Cooling device for semiconductor process chamber and semiconductor process chamber

Abstract

The present invention provides a cooling device for a semiconductor process chamber and a semiconductor process chamber. The cooling device is used to cool the top wall of the cavity. A fixing plate is connected to the cavity and arranged opposite to the top wall of the cavity to form an accommodation space for installing a cooling pipeline, and is provided with a plurality of through holes corresponding to the air inlets of a plurality of cooling pipelines. The barrier component divides the top wall of the cavity into a middle and edge cooling area, and the accommodation space is divided into a middle and edge cooling space. A plurality of cooling pipelines are arranged in the edge cooling space at intervals. One end of the cooling pipeline is connected to the fixing plate, and is provided with a main pipeline extending in the radial direction of the top wall of the cavity. The pipe wall of the main pipeline is provided with an air outlet facing the top wall of the cavity and having a spacing between the main pipeline and the top wall of the cavity. The cooling device for a semiconductor process chamber and the semiconductor process chamber provided by the present invention can improve the cooling effect of the semiconductor process chamber, thereby reducing the influence of the reflection of the heat source of the semiconductor process chamber, and improving the service life of the semiconductor process chamber.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a cooling device for a process chamber and a process chamber. Background Art

[0002] In the Chemical Vapor Deposition (CVD) process, the temperature in the process chamber can reach about 1100°C. Therefore, the process chamber needs to be made of quartz material to provide the required temperature environment for the process, and the outer surface of the transparent quartz is plated with gold to reflect the heat source into the process chamber with the help of the gold-plated layer, thereby increasing the reflectivity of the heat source and ensuring that the temperature in the process chamber can be maintained within the temperature range required by the process. Metal fixed structures such as racks and transmission structures outside the process chamber can hardly withstand such high temperatures. Therefore, the outside of the process chamber needs to be cooled.

[0003] like Figure 8 As shown in FIG. 1 , an existing method for cooling the outside of the process chamber is to set a cooling device 6 on the top of the process chamber, and the cooling device 6 delivers cold air from two opposite sides of the top of the process chamber to the middle. In addition, a cofferdam 7 is also set on the top of the process chamber, and the cold air flows from the edge of the cofferdam 7 along the arc of the cofferdam 7 to the arc top of the cofferdam 7 (as shown in FIG. Figure 8 However, this will cause the cold air to flow from both sides to the middle, and because the flow distance is long and the area is large, when the cold air flows to the middle of the process chamber, the temperature of the cold air has increased and the wind speed has decreased, resulting in a weakened cooling effect of the cold air on the middle of the process chamber, causing uneven cooling of the outside of the process chamber. In addition, because the edge of the cofferdam 7 has a corner, the cold air in the corner area (such as Figure 8 The wind speed is low and difficult to flow, resulting in poor cooling effect of the cold wind on the corner area. In addition, the cold wind is in the arc top area of ​​the cofferdam 7 (as shown in FIG. Figure 8 The wind speed in the middle area (shown as Q) is low, and the cold wind is blocked by the arc-shaped cofferdam 7. When the cold wind reaches the arc top area, the wind direction will change, resulting in the cold wind may not be able to reach the arc top area of ​​the cofferdam 7, resulting in the corner area and arc top area of ​​the cofferdam 7 forming a "dead zone" with poor cooling effect. In practical applications, due to the uneven cooling of the outside of the process chamber, the gold-plated layer of the process chamber will crack or even fall off, and due to the poor cooling effect of the corner area and arc top area of ​​the cofferdam 7, the gold-plated layer in the corner area and arc top area of ​​the cofferdam 7 will fall off more easily, and due to the poor cooling effect in the middle of the process chamber, the gold-plated layer in the middle of the process chamber will fall off first, affecting the heat source reflection effect and service life of the process chamber. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a cooling device for a semiconductor process chamber and a semiconductor process chamber, which can improve the cooling effect of the semiconductor process chamber, thereby reducing the impact of heat source reflection in the semiconductor process chamber and increasing the service life of the semiconductor process chamber.

[0005] In order to achieve the purpose of the present invention, a cooling device for a semiconductor process chamber is provided, which is arranged on the cavity top wall of the semiconductor process chamber and is used to cool the cavity top wall. The cooling device includes a fixing plate and a plurality of cooling pipelines, wherein:

[0006] The fixing plate is connected to the cavity, and the fixing plate is arranged opposite to the top wall of the cavity to cooperate to form an accommodation space for installing the cooling pipeline;

[0007] The cooling device further comprises a barrier component, wherein the barrier component divides the cavity top wall into an intermediate cooling area and an edge cooling area, the accommodation space is correspondingly divided into an intermediate cooling space and an edge cooling space in correspondence with the cavity top wall, and a plurality of cooling pipelines are arranged at intervals in the edge cooling space for blowing cooling gas to the cavity top wall;

[0008] One end of the cooling pipeline is connected to the fixed plate, and a plurality of through holes are formed on the fixed plate, and the air inlets of the plurality of cooling pipelines are connected one-to-one with the plurality of through holes; the cooling pipeline is provided with a main pipeline extending along the radial direction of the top wall of the cavity, and the pipe wall of the main pipeline is provided with an air outlet facing the top wall of the cavity, and there is a distance between the air outlet and the top wall of the cavity.

[0009] Optionally, the cooling pipeline also includes an air intake duct, one end of which is an air inlet of the cooling pipeline, the air intake duct extends in a vertical direction along the top wall of the cavity and is connected to one end of the main duct; the connection between the air intake duct and the main duct is configured as a bending section for uniformly flowing the cooling gas.

[0010] Optionally, the plurality of cooling pipelines include a plurality of first cooling pipelines and a plurality of second cooling pipelines, wherein:

[0011] The air outlet of the first cooling pipeline is arranged in parallel with the top wall of the cavity, and the air outlet of the second cooling pipeline forms an angle with the top wall of the cavity.

[0012] Optionally, the first cooling pipeline is arranged in the middle position of the edge cooling space, a plurality of the second cooling pipelines are symmetrically arranged on both sides of the first cooling pipeline, and the air outlets of the second cooling pipelines are set in a direction away from the first cooling pipeline.

[0013] Optionally, the barrier assembly includes two arc-shaped barrier plates, and the two arc-shaped barrier plates and the edge of the top wall of the cavity form an edge cooling area; the first cooling pipeline and the second cooling pipeline are arranged in the edge cooling space at intervals along the arc direction of the two arc-shaped barrier plates, and are connected to the fixed plate.

[0014] Optionally, the angle between the air outlet of the second cooling pipeline and the top wall of the cavity is 50°-70°.

[0015] Optionally, the position of the air outlet opening on the pipe wall of the main pipe is from the position where the main pipe is opposite to the arc-shaped baffle plate to the end of the main pipe.

[0016] Optionally, the orthographic projection of the cooling airflow of the second cooling pipeline on the top wall of the cavity is parallel to the tangent line of the arc-shaped baffle plate.

[0017] Optionally, a plurality of air outlet channels are provided in the channel of the cooling pipeline, one end of each of the air outlet channels extends to the air inlet of the cooling pipeline and is connected to the through hole, and the other end of each of the air outlet channels extends to the air outlet of the cooling pipeline, and the plurality of air outlet channels are used to uniformly flow the cooling gas.

[0018] Optionally, an air inlet flange is correspondingly provided on each of the through holes, and the air inlet flange is used to connect with the gas source of the cooling gas. A flow regulating device is provided upstream of each of the air inlet flanges for correspondingly regulating the flow of the cooling gas entering each of the cooling pipelines.

[0019] The present invention further provides a semiconductor process chamber, comprising a cavity and the cooling device provided by the present invention, wherein the cooling device is arranged on the top wall of the cavity and is used to cool the top wall of the cavity.

[0020] The present invention has the following beneficial effects:

[0021] The cooling device of the semiconductor process chamber provided by the present invention arranges a plurality of cooling pipelines at intervals in the edge cooling space of the accommodation space formed by the cooperation of a fixing plate and the cavity top wall, and can use the plurality of cooling pipelines to blow cooling gas to the edge cooling area of ​​the cavity top wall at intervals, thereby avoiding the temperature rise and flow rate reduction caused by the cooling gas flowing from the opposite sides of the cavity top wall to the middle, and avoiding the existence of areas in the edge cooling area that the cooling gas cannot reach, so that the temperature and flow rate of the cooling gas at various locations in the edge cooling area of ​​the cavity top wall are similar, and the cooling gas can reach various locations in the edge cooling area, thereby improving the uniformity of the cooling gas cooling the cavity top wall, improving the cooling effect on the semiconductor process chamber, reducing the probability of cracks or even falling off of the gold-plated layer on the outer surface of the cavity, thereby reducing the influence of the heat source reflection of the semiconductor process chamber, and improving the service life of the semiconductor process chamber.

[0022] The semiconductor process chamber provided by the present invention can improve the cooling effect of the semiconductor process chamber by arranging the cooling device of the semiconductor process chamber provided by the present invention on the top wall of the chamber, thereby reducing the influence of heat source reflection of the semiconductor process chamber and improving the service life of the semiconductor process chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a cooling device for a semiconductor process chamber and a three-dimensional structure of a semiconductor process chamber provided by an embodiment of the present invention;

[0024] Figure 2 A schematic diagram of the main structure of a semiconductor process chamber cooling device and a semiconductor process chamber provided by an embodiment of the present invention;

[0025] Figure 3 for Figure 2 A schematic diagram of the cross-sectional structure viewed from above in the AA direction;

[0026] Figure 4 A schematic diagram of the structure of an intermediate cooling component provided by an embodiment of the present invention;

[0027] Figure 5 for Figure 4 Schematic diagram of the cross-sectional structure in the CC direction;

[0028] Figure 6 A schematic diagram of the structure of an edge cooling component provided by an embodiment of the present invention;

[0029] Figure 7 for Figure 6 Schematic diagram of the cross-sectional structure in the BB direction;

[0030] Figure 8 It is a schematic diagram of a cooling device of an existing semiconductor process chamber and a top view of the structure of the semiconductor process chamber;

[0031] Description of reference numerals:

[0032] 1- cavity; 2- fixing plate; 21- through hole; 3- cooling pipeline; 31- first cooling pipeline;

[0033] 32-second cooling pipeline; 33-main pipeline; 34-air inlet pipeline; 35-air outlet channel; 4-blocking assembly; 41-arc-shaped blocking plate; 5-air inlet flange; 6-cooling device; 7-cofferdam. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the technical solution of the present invention, the cooling device for a semiconductor process chamber and the semiconductor process chamber provided by the present invention are described in detail below with reference to the accompanying drawings.

[0035] like Figure 1-Figure 3 As shown, an embodiment of the present invention provides a cooling device for a semiconductor process chamber, which is arranged on the top wall of a cavity 1 of the semiconductor process chamber and is used to cool the top wall of the cavity 1. The cooling device includes a fixing plate 2 and a plurality of cooling pipes 3, wherein: the fixing plate 2 is connected to the cavity 1, and the fixing plate 2 and the top wall of the cavity 1 are arranged opposite to each other, and the two cooperate to form a receiving space for installing the cooling pipes 3; the cooling device also includes a barrier component 4, and the barrier component 4 divides the top wall of the cavity 1 into an intermediate cooling area and an edge cooling area, and the receiving space and the cooling pipes 3 of the top wall of the cavity 1 are connected to each other. The cooling area is correspondingly divided into an intermediate cooling space and an edge cooling space, and a plurality of cooling pipes 3 are arranged at intervals in the edge cooling space for blowing cooling gas to the top wall of the cavity 1; one end of the cooling pipe 3 is connected to the fixed plate 2, and a plurality of through holes 21 are provided on the fixed plate 2, and the air inlets of the plurality of cooling pipes 3 are connected one by one with the plurality of through holes 21; the cooling pipe 3 is provided with a main pipe 33 extending in a radial direction of the top wall of the cavity 1, and the pipe wall of the main pipe 33 is provided with an air outlet facing the top wall of the cavity 1, and there is a distance between the air outlet and the top wall of the cavity 1.

[0036] The cooling device for a semiconductor process chamber provided by an embodiment of the present invention arranges a plurality of cooling pipes 3 at intervals in the edge cooling space of the accommodation space formed by cooperation between a fixing plate 2 and a top wall of a cavity 1, and can use the plurality of cooling pipes 3 to blow cooling gas at intervals to the edge cooling area of ​​the top wall of the cavity 1, thereby avoiding the temperature rise and flow rate reduction caused by the relative flow of the cooling gas from the opposite sides of the top wall of the cavity 1 to the middle, and avoiding the existence of areas in the edge cooling area that the cooling gas cannot reach, so that the temperature and flow rate of the cooling gas at various locations in the edge cooling area of ​​the top wall of the cavity 1 are similar, and the cooling gas can reach various locations in the edge cooling area, and then the cooling gas can cool the top wall of the cavity 1 uniformly, thereby improving the cooling effect on the semiconductor process chamber, reducing the probability of cracks or even falling off of the gold-plated layer on the outer surface of the cavity 1, thereby reducing the influence of heat source reflection in the semiconductor process chamber, and improving the service life of the semiconductor process chamber.

[0037] Specifically, by connecting the fixing plate 2 to the cavity 1 of the semiconductor process chamber, and arranging the fixing plate 2 and the top wall of the cavity 1 opposite to each other, the fixing plate 2 and the top wall of the cavity 1 can cooperate to form a receiving space for installing the cooling pipeline 3 therebetween, that is, the cooling pipeline 3 can be installed in the receiving space between the relatively arranged fixing plate 2 and the top wall of the cavity 1, thereby realizing the installation of the cooling device and the semiconductor process chamber. With the help of the barrier component 4, the top wall of the cavity 1 is divided into an intermediate cooling area and an edge cooling area, so that the accommodation space between the fixed plate 2 and the top wall of the cavity 1 can be correspondingly divided into an intermediate cooling space and an edge cooling space, wherein the edge cooling area refers to an area close to the edge of the top wall of the cavity 1 relative to the intermediate cooling area, and the edge cooling space refers to an area close to the edge of the accommodation space relative to the intermediate cooling space. By arranging multiple cooling pipes 3 at intervals in the edge cooling space, cooling gas can be blown to the edge cooling area of ​​the top wall of the cavity 1 with the help of multiple cooling pipes 3, and the cooling gas is distributed at intervals in the edge cooling area of ​​the top wall of the cavity 1, thereby avoiding the temperature increase and flow rate reduction caused by the relative flow of the cooling gas from the opposite sides of the top wall of the cavity 1 to the middle, and avoiding the existence of areas in the edge cooling area that the cooling gas cannot reach, so that the temperature and flow rate of the cooling gas at various locations in the edge cooling area of ​​the top wall of the cavity 1 are similar, and the cooling gas can reach various locations in the edge cooling area. In addition, in actual applications, since the intermediate cooling area on the top wall of the cavity 1 is provided with a coil for heating the cavity 1, and the internal area of ​​the cavity 1 corresponding to the intermediate cooling area is the process area, the temperature of the intermediate cooling area is higher than that of the edge cooling area on the top wall of the cavity 1. Therefore, the intermediate cooling area on the top wall of the cavity 1 can be provided with a water cooling device to cool the intermediate cooling area on the top wall of the cavity 1.

[0038] By connecting one end of the cooling pipeline 3 to the fixed plate 2, and opening a plurality of through holes 21 on the fixed plate 2, and making the air inlets of the plurality of cooling pipelines 3 connected to the plurality of through holes 21 one-to-one, cooling gas can be transported to the plurality of cooling pipelines 3 through the plurality of through holes 21 one-to-one, that is, the cooling gas can enter the plurality of cooling pipelines 3 through the plurality of through holes 21 and the air inlets of the plurality of cooling pipelines 3 connected to the plurality of through holes 21 one-to-one in sequence. By providing the cooling pipeline 3 with a main pipeline 33 extending in the radial direction of the top wall of the cavity 1, and opening an air outlet facing the top wall of the cavity 1 on the wall of the main pipeline 33, and making a distance between the air outlet and the top wall of the cavity 1, the cooling gas entering the cooling pipeline 3 can be diffused in the main pipeline 33, and the diffused cooling gas can be blown toward the top wall of the cavity 1 through the air outlet opened on the wall of the main pipeline 33, thereby increasing the area of ​​the cooling gas blown toward the top wall of the cavity 1 through the air outlet, thereby improving the cooling effect of the semiconductor process chamber.

[0039] like Figure 4-Figure 7 As shown, in a preferred embodiment of the present invention, the cooling pipeline 3 may also include an air intake duct 34, one end of which is an air inlet of the cooling pipeline 3, and the air intake duct 34 extends in a vertical direction along the top wall of the cavity and is connected to one end of the main pipeline 33; the connection between the air intake duct 34 and the main pipeline 33 is set as a bending section for uniform flow of cooling gas.

[0040] By making one end of the air intake duct 34 the air inlet of the cooling pipeline 3, and extending the air intake duct 34 in the vertical direction of the top wall of the cavity 1 and connecting with one end of the main pipeline 33, the cooling gas can first enter the air intake duct 34 through the through hole 21 on the fixed plate 2, and then enter the main pipeline 33 through the air intake duct 34. That is to say, the cooling gas enters the air intake duct 34 through the through hole 21 and the end of the air intake duct 34 which is the air inlet of the cooling pipeline 3 in turn, and after passing through the air intake duct 34, enters the main pipeline 33 from the end of the air intake duct 34 connected to the main pipeline 33. By setting the connection between the air inlet pipe 34 and the main pipe 33 as a bending section, the flow direction of the cooling gas can be changed when it passes through the air inlet pipe 34 and enters the main pipe 33, thereby preventing the cooling gas from directly entering the main pipe 33 in the vertical direction, so that the cooling gas can flow into the main pipe 33 evenly, and then the cooling gas can be evenly blown toward the top wall of the cavity 1 through the air outlet, thereby achieving the effect of uniform flow of cooling gas, thereby improving the cooling effect of the semiconductor process chamber.

[0041] like Figure 3-Figure 7As shown, in a preferred embodiment of the present invention, the multiple cooling pipes 3 may include multiple first cooling pipes 31 and multiple second cooling pipes 32, wherein: the air outlet of the first cooling pipe 31 is arranged parallel to the top wall of the cavity 1, and the air outlet of the second cooling pipe 32 has an angle with the top wall of the cavity 1.

[0042] By designing the air outlet of the first cooling pipeline 31 to be arranged parallel to the top wall of the cavity 1, when the first cooling pipeline 31 blows the cooling gas toward the top wall of the cavity 1, the cooling gas can be in vertical contact with the top wall of the cavity 1, so that the cooling gas can flow to the edges of both sides after contacting the top wall of the cavity 1. By designing the air outlet of the second cooling pipeline 32 to have an angle with the top wall of the cavity 1 (such as Figure 6 As shown in the middle angle α), when the second cooling pipeline 32 blows the cooling gas toward the top wall of the cavity 1, the cooling gas can flow toward the edge at an angle with the top wall of the cavity 1, and the cooling gas can be in contact with the top wall of the cavity 1 at an angle, so that the cooling gas can flow toward the edge after contacting the top wall of the cavity 1.

[0043] like Figure 3 As shown, the first cooling pipeline 31 is arranged in the middle position of the edge cooling space (such as Figure 3 The second cooling pipes 32 are symmetrically arranged at intervals on both sides of the first cooling pipe 3 (as shown in the middle area N). Figure 3 The air outlet of the second cooling pipeline 32 is arranged away from the direction of the first cooling pipeline 31.

[0044] That is to say, the first cooling pipeline 31 is arranged in the middle position of the edge cooling space, and the second cooling pipeline 32 is arranged on both sides of the first cooling pipeline 31, relative to the edge of the edge cooling space close to the first cooling pipeline 31, and the second cooling pipelines 32 on both sides of the first cooling pipeline 31 are symmetrically and spaced apart. By arranging the first cooling pipeline 31 in the middle position of the edge cooling space, the first cooling pipeline 31 can be used to blow cooling gas to the middle position of the edge cooling space, and the cooling gas can flow to the edges on both sides after contacting the middle position of the edge cooling space of the top wall of the cavity 1. By arranging the second cooling pipeline 32 symmetrically and spaced apart on both sides of the first cooling pipeline 3, the second cooling pipeline 32 can be used to blow cooling gas to the edges on both sides of the middle position of the edge cooling space, and the cooling gas can flow to the edges on both sides after contacting the edges on both sides of the middle position of the edge cooling space of the top wall of the cavity 1. Thus, the cooling pipeline 3 is arranged in the edge cooling space at intervals by means of the first cooling pipeline 31 and the second cooling pipeline 32, and the cooling gas is blown to the edge cooling area of ​​the top wall of the cavity 1 at intervals. By setting the air outlet of the second cooling pipeline 32 away from the direction of the first cooling pipeline 31, the cooling gas blown toward the top wall of the cavity 1 by the second cooling pipeline 32 can flow toward the edge in the direction away from the first cooling pipeline 31, and the cooling gas blown toward the top wall of the cavity 1 by the second cooling pipeline 32 can flow toward the edge in the direction away from the first cooling pipeline 31 after contacting the top wall of the cavity 1, thereby avoiding the cooling gas blown toward the top wall of the cavity 1 by the second cooling pipeline 32 affecting the flow of the cooling gas blown toward the top wall of the cavity 1 by the first cooling pipeline 31, so as to improve the cooling stability of the cooling device, thereby improving the cooling effect of the semiconductor process chamber.

[0045] Optionally, the angle between the air outlet of the second cooling pipeline 32 and the top wall of the cavity 1 may be 50°-70°.

[0046] Optionally, the angle between the air outlet of the second cooling pipeline 32 and the top wall of the cavity 1 may be 60°.

[0047] like Figure 2 and Figure 3 As shown, in a preferred embodiment of the present invention, the barrier assembly 4 may include two arc-shaped barrier plates 41, and the edges of the two arc-shaped barrier plates 41 and the top wall of the cavity 1 are edge cooling areas; the first cooling pipeline 31 and the second cooling pipeline 32 are arranged in the edge cooling space at intervals along the arc direction of the two arc-shaped barrier plates 41, and are connected to the fixed plate 2.

[0048] That is, the top wall of the cavity 1 is divided into an intermediate cooling area and an edge cooling area by two arc-shaped baffles, so that the accommodation space between the fixing plate 2 and the top wall of the cavity 1 is correspondingly divided into an intermediate cooling space and an edge cooling space, wherein the edge cooling area is the area between the two arc-shaped baffles 41 and the edge of the top wall of the cavity 1, for example, Figure 2 and Figure 3 As shown, the inner arcs of the two arc-shaped baffle plates 41 can be arranged relative to each other to form a structure similar to a "cofferdam". At this time, the area between the inner arcs of the two arc-shaped baffle plates 41 is the intermediate cooling area of ​​the top wall of the cavity 1, which corresponds to the intermediate cooling space of the accommodating space. The area between the outer arcs of the two arc-shaped baffle plates 41 and the edge of the top wall of the cavity 1 is the edge cooling area of ​​the top wall of the cavity 1, which corresponds to the edge cooling space of the accommodating space. By connecting the first cooling pipeline 31 and the second cooling pipeline 32 to the fixed plate 2, the first cooling pipeline 31 and the second cooling pipeline 3 are installed on the cavity 1 through the fixed plate 2. By arranging the first cooling pipeline 31 and the second cooling pipeline 32 in the edge cooling space at intervals along the arc direction of the two arc-shaped baffle plates 41, the cooling gas blown to the top wall of the cavity 1 by the first cooling pipeline 31 and the second cooling pipeline 32 can flow from the arc top area of ​​the arc-shaped baffle plate 41 to the edge along the arc direction of the arc-shaped baffle plate 41 as a whole, forming a vortex-like flow (such as Figure 3 (indicated by the arrow in the middle).

[0049] The inventor of the present invention has found that in the prior art, when the cooling gas flows from the opposite sides to the middle, the flow rate of the cooling gas flowing to the middle is reduced, which will cause the cooling gas to be unable to flow to the arc top area of ​​the arc blocking plate 41, and the arc top area of ​​the arc blocking plate 41 cannot be cooled, causing the gold plating layer in the arc top area of ​​the arc blocking plate 41 to crack or even fall off. Figure 3 As shown, the two side edges of the arc-shaped baffle plate 41 have straight portions, and there is a relatively large corner between the straight portions and the arc-shaped portion of the arc-shaped baffle plate 41. When the cooling gas flows from the opposite sides to the middle, the flow direction of the cooling gas will be parallel to the straight portions of the two side edges of the arc-shaped baffle plate 41. Therefore, the cooling gas may accumulate in the corner area, that is, the cooling gas flowing to the corner area is not easy to flow away from the corner area, resulting in a slower flow rate of the cooling gas in the corner area, a poor cooling effect in the corner area, and cracks or even shedding of the gold-plated layer in the corner area.

[0050] The cooling device for the semiconductor process chamber provided in the embodiment of the present invention, on the one hand, uses the first cooling pipeline 31 to blow cooling gas to the arc top area of ​​the arc baffle plate 41, and enables the cooling gas to flow from the arc top area of ​​the arc baffle plate 41 to the two side edges, thereby avoiding the situation that the cooling gas cannot flow to the arc top area of ​​the arc baffle plate 41, thereby avoiding the situation that the arc top area of ​​the arc baffle plate 41 cannot be cooled, causing the gold-plated layer in the arc top area of ​​the arc baffle plate 41 to crack or even fall off, thereby improving the cooling effect of the semiconductor process chamber, reducing the probability of cracking or even falling off of the gold-plated layer on the outer surface of the cavity 1, thereby reducing the influence of heat source reflection of the semiconductor process chamber, and improving the service life of the semiconductor process chamber. On the other hand, by means of multiple second cooling pipes 32, cooling gas is blown to both sides of the arc top of the arc-shaped baffle plate 41, and the cooling gas is made to flow toward the edge along the arc line of the arc-shaped baffle plate 41, so as to avoid the cooling gas from accumulating in the corner area of ​​the arc-shaped baffle plate 41, thereby improving the cooling effect on the corner area of ​​the arc-shaped baffle plate 41, and then improving the cooling effect on the semiconductor process chamber, reducing the probability of cracks or even falling off of the gold-plated layer on the outer surface of the cavity 1, thereby reducing the influence of the heat source reflection of the semiconductor process chamber and improving the service life of the semiconductor process chamber.

[0051] like Figure 5 As shown, in a preferred embodiment of the present invention, the position where the air outlet opens on the pipe wall of the main pipe 33 is from the position where the main pipe 33 is opposite to the arc-shaped baffle plate 41 to the end of the main pipe 33.

[0052] That is to say, the air outlet is opened on the pipe wall of the main pipe 33 from the side of the main pipe 33 close to the arc-shaped baffle plate 41 to the side of the opposite main pipe 33 away from the arc-shaped baffle plate 41, so that the area of ​​the air outlet can be maximized, thereby maximizing the area of ​​the cooling gas blown to the top wall of the cavity 1 through the air outlet, thereby maximizing the cooling effect of the semiconductor process chamber.

[0053] In a preferred embodiment of the present invention, the orthographic projection of the cooling airflow of the second cooling pipeline 32 on the top wall of the cavity 1 may be parallel to the tangent line of the arc-shaped baffle plate 41 .

[0054] Such a design enables the cooling gas blown by the second cooling pipeline 32 to flow along the arc line of the arc-shaped baffle plate 41 .

[0055] like Figure 5 and Figure 7As shown, in a preferred embodiment of the present invention, a plurality of air outlet channels 35 may be provided in the channel of the cooling pipeline 3, one end of the plurality of air outlet channels 35 extends to the air inlet of the cooling pipeline 3 and is connected to the through hole 21, and the other end extends to the air outlet of the cooling pipeline 3, and the plurality of air outlet channels 35 are used for uniform flow of cooling gas.

[0056] Such a design allows the cooling gas to enter the cooling pipeline 3 through the air inlet of the cooling pipeline 3 and then be evenly distributed in multiple air outlet channels 35, and then be blown from the air outlet to the top wall of the cavity 1 through the multiple air outlet channels 35, so that the cooling gas blown by the cooling pipeline 3 to the top wall of the cavity 1 can be evenly distributed on the top wall of the cavity 1, thereby further improving the uniformity of the cooling of the top wall of the cavity 1 by the cooling gas, and then further improving the cooling effect of the semiconductor process chamber, reducing the probability of cracks or even falling off of the gold-plated layer on the outer surface of the cavity 1, and further reducing the influence of the heat source reflection of the semiconductor process chamber, and further improving the service life of the semiconductor process chamber.

[0057] like Figure 1 and Figure 2 As shown, in a preferred embodiment of the present invention, an air inlet flange 5 can be provided one by one on a plurality of through holes 21, and the air inlet flange 5 is used to be connected to a gas source of the cooling gas. A flow regulating device (not shown in the figure) can be provided upstream of each air inlet flange 5 for correspondingly regulating the flow of the cooling gas entering each cooling pipeline 3.

[0058] That is, by providing the air inlet flanges 5 on the multiple through holes 21 in a one-to-one correspondence and connecting the air inlet flanges 5 with the gas source of the cooling gas, the gas source of the cooling gas can be connected to the fixed plate 2, and the gas source of the cooling gas can be connected to the multiple through holes 21 through the air inlet flanges 5 provided on the multiple through holes 21 in a one-to-one correspondence, so that when the cooling device is cooling, the cooling gas provided by the gas source of the cooling gas can enter the multiple cooling pipelines 3 connected to the multiple through holes 21 in a one-to-one correspondence through the multiple through holes 21. By providing a flow regulating device upstream of each air inlet flange 5, the flow rate of the cooling gas entering each cooling pipeline 3 can be correspondingly adjusted by means of the flow regulating device, so that the flow rate of the cooling gas entering the first cooling pipeline 31 and the second cooling pipeline 32 can be adjusted according to the area of ​​the top wall of the cavity 1 corresponding to the first cooling pipeline 31 and the area of ​​the top wall of the cavity 1 corresponding to the second cooling pipeline 32, and then the flow rate of the cooling gas in the first cooling pipeline 31 and the second cooling pipeline 32 can be appropriately divided and adjusted, so as to improve the utilization rate of the cooling gas.

[0059] Optionally, the flow regulating component may include a wind speed regulating valve.

[0060] An embodiment of the present invention further provides a semiconductor process chamber, comprising a chamber 1 and a cooling device as provided in the embodiment of the present invention, wherein the cooling device is arranged on the top wall of the chamber 1 for cooling the top wall of the chamber 1 .

[0061] The semiconductor process chamber provided by the embodiment of the present invention can improve the cooling effect of the semiconductor process chamber by arranging the cooling device of the semiconductor process chamber provided by the embodiment of the present invention on the top wall of the cavity 1, thereby reducing the influence of the reflection of the heat source of the semiconductor process chamber and improving the service life of the semiconductor process chamber.

[0062] In summary, the cooling device for a semiconductor process chamber and the semiconductor process chamber provided by the present invention can improve the cooling effect on the semiconductor process chamber, thereby reducing the impact of heat source reflection in the semiconductor process chamber and increasing the service life of the semiconductor process chamber.

[0063] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A cooling device for a semiconductor process chamber, arranged on a cavity top wall of the semiconductor process chamber, for cooling the cavity top wall, It is characterized in that The cooling device comprises a fixing plate and a plurality of cooling pipelines, wherein: The fixing plate is connected to the cavity, and the fixing plate is arranged opposite to the top wall of the cavity to cooperate to form an accommodation space for installing the cooling pipeline; The cooling device further comprises a barrier component, wherein the barrier component divides the cavity top wall into an intermediate cooling area and an edge cooling area, the accommodation space is correspondingly divided into an intermediate cooling space and an edge cooling space in correspondence with the cavity top wall, and a plurality of cooling pipelines are arranged at intervals in the edge cooling space for blowing cooling gas to the cavity top wall; One end of the cooling pipeline is connected to the fixed plate, and a plurality of through holes are formed on the fixed plate, and the air inlets of the plurality of cooling pipelines are connected one-to-one with the plurality of through holes; the cooling pipeline is provided with a main pipeline extending along the radial direction of the top wall of the cavity, and the pipe wall of the main pipeline is provided with an air outlet facing the top wall of the cavity, and there is a distance between the air outlet and the top wall of the cavity.

2. The cooling device according to claim 1, It is characterized in that The cooling pipeline also includes an air intake pipe, one end of which is an air inlet of the cooling pipeline. The air intake pipe extends in a vertical direction along the top wall of the cavity and is connected to one end of the main pipe. The connection between the air intake pipe and the main pipe is set as a bending section for uniformly flowing the cooling gas.

3. The cooling device according to claim 1, It is characterized in that The plurality of cooling pipelines include a plurality of first cooling pipelines and a plurality of second cooling pipelines, wherein: The air outlet of the first cooling pipeline is arranged in parallel with the top wall of the cavity, and the air outlet of the second cooling pipeline forms an angle with the top wall of the cavity.

4. The cooling device according to claim 3, It is characterized in that The first cooling pipeline is arranged in the middle position of the edge cooling space, a plurality of the second cooling pipelines are symmetrically arranged on both sides of the first cooling pipeline, and the air outlets of the second cooling pipelines are arranged away from the direction of the first cooling pipeline.

5. The cooling device according to claim 4, It is characterized in that The blocking assembly includes two arc-shaped blocking plates, which form an edge cooling area with the edge of the cavity top wall; the first cooling pipeline and the second cooling pipeline are arranged in the edge cooling space at intervals along the arc direction of the two arc-shaped blocking plates and are connected to the fixed plate.

6. The cooling device according to claim 3, It is characterized in that The included angle between the air outlet of the second cooling pipeline and the top wall of the cavity is 50°-70°.

7. The cooling device according to claim 5, It is characterized in that The position where the air outlet opens on the pipe wall of the main pipe is from the position where the main pipe is opposite to the arc-shaped baffle plate to the end of the main pipe.

8. The cooling device according to claim 5, It is characterized in that The orthographic projection of the cooling airflow of the second cooling pipeline on the top wall of the cavity is parallel to the tangent line of the arc-shaped baffle plate.

9. The cooling device according to claim 1, It is characterized in that A plurality of air outlet channels are arranged in the channel of the cooling pipeline, one end of each of the air outlet channels extends to the air inlet of the cooling pipeline and is connected to the through hole, and the other end of each of the air outlet channels extends to the air outlet of the cooling pipeline, and the plurality of air outlet channels are used to uniformly flow the cooling gas.

10. The cooling device according to claim 1, It is characterized in that An air inlet flange is correspondingly arranged on the plurality of through holes, and the air inlet flange is used to be connected to the gas source of the cooling gas. A flow regulating device is arranged upstream of each of the air inlet flanges, and is used to correspondingly regulate the flow of the cooling gas entering each of the cooling pipelines.

11. A semiconductor process chamber, It is characterized in that It comprises a cavity and a cooling device according to any one of claims 1 to 10, wherein the cooling device is arranged on the top wall of the cavity and is used to cool the top wall of the cavity.

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