Wafer testing method, testing system and testing machine

Abstract

The present application discloses a wafer testing method, a testing system and a testing machine. The wafer testing method includes: the wafer testing method includes multiple test items; determining the test items with abnormal temperature among the test items, and marking the test items with abnormal temperature as abnormal test items; splitting the abnormal test items, and marking the split abnormal test items as abnormal split items; testing the abnormal split items. By splitting the test items with abnormal chuck temperature in the high-temperature pressure test, the present application reduces the temperature rise amplitude of the wafer under the abnormal test item, thereby avoiding the probe card from being damaged by high temperature. Moreover, this method does not require an additional cooling device, has low hardware requirements for the testing machine, and is beneficial to reducing the testing cost.

Description

Technical Field

[0001] This application relates to the field of wafer testing, and particularly to a wafer testing method, a testing system, and a testing machine. Background Art

[0002] After the wafer manufacturing process is completed, the dies on the wafer are tested to ensure the yield of the dies before packaging. The testing of the dies usually includes high-temperature stress testing. High-temperature stress testing is generally carried out through a testing machine and a fully automatic probe station. The wafer is fixed on the chuck of the fully automatic probe station by means of vacuum pumping. At the same time, the wafer is connected to the testing machine interface through a probe card or a pin electronics card, realizing the physical and electrical connection between the testing machine and each die measured simultaneously.

[0003] During the high-temperature stress testing process, since the probe card continuously applies a high voltage to the wafer, the temperature of the wafer will increase accordingly, and then the temperature of the chuck carrying the wafer will rise abnormally. When the chuck temperature exceeds the preset temperature, it will also cause the probe card connected to the wafer to be damaged by high temperature. Summary of the Invention

[0004] The purpose of this application is to provide a wafer testing method, a testing system, and a testing machine, which can improve the abnormal situation of the chuck temperature during the wafer testing process without increasing the testing cost.

[0005] According to the first aspect of the embodiments of this application, a wafer testing method is provided, including:

[0006] The wafer testing method includes multiple test items;

[0007] Determine the test items with abnormal temperature among the test items, and mark the test items with abnormal temperature as abnormal test items;

[0008] Split the abnormal test items, and mark the split abnormal test items as abnormal split items;

[0009] Test the abnormal split items.

[0010] In some embodiments, the determining the test items with abnormal temperature among the test items and marking the test items with abnormal temperature as abnormal test items includes:

[0011] Detect the temperatures before and after testing multiple test items, and obtain a temperature change curve;

[0012] Calculate the slope value of the temperature change according to the temperature change curve;

[0013] Mark the abnormal test item according to the slope value.

[0014] In some embodiments, the splitting of the abnormal test item and marking the split abnormal test item as an abnormal split item includes:

[0015] Determine the test time of the abnormal split item;

[0016] Calculate the number of abnormal split items based on the test time of the abnormal split item and the test time of the abnormal test item;

[0017] Split the abnormal test item according to the calculated number of abnormal split items.

[0018] In some embodiments, the detecting of the temperature before and after the testing of multiple test items and obtaining the temperature change curve includes:

[0019] Obtain the temperature of the chuck before and after the testing of multiple test items through a sensor, and transmit the obtained temperature of the chuck to the test machine through a communication interface;

[0020] The test machine obtains the temperature change curve based on the temperature of the chuck.

[0021] In some embodiments, the marking of the abnormal test item according to the slope value includes:

[0022] The test machine calculates the slope value of the temperature change curve before and after the testing of different test items based on the temperature change curve;

[0023] The abnormal test item is the test item corresponding to the slope value exceeding the preset slope value on the temperature change curve.

[0024] In some embodiments, the marking of the abnormal test item according to the slope value includes:

[0025] The test machine calculates the maximum slope value of the temperature change curve before and after the testing of different test items based on the temperature change curve;

[0026] The abnormal test item is the test item corresponding to the maximum slope value on the temperature change curve.

[0027] In some embodiments, the test method is a high-temperature pressure test.

[0028] In some embodiments, after determining the test item with temperature abnormality among the test items, the method further includes:

[0029] Reduce the temperature monitoring frequency of the remaining test items without temperature abnormality.

[0030] In some embodiments, when testing the abnormal split item, the method further includes:

[0031] Reducing the number of temperature monitoring times during the testing process of the abnormal split item.

[0032] In some embodiments, after testing the abnormal split item, it further includes:

[0033] Splitting again the abnormal split item with abnormal temperature.

[0034] According to the second aspect of the embodiments of the present application, a test system is provided, including:

[0035] A temperature detection module, configured to obtain the chuck temperature and generate a temperature curve;

[0036] A control module, configured to control the temperature detection module to detect the temperature change before and after the test item;

[0037] A test module, configured to calculate the slope value of the temperature curve and mark the test item as an abnormal test item according to the slope value;

[0038] A splitting module, configured to calculate the number of abnormal split items and split the abnormal test item according to the number of the abnormal split items.

[0039] According to the third aspect of the embodiments of the present application, a test machine is provided, including the test system described in the above embodiments.

[0040] The above technical solutions of the embodiments of the present application at least have the following beneficial technical effects:

[0041] The wafer testing method, test system and test machine provided by the embodiments of the present application reduce the temperature rise amplitude of the wafer under the abnormal test item by splitting the test item with abnormal chuck temperature in the high-temperature pressure test, thereby avoiding the probe card being damaged by high temperature. This method does not require an additional cooling device, has low hardware requirements for the test machine, is beneficial to reducing the test cost, and can realize the testing of the wafer without extending the test time. Description of the Drawings

[0042] Figure 1 It is the temperature change curve of the test item obtained by the test machine without splitting the test item;

[0043] Figure 2 It is the flow schematic diagram of the wafer testing method provided by an embodiment of the present application;

[0044] Figure 3 It is the temperature change curve after splitting an abnormal test item provided by an embodiment of the present application;

[0045] Figure 4 is the temperature change curve after splitting another abnormal test item provided by an embodiment of the present application;

[0046] Figure 5 is the structural block diagram of a test system provided by an embodiment of the present application;

[0047] Figure 6 is the structural block diagram of a test machine provided by an embodiment of the present application. Detailed implementation manners

[0048] After the wafer manufacturing process is completed, the dies on the wafer are tested to ensure the yield of the dies before packaging. The testing of the dies usually includes high-temperature stress testing. High-temperature stress testing is generally carried out through a test machine and a full-automatic probe station. The wafer is fixed on the chuck of the full-automatic probe station by means of vacuum pumping. At the same time, the wafer is connected to the test machine interface through a probe card or a pin electronics card to achieve the physical and electrical connection between the test machine and each die measured simultaneously.

[0049] The currently used full-automatic probe station belongs to a single-temperature system, that is, it can only heat up the chuck and cannot adjust the temperature when the temperature of the chuck exceeds the preset temperature. During the high-temperature stress test, a high voltage is continuously applied to the wafer through the probe card, and the temperature of the wafer will also increase accordingly, resulting in an abnormal temperature rise of the chuck carrying the wafer. When the temperature of the chuck exceeds the preset temperature, since the temperature cannot be adjusted, the probe card connected to the wafer is finally damaged by high temperature.

[0050] The present application proposes a wafer testing method, which reduces the temperature rise amplitude of the wafer under the abnormal test item by splitting the test item of the abnormal chuck temperature that appears in the high-temperature stress test, thereby avoiding the probe card being damaged by high temperature. This method does not require an additional cooling device, has low hardware requirements for the test machine, is beneficial to reducing the test cost, and at the same time realizes the testing of the wafer without extending the test time.

[0051] To make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the specific implementation manners and with reference to the accompanying drawings. It should be understood that these descriptions are exemplary and are not intended to limit the scope of the present application. In addition, the technical features involved in different implementation manners of the present application described below can be combined with each other as long as they do not conflict with each other.

[0052] Refer to Figure 2, an embodiment of the present application provides a wafer testing method, including:

[0053] S1. The wafer testing method includes multiple test items;

[0054] S2. Determine the test items with temperature anomalies among the test items, and mark the test items with temperature anomalies as abnormal test items;

[0055] S3. Split the abnormal test items, and mark the split abnormal test items as abnormal split items;

[0056] S4. Test the abnormal split items.

[0057] The above method reduces the temperature rise amplitude of the wafer under the abnormal test item by splitting the test item with chuck temperature anomaly in the high-temperature pressure test, thereby avoiding the probe card being damaged by high temperature. This method does not require an additional cooling device, has low hardware requirements for the test machine, is beneficial to reducing the test cost, and realizes the test of the wafer while ensuring that the test time is not extended.

[0058] In step S1, the entire process of the wafer testing method includes multiple test items, and each test item can include a type of test. For example, it can include pressure tests on different device structures in the wafer at high temperature. Specifically, it can be low-pressure or high-pressure tests on device structures such as word lines and bit lines. According to different designed products, the number of test items in the wafer test options is different. For example, there can be dozens or hundreds of tests.

[0059] In some embodiments, a series of test items of the wafer can be marked separately in sequence. For example, Item1, Item2, Item3, Item4…Item n, etc. During the test process, the test machine can test these test items in sequence. If a test item passes, the test of the next test item continues. When a certain test item fails, the failure of the test item is displayed. When the tests of all test items pass, the test result of the wafer is considered to pass.

[0060] In step S2, mark the test items with temperature anomalies among the test items as abnormal test items. Exemplarily, when the change amount of the chuck temperature before and after a certain test item exceeds the threshold, it is considered that the test item has a temperature anomaly. Or after testing each test item, determine the test item that causes the largest change amount of the chuck temperature as the test item with temperature anomaly.

[0061] In some embodiments, the temperature before and after testing multiple test items can be detected, and a temperature change curve can be obtained to determine whether a temperature anomaly occurs in the test item. Among them, the temperature change curve can be obtained by a test machine; further, the slope value of the temperature change can be calculated based on the temperature change curve, and then it can be determined whether the test item belongs to the situation of temperature anomaly according to the slope value.

[0062] In some embodiments, the temperature of the chuck before and after testing multiple test items can be obtained through a sensor, and the obtained temperature of the chuck is transmitted to the test machine through a communication interface; the test machine obtains a temperature change curve according to the temperature of the chuck. For example, a temperature sensor is arranged inside the chuck of a full-automatic probe station. The temperature sensor is composed of a sensing coil. The full-automatic probe station and the test machine communicate through a General-Purpose Interface Bus (GPIB). Before and after testing, the test machine sends a temperature measurement request to the full-automatic probe station through the GPIB. The full-automatic probe station controls the temperature sensor to detect the chuck temperature according to the temperature measurement request and transmits the detected chuck temperature to the test machine.

[0063] In some embodiments, the method for marking the abnormal test item according to the slope value can be: the test machine calculates the slope values of the temperature change curves before and after testing different test items according to the temperature change curve; the abnormal test item is the test item corresponding to the slope value exceeding the preset slope value on the temperature change curve. This method is convenient for marking multiple test items as abnormal test items at the same time. For example, the slope values of the temperature change curves of the chucks corresponding to test items Item1, Item2, Item3, and Item4 are 0.2, 0.4, 0.9, and 0.8 respectively. When the preset slope value is 0.7, then test items Item3 and Item4 are both marked as abnormal test items.

[0064] In other embodiments, the method for marking the abnormal test item according to the slope value can also be: the test machine calculates the slope values of the temperature change curves before and after testing different test items according to the temperature change curve and compares to calculate the maximum slope value of each test item; the test item corresponding to the maximum slope value is the abnormal test item. For example, the slope values of the temperature change curves of the chucks corresponding to test items Item1, Item2, Item3, and Item4 are 0.2, 0.4, 0.6, and 0.8 respectively. Then the slope value of test item Item3 is the largest. Therefore, Item3 is correspondingly marked as an abnormal test item. If different test items among test items Item1, Item2, Item3, and Item4 all appear the maximum value, then the above test items are marked as abnormal test items at the same time. Specifically, different marking methods provided in the above embodiments can be selected according to actual test requirements.

[0065] In step S3, the abnormal test item is split, and the split abnormal test item is marked as an abnormal split item. Exemplarily, the splitting method of the abnormal test item may be: determining the test time of the abnormal split item; calculating the number of abnormal split items according to the test time of the abnormal split item and the test time of the abnormal test item; and splitting the abnormal test item according to the calculated number of abnormal split items. For example, when the preset duration of the abnormal split item is 0.5 seconds and the original preset test duration of the abnormal test item is 10 seconds, the splitting number of the abnormal split items is determined to be 20 according to the preset duration of the abnormal test item and the preset duration of the abnormal split item, and then the abnormal test item can be split according to the number to be split.

[0066] In some embodiments, different splitting criteria can be formulated according to the temperature change of the chuck to split the abnormal test item. When the temperature change of the chuck is large, that is, when the temperature value of the chuck after testing is larger, the preset duration is shorter, so as to increase the splitting number and reduce the influence of the temperature abnormality caused by the abnormal test item. Refer to Figure 1 , Exemplarily, when each test item is being tested, the temperature change of the chuck before and after different test items is different. When the temperature of the chuck is 130°C after a certain test item is tested, the test time of the abnormal split item can be preset to 0.5 seconds. When the temperature of the chuck is 140°C, the test duration of the abnormal split item can be preset to 0.3 seconds.

[0067] In other embodiments, the method for splitting the abnormal test item may also be: determining the number of abnormal split items; and splitting the abnormal test item according to the determined number of abnormal split items. Exemplarily, when the temperature change of the chuck is large, that is, when the temperature value of the chuck after testing is larger, the splitting number is more, so as to reduce the influence of the temperature abnormality caused by the abnormal test item. For example, when the temperature of the chuck is 130°C after a certain test item is tested, the splitting number is set to 20. When the temperature of the chuck is 140°C, the splitting number is set to 30. This method omits the step of determining the test time of the abnormal split item, can directly determine the number of abnormal split items, and uses the determined number of abnormal split items to split the abnormal test item. The specific splitting method can select any one of the above embodiments according to actual needs.

[0068] In step S4, the abnormal split item is tested. Exemplarily, first, the preliminary preparation work for wafer testing is completed, that is, a wafer to be tested and the wafer testing system (including a test machine and a full-automatic probe station) are provided, and the connection between the wafer to be tested and the wafer testing system is completed. Among them, before testing, the methods of steps S1-S3 are loaded into the main control unit (such as a CPU) of the test machine. During the test, the main control unit executes the methods of steps S1-S3 to determine and split the abnormal test item, so as to sequentially test the obtained abnormal split items.

[0069] In some embodiments, the wafer is connected to the test machine interface through the probe card of a fully automatic probe station, realizing the physical and electrical connection between the test machine and the measured wafer. After the connection, the test machine will provide different voltages during the test and simultaneously monitor the response of the measured device structure, and then judge the performance of the corresponding device structure according to the obtained response results. Usually, the wafer will undergo a series of high-temperature and low-pressure tests to ensure that the product standards required before packaging are met. Among them, the test machine communicates with the probe card of the fully automatic probe station through a test arm (Prober Handler Agent, PHA). The probe card has probes. By moving the probes on the probe card, the probes can be docked with the test pads on the wafer to apply pressure to the wafer, so as to conduct tests. The wafer has test items to be tested in sequence, such as high-temperature and low-pressure test items, high-temperature and high-pressure test items, etc. During the test process, the test machine sends test instructions to the probe card through the PHA, and the probe card applies high or low voltage to the wafer through the probes.

[0070] The following verifies the method provided in the embodiments of the present application through experiments.

[0071] First, obtain the temperature change curves of each test item of the wafer without splitting the test items, as Figure 1 shown. The test corresponding to test item Item19 causes the chuck temperature to change by 5°C, and the slope value corresponding to it in the temperature change curve is the largest. Therefore, according to the maximum slope value, it is determined that the test item causing the abnormal chuck temperature is Item19, and the test item Item19 is marked as an abnormal test item.

[0072] According to the method described in the embodiments of the present application, the test item Item19 is split. Exemplarily, the test duration of Item19 is 10 seconds, and the test time of the split items of Item19 is 0.5 seconds. Then, it is determined that the number of split items of Item19 is 20 items. Further, Item19 is split into 20 items in total, namely Item19_1, Item19_2, Item19_3, Item19_4, Item19_5, Item19_6, Item19_7, Item19_8, Item19_9, Item19_10, Item19_11, Item19_12, Item19_13, Item19_14, Item19_15, Item19_16, Item19_17, Item19_18, Item19_19 and Item19_20 for testing.

[0073] Refer to Figure 3, the test items after splitting the wafer Item19 by the probe are tested, and the temperature change of Item19 before and after the test is 3.5 °C. Therefore, splitting the test items according to the method provided in the embodiments of the present application can improve the abnormal situation of the chuck temperature.

[0074] Exemplarily, the test duration of Item19 is 10 seconds, and the test time of the split items of Item19 is 0.25 seconds. Then, it is determined that the number of split items of Item19 is 40 items. Further, Item19 is split into Item19_1, Item19_2, Item19_3, Item19_4, Item19_5, Item19_6, Item19_7, Item19_8, Item19_9, Item19_10, Item19_11, Item19_12, Item19_13, Item19_14, Item19_15, Item19_16, Item19_17, Item19_18, Item19_19, Item19_20, Item19_21, Item19_22, Item19_23, Item19_24, Item19_25, Item19_26, Item19_27, Item19_28, Item19_29, Item19_30, Item19_31, Item19_32, Item19_33, Item19_34, Item19_35, Item19_36, Item19_37, Item19_38, Item19_39 and Item19_40.

[0075] Refer to Figure 4 It can be seen that after splitting, the test item Item19 causes the chuck temperature to rise by 1.5 °C, significantly improving the abnormal situation of the chuck temperature. Moreover, compared with only splitting the abnormal test items into 20 items, the effect is significantly improved.

[0076] In the above experimental process, splitting the abnormal test items can improve the abnormal situation of the chuck temperature. However, to further improve the test efficiency, in some embodiments, after determining the test items with abnormal temperature in the test items, it further includes reducing the temperature monitoring times of the remaining test items without abnormal temperature.

[0077] Under normal circumstances, the time for each test item to read the temperature is about 0.8 seconds. Therefore, by reducing the temperature reading times of the test items without abnormal temperature or removing the temperature reading function, the test efficiency can be further improved.

[0078] In other embodiments, when testing the abnormal split item, the number of temperature monitoring times during the testing process of the abnormal split item can also be reduced. By reducing the number of system monitoring times in the testing process or removing the system monitoring function, the testing efficiency can also be further improved. This solution has similar technical effects to the solution of reducing the number of temperature readings, and will not be elaborated here.

[0079] In some embodiments, the wafer testing method may further include: after testing the abnormal split item, splitting the abnormal split item with abnormal temperature again. Exemplarily, when testing the abnormal split item, if the abnormal split item with abnormal temperature appears, the testing duration can be further shortened, and the abnormal split item with abnormal temperature can be split again, so as to further reduce the phenomenon of abnormal increase in the wafer temperature caused by the abnormal test item by splitting a local split test item, thereby avoiding damage to the probe card due to high temperature.

[0080] As Figure 5 shown, an embodiment of the present application further provides a testing system. The testing system 200 includes a temperature detection module 201, a control module 202, a testing module 203, and a splitting module 204.

[0081] Among them, the temperature detection module 201 is configured to obtain the chuck temperature and generate a temperature curve; the control module 202 is configured to control the temperature detection module to detect the temperature change before and after the test item; the testing module 203 is configured to calculate the slope value of the temperature curve and mark the test item as an abnormal test item according to the slope value; the splitting module 204 is configured to calculate the number of abnormal split items and split the abnormal test item according to the number of abnormal split items.

[0082] In some embodiments, the temperature detection module 201 may include a temperature sensor and a temperature curve recorder. Among them, the temperature sensor is composed of a sensing coil, and the temperature sensor can be arranged inside the chuck of the full-automatic probe station to detect the temperature of the chuck. The temperature curve recorder is communicatively connected to the temperature sensor and can record the temperature change curve according to the temperature detected by the temperature sensor. Exemplarily, the temperature sensor can be the temperature sensor of the full-automatic probe station, and the temperature curve recorder can be the temperature curve recorder of the testing machine. The full-automatic probe station and the testing machine communicate through the General Purpose Interface Bus (GPIB). The testing machine sends a temperature measurement request to the full-automatic probe station through the GPIB. The full-automatic probe station controls the temperature sensor to detect the chuck temperature according to the temperature measurement request and transmits the detected chuck temperature to the testing machine. After receiving the chuck temperature transmitted by the full-automatic probe station, the testing machine can record the temperature curve of the chuck through the temperature curve recorder.

[0083] In some embodiments, the control module 202 may include a memory and a processor. The computer-readable storage medium may include, but is not limited to, any type of disk, including floppy disks, optical disks, DVDs, CD-ROMs, microdrives, and magneto-optical disks, ROMs, RAMs, EPROMs, EEPROMs, DRAMs, VRAMs, flash memory devices, magnetic or optical cards, nanosystems (including molecular memory ICs), or any type of medium or device suitable for storing instructions and / or data. Exemplarily, the processor is respectively connected to the memory and the temperature detection module 201. A computer program is stored in the memory. When the program is executed by the processor, it controls the temperature detection module to detect the temperature changes before and after the test item.

[0084] In some embodiments, the test module 203 is configured to mark abnormal test items according to the slope value. Specifically, it may include: the test machine calculates the slope values of the temperature change curves before and after the tests of different test items according to the temperature change curve; the abnormal test item is the test item corresponding to the slope value exceeding the preset slope value on the temperature change curve. For example, the slope values of the temperature change curves of the chucks corresponding to test items Item1, Item2, Item3, and Item4 are 0.2, 0.4, 0.9, and 0.8 respectively. When the preset slope value is 0.7, then both test items Item3 and Item4 are marked as abnormal test items. In other embodiments, the test module 203 is also used to implement calculating the slope values of the temperature change curves before and after the tests of different test items according to the temperature change curve by the test machine, and comparing to calculate the maximum slope value of each test item; the test item corresponding to the maximum slope value is the abnormal test item. For example, the slope values of the temperature change curves of the chucks corresponding to test items Item1, Item2, Item3, and Item4 are 0.2, 0.4, 0.6, and 0.8 respectively. Then the slope value of test item Item3 is the largest. Therefore, Item3 is correspondingly marked as an abnormal test item. For the above two methods, the former can mark multiple test items as abnormal test items at the same time, and the latter only marks one test item as an abnormal test item. Specifically, the different marking methods provided in the above embodiments can be selected according to the actual test requirements. In some embodiments, the splitting module 204 is configured to split the abnormal test items. Exemplarily, when the splitting module confirms that the preset duration of the abnormal split item is 0.5 seconds and the original test preset duration of the abnormal test item is 10 seconds, the splitting module 204 determines the splitting number of the abnormal split item to be 20 according to the preset duration of the abnormal test item and the preset duration of the abnormal split item, and then splits the abnormal test item according to the splitting number.

[0085] The test module 203 and the splitting module 204 may include a memory, a controller, and a processor. Among them, the memory may include, but is not limited to, any type of disk, including floppy disks, optical disks, DVDs, CD-ROMs, microdrives, and magneto-optical disks, ROMs, RAMs, EPROMs, EEPROMs, DRAMs, VRAMs, flash memory devices, magnetic or optical cards, nanosystems (including molecular memory ICs), or any type of medium or device suitable for storing instructions and / or data. The processor may include a microprocessor and a central processing unit, and the controller may be a microcontroller, an application-specific logic circuit system (e.g., a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), etc.), or other suitable processors. The memory, the controller, and the processor are configured to implement the functions of the test module and the splitting module described in any of the above embodiments.

[0086] As Figure 6 shown, an embodiment of the present application provides a test machine. The test machine 300 may include: at least one processor 301, at least one network interface 304, a user interface 303, a memory 305, and at least one communication bus 302.

[0087] Among them, the communication bus 302 is used to enable connection and communication between these components.

[0088] Among them, the user interface 303 may include a display screen and a camera. Optionally, the user interface 303 may further include a standard wired interface and a wireless interface.

[0089] Among them, the network interface 304 may optionally include a standard wired interface and a wireless interface (such as a WI-FI interface).

[0090] Among them, the processor 301 may include one or more processing cores. The processor 301 uses various interfaces and circuits to connect various parts within the entire terminal 300. By running or executing instructions, programs, code sets, or instruction sets stored in the memory 305, and by invoking the data stored in the memory 305, it executes various functions of the terminal 300 and processes data. Optionally, the processor 301 may be implemented in at least one hardware form of digital signal processing (DSP), field-programmable gate array (FPGA), or programmable logic array (PLA). The processor 301 may integrate one or a combination of several of a central processing unit (CPU), a graphics processing unit (GPU), and a modem, etc. Among them, the CPU mainly processes the operating system, user interface, application programs, etc.; the GPU is responsible for rendering and drawing the content to be displayed on the display screen; the modem is used to process wireless communication. It can be understood that the above-mentioned modem may not be integrated into the processor 301 and may be implemented separately by a single chip.

[0091] Among them, the memory 305 may include random access memory (RAM) and may also include read-only memory. Optionally, the memory 305 includes a non-transitory computer-readable storage medium. The memory 305 can be used to store instructions, programs, code, code sets, or instruction sets. The memory 305 may include a program storage area and a data storage area. Among them, the program storage area may store instructions for implementing the operating system, instructions for at least one function (such as touch function, sound playback function, image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area may store the data involved in the above-mentioned various method embodiments. Optionally, the memory 305 may also be at least one storage device located far from the aforementioned processor 301. As Figure 6 shown, the memory 305, as a computer storage medium, may include an operating system, a network communication module, a user interface module, and application programs.

[0092] In Figure 6In the electronic device 300 shown, the user interface 303 is mainly used to provide an interface for user input and obtain the data input by the user; and the processor 301 can be used to call the application programs stored in the memory 305 and specifically execute the steps of the method in any of the above embodiments.

[0093] An embodiment of the present application also provides a testing machine, including the testing machine as described above.

[0094] The testing machine can achieve the effects that can be achieved by the wafer testing method as described above, which will not be elaborated here one by one. It should be understood that the above specific embodiments of the present application are only used for exemplary illustration or explanation of the principle of the present application, and do not constitute a limitation to the present application. Therefore, any modifications, equivalent replacements, improvements, etc. made without departing from the spirit and scope of the present application shall be included within the protection scope of the present application. In addition, the appended claims of the present application are intended to cover all changes and modification examples that fall within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. A wafer testing method, characterized in that, Including: The wafer testing method includes multiple test items; Determine the test items with temperature anomalies among the test items, and mark the test items with temperature anomalies as abnormal test items; Split the abnormal test items, and mark the split abnormal test items as abnormal split items; Test the abnormal split items; Among them, the splitting of the abnormal test items and marking the split abnormal test items as abnormal split items includes: Determine the test time of the abnormal split items; Calculate the number of abnormal split items based on the test time of the abnormal split items and the test time of the abnormal test items; Split the abnormal test items according to the calculated number of abnormal split items; Among them, determining the test items with temperature anomalies among the test items and marking the test items with temperature anomalies as abnormal test items includes: Detect the temperatures before and after testing multiple test items, and obtain a temperature change curve; Calculate the slope value of the temperature change based on the temperature change curve; Mark the abnormal test items according to the slope value; Among them, detecting the temperatures before and after testing multiple test items and obtaining a temperature change curve includes: Obtain the temperatures of the chuck before and after testing multiple test items through a sensor, and transmit the obtained temperatures of the chuck to the test machine through a communication interface; The test machine obtains a temperature change curve based on the temperature of the chuck; Among them, by splitting the test items with temperature anomalies of the chuck during the split test, the temperature rise amplitude of the wafer under the abnormal test items is reduced.

2. The method according to claim 1, wherein The marking of the abnormal test items according to the slope value includes: The test machine calculates the slope values of the temperature change curves before and after testing different test items based on the temperature change curve; The abnormal test item is the test item corresponding to the slope value exceeding the preset slope value on the temperature change curve.

3. The method according to claim 1, wherein The marking of the abnormal test items according to the slope value includes: The test machine calculates the maximum slope value of the temperature change curves before and after testing different test items based on the temperature change curve; The abnormal test item is the test item corresponding to the maximum slope value on the temperature change curve.

4. The method according to claim 1, wherein The test method is a high-temperature pressure test.

5. The method according to claim 1, wherein After determining the test items with temperature anomalies among the test items, the method further includes: Reducing the number of temperature monitoring times for the remaining test items without temperature anomalies.

6. The method according to claim 1, wherein When testing the abnormal split items, the method further includes: Reducing the number of temperature monitoring times during the testing of the abnormal split items.

7. The method according to any one of claims 1-6, wherein After testing the abnormal split items, it further includes: Splitting the abnormal split items with temperature anomalies again.

8. A test system, wherein Including: A temperature detection module for obtaining the chuck temperature and generating a temperature curve; A control module for controlling the temperature detection module to detect the temperature change before and after the test item; A test module for calculating the slope value of the temperature curve and marking the test item as an abnormal test item according to the slope value; A splitting module for calculating the number of abnormal split items and splitting the abnormal test item according to the number of abnormal split items; Among them, splitting the abnormal test item according to the number of abnormal split items includes: Determining the test time of the abnormal split item; Calculating the number of abnormal split items according to the test time of the abnormal split item and the test time of the abnormal test item; Splitting the abnormal test item according to the calculated number of abnormal split items; Among them, determining the test item with temperature abnormality in the test item and marking the test item with temperature abnormality as an abnormal test item includes: Detecting the temperature before and after multiple test items and obtaining a temperature change curve; Calculating the slope value of the temperature change according to the temperature change curve; Marking the abnormal test item according to the slope value; Among them, detecting the temperature before and after multiple test items and obtaining a temperature change curve includes: Obtaining the temperature of the chuck before and after multiple test items through a sensor, and transmitting the obtained temperature of the chuck to the test machine through a communication interface; The test machine obtains a temperature change curve according to the temperature of the chuck; Among them, by splitting the test item with the temperature abnormality of the chuck in the test, the temperature rise amplitude of the wafer under the abnormal test item is reduced.

9. A test machine, characterized in that It includes the test system according to claim 8.

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