surface of the water-receiving tray pedestal is an inclined surface structure with a high edge and a low middle, and a water leakage hole is provided at the middle position of the water-receiving tray pedestal.

[0012] As a further improvement of the present invention, a boss is provided on the water-receiving tray pedestal corresponding to the position between the inner cylinder and the outer cylinder. At least two convex strips are provided on the boss, and an air inlet passage is provided at the top of each convex strip.

[0013] As a further improvement of the present invention, the hot-end fin group includes a sleeve and hot fins. The hot fins are arranged on the outer wall of the sleeve and are spirally arranged along the height direction of the sleeve according to the left-hand helix or right-hand helix rule.

[0014] As a further improvement of the present invention, the widths of all the hot fins in the radial direction of the sleeve are not equal, including wide fins and narrow fins.

[0015] As a further improvement of the present invention, the narrow fins and the wide fins are arranged alternately, and three narrow fins are provided between two adjacent wide fins.

[0016] As a further improvement of the present invention, heat-conducting silicone grease is coated on the contact surfaces of the semiconductor refrigeration sheet with the cold-end fin group and the hot-end fin group.

[0017] A low-temperature device provided by the present invention includes a barrel body assembly, a base assembly and an upper end cover assembly arranged at both ends of the barrel body assembly, and the semiconductor cooling and heating assembly arranged in the barrel body assembly. A air supply assembly communicated with the semiconductor cooling and heating assembly is arranged on the base assembly. A heat discharge port for discharging hot air is arranged on the barrel body assembly, and an air discharge port for discharging cold air or natural air is arranged on the upper end cover assembly.

[0018] As a further improvement of the present invention, the heat discharge port is arranged at the upper part of the barrel body assembly, corresponding to the position of the hot-end fin group; an air discharge baffle is arranged on the heat discharge port.

[0019] As a further improvement of the present invention, the upper end cover assembly includes a top cover and an air outlet cover. A pick-up and placement opening is provided at the center of the top cover, and the diameter of the pick-up and placement opening is equal to the diameter of the inner cylinder in the cold-end fin group; a first air outlet for discharging cold air is provided on the top cover corresponding to the position of the cold-end fin group. The air outlet cover is covered above the pick-up and placement opening and is screwed to the top cover. The air discharge port is arranged on the side wall of the air outlet cover; the opening and closing and direction of the air discharge port are adjusted by adjusting the depth and angle of the air outlet cover screwed into the top cover.

[0020] As a further improvement of the present invention, the upper end cover assembly further includes a control panel. An inner limiting ring and an outer limiting ring are provided on the top cover, and the control panel is clamped in a card slot formed by the inner limiting ring and the outer limiting ring; the air outlet cover is screwed on the inner limiting ring.

[0021] As a further improvement of the present invention, the first air outlet is a strip-shaped hole and is uniformly arranged along the circumferential direction of the air outlet cover.

[0022] As a further improvement of the present invention, the base assembly includes a base and a water tank. The base and the water tank are spliced together to form the disc-shaped base assembly; the air supply assembly includes a first air inlet assembly and a second air inlet assembly arranged on opposite sides inside the base. The first air inlet assembly is communicated with the cold end fin group; the second air inlet assembly is communicated with the hot end fin group; a water inlet communicated with the cold end fin group is arranged at the top of the water tank.

[0023] As a further improvement of the present invention, the base is an integral structure, or alternatively, the base is a split structure and is formed by docking the upper and lower half seats.

[0024] As a further improvement of the present invention, both the first air inlet assembly and the second air inlet assembly include an air inlet, an air inlet duct, a fan, and an air inlet. The air inlet is arranged on the side wall of the base, the air inlet duct extends along the circumferential direction of the base, the fan is arranged in the air inlet duct, and the air inlet is arranged on the top of the base.

[0025] As a further improvement of the present invention, a transparent mirror is arranged on the side wall of the water tank.

[0026] As a further improvement of the present invention, a float for detecting the water level height is further arranged in the water tank.

[0027] As a further improvement of the present invention, the low-temperature device has four operating modes, namely a natural air supply mode of turning off the semiconductor refrigeration sheet and supplying air through the air outlet; a refrigeration air supply mode of turning on the semiconductor refrigeration sheet and supplying air through the air outlet; a refrigeration preservation mode of turning on the semiconductor refrigeration sheet, reducing the fan speed in the second air supply component, partially closing or completely closing the air outlet; and a refrigeration dehumidification mode of turning on the semiconductor refrigeration sheet, reducing the fan speed in the second air supply component, and slowly supplying air through the air outlet.

[0028] As a further improvement of the present invention, the low-temperature device is a low-temperature box.

[0029] A control method provided by the present invention, a method for controlling the low-temperature device, includes the following steps:

[0030] Step 100: Power on the device and turn on the low-temperature equipment. Select the operating mode through the control panel.

[0031] Step 200: When the natural air supply mode is selected, the thermoelectric cooler is not powered on, the fan in the first air supply component is turned on, and the top air outlet is exposed for natural air supply.

[0032] Step 300: When the refrigerating air supply mode is selected, the thermoelectric cooler is powered on, the fans in both the first air supply component and the second air supply component are turned on, and the top air outlet is exposed for refrigerating air supply.

[0033] Step 400: When the refrigerating and fresh-keeping mode is selected, the thermoelectric cooler is powered on, the fans in both the first air supply component and the second air supply component are turned on, the fan in the second air supply component operates at a low speed, and the top air outlet is partially closed or completely closed for refrigerating and fresh-keeping.

[0034] Step 500: When the refrigerating and dehumidifying mode is selected, the thermoelectric cooler is powered on, the fans in both the first air supply component and the second air supply component are turned on, the fan in the second air supply component operates at a low speed, and the top air outlet is opened for slow air supply during refrigerating and dehumidifying.

[0035] As a further improvement of the present invention, in Steps 200, 300, and 500, the air outlet direction can also be adjusted by adjusting the angle of the air outlet cover.

[0036] The present invention has the following beneficial effects compared with the prior art:

[0037] The semiconductor cooling and heating component provided by the present invention adopts a thermoelectric cooler with a non-planar structure, and fin groups are respectively arranged on both sides of the thermoelectric cooler, so that the curved surface structure of the thermoelectric cooler at the heat absorption end can deflect and change the direction of the air flow, as well as change the air flow velocity, thereby forming an obvious low-temperature area on one side of the heat absorption end of the thermoelectric cooler, improving the refrigerating and dehumidifying effect.

[0038] The low-temperature equipment provided by the present invention is a new type of semiconductor multi-functional low-temperature box. Based on the structures of a traditional dehumidifier and a desktop refrigeration device, it adopts a cylindrical cooling fin and an S-shaped surrounding fin structure to achieve the effect of external heat dissipation and internal refrigeration. Further, by arranging fans on both the first air inlet component and the second air inlet component and adopting a double-fan structure, the functions of the equipment are strengthened, making this desktop device integrate the functions of air supply, cold air, fresh-keeping, and dehumidification. A heat-conducting silicone grease is applied between the thermoelectric cooler and the heat-conducting hot-end fin group. Appropriate air inlet channels, specifically a cold air channel and a hot air channel, are designed for this new structure; and a condensate water channel structure located on the cold-end fin group and the base component is convenient for the collection and storage of condensate water.

[0039] The low-temperature device provided by the present invention has the following functions: when the semiconductor refrigeration sheet is powered off, the cold-side fan starts. The user can adjust the top air outlet cover to change the air supply direction to achieve the air supply function. When the semiconductor refrigeration sheet is powered on, both side fans start. When the top air outlet cover exposes the air exhaust port, the refrigeration and air supply function is realized. When the air exhaust port is closed, the refrigeration and preservation function is realized. By opening the air exhaust port and reducing the speed of the cold-end fan, the refrigeration and dehumidification function can be achieved. With a single desktop refrigeration device, the refrigeration needs of users on the desktop can be met. Description of the Drawings

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0041] Figure 1 It is a schematic diagram of the overall structure of the low-temperature device of the present invention;

[0042] Figure 2 It is a semi-sectional view of the low-temperature device of the present invention;

[0043] Figure 3 It is an exploded view of the low-temperature device of the present invention;

[0044] Figure 4 It is a schematic diagram of the exploded structure of the upper end cover assembly in the low-temperature device of the present invention;

[0045] Figure 5 It is a schematic diagram of the structure of the barrel body assembly and the semiconductor cooling and heating assembly in the low-temperature device of the present invention;

[0046] Figure 6 It is a schematic diagram of the exploded structure of the base assembly in the low-temperature device of the present invention;

[0047] Figure 7 It is a diagram of the cold air flow path when the low-temperature device of the present invention is operating;

[0048] Figure 8 It is a diagram of the hot air flow path when the low-temperature device of the present invention is operating;

[0049] Figure 9 It is a diagram of the condensate flow path when the low-temperature device of the present invention is operating;

[0050] Figure 10 It is a cross-sectional view of the cold-end fin group in the low-temperature device of the present invention;

[0051] Figure 11 It is a schematic diagram of the structure of the water receiving tray pedestal in the low-temperature device of the present invention.

[0052] In the figure: 1. Semiconductor refrigeration chip; 2. Hot-end fin group; 21. Sleeve; 22. Hot fin; 221. Wide fin; 222. Narrow fin; 3. Cold-end fin group; 31. Outer cylinder; 32. Inner cylinder; 33. Cold fin; 34. Water drain hole; 35. Flow guide groove; 36. Water receiving tray pedestal; 37. Leakage hole; 38. Rib; 39. Air inlet passage; 10. Barrel body assembly; 101. Exhaust baffle; 20. Base assembly; 201. Base; 202. Water tank; 203. Water inlet; 204. Air inlet; 205. Air inlet duct; 206. Fan; 207. Air inlet; 208. Transparent mirror; 209. Float; 210. Filter screen; 211. Air inlet baffle; 30. Upper end cover assembly; 301. Exhaust port; 302. Top cover; 303. Air outlet cover; 304. Access port; 305. First air outlet; 306. Control panel; 307. Inner limit ring; 308. Outer limit ring. Detailed implementation mode

[0053] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other implementation manners obtained by those of ordinary skill in the art based on the embodiments of the present invention without any creative work belong to the scope protected by the present invention.

[0054] As Figure 2 shown, the present invention provides a semiconductor cooling and heating component, including a semiconductor refrigeration chip 1, a hot-end fin group 2 and a cold-end fin group 3. The semiconductor refrigeration chip 1 has a non-planar structure, and the cold-end fin group 3 and the hot-end fin group 2 are respectively attached to both sides of the semiconductor refrigeration chip 1.

[0055] Figure 2 The figure is a half-sectional view, which is a structural diagram of a low-temperature device when a long-barrel-shaped fresh-keeping object (such as a beverage bottle) is placed inside.

[0056] The semiconductor cooling and heating component provided by the present invention, by adopting a semiconductor refrigeration chip with a non-planar structure and respectively arranging fin groups on both sides of the semiconductor refrigeration chip, enables the curved surface structure of the refrigeration chip to deflect and change the direction of the air flow and the change of the air flow velocity at the heat absorption end of the semiconductor refrigeration chip, so that an obvious low-temperature area can be formed on one side of the heat absorption end of the semiconductor refrigeration chip, improving the refrigeration and dehumidification effects.

[0057] Furthermore, in this embodiment, the semiconductor refrigeration chip 1 has a cylindrical structure. The cold-end fin group 3 is arranged inside the semiconductor refrigeration chip 1 to perform refrigeration inside the semiconductor refrigeration chip 1, and the hot-end fin group 2 is arranged outside the semiconductor refrigeration chip 1 to perform heat dissipation outside the semiconductor refrigeration chip 1.

[0058] As an alternative embodiment of the present invention, the cold-end fin group 3 includes an outer cylinder 31, an inner cylinder 32, and cold fins 33; the outer cylinder 31 and the inner cylinder 32 are concentric structures, the outer cylinder 31 is sleeved inside the thermoelectric cooler 1, and the outer cylinder 31 is in contact connection with the inner wall of the thermoelectric cooler 1 for cold conduction; the cold fins 33 are arranged between the outer cylinder 31 and the inner cylinder 32 and are spirally arranged along the height direction of the outer cylinder 31 according to the right-hand helix or left-hand helix rule. It should be noted here that both ends of the cold fins 33 are fixedly connected to the inner walls of the outer cylinder 31 and the inner cylinder 32 respectively, and an accommodation cavity is formed inside the inner cylinder 32, and the articles to be preserved can be placed in this accommodation cavity. The cold fins 33 are arranged along the entire height range of the outer cylinder 31. Since the cold fins 33 are arranged in a spiral manner, an S-shaped cold channel is formed between the inner cylinder 32 and the outer cylinder 31 for the air flow to pass through, which not only increases the flow time but also increases the contact area, so that the cold of the thermoelectric cooler 1 can be fully utilized to cool the air flow and send it out or preserve and refrigerate the articles.

[0059] Since condensate is likely to be generated during the refrigeration process, in the present invention, water-drop holes 34 are provided on the cold fins 33. By providing the water-drop holes 34, the condensate on the cold fins 33 or in the cold channel can drip down to the lower part of the cold-end fin group 3 for collection. Specifically, in the present invention, there are multiple water-drop holes 34 on the cold fins 33, which are arranged at intervals along the length direction of the cold fins 33, that is, the spiral direction. The interval size can be set according to actual needs, but at least one water-drop hole 34 should be ensured on each turn of the cold fins 33. Of course, the optimal way is to have water-drop holes 34 in the four angular ranges of each turn of the cold fins 33 to ensure the timely and rapid discharge of condensate.

[0060] To further improve the collection and discharge efficiency of condensate, a diversion groove 35 extending along its length direction is provided on the inner side and / or the outer side of the cold fins 33.

[0061] Specifically, the diversion groove 35 is a downwardly concave groove, and the spiral inclination angle of the cold fins 33 is utilized to facilitate the rapid downward flow of a large amount of condensate.

[0062] Furthermore, in this embodiment, all the cold fins 33 have the same width along the radial direction of the outer cylinder 31.

[0063] As an alternative embodiment of the present invention, the cold-end fin group 3 further includes a water-receiving tray pedestal 36 clamped at the bottoms of the outer cylinder 31 and the inner cylinder 32. The upper surface of the water-receiving tray pedestal 36 is an inclined surface structure with a high edge and a low middle, and the inclined surface structure is provided to facilitate the collection of the condensate falling onto the water-receiving tray pedestal 36, and a water leakage hole 37 is provided at the middle position of the water-receiving tray pedestal 36.

[0064] Such as Figure 10As shown, further, the bottom of the inner cylinder 32 is shorter than that of the outer cylinder 31 by a section, leaving an assembly space for the water receiving tray pedestal 36, so that the water receiving tray pedestal 36 can be clamped on the outer cylinder 31 and abutted against the bottom of the inner cylinder 32. Through the outer cylinder 31, the inner cylinder 32 and the water receiving tray pedestal 36, two independent spaces are formed inside and outside the inner cylinder 32.

[0065] As Figure 11 shown, after the air enters through the water receiving tray pedestal 36, it reaches the space between the outer cylinder 31 and the inner cylinder 32, and then spirals upward through the cold fins 33 for heat exchange; further, in order to prevent the falling condensate from falling into the air supply channel of the water receiving tray pedestal 36, in this embodiment, a convex platform is provided on the water receiving tray pedestal 36 corresponding to the position between the inner cylinder 32 and the outer cylinder 31. By setting the convex platform, the condensate is prevented from flowing into the air inlet passage 39. At least two convex strips 38 are provided on the convex platform, and an air inlet passage 39 is provided at the top of each convex strip 38. The air enters the space between the outer cylinder 31 and the inner cylinder 32 through the air inlet passage 39, and a drainage channel is formed between two adjacent convex strips 38. Further, the convex platform is inclined, so that the drainage channel has a certain slope, which is convenient for the rapid discharge of condensate.

[0066] In this embodiment, the number of the convex strips 38 is four.

[0067] As an alternative embodiment of the present invention, the hot end fin group 2 includes a sleeve 21 and hot fins 22. The hot fins 22 are arranged on the outer wall of the sleeve 21. The sleeve 21 is sleeved outside the semiconductor refrigeration sheet 1, and the inner wall of the sleeve 21 is in contact connection with the inner wall of the semiconductor refrigeration sheet 1; the hot fins 22 are spirally arranged along the height direction of the sleeve 21 according to the left - hand helix or right - hand helix rule. It should be noted here that the spiral direction of the cold fins 33 is opposite to that of the hot fins 22. That is to say, assuming that the cold fins 33 are spiraled in a right - hand helix manner, then the hot fins 22 are spiraled in a left - hand helix manner. By adopting the reverse spiral arrangement of the cold fins 33 and the hot fins 22, it helps to enhance heat dissipation.

[0068] Further, the widths of all the hot fins 22 along the radial direction of the sleeve 21 are not equal, including wide fins 221 and narrow fins 222.

[0069] Specifically, the narrow fins 222 and the wide fins 221 are alternately welded. There are three narrow fins 222 between two adjacent wide fins 221. By matching three narrow fins 222 with one wide fin 221, the air duct resistance is reduced.

[0070] Further, heat - conducting silicone grease is coated on the contact surfaces of the semiconductor refrigeration sheet 1 with the cold end fin group 3 and the hot end fin group 2. Specifically, heat - conducting silicone grease is coated on the contact surfaces of the sleeve 21 and the semiconductor refrigeration sheet 1, and on the contact surfaces of the outer cylinder 31 and the semiconductor refrigeration sheet 1.

[0071] As Figure 1 andFigure 3 As shown in the figure, the present invention provides a low-temperature device, which includes a barrel body component 10, a base component 20 and an upper end cover component 30 arranged at both ends of the barrel body component 10, and a semiconductor cooling and heating component arranged inside the barrel body component 10. A wind supply component communicated with the semiconductor cooling and heating component is arranged on the base component 20. A heat discharge port for discharging hot air is arranged on the barrel body component 10, and an air discharge port 301 for discharging cold air or natural air is arranged on the upper end cover component 30.

[0072] The heat discharge port is arranged at the upper part of the barrel body component 10, corresponding to the position of the hot end fin group 2; a wind discharge baffle 101 is arranged on the heat discharge port. Natural air absorbs heat through the inner wall of the barrel body component 10 and the hot end fin group 2 outside the semiconductor refrigeration sheet 1 and is then discharged to the outside of the low-temperature device through the heat discharge port. Natural air exchanges heat and cools down through the inner side of the semiconductor refrigeration sheet 1 and the cold end fin group 3, or is discharged to the outside through the air discharge port 301 to cool and refrigerate a specified position, or refrigerates and preserves the items to be cooled placed inside the cold end fin group 3 in the barrel body component 10.

[0073] As Figure 4 shown, further, the upper end cover component 30 includes a top cover 302 and an air outlet cover 303. A taking and placing port 304 is opened at the center of the top cover 302. The diameter of the taking and placing port 304 is equal to the diameter of the inner cylinder 32 in the cold end fin group 3. The items to be preserved are placed into the inner cylinder 32 through the taking and placing port 304 for refrigeration and preservation. A first air outlet 305 for discharging cold air is arranged on the top cover 302 corresponding to the position of the cold end fin group 3. Specifically, the position corresponding to the cold end fin group 3 refers to the position between the outer cylinder 31 and the inner cylinder 32, that is, the position of the cold fins 33. The air outlet cover 303 is covered above the taking and placing port 304 and is screwed to the top cover 302. The air discharge port 301 is arranged on the side wall of the air outlet cover 303. By adjusting the depth and angle of the air outlet cover 303 screwed into the top cover 302, the opening and closing and direction of the air discharge port 301 can be adjusted. By adjusting the depth of the air outlet cover 303 screwed into the top cover 302, the height of the air discharge port 301 can also be adjusted according to requirements.

[0074] Specifically, a threaded section is arranged at the bottom of the side wall of the air outlet cover 303. When the air outlet cover 303 is fully screwed into the top cover 302, the air discharge port 301 can be completely blocked. By controlling the air outlet cover 303 to be screwed out upwards, the air discharge port 301 can be exposed for cold air discharge. Moreover, by adjusting the direction of the air outlet cover 303, the direction of the air discharge port 301 can be changed to blow air in different directions.

[0075] As an alternative embodiment of the present invention, the upper end cover assembly 30 further includes an annular control panel 306, on which control buttons are arranged; inner limiting ring 307 and outer limiting ring 308 are provided on the top cover 302, and the control panel 306 is clamped in the card slot formed by the inner limiting ring 307 and the outer limiting ring 308; the air outlet cover 303 is screwed onto the inner limiting ring 307.

[0076] Specifically, the inner limiting ring 307 is arranged outside the first air outlet 305, the outer limiting ring 308 is arranged at the edge of the top cover 302, and the inner limiting ring 307, the outer limiting ring 308 and the air outlet cover 303 have the same height.

[0077] Furthermore, the first air outlet 305 is a strip-shaped hole, which is uniformly arranged along the circumferential direction of the air outlet cover 303.

[0078] As Figure 5 shown, as an alternative embodiment of the present invention, the base assembly 20 includes a base 201 and a water tank 202. The base 201 and the water tank 202 are spliced together to form a disc-shaped base assembly 20. The base 201 is a fan-shaped structure with a notch, and the water tank 202 is arranged at the front-side notch of the base 201; the water tank 202 is a fan-shaped structure; the air supply assembly includes a first air inlet assembly and a second air inlet assembly arranged on opposite sides inside the base 201. The first air inlet assembly is connected to the cold end fin group 3; the second air inlet assembly is connected to the hot end fin group 2; an inlet 203 connected to the cold end fin group 3 is arranged at the top of the water tank 202.

[0079] The condensed water generated by the cold end fin group 3 all falls on the water receiving tray pedestal 36 at the bottom, and finally the condensed water flows into the water tank 202 through the water leakage holes 37.

[0080] Furthermore, the first air inlet assembly and the second air inlet assembly are respectively hot and cold air diversion assemblies.

[0081] Furthermore, the base 201 is an integral structure, or the base 201 is a split structure, which is formed by docking the upper and lower half seats. If the base cannot be integrally formed by injection molding due to mold design or efficiency issues, this part can be split into two parts, namely the upper and lower half seats, and a base assembly is formed through buckles or the like to achieve air supply guidance and component assembly.

[0082] Furthermore, both the first air inlet assembly and the second air inlet assembly include an air inlet 204, an air inlet duct 205, a fan 206 and an air inlet 207. The air inlet 204 is arranged on the side wall of the base 201, the air inlet duct 205 extends along the circumferential direction of the base 201, the fan 206 is arranged in the air inlet duct 205, and the air inlet 207 is arranged on the top of the base 201.

[0083] There is a socket on the top of the base 201. A filter net 210 is inserted into the socket. The filter net 210 is inserted into the air inlet duct 205 through the socket. An air inlet baffle is arranged on the air inlet 204. There is a jack for inserting the fan on the top of the base 201. The fan 206 is inserted into the air inlet duct 205 after passing through the jack. The air inlets 207 corresponding to the positions of the hot end fin groups 2 are close to the edge of the base 201, and the air inlets 207 corresponding to the positions of the cold end fin groups 3 are arranged close to the interior of the base 201. The two air inlets 207 respectively send natural air into the hot end fin groups 2 and the cold end fin groups 3.

[0084] There is a water tank 202 on the front side of the base 201 for collecting condensed water, and a power cord outlet is reserved on the rear side of the base 201.

[0085] Furthermore, a transparent mirror 208 is arranged on the side wall of the water tank 202 to facilitate observing the water level.

[0086] Furthermore, a float 209 for detecting the water level height is also arranged in the water tank 202 to detect the water level height in the water tank 202.

[0087] As an alternative implementation mode of the present invention, the low-temperature device has four operation modes, namely, a natural air supply mode in which the semiconductor refrigeration sheet 1 is turned off and air is supplied through the air outlet 301; a refrigerated air supply mode in which the semiconductor refrigeration sheet 1 is turned on and air is supplied through the air outlet 301; a refrigerated fresh-keeping mode in which the semiconductor refrigeration sheet 1 is turned on, the rotation speed of the fan 206 in the second air supply component is reduced, and the air outlet 301 is partially closed or completely closed; and a refrigerated dehumidification mode in which the semiconductor refrigeration sheet 1 is turned on, the rotation speed of the fan 206 in the second air supply component is reduced, and air is slowly supplied through the air outlet 301.

[0088] Furthermore, in this embodiment, the low-temperature device is a low-temperature box.

[0089] The low-temperature device provided by the present invention is a new type of semiconductor multi-functional low-temperature box. Based on the structures of traditional dehumidifiers and desktop refrigeration devices, a cylindrical refrigeration sheet and an S-shaped surrounding fin structure are adopted to achieve the effect of external heat dissipation and internal refrigeration. Furthermore, by arranging fans on both the first air inlet component and the second air inlet component and adopting a double-fan structure, the function of the device is enhanced, enabling the desktop device to integrate functions of air supply, cold air, fresh-keeping, and dehumidification. Thermal conductive silicone grease is applied between the semiconductor refrigeration sheet and the thermally conductive hot end fin group. Appropriate air inlet ducts, specifically the cold air duct and the hot air duct, are designed for this new structure; and a condensation water path structure located on the cold end fin group and the base component is convenient for the collection and storage of condensed water flow.

[0090] A control method provided by the present invention, a method for controlling a low-temperature device, includes the following steps:

[0091] Step 100: Power on the low-temperature device and select the operating mode through the control panel.

[0092] Step 200: When the natural ventilation mode is selected, the semiconductor refrigeration chip is not powered on, the fan in the first air supply component is turned on, and the top air outlet is exposed for natural ventilation.

[0093] Step 300: When the refrigeration ventilation mode is selected, the semiconductor refrigeration chip is powered on, the fans in both the first air supply component and the second air supply component are turned on, and the top air outlet is exposed for refrigeration ventilation. As shown, the cold-side fan 206 sucks in air, filters it through the air inlet baffle 211 and the filter screen 210. The air enters the water receiving tray pedestal 36 through the air inlet duct 205 of the base 201, and then enters the S-shaped cold fin 33 air duct in the cold end fin group 3. The cold end S-shaped fins are spiraled according to the left-hand rule, and there are water dropping holes 34 and guiding diversion grooves 35 in the middle, effectively preventing the condensed water caused by bottom air inlet from flowing back to the fan. Subsequently, the cold air is discharged through the first air outlet 305 arranged in the middle of the top cover 302, and finally, according to the arrangement of the air outlet cover 303, the blowing direction is changed. As shown, the hot-side fan 206 sucks in air, filters it through the air inlet baffle 211 and the filter screen 210. The air enters the hot end fin group 2 through the air inlet duct 205 of the base 201. The arrangement of the hot fins 22 strengthens heat dissipation and reduces wind resistance at the same time. Finally, the hot air spirally gathers at the top and is discharged from the exhaust baffle 101 fixed on the barrel body assembly 10. As shown, when the wet air is cooled through the cold air duct in the cold end fin group 3, water droplets will condense, gather around the cold fins 33. The condensed water converges on the water receiving tray pedestal according to the diversion grooves and water dropping holes left by the S-shaped cold fins. At the same time, when cooling the items in the cooling container, the generated water droplets will also drip onto the bottom water receiving tray pedestal. To prevent the condensed water from flowing back to the cold end fan air duct, a convex platform structure is adopted, and convex strips are set on the convex platform structure. An air inlet passage is set at the top of the convex strips, and drainage channels are left on both sides of each row of convex strips. Finally, all the condensed water generated in the device is introduced into the water tank. Figure 7 Shown, the cold air side fan 206 sucks in air, filters it through the air inlet baffle 211 and the filter screen 210. The air passes through the air inlet duct 205 of the base 201 and enters the cold end fin group 3. Among them, the cold end S-shaped fins are arranged in a left-hand rule spiral, and there are water dropping holes 34 and guiding diversion grooves 35 in the middle, effectively preventing the condensed water caused by bottom air inlet from flowing back to the fan. Subsequently, the cold air is discharged through the first air outlet 305 arranged in the middle of the top cover 302, and finally, according to the arrangement of the air outlet cover 303, the blowing direction is changed. As shown, the hot air side fan 206 sucks in air, filters it through the air inlet baffle 211 and the filter screen 210. The air passes through the air inlet duct 205 of the base 201 and enters the hot end fin group 2. Among them, the arrangement of the hot fins 22 strengthens heat dissipation while reducing wind resistance. Finally, the hot air spirally gathers at the top and is discharged from the exhaust baffle 101 fixed on the barrel body assembly 10. As shown, when the wet air is cooled through the cold air duct in the cold end fin group 3, water droplets will condense, gather around the cold fins 33. The condensed water converges on the water receiving tray pedestal according to the diversion grooves and water dropping holes left by the S-shaped cold fins. At the same time, when cooling the items in the cooling container, the generated water droplets will also drip onto the bottom water receiving tray pedestal. To prevent the condensed water from flowing back to the cold end fan air duct, a convex platform structure is adopted, and convex strips are set on the convex platform structure. An air inlet passage is set at the top of the convex strips, and drainage channels are left on both sides of each row of convex strips. Finally, all the condensed water generated in the device is introduced into the water tank. Figure 8 Shown, the hot air side fan 206 sucks in air, filters it through the air inlet baffle 211 and the filter screen 210. The air passes through the air inlet duct 205 of the base 201 and enters the hot end fin group 2. Among them, the arrangement of the hot fins 22 strengthens heat dissipation while reducing wind resistance. Finally, the hot air spirally gathers at the top and is discharged from the exhaust baffle 101 fixed on the barrel body assembly 10. As shown, when the wet air is cooled through the cold air duct in the cold end fin group 3, water droplets will condense, gather around the cold fins 33. The condensed water converges on the water receiving tray pedestal according to the diversion grooves and water dropping holes left by the S-shaped cold fins. At the same time, when cooling the items in the cooling container, the generated water droplets will also drip onto the bottom water receiving tray pedestal. To prevent the condensed water from flowing back to the cold end fan air duct, a convex platform structure is adopted, and convex strips are set on the convex platform structure. An air inlet passage is set at the top of the convex strips, and drainage channels are left on both sides of each row of convex strips. Finally, all the condensed water generated in the device is introduced into the water tank. Figure 9 Shown, when the wet air is cooled through the cold air duct in the cold end fin group 3, water droplets will condense, gather around the cold fins 33. The condensed water converges on the water receiving tray pedestal according to the diversion grooves and water dropping holes left by the S-shaped cold fins. At the same time, when cooling the items in the cooling container, the generated water droplets will also drip onto the bottom water receiving tray pedestal. To prevent the condensed water from flowing back to the cold end fan air duct, a convex platform structure is adopted, and convex strips are set on the convex platform structure. An air inlet passage is set at the top of the convex strips, and drainage channels are left on both sides of each row of convex strips. Finally, all the condensed water generated in the device is introduced into the water tank.

[0094] Step 400: When the refrigeration and preservation mode is selected, the semiconductor refrigeration chip is powered on, the fans in both the first air supply component and the second air supply component are turned on, the fan in the second air supply component runs at a low speed, and the top air outlet is partially closed or completely closed for refrigeration and preservation.

[0095] Step 500: When the refrigeration and dehumidification mode is selected, the semiconductor refrigeration chip is powered on, the fans in both the first air supply component and the second air supply component are turned on, the fan in the second air supply component runs at a low speed, and the top air outlet is opened for slow air supply for refrigeration and dehumidification.

[0096] In steps 200, 300, and 500, the exhaust air direction of the air outlet can also be adjusted by adjusting the angle of the air outlet cover.

[0097] Specifically, there are four functions that can be switched after the device is turned on. In the natural air supply state, the user needs to manually open the top air outlet cover 303 to open the air flow channel, and then the cold air blows sidewise. In the refrigerating air supply state, after the thermoelectric cooler is turned on, the user also needs to open the air channel, and at this time, both the cold and hot side fans are turned on. In the refrigerating and fresh-keeping state, it is up to the user to decide whether to fully open the air channel. By closing part of the air channel (the air outlet cover 303 is semi-rotated into the top cover 302 or fully rotated in), the low wind speed of the cold side fan can reduce the heat exchange in the low-temperature area and ensure a relatively low temperature state in the incubator. The hot air side is turned on at high wind speed to enhance heat exchange and improve the refrigeration efficiency of the thermoelectric cooler. In the refrigerating and dehumidifying state, the air flow channel is opened, the cold side fan is at low wind speed to ensure complete condensation of water vapor on the cold air side, and the hot air side is also at high wind speed to enhance heat dissipation. When the water tank float detects that the water tank is full, the device will immediately stop to protect the equipment.

[0098] For the low-temperature device provided by the present invention, when the thermoelectric cooler is turned off and powered on, the cold side fan is turned on, and the user can adjust the air supply direction by adjusting the top air outlet cover to achieve the air supply function. When the thermoelectric cooler is turned on and powered on, both side fans are turned on. When the top air outlet cover exposes the air outlet, the refrigerating air supply function is achieved. When the air outlet is closed, the refrigerating and fresh-keeping function is achieved. By opening the air outlet and reducing the speed of the cold end fan, the refrigerating and dehumidifying function can be achieved. With a single desktop refrigeration device, the refrigeration needs of the user on the desktop can be met.

[0099] It should be noted here that "inward" is the direction towards the center of the accommodation space, and "outward" is the direction away from the center of the accommodation space.

[0100] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the Figure 1 orientation or positional relationship shown, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0101] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0102] In the present invention, unless otherwise clearly defined and limited, terms such as "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0103] In the present invention, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0104] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0105] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A semiconductor thermoelectric module, characterized in that, It includes a semiconductor refrigeration chip, a hot-end fin group and a cold-end fin group. The semiconductor refrigeration chip has a non-planar structure, and the cold-end fin group and the hot-end fin group are respectively attached to both sides of the semiconductor refrigeration chip. The semiconductor refrigeration chip has a cylindrical structure. The cold-end fin group is arranged inside the semiconductor refrigeration chip, and the hot-end fin group is arranged outside the semiconductor refrigeration chip. The cold-end fin group includes an outer cylinder, an inner cylinder and cold fins. The outer cylinder and the inner cylinder are concentric structures. The cold fins are arranged between the outer cylinder and the inner cylinder and are spirally arranged along the height direction of the outer cylinder according to the right-hand helix or left-hand helix rule. The hot-end fin group includes a sleeve and hot fins. The hot fins are arranged on the outer wall of the sleeve and are spirally arranged along the height direction of the sleeve according to the left-hand helix or right-hand helix rule. All the hot fins have different widths along the radial direction of the sleeve, including wide fins and narrow fins. The cold-end fin group further includes a water-receiving tray pedestal clamped at the bottoms of the outer cylinder and the inner cylinder. On the water-receiving tray pedestal, a boss is arranged corresponding to the position between the inner cylinder and the outer cylinder. At least two convex strips are arranged on the boss, and each top of the convex strips is provided with an air inlet passage.

2. The semiconductor cooling and heating component according to claim 1, characterized in that, The cold fins are provided with water-drop holes.

3. The semiconductor cooling and heating component according to claim 1, wherein On the inner side and / or the outer side of the cold fins, a diversion groove extending along its length direction is arranged.

4. The semiconductor cooling and heating component according to claim 1, characterized in that, All the cold fins have the same width along the radial direction of the outer cylinder.

5. The semiconductor thermoelectric module according to claim 1, wherein The upper surface of the water-receiving tray pedestal is an inclined surface structure with a high edge and a low middle, and a water leakage hole is arranged at the middle position of the water-receiving tray pedestal.

6. The semiconductor cooling and heating component according to claim 1, wherein The narrow fins and the wide fins are arranged alternately, and three narrow fins are arranged between two adjacent wide fins.

7. The semiconductor cooling and heating component according to claim 1, characterized in that, Thermal conductive silicone grease is coated on the contact surfaces of the semiconductor refrigeration chip with the cold-end fin group and the hot-end fin group.

8. A low-temperature device, characterized in that, It includes a barrel body assembly, a base assembly and an upper end cover assembly arranged at both ends of the barrel body assembly, and a semiconductor cooling and heating assembly as described in any one of claims 1-7 arranged in the barrel body assembly. A wind supply assembly communicated with the semiconductor cooling and heating assembly is arranged on the base assembly. A heat discharge port for discharging hot air is arranged on the barrel body assembly, and an air discharge port for discharging cold air or natural air is arranged on the upper end cover assembly.

9. The cryogenic device according to claim 8, characterized in that, The heat discharge port is arranged at the upper part of the barrel body assembly, corresponding to the position of the hot-end fin group. An exhaust baffle is arranged on the heat discharge port.

10. The cryogenic device according to claim 8, characterized in that, The upper end cover assembly includes a top cover and an air outlet cover. A taking and placing opening is opened at the center of the top cover, and the diameter of the taking and placing opening is equal to the diameter of the inner cylinder in the cold-end fin group. A first air outlet for discharging cold air is arranged on the top cover corresponding to the position of the cold-end fin group. The air outlet cover is covered above the taking and placing opening and is screwed to the top cover. The air discharge port is arranged on the side wall of the air outlet cover. By adjusting the depth and angle of the air outlet cover screwed into the top cover, the opening and closing and direction of the air discharge port can be adjusted.

11. The cryogenic device according to claim 10, characterized in that, The upper end cover assembly further includes a control panel. An inner limiting ring and an outer limiting ring are arranged on the top cover. The control panel is clamped in a card slot formed by the inner limiting ring and the outer limiting ring. The air outlet cover is screwed to the inner limiting ring.

12. The cryogenic device according to claim 10, wherein The first air outlet is a strip-shaped hole, which is uniformly arranged along the circumferential direction of the air outlet cover.

13. The cryogenic device according to claim 8, wherein The base assembly includes a base and a water tank. The base and the water tank are spliced together to form the disc-shaped base assembly. The air supply assembly includes a first air inlet assembly and a second air inlet assembly arranged on opposite sides inside the base. The first air inlet assembly is communicated with the cold end fin group. The second air inlet assembly is communicated with the hot end fin group. An inlet is arranged at the top of the water tank and is communicated with the cold end fin group.

14. The cryogenic device according to claim 13, wherein, The base is an integral structure, or the base is a split structure and is formed by docking the upper and lower half seats.

15. The cryogenic device according to claim 13, wherein Both the first air inlet assembly and the second air inlet assembly include an air inlet, an air inlet duct, a fan and an air inlet opening. The air inlet is arranged on the side wall of the base. The air inlet duct extends along the circumferential direction of the base. The fan is arranged in the air inlet duct. The air inlet opening is arranged at the top of the base.

16. The cryogenic device according to claim 13, wherein A transparent mirror is arranged on the side wall of the water tank.

17. The cryogenic device according to claim 13, wherein A float for detecting the water level height is further arranged in the water tank.

18. The cryogenic device according to claim 8, wherein, The low-temperature device has four operating modes, namely, a natural air supply mode in which the semiconductor refrigerating sheet is turned off and air is supplied through the air outlet; A refrigerating air supply mode in which the semiconductor refrigerating sheet is turned on and air is supplied through the air outlet; A refrigerating and fresh-keeping mode in which the semiconductor refrigerating sheet is turned on, the rotation speed of the fan in the second air supply assembly is reduced, the air outlet is partially closed or completely closed; a refrigerating and dehumidifying mode in which the semiconductor refrigerating sheet is turned on, the rotation speed of the fan in the second air supply assembly is reduced, and air is slowly supplied through the air outlet.

19. The cryogenic device according to claim 8, characterized in that, The low-temperature device is a low-temperature box.

20. A control method, characterized in that, A method for controlling the low-temperature device according to any one of claims 8-19 includes the following steps: Step 100: Power on, turn on the low-temperature device, and select an operating mode through the control panel. Step 200: When the natural air supply mode is selected, the semiconductor refrigerating sheet is not powered on, the fan in the first air supply assembly is turned on, and the top air outlet is exposed for natural air supply. Step 300: When the refrigerating air supply mode is selected, the semiconductor refrigerating sheet is powered on, the fans in both the first air supply assembly and the second air supply assembly are turned on, and the top air outlet is exposed for refrigerating air supply. Step 400: When the refrigerating and fresh-keeping mode is selected, the semiconductor refrigerating sheet is powered on, the fans in both the first air supply assembly and the second air supply assembly are turned on, the fan in the second air supply assembly operates at a low speed, and the top air outlet is partially closed or completely closed for refrigerating and fresh-keeping. Step 500: When the refrigerating and dehumidifying mode is selected, the semiconductor refrigerating sheet is powered on, the fans in both the first air supply assembly and the second air supply assembly are turned on, the fan in the second air supply assembly operates at a low speed, and the top air outlet is opened for slow air supply for refrigerating and dehumidifying.

21. The control method according to claim 20, characterized in that, In steps 200, 300 and 500, the air outlet direction of the air outlet can also be adjusted by adjusting the angle of the air outlet cover.

Images