LED lamp bead

Abstract

The LED lamp bead comprises an LED support and a plurality of chips, the LED support comprises a bonding pad set, a bowl cup and a white channel, the bonding pad set comprises a first bonding pad and a second bonding pad which are arranged at an interval, the white channel is arranged between the first bonding pad and the second bonding pad, the first bonding pad is provided with a first bonding wire area and a die bonding area, the second bonding pad is provided with a second bonding wire area, the die bonding area is provided with the plurality of chips, and the bowl cup is arranged on the bowl cup. The two ends of the plurality of chips are electrically connected with the first bonding wire area and the second bonding wire area through leads respectively, a first hollow part and at least one second hollow part are arranged on the two opposite sides of the cup wall of the bowl cup, the first bonding wire area is located in the first hollow part, and the second bonding wire area and the white channel are located in the second hollow part; the first hollow-out part and the second hollow-out part are respectively provided with a reflecting colloid; the enlargement of the die bonding area of the die bonding area provides conditions for the arrangement of a plurality of chips, and avoids the limitation of a bonding wire and a white channel on the placement scheme of the plurality of chips, thereby unifying the specification of the PCB.

Description

Technical Field

[0001] This utility model relates to the field of LED technology, and in particular to an LED lamp bead. Background Technology

[0002] LED chips have become the mainstream choice for modern lighting due to their advantages such as high efficiency, energy saving, long life, environmental friendliness, and durability.

[0003] However, due to the different pad ratios of LED lamp beads, the LED lamp bead bracket has low compatibility and many product specifications, which leads to the need for customized PCB boards, which is not conducive to mass production and cost control. In addition, heat dissipation affects the reliability of LED lamp beads. Improving the heat dissipation capacity of LED lamp beads can effectively extend their service life. Utility Model Content

[0004] In view of the above situation, it is necessary to provide an LED lamp bead to address the compatibility and reliability issues of LED brackets in the existing technology.

[0005] An LED lamp bead includes an LED bracket and several chips. The LED bracket includes a pad group, a cup, and a white track. The pad group includes a first pad and a second pad spaced apart. The first pad covers the bottom of the cup, and the second pad is located at the bottom of one cup wall. The white track is provided between the first pad and the second pad. A first bonding area and a die-bonding area are provided on the first pad, and a second bonding area is provided on the second pad. The first bonding area is located on the side of the die-bonding area away from the second bonding area. The die-bonding area is located inside the cup. Several chips are provided on the die-bonding area. The two ends of the chips are electrically connected to the first bonding area and the second bonding area respectively through leads. The cup wall has a first cutout and at least one second cutout on opposite sides. The first bonding area is located in the first cutout, and the second bonding area and the white track are located in the second cutout. Reflective adhesive is provided in both the first cutout and the second cutout.

[0006] The beneficial effects of this utility model are:

[0007] The first bonding area is located within the first cutout section, and the first pad covers the entire bottom of the cup. The die-bonding area is located within the cup, and the second bonding area and white track are located within the second cutout section. The increased die-bonding area provides conditions for the placement of multiple chips, avoiding the limitations imposed by bonding lines and white tracks on the placement of multiple chips. It can fully cover the requirements of different pad ratios such as 28 / 37 / 46 / 55, thereby unifying the specifications of the PCB board. At the same time, the increased die-bonding area also increases the contact area with the PCB, improving the heat dissipation effect of the LED bracket and thus improving the reliability of the LED bracket. In addition, the filling of high-reflectivity colloid inside the cup reduces the ineffective emission of chip light from the solder joints, thereby increasing the brightness of the LED beads.

[0008] Furthermore, an extension is provided along the periphery of a portion of the first pad, and the cup covers the extension.

[0009] Furthermore, the height of the extension is lower than the height of the bowl / cup.

[0010] Furthermore, several beveled openings are provided along the periphery of the second pad.

[0011] Furthermore, the second hollow portion includes a first inclined portion, a second inclined portion, and a third inclined portion, with the opposite sides of the second inclined portion abutting against the first inclined portion and the third inclined portion, respectively.

[0012] Furthermore, the length of the top surface of the second hollow portion is greater than the length of the bottom surface of the second hollow portion.

[0013] Furthermore, the bowl is filled with fluorescent adhesive, which covers several of the chips and the die-bonding area. Attached Figure Description

[0014] Figure 1 This is a top view of the LED lamp bead according to the first embodiment of the present invention.

[0015] Figure 2 This is a top view of the LED bracket according to the first embodiment of the present invention;

[0016] Figure 3 This is a bottom view of the LED bracket according to the first embodiment of the present invention;

[0017] Figure 4 This is a top view of the first pad of the first embodiment of the present invention;

[0018] Figure 5 This is a top view of the LED bracket according to the second embodiment of the present invention;

[0019] Figure 6 This is a top view of the LED bracket according to the third embodiment of the present invention.

[0020] In the diagram: 1. LED bracket; 11. Pad group; 111. First pad; 1111. First bonding wire area; 1112. Die bonding area; 112. Second pad; 1121. Second bonding wire area; 1122. Beveled portion; 113. Extension portion; 12. Cup; 121. First cutout portion; 122. Second cutout portion; 1221. First beveled portion; 1222. Second beveled portion; 1223. Third beveled portion; 13. White track; 2. Chip. Detailed Implementation

[0021] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0022] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items. Furthermore, the various embodiments of the invention, the features within those embodiments, and the features of the embodiments may be freely combined without obvious conflict or contradiction.

[0024] Example 1

[0025] One type of LED light bead, such as Figure 1 As shown, it includes an LED bracket 1 and multiple chips 2.

[0026] Specifically, such as Figures 1 to 4As shown, the LED bracket 1 includes a pad group 11, a bowl 12, and a white track 13. The pad group 11 includes a first pad 111 and a second pad 112 spaced apart. The first pad 111 covers the bottom of the bowl 12, and the second pad 112 is located at the bottom of one cup wall of the bowl 12. A white track 13 is provided between the first pad 111 and the second pad 112. A first bonding area 1111 and a die bonding area 1112 are provided on the first pad 111, and a second bonding area 1121 is provided on the second pad 112. The first bonding area 1111 is located on the side of the die bonding area 1112 away from the second bonding area 1121. The die bonding area 1112 is located inside the bowl 12. A plurality of chips 2 are provided on the die bonding area 1112, and the two ends of the plurality of chips 2 are electrically connected to the first bonding area 1111 and the second bonding area 1121 respectively through leads. An extension 113 is provided along the periphery of a portion of the first pad 111, and a cup 12 surrounds the extension 113. The height of the extension 113 is lower than the height of the cup 12. A plurality of beveled openings 1122 are provided along the periphery of the second pad 112. The first bonding area 1111 is located within the first cutout portion 121, and the first pad 111 covers the entire bottom of the cup 12. The die-bonding area 1112 is located within the cup 12. The second bonding area 1121 and the white track 13 are located within the second cutout portion 122 at the corner of the cup 12. The increased die-bonding area of ​​the die-bonding area 1112 provides conditions for the placement of multiple chips 2, which can be arbitrarily adjusted within the die-bonding area 1112. This avoids the limitations imposed by the bonding wires and white track 13 on the placement scheme of multiple chips 2, and can fully cover the requirements of different pad ratios such as 28 / 37 / 46 / 55, thereby unifying the PCB board. At the same time, the increased die-bonding area of ​​the die-bonding area 1112 also increases the contact area with the PCB, improving the heat dissipation effect of the LED bracket 1. The setting of the extension portion 113 makes the first pad 111 also resemble a bowl shape. After the extension portion 113 is wrapped by the cup 12, it effectively reduces external contamination and improves the airtightness of the LED beads. The second pad 112 is smaller in area than the first pad 111, so the contact area with the cup 12 is small. Multiple beveled openings 1122 are provided around its periphery to avoid the risk of the second pad 112 falling off.

[0027] Specifically, the cup 12 has a first hollow portion 121 and a second hollow portion 122 on opposite sides of its cup wall. The second hollow portion 122 is located at the corner of the cup 12. The first bonding area 1111 is located within the first hollow portion 121, and the second bonding area 1121 and the white track 13 are located within the second hollow portion. The second hollow portion 122 includes a first inclined surface 1221, a second inclined surface 1222, and a third inclined surface 1223. The opposite sides of the second inclined surface 1222 abut against the first inclined surface 1221 and the third inclined surface 1223, respectively. The length of the top surface of the second hollow portion 122 is greater than the length of the bottom surface of the second hollow portion 122. Reflective adhesive is provided in both the first hollow portion 121 and the second hollow portion 122. A fluorescent adhesive layer is provided inside the cup 12, which covers multiple chips 2 and the die-bonding area 1112. The second cutout portion 122 includes a first inclined portion 1221, a second inclined portion 1222, and a third inclined portion 1223, which facilitates wire bonding operations and the adhesion and molding of high-reflectivity colloid. Furthermore, the filling of the cup 12 with high-reflectivity colloid reduces the ineffective emission of light from the solder joints to the chip 2, improving the brightness of the LED beads and preventing contaminant intrusion, thereby enhancing the reliability of the LED beads.

[0028] In this invention, the first bonding area 1111 is located within the first hollow portion 121, the first pad 111 covers the entire bottom of the cup 12, the die bonding area 1112 is located within the cup 12, and the second bonding area 1121 and the white track 13 are located within the second hollow portion 122 at the corner of the cup 12. The expansion of the die bonding area 1112 provides conditions for the placement of multiple chips 2, which can be arbitrarily adjusted within the die bonding area 1112, avoiding the limitations imposed by the bonding wires and white track 13 on the placement scheme of multiple chips 2. It can fully cover the requirements of different pad ratios such as 28 / 37 / 46 / 55, thereby unifying the specifications of the PCB board. At the same time, the expansion of the die bonding area 1112 also increases the contact area with the PCB, improving the heat dissipation effect of the LED bracket and thus improving the reliability of the LED bracket. In addition, the filling of high reflectivity colloid within the cup 12 reduces the ineffective emission of light from the solder joints to the chip 2, thereby improving the brightness of the LED beads.

[0029] Example 2

[0030] The difference between this embodiment and Embodiment 1 is that:

[0031] like Figure 5 As shown, the second hollowed-out part 122 is located on the cup wall of the bowl 12 and is positioned opposite to the first hollowed-out part 121.

[0032] Example 3

[0033] The difference between this embodiment and Embodiment 1 is that:

[0034] like Figure 6As shown, there are two second hollowed-out portions 122, and both second hollowed-out portions 122 are located at the corners of the bowl 12.

[0035] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] The embodiments described above are merely illustrative of the implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An LED lamp bead, characterized in that: The LED bracket comprises a pad group, a bowl cup and a white track, the pad group comprises a first pad and a second pad arranged at intervals, the first pad covers the bottom of the bowl cup, the second pad is arranged at the bottom of a cup wall of the bowl cup, the white track is arranged between the first pad and the second pad, the first pad is provided with a first wire area and a die bonding area, the second pad is provided with a second wire area, the first wire area is located on the side of the die bonding area away from the second wire area, the die bonding area is located in the bowl cup, a plurality of chips are arranged on the die bonding area, the two ends of the plurality of chips are respectively connected with the first wire area and the second wire area through lead wires, the cup wall of the bowl cup is provided with a first hollow part and at least one second hollow part on the opposite sides, the first wire area is located in the first hollow part, the second wire area and the white track are located in the second hollow part, and the first hollow part and the second hollow part are provided with reflective glue.

2. The LED lamp bead of claim 1, wherein: An extension is arranged along the circumferential side of the first pad, and the bowl cup wraps the extension.

3. The LED lamp bead of claim 2, wherein: The height of the extension is lower than the height of the bowl cup.

4. The LED lamp bead of claim 1, wherein: A plurality of beveled parts are arranged along the circumferential side of the second pad.

5. The LED lamp bead of claim 1, wherein: The second hollow part comprises a first inclined surface part, a second inclined surface part and a third inclined surface part, and the opposite sides of the second inclined surface part are respectively in abutment with the first inclined surface part and the third inclined surface part.

6. The LED lamp bead of claim 5, wherein: The length of the top surface of the second hollow part is greater than the length of the bottom surface of the second hollow part.

7. The LED lamp bead of claim 1, wherein: A fluorescent glue layer is arranged in the bowl cup, and the fluorescent glue layer covers the plurality of chips and the die bonding area.

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