Information processing device, installation device, and information processing method

Abstract

An information processing device is used in a mounting device that picks up components and places them on a substrate. The information processing device acquires a captured image of the component and sets multiple detection lines for the component to detect brightness differences in the captured image. A control unit then determines a reference position for the outer edge based on the multiple detection lines. The control unit then calculates candidate values ​​for one or more outer edge candidates located along the detection line, using a predetermined weight coefficient that decreases with distance from the reference position. The weight coefficients are then added to the candidate values. Based on the determined candidate values, the control unit selects the position of the outer edge located along the detection line.

Description

Technical Field

[0001] The invention disclosed in this specification relates to an information processing device, an installation device, and an information processing method. Background Art

[0002] In the past, as an information processing device, for example, the following scheme has been proposed: an initial position corresponding to a registration image included in a search object image is obtained, and a corresponding point exploration line of a pattern model is arranged in a manner overlapping on the search object image according to the initial position, and the edge strength and edge angle at the position along the corresponding point exploration line on the search object image are used to obtain the corresponding point on the search object image corresponding to each base point for each corresponding point exploration line, and precise positioning is performed with a higher accuracy than the accuracy of the assigned initial position in a manner such that the cumulative value of the evaluation value of each base point and the corresponding point of the base point becomes minimum or maximum (for example, refer to patent document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2010-67247 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] However, the device of Patent Document 1 does not consider, for example, the case where multiple edge candidates are detected as the outer edge of a component. In such a case, accurate edge detection may not be possible. In other words, there is a demand for more reliable detection of the outer edge of a component in information processing devices.

[0008] The present disclosure has been made in view of such a problem, and a main object thereof is to provide an information processing device, a mounting device, and an information processing method that can more reliably detect the position of an outer edge portion of a component.

[0009] Technical solutions to problems

[0010] The information processing device, the installation device, and the information processing method disclosed in this specification employ the following means to achieve the above-mentioned main objects.

[0011] The information processing device disclosed in this specification is used in an installation device that picks up components and arranges them on a substrate. The information processing device includes a control unit, which obtains a captured image containing the component, sets a plurality of detection lines for the component to detect the brightness difference of the component with respect to the captured image, calculates a reference position of the outer edge portion based on the plurality of detection lines, uses a predetermined weight coefficient in which the weight tends to decrease as the distance from the reference position decreases, to calculate a candidate value obtained by adding the weight coefficient to one or more candidates of the outer edge portion existing on the detection line, and selects the position of the outer edge portion existing on the detection line based on the obtained candidate value.

[0012] In this information processing device, multiple detection lines are set for a component to detect brightness differences in a captured image containing the component. A reference position for the outer edge is determined based on the multiple detection lines. A predetermined weight coefficient, with the weight decreasing as the distance from the reference position decreases, is used to determine candidate values ​​for one or more outer edge candidates located on the detection line. The candidate values ​​are then added to the weight coefficients. The position of the outer edge located on the detection line is then selected based on the determined candidate values. Even when there are multiple candidates for the outer edge of the component, the position of the outer edge on the detection line is selected based on the reference positions determined based on the multiple detection lines and the weight coefficients added. Therefore, even if a candidate is detected locally and deviates from the proper position, the position of the outer edge associated with the component can be detected more reliably. Here, the phrase "the weight decreases as the distance from the reference position decreases" allows for the presence of local portions whose weight does not decrease even if they move away from the reference position. Overall, the weight decreases as the distance from the reference position decreases. Furthermore, the control unit may set a detection line spanning both the component area and the area outside the component area to select the position of the outer edge of the component itself, or may set a detection line spanning a specific portion (e.g., a terminal, etc.) and another portion (e.g., a body, etc.) of the component to select the position of the outer edge of a specific portion of the component. Similarly, the "position of the outer edge associated with the component" may be the outer edge of the entire component or the outer edge of a specific portion of the component. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 1 is a schematic explanatory diagram showing an example of the mounting system 10 .

[0014] Figure 2 It is an explanatory diagram of the component P picked up by the mounting head 22.

[0015] Figure 3 This is a flowchart showing an example of an installation processing routine.

[0016] Figure 4This is a flowchart showing an example of an outer edge detection processing routine.

[0017] Figure 5 1 and 2 are explanatory diagrams showing the setting of detection lines 45 on outer edge portions 41 to 44 of a component P.

[0018] Figure 6 It is a relationship diagram between the detection line position and the brightness value and its differential value.

[0019] Figure 7 It is a relationship diagram between edge candidate positions and weight coefficients.

[0020] Figure 8 1 and 2 are explanatory diagrams of photographs of the component P. FIG.

[0021] Figure 9 This is an explanatory diagram of adding weight coefficients to edge candidates.

[0022] Figure 10 It is an explanatory diagram of a component image 40B obtained by imaging another component PB.

[0023] Figure 11 It is a relationship diagram between other edge candidate positions and weight coefficients.

[0024] Figure 12 This is an explanatory diagram of a component image 40C in which the outer edge portion of a specific portion Ps of a component PC is detected. DETAILED DESCRIPTION

[0025] Hereinafter, this embodiment will be described with reference to the drawings. Figure 1 It is a schematic explanatory diagram showing an example of the mounting system 10 of the present disclosure. Figure 2 1 is an explanatory diagram of a component P picked up by a mounting head 22. The mounting system 10 is a system that performs mounting processing related to mounting a component P on a substrate S. The mounting system 10 includes a mounting device 11 and a management computer (PC) 35. The mounting system 10 is configured as a mounting line in which a plurality of mounting devices 11 are arranged from upstream to downstream. Figure 1 In the figure, for the sake of convenience, only one mounting device 11 is shown. In addition, in this embodiment, the left-right direction (X axis), the front-back direction (Y axis) and the up-down direction (Z axis) are as shown in FIG. Figure 1 shown.

[0026] like Figure 1 As shown, the mounting device 11 includes a substrate processing unit 12, a component supply unit 14, a parts camera 16, a mounting unit 20, and a control device 30. The substrate processing unit 12 is a unit that carries out the loading, conveying, fixing at the mounting position, and unloading of the substrate S. The substrate processing unit 12 has a Figure 1A pair of conveyor belts are provided at intervals in front and behind and are stretched along the left and right directions. The substrate S is transported by the conveyor belts.

[0027] The component supply unit 14 comprises a plurality of feeders equipped with tape reels and a tray unit, which is detachably mounted on the front side of the mounting device 11. A tape is wound around each reel, and a plurality of components P are held on the tape surface along its length. The tape is unwound from the reel toward the rear, and the feeder unit delivers the exposed components to a pickup position where they can be sucked by the suction nozzle 23. The tray unit comprises a tray on which a plurality of components are arranged, and it takes these trays to and from a predetermined pickup position.

[0028] The parts camera 16 is an imaging unit that captures images of one or more components P picked up and held by the mounting head 22. The parts camera 16 is positioned between the component supply unit 14 and the substrate processing unit 12. The imaging range of the parts camera 16 is above the parts camera 16. When the mounting head 22 holding a component P passes above the parts camera 16, the parts camera 16 captures the image and outputs the captured image data to the control device 30.

[0029] The mounting section 20 is a unit that picks up components P from the component supply section 14 and moves toward the substrate S fixed to the substrate processing section 12. The mounting section 20 includes a head moving section 21, a mounting head 22, and a suction nozzle 23. The head moving section 21 includes a slide that is guided by a guide rail and moves in the XY direction, and a motor that drives the slide. The mounting head 22 can be detachably mounted on the slide and moves in the XY direction through the head moving section 21. The mounting head 22 is detachably mounted on its lower surface side with one or more suction nozzles 23 (for example, 16, 8, 4, etc.), and can pick up multiple components P at a time. The suction nozzle 23 is a picking component that picks up components using negative pressure. In addition, the picking component can also be a mechanical chuck that holds the component P. A marking camera 24 is provided on the lower surface side of the mounting head 22 (or slider). The marking camera 24 is, for example, a shooting device that can shoot substrate S, components P, etc. from above. The marking camera 24 moves in the XY direction as the mounting head 22 moves. The lower portion of the mark camera 24 is an imaging area, in which a reference mark for grasping the position of the substrate S attached to the substrate S is imaged, and the image is output to the control device 30 .

[0030] Here, the components P picked up by the mounting head 22 will be described. Figure 2 1 is an explanatory diagram showing an example of a mounting head 22 that has picked up a component P, as viewed from below. Figure 2 In FIG, an example is shown in which the mounting head 22 includes four suction nozzles 23. Figure 2 In FIG, the normal position of the component P is indicated by a dotted line. Figure 2As shown, the component P may also include a first area P1 including an outer edge (also called an edge) and a second area P2 having a brightness value different from that of the first area P1. The main body of the component P is the first area P1, and the terminal is the second area P2. When the component P is picked up by the mounting head 22, there is a case where the position of the component P is offset in the XY coordinate direction relative to the normal position (component Pa) or a case where the component P is rotated relative to the normal position due to tilt (component Pb). In the control device 30, the change in the pickup state of the component P is detected, the offset is corrected, and the component P is configured toward the substrate S.

[0031] like Figure 1 As shown, the control device 30 is configured as a microprocessor centered around a CPU 31 and includes a storage unit 32 for storing various data. The control device 30 functions as an information processing device for detecting the position of the outer edge of the component P. The control device 30 outputs control signals to the substrate processing unit 12, the component supply unit 14, the parts camera 16, and the mounting unit 20, and receives signals from the mounting unit 20, the component supply unit 14, and the parts camera 16. The storage unit 32 stores mounting condition information, including the order in which components P are mounted on the substrate S, the arrangement positions of the components P, and the types of suction nozzles 23 capable of picking up the components P.

[0032] The management PC 35 is a computer that manages information about each device in the installation system 10. The management PC 35 includes a control unit, a storage unit, a display, and an input device. The control unit is configured as a microprocessor centered around a CPU. The storage unit stores information related to production management of the installation system 10, as well as installation condition information.

[0033] Next, the operation of the mounting system 10 of the present embodiment configured as described above will be described, firstly, the mounting process in the mounting device 11. First, the process of mounting the component P onto the substrate S by the mounting device 11 will be described. Figure 3 This is a flowchart showing an example of a mounting processing routine executed by the CPU 31 of the mounting control unit 30 of the mounting device 11. The routine is stored in the storage unit 32 of the mounting device 11 and is executed based on a start instruction from the operator. When the routine is started, the CPU 31 reads and obtains the mounting condition information of the substrate S produced this time (S100), and transports the substrate S to the mounting position through the substrate processing unit 12 and performs a fixing process (S110). Next, the CPU 31 sets the component to be picked up based on the mounting condition information (S120), causes the mounting head 22 to pick up the component P from the feeder at a predetermined position, and moves it toward the top of the part camera 16 (S130).

[0034] Next, the CPU 31 causes the parts camera 16 to photograph the component P in the state picked up by the mounting portion 20 (S140), and performs the component outer edge detection process (S150) to detect the outer edge (edge) of the component P. Next, the CPU 31 sets an offset correction value (S160) for correcting the positional offset and / or rotational offset based on the position of the outer edge of the component P detected by the component outer edge detection process, uses the offset correction value to correct the offset of the component P, and configures the component P toward the substrate S (S170). Then, the CPU 31 determines whether the installation process of the substrate S currently fixed at the mounting position is completed (S180), and when the installation process is not completed, executes the process after S120. That is, the CPU 31 then repeatedly executes the following process: setting the component P to be picked up and configured, causing the mounting portion 20 to pick up the component P, more accurately detecting the outer edge of the component P, and correcting the offset of the component P, and configuring the component P toward the substrate S. On the other hand, in S180, when the mounting process of the substrate S currently fixed to the mounting position is completed, the CPU 31 causes the substrate processing unit 12 to discharge the substrate S that has been mounted (S190), and determines whether the production of all substrates S set in the mounting condition information is completed (S200). If the production of all substrates S is not completed, the CPU 31 executes the processing after S110. On the other hand, when the production of all substrates S is completed, the routine ends.

[0035] Next, the component outer edge detection process in S150 will be described. Figure 4 This is a flowchart showing an example of a component outer edge detection routine executed by CPU 31 of control device 30. This routine is stored in storage unit 32 and executed in step S150 of the mounting process routine. When this routine is started, CPU 31 first obtains an image captured by part camera 16 (S300), detects the approximate position of the component included in the captured image (S310), and sets the position of the detection line (S320).

[0036] Figure 5 This is an explanatory diagram of setting a detection line 45 at the outer edge portions 41 to 44 of the component P. Figure 5 (A) is an explanatory diagram of the component image 40. Figure 5(B) is an explanatory diagram showing detection lines 45 set in component image 40. CPU 31 detects the approximate area of ​​component P contained in component image 40 based on differences in brightness values, and sets multiple detection lines 45 at the outer edges 41 to 44 of component P, spanning the area of ​​component P and the area outside of component P to detect brightness differences. In this control device 30, the first side of component P is defined as outer edge 41, the second side as outer edge 42, the third side as outer edge 43, and the fourth side as outer edge 44. Three detection lines 45 are set on the left and three on the right of outer edges 41 and 42, and four detection lines 45 are set at the center of outer edges 43 and 44. The length, arrangement, number, and other patterns of these detection lines 45 are determined empirically to ensure more accurate detection of the outer edges of component P and are pre-set for each component P. The control device 30 sets the position of the detection line 45 so that the predetermined detection line pattern of the component P is applied to the outer edge portions 41 to 44 of the component P (see Figure 5 (B) The CPU 31 sets the detection line 45 in accordance with the approximate position of the component P and then performs edge detection with higher accuracy.

[0037] After S320 , the CPU 31 obtains a differential value based on the brightness value on each detection line 45 , and detects the position of a maximum value (edge ​​candidate) ( S330 ). Figure 6 This is a relationship diagram between the detection line position, brightness value, and its differential value. Here, the detection line position is standardized as "0" at the starting point of the detection line 45 and "1" at the end point. When the differential value is calculated based on the difference in brightness value at each position of the detection line, as shown in the figure, Figure 6 As shown in FIG, the peak value of the maximum differential value can be detected as the outer edge portion (edge ​​candidate) of the element P. However, as Figure 5 As shown, there are a first region P1 and a second region P2 having different brightness. Furthermore, when the detection line 45 crosses the region outside the element, multiple maximum peaks are detected. Therefore, the CPU 31 needs to detect the correct outer edge of the element P.

[0038] Next, the CPU 31 averages the detection positions of the edge candidates detected in S330 and obtains the reference position (S340). Here, the CPU 31 averages the entire periphery of the component P and obtains the reference position for the entire periphery. For example, the CPU 31 may also use the average value of the maximum peak position of each detection line and its number as the reference position. For example, it can be obtained by accumulating the number of detection lines with a maximum peak position of 0.1, the number of detection lines with a maximum peak position of 0.2, etc. and dividing it by the number of detection lines. In the mounting device 11, since the position of the detection line is set based on the approximate position of the component P in S310, the reference position is roughly obtained as the center of the detection line (0.5).

[0039] Next, the CPU 31 obtains a preset weight coefficient, applies the weight coefficient to the edge candidate detected on each detection line, obtains a candidate value for each edge candidate ( S350 ), and selects the position of the edge on the detection line 45 based on the candidate value ( S360 ). Figure 7 It is a relationship diagram between the edge candidate position and the weight coefficient. The weight coefficient is determined as a coefficient of a normal distribution centered on the reference position in such a way that the weight tends to decrease as it is farther from the reference position. For example, the weight coefficient can be calculated according to the probability density function of the normal distribution (refer to Mathematical Formula 1) using the edge candidate position x, the reference position μ, and the variable σ for weight coefficient adjustment. The weight coefficient is the highest value at the reference position and is set to a smaller value as it is farther away from the reference position. In addition, in the variable σ2 where the variable σ is greater than the predetermined variable σ1, a weight coefficient that changes smoothly with the reference position as the center is obtained, and in the smaller variable σ1, a weight coefficient that changes more greatly is obtained. Then, CPU31 selects the edge candidate position with a larger candidate value as the edge position of component P. The weight coefficient is set empirically according to the category of component P, the brightness difference between each area, etc. As Figure 7 As shown, CPU31 is set to variable σ1, for example. When there is an edge candidate position at the reference position (0.5), the highest value 1.5 is applied as the weight coefficient to the edge candidate position. When there is an edge candidate position 0.1 away from the reference position, the value 0.5 is applied as the weight coefficient to the edge candidate position.

[0040] [Number 1]

[0041]

[0042] x: edge candidate position

[0043] μ: Reference position (average edge position)

[0044] σ: weight coefficient

[0045] Here, a specific example of applying the weighting coefficient will be described. Figure 8 1 and 2 are explanatory diagrams of photographs of the component P. FIG. Figure 9 This is an illustration of adding weight coefficients to edge candidates. Figure 9 (A) is an example of weight coefficient and edge candidates 1 and 2. Figure 9 (B) is an explanatory diagram showing an example of candidate values ​​obtained by adding weight coefficients to edge candidates 1 and 2. Figure 8As shown, when the first area P1 and the second area P2 are located in the component P, edge candidates 1 and 2 are detected in a specific detection line 45. Since the detection line 45 may have slightly different sizes depending on the batch of the component P, the manufacturing company, etc., it is necessary to have a predetermined length that can detect the position of the outer edge even if there are such differences. There is a case where it is inevitable that it will cross multiple areas with different brightness. Figure 8 In the detection line 45, the brightness difference between the first area P1 and the second area P2 is larger than the brightness difference between the area outside the element and the first area P1. Figure 9 As shown in (A), a maximum peak value of edge candidate 2 is larger than that of the legitimate edge candidate 1. If the edge position is determined in this state, the second region P2 is mistakenly detected as the outer edge of the component. However, the control device 30 multiplies the maximum peak value by the weighting coefficient determined so that the reference position obtained by averaging each detection line 45 becomes the maximum value to determine the candidate value. Therefore, as Figure 9 As shown in (B), the control device 30 applies the weighting coefficients to select the appropriate edge candidate 1 closest to the reference position as the maximum candidate value and as the edge position. In this way, the control device 30 uses the differential value of the actual measurement value, rather than an estimated value, and performs more appropriate corrections using the weighting coefficients, thereby enabling more appropriate edge position selection.

[0046] Then, the CPU 31 determines the outer peripheral position of the component P by using the selected edge position, thereby determining the position of the component P ( S370 ), and ends this routine. After S370 , the CPU 31 executes the processes from S160 onwards.

[0047] Here, the correspondence between the components of this embodiment and the components of the present disclosure is clarified. The control device 30 of this embodiment corresponds to the information processing device of the present disclosure, and the CPU 31 corresponds to the control unit. In addition, in this embodiment, by describing the operation of the control device 30, an example of the information processing method of the present disclosure is also clarified.

[0048] In the embodiment described above, the control device 30 sets multiple detection lines 45 along the outer edges 41 to 44 of a component P. These detection lines 45 detect brightness differences across the region of the component P and outside the region of the component P in a captured image. Reference positions of the outer edges 41 to 44 are determined based on these multiple detection lines 45. Furthermore, the control device 30 uses a predetermined weighting factor, which decreases with increasing distance from the reference position, to determine candidate values ​​by adding the weighting factor to one or more edge candidates located on the detection lines 45. The control device 30 then selects the position of the outer edge located on the detection lines 45 based on the determined candidate values. Even in the case where multiple edge candidates exist at the outer edges of the component P, the edge position of the detection lines 45 is selected based on the reference positions determined based on the multiple detection lines 45 and the weighting factor. Therefore, even if edge candidates are detected locally and deviate from their proper positions, the edge position of the component can be detected more reliably.

[0049] In addition, in order to find the reference position relative to the entire periphery of the component P, the CPU 31 can use the reference position that summarizes the entire periphery, and detect the edge position of the component more reliably through simple processing. Furthermore, since the CPU 31 uses a weight coefficient of a normal distribution centered on the reference position, it is possible to perform a higher weighting the closer to the reference position, and a lower weighting the farther from the reference position. Furthermore, since the component P includes a first area P1 of the outer edge and a second area P2 having a brightness value different from that of the first area P1, it is possible to more reliably detect the edge position of the component P having multiple brightness values ​​in which the outer edge is difficult to detect. Furthermore, since the mounting device 11 has a mounting head 22 that picks up the component P and arranges it on the substrate, and a control device 30 that functions as the above-mentioned information processing device, it is possible to more reliably detect the outer edge of the component P undergoing mounting processing, and to more reliably arrange the component P.

[0050] Furthermore, the information processing device disclosed in this specification is not limited to the above-described embodiment, and can of course be implemented in various forms as long as it falls within the technical scope of the present invention.

[0051] For example, in the above-described embodiment, the CPU 31 calculates the reference position based on the average value of the entire periphery of the component P. However, this is not particularly limiting. For example, the edge detection positions of the detection line 45 set for each side of the component P may be averaged to calculate the reference position for each side. This control device 30 enables more reliable detection of the outer edge of the corresponding component. Furthermore, the CPU 31 may also average the edge detection positions of the detection line 45 set for each of multiple sides of the component P to set the reference position for each side. This control device 30 uses the reference position aggregated for each of multiple sides for the same side, making it possible to easily and reliably detect the outer edge of the component P.

[0052] In the above embodiment, the case where CPU 31 applies a weight coefficient calculated according to a function to a component P is described, but it is not particularly limited to this. CPU 31 can also apply weight coefficients defined by different functions to multiple sides of component P based on the detection stability of each side of component P. Figure 10 This is an explanatory diagram of a component image 40B obtained by photographing another component PB. In this component PB, the sides of the first area P1 with upper and lower sides in the periphery of the component PB are straight lines, and the detection stability is high. On the other hand, the second area PB2 with right and left sides in the periphery of the component PB is not a straight line, but is irregularly concave and convex, so the detection stability is low. For such a component PB, the CPU 31 may also set the reference position by summarizing the upper and lower sides with higher detection stability, and set the reference position for each side corresponding to the left and right sides. In addition, for the outer edges 43 and 44 of the left and right sides, a variable σ that is larger than the upper and lower outer edges 41 and 42 may also be used to set the weight coefficient. In the control device 30, by using weight coefficients set by multiple functions, the edge position of the component P can be detected more reliably.

[0053] In the above embodiment, the CPU 31 uses the weight coefficient defined by a function of normal distribution centered at the reference position. However, the present invention is not particularly limited to this, and a weight coefficient defined by a function other than normal distribution may be used. Figure 11 is the relationship between other edge candidate positions and weight coefficients, Figure 11 (A) is an example of a weight coefficient defined by a linear function, Figure 11 (B) is an explanatory diagram of an example of a weight coefficient defined as a weight that tends to decrease as the distance from the reference position increases. Figure 11 As shown in (A) of FIG. 1 , the CPU 31 may use a weight coefficient defined by a function having a linear relationship with the reference position as the center. Alternatively, as shown in FIG. Figure 11As shown in (B), the CPU 31 may also use a weight coefficient set by a function that allows the local existence of a portion whose weight does not decrease even if it moves away from the reference position. The CPU 31 only needs to appropriately use the weight coefficient set by the t function that matches the element P to be detected. In addition, in the above embodiment, the variable σ is used to obtain the weight coefficient corresponding to the variable σ, but it is not particularly limited to this, and the variable σ may also be set to a fixed value. In the control device 30, the method for obtaining the weight coefficient can be further simplified. In addition, in the above embodiment, a larger weight coefficient is set when approaching the reference position, and a larger value of the candidate value obtained by adding the weight coefficient is selected as the edge position, but the size relationship is not particularly limited to this. For example, the differential peak may be set as the negative side, and a larger weight coefficient is set on the negative side when approaching the reference position, and a larger value of the candidate value obtained by adding the weight coefficient is selected as the edge position.

[0054] In the above embodiment, the position of the outer edge of a component P having a first region P1 and a second region P2 having a brightness different from that of the first region P1 is detected. However, the present invention is not limited to this embodiment. The position of the outer edge of a component P that does not have multiple regions such as the first and second regions may also be detected. In the above embodiment, the position of the outer edge of a component P having a rectangular outer periphery is detected. However, the present invention is not limited to this embodiment. The position of the outer edge of a component P having a polygonal outer periphery or a circular or elliptical outer periphery may also be detected. Even in such components P, the edge position of the component P can be detected more reliably.

[0055] In the above embodiment, the CPU 31 sets the detection line 45 spanning the area of ​​the component P and the area outside the component P to select the position of the outer edge of the component itself, but the present invention is not limited to this. For example, the CPU 31 may also set the detection line 45 spanning a specific part of the component P (such as a terminal) and another part (such as the main body) to select the position of the outer edge of the specific part of the component P. Figure 12 This is an explanatory diagram showing detection of the outer edge of a specific portion Ps of a component P. Figure 12This is an explanatory diagram of a component image 40C for detecting the outer edge 41C of a specific portion Ps of a component PC. The component PC has a plurality of specific portions Ps as bumps. The mounting device 11 correctly detects the position of the specific portion Ps when mounting the component PC, and performs the mounting process so that the bumps match the terminals on the substrate S. The CPU 31 sets a detection line 45C in the component image 40C that spans the first area PC1 of the specific portion Ps of the component PC and the second area PC2 of other portions (main body), and selects the position of the outer edge 41C of the specific portion Ps. Then, if a foreign object 46 is present on the specific portion Ps, there is a possibility that the outer edge 41C of the specific portion Ps is erroneously detected. The CPU 31 calculates the reference position of the outer edge 41C of the specific portion Ps in the same manner as described above, calculates a candidate value obtained by adding a weight coefficient, and selects the edge position of the specific portion Ps. In this control device 30, the edge position of the specific portion Ps related to the component PC can also be detected more reliably.

[0056] In the above embodiment, the outer edge of the component P picked up by the mounting head 22 is detected, but the present invention is not particularly limited to this. For example, the outer edge of the component P may be detected based on an image captured by the mark camera 24 of the component P placed on the substrate S. In this case, the position of the outer edge of the component P can also be determined more accurately.

[0057] In the above embodiment, the information processing device and mounting device of the present invention are described as the control device 30 and the mounting device 11. However, this is not particularly limiting and may also be an information processing method. Furthermore, in the above embodiment, the mounting device 11 includes the control device 30 that functions as an information processing device. However, any mounting-related device related to the process of mounting components P on substrates S is not particularly limited. For example, the control device 30 may include an inspection device having an inspection unit that inspects the mounting status of components P, a printing and mounting device having a printing unit and a mounting unit, or a mounting inspection device having a mounting unit and an inspection unit.

[0058] Here, the information processing device, the mounting device, and the information processing method disclosed in the present invention may also be configured as follows. For example, in the information processing device disclosed in the present invention, the control unit may determine the reference position for one or more of each side of the component, each of the multiple sides of the component, and the entire periphery of the component. For a component, there is a case where the detection stability of the brightness value, shape, etc. is different for each side. In the information processing device, when the reference position is determined for each side of the component, the outer edge of the corresponding component can be detected more reliably, and for the same side, the outer edge of the component can be detected simply and reliably using the reference position summarized for each multiple sides, or the outer edge of the component can be detected more reliably through simple processing using the reference position summarized for the entire periphery.

[0059] In the information processing device disclosed herein, the control unit may determine the candidate value using different weighting coefficients for one or more sides of the component based on the detection stability of each side of the component. In this information processing device, the use of multiple weighting coefficients enables more reliable detection of the outer edge of the component.

[0060] In the information processing device disclosed herein, the control unit may use the weighting coefficients of a normal distribution centered on the reference position. In this information processing device, the normal distribution is used so that the closer to the reference position, the higher the weighting, and the farther from the reference position, the lower the weighting.

[0061] In the information processing device disclosed herein, the element may include a first region including the outer edge and a second region having a brightness value different from that of the first region. This information processing device enables more reliable detection of the outer edge of an element having regions with multiple brightness values ​​where the outer edge is difficult to detect.

[0062] The mounting device disclosed herein comprises: a mounting head for picking up components and placing them on a substrate; and any of the aforementioned information processing devices. The mounting device, by including the aforementioned information processing device, can more reliably detect the outer edge of the component being mounted, enabling more reliable component placement, etc.

[0063] The information processing method disclosed herein is used in an installation device that picks up components and configures them on a substrate, and the information processing method includes the following steps: (a) obtaining a captured image containing the component, and setting a plurality of detection lines for the component to detect the brightness difference of the component with respect to the captured image; (b) determining a reference position of the outer edge portion based on the plurality of detection lines set in step (a), and using a predetermined weight coefficient in which the weight tends to decrease as the distance from the reference position decreases, to determine a candidate value obtained by adding the weight coefficient to one or more candidates of the outer edge portion existing on the detection line; and (c) selecting the position of the outer edge portion existing on the detection line based on the candidate value determined in step (b).

[0064] Similar to the aforementioned information processing device, this information processing method, even when there are multiple candidate component outer edges, can select the position of the outer edge of each detection line based on the reference position determined using multiple detection lines and a weighting factor. Therefore, even if there are local candidates that are detected deviating from the correct position, the outer edge of the component can be detected more reliably. Furthermore, this information processing method can employ various embodiments of the aforementioned information processing device, and can also include additional steps for implementing various functions of the aforementioned information processing device.

[0065] Industrial Applicability

[0066] The information processing device and mounting device disclosed herein can be applied to the technical field of devices that perform processes such as picking up and arranging components.

[0067] Description of Reference Numerals

[0068] 10: Mounting system 11: Mounting device 12: Substrate processing unit 14: Component supply unit 16: Part camera 20: Mounting unit 21: Head moving unit 22: Mounting head 23: Suction nozzle 24: Marking camera 30: Control unit 31: CPU 32: Storage unit 35: Management PC 40, 40B, 40C: Component image 41~44, 41C: Outer edge 45, 45C: Detection line 46: Foreign matter P, PB, PC: Components P1, PB1, PC1: First area P2, PB2, PC2: Second area Ps: Specific part S: Substrate.

Claims

1. An information processing device for detecting an outer edge of a component in a mounting device that picks up a component and places it on a substrate, wherein the component includes a first region including the outer edge and a second region having a brightness value different from that of the first region. The information processing device includes a control unit, which obtains a captured image including the component, sets a plurality of detection lines spanning the first area and the second area on the outer edge of the component for the captured image to detect the brightness difference of the component, calculates a differential value based on the brightness difference at each position of each detection line, detects the maximum value of the differential value as the edge candidate of the component, averages the detection positions of the detected multiple edge candidates to obtain a reference position of the outer edge, uses a predetermined weight coefficient in which the weight tends to decrease as the distance from the reference position increases, and for one or more edge candidates existing on each of the detection lines, multiplies each edge candidate by the corresponding weight coefficient to obtain a candidate value, and selects the edge candidate position with the largest candidate value as the position of the outer edge existing on the detection line.

2. The information processing device according to claim 1, wherein The control unit obtains the reference position for one or more of each side of the component, each of a plurality of sides of the component, and the entire outer circumference of the component.

3. The information processing device according to claim 1, wherein The control unit obtains the candidate value using different weight coefficients for one side or a plurality of sides of the element based on the detection stability of each side of the element.

4. The information processing device according to any one of claims 1 to 3, wherein The control unit uses the weight coefficient of a normal distribution centered at the reference position.

5. A mounting device comprising: A mounting head that picks up components and places them on a substrate; and The information processing device according to any one of claims 1 to 4.

6. An information processing method for detecting an outer edge of a component in a mounting device that picks up a component and places it on a substrate, wherein the component includes a first region including the outer edge and a second region having a brightness value different from that of the first region. The information processing method comprises the following steps: (a) acquiring a captured image including the component, and setting a plurality of detection lines spanning the first region and the second region at an outer edge of the component in the acquired captured image to detect a brightness difference of the component; (b) calculating a differential value based on the brightness difference at each position of each detection line set in step (a), detecting the maximum value of the differential value as an edge candidate of the component, averaging the detection positions of the plurality of detected edge candidates to calculate a reference position of the outer edge portion, and using a predetermined weight coefficient in which the weight tends to decrease as the distance from the reference position decreases, for one or more edge candidates existing on each of the detection lines, multiplying each edge candidate by the corresponding weight coefficient to calculate a candidate value; and (c) The edge candidate position having the largest candidate value is selected as the position of the outer edge portion existing on the detection line.

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