Surface Mounted LED Structure

Abstract

The present invention discloses a surface-mounted lamp bead structure. The surface-mounted lamp bead structure includes a bracket, a bowl cup, a chip, and a plurality of pads. The bracket has the bowl cup; the chip is fixed in the bowl cup and includes at least one first chip and a plurality of second chips, and the plurality of second chips are arranged around at least one first chip; a first color temperature fluorescent glue is coated on the first chip by dispensing, and a second color temperature fluorescent glue covering at least the plurality of second chips is filled in the bowl cup; the plurality of pads are arranged on the bracket, and the chips are distributed on at least two of the pads. The technical solution of the present invention avoids the crossing between the leads of the surface-mounted lamp bead structure and avoids the short circuit of the surface-mounted lamp bead structure.

Description

Technical Field

[0001] The present invention relates to the technical field of lighting, and particularly to a structure of a surface-mounted lamp bead. Background Art

[0002] Currently, common two-color temperature lamp beads mainly fix multiple chips on a bracket, then connect the chips in series or parallel through leads, and then separately apply phosphor pastes with different ratios to the multiple chips to adjust the color temperature, so as to make the lamp beads achieve the two-color temperature effect.

[0003] However, existing products often have problems of crossing between multiple leads, which pose great potential safety hazards during welding. At the same time, the crossing of leads easily causes the collapse between the leads, thus easily causing problems such as short circuits. Summary of the Invention

[0004] The main purpose of the present invention is to provide a structure of a surface-mounted lamp bead, aiming to provide a surface-mounted lamp bead structure without lead crossing, thereby avoiding short circuits in the surface-mounted lamp bead structure.

[0005] To achieve the above object, the surface-mounted lamp bead structure proposed by the present invention includes:

[0006] A bracket having a bowl cup;

[0007] Chips fixed in the bowl cup, including at least one first chip and multiple second chips, and the multiple second chips are arranged around at least one first chip; a first-color-temperature fluorescent glue is applied on the first chip with glue, and a second-color-temperature fluorescent glue covering at least the multiple second chips is filled in the bowl cup; and

[0008] Multiple pads provided on the bracket, and the chips are distributed on at least two of the pads.

[0009] Optionally, the pads include a first pad, a second pad, a third pad, and a fourth pad. The first pad and the second pad are located on one side of the bracket, the third pad and the fourth pad are located on the other side of the bracket, and the first pad is located above the second pad, the fourth pad is located above the third pad. At least one first chip is connected in series or parallel between the first pad and the fourth pad through a lead, and the multiple second chips are connected in series or parallel between the second pad and the third pad through a lead.

[0010] Optionally, the first chip includes a first No. 1 chip and a first No. 2 chip arranged side by side. The second chip includes a second No. 1 chip located on the left side of the first No. 1 chip, a second No. 2 chip located on the lower side of the first No. 1 chip and the first No. 2 chip, a second No. 3 chip located on the right side of the first No. 2 chip, and a second No. 4 chip located on the upper side of the first No. 1 chip and the first No. 2 chip. Among them, the second No. 4 chip is disposed on the fourth pad, and the first No. 1 chip, the first No. 2 chip, the second No. 1 chip, the second No. 2 chip, and the second No. 3 chip are disposed on the second pad.

[0011] Optionally, the first No. 1 chip is connected to the first pad through a first lead, the first No. 1 chip is connected to the first No. 2 chip through a second lead, and the first No. 2 chip is connected to the fourth pad through a third lead. The second No. 1 chip is connected to the second pad through a fourth lead, the second No. 1 chip is connected to the second No. 2 chip through a fifth lead, and the second No. 2 chip is connected to the third pad through a sixth lead. The second No. 4 chip is connected to the second pad through a seventh lead, the second No. 4 chip is connected to the second No. 3 chip through an eighth lead, and the second No. 3 chip is connected to the third pad through a ninth lead. Among them, the first lead is located between the fourth lead and the seventh lead.

[0012] Optionally, the second pad is provided with a lug structure that protrudes toward the upper side of the second pad for soldering the seventh lead.

[0013] Optionally, the third lead is located between the seventh lead and the eighth lead.

[0014] Optionally, the ninth lead is located above the sixth lead.

[0015] Optionally, the first chip includes a first No. 1 chip and a first No. 2 chip arranged side by side. The second chip includes a second No. 1 chip located on the left side of the first No. 1 chip, a second No. 2 chip located on the lower side of the first No. 1 chip and the first No. 2 chip, a second No. 3 chip located on the right side of the first No. 2 chip, and a second No. 4 chip located on the upper side of the first No. 1 chip and the first No. 2 chip. Among them, the second No. 4 chip is disposed on the fourth pad, the second No. 3 chip is located on the third pad, and the first No. 1 chip, the first No. 2 chip, the second No. 1 chip, and the second No. 2 chip are disposed on the second pad.

[0016] Optionally, the first chip includes a first No. 1 chip and a first No. 2 chip arranged side by side, and the second chip includes a second No. 1 chip located on the left side of the first No. 1 chip, a second No. 2 chip located on the lower side of the first No. 1 chip and the first No. 2 chip, a second No. 3 chip located on the right side of the first No. 2 chip, and a second No. 4 chip located on the upper side of the first No. 1 chip and the first No. 2 chip; wherein, the second No. 4 chip is disposed on the fourth pad, the second No. 3 chip is located on the third pad, the second No. 1 chip is disposed on the first pad, and the first No. 1 chip, the first No. 2 chip, and the second No. 2 chip are disposed on the second pad.

[0017] Optionally, the number of the first chips is less than that of the second chips, and the volume of the first chips is larger than that of the second chips.

[0018] One technical solution of the present invention is to provide at least one first chip and a plurality of second chips coated with fluorescent glue of different color temperatures in the patch lamp bead structure, and the plurality of second chips are arranged around the at least one first chip, so that the first chips and the second chips are evenly distributed. Compared with the prior art in which the glue is separated by a bracket, the present invention avoids the problem of the deviation of the light-emitting center point of the lamp bead and the hidden danger of polarized light of the light spot. Thus, when using this patch lamp bead structure, whether it is monochromatic temperature or two-color temperature mixed light illumination, light is emitted in a uniform ring shape with at least one first chip at the center of the bracket as the center point, the light-emitting effect is good, the light efficiency is high, and at the same time, the light distribution and color matching effect of the patch lamp bead structure are improved. At the same time, the chips are distributed on at least two pads, which facilitates the connection between the chips, avoids the problem of lead crossing in the connection between the chips, further avoids the lead collapse easily caused by lead crossing, and further avoids the short circuit caused by lead collapse, thereby improving the service life of the patch lamp bead structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0020] Figure 1 It is a schematic structural diagram of an embodiment of the patch lamp bead structure of the present invention.

[0021] Explanation of the reference numerals in the drawings:

[0022]

[0023]

[0024] The realization, functional features and advantages of the object of the present invention will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners

[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0026] It should be noted that all directional indications (such as up, down, left, right, front, back,...) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0027] In addition, the descriptions involving "first", "second", etc. in the present invention are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, "and / or" throughout the text includes three scenarios. Taking A and / or B as an example, it includes the technical solution of A, the technical solution of B, and the technical solution that both A and B are satisfied. In addition, the technical solutions between the embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0028] Currently, common two-color temperature lamp beads mainly use a bracket to separate glue to achieve two-color display, that is, a barrier line is designed in the middle of the bracket to divide the bracket into two parts. The lamp beads in the two parts are designed with a parallel circuit, and then the color temperature is adjusted by different ratios of phosphor dots on both sides, so as to achieve the effect of two-color temperature. However, for the two-color temperature lamp beads produced by this solution, the problem of the light-emitting center point of the lamp beads shifting will occur during use, and there is also a hidden danger of spot polarization.

[0029] When manufacturing a two-color temperature lamp bead, multiple chips are first fixed on a bracket, and then the chips are connected in series or parallel through leads. Different ratios of phosphor are respectively dot-coated on the multiple chips to adjust the color temperature, so that the lamp bead achieves the effect of two-color temperature. However, in existing products, there are often problems of crossing between multiple leads, which pose great safety hazards during welding. At the same time, the crossing of leads is likely to cause the collapse between the leads, thus easily causing problems such as short circuits, and further easily causing problems such as dead lamps during the production process or use process. In view of this, the present invention proposes a patch lamp bead structure.

[0030] Please refer to Figure 1 , in an embodiment of the present invention, the patch lamp bead structure includes a bracket 10, a bowl cup 20, a chip, and a pad. Among them, the bracket 10 has the bowl cup 20. Specifically, the bracket 10 provides a fixing position for the installation of the chip, and the bowl cup 20 is mainly used to gather the light emitted by the chip. A parabolic curved surface design is often adopted, which can more effectively reduce light loss. In one embodiment, the center of the bowl cup 20 coincides with the center of the bracket 10. In this way, it is more convenient for the chip fixed in the bowl cup 20 to be arranged at the center of the bracket 10, which is beneficial to the uniformity of light output.

[0031] The chip is fixed in the bowl cup 20, including at least one first chip and multiple second chips. The multiple second chips are arranged around the at least one first chip. Specifically, the first chip is located at the center of the bowl cup 20, and the multiple second chips are arranged at intervals along the circumference of the at least one first chip to form an annular structure with the at least one first chip as the center and the multiple second chips arranged around the at least one first chip. In some embodiments, the multiple second chips are evenly spaced along the circumference of the at least one first chip, which is beneficial to the uniformity of light output of the chip.

[0032] The first chip is coated with a first color temperature fluorescent glue by dispensing, and the bowl cup 20 is filled with a second color temperature fluorescent glue that at least covers a plurality of second chips. In one embodiment, the bowl cup 20 is filled with a second color temperature fluorescent glue that covers a plurality of second chips. In this way, the first chip and the second chip emit light of different color temperatures to achieve a two-color temperature display effect. In another embodiment, the bowl cup 20 is filled with a second color temperature fluorescent glue that covers a plurality of second chips and the first color temperature fluorescent glue. That is, in this embodiment, the second color temperature fluorescent glue covers both a plurality of second chips and the first color temperature fluorescent glue at the same time. In this way, it is also possible to make the first chip and the second chip emit light of different color temperatures, thereby achieving a two-color temperature display effect. In the above two embodiments, as long as the phosphor ratio in the first color temperature fluorescent glue and the second color temperature fluorescent glue is well adjusted, the first chip and the second chip can emit the required different color temperature lights. In one embodiment, the first color temperature fluorescent glue coated on the first chip by dispensing is warm white light glue, and the second color temperature fluorescent glue covered on the second chip is positive white light glue. Of course, it can also be that the first color temperature fluorescent glue is positive white light glue and the second color temperature fluorescent glue is warm white light glue. Here, the types of the first color temperature fluorescent glue and the second color temperature fluorescent glue are not limited.

[0033] In this way, the first chip and the second chip are evenly distributed. When using this surface-mounted lamp bead structure, whether it is monochromatic temperature or two-color temperature mixed light illumination, light is emitted in a uniform ring shape with at least one first chip at the center of the bracket 10 as the center point. The light-emitting effect is good and the light efficiency is high. At the same time, compared with the prior art solution of dividing the bracket 10 into two parts by a barrier line and then dispensing glue respectively, the present invention arranges the second chip around the first chip, and dispenses glue on the first chip and the second chip respectively to cover fluorescent glues of different color temperatures, improving the light distribution and color matching effect of the surface-mounted lamp bead structure.

[0034] A plurality of pads are provided on the bracket 10, and the chips are distributed on at least two pads. Specifically, a plurality of pads are provided on the bracket 10, and at the same time, PIN pins corresponding to the pads one by one are provided on the outer side of the bracket 10, so that the surface-mounted lamp bead structure is connected to the peripheral circuit through the PIN pins. The pads provide a welding position for the connection between the chips. The chips are distributed on at least two pads, which facilitates the connection between the chips, avoids the problem of lead crossing in the connection between the chips, and further avoids the lead collapse easily caused by lead crossing, and further avoids the short circuit caused by lead collapse, improving the service life of the surface-mounted lamp bead structure. At the same time, a large amount of heat is generated when the chips are in use. If the chips are not cooled in time, it is easy to make the chip temperature too high, which will cause the chips to burn out and the surface-mounted lamp bead structure cannot be used normally. The pads are generally made of copper material with a relatively high heat dissipation coefficient. The chips are fixed on the pads, and the high-efficiency heat conduction of the pads themselves can transfer the heat generated by the chips faster, so as to achieve the purpose of quickly cooling the chips and making the heat dissipation effect of the chips better.

[0035] One technical solution of the present invention is to provide at least one first chip and multiple second chips with different color temperature fluorescent glue in the surface mount LED structure. The multiple second chips are arranged around the at least one first chip, so that the first chip and the second chips are evenly distributed. Compared with the prior art that separates glue by the bracket 10, the present invention avoids the problem of the deviation of the light-emitting center point of the LED and the hidden danger of polarized light spots. In this way, when using this surface mount LED structure, whether it is monochromatic temperature or two-color temperature mixed light illumination, light is emitted in a uniform ring shape centered on at least one first chip in the center of the bracket 10, with good light-emitting effect and high luminous efficiency. At the same time, the light distribution and color matching effect of the surface mount LED structure are improved. At the same time, the chips are distributed on at least two pads, which facilitates the connection between the chips, avoids the problem of lead crossing in the connection between the chips, further avoids the lead collapse caused by lead crossing, and further avoids the short circuit caused by lead collapse, thus prolonging the service life of the surface mount LED structure.

[0036] Further, the pads include a first pad 51, a second pad 52, a third pad 53, and a fourth pad 54. The first pad 51 and the second pad 52 are located on one side of the bracket 10, and the third pad 53 and the fourth pad 54 are located on the other side of the bracket 10. The first pad 51 is located above the second pad 52, and the fourth pad 54 is located above the third pad 53. At least one first chip is connected in series or in parallel between the first pad 51 and the fourth pad 54 through leads, and multiple second chips are connected in series or in parallel between the second pad 52 and the third pad 53 through leads. In this way, the voltages between at least one first chip and multiple second chips are made similar or equal, which is convenient for controlling dimming and color adjustment.

[0037] Further, in one embodiment, the first chip includes a first No. 1 chip 31 and a second No. 2 chip 32 arranged in parallel. The second chips include a first No. 2 chip 41 on the left side of the first No. 1 chip 31, a second No. 2 chip 42 below the first No. 1 chip 31 and the second No. 2 chip 32, a third No. 2 chip 43 on the right side of the second No. 2 chip 32, and a fourth No. 2 chip 44 above the first No. 1 chip 31 and the second No. 2 chip 32. Among them, the fourth No. 2 chip 44 is arranged on the fourth pad 54, and the first No. 1 chip 31, the second No. 2 chip 32, the first No. 2 chip 41, the second No. 2 chip 42, and the third No. 2 chip 43 are arranged on the second pad 52. In this way, the four second chips are arranged around the two first chips, which is beneficial to the light-emitting uniformity of the chips. Whether it is monochromatic temperature or two-color temperature mixed light illumination, light is emitted in a uniform ring shape centered on the two first chips, with good light-emitting effect and high luminous efficiency. At the same time, arranging the fourth No. 2 chip 44 on the fourth pad 54 and other chips on the second pad 52 is beneficial to the arrangement of the connection leads between the chips, thus avoiding the crossing of multiple leads.

[0038] Further, in one embodiment, the first No. 1 chip 31 is connected to the first pad 51 through the first lead 61, the first No. 1 chip 31 is connected to the second No. 1 chip 32 through the second lead 62, and the second No. 1 chip 32 is connected to the fourth pad 54 through the third lead 63; the first No. 2 chip 41 is connected to the second pad 52 through the fourth lead 64, the first No. 2 chip 41 is connected to the second No. 2 chip 42 through the fifth lead 65, and the second No. 2 chip 42 is connected to the third pad 53 through the sixth lead 66; the fourth No. 2 chip 44 is connected to the second pad 52 through the seventh lead 67, the fourth No. 2 chip 44 is connected to the third No. 2 chip 43 through the eighth lead 68, and the third No. 2 chip 43 is connected to the third pad 53 through the ninth lead 69; wherein, the first lead 61 is located between the fourth lead 64 and the seventh lead 67. In this way, the first lead 61 is arranged between the fourth lead 64 and the seventh lead 67, thus avoiding the crossing between the first lead 61 and the fourth lead 64, and at the same time avoiding the crossing between the first lead 61 and the seventh lead 67, thereby avoiding the lead collapse easily caused by the lead crossing, and further avoiding the short circuit caused by the lead collapse, that is, the short circuit between the first No. 1 chip 31 and the first No. 2 chip 41, and between the first No. 1 chip 31 and the fourth No. 2 chip 44, and improving the service life of the SMD lamp bead structure.

[0039] Furthermore, for the convenience of soldering the seventh lead 67, the second pad 52 is provided with a lug structure 52a, and the lug structure 52a protrudes towards the upper side of the second pad 52 for soldering the seventh lead 67. The setting of the lug structure 52a provides a relatively sufficient soldering position for the seventh lead 67, thus avoiding the contact between the seventh lead 67 and the first No. 1 chip 31 or other chips on the second pad 52, and further avoiding the short circuit between the seventh lead 67 and the first No. 1 chip 31 or other chips on the second pad 52, thereby improving the safety of the circuit connection of the SMD lamp bead structure. In the scheme shown in the figure of the present invention, the lug structure 52a protrudes in an arc shape towards the upper side of the second pad 52. Of course, the lug structure 52a can protrude in a rectangular or triangular shape or other structures towards the upper side of the second pad 52, and the specific shape of the lug structure 52a is not limited herein.

[0040] Furthermore, the third lead 63 is located between the seventh lead 67 and the eighth lead 68. In this way, the third lead 63 is arranged between the seventh lead 67 and the eighth lead 68, thus avoiding the crossing between the third lead 63 and the seventh lead 67, and at the same time avoiding the crossing between the third lead 63 and the eighth lead 68, thereby avoiding the lead collapse easily caused by the lead crossing, and further avoiding the short circuit caused by the lead collapse, that is, the short circuit between the second No. 1 chip 32 and the third No. 2 chip 43, and between the second No. 1 chip 32 and the fourth No. 2 chip 44, and improving the service life of the SMD lamp bead structure.

[0041]

[0041] Further, the ninth lead 69 is located above the sixth lead 66. In this way, by arranging the ninth lead 69 above the sixth lead 66, the crossing between the ninth lead 69 and the sixth lead 66 is avoided, thereby avoiding the lead collapse that is likely to be caused by the lead crossing, and further avoiding the short circuit caused by the lead collapse, that is, the short circuit between the second chip 42 of the second type and the second chip 43 of the third type, and improving the service life of the surface-mounted lamp bead structure.

[0042] Further, in an embodiment, the first chip includes a first chip 31 of the first type and a second chip 32 of the second type arranged in parallel. The second chip includes a second chip 41 of the first type located on the left side of the first chip 31 of the first type, a second chip 42 of the second type located below the first chip 31 of the first type and the second chip 32 of the second type, a second chip 43 of the third type located on the right side of the second chip 32 of the second type, and a second chip 44 of the fourth type located above the first chip 31 of the first type and the second chip 32 of the second type. Among them, the second chip 44 of the fourth type is disposed on the fourth pad 54, the second chip 43 of the third type is located on the third pad 53, and the first chip 31 of the first type, the second chip 32 of the second type, the second chip 41 of the first type, and the second chip 42 of the second type are disposed on the second pad 52. In this embodiment, the chips are distributed on three pads, that is, the second chip 44 of the fourth type is disposed on the fourth pad 54, the second chip 43 of the third type is located on the third pad 53, and the other chips are distributed on the second pad 52. In this way, it is convenient for arranging the leads between the chips, avoiding the crossing between the leads, thereby avoiding the lead collapse that is likely to be caused by the lead crossing, and further avoiding the short circuit caused by the lead collapse, and improving the service life of the surface-mounted lamp bead structure.

[0043] Further, in one embodiment, the first chip includes a first No. 1 chip 31 and a first No. 2 chip 32 arranged in parallel. The second chip includes a second No. 1 chip 41 located on the left side of the first No. 1 chip 31, a second No. 2 chip 42 located on the lower side of the first No. 1 chip 31 and the first No. 2 chip 32, a second No. 3 chip 43 located on the right side of the first No. 2 chip 32, and a second No. 4 chip 44 located on the upper side of the first No. 1 chip 31 and the first No. 2 chip 32. Among them, the second No. 4 chip 44 is disposed on the fourth pad 54, the second No. 3 chip 43 is located on the third pad 53, the second No. 1 chip 41 is disposed on the first pad 51, and the first No. 1 chip 31, the first No. 2 chip 32, and the second No. 2 chip 42 are disposed on the second pad 52. In this embodiment, the chips are distributed on four pads, that is, the second No. 4 chip 44 is disposed on the fourth pad 54, the second No. 3 chip 43 is located on the third pad 53, the second No. 1 chip 41 is disposed on the first pad 51, and the other chips are distributed on the second pad 52. In this way, the arrangement of the leads between the chips is facilitated, the crossing of the leads is avoided, and further, the lead collapse that is likely to be caused by the crossing of the leads is avoided, and further, the short circuit caused by the lead collapse is avoided, thereby improving the service life of the patch lamp bead structure.

[0044] Further, to facilitate the control of dimming and color mixing, the number of the first chips is less than that of the second chips, and the volume of the first chips is larger than that of the second chips. In the chip structure, the larger the volume of the chip, the greater the overload current it can withstand. In this embodiment, the number of the first chips is less than that of the second chips, and a plurality of the second chips are arranged around at least one first chip. At least one first chip is connected in series between two pads, and a plurality of the second chips are connected in parallel between two pads. To make the luminous intensity between the first chip and the second chip similar, that is, the total current in the circuit of the first chip is similar or equal to the total current in the circuit structure of the second chip, the volume of the first chips with a smaller number is made larger than that of the second chips, so that the first chips can carry a larger current, so that the overload currents between the first chip and the second chip are similar or equal, and further, the luminous intensities of the first chip and the second chip are similar, thus facilitating the control of dimming and color mixing.

[0045] The above are only the optional embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. All equivalent structural transformations made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A patch LED structure, characterized in that, Comprising: A bracket having a bowl cup; A chip fixed within the bowl cup, including at least one first chip and a plurality of second chips, the plurality of second chips being arranged around at least one of the first chips; a first color temperature fluorescent glue is coated on the first chip by dotting, and a second color temperature fluorescent glue covering at least the plurality of second chips is filled within the bowl cup; And A plurality of pads provided on the bracket, the chips being distributed on at least two of the pads; The pads include a first pad, a second pad, a third pad, and a fourth pad. The first pad and the second pad are located on one side of the bracket, the third pad and the fourth pad are located on the other side of the bracket, and the first pad is located above the second pad, the fourth pad is located above the third pad. At least one of the first chips is connected in series or in parallel between the first pad and the fourth pad through leads, and the plurality of second chips are connected in series or in parallel between the second pad and the third pad through leads; The first chip includes a first No. 1 chip and a first No. 2 chip arranged in parallel. The second chips include a second No. 1 chip located on the left side of the first No. 1 chip, a second No. 2 chip located below the first No. 1 chip and the first No. 2 chip, a second No. 3 chip located on the right side of the first No. 2 chip, and a second No. 4 chip located above the first No. 1 chip and the first No. 2 chip; Wherein, the second No. 4 chip is provided on the fourth pad, and the first No. 1 chip, the first No. 2 chip, the second No. 1 chip, the second No. 2 chip, and the second No. 3 chip are provided on the second pad; Or, the second No. 4 chip is provided on the fourth pad, the second No. 3 chip is located on the third pad, and the first No. 1 chip, the first No. 2 chip, the second No. 1 chip, and the second No. 2 chip are provided on the second pad; Or, the second No. 4 chip is provided on the fourth pad, the second No. 3 chip is located on the third pad, the second No. 1 chip is provided on the first pad, and the first No. 1 chip, the first No. 2 chip, and the second No. 2 chip are provided on the second pad.

2. The patch lamp bead structure according to claim 1, wherein The first No. 1 chip is connected to the first pad through a first lead, the first No. 1 chip is connected to the first No. 2 chip through a second lead, and the first No. 2 chip is connected to the fourth pad through a third lead; the second No. 1 chip is connected to the second pad through a fourth lead, the second No. 1 chip is connected to the second No. 2 chip through a fifth lead, and the second No. 2 chip is connected to the third pad through a sixth lead; the second No. 4 chip is connected to the second pad through a seventh lead, the second No. 4 chip is connected to the second No. 3 chip through an eighth lead, and the second No. 3 chip is connected to the third pad through a ninth lead; wherein, the first lead is located between the fourth lead and the seventh lead.

3. The SMD lamp bead structure according to claim 2, wherein, The second pad is provided with a lug structure protruding towards the upper side of the second pad for soldering the seventh lead.

4. The patch LED structure according to claim 2, wherein, The third lead is located between the seventh lead and the eighth lead.

5. The patch LED structure according to claim 2, wherein, The ninth lead is located above the sixth lead.

6. The patch LED structure according to claim 1, characterized in that The number of the first chips is less than that of the second chips, and the volume of the first chips is larger than that of the second chips.

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