Display panel, display device and manufacturing method of display panel

Abstract

The application discloses a display panel, a display device and a manufacturing method of the display panel. The display panel comprises a bearing layer, the bearing layer comprises a first bearing part located in a display area and a second bearing part located in a bending area; a circuit layer comprises a first circuit part and a second circuit part, the first circuit part is at least partially located in the display area, the second circuit part is located in the bending area and electrically connected with the first circuit part, in a thickness direction, the second bearing part is protruded from the first bearing part to a side away from the second circuit part and forms a protruding part, and the second circuit part is at least partially recessed relative to the first circuit part to a side where the second bearing part is located. The application can improve the bending resistance of the bending area, so that the bending radius of the display panel can be further reduced.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] In recent years, full-screen displays have become the mainstream design solution in the display field and have been favored by consumers. Currently, the flexibility of flexible screens is mainly used to achieve full-screen displays. By bending the edges of the flexible screen to the back of the main display area, the bezel width of the flexible screen is reduced, thereby increasing the screen-to-body ratio.

[0003] The width of the bezel of a flexible screen depends on its bending radius. However, the bending stress that the circuitry in the bending area can withstand is currently relatively small, making it prone to breakage. This limits the bending radius of the flexible screen and prevents it from meeting the requirements for narrow bezels. Summary of the Invention

[0004] This application provides a display panel, a display device, and a method for manufacturing the display panel, which can improve the bending resistance of the circuit in the bending area and further reduce the bending radius of the display panel.

[0005] In a first aspect, embodiments of this application provide a display panel including a display area and a bending area. The display panel includes: a carrier layer, the carrier layer including a first carrier portion located in the display area and a second carrier portion located in the bending area; and a circuit layer, which is stacked on the carrier layer in the thickness direction of the carrier layer. The circuit layer includes a first circuit portion and a second circuit portion. The first circuit portion is at least partially located in the display area, and the second circuit portion is located in the bending area and electrically connected to the first circuit portion. In the thickness direction, the second carrier portion protrudes from the first carrier portion to a side opposite to the second circuit portion, forming a protrusion. The second circuit portion is at least partially recessed relative to the first circuit portion towards the side where the second carrier portion is located. The display panel is capable of bending in the bending area to form a bent state.

[0006] According to the foregoing embodiments of the first aspect of this application, the display panel further includes a bonding area located on the side of the bending area away from the display area, the carrier layer further includes a third carrier portion located in the bonding area, and the circuit layer further includes a third circuit portion located at least partially in the bonding area, the third circuit portion being electrically connected to the second circuit portion.

[0007] According to any of the foregoing embodiments of the first aspect of this application, in the thickness direction, the second bearing portion protrudes from the third bearing portion on the side opposite to the second line portion, and the second line portion is at least partially recessed relative to the third line portion on the side where the second bearing portion is located.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the third carrier portion is disposed on the same layer as the second carrier portion, and the third circuit portion is disposed on the same layer as the second circuit portion.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the first line portion is connected to the second line portion via a via, and / or the third line portion is connected to the first line portion via a via.

[0010] According to any of the foregoing embodiments of the first aspect of this application, one end of the first line portion near the second line portion extends to the side of the elastic protective layer opposite to the second line portion. A first connection hole penetrating the elastic protective layer in the thickness direction is provided at the position where the first line portion overlaps with the elastic protective layer. A conductive metal layer is provided on the inner surface of the first connection hole. The first line portion and the second line portion are electrically connected through the conductive metal layer.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the elastic protective layer is flush with the side surface facing away from the second circuit portion, the side surface facing the first bearing portion of the first circuit portion, and the side surface facing the third bearing portion of the third circuit portion.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the first support portion and the third support portion are disposed in the same layer, the second support portion is disposed in layers with the first support portion and the third support portion, and the second support portion is connected to the first support portion and the third support portion through the elastic protective layer.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: an encapsulation layer located in the display area, the bending area, and the bonding area, the encapsulation layer exposing one end of the third line portion away from the second line portion.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the second bearing portion is provided with a wiring groove on the side facing the wiring layer in the thickness direction, the second wiring portion is provided on the inner sidewall and bottom of the wiring groove, and the elastic protective layer is provided inside the wiring groove.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the second wiring portion includes a plurality of second wirings extending along a first direction and spaced apart in a second direction, the wiring grooves extending along the first direction for a predetermined length, the second bearing portion being provided with a plurality of the wiring grooves spaced apart in the second direction, the second direction being perpendicular to the thickness direction, and the second direction intersecting the first direction.

[0016] According to any of the foregoing embodiments of the first aspect of this application, in the thickness direction, the side of the elastic protective layer away from the second bearing portion protrudes from the first circuit portion.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the second support portion is an elastic colloidal layer; or, both the first support portion and the second support portion include a polyimide layer and an inorganic layer stacked in the thickness direction.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a light-emitting device layer located in the display area and electrically connected to the first circuit portion; an encapsulation layer stacked on the light-emitting device layer in the thickness direction; the encapsulation layer being located in the display area and the bonding area and exposing the bending area.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the side of the elastic protective layer away from the carrier layer is flush with the side of the encapsulation layer away from the light-emitting device layer.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the bending area includes a first transition area and a bending area, the first transition area connects the display area and the bending area, and the connection position between the first line portion and the second line portion is located in the first transition area.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the bending area further includes a second transition area, the second transition area connecting the bending area and the binding area, and the connection position between the second line portion and the third line portion is located in the second transition area.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes an isolation layer disposed on both sides of the protrusion in the first direction.

[0023] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a support layer disposed on the side of the carrier layer opposite to the circuit layer. The support layer includes a first support layer and a second support layer. The first support layer is located in the display area and disposed on the side of the first carrier portion opposite to the first circuit portion. The second support layer is located in the bonding area and disposed on the side of the third carrier portion opposite to the third circuit portion. In the first direction, the first support layer is spaced apart from the protrusion, and the second support layer is spaced apart from the protrusion.

[0024] Secondly, embodiments of this application provide a display device, including a display panel as described in any of the preceding embodiments.

[0025] Thirdly, embodiments of this application provide a method for manufacturing a display panel, comprising: providing a support platform, the support platform including a first region and a second region disposed along a first direction, the second region being provided with a groove; forming a bearing layer on the support platform, the bearing layer including a first bearing portion located in the first region and a second bearing portion located in the second region, the second bearing portion protruding from the first bearing portion on the side facing the support platform and forming a protrusion; forming a circuit layer on the bearing layer, the circuit layer including a first circuit portion at least partially located in the first region and a second circuit portion located in the second region, the second circuit portion being electrically connected to the first circuit portion, and the second circuit portion being at least partially recessed relative to the first circuit portion toward the side where the second bearing portion is located; and removing the support platform.

[0026] According to the foregoing embodiments of the second aspect of this application, the support platform further includes a third region located along the first direction on the side of the second region away from the first region, the bearing layer includes a third bearing portion located in the third region, and the wiring layer includes a third wiring portion located at least partially in the third region, the third wiring portion being electrically connected to the second wiring portion.

[0027] According to any of the foregoing embodiments of the second aspect of this application, the second line portion is at least partially recessed relative to the third line portion toward the side where the second bearing portion is located.

[0028] According to any of the foregoing embodiments of the second aspect of this application, the groove extends from the second region to the third region, the third support portion is disposed in the same layer as the second support portion, and the third circuit portion is disposed in the same layer as the second circuit portion.

[0029] According to any of the foregoing embodiments of the second aspect of this application, before removing the support platform, the manufacturing method further includes: forming an elastic protective layer on the second circuit portion, the elastic protective layer being located in the second region.

[0030] According to any of the foregoing embodiments of the second aspect of this application, the step of forming a circuit layer on the carrier layer and forming an elastic protective layer on the second circuit portion includes: forming a second circuit portion on the second carrier portion; forming an elastic protective layer on the second circuit portion, wherein the orthographic projection of the elastic protective layer in the thickness direction of the carrier layer covers the orthographic projection of the second circuit portion in the thickness direction; forming a first circuit portion on the first carrier portion and the elastic protective layer, and forming a third circuit portion on the third carrier portion and the elastic protective layer; providing a first connecting hole penetrating the elastic protective layer in the thickness direction at the position where the first circuit portion overlaps with the elastic protective layer, and providing a second connecting hole penetrating the elastic protective layer in the thickness direction at the position where the third circuit portion overlaps with the elastic protective layer; forming a conductive metal layer on the inner surface of the first connecting hole and the second connecting hole, so that the first circuit portion is electrically connected to the second circuit portion, and the second circuit portion is electrically connected to the third circuit portion.

[0031] According to any of the foregoing embodiments of the second aspect of this application, the step of forming a bearing layer on the support platform, forming a circuit layer on the bearing layer, and forming an elastic protective layer on the second circuit portion includes: forming a first bearing portion located in the first region and a third bearing portion located in the third region on the support platform; forming a filling layer located in the second region on the support platform; removing a portion of material from the side surface of the filling layer facing away from the support platform in the thickness direction to form a second bearing portion including a wiring groove; forming a first circuit portion on the first bearing portion, forming a third circuit portion on the third bearing portion, forming a second circuit portion on the inner sidewall and bottom of the wiring groove, and electrically connecting the first circuit portion and the second circuit portion, and electrically connecting the third circuit portion and the second circuit portion; forming an elastic protective layer on the second circuit portion, the elastic protective layer being disposed within the wiring groove.

[0032] According to any of the foregoing embodiments of the second aspect of this application, before removing the support platform, the manufacturing method further includes: forming a light-emitting device layer on the circuit layer, the light-emitting device layer being located in the first region and electrically connected to the first circuit portion; forming an encapsulation layer on the light-emitting device layer, the orthographic projection of the encapsulation layer in the thickness direction of the carrier layer at least covering the light-emitting device layer.

[0033] According to any of the foregoing embodiments of the second aspect of this application, after removing the support platform, the manufacturing method further includes: forming a support layer on the side of the carrier layer opposite to the circuit layer, the support layer including a first support layer and a second support layer, the first support layer being disposed on the side surface of the first carrier portion opposite to the first circuit portion, the second support layer being disposed on the side surface of the third carrier portion opposite to the third circuit portion, and in the first direction, the first support layer and the second carrier portion are spaced apart, and the second support layer and the second carrier portion are spaced apart.

[0034] According to any of the foregoing embodiments of the second aspect of this application, after removing the support platform, the manufacturing method further includes: forming an isolation layer on both sides of the protrusion in the first direction.

[0035] The display panel, display device, and manufacturing method of the display panel provided in this application embodiment include a second carrier portion and a second circuit portion located in the bending area. The display panel can be bent in the bending area to form a bent state. Both the second circuit portion and the second carrier portion protrude towards the backlight direction of the display panel, so that the position of the second circuit portion can be adjusted without thinning the second carrier portion. The protruding portion of the second circuit portion is not limited by the thickness of the carrier layer. When the display panel is in a bent state, the second circuit portion can be located on the bending neutral surface of the bending area or on the side where the bending pressure portion is located. The second circuit portion is not subject to tensile stress. Since the compressive strength of the circuit layer is much greater than its tensile strength, the bending resistance of the second circuit portion is high. The bending radius of the bending area of ​​the display panel can be further reduced, which can meet the usage requirements of narrow bezel displays. Attached Figure Description

[0036] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0037] Figure 1 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application;

[0038] Figure 2 This is a schematic diagram of the structure of a display panel in a bent state according to an embodiment of this application;

[0039] Figure 3 A top view of the second circuit section of a display panel provided in an embodiment of this application;

[0040] Figure 4 This is a schematic diagram of the structure of a display panel in a bent state, provided in another embodiment of this application;

[0041] Figure 5 A top view of the second support portion of a display panel provided in another embodiment of this application;

[0042] Figure 6 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0043] Figure 7 A top view of the second support portion of a display panel provided in another embodiment of this application;

[0044] Figure 8 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0045] Figure 9 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0046] Figure 10 This is a schematic diagram of the structure of a display panel in a bent state, provided in another embodiment of this application;

[0047] Figure 11 A schematic diagram of the structure of a display panel in a bent state, provided in yet another embodiment of this application;

[0048] Figure 12 A top view of the second support portion of a display panel provided in yet another embodiment of this application;

[0049] Figure 13 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0050] Figure 14 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0051] Figure 15 A schematic diagram of the structure of a display panel in a bent state, provided in yet another embodiment of this application;

[0052] Figure 16 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0053] Figures 16a to 16g These are schematic diagrams illustrating the various stages of a method for manufacturing a display panel according to an embodiment of this application.

[0054] Figure 17 A flowchart illustrating a method for manufacturing a display panel according to another embodiment of this application;

[0055] Figure 18 A flowchart illustrating a method for manufacturing a display panel according to yet another embodiment of this application;

[0056] Figures 18a to 18dThese are schematic diagrams illustrating the various stages of a method for manufacturing a display panel according to yet another embodiment of this application.

[0057] Figure 19 A flowchart illustrating a method for manufacturing a display panel according to another embodiment of this application;

[0058] Figures 19a to 19g These are schematic diagrams illustrating the various stages of a method for manufacturing a display panel according to another embodiment of this application.

[0059] Figure 20 A flowchart illustrating a method for manufacturing a display panel according to yet another embodiment of this application;

[0060] Figures 20a to 20g These are schematic diagrams illustrating the various stages of a method for manufacturing a display panel according to yet another embodiment of this application.

[0061] Figure 21 A flowchart illustrating a method for manufacturing a display panel according to another embodiment of this application;

[0062] Figures 21a to 21f These are schematic diagrams illustrating the various stages of a method for manufacturing a display panel according to another embodiment of this application.

[0063] Figure 22 A flowchart illustrating a method for manufacturing a display panel according to yet another embodiment of this application;

[0064] Figure 23 This is a schematic diagram of the molding stage of a method for manufacturing a display panel according to another embodiment of this application.

[0065] Explanation of reference numerals in the attached figures:

[0066] Display area A1; Bending area A2; First transition area A21; Bending area A22; Second transition area A23; Binding area A3;

[0067] Support layer 100; first support portion 110; second support portion 120; wiring groove 121; third support portion 130; protrusion 140; isolation layer 150;

[0068] Line layer 200; First line section 210; Second line section 220; Second routing 221; Third line section 230;

[0069] Elastic protective layer 300; first connecting hole 310; second connecting hole 320; conductive metal layer 330;

[0070] Encapsulation layer 400;

[0071] First support layer 510; Second support layer 520;

[0072] Composite functional layer 600;

[0073] Support platform 001; Groove 010; Filling layer 020; First zone E1; Second zone E2; Third zone E3;

[0074] First direction X; second direction Y; thickness direction Z. Detailed Implementation

[0075] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0076] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0077] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0078] To better understand this application, the following will be combined with... Figures 1 to 23 The present application provides a detailed description of the display panel, display device, and manufacturing method of the display panel according to embodiments of the present application.

[0079] Currently, full-screen displays primarily utilize the flexibility of flexible screens. By bending the edges of the flexible screen to the back of the main display area, the bezel width is reduced, increasing the screen-to-body ratio. The bezel width depends on the bending radius of the flexible screen. However, the bending stress that the circuitry in the bending area can withstand is currently relatively small, making it prone to breakage. This limits the bending radius of the flexible screen and cannot meet the requirements for narrow bezels.

[0080] To address the aforementioned issues, this application provides a display panel that improves the bending resistance of the bending area, thereby further reducing the bending radius of the display panel and meeting the requirements for narrow bezels. The display panel can be an Organic Light Emitting Diode (OLED) display panel, a Micro-Light Emitting Diode (Micro-LED) display panel, or the like.

[0081] Figure 1 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application; Figure 2 This is a schematic diagram of the structure of a display panel in a bent state according to an embodiment of this application; Figure 3 This is a top view of the second circuit section of a display panel provided in an embodiment of this application.

[0082] like Figure 1 and Figure 2 As shown, the display panel of this application embodiment includes a display area A1 and a bending area A2, and the display panel can be bent in the bending area A2 to form a bent state.

[0083] The display panel has a flat state and a bent state. Optionally, in the flat state, the display area A1 and the bent area A2 are set along the first direction X. In the bent state, the part of the display panel located in the display area A1 can be flat, and the part of the display panel located in the bent area A2 can be arc-shaped.

[0084] The display panel includes a carrier layer 100 and a circuit layer 200, wherein the circuit layer 200 is stacked on the carrier layer 100 in the thickness direction Z. The carrier layer 100 includes a first carrier portion 110 located in the display area A1 and a second carrier portion 120 located in the bending area A2; the circuit layer 200 includes a first circuit portion 210 and a second circuit portion 220, wherein the first circuit portion 210 is at least partially located in the display area A1, and the second circuit portion 220 is located in the bending area A2 and is electrically connected to the first circuit portion 210.

[0085] In the thickness direction Z, the second support portion 120 protrudes from the first support portion 110 on the side opposite to the second line portion 220 and forms a protrusion 140. The second line portion 220 is at least partially recessed relative to the first line portion 210 on the side where the second support portion 120 is located.

[0086] According to the display panel of the present application embodiment, both the second line portion 220 and the second carrier portion 120 protrude towards the backlight direction of the display panel, so that the position of the second line portion 220 can be adjusted without thinning the second carrier portion 120. The protruding portion of the second line portion 220 is not limited by the thickness of the carrier layer 100. When the display panel is in a bent state, the second line portion 220 can be located on the bending neutral surface of the bending area A2 or on the side where the bending pressure portion is located. The second line portion 220 is not subject to tensile stress. Since the compressive strength of the line layer 200 is much greater than its tensile strength, the bending resistance of the second line portion 220 is high. The bending radius of the bending area A2 of the display panel can be further reduced, which can meet the usage requirements of narrow bezel display.

[0087] This application does not specifically limit the offset dimensions of the second wiring portion 220 and the second support portion 120. Optionally, the second wiring portion 220 may be at least partially recessed relative to the first support portion 110 toward the side where the second support portion 120 is located, and the second wiring portion 220 may at least partially protrude from the first support portion 110, which can increase the offset distance of the second wiring portion 220 and further improve the bending resistance of the second wiring portion 220 and the bending area A2. Of course, the orthographic projection of the second wiring portion 220 in the first direction X may also be completely within the orthographic projection of the first support portion 110 in the first direction X, which is also within the protection scope of this application.

[0088] In some embodiments, the second support portion 120 is bendable, so that the display panel can be bent at the location of the bending area A2 to form a bent state. Optionally, the second support portion 120 may be made of polyimide (PI) material or a material containing PI. The organic layer made of polyimide material has good flexibility and is resistant to bending.

[0089] Optionally, for ease of manufacturing, the layer structure and materials of the first support portion 110 and the second support portion 120 can be the same.

[0090] Optionally, both the first carrier portion 110 and the second carrier portion 120 include a polyimide layer and an inorganic layer stacked in the thickness direction Z. The first circuit portion 210 and the second circuit portion 220 are stacked on the inorganic layer. On the one hand, this facilitates the formation of the circuit layer 200 on the carrier layer 100. On the other hand, the carrier layer 100 can better support and protect the circuit layer 200.

[0091] Optionally, the inorganic layer can be made of foam or similar materials, which can both block light and provide cushioning and protection for the display panel.

[0092] Optionally, the first support portion 110 and the second support portion 120 include a first polyimide layer, a first inorganic layer, a second polyimide layer and a second inorganic layer sequentially stacked in the thickness direction Z, which can better support and protect the circuit layer 200.

[0093] In other embodiments, the second support portion 120 can be an elastic gel layer, which can also ensure the bending resistance of the bending area A2 of the display panel. Optionally, the second support portion 120 can be made of materials such as thermosetting adhesives and UV adhesives, which have high elasticity, good flexibility, and bending resistance.

[0094] In some optional embodiments, the display panel further includes an elastic protective layer 300, which is located in the bending region A2 and stacked on the second circuit portion 220 in the thickness direction Z. By covering the second circuit portion 220 with the elastic protective layer 300, the second circuit portion 220 can be protected, and the thickness of the display panel in the bending region A2 portion can be increased, which is beneficial to adjusting the second circuit portion 220 to the bending neutral surface or the side where the bending pressure portion is located.

[0095] The elastic protective layer 300 is bendable. Optionally, the material of the elastic protective layer 300 can be a flexible colloid, which can ensure the bending resistance of the bending area A2 of the display panel. Optionally, the material of the elastic protective layer 300 can be made of thermosetting adhesive, UV adhesive, etc., which has high elasticity, good flexibility, and bend resistance.

[0096] In some embodiments, the second support portion 120 and the first support portion 110 are arranged in layers, and the second support portion 120 can be connected to the first support portion 110 through an elastic protective layer 300, which is simple and reliable. The orthographic projection of the second support portion 120 in the first direction X and the orthographic projection of the first support portion 110 in the first direction X may partially overlap or not overlap at all, both of which are within the protection scope of this application.

[0097] The second line section 220 is electrically connected to the first line section 210. There are various ways to make the electrical connection. In some optional embodiments, the first line section 210 and the second line section 220 can be connected through a via.

[0098] To facilitate the via connection between the second line section 220 and the first line section 210, optionally, the surface of the elastic protective layer 300 facing away from the second line section 220 can be flush with the surface of the first line section 210 facing the first support portion 110. The end of the first line section 210 near the second line section 220 can extend to the side of the elastic protective layer 300 facing away from the second line section 220. When manufacturing the display panel, the first line section 210 can be formed on the first support portion 110 and the elastic protective layer 300, so that the end of the first line section 210 near the second line section 220 extends to the bending area A2 and overlaps with the elastic protective layer 300. The position where the first line section 210 overlaps with the elastic protective layer 300 can be provided with a first connecting hole 310 penetrating the elastic protective layer 300 in the thickness direction Z. A conductive metal layer 330 is formed on the inner surface of the first connecting hole 310, thereby realizing the electrical connection between the first line section 210 and the second line section 220.

[0099] Please continue to refer to this. Figure 1 and Figure 2 In some optional embodiments, the display panel further includes a light-emitting device layer and an encapsulation layer 400. The light-emitting device layer is located in the display area A1 and is stacked on the first circuit portion 210 in the thickness direction Z. The light-emitting device layer is electrically connected to the first circuit portion 210 and includes multiple light-emitting devices. The first circuit portion 210 can control the light emission display of the light-emitting device layer. The encapsulation layer 400 is at least located in the display area A1 and is stacked on the light-emitting device layer in the thickness direction Z. The encapsulation layer 400 protects the light-emitting device layer and prevents the external environment from affecting the light emission performance of the display panel.

[0100] Optionally, the encapsulation layer 400 may be located in the display area A1 and the bending area A2. In the bending area A2, the encapsulation layer 400 is stacked on the elastic protective layer 300 in the thickness direction Z to protect the circuit layer 200 and the elastic protective layer 300 through the encapsulation layer 400.

[0101] like Figure 3 As shown, in some embodiments, the second line portion 220 may include a plurality of first traces extending along the first direction X and spaced apart in the second direction Y, and the second line portion 220 may include a plurality of second traces extending along the first direction X and spaced apart in the second direction Y, with the plurality of first traces and the plurality of second traces connected one-to-one.

[0102] The second direction Y is perpendicular to the thickness direction Z, and intersects with the first direction X. Optionally, the second direction Y is perpendicular to the first direction X.

[0103] Figure 4 This is a schematic diagram of the structure of a display panel in a bent state, provided in another embodiment of this application;

[0104] Figure 5 This is a top view of the second support portion of a display panel provided in another embodiment of this application.

[0105] like Figure 4 and Figure 5 As shown, in some optional embodiments, the bending area A2 of the display panel may include a first transition area A21 and a bending area A22. The first transition area A21 connects the display area A1 and the bending area A22, and the display panel can be bent in the bending area A22 to form a bent state. In the bent state of the display panel, the portion of the display panel located between the display area A1 and the first transition area A21 is flat. The first transition area A21 is provided between the display area A1 and the bending area A22 to avoid bending stress at the connection between the display area A1 and the bending area A2. This protects the display function of the display panel and prevents interlayer separation at the end where the bending area A2 is connected to the display area A1.

[0106] Optionally, the connection point between the first circuit portion 210 and the second circuit portion 220 is located in the first transition region A21, that is, the first connecting hole 310 and the conductive metal layer 330 formed on the inner surface of the first connecting hole 310 are located in the first transition region A21. This can prevent the connection structure from affecting the strength and bending resistance of the circuit layer 200 located in the bending region A22, ensuring that the circuit layer 200 will not break due to bending. Of course, the connection point between the first circuit portion 210 and the second circuit portion 220 can also be set in the bending region A22, which is also within the protection scope of this application.

[0107] Figure 6 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application; Figure 7 This is a top view of the second support portion of a display panel provided in another embodiment of this application.

[0108] like Figure 6 and Figure 7 As shown, in some optional embodiments, the second carrier portion 120 may have a wiring groove 121 on the side facing the circuit layer 200 in the thickness direction Z, and the second circuit portion 220 may be disposed on the inner sidewall and bottom of the wiring groove 121. An elastic protective layer 300 may be disposed within the wiring groove 121 to cover and protect the second circuit portion 220.

[0109] When manufacturing the display panel, after forming a wiring groove 121 on the second support portion 120, a first wiring portion 210 can be formed on the first support portion 110, and a second wiring portion 220 can be formed on the inner side wall and bottom of the wiring groove 121, and the end of the second wiring portion 220 close to the first wiring portion 210 can be directly connected to the first wiring portion 210.

[0110] Optionally, the second wiring section 220 includes a plurality of second traces extending along the first direction X and spaced apart in the second direction Y. Correspondingly, the second support section 120 may be provided with a plurality of wiring grooves 121 spaced apart in the second direction Y. The wiring grooves 121 extend along the first direction X by a predetermined length, and the plurality of wiring grooves 121 correspond one-to-one with the plurality of second traces. Of course, the second support section 120 may also be provided with only one wiring groove 121, and the width of the wiring groove 121 in the second direction Y is not less than the overall width of the second wiring section 220 in the second direction Y, which is also within the protection scope of this application.

[0111] Optionally, the second support portion 120 can be an elastic gel layer, which can ensure the bending resistance of the bending area A2 of the display panel. Optionally, the material of the second support portion 120 can be thermosetting adhesive, UV adhesive, etc., which have high elasticity, good flexibility, and bend resistance.

[0112] In some alternative embodiments, the side of the elastic protective layer 300 facing away from the second line portion 220 may protrude from the first line portion 210 in the thickness direction Z.

[0113] In some alternative embodiments, the display panel includes an encapsulation layer 400, which may be located in the display area A1. The encapsulation layer 400 exposes the bending area A2 to protect the first circuit portion 210 while preventing the encapsulation layer 400 from affecting the bending performance of the bending area A2.

[0114] Optionally, in the thickness direction Z, the surface of the elastic protective layer 300 facing away from the second circuit section 220 can be flush with the surface of the encapsulation layer 400 facing away from the circuit layer 200. This allows the bending area A2 and the display area A1 of the display panel to have a smooth and flat transition in appearance, making the appearance of the display panel more aesthetically pleasing.

[0115] Figure 8 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application.

[0116] like Figure 8 As shown, in some optional embodiments, the display panel may further include a bonding area A3 located on the side of the bending area A2 away from the display area A1, the carrier layer 100 may further include a third carrier portion 130 located in the bonding area A3, and the circuit layer 200 may further include a third circuit portion 230 located at least partially in the bonding area A3, the third circuit portion 230 being electrically connected to the second circuit portion 220.

[0117] In the flattened state of the display panel, the display area A1, the transition area A2, and the bonding area A3 can be arranged sequentially along the first direction X. In the bent state of the display panel, the part of the display panel located in the bonding area A3 can be flat and located on the side of the backlight surface of the display area A1, so as to facilitate bonding of chips and other components.

[0118] Optionally, the third wiring section 230 may include a plurality of third traces extending along the first direction X and spaced apart in the second direction Y, wherein the plurality of third traces are connected one-to-one with the plurality of first traces.

[0119] Please continue to refer to this. Figure 8 In some optional embodiments, the third carrier portion 130 and the second carrier portion 120 can be arranged on the same layer, and the third circuit portion 230 and the second circuit portion 220 can be arranged on the same layer, so that the third carrier portion 130 and the second carrier portion 120 can be integrally formed, and the third circuit portion 230 and the second circuit portion 220 can be integrally formed. The electrical connection between the third circuit portion 230 and the second circuit portion 220 is simple and convenient, thereby facilitating the manufacturing of the display panel.

[0120] It is understandable that the third support portion 130 is arranged on the same layer as the second support portion 120, and the third circuit portion 230 is arranged on the same layer as the second circuit portion 220. Then, the side of the third support portion 130 facing away from the third circuit portion 230 protrudes from the first support portion 110, and the third circuit portion 230 is at least partially recessed relative to the first circuit portion 210 towards the side where the third support portion 130 is located. This causes the third circuit portion 230 and the third support portion 130 to be offset towards the backlight direction of the display panel, which can improve the bending resistance of the third circuit portion 230 and the bonding area A3.

[0121] It should be noted that the third bearing part 130 and the second bearing part 120 are arranged on the same layer, the third circuit part 230 and the second circuit part 220 are arranged on the same layer, and the first circuit part 210 and the second circuit part 220 can be connected by through holes or by other electrical connections, all of which are within the protection scope of this application.

[0122] Please continue to refer to this. Figure 8 In some optional embodiments, the elastic protective layer 300 may extend from the bending area A2 to the bonding area A3. In the bonding area A3, the elastic protective layer 300 is located on the side of the third line portion 230 facing away from the third support portion 130. By covering at least a portion of the third line portion 230 with the elastic protective layer 300, the third line portion 230 can be protected, and the thickness of the display panel in the bonding area A3 portion can be increased.

[0123] Optionally, the elastic protective layer 300 exposes one end of the third circuit section 230 away from the second circuit section 220. The end of the third circuit section 230 away from the second circuit section 220 can be a bonding pin. Exposing the bonding pin facilitates the bonding connection between the chip and other components and the circuit layer 200.

[0124] Optionally, the encapsulation layer 400 can be located in the display area A1, the bending area A2, and the bonding area A3. In the bending area A2 and the bonding area A3, the encapsulation layer 400 can be stacked on the elastic protective layer 300 in the thickness direction Z so as to protect the elastic protective layer 300 through the encapsulation layer 400.

[0125] Optionally, the encapsulation layer 400 exposes one end of the third line portion 230 away from the second line portion 220. The end of the third line portion 230 away from the second line portion 220 can be a bonding pin. Exposing the bonding pin facilitates bonding and connection of components such as chips to the line layer 200.

[0126] Figure 9 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application; Figure 10 This is a schematic diagram of the structure of a display panel in a bent state, as provided in another embodiment of this application.

[0127] like Figure 9 and 10 As shown, in some alternative embodiments, in the thickness direction Z, the second support portion 120 may also protrude from both the first support portion 110 and the third support portion 130 on the side opposite to the second line portion 220. The second line portion 220 may at least partially be recessed relative to the first line portion 210 and the third line portion 230 on the side where the second support portion 120 is located, which is also within the protection scope of this application.

[0128] Optionally, the third carrier portion 130 and the first carrier portion 110 can be arranged on the same layer, and the third circuit portion 230 and the first circuit portion 120 can be arranged on the same layer, which facilitates the manufacturing of the display panel. Of course, the third carrier portion 130 and the first carrier portion 110 can also be arranged on separate layers, and the third circuit portion 230 and the first circuit portion 120 can also be arranged on separate layers, which is also within the protection scope of this application.

[0129] The second line section 220 is electrically connected to the third line section 230. In some optional embodiments, the second line section 220 and the third line section 230 may be connected via a via.

[0130] To facilitate the via connection between the second circuit section 220 and the third circuit section 230, optionally, the surface of the elastic protective layer 300 facing away from the second circuit section 220 and the surface of the third circuit section 230 facing the third support section 130 can be flush. The end of the third circuit section 230 near the second circuit section 220 can extend to the side of the elastic protective layer 300 facing away from the second circuit section 220. When manufacturing the display panel, the third circuit section 230 can be formed on the third support section 130 and the elastic protective layer 300, so that the end of the third circuit section 230 near the second circuit section 220 extends to the bending area A2 and overlaps with the elastic protective layer 300. At the position where the third circuit section 230 overlaps with the elastic protective layer 300, a second connecting hole 320 penetrating the elastic protective layer 300 in the thickness direction Z can be provided. A conductive metal layer 330 is formed on the inner surface of the second connecting hole 320, thereby realizing the electrical connection between the third circuit section 230 and the second circuit section 220.

[0131] Optionally, the second line section 220 and the third line section 230 are connected by a via, and the first line section 210 is connected by a via to the second line section 220. To facilitate the manufacturing of the display panel, the three surfaces of the elastic protective layer 300—the side facing away from the second line section 220, the side facing the first support section 110 of the first line section 210, and the side facing the third support section 130—can be flush.

[0132] Please continue to refer to this. Figure 9 and Figure 10 In some optional embodiments, the encapsulation layer 400 may be located in the display area A1, the bending area A2 and the bonding area A3. In the bonding area A3, the encapsulation layer 400 may be stacked on the third circuit portion 230 in the thickness direction Z to protect the third circuit portion 230 through the encapsulation layer 400.

[0133] Optionally, the encapsulation layer 400 exposes one end of the third line portion 230 away from the second line portion 220. The end of the third line portion 230 away from the second line portion 220 can be a bonding pin. Exposing the bonding pin facilitates bonding and connection of components such as chips to the line layer 200.

[0134] In some optional embodiments, the second line portion 220 may be recessed relative to the first support portion 110 and the third support portion 130 toward the side where the second support portion 120 is located. The display panel may also include an isolation layer 150, which is disposed on both sides of the protrusion 140 in the first direction X. The isolation layer 150 can effectively prevent the two ends of the second line portion 220 from being exposed in the first direction X, thereby improving the safety performance of the display panel.

[0135] Figure 11 A schematic diagram of the structure of a display panel in a bent state, provided in yet another embodiment of this application;

[0136] Figure 12 This is a top view of the second support portion of a display panel provided in another embodiment of this application.

[0137] like Figure 11 and 12 As shown, in some optional embodiments, the bending area A2 of the display panel may include a second transition area A23. The second transition area A23 connects the bending area A22 and the bonding area A3. In the bent state of the display panel, the portion of the display panel located in the bonding area A3 and the second transition area A23 is flat. By setting the second transition area A23 between the bending area A22 and the bonding area A3, bending stress can be avoided at the connection between the bonding area A3 and the bending area A2, thereby effectively preventing interlayer separation at the end where the bending area A2 and the bonding area A3 are connected.

[0138] Optionally, the connection point between the second circuit section 220 and the third circuit section 230 is located in the second transition region A23. That is, the second connecting hole 320 and the conductive metal layer 330 formed on the inner surface of the second connecting hole 320 are located in the second transition region A23. This can prevent the connection structure from affecting the strength and bending resistance of the circuit layer 200 located in the bending region A22, ensuring that the circuit layer 200 will not break due to bending. Of course, the connection point between the third circuit section 230 and the second circuit section 220 can also be set in the bending region A22, which is also within the protection scope of this application.

[0139] Optionally, the bending area A2 of the display panel may include a first transition area A21, a bending area A22, and a second transition area A23. The first transition area A21 connects the display area A1 and the bending area A22, and the second transition area A23 connects the bending area A22 and the bonding area A3. The first connecting hole 310 is located in the first transition area A21, and the second connecting hole 320 is located in the second transition area A23, so as to ensure the strength and bending resistance of the circuit layer 200 located in the bending area A22.

[0140] Figure 13 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application.

[0141] The second circuit section 220 and the third circuit section 230 can also be electrically connected in other ways, such as Figure 13As shown, in some optional embodiments, the second carrier portion 120 has a wiring groove 121 on the side facing the circuit layer 200 in the thickness direction Z, and the second circuit portion 220 is disposed on the inner sidewall and bottom of the wiring groove 121. When manufacturing the display panel, after forming the wiring groove 121 on the second carrier portion 120, a first circuit portion 210 can be formed on the first carrier portion 110, a third circuit portion 230 can be formed on the third carrier portion 130, and a second circuit portion 220 can be formed on the inner sidewall and bottom of the wiring groove 121, and the two ends of the second circuit portion 220 in the first direction X are directly connected to the first circuit portion 210 and the third circuit portion 230.

[0142] In some alternative embodiments, the side of the elastic protective layer 300 facing away from the second line portion 220 may simultaneously protrude from the first line portion 210 and the third line portion 230 in the thickness direction Z.

[0143] Optionally, the encapsulation layer 400 may be located in the display area A1 and the bonding area A3. The encapsulation layer 400 exposes the bending area A2 to protect the first circuit section 210 and the third circuit section 230 through the encapsulation layer 400, while avoiding the encapsulation layer 400 from affecting the bending performance of the bending area A2.

[0144] Optionally, in the thickness direction Z, the surface of the elastic protective layer 300 facing away from the second circuit section 220 can be flush with the surface of the encapsulation layer 400 facing away from the circuit layer 200. This allows the bending area A2 and the display area A1 of the display panel to have a smooth and flat transition in appearance, making the appearance of the display panel more aesthetically pleasing.

[0145] Figure 14 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application; Figure 15 This is a schematic diagram of the structure of a display panel in a bent state, according to another embodiment of this application.

[0146] like Figure 14 and Figure 15 As shown, in some optional embodiments, the display panel may further include a support layer disposed on the side of the carrier layer 100 facing away from the circuit layer 200. The support layer may include a first support layer 510 and a second support layer 520. The first support layer 510 is located in the display area A1 and disposed on the side of the first carrier portion 110 facing away from the first circuit portion 210. The second support layer 520 is located in the bonding area A3 and disposed on the side of the third carrier portion 130 facing away from the third circuit portion 230. By providing the first support layer 510 and the second support layer 520, the portions of the display panel located in the display area A1 and the bonding area A3 are kept flat.

[0147] Optionally, in the flattened state of the display panel, in the first direction X, the first support layer 510 is spaced apart from the protrusion 140, and the second support layer 520 is spaced apart from the protrusion 140, so that when the display panel changes from the flattened state to the bent state, the first support layer 510 and the second support layer 520 will not interfere with the protrusion 140 that is deformed due to compression.

[0148] Optionally, the display panel may further include a composite functional layer 600, which is disposed on the side of the first support layer 510 facing away from the first carrier portion 110. In the bent state of the display panel, the portion of the display panel located in the bonding area A3 may be located on the side of the display area A1 portion facing away from the light emission direction, and the first support layer 510 and the second support layer 520 are connected through the composite functional layer 600.

[0149] In addition, this application also provides a display device, including a display panel as described in any of the preceding embodiments.

[0150] Furthermore, this application also provides a method for manufacturing a display panel. This method can be used to manufacture the display panel described above.

[0151] Figure 16 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application; Figures 16a to 16g These are schematic diagrams illustrating the various stages of a method for manufacturing a display panel according to an embodiment of this application. Figure 17 A flowchart illustrating a method for manufacturing a display panel according to another embodiment of this application.

[0152] like Figure 16 As shown, the method for manufacturing a display panel provided in this application includes steps S100 to S400.

[0153] In step S100, as Figure 16a As shown, a support platform 001 is provided. The support platform 001 includes a first region E1 and a second region E2 arranged sequentially along a first direction X, and the second region E2 is provided with a groove 010.

[0154] Among them, the first area E1 and the second area E2 of the support platform 001 correspond one-to-one with the display area A1 and the bending area A2 of the display panel to be manufactured.

[0155] In step S200, as Figure 16b As shown, a support layer 100 is formed on the support platform 001. The support layer 100 includes a first support portion 110 located in the first region E1 and a second support portion 120 located in the second region E2. The side of the second support portion 120 facing the support platform 001 protrudes from the first support portion 110 and forms a protrusion 140.

[0156] In step S300, as Figures 16c to 16f As shown, a circuit layer 200 is formed on the carrier layer 100. The circuit layer 200 includes a first circuit portion 210 located at least partially in the first region E1 and a second circuit portion 220 located in the second region E2. The second circuit portion 220 is electrically connected to the first circuit portion 210, and the second circuit portion 220 is recessed at least partially relative to the first circuit portion 210 toward the side where the second carrier portion 120 is located.

[0157] It is understood that, in the thickness direction Z of the support layer 100, at least part of the side surface of the second support portion 120 facing the second circuit portion 220 is recessed toward the side where the support platform 001 is located relative to the side surface of the first support portion 110 facing the first circuit portion 210, so that at least part of the second circuit portion 220 can be recessed toward the side where the second support portion 120 is located relative to the first circuit portion 210.

[0158] In step S400, the support platform 001 is removed.

[0159] According to the method for manufacturing a display panel according to the embodiments of this application, a groove 010 is provided in the second region E2 of the support platform 001 forming the display panel, so that the second circuit portion 220 and the second carrier portion 120 formed in the second region E2 are both offset towards the backlight direction of the display panel. Therefore, the position of the second circuit portion 220 can be adjusted without thinning the second carrier portion 120, and the position adjustment space of the second circuit portion 220 is not limited by the thickness of the carrier layer 100. Therefore, the second circuit portion 220 can be adjusted to the bending neutral surface of the bending region A2 or the side where the bending pressure portion is located, thereby improving the bending resistance of the second circuit portion 220 and the bending region A2, and further reducing the bending radius of the bending region A2 of the display panel, which can meet the usage requirements of narrow bezel display.

[0160] In some optional embodiments, the method for manufacturing the display panel provided in this application may further include, before step S400: forming an elastic protective layer 300 on the second circuit portion 220, wherein the elastic protective layer 300 is located in the second region. By covering the second circuit portion 220 with the elastic protective layer 300, the second circuit portion 220 can be protected, and the thickness of the display panel located in the bending region A2 can be increased, which is beneficial for adjusting the second circuit portion 220 to the bending neutral surface or the side where the bending pressure portion is located.

[0161] In some optional embodiments, the method for manufacturing a display panel provided in this application may further include, before step S400:

[0162] Step S500: Form a light-emitting device layer on the circuit layer 200;

[0163] Step S600: As Figure 16gAs shown, an encapsulation layer 400 is formed on the light-emitting device layer.

[0164] The light-emitting device layer is located in the first region E1 and is electrically connected to the first circuit section 210. The first circuit section 210 can control the light emission of the light-emitting device layer. The orthogonal projection of the encapsulation layer 400 on the thickness direction Z of the carrier layer 100 at least covers the light-emitting device layer. The encapsulation layer 400 can protect the light-emitting device layer and prevent the external environment from affecting the light emission performance of the display panel.

[0165] Optionally, the encapsulation layer 400 may be located in the display area A1 and the bending area A2 to protect the circuit layer 200 through the encapsulation layer 400.

[0166] Optionally, the encapsulation layer 400 may be located only in the display area A1 to avoid the encapsulation layer 400 affecting the bending of the bending area A2.

[0167] In some alternative embodiments, such as Figure 17 As shown, the steps of forming a circuit layer 200 on the carrier layer 100 and forming an elastic protective layer 300 on the second circuit portion 220 may specifically include:

[0168] like Figure 16c As shown, a second wiring portion 220 is formed on the second carrier portion 120. Optionally, the second wiring portion 220 may include a plurality of traces extending along the first direction X and spaced apart in the second direction Y.

[0169] like Figure 16d As shown, an elastic protective layer 300 is formed on the second line section 220.

[0170] The second support part 120 and the first support part 110 are arranged in layers. The second support part 120 is connected to the first support part 110 through an elastic protective layer 300, and the connection is simple and reliable.

[0171] Optionally, the surface of the elastic protective layer 300 facing away from the support platform 001 and the surface of the first bearing portion 110 facing away from the support platform 001 can be flush; the orthogonal projection of the elastic protective layer 300 in the thickness direction Z of the bearing layer 100 can cover the orthogonal projection of the second circuit portion 220 in the thickness direction Z.

[0172] like Figure 16e As shown, a first line portion 210 is formed on the first bearing portion 110 and the elastic protective layer 300.

[0173] The first line section 210 extends to the second zone E2 at one end and overlaps with the elastic protective layer 300.

[0174] like Figure 16fAs shown, a first connection hole 310 is provided at the position where the first circuit section 210 overlaps with the elastic protective layer 300, and a conductive metal layer 330 is formed on the inner surface of the first connection hole 310. The first connection hole 310 penetrates the elastic protective layer 300 in the thickness direction Z, and the first circuit section 210 and the second circuit section 220 are electrically connected through the conductive metal layer 330.

[0175] Figure 18 A flowchart illustrating a method for manufacturing a display panel according to yet another embodiment of this application; Figures 18a to 18d These are schematic diagrams illustrating the operation process of a method for manufacturing a display panel according to yet another embodiment of this application.

[0176] In some other alternative embodiments, such as Figure 18 As shown, the steps of forming a bearing layer 100 on the support platform 001, forming a circuit layer 200 on the bearing layer 100, and forming an elastic protective layer 300 on the second circuit section 220 may specifically include:

[0177] like Figure 18a As shown, a first bearing portion 110 located in the first region E1 is formed on the support platform 001; a filling layer 020 located in the second region E2 is formed on the support platform 001. The order in which the first bearing portion 110 is formed and the filling layer 020 is formed is not important. Optionally, the surface of the filling layer 020 facing away from the support platform 001 can be flush with the surface of the first bearing portion 110 facing away from the support platform 001.

[0178] like Figure 18b As shown, a portion of material is removed from the side surface of the filling layer 020 facing away from the support platform 001 in the thickness direction Z to form a second support portion 120 including a wiring groove 121.

[0179] Optionally, multiple wiring channels 121 can be provided, with the multiple wiring channels 121 spaced apart in the second direction Y. The multiple wiring channels 121 can correspond one-to-one with the multiple second traces of the second line section 220. Of course, only one wiring channel 121 can also be provided, and the width of the wiring channel 121 in the second direction Y is not less than the width of the second line section 220 in the second direction Y, which is also within the protection scope of this application.

[0180] like Figure 18c As shown, a first wiring section 210 is formed on the first support portion 110, and a second wiring section 220 is formed on the inner sidewall and bottom of the wiring groove 121, and the first wiring section 210 and the second wiring section 220 are electrically connected.

[0181] like Figure 18d As shown, an elastic protective layer 300 is formed on the second line section 220, and the elastic protective layer 300 is disposed in the wiring groove 121.

[0182] Optionally, in the thickness direction Z, the elastic protective layer 300 may protrude from the first circuit section 210 on the side opposite to the second circuit section 220.

[0183] Figure 19 A flowchart illustrating a method for manufacturing a display panel according to another embodiment of this application; Figures 19a to 19g These are schematic diagrams illustrating the operation process of a method for manufacturing a display panel according to another embodiment of this application.

[0184] In some alternative embodiments, such as Figure 19a As shown, the support platform 001 also includes a third zone E3, which is located on the side of the second zone E2 away from the first zone E1 along the first direction X. The third zone E3 corresponds to the binding area A3 of the display panel to be manufactured.

[0185] In some alternative embodiments, such as Figure 19a As shown, the second area E2 of the support platform 001 is provided with a groove 010, and the upper surfaces of the first area E1 and the third area E3 of the support platform 001 can be flush.

[0186] like Figure 19b As shown, a support layer 100 is formed on the support platform 001. The support layer 100 includes a first support portion 110 located in the first region E1, a second support portion 120 located in the second region E2, and a third support portion 130 located in the third region E3. The first support portion 110 and the third support portion 130 can be arranged on the same layer. The second support portion 120 is arranged on a separate layer from the first support portion 110 and the third support portion 130. The side of the second support portion 120 facing the support platform 001 protrudes from the first support portion 110 and the third support portion 130 and forms a protrusion 140.

[0187] like Figure 19c As shown, a second line section 220 is formed on the second carrier section 120.

[0188] like Figure 19d As shown, an elastic protective layer 300 is formed on the second line section 220.

[0189] The second support part 120 is arranged in layers with the first support part 110 and the third support part 130. The second support part 120 is connected to the first support part 110 and the third support part 130 through the elastic protective layer 300, and the connection is simple and reliable.

[0190] Optionally, the elastic protective layer 300, the first bearing part 110, and the third bearing part 130 can be flush with each other.

[0191] like Figure 19eAs shown, a first circuit portion 210 is formed on the first bearing portion 110 and the elastic protective layer 300, and a third circuit portion 230 is formed on the third bearing portion 130 and the elastic protective layer 300.

[0192] The first line section 210 extends to the second zone E2 at one end and overlaps with the elastic protective layer 300, and the third line section 230 extends to the second zone E2 at one end and overlaps with the elastic protective layer 300.

[0193] like Figure 19f As shown, a first connecting hole 310 penetrating the elastic protective layer 300 in the thickness direction Z is provided at the position where the first circuit section 210 overlaps with the elastic protective layer 300, and a second connecting hole 320 penetrating the elastic protective layer 300 in the thickness direction Z is provided at the position where the third circuit section 230 overlaps with the elastic protective layer 300; a conductive metal layer 330 is formed on the inner surface of the first connecting hole 310 and the second connecting hole 320, so that the first circuit section 210 is electrically connected to the second circuit section 220, and the second circuit section 220 is electrically connected to the third circuit section 230.

[0194] like Figure 19g As shown, a light-emitting device layer is formed on the circuit layer 200; an encapsulation layer 400 is formed on the light-emitting device layer.

[0195] Optionally, the encapsulation layer 400 may be located in the display area A1, the bending area A2 and the bonding area A3, and the encapsulation layer 400 may expose the end of the third line portion 230 away from the second line portion 220, so as to protect the line layer 200 through the encapsulation layer 400 and facilitate the bonding connection of components such as chips to the line layer 200.

[0196] Figure 20 A flowchart illustrating a method for manufacturing a display panel according to yet another embodiment of this application; Figures 20a to 20g These are schematic diagrams illustrating the various stages of a method for manufacturing a display panel according to yet another embodiment of this application.

[0197] In some other alternative embodiments, such as Figure 20 As shown, the steps of forming a bearing layer 100 on the support platform 001, forming a circuit layer 200 on the bearing layer 100, and forming an elastic protective layer 300 on the second circuit section 220 may specifically include:

[0198] like Figure 20a As shown, a first bearing portion 110 located in the first region E1 and a third bearing portion 130 located in the third region E3 are formed on the support platform 001; a filling layer 020 located in the second region E2 is formed on the support platform 001. Optionally, the surface of the filling layer 020 facing away from the support platform 001 can be flush with the surface of the first bearing portion 110 facing away from the support platform 001.

[0199] like Figure 20b As shown, a portion of material is removed from the side surface of the filling layer 020 facing away from the support platform 001 in the thickness direction Z to form a second support portion 120 including a wiring groove 121.

[0200] Optionally, multiple wiring channels 121 can be provided, with the multiple wiring channels 121 spaced apart in the second direction Y. The multiple wiring channels 121 can correspond one-to-one with the multiple second traces of the second line section 220. Of course, only one wiring channel 121 can also be provided, and the width of the wiring channel 121 in the second direction Y is not less than the width of the second line section 220 in the second direction Y, which is also within the protection scope of this application.

[0201] like Figure 20c As shown, a first line section 210 is formed on the first support section 110, a third line section 230 is formed on the third support section 130, a second line section 220 is formed on the inner sidewall and bottom of the wiring trough 121, and the first line section 210 is electrically connected to the second line section 220, and the third line section 230 is electrically connected to the second line section 220.

[0202] like Figure 20d As shown, an elastic protective layer 300 is formed on the second line section 220, and the elastic protective layer 300 is disposed in the wiring groove 121.

[0203] Optionally, in the thickness direction Z, the elastic protective layer 300 may protrude from the first line portion 210 and the third line portion 230 on the side opposite to the second line portion 220.

[0204] like Figure 20e As shown, in step S600, an encapsulation layer 400 is formed on the light-emitting device layer. The encapsulation layer 400 may be located only in the first region E1 and the third region E3, that is, the encapsulation layer 400 exposes the second region E2. At this time, the light-emitting device layer may be formed on the circuit layer 200 first, and the encapsulation layer 400 may be formed on the light-emitting device layer, and then the elastic protective layer 300 may be formed on the second circuit portion 220.

[0205] Optionally, the surface of the elastic protective layer 300 facing away from the second circuit section 220 can be flush with the surface of the encapsulation layer 400 facing away from the circuit layer 200. This allows the bending area A2 of the display panel to have a smooth and flat transition with the display area A1 and the bonding area A3, making the appearance of the display panel more aesthetically pleasing.

[0206] In some alternative embodiments, such as Figure 20fAs shown, the method for manufacturing a display panel provided in this application embodiment may further include, after step S400, forming an isolation layer 150 on both sides of the protrusion 140 in the first direction X. The isolation layer 150 can effectively prevent the two ends of the second circuit portion 220 from being exposed in the first direction X, thereby improving the safety performance of the display panel.

[0207] In some alternative embodiments, please continue to refer to Figure 20f The method for manufacturing a display panel provided in this application embodiment can further form a support layer on the side of the carrier layer 100 facing away from the circuit layer 200 after step S400.

[0208] The support layer includes a first support layer 510 and a second support layer 520. The first support layer 510 is disposed on the side surface of the first bearing portion 110 facing away from the first circuit portion 210, and the second support layer 520 is disposed on the side surface of the third bearing portion 130 facing away from the third circuit portion 230.

[0209] Optionally, in the first direction X, the first support layer 510 and the second support portion 120 are spaced apart, and the third support layer is spaced apart from the second support portion 120, so that when the bending area A2 of the display panel is bent, the first support layer 510 and the second support layer 520 will not interfere with the protrusion 140 that is deformed due to compression.

[0210] Optionally, the method for manufacturing the display panel provided in this application embodiment may also provide a composite functional layer 600 on the side of the first support layer 510 facing away from the first carrier portion 110.

[0211] In some alternative embodiments, such as Figure 20g As shown in the embodiments of this application, the method for manufacturing a display panel may further include:

[0212] The display panel is bent at the location of the bending area A2 and in the opposite direction to the light emission direction of the display panel to form a bent state, so that the part of the display panel located in the bonding area A3 can be located on the side of the display area A1 that is away from the light emission direction. The first support layer 510 and the second support layer 520 are connected through the composite functional layer 600.

[0213] Figure 21 A flowchart illustrating a method for manufacturing a display panel according to another embodiment of this application; Figures 21a to 21f These are schematic diagrams illustrating the operation process of a method for manufacturing a display panel according to another embodiment of this application.

[0214] In some alternative embodiments, such as Figure 21aAs shown, the support platform 001 also includes a third region E3. Along the first direction X, the third region E3 is located on the side of the second region E2 away from the first region E1, and the groove 010 can extend from the second region E2 to the third region E3, that is, the upper surfaces of the third region E3 and the second region E2 of the support platform 001 can be flush. Among them, the third region E3 corresponds to the bonding area A3 of the display panel to be manufactured.

[0215] like Figure 21b As shown, a support layer 100 is formed on the support platform 001. The support layer 100 includes a first support portion 110 located in the first region E1, a second support portion 120 located in the second region E2, and a third support portion 130 located in the third region E3. The second support portion 120 and the third support portion 130 are arranged in the same layer. The side of the second support portion 120 facing the support platform 001 and the side of the third support portion 130 facing the support platform 001 both protrude from the first support portion 110 and form a protrusion 140.

[0216] like Figure 21c As shown, a second circuit section 220 is formed on the second support section 120, and a third circuit section 230 is formed on the third support section 130. The third circuit section 230 is disposed on the same layer as the second circuit section 220, and the third circuit section 230 is electrically connected to the second circuit section 220.

[0217] like Figure 21d As shown, an elastic protective layer 300 is formed on the second line section 220 and the third line section 230.

[0218] Optionally, the elastic protective layer 300 exposes one end of the third circuit section 230 away from the second circuit section 220. The end of the third circuit section 230 away from the second circuit section 220 can be a bonding pin. Exposing the bonding pin facilitates the bonding connection between the chip and other components and the circuit layer 200.

[0219] like Figure 21e As shown, a first line portion 210 is formed on the first support portion 110 and the elastic protective layer 300. The end of the first line portion 210 near the second region E2 extends to the second region E2 and overlaps with the elastic protective layer 300. The second line portion 220 is at least partially recessed relative to the first line portion 210 toward the side where the first support portion 110 is located, and the third line portion 230 is at least partially recessed relative to the first line portion 210 toward the side where the third support portion 130 is located.

[0220] A first connecting hole 310 is provided at the position where the first circuit section 210 overlaps with the elastic protective layer 300, penetrating the elastic protective layer 300 in the thickness direction Z. A conductive metal layer 330 is formed on the inner surface of the first connecting hole 310. The first circuit section 210 and the second circuit section 220 are electrically connected through the conductive metal layer 330, that is, the first circuit section 210 and the second circuit section 220 are connected through a via.

[0221] like Figure 21f As shown, a light-emitting device layer is formed on the circuit layer 200; an encapsulation layer 400 is formed on the light-emitting device layer. The encapsulation layer 400 may be located in the display area A1, the bending area A2, and the bonding area A3, and the encapsulation layer 400 may expose the end of the third circuit portion 230 away from the second circuit portion 220, so as to protect the circuit layer 200 through the encapsulation layer 400 and facilitate the bonding connection of components such as chips to the circuit layer 200.

[0222] It is understood that when the support platform 001 includes the third area E3, and the groove 010 can extend from the second area E2 to the third area E3, the third bearing part 130 and the second bearing part 120 are arranged on the same layer, the third circuit part 230 and the second circuit part 220 are arranged on the same layer, and the first circuit part 210 and the second circuit part 220 can also be electrically connected in other ways than through-hole connection, which is also within the protection scope of this application.

[0223] Figure 22 A flowchart illustrating a method for manufacturing a display panel according to yet another embodiment of this application; Figure 23 This is a schematic diagram of the molding stage of a method for manufacturing a display panel according to another embodiment of this application.

[0224] Please refer to the following: Figure 22 and Figure 23 As shown in the embodiment of this application, the method for manufacturing a display panel includes:

[0225] Step S100: Provide a support platform 001. The support platform 001 includes a first area E1, a second area E2 and a third area E3 arranged sequentially along the first direction X, and the second area E2 and the third area E3 are provided with grooves 010.

[0226] Step S200: A first support portion 110 located in the first region E1 is formed on the support platform 001; a filling layer 020 located in the second region E2 and the third region E3 is formed on the support platform 001; a portion of material is removed inward from the side surface of the filling layer 020 facing away from the support platform 001 in the thickness direction Z, forming a second support portion 120 and a third support portion 130 including a wiring groove 121. Optionally, the surface of the filling layer 020 facing away from the support platform 001 can be flush with the surface of the first support portion 110 facing away from the support platform 001.

[0227] Step S300: A first line portion 210 is formed on the first support portion 110, a second line portion 220 and a third line portion 230 are formed on the inner sidewall and bottom of the wiring groove 121, and the first line portion 210 is electrically connected to the second line portion 220, and the third line portion 230 is electrically connected to the second line portion 220; an elastic protective layer 300 is formed on the second line portion 220 and the third line portion 230, and the elastic protective layer 300 is disposed in the wiring groove 121.

[0228] The second circuit section 220 is located in the second region E2, and the third circuit section 230 is located in the second region E3. Optionally, in the thickness direction Z, the side of the elastic protective layer 300 facing away from the second circuit section 220 may protrude from the first circuit section 210, and the side of the elastic protective layer 300 facing away from the second circuit section 220 and the side of the elastic protective layer 300 facing away from the third circuit section 230 may be flush.

[0229] Optionally, the elastic protective layer 300 may expose one end of the third line portion 230 away from the second line portion 220. The end of the third line portion 230 away from the second line portion 220 may be a bonding pin. Exposing the bonding pin facilitates the bonding connection of components such as chips to the line layer 200.

[0230] Step S500: A light-emitting device layer is formed on the first line section 210.

[0231] Step S600: Form an encapsulation layer 400 on the light-emitting device layer.

[0232] Optionally, the encapsulation layer 400 may be located only in the first region E1, that is, the encapsulation layer 400 exposes the second region E2 and the third region E3. In this case, a light-emitting device layer may be formed on the circuit layer 200 first, and the encapsulation layer 400 may be formed on the light-emitting device layer, and then an elastic protective layer 300 may be formed on the second circuit section 220.

[0233] Optionally, the surface of the elastic protective layer 300 facing away from the second circuit section 220 can be flush with the surface of the encapsulation layer 400 facing away from the circuit layer 200. This allows the bending area A2 of the display panel to have a smooth and flat transition with the display area A1 and the bonding area A3, making the appearance of the display panel more aesthetically pleasing.

[0234] Of course, the surface of the elastic protective layer 300 facing away from the second line portion 220 and the third line portion 230 can also be flush with the surface of the first line portion 210 facing away from the first support portion 110, and the encapsulation layer 400 can also extend from the first region E1 to the third region E3, which is also within the scope of protection of this application.

[0235] Step S400: Remove the support platform 001 to form the display panel.

[0236] According to the method for manufacturing a display panel according to the embodiments of this application, a groove 010 is provided in at least the second region E2 of the support platform 001 forming the display panel, so that the second line portion 220 and the second carrier portion 120 formed in the second region E2 are both offset towards the backlight direction of the display panel. Therefore, the position of the second line portion 220 can be adjusted without thinning the second carrier portion 120, and the position adjustment space of the second line portion 220 is not limited by the thickness of the carrier layer 100. Therefore, the second line portion 220 can be adjusted to the bending neutral surface of the bending region A2 or the side where the bending pressure portion is located, thereby improving the bending resistance of the second line portion 220 and the bending region A2, and further reducing the bending radius of the bending region A2 of the display panel, which can meet the usage requirements of narrow bezel display.

[0237] The embodiments described above are not exhaustive, nor do they limit the application to the specific embodiments described herein. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, comprising a display area and a bending area, characterized in that, The display panel includes: A support layer, the support layer comprising a first support portion located in the display area and a second support portion located in the bending area; A circuit layer is stacked on the carrier layer in the thickness direction. The circuit layer includes a first circuit portion and a second circuit portion. The first circuit portion is at least partially located in the display area, and the second circuit portion is located in the bending area and electrically connected to the first circuit portion. In the thickness direction, the second support portion protrudes from the first support portion and forms a protrusion on the side opposite to the second line portion, and the second line portion is at least partially recessed relative to the first line portion toward the side where the second support portion is located. The display panel can be bent in the bending area to form a bent state. The display panel further includes a bonding area located on the side of the bending area away from the display area, and the support layer further includes a third support portion located in the bonding area. The display panel further includes an elastic protective layer, which is located in the bending area and is stacked on the second circuit portion in the thickness direction; The first support portion and the third support portion are disposed in the same layer, and the second support portion is disposed in a separate layer from the first support portion and the third support portion. The second support portion is connected to the first support portion and the third support portion through the elastic protective layer.

2. The display panel according to claim 1, characterized in that, The circuit layer also includes a third circuit section located at least partially in the bonding area, the third circuit section being electrically connected to the second circuit section.

3. The display panel according to claim 2, characterized in that, In the thickness direction, the second support portion protrudes from the third support portion on the side opposite to the second line portion, and the second line portion is at least partially recessed relative to the third line portion on the side where the second support portion is located; or, The third bearing portion is disposed on the same layer as the second bearing portion, and the third circuit portion is disposed on the same layer as the second circuit portion.

4. The display panel according to claim 2, characterized in that, The first circuit section is connected to the second circuit section via a via, and / or the third circuit section is connected to the second circuit section via a via.

5. The display panel according to claim 2, characterized in that, One end of the first line portion near the second line portion extends to the side of the elastic protective layer opposite to the second line portion. A first connection hole penetrating the elastic protective layer in the thickness direction is provided at the position where the first line portion overlaps with the elastic protective layer. A conductive metal layer is provided on the inner surface of the first connection hole. The first line portion and the second line portion are electrically connected through the conductive metal layer.

6. The display panel according to claim 5, characterized in that, The elastic protective layer is flush with the side surface of the second circuit section, the side surface of the first circuit section facing the first bearing section, and the side surface of the third circuit section facing the third bearing section.

7. The display panel according to claim 2, characterized in that, The display panel further includes: an encapsulation layer, The encapsulation layer is located in the display area, the bending area, and the bonding area, and the encapsulation layer exposes the end of the third line portion away from the second line portion.

8. The display panel according to claim 1, characterized in that, The second bearing portion has a wiring groove on the side facing the wiring layer in the thickness direction, the second wiring portion is disposed on the inner side wall and bottom of the wiring groove, and the elastic protective layer is disposed inside the wiring groove.

9. The display panel according to claim 8, characterized in that, The second wiring portion includes a plurality of second wirings extending along a first direction and spaced apart in a second direction. The wiring groove extends a predetermined length along the first direction. The second bearing portion is provided with a plurality of wiring grooves spaced apart in the second direction. The second direction is perpendicular to the thickness direction and intersects with the first direction.

10. The display panel according to claim 9, characterized in that, In the thickness direction, the side of the elastic protective layer away from the second bearing portion protrudes from the first circuit portion.

11. The display panel according to claim 1, characterized in that, The second supporting part is an elastic colloidal layer; or, Both the first support portion and the second support portion include a polyimide layer and an inorganic layer stacked in the thickness direction.

12. The display panel according to claim 8, characterized in that, The display panel also includes: A light-emitting device layer is located in the display area and is electrically connected to the first circuit section; An encapsulation layer is stacked on the light-emitting device layer in the thickness direction; the encapsulation layer is located in the display area and the bonding area and exposes the bending area.

13. The display panel according to claim 12, wherein the side of the elastic protective layer away from the carrier layer is flush with the side of the encapsulation layer away from the light-emitting device layer.

14. The display panel according to claim 2, characterized in that, The bending area includes a first transition area and a bending area. The first transition area connects the display area and the bending area, and the connection position between the first line portion and the second line portion is located in the first transition area.

15. The display panel according to claim 14, characterized in that, The bending area also includes a second transition area, which connects the bending area and the binding area. The connection point between the second line portion and the third line portion is located in the second transition area.

16. The display panel according to claim 2, characterized in that, The display panel further includes an isolation layer disposed on both sides of the protrusion in a first direction.

17. The display panel according to claim 2, characterized in that, The display panel further includes a support layer disposed on the side of the carrier layer facing away from the circuit layer. The support layer includes a first support layer and a second support layer. The first support layer is located in the display area and disposed on the side of the first carrier portion facing away from the first circuit portion. The second support layer is located in the bonding area and disposed on the side of the third carrier portion facing away from the third circuit portion. In a first direction, the first support layer and the protrusion are spaced apart, and the second support layer and the protrusion are spaced apart.

18. A display device, characterized in that, Includes the display panel as described in any one of claims 1-17.

19. A method for manufacturing a display panel as described in any one of claims 1-17, characterized in that, include: A support platform is provided, the support platform including a first area and a second area disposed along a first direction, the second area being provided with a groove; A bearing layer is formed on the support platform. The bearing layer includes a first bearing portion located in the first region and a second bearing portion located in the second region. The side of the second bearing portion facing the support platform protrudes from the first bearing portion and forms a protrusion. A circuit layer is formed on the carrier layer. The circuit layer includes a first circuit portion located at least partially in the first region and a second circuit portion located in the second region. The second circuit portion is electrically connected to the first circuit portion, and the second circuit portion is at least partially recessed relative to the first circuit portion toward the side where the second carrier portion is located. Remove the support platform.

20. The manufacturing method according to claim 19, characterized in that, The support platform further includes a third region, which is located on the side of the second region away from the first region along the first direction. The bearing layer includes a third bearing portion located in the third region, and the wiring layer includes a third wiring portion located at least partially in the third region. The third wiring portion is electrically connected to the second wiring portion.

21. The manufacturing method according to claim 20, characterized in that, The second circuit portion is at least partially recessed relative to the third circuit portion toward the side where the second bearing portion is located, or, The groove extends from the second region to the third region, and the third support portion is disposed on the same layer as the second support portion; the third circuit portion is disposed on the same layer as the second circuit portion.

22. The manufacturing method according to claim 20, characterized in that, Prior to removing the support platform, the manufacturing method further includes: An elastic protective layer is formed on the second line section, and the elastic protective layer is located in the second region.

23. The manufacturing method according to claim 22, characterized in that, The step of forming a circuit layer on the carrier layer and forming an elastic protective layer on the second circuit portion includes: A second circuit section is formed on the second bearing section; An elastic protective layer is formed on the second circuit section, and the orthographic projection of the elastic protective layer in the thickness direction of the bearing layer covers the orthographic projection of the second circuit section in the thickness direction. A first circuit portion is formed on the first bearing portion and the elastic protective layer, and a third circuit portion is formed on the third bearing portion and the elastic protective layer; A first connecting hole is provided at the position where the first line portion overlaps with the elastic protective layer, penetrating the elastic protective layer in the thickness direction; and a second connecting hole is provided at the position where the third line portion overlaps with the elastic protective layer, penetrating the elastic protective layer in the thickness direction. A conductive metal layer is formed on the inner surface of the first connecting hole and the second connecting hole, so that the first circuit part is electrically connected to the second circuit part, and the second circuit part is electrically connected to the third circuit part. or, The process of forming a load-bearing layer on the support platform, forming a circuit layer on the load-bearing layer, and forming an elastic protective layer on the second circuit portion includes: A first bearing portion located in the first region and a third bearing portion located in the third region are formed on the support platform; A filling layer located in the second region is formed on the support platform; A portion of the material is removed inward from the side surface of the filling layer facing away from the support platform in the thickness direction to form a second bearing portion including a wiring groove; A first wiring portion is formed on the first support portion, a third wiring portion is formed on the third support portion, a second wiring portion is formed on the inner sidewall and bottom of the wiring groove, and the first wiring portion is electrically connected to the second wiring portion, and the third wiring portion is electrically connected to the second wiring portion. An elastic protective layer is formed on the second line section, and the elastic protective layer is disposed in the wiring groove.

24. The manufacturing method according to claim 20, characterized in that, Prior to removing the support platform, the manufacturing method further includes: A light-emitting device layer is formed on the circuit layer, and the light-emitting device layer is located in the first region and electrically connected to the first circuit section; An encapsulation layer is formed on the light-emitting device layer, and the orthogonal projection of the encapsulation layer in the thickness direction of the carrier layer at least covers the light-emitting device layer.

25. The manufacturing method according to claim 20, characterized in that, After removing the support platform, the manufacturing method further includes: A support layer is formed on the side of the carrier layer opposite to the circuit layer. The support layer includes a first support layer and a second support layer. The first support layer is disposed on the side surface of the first carrier portion opposite to the first circuit portion, and the second support layer is disposed on the side surface of the third carrier portion opposite to the third circuit portion. In the first direction, the first support layer and the second carrier portion are spaced apart, and the second support layer and the second carrier portion are spaced apart.

26. The manufacturing method according to claim 20, characterized in that, After removing the support platform, the manufacturing method further includes: An isolation layer is formed on both sides of the protrusion in the first direction.

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