Display Devices

Abstract

The present invention relates to a display device, comprising: a substrate having a first island and a second island spaced apart from each other; a first pixel arranged on the first island; and a second pixel arranged on the second island, wherein the first pixel comprises a first base layer, a first transistor located on the first base layer, a first light-emitting element electrically connected to the first transistor, and a first encapsulation layer covering the first light-emitting element, and wherein the second pixel comprises a second base layer, a second transistor located on the second base layer, a second light-emitting element electrically connected to the second transistor, and a second encapsulation layer covering the second light-emitting element.

Description

[0001] This application is a divisional application of patent application with application number 201610134768.7 and title “Organic Light Emitting Diode Display” filed on March 10, 2016. Technical Field

[0002] One or more embodiments described herein relate to a display device. Background Art

[0003] Various flat panel displays have been developed. Examples include liquid crystal displays, plasma display panels, organic light emitting diode (OLED) displays, field effect displays, and electrophoretic displays. Each pixel of an OLED display has an organic emission layer located between two electrodes. Electrons injected from one electrode and holes injected from the other electrode combine in the organic emission layer to generate excitons. Light is emitted when the excitons change state.

[0004] OLED displays have self-luminous properties, which allow them to achieve improved performance and efficiency, such as low power consumption, high brightness and high response speed. In addition, because OLED displays do not require additional light sources (such as backlights), they can also be thinner and lighter than other displays.

[0005] Recently, bendable, foldable, retractable or extendable display devices have been developed. In the retractable display device, the light emitting device may be formed on a retractable substrate. When the retractable substrate is stretched, the light emitting device or the wire laminated on the upper portion of the retractable substrate may be damaged. Summary of the invention

[0006] According to one or more embodiments, an organic light emitting diode display includes: a retractable substrate; a plurality of pixel forming plates located on the substrate and separated from each other; and first pixels and second pixels on corresponding first pixel forming plates and second pixel forming plates adjacent in a first direction among the plurality of pixel forming plates, the first pixel forming plates and the second pixel forming plates being connected by a first bridge; and a cutout groove located in the first pixel forming plates and the second pixel forming plates and adjacent to an area connected to the first bridge.

[0007] The first bridge may be bent in a second direction intersecting the first direction. The first bridge may have a predetermined width. The first bridge may have a predetermined radius of curvature. The first bridge may be bent upward along the second direction.

[0008] The first pixel forming plate may include: a first main support plate; a first wing plate located on one lateral surface of the first main support plate, wherein one side end of the first wing plate is connected to the first bridge; a second wing plate located on another lateral surface of the first main support plate and adjacent to the one side end of the first wing plate; and a first cutout groove located between one side end of the second wing plate and the first bridge.

[0009] The second pixel forming plate may include: a second main support plate; a third wing plate located on a lateral surface of the second main support plate to face the first wing plate of the first pixel forming plate, and one side end of the third wing plate is connected to the first bridge; a fourth wing plate located on another lateral surface of the second main support plate and adjacent to the one side end of the third wing plate; and a second cutout groove located between one side end of the fourth wing plate and the first bridge.

[0010] The base layer may include: a third pixel forming plate adjacent to the first pixel forming plate in the second direction; a third pixel located on the third pixel forming plate; and a second bridge connecting the first pixel forming plate and the third pixel forming plate.

[0011] The third pixel forming plate may include: a third main support plate; a fifth wing plate located on a lateral surface of the third main support plate to face the second wing plate of the first pixel forming plate, one side end of the fifth wing plate being connected to the second bridge; and a sixth wing plate located on another lateral surface of the third main support plate and adjacent to the one side end of the fifth wing plate, wherein the second bridge is connected to the other side end of the second wing plate of the first pixel forming plate; and a third cutout groove located between one side end of the sixth wing plate and the second bridge.

[0012] The display may further include a plurality of first to third wires connected to the first pixel on the first pixel forming plate, and the first wire may pass through the upper side of the first bridge to be connected to the second pixel of the second pixel forming plate. The first wire may extend in the length direction of the first bridge and may be arranged outside a center line of the first bridge passing through the center of the first bridge.

[0013] The display may include a plurality of dummy wires located on the first bridge and arranged above or below the first wire to overlap a portion of the first wire, wherein the strain on the dummy wires is greater than the strain on the first wires. The dummy wires may extend in the length direction of the first bridge and may be arranged inside a centerline of the first bridge passing through the center of the first bridge. The length of the dummy wires may decrease from the inside of the first bridge toward the outside thereof.

[0014] The display may include a sensing thin film transistor located on a corresponding pixel forming plate and connected to at least one of the first to third wires to measure strain on at least one of the first to third wires. The first wire may include a plurality of gate lines. The second bridge may be bent in a first direction. The second bridge may have a predetermined width. The second bridge may have a predetermined radius of curvature.

[0015] The second wire and the third wire may be connected to the third pixel on the third pixel forming plate through the upper side of the second bridge. Based on the center line of the second bridge extending in the length direction of the second bridge and passing through the center of the second bridge, a portion of the second wire and the third wire having a strain within a first range may be arranged outside the center line, and another portion of the second wire and the third wire having a strain within a second range may be arranged inside the center line, the second range being greater than the first range. The second wire may include a plurality of data lines, and the third wire includes a plurality of drive voltage lines. The first bridge may be bent downward along the second direction.

[0016] The first pixel forming plate may include: a first main support plate; a first wing plate located on one lateral surface of the first main support plate; and a second wing plate located on another lateral surface of the first main support plate, wherein one side end of the second wing plate is connected to the first bridge, and wherein the first cutout groove is located between a side end of the first wing plate adjacent to the one side end of the second wing plate and the first bridge.

[0017] The second pixel forming plate may include: a second main support plate; a third wing plate formed on one lateral surface of the second main support plate to face the first wing plate of the first pixel forming plate; and a fourth wing plate formed on another lateral surface of the second main support plate, wherein one side end of the fourth wing plate is connected to the first bridge, and wherein the second cutout groove is located between a side end of the third wing plate adjacent to the one side end of the fourth wing plate and the first bridge.

[0018] The display may include a plurality of first pixels and a plurality of second pixels. Each of the first pixels and the second pixels may include at least one pixel circuit. Each of the first pixels and the second pixels may include a plurality of sub-pixels. Each of the pixel forming panels may have a substantially polygonal shape.

[0019] According to one or more other embodiments, an organic light emitting diode display includes: a retractable substrate; a plurality of pixel forming plates located on the substrate and separated from each other; first pixels and second pixels on corresponding first pixel forming plates and second pixel forming plates adjacent in a first direction among the plurality of pixel forming plates; and first to third wires connected to the first pixels located on the first pixel forming plate, wherein the first pixel forming plate and the second pixel forming plate are connected by a first bridge, and wherein the first wire passes through the upper side of the first bridge and is connected to the second pixel of the second pixel forming plate.

[0020] The first bridge may have a predetermined width and may be bent in a second direction intersecting the first direction. The first bridge may have a predetermined radius of curvature. The first wire may extend in a length direction of the first bridge and may be disposed outside a center line of the first bridge passing through a center of the first bridge.

[0021] The display may include a plurality of dummy conductive lines located on the first bridge and above or below the first conductive line to overlap a portion of the first conductive line, wherein the dummy conductive lines extend in a length direction of the first bridge and are disposed inside a center line of the first bridge passing through a center of the first bridge, and wherein strain on the dummy conductive lines is greater than strain on the first conductive line.

[0022] The base layer may include: a third pixel forming plate adjacent to the first pixel forming plate in a second direction intersecting the first direction; and a second bridge connecting the first pixel forming plate and the third pixel forming plate, wherein the second wire and the third wire pass through the upper side of the second bridge and are connected to the third pixel on the third pixel forming plate. The second bridge may have a predetermined width and bend in the first direction. The second bridge may have a predetermined radius of curvature.

[0023] Based on a center line of the second bridge extending in the length direction of the second bridge and passing through the center of the second bridge, a portion of the second wire and the third wire can have a strain within a first range and can be set outside the center line, and another portion of the second wire and the third wire can have a strain within a second range and can be set inside the center line, the second range being larger than the first range. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Features will become apparent to those skilled in the art by describing in detail exemplary embodiments with reference to the accompanying drawings, in which:

[0025] Figure 1 An embodiment of an OLED display is shown;

[0026] Figure 2 An embodiment of a pixel is shown;

[0027] Figure 3 A base layer according to a first embodiment is shown;

[0028] Figure 4 Show Figure 3 An enlarged view of area A in FIG.

[0029] Figure 5 An example of first to third conductive lines connected to a pixel is shown;

[0030] Figure 6 An example for extending a base layer is shown;

[0031] Figure 7 Show Figure 6 Example of strain in region B;

[0032] Figure 8 An example showing the variation of strain based on position;

[0033] Fig. 9 An example of a pixel circuit is shown;

[0034] Fig.10 An example of a pixel layout is shown;

[0035] Fig.11 Shown along Fig.10 A view of section line XI-XI in FIG.

[0036] Fig.12 Shown along Fig.10 A view along section line XII-XII in FIG.

[0037] Figures 13 to 17 An example layout of the conductors in the bridge region is shown;

[0038] Fig.18 shows an example of a connection structure between a wire and a sensing transistor for measuring strain on the wire;

[0039] Figures 19 to 21 An embodiment of a sub-pixel layout is shown;

[0040] Fig. 22 A top view of a base layer of a second embodiment is shown;

[0041] Fig.23 A top view of a substrate of a third embodiment is shown;

[0042] Fig.24 Show Fig.23 An enlarged view of region C in FIG.

[0043] Fig.25 Shows connection to Fig.24 An example of first to third conductive lines for each pixel on a base layer in FIG. DETAILED DESCRIPTION

[0044] Example embodiments will be described more fully below with reference to the accompanying drawings; however, the exemplary embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make this disclosure comprehensive and complete and to fully convey the exemplary implementations to those skilled in the art. The embodiments may be combined to form additional embodiments.

[0045] It will also be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. Additionally, it will be understood that when a layer is referred to as being "under" another layer, it can be directly under, or one or more intervening layers may also be present. Additionally, it will be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present. Like reference numerals refer to like elements throughout.

[0046] Figure 1 An embodiment of an OLED display is shown, Figure 2 A cross-sectional view showing an embodiment of a pixel (PX) structure, Figure 3 A top view showing an embodiment of a substrate of an OLED display, Figure 4 Show Figure 3 is an enlarged view of region A in FIG. 1 , and Figure 5 Shows connection to Figure 4 An example of first to third conductive lines of a pixel on a base layer in FIG.

[0047] exist Figure 1 and Figure 2 , the OLED display includes a retractable substrate 100 having an island (IS) shape and a pixel (PX) structure located on the retractable substrate 100. The pixel (PX) structure represents the remaining configuration of the OLED display except for the substrate 100.

[0048] refer to Figure 1 , the substrate 100 has a structure for supporting pixels. As a retractable substrate, the substrate 100 can be extended or compressed in at least one direction. The substrate 100 has an island shape, in which, for example, a plurality of islands (IS) are spaced apart from each other by a predetermined distance P. When the substrate 100 is stretched, the distance P between the islands IS increases or decreases. However, even if the substrate 100 is stretched, each of the islands (IS) is not changed, for example, the width and / or height of each of the islands IS is not increased or decreased.

[0049] In addition, even if the substrate 100 is stretched, the structure of the pixel PX on the island IS is not changed. However, the bridge BR connecting the pixel PX structures to each other and the region CN in which the bridge and the pixel PX are connected may be changed.

[0050] refer to Figure 2 , the pixel PX on the substrate 100 includes a base layer 110, a thin film transistor TFT, a first electrode, an emission layer, and a second electrode, etc. The base layer 110 is located on the substrate 100. For example, the base layer 110 is located on each of the islands on the substrate 100. In this case, the base layer 110 is formed to be stretched together with the substrate 100 when the substrate 100 is stretched.

[0051] refer to Figure 3 , the base layer 110 includes a plurality of pixel forming plates 1110 and a bridge 1130. The pixel forming plates 1110 are respectively arranged on the islands IS of the substrate 100. The pixel forming plates 1110 can be arranged in a lattice shape. Each of the pixels PX can be formed on each of the pixel forming plates 1110. The bridge 1130 connects the pixel forming plates 1110 to each other. In another embodiment, a plurality of pixels can be formed on each of the pixel forming plates 1110.

[0052] Each of the pixels may include a pixel circuit for driving the organic light emitting element. The pixel circuit may include, for example, a thin film transistor and a storage capacitor Cst for driving the pixel.

[0053] Each of the pixel forming plates 1110 may have a shape corresponding to the cross-sectional shape of the island IS of the substrate 100. In one embodiment, the pixel forming plates 1110 may have a substantially quadrilateral shape. In another embodiment, the pixel forming plates 1110 may have a different shape, for example, a polygonal shape such as a circular, triangular, or pentagonal shape corresponding to the cross-sectional shape of the island IS of the substrate 100.

[0054] refer to Figure 4 , Figure 3 The enlarged view of the area A in FIG. 1 includes a first pixel forming plate 1111 and a second pixel forming plate 1113 arranged in a first direction in the pixel forming plate 1110. The first pixel forming plate 1111 and the third pixel forming plate 1115 are arranged in a second direction perpendicular to the first direction. The first pixel forming plate 1111 and the second pixel forming plate 1113 are connected by a first bridge 1131, and the first pixel forming plate 1111 and the third pixel forming plate 1115 are connected by a second bridge 1133.

[0055] The first pixel forming plate 1111 includes a first main support plate 1111a, a first wing plate 1111b and a second wing plate 1111c. The first main support plate 1111a is in the central area of ​​the first pixel forming plate 1111. Thin film transistors and organic light emitting elements are formed on the first main support plate 1111a. The first main support plate 1111a may have a substantially quadrilateral shape.

[0056] The first wing plate 1111b and the second wing plate 1111c are formed on the lateral surface of the first pixel forming plate 1111 and are combined with a bridge connecting the pixel forming plates to each other. The second wing plate 1111c is located on the first main support plate 1111a and is adjacent to the first wing plate 1111b. Figure 4 In the figure, the dotted line between the first main support plate 1111a and the first wing plate 1111b and the second wing plate 1111c is a virtual line that distinguishes the main support plate from the wing plate.

[0057] In addition to the first wing plate 1111b and the second wing plate 1111c, additional wing plates may be formed on the lateral surface of the first main support plate 1111a. Figure 4 As shown, the wing plates may be formed on the left and right sides and the upper and lower sides of the first main support plate 1111a. Four wing plates may be formed on the first main support plate 1111a. In this case, the four wing plates are respectively arranged on each lateral surface of the quadrilateral first main support plate 1111a. The wing plates formed on the pixel forming plate may have a substantially quadrilateral shape.

[0058] In addition, the second pixel forming plate 1113 includes a second main support plate 1113a, a third wing plate 1113b and a fourth wing plate 1113c. Like the first main support plate 1111a, the second main support plate 1113a is the central area of ​​the second pixel forming plate 1113. Thin film transistors and organic light emitting elements are formed on the second main support plate 1113a. The second main support plate 1113a has a substantially quadrilateral shape.

[0059] The third wing plate 1113b and the fourth wing plate 1113c are formed on the lateral surface of the second pixel forming plate 1113 and are combined with a bridge connecting the pixel forming plates to each other. The third wing plate 1113b is located on the lateral surface of the second main support plate 1113a to face the first wing plate 1111b of the first pixel forming plate 1111. The fourth wing plate 1113c is located on the second main support plate 1113a and is adjacent to the third wing plate 1113b.

[0060] In addition to the third wing plate 1113b and the fourth wing plate 1113c, additional wing plates may be formed on the lateral surface of the second main support plate 1113a. Figure 4 As shown, similar to the first main support plate 1111a, the wing plate may be formed on the left and right sides and the upper and lower sides of the second main support plate 1113a. Four wing plates may be formed on the second main support plate 1113a. In this case, the four wing plates are arranged on the corresponding lateral surfaces of the quadrilateral second main support plate 1113a. The wing plate formed on the pixel forming plate may have a substantially quadrilateral shape.

[0061] The third pixel forming plate 1115 includes a third main support plate 1115a, a fifth wing plate 1115b and a sixth wing plate 1115c. Like the first main support plate 1111a, the third main support plate 1115a is the central area of ​​the third pixel forming plate 1115, and thin film transistors and organic light emitting elements are located on the third main support plate 1115a. The third main support plate 1115a may have a substantially quadrilateral shape.

[0062] The fifth wing plate 1115b and the sixth wing plate 1115c are formed on the lateral surface of the third pixel forming plate 1115 and are combined with a bridge connecting the pixel forming plates to each other. The fifth wing plate 1115b is located on the lateral surface of the third main support plate 1115a to face the second wing plate 1111c of the first pixel forming plate 1111. The sixth wing plate 1115c is located on the third main support plate 1115a and is adjacent to the fifth wing plate 1115b.

[0063] In addition to the fifth wing plate 1115b and the sixth wing plate 1115c, additional wing plates may be formed on the lateral surface of the third main support plate 1115a. Figure 4 As shown, similar to the first main support plate 1111a, the wing plates may be formed on the left and right sides and the upper and lower sides of the third main support plate 1115a. Four wing plates may be formed on the third main support plate 1115a. In this case, the four wing plates are arranged on the corresponding lateral surfaces of the third main support plate 1115a of the quadrilateral shape.

[0064] In one embodiment, the first wing plate 1111b of the first pixel forming plate 1111 and the third wing plate 1113b of the second pixel forming plate 1113 are connected by a first bridge 1131. The first bridge 1131 is combined with ends of the first wing plate 1111b and the third wing plate 1113b on the same side.

[0065] The first bridge 1131 may have a curved shape, such as a bent shape. The first bridge 1131 may have a predetermined constant width. In one embodiment, the first bridge 1131 may have a predetermined radius of curvature. In this case, when the substrate 100 disposed under the first bridge 1131 is stretched, the shape of the first bridge 1131 is changed.

[0066] refer to Figure 6 , when the substrate 100 is stretched, each of the pixel forming plates on the island IS of the substrate 100 moves in one direction, and the shape of the first bridge 1131 connecting the first pixel forming plate 1111 and the second pixel forming plate 1113 is changed. In this case, the radius of curvature of the first bridge 1131 increases, so that the area of ​​the base layer 110 can be enlarged or its length can be extended in one direction.

[0067] Reference again Figure 4The second wing plate 1111c of the first pixel forming plate 1111 and the fifth wing plate 1115b of the third pixel forming plate 1115 are connected by a second bridge 1133. The second bridge 1133 is combined with the ends of the second wing plate 1111c and the fifth wing plate 1115b on the same side.

[0068] Like the first bridge 1131, the second bridge 1133 may be curved. In this case, the second bridge 1133 may have a predetermined width. In one embodiment, the second bridge 1133 may have a predetermined radius of curvature.

[0069] As with the first bridge 1131, when the substrate 100 disposed below the second bridge 1133 is stretched, the shape of the second bridge 1133 is changed. When the substrate 100 is stretched, the shape of the second bridge 1133 connecting the first pixel forming plate 1111 and the third pixel forming plate 1115 is changed. In this case, the radius of curvature of the second bridge 1133 increases, so that the area of ​​the base layer 110 can be expanded or its length can be extended in one direction.

[0070] In one embodiment, the first cutout groove 30a is formed in the first pixel forming plate 1111 to be adjacent to a region connected to the first bridge 1131. For example, the first cutout groove 30a may be formed between the first pixel forming plate 1111 and the first bridge 1131.

[0071] More specifically, the first cutout groove 30a may be formed between one side end of the second wing plate 1111c of the first pixel forming plate 1111 and the first bridge 1131. The first cutout groove 30a may prevent the base layer 110 from being broken due to stress occurring between one side end of the second wing plate 1111c and the first bridge 1131.

[0072] exist Figure 4 In the embodiment, if the first cutout groove 30a is not formed between the second wing plate 1111c and the first bridge 1131 of the first pixel forming plate 1111, and the same material as the second wing plate 1111c and the first bridge 1131 is filled in the area of ​​the first cutout groove 30a, the first bridge 1131 may be modified so that stress may be concentrated on this area. Therefore, cracks may occur in this area. In addition, the pixels stacked on the first pixel forming plate 1111 may be damaged.

[0073] In addition, the second cutout groove 30b is formed in the second pixel forming plate 1113 to be adjacent to a region connected to the first bridge 1131. For example, the second cutout groove 30b may be formed between the second pixel forming plate 1113 and the first bridge 1131.

[0074] More specifically, the second cutout groove 30b may be formed between one side end of the fourth wing plate 1113c of the second pixel forming plate 1113 and the first bridge 1131. Similar to the first cutout groove 30a, the second cutout groove 30b may prevent the base layer 110 from being broken due to stress occurring between one side end of the fourth wing plate 1113c and the first bridge 1131.

[0075] In addition, similar to the first and second cutout grooves 30a and 30b, the fourth cutout groove 50b may be formed in the first pixel forming plate 1111 to be adjacent to the region connected to the second bridge 1133. In addition, the third cutout groove 50a may be formed in the third pixel forming plate 1115 to be adjacent to the region connected to the second bridge 1133.

[0076] refer to Figure 5 , one pixel PX1, PX2, PX3 or PX4 may be formed on each of the pixel forming plates 1110 of the base layer 110. Each pixel PX1, PX2, PX3 or PX4 may include a plurality of sub-pixels, such as a red sub-pixel (R), a green sub-pixel (G) and a blue sub-pixel (B).

[0077] Fig. 9 An embodiment of a pixel or sub-pixel in an OLED display is shown. Fig.10 An example of a pixel layout is shown. Fig.11 It is taken along line XI-XI Fig.10 sectional view of . Fig.12 It is taken along line XII-XII Fig.10 sectional view of .

[0078] Will refer to Fig. 9 An equivalent circuit diagram of one pixel or sub-pixel located on each of the pixel forming panels 1110 is described. The OLED display includes a plurality of signal lines 121, 171, and 172, and sub-pixels connected to the plurality of signal lines 121, 171, and 172. In this case, the sub-pixel may be any one of a red sub-pixel R, a green sub-pixel G, and a blue sub-pixel B. As described above, the pixel PX1, PX2, PX3, or PX4 of each of the pixel forming panels 1110 may include a plurality of sub-pixels.

[0079] The signal line includes a gate line 121 for transmitting a scanning signal, a data line 171 for transmitting a data signal, and a driving voltage line 172 for transmitting a driving voltage. The gate line 121 extends substantially in the row direction and is almost parallel to each other. The data line 171 extends substantially in the column direction and is almost parallel to each other. The driving voltage line 172 is shown as extending substantially in the column direction, but may also extend in the row or column direction or have a mesh shape.

[0080] A single sub-pixel includes a thin film transistor including a switching transistor T1 and a driving transistor T2, a storage capacitor Cst, and an organic light emitting element LD. One pixel PX or sub-pixel may include a thin film transistor and a capacitor for compensating current supplied to the organic light emitting element LD.

[0081] The switch transistor T1 includes a control terminal N1, an input terminal N2 and an output terminal connected to a node N3. The control terminal N1 is connected to the gate line 121, the input terminal N2 is connected to the data line 171, and the output terminal is connected to the driving transistor T2.

[0082] The switching transistor T1 transmits a data signal from the data line 171 to the driving transistor T2 based on a scan signal transmitted via the gate line 121 .

[0083] The driving transistor T2 includes a control terminal connected to the node N3, an input terminal N4, and an output terminal N5. The control terminal is connected to the switching transistor T1, the input terminal N4 is connected to the driving voltage line 172, and the output terminal N5 is connected to the organic light emitting element LD. The driving transistor T2 outputs an output current Id whose amount varies according to the voltage applied between the control terminal and the output terminal N5.

[0084] In this case, the capacitor Cst is connected between the control terminal of the driving transistor T2 and the input terminal N4. The capacitor Cst is charged with a data signal applied to the control terminal of the driving transistor T2 and maintains the data signal even after the switching transistor T1 is turned off.

[0085] For example, like an organic light emitting diode (OLED), the organic light emitting element LD has an anode connected to the output terminal N5 of the driving transistor T2 and a cathode connected to the common voltage ELVSS. The organic light emitting element LD emits light of varying intensity according to the output current Id of the driving transistor T2.

[0086] The organic light emitting element LD may include an organic material representing one or more primary colors (eg, red, green, and blue). The OLED display displays a desired image using the spatial sum of these colors.

[0087] The switch transistor T1 and the drive transistor T2 are n-channel field effect transistors (FETs), but at least one of them may be a p-channel FET. In addition, in another embodiment, the connection relationship between the transistors T1 and T2, the capacitor Cst, and the organic light emitting element LD may be different.

[0088] Will refer to Figures 10 to 12 The pixels or sub-pixels formed on each of the pixel forming plates 1110 are described more fully. As described above, the base layer 110 is located on the substrate 100, and may include, for example, polyamide, polyimide, or polyacrylate.

[0089] The buffer layer 120 is formed on the base layer 110. The buffer layer 120 may be formed of silicon nitride (SiN x ) or a single layer of silicon nitride (SiN x ) and silicon oxide (SiO x ) are stacked double layers. The buffer layer 120 serves to planarize the surface while preventing penetration of unnecessary materials such as impurities or moisture.

[0090] The switching semiconductor layer 135a and the driving semiconductor layer 135b are formed on the buffer layer 120 and are separated from each other. These semiconductor layers 135a and 135b may include, for example, polycrystalline silicon or an oxide semiconductor. The oxide semiconductor may include, for example, an oxide based on titanium (Ti), hafnium (Hf), zirconium (Zr), aluminum (Al), tantalum (Ta), germanium (Ge), zinc (Zn), gallium (Ga), tin (Sn) or indium (In) and their composite oxides (such as zinc oxide (ZnO), indium gallium zinc oxide (InGaZnO)). 4 ), indium zinc oxide (Zn-In-O), zinc tin oxide (Zn-Sn-O), indium gallium oxide (In-Ga-O), indium tin oxide (In-Sn-O), indium zirconium oxide (In-Zr-O), indium zirconium zinc oxide (In-Zr-Zn-O), indium zirconium tin oxide (In-Zr-Sn-O), indium zirconium gallium oxide (In-Zr-Ga-O), indium aluminum oxide (In-Al-O), indium zinc aluminum oxide (In-Zn-Al-O), indium tin aluminum oxide (In-Sn-Al-O), indium aluminum gallium oxide (In-A l-Ga-O), indium tantalum oxide (In-Ta-O), indium tantalum zinc oxide (In-Ta-Zn-O), indium tantalum tin oxide (In-Ta-Sn-O), indium tantalum gallium oxide (In-Ta-Ga-O), indium germanium oxide (In-Ge-O), indium germanium zinc oxide (In-Ge-Zn-O), indium germanium tin oxide (In-Ge-Sn-O), indium germanium gallium oxide (In-Ge-Ga-O), titanium indium zinc oxide (Ti-In-Zn-O) and hafnium indium zinc oxide (Hf-In-Zn-O)).

[0091] When the semiconductor layers 135 a and 135 b include an oxide semiconductor material, a separate passivation layer may be added to protect the oxide semiconductor from environmental influences such as high temperature.

[0092] The semiconductor layers 135a and 135b include a channel region that is not doped with impurities. The source region and the drain region are located on opposite sides of the channel region that are doped with impurities. Depending on the type of thin film transistor, the doping impurities may be different and may include, for example, n-type impurities or p-type impurities.

[0093] The switching semiconductor layer 135a and the driving semiconductor layer 135b are divided into a channel region 1355 and a source region 1356 and a drain region 1357 respectively formed at opposite sides of the channel region 1355. The channel region 1355 of the switching semiconductor layer 135a and the driving semiconductor layer 135b may include polysilicon not doped with impurities, for example, may be an intrinsic semiconductor.

[0094] The source region 1356 and the drain region 1357 of the switching semiconductor layer 135 a and the driving semiconductor layer 135 b may include polysilicon doped with conductive impurities, for example, may be an impurity semiconductor.

[0095] The gate insulating layer 140 is located on the switching semiconductor layer 135a and the driving semiconductor layer 135b. The gate insulating layer 140 may be a single layer or a multilayer including, for example, at least one of silicon nitride and silicon oxide.

[0096] The gate line 121, the driving gate electrode 125b and the first capacitor electrode 128 are positioned on the gate insulating layer 140. The gate line 121 extends in a horizontal direction and transmits a scan signal to the switching transistor T1. The gate line 121 includes a switching gate electrode 125a protruding toward the switching semiconductor layer 135a.

[0097] The driving gate electrode 125b protrudes from the first capacitor electrode 128 toward the driving semiconductor layer 135b. Each of the switching gate electrode 125a and the driving gate electrode 125b overlaps the channel region 1355.

[0098] The interlayer insulating layer 160 is located on the gate line 121, the driving gate electrode 125b, and the first capacitor electrode 128. Like the gate insulating layer 140, the interlayer insulating layer 160 may include, for example, silicon nitride, and / or silicon oxide.

[0099] In the interlayer insulating layer 160 and the gate insulating layer 140, a source contact hole 61 and a drain contact hole 62 are formed to respectively expose the source region 1356 and the drain region 1357. A storage contact hole 63 is formed to expose some of the first capacitor electrode 128.

[0100] A data line 171 having a switching source electrode 176 a , a driving voltage line 172 having a driving source electrode 176 b and a second capacitor electrode 178 , a switching drain electrode 177 a connected to the first capacitor electrode 128 , and a driving drain electrode 177 b are formed on the interlayer insulating layer 160 .

[0101] The data line 171 transmits a data signal and extends across the gate line 121. The driving voltage line 172 transmits a driving voltage and is spaced apart from the data line 171 to extend in the same direction as the data line 171.

[0102] The switching source electrode 176a protrudes from the data line 171 toward the switching semiconductor layer 135a. The driving source electrode 176b protrudes from the driving voltage line 172 toward the driving semiconductor layer 135b. Each of the switching source electrode 176a and the driving source electrode 176b is connected to the source region 1356 through the source contact hole 61. The switching drain electrode 177a faces the switching source electrode 176a, and the driving drain electrode 177b faces the driving source electrode 176b.

[0103] Each of the switching drain electrode 177a and the driving drain electrode 177b is connected to the drain region 1357 through the drain contact hole 62. The switching drain electrode 177a extends to be electrically connected to the first capacitor electrode 128 and the driving gate electrode 125b through the contact hole 63 in the interlayer insulating layer 160.

[0104] The second capacitor electrode 178 protrudes from the driving voltage line 172 to overlap the first capacitor electrode 128. Therefore, the first capacitor electrode 128 and the second capacitor electrode 178 form a storage capacitor Cst, in which the interlayer insulating layer 160 serves as a dielectric material.

[0105] The switching semiconductor layer 135a, the switching gate electrode 125a, the switching source electrode 176a and the switching drain electrode 177a form a switching transistor T1. Meanwhile, the driving semiconductor layer 135b, the driving gate electrode 125b, the driving source electrode 176b and the driving drain electrode 177b form a driving transistor T2. The switching transistor T1 and the driving transistor T2 correspond to switching elements.

[0106] A passivation layer 180 is formed on the switching source electrode 176 a , the driving source electrode 176 b , the switching drain electrode 177 a , and the driving drain electrode 177 b .

[0107] The pixel electrode 710 is formed on the passivation layer 180. The pixel electrode 710 may include, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ) or reflective metals such as lithium, calcium, lithium fluoride / calcium, lithium fluoride / aluminum, aluminum, silver, magnesium, gold, etc.

[0108] The pixel electrode 710 is electrically connected to the driving drain electrode 177 b of the driving transistor T2 through a contact hole 181 in the passivation layer 180 , and becomes an anode of the organic light emitting element 70 .

[0109] The pixel defining layer 350 is formed on the edge portion of the pixel electrode 710 and the passivation layer 180. The pixel defining layer 350 includes an opening exposing the pixel electrode 710. The pixel defining layer 350 includes a resin based on, for example, polyacrylate or polyimide, or a silicon dioxide-based inorganic material.

[0110] The organic emission layer 720 is formed in the opening of the pixel defining layer 350. The organic emission layer 720 may be formed with a plurality of layers including a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and / or an electron injection layer (EIL). When all of the above layers are included, the HIL may be disposed on the pixel electrode 710 serving as an anode, and the HTL, the emission layer, the ETL, and the EIL may be sequentially stacked on the HIL.

[0111] The organic emission layer 720 may include a red organic emission layer emitting red light, a green organic emission layer emitting green light, and / or a blue organic emission layer emitting blue light. The red organic emission layer, the green organic emission layer, and the blue organic emission layer are formed on the red pixel, the green pixel, and the blue pixel, respectively, to realize a color image.

[0112] Red, green, and blue organic emission layers may be integrally stacked for red, green, and blue pixels, and red, green, and blue color filters may be respectively formed in each pixel, thereby realizing a color image.

[0113] In another embodiment, a white organic emission layer emitting white light is formed on all of the red pixels, green pixels, and blue pixels. Red, green, and blue color filters may be formed for these pixels, respectively, to achieve a color image. When a color image is achieved using a white organic emission layer and a color filter, a deposition mask for depositing a red, green, and blue organic emission layer on individual pixels, i.e., a red pixel, a green pixel, and a blue pixel, is not required.

[0114] In another embodiment, the white organic emission layer may be formed to have a single organic emission layer, and may further include a configuration in which a plurality of organic emission layers are stacked to emit white light. For example, a configuration in which at least one yellow organic emission layer and at least one blue organic emission layer are combined to emit white light, a configuration in which at least one cyan organic emission layer and at least one red organic emission layer are combined to emit white light, or a configuration in which at least one magenta organic emission layer and at least one green organic emission layer are combined to emit white light may be further included.

[0115] The common electrode 730 is formed on the pixel defining layer 350 and the organic emission layer 720. The common electrode 730 may include, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3), or a reflective metal such as lithium, calcium, lithium fluoride / calcium, lithium fluoride / aluminum, aluminum, silver, magnesium, gold, etc. The common electrode 730 may be a cathode of the organic light emitting element 70. The pixel electrode 710, the organic emission layer 720, and the common electrode 730 form the organic light emitting element 70. An overcoat layer may be formed on the common electrode 730 to protect the organic light emitting element 70.

[0116] In one embodiment, the first to third conductive lines 121, 171, and 172 are connected to the pixels PX1, PX2, PX3, and PX4 on the pixel forming board 1110 and may be formed on the bridge 1130. For example, a plurality of conductive lines connected to the pixels PX1, PX2, PX3, and PX4 may extend to the pixel forming board through the bridge, respectively.

[0117] Reference again Figure 5 , the first wire 121 extends in the first direction through the pixel PX1 on the first pixel forming plate 1111. The first wire 121 is formed on the first bridge 1131 and may be connected to the pixel PX2 of the second pixel forming plate 1113. For example, the first wire 121 extends in the first direction through the first pixel forming plate 1111, the first bridge 1131, and the second pixel forming plate 1113.

[0118] In one embodiment, the first conductive line 121 may correspond to the aforementioned gate line 121 for transmitting a scan signal. Fig.10 In the embodiment, the gate lines 121 extend substantially in a row direction and may correspond to the first conductive lines 121. For example, the gate lines 121 may be respectively connected to the pixels through bridges for connecting pixel forming plates.

[0119] The second conductive line 171 and the third conductive line 172 extend through the pixel PX1 on the first pixel forming plate 1111 in the second direction and may be formed on the second bridge 1133. The second conductive line 171 and the third conductive line 172 may be connected to the pixel PX3 of the third pixel forming plate 1115. For example, the second conductive line 171 and the third conductive line 172 extend through the first pixel forming plate 1111, the second bridge 1133, and the third pixel forming plate 1115.

[0120] In one embodiment, the second wire 171 and the third wire 172 may correspond to the aforementioned data line 171 for transmitting a data signal and the aforementioned driving voltage line 172 for transmitting a driving voltage, respectively. Fig.10 , the data line 171 and the driving voltage line 172 extend substantially in the column direction and may respectively correspond to the second conductive line 171 and the third conductive line 172. For example, the data line 171 and the driving voltage line 172 may be respectively connected to the pixels through a bridge for connecting the pixel forming plates.

[0121] Figure 7 Show Figure 6 An example of the strain in region B, and Figure 8 is a diagram showing an example of how strain varies according to the position of a bridge. More specifically, Figure 7 Explained are example results of measuring strain occurring in the region of the first bridge 1131 when the first pixel forming plate 1111 and the second pixel forming plate 1113 are moved in opposite side directions. Figure 8 The result of measuring the strain on the first bridge 1131 along the d-axis corresponding to the outer circumferential direction based on the reference point S is explained.

[0122] refer to Figure 7 , when the first pixel forming plate 1111 and the second pixel forming plate 1113 move in opposite lateral directions, the strain occurring in the first bridge 1131 varies depending on the position. Strain is a measure of the rate of change (%) of length per unit length. For example, Figure 7 Each of regions a, b, c, and d in is a region in which strain is equal, and the strain decreases from region a toward region b, region c, and region d.

[0123] The closer to the reference point S, the more the strain on the first bridge 1131 increases. That is, based on a predetermined radius of curvature, the closer to the center of the first bridge 1131, the more the strain increases. For example, based on a center line passing through the center of the width of the first bridge 1131, the strain on the inner side of the center line is greater than the strain on the outer side thereof.

[0124] refer to Figure 8 ,based on Figure 7 For the reference point S in the figure, the strain decreases rapidly as it approaches the outside along the d-axis.

[0125] based on Figure 7 and Figure 8 According to the measurement results in FIG. 1 , when the first pixel forming plate 1111 and the second pixel forming plate 1113 move in opposite lateral directions, a greater change occurs on the inner side than on the outer side in the first bridge 1131. Therefore, the first conductive line 121 formed on the bridge 1130 may be disposed on the outer side of the bridge 1130 based on the center line.

[0126] refer to Fig.13 , the first conductive line 121 may be disposed outside the center line CL based on the center line CL passing through the center of the width of the first bridge 1131. As described above, since the first conductive line 121 is disposed outside where the strain is relatively small, the first conductive line 121 may be prevented from being disconnected or broken due to repeated movement of the first pixel forming plate 1111 and the second pixel forming plate 1113.

[0127] In one embodiment, the first conductive line 121 may be uniformly disposed in the bridge 1130 . However, the dummy conductive line 800 may be located inside the center line CL. In this case, the strain on the dummy conductive line 800 may be greater than the strain on the first conductive line 121 .

[0128] refer to Fig.14 and Fig.15 , the dummy wire 800 may be located above or below the first wire 121 on the inner side of the center line CL. Fig.14 As shown, the first conductive line 121 may be uniformly stacked, and the dummy conductive line 800 may be additionally stacked on the first conductive line 121 inside the center line CL. Fig.15 As shown, the dummy conductive line 800 is stacked inside the center line CL, and the first conductive line 121 may be uniformly stacked on the dummy conductive line 800 .

[0129] In one embodiment, the first conductive line 121 may be evenly located above the bridge 1130. However, if Fig.16 As shown, the dummy wire 800 may be additionally provided in the central region of the bridge 1130. The length of the dummy wire 800 becomes shorter and shorter from the inner side of the bridge 1130 toward the outer side thereof. In addition, the strain on the dummy wire 800 is greater than the strain on the first wire 121. The inner side of the bridge 1130 is the region where the center of the radius of curvature of the curved bridge 1130 is located, and the outer side of the bridge 1130 is the remaining region except the central region.

[0130] In one embodiment, among the second conductive wire 171 and the third conductive wire 172 on the bridge 1130, the conductive wire having a relatively small strain is located outside the center line CL. In addition, among the second conductive wire 171 and the third conductive wire 172, the conductive wire having a relatively large strain is located inside the center line CL. Therefore, since the conductive wire having a relatively large strain is disposed inside the center line CL and the conductive wire having a relatively small strain is disposed outside the center line CL, the second conductive wire 171 and the third conductive wire 172 can be prevented from being disconnected or broken due to repeated movement of the first pixel forming plate 1111 and the second pixel forming plate 1113.

[0131] For example, refer to Fig.17 , the second conductive line 171 may be disposed inside the center line CL, and the third conductive line 172 may be disposed outside the center line CL. In one embodiment, the second conductive line 171 and the third conductive line 172 correspond to the data line 171 and the driving voltage line 172, respectively. The second conductive line 171 may include a metal having a greater strain than that of the third conductive line 172.

[0132] In one embodiment, the sensing thin film transistor 900 for measuring the strain of the first to third conductive lines 121, 171, and 172 on the bridge 1130 may be disposed on the pixel forming plate 1110. For example, referring to Fig.18 In order to detect the strain on the second conductive line 171, the sensing thin film transistor 900 may be connected to the second conductive line 171 to measure the resistance of the second conductive line 171. The sensing thin film transistor 900 may be, for example, a sensing thin film transistor for measuring the resistance of metal.

[0133] Fig.19 , Fig. 20 and Fig.21 11 is an example of a layout view of sub-pixels located on a pixel forming plate. As described above, the pixel PX on each of the pixel forming plates 1110 may include a plurality of sub-pixels. In this case, a red sub-pixel (R), a green sub-pixel (G), and a blue sub-pixel (B) may be arranged in each pixel PX in various forms. In another embodiment, at least one pixel PX may be formed on each of the pixel forming plates, for example, a plurality of pixels PX including a red sub-pixel, a green sub-pixel, and a blue sub-pixel may be formed on each of the pixel forming plates.

[0134] refer to Fig.19 , the green sub-pixel (G) is located at the center of the pixel forming plate 1110 and extends in the second direction. The blue sub-pixel B and the red sub-pixel R may be disposed on opposite sides of the green sub-pixel (G).

[0135] refer to Fig. 20 The pair of green sub-pixels G may be spaced apart from each other at a predetermined angle relative to the first direction. The blue sub-pixel B and the red sub-pixel R may be symmetrical to the pair of green sub-pixels G based on the second direction.

[0136] refer to Fig.21 , the first blue sub-pixel B1 and the red sub-pixel R may be spaced apart from each other in the first direction. The green sub-pixel G and the second blue sub-pixel B2 may be spaced apart from each other in the second direction. In one embodiment, the first blue sub-pixel B1 and the second blue sub-pixel B2 may emit light having different wavelengths.

[0137] Fig. 22 FIG. 1 is a top view of a substrate of another embodiment of an OLED display. Fig. 22 , this OLED display is different from the OLED display of the aforementioned embodiment in terms of the structure of the base layer.

[0138] like Figure 4As shown, in the OLED display of the aforementioned embodiment, the first bridge 1131 is bent upward along the second direction. In addition, the first bridge 1131 connecting the first pixel forming plate 1111 and the second pixel forming plate 1113 is connected to the first wing plate 1111b and the third wing plate 1113b.

[0139] However, if Fig. 22 As shown, in this embodiment, the first bridge 1131" is bent downward along the second direction. Here, the upward and downward bending in the second direction is applicable to Figure 4 and Fig. 22 to distinguish the curved shape of the first bridge. In this case, the upward bending in the second direction represents the direction from the first pixel forming plates 1111 and 1111" toward the third pixel forming plates 1115 and 1115". The downward bending in the second direction represents the direction from the third pixel forming plates 1115 and 1115" toward the first pixel forming plates 1111 and 1111".

[0140] The configurations of the first to third pixel forming plates 1111", 1113", and 1115" may be the same as those of the first to third pixel forming plates 1111, 1113, and 1115 of the aforementioned embodiments. In addition, as in the aforementioned embodiments, the first bridge 1131" may have a predetermined width. In addition, the first bridge 1131" may be bent to a predetermined radius of curvature.

[0141] refer to Fig. 22 , the first bridge 1131" is connected to the second wing plate 1111c" of the first pixel forming plate 1111" and the fourth wing plate 1113c" of the second pixel forming plate 1113". The first bridge 1131" is combined with the ends of the second wing plate 1111c" and the fourth wing plate 1113c" facing each other. For example, the second wing plate 1111c" is located on the upper part of the quadrilateral first main support plate 1111a", and the fourth wing plate 1113c" is located on the upper part of the quadrilateral second main support plate 1113a". The first bridge 1131" bent downward along the second direction is combined with each of the ends of the second wing plate 1111c" and the fourth wing plate 1113c" facing each other.

[0142] In this embodiment, the first cutout groove 30a" is formed in the first pixel forming plate 1111" to be adjacent to the area connected to the first bridge 1131". For example, the first cutout groove 30a" can be located between the first pixel forming plate 1111" and the first bridge 1131". For example, the first cutout groove 30a" is located between one side end portion of the first wing plate 1111b" of the first pixel forming plate 1111" and the first bridge 1131". The first cutout groove 30a" can prevent the base layer 110 from breaking due to stress occurring between one side end portion of the first wing plate 1111b" and the first bridge 1131".

[0143] exist Fig. 22 In the present invention, if the first cutout groove 30a'' is not formed between the first wing plate 1111b'' and the first bridge 1131'' of the first pixel forming plate 1111'', and the same material as the first wing plate 1111b'' and the first bridge 1131'' is filled in the area of ​​the first cutout groove 30a'', the first bridge 1131'' may be modified so that stress may be concentrated in this area. Therefore, cracks may occur in this area. In addition, the pixels stacked on the first pixel forming plate 1111'' may be damaged.

[0144] In addition, a second cutout groove 30b" is formed in the second pixel forming plate 1113" to be adjacent to the area connected to the first bridge 1131". For example, the second cutout groove 30b" may be located between the second pixel forming plate 1113" and the first bridge 1131". For example, the second cutout groove 30b" is located between one side end portion of the third wing plate 1113b" of the second pixel forming plate 1113" and the first bridge 1131". Similar to the first cutout groove 30a", the second cutout groove 30b" may prevent the base layer 110 from breaking due to stress occurring between one side end portion of the third wing plate 1113c" and the first bridge 1131".

[0145] In addition, similar to the above-mentioned first cutout groove 30a" and the second cutout groove 30b", a fourth cutout groove 50b" can be formed in the first pixel forming plate 1111" to be adjacent to the area connected to the second bridge 1133". In addition, the third cutout groove 50a" can be formed in the third pixel forming plate 1115" to be adjacent to the area connected to the second bridge 1133".

[0146] Fig.23 is a top view of a substrate of another embodiment of an OLED display. Fig.24 Show Fig.23 Magnified view of area C in FIG. Fig.25 Shows connection to Fig.24 An example of the first to third conductive lines of each pixel on the base layer in FIG. Figure 23 to Figure 25 In the embodiment, the OLED display is different from the OLED display of the aforementioned initial embodiment in terms of the structure of the base layer.

[0147] like Figure 4 As shown, in the OLED display of the aforementioned initial embodiment, the cutout grooves 30a, 30b, 50a and 50b are formed in the pixel forming plates 1111, 1113 and 1115 so as to be adjacent to the regions connected to the bridges 1131 and 1133. However, in the OLED display of the present embodiment, as shown in FIG. Fig.23 and Fig.24As shown, no cutout grooves are formed in the pixel forming plates 1111', 1113', and 1115' adjacent to the regions connected to the bridges 1131' and 1133'. That is, the OLED display of this embodiment is different in whether the cutout grooves are formed in the base layer.

[0148] According to the above-mentioned second embodiment, the first pixel forming plate 1111' and the second pixel forming plate 1113' are arranged in the first direction. In addition, the first pixel forming plate 1111' and the third pixel forming plate 1115' are arranged in the second direction. In this case, the first pixel forming plate 1111' and the second pixel forming plate 1113' are connected by the first bridge 1131', and the first pixel forming plate 1111' and the third pixel forming plate 1115' are connected by the second bridge 1133'.

[0149] For example, the first pixel forming plate 1111 ′ includes a first main supporting plate 1111 a ′ and first and second wing plates 1111 b ′ and 1111 c ′.

[0150] The first main support plate 1111a' may have a substantially quadrilateral shape located in the central area of ​​the first pixel forming plate 1111'. In addition, a first wing plate 1111b' and a second wing plate 1111c' are formed in the lateral surface of the first pixel forming plate 1111' and are combined with a bridge connecting the pixel forming plates to each other. The second wing plate 1111c' is disposed in the first main support plate 1111a' to be adjacent to the first wing plate 1111b'. Fig.24 In the figure, the dotted line shown between the first main support plate 1111a' and the first wing plate 1111b' and the second wing plate 1111c' is a virtual line used to distinguish between the main support plate and the wing plate.

[0151] In this case, the first wing plate 1111b' and the second wing plate 1111c' provided in the lateral surface of the first pixel forming plate 1111' may be formed to have a substantially triangular shape. Fig.24 As shown, since the first wing plate 1111b' and the second wing plate 1111c' are formed to have a triangular shape, a cutout groove is not formed between the first bridge 1131' and the second wing plate 1111c'.

[0152] Similar to the aforementioned first pixel forming plate 1111', the wing plates of the second pixel forming plate 1113' and the third pixel forming plate 1115' are also formed to have a triangular shape, and a cutout groove is not formed between the second pixel forming plate 1113' and the third pixel forming plate 1115' and the bridge.

[0153] refer to Fig.25In the present embodiment, the first to third conductive lines 121', 171', and 172' connected to the pixels PX1', PX2', PX3', and PX4' formed on the pixel forming plate 1110' may be formed on the bridges 1131', 1133', and 1135'. For example, in the same manner as in the first embodiment, the plurality of conductive lines connected to the pixels PX1', PX2', PX3', and PX4' may be extended to the pixel forming plate through the bridges 1131', 1133', and 1135', respectively.

[0154] For example, a first wire 121' extending in the first direction through a pixel PX1' formed on a first pixel forming plate 1111' is formed on a first bridge 1131'. In addition, the first wire 121' may be connected to a pixel PX2' of a second pixel forming plate 1113'. For example, the first wire 121' is formed to extend in the first direction through the first pixel forming plate 1111', the first bridge 1131', and the second pixel forming plate 1113'.

[0155] The second wire 171' and the third wire 172' extending in the second direction through the pixel PX1' formed on the first pixel forming plate 1111' are formed on the second bridge 1133'. In addition, the second wire 171' and the third wire 172' may be connected to the pixel PX3' of the third pixel forming plate 1115'. For example, the second wire 171' and the third wire 172' are formed to extend through the first pixel forming plate 1111', the second bridge 1133', and the third pixel forming plate 1115'.

[0156] In this embodiment, the first to third wires 121', 171' and 172' passing through the first bridge 1131' or the second bridge 1133' can be connected with Figures 13 to 17 Since the first to third conductive lines 121', 171' and 172' are arranged in the aforementioned structure, the first to third conductive lines 121', 171' and 172' can be prevented from being disconnected or broken due to repeated movement of the first to third pixel forming plates 1111', 1113' and 1115'.

[0157] Example embodiments have been disclosed herein, and although specific terms are used, they are used and interpreted in a general and descriptive sense only and not for purposes of limitation. In some cases, it will be apparent to one of ordinary skill in the art to which this application is filed that features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise indicated. Therefore, those skilled in the art will appreciate that various changes in form and detail may be made without departing from the spirit and scope of the invention as set forth in the appended claims.

Claims

1. A display device, comprising: a substrate having first and second islands spaced apart from each other; A first pixel is disposed on the first island; a second pixel, disposed on the second island; as well as A bridge connects the first pixel and the second pixel, The first pixel includes a first base layer, a first transistor located on the first base layer, a first light-emitting element electrically connected to the first transistor, and a first encapsulation layer covering the first light-emitting element. The second pixel includes a second base layer, a second transistor located on the second base layer, a second light emitting element electrically connected to the second transistor, and a second encapsulation layer covering the second light emitting element, and Therein, in plan view, the bridge has a curved shape. 2 . The display device according to claim 1 , wherein the bridge has a predetermined radius of curvature in the plan view. 3 . The display device according to claim 1 , wherein the first encapsulation layer is in contact with an upper surface of the first base layer, and the second encapsulation layer is in contact with an upper surface of the second base layer.

4. The display device according to claim 1, wherein: The first pixel further includes a first buffer layer between the first base layer and the first transistor, The second pixel further includes a second buffer layer between the second base layer and the second transistor, The first encapsulation layer contacts a side surface of the first buffer layer, and The second encapsulation layer contacts a side surface of the second buffer layer. 5 . The display device of claim 4 , wherein the first buffer layer and the second buffer layer are spaced apart from each other.

6. The display device according to claim 4, wherein: The first pixel further includes a first insulating layer between the first buffer layer and the first light emitting element, The second pixel further includes a second insulating layer between the second buffer layer and the second light emitting element, The first encapsulation layer contacts a side surface of the first insulating layer, and The second encapsulation layer contacts a side surface of the second insulating layer. 7 . The display device of claim 6 , wherein the first insulating layer and the second insulating layer are spaced apart from each other. 8 . The display device according to claim 1 , wherein each of the first substrate and the second substrate includes a pixel forming plate on which at least one sub-pixel is provided.

9. A display device, comprising: substrate; A first base layer and a second base layer are disposed on the substrate and are spaced apart from each other; a bridge connecting the first base layer and the second base layer; A first transistor and a second transistor are disposed on the first base layer and the second base layer, respectively; A first light emitting element and a second light emitting element are electrically connected to the first transistor and the second transistor, respectively; as well as A first encapsulation layer and a second encapsulation layer respectively cover the first light-emitting element and the second light-emitting element, Therein, in plan view, the bridge has a curved shape.

10. The display device according to claim 9, wherein the bridge has a predetermined radius of curvature in the plan view. 11 . The display device of claim 9 , wherein the first encapsulation layer contacts an upper surface of the first base layer, and the second encapsulation layer contacts an upper surface of the second base layer.

12. The display device according to claim 9, further comprising: A first buffer layer, located between the first base layer and the first transistor; as well as a second buffer layer, located between the second base layer and the second transistor, The first encapsulation layer contacts a side surface of the first buffer layer, and the second encapsulation layer contacts a side surface of the second buffer layer. 13 . The display device of claim 12 , wherein the first buffer layer and the second buffer layer are spaced apart from each other.

14. The display device according to claim 12, further comprising: A first insulating layer, located between the first buffer layer and the first light-emitting element; as well as a second insulating layer, located between the second buffer layer and the second light-emitting element, The first encapsulation layer contacts the side surface of the first insulating layer, and the second encapsulation layer contacts the side surface of the second insulating layer. 15 . The display device of claim 14 , wherein the first insulating layer and the second insulating layer are spaced apart from each other. 16 . The display device according to claim 9 , wherein each of the first substrate and the second substrate includes a pixel forming plate on which at least one sub-pixel is provided.

Images