Temperature-average chamber, electronic device, and method for manufacturing temperature-average chamber

Abstract

Embodiments of the present application relate to a temperature-averaging chamber, an electronic device, and a method for manufacturing a temperature-averaging chamber. The temperature-averaging chamber includes a first cover plate and a second cover plate located above the first cover plate. The temperature-averaging chamber also includes a first capillary structure layer arranged on the upper surface of the first cover plate facing the second cover plate, which is used to fill a working medium with a heat-evaporating property. The temperature-averaging chamber also includes a second capillary structure arranged on the lower surface facing the first cover plate, which is used to condense the working medium evaporated from the first capillary structure layer from a gaseous state to a liquid state. The temperature-averaging chamber also includes a connector arranged between the first cover plate and the second cover plate, which is used to guide the working medium condensed into a liquid state by the second capillary structure layer to the first capillary structure layer. The temperature-averaging chamber also includes an array-type reflux channel arranged on the first capillary structure layer, which is used to reflux at least a portion of the working medium guided back by the connector to the heat source area of ​​the first capillary structure layer. In this way, the heat transfer capacity of the temperature-averaging chamber can be improved and evaporation overheating can be effectively controlled.

Description

Technical Field

[0001] The present application relates to electronic devices, and more particularly to a heat dissipation structure in electronic devices. Background Art

[0002] With the development of technology, higher and higher requirements are put forward for the functionality and integration of electronic devices. At the same time, since a large number of components are integrated in electronic devices, these components will generate a lot of heat during the operation of electronic devices, which also requires electronic devices to provide the strongest possible heat dissipation performance.

[0003] Vapor Chambers are widely used to dissipate heat from heat source components in electronic devices. For example, a Vapor Chamber (VC) is a two-phase passive radiator that relies on capillary force to drive the cyclic evaporation of the medium. The heat of the heat source is continuously cooled in the Vapor Chamber through the alternating cycle of vaporization and liquefaction. However, in the current cyclic cooling process in the Vapor Chamber, the internal design space of the electronic equipment and the limitations of the heat transfer load will affect the heat dissipation performance, making it difficult to meet the heat dissipation requirements of the electronic equipment. Summary of the invention

[0004] The present application provides a temperature-averaging chamber, an electronic device including the temperature-averaging chamber, and a method for manufacturing the temperature-averaging chamber, which can be used to improve the heat dissipation performance of the temperature-averaging chamber.

[0005] In a first aspect, the present application discloses a temperature-averaging chamber. The temperature-averaging chamber includes a first cover plate and a second cover plate located above the first cover plate. The temperature-averaging chamber also includes a first capillary structure layer. The first capillary structure layer is disposed on the upper surface of the first cover plate and is used to fill a working medium having a heat-evaporating property. The temperature-averaging chamber also includes a second capillary structure layer. The second capillary structure layer is disposed on the lower surface facing the first cover plate. The second capillary structure layer is used to condense the working medium evaporated from the first capillary structure layer from a gaseous state to a liquid state. The temperature-averaging chamber also includes an array-type reflux channel disposed on the first capillary structure layer, and the array-type reflux channel is used to reflux at least a portion of the working medium that refluxes to the first capillary structure layer after condensation through the capillary structure layer to a heat source area of ​​the first capillary structure layer.

[0006] During use, as the heat source continues to generate heat, the heat load of the temperature-averaging chamber continues to grow. After the heat load increases, the flow resistance of the working fluid inside the capillary layer increases due to the increase in the circulating working mass inside the temperature-averaging chamber. When the return liquid flow resistance exceeds the maximum capillary force provided by the capillary core, the capillary core of the first capillary structure layer will be partially burned dry, and the temperature-averaging chamber reaches the heat transfer heat load limit. If the heat transfer heat load limit is achieved by increasing the reflux cross-sectional area of ​​the liquid, that is, increasing the thickness of the first capillary structure layer, it will lead to an increase in the steam escape flow resistance and the increase in the thermal resistance of the capillary core, thereby causing a large evaporation superheat problem. By arranging an array of reflux channels in the temperature-averaging chamber proposed in the first aspect, an additional reflux channel can be established between the non-heat source area and the heat source area of ​​the first capillary structure layer, thereby effectively reducing the return liquid flow resistance and increasing the heat transfer heat load limit, and the gaps between the array reflux channel structures will provide a steam escape channel, reducing the steam escape flow resistance, thereby effectively reducing the evaporation superheat.

[0007] In some embodiments, the temperature-averaging chamber further includes a connector disposed between the first cover plate and the second cover plate, the connector being used to direct the working fluid condensed into a liquid by the second capillary structure layer to a non-heat source region of the first capillary structure layer, wherein the distance between the non-heat source region and the heat source located on the lower surface of the first cover plate is greater than the distance between the heat source region and the heat source.

[0008] In some embodiments, the thickness of the heat source region in the height direction of the temperature uniformity chamber is smaller than the thickness of the non-heat source region in the height direction.

[0009] In some embodiments, the arrayed reflux channels may include a first group of reflux channels and a second group of reflux channels. The first group of reflux channels are connected to the non-heat source region of the first capillary structure layer and the second group of reflux channels, respectively, and are used to guide the working fluid guided by the connector to the first capillary structure layer from the non-heat source region to the second group of reflux channels. The second group of reflux channels are connected to the heat source region of the first capillary structure layer, and are used to guide the working fluid guided by the first group of reflux channels to the heat source region.

[0010] According to the positional relationship between the heat source and the first capillary structure layer, different areas can be divided on the first capillary structure layer, namely the heat source area and the non-heat source area, and multiple groups of reflux channels are set based on the divided areas. Among them, the first group of reflux channels achieves good contact with the non-heat source area and the second group of reflux channels, ensuring that the working fluid condensed into liquid can be guided from the non-heat source area to the second group of reflux channels through the first group of reflux channels. The second group of reflux channels achieves good contact with the heat source area, and refluxes the liquid working fluid guided by the first group of reflux channels to the heat source area, so that a balance can be achieved between the evaporated working fluid in the heat source area and the refluxed working fluid, thereby ensuring a larger heat transfer load and reducing the possibility of overheating in the heat source area.

[0011] For example, when the liquid condensed by the second capillary structure layer is guided by the connecting piece back to the non-heat source area of ​​the first capillary structure layer away from the heat source, a guide path can be formed from the non-heat source area to the first group of reflux channels to the second group of reflux channels and then to the heat source area. In this way, multiple different heat source areas of the first capillary structure layer can be fully utilized, thereby effectively reducing the return liquid flow resistance and thereby improving the thermal load limit of the temperature-averaging chamber.

[0012] In some embodiments, the thickness of the heat source region depends on the evaporation efficiency of the working fluid from the heat source region and the capillary force of the heat source region absorbing the working fluid. In some embodiments, the heat source region is within a thickness range of 50-300 μm.

[0013] Since the heat source area near the heat source of the first capillary structure layer can be set thinner, the thermal conductivity resistance of the powder layer in the heat source area can be effectively reduced. At the same time, the gap between the array powder layers can provide a flow channel for the escape of steam, reduce the flow resistance of steam, and thus effectively control the evaporation superheat.

[0014] In some embodiments, a protrusion that protrudes away from the second cover plate is further formed on the first cover plate, and the heat source area is located at the protrusion.

[0015] In some embodiments, a recessed portion that is recessed toward the second cover plate is further formed on the first cover plate, and the heat source area is located at the recessed portion.

[0016] The shell structure of the temperature-averaging chamber, especially the first cover plate close to the heat source, can be designed in various ways according to the structure of the heat source in the electronic device to meet different requirements on the size and heat dissipation performance of the electronic device.

[0017] In some embodiments, the second set of return channels are arranged to be distributed on the first capillary structure layer along the transverse direction and / or longitudinal direction of the first capillary structure layer or distributed on the first capillary structure layer at an angle to the transverse direction and / or longitudinal direction of the first capillary structure layer.

[0018] In some embodiments, the first group of return channels are arranged to be distributed along the lateral direction or the longitudinal direction of the first capillary structure layer, and are connected to the second group of return channels below the second group of return channels; or are distributed in a manner that is angled with the first group of return channels, and are connected to the second group of return channels below the second group of return channels.

[0019] In some embodiments, the second group of return channels includes a first portion of return channels distributed on the first capillary structure layer along a transverse direction of the first capillary structure layer and a second portion of return channels distributed on the first capillary structure layer along a longitudinal direction of the first capillary structure layer.

[0020] In some embodiments, the first group of reflow channels includes a third partial reflow channel distributed along the lateral direction, connected to one of the first reflow channel or the second reflow channel below the second group of reflow channels; and a fourth partial reflow channel distributed along the longitudinal direction, connected to the other of the first reflow channel and the second reflow channel below the second group of reflow channels.

[0021] In some embodiments, each channel in the first group of reflux channels and the second group of reflux channels may be distributed at a predetermined interval. On the premise of satisfying liquid reflux, the distance between the arrayed reflux channels may be arranged relatively loosely within the range of the heat source area to reduce the thermal conduction temperature difference, thereby reducing the temperature of the local hot spot of the chip.

[0022] In some embodiments, the connecting member may include a material having a porous structure, and the material having a porous structure is used to guide the working medium condensed into a liquid state from the second capillary structure layer to the first capillary structure layer.

[0023] In some embodiments, the material having a porous structure is also used to guide the working medium condensed into a liquid state from the second capillary structure layer to the array-type reflux channel.

[0024] In this way, the connector uses the material with a porous structure arranged thereon to guide the liquid condensed through the second capillary structure layer back to the first capillary structure layer and / or the array reflux channel, so as to cooperate with the first capillary structure layer and the second capillary structure layer to form a cooling cycle inside the temperature uniformity chamber.

[0025] In some embodiments, the connector is configured to be connected between the second capillary structure layer and the non-heat source area of ​​the first capillary structure layer. On the first capillary structure layer, the connector can be connected only to the non-heat source area away from the heat source to promote the evaporation effect of the heat source area. At the same time, as long as the flow diversion is satisfied, the connector can be arranged as little as possible.

[0026] In some embodiments, the cross-section of the array-type reflow channel is at least one of rectangular, circular or trapezoidal.

[0027] In some embodiments, the porous structure included in the array-type reflow channels includes at least one of a sintered powder structure, a woven mesh structure, and a metal fiber structure.

[0028] The arrangement of various reflux channels can be realized according to factors such as the size of the temperature-averaging chamber, the positional relationship between the heat source and the temperature-averaging chamber, the expected heat load carrying capacity, etc. Thus, the reflux channels of the temperature-averaging chamber can be realized in a flexible arrangement to meet different heat dissipation requirements.

[0029] In some embodiments, the first capillary structure layer and / or the second capillary structure layer is a layer having a porous structure.

[0030] In some embodiments, the material having a porous structure is configured as a layer having a porous structure.

[0031] In some embodiments, the porous structure includes at least one of a sintered powder structure, a woven mesh structure, and a metal fiber structure.

[0032] In some embodiments, the porous structure is formed from copper powder, copper wire, or aluminum powder.

[0033] The porous structure in the evaporation layer can be formed by a variety of materials, thereby providing a variety of possibilities for the manufacturing method of the temperature-uniform chamber, thereby controlling the manufacturing cost of the temperature-uniform chamber.

[0034] In some embodiments, the temperature-average chamber may further include a heat sink, which is arranged above the second cover plate of the housing and configured to facilitate heat exchange between the temperature-average chamber and the external environment.

[0035] In a second aspect, the present application discloses an electronic device. The electronic device may include an electronic component and a temperature-averaging chamber disclosed according to the first aspect and any one of the embodiments of the first aspect. The electronic component is arranged below the heat source area of ​​the first cover plate, and the temperature-averaging chamber is used to dissipate heat from the electronic component.

[0036] In a third aspect, the present application discloses a method for manufacturing a uniform temperature chamber. The method includes providing a first cover plate and a second cover plate located above the first cover plate. A first capillary structure layer is provided on the upper surface of the first cover plate facing the second cover plate, and the first capillary structure layer is used to fill a working fluid having a heated evaporation characteristic. A second capillary structure layer is provided on the lower surface of the second cover plate facing the first cover plate, and the second capillary structure layer is used to condense the working fluid evaporated from the first capillary structure layer from a gaseous state to a liquid state. An array of reflux channels is provided on the first capillary structure layer, and the array of reflux channels is used to guide at least a portion of the working fluid that refluxes to the first capillary structure layer after condensation through the capillary structure layer to the heat source area of ​​the first capillary structure layer.

[0037] In some embodiments, the method further includes: providing a connector, which is disposed between the first cover plate and the second cover plate and is used to guide the working medium condensed into a liquid by the second capillary structure layer to the first capillary structure layer.

[0038] It should be understood that the contents described in the summary of the invention are not intended to limit the key or important features of the embodiments of the present application, nor are they intended to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The above and other features, advantages and aspects of the various embodiments of the present application will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, wherein:

[0040] Figure 1 A schematic diagram of an electronic device in which one embodiment of the present application can be implemented is shown;

[0041] Figure 2 A schematic diagram of a temperature-averaging chamber according to an embodiment of the present application is shown;

[0042] Figure 3 A three-dimensional diagram of a temperature-averaging chamber according to an embodiment of the present application is shown;

[0043] Figure 4 Shows Figure 2 The cross-sectional view of the temperature-averaging cavity along line AA;

[0044] Figure 5 Shows Figure 2 The cross-sectional view of the temperature-averaging cavity along line BB;

[0045] Figure 6A-6C A schematic diagram showing the distribution of the reflux channels of the temperature-averaging chamber according to an embodiment of the present application;

[0046] Figure 7A-7C A schematic diagram showing the distribution of the reflux channels of the temperature-averaging chamber according to an embodiment of the present application;

[0047] Figure 8 A schematic diagram of a temperature-averaging chamber according to an embodiment of the present application is shown;

[0048] Fig. 9 A schematic diagram showing a temperature-averaging chamber according to an embodiment of the present application; and

[0049] Fig.10 A flow chart of a method for manufacturing a temperature-uniform chamber according to one embodiment of the present application is shown. DETAILED DESCRIPTION

[0050] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be interpreted as being limited to the embodiments described herein. Instead, these embodiments are provided to provide a more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not intended to limit the scope of protection of the present application.

[0051] In the description of the embodiments of the present application, the term "including" and similar terms should be understood as open inclusion, that is, "including but not limited to". The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc. can refer to different or the same objects. Other explicit and implicit definitions may also be included below.

[0052] As mentioned above, with the development of technology, higher and higher requirements are put forward for the functionality and integration of electronic devices. At the same time, since a large number of components are integrated in electronic devices, and these components generate a lot of heat during the operation of electronic devices, this also requires electronic devices to provide the strongest possible heat dissipation performance.

[0053] Vapor Chambers are widely used to dissipate heat from heat source components in electronic devices. For example, a Vapor Chamber (VC) is a two-phase passive radiator that relies on capillary force to drive the cyclic evaporation of the medium. The heat of the heat source is continuously cooled in the Vapor Chamber through the alternating cycle of vaporization and liquefaction.

[0054] Specifically, in the conventional solution, the temperature-averaging chamber includes, for example, capillary layers arranged on the upper and lower covers of the temperature-averaging chamber, a powder ring connecting the upper and lower capillary layers, and a cavity formed between the upper and lower capillary layers. The heat of the heat source is conducted to the capillary layer of the lower cover plate through the lower cover plate and evaporated, and the evaporated gas is condensed in the capillary layer of the upper cover plate. The working fluid condensed into a liquid state flows back to the capillary layer of the lower cover plate through the capillary layer of the upper cover plate and the powder ring to perform the next cooling cycle.

[0055] However, during the circulating cooling process in the temperature-averaging chamber, the internal design space of the electronic equipment and the limitation of the heat transfer load will affect the heat dissipation performance. For example, when cooling a chip with a high heat flux density (>100W / cm2), the problem faced is, on the one hand, the limited heat transfer load limit (Qmax). Since the working fluid condensed into liquid inside the temperature-averaging chamber flows back through the upper capillary layer-powder column-lower capillary layer to reach the lower capillary layer, it is limited by the loop channel and the thickness section of the lower capillary layer. Under high power consumption, the return flow resistance of the temperature-averaging chamber is much greater than the capillary driving force, resulting in the partial drying of the lower capillary layer and the deterioration of the overall performance of the temperature-averaging chamber.

[0056] Another problem is that in order to meet the heat transfer capacity requirements of high power consumption, the capillary structure needs to be designed to be thicker. The thicker the capillary structure, the greater the thermal conductivity temperature difference from the lower layer of the capillary structure to the cavity. At the same time, the thicker the capillary structure, the greater the resistance to the flow of the working fluid that condenses into liquid. This resistance will also cause a large thermal conductivity temperature difference from the lower layer of the capillary structure to the cavity, resulting in a large temperature difference in the entire device, which will cause the chip to overheat and affect the heat dissipation efficiency.

[0057] Therefore, the embodiment of the present application proposes a temperature-averaging chamber. The temperature-averaging chamber includes an array of reflux channels arranged in the chamber, which can significantly improve the heat transfer limit of the temperature-averaging chamber. At the same time, the temperature-averaging chamber can effectively reduce the evaporation superheat.

[0058] Figure 1 A schematic diagram of an electronic device 300 in which an embodiment of the present application can be implemented is shown. In one embodiment, the electronic device 300 may include an electronic component 200. The electronic component 200 may be, for example, a chip. The electronic device 300 also includes a temperature-averaging chamber 100 arranged adjacent to the electronic component 200. The temperature-averaging chamber 100 can be used for heat dissipation of the electronic component 200 to expand local heat energy from the electronic component 200.

[0059] As an example, the electronic device 300 can be a set-top box, an entertainment unit, a navigation device, a communication device, a fixed location data unit, a mobile location data unit, a mobile phone, a cellular phone, a smart phone, a tablet computer, a tablet phone, a computer, a portable computer, a desktop computer, a personal digital assistant (PDA), a monitor, a computer monitor, a television, a tuner, a radio, a satellite radio, a music player, a digital music player, a portable music player, a digital video player, a video player, a digital video disc (DVD) player, a portable digital video player, or other suitable devices. In addition to the chip, the electronic component 200 can also be, for example, any device in the above-mentioned electronic device 300 that has a heat dissipation requirement.

[0060] Figure 2 A schematic diagram of a temperature-averaging chamber according to an embodiment of the present application is shown. Figure 3 FIG. 2 shows a three-dimensional diagram of a temperature-averaging chamber according to an embodiment of the present application. Figure 2 and Figure 3 A temperature-averaging chamber according to an embodiment of the present application is described in detail. Figure 2 and Figure 3 As shown, the temperature-average chamber 100 may include a housing 110. The housing 110 may include a first cover plate 111 and a second cover plate 112. The second cover plate 112 may be arranged above the first cover plate. The first cover plate and the second cover plate may be parallel to each other. The first cover plate 111 may be arranged adjacent to the electronic component 200, and the second cover plate 112 may be arranged away from the first cover plate 111. The housing 110 may also include a side plate 123 arranged between the first cover plate 111 and the second cover plate 112. The first cover plate 111, the second cover plate 112 and the side plate 123 may enclose an internal space of the housing 110, which may be regarded as a heat dissipation chamber of the temperature-average chamber 100.

[0061] In some embodiments, the housing 110 may be constructed of a metal material, such as copper, copper alloy, or aluminum. The first cover plate 111, the second cover plate 112, and the side plate 123 may be connected to each other by a welding process to form an internal space of the housing 110.

[0062] A first capillary structure layer 113 is arranged on the upper surface of the first cover plate 111 facing the second cover plate 112, and a second capillary structure layer 114 is arranged on the upper surface of the second cover plate 112 facing the first cover plate. The first capillary structure layer 113 can be filled with a working fluid having a heat evaporation characteristic. During the heat dissipation process, the heat from the electronic component 200 evaporates the working fluid filled in the first capillary structure layer 113 into gas. The gas rises in the heat dissipation cavity and reaches the second capillary structure layer 114. At the second capillary structure layer 114, the gas is cooled and condensed into liquid by heat exchange with the heat sink or air arranged above the second cover plate 112.

[0063] In some embodiments, the first capillary structure layer 113 and the second capillary structure layer 114 can be constructed as a layer with a porous structure. The porous structure may include a sintered powder structure, a woven mesh structure or a metal fiber structure. The powder, mesh and other structures in the porous structure can be realized by metals such as copper powder, copper wire or aluminum powder. The porous structure of the first capillary structure layer 113 and the porous structure of the second capillary structure layer 114 can be combined with the corresponding first cover plate 111 and second cover plate 112 by sintering, so as to be formed into a whole. It should be known that in the above-mentioned capillary structure layer, these porous structures are equivalent to capillaries. When liquids are in these porous structures, they can flow with the help of capillary forces. For details, please refer to the description of capillary phenomena in the prior art, which will not be repeated here.

[0064] A plurality of connectors 117 are arranged between the first capillary structure layer 113 and the second capillary structure layer 114. The connector 117 may include a support structure 118 and a material 119 having a porous structure formed around the support structure 118. The liquid condensed at the second capillary structure layer 114 may be guided toward the first capillary structure layer 113 via the material 119 having a porous structure of the connector 117, thereby forming a cooling cycle in the heat dissipation cavity. The function of the material 119 having a porous structure is the same as that of the first capillary structure layer 113 and the second capillary structure layer 114, and the liquid may be transferred by means of capillary force.

[0065] As an example, the support structure 118 may be configured as a cylinder, a cuboid, a cube, a quadrangular pyramid or a truncated pyramid, etc. The support structure 118 may be ensured to maintain good welding contact with the inner surfaces of the first cover plate 111 and the second cover plate 112 by welding.

[0066] As described above, the electronic component 200 of the electronic device 300 generates heat during use, and the temperature chamber 100 is used to dissipate heat for the electronic component 200. In some embodiments, the electronic component 200 is disposed below the first cover plate 111. The first capillary structure layer 113 on the upper surface of the first cover plate 111 can be divided into a heat source area 115 and a non-heat source area 116 according to different distances from the electronic component 200 (i.e., the heat source). Compared with the non-heat source area 116, the heat source area 115 is closer to the electronic component 200. Those skilled in the art should know that when heat energy is transmitted, the electronic component 200 acts as a heat source, and the area closer to the electronic component 200 in the first capillary structure layer 113 has a higher heat. Therefore, when the liquid working medium filled in this area evaporates under heat, the evaporation rate is faster. In contrast, the area of ​​the first capillary structure layer 113 far away from the electronic component 200 has a lower temperature, and the evaporation rate of the liquid working medium filled therein is correspondingly lower. Therefore, in engineering practice, the heat source area and non-heat source area can be flexibly divided according to the evaporation rate of the working fluid.

[0067] In some embodiments, the connector 117 may be configured to connect between the second capillary structure layer 114 and the non-heat source region 116 of the first capillary structure layer 113, such as in Figure 2 That is, the connector 117 can be connected only to the non-heat source area far away from the heat source, and no connector is provided on the heat source area 115, thereby promoting the evaporation effect of the heat source area. At the same time, as long as the flow guidance is satisfied, the connectors can be arranged as little as possible.

[0068] In some embodiments, the material 119 with a porous structure can be configured as a layer with a porous structure. The porous structure can be achieved by sintering powder. The material 119 with a porous structure can be configured as a ring and the inner diameter of the ring is consistent with the support structure 118. The outer diameter of the material 119 with a porous structure can be, for example, circular, rectangular or trapezoidal. The height of the material 119 with a porous structure can be, for example, the distance from the first capillary structure layer 113 to the second capillary structure layer 114.

[0069] The temperature-averaging chamber 100 may further include an arrayed reflux channel 160. The arrayed reflux channel 160 is formed on the first capillary structure layer 113 and connected to the first capillary structure layer 113. The arrayed reflux channel 160 may guide the returned liquid to at least one heat source region of the first capillary structure layer 113. In addition, the arrayed reflux channel 160 may also be connected to the connector 117 to guide the working fluid returned by the material 119 having a porous structure to the arrayed reflux channel 160.

[0070] By arranging an array of reflux channels between the first capillary structure layer and the connector, additional reflux channels can be established between different areas of the first capillary structure layer, thereby effectively reducing the return liquid flow resistance and increasing the heat transfer thermal load limit, and the gaps between the array reflux channel structures provide vapor escape channels, reducing the vapor escape flow resistance, thereby effectively reducing the evaporation superheat.

[0071] It should be noted that in the temperature-averaging chamber 100, in the two-phase (liquid-gas) circulation system composed of the first capillary structure layer 113 (i.e., the evaporation layer) and the second capillary structure layer 114 (i.e., the condensation layer), the connector 117 is not necessary. The working fluid after condensation in the second capillary structure layer 114 can, for example, also be guided to the first capillary structure layer 113 by capillary force through the side panels 123 on both sides of the temperature-averaging chamber 100 by setting a material with a porous structure on the side panels. In addition, for example, the liquid working fluid after condensation in the second capillary structure layer 114 can also flow back to the first capillary structure layer 113 by gravity or other means.

[0072] In some embodiments, the arrayed return channels 160 may include a first group of return channels 130 and a second group of return channels 120. The first group of return channels 130 may be connected to a non-heat source region 116 of the first capillary structure layer 113, and the non-heat source region 116 is farther away from the electronic component 200 than the heat source region 115. The first group of return channels 130 may also be connected to the second group of return channels 120. The second group of return channels 120 may be connected to a heat source region 115 of the first capillary structure layer 113. The heat source region 115 may be adjacent to the electronic component 200, for example. The first group of return channels may guide the working medium condensed into a liquid state from the non-heat source region to the second group of return channels, and the second group of return channels is used to guide the working medium condensed into a liquid state from the first group of return channels to the heat source region.

[0073] According to the positional relationship between the heat source and the first capillary structure layer, different heat source areas and non-heat source areas can be divided on the first capillary structure layer, and multiple groups of reflux channels are set based on the heat source areas. The first group of reflux channels achieves good contact with the non-heat source area and the second group of reflux channels, ensuring that the working fluid condensed into liquid can be guided from the non-heat source area to the second group of reflux channels through the first group of reflux channels. The second group of reflux channels achieves good contact with the heat source area.

[0074] Through the above method, when the liquid condensed by the second capillary structure layer 114 is guided back to the non-heat source area of ​​the first capillary structure layer 113 away from the heat source by the connecting piece 117, in addition to the guide path from the non-heat source area to the heat source area inside the first capillary structure layer 113, an additional guide path can be formed from the non-heat source area to the first group of reflux channels to the second group of reflux channels, and then to the heat source area. In this way, multiple different areas of the first capillary structure layer can be fully utilized, thereby effectively reducing the return liquid flow resistance, and the efficiency of the liquid working medium returning to the heat source area is improved, thereby increasing the thermal load limit of the temperature-averaging chamber.

[0075] In this way, on the one hand, multiple different areas of the first capillary structure layer can be fully utilized, thereby effectively reducing the return flow resistance, thereby increasing the heat load limit of the temperature-averaging chamber. On the other hand, the gaps between the multiple return channels in the heat source area of ​​the first capillary structure layer close to the heat source provide escape channels for the evaporation gas, reducing the escape flow resistance of the evaporation gas, thereby effectively reducing the evaporation superheat.

[0076] In some embodiments, the heat source region 115 may have a thinner thickness than the non-heat source region 116. The thickness of the heat source region 115 may depend on the evaporation efficiency of the working fluid from the heat source region and the capillary force of the working fluid condensed into liquid absorbed by the heat source region. For example, the heat source region may be in the range of 50-300 μm in thickness. By setting a suitable thickness of the heat source region, on the one hand, the evaporation capacity can be guaranteed, and on the other hand, the escape resistance of the evaporated gas generated by the phase change inside the evaporation layer can be reduced, thereby reducing the evaporation overheating.

[0077] The second group of return channels 120 may be evenly distributed in the heat source region 115, and the first group of return channels 130 may be evenly distributed in the non-heat source region 116. The second group of return channels 120 and the first group of return channels 130 may be distributed in the heat source region 115 and the non-heat source region 116 of the first capillary structure layer 113 in a variety of different ways.

[0078] Figure 4 Shows Figure 2 Cross-sectional view of the temperature-averaging chamber along line AA. Figure 5 Shows Figure 2 The cross-section of the temperature-averaging cavity along line BB. Figure 4 and Figure 5 As shown, in some embodiments, multiple return channels of the second group of return channels 120 can be evenly distributed on the heat source area 115 along the longitudinal direction L of the first capillary structure layer 113, and multiple return channels of the first group of return channels 130 can be evenly distributed on the non-heat source area 116 along the lateral direction H of the first capillary structure layer 113.

[0079] Figure 6A-6C A schematic diagram showing the distribution of the return channels of the temperature-uniform chamber according to an embodiment of the present application is shown. Figure 6A-6C Schematic diagram showing the distribution of the return channel of the temperature-averaging chamber according to an embodiment of the present application. Without considering other components in the temperature-averaging chamber 100, Figure 6A-6C as well as Figure 7A-7C Exemplary arrangements of the second group of return channels 120 and the first group of return channels 130 are shown, respectively.

[0080] like Fig. 6A As shown, the plurality of return channels of the second group of return channels 120 may be arranged along the longitudinal direction L of the first capillary structure layer 113. Figure 6B As shown, the plurality of return channels of the second group of return channels 120 may be arranged along the lateral direction H of the first capillary structure layer 113. Fig. 7A As shown, the plurality of return channels of the first group of return channels 130 may be arranged along the lateral direction H of the first capillary structure layer 113. Figure 7B As shown, the plurality of return channels of the first group of return channels 130 may be arranged along the longitudinal direction L of the first capillary structure layer 113 .

[0081] Can understand, in Fig. 6A , Figure 6B , Fig. 7A as well as Figure 7B The arrangement of the multiple return channels of the second group of return channels 120 and the multiple return channels of the first group of return channels 130 can be combined in any appropriate manner. For example, the multiple return channels of the second group of return channels 120 and the multiple return channels of the first group of return channels 130 can be arranged in the heat source area 115 and the non-heat source area 116 along the transverse direction H of the first capillary structure layer 113. For another example, the multiple return channels of the second group of return channels 120 and the multiple return channels of the first group of return channels 130 can be arranged in the heat source area 115 and the non-heat source area 116 along the longitudinal direction L of the first capillary structure layer 113. For another example, one group of return channels in the second group of return channels 120 and the first group of return channels 130 can be arranged along the lateral direction H of the first capillary structure layer 113, while another group of return channels in the second group of return channels 120 and the first group of return channels 130 can be arranged along the longitudinal direction L of the first capillary structure layer 113.

[0082] Although not shown in the figure, it is also possible that, in some embodiments, the plurality of return channels of the second group of return channels 120 are distributed on the first capillary structure 113 in a manner that is angled with the transverse direction H or the longitudinal direction L of the first capillary structure layer 113. Similarly, the plurality of return channels of the first group of return channels 130 can be distributed in a manner that is angled with the plurality of return channels of the second group of return channels 120, and communicate with the second group of return channels 120.

[0083] In some embodiments, the second group of return channels 120 may include a first portion of return channels 121 and a second portion of return channels 122. Figure 6C As shown, the first partial return channel 121 may be arranged along the transverse direction H of the first capillary structure layer 113. The second partial return channel 122 may be arranged along the longitudinal direction L of the first capillary structure layer 113. Or vice versa.

[0084] In some embodiments, each channel in the first group of reflux channels 130 and the second group of reflux channels 120 may be distributed at a predetermined interval. Under the premise of satisfying liquid reflux, the distance between the arrayed reflux channels may be arranged relatively loosely within the range of the heat source area to reduce the thermal conduction temperature difference, thereby reducing the temperature of the local hot spot of the chip.

[0085] In some embodiments, the first group of return channels 130 may optionally include a third portion of return channels 132 and a fourth portion of return channels 131. Figure 7C As shown, the third partial return channel 132 can be arranged along the transverse direction H of the first capillary structure layer 113, and communicate with one of the first partial return channel or the second partial return channel. The fourth partial return channel 131 can be arranged along the longitudinal direction L of the first capillary structure layer 113, and communicate with the other of the first partial return channel and the second partial return channel. Or, vice versa.

[0086] In some embodiments, the first group of reflux channels 130 and the second group of reflux channels 120 may be constructed of a material having a porous structure. The porous structure may include a sintered powder structure, a woven mesh structure, or a metal fiber structure. The powder, mesh, and other structures in the porous structure may be implemented using metals such as copper powder, copper wire, or aluminum powder. In some embodiments, the passage cross-section of the array-type reflux channel is configured to be rectangular, oblong, circular, or trapezoidal.

[0087] The arrangement of various reflux channels can be realized according to factors such as the size of the temperature-averaging chamber, the positional relationship between the heat source and the temperature-averaging chamber, the expected heat load carrying capacity, etc. Thus, the reflux channels of the temperature-averaging chamber can be realized in a flexible arrangement to meet different heat dissipation requirements.

[0088] In addition, considering factors such as the internal structure of the electronic device, the size of the heat source, and the heat dissipation requirements, the housing 110 of the temperature-averaging chamber 100 may be designed to have different structures. Figure 8 A schematic diagram of a temperature-averaging chamber according to an embodiment of the present application is shown. Fig. 9 FIG. 1 shows a schematic diagram of a temperature-averaging chamber according to another embodiment of the present application. Figure 8 and Fig. 9 The Figure 2 The same or similar parts are marked with the same reference numerals. Figure 8 and Fig. 9 The Figure 2 The same or similar structures are not described in detail here.

[0089] like Figure 8 As shown, a protrusion 140 protruding in a direction away from the second cover plate may be formed on the first cover plate 111 of the housing 110 of the temperature chamber 100. The area of ​​the first capillary structure layer 113 at the protrusion 140 is the heat source area 115. Figure 8 It can be seen that the second group of return channels 120 are distributed on the heat source area 115.

[0090] like Fig. 9 As shown, a recessed portion 150 that is recessed toward the second cover plate may be formed on the first cover plate 111 of the housing 110 of the temperature-averaging chamber 100. The area of ​​the first capillary structure layer 113 at the recessed portion 150 is the heat source area 115. Fig. 9 It can be seen that the second group of return channels 120 are distributed on the heat source area 115.

[0091] In this way, the shell structure of the temperature-averaging chamber, especially the first cover plate close to the heat source, can be designed in various ways according to the structure of the heat source in the electronic device to meet the different requirements of the size and heat dissipation performance of the electronic device.

[0092] In addition, although not shown in the figure, the temperature-averaging chamber 100 may also include a plurality of heat sinks, for example. The heat sink may be arranged above the second cover plate 112 of the housing 110 and configured to facilitate heat exchange between the temperature-averaging chamber 100 and the external environment. The heat sink may be configured as a heat dissipation fin, such as a copper fin or an aluminum fin. The heat sink may be soldered to the second cover plate 112, for example, by solder paste, so that the heat sink forms good contact with the housing of the temperature-averaging chamber. The height and thickness of the heat sink may be defined according to the housing size of the temperature-averaging chamber 110. The spacing between the plurality of heat sinks may be determined according to the desired flow resistance.

[0093] The temperature-averaging chamber of the embodiment of the present application increases the cross-section of the reflux channel of the medium by increasing the reflux transmission path of the medium, thereby effectively reducing the reflux resistance of the medium and improving the ultimate heat transfer capacity of the temperature-averaging chamber. At the same time, since the evaporation area of ​​the first capillary structure layer close to the heat source can be set thinner, the thermal conductivity resistance of the powder layer in the heat source area can be effectively reduced. At the same time, the gap between the array powder layers can provide a flow channel for the escape of the evaporating gas, reduce the flow resistance of the evaporating gas, and effectively control the evaporation superheat.

[0094] Fig.10 FIG. 1 is a flow chart of a method 1000 for manufacturing a substrate assembly according to an embodiment of the present application. Figure 1-Figure 9 The features described can be applied to Fig.10 Method 1000 is shown.

[0095] At 1002 , a first cover plate 111 and a second cover plate 112 located above the first cover plate 111 are provided.

[0096] At 1004, a first capillary structure layer 113 is provided. The first capillary structure layer 113 is arranged on the upper surface of the first cover plate 111 facing the second cover plate 112, and is filled with a working medium having a characteristic of evaporating upon heating.

[0097] At 1006 , a second capillary structure layer 114 is provided. The second capillary structure layer 114 is arranged on the lower surface of the second cover plate 112 facing the first cover plate 111 , and is used to condense the working medium evaporated from the first capillary structure layer 113 from gaseous state to liquid state.

[0098] At 1008 , a connector 117 is provided. The connector 117 is disposed between the first cover plate 111 and the second cover plate 112 and is used to guide the working medium condensed into liquid by the second capillary structure layer 114 to the first capillary structure layer 113 .

[0099] At 1010, an array of reflux channels is provided. The array of reflux channels is used to reflux at least a portion of the working medium guided back by the connector 117 to the heat source region of the first capillary structure layer 113. If the liquid working medium condensed in the second capillary structure layer 114 is refluxed to the first capillary structure layer 113 by other means other than the connector 117, then step 1008 is not necessary. For details, please refer to the description of the connector 117 in the aforementioned device embodiment, which will not be repeated here.

[0100] By arranging an array of reflux channels on the first capillary structure layer, the phenomenon that the condensed liquid cannot be effectively guided back from the second capillary structure layer to the first capillary structure layer due to heat load limitation and flow resistance of each evaporation layer is significantly improved. The array of reflux channels can guide the condensed liquid to different areas on the first capillary structure layer, thereby promoting the process of cooling cycle, and thus improving the overall performance of the temperature-averaging chamber.

[0101] In addition, the gaps between the array-type reflux channels can provide flow channels for the escape of the evaporated gas, thereby reducing the flow resistance of the evaporated gas and effectively controlling the evaporation superheat.

[0102] Although the subject matter has been described in language specific to structural features and / or methodological logical actions, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or actions described above. On the contrary, the specific features and actions described above are merely example forms of implementing the claims.

Claims

1. A temperature-averaging chamber (100), It is characterized in that include: A first cover plate (111) and a second cover plate (112) located above the first cover plate (111); A first capillary structure layer (113) is arranged on the upper surface of the first cover plate (111) facing the second cover plate (112), and the first capillary structure layer (113) is filled with a working fluid having a characteristic of evaporating when heated; a second capillary structure layer (114), arranged on the lower surface of the second cover plate (112) facing the first cover plate (111), and used for condensing the working fluid evaporated from the first capillary structure layer (113) from a gaseous state into a liquid state; and An array of reflux channels (160) is arranged on the first capillary structure layer (113) and is used to reflux at least a portion of the working fluid that refluxes to the first capillary structure layer (113) after being condensed by the second capillary structure layer (114) to the heat source region (115) in the first capillary structure layer (113), wherein: The array-type reflux channels (160) comprise: a first group of reflux channels (130) and a second group of reflux channels (120); the first group of reflux channels (130) are respectively connected to a non-heat source region (116) in the first capillary structure layer (113) and the second group of reflux channels (120); the first group of reflux channels (130) are used to guide the working fluid directed to the first capillary structure layer (113) from the non-heat source region (116) to the second group of reflux channels (120); the second group of reflux channels (120) are connected to the heat source region (115) of the first capillary structure layer (113) and are used to guide the working fluid guided by the first group of reflux channels (130) to the heat source region (115).

2. The temperature-averaging chamber (100) according to claim 1, It is characterized in that The temperature-averaging chamber (100) further comprises: A connecting member (117) is arranged between the first cover plate (111) and the second cover plate (112), and is used for guiding the working fluid condensed into liquid by the second capillary structure layer (114) to the non-heat source area (116) of the first capillary structure layer (113), wherein the distance between the non-heat source area (116) and the heat source located on the lower surface of the first cover plate (111) is greater than the distance between the heat source area (115) and the heat source.

3. The temperature-averaging chamber (100) according to claim 2, It is characterized in that In the height direction (v) of the temperature-averaging chamber (100), the thickness of the heat source region (115) is smaller than the thickness of the non-heat source region (116).

4. The temperature-averaging chamber (100) according to claim 3, It is characterized in that The first group of reflux channels (130) is used to guide the working fluid guided by the connecting piece to the first capillary structure layer (113) from the non-heat source area (116) to the second group of reflux channels (120).

5. The temperature-averaging chamber (100) according to any one of claims 1 to 4, It is characterized in that A protrusion (140) is also formed on the lower surface of the first cover plate (111) and protrudes in a direction away from the second cover plate (112), and the heat source area (115) is located above the protrusion (140).

6. The temperature-averaging chamber (100) according to any one of claims 1 to 4, It is characterized in that A recessed portion (150) is also formed on the lower surface of the first cover plate (111) and is recessed in a direction toward the second cover plate (112), and the heat source area (115) is located above the recessed portion (150).

7. The temperature-averaging chamber (100) according to claim 4, It is characterized in that The second set of return channels (120) is arranged as follows: distributed on the first capillary structure layer (113) along the transverse direction (H) and / or the longitudinal direction (L) of the first capillary structure layer (113); or The nanostructured particles are distributed on the first capillary structure layer (113) in a manner that forms an angle with respect to a transverse direction (H) or a longitudinal direction (L) of the first capillary structure layer (113).

8. The temperature-averaging chamber (100) according to claim 4 or 7, It is characterized in that The first set of return channels (130) are arranged as follows: distributed along the transverse direction (H) or the longitudinal direction (L) of the first capillary structure layer (113) and connected to the second group of return channels (120) below the second group of return channels (120); or The second group of return channels (120) are distributed in an angled manner and communicate with the second group of return channels (120) below the second group of return channels (120).

9. The temperature-averaging chamber (100) according to claim 4, It is characterized in that The second group of reflux channels (120) comprises: a first portion of return channels (121) distributed on the first capillary structure layer (113) along a transverse direction (H) of the first capillary structure layer (113); and A second partial return channel (122) is distributed on the first capillary structure layer (113) along the longitudinal direction (L) of the first capillary structure layer (113).

10. The temperature-averaging chamber (100) according to claim 9, It is characterized in that The first group of return channels (130) includes: a third partial return channel (131) distributed along the transverse direction (H), connected to one of the first partial return channel or the second partial return channel below the second group of return channels (120); and A fourth partial return channel (132) distributed along the longitudinal direction (L) is connected to the other of the first partial return channel and the second partial return channel below the second group of return channels (120).

11. The temperature-averaging chamber (100) according to any one of claims 2 to 4, It is characterized in that The connecting member (117) comprises a material (119) having a porous structure, and the material (119) having a porous structure is used to guide the working medium condensed into a liquid state from the second capillary structure layer (114) to the first capillary structure layer (113).

12. The temperature-averaging chamber (100) according to claim 11, It is characterized in that If the arrayed reflux channel (160) is connected to the material (119) having a porous structure, the material (119) having a porous structure is also used to guide at least a portion of the working fluid condensed into a liquid by the second capillary structure layer (114) to the arrayed reflux channel (160).

13. The temperature-averaging chamber (100) according to any one of claims 1 to 4, It is characterized in that The first capillary structure layer (113) and / or the second capillary structure layer (114) is a layer having a porous structure.

14. The temperature-averaging chamber (100) according to any one of claims 1 to 4, It is characterized in that Also includes: A heat sink is arranged above the second cover plate (112) and is configured to promote heat exchange between the temperature-averaging chamber (100) and the external environment.

15. The temperature-averaging chamber (100) according to any one of claims 4 and 10, It is characterized in that The channels in the first group of reflux channels (130) are distributed at predetermined intervals.

16. The temperature-averaging chamber (100) according to any one of claims 4, 7 and 9, It is characterized in that The channels in the second group of reflux channels (120) are distributed at predetermined intervals.

17. The temperature-averaging chamber (100) according to any one of claims 1 to 4, It is characterized in that The thickness of the heat source region (115) depends on the evaporation efficiency of the working medium from the heat source region and the absorption efficiency of the working medium condensed into liquid by the heat source region.

18. The temperature-averaging chamber (100) according to any one of claims 1 to 4, It is characterized in that The thickness of the heat source region (115) is in the range of 50-300 μm.

19. An electronic device (300), It is characterized in that include: Electronic components (200); as well as According to the temperature-averaging chamber (100) according to any one of claims 1 to 18, the electronic component (200) is arranged below the heat source area of ​​the first cover plate (111), and the temperature-averaging chamber (100) is used to dissipate heat for the electronic component (200).

20. A method for manufacturing a temperature-averaging chamber (100), It is characterized in that The method comprises: Providing a first cover plate (111) and a second cover plate (112) located above the first cover plate (111); Providing a first capillary structure layer (113) arranged on the upper surface of the first cover plate (111) facing the second cover plate (112), wherein the first capillary structure layer (113) is filled with a working fluid having a characteristic of evaporating when heated; providing a second capillary structure layer (114) disposed on the lower surface of the second cover plate (112) facing the first cover plate (111), for condensing the working fluid evaporated from the first capillary structure layer (113) from a gaseous state into a liquid state; and An array of reflux channels (160) is provided on the first capillary structure layer (113), wherein the array of reflux channels (160) is used to reflux at least a portion of the working fluid that refluxes to the first capillary structure layer (113) after condensation through the second capillary structure layer (114) to a heat source region (115) of the first capillary structure layer (113), wherein the array of reflux channels (160) comprises: a first group of reflux channels (130) and a second group of reflux channels (120), wherein the first group of reflux channels (130) is connected to the first capillary structure layer (114) and the second group of reflux channels (120), respectively. The non-heat source region (116) in the capillary structure layer (113) and the second group of reflux channels (120) are connected; the first group of reflux channels (130) are used to guide the working fluid guided to the first capillary structure layer (113) from the non-heat source region (116) to the second group of reflux channels (120); the second group of reflux channels (120) are connected to the heat source region (115) of the first capillary structure layer (113) and are used to guide the working fluid guided by the first group of reflux channels (130) to the heat source region (115).

21. The manufacturing method according to claim 20, It is characterized in that Also includes: A connecting piece (117) is provided and arranged between the first cover plate (111) and the second cover plate (112), wherein the connecting piece (117) is used to guide the working fluid condensed into liquid by the second capillary structure layer (114) to the first capillary structure layer (113).

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