X-ray device

Abstract

The present disclosure provides an X-ray device comprising a flexible substrate, a driver integrated circuit, and a scintillator layer. The flexible substrate comprises an array portion and an extension portion. The driver integrated circuit is disposed on the flexible substrate. The scintillator layer is disposed on the flexible substrate.

Description

Technical Field

[0001] The present disclosure relates to an X-ray device. Background Art

[0002] X-ray devices convert X-rays into visible light through a scintillator. A sensor panel within the device senses the visible light and converts it into an image corresponding to the intensity distribution of the visible light. Generally speaking, an X-ray device includes components such as a scintillator, a sensor panel, a flexible printed circuit board, and a printed circuit board. These components are typically joined together through a bonding process. However, the numerous and complex bonding processes can hinder the X-ray device from achieving high yield, low cost, or lightweight requirements. Summary of the Invention

[0003] The present disclosure provides an X-ray device that helps to improve yield, reduce costs, or achieve lightweighting.

[0004] According to an embodiment of the present disclosure, an X-ray device includes a flexible substrate, a driver integrated circuit, and a scintillator layer. The flexible substrate includes an array portion and an extension portion. The driver integrated circuit is disposed on the flexible substrate. The scintillator layer is disposed on the flexible substrate.

[0005] Based on the above, in the embodiment disclosed herein, since the driver integrated circuit and the scintillator layer are disposed on the flexible substrate, that is, the flexible substrate can integrate components such as the sensor panel, the soft board and the circuit board together, thereby simplifying the complicated bonding process and helping to improve the yield, reduce costs or achieve the purpose of lightweighting.

[0006] To make the above features and advantages of the present disclosure more clearly understood, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure.

[0008] Figure 1 is a schematic cross-sectional view of an X-ray device according to an embodiment of the present disclosure;

[0009] Figure 2 yes Figure 1 Schematic diagram of a top view of the sensing structure in a flattened state;

[0010] Figure 3 is a schematic top view of a sensor structure in a flattened state according to another embodiment of the present disclosure;

[0011] Figure 4 yes Figure 3Schematic cross-sectional view of the sensing structure in the X-ray device;

[0012] Figure 5 is a schematic top view of a sensor structure in a flattened state according to another embodiment of the present disclosure;

[0013] Figure 6 yes Figure 5 A schematic cross-sectional view of the sensing structure in FIG. 1 taken along line AA' in the X-ray device;

[0014] Figure 7 FIG. 4 is a schematic top view of a sensor structure in a flattened state according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0015] The present disclosure will be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, to facilitate understanding and simplify the drawings, many of the drawings in this disclosure depict only portions of electronic devices, and certain components in the drawings are not drawn to scale. Furthermore, the number and dimensions of components in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure. For example, the relative sizes, thicknesses, and positions of various layers, regions, and / or structures may be reduced or exaggerated for clarity.

[0016] Throughout this disclosure and the following claims, certain terms are used to refer to specific components. Those skilled in the art will appreciate that electronic device manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but are named differently. In the following description and claims, words such as "having" and "including" are open-ended and should be interpreted as meaning "including, but not limited to..."

[0017] The directional terms mentioned herein, such as “up,” “down,” “front,” “back,” “left,” “right,” etc., are only directions with reference to the accompanying drawings. Therefore, the directional terms used are for illustration, not for limitation. It should be understood that when an element or a film layer is referred to as being “on” or “connected to” another element or film layer, the element or film layer may be directly on or directly connected to the other element or film layer, or there may be an intervening element or film layer between the two (indirect case). Conversely, when an element or film layer is referred to as being “directly on” or “directly connected to” another element or film layer, there may be no intervening element or film layer between the two. In addition, when an element or film layer is referred to as overlapping another element, the element or film layer at least partially overlaps with the other element or film layer.

[0018] The terms "about," "approximately," "substantially," or "substantially" as used herein generally represent values ​​within 10% of a given value or range, or values ​​within 5%, 3%, 2%, 1%, or 0.5% of a given value or range. In addition, the phrases "a given range is from a first value to a second value," "a given range is within the range from a first value to a second value," and "a given range is within the range from a first value to a second value" indicate that the given range includes the first value, the second value, and other values ​​therebetween.

[0019] In some embodiments of the present disclosure, terms such as "connected" and "interconnected," unless otherwise specified, may refer to two structures being in direct contact, or may refer to two structures not being in direct contact, with another structure positioned between them. Terms such as "connected" and "interconnected" may also include situations where both structures are movable or both structures are fixed. Furthermore, the terms "electrically connected" and "coupled" encompass any direct and indirect electrical connection means.

[0020] In the following embodiments, the same or similar elements will use the same or similar reference numerals, and their redundant description will be omitted. In addition, the features in different embodiments can be mixed and matched as needed as long as they do not violate the spirit of the invention or conflict with each other, and simple equivalent changes and modifications made in accordance with this specification or claims are still within the scope of this disclosure. That is, the following embodiments can replace, reorganize, and mix the technical features in several different embodiments to complete other embodiments without departing from the spirit of this disclosure. In addition, the terms "first", "second", etc. mentioned in this specification or claims are only used to name different elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit on the number of elements, nor are they used to limit the manufacturing order or setting order of the elements.

[0021] Figure 1 FIG. 4 is a schematic cross-sectional view of an X-ray device according to an embodiment of the present disclosure. Figure 2 yes Figure 1 Schematic diagram of a top view of the sensor structure in a flattened state. The top view direction referred to in the present disclosure may be, for example, the z direction.

[0022] Please refer to Figure 1 and Figure 2 The X-ray device 1 may include a sensing structure 10. The sensing structure 10 may include a flexible substrate 100, a scintillator layer 120, a support plate 130, a driver integrated circuit 112, and a driver integrated circuit 114. The flexible substrate 100 may include an array portion 102 and an extension portion 104. The boundary 102A may be the boundary between the array portion 102 and the extension portion 104. The driver integrated circuit 112 and / or the driver integrated circuit 114 may be disposed on the flexible substrate 100. The scintillator layer 120 may be disposed on the flexible substrate 100.

[0023] In some embodiments, the array portion 102 of the flexible substrate 100 may include a plurality of sensing units (not shown) and a plurality of circuits (not shown) electrically connected to the sensing units. In some embodiments, the sensing units may be arranged in an array to generate an image. At least one sensing unit may include one or more switching elements and one or more sensing elements electrically connected to the one or more switching elements. The switching element may include, for example, a thin film transistor, such as a top gate, bottom gate, or dual gate thin film transistor including amorphous silicon, low temperature polysilicon (LTPS), or metal oxide, but is not limited thereto. In some embodiments, different thin film transistors may have the different semiconductor materials mentioned above. The sensing element is suitable for sensing visible light and generating an electronic signal corresponding to the light intensity of the visible light. For example, the sensing element may include a photodiode. However, the arrangement of the sensing units, the number of switching elements included in each sensing unit, the number of sensing elements included in each sensing unit, the type of switching elements or the type of photosensitive elements may be changed as needed, and are not limited to the above. The circuit electrically connected to the sensing unit may include a data line (not shown) and a gate line (not shown). For example, in the case where the switching element is an active element, the gate line may be electrically connected to the gate of the active element; the data line may be electrically connected to the source of the active element; and the drain of the active element may be electrically connected to the sensing element. However, the above-mentioned electrical connection method may vary depending on the number and / or type of sensing elements and / or switching elements, and is not limited to the above.

[0024] In some embodiments, the extension portion 104 of the flexible substrate 100 can be bent to the back side of the array portion 102, allowing the X-ray device 1 to have a narrow-frame design. For example, the extension portion 104 can at least partially overlap with the array portion 102 in the normal direction of the support plate 130 (e.g., the z-direction). Peripheral circuitry originally disposed in the array portion 102 can then be relocated to the extension portion 104, reducing the space surrounding the array portion 102 and achieving a narrow-frame design. In some embodiments, the extension portion 104 of the flexible substrate 100 can be a portion extending from the boundary 102A of the array portion 102 in the x-direction and / or the y-direction. In some embodiments, the x-direction can be a direction substantially parallel to the direction in which the gate lines in the array portion 102 extend, and the y-direction can be a direction substantially parallel to the direction in which the data lines in the array portion 102 extend.

[0025] In some embodiments, the material of the flexible substrate 100 may include, for example, glass, quartz, sapphire, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), or a combination thereof, but is not limited thereto.

[0026] In some embodiments, the driver integrated circuit 112 and / or the driver integrated circuit 114 may be disposed on the extension portion 104 of the flexible substrate 100. Figure 2 In one embodiment, the driver integrated circuit 112 may be disposed in an extension portion 104 of the flexible substrate 100 extending from a boundary 102A of the array portion 102 along the y-direction; and the driver integrated circuit 114 may be disposed in an extension portion 104 of the flexible substrate 100 extending from a side of the array portion 102 along the x-direction, and the x-direction and the y-direction are different directions. The traces (not shown) electrically connecting the driver integrated circuit 112 and / or the driver integrated circuit 114 and the component module 140 may be disposed in the extension portion 104. However, the present disclosure is not limited to the above. In another embodiment, the traces electrically connecting the driver integrated circuit 112 and / or the driver integrated circuit 114 and the component module 140 may be partially disposed on the extension portion 104 of the flexible substrate 100, and another portion of the traces may be disposed on the array portion 102 of the flexible substrate 100. Specifically, the extension portion 104 of the flexible substrate 100 may include circuitry extending from the array portion 102 to the extension portion 104, enabling electrical connection between components in the array portion 102 (e.g., sensor units) and components in the extension portion 104 (e.g., driver integrated circuit 112 and / or driver integrated circuit 114). In yet another embodiment, the driver integrated circuit 112 may be disposed in the extension portion 104 of the flexible substrate 100 extending from one side of the array portion 102 in the x-direction, while the driver integrated circuit 114 may be disposed in the extension portion 104 of the flexible substrate 100 extending from one side of the array portion 102 in the y-direction.

[0027] The driver integrated circuit 112 or the driver integrated circuit 114 can be electrically connected to different circuits according to the design requirements of the X-ray device 1. In one embodiment, if the driver integrated circuit 112 is electrically connected to the data line, the driver integrated circuit 112 can be a read out integrated circuit (ROIC); if the driver integrated circuit 114 is electrically connected to the gate line, the driver integrated circuit 114 can be a gate driver integrated circuit (Gate driver IC), but is not limited thereto. In another embodiment, the driver integrated circuit 112 can be electrically connected to the gate line; and the driver integrated circuit 114 can be electrically connected to the data line. The driver integrated circuit 112 and the driver integrated circuit 114 can be the same as or different from each other. Please refer to Figure 1 and Figure 2 It is worth noting that Figure 1 Two different observation directions can be indicated, and the driver integrated circuit can represent different driver integrated circuits depending on the observation direction. That is to say, if Figure 2 Observe in the observation direction A, then Figure 1 The driving integrated circuit in the embodiment is the driving integrated circuit 112; Figure 2 Observe in the observation direction B, then Figure 1 The driving integrated circuit in the embodiment is the driving integrated circuit 114 .

[0028] In some embodiments, the extension portion 104 of the flexible substrate 100 has a plurality of gaps 106 at the boundary adjacent to the array portion 102 (such as the boundary 102A). In this way, when the extension portion 104 is bent to the back side of the array portion 102, the stress generated by the flexible substrate 100 at the bending portion can be reduced to improve the quality of the process or improve the process yield. However, the present disclosure is not limited to this. In other embodiments, the extension portion 104 of the flexible substrate 100 may not include a plurality of gaps 106 at the boundary adjacent to the array portion 102. In some embodiments, the driver integrated circuit 112 and / or the driver integrated circuit 114 may be disposed between two adjacent gaps 106, but is not limited thereto. It is worth noting that, Figure 2 The plurality of gaps 106 shown are merely an example of the present disclosure, and the present disclosure is not limited thereto. In some embodiments, the shape, quantity, density, or arrangement of the plurality of gaps 106 may not be limited.

[0029] In some embodiments, the scintillator layer 120 may be arranged corresponding to the sensing area in the array unit 102. For example, the scintillator layer 120 may at least partially overlap with the sensing area in the array unit 102 in the normal direction of the support plate 130 (e.g., the z-direction). In some embodiments, the material of the scintillator layer 120 may include cesium iodide (CsI), but is not limited thereto. In other embodiments, the material of the scintillator layer 120 may include other types of inorganic scintillators or organic scintillators suitable for converting X-rays incident into visible light in the X-ray device 1. In some embodiments, the scintillator layer 120 may be formed on the flexible substrate 100 by a deposition process. The deposition process may include, but is not limited to, an evaporation process.

[0030] The support plate 130 can be arranged on the array portion 102 of the flexible substrate 100. In other words, the support plate 130 is arranged corresponding to the array portion 102. In detail, in the normal direction of the support plate 130, the support plate 130 and the array portion 102 at least partially overlap, and the support plate 130 and the scintillator layer 120 are arranged on different sides of the flexible substrate 100. In this way, when other film layers are formed on the array portion 102 of the flexible substrate 100, these film layers are not easily deformed by external forces during the manufacturing process, so that the film layers formed on the flexible substrate 100 (such as the scintillator layer 120) can have good flatness or stability, which helps to improve the yield. In some embodiments, the support plate 130 can be a hard support plate. For example, the material of the support plate 130 may include glass, ceramic or stainless steel, but is not limited thereto. In some embodiments, please refer to Figure 2 In the top view, the array portion 102 can be defined as the portion overlapping with the support plate 130. For example, the boundary 102A can be the boundary line between the array portion 102 and the extension portion 104, or it can be the boundary of the support plate 130. The portion that does not overlap with the support plate 130 can be defined as the extension portion 104.

[0031] In some embodiments, the X-ray device 1 may further include a component module 140. The arrangement and / or quantity of the component module 140 may be changed as needed. In some embodiments, the component module 140 may include passive components, such as capacitors, resistors, or inductors. The component module 140 may be disposed on the extension 104 of the flexible substrate 100. In some embodiments, the component module 140 may be mounted on the extension 104 of the flexible substrate 100 by surface mounting technology (SMT), thereby omitting the circuit board containing the component module and helping to improve yield, reduce costs, or achieve lightweighting, but the present disclosure is not limited thereto.

[0032] In some embodiments, the X-ray device 1 may further include a housing 12. The housing 12 may surround the flexible substrate 100. For details, please refer to Figure 1 The housing 12 may include a light incident portion 12A and a carrying portion 12B. The light incident portion 12A is disposed on the light incident side of the X-ray device 1, wherein the X-ray (eg Figure 1The target arrow (X) enters the X-ray device 1 through the light entrance portion 12A. The material of the light entrance portion 12A may include, but is not limited to, carbon fiber. The support portion 12B is connected to the light entrance portion 12A, and the support portion 12B and the light entrance portion 12A form a space S that at least accommodates the sensor structure 10. In other words, the space S accommodates at least the flexible substrate 100, the driver integrated circuit 112, the driver integrated circuit 114, and the scintillator layer 120. The material of the support portion 12B can be any material suitable for supporting the sensor structure 10, without limitation.

[0033] The following will be Figure 2 The manufacturing method of the sensing structure is described as an example, but the present disclosure is not limited thereto.

[0034] In some embodiments, the sensing structure 10 can be manufactured through the following steps. First, a flexible substrate 100 including an array portion 102 and an extension portion 104 is provided, wherein the flexible substrate 100 may include a scintillator layer 120 formed in the array portion 102. Next, a driver integrated circuit 112 and / or a driver integrated circuit 114 are formed on the extension portion 104 and / or the array portion 102 of the flexible substrate 100. Thereafter, a component module 140 is formed in the extension portion 104 of the flexible substrate 100. In some embodiments, the driver integrated circuit 112 and / or the driver integrated circuit 114 can be formed on the flexible substrate 100 through a bonding process. In some embodiments, the component module 140 can be mounted on the extension portion 104 of the flexible substrate 100 using surface mounting technology.

[0035] Figure 3 FIG. 1 is a schematic top view of a sensor structure in a flattened state according to another embodiment of the present disclosure. Figure 4 yes Figure 3 Schematic cross-sectional view of the sensing structure in the X-ray device. Figure 3 and Figure 4 The sensing structure 20 in Figure 1 and Figure 2 The difference between the sensing structure 10 and the sensing structure 10 is that the extension portion 104 of the flexible substrate 100A does not include the plurality of gaps 106 at the boundary (e.g., boundary 102A) adjacent to the array portion 102, and the sensing structure 20 further includes a carrier 150. Other identical or similar components are numbered identically or similarly. The connection relationship, materials, and manufacturing processes of the remaining components have been described in detail above and will not be repeated here. It is worth noting that although Figure 3The extension portion 104 of the flexible substrate 100A shown does not include multiple gaps 106 at the boundary adjacent to the array portion 102, but this is only one embodiment of the present disclosure. In another embodiment, the extension portion 104 of the flexible substrate 100A may include multiple gaps 106 at the boundary adjacent to the array portion 102.

[0036] Please refer to Figure 3 and Figure 4 The sensing structure 20 in the X-ray device 2 may further include a carrier 150. In some embodiments, the carrier 150 may be disposed on the extension 104, and the carrier 150 and the driver integrated circuit 112 and / or the driver integrated circuit 114 may be disposed on different sides of the flexible substrate 100A. For example, the driver integrated circuit 112 and / or the driver integrated circuit 114 may be disposed on the surface 100A1 of the flexible substrate 100A, and the carrier 150 may be disposed on the surface 100A2 of the flexible substrate 100A, where the surfaces 100A1 and 100A2 are different surfaces and are disposed correspondingly to each other. In another embodiment, the carrier 150 may be a portion of a component left over during the manufacturing process of the X-ray device 2. That is, during the manufacturing process of the X-ray device 2, the flexible substrate 100A may be first disposed on the carrier 150. Components such as the scintillator layer 120, the driver integrated circuit 112, or the driver integrated circuit 114 may then be disposed on the flexible substrate 100A. Then, the carrier 150 and the flexible substrate 100A may be partially separated using, for example, a laser lift-off process, leaving the carrier 150 disposed on the extension 104. This prevents other film layers formed on the extension 104 of the flexible substrate 100A or other components (such as the component module 140, the driver integrated circuit 112, or the driver integrated circuit 114) from being deformed by external forces, thereby ensuring good flatness of the extension 104 or increasing the stability of other film layers formed on the extension 104 or other components (such as the component module 140, the driver integrated circuit 112, or the driver integrated circuit 114), thereby improving yield. In some embodiments, the carrier 150 may be a hard carrier. For example, the material of the carrier 150 may include glass, ceramic or stainless steel, but is not limited thereto. In some embodiments, please refer to Figure 4 The boundary of the extension portion 104 of the flexible substrate 100A (eg, boundary 104A) may be substantially aligned with the boundary of the carrier 150 , but the disclosure is not limited thereto. In another embodiment, the boundary of the carrier 150 may protrude beyond the boundary 104A of the extension portion 104 .

[0037] Figure 5 FIG. 4 is a schematic top view of a sensor structure in a flattened state according to another embodiment of the present disclosure. Figure 6 yes Figure 5Schematic cross-sectional view of the sensing structure in the X-ray device taken along line AA'. Figure 5 and Figure 6 The sensing structure 30 in Figure 3 and Figure 4 The sensing structure 20 in the embodiment of the present invention is different in that the extension portion 104 of the flexible substrate 100B extends from the boundary 102A of the array portion 102 along the y-direction, while the flexible substrate 100B may or may not include the extension portion 104 extending from one side of the array portion 102 along the x-direction. In other words, one side of the array portion 102 may or may not extend along the x-direction, depending on design conditions. Figure 5 The sensing structure 30 in the embodiment further includes a circuit structure 170, which may include multiple wirings. Other identical or similar components are numbered identically or similarly. The connection relationships, materials, and manufacturing processes of the remaining components have been described in detail above, so they will not be repeated hereafter. It should be understood that for a better understanding, some components will be described in detail below. Figure 5 is omitted and / or simplified, but the present disclosure is not limited thereto. Figure 5 Only two traces are drawn, but the present disclosure is not limited thereto. The circuit structure 170 may also include, for example, traces extending in the x-direction. Similarly, Figure 6 The flexible substrate 100B and the scintillator layer 120 may also include other layers, and the driver integrated circuit 114 and the traces, or the traces and the flexible substrate 100B may include other layers. For example, the driver integrated circuit 114 and the traces may include solid transparent optical adhesive (OCA) or anisotropic conductive film (ACF), but the present disclosure is not limited to this. The traces and the flexible substrate 100B may include an insulating layer or a functional layer, and the functional layer may be a flat layer, but the present disclosure is not limited to this. It is worth noting that Figure 5 The boundary of the carrier 150 protruding from the boundary 104A of the extension portion 104 is only an example, and the present disclosure is not limited thereto. In another embodiment, the boundary 104A of the extension portion 104 of the flexible substrate 100B may be substantially aligned with the boundary of the carrier 150. Figure 5 and Figure 6In some embodiments of the present disclosure, the wiring (not shown) electrically connecting the driver integrated circuit 112 and the component module 140 may be disposed in the extension portion 104; and the wiring 170A1 and 170A2 electrically connecting the driver integrated circuit 114 and the component module 140 may be disposed on the array portion 102. In detail, the wiring electrically connecting the driver integrated circuit 114 and the component module 140 uses an array wiring (wire on array, WOA) to connect the component module 140 in series, which can facilitate the design of a narrow frame. In one embodiment, the wiring 170A1 and 170A2 can be disposed, for example, between the driver integrated circuit 114 and the flexible substrate 100B. In some embodiments, the driver circuit 112 can be disposed on the back side of the support plate 130 as the extension portion 104 bends to the back side of the support plate 130. This structure is similar to Figure 4 , and can be used for simultaneous reference. Therefore, the driver integrated circuit 112 and the driver integrated circuit 114 can be located at different levels in the X-ray device 3. In some embodiments, the sensing structure 30 can optionally include a carrier 150. In some embodiments, the driver integrated circuit 114 can be a gate driver integrated circuit and is disposed on the array portion 102. That is, the driver integrated circuit 114 is electrically connected to gate lines (not shown) on the array portion 102.

[0038] Figure 7 FIG. 4 is a schematic top view of a sensor structure in a flattened state according to another embodiment of the present disclosure. Figure 7 The sensing structure 40 in Figure 2 The difference between the sensing structure 10 and the sensing structure 40 is that the sensing structure 40 also includes a circuit board 160. Other identical or similar components use the same or similar reference numerals. The connection relationship, materials and manufacturing processes of the remaining components have been described in detail in the previous text and will not be repeated below.

[0039] Please refer to Figure 7 , the sensing structure 40 further includes a circuit board 160. In some embodiments, the circuit board 160 may be disposed on the extension portion 104. The circuit board 160 may include a component module 140, and the component module 140 is disposed on the circuit board 160, and the driver integrated circuit 112 and / or the driver integrated circuit 114 may be electrically connected to the component module 140 via lines in the circuit board 160. In another embodiment, the circuit board 160 partially overlaps with the extension portion 104 in the normal direction of the support portion 130. In addition, the extension portion 104 of the flexible substrate 100C may selectively include a plurality of gaps at the boundary 102A adjacent to the array portion 102, for example Figure 2In some embodiments, the extension portion 104 of the flexible substrate 100C may extend from one side of the array portion 102 (e.g., the boundary 102A) along the y-direction. In this way, the driver integrated circuit 112 may be electrically connected to the component module 140 via the circuit board 160.

[0040] In another embodiment, the wiring (not shown) electrically connecting the driving circuit 114 and the component module 140 may be provided in the array portion 102. Figure 5 In some embodiments, the driver integrated circuit 114 may be a gate driver integrated circuit and disposed on the array portion 102. Furthermore, the flexible substrate 100C may include or not include an extension 104 extending from one side of the array portion 102 in the x-direction. In other words, one side of the array portion 102 may or may not have an extension 104 extending in the x-direction, depending on the design.

[0041] In summary, in the embodiments disclosed herein, since the driver integrated circuit and the scintillator layer are disposed on the flexible substrate, that is, the flexible substrate can integrate components such as the sensor panel, soft board and / or circuit board together, which can simplify the complicated joining process, help improve the yield, reduce costs or achieve the purpose of lightweighting. In some embodiments, the extension portion of the flexible substrate may have a plurality of gaps at the boundary adjacent to the array portion, so as to reduce the stress generated by the flexible substrate at the bend, thereby improving the quality of the process. In some embodiments, the driver integrated circuit may be disposed on the array portion, and the driver integrated circuit may be connected in series with the component modules in the array portion by means of array wiring, which can help to design a narrow frame. In some embodiments, the sensing structure may further include a support plate disposed on the array portion of the flexible substrate. When other film layers are formed on the array portion of the flexible substrate, these film layers are not easily deformed by external forces during the manufacturing process, so that the film layers formed on the flexible substrate have good flatness or stability, which helps to improve the yield. In some embodiments, the sensing structure may further include a carrier plate placed on the extension portion. In this way, when other film layers are formed or other components are placed on the extension portion of the flexible substrate, these film layers or other components are not easily deformed by external forces during the manufacturing process or the placement process, so that the film layers or other components formed on the flexible substrate have good flatness or stability, which helps to improve the yield.

[0042] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate from the essence of the corresponding technical solutions within the scope of the technical solutions of the embodiments of the present disclosure. As long as the features of the embodiments do not violate the spirit of the invention or conflict with each other, they can be mixed and matched for use.

[0043] Although the embodiments and advantages of the present disclosure have been disclosed above, it should be understood that those skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure, and the features between the embodiments may be arbitrarily mixed and replaced with each other to form other new embodiments. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Those skilled in the art can understand from the content of the present disclosure that the processes, machines, manufacturing, material compositions, devices, methods and steps currently or in the future developed can be used according to the present disclosure as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present disclosure includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present disclosure also includes the combination of each claim and embodiment. The scope of protection of the present disclosure shall be determined by the appended claims.

Claims

1. An X-ray device, characterized in that: include: A flexible substrate comprising an array portion and an extension portion; A driver integrated circuit is provided on the flexible substrate; as well as A scintillator layer is provided on the flexible substrate. The extension portion has a plurality of gaps at a boundary adjacent to the array portion.

2. The X-ray device according to claim 1, characterized in that Also includes: The carrier is arranged on the extending portion, and the carrier and the driving integrated circuit are arranged on different sides of the flexible substrate.

3. The X-ray device according to claim 1, wherein Also includes: A support plate is disposed on the array portion, and the support plate and the scintillator layer are disposed on different sides of the flexible substrate.

4. The X-ray device according to claim 3, characterized in that In a top view direction, the support plate at least partially overlaps with the scintillator layer.

5. The X-ray device according to claim 1, characterized in that Also includes: A plurality of component modules are arranged on the extension portion.

6. The X-ray device according to claim 1, characterized in that The flexible substrate includes polyimide.

7. The X-ray device according to claim 1, characterized in that Also includes: The housing surrounds the flexible substrate.

8. The X-ray device according to claim 1, wherein The driving integrated circuit is a gate driving integrated circuit.

9. The X-ray device according to claim 8, characterized in that Also includes: A circuit structure, wherein the circuit structure includes a plurality of traces, and the plurality of traces are arranged between the gate driver integrated circuit and the flexible substrate.

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