A radio frequency microsystem based on non-uniform electromagnetic metamaterials

Abstract

The application relates to the technical field of system-level packaging, and discloses a radio frequency microsystem based on a non-uniform electromagnetic super material, which comprises a chamber, a plurality of electromagnetic radiation sources arranged in the chamber, wherein the plurality of electromagnetic radiation sources are configured to generate electromagnetic radiation with different frequencies, and a non-uniform electromagnetic super material layer comprising a plurality of wave-absorbing areas, wherein the plurality of wave-absorbing areas are configured to absorb electromagnetic radiation with different frequencies.

Description

Technical Field

[0001] This invention generally relates to the field of system-in-package technology. Specifically, this invention relates to a radio frequency microsystem based on a non-uniform electromagnetic metamaterial. Background Technology

[0002] As RF System-in-Package (RF SiP) develops towards high power, multi-chip heterogeneous integration, and miniaturization of RF microsystems, the types of radiation sources in RF SiP within a limited space are increasing. The radiation frequencies and characteristics of each type of radiation source are also different, which leads to an increasingly complex electromagnetic environment within the RF SiP. Therefore, it is necessary to improve the electromagnetic environment to enhance the stability of the system.

[0003] Traditionally, technical solutions for improving the electromagnetic environment typically include shielding and absorption technologies.

[0004] Shielding solutions typically employ grounded metal casings. While metal casings can effectively shield electromagnetic radiation, they cannot absorb electromagnetic waves. Consequently, electromagnetic waves generated by radiation sources within the RF SiP cavity are confined within the metal casing, leading to electromagnetic pollution within the RF SiP cavity and potentially causing cavity resonance and self-excitation. Therefore, a combination of electromagnetic shielding and wave absorption is usually required.

[0005] Traditional absorbing materials are typically composite magnetic materials or porous dielectric materials, capable of absorbing electromagnetic waves in specific frequency bands. However, applying these traditional absorbing materials to RF SiP (System-in-Package) presents several challenges: Firstly, the thickness of traditional absorbing materials is usually on the order of millimeters or centimeters, while the usable space in RF SiP is typically on the order of micrometers, making it difficult for traditional materials to meet the required thickness. Secondly, traditional absorbing materials are usually uniformly distributed, but the types and frequency bands of radiation sources in RF SiP are increasing. Uniformly distributed absorbing materials have a limited absorption band, making it difficult to achieve high absorption rates from multiple radiation sources at multiple frequencies simultaneously. Summary of the Invention

[0006] To at least partially solve the aforementioned problems in the prior art, this invention proposes a radio frequency microsystem based on a non-uniform electromagnetic metamaterial, comprising:

[0007] Chamber;

[0008] A plurality of electromagnetic radiation sources are arranged in the chamber, wherein the plurality of electromagnetic radiation sources are configured to generate electromagnetic radiation of different frequencies; and

[0009] A non-uniform electromagnetic metamaterial layer comprising multiple absorbing regions configured to absorb electromagnetic radiation of different frequencies.

[0010] In one embodiment of the present invention, the non-uniform electromagnetic metamaterial layer comprises:

[0011] substrate;

[0012] An electromagnetic metamaterial unit disposed on a first side of the substrate, wherein the electromagnetic metamaterial is configured to absorb electromagnetic radiation; and

[0013] A metal shielding layer is disposed on the second side of the substrate, wherein the metal shielding layer is configured to shield electromagnetic radiation.

[0014] In one embodiment of the present invention, the plurality of absorbing regions include a variety of electromagnetic metamaterial units, wherein the plurality of electromagnetic metamaterial units are configured to absorb electromagnetic radiation at different frequencies.

[0015] In one embodiment of the present invention, the non-uniform electromagnetic metamaterial layer includes resistive thin film units, wherein the resistive thin film units are arranged at the electromagnetic metamaterial units and / or the resistive thin film units are arranged at the junctions between a plurality of electromagnetic metamaterial units.

[0016] In one embodiment of the present invention, the electromagnetic metamaterial unit is configured to induce electromagnetic radiation to form conduction current and displacement current, and to dissipate energy using the resistance of the electromagnetic metamaterial unit.

[0017] In one embodiment of the invention, the resistive thin film unit is configured to dissipate energy using its resistance.

[0018] In one embodiment of the present invention, the electromagnetic radiation source includes a chip and wire bonding.

[0019] In one embodiment of the present invention, the radio frequency microsystem based on non-uniform electromagnetic metamaterials includes through-silicon vias, ball grid arrays, and resistive capacitors.

[0020] In one embodiment of the present invention, the non-uniform electromagnetic metamaterial layer is constructed by the RDL process.

[0021] This invention offers at least the following advantages: Addressing the challenge of absorbing electromagnetic radiation from multiple sources within the limited space of an RF SiP (Radio Frequency Integrated Platform), this invention proposes a radio frequency microsystem based on a non-uniform electromagnetic metamaterial by utilizing the absorption properties of electromagnetic metamaterials. Specifically, a non-uniform electromagnetic metamaterial layer with a thickness on the micrometer scale can be fabricated using the RDL (Rapid Layer) process. This non-uniform electromagnetic metamaterial layer is divided into multiple absorbing regions, where the repeating unit structure and size of the electromagnetic metamaterial differ in different absorbing regions to correspond to different absorption frequency bands. The non-uniform electromagnetic metamaterial layer, composed of electromagnetic metamaterial units in multiple absorbing regions, can absorb multi-band radiation generated by different types of radiation sources within the RF SiP. Attached Figure Description

[0022] To further illustrate the advantages and other features of the various embodiments of the present invention, a more specific description of the embodiments of the present invention will be presented with reference to the accompanying drawings. It is understood that these drawings depict only typical embodiments of the invention and are therefore not intended to limit its scope. In the drawings, identical or corresponding parts will be indicated by the same or similar reference numerals for clarity.

[0023] Figure 1 A schematic diagram of a radio frequency microsystem based on a non-uniform electromagnetic metamaterial is shown in one embodiment of the present invention.

[0024] Figure 2A-2B The diagram shows a structural schematic and an equivalent circuit schematic of a non-uniform electromagnetic metamaterial layer in one embodiment of the present invention.

[0025] Figure 3 A top view of the non-uniform electromagnetic metamaterial layer described in one embodiment of the present invention is shown. Detailed Implementation

[0026] It should be noted that the components in the various figures may be shown exaggeratedly for illustrative purposes and are not necessarily to scale. In each figure, the same reference numerals are used for components that are identical or have the same function.

[0027] In this invention, unless otherwise specified, "arranged on," "arranged above," and "arranged on" do not exclude the possibility of an intermediate element between them. Furthermore, "arranged on or above" merely indicates the relative positional relationship between two components, and in certain cases, such as when the product orientation is reversed, it can also be converted to "arranged below or under," and vice versa.

[0028] In this invention, the various embodiments are merely intended to illustrate the solutions of the invention and should not be construed as limiting.

[0029] In this invention, unless otherwise specified, the quantifiers “a” and “one” do not exclude scenarios involving multiple elements.

[0030] It should also be noted that, in the embodiments of the present invention, only a portion of the components or parts may be shown for clarity and simplicity. However, those skilled in the art will understand that, under the teachings of the present invention, necessary components or parts can be added as needed for specific scenarios. Furthermore, unless otherwise stated, features in different embodiments of the present invention can be combined with each other. For example, a feature in the second embodiment can replace a corresponding or functionally identical or similar feature in the first embodiment, and the resulting embodiment will also fall within the scope of disclosure or description of this application.

[0031] It should also be noted that, within the scope of this invention, the terms "same," "equal," and "equal to" do not imply that the two values ​​are absolutely equal, but rather allow for a certain reasonable margin of error. In other words, the terms also encompass "substantially the same," "substantially equal," and "substantially equal to." Similarly, in this invention, the directional terms "perpendicular to," "parallel to," etc., also encompass the meanings of "substantially perpendicular to" and "substantially parallel to."

[0032] Furthermore, the numbering of the steps in the methods of the present invention does not limit the execution order of the method steps. Unless otherwise specified, the method steps may be executed in different orders.

[0033] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0034] Figure 1 A schematic diagram of a radio frequency microsystem based on a non-uniform electromagnetic metamaterial is shown in one embodiment of the present invention. Figure 1 As shown, the radio frequency microsystem may include a chamber 101, an electromagnetic metamaterial unit 102, a substrate 103, a metal shielding layer 104, a chip 105, a wire bond 106, a through silicon via 107, a ball grid array (BGA) 108, and a resistive capacitor device 109.

[0035] The chip 105 and the wire bonding 106 are arranged in the cavity 101. The chip 105 may include multiple types, and the wire bonding 106 and the multiple chips 105 can constitute multiple electromagnetic radiation sources, thereby generating electromagnetic radiation with different electromagnetic generation frequencies in the cavity 101, polluting the electromagnetic environment of the cavity.

[0036] The electromagnetic metamaterial unit 102, substrate 103, and metal shielding layer 104 can constitute a non-uniform electromagnetic metamaterial layer. Because multiple chips 105 are heterogeneously integrated within the cavity 101, the electromagnetic field within the cavity 101 is non-uniformly distributed due to the multiple chips 105 and the wire bonding 106. Traditional absorbing materials are typically uniformly distributed, resulting in insufficient absorption. The non-uniform electromagnetic metamaterial layer can be constructed with multiple absorbing regions, which can absorb electromagnetic radiation of different frequencies.

[0037] Figure 2A-2B The diagram shows a structural schematic and an equivalent circuit schematic of a non-uniform electromagnetic metamaterial layer in one embodiment of the present invention.

[0038] like Figure 2A As shown, the non-uniform electromagnetic metamaterial layer may include electromagnetic metamaterial units 201, a substrate 202, a metal shielding layer 203, and resistive thin film units 204. The substrate 202 may be made of silicon. The electromagnetic metamaterial units 201 may be disposed on a first side of the substrate 202, wherein the electromagnetic metamaterial 201 can absorb induced electromagnetic radiation to form conduction current and displacement current, and utilizes the resistance of the electromagnetic metamaterial units 201 to dissipate energy to absorb electromagnetic radiation. The metal shielding layer 203 may be disposed on a second side of the substrate 202, wherein the metal shielding layer 203 can shield electromagnetic radiation to ensure near-zero transmission of electromagnetic waves. The resistive thin film units 204 may be disposed at the electromagnetic metamaterial units 201 and / or the resistive thin film units 204 may be disposed at the connection points between multiple electromagnetic metamaterial units 201, and the resistive thin film units 204 can further dissipate energy to absorb electromagnetic radiation using their resistance.

[0039] The equivalent circuit diagram of the non-uniform electromagnetic metamaterial layer can be as follows: Figure 2B As shown, the wave absorption characteristics of electromagnetic metamaterials can be analyzed using transmission line theory.

[0040] Figure 3 A top view of the non-uniform electromagnetic metamaterial layer described in one embodiment of the present invention is shown. Figure 3 As shown, the non-uniform electromagnetic metamaterial layer can be constructed with multiple absorbing regions, wherein each of the multiple absorbing regions has electromagnetic metamaterial units with different absorbing frequency bands to absorb electromagnetic radiation with different frequencies.

[0041] Figure 3Taking the division of the first to fourth absorbing regions 301-304 as an example, the absorption frequency bands of the first to fourth absorbing regions 301-304 can correspond to the electromagnetic radiation frequency bands generated by the electromagnetic radiation source below the corresponding region. For example, if the main frequency of the electromagnetic radiation generated by the electromagnetic radiation source below the first region 301 is f1, then the center frequency of the absorption frequency band of the electromagnetic metamaterial unit in the first region 301 is f1. Similarly, the center frequency of the absorption frequency band of the second region 302 can be f2, the center frequency of the absorption frequency band of the third region 303 is f3, and the center frequency of the absorption frequency band of the fourth region 304 is f4. In this embodiment, the non-uniform electromagnetic metamaterial layer can absorb electromagnetic radiation with center frequencies of f1, f2, f3, and f4 according to the distribution of the electromagnetic radiation.

[0042] Although various embodiments of the invention have been described above, it should be understood that they are presented by way of example only and not as limitations. It will be apparent to those skilled in the art that various combinations, modifications, and alterations can be made without departing from the spirit and scope of the invention. Therefore, the breadth and scope of the invention disclosed herein should not be limited by the exemplary embodiments disclosed above, but should be defined solely by the appended claims and their equivalents.

Claims

1. A radio frequency microsystem based on a non-uniform electromagnetic metamaterial, characterized in that, include: Chamber; Multiple electromagnetic radiation sources are arranged in the chamber, wherein the multiple electromagnetic radiation sources are configured to generate electromagnetic radiation at different frequencies. as well as A non-uniform electromagnetic metamaterial layer comprising multiple absorbing regions configured to absorb electromagnetic radiation at different frequencies, wherein the absorption band of each of the multiple absorbing regions corresponds to the electromagnetic radiation band generated by an electromagnetic radiation source beneath that region. The non-uniform electromagnetic metamaterial layer includes: substrate; An electromagnetic metamaterial unit is disposed on a first side of the substrate, wherein the electromagnetic metamaterial is configured to absorb electromagnetic radiation. as well as A metal shielding layer is disposed on a second side of the substrate, wherein the metal shielding layer is configured to shield electromagnetic radiation. The plurality of absorbing regions comprise various electromagnetic metamaterial units, which are configured to absorb electromagnetic radiation at different frequencies. The non-uniform electromagnetic metamaterial layer includes resistive thin film units, wherein the resistive thin film units are disposed at the electromagnetic metamaterial units and / or the resistive thin film units are disposed at the junctions between a plurality of electromagnetic metamaterial units.

2. The radio frequency microsystem based on non-uniform electromagnetic metamaterials according to claim 1, characterized in that, The electromagnetic metamaterial unit is configured to induce electromagnetic radiation to generate conduction current and displacement current, and to dissipate energy using the resistance of the electromagnetic metamaterial unit.

3. The radio frequency microsystem based on non-uniform electromagnetic metamaterials according to claim 2, characterized in that, The resistive thin-film unit is configured to dissipate energy using its resistance.

4. The radio frequency microsystem based on non-uniform electromagnetic metamaterials according to claim 1, characterized in that, The electromagnetic radiation source includes a chip and wire bonding.

5. The radio frequency microsystem based on non-uniform electromagnetic metamaterials according to claim 1, characterized in that, This includes through-silicon vias, ball grid arrays, and resistive capacitors.

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