Millimeter wave phased array antenna array integrated adapter

Abstract

The present invention provides a millimeter-wave phased array antenna array integrated conversion joint, comprising a metal ground, terminals arranged on the front side of the metal ground, and metal needles arranged on the back side of the metal ground. The terminals and the metal needles are connected in a one-to-one correspondence to form an inner conductor. The metal ground serves as an outer conductor, and the terminals when viewed from the front side of the metal ground or the metal needles when viewed from the back side of the metal ground are arranged in an array. An impedance medium is filled between the inner conductor and the outer conductor. The present invention uses a millimeter-wave phased array antenna array integrated conversion joint, directly integrating a 4*4-channel RF signal switching interconnection, greatly reducing the number of ordinary RF connectors used and reducing the manufacturing cost of the phased array antenna array.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a millimeter wave phased array antenna array integrated conversion joint. Background Art

[0002] Millimeter-wave phased array antennas are increasingly being used in mobile communication systems. Due to their high operating frequency and large array size, millimeter-wave phased array antennas are relatively small and expensive to manufacture. Microstrip-based phased array antennas are widely used in beamforming communication systems due to their flat structure, small size, ease of fabrication, and low cost.

[0003] The traditional method for interconnecting microstrip antenna arrays with multi-channel RF transceiver components is to use a multi-stage RF connector in series, where SMP connectors are installed on the antenna array and transceiver components, and the components are interconnected via KK connectors. This method requires three sets of connectors. For large-scale phased arrays, the excessive number of RF connectors leads to increased RF signal transmission loss and increased system costs. Furthermore, the assembly of SMP connectors and KK connectors requires structural thickness, resulting in an excessively large gap between the antenna and transceiver components, hindering miniaturization. Furthermore, the installation of SMPs requires a sintering process, and large-scale antenna arrays and transceiver components require a large number of SMP connectors, making it difficult to ensure process consistency, which directly affects the performance of the entire system.

[0004] Direct integration between antenna arrays and transceiver components has also been achieved using coupled feeds. However, this approach exhibits significant mutual coupling at millimeter-wave frequencies, making implementation difficult. Furthermore, this coupling approach cannot independently test the functions of individual channels within the transceiver. Therefore, achieving low-loss, compact, and consistent RF interconnection between microstrip phased array antennas and multi-channel transceivers is an urgent challenge.

[0005] Patent document CN206516752U discloses a millimeter-wave 64-element tile phased array antenna based on a tile structure, including a 2*2 TR component array, each TR component subarray channel number is 4*4, a total of 64 subarray channels; each TR component includes a transceiver channel module, a power module, a control module and a structural cavity, the power module is connected to the external interface, the power module and the control module are vertically interconnected through pins, the control module and the transceiver channel module are connected through gold wire bonding, and the three modules are placed in parallel in sequence, but this design still cannot solve the problem of compact structure and good consistency of RF interconnection. Summary of the Invention

[0006] In view of the defects in the prior art, the object of the present invention is to provide a millimeter wave phased array antenna array integrated conversion joint.

[0007] According to the present invention, a millimeter wave phased array antenna array integrated conversion joint is provided, comprising a metal ground, a terminal arranged on the front surface of the metal ground, and a metal pin arranged on the back surface of the metal ground;

[0008] The terminals and the metal needles are connected one-to-one to form an inner conductor, the metal ground is an outer conductor, and the terminals on the front side or the metal needles on the back side of the metal ground are arranged in an array when viewed from above;

[0009] An impedance medium is filled between the inner conductor and the outer conductor.

[0010] Preferably, the impedance medium is made of Teflon.

[0011] Preferably, the terminal adopts an elastic structure.

[0012] Preferably, the terminals on the front side of the metal ground or the metal pins on the back side are arranged in a 4*4 array.

[0013] Preferably, the distance between two adjacent terminals or two adjacent metal needles is half the wavelength of the operating frequency.

[0014] Preferably, the surfaces of the terminal, metal ground and metal needle are all gold-plated.

[0015] Preferably, the metal floor has one or more mounting holes and one or more positioning holes.

[0016] Preferably, the diameter of the terminal is 0.4 mm, and the retractable elastic range is 0 to 0.4 mm;

[0017] The diameter of the metal needle is 0.4 mm and the length is 1 mm.

[0018] Preferably, when in use, the terminal is connected to the printed circuit board radio frequency interface of the transceiver component in a solder-free crimping manner.

[0019] Preferably, the metal needle is connected to the microstrip antenna by welding or bonding with conductive adhesive.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The present invention adopts a millimeter-wave phased array antenna array integrated conversion connector, which directly integrates 4*4-way RF signal switching interconnection, greatly reducing the number of ordinary RF connectors used and reducing the manufacturing cost of the phased array antenna array.

[0022] 2. The present invention directly connects the signal of the radio frequency transceiver component to the antenna without any conversion connector in the middle, thereby reducing the insertion loss caused by the conversion connector and improving the performance of the radio frequency path.

[0023] 3. The present invention adopts a millimeter-wave phased array antenna array integrated conversion joint. The performance consistency between the multiple connectors on the integrated joint is ensured by a tight-fitting fixation method. Compared with the traditional method of welding or bonding multiple independent SMP joints, its consistency is greatly improved. The entire integrated joint only requires simple screw fastening installation, which greatly simplifies the installation process.

[0024] 4. The present invention adopts a millimeter-wave phased array antenna array integrated conversion connector. The phased array communication system can independently test and evaluate the performance of each transceiver channel. Compared with the integration of microstrip antenna and transceiver components, it has more flexibility.

[0025] 5. The present invention adopts a millimeter-wave phased array antenna array integrated conversion connector, which is integrated with the box structure of the transceiver component to reduce the weight and volume of the entire phased array antenna system. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Other features, objects and advantages of the present invention will become more apparent upon reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0027] Figure 1 It is a front structural schematic diagram of the present invention;

[0028] Figure 2 It is a side structural schematic diagram of the present invention;

[0029] Figure 3 It is a schematic diagram of the reverse structure of the present invention;

[0030] Figure 4 This is an exploded schematic diagram of the installation structure of an example of the present invention;

[0031] Figure 5 This is a standing wave simulation diagram in Example 2 of the present invention;

[0032] Figure 6 This is a simulation diagram of insertion loss in Example 2 of the present invention.

[0033] The figure shows:

[0034] Terminal 1 Positioning hole 5

[0035] Metal ground 2 Microstrip array antenna 6

[0036] Metal needle 3 integrated conversion connector 7

[0037] Mounting hole 4 Transceiver component printed circuit board 8 DETAILED DESCRIPTION

[0038] The present invention will be described in detail below with reference to specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those skilled in the art, several changes and improvements can be made without departing from the scope of the present invention. These all fall within the scope of protection of the present invention.

[0039] Example 1:

[0040] The present invention provides a millimeter-wave phased array antenna array integrated conversion connector, comprising a metal ground 2, terminals 1 arranged on the front of the metal ground 2, and metal needles 3 arranged on the back of the metal ground 2. The terminals 1 and the metal needles 3 are connected in a one-to-one correspondence to form an inner conductor. The terminals 1 employ an elastic structure, such as an elastic and retractable wool button. The metal ground 2 serves as the outer conductor, and the terminals 1 on the front or the metal needles 3 on the back of the metal ground 2 are arranged in an array when viewed from above. The terminals 1 on the front or the metal needles 3 on the back of the metal ground 2 are preferably arranged in a 4*4 array. An impedance medium is filled between the inner and outer conductors and is matched to 50 ohms. The impedance medium is preferably made of Teflon.

[0041] The distance between two adjacent terminals 1 or two adjacent metal needles 3 is half the wavelength of the operating frequency.

[0042] In practical applications, the metal floor 2 is provided with one or more mounting holes 4 and one or more positioning holes 5 for easy installation and fixing.

[0043] When in use, the front side of the present invention is connected to the PCB radio frequency interface of the transceiver component, which adopts a solder-free crimping method. The back side is connected to the microstrip antenna, which is fixed to the metal ground 2 on the back side of the connector by welding or conductive adhesive bonding. The antenna feed is connected to the metal probe on the back side of the connector by welding or conductive adhesive bonding.

[0044] Example 2:

[0045] This embodiment is a preferred example of embodiment 1.

[0046] In this embodiment, Figure 1 、 Figure 2 、 Figure 3 As shown, the integrated conversion connector 7 includes 16 front elastic terminals 1, a metal ground 2, and 16 back metal needles 3, wherein the front terminals 1 and the back metal needles 3 are interconnected, and the millimeter wave signal is transmitted between the terminals 1 and the metal needles 3.

[0047] Terminals 1 and metal needles 3 are arranged in a 4x4 array, with a spacing of half the operating wavelength. The specific dimensions are determined by the operating center frequency. Terminal 1 has a diameter of 0.4mm and an elastic range of 0 to 0.4mm. Metal needles 3 also have a diameter of 0.4mm and a length of 1mm.

[0048] The terminal 1 and the metal needle 3 are the inner conductors of the adapter, and the metal ground 2 is the outer conductor of the adapter. Teflon dielectric is filled between the inner and outer conductors, and 50 ohm impedance matching is performed.

[0049] The terminal 1 and the printed circuit board of the transceiver component are interconnected by a soldering-free crimping method, and the metal needle 3 and the microstrip antenna are interconnected by a soldering method.

[0050] The surfaces of the terminal 1, the metal ground 2, and the reverse metal pin 3 are all gold-plated.

[0051] There are two positioning holes 5 and five mounting holes 4 on the metal ground 2. Figure 3 shown.

[0052] The millimeter wave phased array antenna array integrated conversion joint of the present invention is suitable for millimeter wave phased array antenna array systems, and is particularly suitable for antenna arrays in the form of microstrip lines. Figure 4 The figure shows an exploded view of the structure of an example using the millimeter-wave phased array antenna array integrated conversion joint. In this example, only four of the integrated conversion joints 7 are used to achieve direct interconnection between the 64-unit microstrip array antenna 6 and the transceiver component printed circuit board 8. It has a compact structure, simple installation, and excellent performance, and can be widely used in large-scale planar millimeter-wave phased array antenna array systems.

[0053] Figure 5 This is a standing wave simulation diagram of the single-channel RF adapter in the present invention. The horizontal axis is frequency in GHz, and the vertical axis is input return loss VSWR. The result shows that VSWR is ≤ 1.03 in the frequency range of 25 GHz to 30 GHz.

[0054] Figure 6 The insertion loss simulation diagram of the single-channel RF adapter in the present invention is given, and the result is S21≤-0.1dB in the frequency range of 25GHz to 30GHz. The simulation results of the remaining 15-channel adapters are exactly the same as the single adapter.

[0055] The present invention utilizes a 4x4 array-type integrated RF adapter. One end of the adapter is crimped to the transceiver assembly using a solderless elastic button. The other end of the adapter is a probe, soldered to feed the microstrip antenna array. The metal center portion of the adapter serves as both a shielding enclosure for the transceiver assembly and a reflector for the microstrip array antenna. The inner and outer conductors of the adapter are filled with dielectric and matched to 50 ohms. This invention enables interconnection between a 16-element microstrip antenna array and a 16-channel transceiver assembly, with low loss, compact structure, good consistency, small size, and ease of integration and installation.

[0056] In the description of this application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0057] The above describes specific embodiments of the present invention. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art may make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. The embodiments of this application and the features in the embodiments may be combined with each other in any manner unless there is a conflict.

Claims

1. A millimeter wave phased array antenna array integrated conversion joint, characterized in that: The integrated design of the box structure is adopted to directly realize the connection of the radio frequency transceiver component signal to the antenna without any conversion connector in the middle, comprising a metal ground (2), a terminal (1) arranged on the front of the metal ground (2), and a metal pin (3) arranged on the back of the metal ground (2); The terminals (1) and the metal needles (3) are connected in a one-to-one correspondence to form an inner conductor, the metal ground (2) is an outer conductor, and the terminals (1) on the front side or the metal needles (3) on the back side of the metal ground (2) are arranged in an array when viewed from above, the inner ends of the terminals (1) and the inner ends of the metal needles (3) are connected and are both located inside the metal ground (2), and the outer ends of the terminals (1) and the outer ends of the metal needles (3) extend to the outside of the metal ground (2); An impedance medium is filled between the inner conductor and the outer conductor; The impedance medium is made of Teflon; The terminal (1) adopts an elastic structure, the front terminal (1) and the back metal needle (3) are interconnected, and the millimeter wave signal is transmitted between the terminal (1) and the metal needle (3); The terminals (1) on the front side of the metal ground (2) or the metal pins (3) on the back side are arranged in a 4*4 array; The distance between two adjacent terminals (1) or two adjacent metal needles (3) is half the wavelength of the operating frequency; The performance consistency between the multi-way connectors on the integrated joint is ensured by the tight fit fixing method, and the entire integrated joint can be fastened and installed by screws; The phased array communication system can independently test and evaluate the performance of each transmit and receive channel; When in use, the front side of the metal ground (2) is connected to the radio frequency interface of the printed circuit board of the transceiver component, using a solder-free crimping method, and the back side is connected to the microstrip antenna, which is fixed to the metal ground (2) on the back side of the connector by soldering or conductive adhesive bonding; The surfaces of the terminal (1), the metal ground (2), and the metal needle (3) are all gold-plated; The metal ground (2) has one or more (4) and one or more positioning holes (5).

2. The millimeter wave phased array antenna array integrated conversion connector according to claim 1, characterized in that: The terminal (1) has a diameter of 0.4 mm and a retractable elastic range of 0 to 0.4 mm; The metal needle (3) has a diameter of 0.4 mm and a length of 1 mm.

3. The millimeter wave phased array antenna array integrated conversion connector according to claim 1, characterized in that: When in use, the terminal (1) is connected to the radio frequency interface of the printed circuit board of the transceiver component in a solder-free crimping manner.

4. The millimeter wave phased array antenna array integrated conversion connector according to claim 1, characterized in that: The metal needle (3) is connected to the microstrip antenna by welding or conductive adhesive bonding.

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