Die bonder with die bonder module

Abstract

The application relates to a die bonder with a die bonding module, comprising: a mounting frame module; a dispensing module, which is arranged on the mounting frame module; a material waiting module, which is arranged on the mounting frame module; a die bonding module, which is arranged on the mounting frame module, and the die bonding module comprises a die bonding head structure and a mechanical arm structure, the mechanical arm is mounted on the mounting frame module, the die bonding head structure is mounted on the mechanical arm structure, and the mechanical arm structure can drive the die bonding head structure to move; a material discharging module, which is arranged on the mounting frame module; and a conveying module, which is arranged on the mounting frame module and can drive a carrier plate to move among the dispensing module, the material waiting module, the die bonding module and the material discharging module. The technical scheme of the application effectively solves the problems of low integration and low work efficiency of the die bonder in the prior art.

Description

Technical Field

[0001] This application relates to the technical field of die bonders, and more particularly to a die bonder with a die bonder module. Background Technology

[0002] The rapid development of modern electronic information technology has placed increasingly higher demands on electronic products, requiring them to be miniaturized, portable, multifunctional, highly reliable, and low-cost. Currently, electronic packaging, in order to meet the requirements of various electronic products, has gradually shed its subordinate position as a post-process in microelectronics manufacturing and become relatively independent. Various packaging technologies have been developed to address the specific requirements of different electronic products, resulting in a large number of new theories, materials, processes, equipment, and electronic products. Electronic packaging and testing technologies, along with chip design and manufacturing, are jointly driving the development of the information society.

[0003] In existing technologies, the die bonder in electronic packaging and testing is designed with separate dispensing and die bonding components. For example, the dispensing structure is located at one position, the die bonding structure is located at another position, and the carrier structure is positioned between the dispensing and die bonding structures. This structure is not conducive to integration and has low work efficiency. Summary of the Invention

[0004] This application provides a die bonder with a die bonder module to solve the problems of low integration and low working efficiency of existing die bonders.

[0005] To achieve the above objectives, this application provides a die bonder with a die bonder module, comprising: a mounting frame module; a dispensing module disposed on the mounting frame module; a waiting module disposed on the mounting frame module; a die bonder module disposed on the mounting frame module, the die bonder module including a die bonder head structure and a robotic arm structure, the robotic arm being mounted on the mounting frame module, the die bonder head structure being mounted on the robotic arm structure, and the robotic arm structure being capable of driving the die bonder head structure to move; a feeding module disposed on the mounting frame module; and a conveying module disposed on the mounting frame module and capable of driving the carrier board to move between the dispensing module, the waiting module, the die bonder module, and the feeding module.

[0006] Furthermore, the mounting bracket module includes a base assembly, a guide rail assembly, and a flow channel assembly. The guide rail assembly is fixed on the base assembly, the flow channel assembly is movably mounted on the guide rail assembly, and the carrier plate is supported on the flow channel assembly.

[0007] Furthermore, the flow channel assembly includes a limiting support frame structure, which includes a first limiting support plate and a second limiting support plate. The first limiting support plate and the second limiting support plate have an adjustable predetermined distance to form a flow channel. Both the first limiting support plate and the second limiting support plate extend along the moving direction of the carrier plate.

[0008] Furthermore, the first limiting support plate includes a first limiting plate and a first support plate. The first support plate is located on the side of the first limiting plate closer to the second limiting support plate. The upper surface of the first support plate is lower than the upper surface of the first limiting plate to form a first stepped surface. The second limiting support plate includes a second limiting plate and a second support plate. The second support plate is located on the side of the second limiting plate closer to the first limiting support plate. The upper surface of the second support plate is lower than the upper surface of the second limiting plate to form a second stepped surface.

[0009] Furthermore, the flow channel assembly also includes a flow channel driving structure, which is connected to the limiting support frame structure to drive the limiting support frame structure to change the predetermined distance of the flow channel.

[0010] Furthermore, the flow channel drive structure includes a first motor, a lead screw, and two connecting parts. The output shaft of the first motor is connected to the lead screw, and the two ends of the lead screw are respectively connected to the two connecting parts by threads. The first limiting support plate and the second limiting support plate are respectively fixedly connected to the two connecting parts.

[0011] Furthermore, the die bonder also includes a first pressure plate structure and a first top plate structure. The first pressure plate structure is fixedly connected to the limiting support frame, and the first top plate structure is set on the mounting frame module. The first pressure plate structure and the first top plate structure are set correspondingly, and the first pressure plate structure cooperates with the dispensing module.

[0012] Furthermore, the first top plate structure includes a second motor, a first cam, a first transmission part, and a first top plate. The second motor is connected to the first cam to drive the first cam to rotate. The first cam cooperates with the bottom of the first transmission part. The top of the first transmission part is fixedly connected to the first top plate. The first top plate and the first pressure plate structure have a pressing position close to each other or a disengaged position far apart from each other.

[0013] Furthermore, the first transmission part includes a first mating block and a first connecting plate, and the bottom surface of the first mating block has an arc-shaped surface that mates with the first cam.

[0014] Furthermore, the first top plate structure also includes a first elastic element, one end of which is connected to the base assembly, and the second end of which is connected to the first top plate structure so that the first transmission part contacts the first cam.

[0015] Furthermore, the first pressure plate structure includes a first pressure plate and a second elastic member. The second elastic member is disposed on the first pressure plate. When the first top plate and the first pressure plate structure are in a pressing position, the first top plate and the second elastic member jointly press against the load plate.

[0016] Furthermore, the second elastic element includes a first spring sheet, which is fixed to the first pressure plate.

[0017] Furthermore, the first spring includes a first connecting plate and a first pressure foot. The first end of the first pressure foot is connected to the side of the first connecting plate. The first pressure plate has a hollow hole. The first connecting plate is connected to the surface of the first pressure plate away from the first top plate structure. The second end of the first pressure foot passes through the hollow hole.

[0018] Furthermore, the angle between the plane of the first connecting plate and the plane of the first presser foot is greater than 90° and less than 180°, and the second end of the first presser foot has an outward flange, which is connected to the first presser foot through an arc-shaped connecting part.

[0019] Furthermore, the conveying module includes a third motor, a conveyor belt, driven wheels, and a carrier plate clamping structure. The third motor and driven wheels are respectively located at both ends of the mounting frame module. The conveyor belt cooperates with the third motor and driven wheels, and the carrier plate clamping structure is located on the conveyor belt.

[0020] Furthermore, the carrier plate clamping structure includes a clamping mounting base, a fixed clamping part, a movable clamping part, and a clamping drive part. The clamping mounting base is mounted on the conveyor belt, the fixed clamping part is fixedly mounted on the clamping mounting base, and the clamping drive part is mounted on the clamping mounting base. The clamping drive part is connected to the movable clamping part to drive the movable clamping part to move closer to the fixed clamping part in a clamping position, or to drive the movable clamping part away from the fixed clamping part in a releasing position.

[0021] Furthermore, the die bonder structure includes a die bonder and a die bonder connector. The die bonder connector is fixed to the robotic arm structure, and the die bonder is mounted on the die bonder connector by magnetic force.

[0022] Furthermore, the die bonder includes a die bonder body and a die bonder mounting base, the die bonder mounting base having a mounting hole, and the die bonder body being mounted in the mounting hole.

[0023] Furthermore, the die bonder mounting base includes a ferromagnetic body, a first mounting section, a limiting section, and a second mounting section. The limiting section is located between the first mounting section and the second mounting section. The ferromagnetic body is located on the side of the first mounting section away from the limiting section. The outer diameter of the limiting section is larger than the outer diameter of the first mounting section.

[0024] Furthermore, the die bonder connector includes a base body and a connecting tube, the connecting tube being disposed on the side wall of the base body and being able to communicate with the die bonder body.

[0025] Furthermore, the mounting hole extends from the end of the second mounting section away from the limiting section to the first mounting section, and the sidewall of the first mounting section has a connecting hole that connects the mounting hole and the connecting pipe.

[0026] Furthermore, the die bond connector also includes a magnet, and the housing includes a receiving space in which the magnet is disposed.

[0027] Furthermore, the ferromagnetic body and the first mounting section are located within the receiving space, and the first mounting section has a mutually cooperating limiting part between it and the wall of the receiving space.

[0028] Furthermore, the die bonding module also includes a die bonding head structure and a die bonding head storage structure, both of which are mounted on the mounting frame module.

[0029] The technical solutions provided in this application have the following advantages compared with the prior art:

[0030] The technical solution of this application involves the carrier being conveyed by a conveying module and sequentially passing through a dispensing module for dispensing. It then enters a waiting module for inspection, such as checking the dispensing quality. After passing through the waiting module, it enters a die-bonding module driven by the conveying module. After die-bonding, it passes through a feeding module. This assembly line operation completes dispensing, inspection, and die-bonding, significantly improving the efficiency of the die-bonding machine. The technical solution of this application effectively solves the problems of low integration and low efficiency in existing die-bonding machines. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 A three-dimensional structural schematic diagram of a die bonder according to an embodiment of this application is shown;

[0034] Figure 2 It shows Figure 1 A schematic diagram of the flow channel structure of a die bonder;

[0035] Figure 3 It shows Figure 1 A schematic diagram of the first pressure plate structure of the die bonder;

[0036] Figure 4 It shows Figure 1 A schematic diagram of the flow channel drive structure of a die bonder;

[0037] Figure 5 It shows Figure 1 A partially enlarged schematic diagram of the die bonding module of the die bonder;

[0038] Figure 6 It shows Figure 1 A schematic diagram of the die bonding module assembly of the die bonder;

[0039] Figure 7 It shows Figure 6 A schematic diagram of the die bond head storage structure of the die bond module;

[0040] Figure 8 It shows Figure 1 A schematic diagram of the die bonding structure of the die bonder;

[0041] Figure 9 It shows Figure 8 A schematic diagram of a die bonder with a die bonder structure.

[0042] The above figures include the following reference numerals:

[0043] 10. Mounting bracket module; 11. Base assembly; 12. Guide rail assembly; 13. Flow channel assembly; 131. Limiting support frame structure; 132. Flow channel drive structure; 20. Dispensing module; 30. Material waiting module; 40. Die bonding module; 41. Die bonding head structure; 411. Die bonding head; 412. Die bonding head connector; 42. Robotic arm structure; 43. Die bonding head storage structure; 50. Unloading module; 60. Conveying module; 70. First pressure plate structure; 71. First pressure plate; 72. Second elastic element; 80. First top plate structure. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0045] like Figures 1 to 9 As shown, a die bonder according to this embodiment includes: a mounting frame module 10, a dispensing module 20, a waiting module 30, a die bonder module 40, a feeding module 50, and a conveying module 60. The dispensing module 20 is mounted on the mounting frame module 10. The waiting module 30 is mounted on the mounting frame module 10. The die bonder module 40 is mounted on the mounting frame module 10 and includes a die bonder head structure 41 and a robotic arm structure 42. The robotic arm is mounted on the mounting frame module 10, and the die bonder head structure 41 is mounted on the robotic arm structure 42. The robotic arm structure 42 can drive the die bonder head structure 41 to move. The feeding module 50 is mounted on the mounting frame module 10. The conveying module 60 is mounted on the mounting frame module 10 and can drive the carrier board to move between the dispensing module 20, the waiting module 30, the die bonder module 40, and the feeding module 50.

[0046] In this embodiment, the carrier, conveyed by the conveying module 60, sequentially passes through the dispensing module 20 for dispensing, and then enters the waiting module 30 for inspection, such as checking whether the dispensing is qualified. After passing through the waiting module 30, it enters the die-bonding module 40 under the drive of the conveying module 60. After completing the die-bonding work, it passes through the unloading module 50. This assembly line operation completes dispensing, inspection, and die-bonding, greatly improving the working efficiency of the die-bonding machine. This embodiment effectively solves the problems of low integration and low working efficiency of existing die-bonding machines. The carrier includes the carrier body and the objects on the carrier body.

[0047] like Figure 1 and Figure 2 As shown, in this embodiment, the mounting frame module 10 includes a base assembly 11, a guide rail assembly 12, and a flow channel assembly 13. The guide rail assembly 12 is fixed on the base assembly 11, and the flow channel assembly 13 is movably mounted on the guide rail assembly 12, supporting the carrier plate on the flow channel assembly 13. The flow channel assembly 13 moves on the guide rail assembly 12, accommodating carrier plates of different sizes and models, thus enhancing the versatility of the die bonder. It should be noted that the extension direction of the guide rail assembly 12 is perpendicular to the extension direction of the flow channel assembly 13. This embodiment also includes a guide structure, which is fixed on the mounting frame module 10. The flow channel assembly 13 and the guide structure cooperate to ensure smoother movement of the flow channel assembly 13 when adjusting the width of the flow channel. Multiple guide rail assemblies are included, each adapted to the limiting support frame structure 131 and located at the bottom of the limiting support frame structure 131.

[0048] like Figure 2 As shown, in this embodiment, the flow channel assembly 13 includes a limiting support frame structure 131, which includes a first limiting support plate and a second limiting support plate. The first and second limiting support plates have an adjustable predetermined distance to form a flow channel. Both the first and second limiting support plates extend along the moving direction of the carrier plate. The limiting structure includes the first and second limiting support plates. By adjusting the distance between the first and second limiting support plates, it can accommodate carrier plates of different sizes. This structure has low manufacturing costs and is easy to operate. It should be noted that the guide structure consists of multiple guide rods, through which the first and second limiting support plates pass. The extending direction of each guide rod is parallel to the guide rail assembly 12.

[0049] like Figure 2As shown, in this embodiment, the first limiting support plate includes a first limiting plate and a first support plate. The first support plate is located on the side of the first limiting plate closer to the second limiting support plate. The upper surface of the first support plate is lower than the upper surface of the first limiting plate to form a first stepped surface. The second limiting support plate includes a second limiting plate and a second support plate. The second support plate is located on the side of the second limiting plate closer to the first limiting support plate. The upper surface of the second support plate is lower than the upper surface of the second limiting plate to form a second stepped surface. The cooperation of the first stepped surface and the second stepped surface can support the carrier plate, thus providing upward support and reducing the stress on the conveying module 60. The cooperation of the side surfaces of the first and second limiting plates prevents the carrier plate from detaching from the flow channel, allowing the carrier plate to move better along the predetermined track. The structure of the first and second limiting support plates in this embodiment is simple and easy to operate. It should be noted that the heights of the first and second stepped surfaces are the same. The first limiting plate includes a first limiting plate segment, a second limiting plate segment, a third limiting plate segment, and a fourth limiting plate segment. The second limiting plate includes a fifth limiting plate segment, a sixth limiting plate segment, a seventh limiting plate segment, and an eighth limiting plate segment. The first support plate includes a first support plate segment, a second support plate segment, a third support plate segment, and a fourth support plate segment. The second support plate includes a fifth support plate segment, a sixth support plate segment, a seventh support plate segment, and an eighth support plate segment. The first limiting plate segment and the first support plate segment are connected together; the second limiting plate segment and the second support plate segment are connected together; the third limiting plate segment and the third support plate segment are connected together, and so on. The first limiting plate segment, the first supporting plate segment, the fifth limiting plate segment, and the fifth supporting plate segment have the same length and are all set corresponding to the dispensing module 20; the second limiting plate segment, the second supporting plate segment, the sixth limiting plate segment, and the sixth supporting plate segment have the same length and are set corresponding to the waiting module 30; the third limiting plate segment, the third supporting plate segment, the seventh limiting plate segment, and the seventh supporting plate segment have the same length and are set corresponding to the die bonding module 40; the fourth limiting plate segment, the fourth supporting plate segment, the eighth limiting plate segment, and the eighth supporting plate segment have the same length and are set corresponding to the unloading module 50.

[0050] like Figure 2 and Figure 4 As shown, in the technical solution of this embodiment, the flow channel assembly 13 further includes a flow channel driving structure 132, which is connected to the limiting support frame structure 131 to drive the limiting support frame structure 131 to change the predetermined distance of the flow channel. The above structure is easy to set up and operate.

[0051] like Figure 2 and Figure 4As shown, in this embodiment, the flow channel drive structure 132 includes a first motor, a lead screw, and two connecting parts. The output shaft of the first motor is connected to the lead screw, and both ends of the lead screw are threadedly connected to the two connecting parts. A first limiting support plate and a second limiting support plate are fixedly connected to the two connecting parts. The flow channel drive structure 132 described above has a lower processing cost and applies a more balanced force. Specifically, both ends of the lead screw connected to the two connecting parts have the same thread, which makes the force exerted by the lead screw on the two connecting parts more balanced, enabling the two connecting parts to move synchronously and simultaneously. The two connecting parts respectively drive the first limiting support plate and the second limiting support plate to move synchronously and simultaneously. When the size of the carrier plate changes and the width of the flow channel needs to be adjusted, the first limiting plate and the second limiting plate on both sides of the carrier plate simultaneously and synchronously move towards the carrier plate, thus improving the working accuracy in terms of both force and moving distance.

[0052] like Figure 1 and Figure 3 As shown in the technical solution of this embodiment, the die bonder further includes a first pressure plate structure 70 and a first top plate structure 80. The first pressure plate structure 70 is fixedly connected to the limiting support frame, and the first top plate structure 80 is disposed on the mounting frame module 10. The first pressure plate structure 70 and the first top plate structure 80 are correspondingly disposed, and the first pressure plate structure 70 cooperates with the dispensing module 20. By fixing the carrier plate with the first pressure plate structure 70 and the first top plate structure 80, the carrier plate can be limited and fixed in multiple directions, thus further ensuring the accuracy of the carrier plate during operation. The second pressure plate structure and the second top plate structure are disposed at corresponding positions in the die bonder module 40.

[0053] like Figure 1 , Figure 3 and Figure 4 As shown, in this embodiment, the first top plate structure 80 includes a second motor, a first cam, a first transmission part, and a first top plate. The second motor is connected to the first cam to drive the first cam to rotate. The first cam engages with the bottom of the first transmission part, and the top of the first transmission part is fixedly connected to the first top plate. The first top plate and the first pressure plate structure 70 have a pressing position that is close to each other or a disengaging position that is far apart from each other. The structure of the first cam ensures that the force applied by the first top plate when pressing against the load plate is relatively gentle. Similarly, when the first top plate moves from the pressing position to the disengaging position, it also moves away smoothly.

[0054] like Figure 4As shown in the technical solution of this embodiment, the first transmission part includes a first mating block and a first connecting plate. The bottom surface of the first mating block has an arc-shaped surface that mates with the first cam. The arc-shaped surface of the bottom surface of the first mating block makes the contact area between the first mating block and the first cam relatively large, thus ensuring a more stable fit between them. Furthermore, the arc-shaped structure of the first mating block also ensures that the first transmission part moves at the desired speed.

[0055] In this embodiment, the first top plate structure 80 further includes a first elastic element. One end of the first elastic element is connected to the base assembly 11, and the second end of the first elastic element is connected to the first top plate structure 80 so that the first transmission part contacts the first cam. The first elastic element ensures that the first cam and the first mating block can have a mutual pressing force under the action of external force, that is, the first transmission part always maintains a downward force under the action of spring force. The first elastic element includes two springs, which are symmetrically located on both sides of the first cam to make the force between the first transmission part and the first cam balanced and uniform. Specifically, the two springs are in a stretched state.

[0056] like Figure 3 As shown, in the technical solution of this embodiment, the first pressure plate structure 70 includes a first pressure plate 71 and a second elastic member 72. The second elastic member 72 is disposed on the first pressure plate 71. When the first top plate and the first pressure plate structure 70 are in a pressing position, the first top plate and the second elastic member 72 jointly press against the carrier plate. The provision of the second elastic member 72 ensures that when the carrier plate is pressed together by the first top plate structure 80 and the first pressure plate structure 70, the carrier plate is not rigidly pressed, and the carrier plate has a buffering force. This structure ensures that the carrier plate is not easily damaged.

[0057] like Figure 3 As shown, in this embodiment, the second elastic element 72 includes a first spring sheet, which is fixed to the first pressure plate 71. The above structure is compact and easy to use.

[0058] like Figure 3 As shown, in this embodiment, the first spring includes a first connecting plate and a first pressure foot. The first end of the first pressure foot is connected to the side of the first connecting plate. The first pressure plate 71 has a hollow hole. The first connecting plate is connected to the surface of the first pressure plate 71 away from the first top plate structure 80. The second end of the first pressure foot passes through the hollow hole. The above structure is compact and has low processing cost. Specifically, the first connecting plate and the first pressure foot are integrally formed.

[0059] like Figure 3As shown, in this embodiment, the angle between the plane of the first connecting plate and the plane of the first pressure foot is greater than 90° and less than 180°. The second end of the first pressure foot has an outward flange, which is connected to the first pressure foot through an arc-shaped connecting part. The angle between the plane of the first connecting plate and the plane of the first pressure foot is greater than 90° and less than 180°, which ensures the ease of use of the first spring piece. For example, when the first spring piece moves downward, the increased angle between the plane of the first connecting plate and the plane of the first pressure foot can achieve the force and elastic force on the carrier plate. The second spring piece includes a second connecting plate and two second pressure feet. The two second pressure feet are arranged opposite to each other on both sides of the second connecting plate. The first connecting plate and the second connecting plate have the same structure, and the first pressure feet have the same structure. When there are multiple hollow holes, adjacent hollow holes have connecting bridges. The second connecting plate is connected on the connecting bridges. Both ends of the second connecting plate have second pressure feet, so that both sides of the second connecting plate can form elastic pressure on the carrier plate. The first spring piece is used at the position of the hollow holes at both ends, and the second spring piece is used at the position of the connecting bridge between two adjacent hollow holes.

[0060] In the technical solution of this embodiment, the unloading module 50 includes an anti-static push rod, which pushes the carrier plate away from the flow channel assembly and also prevents static electricity from damaging the carrier plate.

[0061] like Figure 1 As shown, in this embodiment, the conveying module 60 includes a third motor, a conveyor belt, driven wheels, and a carrier plate clamping structure. The third motor and driven wheels are respectively disposed at both ends of the mounting frame module 10. The conveyor belt cooperates with the third motor and driven wheels, and the carrier plate clamping structure is disposed on the conveyor belt. The conveyor belt can ensure a large span for the conveying module 60. In this embodiment, multiple carrier plate clamping structures can be used, which improves efficiency. For example, the dispensing module 20 and the die bonding module 40 can work simultaneously, moving different carrier plates at the same time. The second top plate structure includes a fourth motor, a second cam, a second transmission part, and a second top plate.

[0062] In this embodiment, the carrier plate clamping structure includes a clamping mounting base, a fixed clamping part, a movable clamping part, and a clamping drive part. The clamping mounting base is mounted on a conveyor belt, the fixed clamping part is fixedly mounted on the clamping mounting base, and the clamping drive part is mounted on the clamping mounting base. The clamping drive part is connected to the movable clamping part to drive the movable clamping part closer to the fixed clamping part in a clamping position, or to drive the movable clamping part away from the fixed clamping part in a released position. The part of the carrier plate clamping structure that mates with the carrier plate is made of PEEK (polyetheretherketone) material. The carrier plate clamping structure described above is easy to operate. The movable clamping part can be connected to a pneumatic cylinder, a hydraulic cylinder, or an electric actuator.

[0063] like Figures 5 to 9As shown, in this embodiment, the die-bonding head structure 41 includes a die-bonding head 411 and a die-bonding head connector 412. The die-bonding head connector 412 is fixed to the robotic arm structure 42, and the die-bonding head 411 is magnetically mounted on the die-bonding head connector 412. The robotic arm structure 42 can drive the die-bonding head 411 to work, making the die-bonding work more precise and highly automated. The die-bonding head 411 and the die-bonding head connector 412 are connected by magnetic force, which greatly improves the assembly and disassembly efficiency. The die-bonding head 411 and the die-bonding head connector 412 are magnetically attracted and fixed, reducing the steps of installing and removing screws.

[0064] In this embodiment, the die bonder 411 includes a die bonder body and a die bonder mounting base. The die bonder mounting base has a mounting hole, and the die bonder body is installed in the mounting hole. The structure of the die bonder body and the die bonder mounting base facilitates maintenance and allows for the installation of mating structures, such as a ferromagnetic material in the die bonder mounting base.

[0065] like Figure 9 As shown, in this embodiment, the die bonder mounting base includes a ferromagnetic body, a first mounting section, a limiting section, and a second mounting section. The limiting section is located between the first and second mounting sections. The ferromagnetic body is located on the side of the first mounting section away from the limiting section, and the outer diameter of the limiting section is larger than the outer diameter of the first mounting section. The ferromagnetic body facilitates the mating connection between the die bonder body and the die bonder mounting base. The limiting section ensures that the bottom edge of the die bonder mounting base abuts against the upper surface of the limiting section. The limiting section is a circular plate, and the upper part of the first mounting section is frustoconical, while the lower part is cylindrical. Figure 9 As shown. The second mounting section is fixed to the die bonder body by a pin. The side wall of the second mounting end has a pin through hole, and the side wall of the die bonder body has a groove corresponding to the pin hole. The pin passes through the pin through hole and enters the groove.

[0066] like Figure 8 As shown, in this embodiment, the die bonder connector 412 includes a base body and a connecting tube. The connecting tube is disposed on the side wall of the base body and can communicate with the die bonder body. The above structure is compact and easy to connect. The negative pressure adsorbed by the connecting tube is between 0.1 kPa and 0.8 kPa.

[0067] like Figure 8 and Figure 9 As shown, in this embodiment, the mounting hole extends from the end of the second mounting section away from the limiting section to the first mounting section. The sidewall of the first mounting section has a connecting hole that connects the mounting hole and the connecting tube. The above structure is compact and easy to install, and the die bonding head body is a hollow tube.

[0068] like Figure 8 and Figure 9As shown, in this embodiment, the die bond connector 412 further includes a magnet, and the connector includes a receiving space, within which the magnet is disposed. The above structure is compact and offers high assembly / disassembly efficiency. In this embodiment, the magnet is a permanent magnet, and the connection between the die bond 411 and the die bond mounting base is achieved through the attraction of the two magnets. When disassembling, the die bond 411 is removed from the die bond mounting base by external force. Alternatively, the magnet can be an electromagnet; when disassembly is required, the electromagnet is de-energized, and the die bond 411 is removed under the influence of gravity or external force.

[0069] like Figure 8 and Figure 9 As shown, in this embodiment, the ferromagnetic material and the first mounting section are located within the accommodating space, and the first mounting section has a mutually cooperating limiting part with the wall of the accommodating space. This results in a high fitting accuracy between the die bonder 411 and the die bonder connector 412. The first mounting section has a frustum that mates with the frustum section, further improving the fitting accuracy between the connector and the die bonder 411, and reducing the processing cost of the above structure. The accommodating space, from the side away from the die bonder 411 to the side closer to the die bonder 411, sequentially includes a first cylindrical section, a second cylindrical section, a frustum section, and a cylindrical section, with the magnet mounted inside the connector. The side wall of the first mounting base has a foolproof surface, and the side wall of the connector has a plane that mates with the foolproof surface. A fixing hole is located on the side wall of the connector corresponding to the foolproof surface, and a pin is used to fix the first mounting end to the connector.

[0070] like Figure 8 and Figure 9 As shown, in this embodiment, the die bonding module 40 further includes a die bonding head removal structure and a die bonding head storage structure 43, both of which are mounted on the mounting frame module 10. This structure further improves the automation level of the die bonding machine. When the die bonding head 411 needs to be replaced, it is removed by the die bonding head removal structure, and then the die bonding head 411 in the die bonding head storage structure is automatically installed using magnetic force. The die bonding head removal structure can be a standalone structure or part of a system, for example, a connecting tube blowing out positive pressure gas, which removes the die bonding head 411 using the force of the positive pressure gas.

[0071] It should be noted that the die bonder in this embodiment has multiple cameras. For example, a camera (or a video camera if needed) is installed at the position of the material receiving module 30 to detect the dispensing result. Both the dispensing module 20 and the die bonder module are equipped with cameras to detect the dispensing and die bonding processes. This embodiment also includes a movable camera that can be moved to the required detection position as needed.

[0072] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0073] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A die bonder with a die bonder module, characterized in that, include: Mounting bracket module (10); A dispensing module (20) is disposed on the mounting bracket module (10); A material waiting module (30) is disposed on the mounting frame module (10); A die bonding module (40) is disposed on the mounting frame module (10). The die bonding module (40) includes a die bonding head structure (41) and a robotic arm structure (42). The robotic arm structure (42) is mounted on the mounting frame module (10), and the die bonding head structure (41) is mounted on the robotic arm structure (42). The robotic arm structure (42) can drive the die bonding head structure (41) to move. A feeding module (50) is disposed on the mounting frame module (10); A conveying module (60) is disposed on the mounting frame module (10) and can drive the carrier plate to move in the dispensing module (20), the waiting module (30), the die bonding module (40) and the unloading module (50); The die bond head structure (41) includes a die bond head (411) and a die bond head connector (412). The die bond head connector (412) is fixed on the robotic arm structure (42). The die bond head (411) is magnetically mounted on the die bond head connector (412). The mounting bracket module (10) includes a base assembly (11), a guide rail assembly (12), and a flow channel assembly (13). The guide rail assembly (12) is fixed on the base assembly (11), the flow channel assembly (13) is movably disposed on the guide rail assembly (12), and the carrier plate is supported on the flow channel assembly (13). The flow channel assembly (13) includes a limiting support frame structure (131), which includes a first limiting support plate and a second limiting support plate. The first limiting support plate and the second limiting support plate have an adjustable predetermined distance to form a flow channel. Both the first limiting support plate and the second limiting support plate extend along the moving direction of the carrier plate. The die bonder also includes a first pressure plate structure (70) and a first top plate structure (80). The first pressure plate structure (70) is fixedly connected to the limiting support frame. The first top plate structure (80) is disposed on the mounting frame module (10). The first pressure plate structure (70) and the first top plate structure (80) are disposed correspondingly. The first pressure plate structure (70) cooperates with the dispensing module (20). The first pressure plate structure (70) includes a first pressure plate (71) and a second elastic member (72). The second elastic member (72) is disposed on the first pressure plate (71). When the first top plate and the first pressure plate structure (70) are in a pressing position, the first top plate and the second elastic member (72) jointly press against the carrier plate.

2. The die bonder according to claim 1, characterized in that, The first limiting support plate includes a first limiting plate and a first support plate. The first support plate is located on the side of the first limiting plate closer to the second limiting support plate. The upper surface of the first support plate is lower than the upper surface of the first limiting plate to form a first stepped surface. The second limiting support plate includes a second limiting plate and a second support plate. The second support plate is located on the side of the second limiting plate closer to the first limiting support plate. The upper surface of the second support plate is lower than the upper surface of the second limiting plate to form a second stepped surface.

3. The die bonder according to claim 1, characterized in that, The flow channel assembly (13) further includes a flow channel driving structure (132), which is connected to the limiting support frame structure (131) to drive the limiting support frame structure (131) to change the predetermined distance of the flow channel.

4. The die bonder according to claim 3, characterized in that, The flow channel drive structure (132) includes a first motor, a lead screw and two connecting parts. The output shaft of the first motor is connected to the lead screw, and the two ends of the lead screw are respectively connected to the two connecting parts by threads. The first limiting support plate and the second limiting support plate are respectively fixedly connected to the two connecting parts.

5. The die bonder according to claim 1, characterized in that, The first top plate structure (80) includes a second motor, a first cam, a first transmission part and a first top plate. The second motor is connected to the first cam to drive the first cam to rotate. The first cam cooperates with the bottom of the first transmission part. The top of the first transmission part is fixedly connected to the first top plate. The first top plate and the first pressure plate structure (70) have a pressing position close to each other or a disengaging position far away from each other.

6. The die bonder according to claim 5, characterized in that, The first transmission part includes a first mating block and a first connecting plate, and the bottom surface of the first mating block has an arc-shaped surface that mates with the first cam.

7. The die bonder according to claim 5, characterized in that, The first top plate structure (80) further includes a first elastic element, one end of which is connected to the base assembly (11), and the second end of which is connected to the first top plate structure (80) so that the first transmission part contacts the first cam.

8. The die bonder according to claim 1, characterized in that, The second elastic element (72) includes a first spring sheet, which is fixed on the first pressure plate (71).

9. The die bonder according to claim 8, characterized in that, The first spring includes a first connecting plate and a first pressure foot. The first end of the first pressure foot is connected to the side of the first connecting plate. The first pressure plate (71) has a hollow hole. The first connecting plate is connected to the surface of the first pressure plate (71) away from the first top plate structure (80). The second end of the first pressure foot passes through the hollow hole.

10. The die bonder according to claim 9, characterized in that, The angle between the plane of the first connecting plate and the plane of the first presser foot is greater than 90° and less than 180°. The second end of the first presser foot has an outward flange, and the flange is connected to the first presser foot through an arc-shaped connecting part.

11. The die bonder according to claim 1, characterized in that, The conveying module (60) includes a third motor, a conveyor belt, driven wheels and a carrier plate clamping structure. The third motor and the driven wheels are respectively disposed at both ends of the mounting frame module (10). The conveyor belt cooperates with the third motor and the driven wheels. The carrier plate clamping structure is disposed on the conveyor belt.

12. The die bonder according to claim 11, characterized in that, The carrier plate clamping structure includes a clamping mounting base, a fixed clamping part, a movable clamping part, and a clamping driving part. The clamping mounting base is mounted on a conveyor belt. The fixed clamping part is fixedly disposed on the clamping mounting base. The clamping driving part is disposed on the clamping mounting base. The clamping driving part is connected to the movable clamping part to drive the movable clamping part closer to the fixed clamping part in a clamping position, or to drive the movable clamping part away from the fixed clamping part in a releasing position.

13. The die bonder according to claim 1, characterized in that, The die bonder (411) includes a die bonder body and a die bonder mounting base. The die bonder mounting base has a mounting hole, and the die bonder body is installed in the mounting hole.

14. The die bonder according to claim 13, characterized in that, The die bond head mounting base includes a ferromagnetic body, a first mounting section, a limiting section, and a second mounting section. The limiting section is located between the first mounting section and the second mounting section. The ferromagnetic body is located on the side of the first mounting section away from the limiting section. The outer diameter of the limiting section is larger than the outer diameter of the first mounting section.

15. The die bonder according to claim 14, characterized in that, The die bond head connector (412) includes a base body and a connecting tube. The connecting tube is disposed on the side wall of the base body and can communicate with the die bond head body.

16. The die bonder according to claim 15, characterized in that, The mounting hole extends from the end of the second mounting section away from the limiting section to the first mounting section. The sidewall of the first mounting section has a connecting hole that connects the mounting hole and the connecting pipe.

17. The die bonder according to claim 15, characterized in that, The die bond connector (412) also includes a magnet, and the body includes a receiving space, in which the magnet is disposed.

18. The die bonder according to claim 17, characterized in that, The ferromagnetic body and the first mounting section are located within the accommodating space, and the first mounting section has a mutually cooperating limiting part between itself and the wall of the accommodating space.

19. The die bonder according to claim 1, characterized in that, The die bonding module (40) further includes a die bonding head structure and a die bonding head storage structure, both of which are mounted on the mounting frame module (10).

Images