Electronic component and mounting board on which the electronic component is mounted

Abstract

An electronic component and a mounting board on which the electronic component is mounted are provided. The electronic component includes: a capacitor body; a pair of external electrodes, respectively disposed on ends of the capacitor body; a pair of metal frames, each of the pair of metal frames being configured to be connected to a corresponding one of the pair of external electrodes; and a conductive bonding layer, disposed between the external electrodes and the metal frames, having a discontinuous region.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0115242 filed on September 9, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to an electronic component and a mounting board on which the electronic component is mounted. Background Art

[0003] Multilayer capacitors are used in various electronic devices due to their small size and high capacitance.

[0004] Recently, due to a rapid growth in interest in environmentally friendly vehicles and electric vehicles, the importance of power drive systems in vehicles is increasing, and accordingly, the demand for multilayer capacitors required for the power drive systems is also increasing.

[0005] Multilayer capacitors are required to have high levels of thermal, electrical, and mechanical reliability so that they can be used as components for vehicles.

[0006] As component mounting density in vehicles increases, there is a need for a multilayer capacitor that can achieve high capacitance while being easily mounted in a limited space and is highly resistant to vibration and deformation.

[0007] To improve durability against such vibration and deformation, the multilayer capacitor may be mounted on the board while being spaced apart from the board using a metal frame.

[0008] However, in the case where an electronic component uses a metal frame, a bonding portion between an external electrode of a multilayer capacitor and the metal frame may be degraded due to thermal and mechanical shock during board mounting.

[0009] In a temperature cycle environment, deterioration may occur between the external electrodes and the conductive bonding material and between the metal frame and the conductive bonding material due to differences in thermal expansion coefficients, and adhesion of the multilayer capacitor may deteriorate after environmental testing. Summary of the Invention

[0010] One aspect of the present disclosure is to provide an electronic component and a mounting board on which the electronic component is mounted, which can improve the durability of a multilayer capacitor against vibration and deformation and prevent adhesion from deteriorating after environmental testing while improving the bonding strength between the multilayer capacitor and a metal frame.

[0011] According to one aspect of the present disclosure, an electronic component includes: a capacitor body; a pair of external electrodes, respectively arranged on ends of the capacitor body; a pair of metal frames, each of the pair of metal frames being configured to be connected to a corresponding one of the pair of external electrodes; and a conductive bonding layer, arranged between the external electrodes and the metal frames, and having a discontinuous area.

[0012] The discontinuous region may be formed to have a linear shape.

[0013] The discontinuous region may be formed to have a dot shape.

[0014] The discontinuous region may have a grid shape.

[0015] The discontinuous region may include a plurality of discontinuous regions formed to be spaced apart from each other.

[0016] In this case, the discontinuous region may include a plurality of discontinuous regions formed to be spaced apart from each other in a width direction of the capacitor body.

[0017] In addition, the discontinuous region may include a plurality of discontinuous regions formed to be spaced apart from each other in a thickness direction of the capacitor body.

[0018] The capacitor body may include a dielectric layer and a plurality of inner electrodes, the plurality of inner electrodes being alternately disposed with the dielectric layer interposed between adjacent inner electrodes.

[0019] The external electrode may include a head portion provided on one surface of the capacitor body, and a band portion extending from the head portion to a portion of an upper surface, a portion of a lower surface, and portions of both side surfaces of the capacitor body.

[0020] The metal frame may include a connection portion connected to the head portion, and a mounting portion bent and extended from a lower end of the connection portion.

[0021] Furthermore, 0.40≤A / (A+B)≤0.90, wherein A is the total area of ​​the bonding regions in the conductive bonding layer, and B is the total area of ​​the discontinuous regions in the conductive bonding layer.

[0022] According to another aspect of the present disclosure, a mounting board on which an electronic component is mounted includes a board having a plurality of electrode pads provided on an upper surface thereof; and the electronic component, each of the pair of metal frames being connected to a corresponding one of the plurality of electrode pads.

[0023] According to another aspect of the present disclosure, an electronic component includes: a pair of metal frames, each having a connection surface, the pair of metal frames being spaced apart from each other and arranged so that the connection surfaces face each other; a conductive bonding layer arranged on each of the connection surfaces, the conductive bonding layer having a plurality of conductive bonding portions arranged discontinuously; and a capacitor having a pair of external electrodes arranged on opposite end surfaces of the capacitor, the capacitor being arranged between the pair of metal frames so that the pair of external electrodes respectively contact the plurality of conductive bonding portions of the corresponding metal frames. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the detailed description taken in conjunction with the following drawings.

[0025] Figure 1 is a schematic perspective view of a multilayer capacitor applied to an exemplary embodiment of the present disclosure.

[0026] Figure 2A and Figure 2B are shown for Figure 1 1. A plan view of a first inner electrode and a second inner electrode of a multilayer capacitor.

[0027] Figure 3 It is along Figure 1 A cross-sectional view taken along line II'.

[0028] Figure 4 is a schematic structural perspective view illustrating an electronic component according to an exemplary embodiment of the present disclosure.

[0029] Figure 5 It is along Figure 4 A cross-sectional view taken along line II-II'.

[0030] Figure 6 The first metal frame is shown in FIG. Figure 5 A side view of the structure on the first head in a state where the first conductive bonding layer is separated and formed.

[0031] Figure 7 is a cross-sectional view of an electronic component according to another exemplary embodiment of the present disclosure.

[0032] Figure 8 The first metal frame is shown in FIG. Figure 7 A side view of the structure on the first head in a state where the first conductive bonding layer is separated and formed.

[0033] Figure 9 and Figure 10 are side views respectively showing various modified examples of the conductive bonding layer.

[0034] Figure 11 is a graph showing the detachment rate at room temperature and the detachment rate after temperature cycling (TC) according to the ratio of the bonding area in the conductive bonding layer.

[0035] Figure 12 It shows Figure 5 A cross-sectional view of a state where electronic components are mounted on a board. DETAILED DESCRIPTION

[0036] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0037] However, the present disclosure may be exemplified in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0038] Throughout this specification, it will be understood that when an element such as a layer, region, or wafer (plate) is referred to as being “on”, “connected to”, or “bonded to” another element, the element may be directly “on”, “connected to”, or “bonded to” the other element, or there may be other elements intervening therebetween. In contrast, when an element is referred to as being “directly on”, “directly connected to”, or “directly bonded to” another element, there are no intervening elements or layers. The same reference numerals always refer to the same elements. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0039] It will be apparent that although terms such as "first," "second," "third," etc. may be used herein to describe various members, components, regions, layers, and / or portions, these members, components, regions, layers, and / or portions are not limited by these terms. These terms are used solely to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Thus, a first member, first component, first region, first layer, or first portion discussed below may be referred to as a second member, second component, second region, second layer, or second portion without departing from the teachings of the exemplary embodiments.

[0040] For ease of description, spatially relative terms such as "above," "above," "below," and "below" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, then elements described as being "above" or "above" other elements would then be positioned "below" or "below" the other elements. Thus, the term "above" may include both "above" and "below" orientations depending on the specific orientation of the drawing. The device may also be positioned in other ways (rotated 90 degrees or in other orientations), and the spatially relative terms used herein may be interpreted accordingly.

[0041] The terms used herein describe specific embodiments only, and the present disclosure is not limited thereto. As used herein, unless the context clearly indicates otherwise, the singular is intended to include the plural. It will be further understood that when the terms "comprise" and / or "comprising" are used in this specification, the presence of the stated features, integers, steps, operations, components, elements and / or groups thereof is enumerated, but the presence or addition of one or more other features, integers, steps, operations, components, elements and / or groups thereof is not excluded.

[0042] Hereinafter, embodiments of the present disclosure will be described with reference to schematic diagrams illustrating embodiments of the present disclosure. In the accompanying drawings, variations in the shapes shown may be expected, for example, due to manufacturing techniques and / or tolerances. Thus, for example, the embodiments of the present disclosure should not be interpreted as being limited to the specific shapes of the regions shown herein, but rather include variations in shapes resulting from manufacturing. The following embodiments may also be constructed from one or a combination of embodiments.

[0043] The contents of the present disclosure described below may have various configurations, and only required configurations are presented here, but are not limited thereto.

[0044] When defining directions to clearly describe the embodiments in the present disclosure, X, Y, and Z in the drawings represent a length direction, a width direction, and a thickness direction of the multilayer capacitor and the electronic component, respectively.

[0045] Here, in embodiments, the Z direction may have the same meaning as a stacking direction along which dielectric layers are stacked on each other.

[0046] Figure 1 is a schematic perspective view of a multilayer capacitor applied to an exemplary embodiment, Figure 2A and Figure 2B are shown for Figure 1 a plan view of a first inner electrode and a second inner electrode of a multilayer capacitor, Figure 3 It is along Figure 1A cross-sectional view taken along line II'.

[0047] In the following, reference will be made to Figures 1 to 3 The structure of multilayer capacitor 100 applied to the electronic component of the present embodiment is described.

[0048] The multilayer capacitor 100 may be a multilayer ceramic capacitor and may include a capacitor body 110 and first and second external electrodes 131 and 132, respectively disposed on both ends of the capacitor body 110 in an X direction, which is defined as a first direction.

[0049] The capacitor body 110 may be formed by stacking a plurality of dielectric layers 111 in the Z direction and sintering the stacked dielectric layers 111. Adjacent dielectric layers 111 of the capacitor body 110 are integrated so that a boundary therebetween may not be apparent without using a scanning electron microscope (SEM).

[0050] The capacitor body 110 may include a plurality of dielectric layers 111 and first and second internal electrodes 121 and 122, which are alternately arranged in the Z direction with the respective dielectric layers 111 interposed therebetween. The first and second internal electrodes 121 and 122 may have opposite polarities to each other.

[0051] The capacitor body 110 may include an active area and cover areas 112 and 113 .

[0052] The effective region is a portion that contributes to the capacitance of the multilayer capacitor.

[0053] Cover regions 112 and 113 may be provided as edge portions on upper and lower portions of the active region in the Z direction, respectively. Cover regions 112 and 113 may be provided by stacking a single dielectric layer or at least two dielectric layers on upper and lower surfaces of the active region, respectively.

[0054] The cover regions 112 and 113 may serve to prevent the first and second internal electrodes 121 and 122 from being damaged due to physical stress or chemical stress.

[0055] The shape of the capacitor body 110 is not limited and may have an overall hexahedral shape in some embodiments.

[0056] In this embodiment, if Figure 1As shown in FIG, the capacitor body 110 has a hexahedral shape including a first surface 1, a second surface 2, a third surface 3, a fourth surface 4, a fifth surface 5, and a sixth surface 6. The first surface 1 and the second surface 2 are opposite to each other in the Z direction, the third surface 3 and the fourth surface 4 are connected to the first surface 1 and the second surface 2 and are opposite to each other in the X direction, and the fifth surface 5 and the sixth surface 6 are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other in the Y direction. The first surface 1 may be a mounting surface. Here, based on Figure 1 In the orientation in FIG, the first surface 1 and the second surface 2 may be referred to as a lower surface and an upper surface, respectively, the third surface 3 and the fourth surface 4 may be referred to as end surfaces, and the fifth surface 5 and the sixth surface 6 may be referred to as side surfaces.

[0057] The shape and size of the capacitor body 110 and the number of laminated dielectric layers 111 are not limited to the shapes, sizes, and numbers shown in the drawings of this embodiment.

[0058] The dielectric layer 111 may include ceramic powder, such as BaTiO 3 -based ceramic powder.

[0059] BaTiO3 based ceramic powder can be a mixture of calcium (Ca), zirconium (Zr) and the like partially dissolved in BaTiO3 (Ba 1-x Ca x )TiO3、Ba(Ti 1-y Ca y )O3、(Ba 1-x Ca x )(Ti 1-y Zr y )O3、Ba(Ti 1-y Zr y )O3, etc., but not limited to these.

[0060] Ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may also be added to the dielectric layer 111 .

[0061] The ceramic additive may include, for example, transition metal oxides, transition metal carbides, rare earth elements, magnesium (Mg), aluminum (Al), and the like.

[0062] The first and second internal electrodes 121 and 122 may be electrodes to which voltages of opposite polarities may be applied. Each of the first and second internal electrodes 121 and 122 may be formed on the dielectric layer 111 and may be stacked in the Z direction.

[0063] The first and second internal electrodes 121 and 122 may be alternately disposed inside the capacitor body 110 and opposed to each other in the Z direction, with a single dielectric layer 111 interposed between adjacent first and second internal electrodes 121 and 122. In this case, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by the dielectric layer 111 disposed therebetween.

[0064] In the present embodiment, it is shown and described that a plurality of internal electrodes are stacked in the Z direction. However, the present disclosure is not limited thereto and can be applied to a structure in which internal electrodes are stacked in the Y direction as needed.

[0065] One end portion of the first inner electrode 121 may be exposed through the third surface 3 of the capacitor body 110. The end portion of the first inner electrode 121 exposed through the third surface 3 of the capacitor body 110 may be connected to a first external electrode 131 disposed on one end portion of the capacitor body 110 in the X direction to be electrically connected to the end portion of the first inner electrode 121.

[0066] One end portion of the second inner electrode 122 may be exposed through the fourth surface 4 of the capacitor body 110. The end portion of the second inner electrode 122 exposed through the fourth surface 4 of the capacitor body 110 may be connected to a second outer electrode 132 disposed on the other end portion of the capacitor body 110 in the X direction to be electrically connected to the end portion of the second inner electrode 122.

[0067] According to the above configuration, when a predetermined voltage is applied to the first and second external electrodes 131 and 132 , charges are accumulated between the first and second internal electrodes 121 and 122 .

[0068] In this case, the capacitance of the multilayer capacitor 100 may be proportional to an overlapping area between the first and second internal electrodes 121 and 122 stacked in the Z direction in the active region.

[0069] The material forming the first and second internal electrodes 121 and 122 is not necessarily limited.

[0070] For example, the first and second internal electrodes 121 and 122 may be formed using a conductive paste formed using a noble metal material or at least one of nickel (Ni) and copper (Cu). The noble metal material may be platinum (Pt), palladium (Pd), a palladium-silver (Pd-Ag) alloy, or the like. Other conductive materials may also be considered within the scope of the present disclosure.

[0071] In this case, a method of printing the conductive paste such as screen printing or gravure printing may be used, but the present disclosure is not limited thereto.

[0072] Voltages having opposite polarities may be supplied to the first and second external electrodes 131 and 132. The first and second external electrodes 131 and 132 may be provided on both ends of the body 110 in the X direction and may be connected to exposed ends of the first and second internal electrodes 121 and 122, respectively, to be electrically connected to each other.

[0073] The first external electrode 131 may include a first head portion 131 a and a first band portion 131 b .

[0074] The first head 131a may be provided on the third surface 3 of the body 110. The first head 131a may contact an end portion of the first inner electrode 121 exposed to the outside through the third surface 3 of the capacitor body 110 to electrically connect the first inner electrode 121 and the first outer electrode 131 to each other.

[0075] The first tape portion 131b extends from the first head 131a to a portion of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 of the body 110. The first tape portion 131b may be used to improve adhesive strength.

[0076] The second external electrode 132 may include a second head portion 132 a and a second band portion 132 b .

[0077] The second head 132a may be disposed on the fourth surface 4 of the body 110. The second head 132a may contact an end portion of the second inner electrode 122 exposed to the outside through the fourth surface 4 of the body 110 to electrically connect the second inner electrode 122 and the second outer electrode 132 to each other.

[0078] The second tape portion 132b extends from the second head portion 132a to a portion of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 of the body 110. The second tape portion 132b may be used to improve adhesive strength.

[0079] The first and second external electrodes 131 and 132 may further include a plating layer.

[0080] The plating layer of the first external electrode 131 includes a first nickel (Ni) plating layer set on the capacitor body 110 and a first tin (Sn) plating layer covering the first nickel (Ni) plating layer, and the plating layer of the second external electrode 132 includes a second nickel (Ni) plating layer set on the capacitor body 110 and a second tin (Sn) plating layer covering the second nickel (Ni) plating layer.

[0081] Figure 4 is a perspective view showing a schematic structure of an electronic component according to an exemplary embodiment, Figure 5 It is along Figure 4 A cross-sectional view taken along line II-II', Figure 6 The first metal frame is shown in FIG. Figure 5 A side view of the structure on the first head in a state where the first conductive bonding layer is separated and formed.

[0082] Reference Figures 4 to 6 According to the present embodiment, the electronic component 101 may include: a multilayer capacitor 100; a first metal frame 140 and a second metal frame 150, respectively connected to a first external electrode 131 and a second external electrode 132 of the multilayer capacitor 100; a first conductive bonding layer 160, arranged between the first external electrode 131 and the first metal frame 140; and a second conductive bonding layer 170, arranged between the second external electrode 132 and the second metal frame 150.

[0083] In this case, each of the first conductive bonding layer 160 and the second conductive bonding layer 170 may have a plurality of discontinuous regions formed to be spaced apart from each other.

[0084] The first metal frame 140 may include a first connection portion 141 and a first mounting portion 142 .

[0085] The first connection portion 141 is a portion coupled to the first head portion 131 a of the first external electrode 131 to be physically connected thereto, and is electrically connected to the first head portion 131 a of the first external electrode 131 .

[0086] In this case, the first conductive bonding layer 160 may be disposed between the first head portion 131 a of the first external electrode 131 and the first connection portion 141 .

[0087] The first conductive bonding layer 160 may be formed using high temperature solder, a conductive bonding material, or the like, but the present disclosure is not limited thereto.

[0088] In this embodiment, the discontinuous region of the first conductive bonding layer 160 may be formed in a linear shape and may be formed to be generally linear in the Y direction. The first conductive bonding layer 160 may include two first conductive bonding portions 161 and 162, and the discontinuous region 181 is provided between the two first conductive bonding portions 161 and 162. Each of the two first conductive bonding portions 161 and 162 may have a polygonal shape.

[0089] In this embodiment, the two first conductive bonding portions 161 and 162 may be arranged in a linear shape and respectively disposed above and below the discontinuous region 181 , and the discontinuous region 181 is interposed between the two first conductive bonding portions 161 and 162 .

[0090] In this case, the first conductive bonding portion 161 disposed above the discontinuous region 181 and the first conductive bonding portion 162 disposed below the discontinuous region 181 may be formed to have the same width in the Z direction. Alternatively, the first conductive bonding portion 161 disposed above the discontinuous region 181 and the first conductive bonding portion 162 disposed below the discontinuous region 181 may be formed to have different widths in the Z direction.

[0091] Therefore, a spacing portion where the first head portion 131 a of the first external electrode 131 and the first connection portion 141 of the first metal frame 140 are not coupled to each other may be provided between the first head portion 131 a and the first connection portion 141 by the discontinuous region 181 .

[0092] For example, an area where the first conductive bonding layer 160 is not bonded to the first head 131a may exist in an area where the first conductive bonding layer 160 and the first head 131a are opposite to each other, and the bonding area where the first conductive bonding layer 160 is bonded to the first head 131a may be divided into a plurality of areas (for example, first conductive bonding portions 161 and 162) spaced apart from each other.

[0093] Due to a difference in thermal expansion coefficients between the first conductive bonding layer 160 and the first external electrode 131 , thermal stress may be generated in a bonding interface between the first conductive bonding layer 160 and the first external electrode 131 .

[0094] According to this embodiment, since the length of the portion where the first conductive bonding layer 160 and the first head portion 131a of the first external electrode 131 are continuously bonded to each other is reduced by the discontinuous region, thermal stress caused by the difference in thermal expansion coefficient in a temperature cycle environment can be reduced. Therefore, degradation of the bonding interface between the first conductive bonding layer 160 and the first head portion 131a can be reduced.

[0095] Similarly, due to a difference in thermal expansion coefficients between the first conductive bonding layer 160 and the first metal frame 140 , thermal stress may be generated in a bonding interface between the first conductive bonding layer 160 and the first metal frame 140 .

[0096] According to this embodiment, since the length of the portion where the first conductive bonding layer 160 and the first connection portion 141 are continuously bonded to each other is reduced by the discontinuous region, thermal stress caused by the difference in thermal expansion coefficient in a temperature cycle environment can be reduced. Therefore, degradation of the bonding interface between the first conductive bonding layer 160 and the first connection portion 141 can be reduced.

[0097] The first mounting portion 142 may be bent from a lower end of the first connection portion 141 in the X-direction (first direction), and may extend to the mounting surface in a horizontal direction.

[0098] When the electronic component 101 is mounted on a board, the first mounting portion 142 may function as a connection terminal.

[0099] The first mounting portion 142 may be disposed to be spaced apart from a lower end of the multilayer capacitor 100 .

[0100] The second metal frame 150 may include a second connection portion 151 and a second mounting portion 152 .

[0101] The second connection part 151 may be physically connected to the second head portion 132 a of the second external electrode 132 , and may be electrically connected to the second head portion 132 a of the second external electrode 132 .

[0102] In this case, the second conductive bonding layer 170 may be disposed between the second head portion 132 a of the second external electrode 132 and the second connection portion 151 .

[0103] The second conductive bonding layer 170 may be formed using high temperature solder, a conductive bonding material, etc., but the present disclosure is not limited thereto.

[0104] In this embodiment, the discontinuous region of the second conductive bonding layer 170 may be formed in a linear shape and may be formed to be generally linear in the Y direction. The second conductive bonding layer 170 may include two second conductive bonding portions 171 and 172, and the discontinuous region 191 is provided between the two second conductive bonding portions 171 and 172.

[0105] In this embodiment, the two second conductive joints 171 and 172 may be arranged in a linear shape and respectively disposed above and below the discontinuous region 191, with the discontinuous region 191 being interposed between the two second conductive joints 171 and 172. In other words, the two second conductive joints 171 and 172 are separated by the discontinuous region 191.

[0106] In this case, the second conductive bonding portion 171 disposed above the discontinuous region 191 and the second conductive bonding portion 172 disposed below the discontinuous region 191 may be formed to have the same width in the Z direction. Alternatively, the second conductive bonding portion 171 disposed above the discontinuous region 191 and the second conductive bonding portion 172 disposed below the discontinuous region 191 may be formed to have different widths in the Z direction.

[0107] Therefore, a spacing portion where the second head portion 132 a of the second external electrode 132 and the second connection portion 151 of the second metal frame 150 are not coupled to each other may be provided between the second head portion 132 a and the second connection portion 151 by the discontinuous region 191 .

[0108] For example, an area where the second conductive bonding layer 170 is not bonded to the second head 132a may exist in an area where the second conductive bonding layer 170 and the second head 132a are opposite to each other, and the bonding area where the second conductive bonding layer 170 is bonded to the second head 132a may be divided into a plurality of areas (for example, second conductive bonding parts 171 and 172) spaced apart from each other.

[0109] Due to a difference in thermal expansion coefficients between the second conductive bonding layer 170 and the second external electrode 132 , thermal stress may be generated in a bonding interface between the second conductive bonding layer 170 and the second external electrode 132 .

[0110] According to this embodiment, since the length of the portion where the second conductive bonding layer 170 and the second head portion 132a of the second external electrode 132 are continuously bonded to each other is reduced by the discontinuous region, thermal stress caused by the difference in thermal expansion coefficient in a temperature cycle environment can be reduced. Therefore, degradation of the bonding interface between the second conductive bonding layer 170 and the second head portion 132a can be reduced.

[0111] Similarly, due to a difference in thermal expansion coefficients between the second conductive bonding layer 170 and the second metal frame 150 , thermal stress may be generated in a bonding interface between the second conductive bonding layer 170 and the second metal frame 150 .

[0112] According to this embodiment, since the length of the portion where the second conductive bonding layer 170 and the second connection portion 151 are continuously bonded to each other is reduced by the discontinuous region, thermal stress caused by the difference in thermal expansion coefficient in a temperature cycle environment can be reduced. Therefore, degradation of the bonding interface between the second conductive bonding layer 170 and the second connection portion 151 can be reduced.

[0113] The second mounting portion 152 may be bent from a lower end of the second connection portion 151 in the X-direction (first direction), and may extend to the mounting surface in a horizontal direction.

[0114] When the electronic component 101 is mounted on a board, the second mounting portion 152 may function as a connection terminal.

[0115] The second mounting portion 152 may be disposed to be spaced apart from a lower end of the multilayer capacitor 100 .

[0116] In the present disclosure, discontinuous regions of the first conductive bonding layer and the second conductive bonding layer may be patterned into various structures and changed into various forms.

[0117] The first conductive bonding layer and the second conductive bonding layer are substantially the same except that the second conductive bonding layer is provided on the head of the second external electrode. Therefore, the description will be given focusing on the first conductive bonding layer, but the description will be deemed to include the description of the second conductive bonding layer.

[0118] Figure 7 is a cross-sectional view of an electronic component according to another exemplary embodiment, Figure 8 The first metal frame is shown in FIG. Figure 7 A side view of the structure on the first head in a state where the first conductive bonding layer is separated and formed.

[0119] Reference Figure 7 and Figure 8 , the discontinuous region can be formed in a linear shape and can be formed to be generally linear in the Y direction.

[0120] In addition, the plurality of discontinuous regions may be disposed at a certain interval in the Z direction so as to be spaced apart from each other.

[0121] In this embodiment, a plurality of first conductive bonding portions 161a, 161b, 161c, and 161d may be provided to have a linear shape while being spaced apart from one another, and a plurality of discontinuous regions 181a, 181b, and 181c spaced apart along the Z direction provided on the first head portion 131a are interposed between the plurality of first conductive bonding portions 161a, 161b, 161c, and 161d.

[0122] In this case, the plurality of discontinuous regions 181 a , 181 b , and 181 c may be formed to have the same width in the Z direction.

[0123] As another example, unlike what is shown in the drawings, a plurality of discontinuous regions 181a, 181b and 181c may be formed so that some of the discontinuous regions 181a, 181b and 181c have the same width in the Z direction, or all of the discontinuous regions 181a, 181b and 181c may have different widths in the Z direction.

[0124] In addition, the plurality of first conductive coupling parts 161 a , 161 b , 161 c , and 161 d may be formed to have the same width in the Z direction.

[0125] As another example, unlike what is shown in the accompanying drawings, the plurality of first conductive joining portions 161a, 161b, 161c and 161d may be formed so that some of the first conductive joining portions 161a, 161b, 161c and 161d are formed to have the same width in the Z direction, or all of the first conductive joining portions 161a, 161b, 161c and 161d have different widths in the Z direction.

[0126] Therefore, a plurality of spacers may be provided between the first head portion 131 a and the first connection portion 141 of the first metal frame 140 through the plurality of discontinuous regions 181 a , 181 b , and 181 c .

[0127] A plurality of second conductive joining portions 171a, 171b, 171c and 171d may be provided to have a linear shape while being spaced apart from one another, and a plurality of discontinuous regions 191a, 191b and 191c spaced apart along the Z direction provided on the second head portion 132a are interposed between the plurality of second conductive joining portions 171a, 171b, 171c and 171d.

[0128] In this case, the plurality of discontinuous regions 191 a , 191 b , and 191 c may be formed to have the same width in the Z direction.

[0129] As another example, unlike what is shown in the drawings, a plurality of discontinuous regions 191a, 191b and 191c may be formed so that some of the discontinuous regions 191a, 191b and 191c have the same width in the Z direction, or all of the discontinuous regions 191a, 191b and 191c may have different widths in the Z direction.

[0130] In addition, the plurality of second conductive coupling portions 171 a , 171 b , 171 c , and 171 d may be formed to have the same width in the Z direction.

[0131] As another example, unlike what is shown in the accompanying drawings, the plurality of second conductive bonding portions 171a, 171b, 171c and 171d may be formed so that some of the second conductive bonding portions 171a, 171b, 171c and 171d are formed to have the same width in the Z direction, or all of the second conductive bonding portions 171a, 171b, 171c and 171d have different widths in the Z direction.

[0132] Therefore, a plurality of spacers may be provided between the second head portion 132 a and the second connection portion 151 of the second metal frame 150 through the plurality of discontinuous regions 191 a , 191 b , and 191 c .

[0133] Figure 9 and Figure 10 are side views respectively showing various modified examples of the conductive bonding layer.

[0134] Reference Figure 9 In the first conductive bonding layer 160' provided on the first head 131a, the discontinuous region 181' may be formed in a linear shape and may be formed to be generally linear in the Z direction to space the first conductive bonding portions 161' and 162' apart from each other in the Y direction.

[0135] Similarly, in the second conductive bonding layer provided on the second head, the discontinuous region may be formed in a linear shape, and may be formed to be generally linear in the Z direction.

[0136] As another example, the discontinuous regions may be arranged such that a plurality of discontinuous regions are spaced apart from each other in the Y direction.

[0137] In this case, the plurality of first conductive bonding layers may be disposed on the first head portion and spaced apart from each other at a certain interval along the Y direction, and the corresponding discontinuous regions are interposed between the plurality of first conductive bonding layers.

[0138] A plurality of second conductive bonding layers may be arranged on the second head at a certain interval along the Y direction, and corresponding discontinuous regions are located between the plurality of second conductive bonding layers.

[0139] Reference Figure 10 , the first conductive coupling portion 161 ″ may be formed in the form of a plurality of points that are spaced apart from each other.

[0140] like Figure 10 As shown in FIG, for example, a plurality of first conductive coupling portions 161 ″ may be disposed on the first head portion 131 a in a grid pattern. Thus, the discontinuous region 181 ″ may be formed to generally have a grid shape.

[0141] Reference Figure 6 As an example, 0.40≤A / (A+B)≤0.90, where "A" is the total area of ​​the bonding region of the first conductive bonding layer 160 bonded to the first header 131a or the total area of ​​the bonding region of the second conductive bonding layer 170 bonded to the second header 132a, and "B" is the total area of ​​the discontinuous regions 181 in the first conductive bonding layer 160 or the total area of ​​the discontinuous regions 191 in the second conductive bonding layer 170. In other words, the area of ​​the header covered by the conductive bonding layer is in the range of 35% to 95% of the total area of ​​the corresponding header, preferably, in the range of 40% to 90%.

[0142] Figure 12 It shows Figure 5 A cross-sectional view of a state where electronic components are mounted on a board.

[0143] Reference Figure 12 , the mounting board according to the present embodiment may include a board 210 and first and second electrode pads 221 and 222 disposed to be spaced apart from each other on an upper surface of the board 210 .

[0144] When the first mounting portion 142 and the second mounting portion 152 are in contact with the first electrode pad 221 and the second electrode pad 222 respectively, the electronic component 101 can be mounted on the board 210 by connecting the first mounting portion 142 of the first metal frame 140 to the first electrode pad 221 and connecting the second mounting portion 152 of the second metal frame 150 to the second electrode pad 222.

[0145] In this case, the first mounting portion 142 may be coupled to the first electrode pad 221 by solder 231 to be electrically and physically connected thereto, and the second mounting portion 152 may be coupled to the second electrode pad 222 by solder 232 to be electrically and physically connected thereto.

[0146] A multilayer capacitor according to the related art has a structure in which external electrodes and boards are brought into direct contact with each other by solder during board mounting.

[0147] Therefore, since thermal deformation or mechanical deformation occurring in the board is directly transferred to the multilayer capacitor, it may be difficult for the multilayer capacitor to ensure a high level of reliability.

[0148] In the electronic component 101 according to this embodiment, the first and second metal frames 140 and 150 may be respectively coupled to both ends of the multilayer capacitor 100 to ensure a spacing between the first and second external electrodes 131 and 132 of the multilayer capacitor 100 and the board 210 .

[0149] Therefore, when the electronic component 101 is mounted on the board 210 , stress from the board 210 can be prevented from being directly transferred to the multilayer capacitor 100 , thereby improving thermal reliability, electrical reliability, mechanical reliability, etc. of the electronic component 101 .

[0150] However, in the case of an electronic component using a metal frame, a conductive bonding layer is provided between the metal frame and the external electrodes to form bonding interfaces between the metal frame and the conductive bonding layer and between the external electrodes and the conductive bonding layer.

[0151] Under environmental conditions such as temperature cycles, thermal stress may be generated in the bonding interface between the conductive bonding layer and the metal frame and in the bonding interface between the conductive bonding layer and the external electrodes due to differences in thermal expansion coefficients.

[0152] Since such thermal stress degrades a bonding interface, causing the metal frame and the external electrodes to be separated from each other, physical defects or electrical defects may occur in the electronic component.

[0153] Generally, in an electronic component using a metal frame, an integral conductive bonding layer is formed on a head portion of an external electrode of a multilayer capacitor to be continuously connected to an entire region corresponding to a connection portion of the metal frame.

[0154] In addition, in this embodiment, the conductive bonding layer formed in the head of the external electrode has a discontinuous area. Therefore, the conductive bonding layer formed on a single head is divided into a plurality of conductive bonding layers spaced apart from each other, rather than a continuously connected integral conductive bonding layer.

[0155] In the electronic component according to the related art, since thermal stress is applied to the entire length of the conductive bonding layer and the head of the external electrode having different thermal expansion coefficients, the thermal stress may increase in a temperature cycle environment.

[0156] Furthermore, in this embodiment, the discontinuous region where the conductive bonding layer and the head of the external electrode are separated from each other without being bonded to each other can reduce the length of the bonding surface where thermal stress is generated. Therefore, the possibility of degradation of the bonding surface due to thermal stress in a temperature cycling environment can be reduced.

[0157] As a result, the continuous length of the portion where the external electrode and the metal frame are bonded to each other can be reduced due to the discontinuous region. Therefore, the thermal stress caused by the difference in thermal expansion coefficient can be dispersed and reduced, thereby suppressing the degradation of the bonding interface between the conductive bonding layer and the external electrode in a temperature cycling environment.

[0158] As described above, the metal frame structure can prevent the reduction in reliability and warpage resistance of electronic components due to external stress, and can inhibit the degradation of the bonding interface due to the difference in thermal expansion coefficients between the metal frame and the conductive bonding layer and between the external electrode and the conductive bonding layer.

[0159] Therefore, according to this embodiment, the bonding strength of the multilayer capacitor and the metal frame can be ensured to a certain level or higher while improving the reliability of the electronic component, and interface degradation in a temperature cycle environment can be suppressed to improve the adhesive strength.

[0160] Figure 11 is a graph showing the detachment rate at room temperature and the detachment rate after temperature cycling (TC) according to the ratio of the bonding area in the conductive bonding layer.

[0161] In the conductive bonding layer, the area of ​​the bonding region to which the conductive bonding material is applied and the area of ​​the discontinuous region (non-bonding region) to which the conductive bonding material is not applied can be measured by the following method.

[0162] In a multilayer capacitor incorporating a metal frame, the conductive bonding layer may be polished in a direction perpendicular to the mounting surface of the multilayer capacitor (e.g., the X direction) to a portion having half the size in the X direction. Of the polished surface, the areas of the portion to which the conductive bonding material is applied and the portion to which the conductive bonding material is not applied may be measured using an optical microscope.

[0163] In this case, when the bonding area between the conductive bonding layer and the head of the external electrode is very small, the adhesive strength of the external electrode may be reduced. In addition, when the discontinuous area (non-bonding area) is very small, the effect of alleviating thermal stress may be reduced.

[0164] For example, there is an appropriate ratio between the bonding area and the discontinuous area. To confirm this, the bonding strength of the metal frame and the multilayer capacitor was evaluated based on the ratio between the bonding area and the discontinuous area.

[0165] To confirm the adhesive strength of the multilayer capacitors, 20 electronic components were mounted on a printed circuit board (PCB) using a sheet mounter under each condition, and then a force of 10 N was applied at a rate of 1 mm / min for 10 seconds. The detachment rate was used to evaluate whether the multilayer capacitors separated from the metal frame.

[0166] When "A" is the sum of the total area of ​​the bonding area of ​​the conductive bonding layer observed in the polished cross section and "B" is the sum of the total area of ​​the discontinuous area (non-bonding area), the bonding strength at room temperature and the bonding strength after 1000 temperature cycles (-40°C to 125°C) were tested based on the ratio of A to (A+B) (i.e., A / (A+B)). The ratio A / (A+B) represents the ratio of the total area of ​​the head of the external electrode covered by the conductive bonding layer to the total area of ​​the corresponding head of the external electrode.

[0167] In addition, the detachment rate of the room temperature test and the detachment rate after temperature cycling (-40℃ to 25℃) are Figure 11 and shown in Table 1.

[0168] Table 1

[0169]

[0170]

[0171] Refer to Table 1 and Figure 11 , in the adhesion strength test at room temperature, the conductive bonding layer did not support the outer electrode, and the multilayer capacitor was separated from the metal frame (i.e., detachment occurred) under the condition that A / (A+B) was 35% or less.

[0172] In addition, under the condition that A / (A+B) is 40% or greater (the discontinuous area is reduced and the total area of ​​the conductive bonding layer is increased), the multilayer capacitor is not separated from the metal frame (ie, detachment does not occur).

[0173] However, in the adhesion strength test after temperature cycling, the multilayer capacitor separated from the metal frame (i.e., detached) under the condition that A / (A+B) was 35% or less and under the condition that A / (A+B) was 95% or greater (the total area of ​​the conductive bonding layer was relatively large).

[0174] For example, when the bonding area between the conductive bonding layer and the head of the external electrode is very large, the bonding strength at room temperature is high, but the bonding strength in a temperature cycle environment decreases due to degradation of the bonding area between the conductive bonding layer and the head of the external electrode.

[0175] Therefore, forming a discontinuous region having a predetermined level in the conductive bonding layer is effective in preventing degradation of the bonding region between the conductive bonding layer and the head of the external electrode in a temperature cycle environment.

[0176] According to this embodiment, when A / (A+B) is 0.40 to 0.90, the bonding strength at room temperature can be ensured in the structure of the multilayer capacitor combined with the metal frame, and the interface degradation in the temperature cycling environment can be suppressed to improve the bonding strength after environmental testing.

[0177] As described above, the durability of the multilayer capacitor against vibration and deformation can be improved, and the bonding strength between the multilayer capacitor and the metal frame can be improved while preventing the adhesion from deteriorating after environmental testing. As a result, the reliability of the electronic component can be improved.

[0178] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. An electronic component comprising: capacitor body; a pair of external electrodes, respectively disposed on ends of the capacitor body in the length direction; a pair of metal frames; as well as a conductive bonding layer disposed between the external electrode and the metal frame and connecting each of the pair of metal frames to a corresponding one of the pair of external electrodes, and having a discontinuous region, Wherein, 0.40≤A / (A+B)≤0.90, wherein A is the total area of ​​the bonding regions in the conductive bonding layer, and B is the total area of ​​the discontinuous regions in the conductive bonding layer.

2. The electronic component according to claim 1, wherein The discontinuous region is formed to have a linear shape.

3. The electronic component according to claim 1, wherein The discontinuous region is formed to have a dot shape.

4. The electronic component according to claim 1, wherein The discontinuous region has a grid shape.

5. The electronic component according to claim 1, wherein The discontinuous region includes a plurality of discontinuous regions formed to be spaced apart from each other. The electronic component according to claim 5 , wherein: The discontinuous region includes a plurality of discontinuous regions formed to be spaced apart from each other in a width direction of the capacitor body.

7. The electronic component according to claim 5, wherein The discontinuous region includes a plurality of discontinuous regions formed to be spaced apart from each other in a thickness direction of the capacitor body.

8. The electronic component according to claim 1, wherein The capacitor body includes a dielectric layer and a plurality of inner electrodes, the plurality of inner electrodes being alternately arranged with the dielectric layer interposed between adjacent inner electrodes.

9. The electronic component according to claim 1, wherein The outer electrode comprises: a head portion provided on an end surface of the capacitor body; and A band portion extends from the head portion to a portion of the upper surface, a portion of the lower surface, and portions of both side surfaces of the capacitor body.

10. The electronic component according to claim 9, wherein The metal frame comprises: a connecting portion connected to the head; and The mounting portion is bent and extended from the lower end of the connecting portion.

11. The electronic component according to any one of claims 1 to 10, wherein: The pair of metal frames are spaced apart from the pair of external electrodes in the length direction.

12. A mounting plate having an electronic component mounted thereon, comprising: a board having a plurality of electrode pads disposed on an upper surface of the board; and According to any one of claims 1 to 11, each of the pair of metal frames is connected to a corresponding one of the plurality of electrode pads.

13. An electronic assembly comprising: a pair of metal frames each having a connection surface, the pair of metal frames being spaced apart from each other in a length direction and arranged so that the connection surfaces face each other in the length direction; a conductive bonding layer provided on each of the connection surfaces, the conductive bonding layer having a plurality of conductive bonding portions provided discontinuously; as well as a capacitor having a pair of external electrodes provided on opposite end surfaces of the capacitor, the capacitor being provided between the pair of metal frames so that the pair of external electrodes respectively contact the plurality of conductive joints on the corresponding metal frames, Wherein, a total area of ​​one of the pair of external electrodes covered by the plurality of conductive bonding portions is in a range from 40% to 90% of a total area of ​​the corresponding external electrode facing the connection surface.

14. The electronic component according to claim 13, wherein The conductive bonding portions are spaced apart from each other.

15. The electronic component according to claim 13, wherein The pair of metal frames are spaced apart from the pair of external electrodes in the length direction.

16. The electronic component according to claim 13, wherein The capacitor is a multilayer ceramic capacitor.

17. The electronic component according to claim 13, wherein Each of the plurality of conductive bonding parts has a polygonal shape.

18. The electronic component according to claim 13, wherein Each of the pair of metal frames includes a mounting portion extending perpendicularly from the connection surface and toward the other of the pair of metal frames, Wherein, the capacitor is arranged to be spaced apart from the mounting portion.

19. The electronic component according to claim 18, wherein The capacitor includes an inner electrode disposed perpendicular to the connection surface and the mounting portion.

20. The electronic assembly according to claim 18, wherein The capacitor includes an inner electrode disposed parallel to the mounting portion and perpendicular to the connection surface.

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