Optical fingerprint identification chip and electronic device

Abstract

The application discloses an optical fingerprint identification chip and an electronic device. The optical fingerprint identification chip comprises a light-transmitting cover plate, a substrate and encapsulating glue. The substrate is provided with a touch component, a light-emitting component and a fingerprint identification die close to the surface of the light-transmitting cover plate. The touch component is used for responding to the touch operation of a finger on the light-transmitting cover plate and generating a trigger signal. The light-emitting component is used for emitting light to the light-transmitting cover plate according to the trigger signal. The fingerprint identification die is used for receiving the light reflected by the finger on the light-transmitting cover plate according to the trigger signal to perform fingerprint detection. The encapsulating glue is arranged between the light-transmitting cover plate and the substrate and connects the light-transmitting cover plate and the substrate. The optical fingerprint identification chip provided by the application is integrally packaged, and when the electronic device is assembled or repaired, the damage of the fingerprint identification die caused by accidental collision can be avoided, and the assembly process difficulty of the electronic device is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the fingerprint identification technical field, especially to an optical fingerprint identification chip and electronic equipment. BACKGROUND

[0002] The ultra-thin optical fingerprint is a scheme adopted by many 5G mobile phones on the market at present, which can save space for the battery and thus improve the battery capacity due to the ultra-thin design without occupying the small board space.

[0003] In the related art, the fingerprint identification crystal is placed between the screen and the middle frame, and the four sides of the exposed fingerprint identification crystal need to be sealed with sealing foam.

[0004] However, the assembly process of the fingerprint identification crystal is complex during the assembly of the mobile phone, and the exposed fingerprint identification crystal is easy to be damaged. SUMMARY

[0005] Therefore, the present application provides an optical fingerprint identification chip and electronic equipment, which at least partially solve the above-mentioned problems.

[0006] The present application provides an optical fingerprint identification chip, characterized in that it comprises:

[0007] A light-transmitting cover plate;

[0008] A substrate, which is provided with a touch component, a light-emitting piece and a fingerprint identification crystal close to the surface of the light-transmitting cover plate, the touch component is used to respond to the touch operation of the finger located on the light-transmitting cover plate and generate a trigger signal, the light-emitting piece is used to emit light to the light-transmitting cover plate in response to the trigger signal, and the fingerprint identification crystal is used to receive the light reflected by the finger located on the light-transmitting cover plate in response to the trigger signal to perform fingerprint detection;

[0009] An encapsulation glue, which is arranged between the light-transmitting cover plate and the substrate and connects the light-transmitting cover plate and the substrate.

[0010] As an optional way that can be implemented, the light-emitting piece and the fingerprint identification crystal are arranged at a distance of 0.5mm-5mm.

[0011] As an optional way that can be implemented, at least two light-emitting pieces are provided, and the fingerprint identification crystal is located between the two adjacent light-emitting pieces.

[0012] As an optional way that can be implemented, the encapsulation glue covers the touch component, the light-emitting piece and the fingerprint identification crystal.

[0013] As an optional way that can be implemented, the transparency of the encapsulation glue is greater than or equal to 90%.

[0014] As an implementable optional mode, the touch component is arranged along the length direction of the fingerprint recognition wafer.

[0015] As an implementable optional mode, the touch component surrounds the fingerprint recognition wafer.

[0016] As an implementable optional mode, the touch component partially surrounds the fingerprint recognition wafer.

[0017] As an implementable optional mode, the touch component comprises two touch pieces, and the two touch pieces are arranged on two sides of the fingerprint recognition wafer respectively.

[0018] As an implementable optional mode, the thickness of the substrate is greater than or equal to 0.1 mm.

[0019] As an implementable optional mode, the thickness of the fingerprint recognition wafer is less than or equal to 0.2 mm.

[0020] As an implementable optional mode, the thickness of the light-transmitting cover plate is greater than or equal to 0.1 mm.

[0021] The application provides an electronic device comprising the optical fingerprint recognition chip.

[0022] As an implementable optional mode, a middle frame is further included, and the optical fingerprint recognition chip is arranged on the side edge of the middle frame.

[0023] As an implementable optional mode, the side edge of the middle frame is provided with a mounting hole, and the optical fingerprint recognition chip is embedded in the mounting hole.

[0024] As an implementable optional mode, a flexible circuit board is further included, and the flexible circuit board is arranged on the substrate and electrically connected with the substrate.

[0025] As an implementable optional mode, a reinforcing plate is further included, and the reinforcing plate is arranged on the flexible circuit board.

[0026] The optical fingerprint recognition chip provided by the application is integrally packaged, has the functions of triggering fingerprint recognition, self-illumination and fingerprint recognition, and can avoid damage of the fingerprint recognition wafer caused by accidental collision when assembling or repairing the electronic device, thereby reducing the difficulty of the assembly process of the electronic device and simplifying the assembly process of the electronic device.

[0027] Further, the light-emitting piece and the fingerprint recognition wafer are arranged apart from each other, which helps to reduce the thickness of the optical fingerprint recognition chip.

[0028] Further, the fingerprint recognition wafer is located between the two adjacent light-emitting pieces, which helps the fingerprint recognition wafer to obtain good finger fingerprint information.

[0029] Further, the touch component is arranged along the length direction of the fingerprint recognition wafer, which helps to improve the sensitivity of the optical fingerprint recognition chip. BRIEF DESCRIPTION OF DRAWINGS

[0030] Other features, objects, and advantages of the application will become more apparent from the following detailed description of non-limiting embodiments thereof as read in conjunction with the accompanying drawings:

[0031] Figure 1 is a structural schematic diagram of an optical fingerprint recognition chip according to an embodiment of the application;

[0032] Figure 2 is a structural schematic diagram of an optical fingerprint recognition chip according to an embodiment of the application; Figure 1 is an A-A direction cross-sectional view of

[0033] Figure 3 is another A-A direction cross-sectional view of Figure 1

[0034] Figure 4 is still another A-A direction cross-sectional view of Figure 1

[0035] Figure 5 is an exploded view of an optical fingerprint recognition chip according to an embodiment of the application;

[0036] Figure 6 is a working principle diagram of an optical fingerprint recognition chip according to an embodiment of the application;

[0037] Figure 7 is a structural schematic diagram of the connection among an optical fingerprint recognition chip, a flexible circuit board and a reinforcing plate of an electronic device according to an embodiment of the application;

[0038] Figure 8 is a middle frame structural schematic diagram of an electronic device according to an embodiment of the application;

[0039] Figure 9 is a working flow diagram of an optical fingerprint recognition chip according to an embodiment of the application. DETAILED DESCRIPTION

[0040] The application will be further described below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the related application, but not to limit the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the application. In addition, it should be noted that, for the convenience of description, only the parts related to the application are shown in the drawings.

[0041] ​​In the description of the present application, it needs to be understood that the terms "radial", "axial", "upper", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In the description of the present application, unless otherwise specified and limited, the terms "mounting", "setting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrally connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0042] In the description of the present application, it needs to be explained that, unless otherwise explicitly specified and limited, the terms "mounting", "setting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrally connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0043] Reference Figure 1 , shows an optical fingerprint identification chip suitable for electronic devices such as mobile phones, tablets and smart wearable devices.

[0044] Reference Figure 1 The optical fingerprint identification chip includes a light-transmitting cover plate 100, a substrate 200 and a packaging glue 300.

[0045] The substrate 200 is provided with a touch component 23, a light-emitting piece 22 and a fingerprint identification die 21 close to the surface of the light-transmitting cover plate 100, the touch component 23 is used to generate a trigger signal in response to the touch operation of the finger located on the light-transmitting cover plate 100; the light-emitting piece 22 is used to emit light to the light-transmitting cover plate 100 in response to the trigger signal; the fingerprint identification die 21 is used to receive the light reflected by the finger located on the light-transmitting cover plate 100 to perform fingerprint detection in response to the trigger signal.

[0046] The packaging glue 300 is arranged between the light-transmitting cover plate 100 and the substrate 200, and connects the light-transmitting cover plate 100 and the substrate 200.

[0047] In the present embodiment, the light-transmitting cover plate 100 can be a glass plate, a tempered glass plate and the like, and its main material can be silicon dioxide.

[0048] In the embodiment, the substrate 200 comprises a first surface and a second surface arranged oppositely, and the first surface is close to the light-transmitting cover plate 100. The touch component 23, the light-emitting component 22 and the fingerprint identification chip 21 are arranged on the first surface of the substrate. The substrate 200 is a printed circuit board (PCB), which can provide power for the touch component 23, the light-emitting component 22 and the fingerprint identification chip 21, and can also transmit signals to the touch component 23, the light-emitting component 22 and the fingerprint identification chip 21. The touch component 23 can be a touch sensor, for example, a TX (transport) / RX (receive) module made of copper on the substrate. The light-emitting component 22 can be a low-light LED. The control system of the electronic device can be electrically connected to the touch component 23, the light-emitting component 22 and the fingerprint identification chip 21, respectively.

[0049] In the embodiment, the encapsulating glue 300 is an optical glue, which is colorless and transparent, has a light transmittance of more than 90%, good bonding strength, can be cured at room temperature or medium temperature, and has a small curing shrinkage. The encapsulating glue 300 can be an organic silicone glue, an acrylic resin, an unsaturated polyester, a polyurethane, an epoxy resin, etc. The encapsulating glue 300 connects the light-transmitting cover plate 100 and the substrate 200, and encapsulates the light-transmitting cover plate 100, the substrate 200, the touch component 23, the light-emitting component 22 and the fingerprint identification chip 21 into an integrated module.

[0050] Reference Figure 9 and Figure 6 , Figure 9 is a schematic diagram of the working process of the optical fingerprint identification chip, Figure 6 is a schematic diagram of the working principle of the optical fingerprint identification chip. When performing fingerprint detection, when the finger touches the light-transmitting cover plate 100, the touch component 23 generates a trigger signal in response to the touch operation of the finger and sends the trigger signal to the control system. The control system receives the trigger signal, generates a first control signal and a second control signal, sends the first control signal to the light-emitting component 22, and sends the second control signal to the fingerprint identification chip 21. The light-emitting component 22 receives the first control signal, and emits light to the light-transmitting cover plate 100. The fingerprint identification chip 21 receives the second control signal, starts to work, receives the light reflected by the finger, converts the light signal into an electric signal to generate a fingerprint image, and further sends the fingerprint image to the control system. The control system receives the above-mentioned fingerprint image, performs image processing to obtain a fingerprint signal, and identifies the fingerprint signal through an algorithm. When the identification is correct, it indicates that the finger successfully unlocks the electronic device. When the identification is incorrect, it indicates that the finger fails to unlock the electronic device.

[0051] The optical fingerprint recognition chip integrated package of the embodiment has the functions of triggering fingerprint recognition, self-luminous and fingerprint recognition. When assembling or repairing electronic devices, the optical fingerprint recognition chip integrated package can avoid damage of the fingerprint recognition die 21 caused by accidental collision. In addition, the optical fingerprint recognition chip integrated package reduces the difficulty of the electronic device assembly process and simplifies the electronic device assembly process, thereby improving the assembly efficiency of the electronic device and reducing the production cost.

[0052] In some preferred embodiments, the light emitting piece 22 is arranged at a distance of 0.5mm-5mm from the fingerprint recognition die 21.

[0053] Reference Figure 2 and Figure 6 In the embodiment, the fingerprint recognition die 21 is rectangular, and the fingerprint recognition die 21 is arranged at the middle position of the substrate 200. The light emitting piece 22 can be arranged at a distance d1 from the short side of the fingerprint recognition die 21, so that the light emitted by the light emitting piece 22 can be acquired by the fingerprint recognition die 21 after being reflected by the finger, wherein d1=1mm. It should be noted that d1=1mm is selected in combination with the actual production process. In some embodiments, d1 can also be 0.5mm, or d1 can also be 5mm. The embodiment helps to increase the incident angle and the reflection angle, so that the incident angle and the reflection angle are both obtuse angles, thereby reducing the thickness of the optical fingerprint recognition chip.

[0054] In some embodiments, the light emitting piece 22 can be arranged at a distance d2 from the long side of the fingerprint recognition die 21, so that the light emitted by the light emitting piece 22 can be acquired by the fingerprint recognition die 21 after being reflected by the finger.

[0055] In some preferred embodiments, the optical fingerprint recognition chip is provided with at least two light emitting pieces 22, and the fingerprint recognition die 21 is located between the two adjacent light emitting pieces 22.

[0056] Reference Figure 2 and Figure 6 In the embodiment, the fingerprint recognition die 21 is rectangular, and the fingerprint recognition die 21 is arranged at the middle position of the substrate 200. Two light emitting pieces 22 are arranged along the length direction of the fingerprint recognition die 21, one light emitting piece 22 is arranged at a distance d1 from one short side of the fingerprint recognition die 21, and the other light emitting piece 22 is arranged at a distance d1 from the other short side of the fingerprint recognition die 21.

[0057] The embodiment helps the fingerprint recognition die 21 to acquire good finger fingerprint information and ensure the successful unlocking of the electronic device by the finger.

[0058] In some preferred embodiments, the touch assembly 23 is arranged along the length direction of the fingerprint recognition die 21.

[0059] ReferenceFigure 2 In the embodiment, the fingerprint identification die 21 is rectangular, and the fingerprint identification die 21 is arranged at the middle position of the substrate 200. Two light emitting components 22 are arranged along the length direction of the fingerprint identification die 21, one light emitting component 22 is arranged at a distance d1 from one short side of the fingerprint identification die 21, and the other light emitting component 22 is arranged at a distance d1 from the other short side of the fingerprint identification die 21. The touch assembly 23 includes two touch components, and the touch components are in a strip shape. The two touch components are arranged between the two light emitting components 22 along the length direction of the fingerprint identification die 21 and are arranged at two sides of the fingerprint identification die 21, respectively.

[0060] The touch assembly 23 of the embodiment enables the optical fingerprint identification chip to quickly respond to the touch operation of the finger, thereby improving the sensitivity of the optical fingerprint identification chip.

[0061] Reference Figure 3 In some embodiments, the touch assembly 23 is in a U shape, includes three touch components, and the three touch components are sequentially connected in a head-to-tail manner. The touch assembly 23 partially surrounds the fingerprint identification die 21.

[0062] Reference Figure 4 In some embodiments, the touch assembly 23 is in a waist-shaped ring, includes four touch components, and the four touch components are sequentially connected in a head-to-tail manner. The touch assembly 23 completely surrounds the fingerprint identification die 21.

[0063] In some preferred embodiments, the packaging glue 300 covers the touch assembly 23, the light emitting component 22, and the fingerprint identification die 21.

[0064] Reference Figure 1 and Figure 5 In the embodiment, the fingerprint identification die 21 is rectangular, and the fingerprint identification die 21 is arranged at the middle position of the substrate 200. Two light emitting components 22 are arranged along the length direction of the fingerprint identification die 21, one light emitting component 22 is arranged at a distance d1 from one short side of the fingerprint identification die 21, and the other light emitting component 22 is arranged at a distance d1 from the other short side of the fingerprint identification die 21. The touch assembly 23 includes two touch components, and the touch components are in a strip shape. The two touch components are arranged between the two light emitting components 22 along the length direction of the fingerprint identification die 21 and are arranged at two sides of the fingerprint identification die 21, respectively.

[0065] The packaging glue 300 completely covers the touch assembly 23, the light emitting component 22, and the fingerprint identification die 21, so that the incident light or the reflected light propagates in the same medium, thereby avoiding the light energy damage caused by light refraction.

[0066] Reference Figure 8 In some preferred embodiments, the thickness of the substrate 200 is greater than or equal to 0.1 mm.

[0067] In the embodiment, the thickness of the substrate 200 is 0.1 mm, which helps to reduce the thickness of the optical fingerprint recognition chip, and the thickness of the optical fingerprint recognition chip can be 1 mm. When the optical fingerprint recognition chip is installed on the side of the middle frame 600 of the mobile phone, the side of the middle frame 600 is provided with a mounting hole 64, and the depth of the mounting hole 64 is equivalent to the thickness of the optical fingerprint recognition chip. The middle frame 600 of different types of mobile phones corresponds to different depths of the mounting hole 64, and by adjusting the thickness of the substrate 200, the optical fingerprint recognition chip can be embedded in different mounting holes 64, thereby adapting to various types of mobile phones.

[0068] In some preferred embodiments, the thickness of the fingerprint recognition wafer 21 is less than or equal to 0.2 mm.

[0069] Reference Figure 8 , the thickness of the fingerprint recognition wafer 21 is 0.1 mm, which helps to reduce the thickness of the optical fingerprint recognition chip, and the thickness of the optical fingerprint recognition chip can be 1 mm. When the optical fingerprint recognition chip is installed on the side of the middle frame 600 of the mobile phone, the side of the middle frame 600 is provided with a mounting hole 64, and the depth of the mounting hole 64 is equivalent to the thickness of the optical fingerprint recognition chip. The middle frame 600 of different types of mobile phones corresponds to different depths of the mounting hole 64, and by adjusting the thickness of the fingerprint recognition wafer 21, the optical fingerprint recognition chip can be embedded in different mounting holes 64, thereby adapting to various types of mobile phones.

[0070] In some preferred embodiments, the thickness of the light-transmitting cover plate 100 is greater than or equal to 0.1 mm.

[0071] Reference Figure 8 , the thickness of the light-transmitting cover plate 100 is 0.1 mm, which helps to reduce the thickness of the optical fingerprint recognition chip, and the thickness of the optical fingerprint recognition chip can be 1 mm. When the optical fingerprint recognition chip is installed on the side of the middle frame 600 of the mobile phone, the side of the middle frame 600 is provided with a mounting hole 64, and the depth of the mounting hole 64 is equivalent to the thickness of the optical fingerprint recognition chip. The middle frame 600 of different types of mobile phones corresponds to different depths of the mounting hole 64, and by adjusting the thickness of the light-transmitting cover plate 100, the optical fingerprint recognition chip can be embedded in different mounting holes 64, thereby adapting to various types of mobile phones.

[0072] In some preferred embodiments, the cross section of the optical fingerprint recognition chip can be circular, elliptical, rectangular, or waist-shaped, etc. The shape of the optical fingerprint recognition chip matches the shape of the mounting hole 64, so that the optical fingerprint recognition chip can be embedded in the mounting hole 64. It should be noted that "cross section" here refers to the cross section parallel to the substrate 200 or the light-transmitting cover plate 100.

[0073] In some preferred embodiments, the optical fingerprint identification chip adopts EMC package, and the plastic sealing material is thermosetting epoxy resin. The thermosetting epoxy resin material itself has very good light resistance and heat resistance, and ensures a longer service life under the same packaging conditions and power.

[0074] An electronic device includes a flexible circuit board 400 and the optical fingerprint identification chip.

[0075] In the embodiment, the optical fingerprint identification chip is arranged on the flexible circuit board (FPC) 400, and the optical fingerprint identification chip is electrically connected with the flexible circuit board 400.

[0076] Reference Figure 7 In particular, the optical fingerprint identification chip includes the light-transmitting cover plate 100, the encapsulating glue 300 and the substrate 200 arranged in sequence. The touch component 23, the light-emitting piece 22 and the fingerprint identification die 21 are arranged on the surface of the substrate 200 close to the light-transmitting cover plate 100. The encapsulating glue 300 is arranged between the light-transmitting cover plate 100 and the substrate 200, and connects the light-transmitting cover plate 100 and the substrate 200, so as to realize the packaging of the optical fingerprint identification chip. The flexible circuit board 400 is arranged on the substrate 200, and the flexible circuit board 400 is electrically connected with the substrate 200.

[0077] The flexible circuit board 400 electrically connects the optical fingerprint identification chip with the control system of the electronic device. The flexible circuit board 400 can provide electric energy to the optical fingerprint identification chip, and the flexible circuit board 400 can also transmit signals to the optical fingerprint identification chip and the control system of the electronic device.

[0078] In some preferred embodiments, the electronic device further includes a reinforcing plate 500, and the reinforcing plate 500 is arranged on the flexible circuit board 400.

[0079] In the embodiment, the optical fingerprint identification chip, the flexible circuit board 400 and the reinforcing plate 500 are arranged in sequence. The optical fingerprint identification chip is arranged on the upper surface of the flexible circuit board 400, and the reinforcing plate 500 is arranged on the lower surface of the flexible circuit board 400.

[0080] Reference Figure 7 In particular, the optical fingerprint identification chip includes the light-transmitting cover plate 100, the encapsulating glue 300 and the substrate 200 arranged in sequence. The touch component 23, the light-emitting piece 22 and the fingerprint identification die 21 are arranged on the surface of the substrate 200 close to the light-transmitting cover plate 100. The encapsulating glue 300 is arranged between the light-transmitting cover plate 100 and the substrate 200, and connects the light-transmitting cover plate 100 and the substrate 200, so as to realize the packaging of the optical fingerprint identification chip. The upper surface of the flexible circuit board 400 is arranged on the substrate 200, and the flexible circuit board 400 is electrically connected with the substrate 200. The reinforcing plate 500 is arranged on the lower surface of the flexible circuit board 400.

[0081] The reinforcing plate 500 is an ultra-thin steel sheet with a thickness of about 0.1 mm, thin in thickness and high in strength. The embodiment improves the strength of the optical fingerprint recognition chip under the premise of ensuring the overall thickness of the electronic device, which helps to ensure the yield and service life of the electronic device.

[0082] In some preferred embodiments, the electronic device further comprises a middle frame 600, and the side of the middle frame 600 is provided with a mounting hole 64, and the optical fingerprint recognition chip is embedded in the mounting hole 64.

[0083] Reference Figure 8 In the embodiment, the electronic device is a mobile phone. The middle frame 600 of the mobile phone comprises a first surface and a second surface arranged oppositely, and the first surface is provided with a first recess 61, a second recess 62 and a third recess 63 in sequence. The first recess 61 is used for mounting a mainboard, the second recess 62 is used for mounting a battery, and the third recess 63 is used for mounting a small plate, a sound element and the like. A fourth recess (shielded, not shown) is arranged on the second surface, and the fourth recess is used for mounting a display screen. The side of the middle frame 600 is provided with a mounting hole 64, and the optical fingerprint recognition module is embedded in the mounting hole 64.

[0084] In the related art, the optical fingerprint recognition module is arranged in the fourth recess and located below the display screen. Compared with the related art, the embodiment is beneficial to reduce the overall thickness of the electronic device.

[0085] In some embodiments, the optical fingerprint recognition module can also be arranged on the first surface of the electronic device.

[0086] In some embodiments, the optical fingerprint recognition module is arranged on the side of the middle frame 600, and the optical fingerprint recognition module is integrally designed with a power key located on the side of the middle frame 600.

[0087] The above embodiments only illustrate the technical solutions of the application and do not limit the application. Although the application is described in detail with reference to the embodiments, those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the application.

Claims

1. An optical fingerprint identification chip, characterized in that, include: Translucent cover plate; The substrate includes a first surface and a second surface disposed opposite to each other. The first surface is close to the light-transmitting cover plate and the two are separated. A touch component, a light-emitting element and a fingerprint recognition chip are disposed on the first surface of the substrate. The touch component is used to generate a trigger signal in response to the touch operation of a finger located on the light-transmitting cover plate. The light-emitting element is used to emit light toward the light-transmitting cover plate in response to the trigger signal; The fingerprint recognition chip is used to receive light reflected from a finger located on the light-transmitting cover for fingerprint detection. An encapsulating adhesive is disposed between the light-transmitting cover and the substrate to encapsulate the light-transmitting cover, the substrate, the touch component, the light-emitting element, and the fingerprint recognition chip into a single module. The fingerprint recognition chip is rectangular and is located in the middle of the substrate. Two light-emitting elements are arranged along the length of the fingerprint recognition chip. One light-emitting element is positioned at a distance d1 from one short side of the fingerprint recognition chip, and the other light-emitting element is positioned at a distance d1 from the other short side of the fingerprint recognition chip. The touch assembly includes two touch elements, which are strip-shaped. The two touch elements extend along the length of the fingerprint recognition chip and are laid between the two light-emitting elements, and are respectively located on both sides of the fingerprint recognition chip. The touch assembly surrounds the fingerprint recognition chip, or the touch assembly partially surrounds the fingerprint recognition chip.

2. The optical fingerprint identification chip according to claim 1, characterized in that, The light-emitting element is positioned 0.5mm to 5mm away from the fingerprint recognition chip.

3. The optical fingerprint identification chip according to claim 2, characterized in that, The optical fingerprint recognition chip is provided with at least two light-emitting elements, and the fingerprint recognition chip is located between two adjacent light-emitting elements.

4. The optical fingerprint identification chip according to claim 1, characterized in that, The encapsulating adhesive covers the touch component, the light-emitting element, and the fingerprint recognition chip.

5. The optical fingerprint identification chip according to claim 4, characterized in that, The transparency of the encapsulating adhesive is greater than or equal to 90%.

6. The optical fingerprint identification chip according to claim 1, characterized in that, The touch component is arranged along the length of the fingerprint recognition chip.

7. The optical fingerprint identification chip according to claim 1, characterized in that, The touch component includes two touch elements, which are respectively disposed on both sides of the fingerprint recognition chip.

8. The optical fingerprint identification chip according to any one of claims 1-7, characterized in that, The thickness of the substrate is greater than or equal to 0.1 mm.

9. The optical fingerprint identification chip according to any one of claims 1-7, characterized in that, The thickness of the fingerprint recognition chip is less than or equal to 0.2 mm.

10. The optical fingerprint identification chip according to any one of claims 1-7, characterized in that, The thickness of the light-transmitting cover is greater than or equal to 0.1 mm.

11. An electronic device, comprising: include: The optical fingerprint recognition chip according to any one of claims 1 to 10.

12. The electronic device of claim 11, wherein, It also includes a mid-frame, with the optical fingerprint recognition chip disposed on the side of the mid-frame.

13. The electronic device of claim 12, wherein, The side of the mid-frame is provided with a mounting hole, and the optical fingerprint recognition chip is embedded in the mounting hole.

14. The electronic device of claim 11, wherein, The electronic device further includes a flexible circuit board disposed on the substrate and electrically connected to the substrate.

15. The electronic device of claim 14, wherein, The electronic device also includes a reinforcing plate, which is attached to the flexible circuit board.

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