A temperature control compensation system for a multi-chip module and a method of making the same

Abstract

The application discloses a temperature control compensation system for a multi-chip assembly and a preparation method thereof, and relates to the technical field of microelectronic heat dissipation. The temperature control compensation system comprises a heat dissipation assembly, a temperature sensing assembly, a heating assembly and a peripheral circuit control unit. After the multi-chip assembly and the heat dissipation assembly are integrated, the heat dissipation assembly is used to transport heat, the temperature sensing assembly is arranged on the front surface of the multi-chip assembly, the heating assembly is arranged on the front surface of the first heat dissipation assembly in the heat dissipation assembly and the lower surface of the multi-chip assembly, the heating state of the corresponding heating unit in the heating assembly is controlled according to the temperature of each chip unit in the multi-chip assembly fed back by the temperature sensing assembly, the temperature of the low-temperature chip unit is increased, the temperature difference between the multiple chip units caused by the micro-flow heat dissipation assembly and the difference in mounting processes is reduced, and the temperature uniformity of the multi-chip assembly heat dissipation is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of microelectronic heat dissipation technology, and in particular to a temperature control compensation system for a multi-chip assembly and a preparation method thereof. BACKGROUND

[0002] In many electronic systems or devices, such as supercomputers, active phased array radars, laser radars, etc., there are multiple chips that need to be cooled, and the temperature uniformity of the multiple chips is required to be high. When the temperature distribution of the multiple chips is uneven, the performance of the electronic system or device will be reduced. For example, for an active phased array radar, when the surface temperature difference of the heat sources of two T / R components (the part between the video and the antenna in a wireless transceiver system) exceeds 10 degrees Celsius, the phase deviation of the output signal will affect the beam spatial synthesis performance of the antenna, resulting in a decrease in the overall performance of the antenna. For a laser radar with a semiconductor laser as a light source, the wavelength of the semiconductor laser is sensitive to temperature, and the emission wavelength of the semiconductor laser changes by 0.2-0.3 nanometers per degree Celsius. When the temperature of the semiconductor laser is uneven, the laser wavelength will shift, thereby affecting the measurement results. Therefore, an effective cooling method is needed to cool the multiple chips and ensure the temperature uniformity of the multiple chips.

[0003] At present, the main methods for cooling multiple chips include air cooling, patch cooling, and embedded cooling. Due to the large size of the air cooling system, it cannot achieve uniform cooling at a high level, resulting in a large temperature deviation. The liquid cooling system still has uneven temperature distribution of the multiple chips due to factors such as thermal interface material, processing deviation, cooling medium flow uniformity, etc. In terms of improving the temperature uniformity of multiple chips, the current air cooling, patch cooling, and embedded liquid cooling methods for cooling multiple chips all use passive methods, such as improving the air cooling structure. Topological optimization of the micro-channel structure and liquid distribution structure of the patch cooling and embedded cooling improves the processing requirements and system design requirements of the cooling system, thereby greatly increasing the cost of the system. SUMMARY

[0004] The present application aims to provide a temperature control compensation system for a multi-chip assembly and a preparation method thereof to solve the problem of uneven temperature distribution of multiple chips and low stability of the cooling system.

[0005] In a first aspect, the present application provides a temperature control compensation system for a multi-chip assembly, which comprises a cooling assembly, a temperature sensing assembly, a heating assembly, and a peripheral circuit control unit. The temperature sensing assembly and the heating assembly are electrically connected to the peripheral circuit control unit.

[0006] The heat dissipation assembly is located on one side of the multi-chip assembly and is configured to dissipate heat generated by the multi-chip assembly;

[0007] The temperature sensing assembly is configured to acquire real-time temperatures of each chip unit in the multi-chip assembly and send the real-time temperatures of each chip unit to the peripheral circuit control unit;

[0008] The peripheral circuit control unit is configured to control heating states of corresponding heating units in the heating assembly based on the real-time temperatures of each chip unit, wherein each heating unit is used to heat a corresponding chip unit;

[0009] The heating assembly is located on one side of the multi-chip assembly and is configured to heat a corresponding chip unit with a temperature lower than a preset value by using the heating units under the control of the peripheral circuit control unit.

[0010] In the above technical solution, the multi-chip assembly and the heat dissipation assembly are integrated, heat is transported by the heat dissipation assembly, a temperature sensing assembly is arranged on the front of the multi-chip assembly, a heating assembly is arranged on the front of the first heat dissipation assembly in the heat dissipation assembly and the bottom of the multi-chip assembly, each heating unit in the heating assembly controls the temperature of one heat source chip, and the heating states of corresponding heating units in the heating assembly are controlled according to the temperatures of each chip unit in the multi-chip assembly fed back by the temperature sensing assembly, so as to improve the temperature of a low-temperature chip unit, reduce the temperature difference between multiple chip units caused by differences in micro-flow heat dissipation assemblies and mounting processes, and realize temperature control compensation of multi-chip assembly heat dissipation and improve the temperature uniformity of multi-chip assembly heat dissipation.

[0011] In a possible implementation, the heat dissipation assembly includes a first heat dissipation unit and a second heat dissipation unit arranged on the first heat dissipation unit, and the multi-chip assembly is located on the second heat dissipation unit;

[0012] The second heat dissipation unit includes a second heat dissipation substrate with a micro-flow channel, an inlet and an outlet, the inlet, the micro-flow channel and the outlet are sequentially connected, and the openings of the inlet and the outlet are both directed to the first heat dissipation unit;

[0013] The first heat dissipation unit includes a first heat dissipation substrate with an inlet channel and an outlet channel, the inlet channel is connected to the inlet, and the outlet channel is connected to the outlet;

[0014] When the heat dissipating assembly dissipates the heat generated by the multi-chip assembly, the cooling liquid enters from the inlet channel, and flows out after sequentially passing through the inlet, the micro-channel, the outlet and the outlet channel.

[0015] In a possible implementation, the heating assembly comprises a plurality of heating units, each of which is located at a side of the heat dissipating assembly facing the multi-chip assembly and is arranged opposite to a corresponding chip unit in the multi-chip assembly.

[0016] In a possible implementation, the multi-chip assembly comprises a plurality of chip units, each of which comprises a heat source chip and a thermal interface material layer; each of the heat source chips is located on a corresponding thermal interface material layer, each of the thermal interface material layers is located on a corresponding heating unit in the heating assembly, and each of the thermal interface material layers is configured to connect the corresponding heat source chip and the corresponding heating assembly.

[0017] In a possible implementation, each of the heating units is arranged opposite to a heat generation area of a corresponding heat source chip.

[0018] In a possible implementation, the composition material of the thermal interface material layer comprises any one of thermally conductive silica gel or non-conductive silicone grease.

[0019] In a possible implementation, the temperature sensing assembly comprises a plurality of temperature sensing units; each of the temperature sensing units is arranged on a corresponding chip unit and is configured to acquire the temperature of the corresponding chip unit, and each of the temperature sensing units is electrically connected to the peripheral circuit control unit and is configured to send the temperature of the corresponding chip unit to the peripheral circuit control unit.

[0020] In a second aspect, the present application further provides a preparation method of a temperature control compensation system for a multi-chip assembly, which is applied to the preparation of the temperature control compensation system in any one of the first aspect, and the preparation method comprises:

[0021] preparing the heat dissipating assembly, the temperature sensing assembly, the heating assembly and the peripheral circuit control unit;

[0022] connecting the temperature sensing assembly, the heating assembly and the peripheral circuit control unit with the heat dissipating assembly;

[0023] connecting the multi-chip assembly with the heating assembly to obtain the temperature control compensation system;

[0024] The heat dissipation assembly is located on one side of the multi-chip assembly and is configured to dissipate heat generated by the multi-chip assembly; the temperature sensing assembly is configured to acquire real-time temperatures of each chip unit in the multi-chip assembly and send the real-time temperatures of each chip unit to the peripheral circuit control unit; the peripheral circuit control unit is configured to control heating states of corresponding heating units in the heating assembly based on the real-time temperatures of each chip unit; each heating unit is used to heat a corresponding chip unit; and the heating assembly is located on one side of the multi-chip assembly and is configured to heat a corresponding chip unit with a temperature lower than a preset value by using the heating units under the control of the peripheral circuit control unit.

[0025] In a possible implementation, the heat dissipation assembly includes a first heat dissipation unit and a second heat dissipation unit arranged on the first heat dissipation unit; and the heat dissipation assembly is prepared by:

[0026] respectively preparing the first heat dissipation unit and the second heat dissipation unit;

[0027] bonding the first heat dissipation unit and the second heat dissipation unit to obtain the heat dissipation assembly.

[0028] In a possible implementation, the second heat dissipation unit includes a second heat dissipation substrate with a micro flow channel, a first liquid inlet and a first liquid outlet; the liquid inlet, the micro flow channel and the liquid outlet are sequentially connected and communicate with each other, and the openings of the liquid inlet and the liquid outlet are both directed to the first heat dissipation unit; the first heat dissipation unit includes a first heat dissipation substrate with a liquid inlet channel and a liquid outlet channel, the liquid inlet channel is connected with the liquid inlet, and the liquid outlet channel is connected with the liquid outlet; when the heat dissipation assembly dissipates the heat generated by the multi-chip assembly, the cooling liquid enters from the liquid inlet channel, sequentially passes through the liquid inlet, the micro flow channel, the liquid outlet and the liquid outlet channel and then flows out; and the first heat dissipation unit and the second heat dissipation unit are respectively prepared by:

[0029] the micro flow channel is made on the back of the second heat dissipation substrate by oxidation, photolithography, reactive ion etching and deep reactive ion etching;

[0030] the liquid inlet and the liquid outlet are made on the second heat dissipation substrate by laser drilling on the side of the first heat dissipation substrate away from the second heat dissipation substrate, and the liquid inlet channel and the liquid outlet channel are made on the first heat dissipation substrate to obtain the first heat dissipation unit and the second heat dissipation unit.

[0031] The preparation method of the temperature control compensation system for the multi-chip assembly has the same beneficial effects as those of the temperature control compensation system for the multi-chip assembly described in the first aspect or any possible implementation manner of the first aspect, which will not be repeated here.

[0032] In a third aspect, the present application further provides a digital-to-analog converter comprising the preparation method of the temperature control compensation system for the multi-chip assembly according to any one of the second aspect.

[0033] The digital-to-analog converter provided in the third aspect has the same beneficial effects as those of the preparation method of the temperature control compensation system for the multi-chip assembly described in the second aspect or any possible implementation manner of the second aspect, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0034] The accompanying drawings, which are included to provide a further understanding of the present application, form a part of the present application and are included to further explain the present application and, together with the description, serve to explain the present application. In the drawings:

[0035] Figure 1 A structure schematic diagram of a temperature control compensation system for a multi-chip assembly provided by an embodiment of the present application is shown;

[0036] Figure 2 A structure schematic diagram of another temperature control compensation system for a multi-chip assembly provided by an embodiment of the present application is shown;

[0037] Figure 3 A flow schematic diagram of a preparation method of a temperature control compensation system for a multi-chip assembly provided by an embodiment of the present application is shown;

[0038] Figure 4 A process schematic diagram of a preparation of the heat dissipation assembly and the heating assembly provided by an embodiment of the present application is shown;

[0039] Figure 5 A structure schematic diagram of bonding of a first heat dissipation substrate and a second heat dissipation substrate provided by an embodiment of the present application is shown;

[0040] Figure 6 A three-dimensional structure schematic diagram of a temperature control compensation system for a multi-chip assembly provided by an embodiment of the present application is shown;

[0041] Figure 7 A hardware structure schematic diagram of an electronic device provided by an embodiment of the present application is shown. BRIEF DESCRIPTION OF DRAWINGS

[0043] 01 - heat dissipation assembly; 02 - temperature sensing assembly; 03 - heating assembly; 04 - peripheral circuit control unit; 05 - multi-chip assembly; 011 - first heat dissipation unit; 0111 - first heat dissipation substrate; 012 - second heat dissipation unit; 0121 - second heat dissipation substrate; a - microfluidic channel; b - liquid inlet; c - liquid outlet; d - liquid inlet channel; e - liquid outlet channel; 031 - heating unit; 051 - chip unit; 0511 - heat source chip; 0512 - thermal interface material layer; 021 - temperature sensing unit; 032 - heating unit pad; 041 - peripheral circuit control module; 042 - peripheral circuit control module power supply interface; 043 - temperature sensing unit power supply interface; 044 - heating assembly power supply interface; 400 - electronic device; 410 - processor; 440 - communication line; 420 - communication interface; 430 - memory. DETAILED DESCRIPTION

[0044] In order to clearly describe the technical solutions of the embodiments of the present application, in the embodiments of the present application, the words "first", "second", etc. are used to distinguish the same items or similar items with basically the same function and effect. For example, the first threshold and the second threshold are only used to distinguish different thresholds, and do not limit the order. Those skilled in the art can understand that the words "first", "second", etc. do not limit the number and execution order, and the words "first", "second", etc. also do not mean that they must be different.

[0045] It should be noted that in the present application, the words "exemplary" or "for example" are used to represent an example, illustration or description. Any embodiment or design scheme described as "exemplary" or "for example" in the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. Rather, the words "exemplary" or "for example" are intended to present the relevant concept in a specific manner.

[0046] In the present application, "at least one" means one or more, and "multiple" means two or more. The association relationship of the associated objects is described, which means that there can be three relationships, for example, A and / or B, which can represent the following cases: A exists alone, A and B exist together, B exists alone, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after it. "At least one of the following" or similar expressions means any combination of these items, including any combination of single item or multiple items. For example, at least one of a, b or c can represent: a, b, c, the combination of a and b, the combination of a and c, the combination of b and c, or the combination of a, b and c, where a, b and c can be single or multiple.

[0047] Figure 1A structural diagram of a temperature control compensation system for a multi-chip assembly is shown in the embodiment of the present application, as shown in Figure 1 The temperature control compensation system for the multi-chip assembly comprises:

[0048] A heat dissipation assembly 01, a temperature sensing assembly 02, a heating assembly 03, and a peripheral circuit control unit 04; the temperature sensing assembly 02 and the heating assembly 03 are electrically connected to the peripheral circuit control unit 04;

[0049] The heat dissipation assembly 01 is located on one side of the multi-chip assembly 05 and is configured to dissipate the heat generated by the multi-chip assembly 05;

[0050] The temperature sensing assembly 02 is configured to obtain the real-time temperature of each chip unit in the multi-chip assembly 05 and send the real-time temperature of each chip unit to the peripheral circuit control unit 04;

[0051] The peripheral circuit control unit 04 is configured to control the heating state of a corresponding heating unit in the heating assembly 03 based on the real-time temperature of each chip unit; each heating unit is used to heat a corresponding chip unit;

[0052] The heating assembly 03 is located on one side of the multi-chip assembly 05 and is configured to heat a corresponding chip unit with a temperature lower than a preset value by using a heating unit under the control of the peripheral circuit control unit 04.

[0053] In summary, the temperature control compensation system for the multi-chip assembly provided in the embodiment of the present application can realize heat transport by system integration of the multi-chip assembly and the heat dissipation assembly, and realize temperature control compensation of multi-chip assembly heat dissipation by setting a temperature sensing assembly on the front of the multi-chip assembly, a heating assembly on the front of the first heat dissipation assembly in the heat dissipation assembly and the bottom of the multi-chip assembly, wherein each heating unit in the heating assembly controls the temperature of one heat source chip, and the heating state of a corresponding heating unit in the heating assembly is controlled according to the temperature of each chip unit in the multi-chip assembly fed back by the temperature sensing assembly, so as to improve the temperature of the low-temperature chip unit and reduce the temperature difference between the multiple chip units caused by the micro-flow heat dissipation assembly and the difference in mounting process, thereby realizing temperature control compensation of multi-chip assembly heat dissipation and improving the temperature uniformity of multi-chip assembly heat dissipation.

[0054] Optionally, Figure 2 A structural diagram of another temperature control compensation system for a multi-chip assembly is shown in the embodiment of the present application, as shown in Figure 2As shown, the heat dissipation assembly 01 includes a first heat dissipation unit 011, and a second heat dissipation unit 012 disposed on the first heat dissipation unit 011, and the multi-chip assembly 05 is located on the second heat dissipation unit 012.

[0055] The second heat dissipation unit 012 includes a second heat dissipation substrate 0121 having a micro-channel a, a liquid inlet b and a liquid outlet c; the liquid inlet b, the micro-channel a and the liquid outlet c are sequentially connected and communicated, and the openings of the liquid inlet b and the liquid outlet c are both directed to the first heat dissipation unit 011.

[0056] The first heat dissipation unit 011 includes a first heat dissipation substrate 0111 having a liquid inlet channel d and a liquid outlet channel e, the liquid inlet channel d is connected and communicated with the liquid inlet b, and the liquid outlet channel e is connected and communicated with the liquid outlet c.

[0057] When the heat dissipation assembly 01 dissipates the heat generated by the multi-chip assembly 05, the cooling liquid enters from the liquid inlet channel d, sequentially passes through the liquid inlet b, the micro-channel a, the liquid outlet c and the liquid outlet channel e, and then flows out.

[0058] Optionally, referring to Figure 2 , the heating assembly 03 includes a plurality of heating units 031, each of which is located on the side of the heat dissipation assembly 01 facing the multi-chip assembly 05, and is disposed opposite to the corresponding chip unit 051 in the multi-chip assembly 05.

[0059] In this application, the number of heating units and the number of chip units are one-to-one corresponding, and the number of chip units and the number of heating units are not specifically limited in the embodiments of the application, and can be adjusted according to the actual application scene.

[0060] Optionally, the heating unit can be a heating resistance wire processed by a complementary metal oxide semiconductor (CMOS) process, which can be made by evaporation sputtering stripping process and other process steps, and can also be other heating parts, which are not specifically limited in the embodiments of the application, and can be adjusted according to the actual application scene.

[0061] Optionally, referring to Figure 2 , the multi-chip assembly 05 includes a plurality of chip units 051, each of which includes a heat source chip 0511 and a thermal interface material layer 0512.

[0062] Each of the heat source chips 0511 is located on a corresponding heat interface material layer 0512, each of the heat interface material layers 0512 is located on a corresponding heating unit 031 in the heating assembly 03, and each of the heat interface material layers 0512 is configured to connect the corresponding heat source chip 0511 and the corresponding heating assembly 03.

[0063] In the present application, the composition of the heat interface material layer includes any one of thermally conductive silica gel or non-conductive silicone grease, and can also include other insulating thermal interface materials, which are not specifically limited in the embodiments of the present application and can be adjusted according to actual application scenarios.

[0064] It should be noted that the thickness of the heat interface material layer is not specifically limited in the embodiments of the present application and can be adjusted according to actual application scenarios.

[0065] Optionally, referring to Figure 2 Each of the heating units 031 is arranged opposite to a heat generation area of the corresponding heat source chip 0511.

[0066] Optionally, referring to Figure 2 The temperature sensing assembly 02 includes a plurality of temperature sensing units 021, each of which is arranged on a corresponding chip unit 051 and used to obtain the temperature of the corresponding chip unit 051, and each of the temperature sensing units 021 is electrically connected to the peripheral circuit control unit 04 and used to send the temperature of the corresponding chip unit 051 to the peripheral circuit control unit 04.

[0067] In the present application, the temperature sensing unit can be a temperature sensing diode or a temperature sensing resistance wire, and can also be other devices that can realize temperature sensing, which are not specifically limited in the embodiments of the present application.

[0068] In the present application, the cooling working medium flows into the heat dissipation assembly, the heat dissipation assembly can dissipate heat for the multi-chip assembly, the temperature sensing array in the temperature sensing assembly can monitor the temperature of each chip unit in the multi-chip assembly in real time and transmit data to the peripheral circuit control unit, the peripheral circuit control unit can independently fine-tune the current of the heating unit in real time according to the temperature of each heat source, and the temperature of part of the heat source is improved, so as to realize temperature control compensation of the multi-chip, improve the temperature uniformity of the multi-chip, and realize temperature deviation <1℃ of multiple heat sources.

[0069] In summary, the temperature control compensation system for the multi-chip assembly provided by the embodiments of the present application can realize heat source heat transport through the system integration of the multi-chip assembly and the heat dissipation assembly, and through the heat dissipation assembly, and through the temperature sensor assembly arranged on the front surface of the multi-chip assembly, the heating assembly arranged on the front surface of the first heat dissipation assembly in the heat dissipation assembly and the lower surface of the multi-chip assembly, wherein each heating unit in the heating assembly controls the temperature of one heat source chip, and the on-off control of the heating state of the corresponding heating unit in the heating assembly is performed according to the temperature of each chip unit in the multi-chip assembly fed back by the temperature sensor assembly, so as to improve the temperature of the low-temperature chip unit, reduce the temperature difference between the multiple chip units caused by the micro-flow heat dissipation assembly and the difference in mounting process, and thus realize the temperature control compensation of the multi-chip assembly heat dissipation and improve the temperature uniformity of the multi-chip assembly heat dissipation.

[0070] Figure 3 A flowchart of a preparation method of a temperature control compensation system for a multi-chip assembly provided by the embodiments of the present application is shown, which is used for preparing Figures 1 to 2 Any of the temperature control compensation systems for a multi-chip assembly, such as Figure 3 As shown, the method comprises:

[0071] Step 101: preparing the heat dissipation assembly, the temperature sensor assembly, the heating assembly and the peripheral circuit control unit.

[0072] In the present application, the heat dissipation assembly comprises a first heat dissipation unit and a second heat dissipation unit arranged on the first heat dissipation unit; the preparation of the heat dissipation assembly comprises:

[0073] Substep A1: respectively preparing the first heat dissipation unit and the second heat dissipation unit;

[0074] Substep A2: bonding the first heat dissipation unit and the second heat dissipation unit to obtain the heat dissipation assembly.

[0075] Optionally, as shown in Figure 2 The heat dissipation assembly 01 comprises a first heat dissipation unit 011 and a second heat dissipation unit 012 arranged on the first heat dissipation unit 011, and the multi-chip assembly 05 is located on the second heat dissipation unit 012. Wherein, the second heat dissipation unit 012 comprises a second heat dissipation substrate 0121 with a micro-flow channel a, a liquid inlet b and a liquid outlet c; wherein the liquid inlet b, the micro-flow channel a and the liquid outlet c are sequentially connected, and the openings of the liquid inlet b and the liquid outlet c are both towards the first heat dissipation unit 011.

[0076] The first heat dissipation unit 011 comprises a first heat dissipation substrate 0111 with an inlet channel d and an outlet channel e, the inlet channel d is in communication with the inlet port b, and the outlet channel e is in communication with the outlet port c.

[0077] When the heat dissipation assembly 01 dissipates the heat generated by the multi-chip assembly 05, the cooling liquid enters from the inlet channel d, sequentially passes through the inlet port b, the micro-channel a, the outlet port c and the outlet channel e, and then flows out. The specific implementation process of the sub-step A1 can include:

[0078] Sub-step B1: the micro-channel is made on the back of the second heat dissipation substrate by oxidation, photolithography, reactive ion etching and deep reactive ion etching.

[0079] Sub-step B2: the inlet port and the outlet port are made on the second heat dissipation substrate by laser drilling on the side of the first heat dissipation substrate away from the second heat dissipation substrate, and the inlet channel and the outlet channel are made on the first heat dissipation substrate, thereby obtaining the first heat dissipation unit and the second heat dissipation unit.

[0080] For example, Figure 4 A process diagram for preparing the heat dissipation assembly and the heating assembly provided by the embodiment of the present application is shown, as shown in Figure 4 (a), according to the distribution position of the heat points of the multi-chip assembly, the heating assembly 03 can be made on the front surface of the second heat dissipation substrate 0121 by oxidation, metal sputtering, photolithography, etching and other processes, wherein the heating assembly 03 can be a heating resistance wire, as shown in Figure 4 (b), the micro-channel a can be made on the back of the second heat dissipation substrate 0121 by oxidation, photolithography, reactive ion etching and deep reactive ion etching.

[0081] Further, the inlet port b, the inlet channel d, the outlet port c and the outlet channel e can be made on the side of the first heat dissipation substrate 0111 away from the second heat dissipation substrate 0121 by laser drilling, thereby obtaining the first heat dissipation unit and the second heat dissipation unit.

[0082] Optionally, in the present application, the material of the first heat dissipation substrate can include silicon, glass, FR4 (epoxy glass cloth laminated board) and other materials, and the embodiment of the present application does not make specific limitation thereon, which can be adjusted according to the actual application scenario.

[0083] In the present application, different bonding methods can be selected according to the material of the substrate, and the bonding method can be selected from Si / Si, Au / Au, Si / glass, Au / Sn bonding and other bonding methods.

[0084] Wherein, different bonding methods need to be selected, and the bonding surface needs to be processed accordingly, and the bonding surface needs to be free of impurities and defects to prevent defects such as loose bonding or substrate breakage.

[0085] For example, if Si / Si bonding is selected, hydrogen fluoride (HF) is used to remove SiO2 on the back surface of the second substrate. For another example, if Au / Au bonding is selected, a layer of gold is evaporated on the back surface of the second substrate and the front surface of the first heat dissipation substrate by magnetron sputtering. When the second substrate material is glass, Si / glass bonding can be selected.

[0086] Step 102: connecting the temperature sensing component, the heating component, and the peripheral circuit control unit with the heat dissipation component.

[0087] In this application, the heating component and the peripheral circuit control unit can be bonded on the front surface of the second substrate by epoxy glue or the like.

[0088] Step 103: connecting the multi-chip component with the heating component to obtain the temperature control compensation system.

[0089] Wherein, each chip unit in the multi-chip component can be one-to-one corresponding to a heating unit in the heating component, and the back surface of the chip unit and the heating unit are bonded by a layer of thermal interface material such as heat-conducting silicone or non-conductive silicone grease, wherein the thermal interface material layer needs to ensure insulation to prevent affecting the heating unit, and the thermal interface material can be applied by a chip glue machine to make the thickness of the thermal interface material layer under the multiple chip units uniform.

[0090] Optionally, the connection of the chip component and the heating component with the peripheral circuit control unit can be achieved by gold wire bonding.

[0091] In this application, Figure 5 A structure diagram of bonding of a first heat dissipation substrate and a second heat dissipation substrate is shown, as shown in Figure 5 As shown, the first heat dissipation substrate 0111 and the second heat dissipation substrate 0121 can be bonded according to the alignment coordinates to prevent large positional deviation during bonding.

[0092] In the present application, the heat dissipation assembly is located on one side of the multi-chip assembly and is configured to dissipate the heat generated by the multi-chip assembly; the temperature sensing assembly is configured to obtain the real-time temperature of each chip unit in the multi-chip assembly and send the real-time temperature of each chip unit to the peripheral circuit control unit; the peripheral circuit control unit is configured to control the heating state of the corresponding heating unit in the heating assembly based on the real-time temperature of each chip unit; wherein each heating unit is used to heat the corresponding chip unit; the heating assembly is located on one side of the multi-chip assembly and is configured to heat the corresponding chip unit with a temperature lower than a preset value under the control of the peripheral circuit control unit by using the heating unit.

[0093] Figure 6 A three-dimensional structure diagram of a temperature control compensation system for a multi-chip assembly is shown, as shown in Figure 6 Taking a chip assembly including four chip units as an example, the three layers from bottom to top are a first heat dissipation substrate 0111, a second heat dissipation substrate 0121, and four heat source chips 0511. The first heat dissipation substrate 0111 is bonded with the back of the second heat dissipation substrate 0121, and the four heat source chips 0511 are bonded one by one with the heating assembly 03 through an insulating thermal interface material layer. The temperature sensing assembly 02 (which can be a temperature measuring diode or a temperature measuring resistance wire) integrated on the heat source chip 0511 can monitor the temperature of the heat source chip 0511 in real time, and adjust the current of part of the heating assembly 03 through the peripheral circuit control unit 04, so as to fine-tune the temperature of the corresponding heat source chip 0511, and realize the temperature uniformity of the multi-chip. Wherein, the heating assembly 03 includes a heating unit 031 and a heating unit pad 032, and the first heat dissipation substrate 0111 includes a liquid inlet channel d and a liquid outlet channel e, in Figure 6 The structure diagram of the peripheral circuit control unit is shown, wherein the peripheral circuit control unit 04 includes an electrically connected peripheral circuit control module 041, a peripheral circuit control module power supply interface 042, a temperature sensing unit power supply interface 043, and a thermal assembly power supply interface 044.

[0094] Here, only one implementation measure is given by way of example, but the actual implementation is not limited to this. Other similar temperature control methods and systems can be used to realize the temperature control compensation method and system of the multi-chip heat dissipation, or other heat dissipation methods can be used to realize the heat transport method, which also belongs to the implementation measures of the present application.

[0095] The application can realize heat source heat transport through the heat dissipation assembly after system integration of the multi-chip assembly and the heat dissipation assembly, set the temperature sensing assembly on the front surface of the multi-chip assembly, set the heating assembly on the front surface of the first heat dissipation assembly in the heat dissipation assembly and the lower surface of the multi-chip assembly, each heating unit in the heating assembly controls the temperature of one heat source chip, and the heating state of the corresponding heating unit in the heating assembly is controlled according to the temperature of each chip unit in the multi-chip assembly fed back by the temperature sensing assembly, so as to improve the temperature of the low-temperature chip unit and reduce the temperature difference between the multiple chip units caused by the micro-flow heat dissipation assembly and the mounting process difference, thereby realizing temperature control compensation of the multi-chip assembly heat dissipation, improving the temperature uniformity of the multi-chip assembly heat dissipation, and realizing high-precision temperature control requirements.

[0096] The temperature control compensation system for the multi-chip assembly provided by the application embodiment has flexible temperature control, the heating assembly corresponds to the heat source chip one by one, thereby realizing independent temperature regulation of each heat source, and in the listed embodiment, the transmission path is short, the thermal interface material is less, and there is only one layer of thermal interface material between the embedded micro-flow channel heat dissipation assembly and the heat source chip, thereby avoiding the influence of the long transmission path and multiple layers of thermal interface material on the heat dissipation performance.

[0097] In summary, the preparation method of the temperature control compensation system for the multi-chip assembly provided by the application embodiment can prepare the heat dissipation assembly, the temperature sensing assembly, the heating assembly and the peripheral circuit control unit, connect the temperature sensing assembly, the heating assembly and the peripheral circuit control unit with the heat dissipation assembly, connect the multi-chip assembly with the heating assembly, and obtain the temperature control compensation system. After system integration of the multi-chip assembly and the heat dissipation assembly, the heat source heat transport can be realized through the heat dissipation assembly, the heating assembly and the temperature sensing assembly are set on the front surface of the multi-chip assembly, and the heating state of the corresponding heating unit in the heating assembly is controlled according to the temperature of each chip unit in the multi-chip assembly fed back by the temperature sensing assembly, so as to improve the temperature of the low-temperature chip unit and reduce the temperature difference between the multiple chip units caused by the micro-flow heat dissipation assembly and the mounting process difference, thereby realizing temperature control compensation of the multi-chip assembly heat dissipation, improving the temperature uniformity of the multi-chip assembly heat dissipation.

[0098] Figure 7 A hardware structure schematic diagram of an electronic device provided by an embodiment of the application is shown. Figure 7 As shown in the figure, the electronic device 400 includes a processor 410.

[0099] As shown in Figure 7 The processor 410 can be a general central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits for controlling the execution of programs of the present application.

[0100] As shown in Figure 7 The electronic device 400 can further include a communication line 440. The communication line 440 can include a path for transmitting information between the components.

[0101] Optionally, as shown in Figure 7 The electronic device can further include a communication interface 420. The communication interface 420 can be one or more. The communication interface 420 can use any transceiver-like device for communicating with other devices or communication networks.

[0102] Optionally, as shown in Figure 7 The electronic device can further include a memory 430. The memory 430 is used to store computer execution instructions for executing the present application, and is controlled by the processor to execute. The processor is used to execute the computer execution instructions stored in the memory, so as to realize the method provided by the embodiments of the present application.

[0103] As shown in Figure 7 The memory 430 can be a read-only memory (ROM) or other type of static storage device that can store static information and instructions, a random access memory (RAM) or other type of dynamic storage device that can store information and instructions, an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disk storage, a magnetic disk storage medium or other magnetic storage device, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer, but is not limited to this. The memory 430 can exist independently and be connected to the processor 410 through the communication line 440. The memory 430 can also be integrated with the processor 410.

[0104] Optionally, the computer-executable instructions in the embodiments of the present application can also be referred to as application codes, and the embodiments of the present application do not make specific limitations thereto.

[0105] In a specific implementation, as an embodiment, as shown in Figure 7 the processor 410 can include one or more CPUs, such as CPU0 and CPU1 in Figure 7 .

[0106] In a specific implementation, as an embodiment, as shown in Figure 7 the terminal device can include multiple processors, such as the processor 410 and the processor in Figure 7 . Each of these processors can be a single-core processor or a multi-core processor.

[0107] In an aspect, a computer-readable storage medium is provided, and the computer-readable storage medium stores instructions, when the instructions are executed, the functions performed by the terminal device in the above embodiments are implemented.

[0108] In the above embodiments, all or part of the embodiments can be implemented by software, hardware, firmware, or any combination thereof. When implemented by software, all or part of the embodiments can be implemented in the form of a computer program product. The computer program product includes one or more computer programs or instructions. When the computer programs or instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present application are performed. The computer can be a general-purpose computer, a special-purpose computer, a computer network, a terminal, a user equipment, or other programmable devices. The computer programs or instructions can be stored in a computer-readable storage medium or transferred from one computer-readable storage medium to another computer-readable storage medium, for example, the computer programs or instructions can be transferred from one website, computer, server, or data center to another website, computer, server, or data center through wired or wireless means. The computer-readable storage medium can be any available medium accessible by a computer or a data storage device such as a server, data center, etc. that integrates one or more available media. The available media can be a magnetic medium, such as a floppy disk, a hard disk, a magnetic tape; an optical medium, such as a digital video disc (DVD); or a semiconductor medium, such as a solid state drive (SSD).

[0109] Although the application has been described in connection with various embodiments thereof, it will be understood that the application is capable of further modifications and that this application is intended to cover any and all such variations, using the scope of the claims. In the claims, the term comprising does not exclude the presence of other elements or steps than those listed in a claim. The term "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. A single processor or other unit can fulfil the functions of several items recited in the claims. The terms "first", "second" and the like in the description do not necessarily imply that there are two or more items. Embodiments of the application can relate to any of the specific features and combinations thereof without necessarily referring to the corresponding drawings.

[0110] Although the application has been described in connection with specific embodiments thereof, it will be understood that it is capable of further modifications and this application is intended to cover any and all such variations, using the scope of the claims. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense. It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Therefore, it is intended that the present application cover all such modifications and variations of the application that come within the scope of the appended claims and their equivalents.

Claims

1. A temperature control compensation system for a multi-chip module, comprising: The temperature control and compensation system includes: a heat dissipation component, a temperature sensing component, a heating component, and a peripheral circuit control unit; the temperature sensing component and the heating component are both electrically connected to the peripheral circuit control unit. The heat dissipation component is located on one side of the multi-chip assembly and is configured to dissipate heat generated by the heat source of the multi-chip assembly; the multi-chip assembly includes: multiple chip units; The temperature sensing component is configured to acquire the real-time temperature of each chip unit in the multi-chip component and send the real-time temperature of each chip unit to the peripheral circuit control unit. The peripheral circuit control unit is configured to control the heating state of the corresponding heating unit in the heating assembly based on the real-time temperature of each chip unit; wherein each heating unit is used to heat the corresponding chip unit; The heating component is located on one side of the multi-chip assembly and is configured under the control of the peripheral circuit control unit to heat the corresponding chip unit whose temperature is lower than the preset value. The heat dissipation assembly includes a first heat dissipation unit and a second heat dissipation unit disposed on the first heat dissipation unit, wherein the multi-chip assembly is located on the second heat dissipation unit; The second heat dissipation unit includes a second heat dissipation substrate having a microchannel, a liquid inlet, and a liquid outlet; wherein the liquid inlet, the microchannel, and the liquid outlet are connected in sequence, and the openings of the liquid inlet and the liquid outlet both face the first heat dissipation unit; The first heat dissipation unit includes a first heat dissipation substrate having an inlet channel and an outlet channel, wherein the inlet channel is connected to the inlet port and the outlet channel is connected to the outlet port; When the heat dissipation component dissipates the heat generated by the multi-chip component, the coolant enters from the inlet channel, passes through the inlet port, microchannel, outlet port and outlet channel in sequence, and then flows out. The heating assembly includes multiple heating units, each of which is disposed opposite to a corresponding chip unit in the multi-chip assembly. Cooling fluid flows into the heat dissipation component, which dissipates heat from the multi-chip assembly. The temperature sensing array in the temperature sensing component monitors the temperature of each chip unit in the multi-chip assembly in real time and transmits the data to the peripheral circuit control unit. The peripheral circuit control unit independently and in real time fine-tunes the heating unit current according to the temperature of each heat source, thereby increasing the temperature of some heat sources, thus realizing temperature control compensation for the multi-chip, improving the temperature uniformity of the multi-chip, and achieving a temperature deviation of < 1℃ for multiple heat sources.

2. The temperature control compensation system for a multiple-chip assembly of claim 1, wherein, Each of the heating units is located on the side of the heat dissipation assembly facing the multi-chip assembly.

3. The temperature control compensation system for a multiple-chip module of claim 1, wherein, Each of the chip units includes a heat source chip and a thermal interface material layer; each heat source chip is located on a corresponding thermal interface material layer, each thermal interface material layer is located on a corresponding heating unit in the heating assembly, and each thermal interface material layer is configured to connect the corresponding heat source chip and the corresponding heating assembly.

4. The temperature control compensation system for a multiple-chip module of claim 3, wherein, Each heating unit is positioned opposite to the heating zone of the corresponding heat source chip.

5. The temperature control compensation system for multi-chip modules according to claim 3, characterized in that, The thermal interface material layer is composed of either thermally conductive silicone or non-conductive silicone grease.

6. The temperature control compensation system for a multi-chip assembly according to any one of claims 1-5, characterized in that, The temperature sensing component includes: a plurality of temperature sensing units; each temperature sensing unit is disposed on a corresponding chip unit for acquiring the temperature of the corresponding chip unit, and each temperature sensing unit is electrically connected to the peripheral circuit control unit for sending the temperature of the corresponding chip unit to the peripheral circuit control unit.

7. A method for fabricating a temperature control compensation system for a multi-chip assembly, characterized in that, The method of preparing the temperature control compensation system according to any one of claims 1-6 includes: Prepare the heat dissipation component, the temperature sensing component, the heating component, and the peripheral circuit control unit; Connect the temperature sensing component, the heating component, and the peripheral circuit control unit to the heat dissipation component; The multi-chip assembly is connected to the heating assembly to obtain the temperature control compensation system; The heat dissipation component is located on one side of the multi-chip assembly and is configured to dissipate heat generated by the multi-chip assembly. The temperature sensing component is configured to acquire the real-time temperature of each chip unit in the multi-chip assembly and send the real-time temperature of each chip unit to the peripheral circuit control unit. The peripheral circuit control unit is configured to control the heating state of the corresponding heating unit in the heating assembly based on the real-time temperature of each chip unit. Each heating unit is used to heat the corresponding chip unit. The heating assembly is located on one side of the multi-chip assembly and is configured to heat the corresponding chip unit with a temperature lower than a preset value under the control of the peripheral circuit control unit.

8. The method for preparing a temperature control compensation system for a multi-chip assembly according to claim 7, characterized in that, The heat dissipation assembly includes a first heat dissipation unit and a second heat dissipation unit disposed on the first heat dissipation unit; the fabrication of the heat dissipation assembly includes: The first heat dissipation unit and the second heat dissipation unit are fabricated respectively; The first heat dissipation unit and the second heat dissipation unit are bonded together to obtain the heat dissipation component.

9. The method for preparing a multi-chip temperature control compensation system according to claim 8, characterized in that, The second heat dissipation unit includes a second heat dissipation substrate having a microchannel, a first liquid inlet, and a first liquid outlet; wherein the liquid inlet, the microchannel, and the liquid outlet are sequentially connected, and the openings of the liquid inlet and the liquid outlet both face the first heat dissipation unit; the first heat dissipation unit includes a first heat dissipation substrate having an inlet channel and an outlet channel, the inlet channel being connected to the inlet, and the outlet channel being connected to the outlet; when the heat dissipation component dissipates heat from the heat source generated by the multi-chip component, coolant enters from the inlet channel, flows out sequentially through the inlet, the microchannel, the outlet, and the outlet channel; the preparation of the first heat dissipation unit and the second heat dissipation unit includes: The microchannels are fabricated on the back side of the second heat dissipation substrate by oxidation, photolithography, reactive ion etching, and deep reactive ion etching. The liquid inlet and the liquid outlet are formed on the second heat dissipation substrate by laser drilling on the side of the first heat dissipation substrate away from the second heat dissipation substrate, and the liquid inlet channel and the liquid outlet channel are formed on the first heat dissipation substrate to obtain the first heat dissipation unit and the second heat dissipation unit.

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