Substrate processing apparatus and cleaning method for substrate processing apparatus

Abstract

A substrate processing apparatus and a cleaning method of a substrate processing apparatus capable of removing foreign matter attached to a peripheral wall portion of a cup are provided. A substrate processing apparatus according to a technical scheme of an embodiment includes a holding portion, a processing liquid supply portion, a first cup, a second cup, and a cleaning liquid supply portion. The holding portion is configured to hold a substrate. The processing liquid supply portion is configured to supply a first processing liquid and a second processing liquid to the substrate. The first cup has a peripheral wall portion and is configured to recover the first processing liquid in a recovery portion formed by the peripheral wall portion. The second cup is disposed adjacent to the first cup and is configured to recover the second processing liquid. The cleaning liquid supply portion is configured to supply a cleaning liquid to the recovery portion of the first cup. In the substrate processing apparatus, the peripheral wall portion is cleaned by causing the cleaning liquid supplied from the cleaning liquid supply portion to overflow from the peripheral wall portion toward the second cup.

Description

[0001] This application is a divisional application of the application filed on January 12, 2017, with application number 201710022808.3 and entitled "Substrate Processing Apparatus and Cleaning Method for Substrate Processing Apparatus". Technical Field

[0002] The disclosed embodiments relate to a substrate processing apparatus and a cleaning method for the substrate processing apparatus. Background Technology

[0003] Conventionally, substrate processing apparatuses are known to supply predetermined processing solutions to substrates such as semiconductor wafers and glass substrates to perform various processing (see, for example, Patent Document 1).

[0004] For the aforementioned substrate processing apparatus, a cup-shaped member arranged to surround the substrate is used to collect and discharge processing liquid that has spilled from the substrate. This cup-shaped member is configured to have a peripheral wall portion that is erected vertically from, for example, the bottom, and the space formed by the peripheral wall portion serves as a collection section to collect and discharge the processing liquid.

[0005] Furthermore, in the aforementioned substrate processing apparatus, when multiple processing liquids are present, multiple cup-shaped members are provided depending on the type of processing liquid. That is, when the substrate processing apparatus supplies a first processing liquid and a second processing liquid to the substrate, it has a first cup-shaped member for recovering the first processing liquid and a second cup-shaped member disposed adjacent to the first cup-shaped member for recovering the second processing liquid.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 2013-089628 Summary of the Invention

[0009] The problem the invention aims to solve

[0010] However, in the aforementioned substrate processing apparatus, when the processing liquid is discharged after various processes, for example, a portion of the first processing liquid sometimes remains in the first cup-shaped member. Similarly, a portion of the second processing liquid sometimes remains in the second cup-shaped member. In this case, in the substrate processing apparatus, it is known that the remaining first and second processing liquids react to produce foreign matter such as crystals, which adhere to the peripheral wall of the first cup-shaped member.

[0011] The objective of one embodiment is to provide a substrate processing apparatus and a cleaning method for the substrate processing apparatus capable of removing foreign matter attached to the peripheral wall of a cup-shaped component.

[0012] Solution for solving the problem

[0013] One embodiment of the substrate processing apparatus includes a holding section, a processing liquid supply section, a first cup-shaped member, a second cup-shaped member, a cleaning liquid supply section, a discharge pipe, and a valve. The holding section holds the substrate. The processing liquid supply section supplies the substrate with a first processing liquid and a second processing liquid. The first cup-shaped member has a peripheral wall portion for recovering the first processing liquid in a recovery section formed by the peripheral wall portion. The second cup-shaped member is disposed adjacent to the first cup-shaped member and is used to recover the second processing liquid. The cleaning liquid supply section supplies cleaning liquid to the recovery section of the first cup-shaped member via a drain port formed at the bottom of the recovery section of the first cup-shaped member. The discharge pipe is connected to the recovery section for discharging the first processing liquid recovered in the recovery section. The valve controls the discharge of the first processing liquid from the discharge pipe. In the substrate processing apparatus, the peripheral wall portion is cleaned by allowing the cleaning liquid supplied by the cleaning liquid supply section to overflow from the peripheral wall portion towards the second cup-shaped member. The cleaning fluid supply unit is connected to the drain pipe at a position upstream of the valve in the flow direction. When the valve is closed, the cleaning fluid is supplied from the drain pipe to the recovery unit of the first cup-shaped member.

[0014] Another embodiment of the substrate processing apparatus includes a holding section, a processing liquid supply section, a first cup-shaped member, a second cup-shaped member, and a cleaning liquid supply section. The holding section holds the substrate. The processing liquid supply section supplies the first processing liquid and the second processing liquid to the substrate. The first cup-shaped member has a peripheral wall portion, and the first processing liquid is collected in a collection section formed by the peripheral wall portion. The second cup-shaped member is disposed adjacent to the first cup-shaped member and is used to collect the second processing liquid. The cleaning liquid supply section supplies cleaning liquid to the collection section of the first cup-shaped member. In the substrate processing apparatus, the peripheral wall portion is cleaned by causing the cleaning liquid supplied by the cleaning liquid supply section to overflow from the peripheral wall portion towards the second cup-shaped member. The cleaning liquid supply section includes a substrate nozzle that sprays substrate cleaning liquid for cleaning the substrate. The substrate nozzle delivers substrate cleaning liquid as cleaning liquid for cleaning the peripheral wall portion to the collection section of the first cup-shaped member.

[0015] Another embodiment of the substrate processing apparatus includes a holding section, a processing liquid supply section, a first cup-shaped member, a second cup-shaped member, and a cleaning liquid supply section. The holding section holds the substrate. The processing liquid supply section supplies a first processing liquid and a second processing liquid to the substrate. The first cup-shaped member has a peripheral wall portion, and the first processing liquid is collected in a collection section formed by the peripheral wall portion. The second cup-shaped member is disposed adjacent to the first cup-shaped member and is used to collect the second processing liquid. The cleaning liquid supply section supplies cleaning liquid to the collection section of the first cup-shaped member. In the substrate processing apparatus, the peripheral wall portion is cleaned by causing the cleaning liquid supplied by the cleaning liquid supply section to overflow from the peripheral wall portion towards the second cup-shaped member. The cleaning liquid supply section includes a holding mechanism nozzle that sprays a holding mechanism cleaning liquid for cleaning the holding mechanism, including the holding section. The holding mechanism nozzle supplies the holding mechanism cleaning liquid as a cleaning liquid for cleaning the peripheral wall portion to the collection section of the first cup-shaped member.

[0016] The effects of the invention

[0017] According to one embodiment, foreign matter attached to the peripheral wall of a cup-shaped component can be removed. Attached Figure Description

[0018] Figure 1 This is a diagram showing the schematic configuration of the substrate processing system according to the first embodiment.

[0019] Figure 2 It is a diagram showing the general structure of the processing unit.

[0020] Figure 3 It is a schematic cross-sectional view showing a specific configuration example of the processing unit.

[0021] Figure 4A This diagram illustrates the structure of the cleaning fluid supply unit and the cleaning process.

[0022] Figure 4B This is a diagram used to illustrate the cleaning process.

[0023] Figure 4C This is a diagram used to illustrate the cleaning process.

[0024] Figure 5 This is a flowchart illustrating the processing sequence of the substrate processing system of the first embodiment.

[0025] Figure 6 This is a flowchart illustrating an example of the processing sequence for cleaning the wall portion, etc., in the first cycle of a substrate processing system.

[0026] Figure 7This is a schematic cross-sectional view showing the configuration examples of the processing unit in the first to third variations.

[0027] Figure 8 This is a schematic diagram showing the general configuration of the cleaning fluid supply unit and the like in the second embodiment.

[0028] Explanation of reference numerals in the attached figures

[0029] 1. Substrate processing system; 4. Control device; 16. Processing unit; 18. Control unit; 30. Substrate holding mechanism; 31. Holding part; 40. Processing fluid supply unit; 50. Recovery cup-shaped part; 50a. First cup-shaped part; 50b. Second cup-shaped part; 50c. Third cup-shaped part; 54a. First peripheral wall part; 54b. Second peripheral wall part; 55a. First liquid receiving part; 55b. Second liquid receiving part; 56a. First support member; 57a. Second support member; 59a. Through hole; 59b. Through hole; 70. Processing fluid supply source; 80. Cleaning fluid supply unit; 111. Circulation pipeline; 200. Heat exchange unit. Detailed Implementation

[0030] Hereinafter, embodiments of the substrate processing apparatus and the cleaning method of the substrate processing apparatus disclosed in this application will be described in detail with reference to the accompanying drawings. Furthermore, the present invention is not limited to the embodiments shown below.

[0031] <1. Composition of the substrate processing system>

[0032] (First Embodiment)

[0033] Figure 1 This diagram illustrates the general configuration of the substrate processing system according to this embodiment. Hereinafter, to clarify the positional relationships, the X-axis, Y-axis, and Z-axis are defined as mutually orthogonal, with the positive direction of the Z-axis set as the vertically upward direction.

[0034] like Figure 1 As shown, the substrate processing system 1 has an input / output station 2 and a processing station 3. The input / output station 2 and the processing station 3 are arranged adjacent to each other.

[0035] The input / output station 2 has a carrier placement section 11 and a transport section 12. A plurality of carriers C are placed in the carrier placement section 11, and the plurality of carriers C accommodate a plurality of substrates, which in this embodiment are semiconductor wafers (hereinafter referred to as wafers W) in a horizontal state.

[0036] The transport section 12 is disposed adjacent to the carrier placement section 11, and a substrate transport device 13 and a transfer section 14 are disposed therein. The substrate transport device 13 has a wafer holding mechanism for holding the wafer W. In addition, the substrate transport device 13 can move in the horizontal and vertical directions and rotate about the vertical axis, and the wafer W is transported between the carrier C and the transfer section 14 using the wafer holding mechanism.

[0037] The processing station 3 is arranged adjacent to the conveying section 12. The processing station 3 has a conveying section 15 and a plurality of processing units 16. The plurality of processing units 16 are arranged side by side on both sides of the conveying section 15.

[0038] The transport section 15 has a substrate transport device 17 inside. The substrate transport device 17 has a wafer holding mechanism for holding the wafer W. In addition, the substrate transport device 17 can move in the horizontal and vertical directions and rotate around the vertical axis, and uses the wafer holding mechanism to transport the wafer W between the transfer section 14 and the processing unit 16.

[0039] The processing unit 16 performs a predetermined substrate processing on the wafer W transported by the substrate transport device 17.

[0040] Furthermore, the substrate processing system 1 includes a control device 4. The control device 4 is, for example, a computer, and includes a control unit 18 and a storage unit 19. The storage unit 19 stores programs that control various processes performed in the substrate processing system 1. The control unit 18 controls the operation of the substrate processing system 1 by reading and executing the programs stored in the storage unit 19.

[0041] Furthermore, the program can be recorded on a computer-readable storage medium, or it can be installed from that storage medium into the storage unit 19 of the control device 4. Examples of computer-readable storage media include hard disks (HD), floppy disks (FD), optical disks (CD), magneto-optical disks (MO), and memory cards.

[0042] In the substrate processing system 1 configured as described above, firstly, the substrate transport device 13 of the input / output station 2 removes the wafer W from the carrier C placed on the carrier placement section 11 and places the removed wafer W on the transfer section 14. The wafer W placed on the transfer section 14 is then removed from the transfer section 14 by the substrate transport device 17 of the processing station 3 and input to the processing unit 16.

[0043] After the wafer W input to the processing unit 16 is processed by the processing unit 16, it is output from the processing unit 16 and placed in the transfer section 14 by the substrate transport device 17. Furthermore, the processed wafer W placed in the transfer section 14 is returned to the carrier C of the carrier placement section 11 by the substrate transport device 13.

[0044] Next, refer to Figure 2 The general configuration of the processing unit 16 of the substrate processing system 1 will be described. Figure 2 This is a diagram showing the general structure of the processing unit 16.

[0045] like Figure 2 As shown, the processing unit 16 has a chamber 20, a substrate holding mechanism 30, a processing fluid supply unit 40, and a recovery cup-shaped member 50.

[0046] The chamber 20 is used to house the substrate holding mechanism 30, the process fluid supply unit 40, and the recovery cup-shaped member 50. An FFU (Fan Filter Unit) 21 is provided at the top of the chamber 20. The FFU 21 is used to form a downward flow within the chamber 20.

[0047] The substrate holding mechanism 30 includes a holding portion 31, a support portion 32, and a driving portion 33. The holding portion 31 is used to horizontally hold the wafer W. The support portion 32 is a member extending in the vertical direction, with its base end supported by the driving portion 33 to be rotatable, and its top end horizontally supporting the holding portion 31. The driving portion 33 is used to rotate the support portion 32 about a vertical axis. By using the driving portion 33 to rotate the support portion 32, the substrate holding mechanism 30 rotates the holding portion 31 supported on the support portion 32, thereby rotating the wafer W held on the holding portion 31.

[0048] The processing fluid supply unit 40 is used to supply processing fluid to the wafer W. The processing fluid supply unit 40 is connected to the processing fluid supply source 70.

[0049] The recovery cup 50 is configured to surround the holding portion 31 and collects the processing liquid that spills from the wafer W due to the rotation of the holding portion 31. A drain port 51 is formed at the bottom of the recovery cup 50, through which the processing liquid collected by the recovery cup 50 is discharged to the outside of the processing unit 16. In addition, an exhaust port 52 is formed at the bottom of the recovery cup 50 for discharging the gas supplied from the FFU 21 to the outside of the processing unit 16.

[0050] <2. Specific Structure of the Processing Unit>

[0051] Next, refer to Figure 3 The configuration of the above-mentioned processing unit 16 will be described in more detail. Figure 3 This is a schematic cross-sectional view showing a specific configuration example of the processing unit 16.

[0052] like Figure 3As shown, FFU21 is connected to the inactive gas supply source 23 via valve 22. FFU21 is used to eject inactive gases such as N2 gas supplied from the inactive gas supply source 23 as a downflow gas into the chamber 20. In this way, by using inactive gases as the downflow gas, wafer W oxidation can be prevented.

[0053] A holding member 311 for holding the wafer W from the side is provided on the upper surface of the holding portion 31 of the substrate holding mechanism 30. The wafer W is held horizontally by the holding member 311 in a state that is slightly separated from the upper surface of the holding portion 31.

[0054] The processing fluid supply unit 40 includes a nozzle 41, an arm 42 for horizontally supporting the nozzle 41, and a rotary lifting mechanism 43 for rotating and raising the arm 42. The nozzle 41 is connected to one end of a pipe (not shown), the other end of which branches into multiple branches. Each end of the branched pipe is connected to an alkaline processing liquid supply source 70a, an acidic processing liquid supply source 70b, an organic processing liquid supply source 70c, and a DIW supply source 70d, respectively. Additionally, valves 60a to 60d are provided between each supply source 70a to 70d and the nozzle 41.

[0055] The processing fluid supply unit 40 supplies alkaline processing liquid, acidic processing liquid, organic processing liquid and DIW (room temperature pure water) supplied from the above-mentioned supply sources 70a to 70d to the surface of the wafer W through the nozzle 41 to perform liquid processing on the wafer W.

[0056] Furthermore, while the above describes liquid treatment of the surface of wafer W, it is not limited to this; liquid treatment can also be performed on, for example, the back side or periphery of wafer W. Additionally, in this embodiment, alkaline treatment liquid, acidic treatment liquid, organic treatment liquid, and DIW are supplied from a single nozzle 41, but the processing fluid supply unit 40 may also have multiple nozzles corresponding to each treatment liquid.

[0057] A first rotating cup-shaped member 101 and a second rotating cup-shaped member 102 are provided at the periphery of the retaining part 31, which rotate integrally with the retaining part 31. For example... Figure 3 As shown, the second rotating cup-shaped member 102 is positioned more inward than the first rotating cup-shaped member 101.

[0058] These first rotating cup-shaped members 101 and second rotating cup-shaped members 102 are generally formed in a ring shape. If the first rotating cup-shaped member 101 and second rotating cup-shaped member 102 rotate together with the holding part 31, the processing liquid that will be scattered from the rotating wafer W will be guided to the recovery cup-shaped member 50.

[0059] The recycling cup-shaped member 50 has a first cup-shaped member 50a, a second cup-shaped member 50b, and a third cup-shaped member 50c sequentially from the inner side near the rotation center of the wafer W held and rotated by the holding part 31. In addition, the recycling cup-shaped member 50 has a cylindrical inner wall portion 54d centered on the rotation center of the wafer W on the inner circumferential side of the first cup-shaped member 50a.

[0060] The first cup-shaped member 50a to the third cup-shaped member 50c and the inner wall portion 54d are provided on the bottom 53 of the recovery cup-shaped member 50. Specifically, the first cup-shaped member 50a has a first peripheral wall portion 54a and a first liquid receiving portion 55a.

[0061] The first peripheral wall portion 54a is erected from the bottom 53 and is formed in a cylindrical shape (e.g., a cylindrical shape). A space is formed between the first peripheral wall portion 54a and the inner wall portion 54d, which is configured as a first drain tank 501a for recovering and discharging processing liquids, etc. A first liquid receiving portion 55a is provided above the upper surface 54a1 of the first peripheral wall portion 54a.

[0062] Furthermore, the first cup-shaped member 50a has a first lifting mechanism 56, configured to be able to be lifted or lowered using the first lifting mechanism 56. Specifically, the first lifting mechanism 56 has a first support member 56a and a first lifting drive unit 56b.

[0063] The first support member 56a is multiple (e.g., 3). Figure 3 (Only one is shown in the figure) A longitudinally elongated member. The first support member 56a passes through a through hole formed in the first peripheral wall portion 54a in a movable manner. Furthermore, as the first support member 56a, a cylindrical rod can be used, but it is not limited to this.

[0064] The first support member 56a is positioned such that its upper end is exposed from the upper surface 54a1 of the first peripheral wall portion 54a, and is connected to the lower surface of the first liquid receiving portion 55a to support the first liquid receiving portion 55a from below. On the other hand, the lower end of the first support member 56a is connected to the first lifting drive portion 56b.

[0065] The first lifting drive unit 56b causes the first support member 56a to move up and down along, for example, the Z-axis direction, thereby causing the first liquid receiving part 55a to move up and down relative to the first peripheral wall part 54a. Furthermore, a cylinder can be used as the first lifting drive unit 56b. Additionally, the first lifting drive unit 56b is controlled by the control device 4.

[0066] The first liquid receiving unit 55a, driven by the first lifting drive unit 56b, moves between a processing position that receives the processing liquid that is scattered from the rotating wafer W and a retraction position that moves from the processing position to the lower side.

[0067] In detail, when the first liquid receiving part 55a is in the processing position, an opening is formed on the inner side of the upper end of the first liquid receiving part 55a, and a flow path is formed from the opening to the first drain tank 501a.

[0068] On the other hand, such as Figure 3 As shown, the inner wall portion 54d has an extension portion 54d1 that extends at an angle toward the periphery of the holding portion 31. When the first liquid receiving portion 55a is in the retracted position, it abuts against the extension portion 54d1 of the inner wall portion 54d, and the opening on the inner side of the upper end is closed, thus sealing the flow path to the first drain tank 501a.

[0069] The second cup-shaped member 50b has the same configuration as the first cup-shaped member 50a. Specifically, the second cup-shaped member 50b has a second peripheral wall portion 54b, a second liquid receiving portion 55b, and a second lifting mechanism 57. The second cup-shaped member 50b is disposed adjacent to the first cup-shaped member 50a on the side of the first peripheral wall portion 54a of the first cup-shaped member 50a.

[0070] The second peripheral wall 54b is vertically disposed on the outer periphery of the bottom 53 near the first peripheral wall 54a, and is formed in a cylindrical shape. Furthermore, the space formed between the second peripheral wall 54b and the first peripheral wall 54a is provided as a second drain tank 501b for recovering and discharging the processing liquid, etc.

[0071] The second liquid receiving part 55b is located on the outer periphery of the first liquid receiving part 55a and is provided above the upper surface 54b1 of the second peripheral wall part 54b.

[0072] The second lifting mechanism 57 has a second support member 57a and a second lifting drive unit 57b. The second support member 57a is multiple (e.g., three). Figure 3 (Only one is shown in the figure) A longitudinally elongated member is inserted through a through hole formed in the second peripheral wall portion 54b in a movable manner. In addition, as the second support member 57a, a cylindrical rod can be used, but it is not limited to this.

[0073] The second support member 57a is positioned such that its upper end is exposed from the upper surface 54b1 of the second peripheral wall portion 54b, and is connected to the lower surface of the second liquid receiving portion 55b to support the second liquid receiving portion 55b from below. Furthermore, the upper surface 54b1 of the second peripheral wall portion 54b is positioned such that it is below the upper surface 54a1 of the first peripheral wall portion 54a in the vertical direction.

[0074] The lower end of the second support member 57a is connected to the second lifting drive unit 57b. The second lifting drive unit 57b is used to move the second support member 57a up and down along, for example, the Z-axis direction. Thus, the second support member 57a is used to move the second liquid receiving part 55b up and down relative to the second peripheral wall part 54b.

[0075] Furthermore, a cylinder can be used as the second lifting drive unit 57b. Additionally, the second lifting drive unit 57b is also controlled by the control device 4.

[0076] Furthermore, the second liquid receiving section 55b also moves between the processing position and the retracted position. Specifically, when the second liquid receiving section 55b is in the processing position and the first liquid receiving section 55a is in the retracted position, an opening is formed on the inner side of the upper end of the second liquid receiving section 55b, forming a flow path from the opening to the second drain tank 501b.

[0077] On the other hand, such as Figure 3 As shown, when the second liquid receiving part 55b is in the retracted position, it abuts against the first liquid receiving part 55a, and the opening on the inner side of its upper end is closed, thus sealing the flow path to the second drain tank 501b. Furthermore, while the retracted position of the second liquid receiving part 55b abuts against the first liquid receiving part 55a is described above, it is not limited to this; it may also abut against, for example, the inner wall portion 54d to close the opening on the inner side of its upper end.

[0078] The third cup-shaped member 50c has a third peripheral wall portion 54c and a third liquid receiving portion 55c. The third cup-shaped member 50c is disposed adjacent to the second cup-shaped member 50b on the side opposite to the first cup-shaped member 50a. The third peripheral wall portion 54c is vertically disposed on the outer peripheral side of the bottom 53 near the second peripheral wall portion 54b and is formed into a cylindrical shape. Furthermore, the space between the third peripheral wall portion 54c and the second peripheral wall portion 54b is provided as a third drain tank 501c for recovering and discharging the processing liquid, etc.

[0079] The third liquid receiving portion 55c is formed continuously from the upper end of the third peripheral wall portion 54c. The third liquid receiving portion 55c is formed to surround the wafer W held by the holding portion 31 and extend above the first liquid receiving portion 55a and the second liquid receiving portion 55b.

[0080] like Figure 3 As shown, when the first liquid receiving part 55a and the second liquid receiving part 55b are both in the retracted position, the third liquid receiving part 55c forms an opening on the inner side of the upper end of the third liquid receiving part 55c, forming a flow path from the opening to the third drain tank 501c.

[0081] On the other hand, when the second liquid receiving part 55b is in the raised position, or when both the first liquid receiving part 55a and the second liquid receiving part 55b are in the raised position, the third liquid receiving part 55c abuts against the second liquid receiving part 55b, the opening on the inner side of the upper end is closed, and the flow path to the third drain tank 501c is blocked.

[0082] In the portion of the bottom 53 corresponding to the first cup-shaped member 50a to the third cup-shaped member 50c, or more precisely, in the portion of the bottom 53 corresponding to the first drain tank 501a to the third drain tank 501c, drain ports 51a to 51c are formed at intervals along the circumferential direction of the recovery cup-shaped member 50.

[0083] Here, we will take the cases where the treatment liquid discharged from drain port 51a is an acidic treatment liquid, the treatment liquid discharged from drain port 51b is an alkaline treatment liquid, and the treatment liquid discharged from drain port 51c is an organic treatment liquid as examples. Furthermore, the types of treatment liquids discharged from each of the aforementioned drain ports 51a to 51c are merely illustrative and are not limited to any particular type.

[0084] The drain port 51a is connected to the drain pipe 91a. A valve 62a is installed midway along the drain pipe 91a, at which point it branches into a first drain pipe 91a1 and a second drain pipe 91a2. Furthermore, the valve 62a can be a three-way valve that can switch between, for example, a closed position, a position that opens the drain path towards the first drain pipe 91a1, and a position that opens towards the second drain pipe 91a2.

[0085] If the aforementioned acid treatment solution can be reused, the first drain pipe 91a1 is connected to the acid treatment solution supply source 70b (e.g., a tank for storing the acid treatment solution), so that the drained solution returns to the acid treatment solution supply source 70b. That is, the first drain pipe 91a1 functions as a circulation pipeline. Furthermore, the second drain pipe 91a2 will be discussed subsequently.

[0086] Drain port 51b is connected to drain pipe 91b. A valve 62b is installed midway through drain pipe 91b. Drain port 51c is connected to drain pipe 91c. A valve 62c is installed midway through drain pipe 91c. Furthermore, valves 62b and 62c are controlled by control device 4.

[0087] Furthermore, when the processing unit 16 performs substrate processing, it raises and lowers the first liquid receiving section 55a of the first cup-shaped member 50a and the second liquid receiving section 55b of the second cup-shaped member 50b according to the type of processing liquid used in each process of substrate processing, and performs switching of the drain ports 51a to 51c.

[0088] When processing wafer W by spraying, for example, an acid-based processing solution onto wafer W, the control device 4 opens valve 60b while controlling the drive unit 33 of substrate holding mechanism 30 to rotate holding unit 31 at a predetermined rotation speed.

[0089] At this time, the control device 4 raises the first cup-shaped member 50a in advance. That is, the control device 4 raises the first support member 56a and the second support member 57a by means of the first lifting drive unit 56b and the second lifting drive unit 57b, raising the first liquid receiving part 55a to the processing position, thereby pre-forming a flow path from the opening on the inner side of the upper end of the first liquid receiving part 55a to the first drain tank 501a. As a result, the acid-based processing solution supplied to the wafer W flows downward and into the first drain tank 501a.

[0090] Furthermore, the control device 4 pre-controls valve 62a to open the discharge path towards the first discharge pipe 91a1. As a result, the acid-based processing solution flowing into the first discharge tank 501a returns to the acid-based processing solution supply source 70b via discharge pipe 91a and the first discharge pipe 91a1. The acid-based processing solution returned to the acid-based processing solution supply source 70b is then supplied to the wafer W again. Thus, the first cup-shaped member 50a is connected to a circulation line that recirculates the recovered acid-based processing solution and supplies it back to the wafer W.

[0091] In addition, when processing wafer W by spraying, for example, an alkaline treatment solution onto wafer W, the control device 4 opens valve 60a while controlling the drive unit 33 in the same way to rotate the holding unit 31 at a predetermined rotation speed.

[0092] At this time, the control device 4 initially raises only the second cup-shaped member 50b. That is, the control device 4, using the second lifting drive unit 57b, raises the second support member 57a, causing the second liquid receiving unit 55b to rise to the processing position, thereby pre-forming a flow path from the opening at the upper inner side of the second liquid receiving unit 55b to the second drain tank 501b. Meanwhile, the first cup-shaped member 50a descends. As a result, the alkaline processing solution supplied to the wafer W flows downwards into the second drain tank 501b.

[0093] Additionally, control device 4 pre-opens valve 62b. As a result, the alkaline treatment liquid in the second drain tank 501b is discharged to the outside of the treatment unit 16 via drain pipe 91b. Thus, drain pipe 91b functions as a drain line for discharging the recovered second treatment liquid to the outside of the treatment unit 16. Specifically, the second cup-shaped member 50b is connected to the drain line.

[0094] In addition, when processing wafer W by spraying, for example, an organic processing liquid onto wafer W, the control device 4 opens valve 60c while controlling the drive unit 33 in the same way so that the holding unit 31 rotates at a predetermined rotation speed.

[0095] At this time, the control device 4 pre-lowers the first cup-shaped member 50a and the second cup-shaped member 50b (see reference). Figure 3Specifically, the control device 4, using the first lifting drive unit 56b and the second lifting drive unit 57b, lowers the first support member 56a and the second support member 57a, causing the first liquid receiving unit 55a and the second liquid receiving unit 55b to descend to their retracted positions. This pre-forms a flow path from the opening at the upper inner side of the third liquid receiving unit 55c to the third drain tank 501c. Consequently, the organic processing liquid supplied to the wafer W flows downwards into the third drain tank 501c.

[0096] Additionally, the control device 4 pre-opens the valve 62c, so that the organic processing liquid in the third drain tank 501c is discharged to the outside of the processing unit 16 via the drain pipe 91c. In this way, the third cup-shaped member 50c is also connected to the drain line (e.g., drain pipe 91c) that discharges the recovered third processing liquid to the outside of the processing unit 16.

[0097] Furthermore, the discharge paths of the acidic, alkaline, organic, and cleaning solutions described above are illustrative and not limiting. That is, it is also possible, for example, that each drain port 51a to 51c is connected to a drain pipe, and that the drain pipe is equipped with multiple valves corresponding to the properties of the acidic or alkaline treatment solutions, and the discharge path branches from the position of the valves.

[0098] Additionally, the drain pipe 91b is connected to the drain pipe 92a, which is connected to the through hole through which the first support member 56a passes in the first peripheral wall portion 54a. The drain pipe 92a discharges the cleaning fluid (discussed later) that has entered the through hole of the first peripheral wall portion 54a, and the cleaning fluid is discharged to the outside of the processing unit 16 via the drain pipe 91b.

[0099] In addition, the drain pipe 91c is also connected to the drain pipe 92b, which is connected to the through hole through which the second support member 57 passes in the second peripheral wall portion 54b. The drain pipe 92b discharges the cleaning fluid and the like that that enters the through hole of the second peripheral wall portion 54b, and the cleaning fluid is discharged to the outside of the processing unit 16 via the drain pipe 91c.

[0100] Exhaust ports 52a, 52b, and 52c are formed at the bottom 53, the first peripheral wall 54a, and the second peripheral wall 54b of the recovery cup-shaped member 50, respectively. Furthermore, exhaust ports 52a, 52b, and 52c are connected to an exhaust pipe, which branches into a first exhaust pipe 93a to a third exhaust pipe 93c on the downstream side of the exhaust. Additionally, a valve 64a is provided in the first exhaust pipe 93a, a valve 64b is provided in the second exhaust pipe 93b, and a valve 64c is provided in the third exhaust pipe 93c.

[0101] The first exhaust pipe 93a is for acidic exhaust, the second exhaust pipe 93b is for alkaline exhaust, and the third exhaust pipe 93c is for organic exhaust. These are switched by the control device 4 according to the various processes of substrate processing.

[0102] When performing a process that generates, for example, acidic exhaust gas, the control device 4 switches to the first exhaust pipe 93a, and the acidic exhaust gas is discharged via valve 64a. Similarly, when performing a process that generates alkaline exhaust gas, the control device 4 switches to the second exhaust pipe 93b, and the alkaline exhaust gas is discharged via valve 64b. Furthermore, when performing a process that generates organic exhaust gas, the control device 4 switches to the third exhaust pipe 93c, and the organic exhaust gas is discharged via valve 64c.

[0103] In this embodiment, SPM (a mixture of sulfuric acid and hydrogen peroxide in water) is used as the acidic treatment solution. SC1 (a mixture of ammonia, hydrogen peroxide, and water) is used as the alkaline treatment solution, and IPA (isopropanol) is used as the organic treatment solution.

[0104] Furthermore, SPM is an example of the first treatment solution, SC1 is an example of the second treatment solution, and IPA is an example of the third treatment solution. Moreover, the types of acidic, alkaline, and organic treatment solutions are not limited to these.

[0105] However, as described above, if SPM and SC1 are used in the processing unit 16, foreign matter such as crystals will adhere to, for example, the first peripheral wall portion 54a of the first cup-shaped member 50a.

[0106] In detail, when wafer W is processed by, for example, SC1, the SC1 supplied to wafer W is recovered by the second cup-shaped member 50b and then discharged through the drain pipe 91b. Alternatively, if processed by SPM, the SPM supplied to wafer W is recovered by the first cup-shaped member 50a and then discharged through the drain pipe 91a.

[0107] However, due to the discharge environment of each treatment liquid, a portion of SC1 and a portion of SPM may remain in the first cup-shaped member 50a and the second cup-shaped member 50b. In this case, the remaining SC1 may sometimes react with SPM to produce crystals.

[0108] Specifically, it is known that sometimes the ammonia component of SC1 reacts with the sulfuric acid component of SPM to produce ammonium sulfate crystals, which adhere as foreign matter to the first peripheral wall portion 54a of the first cup-shaped member 50a. Furthermore, such crystal formation is not limited to the combination of SC1 and SPM; it can also occur with combinations of other types of treatment solutions.

[0109] Therefore, in the processing unit 16 of this embodiment, a structure is provided that includes a cleaning fluid supply section for supplying cleaning fluid to the first peripheral wall portion 54a of the first cup-shaped member 50a. This allows for the removal of foreign matter such as crystals adhering to the first peripheral wall portion 54a.

[0110] <3. Specific structure of the cleaning fluid supply unit>

[0111] The following is for reference Figure 4A The cleaning fluid supply section 80, which supplies cleaning fluid to the first perimeter wall section 54a, etc., is described in detail in the accompanying drawings. Figure 4A This is a schematic enlarged sectional view used to illustrate the structure of the cleaning fluid supply unit 80 and the first to third cup-shaped members 50a to 50c.

[0112] like Figure 4A As shown, the cleaning fluid supply unit 80 of the processing unit 16 includes a cleaning fluid supply pipe 81a and a valve 82a. One end of the cleaning fluid supply pipe 81a is connected to the cleaning fluid supply source 83, and the other end is connected to the drain pipe 91a of the first cup-shaped member 50a. Specifically, the valve 82a is a valve used to control the discharge of SPM in the drain pipe 91a, and the other end of the cleaning fluid supply pipe 81a is connected to the drain pipe 91a at a position upstream of the valve 82a in the direction of fluid flow.

[0113] Valve 82a is provided on cleaning fluid supply pipe 81a and is controlled by control device 4. In addition, DIW can be used as the cleaning fluid supplied by cleaning fluid supply unit 80, but it is not limited to this.

[0114] Here, the drain pipe 91a, which is connected to the cleaning fluid supply pipe 81a, will be described. The SPM (acid-based processing fluid) flowing in the drain pipe 91a can be reused as described above, and therefore returned to the acid-based processing fluid supply source 70b, from which it is supplied to the wafer W again.

[0115] Specifically, such as Figure 4A As shown, the acid-based treatment fluid supply source 70b of the treatment fluid supply unit 40 has a tank 110 for storing SPM and a circulation line 111 connecting the tank 110 and the nozzle 41.

[0116] Tank 110 is connected to the end of the first drain pipe 91a1 located downstream of the aforementioned drain pipe 91a. SPM flowing in the first drain pipe 91a1 flows into and is stored in tank 110. In addition, tank 110 is connected to a replenishment section 114 for replenishing SPM, and also to a waste liquid section 115 for disposing of the SPM in tank 110.

[0117] A pump 112 is installed on the circulation line 111. The pump 112 pressurizes and delivers the SPM from the tank 110 toward the nozzle 41. In addition, a filter 113 is installed on the downstream side of the circulation line 111 near the pump 112 to remove particulate matter and other pollutants contained in the SPM. Auxiliary equipment (such as heaters) may also be installed on the circulation line 111 as needed.

[0118] Next, the structures of the first cup-shaped member 50a and the second cup-shaped member 50b will be further explained. For example... Figure 4A As shown, a through hole 59a for the first support member 56a to pass through is formed in the first peripheral wall portion 54a of the first cup-shaped member 50a as described above. The through hole 59a has an opening 59a1 formed on the upper surface 54a1 of the first peripheral wall portion 54a.

[0119] Furthermore, in the first cup-shaped member 50a, a space is formed between the first peripheral wall portion 54a and the first liquid receiving portion 55a; more specifically, between the upper surface 54a1 of the first peripheral wall portion 54a and the lower surface 55a1 of the first liquid receiving portion 55a, which is the portion opposite to the upper surface 54a1. Cleaning fluid can flow through this space, as will be discussed later. Furthermore, the first peripheral wall portion 54a is an example of a peripheral wall portion, and the first liquid receiving portion 55a is an example of a liquid receiving portion.

[0120] A through hole 59b for the second support member 57a to pass through is also formed in the second peripheral wall portion 54b of the second cup-shaped member 50b. The through hole 59b of the second peripheral wall portion 54b has an opening 59b1 formed on the upper surface 54b1 of the second peripheral wall portion 54b.

[0121] In addition, in the second cup-shaped member 50b, a space for the cleaning fluid to flow is also formed between the second peripheral wall portion 54b and the second liquid receiving portion 55b, specifically between the upper surface 54b1 of the second peripheral wall portion 54b and the lower surface 55b1 of the second liquid receiving portion 55b, which is the part opposite to the upper surface 54b1.

[0122] Furthermore, the first perimeter wall portion 54a, as described above, can be cleaned. In addition, Figure 4A and Figure 4B , 4C This is a diagram used to illustrate the cleaning process in this embodiment.

[0123] In detail, the control device 4 opens valve 82a during the cleaning process of the first cycle wall 54a, etc. At the same time, the control device 4 closes valves 62a, 62b, and 62c.

[0124] Therefore, as Figure 4AAs shown, the cleaning fluid L from the cleaning fluid supply source 83 is sprayed from the drain port 51a into the first drain tank 501a via the cleaning fluid supply pipe 81a, valve 82a, and drain pipe 91a. Thus, the cleaning fluid supply unit 80 supplies cleaning fluid L from the drain pipe 91a to the first drain tank 501a of the first cup-shaped member 50a when the valve 62a is closed. Furthermore, the first drain tank 501a is an example of a recovery unit.

[0125] Furthermore, the cleaning fluid L supplied by the cleaning fluid supply unit 80 is stored in the first drain tank 501a, and the water level gradually rises. The cleaning fluid L is further supplied by the cleaning fluid supply unit 80. If the water level of the cleaning fluid L reaches the upper surface 54a1 of the first peripheral wall portion 54a, then... Figure 4B As shown, the cleaning fluid L overflows from the first peripheral wall 54a to the second cup-shaped member 50b, passing over the upper surface 54a1 of the first peripheral wall 54a. Furthermore, the overflowing cleaning fluid L is stored in the second drain tank 501b of the second cup-shaped member 50b, and the water level gradually rises.

[0126] Therefore, the upper surface 54a1 and side surface of the first perimeter wall 54a are cleaned by the cleaning solution L, thereby removing foreign matter such as crystals adhering to the first perimeter wall 54a. In addition, ammonium sulfate crystals have relatively high water solubility, so they are removed while dissolving in the cleaning solution L.

[0127] Furthermore, as described above, a space is formed between the first peripheral wall portion 54a and the first liquid receiving portion 55a. Therefore, the cleaning fluid L flows between the first peripheral wall portion 54a and the first liquid receiving portion 55a while overflowing from the first peripheral wall portion 54a towards the second cup-shaped member 50b. Thus, in this embodiment, the cleaning fluid L supplied by the cleaning fluid supply unit 80 overflows from between the first peripheral wall portion 54a and the first liquid receiving portion 55a towards the second cup-shaped member 50b. As a result, foreign matter present between the first peripheral wall portion 54a and the first liquid receiving portion 55a can also be removed.

[0128] Furthermore, the first liquid receiving section 55a can be lowered to such a degree that, when the cleaning fluid L overflows from the first peripheral wall section 54a, the portion of the first liquid receiving section 55a opposite to the upper surface 54a1 of the first peripheral wall section 54a can be cleaned by the cleaning fluid L. That is, as... Figure 4B As shown, when, for example, the first liquid receiving section 55a is in the lowered, retracted position, the cleaning fluid L overflowing from the first peripheral wall section 54a is supplied to the lower surface 55a1 of the first liquid receiving section 55a, which is opposite to the upper surface 54a1 of the first peripheral wall section 54a. This allows the lower surface 55a1 of the first liquid receiving section 55a to be cleaned, removing any attached foreign matter.

[0129] Furthermore, the aforementioned "the extent to which the first liquid receiving part 55a descends to the point where it is opposite the upper surface 54a1 of the first peripheral wall part 54a can be cleaned by the cleaning liquid L" refers to the distance between the upper surface 54a1 of the first liquid receiving part 55a and the lower surface 55a1 of the first liquid receiving part 55a, which is the distance at which the cleaning liquid L touches the lower surface 55a1, but is not limited to this.

[0130] Furthermore, the upper surface 54a1 of the first peripheral wall portion 54a, the lower surface 55a1 of the first liquid receiving portion 55a, and the area between the first peripheral wall portion 54a and the first liquid receiving portion 55a are all locations where the mixture of SPM remaining in the first cup-shaped member 50a and SC1 remaining in the second cup-shaped member 50b is likely to adhere. In this embodiment, cleaning solution L is supplied to these areas where the mixture of SPM and SC1 may adhere and crystallize for cleaning.

[0131] In this embodiment, the areas of the first peripheral wall 54a to be cleaned by the cleaning fluid supply unit 80 include areas where the mixture of SPM (first processing fluid) and SC1 (second processing fluid) is adhered. Therefore, areas in the first peripheral wall 54a where foreign matter such as crystals easily adheres can be cleaned, and foreign matter can be effectively removed.

[0132] In addition, the aforementioned foreign matter such as crystals sometimes adheres to parts other than the first peripheral wall portion 54a, such as the first support member 56a. Therefore, the cleaning fluid supply unit 80 of this embodiment also supplies cleaning fluid L to the first support member 56a for cleaning.

[0133] In detail, in this embodiment, the through hole 59a has an opening 59a1 formed on the upper surface 54a1 of the first peripheral wall portion 54a, as described above. Therefore, as... Figure 4B As shown, the cleaning fluid L flowing from the upper surface 54a1 of the first peripheral wall 54a and overflowing into the second cup-shaped member 50b flows from the upper surface 54a1 through the opening 59a1 into the through hole 59a and accumulates inside the through hole 59a. This allows for cleaning of the outer periphery of the first support member 56a and the through hole 59a, removing foreign matter adhering to the outer periphery of the first support member 56a and the through hole 59a.

[0134] Furthermore, the above description uses the example of cleaning the first liquid receiving section 55a after it has been lowered as an example, but it is not limited to this. Cleaning can also be performed after the first liquid receiving section 55a has been raised.

[0135] Alternatively, the control device 4 can also control the first lifting drive unit 56b to raise and lower the first support member 56a, and perform cleaning while moving the first liquid receiving unit 55a up and down. As a result, the first support member 56a moves within the through hole 59a filled with cleaning fluid L, thus efficiently removing foreign matter adhering to the outer periphery of the first support member 56a.

[0136] If cleaning fluid L is further supplied from the cleaning fluid supply unit 80, the water level of the cleaning fluid L in the second drain tank 501b reaches the upper surface 54b1 of the second peripheral wall portion 54b. Furthermore, the second drain tank 501b is an example of a second recovery unit.

[0137] Therefore, as Figure 4C As shown, the cleaning fluid L overflows from the second peripheral wall 54b to the third cup-shaped member 50c, passing over the upper surface 54b1 of the second peripheral wall 54b. Furthermore, the overflowing cleaning fluid L is stored in the third drain tank 501c of the third cup-shaped member 50c.

[0138] Thus, in this embodiment, the cleaning fluid L overflowing from the first liquid receiving section 55a to the second cup-shaped member 50b side is recovered by the second drain tank 501b of the second cup-shaped member 50b. Furthermore, a portion of the recovered cleaning fluid L overflows from the second peripheral wall section 54b to the third cup-shaped member 50c side.

[0139] As a result, the upper surface 54b1 and side surface of the second peripheral wall portion 54b are cleaned by the cleaning fluid L, thereby removing foreign matter adhering to the second peripheral wall portion 54b. Furthermore, the cleaning fluid L flows between the second peripheral wall portion 54b and the second liquid receiving portion 55b in the same manner as the first peripheral wall portion 54a, thus also removing foreign matter present between the second peripheral wall portion 54b and the second liquid receiving portion 55b.

[0140] Furthermore, the second liquid receiving section 55b can be lowered to such a degree that, when the cleaning fluid L overflows from the second peripheral wall section 54b, the portion of the second liquid receiving section 55b opposite to the upper surface 54b1 of the second peripheral wall section 54b (lower surface 55b1) can be cleaned by the cleaning fluid L. That is, as... Figure 4C As shown, when, for example, the second liquid receiving section 55b is in the lowered, retracted position, the cleaning fluid L overflowing from the second peripheral wall section 54b is supplied to the lower surface 55b1 of the second liquid receiving section 55b. This also allows the removal of foreign matter adhering to the lower surface 55b1 of the second liquid receiving section 55b.

[0141] In addition, such as Figure 4CAs shown, the cleaning fluid L flowing from the upper surface 54b1 of the second peripheral wall 54b and overflowing into the third cup-shaped member 50c flows from the upper surface 54b1 through the opening 59b1 into the through hole 59b and accumulates inside the through hole 59b. This allows for cleaning of the outer periphery of the second support member 57a and the through hole 59b, removing foreign matter adhering to the outer periphery of the second support member 57a and the through hole 59b.

[0142] Furthermore, the second liquid receiving unit 55b, like the first liquid receiving unit 55a, can be cleaned in the raised state, or it can be cleaned while moving up and down.

[0143] Furthermore, the processing unit 16 of this embodiment, by being configured as described above, can prevent the cleaning solution L containing SCI and IPA after cleaning from flowing into the acid-based treatment solution supply source 70b, which serves as the supply source of SPM.

[0144] In detail, the cleaning fluid supply unit 80 supplies cleaning fluid L to the first drain tank 501a of the first cup-shaped member 50a connected to the drain pipe 91a, which functions as a circulation line for the SPM. Furthermore, the cleaning fluid L supplied to the first cup-shaped member 50a overflows sequentially into the second cup-shaped member 50b and the third cup-shaped member 50c, which are connected to the drain pipes 91b and 91c, which also function as drainage lines.

[0145] Therefore, the cleaning fluid L containing SC1 that has accumulated in, for example, the second drain tank 501b, flows from the second cup-shaped member 50b to the third cup-shaped member 50c, but does not flow into the first cup-shaped member 50a. Similarly, the cleaning fluid L containing IPA that has accumulated in the third drain tank 501c remains in the third cup-shaped member 50c and does not flow from the third cup-shaped member 50c into the second cup-shaped member 50b or the first cup-shaped member 50a.

[0146] This prevents the cleaning solution L containing SCl and IPA from flowing into the acid-based processing solution supply source 70b, which serves as the source of SPM. Thus, it prevents SCl and IPA from mixing into the acid-based processing solution supply source 70b, allowing the recovered SPM to be reused and supplied to the wafer W again.

[0147] Furthermore, as described above, the upper surface 54b1 of the second peripheral wall portion 54b is located below the upper surface 54a1 of the first peripheral wall portion 54a in the vertical direction. Therefore, the cleaning fluid L accumulated in the second drain tank 501b of the second cup-shaped member 50b can reliably overflow towards the third cup-shaped member 50c, preventing it from flowing into the first cup-shaped member 50a. This further prevents the cleaning fluid L containing SC1 or the like from flowing into the acid-based treatment fluid supply source 70b, which serves as the supply source for the SPM.

[0148] <4. Specific Operations of the Substrate Processing System>

[0149] Next, refer to Figure 5 The substrate processing performed by the substrate processing system 1 of this embodiment will be described.

[0150] Figure 5 This is a flowchart illustrating the processing sequence performed by the substrate processing system 1 in this embodiment. Furthermore, Figure 5 The processing sequences shown can be executed under the control of the control unit 18 of the control device 4.

[0151] like Figure 5 As shown, in processing unit 16, firstly, input processing of wafer W is performed (step S1). In this input processing, the substrate transport device 17 ( Figure 1 (Refer to) After the wafer W is placed on the holding part 31, the wafer W is held by the holding part 31.

[0152] Next, in processing unit 16, the first chemical solution treatment (step S2) is performed. In the first chemical solution treatment, control unit 18 first rotates holding unit 31 by driving unit 33, thereby rotating wafer W. Next, control unit 18 opens valve 60a for a predetermined time, supplying SC1 from nozzle 41 to the surface of wafer W. Thus, the surface of wafer W is treated by SC1.

[0153] Next, in processing unit 16, a first rinsing process (step S3) is performed. In this first rinsing process, control unit 18 opens valve 60d for a predetermined time, supplying DIW from nozzle 41 to wafer W. As a result, SC1 remaining on wafer W is rinsed away by DIW.

[0154] Next, in processing unit 16, a second chemical solution treatment is performed (step S4). In this second chemical solution treatment, control unit 18 opens valve 60b for a predetermined time, supplying SPM from nozzle 41 to the surface of wafer W. Thus, the surface of wafer W is treated with SPM.

[0155] Next, in processing unit 16, a second rinsing process (step S5) is performed. In the second rinsing process, control unit 18 opens valve 60d for a predetermined time, supplying DIW from nozzle 41 to the surface of wafer W. As a result, SPM remaining on wafer W is rinsed away by DIW.

[0156] Next, a drying process is performed in processing unit 16 (step S6). In this drying process, control unit 18 opens valve 60c for a predetermined time, supplying IPA from nozzle 41 to the surface of wafer W. As a result, DIW remaining on the surface of wafer W is replaced with IPA, which has a higher volatility than DIW. Afterward, the IPA on wafer W is shaken off, thereby drying wafer W.

[0157] Next, in the processing unit 16, output processing (step S7) is performed. In this output processing, after the control unit 18 stops the rotation of the wafer W performed by the drive unit 33, the wafer W is transported by the substrate transport device 17 (see reference). Figure 1 Output from processing unit 16. If the output processing is complete, the processing of a series of substrates for one wafer W is complete.

[0158] Next, in processing unit 16, a cleaning process is performed to clean the first peripheral wall portion 54a, etc. (step S8). Furthermore, this cleaning process does not need to be performed every time a wafer W is output. That is, the timing of the cleaning process can be arbitrarily set; for example, it can be performed once after substrate processing of multiple wafers W. Alternatively, the substrate holding mechanism 30, which will be discussed later, can also be cleaned during the processing in step S8.

[0159] Reference Figure 6 The cleaning process for the wall portion 54a, etc., in the first week is explained. Figure 6 This is a flowchart illustrating an example of the processing sequence of the cleaning process performed in the first cycle wall portion 54a, etc., in the substrate processing system 1.

[0160] like Figure 6 As shown, the control unit 18 of the control device 4 closes valves 62a, 62b, and 62c (step S10). Next, the control unit 18 opens valve 82a of the cleaning fluid supply unit 80, supplying cleaning fluid L to the first drain tank 501a of the first cup-shaped member 50a (step S11). As a result, cleaning fluid L accumulates in the first drain tank 501a of the first cup-shaped member 50a, and the cleaning fluid L accumulated in the first drain tank 501a overflows into the second cup-shaped member 50b and the third cup-shaped member 50c over time, thus cleaning the first peripheral wall portion 54a, the second peripheral wall portion 54b, etc.

[0161] Next, the control unit 18 drives the first support member 56a and the second support member 57a using the first lifting drive unit 56b and the second lifting drive unit 57b, causing the first liquid receiving part 55a and the second liquid receiving part 55b to rise and fall (step S12). In this way, by raising and lowering the first liquid receiving part 55a and the second liquid receiving part 55b, the first support member 56a and the second support member 57a move within the through holes 59a and 59b filled with cleaning fluid L, and can be cleaned efficiently.

[0162] Furthermore, the aforementioned step S12 may not be necessary, and the cleaning of the first peripheral wall portion 54a, etc., can be performed directly without performing step S12, in the state after the first liquid receiving portion 55a and the second liquid receiving portion 55b have descended or risen.

[0163] Next, if the cleaning of the first wall section 54a and the like is completed after a predetermined time, the control unit 18 closes the valve 82a of the cleaning fluid supply unit 80, thereby stopping the supply of cleaning fluid L to the first drain tank 501a (step S13).

[0164] Next, the control unit 18 opens valves 62a, 62b, and 62c (step S14). In addition, in step S14, valve 62a is opened in such a way that the discharge path is opened to the second discharge pipe 91a2.

[0165] Thus, the cleaning fluid L from the first drain tank 501a is discharged to the outside of the processing unit 16 via drain pipe 91a, valve 62a, and the second drain pipe 91a2. Similarly, the cleaning fluid L from the second drain tank 501b and the through hole 59a flows to valve 62b via drain pipe 91b and drain pipe 92a, and is discharged to the outside of the processing unit 16. Likewise, the cleaning fluid L from the third drain tank 501c and the through hole 59b flows to valve 62c via drain pipe 91c and drain pipe 92b, and is discharged to the outside of the processing unit 16. In this way, the cleaning process of the first peripheral wall portion 54a, etc., is completed.

[0166] Furthermore, in the above description, after closing valves 62a, 62b, and 62c in step S10, the supply of cleaning fluid L begins in step S11, but this is not a limitation. That is, steps S10 and S11 can be performed simultaneously, or step S10 can be performed after step S11.

[0167] In addition, after stopping the supply of cleaning fluid L in step S13, valves 62a, 62b, and 62c are opened in step S14. However, this is not a limitation. Steps S13 and S14 can be performed simultaneously or in the order of steps S14 and S13.

[0168] In addition, while the above describes the cleaning process by closing valve 62c, it is not limited to this. For example, valve 62c can be opened to sequentially discharge the cleaning fluid L that has flowed into the third cup-shaped member 50c and the through hole 59b while performing the cleaning process.

[0169] Furthermore, the supply amount of cleaning fluid L from the cleaning fluid supply unit 80 to the first drain tank 501a can be set to be greater than the discharge amount of cleaning fluid L from the drain pipes 91a, 91b, and 91c. If the supply amount of cleaning fluid L is set in this way, even when the valves 62a, 62b, and 62c are kept open, the cleaning fluid L can overflow from the first cup-shaped member 50a to the second cup-shaped member 50b and the third cup-shaped member 50c to clean the first peripheral wall portion 54a, etc.

[0170] As described above, the processing unit 16 of the first embodiment (equivalent to an example of a "substrate processing apparatus") includes a holding section 31, a processing fluid supply section 40 (equivalent to an example of a "processing liquid supply section"), a first cup-shaped member 50a, a second cup-shaped member 50b, and a cleaning liquid supply section 80. The holding section 31 is used to hold the wafer W. The processing fluid supply section 40 is used to supply SPM (first processing liquid) and SC1 (second processing liquid) to the wafer W.

[0171] The first cup-shaped member 50a has a first peripheral wall portion 54a, and collects SPM in a first drain tank 501a formed by the first peripheral wall portion 54a. The second cup-shaped member 50b is disposed adjacent to the first cup-shaped member 50a and is used to collect SC1. A cleaning fluid supply unit 80 supplies cleaning fluid L to the first drain tank 501a of the first cup-shaped member 50a. In the processing unit 16, the first peripheral wall portion 54a is cleaned by causing the cleaning fluid L supplied by the cleaning fluid supply unit 80 to overflow from the first peripheral wall portion 54a towards the second cup-shaped member 50b. This removes foreign matter adhering to the first peripheral wall portion 54a of the first cup-shaped member 50a.

[0172] Furthermore, when valve 62a is closed, the cleaning fluid supply unit 80 supplies cleaning fluid L from drain pipe 91a to the first drain tank 501a of the first cup-shaped member 50a. Thus, cleaning fluid L can be supplied to the first drain tank 501a of the first cup-shaped member 50a with a simple structure, for example, connecting drain pipe 91a to cleaning fluid supply pipe 81a.

[0173] Furthermore, while the above describes supplying cleaning fluid L from drain pipe 91a to first drain tank 501a, this is not a limitation. That is, though the diagram is omitted, a nozzle could be positioned facing the first drain tank 501a, from which cleaning fluid L could be directly supplied to the first drain tank 501a.

[0174] <5. Variations>

[0175] Next, the first to third modifications of the processing unit 16 of the first embodiment will be described. In the processing unit 16 of the first to third modifications, the supply path of the cleaning fluid L up to the first drain tank 501a was changed.

[0176] Figure 7 This is a schematic cross-sectional view showing the configuration examples of the processing unit 16 in the first to third modifications. Furthermore, in the first to third modifications, the cleaning fluid supply pipe 81a, valve 82a, etc., of the first embodiment are removed.

[0177] like Figure 7 As shown, in the first modified example, the substrate cleaning solution used to clean the wafer W is supplied to the first drain tank 501a of the first cup-shaped member 50a as the cleaning solution L used to clean the first peripheral wall portion 54a.

[0178] Specifically, in the first modification, the cleaning fluid supply unit 80 is configured to include a nozzle 41 for spraying cleaning fluid for the substrate. Furthermore, the nozzle 41 is an example of a substrate nozzle. During the cleaning process, the control unit 18 of the control device 4 raises the first cup-shaped member 50a and the second cup-shaped member 50b, placing the first liquid receiving unit 55a in a processing position, thereby forming a flow path from the opening inside the upper end of the first liquid receiving unit 55a to the first drain tank 501a.

[0179] Furthermore, the control unit 18 opens valve 60d, supplying substrate cleaning fluid (DIW) from DIW supply source 70d from nozzle 41 to holding unit 31. At this time, the control unit 18 pre-emptively uses drive unit 33 (see reference 33) Figure 3 This causes the retaining part 31 to rotate.

[0180] Therefore, as Figure 7 As indicated by the dashed arrow, the substrate cleaning fluid supplied from the nozzle 41 to the holding part 31 is thrown outwards from the outer periphery of the holding part 31 due to the centrifugal force generated by the rotation of the holding part 31. The first liquid receiving part 55a receives the substrate cleaning fluid that has been thrown outwards from the holding part 31. The substrate cleaning fluid received by the first liquid receiving part 55a flows downwards into the first drain tank 501a, and the flowing substrate cleaning fluid is used as cleaning fluid L to clean the first peripheral wall part 54a.

[0181] Thus, in the first modification, the processing fluid supply unit 40 functions as a cleaning fluid supply unit 80, and the nozzle 41 of the cleaning fluid supply unit 80 supplies the substrate cleaning fluid as cleaning fluid L for cleaning the first peripheral wall portion 54a to the first drain tank 501a. Therefore, in the first modification, the cleaning fluid L can be supplied to the first drain tank 501a of the first cup-shaped member 50a using existing DIW supply source 70d, nozzle 41, etc.

[0182] Next, the second and third modifications will be described. In the second and third modifications, the cleaning liquid used to clean the substrate holding mechanism 30, including the holding part 31, is supplied to the first drain tank 501a of the first cup-shaped member 50a as the cleaning liquid L used to clean the first peripheral wall part 54a.

[0183] Specifically, in the processing unit 16 of the second and third modifications, the cleaning liquid supply unit 80 supplies cleaning liquid for the holding mechanism to the substrate holding mechanism 30 and the like during each processing time when, for example, the substrate processing described above is not performed, to clean the substrate holding mechanism 30 and the like.

[0184] In detail, the cleaning fluid supply unit 80 includes nozzles 84 and 85, cleaning fluid supply pipes 81b and 81c, and valves 82b and 82c. Nozzle 84 is positioned facing the support portion 32. Nozzle 84 is connected to the cleaning fluid supply source 83 via cleaning fluid supply pipe 81b and valve 82b.

[0185] Nozzle 85 is a nozzle used for cleaning the back side of the holding part 31, and is disposed, for example, near the upper end of the inner wall part 54d. In addition, nozzle 85 includes a first nozzle 85a to a third nozzle 85c.

[0186] The first nozzle 85a is positioned near the center of the back surface facing, for example, the retaining portion 31. The second nozzle 85b is positioned on the outer periphery of the back surface facing the retaining portion 31, beyond the center. The third nozzle 85c is positioned near the periphery of the back surface facing the retaining portion 31. In other words, the back surface of the retaining portion 31 is divided into three regions from the center towards the periphery, and the first to third nozzles 85a face each region.

[0187] Additionally, nozzles 85a to 85c are connected to a cleaning fluid supply source 83 via a cleaning fluid supply pipe 81c and a valve 82c. Furthermore, in Figure 3In the example shown, nozzles 85a to 85c are connected to a cleaning fluid supply pipe 81c that branches off midway, but this is not a limitation; nozzles 85a to 85c may also be connected to independent cleaning fluid supply pipes. Furthermore, in the above description, nozzle 85 is configured to include three nozzles 85a to 85c, but the number of nozzles is not limited to this. Additionally, nozzles 84 and 85 described above are an example of a nozzle for a holding mechanism used to spray cleaning fluid for the holding mechanism.

[0188] Furthermore, when cleaning the support column 32, the control device 4 opens valve 82b to supply cleaning fluid for the holding mechanism to the support column 32 and the like through nozzle 84. Additionally, when cleaning the back side of the holding section 31, the control device 4 opens valve 82c to supply cleaning fluid for the holding mechanism to the back side of the holding section 31 through nozzle 85.

[0189] Furthermore, the cleaning fluid for the holding mechanism after cleaning the substrate holding mechanism 30 falls into a central drain trough 501d formed near the center of the inner circumference side of the inner wall portion 54d, and is discharged from the central drain trough 501d via drain ports 51d and 51e formed at the bottom 53 of the recovery cup-shaped member 50. Specifically, the drain port 51d has an opening located at a position on the bottom 53 closer to the inner circumference side than the inner wall portion 54d, allowing the cleaning fluid for the holding mechanism flowing down into the central drain trough 501d to flow in.

[0190] Furthermore, the opening of the drain port 51e is located near the base end of the extension portion 54d1 of the inner wall portion 54d, allowing the cleaning fluid for the retaining mechanism flowing from the extension portion 54d1 to flow in. The drain port 51d is connected to the drain pipe 91d, while the drain port 51e is connected to the drain pipe 91e. These drain pipes 91d and 91e are connected to the drain pipe 91a at a position upstream of the drain valve 62a in the direction of fluid flow.

[0191] During the cleaning process of the substrate holding mechanism 30, the control device 4 controls the valve 62a in advance to open the discharge path to the second drain pipe 91a2. As a result, the cleaning liquid of the holding mechanism after cleaning the substrate holding mechanism 30 flows from the drain port 51d through the drain pipe 91d to the drain pipe 91a, or from the drain port 51e through the drain pipe 91e to the drain pipe 91a, and then is discharged to the outside of the processing unit 16 through the valve 62a and the second drain pipe 91a2.

[0192] This prevents the cleaning fluid for the holding mechanism from flowing into the acid treatment fluid supply source 70b. Furthermore, by partially sharing the discharge path between the acid treatment fluid and the cleaning fluid for the holding mechanism, the processing unit 16 can be miniaturized.

[0193] In the second and third modifications, the first peripheral wall portion 54a and the like are cleaned in the processing unit 16 configured as described above. Specifically, in the second modification, the control unit 18 opens the valve 82b to supply cleaning fluid (DIW) for the holding mechanism from the nozzle 84 to the support portion 32 and the like.

[0194] Therefore, as Figure 7 As indicated by the double-dotted arrow, the cleaning fluid supplied to the support section 32, etc., for the retaining mechanism falls into the central drain tank 501d and flows out from the drain port 51d to the drain pipe 91d. Furthermore, during the cleaning process of the first peripheral wall section 54a, etc., valve 62a is closed as described above. Therefore, the cleaning fluid for the retaining mechanism flowing from the central drain tank 501d to the drain pipe 91d flows through the drain pipe 91a from the drain port 51a into the first drain tank 501a, and the flowing cleaning fluid for the retaining mechanism is used as the cleaning fluid L for cleaning the first peripheral wall section 54a.

[0195] Thus, in the second modification, the nozzle 84 that cleans the support column 32, etc., supplies the cleaning fluid used by the holding mechanism as the cleaning fluid L for cleaning the first peripheral wall 54a to the first drain tank 501a of the first cup-shaped member 50a. Therefore, the structure for cleaning the support column 32 and the structure for cleaning the first peripheral wall 54a, etc., can be shared, thereby enabling miniaturization and cost reduction of the processing unit 16.

[0196] Next, the operation of the processing unit 16 in the third modification will be explained. In the third modification, the control unit 18 raises the first cup-shaped member 50a and the second cup-shaped member 50b, placing the first liquid receiving part 55a in the processing position, thereby forming a flow path from the opening inside the upper end of the first liquid receiving part 55a to the first drain tank 501a.

[0197] Furthermore, the control unit 18 opens the valve 82c, supplying cleaning fluid (DIW) from the cleaning fluid supply source 83 to the back of the retaining part 31 from the nozzle 85. At this time, the control unit 18 pre-rotates the retaining part 31 using the drive unit 33.

[0198] Therefore, as Figure 7 As indicated by the dashed arrow, the cleaning fluid for the retaining mechanism supplied to the back of the retaining part 31 falls into the central drain tank 501d and flows out from the drain port 51d to the drain pipe 91d. Additionally, the cleaning fluid for the retaining mechanism supplied to the back of the retaining part 31 also falls into the extension section 54d1 and flows out from the extension section 54d1 through the drain port 51e to the drain pipe 91e. Furthermore, because valve 62a is closed, all the cleaning fluid for the retaining mechanism flowing out of the drain pipes 91d and 91e flows into the first drain tank 501a through the drain pipe 91a from the drain port 51a.

[0199] Furthermore, the cleaning fluid for the holding mechanism supplied to the back of the holding part 31 is thrown outwards towards the outer periphery of the holding part 31 due to the centrifugal force generated by the rotation of the holding part 31, and the first liquid receiving part 55a receives the cleaning fluid for the holding mechanism that is thrown outwards from the back of the holding part 31. The cleaning fluid for the holding mechanism received by the first liquid receiving part 55a flows downwards into the first drain tank 501a. The cleaning fluid for the holding mechanism that flows into the first drain tank 501a as described above is used as cleaning fluid L to clean the first peripheral wall part 54a.

[0200] Thus, in the third modification, the nozzle 85 for cleaning the back side of the holding part 31 supplies the cleaning fluid for the holding mechanism, which is also the cleaning fluid L for cleaning the first peripheral wall part 54a, to the first drain tank 501a of the first cup-shaped member 50a. Therefore, the structure for cleaning the back side of the holding part 31 and the structure for cleaning the first peripheral wall part 54a, etc., can be shared, thereby enabling miniaturization and cost reduction of the processing unit 16.

[0201] Furthermore, the supply path of the cleaning fluid L up to the first drain tank 501a in the first embodiment and the first to third modifications described above can also be appropriately combined. That is, for example, the first embodiment and the first modification can be combined to supply the cleaning fluid L to the first drain tank 501a from both the cleaning fluid supply pipe 81a and the nozzle 41.

[0202] In addition, in the above-described embodiments and variations, drain pipes 92a and 92b are provided to discharge the cleaning fluid L that enters the through hole 59a of the first peripheral wall portion 54a and the through hole 59b of the second peripheral wall portion 54b, but the embodiments are not limited thereto.

[0203] For example, drain pipes 92a and 92b can be omitted, allowing the cleaning fluid L entering through holes 59a in the first peripheral wall portion 54a and 59b in the second peripheral wall portion 54b to leak out from the lower part of the bottom 53, with the bottom of the chamber 20 receiving the cleaning fluid L. In this case, such as Figure 7 As shown in the diagram, a common drain pipe 201 is provided at the bottom of the chamber 20 to discharge the cleaning fluid L received from the through holes 59a of the first peripheral wall portion 54a and 59b of the second peripheral wall portion 54b. By adopting this structure, compared with the case where drain pipes 92a and 92b are provided, the device can be simplified and made at a low cost.

[0204] (Second Implementation)

[0205] Next, the substrate processing system 1 of the second embodiment will be described. Furthermore, in the following description, the same reference numerals are used for the same parts as those already described, and repeated descriptions are omitted.

[0206] In the second embodiment, the structure is designed such that the temperature of the cleaning fluid L is increased by heating it, thereby further removing foreign matter adhering to the first peripheral wall portion 54a, etc. Figure 8 This is a schematic diagram showing the general configuration of the cleaning fluid supply unit 80, etc., in the second embodiment.

[0207] like Figure 8 As shown, SPM is stored in tank 110. This SPM is a relatively high-temperature mixture due to the heat of reaction from the chemical reaction when sulfuric acid and hydrogen peroxide are mixed.

[0208] In the second embodiment, a heat exchange unit 200 for exchanging heat between the SPM (mixture solution) and the cleaning fluid L is provided in the tank 110. The heat exchange unit 200 is configured to be provided inside the tank 100, and the cleaning fluid supply pipe 81a passes through it.

[0209] Therefore, in the heat exchange section 200, the cleaning fluid L in the cleaning fluid supply pipe 81a is heated by the relatively high temperature SPM. Compared with the cleaning fluid before heating, the ammonium sulfate crystals in the heated cleaning fluid L become easier to dissolve. Therefore, by using the heated cleaning fluid L for cleaning treatment, foreign matter such as crystals adhering to the first peripheral wall 54a can be further removed.

[0210] Furthermore, while a heat exchange unit 200 is provided in tank 110 as described above, this is not a limitation. That is, though not shown in the diagram, the structure could also be as follows: for example, a refrigerant pipe carrying a cooling medium such as water is disposed inside tank 110, and this refrigerant pipe and the cleaning fluid supply pipe 81a are connected to a heat exchange unit located outside tank 110. Even with the above structure, heat exchange can occur between the SPM and the cleaning fluid L, heating the cleaning fluid L to raise its temperature.

[0211] In addition, in the second embodiment, the cleaning fluid L flowing in the cleaning fluid supply pipe 81a is heated, but it is not limited to this. In, for example, in the first to third modifications, the cleaning fluid for the substrate and the cleaning fluid for the holding mechanism used as the cleaning fluid L may also be heated.

[0212] Furthermore, in the above-described embodiments, the cleaning fluid L overflows from the first drain trough 501a of the first cup-shaped member 50a to the second cup-shaped member 50b and the third cup-shaped member 50c, but is not limited to this.

[0213] That is, the cleaning fluid L can overflow from the second drain tank 501b of the second cup-shaped member 50b to the first cup-shaped member 50a and the third cup-shaped member 50c, or the cleaning fluid L can overflow from the third drain tank 501c of the third cup-shaped member 50c to the second cup-shaped member 50b and the first cup-shaped member 50a. Alternatively, the structure can be such that the cleaning fluid L overflows from the first drain tank 501a of the first cup-shaped member 50a to the second cup-shaped member 50b, while the valve 62b is opened, etc., so that the cleaning fluid L does not overflow to the third cup-shaped member 50c.

[0214] Furthermore, in the aforementioned processing unit 16, the acid-based treatment liquid is recycled and reused via the first drain pipe 91a1, but this is not a limitation; the structure may also not reuse the acid-based treatment liquid. Additionally, in the above description, the first lifting drive unit 56b and the second lifting drive unit 57b are designed to be independent, but this is not a limitation; for example, the first lifting drive unit 56b and the second lifting drive unit 57b may be shared.

[0215] Further effects and variations can be readily derived by those skilled in the art. Therefore, the broader scope of the present invention is not limited to the specific, detailed, and representative embodiments described above. Consequently, various modifications can be made without departing from the spirit or scope of the general concept of the invention as defined by the claims and their equivalents.

Claims

1. A substrate processing apparatus, characterized in that, The substrate processing apparatus includes: A holding section, which is used to hold the substrate; A processing liquid supply unit is used to supply a first processing liquid and a second processing liquid to the substrate; The first cup-shaped member has a peripheral wall portion for recovering the first treatment liquid into a recovery portion formed by the peripheral wall portion; The second cup-shaped member, which is disposed adjacent to the first cup-shaped member, is used to recover the second treatment liquid; A cleaning fluid supply unit is used to supply cleaning fluid to the recovery unit of the first cup-shaped member via a drain port, the drain port being formed at the bottom of the recovery unit of the first cup-shaped member; A drain pipe, which is connected to the recovery unit, is used to discharge the first processed liquid recovered into the recovery unit; A valve is used to control the discharge of the first treatment liquid from the drain pipe. The peripheral wall portion is cleaned by allowing the cleaning fluid supplied by the cleaning fluid supply unit to overflow from the peripheral wall portion towards the second cup-shaped member side. The cleaning fluid supply unit is connected to the drain pipe at a position upstream of the valve in the flow direction. When the valve is closed, the cleaning fluid is supplied from the drain pipe to the recovery unit of the first cup-shaped member.

2. A substrate processing apparatus, characterized in that, The substrate processing apparatus includes: A holding section, which is used to hold the substrate; A processing liquid supply unit is used to supply a first processing liquid and a second processing liquid to the substrate; The first cup-shaped member has a peripheral wall portion for recovering the first treatment liquid into a recovery portion formed by the peripheral wall portion; The second cup-shaped member, which is disposed adjacent to the first cup-shaped member, is used to recover the second treatment liquid; A cleaning fluid supply unit is used to supply cleaning fluid to the recovery unit of the first cup-shaped member. The peripheral wall portion is cleaned by allowing the cleaning fluid supplied by the cleaning fluid supply unit to overflow from the peripheral wall portion towards the second cup-shaped member side. The cleaning fluid supply unit includes a substrate nozzle that sprays a substrate cleaning fluid for cleaning the substrate. The substrate nozzle supplies substrate cleaning fluid to the recovery section of the first cup-shaped member as a cleaning fluid for cleaning the peripheral wall portion.

3. A substrate processing apparatus, characterized in that, The substrate processing apparatus includes: A holding section, which is used to hold the substrate; A processing liquid supply unit is used to supply a first processing liquid and a second processing liquid to the substrate; The first cup-shaped member has a peripheral wall portion for recovering the first treatment liquid into a recovery portion formed by the peripheral wall portion; The second cup-shaped member, which is disposed adjacent to the first cup-shaped member, is used to recover the second treatment liquid; A cleaning fluid supply unit is used to supply cleaning fluid to the recovery unit of the first cup-shaped member. The peripheral wall portion is cleaned by allowing the cleaning fluid supplied by the cleaning fluid supply unit to overflow from the peripheral wall portion towards the second cup-shaped member side. The cleaning fluid supply unit includes a nozzle for the retaining mechanism that sprays cleaning fluid for cleaning the retaining mechanism, including the retaining unit. The nozzle of the retaining mechanism supplies the retaining mechanism cleaning fluid, which is used to clean the peripheral wall portion, to the recovery section of the first cup-shaped member.

4. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that, The first cup-shaped member has a liquid receiving portion disposed above the peripheral wall portion, which surrounds the substrate held by the holding portion, for receiving the first processing liquid that spills from the substrate. The cleaning fluid supplied by the cleaning fluid supply unit overflows from between the peripheral wall and the liquid receiving unit toward the second cup-shaped member.

5. The substrate processing apparatus according to claim 4, characterized in that, The liquid receiving part can move up and down relative to the peripheral wall part. The liquid receiving section is lowered to such a degree that the portion of the liquid receiving section opposite the upper surface of the peripheral wall can be cleaned by the cleaning liquid when the cleaning liquid overflows from the peripheral wall.

6. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that, The first cup-shaped member is connected to a circulation pipeline that recirculates the recovered first processing liquid to supply it back to the substrate. The second cup-shaped component is connected to a circulation pipeline that discharges the recovered second treatment liquid to the outside of the device.

7. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that, The substrate processing apparatus has a third cup-shaped member, which is disposed adjacent to the second cup-shaped member on the opposite side of the first cup-shaped member, for recovering the third processing liquid supplied from the processing liquid supply unit. The second cup-shaped member has: a second peripheral wall portion and a second recovery portion formed by the second peripheral wall portion and the peripheral wall portion. The cleaning fluid overflowing from the peripheral wall to the second cup-shaped member is recovered by the second recovery section of the second cup-shaped member. The second peripheral wall is cleaned by allowing a portion of the recovered cleaning fluid to overflow from the second peripheral wall to the third cup-shaped member side.

8. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that, The first treatment solution comprises a mixture of sulfuric acid and hydrogen peroxide water. The substrate processing apparatus also includes a heat exchange unit for exchanging heat between the mixture and the cleaning solution.

9. A cleaning method for a substrate processing apparatus, the substrate processing apparatus comprising: A holding section for holding the substrate; The substrate processing apparatus includes a processing liquid supply unit for supplying a first processing liquid and a second processing liquid to the substrate; a first cup-shaped member having a peripheral wall for recovering the first processing liquid in a recovery section formed by the peripheral wall; a second cup-shaped member disposed adjacent to the first cup-shaped member for recovering the second processing liquid; a cleaning liquid supply unit for supplying cleaning liquid to the recovery section of the first cup-shaped member via a drain port formed at the bottom of the recovery section of the first cup-shaped member; a drain pipe connected to the recovery section for discharging the first processing liquid recovered in the recovery section; and a valve for controlling the discharge of the first processing liquid from the drain pipe. The cleaning liquid supply unit is connected to the drain pipe at a position upstream of the valve in the flow direction. When the valve is closed, cleaning liquid is supplied from the drain pipe to the recovery section of the first cup-shaped member. The cleaning method of this substrate processing apparatus is characterized by... The cleaning method of the substrate processing apparatus includes the following steps: The peripheral wall is cleaned by supplying cleaning fluid to the recovery section of the first cup-shaped member, causing the supplied cleaning fluid to overflow from the peripheral wall to the second cup-shaped member.

10. The cleaning method of the substrate processing apparatus according to claim 9, characterized in that, The first cup-shaped member includes a liquid receiving portion disposed above the peripheral wall portion, which surrounds the substrate held by the holding portion, for receiving the first processing liquid that spills from the substrate. The supplied cleaning fluid overflows from between the peripheral wall and the liquid receiving part toward the second cup-shaped member.

11. The cleaning method of the substrate processing apparatus according to claim 10, characterized in that, The first cup-shaped component also includes: A support member for supporting the liquid receiving part and for raising and lowering the liquid receiving part relative to the peripheral wall portion; A through hole, formed within the peripheral wall portion, allows the supporting member to pass through. The cleaning fluid overflowing from the peripheral wall is directed into the through hole to clean the support member.

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