A device status monitoring data collection system using a mobile device

Abstract

A device status monitoring data collection system using a mobile device, comprising a mobile device, a mobile gateway and a plurality of monitoring devices; each monitoring device respectively detects a device detection point; the monitoring device includes a power supply, a sensor, a data processing module, an MCU and an industrial wireless communication module; the power supply supplies power to the sensor, the data processing module, the MCU and the industrial wireless communication module; the sensor collects the monitoring signal of the monitored device, and after the signal is converted by the data processing module, it is sent out by the IEEE 802.15.4 communication module; the mobile gateway includes a battery, a Bluetooth communication module, an industrial wireless communication module and an MCU; the power supply supplies power to the Bluetooth communication module, the industrial wireless communication module and the MCU; the mobile gateway communicates with the mobile device through Bluetooth communication; the mobile gateway communicates with the monitoring device through the industrial wireless communication module. This system is convenient for collecting status monitoring data.

Description

[0001] This invention application is a divisional application of the invention entitled “A system for collecting device status monitoring data through a mobile device” with application number “201811352819.9” and application date “November 14, 2018”. Technical Field

[0002] The present invention belongs to the technical field of industrial site management, and in particular is a system which combines existing mobile applications with Internet of Things applications and collects equipment status monitoring data through mobile devices. Background Art

[0003] Mobile applications have become increasingly popular in the industrial field. The core of mobile applications is that people bring mobile devices to work on-site. They organically combine office work scenes with industrial site work scenes through technologies such as the Internet of Things and mobile front-end and back-end software.

[0004] Equipment status monitoring, whether using built-in or post-installed monitoring devices, requires data upload via a wired industrial bus or wirelessly. Industrial buses require laying cables and typically only cover key locations, while wireless methods require setting up gateways, which can be difficult to deploy in metallic environments. Consequently, industrial sites still rely on people using specialized instruments to perform regular measurements at numerous monitoring points. Summary of the Invention

[0005] The technical solution of the present invention is to expand the above mobile devices into mobile gateways for collecting status monitoring data.

[0006] Design Concept: This solution is based on mature Bluetooth technology, wireless transmission technology, and low-power operation design of battery-powered devices. It is a system designed to extend on-site mobile applications and equipment status monitoring applications:

[0007] 1) Design a mobile gateway, one end of which is connected to the mobile device via Bluetooth, and the other end is connected to the status monitoring device via a wireless network (e.g., wireless based on the IEEE802.15.4 protocol);

[0008] 2) Design a battery-powered adapter with extremely low power consumption to match existing monitoring devices in industrial sites that do not meet wireless requirements, and convert their signals into wireless signals that meet, for example, the IEEE802.15.4 protocol.

[0009] 3) Design monitoring equipment with wireless transmission mode.

[0010] The technical solution is as follows: A device status monitoring data collection system using a mobile device, which includes a mobile device (such as a smart phone or a tablet computer, etc.), a mobile gateway, and multiple monitoring devices; each monitoring device detects a device detection point;

[0011] The monitoring device includes a power supply, a sensor, a data processing module, an MCU, and an industrial-grade wireless communication module; the power supply powers the sensor, the data processing module, the MCU, and the industrial-grade wireless communication module; the sensor collects the monitoring signal of the device to be monitored, and after converting the signal through the data processing module, it is sent out by the IEEE 8-2.15.4 communication module;

[0012] The mobile gateway includes a battery, a Bluetooth communication module, an industrial-grade wireless communication module, and an MCU; the power supply powers the Bluetooth communication module, the industrial-grade wireless communication module, and the MCU; the mobile gateway communicates with the mobile device through Bluetooth communication; the mobile gateway communicates with the monitoring device through the industrial-grade wireless communication module;

[0013] a. The working process of the monitoring device includes:

[0014] After periodically waking up the monitoring device in the sleep state;

[0015] The data collected by the sensor is put into the memory; and the industrial-grade wireless communication module is turned on to start receiving data from the mobile gateway; if data from the mobile gateway is received, the MCU controls the operation of the monitoring device according to the received data instruction;

[0016] If there is no data from the mobile gateway, the industrial-grade wireless communication module is switched to the transmit state;

[0017] If the transmit channel is busy, after waiting for a certain period of time, the transmit channel idle / busy state is detected again; until the transmit channel is idle, the data in the memory is sent to the mobile gateway;

[0018] After the data is sent, the monitoring device returns to the sleep state;

[0019] b. The working process of the mobile gateway includes:

[0020] First, judge whether there is a new command;

[0021] If there is a new command, the industrial-grade wireless communication module is switched to the transmit state to continuously send the new command;

[0022] If there is no new command, the industrial-grade wireless communication module is switched to the receive state; if there is data from the monitoring device, it is received and stored, and if there is no data from the monitoring device, it is in a waiting state;

[0023] When an instruction from a mobile device is received through the Bluetooth communication module, the data in the memory is uploaded according to the instruction.

[0024] It also includes one or more network transmission mode adapters. The adapter includes an industrial bus data interface module, an MCU, an industrial-grade wireless communication module, and a power supply; the power supply powers the industrial bus data interface module, the industrial-grade wireless communication module, and the MCU; the data output end of the industrial bus data interface module is connected to the data input end of the MCU, and the data output end of the MCU is connected to the wired data input end of the industrial-grade wireless communication module;

[0025] The working process of the adapter includes:

[0026] After waking up the adapter in the sleep state regularly;

[0027] The data obtained by the industrial bus data interface module is put into the memory; and the industrial-grade wireless communication module is turned on to start receiving data from the mobile gateway; if data from the mobile gateway is received, the MCU controls the operation of the adapter according to the received data instruction;

[0028] If there is no data from the mobile gateway, the industrial-grade wireless communication module is switched to the transmit state;

[0029] If the transmit channel is busy, after waiting for a certain period of time, the idle / busy state of the transmit channel is detected again; until the transmit channel is idle, the data in the memory is sent to the mobile gateway;

[0030] After the data is sent, the adapter returns to the sleep state.

[0031] The industrial-grade wireless communication module is a communication module based on IEEE 8-2.15.4 or a Zigbee module. Description of the Drawings

[0032] Figure 1 It is a schematic diagram of the principle of this system;

[0033] Figure 2 It is a schematic diagram of the principle of the monitoring device / adapter;

[0034] Figure 3 It is a schematic diagram of the principle of the mobile gateway;

[0035] Figure 4 It is a schematic diagram of the communication process of the monitoring device / adapter;

[0036] Figure 5 It is a schematic diagram of the communication process of the gateway;

[0037] Figure 6-1 It is a schematic diagram of the structure of the monitoring device in Example 1;

[0038] Figure 6-2 is a schematic diagram of the electrical principle of the monitoring device in Example 1;

[0039] In the figure: the housing 101 of the monitoring device in Example 1, the magnetic seat 102 of the monitoring device in Example 1, the first cylinder 103, the second cylinder 104, the piezoelectric ceramic vibration sensor 105 of the monitoring device in Example 1, the infrared temperature sensor 106 of the monitoring device in Example 1, the display interface 107 of the segment code LCD display unit, the pressing structure 108 of the power button of the monitoring device in Example 1, the charging terminal 109 of the power supply of the monitoring device in Example 1;

[0040] Figure 7-1 is a schematic structural diagram of the monitoring device in Example 2;

[0041] Figure 7-2 is a schematic diagram of the electrical principle of the monitoring device in Example 2;

[0042] In the figure: the housing 201 of the monitoring device in Example 2, the magnetic seat 202 of the monitoring device in Example 2, the main PCB board 203, the auxiliary PCB board 204, the piezoelectric ceramic vibration sensor 205 of the monitoring device in Example 2, the MEMs sensor 206, the temperature sensor 207, the battery 208 of the monitoring device in Example 2, the antenna 209 of the ZigBee communication module;

[0043] Figure 8-1 is a schematic structural diagram of the monitoring device in Example 3;

[0044] Figure 8-2 is a schematic diagram of the radial cross-section of the RFID tag and the sealing layer;

[0045] In the figure: the main body 301 of the monitoring device in Example 3, the base 302 of the monitoring device in Example 3, the RFID tag 303, the antenna 304 of the RFID card reading circuit, the first through hole 305, the convex post 306, the sealing material 307, the metal sheet 308, the annular recess 309;

[0046] Figure 9 is a schematic diagram of the connection structure of the main magnet and the sub-magnet;

[0047] Figure 10 is a schematic diagram of the structure of the second notch part (the principles of the first notch and the second notch are the same);

[0048] In the figure: the main magnet 10, the sub-magnet 11, the pressure plate 12, the connecting rod 13, the first notch 14, the second notch 15, the ball 16, the groove 17. Specific embodiments

[0049] The following further describes this case in combination with the accompanying drawings and specific embodiments:

[0050] Such asFigures 1-5 , a device status monitoring data collection system using a mobile device, including a mobile device (such as a smart phone or a tablet computer, etc.), a mobile gateway, and multiple monitoring devices; each monitoring device detects a device detection point respectively;

[0051] The monitoring device includes a power supply, a sensor, a data processing module, an MCU, and an industrial-grade wireless communication module; the power supply supplies power to the sensor, the data processing module, the MCU, and the industrial-grade wireless communication module; the sensor collects the monitoring signal of the device to be monitored, and after converting the signal through the data processing module, it is sent out by the IEEE 8-2.15.4 communication module;

[0052] The mobile gateway includes a battery, a Bluetooth communication module, an industrial-grade wireless communication module, and an MCU; the power supply supplies power to the Bluetooth communication module, the industrial-grade wireless communication module, and the MCU; the mobile gateway communicates with the mobile device through Bluetooth communication; the mobile gateway communicates with the monitoring device through the industrial-grade wireless communication module;

[0053] a. The communication process of the monitoring device includes:

[0054] After waking up the monitoring device in the sleep state regularly;

[0055] The data collected by the sensor is put into the memory; and the industrial-grade wireless communication module is turned on to start receiving data from the mobile gateway; if data from the mobile gateway is received, the MCU controls the operation of the monitoring device according to the received data instruction;

[0056] If there is no data from the mobile gateway, the industrial-grade wireless communication module is switched to the transmit state;

[0057] If the transmit channel is busy, after waiting for a certain period of time, the transmit channel idle / busy state is detected again; until the transmit channel is idle, the data in the memory is sent to the mobile gateway;

[0058] After the data is sent, the monitoring device returns to the sleep state;

[0059] b. The working process of the mobile gateway includes:

[0060] First, judge whether there is a new command;

[0061] If there is a new command, the industrial-grade wireless communication module is switched to the transmit state to continuously send the new command;

[0062] If there is no new command, the industrial-grade wireless communication module is switched to the receive state; if there is data from the monitoring device, it is received and stored, if there is no data from the monitoring device, it is in a waiting state;

[0063] When receiving an instruction from a mobile device through the Bluetooth communication module, the data in the memory is uploaded according to the instruction.

[0064] It further includes one or more network transmission mode adapters. The adapter includes an industrial bus data interface module, an MCU, an industrial-grade wireless communication module, and a power supply; the power supply supplies power to the industrial bus data interface module, the industrial-grade wireless communication module, and the MCU; the data output end of the industrial bus data interface module is connected to the data input end of the MCU, and the data output end of the MCU is connected to the wired data input end of the industrial-grade wireless communication module;

[0065] The working process of the adapter includes:

[0066] After waking up the adapter in the sleep state regularly;

[0067] The data obtained by the industrial bus data interface module is put into the memory; and the industrial-grade wireless communication module is turned on to start receiving data from the mobile gateway; if data from the mobile gateway is received, the MCU controls the operation of the adapter according to the received data instruction;

[0068] If there is no data from the mobile gateway, the industrial-grade wireless communication module is switched to the transmit state;

[0069] If the transmission channel is in a busy state, after waiting for a certain period of time, the idle / busy state of the transmission channel is detected again; until the transmission channel is in an idle state, the data in the memory is sent to the mobile gateway;

[0070] After the data is sent, the adapter returns to the sleep state.

[0071] The industrial-grade wireless communication module is a communication module based on IEEE 8-2.15.4 or a Zigbee module.

[0072] 1. The implementation composition principle of the present invention is as Figure 1 :

[0073] √ Monitoring device management software of the mobile device: used to manage and collect the monitoring devices existing in the system;

[0074] √ Gateway: wireless conversion;

[0075] √ Monitoring device or adapter: collect data and upload it;

[0076] Technologically, there are several key technical points that directly affect whether this method has realizable value:

[0077] √ Many-to-many situation: In the same area, there are multiple mobile devices corresponding to multiple monitoring devices;

[0078] √ Very low power consumption requirements of the monitoring device: The purpose of wireless is to reduce wiring and deployment difficulty. Therefore, it is basically powered by batteries. Thus, the working time becomes a very important indicator, usually measured in years.

[0079] 2. Detection device / adapter (such as Figure 2 )

[0080] The data collected by the monitoring device is sent to the MCU for processing after analog-to-digital conversion (or the adapter obtains the data from the existing monitoring device that does not meet the wireless requirements through the industrial bus), and the result data is uploaded to the gateway and relayed to the mobile device through the gateway.

[0081] When implementing the project, low-power devices need to be selected, such as those with low static current. At the same time, the MCU has an embedded clock, can be woken up regularly, and has low sleep power consumption requirements, all of which should be at the level of a few microamps or lower.

[0082] In terms of the working mode, it should work periodically, but it is required to collect data without the user noticing. Therefore, there is a trade-off relationship in the selection of the working cycle with the walking speed of people, the wireless transmission distance, the working time, etc.

[0083] The general walking speed of people is about 1 m / s, and the wireless transmission distance is calculated based on a minimum radius of 10 meters. The intersection time with people is at least 10 s. The measurement and transmission of a total value generally take 10 ms to complete. Referring to a battery capacity of 1000 mAh and a working current of 20 mA, and a duty cycle of 10 mA / 10 s, the theoretically available working time is: 5 years.

[0084] In terms of time, the battery capacity, the amount of data transmitted, and sudden interference all affect the result, but it is basically no problem to ensure a working time of 1 year.

[0085] The protocol of the monitoring device / adapter is such as Figure 4 , and the principle of the monitoring device / adapter logic is first come, first served.

[0086] 3. Mobile gateway, such as Figure 3 .

[0087] The wireless gateway can use a rechargeable battery. Therefore, in terms of power consumption, it can be designed with reference to portable devices. The Bluetooth protocol is in a point-to-point form and will be relatively stable once bound to the mobile device.

[0088] The gateway protocol is such as Figure 5 , and it is in the receiving state by default. When a new command needs to be given, it uses a 10-second non-probing broadcast.

[0089] In this example, the monitoring device has the following three implementation methods to solve different specific technical problems.

[0090] Method 1 (such as Figure 6-1 , 6-2 , 9, 10) of the monitoring device includes a housing, a piezoelectric ceramic vibration sensor, an infrared temperature sensor, a data processing circuit, a human-machine interaction unit, and a power supply; the power supply supplies power to the piezoelectric ceramic vibration sensor, the infrared temperature sensor, the data processing circuit, and the human-machine interaction unit;

[0091] The housing is formed by connecting two hollow cylinders on the left and right, and the axes of the two cylinders are perpendicular to the horizontal plane;

[0092] A magnetic attraction seat composed of magnets is connected to the bottom surface of the first cylinder; the probe of the piezoelectric ceramic vibration sensor is fixedly connected to the bottom surface of the first cylinder;

[0093] The bottom surface of the second cylinder is higher than the bottom surface of the first cylinder; the probe of the infrared temperature sensor extends out of the bottom surface of the second cylinder and faces downward;

[0094] The output ends of the piezoelectric ceramic vibration sensor and the infrared temperature sensor are both connected to the data input end of the data processing circuit; the data output end of the data processing circuit is connected to the data input end of the MCU, and the data output end of the MCU is connected to the data input end of the human-machine interaction unit.

[0095] Furthermore, the data processing circuit is an analog-to-digital conversion circuit; the output ends of the piezoelectric ceramic vibration sensor and the infrared temperature sensor are connected to the input end of the analog-to-digital conversion circuit, the data input end connected to the MCU, and the data output end of the MCU is connected to the data input end of the human-machine interaction unit (such as a segment code LCD display unit).

[0096] Since the analog quantity is collected by the sensor, here, it is converted into a digital quantity by the analog-to-digital conversion circuit for the subsequent unit. Here, the accuracy requirement for analog-to-digital conversion is not high, and 16 bits can be used.

[0097] The principle of this solution is to adsorb the whole device at the corresponding position of the equipment through the magnetic attraction seat. The probe of the piezoelectric ceramic vibration sensor is rigidly connected to the structure part, senses the vibration transmitted from the equipment, and converts it into an electrical signal. At the same time, the probe of the infrared temperature sensor non-contact detects the temperature of the measured position. The monitoring of two types of indicators is realized on one equipment. The data processing circuit converts the electrical signals of vibration measurement and temperature measurement into digital signals to the MCU until the human-machine interaction unit.

[0098] Further, it may also include a Bluetooth transmitting unit, and the data input end of the Bluetooth transmitting unit is also connected to the data output end of the MCU. The information on vibration measurement and temperature measurement can also be sent out through the Bluetooth transmitting unit (directly to a mobile device), facilitating other devices with Bluetooth communication to receive the data for further collection and processing.

[0099] Further, the power supply is a rechargeable power supply; the power supply is inside the housing, and the charging terminal of the power supply is exposed on the surface of the housing. Since the working energy consumption of this device is very low, and the main energy-consuming parts are the communication unit and the display unit, a mature rechargeable power supply can be used. There is no high requirement for the service life of the rechargeable power supply, and the maintenance is simple. Just charge at the terminal without disassembling the battery.

[0100] Since the result data displayed by this device is relatively simple, an existing segment LCD display unit can meet the requirements. At the same time, the segment LCD display unit is small in size and low in power consumption, which is very suitable.

[0101] It also includes a power button, and the power button is connected in series to the output end of the power supply. The pressing structure of the power button is exposed on the surface of the housing.

[0102] Further, the magnetic suction base includes a main magnet and sub-magnets; the main magnet is disc-shaped and is directly below the probe of the piezoelectric ceramic vibration sensor;

[0103] There are multiple sub-magnets, which are rotatably connected to the periphery of the main magnet and are symmetric about the axis of the main magnet.

[0104] Further, the connection structure between the main magnet and the sub-magnets is as follows: it includes a pressure plate and a connecting rod; a spherical crown-shaped first notch with an upward opening is formed at the edge of the pressure plate, and a groove is formed on the wall of the first notch; a spherical crown-shaped second notch with a downward opening is formed at the edge of the sub-magnet, and a groove is formed on the wall of the second notch; the first ends of the connecting rods are respectively connected with balls corresponding to the shapes of the first and second notches, and the front and rear of the connecting rods are respectively in the grooves of the pressure plate and the sub-magnet; the two balls are respectively in the first and second notches.

[0105] Since the device in this example may be applied to positions with uneven curved surfaces, multiple sub-magnets are used to adsorb near the monitoring position, and the connecting rod is used to pull the main magnet to make this device relatively stable.

[0106] The device in this example adopts a compact structure to integrate Bluetooth transmission, piezoelectric vibration measurement, infrared non-contact temperature monitoring, segment display, etc. into a very small structure, enabling this device to be independently used as a monitoring tool simply and flexibly in the existing factory management.

[0107] Method 2 (such as Figure 7-1 、 7-2, a monitoring device (9, 10), comprising a housing, a piezoelectric ceramic vibration sensor for high-frequency monitoring, a MEMs sensor for low-frequency monitoring, a temperature sensor, and a data processing circuit; a power supply supplies power to the piezoelectric ceramic vibration sensor, the MEMs sensor, the temperature sensor, and the data processing circuit; the power supply, the piezoelectric ceramic vibration sensor, the MEMs sensor, the temperature sensor, the data processing circuit, the MCU, and the industrial-grade wireless communication module are all connected to the PCB board;

[0108] The housing is a hollow cylinder, the bottom surface of the cylinder is open, and a base is fixed to the open bottom surface; the piezoelectric ceramic vibration sensor, the MEMs sensor, the temperature sensor, the data processing circuit, the industrial-grade wireless communication module, the MCU, and the PCB board are all fixed inside the hollow of the cylinder;

[0109] The material of the base is a hard heat-conducting material; the probe of the temperature sensor is closely attached to the base; the probe of the piezoelectric ceramic vibration sensor is closely attached to the base;

[0110] The output ends of the piezoelectric ceramic vibration sensor, the MEMs sensor, and the infrared temperature sensor are all connected to the data input end of the data processing circuit; the data output end of the data processing circuit is connected to the data input end of the MCU, and the data output end of the MCU is connected to the data input end of the industrial-grade wireless communication module.

[0111] Further, the communication circuit is a ZigBee communication module; the antenna of the ZigBee communication module is connected to the outer wall of the housing, and the antenna and the wiring terminal of the ZigBee communication module are connected by a waveguide.

[0112] Further, the power supply is a battery.

[0113] Further, there are two PCB boards, a main PCB board and a secondary PCB board, and the two PCB boards are electrically connected; the main PCB board is on top and the secondary PCB board is at the bottom;

[0114] The main body of the piezoelectric ceramic vibration sensor is welded to the bottom surface of the main PCB board, the main body of the electro-ceramic vibration sensor passes through the through hole in the center of the secondary PCB board from top to bottom, and the probe of the electro-ceramic vibration sensor is closely attached to the top surface of the base; the battery is connected to the top surface of the main PCB board; the industrial-grade wireless communication module and the MCU are connected to the main PCB board;

[0115] The MEMs sensor is welded to the top surface of the secondary PCB board;

[0116] The temperature sensor is welded to the bottom surface of the secondary PCB board, and the temperature sensor is sandwiched between the bottom surface of the secondary PCB board and the top surface of the base, and the probe of the temperature sensor is closely attached to the top surface of the base.

[0117] Further, the base is a magnetic suction seat made of a magnet.

[0118] Furthermore, the data processing circuit is an analog-to-digital conversion circuit; the analog-to-digital conversion circuit further has an enabling circuit;

[0119] The trigger signal output terminal of the MEMs sensor is connected to the trigger signal input terminal of the enabling circuit;

[0120] The output ends of the piezoelectric ceramic vibration sensor and the temperature sensor are connected to the input end of the analog-to-digital conversion circuit;

[0121] The output end of the analog-to-digital conversion circuit is connected to the data input end of the communication circuit; the digital signal output end of the MEMs sensor is connected to the data input end of the communication circuit.

[0122] Since the sensor collects analog data, it is converted into digital data through the analog-to-digital conversion circuit and sent to the subsequent unit. Here, the accuracy requirement of the analog-to-digital conversion is not high, and 16 bits is sufficient.

[0123] To reduce costs by utilizing existing components, the data processing circuitry was implemented using an MCU. The MCU's signal inputs (if it lacks A / D conversion capabilities, an A / D converter is added to the corresponding input ports) are connected to the outputs of the three sensors. One MCU input is connected to the trigger signal output of the MEMS sensor. The MCU output data is transmitted via the ZigBee communication module.

[0124] The principle behind this example is to mount (adsorb) the entire device to the corresponding position on the equipment via a base (magnetic base). The piezoelectric ceramic vibration sensor's probe, rigidly connected to the structural components, senses high-frequency vibrations from the equipment and converts them into electrical signals. The MEMs sensor senses low-frequency vibrations from the equipment and converts them into electrical signals. The temperature sensor's probe detects the temperature of the measured location transmitted from the base and converts it into an electrical signal. A data processing circuit converts the electrical signals for high- and low-frequency vibration and temperature measurements into digital signals that are transmitted to the communication module. Here, the MEMs sensor, due to its inherent functional and performance characteristics, not only provides high-density continuous low-frequency monitoring but also triggers the overall operation of the monitoring device.

[0125] Furthermore, the power supply is a rechargeable power supply. Due to the low power consumption and triggering characteristics of the MEMs of this device, when the device (intermittent working device) is not working, the device is also basically in a non-working state, and the working energy consumption is very low.

[0126] The device can use a mature rechargeable power supply, does not require a high life span of the rechargeable power supply, and is easy to maintain.

[0127] Furthermore, the magnetic suction base includes a main magnet and sub-magnets; the main magnet is disc-shaped and is directly below the probe of the piezoelectric ceramic vibration sensor;

[0128] There are multiple sub-magnets which are rotatably connected to the periphery of the main magnet and are symmetric about the axis of the main magnet.

[0129] Furthermore, the connection structure between the main magnet and the sub-magnets is as follows: it includes a pressure plate and a connecting rod; a spherical crown-shaped first notch with an upward opening is formed at the edge of the pressure plate, and a groove is formed on the wall of the first notch; a spherical crown-shaped second notch with a downward opening is formed at the edge of the sub-magnet, and a groove is formed on the wall of the second notch; the first ends of the connecting rods are respectively connected with balls corresponding to the shapes of the first and second notches, the front and rear of the connecting rods are respectively in the grooves of the pressure plate and the sub-magnet; the two balls are respectively in the first and second notches.

[0130] Since the equipment where the device in this example is applied may have an uneven curved surface, therefore, multiple sub-magnets are used to adsorb near the monitoring position, and a connecting rod is used to pull the main magnet, making the device in this example relatively stable. The device in this example is small in size and diverse in monitoring data, and can preferably extract impact signals.

[0131] Method 3 (such as Figure 8-1 , 8-2 , 9, 10) of the monitoring device, including a base and a main body, the base is connected to the bottom of the main body, and a sensor and an industrial-grade wireless communication module are installed in the main body; the data of the sensor is transmitted to the MCU, and then transmitted from the MCU to the industrial-grade wireless communication module; it also includes an RFID system, the RFID tag of the RFID system is installed on the base, and the RFID card reading circuit of the RFID system is installed on the main body; the main body and the base are detachably connected; the data of the RFID card reading circuit is transmitted to the MCU, and then transmitted from the MCU to the industrial-grade wireless communication module;

[0132] A first through hole is formed at the central position of the base; the RFID tag is wrapped with a sealing layer, and the bottom surface of the sealing layer is connected to the top surface of the base; a second through hole is formed in the sealing layer, and the position of the second through hole corresponds to the central position of the coil of the RFID tag;

[0133] A convex column facing downward is provided at the middle position of the bottom of the housing of the main body, and the convex column is detachably connected to the inner cavity of the first through hole; the antenna of the RFID card reading circuit is located at the bottom of the housing and is annularly arranged around the convex column.

[0134] The principle of this device is to connect the main body to the base, and the base is fixed on the device to be monitored. During operation, the RFID card reading circuit emits radio wave energy of a specific frequency to the RFID tag, driving the RFID tag to transmit its ID Code. At this time, the RFID card reading circuit receives this ID Code and sends it to the upper-level monitoring network through the communication circuit. At this time, even if the main body is replaced, it will not affect the identification of the device to be monitored by the monitoring network.

[0135] Furthermore, in the axial cross-section, the structures of the RFID tag and the sealing layer are as follows:

[0136] The tag layer is formed by wrapping the RFID tag with a sealing material; the metal layer is formed by wrapping a metal sheet with a sealing material. In the metal layer, there is a gap between the upper part of the metal sheet and the sealing material; the tag layer is connected above the metal layer.

[0137] Furthermore, the sealing material is soft glue (such as rubber or silica gel).

[0138] Furthermore, the coil of the RFID tag is in a circular ring shape; the antenna of the RFID card reading circuit is in a circular ring shape;

[0139] The convex post is in a cylindrical shape, and the convex post is inside the hollow of the circular ring-shaped antenna; the bottom surface of the housing of the main body is circular;

[0140] There is a downward annular concave on the top surface of the base, and both the RFID tag and the sealing layer are embedded in the annular concave; when the main body is connected to the base, the antenna of the RFID card reading circuit is in the annular concave.

[0141] Furthermore, the outer wall of the convex post is provided with an external thread, and the inner wall of the first through hole is provided with a corresponding internal thread.

[0142] Furthermore, the convex post is hollow, and the material of the convex post is hard and heat-conductive;

[0143] The sensor includes a piezoelectric ceramic vibration sensor and a temperature sensor; the probe of the piezoelectric ceramic vibration sensor is fixed inside the hollow of the convex post; the probe of the temperature sensor is attached to the bottom surface of the hollow of the convex post.

[0144] The height of the convex post corresponds to the depth of the first through hole. When the main body is connected to the base, the bottom surface of the convex post is flush with the bottom surface of the first through hole.

[0145] Furthermore, the base is a magnetic adsorption base composed of a magnet;

[0146] The magnetic adsorption base includes a main magnet and sub-magnets; the first through hole is located at the central position of the main magnet; there are multiple sub-magnets, which are rotatably connected to the periphery of the main magnet and are symmetric about the axis of the main magnet;

[0147] The connection structure of the main magnet and the sub-magnet is as follows: it includes a pressure plate and a connecting rod; the pressure plate is in a circular ring shape and presses on the outer edge position of the top surface of the main magnet;

[0148] At the edge of the pressure plate, there is a first notch in the shape of a spherical crown with an upward opening, and a groove is opened on the wall of the first notch; at the edge of the sub-magnet, there is a second notch in the shape of a spherical crown with a downward opening, and a groove is opened on the wall of the second notch; at the head end of the connecting rod, balls corresponding to the shapes of the first and second notches are respectively connected, and the front and rear of the connecting rod are respectively in the grooves of the pressure plate and the sub-magnet; the two balls are respectively in the first and second notches.

[0149] Furthermore, a protrusion for welding is connected to the base.

[0150] The main considerations for adopting the above structural design are as follows: Since the environment such as temperature and vibration at the use site is relatively harsh, this device should have high reliability.

[0151] In this solution, the mature RFID tag technology is adopted. There is a metal layer separated below the RFID tag, making the metal layer serve as a signal reflection layer, reducing the influence of the metal in the use environment on the tag. The tag is wrapped with a soft glue sealing layer, reducing the influence of high temperature, vibration, impact, etc. of the monitored device on the tag. The circular alignment design of the RFID tag and the base ensures that there is no problem with the antenna alignment direction when the sensor is installed on the intelligent seat; for those with welding requirements, welding ears can be added on both sides of the circular intelligent seat.

[0152] At the same time, the data sent out by the RFID tag technology is relatively simple, only the ID code. The data information of the ID code is used as a data input of the communication circuit, and the RFID card reading circuit is connected to the power supply. For engineers, this can be completed according to the instructions or Demo of the RFID system. And there is no need for principled modification of existing circuits such as sensors and communication circuits.

[0153] When this device is in use, as long as the base and the device monitoring point are bound, even if there are movements, replacements, etc. of the sensor part, the control end of the monitoring network can automatically identify and update.

Claims

1. A device status monitoring data collection system using a mobile device, characterized in that It includes a mobile device, a mobile gateway, and multiple monitoring devices; each monitoring device detects a device detection point respectively; The monitoring device includes a power supply, a sensor, a data processing module, an MCU, and an industrial-grade wireless communication module; the power supply powers the sensor, the data processing module, the MCU, and the industrial-grade wireless communication module; the sensor collects the monitoring signal of the monitored device, and after converting the signal through the data processing module, it is sent out by the industrial-grade wireless communication module; The mobile gateway includes a battery, a Bluetooth communication module, an industrial-grade wireless communication module, and an MCU; the battery powers the Bluetooth communication module, the industrial-grade wireless communication module, and the MCU; the mobile gateway communicates with the mobile device through Bluetooth communication; the mobile gateway communicates with the monitoring device through the industrial-grade wireless communication module; a. The communication process of the monitoring device includes: After waking up the monitoring device in the sleep state regularly; The data collected by the sensor is put into the memory; and the industrial-grade wireless communication module is turned on to start receiving data from the mobile gateway; if data from the mobile gateway is received, the MCU controls the operation of the monitoring device according to the received data instruction; If there is no data from the mobile gateway, the industrial-grade wireless communication module is switched to the transmit state; If the transmit channel is busy, after waiting for a certain period of time, the idle / busy state of the transmit channel is detected again; until the transmit channel is idle, the data in the memory is sent to the mobile gateway; After the data is sent, the monitoring device returns to the sleep state; b. The communication process of the mobile gateway includes: First, judge whether there is a new command; If there is a new command, the industrial-grade wireless communication module is switched to the transmit state to continuously send the new command; If there is no new command, the industrial-grade wireless communication module is switched to the receive state; if there is data from the monitoring device, it is received and stored, if there is no data from the monitoring device, it is in a waiting state; When an instruction from the mobile device is received through the Bluetooth communication module, the data in the memory is uploaded according to the instruction; The structure of the monitoring device is: It includes a housing, a piezoelectric ceramic vibration sensor for high-frequency monitoring, a MEMs sensor for low-frequency monitoring, a temperature sensor, and a data processing module; the power supply powers the piezoelectric ceramic vibration sensor, the MEMs sensor, the temperature sensor, and the data processing module; the power supply, the piezoelectric ceramic vibration sensor, the MEMs sensor, the temperature sensor, the data processing module, the MCU, and the industrial-grade wireless communication module are all connected to the PCB board; The housing is a hollow cylinder, the bottom surface of the cylinder is open, and a base is fixed to the open bottom surface; the piezoelectric ceramic vibration sensor, the MEMs sensor, the temperature sensor, the data processing module, the industrial-grade wireless communication module, the MCU, and the PCB board are all fixed inside the hollow of the cylinder; The material of the base is a hard heat-conducting material; the probe of the temperature sensor is closely attached to the base; the probe of the piezoelectric ceramic vibration sensor is closely attached to the base; The output ends of the piezoelectric ceramic vibration sensor, the MEMs sensor, and the infrared temperature sensor are all connected to the data input end of the data processing module; the data output end of the data processing module is connected to the data input end of the MCU, and the data output end of the MCU is connected to the data input end of the industrial wireless communication module; The base is a magnetic absorption base composed of magnets; the magnetic absorption base includes a main magnet and sub-magnets; the main magnet is disc-shaped and is directly below the probe of the piezoelectric ceramic vibration sensor; there are multiple sub-magnets, which are rotatably connected to the periphery of the main magnet and are symmetric about the axis of the main magnet; The connection structure between the main magnet and the sub-magnets is as follows: it includes a pressure plate and a connecting rod; a spherical crown-shaped first notch with an upward opening is formed at the edge of the pressure plate, and a groove is formed on the wall of the first notch; a spherical crown-shaped second notch with a downward opening is formed at the edge of the sub-magnet, and a groove is formed on the wall of the second notch; the first ends of the connecting rods are respectively connected with balls corresponding to the shapes of the first and second notches, and the front and rear of the connecting rods are respectively in the grooves of the pressure plate and the sub-magnets; the two balls are respectively in the first and second notches.

2. The system according to claim 1, wherein It further includes a network transmission mode adapter, which includes an industrial bus data interface module, an MCU, an industrial wireless communication module, and a power supply; the power supply supplies power to the industrial bus data interface module, the industrial wireless communication module, and the MCU; the data output end of the industrial bus data interface module is connected to the data input end of the MCU, and the data output end of the MCU is connected to the wired data input end of the industrial wireless communication module; The communication process of the adapter includes: After regularly waking up the adapter in the sleep state; The data obtained by the industrial bus data interface module is put into the memory; and the industrial wireless communication module is turned on to start receiving data from the mobile gateway; if data from the mobile gateway is received, the MCU controls the operation of the adapter according to the received data instructions; If there is no data from the mobile gateway, the industrial wireless communication module is switched to the transmitting state; If the transmitting channel is in a busy state, after waiting for a certain period of time, the idle / busy state of the transmitting channel is detected again; until the transmitting channel is in an idle state, the data in the memory is sent to the mobile gateway; After the data is sent, the adapter returns to the sleep state.

3. The system according to claim 1, wherein The industrial wireless communication module is a communication module based on IEEE802.15.4 or a Zigbee module.

4. The system according to claim 1, wherein the PCB board There are two main PCB boards and auxiliary PCB boards, and the two PCB boards are electrically connected; the main PCB board is on the top and the auxiliary PCB board is on the bottom; The main body of the piezoelectric ceramic vibration sensor is welded to the bottom surface of the main PCB board, and the main body of the piezoelectric ceramic vibration sensor passes through the through hole in the center of the auxiliary PCB board from top to bottom, and the probe of the piezoelectric ceramic vibration sensor is closely attached to the top surface of the base; the battery is connected to the top surface of the main PCB board; the industrial wireless communication module and the MCU are connected to the main PCB board; The MEMs sensor is welded to the top surface of the auxiliary PCB board; The temperature sensor is welded to the bottom surface of the auxiliary PCB board, and the temperature sensor is clamped between the bottom surface of the auxiliary PCB board and the top surface of the base, and the probe of the temperature sensor is closely attached to the top surface of the base.

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