Wafer flipping device and mass transfer apparatus

Abstract

The application relates to a wafer overturning device and a mass transfer equipment. The wafer overturning device comprises a wafer carrier, a rotating driving mechanism and a laser ranging module. One side of the wafer carrier is provided with a wafer fixing area, the wafer carrier can load and fix a wafer in the wafer fixing area; the rotating driving mechanism is connected with the wafer carrier and is used for driving the wafer carrier to rotate so as to change the orientation of the wafer fixing area; and the laser ranging module is installed on a rotating body driven to rotate by the rotating driving mechanism and is used for measuring the distance between the wafer loaded on the wafer carrier and a target substrate. The wafer overturning device can measure the distance between the wafer and the target substrate by arranging the laser ranging module, the overturning process of the wafer carrier can be adjusted in time according to the distance between the wafer and the target substrate, collision between the wafer carrier and the target substrate and the fixing equipment of the target substrate can be avoided, and damage caused by the collision can be prevented.

Description

Technical Field

[0001] This invention relates to the technical field of Micro / Mini LED devices and equipment, and particularly to a wafer flipping device and mass transfer equipment. Background Technology

[0002] Mini LED and Micro LED displays represent a new technological development trend in the display field in recent years. The production and fabrication of Mini LED and Micro LED display products differ from those of traditional LCD and OLED displays. The most significant difference lies in the efficiency and quality of transferring a large number of Micro / Mini LED chips onto a target substrate—a process generally referred to as mass transfer.

[0003] There are some limiting issues in performing massive data transfers. These include:

[0004] When performing wafer flipping, the wafer needs to be held in place and flipped. During this process, insufficient or excessive adsorption force may cause the adsorbed wafer to fall off or be damaged.

[0005] When transferring Micro / Mini LED chips from a wafer to a target substrate using a flipping device, it is difficult to determine the distance between the wafer and the target substrate. If the distance between the wafer and the target substrate is not appropriate, such as being too large, it will reduce the accuracy of transferring the Micro / Mini LED chips to the target substrate, making it impossible to accurately and smoothly complete the transfer of Micro / Mini LED chips from the wafer. Summary of the Invention

[0006] This invention provides a wafer flipping device and a mass transfer device to solve one of the technical problems existing in the prior art.

[0007] The wafer flipping device provided by the present invention includes a wafer stage, a rotation drive mechanism, and a laser ranging module. One side of the wafer stage has a wafer fixing area, and the wafer stage can load and fix a wafer in the wafer fixing area. The rotation drive mechanism is connected to the wafer stage and is used to drive the wafer stage to rotate, thereby changing the orientation of the wafer fixing area. The laser ranging module is mounted on a rotating body driven to rotate by the rotation drive mechanism and is used to measure the distance between the wafer loaded on the wafer stage and the target substrate.

[0008] The laser ranging module is detachably connected to the rotating body.

[0009] The wafer flipping device further includes a vacuum pumping mechanism; a negative pressure adsorption hole is provided on the wafer fixing area of ​​the wafer stage, and the negative pressure adsorption hole is connected to the vacuum pumping mechanism.

[0010] The wafer flipping device also includes a stop, and the rotating body has a blocked part, with the stop being disposed on the rotation path of the blocked part.

[0011] The blocked part is a stop block provided on the rotating body.

[0012] The rotating body is provided with an arc-shaped groove, the stop part is inserted into the arc-shaped groove, and the blocked part is the end of the arc-shaped groove.

[0013] The wafer flipping device further includes a photoelectric sensor and a sensor; the sensor is disposed on the rotating body, and the photoelectric sensor is disposed in the area on the rotation drive mechanism corresponding to the rotation path of the sensor. When the rotating body is in the position corresponding to the sensor and the photoelectric sensor, the distance between the stop and the rotating body is less than a set value.

[0014] The rotating body further includes a mounting base, and the wafer stage is disposed on the mounting base; the rotation drive mechanism is connected to the mounting base.

[0015] The wafer flipping device further includes an adjustment base, which is disposed on the mounting base, and the wafer stage is mounted on the adjustment base; multiple areas of the contact portion of the adjustment base that contacts the wafer stage are movable in directions toward and away from the wafer stage.

[0016] The mass transfer device provided by the present invention includes the wafer flipping device described above.

[0017] The wafer flipping device and mass transfer equipment provided in the embodiments of the present invention have the following advantages compared with the prior art:

[0018] The wafer flipping device provided in this embodiment of the invention includes a wafer stage, a rotation drive mechanism, and a laser ranging module. The rotation drive mechanism is connected to the wafer stage and drives the wafer stage to rotate, thereby achieving the flipping function. The laser ranging module is mounted on the rotating body driven by the rotation drive mechanism and is used to measure the distance between the wafer mounted on the wafer stage and the target substrate. By setting the laser ranging module to measure the distance between the wafer mounted on the wafer stage and the target substrate, the flipping process of the wafer stage can be adjusted in a timely manner based on the distance between the wafer mounted on the wafer stage and the target substrate, avoiding collisions between the wafer stage and the target substrate and the fixing equipment of the target substrate, thus preventing damage caused by collisions.

[0019] The mass transfer device provided in this embodiment of the invention includes the wafer flipping device described above and has the same beneficial effects as the wafer flipping device described above, which will not be repeated here. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the wafer flipping device in an embodiment of the present invention from a first viewing angle.

[0023] Figure 2 This is a schematic diagram of the wafer flipping device in an embodiment of the present invention from a second viewing angle.

[0024] Figure 3 This is a schematic diagram of the wafer flipping device in an embodiment of the present invention from a third-view perspective.

[0025] Figure 4 This is a schematic diagram of the wafer flipping device in an embodiment of the present invention from a fourth viewing angle.

[0026] Figure 5 This is a schematic diagram of the wafer flipping device in an embodiment of the present invention from the fifth viewing angle.

[0027] Figure 6 This is a schematic diagram of the wafer flipping device in an embodiment of the present invention from a sixth-view perspective.

[0028] Figure 7 This is a schematic diagram of the wafer flipping device in an embodiment of the present invention from the seventh viewing angle.

[0029] Figure 8 This is a schematic diagram of the wafer flipping device in an embodiment of the present invention from the eighth viewing angle.

[0030] In the picture:

[0031] 10-Wafer stage; 11-Pipeline;

[0032] 20 - Rotary drive mechanism;

[0033] 30 - Mounting base; 31 - First mounting plate; 32 - Second mounting plate;

[0034] 40 - Adjustment seat;

[0035] 50 - Photoelectric sensor;

[0036] 60-Laser ranging module;

[0037] 70-Stop section;

[0038] 80-stop block. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] The embodiments of the wafer flipping device and mass transfer equipment provided by the present invention will be described below with reference to the accompanying drawings.

[0041] (1) Embodiment of wafer flipping device

[0042] See Figures 1 to 8 The wafer flipping device provided in this embodiment includes a wafer stage 10, a rotation drive mechanism 20, a mounting base 30, an adjustment base 40, a photoelectric sensor 50, a laser ranging module 60, and a stop 70.

[0043] Specifically, the wafer stage 10 has a wafer fixing area on one side, which can load and fix the wafer in the wafer fixing area. The wafer flipping device also includes a vacuum mechanism, and a negative pressure adsorption hole is provided in the wafer fixing area. The negative pressure adsorption hole is connected to the vacuum mechanism (not shown in the figure) through a pipe 11 to form a negative pressure at the negative pressure adsorption hole. When the wafer is placed in the wafer fixing area, the vacuum mechanism generates a negative pressure at the negative pressure adsorption hole, and the wafer will be adsorbed on the wafer fixing area.

[0044] The wafer stage 10 is mounted on the adjustment base 40, and the adjustment base 40 is mounted on the mounting base 30. The mounting base 30 includes a first mounting plate 31 and a second mounting plate 32, wherein the first mounting plate 31 is perpendicular to the direction of the output end of the rotary drive mechanism 20, and the second mounting plate 32 is perpendicular to the first mounting plate 31.

[0045] In this embodiment, the rotary drive mechanism 20 is directly connected to the first mounting plate 31 in the mounting base 30, and indirectly connected through the mounting base 30, the adjusting base 40, and the wafer stage 10. The rotary drive mechanism 20 can drive the mounting base 30, the adjusting base 40, and the wafer stage 10 to rotate, and the mounting base 30, the adjusting base 40, and the wafer stage 10 form a rotating body that rotates together.

[0046] During the rotation of the wafer stage 10 driven by the rotary drive mechanism 20, the rotation of the wafer stage 10 changes the orientation of the wafer fixing area. For example, the orientation of the wafer fixing area can change from upward to downward, or from downward to upward, driven by the rotating wafer stage 10. Thus, the wafer stage 10 can adsorb and fix the wafer in the wafer fixing area at a certain rotation angle. Then, driven by the rotary drive mechanism 20, it rotates to another angle, such as when it rotates to face the target substrate and is located at a position corresponding to the target substrate. Multiple Micro / Mini LED chips on the wafer can be scanned sequentially based on laser scanning or other methods. The laser can ablate the adhesive between the Micro / Mini LED chips and the wafer, thereby releasing the Micro / Mini LED chips on the wafer, detaching them from the wafer, and transferring them to the corresponding mounting positions on the target substrate.

[0047] In this embodiment, the laser ranging module 60 is mounted on the rotating body driven by the rotation drive mechanism 20 and is used to measure the distance between the wafer mounted on the wafer stage 10 and the target substrate. By setting the laser ranging module 60 to measure the distance between the wafer mounted on the wafer stage 10 and the target substrate, the flipping process of the wafer stage 10 can be adjusted in a timely manner according to the distance between the wafer mounted on the wafer stage 10 and the target substrate, avoiding collisions between the wafer stage 10 and the target substrate and the equipment used to fix the target substrate, thus preventing damage caused by collisions.

[0048] Specifically, the laser ranging module 60 is detachably connected to the rotating body. Making the laser ranging module 60 detachably connected achieves the following beneficial effects: Firstly, during the transportation of the wafer flipping device, the laser ranging module 60 can be detached, preventing it from becoming an exposed protruding structure of the wafer flipping device, which not only facilitates transportation but also reduces the probability of collisions with other objects; secondly, when the laser ranging module 60 malfunctions or needs to be replaced or repaired for other reasons, it can be easily detached, thus facilitating replacement or repair.

[0049] A blocking part is provided on the rotating body, such as Figure 2As shown, the blocked part can specifically be a stop block 80 disposed on the rotating body. The purpose of providing the stop part 70 is to limit the rotation of the rotating body, so that the wafer stage 10 rotates within a set angle range and cannot exceed the set angle range. To achieve this purpose, the stop part 70 is disposed on the rotation path of the stop block 80, so that when the stop block 80 rotates to the position of the stop part 70, it will come into contact with the stop part 70, and the stop part 70 can restrict the stop block 80 from continuing to rotate. That is, neither the wafer stage 10 nor the rotating body can continue to rotate, thereby achieving the above purpose.

[0050] In other embodiments of the present invention, the blocked part can be a structure other than the stop block 80. For example, the blocked part can be a rotating body with an arc-shaped groove, and the stop part 70 is inserted into the arc-shaped groove. In this case, the end of the arc-shaped groove is the blocked part. In this structure, when the rotating body rotates, the stop part 70 is located at different positions in the arc-shaped groove at different times. When the rotating body rotates to the end of the arc-shaped groove and contacts the stop part 70, the stop part 70 can prevent the rotating body from continuing to rotate.

[0051] As described above, the wafer flipping device also includes a photoelectric sensor 50. In addition to the photoelectric sensor 50, the wafer flipping device also includes a sensor. Specifically, the sensor can be a sensing element, which is disposed on the rotating body. The photoelectric sensor 50 is disposed on the rotation drive mechanism 20 in a region corresponding to the rotation path of the sensor, and when the rotating body is at the position corresponding to the sensor and the photoelectric sensor 50, the distance between the stop portion 70 and the blocked portion of the rotating body is less than a set value, such as... Figure 4 As shown.

[0052] The photoelectric sensor 50 is set on the rotation path of the sensor. When the sensor rotates to the position corresponding to the photoelectric sensor 50, the photoelectric sensor 50 can detect that the sensor is at the position corresponding to the photoelectric sensor 50, thereby determining the angle and position to which the rotating body and the wafer stage 10 have rotated.

[0053] In this embodiment, when the sensor rotates to the position corresponding to the photoelectric sensor 50, the state between the blocked part and the stop part on the rotating body is: the distance between the stop part 70 and the blocked part of the rotating body is less than a set value. By configuring the value of the set value, this state can be that the blocked part on the rotating body is close to the stop part 70, such as... Figure 4As shown. Thus, the photoelectric sensor 50 and the sensor can determine at a certain moment that the blocked part on the rotating body has rotated to a position close to the stop part 70. Based on the current rotational state of the rotating body, after a certain period of time, the blocked part on the rotating body will reach the stop part 70 and come into contact with and collide with it. After understanding the above information, the output of the rotary drive mechanism 20 can be adjusted, for example, by reducing the rotational speed of the output end of the rotary drive mechanism 20, or by stopping the output power of the rotary drive mechanism 20, to prevent the blocked part on the rotating body from contacting and colliding with the stop part 70 at a subsequent moment.

[0054] In this embodiment, the adjustment seat 40 is disposed on the mounting seat 30, and the wafer stage 10 is mounted on the adjustment seat 40. Multiple areas of the contact portion of the adjustment seat 40 that connects with the wafer stage 10 are movable in directions approaching and away from the wafer stage 10. In other words, the height of different areas on the adjustment seat 40 is adjustable. By setting various heights of different areas of the adjustment seat 40, the state of the wafer stage 10 mounted on the adjustment seat 40 will change accordingly, and the angle of the plane containing the wafer fixing area on the wafer stage 10 will also change accordingly. In actual wafer flipping and transfer scenarios, assuming the wafer needs to be transferred horizontally from the wafer stage 10 of the wafer flipping device to a position corresponding to the target substrate, or transferred from other equipment to the wafer stage 10 of the wafer flipping device, if the plane containing the wafer fixing area of ​​the wafer stage 10 is not horizontal, the height of different areas of the adjustment seat 40 can be specifically controlled and adjusted by adjusting the adjustment seat 40, so that the wafer fixing area on the wafer stage 10 is on a horizontal plane.

[0055] In this embodiment, the wafer flipping device includes an adjustment base 40, which is disposed between the mounting base 30 and the wafer stage 10. However, it should be noted that in other embodiments of the present invention, the wafer flipping device may not include the adjustment base 40. In this case, the specific structural form of the wafer stage 10 disposed on the mounting base 30 may be that the wafer stage 10 is directly mounted on the mounting base 30, specifically on the second mounting plate 32. As for the rotation drive mechanism 20, its output end may still be directly connected to the mounting base 30, specifically connected to the first mounting plate 31.

[0056] In summary, the wafer flipping device provided in this embodiment includes a wafer stage 10, a rotation drive mechanism 20, and a laser ranging module 60. The rotation drive mechanism 20 is connected to the wafer stage 10 and drives the wafer stage 10 to rotate, thereby achieving the flipping function. The laser ranging module 60 is mounted on the rotating body driven by the rotation drive mechanism 20 and is used to measure the distance between the wafer mounted on the wafer stage 10 and the target substrate. By setting the laser ranging module 60 to measure the distance between the wafer mounted on the wafer stage 10 and the target substrate, the flipping process of the wafer stage 10 can be adjusted in a timely manner based on the distance between the wafer mounted on the wafer stage 10 and the target substrate, avoiding collisions between the wafer stage 10 and the target substrate and the fixing equipment of the target substrate, thus preventing damage caused by collisions.

[0057] (2) Examples of Mass Transfer Equipment

[0058] In this embodiment, the mass transfer device includes the wafer flipping device described in the embodiments of the wafer flipping device described above.

[0059] The mass transfer device provided in this embodiment includes the wafer flipping device described in the above-described wafer flipping device embodiment, and has the same beneficial effects as the above-described wafer flipping device, which will not be repeated here.

[0060] The various embodiments in this specification are described in a progressive manner. Several embodiments focus on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other.

[0061] It should be noted that in the specification, claims, and accompanying drawings of this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or specific order or sequence between these entities or operations. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein.

[0062] Furthermore, the terms "comprising," "including," and "having," as well as any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. For example, a process, method, system, product, or apparatus that comprises a list of steps or units is not necessarily limited to those steps or units expressly listed, but may include other steps or units not expressly listed or inherent to such process, method, product, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0063] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0064] The above are merely specific embodiments of this application, enabling those skilled in the art to understand or implement this application. Various modifications and variations to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application. Therefore, this application is not limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A wafer flipping device, characterized in that, The wafer flipping device includes a wafer stage, a rotation drive mechanism, and a laser ranging module. The wafer stage has a wafer fixing area on one side, and the wafer stage can load and fix the wafer in the wafer fixing area; The rotary drive mechanism is connected to the wafer stage and is used to drive the wafer stage to rotate, thereby changing the orientation of the wafer fixing area; The laser ranging module is mounted on a rotating body driven by the rotary drive mechanism and is used to measure the distance between the wafer mounted on the wafer carrier and the target substrate. Among them, by setting up a laser ranging module, the distance between the wafer loaded on the wafer stage and the target substrate is measured. Based on the distance between the wafer loaded on the wafer stage and the target substrate, the flipping process of the wafer stage can be adjusted in a timely manner to avoid collisions between the wafer stage and the target substrate and the fixing equipment of the target substrate, thus preventing damage caused by collisions. The wafer flipping device also has a stop part, and the rotating body has a blocked part, and the stop part is disposed on the rotation path of the blocked part; The blocked part is a stop block provided on the rotating body; The rotating body is provided with an arc-shaped groove, the stop part is inserted into the arc-shaped groove, and the blocked part is the end of the arc-shaped groove; The wafer flipping device further includes a photoelectric sensor and an inductor; the inductor is disposed on the rotating body, and the photoelectric sensor is disposed on the rotation drive mechanism in the area corresponding to the rotation path of the inductor, and when the rotating body is in the position corresponding to the inductor and the photoelectric sensor, the distance between the stop and the rotating body is less than a set value.

2. The wafer flipping device according to claim 1, characterized in that, The laser ranging module is detachably connected to the rotating body.

3. The wafer flipping device according to claim 1, characterized in that, The wafer flipping device also includes a vacuum pumping mechanism; The wafer stage has a negative pressure adsorption hole on its wafer fixing area, and the negative pressure adsorption hole is connected to the vacuum pumping mechanism.

4. The wafer flipping device according to claim 1, characterized in that, The rotating body also includes a mounting base, and the wafer stage is disposed on the mounting base; The rotary drive mechanism is connected to the mounting base.

5. The wafer flipping device according to claim 4, characterized in that, The wafer flipping device further includes an adjustment base, which is disposed on the mounting base, and the wafer stage is mounted on the adjustment base; Multiple regions of the contact portion of the adjustment seat that connects with the wafer stage are movable in directions toward and away from the wafer stage.

6. A mass transfer device, characterized in that, The mass transfer device includes the wafer flipping device according to any one of claims 1 to 5.

Images