Lift pin assembly and substrate processing apparatus having the same

Abstract

A lift pin assembly is provided. The lift pin assembly includes a leveling bolt mounted on a first frame lifted by a lifting device, a lift pin having a weight provided at a lower end of the lift pin and supported by the leveling bolt, and a pressing bracket configured to forcibly move the lift pin downward when the lift pin is locked in a pin hole. The pressing bracket is adjusted in height to be provided while maintaining a certain gap from a top surface of the weight.

Description

TECHNICAL FIELD

[0001] Embodiments of the inventive concept described herein relate to a substrate processing apparatus, and more particularly, to a lift pin assembly for moving a flat panel or a substrate up and down from a platform, and a substrate processing apparatus having the same. BACKGROUND

[0002] Recently, liquid crystal displays (LCDs) and plasma display panels (PDPs) have been used to manufacture image display apparatuses, and substrates of flat panel displays have been used for the LCDs and the PDPs.

[0003] To manufacture the flat panel displays, many manufacturing processes are performed while including a process of manufacturing a substrate, a process of manufacturing a cell, and a process of manufacturing a module. In particular, the process of manufacturing the substrate includes a photolithography process for forming various patterns on the substrate. The photolithography process is performed by sequentially performing a coating process for coating a photosensitive liquid such as a photoresist, an exposure process for forming a specific pattern on the coated photoresist, and a developing process for developing a region corresponding to the exposed photoresist. After or before the coating process and the developing process are performed, a baking process is performed to thermally treat the substrate.

[0004] A lift device is used for a baking unit to move a substrate up and down from a thermal treatment plate. A conventional lift device includes a lift frame including a plurality of lift pins fixed to a lower portion of the thermal treatment plate. The lift frame can be configured to move up and down by a driving motor and a ball screw.

[0005] When the plurality of lift pins are configured to move up and down at the same time as described above, it is very difficult to adjust the height of the lift pins because the lower ends of the lift pins in an upright state are fixedly connected with the lift frame through a fastening unit such as a bolt.

[0006] Recently, as a large size substrate is used, a plurality of lift pins are provided to load / unload the large size substrate. When the height of any one or more of the lift pins is different from the height of the remaining pins, a setup work of aligning the heights of all the pins equally can be difficult. The setup failure of the lift pins can cause a defect of the substrate when a process treatment is performed on the substrate.

[0007] In addition, the lift pins are fixedly coupled to the lift frame in a vertical direction through the fastening unit. Therefore, when the lift frame is deformed from a horizontal state, it is necessary to set the respective heights of any one or more of the lift pins. SUMMARY

[0008] Embodiments of the inventive concept provide a lift pin assembly capable of improving a leveling work efficiency of lift pins and overcoming a setup failure of the lift pins, and a substrate processing apparatus having the same.

[0009] Embodiments of the present inventive concept provide a lift pin assembly and a substrate processing apparatus having the same, which can facilitate setting a height of a pressing bracket to forcibly move a lift pin downward when the lift pin is locked into a pin hole.

[0010] The objects to be achieved by the present inventive concept are not limited to the above-mentioned objects, and other objects not mentioned will become apparent to those skilled in the art from consideration of the following description.

[0011] According to embodiments, a lift pin assembly can be provided, including a leveling bolt installed on a first frame lifted by a lifting device, a lift pin having a weight provided at a lower end of the lift pin and supported by the leveling bolt, and a pressing bracket configured to forcibly move the lift pin downward when the lift pin is locked in a pin hole. The pressing bracket is adjusted in height to be set while maintaining a certain gap from a top surface of the weight.

[0012] In addition, the pressing bracket can be further provided to be simultaneously adjusted in height when a level of the leveling bolt is adjusted.

[0013] In addition, the pressing bracket can include a pressing portion having one end fixed to the leveling bolt and positioned while maintaining a certain gap from the top surface of the weight.

[0014] In addition, the pressing bracket can further include a vertical portion vertically extended downward from one side of the pressing portion, and a fixing portion horizontally extended from a lower end of the vertical portion and fixed by a lower tab of the leveling bolt.

[0015] In addition, the pressing bracket can include a pressing portion positioned while maintaining a certain gap from the top surface of the weight, and a fixing portion vertically extended from one end of the pressing portion and fixed to a side surface of the first frame.

[0016] In addition, the fixing portion can include a slit hole vertically extended so that a fixing bolt is fixed to the side surface of the first frame.

[0017] In addition, the pressing portion can include a through hole having a diameter smaller than that of the weight and larger than that of the lift pin. The through hole can be provided to be open at one side.

[0018] In addition, the lift pin assembly further includes a bolt plate horizontally fixedly coupled to a bottom surface of the first frame. The leveling bolt can be installed on the bolt plate perpendicularly to the bolt plate.

[0019] In addition, the leveling bolt can include a bolt head positioned on a top surface of the bolt plate, and a lower tab positioned on a bottom surface of the bolt plate.

[0020] Further, the fixing portion of the pressing bracket can be fixed to a lower tab of the leveling bolt, which is adjusted in height on a bolt plate.

[0021] According to embodiments, a substrate processing apparatus can be provided, including a housing having a processing space for performing a process on a substrate, a substrate support plate disposed within the processing space and having a top surface for placing the substrate and a pin hole, and a lift pin assembly configured to load / unload the substrate onto / from the substrate support plate. The lift pin assembly includes a lifting device, a first frame moved up and down by the lifting device, a leveling bolt installed on the first frame, a lift pin having a weight disposed at a lower end of the lift pin, respectively supported by the leveling bolt, and moved upward when the first frame is moved upward and moved downward by its own weight when the first frame is moved downward, and a pressing bracket configured to forcibly move the lift pin downward when the first frame is moved downward and when the lift pin is locked in the pin hole. The pressing bracket is adjustable in height to be disposed while maintaining a certain gap from a top surface of the weight.

[0022] Further, the pressing bracket can include a fixing portion fixed to a lower end of the leveling bolt, a vertical portion vertically extended upward from the fixing portion, and a pressing portion horizontally extended from the vertical portion, located above the top surface of the weight, and disposed to maintain a certain gap from the top surface of the weight. The height of the pressing bracket can be adjusted at the same time when the level of the leveling bolt is adjusted.

[0023] Further, the apparatus can further include a bolt plate fixed and horizontally coupled to a bottom surface of the first frame. The leveling bolt can be installed on the bolt plate perpendicular to the bolt plate.

[0024] Further, the leveling bolt can include a bolt head positioned on a top surface of the bolt plate to support the weight of the lift pin when the first frame is moved upward, and a lower tab positioned on a bottom surface of the bolt plate. The fixing portion of the pressing bracket is fixed to the lower tab.

[0025] Further, the pressing bracket can include a pressing portion positioned while maintaining a certain gap from the top surface of the weight, and a fixing portion vertically extended from one end of the pressing portion and fixed to a side surface of the first frame.

[0026] Further, the fixing portion can include a slit hole vertically extended such that a fixing bolt is fixed to the side surface of the first frame and the fixing height of the pressing bracket is adjusted.

[0027] Further, the pressing portion can include a through hole having a diameter smaller than that of the weight and larger than that of the lift pin. The through hole can be disposed to be open at one side.

[0028] Further, the lifting device can include a base frame disposed below the first frame, a lifting unit spaced apart from the center of the base frame by a certain distance and disposed on the base frame to be liftable, a driving unit for driving such that the lifting unit is simultaneously moved upward and downward, and a power transmission unit for simultaneously transmitting a driving force of the driving unit to the lifting unit

[0029] According to embodiments, a lifting pin assembly can be provided, including a first frame moved up and down by a lifting device, leveling bolts installed on the first frame, lifting pins having weights disposed at lower ends of the lifting pins, respectively supported by the leveling bolts, and moved upward when the first frame is moved upward and moved downward by self-weight when the first frame is moved downward, and a pressing bracket configured to forcibly move the lifting pins downward when the first frame is moved downward and when the lifting pins are locked in pin holes. The pressing bracket can include a fixing portion fixed to lower ends of the leveling bolts, a vertical portion vertically extended upward from the fixing portion, and a pressing portion horizontally extended from the vertical portion, located above a top surface of the weight, and disposed to maintain a certain gap from the top surface of the weight. The pressing bracket can be disposed to be simultaneously adjusted in height when the leveling bolts are adjusted in level.

[0030] Further, the lifting pin assembly can further include a bolt plate fixedly and horizontally fixed to a bottom surface of the first frame. The leveling bolts are vertically installed on the bolt plate. The leveling bolts can include bolt heads located on a top surface of the bolt plate to support the weights of the lifting pins when the first frame is moved upward, and lower tabs located on a bottom surface of the bolt plate. The fixing portion of the pressing bracket is fixed to the lower tabs.

[0031] Further, the pressing portion can include a through-hole having a diameter smaller than that of the weight and larger than that of the lifting pin. The through-hole can be disposed to be open at one side. BRIEF DESCRIPTION OF DRAWINGS

[0032] The above and other objects and features will become apparent from the following description, taken in conjunction with the accompanying drawings, wherein like reference numerals refer to like parts throughout the various figures unless otherwise specified, and wherein:

[0033] Figure 1 FIG. 1 illustrates an apparatus for a lithography process according to the present inventive concept;

[0034] Figure 2 is a schematic view illustrating a configuration of a baking unit;

[0035] Figure 3 FIG. 1 illustrates an apparatus for a lithography process according to the present inventive concept; Figure 2 the baking chamber shown;

[0036] Figure 4 FIG. 1 illustrates an apparatus for a lithography process according to the present inventive concept;

[0037] Figure 5 and Figure 6 is an exploded perspective view of the subject matter of a lift pin assembly;

[0038] Figure 7A and Figure 7B The figure shows the upward state and the downward state of the lifting pin;

[0039] Figure 8 The diagram shows adjusting the height of the leveling bolts;

[0040] Figure 9 and Figure 10 FIG. 1 illustrates a pressing bracket according to another embodiment of the present inventive concept; and

[0041] Figure 11 The figure shows the lifting device. DETAILED DESCRIPTION

[0042] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention may be modified in various ways, and the scope of the present invention should not be construed as being limited by the embodiments of the present invention described below. The embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Therefore, the shapes of components in the drawings are exaggerated to highlight a clearer description.

[0043] In the following description of embodiments according to the inventive concept, a baking apparatus used in a lithography apparatus will be described by way of example.

[0044] According to this embodiment, the substrate is used to manufacture a flat panel display (FPD). The FPD may include a liquid crystal display (LCD), a plasma display (PDP), a vacuum fluorescent display (VFD), a field emission (FED) device, or an electroluminescent display (ELD).

[0045] A substrate processing apparatus according to the inventive concept is a baking apparatus for heating and cooling a substrate in a photolithography process.

[0046] like Figure 1 As shown, the apparatus 1 for a photolithography process may include an indexing module 10 , a coating module 20 , an interface module 30 , an edge exposure device 40 , a liquid handling module 50 and an exposure module 60 .

[0047] Substrates "W" are introduced into or withdrawn from the index module 10. The index module 10 has a length arranged along a second direction 14. In this case, the second direction 14 is the direction in which the index module 10 extends. When viewed from above, a direction perpendicular to the second direction 14 is referred to as the first direction 12. A direction perpendicular to the first direction 12 and the second direction 14 is referred to as the third direction 16.

[0048] For example, the transfer module 10 can introduce or withdraw the substrate "W" by a carrying roller or a transfer robot to carry the substrate "W".

[0049] The coating module 20 performs a coating process on the substrate "W". The coating module 20 is disposed adjacent to one side of the transfer module 10. The coating module 20 has a length extending in the first direction 12. The coating module 20 can include a cleaning unit 21, a coating unit 22, a vacuum drying unit 23, and a baking unit 100. In the coating module 20, a cleaning process, a coating process, a vacuum drying process (VCD), and a baking process can be sequentially performed. The cleaning unit 21 performs cleaning of the substrate "W" before performing a coating process on the substrate "W". The cleaning unit 21 can perform a cleaning process by supplying a cleaning liquid to the substrate "W". For example, the cleaning unit 21 can supply a cleaning liquid through a cleaning liquid supply unit disposed above the substrate "W". For example, the cleaning liquid can be supplied in the form of pure water.

[0050] The coating unit 22 performs a coating process on the substrate "W". The substrate "W" that has undergone the coating process is transferred to the vacuum drying unit 23. The vacuum drying unit 23 removes an organic solvent contained in a photoresist (PR) while performing a drying process.

[0051] The baking unit 100 performs a baking process on the substrate "W". For example, the baking process can heat the substrate "W" by a heating unit installed below the substrate "W".

[0052] The substrate "W" that has completely undergone the processes in the coating module 20 is transferred to the interface module 30. The interface module 30 carries the substrate "W" from the coating module 20 to the liquid treatment module 50 and the exposure module 60. The interface module 30 is disposed adjacent to the coating module 20 and the liquid treatment module 50. The interface module 30 is disposed in parallel to the transfer module 10. The interface module 30 has a length extending in the second direction 14. When the substrate "W" is carried from the interface module 30, the substrate "W" can be carried by using a transfer robot.

[0053] The edge exposure device 40 performs an edge exposure process on the substrate "W" to irradiate light to an edge area of the substrate "W". The edge exposure device 40 is interposed between the interface module 30 and the liquid treatment module 50. Alternatively, the edge exposure device 40 can be interposed between the coating module 20 and the interface module 30.

[0054] An exposure process is performed on the substrate "W" in the exposure module 60. The exposure module 60 is disposed adjacent to one side of the interface module 30.

[0055] The liquid treatment module 50 can be used as a developing module to perform a developing process on the substrate "W". The indexing module 10 is disposed adjacent to one side of the liquid treatment module 50. The liquid treatment module 50 is disposed parallel to the coating module 20, having a length extending in the first direction 12.

[0056] The liquid treatment module 50 includes a liquid treatment unit 51, a rinsing unit 52, a drying unit 53, and an inspector 54. In the liquid treatment module 50, after a liquid treatment process is performed in the liquid treatment unit 51, a rinsing process and a drying process are performed in the rinsing unit 52 and the drying unit 53, respectively, and the substrate "W" is inspected in the inspector 54. For example, the liquid treatment process can be a developing process.

[0057] Figure 2 The configuration of the baking unit is schematically illustrated.

[0058] Referring to Figure 2 The baking unit 100 can include a baking chamber 200 and a carrying chamber 120.

[0059] A transfer robot 122 can be provided in the carrying chamber 120 to carry the substrate "W". The transfer robot 122 transfers the substrate "W" carried through the transfer belt carrying path 101 into the baking chamber 200, or transfers the substrate "W" that has undergone a heat treatment in the baking chamber 200 to the cooling chamber 140.

[0060] A plurality of baking chambers 200 can be stacked in a vertical direction. Each baking chamber 200 can include an opener to open or close an opening to introduce or withdraw the substrate "W" into or out of the baking chamber 200. The baking chamber 200 is a device for processing a substrate, which performs a heat treatment on the substrate "W". The substrate processing device will be described below with reference to Figure 3

[0061] Figure 3 The baking chamber shown in Figure 2 The baking chamber shown in Figure 4 The lift pin assembly is illustrated.

[0062] Referring to Figure 3 and Figure 4 The baking chamber 200 can include a housing 210, a substrate support plate 220, and a lift pin assembly 300.

[0063] The housing 210 provides a processing space for performing a baking process on the substrate "W". The substrate support plate 220 is located inside the housing 210, and includes a top surface 222 and pin holes 224 to place the substrate "W".

[0064] ​The lift pin assembly 300 loads / unloads the substrate "W" onto / from the substrate support plate 220. For example, the lift pin assembly 300 can include a lift device 310, a first frame 320, leveling bolts 330, lift pins 340, and a pressing bracket 350.

[0065] The first frame 320 includes horizontal support bars 322 spaced apart from and disposed parallel to each other, and vertical support bars 324 connected to and intersecting the horizontal support bars 322.

[0066] The lift device 310 can be mounted on a base frame 302 disposed below the first frame 320. The lift device 310 can include a plurality of lift units 312, a driving unit 314, and a power transmission unit 326.

[0067] Figure 11 FIG. 1 illustrates a lift device.

[0068] Reference Figure 3 and Figure 11 The plurality of lift units 312 can include a pair of first lift units 312a and a pair of second lift units 312b. The pair of first lift units 312a and the pair of second lift units 312b are spaced apart from the center of the base frame 302 by a certain distance and can be disposed to be liftable on the base frame 302. The pair of first lift units 312a and the pair of second lift units 312b are connected to the first frame 320 at one end thereof to move the first frame 320 up and down.

[0069] The driving unit 314 provides a driving force so that the pair of first lift units 312a and the pair of second lift units 312b move up and down at the same time. The driving force of the driving unit 314 can be transmitted to the pair of first lift units 312a and the pair of second lift units 312b through the power transmission unit 326. For example, the driving unit 314 can be a motor. The power transmission unit 326 can include a driving shaft 326a, a gear box 326b, and a rotating shaft 326c connected to the lift units 312. As described above, the pair of first lift units 312a and the pair of second lift units 312b are mechanically connected to each other to operate at the same time. Therefore, an additional control device is not required to control synchronization.

[0070] As described above, the lift device 310 has a feature that the pair of first lift units 312a and the pair of second lift units 312b move up and down at the same time by the driving of one driving unit 314.

[0071] Figure 5 and Figure 6 is an exploded perspective view of the subject of the lift pin assembly.

[0072] Referring to Figure 5 and Figure 6 The leveling bolt 330 can be fixedly installed on the first frame 320. A central axis of the leveling bolt 330 is linearly aligned with each pin hole 224 of the substrate support plate 220.

[0073] The leveling bolt 330 can be vertically installed in the through hole 392 of the bolt plate 390. The bolt plate 390 is horizontally fixedly coupled to a bottom surface of the first frame 320. The leveling bolt 330 can include a bolt head 332, a lower tab 334, and a fixing nut 336. The bolt head 332 is located on a top surface of the bolt plate 390, and the lower tab 334 is located on a bottom surface of the bolt plate 390 after passing through the through hole 392 of the bolt plate 390. The leveling bolt 330 can be vertically adjusted in height on the bolt plate 390 to adjust the level of the lift pin 340.

[0074] The lift pin 340 can include a pin 342 and a weight 344. The weight 344 can be provided at a lower end of the pin 342. The lift pin 340 is positioned in the pin hole 224 by a guide bushing 346 fixed to a bottom surface of the substrate support plate 220. The guide bushing 346 guides the pin 342 of the lift pin 340 to move up and down.

[0075] Figure 7A and Figure 7B FIGS. 6 and 7 illustrate upward and downward states of the lift pin.

[0076] Referring to Figure 5 to Figure 7B When the first frame 320 moves upward, the lift pin 340 is supported by the leveling bolt 330 and moves upward. Also, when the first frame 320 moves downward, the lift pin 340 moves downward due to the weight thereof. With respect to a downward position of the lift pin 340 when the lift pin 340 moves downward, an upper end of the lift pin 340 is preferably located below a top surface of the substrate support plate 220 by a certain distance "t1" (for example, 2 mm). With respect to an upward position of the lift pin 340 when the lift pin 340 moves upward, the upward position can be a height that allows a carrying device of a substrate "W" to load or unload the substrate onto or from the top surface 222 of the substrate support plate 220 when the substrate "W" is spaced apart from the top surface 222 of the substrate support plate 220.

[0077] When the first frame 320 moves downward and when the lift pin 340 is locked into the pin hole 224, the pressing bracket 350 is prescribed to forcibly move the lift pin 340 downward. The pressing bracket 350 is preferably provided to maintain a certain gap from a top surface of the weight 344. The pressing bracket 350 is prescribed such that a height of the pressing bracket 350 is adjusted when the apparatus is set up. For example, when the level of the leveling bolt 330 is adjusted, the height of the pressing bracket 350 can be simultaneously adjusted.

[0078] For example, the pressing bracket 350 can include a fixing part 352, a vertical part 354, and a pressing part 356. The pressing bracket 350 has a substantially C-shaped cross section. The fixing part 352 is fixed to the lower end of the leveling bolt 330. The vertical part 354 extends vertically upward from the fixing part 352. The pressing part 356 extends horizontally from the vertical part 354 and is located on the top surface of the weight 344. The pressing part 356 is provided to maintain a certain gap "t2" (for example, 1.5 mm) from the top surface of the weight 344. The pressing part 356 has a through-hole 357. The through-hole 357 is formed to have a diameter smaller than that of the weight 344 and larger than that of the lift pin 340. The through-hole 357 has an opening 358, which is opened at one side of the through-hole 357.

[0079] In this case, since interference is avoided upon introduction of the substrate "W" only when the pin standby position (downward position) is located at a distance of at least 0.5 mm below the top surface 222 of the substrate support plate 220, the gap between the pressing member 356 and the weight 344 is necessary.

[0080] As described above, the pressing bracket 350 has the same reference plane (the bottom surface of the first frame) as that of the leveling bolt 330.

[0081] Hereinafter, the installation of the pressing bracket 350 will be described. First, the bolt head 332 of the leveling bolt 330 is fastened to the top surface of the bolt plate 390 while being fastened with the bottom surface of the first frame 320 as a reference plane. If so, since the bolt head 332 of the leveling bolt 330 is always uniform, the height of the lift pin 340 supported on the top surface of the bolt head 332 is equally set.

[0082] As a reference, when the horizontal state of the first frame 320 is deformed, the height of the lift pin 340 can be changed according to the position of the first frame 320. In this case, as shown in FIG. 6, the set height of the lift pin 340 can be adjusted by changing the height of the leveling bolt 330 from the bolt plate 390. Figure 8 As described above, when the installation of the leveling bolt 330 and the lift pin 340 is completed, and when the fixing part 352 of the pressing bracket 350 is fixed by the lower tab of the leveling bolt 330, the leveling bolt 330, the lift pin 340, and the pressing bracket 350 are stacked based on the same plane, and the gap between the pressing bracket 350 and the weight 344 is always automatically set. As described above, since the leveling bolt 330 and the pressing bracket 350 have the same assembly reference position, the lift pin 240 is set on the first frame 320 without an additional work or an additional jig.

[0083] As described above, in the lift pin assembly 300, when the height of the leveling bolt 330 is adjusted only, the height of the pressing frame 350 is actually adjusted as well. Accordingly, the distance between the pressing portion 356 and the weight 344 can maintain a constant gap.

[0084] Figure 9 and Figure 10 illustrates a pressing bracket according to another embodiment of the present inventive concept.

[0085] As Figure 9 and Figure 10 illustrated, the pressing bracket 350a includes a pressing portion 356a which maintains a constant distance from the top surface of the weight 332, and a fixing portion 352a which extends in a vertical direction from one end of the pressing portion 356a and is fixed to the side surface of the first frame 320. The fixing portion 352a includes a slit hole 355 formed in a vertical direction, such that the fixing portion 352a is fixed to the side surface of the first frame 320 by a fastening bolt and the height of the fixing portion 352a is adjusted.

[0086] The pressing bracket 350a having the above-described configuration can be adjusted in height independently of the leveling bolt 330.

[0087] According to the embodiment of the present inventive concept, the lift pin assembly can improve the leveling work efficiency of the lift pin and overcome the failure of the installation of the lift pin.

[0088] According to the embodiment of the present inventive concept, the lift pin assembly can facilitate the installation of the height of the pressing bracket to forcibly move the lift pin downward when the lift pin is locked to the pin hole.

[0089] The technical effects to be achieved by the present inventive concept are not limited to the above-mentioned effects, and any other technical effects not mentioned herein will be clearly understood by those skilled in the art from the following description.

[0090] In the foregoing, while the present inventive concept has been described with reference to the embodiments and the drawings, the present inventive concept is not limited thereto, but can be variously modified and changed by those skilled in the art to which the present inventive concept pertains without departing from the spirit and scope of the present inventive concept claimed in the appended claims. Therefore, the embodiments of the present inventive concept are provided to explain the spirit and scope of the present inventive concept, not to limit them, and thus the spirit and scope of the present inventive concept are not limited by the embodiments. The scope of the present inventive concept should be interpreted based on the appended claims, and all technical ideas within the scope equivalent to the claims should be included in the scope of the present inventive concept.

[0091] While the inventive concept has been described with reference to the implementations described above, it will be apparent to those of ordinary skill in the art that various changes and modifications can be made without departing from the spirit and scope of the inventive concept. Therefore, it is to be understood that what is described above is illustrative of the inventive concept and is not intended to be limiting.

Claims

1. A lift pin assembly comprising: a leveling bolt mounted on a first frame lifted by a lifting device; a lift pin having a weight provided at a lower end of the lift pin and supported by the leveling bolt; and a pressing bracket configured to forcibly move the lift pin downward when the lift pin is locked in a pin hole, wherein the pressing bracket is adjusted in height to be disposed while maintaining a certain gap from a top surface of the weight, and wherein the pressing bracket comprises: a pressing portion having one end fixed to the leveling bolt and positioned while maintaining a certain gap from the top surface of the weight. 2.The lift pin assembly of claim 1, wherein the pressing bracket is disposed to be simultaneously adjusted in height when a level of the leveling bolt is adjusted. 3.The lift pin assembly of claim 1, wherein the pressing bracket further comprises: a vertical portion vertically extended downward from one side of the pressing portion; and a fixing portion horizontally extended from a lower end of the vertical portion and fixed by a lower tab of the leveling bolt. 4.The lift pin assembly of claim 1, wherein the pressing bracket comprises: a pressing portion positioned while maintaining a certain gap from the top surface of the weight; and a fixing portion vertically extended from one end of the pressing portion and fixed to a side surface of the first frame. 5.The lift pin assembly of claim 4, wherein the fixing portion comprises: a slit hole vertically extended such that a fixing bolt is fixed to the side surface of the first frame. 6.The lift pin assembly of claim 1 or 3, wherein the pressing portion comprises: a through hole having a diameter smaller than that of the weight and larger than that of the lift pin, and wherein the through hole is disposed to be open at one side. 7.The lift pin assembly of claim 3, wherein the lift pin assembly further comprises: a bolt plate horizontally fixedly connected to a bottom surface of the first frame, and wherein the leveling bolt is mounted on the bolt plate perpendicularly to the bolt plate. 8.The lift pin assembly of claim 7, wherein the leveling bolt comprises: a bolt head located on a top surface of the bolt plate; and a lower tab located on a bottom surface of the bolt plate, and wherein the fixing portion of the pressing bracket is fixed to the lower tab of the leveling bolt, and a height of the leveling bolt on the bolt plate is adjusted. 9.A substrate processing apparatus, the apparatus comprising: a housing having a processing space for performing a process on a substrate; a substrate support plate disposed within the processing space and having a top surface for placing the substrate and a pin hole; and a lift pin assembly configured to load / unload the substrate on / from the substrate support plate, wherein the lift pin assembly comprises: a lifting device; ​ ​ ​ ​ ​ a first frame which moves up and down by the lifting device; a leveling bolt which is installed on the first frame; a lifting pin having a weight provided at a lower end of the lifting pin, respectively supported by the leveling bolts, and moving upward when the first frame moves upward, and moving downward by the weight when the first frame moves downward; and a pressing bracket configured to forcibly move the lifting pin downward when the first frame moves downward and when the lifting pin is locked in the pin hole, wherein the pressing bracket is adjustable in height to be provided while maintaining a certain gap from a top surface of the weight, wherein one end of the pressing bracket is fixed to the leveling bolt, and wherein the pressing bracket includes a pressing portion provided to maintain a certain gap from the top surface of the weight. 10.The apparatus of claim 9, wherein the pressing bracket further comprises: a fixing portion fixed to a lower end of the leveling bolt; and a vertical portion vertically extended upward from the fixing portion; wherein the pressing portion is horizontally extended from the vertical portion and located on the top surface of the weight, and wherein the pressing bracket is provided to be simultaneously adjusted in height when the horizontal of the leveling bolt is adjusted. 11.The apparatus of claim 9, further comprising: a bolt plate horizontally fixedly connected to a bottom surface of the first frame, wherein the leveling bolt is installed on the bolt plate perpendicular to the bolt plate. 12.The apparatus of claim 11, wherein the leveling bolt comprises: a bolt head located on a top surface of the bolt plate and configured to support the weight of the lifting pin when the first frame moves upward; and a lower tab located on the bottom surface of the bolt plate, wherein the fixing portion of the pressing bracket is fixed to the lower tab. 13.The apparatus of claim 9, wherein the pressing bracket comprises: a pressing portion positioned while maintaining a certain gap from the top surface of the weight; and a fixing portion vertically extended from one end of the pressing portion and fixed to a side surface of the first frame. 14.The apparatus of claim 13, wherein the fixing portion comprises: a slit hole vertically extended such that a fixing bolt is fixed to the side surface of the first frame and a fixing height of the pressing bracket is adjusted. 15.The apparatus of claim 10 or 13, wherein the pressing portion comprises: a through hole having a diameter smaller than a diameter of the weight and larger than a diameter of the lifting pin, and wherein the through hole is provided to be open at one side. 16.The apparatus of claim 9, wherein the lifting device comprises: a base frame provided below the first frame; a lifting unit spaced apart from a center of the base frame by a certain distance and provided on the base frame to be liftable. ​ ​ ​ a driving unit for driving to simultaneously move upward and downward the lifting unit; and a power transmission unit for simultaneously transmitting a driving force of the driving unit to the lifting unit.

17. A lifting pin assembly comprising: a first frame moved up and down by a lifting device; a leveling bolt mounted on the first frame; a lifting pin having a weight provided at a lower end of the lifting pin, respectively supported by the leveling bolt, and moved upward when the first frame is moved upward, and moved downward by a dead weight when the first frame is moved downward; and a pressing bracket configured to forcibly move the lifting pin downward when the first frame is moved downward and when the lifting pin is locked in a pin hole, wherein the pressing bracket comprises: a fixing portion fixed to a lower end of the leveling bolt; a vertical portion vertically extended upward from the fixing portion; and a pressing portion horizontally extended from the vertical portion, located above a top surface of the weight, and provided to maintain a specific gap from the top surface of the weight, and wherein the pressing bracket is provided to be simultaneously adjusted in height when the leveling bolt is horizontally adjusted.

18. The lifting pin assembly of claim 17, further comprising: a bolt plate horizontally fixedly connected to a bottom surface of the first frame, wherein the leveling bolt is vertically mounted on the bolt plate, wherein the leveling bolt comprises: a bolt head located on a top surface of the bolt plate to support the weight of the lifting pin when the first frame is moved upward; and a lower tab located on the bottom surface of the bolt plate, and wherein the fixing portion of the pressing bracket is fixed to the lower tab.

19. The lifting pin assembly of claim 17, wherein the pressing portion comprises: a through hole having a diameter smaller than that of the weight and larger than that of the lifting pin, and wherein the through hole is provided to be open at one side.

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