Path switching component, chamber having the path switching component, substrate processing system and method thereof

Abstract

A path switching assembly (150) for laterally moving a carrier is described. The path switching assembly (150) includes one or more pivotable carrier transport elements (152) for moving a carrier (10) from a first transport path (T1) to a laterally offset second transport path (T2) in a path switching direction (S). In addition, a chamber including the path switching assembly, a processing system including the chamber, a method of switching a transport path of a carrier, and a method of processing a substrate are described.

Description

Technical Field

[0001] Various embodiments of the present disclosure relate to apparatus and methods for transporting carriers, particularly carriers used during processing of large area substrates. Specifically, various embodiments of the present disclosure relate to apparatus and methods for contactless transport of carriers, which can be employed in processing systems for vertical substrate processing (e.g., depositing materials on large area substrates for display production). More specifically, various embodiments of the present disclosure relate to a path switching assembly, which is disposed, for example, in a chamber of a processing system and is configured to move a carrier transverse to a transport direction of a transport path provided by one or more transport systems for carrier transport. Background Art

[0002] Techniques for depositing layers on substrates include, for example, sputtering deposition, physical vapor deposition (PVD), chemical vapor deposition (CVD), and thermal evaporation. Coated substrates can be used in several applications and in several technical fields. For example, coated substrates can be used in the field of display devices. Display devices can be used to manufacture television screens, computer displays, mobile phones, other handheld devices, and similar devices to display information. Typically, displays are produced by coating substrates with stacks of layers of different materials.

[0003] For depositing layer stacks, an inline arrangement of processing modules may be used. An inline processing system comprises a plurality of subsequent processing modules (such as a deposition module) and optionally further processing modules (such as a cleaning module and / or an etching module), wherein processing aspects are subsequently performed in the processing modules, so that a plurality of substrates may be processed continuously or quasi-continuously in an inline processing system.

[0004] During processing, the substrate may be carried by a carrier, i.e., a carrying device for carrying the substrate. The carrier is typically transported through the vacuum chamber using one or more transport systems. The transport system may be configured to transport the carrier along one or more transport paths. At least two transport paths may be arranged close to each other in the vacuum system, such as a first transport path for transporting the carrier in a forward direction and a second transport path for transporting the carrier in a return direction opposite to the forward direction.

[0005] Conventional transport systems have rollers or other supports that are configured to support a carrier and transport the carrier along a transport path and / or transport the carrier from one transport path to another (also referred to as "path switching" or "track switching"). Friction between the carrier and the carrier support during movement of the carrier may generate particles that may contaminate the layer deposited on the substrate. One method of reducing or minimizing particle generation during carrier transport is to employ a non-contact transport system. However, there are some challenges in providing a path switching system for a non-contact transport system. In particular, there is a need for a path switching system that provides a shorter tact time, lower cost, and simpler implementation. Summary of the invention

[0006] In view of the above, a path switching assembly, a method for switching a transport path of a carrier, and a method for processing a substrate according to the independent claims are provided. Additionally, a chamber including a path switching assembly according to multiple embodiments of the present disclosure and a substrate processing system including such a chamber are provided. Further aspects, advantages, and characteristic structures are apparent from the dependent claims, the description, and the drawings.

[0007] According to one aspect of the present disclosure, a path switching assembly is provided, comprising one or more pivotable carrier transport elements for moving a carrier from a first transport path to a laterally offset second transport path in a path switching direction.

[0008] According to another aspect of the present disclosure, a method for switching a transport path of a carrier is provided. The method comprises transferring the carrier from a first transport system to one or more pivotable carrier transport elements, in particular one or more pivotable carrier transport elements of a path switching assembly according to various embodiments described herein. Additionally, the method comprises pivoting the one or more pivotable carrier transport elements from the first transport system to a second transport system. Additionally, the method comprises transferring the carrier from the one or more pivotable carrier transport elements to the second transport system.

[0009] According to another aspect of the present disclosure, a method for processing a substrate is provided. The method comprises transferring a carrier carrying the substrate from a first transport system to one or more pivotable carrier transport elements, in particular one or more pivotable carrier transport elements of a path switching assembly according to any embodiment described herein. Additionally, the method comprises pivoting the one or more pivotable carrier transport elements from the first transport system to a processing position. Additionally, the method comprises processing the substrate by using a processing device.

[0010] According to another aspect of the present disclosure, there is provided a chamber comprising a path switching assembly according to any embodiment described herein. The chamber comprises a first transport system arranged along a first transport path for transporting carriers. Additionally, the chamber comprises a second transport system arranged along a second transport path horizontally offset from the first transport path. Additionally, the chamber comprises the path switching assembly, wherein the one or more pivotable carrier transport elements are pivotally mounted in a bearing arranged in at least one of an upper chamber wall and a bottom chamber wall.

[0011] According to another aspect of the present disclosure, a processing system for vertically processing a substrate is provided. The processing system comprises at least one chamber according to any embodiment described herein.

[0012] According to another aspect of the present disclosure, a method for manufacturing a device is provided, wherein the method comprises using a path switching assembly according to any embodiment of the present disclosure, a chamber according to any embodiment of the present disclosure, a processing system according to any embodiment of the present disclosure, and a method for processing a substrate according to any embodiment of the present disclosure.

[0013] A number of embodiments also relate to apparatus for performing the disclosed methods and include apparatus portions for performing each described method aspect. These method aspects may be performed by hardware components, computers programmed with appropriate software, any combination of the two, or in any other manner. In addition, a number of embodiments according to the present disclosure also relate to methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for performing each function of the apparatus. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to understand in detail the manner in which the above-mentioned features of the present disclosure are achieved, a more particular description of the present disclosure briefly outlined above may be obtained with reference to a number of embodiments. The accompanying drawings relate to a number of embodiments of the present disclosure and are described as follows:

[0015] Figure 1A shows a schematic side view of a path switching assembly according to various embodiments described herein;

[0016] Figure 1B shows a schematic top view of a path switching assembly according to various embodiments described herein;

[0017] Figure 2A and Figure 2B shows a schematic side view and a schematic top view of a path switching assembly according to additional embodiments described herein;

[0018] Figure 3A and Figure 3B shows a schematic side view and a schematic top view of a path switching assembly, illustrating further aspects of the path switching assembly according to various embodiments described herein;

[0019] Figure 4A shows a schematic side view of a chamber including a path switching assembly according to various embodiments described herein;

[0020] Figure 4B shows a schematic top view of a chamber including a path switching assembly according to various embodiments described herein;

[0021] Figure 5 shows a schematic diagram of a processing system according to various embodiments described herein;

[0022] Fig. 6A shows a flow chart for illustrating a method for switching a transport path of a carrier according to various embodiments described herein;

[0023] Figure 6B shows a schematic illustration of a method for describing a method of switching a transport path of a carrier according to various embodiments described herein;

[0024] Fig. 7A A flow chart is shown of an exemplary method for processing a substrate according to various embodiments described herein;

[0025] Figure 7B shows a schematic illustration of a method for processing a substrate according to various embodiments described herein; and

[0026] Figure 8 A flow chart illustrating a method of manufacturing a device according to various embodiments described herein is shown. DETAILED DESCRIPTION

[0027] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are illustrated in the figures. In the following description of the drawings, the same reference numerals refer to the same parts. Only the differences relative to individual embodiments are described. Each example is provided in a manner to explain the present disclosure and is not intended to be a limitation of the present disclosure. In addition, the features illustrated or described as part of one embodiment may be used on or in combination with other multiple embodiments to produce yet another embodiment. The specification is intended to include such modifications and variations.

[0028] Exemplary references Figure 1A and Figure 1B , describing a path switching component 150 according to the present disclosure. Figure 1A shows a side view of the path switching assembly, and Figure 1B 1 shows a top view of the path switching assembly. According to various embodiments that can be combined with any other various embodiments described herein, the path switching assembly 150 includes one or more pivotable carrier conveying elements 152 for moving the carrier 10 from the first transport path T1 to the laterally offset second transport path T2 in the path switching direction S. Typically, the first transport path T1 and the second transport path T2 are substantially parallel to each other. Figure 1A As exemplarily indicated by the double-headed arrow in , the one or more pivotable carrier transport elements 152 are pivotable about a rotation axis 155. Typically, the rotation axis 155 is vertical, ie the rotation axis 155 extends in a vertical direction.

[0029] In the present disclosure, a "vertical direction" is considered to be a direction substantially parallel to the direction in which gravity extends. The vertical direction may deviate from the exact vertical (the latter being defined by gravity) by an angle of, for example, up to 15 degrees. A "lateral direction" is understood to be distinct from the vertical direction. The lateral direction may be perpendicular or substantially perpendicular to the exact vertical direction defined by gravity.

[0030] Therefore, from Figure 1A and Figure 1B , it should be understood that the term "offset laterally" may be understood as "offset horizontally" or "offset perpendicularly to the transport direction T".

[0031] like Figure 1B As shown exemplarily, the first transport path T1 and the second transport path T2 typically extend in the transport direction T. Figure 1B , indicating the path switching direction S. It should therefore be understood that the transport direction T and the path switching direction S typically define a horizontal plane.

[0032] In the present disclosure, a "path switching assembly" may be understood as an assembly configured to move a carrier between different positions laterally offset from each other, such as an assembly for moving between different transport paths. In particular, typically, the path switching assembly is configured to move the carrier laterally in the path switching direction S. For example, referring to Figure 1B It should be understood that the term "path switching direction" can be understood as a horizontal direction, in particular perpendicular to the transport direction T. Figure 1A and Figure 1B It will be appreciated that the transport direction T is typically also a substantially horizontal direction. Thus, the transport direction T and the path switching direction S typically span a horizontal plane.

[0033] Therefore, compared with conventional path switching systems, various embodiments of the path switching assembly of the present disclosure are improved. In particular, various embodiments of the path switching assembly as described herein provide shorter takt time, lower cost and simpler implementation.

[0034] In the present disclosure, a "carrier" may be understood as a carrier configured to hold a substrate, also referred to as a substrate carrier. For example, the carrier may be a substrate carrier for carrying a large area substrate. It should be understood that various embodiments of the path switching assembly may also be used for other carrier types, such as a mask carrier. Therefore, additionally or alternatively, the carrier may be a carrier configured to carry a mask.

[0035] In the present disclosure, the term "substrate" may particularly encompass substantially non-flexible substrates, such as wafers, slices of transparent crystals (such as sapphire or similar crystals), or glass plates. However, the present disclosure is not limited thereto, and the term "substrate" may also encompass flexible substrates, such as coils or foils. The term "substantially non-flexible" should be understood to be distinguished from "flexible". In particular, a substantially non-flexible substrate may have a certain degree of flexibility, such as a glass plate with a thickness of 0.5 mm or less, wherein the flexibility of the substantially non-flexible substrate is small compared to a flexible substrate. According to a plurality of embodiments described herein, the substrate may be made of any material suitable for material deposition. For example, the substrate may be made of a material selected from the group consisting of glass (e.g., soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound material, carbon fiber material, or any other material or material combination that can be coated by a deposition process.

[0036] In this disclosure, the term "large area substrate" refers to a substrate having an area of ​​0.5 m 2 or larger, especially 1m 2 In some embodiments, the large area substrate may be a 4.5 generation substrate (corresponding to about 0.67 m 2 Substrate (0.73m×0.92m)), 5th generation (corresponding to about 1.4m 2 Substrate (1.1m×1.3m)), 7.5th generation (corresponding to about 4.29m 2 Substrate (1.95m×2.2m)), 8.5th generation (corresponding to about 5.7m 2 substrate (2.2m×2.5m)) or even the 10th generation (corresponding to about 8.7m 2 Substrate (2.85m×3.05m)). Even higher generations (such as 11th and 12th generations) and corresponding substrate areas can be similarly realized. In addition, the substrate thickness can be from 0.1mm to 1.8mm, in particular about 0.9mm or less, such as 0.7mm or 0.5mm.

[0037] For example, reference Figure 1B According to various embodiments that can be combined with other various embodiments described herein, one or more pivotable carrier transport elements 152 have a rotation axis 155 that is laterally offset from the first transport path T1 by a first distance D1. In addition, the rotation axis 155 of the one or more pivotable carrier transport elements 152 can be laterally offset from the second transport path T2 by a second distance D2. Typically, the second distance D2 is less than the first distance D1 (i.e., D2<D1).

[0038] like Figure 1A and Figure 1B According to various embodiments, which can be combined with other various embodiments described herein, the one or more pivotable carrier transport elements 152 include a carrier holding element 153 extending radially from the rotation axis. Figure 1A and Figure 1B exemplarily indicated in . Typically, one or more pivotable carrier conveying elements 152 include a carrier holding interface 154 for holding the carrier 10, in particular the carrier holding element 153 includes a carrier holding interface 154 for holding the carrier 10. Therefore, it should be understood that the carrier holding element 153 is suitable for coupling to a corresponding coupling element provided at the carrier 10, in particular the carrier holding interface 154 is suitable for coupling to a corresponding coupling element provided at the carrier 10. For example, the carrier holding interface 154 may include a coupling member that allows rotational movement around a vertical axis. Therefore, when the carrier 10 is coupled to one or more pivotable carrier conveying elements 152, the orientation of the carrier can be maintained during the pivoting of the one or more pivotable carrier conveying elements. In particular, during the pivoting, the carrier can remain substantially parallel to the first transport path T1 and / or the second transport path T2.

[0039] For example, reference Figure 2A and 2B According to various embodiments that can be combined with other various embodiments described herein, the one or more pivotable carrier transport elements 152 include a first pivotable carrier transport element 152A having a first rotation axis 155A and a second pivotable carrier transport element 152B having a second rotation axis 155B. The second rotation axis 155B is parallel to the first rotation axis 155A. In particular, as Figure 2A Indicated exemplarily, the first rotation axis 155A and the second rotation axis 155B are spaced apart by a distance D which substantially corresponds to the length L of the carrier 10 .

[0040] According to various embodiments that can be combined with other various embodiments described herein, such as Figure 2AAs indicated by way of example, the first pivotable carrier transport element 152A and the second pivotable carrier transport element 152B may have different structures. In particular, the first pivotable carrier transport element 152A may include a vertically oriented shaft 159 having a vertical extension of at least the height H of the carrier 10. In addition, as Figure 2A As exemplarily indicated, the carrier holding element 153 of the first pivotable carrier transport element 152A may be arranged to be coupled to the upper and lower portions of the carrier, respectively. The second pivotable carrier transport element 152B may include an arm 157 extending radially from the second rotation axis 155B. Figure 2A Thus, the second pivotable carrier transport element 152B may have a hook-like structure, wherein one end of the hook comprises the second rotation axis 155B, and the other end of the hook comprises a carrier holding interface 154 for coupling the carrier to the second pivotable carrier transport element 152B.

[0041] like Figure 2A As shown exemplarily, an upper second pivotable carrier transport element 152BU and a lower second pivotable carrier transport element 152BL may be provided. For example, the upper second pivotable carrier transport element 152BU and the lower second pivotable carrier transport element 152BL may be mounted mirror-symmetrically to each other, in particular mirror-symmetrically to each other relative to a horizontal symmetry plane.

[0042] For example, reference Figure 3A According to various embodiments that can be combined with other various embodiments described herein, one or more pivotable carrier transport elements 152 are pivotally mounted in bearings 156. In particular, as shown in reference Figure 4A As illustratively described, the bearings 156 may be feedthrough bearings, such as disposed in the upper chamber wall and the bottom chamber wall.

[0043] According to various embodiments that can be combined with other various embodiments described herein, such as Figure 3A Schematically shown, at least one of the one or more pivotable carrier transport elements 152 is connected to a drive 158 for pivoting the one or more pivotable carrier transport elements 152 about a rotation axis 155. According to one example, the first pivotable carrier transport element is connected to the drive 158 and the second pivotable carrier transport element 152B may be connected to the drive 158. For example, the upper second pivotable carrier transport element 152BU and / or the lower second pivotable carrier transport element 152BL may be connected to the drive.

[0044] Although not explicitly shown in the figures, it should be understood that according to various embodiments that can be combined with other various embodiments described herein, a synchronization mechanism can be provided for synchronizing the movement of the first pivotable carrier transport element 152A with the movement of the second pivotable carrier transport element 152B. Therefore, an additional synchronization mechanism can be provided to synchronize the movement of the upper second pivotable carrier transport element 152BU with the movement of the lower second pivotable carrier transport element 152BL.

[0045] For example, reference Figure 3B It should be understood that the path switching assembly 150 as described herein is configured to move the carrier laterally to any position within the radial extent of the carrier retaining element 153. For example, Figure 3B As indicated exemplarily, the carriers may be moved to a processing position PR laterally offset from the second transport path T2.

[0046] For example, reference Figure 4A and Figure 4B , depicts a chamber 210 including a path switching assembly 150 according to the present disclosure. For example, the chamber 210 may be a vacuum chamber of a substrate processing system 200 for vertically processing a substrate as described herein. Thus, the chamber 210 may be a vacuum chamber.

[0047] The term "vacuum" may be understood as a technical vacuum having a vacuum pressure of less than, for example, 10 mbar. Typically, the pressure in a vacuum chamber as described herein may be 10 -5 millibar and about 10 -8 mbar, more typically between 10 -5 Millibar and 10 -7 mbar, and even more typically around 10 -6 millibar and about 10 -7 According to some embodiments, the pressure in the vacuum chamber can be considered as the partial pressure of the evaporated material in the vacuum chamber or the total pressure (when there is only evaporated material as the component to be deposited in the vacuum chamber, the two can be approximately the same). In some embodiments, the total pressure in the vacuum chamber can be between about 10 -4 mbar to about 10 -7 mbar range, especially if a second component (such as a gas or the like) is present in the vacuum chamber in addition to the evaporated material. Thus, the vacuum chamber may be a "vacuum deposition chamber", ie a vacuum chamber configured for vacuum deposition.

[0048] According to a plurality of embodiments that can be combined with any other plurality of embodiments described herein, the chamber 210 includes a first transport system 101 disposed along a first transport path T1 for transporting a carrier 10. In addition, the chamber includes a second transport system 102 disposed along a second transport path T2 horizontally offset from the first transport path T1. In the present disclosure, a "transport system" may be understood as a system configured to transport a carrier in a transport direction along a transport path. The term "transport direction" may be understood as a direction in which a carrier is transported along a transport path. Typically, the transport direction may be a substantially horizontal direction.

[0049] In addition, the chamber 210 includes a path switching assembly 150 according to any embodiment described herein. One or more pivotable carrier transport elements 152 of the path switching assembly 150 are pivotally mounted in bearings 156, in particular feed-through bearings, which are provided in at least one of the upper chamber wall 210U and the lower chamber wall 210B.

[0050] According to various embodiments that can be combined with any other embodiments described herein, such as Figure 4B As exemplarily shown, the chamber comprises a processing device 205 laterally offset from the second transport system 102. The processing device 205 may be selected from the group consisting of a deposition source, an evaporation source, a sputtering source or any other processing device, particularly configured for vertical large area substrate processing.

[0051] According to an embodiment, which can be combined with any other embodiment described herein, the first transport system 101 and the second transport system 102 are magnetic levitation systems.

[0052] In the present disclosure, a "magnetic levitation system" may be understood as a system configured to hold an object (e.g., a carrier) in a contactless manner by using magnetic force. In the present disclosure, the term "levitating" or "levitation" refers to a state of an object (e.g., a carrier carrying a substrate or mask) in which the object floats without mechanical contact or support. In addition, moving or transporting an object refers to providing a driving force, such as a force in a direction different from the levitation force, wherein the object moves from one position to another different position, such as a different position along a transport direction. For example, a carrier carrying a substrate or mask may be suspended, i.e., suspended by a force that counteracts gravity, and may move in a direction different from the direction parallel to gravity while being suspended.

[0053] For example, reference Figure 5, describes a substrate processing system 200 for vertically processing a substrate according to the present disclosure. In the present disclosure, a "substrate processing system" may be understood as a system configured for substrate processing, in particular for material deposition on a substrate.

[0054] According to various embodiments, which may be combined with any other embodiments described herein, the substrate processing system 200 includes at least one chamber according to any embodiment described herein, namely the chamber 210. In addition, the substrate processing system 200 may include one or more additional chambers, for example, one or more additional vacuum chambers arranged in series. Thus, the substrate processing system may be an inline processing system. In particular, an "inline processing system" may be understood as an arrangement of two or more modules arranged in series. A module may be or include a chamber.

[0055] In addition, the inline processing system can be configured for deposition of one or more layers on a vertical substrate. Thus, the substrate processing system can be a vertical substrate processing system, i.e., configured for processing a substrate in a substantially vertical substrate orientation. For example, one or more layers can be deposited in a static deposition process or a dynamic deposition process. The deposition process can be a PVD process (e.g., a sputtering process) or a CVD process. Still further, it should be noted that typically the substrate processing system is a vacuum processing system having one or more chambers configured to provide vacuum conditions.

[0056] The substrate processing system may include an atmospheric module. In particular, Figure 5 As shown illustratively, the atmospheric module may include a swing module 201. Typically, the swing module 201 is configured to process a substrate from a horizontal position to a substantially vertical position. In addition, the processing system may include a load lock module 202. The load lock module may also be referred to herein as a "pre-vacuum module".

[0057] In addition, the processing system may include a transfer module 203. The transfer module 203 may be a high vacuum module. Figure 5 As illustratively shown, the substrate processing system 200 typically includes a processing module 204 .

[0058] It should be appreciated that the load lock module 202, the transfer module 203, and the process module 204 are typically configured to provide vacuum conditions within the respective modules.

[0059] like Figure 5 As exemplarily shown, according to various embodiments that can be combined with other various embodiments described herein, the swing module 201 can be connected to the load lock module 202. The load lock module 202 can be connected to the transfer module 203 and the transfer module 203 can be connected to the processing module 204. Figure 5As exemplarily shown, the modules may be connected via a gate valve 115. In the present disclosure, a "gate valve" may be understood as a port that allows vacuum sealing to adjacent modules or chambers.

[0060] The load lock module or chamber can help equalize the pressure difference between modules. For example, atmospheric pressure is applied in one module, and vacuum is applied in a module connected to the one module via the load lock module.

[0061] like Figure 5 As shown exemplarily, the substrate processing system typically includes a first transport system 101 arranged along a first transport path T1 for transporting the carrier 10. In addition, the substrate processing system typically includes a second transport system 102 arranged along a second transport path T2 horizontally offset from the first transport path T1. The first transport path T1 and the second transport path T2 may also be referred to as a first track and a second track.

[0062] For example, the first track can be a track configured to transport an unprocessed substrate, for example, from an entrance of a substrate processing system toward a substrate processing chamber. The second track can be a track configured to transport a processed substrate, for example, from a substrate processing chamber toward an exit of the substrate processing system. The first track and the second track can also be referred to as substrate transport tracks, respectively. "Track" can be understood as a guiding structure, such as a guide rail, for guiding a substrate along a substrate transport direction. Therefore, "track" can be understood as a mechanical structure. In addition, it should be noted that the substrate transport system can be a contactless transport system, for example based on magnetic levitation.

[0063] For example, a first track may be provided for transporting an unprocessed substrate toward a processing module (also referred to as a substrate processing chamber). A second track may be provided for transporting a processed substrate from the processing module toward an atmospheric module. Typically, the second track is laterally displaced relative to the first track. For example, the first track and the second track may be substantially parallel to each other. Thus, it should be understood that the substrate transport system may be configured to transport one or more substrates from an atmospheric module to one or more processing modules via one or more transfer modules, and vice versa.

[0064] like Figure 5 As illustratively shown, according to various embodiments that can be combined with other various embodiments described herein, the processing module 204 includes a chamber 210 having a path switching assembly 150. Although not explicitly shown, it should be understood that the processing system may include one or more additional chambers or modules that include the path switching assembly 150.

[0065] For example, reference Fig. 6A and Figure 6B, describes a method 300 for switching a transport path of a carrier according to the present disclosure. According to various embodiments that can be combined with any other embodiments described herein, the method includes transferring a carrier from a first transport system 101 to one or more pivotable carrier transfer elements 152 (comprising: Fig. 6A 301 in FIG. 30A ), in particular one or more pivotable carrier transport elements of a path switching assembly according to any embodiment described herein. In addition, the method includes pivoting one or more pivotable carrier transport elements 152 from the first transport system 101 to the second transport system 102 (by Fig. 6A In addition, the method includes transferring the carrier from the one or more pivotable carrier transport elements 152 to the second transport system 102 (represented by block 302 in FIG. 1 ). Fig. 6A 303 in FIG.

[0066] According to various embodiments, which can be combined with any other embodiments described herein, handing over the carrier from the first transport system 101 to the one or more pivotable carrier transport elements 152 comprises reducing the magnetic force acting between the first transport system and the carrier. By reducing the magnetic force acting between the first transport system and the carrier, the carrier can be lowered, i.e., the vertical position of the carrier can be lowered. Thus, a mechanical contact between the one or more pivotable carrier transport elements 152 and the carrier can be established, so that the carrier can be transferred from the first transport system 101 to the second transport system 102 by pivoting the one or more pivotable carrier transport elements 152.

[0067] According to various embodiments, which can be combined with any other embodiments described herein, transferring the carrier from the one or more pivotable carrier transport elements 152 to the second transport system 102 includes increasing the magnetic force acting between the second transport system and the carrier. By increasing the magnetic force acting between the second transport system and the carrier, the carrier can be lifted, i.e., the vertical position of the carrier can be lifted. Thus, the mechanical contact between the one or more pivotable carrier transport elements 152 and the carrier can be released.

[0068] It will be appreciated that reducing and / or increasing the magnetic force acting between the transport system and the carrier may be performed by controlling the electromagnets of the transport system, as described herein.

[0069] For example, reference Figure 6B , describes the position sequence of one or more pivotable carrier transport elements 152 for transporting carriers from the first transport system 101 to the second transport system 102. In particular, before the carrier enters the chamber where the path switching assembly is arranged, the carrier holding element 153 of the first pivotable carrier transport element 152A is located at position P3, and the carrier holding element 153 of the second pivotable carrier transport element 152B is located at position Q3. Figure 6BAs shown, positions P3 and Q3 are laterally displaced from the first transport path T1 and the second transport path T2.

[0070] When the carrier holding element 153 of the first pivotable carrier transport element 152A is in position P3 and the carrier holding element 153 of the second pivotable carrier transport element 152B is in position Q3, the carrier can enter the chamber. When the carrier is arranged on the first transport path T1 in the chamber, the carrier holding element 153 of the first pivotable carrier transport element 152A moves from position P3 to position P1. Therefore, the carrier holding element 153 of the second pivotable carrier transport element 152B moves from position Q3 to position Q1, in particular, simultaneously with the carrier holding element 153 of the first pivotable carrier transport element 152A.

[0071] Position P1 and position Q1 are in line with the first transport path T1. Subsequently, the carrier is moved downwards, for example by a few millimeters, in particular by reducing the magnetic force acting between the first transport system and the carrier. Thus, the carrier is transferred from the first transport system to one or more pivotable carrier conveying elements 152, in particular to the carrier holding element 153 of the first pivotable carrier conveying element 152A and the carrier holding element 153 of the second pivotable carrier conveying element 152B, respectively. Then, the carrier holding element 153 of the first pivotable carrier conveying element 152A is moved from position P1 to position P2, and the carrier holding element 153 of the second pivotable carrier conveying element 152B is moved from position Q1 to position Q2. Positions P2 and Q2 are in line with the second transport path T2. Subsequently, the carrier is lifted, for example by a few millimeters, in particular by increasing the magnetic force acting between the second transport system and the carrier. Thus, the carrier is transferred from one or more pivotable carrier conveying elements 152 to the second transport system 102. The carrier may be transported out of the chamber by the second transport system 102 and leave the carrier on the second transport path T2. In this regard, it should be understood that when a carrier leaves the chamber on the second transport path T2, the next carrier may synchronously enter the chamber on the first transport path T1.

[0072] Exemplary references Fig. 7A and Figure 7B , describes a method 400 for processing a substrate according to the present disclosure. According to various embodiments that can be combined with any other embodiments described herein, the method includes transferring a carrier carrying a substrate from a first transport system 101 to one or more pivotable carrier transfer elements 152 (comprising: Fig. 7A 401 in the figure), in particular one or more pivotable carrier transport elements of a path switching assembly according to any embodiment described herein. In addition, the method 400 includes pivoting one or more pivotable carrier transport elements 152 from the first transport system 101 to the processing position PR (represented by Fig. 7A In addition, the method 400 includes processing the substrate (represented by block 402 in FIG. 1 ) by using the processing device 205. Fig. 7A 403 in FIG.

[0073] For example, reference Figure 7B , it should be understood that the method 400 for processing a substrate may include the method 300 for switching a transport path. In particular, it should be understood that after the carrier is transferred from the first transport system 101 to the one or more pivotable carrier transport elements 152 at positions P1 and Q1, the one or more pivotable carrier transport elements 152 may be moved from positions P1 and Q1 to positions P4 and Q4. Positions P4 and Q4 are laterally offset relative to the second transport path T2. Typically, positions P4 and Q4 are on a line parallel to the second transport path T2. The line extending between positions P4 and Q4 may be referred to as a processing position PR. After processing, the carrier may be moved from the processing position PR to the second transport path T2 and transferred to the second transport system 102.

[0074] For example, reference Figure 8 , describing a method 500 during manufacturing according to various embodiments of the present disclosure. According to various embodiments that may be combined with any other embodiments described herein, the method 500 includes using a path switching component 150 (composed of) according to any embodiment described herein. Figure 8 501 in FIG. 1 ), chamber 210 (represented by Figure 8 502 in FIG. 1 ), a substrate processing system 200 (represented by Figure 8 ) and the method 400 for processing a substrate according to any embodiment described herein (represented by block 503 in FIG. 5 ) Figure 8 Box 504 in represents at least one of ).

[0075] In view of the above, it should be understood that, compared with the prior art, multiple embodiments of the present disclosure beneficially provide a path switching component and a method for the path switching component, which provides a shorter cycle time, lower cost and simpler implementation. Therefore, by using the path switching component and method as described herein in a substrate processing system, especially in a processing chamber of a substrate processing system, the cycle time and cost of the processing system can be reduced.

[0076] While the foregoing is directed to various embodiments, various other and further embodiments may be envisaged without departing from the basic scope, and the scope is to be determined by the scope of the appended claims.

Claims

1. A path switching component (150), the path switching component (150) comprising one or more pivotable carrier conveying elements (152), the one or more pivotable carrier conveying elements being used to move a carrier (10) from a first transport path (T1) to a laterally offset second transport path (T2) in a path switching direction (S), the one or more pivotable carrier conveying elements (152) having a vertical rotation axis (155), and the one or more pivotable carrier conveying elements (152) comprising a carrier holding interface (154) for holding the carrier (10), the carrier holding interface (154) having a coupling member allowing rotational movement around the vertical axis, the one or more pivotable carrier conveying elements (152) comprising a first pivotable carrier conveying element (152A) having a first rotation axis (155A) and a second pivotable carrier conveying element (152B) having a second rotation axis (155B) parallel to the first rotation axis (155A).

2. The path switching assembly (150) of claim 1, wherein the rotation axis (155) is laterally offset from the first transport path (T1) by a first distance (D1).

3. The path switching assembly (150) of claim 2, wherein the rotation axis (155) of the one or more pivotable carrier conveying elements (152) is laterally offset from the second transport path (T2) by a second distance (D2), and the second distance (D2) is smaller than the first distance (D1).

4. The path switching assembly (150) of any one of claims 1 to 3, the one or more pivotable carrier transport elements (152) comprising a carrier retaining element (153) extending radially from the rotation axis.

5. The path switching assembly (150) of any one of claims 1 to 3, wherein the one or more pivotable carrier transport elements (152) are pivotally mounted in bearings (156).

6. The path switching assembly (150) of any one of claims 1 to 3, wherein the one or more pivotable carrier transport elements (152) are pivotally mounted in a feed-through bearing.

7. The path switching assembly (150) of any one of claims 1 to 3, wherein at least one of the one or more carrier transport elements (152) is connected to a drive (158) for rotating the one or more carrier transport elements (152) around the rotation axis (155).

8. The path switching assembly (150) of claim 1, wherein the first rotation axis (155A) and the second rotation axis (155B) are spaced apart by a distance (D) substantially corresponding to a length (L) of the carrier (10).

9. The path switching assembly (150) according to any one of claims 1 to 3, wherein the path switching direction (S) is perpendicular to a transport direction (T) of the carrier (10).

10. The path switching assembly (150) of claim 9, wherein the path switching direction (S) and the transport direction (T) span a horizontal plane.

11. A chamber (210), comprising - a first transport system (101), which is arranged along a first transport path (T1) for transporting a carrier (10); - a second transport system (102) arranged along a second transport path (T2) horizontally offset from the first transport path (T1); and - A path switching assembly (150) as claimed in any one of claims 1 to 10, wherein the one or more pivotable carrier transport elements (152) are pivotally mounted in bearings (156) arranged in at least one of the upper chamber wall (210U) and the bottom chamber wall (210B).

12. The chamber (210) of claim 11, wherein the bearing (156) is a feed-through bearing.

13. The chamber (210) of claim 11, further comprising a handling device (205) laterally offset from the second transport system (102).

14. The chamber (210) according to any one of claims 11 to 13, wherein the first transport system (101) and the second transport system (102) are magnetic levitation systems.

15. A substrate processing system (200) for vertically processing a substrate, comprising at least one chamber according to any one of claims 11 to 14, the chamber being a vacuum chamber.

16. The substrate processing system (200) of claim 15, wherein the at least one chamber is a vacuum chamber.

17. A method for switching a transport path of a carrier, comprising: - handing over the carrier from the first transport system (101) to one or more pivotable carrier transfer elements (152) of a path switching assembly according to any one of claims 1 to 10; - pivoting the one or more pivotable carrier transport elements (152) from the first transport system (101) to a second transport system (102); and - transferring the carrier from the one or more pivotable carrier transport elements (152) to the second transport system (102).

18. A method for processing a substrate, comprising: - handing over the carrier carrying the substrate from the first transport system (101) to one or more pivotable carrier transfer elements (152) of a path switching assembly according to any one of claims 1 to 10; - pivoting the one or more pivotable carrier transport elements (152) from the first transport system (101) to a processing position (PR); and - processing the substrate by using a processing device (205).

19. A method of manufacturing a device, comprising using at least one of the path switching assembly (150) of any one of claims 1 to 10, the chamber (210) of any one of claims 11 to 14, the processing system (200) of claim 15 or 16, and the method of processing a substrate of claim 18.

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