A display panel and its manufacturing method

Abstract

This application discloses a display panel and its fabrication method, belonging to the field of display technology. The display panel provided in this application includes a substrate layer, an etch stop layer, and a light-emitting layer in the transition area between the display area and the aperture. The substrate layer has a partition groove, and the opening size of the partition groove gradually decreases near the bottom in the direction from the substrate layer to the etch stop layer. The etch stop layer has a first through-channel corresponding to and communicating with the partition groove. The light-emitting layer covers the side of the etch stop layer away from the substrate layer and part of the bottom of the partition groove, and the light-emitting layer covering the etch stop layer is disconnected from the light-emitting layer covering the bottom portion. The etch stop layer simplifies the process of forming the partition groove, disconnects the light-emitting layer, interrupts the continuous water and oxygen intrusion path within the aperture, and extends the water and oxygen intrusion path, protecting the light-emitting layer and array layer located in the display area and reducing their probability of being eroded by water and oxygen.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and a method for manufacturing the same. Background Technology

[0002] With the development of display technology, the penetration rate of smart terminals such as mobile phones and tablets with OLED display panels is increasing, and consumers' demands for screen-to-body ratio are also rising. Punch-hole screens have become a mainstream method to improve screen-to-body ratio, which involves creating a through-hole in the display panel to facilitate the placement of devices such as cameras, earpieces, and sensors below the hole, thereby increasing the screen-to-body ratio. However, after punching the hole, moisture and oxygen in the air can easily penetrate the display area through the sidewalls of the hole, corroding the functional film layers such as the light-emitting layer and array layer of the display area, affecting the reliability and display effect of the display panel. Summary of the Invention

[0003] The main technical problem addressed by this application is to provide a display panel and a method for manufacturing the same, which can improve the reliability and display effect of the display panel.

[0004] To solve the above-mentioned technical problems, one technical solution adopted in this application is: providing a display panel with a through opening, the display panel defining a display area and a transition area, the transition area being located between the display area and the opening, and the display panel located in the transition area comprising:

[0005] A substrate layer, wherein at least one partition groove is provided on the first surface of the substrate layer;

[0006] An etching barrier layer covers the first surface, the etching barrier layer is provided with at least one first through groove, and one first through groove is correspondingly connected to one of the partition grooves; wherein, in the direction from the substrate layer to the etching barrier layer, the opening size of the partition groove near the bottom gradually decreases;

[0007] The light-emitting layer covers the side of the etch barrier layer away from the substrate layer and a portion of the bottom of the partition trench, and the light-emitting layer covering the etch barrier layer and the light-emitting layer covering the portion of the bottom of the partition trench are disconnected from each other.

[0008] The display panel located in the display area includes: a substrate layer, an array layer, and a light-emitting layer stacked sequentially; wherein the array layer includes at least one metal layer, and the etching barrier layer is formed by extending at least one of the metal layers to the transition area.

[0009] In the direction from the substrate layer to the etch barrier layer, the array layer includes a plurality of stacked metal layers, and the metal layer closest to the substrate layer extends to the transition region to form the etch barrier layer.

[0010] The partition grooves are multiple in number, arranged in a ring, and sequentially fitted around the opening.

[0011] The partition groove includes a first part, the opening size of which gradually decreases in the direction from the substrate layer to the etch barrier layer; or, the partition groove includes a first part and a second part, the opening size of which gradually decreases in the direction from the substrate layer to the etch barrier layer, and the side of the first part with the smallest opening size is connected to the second part.

[0012] The display panel located in the transition area further includes an encapsulation layer, which continuously covers the light-emitting layer located on the etch barrier layer, the sidewall of the first through-slot, the sidewall of the partition slot, and the light-emitting layer located at the bottom of the partition slot.

[0013] To solve the above-mentioned technical problems, another technical solution adopted in this application is: providing a method for manufacturing a display panel, comprising:

[0014] A substrate layer is provided, the substrate layer defining an opening region, a transition region and a display region, wherein the transition region is located between the display region and the opening region;

[0015] A patterned etch barrier layer is formed on one side surface of the substrate layer located in the aperture region and the transition region, wherein at least one first through-hole is formed on the etch barrier layer, and a portion of the substrate layer is exposed from the first through-hole;

[0016] Using the etching barrier layer as a mask, the portion of the substrate layer exposed from the first through-hole is etched away to form at least one partition trench on the substrate layer; wherein, one of the first through-holes is connected to one of the partition trenches, and the opening size of the partition trench near the bottom gradually decreases in the direction from the substrate layer to the etching barrier layer.

[0017] A light-emitting layer is formed, which covers the side of the etch barrier layer away from the substrate layer and a portion of the bottom of the partition trench, and the light-emitting layer covering the etch barrier layer and the light-emitting layer covering the portion of the bottom of the partition trench are disconnected from each other;

[0018] A through opening is formed corresponding to the opening area.

[0019] The method further includes, after the step of providing the substrate layer:

[0020] A patterned array layer is formed on one side surface of the substrate layer located in the display area; wherein the array layer includes at least one metal layer, and wherein at least one of the metal layers extends to the transition region and the aperture region to form the etching barrier layer.

[0021] The step of using the etch barrier layer as a mask to etch away the substrate layer exposed from the first through-hole to form at least one isolation trench on the substrate layer includes:

[0022] Using the etch barrier layer as a mask, the portion of the substrate layer exposed from the first through-hole is etched away to form the first portion of the partition trench; wherein, in the direction from the substrate layer to the etch barrier layer, the opening size of the first portion gradually decreases; or...

[0023] Using the etch barrier layer as a mask, the portion of the substrate layer exposed from the first through-hole is etched away to form the second part of the partition trench; the portion of the substrate layer exposed from the second part is etched away to form the first part of the partition trench; wherein, in the direction from the substrate layer to the etch barrier layer, the opening size of the first part gradually decreases, and the side with the smallest opening size of the first part is connected to the second part.

[0024] The step of forming the light-emitting layer includes: forming the light-emitting layer on the side surface of the array layer and the etch barrier layer facing away from the substrate layer;

[0025] After the step of forming the light-emitting layer, the method further includes: forming an encapsulation layer on the surface of the light-emitting layer opposite to the substrate layer, the encapsulation layer continuously covering the light-emitting layer, the sidewall of the first through-hole, the sidewall of the partition groove, and the light-emitting layer located at the bottom of the partition groove on the array layer and the etch barrier layer.

[0026] The beneficial effects of this application are as follows: Unlike existing technologies, the display panel provided in this application includes a substrate layer, an etch stop layer, and a light-emitting layer in the transition area between the display area and the aperture. The substrate layer has a partition groove, and the opening size of the partition groove gradually decreases near the bottom in the direction from the substrate layer to the etch stop layer. The etch stop layer has a first through-channel corresponding to and communicating with the partition groove. The light-emitting layer covers the side of the etch stop layer away from the substrate layer and part of the bottom of the partition groove. The light-emitting layer covering the etch stop layer and the light-emitting layer covering part of the bottom of the partition groove are disconnected from each other. The etch stop layer simplifies the process of forming the partition groove and disconnects the subsequently formed light-emitting layer, thus interrupting the continuous intrusion path of water and oxygen within the aperture. Furthermore, the partition groove extends the water and oxygen intrusion path, thereby protecting the light-emitting layer and array layer located in the display area, reducing their erosion by water and oxygen, and improving the reliability and display effect of the display panel. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0028] Figure 1 This is a schematic diagram of the structure of one embodiment of the display panel of this application;

[0029] Figure 2 for Figure 1 A schematic diagram of the cross-section along the AA direction;

[0030] Figure 3 This is a schematic diagram of another embodiment of the display panel of this application;

[0031] Figure 4 for Figure 1 Enlarged view of the dashed box;

[0032] Figure 5 This is a schematic flowchart of one embodiment of the method for manufacturing the display panel of this application;

[0033] Figure 6a for Figure 5 A schematic diagram of the structure corresponding to the implementation method of step S11;

[0034] Figure 6b for Figure 5 A schematic diagram of the structure corresponding to the implementation method of step S12;

[0035] Figure 6c for Figure 6bA schematic diagram of the cross-section along the N-N direction;

[0036] Figure 6d for Figure 5 A schematic diagram of the structure corresponding to the implementation method of step S13;

[0037] Figure 6e for Figure 5 A schematic diagram of the structure corresponding to the implementation method of step S14 in the middle section;

[0038] Figure 6f A schematic diagram of the structure corresponding to one embodiment of forming the encapsulation layer;

[0039] Figure 7a for Figure 5 A schematic diagram of the structure corresponding to another embodiment of step S13;

[0040] Figure 7b for Figure 5 A schematic diagram of the structure corresponding to another embodiment of step S14. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of one embodiment of the display panel of this application. Figure 2 for Figure 1 A cross-sectional diagram along the AA direction is shown. The display panel has a through opening H. The display panel defines a display area 110 and a transition area 120, where the transition area 120 is located between the display area 110 and the opening H. The display area 110 has a display function, while the transition area 120 is the remaining non-display function part after the opening H is cut, and it can protect the display area 110.

[0043] Specifically, the display panel located in the transition region 120 includes a substrate layer 11, an etch barrier layer 12, and a light-emitting layer 13. The first surface of the substrate layer 11 has at least one partition groove B. In the direction from the substrate layer 11 to the etch barrier layer 12, the opening size of the partition groove B near its bottom gradually decreases, forming an undercut structure. The etch barrier layer 12 covers the first surface of the substrate layer 11 and has at least one first through-slot C, with each first through-slot C corresponding to and communicating with one partition groove B. The light-emitting layer 13 covers the side of the etch barrier layer 12 facing away from the substrate layer 11 and a portion of the bottom of the partition groove B. The light-emitting layer 13 covering the etch barrier layer 12 is disconnected from the light-emitting layer 13 covering the portion of the bottom of the partition groove B.

[0044] As can be seen, the etching barrier layer 12 can serve as an etching mask for forming the partition groove B, simplifying the process of forming the partition groove B. Furthermore, after forming the partition groove B with the undercut structure, when forming the light-emitting layer 13, it is disconnected at the sidewall of the partition groove B. This interrupts the continuous intrusion path of water and oxygen along the light-emitting layer 13 within the opening H. The partition groove B also extends the water and oxygen intrusion path, thereby protecting the light-emitting layer located in the display area 110, reducing its likelihood of being eroded by water and oxygen, and improving the reliability and display effect of the display panel.

[0045] In one implementation, please refer to [link / reference needed]. Figure 1 and Figure 2 The display panel located in the display area 110 includes a substrate layer 11, an array layer 14, and a light-emitting layer 13 stacked sequentially. The substrate layer 11 and the substrate layer 11 of the transition area 120 are the same functional film layer, and the light-emitting layer 13 and the light-emitting layer 13 of the transition area 120 are the same functional film layer. The array layer 14 is located only in the display area 110 and includes at least one metal layer (not shown). The etching barrier layer 12 of the transition area 120 is formed by extending from at least one of the metal layers into the transition area 120. That is, when forming at least one of the metal layers, at least one first through-hole C is formed on its corresponding portion of the transition area 120, serving as an etching barrier layer for forming the isolation trench B. This simplifies the process of forming the isolation trench B, eliminates the need for an additional etching barrier layer in the transition area 120, increases production capacity, and reduces costs.

[0046] Specifically, the light-emitting layer 13 may include carrier injection layers, carrier transport layers, organic light-emitting material layers, etc., as in the prior art. The array layer 14 may include various functional film layers used to drive the light-emitting layer 13, such as semiconductor layers, insulating layers, metal layers, anode layers, organic planarization layers, pixel definition layers, etc. In this embodiment, preferably, the metal layer closest to the substrate layer 11 is extended to the transition region 120 in the direction from the substrate layer 11 to the etch stop layer 12 to form the aforementioned etch stop layer 12. Specifically, the metal layer closest to the substrate layer 11 is a patterned metal shielding layer closely attached to the surface of the substrate layer 11, used to shield a portion of the TFTs in the array layer 14 to improve their stability. When patterning it, the portion corresponding to the transition region 120 is patterned simultaneously to form the etch stop layer 12.

[0047] For further information, please refer to [link / reference]. Figure 1 and Figure 2 The partition groove B includes a first part and a second part. In the direction from the substrate layer 11 to the etch barrier layer 12, the opening size of the first part gradually decreases, and the side with the smallest opening size of the first part is connected to the second part.

[0048] Specifically, the substrate layer 11 includes at least one sublayer formed by stacked organic layers 111 and inorganic layers 112. In the same sublayer, the inorganic layer 112 is closer to the etch barrier layer 12 than the organic layer 111. The partition groove B penetrates the inorganic layer 112 and part of the organic layer 111 in the sublayer closest to the etch barrier layer 12. The part of the partition groove B that penetrates the inorganic layer 112 is the second part, and the part that penetrates part of the organic layer 111 is the first part. In the direction from the substrate layer 11 to the etch barrier layer 12, the opening size of the first part of the partition groove B in the organic layer 111 gradually decreases. That is, the first part of the partition groove B in the organic layer 111 forms an undercut structure. This arrangement causes the subsequently formed light-emitting layer 13 to be interrupted at this point, forming a portion covering the etch barrier layer 12 and a portion covering the bottom of the partition groove B. This reduces the probability of the light-emitting layer 13 and the array layer 14 of the display area 110 being eroded by water and oxygen, improving the reliability and display effect of the display panel.

[0049] In other embodiments, the first portion is not limited to being located in the organic layer 111, and the second portion is not limited to being located in the inorganic layer 112. For example, the second portion may simultaneously penetrate both the organic layer 111 and the inorganic layer 112 in the sublayer closest to the etch barrier layer 12, and the first portion may also penetrate the organic layer 111 in the sublayer furthest from the etch barrier layer 12. Furthermore, the shape of the second portion is not limited to... Figure 2 As shown.

[0050] For further information, please refer to [link / reference]. Figure 1 and Figure 2The display panel located in the transition area 120 also includes an encapsulation layer 15, which continuously covers the light-emitting layer 13 on the etch barrier layer 12, the sidewall of the first through-slot C, the sidewall of the partition slot B, and the light-emitting layer 13 at the bottom of the partition slot B. Of course, the display area 110 also has an encapsulation layer 15, covering the surface of the light-emitting layer 13 of the display area 110. Specifically, the encapsulation layer 15 can protect the internal structure of the display panel and isolate it from the external environment. Specifically, it can be an alternately stacked inorganic-organic structure, similar to existing technologies, and will not be described in detail here.

[0051] In one implementation, please refer to Figure 1 See Figure 3 , Figure 3 This is a schematic diagram of the structure of one embodiment of the display panel of this application, and... Figure 2 Unlike the embodiment shown, in this embodiment, the partition groove B includes a first part, the opening size of which gradually decreases in the direction from the substrate layer 11 to the etch barrier layer 12.

[0052] Specifically, the partition groove B penetrates at least a portion of the inorganic layer 112 in the sublayer closest to the etch barrier layer 12. Figure 3 The diagram schematically illustrates the portion of the inorganic layer 112 that is penetrated by the partition groove B. In other embodiments, the entire inorganic layer 112 may be penetrated, meaning the underlying organic layer 111 is exposed from the bottom of the partition groove B. Alternatively, both the inorganic layer 112 and the organic layer 111 may be penetrated; the method is not limited to this. Figure 3 As shown.

[0053] In the direction from the substrate layer 11 to the etch barrier layer 12, the opening size of the first portion of the partition trench B gradually decreases, meaning that the first portion of the partition trench B in the inorganic layer 112 forms an undercut structure. This arrangement causes the subsequently formed light-emitting layer 13 to break at this point, forming a portion covering the etch barrier layer 12 and a portion covering the bottom of the partition trench B. This reduces the probability of the light-emitting layer 13 and the array layer 14 of the display area 110 being eroded by water and oxygen, improving the reliability and display effect of the display panel.

[0054] In one implementation, please refer to Figures 1-3 See Figure 4 , Figure 4 for Figure 1 The enlarged schematic diagram within the dashed box shows multiple partition grooves B arranged in a ring, sequentially nested around the opening H. The partition grooves B can be circular, elliptical, or other shapes. Figure 1 and Figure 4 The circular illustration is not limited to this application.

[0055] Based on the same inventive concept, this application also provides a method for manufacturing a display panel; please refer to [link to relevant documentation]. Figure 5 , Figure 5 This is a flowchart illustrating one embodiment of the method for manufacturing the display panel of this application. The manufacturing method includes the following steps.

[0056] Step S11: Provide a substrate layer, which defines an aperture area, a transition area, and a display area, with the transition area located between the display area and the aperture area.

[0057] Please see Figure 6a , Figure 6a for Figure 5 The schematic diagram corresponding to one embodiment of step S11 shows that a substrate layer 11 is first provided. The substrate layer 11 defines an opening region 130, a transition region 120, and a display region 110, with the transition region 120 located between the display region 110 and the opening region 130. Specifically, the substrate layer 11 includes at least one sublayer formed by stacked organic layers 111 and inorganic layers 112. Figure 6a Draw the case of two sub-layers. For clarity, Figure 6a Only a small portion of the display area 110 surrounding the transition area 120 is drawn, and Figure 6a The right side of the central opening area 130 is the center point of the opening area 130.

[0058] Step S12: A patterned etch barrier layer is formed on one side surface of the substrate layer located in the aperture region and the transition region, wherein at least one first through-groove is formed on the etch barrier layer, and a portion of the substrate layer is exposed from the first through-groove.

[0059] Please combine Figure 6a See Figure 6b and Figure 6c , Figure 6b for Figure 5 A schematic diagram of the structure corresponding to the implementation method in step S12. Figure 6c for Figure 6b A cross-sectional view along the N-N direction shows a patterned etch barrier layer 12 formed on one side of the substrate layer 11 located between the aperture region 130 and the transition region 120. Specifically, the etch barrier layer 12 is formed on one side of the inorganic layer 112. At least one first through-groove C is formed on the etch barrier layer 12, and a portion of the substrate layer 11 is exposed through the first through-groove C. Figure 6b The first through slot C, arranged in a ring shape, is schematically drawn in the middle.

[0060] Meanwhile, a patterned array layer 14 is formed on one side surface of the substrate layer 11 located in the display area 110; wherein the array layer 14 includes at least one metal layer, and wherein at least one metal layer extends to the transition area 120 and the aperture area 130 to form an etch barrier layer 12.

[0061] Preferably, the metal layer closest to the substrate 11 is extended to the transition region 120 in the direction from the substrate 11 to the etch barrier layer 12 to form the etch barrier layer 12. Specifically, the metal layer closest to the substrate 11 is a patterned metal shielding layer closely attached to the surface of the substrate 11, used to shield a portion of the TFTs in the array layer 14 to improve their stability. When patterning it, portions corresponding to the transition region 120 and the aperture region 130 are patterned simultaneously to form the etch barrier layer 12.

[0062] Step S13: Using the etch barrier layer as a mask, etch away the portion of the substrate layer exposed from the first through-hole to form at least one isolation trench on the substrate layer; wherein, a first through-hole is connected to an isolation trench, and in the direction from the substrate layer to the etch barrier layer, the opening size of the isolation trench near the bottom gradually decreases.

[0063] Please combine Figure 6c See Figure 6d , Figure 6d for Figure 5 The schematic diagram of the structure corresponding to one embodiment of step S13 shows that after forming the etch barrier layer 12, the portion of the substrate layer 11 exposed from the first through-hole C is etched away using the etch barrier layer 12 as a mask to form at least one isolation trench B on the substrate layer 11. In this embodiment, one first through-hole C is connected to one isolation trench B, and the opening size of the isolation trench B near the bottom gradually decreases in the direction from the substrate layer 11 to the etch barrier layer 12.

[0064] Specifically, partition groove B can be formed through the following steps:

[0065] Step 1: Using the etching barrier layer 12 as a mask, etch away the portion of the substrate layer 11 exposed in the first through-hole C to form the second part of the partition trench B.

[0066] Specifically, the inorganic layer 112 exposed from the first through-hole C can be etched away to form a second portion D in the inorganic layer 112 closest to the etch barrier layer 12, which is connected to the first through-hole C, and the organic layer 111 closest to the etch barrier layer 12 is exposed from the second portion D.

[0067] In other embodiments, the second portion D is not limited to being located in the inorganic layer 112. For example, the second portion D may simultaneously penetrate both the organic layer 111 and the inorganic layer 112 in the sublayer closest to the etch barrier layer 12, or simultaneously penetrate both sublayers, and the shape of the second portion is not limited to... Figure 6d As shown.

[0068] Step 2: Etch away the portion of substrate 11 exposed in the second part D to form the first part of the isolation trench B. The opening size of the first part gradually decreases in the direction from the substrate 11 to the etch barrier layer 12, and the side with the smallest opening size of the first part is connected to the second part D.

[0069] Specifically, the exposed portion of the organic layer 111 from the second portion D can be etched away to form the first portion of the partition trench B. In the direction from the substrate layer 11 to the etch stop layer 12, the opening size of the first portion of the partition trench B within the organic layer 111 gradually decreases. That is, the first portion of the partition trench B within the organic layer 111 forms an undercut structure, causing the subsequently formed light-emitting layer 13 located in the opening region 130 and the transition region 120 to break at the sidewall of the partition trench B, forming a portion covering the etch stop layer 12 and a portion covering the bottom of the partition trench B portion.

[0070] In other embodiments, the first portion is not limited to being located in the organic layer 111. For example, the first portion may also be located in the inorganic layer 112, or may simultaneously penetrate adjacent organic layers 111 and inorganic layers 112.

[0071] Step S14: A light-emitting layer is formed, which covers the side of the etch barrier layer away from the substrate layer and part of the bottom of the partition trench. The light-emitting layer covering the etch barrier layer and the light-emitting layer covering part of the bottom of the partition trench are disconnected from each other.

[0072] Please combine Figure 6d See Figure 6e , Figure 6e for Figure 5 The schematic diagram of the structure corresponding to step S14 in one embodiment shows that after forming the isolation trench B, a light-emitting layer 13 is formed on the surface of the array layer 14 and the etch barrier layer 12 facing away from the substrate layer 11. This results in the light-emitting layer 13 located in the opening region 130 and the transition region 120 covering the side of the etch barrier layer 12 facing away from the substrate layer 11 and part of the bottom of the isolation trench B. Furthermore, the light-emitting layer 13 covering the etch barrier layer 12 and the light-emitting layer 13 covering part of the bottom of the isolation trench B are disconnected from each other. Subsequently, after cutting each functional film layer in the opening region 130 to form openings, the continuous intrusion path of water and oxygen along the light-emitting layer 13 within the openings will be interrupted, and the isolation trench B further extends the water and oxygen intrusion path.

[0073] Furthermore, please combine Figure 6d Figure 6e See Figure 6f , Figure 6fTo form a structural schematic diagram corresponding to one embodiment of the encapsulation layer, after the light-emitting layer 13 is formed, an encapsulation layer 15 is formed on the surface of the light-emitting layer 13 facing away from the substrate layer 11. The encapsulation layer 15 continuously covers the light-emitting layer 13 located on the array layer 14 and the etch barrier layer 12, the sidewall of the first through-hole C, the sidewall of the partition groove B, and the light-emitting layer 13 located at the bottom of the partition groove B.

[0074] Step S15: A through opening is formed in the corresponding opening area.

[0075] Please refer to the following: Figure 6f and Figure 2 After forming the light-emitting layer 13 and the encapsulation layer 15, a portion of the encapsulation layer 15, a portion of the light-emitting layer 13, a portion of the etch barrier layer 12, and a portion of the substrate layer 11 are cut away from the corresponding opening area 130 to form a through opening H. In the display panel formed in this embodiment, the probability of the light-emitting layer 13 and the array layer 14 of the display area 110 being eroded by water and oxygen is reduced, thereby improving the reliability and display effect of the display panel.

[0076] In another implementation, please refer to Figure 6c See Figure 7a , Figure 7a for Figure 5 A structural diagram corresponding to another embodiment of step S13 shows that the partition groove B can also be formed through the following steps:

[0077] Using the etch barrier layer 12 as a mask, the portion of the substrate layer 11 exposed from the first through-hole C is etched away to form the first part of the partition trench B. The opening size of this first part gradually decreases in the direction from the substrate layer 11 to the etch barrier layer 12.

[0078] Specifically, in this embodiment, the etch barrier layer 12 is used as a mask to etch away a portion of the inorganic layer 112 exposed in the first through-groove C, forming the first part of the partition groove B. That is, the first part of the partition groove B is located only within the inorganic layer 112, and the opening size of the first part gradually decreases in the direction from the substrate layer 11 to the etch barrier layer 12. In other words, the first part has an undercut structure, causing the subsequently formed light-emitting layer 13 to break at this point, forming a portion covering the etch barrier layer 12 and a portion covering the bottom of the partition groove B. This reduces the probability of the light-emitting layer 13 and the array layer 14 of the display area 110 being eroded by water and oxygen, improving the reliability and display effect of the display panel.

[0079] In other embodiments, the first portion of the partition groove B is not limited to the inorganic layer 112 located in the sublayer closest to the etch barrier layer 12, but may also penetrate the entire inorganic layer 112, or simultaneously penetrate the inorganic layer 112 and the organic layer 111, and is not limited to... Figure 7a As shown.

[0080] Furthermore, please combine Figure 7a See Figure 7b , Figure 7b for Figure 5 A schematic diagram of the structure corresponding to another embodiment of step S14 is shown in the figure. Figure 7a After forming the light-emitting layer 13 on the basis of the structure shown, the light-emitting layer 13 covering the etch barrier layer 12 and the light-emitting layer 13 covering the bottom of the partition groove B are disconnected from each other. After the functional film layers of the opening area 130 are cut to form openings, the invasion path of water and oxygen continuously invading along the light-emitting layer 13 in the opening will be interrupted, and the setting of the partition groove B also extends the water and oxygen invasion path.

[0081] Further Figure 7b Based on the structure shown, a packaging layer 15 is further formed, and a portion of the packaging layer 15, a portion of the light-emitting layer 13, a portion of the etch barrier layer 12, and a portion of the substrate layer 11 are cut away corresponding to the opening region 130, resulting in the structure shown. Figure 3 The display panels shown are not illustrated here.

[0082] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display panel having a through opening thereon, the display panel defining a display area and a transition area, the transition area being located between the display area and the opening, characterized in that, The display panel located in the transition zone includes: A substrate layer, wherein at least one partition groove is provided on the first surface of the substrate layer; An etching barrier layer covers the first surface, the etching barrier layer is provided with at least one first through groove, and one first through groove is correspondingly connected to one of the partition grooves; wherein, in the direction from the substrate layer to the etching barrier layer, the opening size of the partition groove near the bottom gradually decreases, and the opening size of the first through groove gradually increases. The light-emitting layer covers the side of the etch barrier layer away from the substrate layer and a portion of the bottom of the partition trench, and the light-emitting layer covering the etch barrier layer and the light-emitting layer covering the portion of the bottom of the partition trench are disconnected from each other; The display panel located in the display area includes: The substrate layer, the array layer, and the light-emitting layer are stacked sequentially; wherein, in the direction from the substrate layer to the etch barrier layer, the array layer includes a plurality of stacked metal layers, and the metal layers that are in close contact with the surface of the substrate layer extend to the transition region to form the etch barrier layer.

2. The display panel according to claim 1, characterized in that, The number of partition grooves is multiple, and the multiple partition grooves are arranged in a ring, and the multiple partition grooves are sequentially fitted around the periphery of the opening.

3. The display panel according to claim 1, characterized in that, The partition groove includes a first portion in which the opening size of the first portion gradually decreases in the direction from the substrate layer to the etch barrier layer; or, The partition groove includes a first part and a second part. In the direction from the substrate layer to the etch barrier layer, the opening size of the first part gradually decreases, and the side with the smallest opening size of the first part is connected to the second part.

4. The display panel according to any one of claims 1-3, characterized in that, The display panel located in the transition area also includes an encapsulation layer that continuously covers the light-emitting layer located on the etch barrier layer, the sidewall of the first through-hole, the sidewall of the partition groove, and the light-emitting layer located at the bottom of the partition groove.

5. A method for manufacturing a display panel, characterized in that, include: A substrate layer is provided, the substrate layer defining an opening region, a transition region and a display region, wherein the transition region is located between the display region and the opening region; A patterned etch barrier layer is formed on one side surface of the substrate layer located in the aperture region and the transition region, wherein at least one first through-hole is formed on the etch barrier layer, and a portion of the substrate layer is exposed from the first through-hole; Using the etching barrier layer as a mask, the portion of the substrate layer exposed from the first through-hole is etched away to form at least one partition trench on the substrate layer; wherein, one of the first through-holes is connected to one of the partition trenches, and in the direction from the substrate layer to the etching barrier layer, the opening size of the partition trench near the bottom gradually decreases, and the opening size of the first through-hole gradually increases. A light-emitting layer is formed, which covers the side of the etch barrier layer away from the substrate layer and a portion of the bottom of the partition trench, and the light-emitting layer covering the etch barrier layer and the light-emitting layer covering the portion of the bottom of the partition trench are disconnected from each other; A through opening is formed corresponding to the opening area; The method further includes, after the step of providing the substrate layer: A patterned array layer is formed on one side surface of the substrate layer located in the display area; wherein the array layer includes a plurality of stacked metal layers, and the metal layers in close contact with the surface of the substrate layer extend to the transition region and the aperture region to form the etching barrier layer.

6. The preparation method according to claim 5, characterized in that, The step of etching away the substrate layer exposed from the first through-hole using the etch barrier layer as a mask to form at least one isolation trench on the substrate layer includes: Using the etching barrier layer as a mask, the portion of the substrate layer exposed from the first through-hole is etched away to form the first part of the partition trench; wherein, in the direction from the substrate layer to the etching barrier layer, the opening size of the first part gradually decreases; or, Using the etch barrier layer as a mask, the portion of the substrate layer exposed from the first through-hole is etched away to form the second part of the partition trench; the portion of the substrate layer exposed from the second part is etched away to form the first part of the partition trench; wherein, in the direction from the substrate layer to the etch barrier layer, the opening size of the first part gradually decreases, and the side with the smallest opening size of the first part is connected to the second part.

7. The preparation method according to claim 5, characterized in that, The step of forming the light-emitting layer includes: The light-emitting layer is formed on the surface of the array layer and the etching barrier layer opposite to the substrate layer; After the step of forming the light-emitting layer, the method further includes: An encapsulation layer is formed on the surface of the light-emitting layer facing away from the substrate layer. The encapsulation layer continuously covers the light-emitting layer, the sidewall of the first through-hole, the sidewall of the partition groove, and the light-emitting layer located at the bottom of the partition groove, which are located on the array layer and the etch barrier layer.

Images