Coating structure and manufacturing method

Abstract

The present invention provides a coating structure and a manufacturing method, the coating structure comprising: a substrate, an electronic component mounted on the substrate, the electronic component is encapsulated with a plastic coating layer, the plastic coating layer comprises an electromagnetic shielding region and a non-electromagnetic shielding region; the electromagnetic shielding region is covered with an electromagnetic shielding coating layer; wherein the first surface of the electromagnetic shielding region is higher or lower than the second surface of the non-electromagnetic shielding region, and the electromagnetic shielding coating layer further comprises a window, the window corresponding to the non-electromagnetic shielding region. There is a height difference between the electromagnetic shielding region and the non-electromagnetic shielding region of the plastic coating layer of the coating structure, and by utilizing this height difference, it is very easy to remove the electromagnetic shielding coating window formed by the electromagnetic shielding coating in the non-electromagnetic shielding region, thereby effectively improving the problems of residual glue, coating debris, device damage, etc. existing in the existing windowing process.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor packaging technology, and in particular relates to a coating structure and a manufacturing method thereof. Background Art

[0002] Semiconductor packaging is a process of electrically connecting a semiconductor chip to a substrate, using packaging colloid to protect the semiconductor chip and substrate from external moisture and pollutants. In order to avoid electromagnetic interference that may cause abnormal electrical functions of semiconductor packaging components, it is usually necessary to sputter an electromagnetic shielding layer outside the plastic sealing layer of the semiconductor packaging component. However, for semiconductor packaging components with antennas, the electromagnetic shielding layer needs to have a partial window corresponding to a specific area of ​​the antenna to facilitate the antenna to transmit and receive signals externally.

[0003] At present, the traditional methods for opening windows in magnetron sputtering coatings in specific areas include the shielding method and the direct removal method.

[0004] like Figure 1 As shown, the tape masking method refers to taking a high-temperature resistant tape and using the technology of mechanical upper and lower prop punching to cut it into sheets in a longitudinal manner, and then sticking the high-temperature resistant tape 6 to the position where a window is required; putting the package body with the high-temperature resistant tape 6 into the magnetron sputtering machine for coating operation. The magnetron sputtering operation generally forms a continuous coating 5, and at this moment the top of the high-temperature tape 6 is also covered by the continuous coating 5; tearing off the high-temperature resistant tape 6 on the surface of the sputtered package body, and preparing the window 5a of the coating 5 in the area covered by the high-temperature resistant tape 6.

[0005] Among them, the package body includes a substrate 1, on which electronic components 2 and an antenna 3 are mounted. The electronic components 2 and the antenna 3 are encapsulated by a plastic layer 4. The outer side of the plastic layer 4 is covered with a coating 5. The window 5a of the coating 5 corresponds to the antenna 3, which facilitates the transmission and reception of electrical signals by the antenna 3.

[0006] The direct removal method is to directly scrape off the coating from a specific area (corresponding to the antenna area) of the sputtered package surface with a scraper.

[0007] The disadvantages of the tape masking method are: the high-temperature tape has poor dimensional stability during the physical punching process, the dimensional accuracy of the tape after punching is poor, and there is glue wire drawing on the cutting edge, which affects subsequent operations; the high-temperature tape of a specific size needs to be pasted to the designated coating window position after punching, and the attachment accuracy is poor and wrinkles are prone to occur; the high-temperature tape is difficult to tear off after sputtering, and residual glue and coating debris are prone to occur in the area after the high-temperature tape is torn off, affecting the appearance and performance of the package.

[0008] The disadvantages of the direct removal method are: low window position accuracy, easy device damage, plating debris, etc., which affect the appearance and performance of the package.

[0009] In view of this, it is necessary to provide a new coating structure and manufacturing process to overcome the problem of opening windows in specific areas of traditional coatings. Summary of the invention

[0010] The technical problem to be solved by the present invention is to propose a coating structure and a manufacturing method for the above-mentioned prior art to solve the problems of poor precision, residual glue, coating debris, device damage, etc. caused by the traditional tape masking method and direct removal method for opening windows in specific areas.

[0011] To solve the above problems, the technical solution of the present invention provides a coating structure, which includes: a substrate, on which electronic components are mounted, and the electronic components are encapsulated with a plastic sealing layer, and the plastic sealing layer includes an electromagnetic shielding area and a non-electromagnetic shielding area; the electromagnetic shielding area is covered with an electromagnetic shielding coating; wherein the first surface of the electromagnetic shielding area is higher or lower than the second surface of the non-electromagnetic shielding area, and the electromagnetic shielding coating also includes a window, and the window corresponds to the non-electromagnetic shielding area.

[0012] As an optional technical solution, the second surface extends away from the first surface toward the inside of the plastic packaging layer so that the non-electromagnetic shielding area is a depression formed in the plastic packaging layer; or, the second surface extends away from the first surface toward the outside of the plastic packaging layer so that the non-electromagnetic shielding area is a protrusion formed outside the plastic packaging layer.

[0013] As an optional technical solution, a vertical distance from the second surface to the first surface is greater than or equal to 10 μm.

[0014] As an optional technical solution, the electronic component includes a signal emitting element, and the signal emitting element is arranged in the non-electromagnetic shielding area.

[0015] The present invention also provides a method for manufacturing a coating structure, the method comprising:

[0016] Providing a substrate, on which electronic components are mounted;

[0017] Providing a plastic encapsulation mold and a plastic encapsulation material, encapsulating a plastic encapsulation layer and a release agent layer outside the electronic component, wherein the plastic encapsulation layer includes an electromagnetic shielding area and a non-electromagnetic shielding area, and a first surface of the electromagnetic shielding area is higher or lower than a second surface of the non-electromagnetic shielding area;

[0018] Demolding, removing the release agent layer outside the electromagnetic shielding area and retaining the release agent layer outside the non-electromagnetic shielding area;

[0019] Sputtering to form a continuous electromagnetic shielding coating layer, which covers the outside of the plastic packaging layer; and

[0020] Removing the release agent layer outside the non-electromagnetic shielding area and the electromagnetic shielding coating thereon to obtain an opening of the electromagnetic shielding coating;

[0021] The plastic encapsulation mold includes a third surface and a fourth surface connected to each other, the third surface and the first surface correspond to each other, the fourth surface and the second surface correspond to each other, and the third surface is lower or higher than the fourth surface.

[0022] As an optional technical solution, the fourth surface extends away from the third surface toward the outside of the molding mold so that the molding mold includes a boss, and the boss makes the non-electromagnetic shielding area concave; or, the fourth surface extends away from the third surface toward the inside of the molding mold so that the molding mold includes a groove, and the groove makes the non-electromagnetic shielding area convex.

[0023] As an optional technical solution, a vertical distance from the third surface to the fourth surface is greater than or equal to 10 μm.

[0024] As an optional technical solution, a plastic encapsulation mold and a plastic encapsulation material are provided, and a plastic encapsulation layer and a release agent layer are encapsulated on the electronic component, wherein the plastic encapsulation layer includes an electromagnetic shielding area and a non-electromagnetic shielding area, and the first surface of the electromagnetic shielding area is higher or lower than the second surface of the non-electromagnetic shielding area. The steps include:

[0025] A molding mold is provided; the molding material is coated on the third surface and the fourth surface of the molding mold, the molding material comprising a resin and a release agent; the molding mold is moved so that the molding material covers the electronic components on the substrate; and the molding material is cured, the resin is cross-linked to form the molding layer, the molding layer is connected to the substrate, the release agent is precipitated to form a release agent layer, and the release agent layer is located between the molding mold and the molding layer; wherein the release agent is a paraffin release agent, and the mass percentage of the paraffin release agent in the molding material is greater than 1%.

[0026] As an optional technical solution, a substrate is provided, and the steps of mounting electronic components on the substrate include: providing a substrate; mounting a signal transmitting device to a first position of the substrate, the first position corresponding to the non-electromagnetic shielding area; and mounting an electromagnetic interference sensitive component to a second position of the substrate, the second position corresponding to the electromagnetic shielding area.

[0027] As an optional technical solution, sputtering forms a continuous electromagnetic shielding coating, which covers the outside of the plastic sealing layer and also includes: providing a carrier board, on which a film layer is arranged; mounting the substrate after plastic sealing and demolding onto the film layer, and the solder pads on the back of the substrate are covered by the film layer; sputtering forms a continuous electromagnetic shielding layer.

[0028] Compared with the prior art, the present invention provides a coating structure and a manufacturing method. There is a height difference between the electromagnetic shielding area and the non-electromagnetic shielding area of ​​the plastic sealing layer of the coating structure. By utilizing this height difference, only the release agent layer on the surface of the electromagnetic shielding area is removed, while the release agent layer in the non-electromagnetic shielding area is retained; by utilizing the difference in adhesion between the retained release agent layer and the electromagnetic shielding coating layer, after the electromagnetic shielding coating layer is sputtered, the retained release agent layer and the electromagnetic shielding coating layer attached thereto are easily removed to form an electromagnetic shielding coating window, thereby effectively improving the problems of residual glue, coating debris, and device damage existing in the existing window opening process. In addition, the operation of reserving a release agent layer on a depression or protrusion is simple and has high precision, so the precision of the subsequent window opening is also high.

[0029] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 A cross-sectional schematic diagram of opening a window in a specific area of ​​the coating of a package using the traditional tape masking method.

[0032] Figure 2 It is a schematic cross-sectional view of the coating structure provided in the first embodiment of the present invention.

[0033] Figure 3 It is a cross-sectional schematic diagram of the coating structure provided in the second embodiment of the present invention.

[0034] Figure 4 It is a cross-sectional schematic diagram of forming a plastic sealing layer and demoulding of the coating structure in the first embodiment of the present invention.

[0035] FIG. 5 is a schematic diagram of removing the release agent layer from the electromagnetic shielding area of ​​the plastic packaging layer of the plating structure in the first embodiment of the present invention.

[0036] Figure 6 It is a schematic diagram of sputtering an electromagnetic shielding layer on the coating structure in the first embodiment of the present invention.

[0037] Figure 7 The cross-sectional diagram is a schematic diagram of removing the release agent layer and the electromagnetic shielding coating layer in the non-electrostatic shielding area of ​​the coating structure in the first embodiment of the present invention.

[0038] Figure 8 The present invention provides a flow chart of a method for manufacturing a coating structure. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments and drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0040] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0041] The object of the present invention is to provide a coating structure and a manufacturing method, wherein the coating structure includes a substrate, electronic components are mounted on the substrate, the electronic components are encapsulated with a plastic sealing layer, the plastic sealing layer includes an electromagnetic shielding area and a non-electromagnetic shielding area, and the electromagnetic shielding coating is covered outside the electromagnetic shielding area; wherein the first surface of the electromagnetic shielding area is higher than or equal to the second surface of the non-electromagnetic shielding area, and the electromagnetic shielding coating also includes a window, which corresponds to the non-electromagnetic shielding area.

[0042] Preferably, the second surface extends away from the first surface toward the inside of the plastic packaging layer so that the non-electromagnetic shielding area is a depression formed in the plastic packaging layer; or, the second surface extends away from the first surface toward the outside of the plastic packaging layer so that the non-electromagnetic shielding area is a protrusion formed outside the plastic packaging layer.

[0043] In the coating structure provided by the present invention, the electromagnetic shielding area and the non-electromagnetic shielding area of ​​the plastic sealing layer are formed with a height difference, and this height difference corresponds to a depression or a protrusion, and this depression or protrusion corresponds to the window of the electromagnetic shielding coating, wherein, by the release agent layer retained on the depression or protrusion by the plastic sealing process, in the subsequent sputtering process of making the electromagnetic shielding coating, the electromagnetic shielding layer has poor adhesion on the reserved release agent layer and is very easy to be removed, that is, by removing the retained release agent layer and the electromagnetic shielding coating attached thereto, a window is formed in the electromagnetic shielding coating corresponding to the non-electromagnetic shielding area. Since the retained release agent layer and the electromagnetic shielding coating covered thereon are both very easy to remove, the problems of residual glue, coating debris, device damage, etc. existing in the existing window opening process can be effectively improved. In addition, the operation of reserving a release agent layer on a depression or protrusion is simple and has high precision, so the precision of the subsequent window opening is also high.

[0044] like Figure 2As shown, in the first embodiment of the present invention, a coating structure 100 is provided, which includes: a substrate 10, on which electronic components are mounted, and the electronic components include, for example, an electromagnetic interference sensitive component 20 and a signal emitting component 30; the electronic components are encapsulated with a plastic packaging layer 40, and the plastic packaging layer 40 includes an electromagnetic shielding area 41 and a non-electromagnetic shielding area 42; the electromagnetic shielding area 41 is covered with an electromagnetic shielding coating 50; wherein, the first surface 411 of the electromagnetic shielding area 41 is higher than the second surface 421 of the non-electromagnetic shielding area 42, and the electromagnetic shielding coating 50 also includes a window 50a, and the window 50a corresponds to the non-electromagnetic shielding area 42.

[0045] In this embodiment, the second surface 421 extends away from the first surface 411 toward the inside of the plastic layer 40 so that the non-electromagnetic shielding area 42 is a depression formed in the plastic layer 40. The signal emitting element 30 is located below the depression, and the signal emitting element 30 emits or receives signals from the opening 50a.

[0046] In a preferred embodiment, the difference between the film thickness H1 in the electromagnetic shielding area 41 and the film thickness H2 in the non-electromagnetic shielding area 42 is greater than or equal to 10 microns, wherein the distance between the first surface 411 and the upper surface of the substrate 10 is defined as the film thickness H1 in the electromagnetic shielding area 41, and the distance between the second surface 412 and the upper surface of the substrate 10 is defined as the film thickness H2 in the non-electromagnetic shielding area 42.

[0047] In other words, the vertical distance D between the first surface 411 and the second surface 421 is greater than or equal to 10 μm; or, the maximum depth of the recess in the plastic encapsulation layer 40 is greater than or equal to 10 μm.

[0048] The vertical distance D between the first surface 411 and the second surface 421 is greater than or equal to 10 μm, which facilitates the removal of the release agent layer 70 (such as Figures 4 to 7 As shown), a release agent layer 71 is retained in the non-electromagnetic shielding area 42 to facilitate the production of the window 50a.

[0049] like Figure 3 As shown, a coating structure 200 is also provided in the second embodiment of the present invention, which differs from the coating structure 100 in that, in the coating structure 200, the plastic encapsulation layer 210 includes an electromagnetic shielding area 211 and a non-electromagnetic shielding area 212; the electromagnetic shielding area 211 is covered with an electromagnetic shielding coating 50; wherein, the first surface 2111 of the electromagnetic shielding area 211 is lower than the second surface 2121 of the non-electromagnetic shielding area 212, and the electromagnetic shielding coating 50 also includes a window 50a, which corresponds to the non-electromagnetic shielding area 212.

[0050] In this embodiment, the second surface 2121 extends away from the first surface 2111 toward the outside of the plastic layer 210 so that the non-electromagnetic shielding area 212 is a protrusion formed outside the plastic layer 40. The signal emitting element 30 is located below the protrusion, and the signal emitting element 30 emits or receives signals from the opening 50a.

[0051] In a preferred embodiment, the difference between the film thickness H1 in the electromagnetic shielding area 211 and the film thickness H3 in the non-electromagnetic shielding area 212 is greater than or equal to 10 microns, wherein the distance between the first surface 2111 and the upper surface of the substrate 10 is defined as the film thickness H1 in the electromagnetic shielding area 211, and the distance between the second surface 2121 and the upper surface of the substrate 10 is defined as the film thickness H3 in the non-electromagnetic shielding area 212.

[0052] In other words, the vertical distance T between the first surface 2111 and the second surface 2121 is greater than or equal to 10 μm; or, the maximum height of the protrusion outside the plastic encapsulation layer 210 is greater than or equal to 10 μm.

[0053] like Figure 8 As shown, the present invention also provides a method 300 for manufacturing a coating structure, which comprises:

[0054] providing a substrate on which electronic components are mounted;

[0055] Providing a plastic encapsulation mold and a plastic encapsulation material, encapsulating a plastic encapsulation layer and a release agent layer outside the electronic component, wherein the plastic encapsulation layer includes an electromagnetic shielding region and a non-electromagnetic shielding region, and a first surface of the electromagnetic shielding region is higher or lower than a second surface of the non-electromagnetic shielding region;

[0056] Demolding, removing the release agent layer outside the electromagnetic shielding area and retaining the release agent layer outside the non-electromagnetic shielding area;

[0057] Sputtering to form a continuous electromagnetic shielding coating layer, which covers the outside of the plastic packaging layer; and

[0058] removing the release agent layer outside the non-electromagnetic shielding area and the electromagnetic shielding coating thereon to obtain an opening of the electromagnetic shielding layer;

[0059] The plastic encapsulation mold includes a third surface and a fourth surface connected to each other, the third surface and the first surface correspond to each other, the fourth surface and the second surface correspond to each other, and the third surface is lower or higher than the fourth surface.

[0060] In a preferred embodiment, the fourth surface extends away from the third surface toward the outside of the molding mold so that the molding mold includes a boss, and the boss makes the non-electromagnetic shielding area concave; or, the fourth surface extends away from the third surface toward the inside of the molding mold so that the molding mold includes a groove, and the groove makes the non-electromagnetic shielding area convex.

[0061] In a preferred embodiment, a vertical distance from the third surface to the fourth surface is greater than or equal to 10 μm.

[0062] In a preferred embodiment, a molding mold and a molding material are provided. In the step of encapsulating the electronic component with a molding layer and a release agent layer, the molding material coated on the molding mold includes a resin and a release agent, wherein the resin is cured to form a molding layer, and the release agent is precipitated to form a release agent layer. Preferably, the release agent is a paraffin release agent, and the mass percentage of the paraffin release agent in the molding material is greater than 1%.

[0063] In a preferred embodiment, a substrate is provided, and the step of mounting electronic components on the substrate includes: providing a substrate; mounting a signal transmitting device to a first position of the substrate, the first position corresponding to a non-electromagnetic shielding area; and mounting an electromagnetic interference sensitive component to a second position of the substrate, the second position corresponding to the electromagnetic shielding area.

[0064] In a preferred embodiment, the step of sputtering to form a continuous electromagnetic shielding coating, which covers the outside of the plastic packaging layer, also includes: providing a carrier board, on which a film layer is arranged; mounting the plastic-sealed and demolded substrate onto the film layer, and the solder pads on the back of the substrate are covered by the film layer; and sputtering to form a continuous electromagnetic shielding layer.

[0065] In a preferred embodiment, in the step of removing the release agent layer outside the electromagnetic shielding area, a grinding wheel is used to grind and remove the corresponding release agent layer. In addition, in the step of removing the release agent layer outside the non-electromagnetic shielding area and the electromagnetic shielding coating thereon, a brush is used to remove the release agent layer and the electromagnetic shielding coating thereon, and then the structure with the coating window is cleaned using high-pressure blowing and a dust collection device to remove the coating debris generated by the removal of the electromagnetic shielding layer in the non-shielded area, and the device packaging is completed.

[0066] The following will be combined Figures 4 to 7 ,by Figure 2 Taking the coating structure 100 shown in FIG. 1 as an example, a method 300 for manufacturing the coating structure is described in detail.

[0067] like Figure 2 and Figure 4 As shown, a substrate 10 is provided, and corresponding electrical components are mounted on the front of the substrate 10, for example, an electromagnetic interference sensitive component 20 is mounted on a first position of the substrate 10 corresponding to the electromagnetic shielding area 41; and a signal emitting component 30 is mounted on a second position of the substrate 10 corresponding to the non-electromagnetic shielding area 42. The electromagnetic interference sensitive component 20 and the signal emitting component 30 are electrically connected to the substrate 10 respectively.

[0068] A molding mold 60 and a molding material 40' are provided; one side surface of the molding mold 60 includes a third surface 61 and a fourth surface 62 connected to each other, wherein the third surface 61 is lower than the fourth surface 62, so that the side of the molding mold 60 contacting the molding material 40' has a boss, and the boss makes the non-electromagnetic shielding area 42 of the molding layer 40 recessed.

[0069] The plastic molding mold 60 is moved close to the substrate 1 mounted with the electronic components, and the plastic molding material 40' contacts and encapsulates the electronic components. After the plastic molding material 40' is plastic molded, the plastic molding layer 40 is connected to the front side of the substrate 10. The plastic molding is, for example, one-step molding.

[0070] Since the plastic encapsulation material 40' includes a resin and a release agent, the resin forms a plastic encapsulation layer 40 that encapsulates the electronic components after cross-linking reaction and solidification; while the release agent does not participate in the cross-linking reaction, and is precipitated and solidified into a release agent layer 70, which is located between the plastic encapsulation mold 60 and the plastic encapsulation layer 40, which is convenient for demolding. Preferably, the release agent is a paraffin release agent, and its mass percentage in the plastic encapsulation material 40' is greater than 1%, so that it is convenient to precipitate and enrich to form a continuous release agent layer 70 between the plastic encapsulation mold 60 and the plastic encapsulation layer 40. The film thickness of the release agent layer 70 is about 10μm.

[0071] In this embodiment, since there is a height difference between the third surface 61 and the fourth surface 62 of the plastic encapsulation mold 60, after plastic encapsulation and demolding, there is also a height difference between the first surface 411 of the electromagnetic shielding region 41 of the plastic encapsulation layer 40 and the second surface 421 of the non-electromagnetic shielding region 42. Preferably, the vertical distance between the first surface 411 and the second surface 421 is greater than or equal to 10 μm.

[0072] like Figure 5 As shown, a grinding wheel 80 is provided to grind the release agent layer 70 on the first surface 411 of the electromagnetic shielding area 41. Since there is a height difference between the first surface 411 and the second surface 421, and the non-electromagnetic shielding area 42 is recessed, the grinding wheel 80 will not grind and contact the release agent layer in the non-electromagnetic shielding area 42. At this time, the release agent layer 71 in the non-electromagnetic shielding area 42 is retained, while the release agent layer 70 on the surface of the electromagnetic shielding area 41 is removed.

[0073] In this embodiment, the grinding depth is controlled within 10 um.

[0074] It should be noted that electronic component mounting and plastic sealing are all carried out on the substrate. Therefore, after completing the plastic sealing, demolding, and release agent removal processes, the substrate usually needs to be cut and divided into particles to form a single package body, and then the single package body is sputtered in a magnetron sputtering machine to produce an electromagnetic shielding coating.

[0075] like Figure 6As shown, the package cut into single particles is mounted on the surface of the adhesive film layer with viscosity on the carrier, and the pads on the back of the substrate 10 are covered by the adhesive film layer. The adhesive film layer covers the pads to prevent the electromagnetic shielding coating from contacting the pads and causing a short circuit in the package.

[0076] The single-grain package fixed on the carrier is placed in a magnetron sputtering machine to perform magnetron sputtering on an electromagnetic shielding coating. At this time, the continuous electromagnetic shielding coating 50 covers all external surfaces of the plastic packaging layer 40, that is, the surfaces of the electromagnetic shielding region 41 and the non-electromagnetic shielding region 42 of the plastic packaging layer 40 are both covered with a continuous electromagnetic shielding coating 50. The surface of the electromagnetic shielding region 41 includes a first surface 411 and a side surface 412 connected to the first surface 411.

[0077] Continue to refer to Figure 6 A brush 90 is provided. Since the non-electromagnetic shielding area 42 is covered with the retained release agent layer 71, the coating in the corresponding area of ​​the electromagnetic shielding coating 50 has poor adhesion to the retained release agent layer 71 and can be easily brushed off by the brush 90, thereby forming a window 50a of the electromagnetic shielding coating 50.

[0078] In the process of brushing the electromagnetic shielding coating 50 in the non-electromagnetic shielding area 42 with the brush 90, the coating may break and peel off. Preferably, the debris generated by removing the coating and retaining the release agent layer 71 can be cleaned by high-pressure blowing and dust collection devices.

[0079] In this embodiment, since the release agent layer on the surface of the electromagnetic shielding area 41 is removed in advance, the electromagnetic shielding coating 50 has good adhesion to the surface of the electromagnetic shielding area 41, which can protect the internal electronic components from external electromagnetic interference; however, there is a retained release agent layer 71 in the non-electromagnetic shielding area 42, and the adhesion between the electromagnetic shielding coating 50 and the retained release agent layer 71 is poor. A brush 90 can be used to remove the retained release agent layer 71 and the electromagnetic shielding coating 50 attached thereto, disconnecting the continuous electromagnetic shielding coating 50 to form a window 50a. The window 50a provides a non-enclosed shielding space for the signal transmitting element 30, which is used to transmit and receive signals with the outside world.

[0080] It can be seen that the beneficial effects of the manufacturing method 300 of the coating structure provided by the present invention include: by designing the surface boss morphology of the plastic layer injection mold, a non-shielding area groove of the plastic body of any shape can be prepared, and the design freedom is high; the release agent in the matching plastic packaging material can be precipitated on the surface of the plastic packaging layer, and the release agent layer can stably resist plating, so as to realize the opening of the electromagnetic shielding coating in the non-electromagnetic shielding area, and facilitate the signal transmission and reception of the signal transmitting element; after grinding and removing the release agent layer covering the outside of the electromagnetic shielding area, the electromagnetic shielding coating has good surface adhesion in the electromagnetic shielding area, and high electromagnetic shielding is achieved, protecting the electromagnetic interference sensitive element 20 from external electromagnetic field interference. In addition, the manufacturing method of the coating structure does not introduce other materials and steps, and has the advantages of low manufacturing cost, easy implementation and promotion.

[0081] In summary, the present invention provides a coating structure and a manufacturing method. There is a height difference between the electromagnetic shielding area and the non-electromagnetic shielding area of ​​the plastic sealing layer of the coating structure. By utilizing this height difference, only the release agent layer on the surface of the electromagnetic shielding area is removed, while the release agent layer in the non-electromagnetic shielding area is retained; by utilizing the difference in adhesion between the retained release agent layer and the electromagnetic shielding coating, after the electromagnetic shielding coating is sputtered, the retained release agent layer and the electromagnetic shielding coating layer attached thereto are easily removed to form an electromagnetic shielding coating window, thereby effectively improving the problems of residual glue, coating debris, and device damage in the existing window opening process. In addition, the operation of reserving a release agent layer on a depression or protrusion is simple and has high precision, so the precision of the subsequent window opening is also high.

[0082] The present invention has been described by the above-mentioned relevant embodiments, however, the above-mentioned embodiments are only examples for implementing the present invention. In addition, the technical features involved in the different embodiments of the present invention described above can be combined with each other as long as they do not conflict with each other. It must be pointed out that the present invention can also have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding changes and deformations should all belong to the protection scope of the claims attached to the present invention.

Claims

1. A method for manufacturing a coating structure, It is characterized in that The production method comprises: Providing a substrate, on which electronic components are mounted; Providing a plastic encapsulation mold and a plastic encapsulation material, encapsulating a plastic encapsulation layer and a release agent layer outside the electronic component, wherein the plastic encapsulation layer includes an electromagnetic shielding area and a non-electromagnetic shielding area, and a first surface of the electromagnetic shielding area is higher or lower than a second surface of the non-electromagnetic shielding area; Demolding, removing the release agent layer outside the electromagnetic shielding area and retaining the release agent layer outside the non-electromagnetic shielding area; Sputtering to form a continuous electromagnetic shielding coating layer, which covers the outside of the plastic packaging layer; and Removing the release agent layer outside the non-electromagnetic shielding area and the electromagnetic shielding coating thereon to obtain an opening of the electromagnetic shielding coating; The plastic encapsulation mold includes a third surface and a fourth surface connected to each other, the third surface and the first surface correspond to each other, the fourth surface and the second surface correspond to each other, and the third surface is lower or higher than the fourth surface.

2. The method for manufacturing the coating structure according to claim 1, It is characterized in that The fourth surface extends away from the third surface toward the outside of the molding mold so that the molding mold includes a boss, and the boss makes the non-electromagnetic shielding area concave; or, the fourth surface extends away from the third surface toward the inside of the molding mold so that the molding mold includes a groove, and the groove makes the non-electromagnetic shielding area convex.

3. The method for making a coating structure according to claim 2, It is characterized in that A vertical distance from the third surface to the fourth surface is greater than or equal to 10 μm.

4. The method for manufacturing the coating structure according to claim 1, It is characterized in that The steps of providing a plastic encapsulation mold and a plastic encapsulation material, encapsulating a plastic encapsulation layer and a release agent layer on the electronic component, wherein the plastic encapsulation layer includes an electromagnetic shielding area and a non-electromagnetic shielding area, and the first surface of the electromagnetic shielding area is higher or lower than the second surface of the non-electromagnetic shielding area include: Provide plastic packaging mold; Applying the molding compound on the third surface and the fourth surface of the molding mold, wherein the molding compound comprises a resin and a release agent; Moving the plastic encapsulation mold so that the plastic encapsulation material covers the electronic components on the substrate; and The molding compound is cured, the resin is cross-linked to form the molding layer, the molding layer is connected to the substrate, the release agent is precipitated to form a release agent layer, and the release agent layer is located between the molding mold and the molding layer; Wherein, the release agent is a paraffin release agent, and the mass percentage of the paraffin release agent in the plastic packaging material is greater than 1%.

5. The method for manufacturing the coating structure according to claim 1, It is characterized in that Providing a substrate, on which electronic components are mounted, comprises the following steps: providing a substrate; Mounting a signal transmitting device to a first position of the substrate, the first position corresponding to the non-electromagnetic shielding area; and An electromagnetic interference sensitive element is mounted on a second position of the substrate, wherein the second position corresponds to the electromagnetic shielding area.

6. The method for manufacturing the coating structure according to claim 1, It is characterized in that The step of forming a continuous electromagnetic shielding coating by sputtering, which covers the outside of the plastic packaging layer, also includes: Providing a carrier board, on which a film layer is disposed; Mounting the plastic-sealed and demoulded substrate onto the adhesive film layer, with the pads on the back of the substrate being covered by the adhesive film layer; Sputtering forms a continuous electromagnetic shielding layer.

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