Method, device and electronic device for processing silk screen data in PCB data

Abstract

The present application provides a method, device and electronic device for processing silk screen data in PCB data, which relates to the technical field of PCB technology and alleviates the technical problem of low position layout accuracy in PCB data. The method includes: detecting whether there is a first overlap between several silk screen layers and between the silk screen layer and the silk screen avoidance area in the PCB data; in response to determining through detection that the first overlap exists, adjusting the position of the target silk screen layer located at the first overlap position according to a preset adjustment rule, so that the target silk screen layer moves out of the silk screen avoidance area and the spacing is greater than the preset distance and the spacing between several target silk screen layers is greater than the preset distance; in response to the completion of the position adjustment of the target silk screen layer, detecting whether there is a second overlap between several adjusted target silk screen layers and between the silk screen avoidance area and the target silk screen layer after the position adjustment is completed; and displaying prompt information of the second overlap position corresponding to the second overlap.

Description

Technical Field

[0001] The present application relates to the field of PCB technology, and in particular to a method, device and electronic device for processing silk screen data in PCB data. Background Art

[0002] The silk screen (short for screen printing) on ​​the printed circuit board (PCB) is also called text or characters, which are usually marked next to components, test pins (points), input and output interfaces to facilitate later debugging, testing, assembly, retrieval, identification, and discrimination. Silk screen is also used for PCB board name, board number, model, date, logo, production cycle, prohibited signs, prohibited areas, directions, QR codes, bar codes, etc. Any text or even graphics that need to be described and identified, so it plays a relatively important role in the entire PCB process (Printed Circuit Board Assembly, PCBA).

[0003] At present, a qualified silk screen cannot overlap with the non-solder mask area (window), component pads, component body, and all other parts that will block the board. Otherwise, not only will the silk screen be incomplete and unrecognizable, but it will also affect component welding or change the impedance value. In mild cases, it will cause local poor welding, and in severe cases, it will cause the component to be unable to be soldered to the plate, causing functional loss or even unusability of the entire circuit board. If the RF circuit is designed to be non-solder mask in the early stage of design, if there is silk screen in the "window" area during manufacturing, it will change the line impedance and affect the circuit performance.

[0004] However, the circuit board images (Gerber) designed by existing PCB Layout software often have overlapping phenomena such as silk screen and non-solder mask areas, which makes the position layout accuracy in PCB data low, affecting the work efficiency of PCB production. Summary of the invention

[0005] The object of the present invention is to provide a method, device and electronic device for processing silk screen data in PCB data, so as to alleviate the technical problem of low position layout accuracy in PCB data.

[0006] In a first aspect, an embodiment of the present application provides a method for processing silk screen data in PCB data, which is applied to a terminal device, and a graphical user interface is provided by the terminal device, and the method includes:

[0007] In response to a generation event for PCB data, determine a silk screen layer and a silk screen avoidance area in the PCB data based on a preset area, and detect whether a first overlap exists between a plurality of the silk screen layers and between the silk screen layer and the silk screen avoidance area;

[0008] In response to determining through detection that the first overlapping situation exists, displaying in the graphical user interface a first overlapping position corresponding to the first overlapping situation in the PCB data;

[0009] Adjusting the position of the target silk-screen layer located at the first overlapping position according to a preset adjustment rule, so that the target silk-screen layer moves out of the silk-screen avoidance area and the spacing is greater than a preset distance, and the spacing between several target silk-screen layers is greater than the preset distance;

[0010] In response to the completion of the position adjustment of the target silk-screen layer, detecting whether there is a second overlap between the target silk-screen layers after the adjustment is completed, and between the silk-screen avoidance area and the target silk-screen layer after the position adjustment is completed;

[0011] The adjusted position of the target silk-screen layer and prompt information of the second overlapping position corresponding to the second overlapping situation in the PCB data are displayed in the graphical user interface.

[0012] In a possible implementation, it also includes:

[0013] In response to the first overlap situation between several of the silk-screen layers and / or between the silk-screen layer and the silk-screen avoidance area, a first error signal is generated and reported according to the first overlap situation, and the total number of the first overlap situations and the first overlap position corresponding to the first overlap situation in the PCB data are recorded.

[0014] In one possible implementation,

[0015] In response to determining through detection that the first overlapping situation exists, the step of displaying in the graphical user interface a first overlapping position corresponding to the first overlapping situation in the PCB data comprises:

[0016] In response to a first overlap between several of the silk-screen layers and / or between the silk-screen layer and the silk-screen avoidance area, the overlapping position corresponding to the first overlap in the PCB data is highlighted in the graphical user interface, and / or the position area in the PCB data except the overlapping position is hidden.

[0017] In a possible implementation, the step of adjusting the position of the target silk-screen layer located at the first overlapping position according to a preset adjustment rule so that the target silk-screen layer moves out of the silk-screen avoidance area and the spacing is greater than a preset distance, and the step of the spacing of several target silk-screen layers being greater than the preset distance includes:

[0018] Move the position of the target silk screen layer located at the first overlapping position to the specified relative position around the component in the PCB data, so that the target silk screen layer is moved to a position outside the silk screen avoidance area and the spacing is greater than the preset distance, and the spacing between several of the target silk screen layers is greater than the preset distance.

[0019] In a possible implementation, after the step of adjusting the position of the target silk-screen layer located at the first overlapping position according to a preset adjustment rule so that the target silk-screen layer moves out of the silk-screen avoidance area and the spacing is greater than a preset distance, and the spacing between several target silk-screen layers is greater than the preset distance, the step further includes:

[0020] If all the specified relative positions are within the silk screen avoidance area, the position of the target silk screen layer is moved to a preset prominent position in the PCB data, and / or the position of the target silk screen layer is highlighted;

[0021] In response to a first position adjustment operation on the target silk-screen layer with a highlighted position, the target silk-screen layer is moved according to the position adjusted by the first position adjustment operation, and the moved position of the target silk-screen layer is displayed in the graphical user interface.

[0022] In a possible implementation, it also includes:

[0023] In response to the second overlapping situation between the target silk-screen layers after a number of adjustments are completed, and / or between the silk-screen avoidance area and the target silk-screen layer after a position adjustment is completed, generating and reporting a second error signal according to the second overlapping situation;

[0024] Recording and displaying in the graphical user interface the total number of the second overlapping situations and the second overlapping positions corresponding to the second overlapping situations in the PCB data;

[0025] In response to a first selection operation on a plurality of the second overlapping positions, displaying in the graphical user interface the target second overlapping positions selected by the first selection operation;

[0026] In response to a second position adjustment operation on the target silk screen layer at the target second overlapping position, the target silk screen layer is moved according to the position adjusted by the second position adjustment operation, and the moved position of the target silk screen layer is displayed in the graphical user interface.

[0027] In a possible implementation, it also includes:

[0028] In response to a second selection operation on a display surface of the PCB data, the PCB data is displayed in the graphical user interface according to the target display surface selected by the second selection operation.

[0029] In a second aspect, an embodiment of the present application provides a device for processing silk screen data in PCB data, which is applied to a terminal device, and a graphical user interface is provided through the terminal device, and the device includes:

[0030] A first detection module is used to respond to a generation event for PCB data, determine a silk screen layer and a silk screen avoidance area in the PCB data based on a preset area, and detect whether a first overlap exists between a plurality of the silk screen layers and between the silk screen layer and the silk screen avoidance area;

[0031] A first display module, configured to display, in the graphical user interface, a first overlapping position corresponding to the first overlapping situation in the PCB data in response to determining through detection that the first overlapping situation exists;

[0032] an adjustment module, configured to adjust the position of the target silk-screen layer located at the first overlapping position according to a preset adjustment rule, so that the target silk-screen layer moves out of the silk-screen avoidance area and the spacing is greater than a preset distance, and the spacing between a plurality of the target silk-screen layers is greater than the preset distance;

[0033] A second detection module is used for detecting whether there is a second overlap between the target silk-screen layers after the adjustment is completed, and between the silk-screen avoidance area and the target silk-screen layer after the position adjustment is completed, in response to the completion of the position adjustment of the target silk-screen layer;

[0034] The second display module is used to display the adjusted position of the target silk screen layer and the prompt information of the second overlapping position corresponding to the second overlapping situation in the PCB data in the graphical user interface.

[0035] In a third aspect, an embodiment of the present application provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program that can be executed on the processor, and when the processor executes the computer program, the method described in the first aspect is implemented.

[0036] In a fourth aspect, an embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions. When the computer-executable instructions are called and executed by a processor, the computer-executable instructions prompt the processor to execute the method described in the first aspect above.

[0037] The embodiments of the present application bring the following beneficial effects:

[0038] A method, device and electronic device for processing silk screen data in PCB data provided by an embodiment of the present application can determine a silk screen layer and a silk screen avoidance area in the PCB data based on a preset area in response to a generation event for PCB data, and detect whether there is a first overlap between a plurality of silk screen layers, and between a silk screen layer and a silk screen avoidance area; in response to determining through detection that the first overlap exists, displaying a first overlap position corresponding to the first overlap in the PCB data in a graphical user interface; adjusting the position of a target silk screen layer located at the first overlap position according to a preset adjustment rule, so that the target silk screen layer moves out of the silk screen avoidance area and the spacing is greater than a preset distance, and the spacing between a plurality of the target silk screen layers is greater than the preset distance; in response to completion of the position adjustment of the target silk screen layer, detecting whether there is a second overlap between a plurality of target silk screen layers after the adjustment is completed, and between the silk screen avoidance area and the target silk screen layer after the position adjustment is completed; and displaying in the graphical user interface the adjusted position of the target silk screen layer and prompt information of the second overlap position corresponding to the second overlap in the PCB data. In this solution, when PCB data is generated, based on detecting whether there is a first overlap between silk screen layers and between silk screen layers and silk screen avoidance areas, when the first overlap exists, the first overlap position corresponding to the first overlap in the PCB data is displayed, and the position of the target silk screen layer located at the first overlap position is adjusted according to a preset adjustment rule, so that the target silk screen layer moves out of the silk screen avoidance area and the spacing is greater than the preset distance, and the spacing of several target silk screen layers is greater than the preset distance, and then when the position adjustment of the target silk screen layer is completed, it is detected whether there is a second overlap between the target silk screen layers after the adjustment is completed, and between the silk screen avoidance area and the target silk screen layer after the position adjustment is completed, and the adjusted position of the target silk screen layer and the prompt information of the second overlap position corresponding to the second overlap in the PCB data are displayed, thereby not only enabling designers to timely discover the overlap errors between silk screens and between silk screens and non-solder mask areas before Gerber out, but the system can also automatically adjust the position of the silk screen layer according to the overlap errors, thereby improving the accuracy of the position layout in the PCB data, and thereby improving the work efficiency of PCB production.

[0039] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0041] Figure 1 A schematic diagram of a process for processing screen printing data in PCB data provided in an embodiment of the present application;

[0042] Figure 2 Another schematic flow chart of the method for processing silk screen data in PCB data provided in an embodiment of the present application;

[0043] Figure 3 A schematic diagram of the structure of a device for processing silk screen data in PCB data provided in an embodiment of the present application;

[0044] Figure 4 A schematic structural diagram of an electronic device provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0046] The terms "including" and "having" and any variations thereof mentioned in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but may optionally include other steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0047] At present, PCB Layout software cannot identify the phenomenon of silk screen overlapping with the above-mentioned areas in advance. Currently, it is completely up to the designer to find the overlap with his eyes. When the PCB manufacturing factory receives the Gerber from the designer, it will import the relevant software to carefully check and confirm whether each layer meets the factory's process manufacturing requirements, so as to make sufficient preparations before manufacturing. Since the factory needs to process a large amount of data every day, the customer and the factory have reached a tacit understanding that when the silk screen overlaps with the above-mentioned areas, the customer must confirm each overlapping position with the customer one by one. One situation is that the silk screen is placed in the above-mentioned areas due to the designer's negligence. At this time, the designer needs to move the silk screen out and re-issue the Gerber to the board factory for confirmation. Another situation is that the designer confirms that the overlap between the silk screen and the above-mentioned areas can be ignored, and the board factory also ignores it. In both cases, the board factory needs to suspend the process and confirm with the designer, which often takes a lot of time for both parties. Because the designer does not have the right tools for the final check, it often leads to the accident of modifying the A error and causing the B error. Therefore, the board factory has to confirm again, and the designers have to modify again and re-send the Gerber to the board factory, which is time-consuming and inefficient. It can be seen that the circuit board images (Gerber) designed by existing PCB Layout and other software often have overlapping phenomena such as silk screen and non-solder mask areas, which makes the position layout accuracy in the PCB data low, thus affecting the work efficiency of PCB production.

[0048] Based on this, the embodiments of the present application provide a method, device and electronic device for processing silk screen data in PCB data, through which the technical problem of low position layout accuracy in PCB data can be alleviated.

[0049] The embodiments of the present invention are further described below in conjunction with the accompanying drawings.

[0050] Figure 1 The present invention provides a flowchart of a method for processing screen printing data in PCB data in an embodiment of the present invention. The method is applied to a terminal device, and a graphical user interface is provided through the terminal device. Figure 1 As shown, the method includes:

[0051] Step S110, in response to a generation event for PCB data, determining a silk screen layer and a silk screen avoidance area in the PCB data based on a preset area, and detecting whether a first overlap exists between several silk screen layers and between the silk screen layer and the silk screen avoidance area.

[0052] The silk screen avoidance area may include the area without solder mask (opening window), component pads, component body, and all other areas where components that may block the board are located.

[0053] It should be noted that the Gerber file is a computer software, a document format set that describes the circuit board (circuit layer, solder mask layer, character layer, etc.) image and drilling and milling data in the circuit board industry software, and is a standard format for image conversion in the circuit board industry. The method for processing silk screen data in PCB data provided in the embodiment of the present application can be applied to a silk screen automatic placement tool for Allegro software.

[0054] In this step, when the PCB data is initially generated, the system determines the silk screen layer and the avoidance area in the PCB data based on the pre-set areas.

[0055] PACKAGE GEOMETRY / SILKSCREEN_TOP or BOTTOM、

[0056] BOARD GEOMETRY / SILKSCREEN_TOP or BOTTOM、

[0057] Define REF DES / SILKSCREEN_TOP or BOTTOM as the silk screen layer, and then add the following content:

[0058] PACKAGE GEOMETRY / SOLDERMASK_TOP or BOTTOM

[0059] PACKAGE GEOMETRY / PLACE_BOUND_TOP or BOTTOM

[0060] PACKAGE GEOMETRY / ASSEMBLY_TOP or BOTTOM

[0061] BOARD GEOMETRY / SOLDERMASK_TOP or BOTTOM

[0062] PIN / SOLDERMASK_TOP or BOT

[0063] VIACLASS / SOLDERMASK_TOP or BOTTOM

[0064] AREAS / PACKAGE KEEPOUT_TOP or BOTTOM

[0065] AREAS / VIA KEEPOUT_TOP or BOTTOM

[0066] AREAS / ROUTE KEEPOUT_TOP or BOTTOM is defined as the avoidance area. Then, visual recognition is used to detect whether there is overlap between the silk-screen layers and between the silk-screen layer and the avoidance area. When any two layers between the silk-screen layers and / or between the silk-screen layer and the avoidance area overlap, the following steps S120 and S130 are executed.

[0067] Step S120, in response to determining through detection that the first overlapping situation exists, displaying a first overlapping position corresponding to the first overlapping situation in the PCB data in a graphical user interface.

[0068] In this step, when any two layers overlap between the silk-screen layers and / or between the silk-screen layer and the avoidance area, the system can highlight the corresponding overlapping position in the PCB data in the graphical user interface.

[0069] Step S130, adjusting the position of the target silk screen layer at the first overlapping position according to a preset adjustment rule, so that the target silk screen layer moves out of the silk screen avoidance area and the spacing is greater than the preset distance, and the spacing between several target silk screen layers is greater than the preset distance.

[0070] For example, the system can automatically try to move the overlapping silk screen layers out of the non-solder mask area (i.e., silk screen avoidance area) according to the preset adjustment rules, and the spacing is greater than a certain distance, or make several silk screen layers no longer overlap and the spacing is also greater than a certain distance. For example, silk screens cannot overlap, and there must be a 0.2mm gap between them; similarly, silk screens cannot overlap and the avoidance area must maintain a distance of 0.2mm.

[0071] Step S140 , in response to the completion of the position adjustment of the target silk-screen layer, detecting whether there is a second overlap between a plurality of adjusted target silk-screen layers and between the silk-screen avoidance area and the adjusted target silk-screen layer.

[0072] In the embodiment of the present application, the system can recheck the overlapping condition of the silk-screen layer after it has moved once.

[0073] Step S150: Displaying the adjusted position of the target silk-screen layer and prompt information of the second overlapping position corresponding to the second overlapping situation in the PCB data in the graphical user interface.

[0074] When generating PCB data, based on detecting whether there is a first overlap between silk screen layers and between silk screen layers and silk screen avoidance areas, when the first overlap exists, the first overlap position corresponding to the first overlap in the PCB data is displayed, and the position of the target silk screen layer located at the first overlap position is adjusted according to a preset adjustment rule, so that the target silk screen layer moves out of the silk screen avoidance area and the spacing is greater than the preset distance, and the spacing of several target silk screen layers is greater than the preset distance, and then when the position adjustment of the target silk screen layer is completed, it is detected whether there is a second overlap between the target silk screen layers after the adjustment is completed, and between the silk screen avoidance area and the target silk screen layer after the position adjustment is completed, and the adjusted position of the target silk screen layer and the prompt information of the second overlap position corresponding to the second overlap in the PCB data are displayed, thereby not only enabling designers to timely discover the overlap errors between silk screens and between silk screens and non-solder mask areas before Gerber out, but the system can also automatically adjust the position of the silk screen layer according to the overlap errors, thereby improving the accuracy of the position layout in the PCB data, and thereby improving the work efficiency of PCB production.

[0075] The above steps are described in detail below.

[0076] In some embodiments, the method may further include the following steps:

[0077] Step a), in response to the first overlap between several silk screen layers and / or between the silk screen layer and the silk screen avoidance area, generate and report a first error signal according to the first overlap, and record the total number of first overlaps and the first overlap positions corresponding to the first overlaps in the PCB data.

[0078] For example, when any two layers overlap, the system will report an error. When the system finds an error, it will record the total number of errors and then the error coordinates. By reporting error signals and recording the number and location of overlaps, timely and effective notifications can be made to efficiently handle overlap issues.

[0079] In some embodiments, the above step S120 may include the following steps:

[0080] Step b), in response to a first overlap between a plurality of silk screen layers and / or between a silk screen layer and a silk screen avoidance area, highlighting the overlap position corresponding to the first overlap in the PCB data in a graphical user interface, and / or hiding the position area in the PCB data except the overlap position.

[0081] Exemplarily, the system may close irrelevant layers and only display the silk-screen layer and the layer of the silk-screen avoidance area, thereby enabling the image in the overlapping area to highlight key points.

[0082] In some embodiments, the above step S130 may include the following steps:

[0083] Step c), moving the position of the target silk screen layer at the first overlapping position to the specified relative position around the component in the PCB data, so that the target silk screen layer is moved to a position outside the silk screen avoidance area and the spacing is greater than the preset distance, and the spacing between several target silk screen layers is greater than the preset distance.

[0084] In practical applications, the preset adjustment rules in the above step S130 can be to avoid the silk screens and to avoid the silk screen avoidance area (such as the non-solder mask area), and to move the silk screen to the upper or lower, left or right position around the component, and the order can be based on the principle of left first, right second, top first, bottom second. The front (TOP) angle of the PCB data can be 0 degrees or 90 degrees, and the back (BOTTOM) angle of the PCB data can be 0 degrees or 270 degrees. By moving the position of the target silk screen layer to the specified relative position around the component, the overlapping target silk screen layers can be separated more efficiently and the target silk screen layer can be effectively moved to a position outside the silk screen avoidance area.

[0085] Based on the above step c), after the above step S130, the method may further include the following steps:

[0086] Step d), if all the specified relative positions are within the silk screen avoidance area, the position of the target silk screen layer is moved to a preset prominent position in the PCB data, and / or the position of the target silk screen layer is highlighted;

[0087] Step e), in response to a first position adjustment operation on the target silk-screen layer with the position highlighted, moving the target silk-screen layer according to the position adjusted by the first position adjustment operation, and displaying the moved position of the target silk-screen layer in a graphical user interface.

[0088] For example, when there are silk screen avoidance areas (such as non-solder mask layers) on all four sides of a component, such as the top, bottom, left, or right, the silk screen can be moved to a more prominent position such as the center of the component, and the silk screen can also be displayed in a prominent manner such as highlighting, which makes it easier for designers to quickly find the silk screen and improves the efficiency of subsequent manual adjustment of the silk screen position.

[0089] In some embodiments, the method may further include the following steps:

[0090] Step f), in response to a second overlap between a plurality of adjusted target silk-screen layers and / or between the silk-screen avoidance area and the target silk-screen layer after position adjustment, generating and reporting a second error signal according to the second overlap;

[0091] Step g), recording and displaying in a graphical user interface the total number of second overlapping situations and the second overlapping positions corresponding to the second overlapping situations in the PCB data;

[0092] Step h), in response to a first selection operation on a plurality of second overlapping positions, displaying the target second overlapping position selected by the first selection operation in a graphical user interface;

[0093] Step i), in response to a second position adjustment operation on the target silk screen layer at the target second overlapping position, moving the target silk screen layer according to the position adjusted by the second position adjustment operation, and displaying the moved position of the target silk screen layer in a graphical user interface.

[0094] For example, the system can recheck the overlap after the silk screen has moved once, and then record the coordinates that cannot be moved and overlap with the silk screen avoidance area. The system interface can prompt the total number of errors, and the system interface can display two buttons, "Previous Error" and "Next Error". When manually operated, each time the buttons are pressed, the screen can automatically jump to the coordinates where the silk screen overlaps with the silk screen avoidance area, so as to facilitate the designer to operate and modify the overlapping errors.

[0095] In some embodiments, the method may further include the following steps:

[0096] Step j), in response to a second selection operation on a display surface of the PCB data, displaying the PCB data in the graphical user interface according to the target display surface selected by the second selection operation.

[0097] The system can also set options for the top and bottom sides of the PCB data. Designers can select the display side and the side to be adjusted of the PCB data as needed to improve their operational efficiency.

[0098] Figure 3 A schematic diagram of the structure of a device for processing screen printing data in PCB data is provided. The device can be applied to a terminal device, and a graphical user interface is provided through the terminal device. Figure 3 As shown, the processing device 300 for silk screen data in PCB data includes:

[0099] A first detection module 301 is used for determining a silk screen layer and a silk screen avoidance area in the PCB data based on a preset area in response to a generation event for the PCB data, and detecting whether a first overlap exists between a plurality of the silk screen layers and between the silk screen layer and the silk screen avoidance area;

[0100] A first display module 302, configured to display, in the graphical user interface, a first overlapping position corresponding to the first overlapping situation in the PCB data in response to determining through detection that the first overlapping situation exists;

[0101] An adjustment module 303 is used to adjust the position of the target silk-screen layer located at the first overlapping position according to a preset adjustment rule, so that the target silk-screen layer moves out of the silk-screen avoidance area and the spacing is greater than a preset distance, and the spacing between several target silk-screen layers is greater than the preset distance;

[0102] A second detection module 304 is used for detecting whether there is a second overlap between the target silk-screen layers after the adjustment is completed, and between the silk-screen avoidance area and the target silk-screen layer after the adjustment is completed, in response to the completion of the position adjustment of the target silk-screen layer;

[0103] The second display module 305 is used to display the adjusted position of the target silk-screen layer and the prompt information of the second overlapping position corresponding to the second overlapping situation in the PCB data in the graphical user interface.

[0104] In some embodiments, the apparatus further comprises:

[0105] The first generating module is used for generating and reporting a first error signal in response to the first overlapping situation between a plurality of the silk-screen layers and / or between the silk-screen layer and the silk-screen avoidance area, and recording the total number of the first overlapping situations and the first overlapping positions corresponding to the first overlapping situations in the PCB data.

[0106] In some embodiments, the first display module is specifically used to:

[0107] In response to a first overlap between several of the silk-screen layers and / or between the silk-screen layer and the silk-screen avoidance area, the overlapping position corresponding to the first overlap in the PCB data is highlighted in the graphical user interface, and / or the position area in the PCB data except the overlapping position is hidden.

[0108] In some embodiments, the adjustment module is specifically used to:

[0109] Move the position of the target silk screen layer located at the first overlapping position to the specified relative position around the component in the PCB data, so that the target silk screen layer is moved to a position outside the silk screen avoidance area and the spacing is greater than the preset distance, and the spacing between several of the target silk screen layers is greater than the preset distance.

[0110] In some embodiments, the apparatus further comprises:

[0111] A display module, for moving the position of the target silk-screen layer to a preset obvious position in the PCB data, and / or highlighting the position of the target silk-screen layer if all the specified relative positions are within the silk-screen avoidance area;

[0112] The first moving module is used to respond to a first position adjustment operation for the target silk-screen layer with a highlighted position, move the target silk-screen layer according to the position adjusted by the first position adjustment operation, and display the moved position of the target silk-screen layer in the graphical user interface.

[0113] In some embodiments, the apparatus further comprises:

[0114] A second generating module, configured to generate and report a second error signal according to the second overlapping situation in response to the second overlapping situation existing between the target silk-screen layers after a plurality of adjustments are completed, and / or between the silk-screen avoidance area and the target silk-screen layer after a position adjustment is completed;

[0115] A recording module, used for recording and displaying in the graphical user interface the total number of the second overlapping situations and the second overlapping positions corresponding to the second overlapping situations in the PCB data;

[0116] A third display module, configured to display, in response to a first selection operation on a plurality of the second overlapping positions, a target second overlapping position selected by the first selection operation in the graphical user interface;

[0117] The second moving module is used to respond to a second position adjustment operation of the target silk screen layer at the target second overlapping position, move the target silk screen layer according to the position adjusted by the second position adjustment operation, and display the moved position of the target silk screen layer in the graphical user interface.

[0118] In some embodiments, the apparatus further comprises:

[0119] A fourth display module is used to respond to a second selection operation on the display surface of the PCB data and display the PCB data in the graphical user interface according to the target display surface selected by the second selection operation.

[0120] The device for processing silk screen data in PCB data provided in the embodiment of the present application has the same technical features as the method for processing silk screen data in PCB data provided in the above embodiment, so it can also solve the same technical problems and achieve the same technical effects.

[0121] An electronic device provided in an embodiment of the present application is Figure 4As shown, the electronic device 400 includes a processor 402 and a memory 401, wherein the memory stores a computer program that can be run on the processor, and the processor implements the steps of the method provided in the above embodiment when executing the computer program.

[0122] See also Figure 4 The electronic device further includes: a bus 403 and a communication interface 404, a processor 402, a communication interface 404 and a memory 401 are connected via the bus 403; the processor 402 is used to execute an executable module stored in the memory 401, such as a computer program.

[0123] The memory 401 may include a high-speed random access memory (RAM), and may also include a non-volatile memory, such as at least one disk storage. The communication connection between the system network element and at least one other network element is realized through at least one communication interface 404 (which may be wired or wireless), and the Internet, wide area network, local area network, metropolitan area network, etc. may be used.

[0124] The bus 403 may be an ISA bus, a PCI bus, or an EISA bus, etc. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 4 Only one bidirectional arrow is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0125] Among them, the memory 401 is used to store programs, and the processor 402 executes the program after receiving the execution instruction. The method executed by the device defined by the process disclosed in any embodiment of the present application can be applied to the processor 402 or implemented by the processor 402.

[0126] The processor 402 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the hardware integrated logic circuit or software instructions in the processor 402. The above processor 402 can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The methods, steps and logic block diagrams disclosed in the embodiments of the present application can be implemented or executed. The general processor can be a microprocessor or the processor can also be any conventional processor, etc. The steps of the method disclosed in the embodiments of the present application can be directly embodied as a hardware decoding processor to execute, or the hardware and software modules in the decoding processor can be combined to execute. The software module may be located in a storage medium mature in the art such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory, or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory 401, and the processor 402 reads the information in the memory 401 and completes the steps of the above method in combination with its hardware.

[0127] Corresponding to the method for processing silk screen data in the above-mentioned PCB data, an embodiment of the present application also provides a computer-readable storage medium, which stores computer-executable instructions. When the computer-executable instructions are called and executed by a processor, the computer-executable instructions prompt the processor to execute the steps of the method for processing silk screen data in the above-mentioned PCB data.

[0128] The processing device of the silk-screen data in the PCB data provided in the embodiment of the present application can be specific hardware on the device or software or firmware installed on the device. The implementation principle and technical effect of the device provided in the embodiment of the present application are the same as those of the aforementioned method embodiment. For the sake of brief description, the parts not mentioned in the device embodiment can refer to the corresponding contents in the aforementioned method embodiment. Technical personnel in the relevant field can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, devices and units described above can all refer to the corresponding processes in the aforementioned method embodiment, and will not be repeated here.

[0129] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0130] For another example, the flowchart and block diagram in the accompanying drawings show the possible architecture, function and operation of the device, method and computer program product according to multiple embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of the code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or the flowchart, and the combination of the boxes in the block diagram and / or the flowchart can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0131] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0132] In addition, each functional unit in the embodiments provided in the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0133] If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method for processing the silk screen data in the PCB data described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as ROM), random access memory (Random Access Memory, referred to as RAM), disk or optical disk and other media that can store program codes.

[0134] It should be noted that similar numbers and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and are not to be understood as indicating or implying relative importance.

[0135] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solution of the present application, rather than to limit it. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the aforementioned embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solution recorded in the aforementioned embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiment of the present application. They should all be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A method for processing screen printing data in PCB data, characterized in that: Applied to a terminal device, a graphical user interface is provided through the terminal device, and the method comprises: In response to a generation event for PCB data, determine a silk screen layer and a silk screen avoidance area in the PCB data based on a preset area, and detect whether a first overlap exists between a plurality of the silk screen layers and between the silk screen layer and the silk screen avoidance area; In response to determining through detection that the first overlapping situation exists, displaying in the graphical user interface a first overlapping position corresponding to the first overlapping situation in the PCB data; Adjusting the position of the target silk-screen layer located at the first overlapping position according to a preset adjustment rule, so that the target silk-screen layer moves out of the silk-screen avoidance area and the spacing is greater than a preset distance, and the spacing between several target silk-screen layers is greater than the preset distance; In response to the completion of the position adjustment of the target silk-screen layer, detecting whether there is a second overlap between the target silk-screen layers after the adjustment is completed, and between the silk-screen avoidance area and the target silk-screen layer after the position adjustment is completed; Displaying, in the graphical user interface, the adjusted position of the target silk-screen layer and prompt information of the second overlapping position corresponding to the second overlapping situation in the PCB data; The step of adjusting the position of the target silk-screen layer located at the first overlapping position according to a preset adjustment rule so that the target silk-screen layer moves out of the silk-screen avoidance area and the spacing is greater than a preset distance, and the step of spacing the target silk-screen layers greater than the preset distance includes: Move the position of the target silk screen layer located at the first overlapping position to the specified relative position around the component in the PCB data, so that the target silk screen layer is moved to a position outside the silk screen avoidance area and the spacing is greater than the preset distance, and the spacing between several of the target silk screen layers is greater than the preset distance.

2. The method according to claim 1, characterized in that Also includes: In response to the first overlap situation between several of the silk-screen layers and / or between the silk-screen layer and the silk-screen avoidance area, a first error signal is generated and reported according to the first overlap situation, and the total number of the first overlap situations and the first overlap position corresponding to the first overlap situation in the PCB data are recorded.

3. The method according to claim 1, characterized in that In response to determining through detection that the first overlapping situation exists, the step of displaying in the graphical user interface a first overlapping position corresponding to the first overlapping situation in the PCB data comprises: In response to a first overlap between several of the silk-screen layers and / or between the silk-screen layer and the silk-screen avoidance area, the overlapping position corresponding to the first overlap in the PCB data is highlighted in the graphical user interface, and / or the position area in the PCB data except the overlapping position is hidden.

4. The method according to claim 1, characterized in that: After the step of adjusting the position of the target silk-screen layer located at the first overlapping position according to the preset adjustment rule so that the target silk-screen layer moves out of the silk-screen avoidance area and the spacing is greater than the preset distance, and the spacing between several target silk-screen layers is greater than the preset distance, the step further includes: If all the specified relative positions are within the silk screen avoidance area, the position of the target silk screen layer is moved to a preset prominent position in the PCB data, and / or the position of the target silk screen layer is highlighted; In response to a first position adjustment operation on the target silk-screen layer with a highlighted position, the target silk-screen layer is moved according to the position adjusted by the first position adjustment operation, and the moved position of the target silk-screen layer is displayed in the graphical user interface.

5. The method according to claim 1, characterized in that Also includes: In response to the second overlapping situation between the target silk-screen layers after a number of adjustments are completed, and / or between the silk-screen avoidance area and the target silk-screen layer after a position adjustment is completed, generating and reporting a second error signal according to the second overlapping situation; Recording and displaying in the graphical user interface the total number of the second overlapping situations and the second overlapping positions corresponding to the second overlapping situations in the PCB data; In response to a first selection operation on a plurality of the second overlapping positions, displaying in the graphical user interface the target second overlapping positions selected by the first selection operation; In response to a second position adjustment operation on the target silk screen layer at the target second overlapping position, the target silk screen layer is moved according to the position adjusted by the second position adjustment operation, and the moved position of the target silk screen layer is displayed in the graphical user interface.

6. The method according to claim 1, characterized in that Also includes: In response to a second selection operation on a display surface of the PCB data, the PCB data is displayed in the graphical user interface according to the target display surface selected by the second selection operation.

7. A device for processing silk screen data in PCB data, characterized in that: Applied to a terminal device, a graphical user interface is provided through the terminal device, and the device comprises: A first detection module is used to respond to a generation event for PCB data, determine a silk screen layer and a silk screen avoidance area in the PCB data based on a preset area, and detect whether a first overlap exists between a plurality of the silk screen layers and between the silk screen layer and the silk screen avoidance area; A first display module, configured to display, in the graphical user interface, a first overlapping position corresponding to the first overlapping situation in the PCB data in response to determining through detection that the first overlapping situation exists; an adjustment module, configured to adjust the position of the target silk-screen layer located at the first overlapping position according to a preset adjustment rule, so that the target silk-screen layer moves out of the silk-screen avoidance area and the spacing is greater than a preset distance, and the spacing between a plurality of the target silk-screen layers is greater than the preset distance; A second detection module is used for detecting whether there is a second overlap between the target silk-screen layers after the adjustment is completed, and between the silk-screen avoidance area and the target silk-screen layer after the position adjustment is completed, in response to the completion of the position adjustment of the target silk-screen layer; A second display module, used for displaying the adjusted position of the target silk-screen layer and prompt information of the second overlapping position corresponding to the second overlapping situation in the PCB data in the graphical user interface; The adjustment module is specifically used for: Move the position of the target silk screen layer located at the first overlapping position to the specified relative position around the component in the PCB data, so that the target silk screen layer is moved to a position outside the silk screen avoidance area and the spacing is greater than the preset distance, and the spacing between several of the target silk screen layers is greater than the preset distance.

8. An electronic device comprising a memory and a processor, wherein the memory stores a computer program that can be run on the processor, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions. When the computer-executable instructions are called and executed by a processor, the computer-executable instructions cause the processor to execute the method according to any one of claims 1 to 6.

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