Display panel and display device

Abstract

Embodiments of the present invention disclose a display panel and a display device, the panel comprising: a substrate; a pixel array located on the substrate, the pixel array comprising a plurality of pixels arranged in an array, the pixels comprising a plurality of sub-pixel structures of different colors, the sub-pixel structures comprising a main conductive pad unit, a spare conductive pad unit, and a light-emitting unit bonded to the main conductive pad unit; an encapsulation layer located on a side of the pixel array facing away from the substrate; and, in edge pixels adjacent to a boundary of the encapsulation layer in a direction parallel to the substrate, a first minimum distance from the spare conductive pad unit to the boundary of the encapsulation layer is greater than a second minimum distance from the main conductive pad unit to the boundary of the encapsulation layer. In embodiments of the present invention, by increasing the minimum distance between the spare conductive pad unit and the boundary of the encapsulation layer in edge pixels, lateral reflections from the spare conductive pad unit are less likely to propagate to the photolithographic boundary of the encapsulation layer, thereby resolving the problem of residual photoresist in the encapsulation layer and ensuring a clear boundary of the encapsulation layer.

Description

Technical Field

[0001] Embodiments of the present invention relate to the technical field of display panels, and in particular to a display panel and a display device. Background Art

[0002] Micro LED displays consume only one-tenth the power of LCDs. Like OLED displays, they are self-luminous, and the distance between pixels can be very small, making them well-suited to the current demand for high-resolution displays. They also offer low power consumption and fast response times. Consequently, micro LED displays have become a hot topic in recent panel industry research.

[0003] At present, during the inspection of existing Micro LED displays, it was found that there were photolithography residue problems in the packaging layer, which affected the product production yield. Summary of the Invention

[0004] Embodiments of the present invention provide a display panel and a display device to solve the problem of photolithography residues in an encapsulation layer.

[0005] An embodiment of the present invention provides a display panel, including:

[0006] substrate;

[0007] A pixel array located on a substrate, the pixel array including a plurality of pixels arranged in an array, the pixels including a plurality of sub-pixel structures of different colors, the sub-pixel structures including a main conductive pad unit, a spare conductive pad unit, and a light-emitting unit bonded to the main conductive pad unit;

[0008] an encapsulation layer located on a side of the pixel array facing away from the substrate;

[0009] In edge pixels adjacent to the encapsulation layer boundary along a direction parallel to the substrate, a first minimum distance from the spare conductive pad unit to the encapsulation layer boundary is greater than a second minimum distance from the main conductive pad unit to the encapsulation layer boundary.

[0010] An embodiment of the present invention further provides a display device, comprising the display panel described above.

[0011] In an embodiment of the present invention, in edge pixels adjacent to the encapsulation layer boundary along a direction parallel to the substrate, the first minimum distance between the spare conductive pad unit and the encapsulation layer boundary is greater than the second minimum distance between the main conductive pad unit and the encapsulation layer boundary. In this embodiment of the present invention, by increasing the distance between the spare conductive pad unit and the encapsulation layer boundary in edge pixels, lateral reflections from the spare conductive pad unit are less likely to propagate to the photolithographic boundary of the encapsulation layer. This reduces the risk of photoresist residue in the encapsulation layer during the photolithography process due to light reflections from the spare conductive pad unit, ensures a clear encapsulation layer boundary, and improves subsequent cutting yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, although the drawings described below are some specific embodiments of the present invention, for those skilled in the art, the basic concepts of the device structure, driving method and manufacturing method disclosed and suggested by the various embodiments of the present invention can be expanded and extended to other structures and drawings. Undoubtedly, these should all be within the scope of the claims of the present invention.

[0013] Figure 1 is a schematic diagram of a display panel provided by an embodiment of the present invention;

[0014] Figure 2 yes Figure 1 Cross-sectional view along A-A';

[0015] Figure 3 is a schematic diagram of a film structure of a display panel provided by an embodiment of the present invention;

[0016] Figure 4 for Figure 1 A partial schematic diagram of the neutron pixel structure;

[0017] Figure 5 is a schematic diagram of another display panel provided by an embodiment of the present invention;

[0018] Figure 6 is a schematic diagram of another display panel provided by an embodiment of the present invention;

[0019] Figure 7 is a schematic diagram of another display panel provided by an embodiment of the present invention;

[0020] Figure 8 is a schematic diagram of another display panel provided by an embodiment of the present invention;

[0021] Figure 9 is a schematic diagram of another display panel provided by an embodiment of the present invention;

[0022] Figure 10 is a schematic diagram of another display panel provided by an embodiment of the present invention;

[0023] Figure 11 is a schematic diagram of another display panel provided by an embodiment of the present invention;

[0024] Figure 12 is a schematic diagram of another display panel provided by an embodiment of the present invention;

[0025] Figure 13Schematic diagram of two types of pixels with and without indentation in a display panel;

[0026] Figure 14 Schematic diagram of two types of pixels with and without indentation in another display panel. DETAILED DESCRIPTION

[0027] To make the objectives, technical solutions, and advantages of the present invention more clear, the following will refer to the accompanying drawings of the embodiments of the present invention to clearly and completely describe the technical solutions of the present invention through implementation methods. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the basic concepts disclosed and suggested by the embodiments of the present invention, all other embodiments obtained by those skilled in the art are within the scope of protection of the present invention.

[0028] refer to Figure 1 FIG. 1 is a schematic diagram of a display panel provided by an embodiment of the present invention. Figure 2 yes Figure 1 Cross-sectional view along line A-A'. The display panel provided in this embodiment includes: a substrate 10; a pixel array 20 located on the substrate 10, the pixel array 20 including a plurality of pixels 20a arranged in an array, the pixels 20a including a plurality of sub-pixel structures 21 of different colors, the sub-pixel structures 21 including a main conductive pad unit 21a, a spare conductive pad unit 21b, and a light-emitting unit 21c bonded to the main conductive pad unit 21a; an encapsulation layer 30 located on a side of the pixel array 20 facing away from the substrate 10; in edge pixels adjacent to a boundary of the encapsulation layer 30 along a direction parallel to the substrate 10, a first minimum distance d1 from the spare conductive pad unit 21b to the boundary of the encapsulation layer 30 is greater than a second minimum distance d2 from the main conductive pad unit 21a to the boundary of the encapsulation layer 30.

[0029] In this embodiment, the optional substrate 10 includes a base and an array structure formed on the base, the array structure includes an array metal layer and an interlayer insulating layer, the array metal layer includes at least a gate metal layer and a source and drain metal layer, thereby forming a pixel driving circuit array including devices such as transistors, and the pixel driving circuit array includes multiple pixel driving circuits. A pixel array 20 is provided on the substrate 10, and the pixel array 20 includes a plurality of pixels 20a arranged in an array, and the pixel 20a includes a plurality of sub-pixel structures 21 of different colors. The pixel driving circuit is used to drive the sub-pixel structure 21 to emit light. The process of the pixel driving circuit driving the sub-pixel structure to emit light will not be repeated here.

[0030] The optional display panel can be a rigid display panel or a flexible display panel; the optional display panel can also be a micro light-emitting diode display panel or a quantum dot display panel, but the display panel of the embodiment of the present invention is not limited to this type.

[0031] The sub-pixel structure 21 in the pixel 20a can have multiple colors. Figure 1 The optional pixel 20a shown includes three sub-pixel structures 21 of different colors, namely, a red sub-pixel structure R, a green sub-pixel structure G, and a blue sub-pixel structure B. In other embodiments, the optional pixel may include four sub-pixel structures of different colors, namely, a red sub-pixel structure, a green sub-pixel structure, a blue sub-pixel structure, and a yellow sub-pixel structure. It will be understood that the sub-pixel structures included in a pixel may have a variety of colors, not limited to the above examples. Figure 1 The R, G, and B markings refer to the red light-emitting unit, green light-emitting device, and blue light-emitting device bonded at their positions.

[0032] There are also many ways to arrange the sub-pixel structures 21 in the pixel 20a. For example, Figure 1 In the illustrated optional pixel 20a, three sub-pixel structures 21 of different colors are arranged along the column direction. In other embodiments, multiple sub-pixel structures of different colors in a pixel can be arranged along the row direction; or, multiple sub-pixel structures of different colors in a pixel can be arranged in a herringbone pattern, etc. In the embodiments of the present invention, the colors and arrangement of the sub-pixel structures in a pixel are not specifically limited, and any pixel arrangement falls within the scope of protection of the present invention.

[0033] Combine Figure 1 and Figure 2 As shown, the sub-pixel structure 21 includes a main conductive pad unit 21a, a backup conductive pad unit 21b, and a light-emitting unit 21c bonded to the main conductive pad unit 21a. The light-emitting principle of the sub-pixel structure 21 is that by applying an electrical signal to the main conductive pad unit 21a, the light-emitting unit 21c bonded to the main conductive pad unit 21a is energized, and the light-emitting unit 21c electroluminescently emits light, and the sub-pixel structure 21 emits light. The main conductive pad unit 21a and the backup conductive pad unit 21b are electrically connected, serving as backup conductive pads for the sub-pixel structure 21. If the light-emitting unit 21c bonded to the main conductive pad unit 21a fails, in order to ensure that the sub-pixel structure 21 emits light normally, a new light-emitting unit 21c can be bonded to its spare conductive pad unit 21b. Then, an electrical signal is applied to the main conductive pad unit 21a. Based on the electrical connection between the main conductive pad unit 21a and the spare conductive pad unit 21b, the light-emitting unit 21c bonded to the spare conductive pad unit 21b can be powered on and emit light, and the sub-pixel structure 21 can emit light normally.

[0034] refer to Figure 3 FIG. 1 is a schematic diagram of the film structure of a display panel provided by an embodiment of the present invention. Figure 3As shown, the optional substrate 10 includes a base 11 and an array layer 12 stacked in sequence, and a light-emitting unit 21c is provided on the substrate 10. The optional substrate 11 is a flexible substrate or a rigid substrate. The array layer 12 includes an array metal layer and an interlayer insulating layer. The array layer 12 includes at least a gate metal layer and a source-drain metal layer. The gate metal layer and the source-drain metal layer constitute a pixel driving circuit array including structures such as thin film transistors. The pixel driving circuit array includes a plurality of pixel driving circuits 13. One light-emitting unit 21c is electrically connected to one pixel driving circuit 13 of the array layer 12, and the pixel driving circuit 13 drives the light-emitting unit 21c to emit light. It can be understood that Figure 3 Only the structure of one pixel driving circuit 13 is illustrated. The pixel driving circuit 13 is composed of at least a plurality of transistors and a storage capacitor electrically connected. The specific circuit structure thereof will not be described in detail here.

[0035] A driving electrode 14 and a main conductive pad unit 21a are provided between the substrate 10 and the light-emitting unit 21c. The light-emitting unit 21c is electrically connected to the driving electrode 14 via the main conductive pad unit 21a. The pixel driving circuit 13 provides an electrical signal to the light-emitting unit 21c via the driving electrode 14 to cause it to emit light. It will be understood that the film layer structure of the display panel includes, but is not limited to, the film layers provided above, as well as other film layers not shown, which are not described in detail here.

[0036] refer to Figure 4 As shown, Figure 1 A partial schematic diagram of the neutron pixel structure. Figure 3 and Figure 4 , a spare conductive pad unit 21b is also provided on the substrate 10. The driving electrode 14 includes a first electrode 14a and a second electrode 14b, the main conductive pad unit 21a includes two main conductive pads, and the spare conductive pad unit 21b includes two spare conductive pads. A main conductive pad and a spare conductive pad are provided on the first electrode 14a, and a main conductive pad and a spare conductive pad are provided on the second electrode 14b. The spare conductive pad unit 21b can serve as a substitute pad for the main conductive pad unit 21a. When the light-emitting unit 21c bonded to the main conductive pad unit 21a fails, a new light-emitting unit 21c is bonded to the spare conductive pad unit 21b, and the driving electrode 14 supplies power to the light-emitting unit 21c through the spare conductive pad unit 21b, thereby realizing normal light emission of the sub-pixel structure.

[0037] It can be understood that the structure of the display panel shown above is only an example. The display panel includes but is not limited to the structure provided above, and also includes other structures not shown, which are not described here one by one.

[0038] refer to Figure 2As shown, the display panel also includes an encapsulation layer 30 located on the side of the pixel array 20 facing away from the substrate 10. The encapsulation layer 30 entirely covers the pixel array 20, thereby encapsulating the display area of ​​the display panel. Optionally, the encapsulation layer 30 is a layer of organic material, in which case the encapsulation layer boundary is the outermost edge of the organic layer. Along a direction parallel to the substrate 10, pixels 20a adjacent to the encapsulation layer boundary are all edge pixels. That is, all pixels 20a located at the outermost periphery of the pixel array 20 are edge pixels, and there are no other pixels or sub-pixel structures between any edge pixel and the encapsulation layer boundary.

[0039] It should be noted that the optional encapsulation layer 30 is a negative photoresist. After the negative photoresist layer is formed, the negative photoresist layer is illuminated, and an insoluble substance is formed in the negative photoresist layer. The photoresist that has not been illuminated can be eliminated by developing with a developer, thereby obtaining a structure composed of insoluble substances. Obviously, after the boundary of the encapsulation layer is irradiated by the reflected light of the edge pixels, insoluble residues will be formed at the boundary of the encapsulation layer. Therefore, the current encapsulation layer has a boundary photolithography residue problem. Based on this, by increasing the distance between the spare conductive pad unit in the edge pixel and the boundary of the encapsulation layer, the reflected light of the edge pixel cannot irradiate the boundary of the encapsulation layer. Then, after photolithography, the boundary of the encapsulation layer is clear and there is no photolithography residue.

[0040] For any edge pixel, there is a certain distance between the spare conductive pad unit 21b and the encapsulation layer boundary. The distance between the spare conductive pad unit 21b and the encapsulation layer 30 boundary in different edge pixels may be different. Therefore, for all edge pixels, there must be a minimum distance value between the spare conductive pad unit 21b and the encapsulation layer 30 boundary. This minimum distance value is the first minimum distance d1 between the spare conductive pad unit 21b and the encapsulation layer 30 boundary in the edge pixel. Figure 1 As shown, d1 is the minimum distance between the spare conductive pad unit 21b and the edge of the encapsulation layer 30 in all edge pixels. For any edge pixel, the distance between the spare conductive pad unit 21b and the edge of the encapsulation layer 30 is greater than or equal to the first minimum distance d1.

[0041] For any edge pixel, there is a certain distance between the main conductive pad unit 21a and the encapsulation layer boundary. The distance between the main conductive pad unit 21a and the encapsulation layer 30 boundary in different edge pixels may be different. Therefore, for all edge pixels, there must be a minimum distance value between the main conductive pad unit 21a and the encapsulation layer 30 boundary. This minimum distance value is the second minimum distance d2 between the main conductive pad unit 21a and the encapsulation layer 30 boundary in the edge pixel. Figure 1 As shown, d2 is the minimum distance between the main conductive pad unit 21a and the edge of the encapsulation layer 30 in all edge pixels. For any edge pixel, the distance between the main conductive pad unit 21a and the edge of the encapsulation layer 30 is greater than or equal to the second minimum distance d2.

[0042] It is understood that under normal conditions, the spare conductive pad unit 21b is directly exposed and no light-emitting unit 21c is bonded thereto, which facilitates subsequent damage repair. An encapsulation layer 30 is provided on the pixel array 20, which can encapsulate and protect the sub-pixel structure 21 to prevent external damage. In addition, in order to obtain an extremely narrow frame, the encapsulation layer 30 is often prepared using a photolithography process. Since the spare conductive pad unit 21b is directly exposed, the spare conductive pad unit 21b will reflect light laterally when the encapsulation layer 30 is photoetched.

[0043] If the distance between the spare conductive pad unit and the encapsulation layer boundary in the edge pixel is small, the lateral reflection of the spare conductive pad unit will cause photoresist residue in the encapsulation layer during the photolithography process, making the boundary of the encapsulation layer unclear and affecting the subsequent cutting yield. Based on this, in the edge pixel, the first minimum distance d1 from the spare conductive pad unit 21b to the encapsulation layer boundary is designed to be greater than the second minimum distance d2 from the main conductive pad unit 21a to the encapsulation layer boundary, increasing the distance between the spare conductive pad unit 21b and the encapsulation layer boundary in the edge pixel. Then, the lateral reflection of the spare conductive pad unit 21b is difficult to propagate to the boundary of the encapsulation layer 30, thereby reducing the risk of photoresist residue in the encapsulation layer 30 caused by the reflection of the spare conductive pad unit 21b during the photolithography process, making the boundary of the encapsulation layer clear after photolithography and improving the subsequent cutting yield.

[0044] It should be noted that the above figures only schematically illustrate key structures in the above embodiments, and do not include all structures operated by the display panel.

[0045] In an embodiment of the present invention, in edge pixels adjacent to the encapsulation layer boundary along a direction parallel to the substrate, the first minimum distance between the spare conductive pad unit and the encapsulation layer boundary is greater than the second minimum distance between the main conductive pad unit and the encapsulation layer boundary. By increasing the distance between the spare conductive pad unit and the encapsulation layer boundary in edge pixels, lateral reflections from the spare conductive pad unit are less likely to propagate to the photolithographic boundary of the encapsulation layer. This reduces the risk of photoresist residue in the encapsulation layer during the photolithography process due to light reflections from the spare conductive pad unit, ensures a clear encapsulation layer boundary, and improves subsequent cutting yield.

[0046] The second minimum distance d2 between the main conductive pad unit 21a and the boundary of the encapsulation layer 30 can be greater than or equal to 2μm. During the manufacturing process, the main conductive pad unit 21a is directly bonded to the light-emitting unit 21c and is not directly exposed before encapsulation. Therefore, when the encapsulation layer 30 is formed on the pixel array 20 for encapsulation protection, the main conductive pad unit 21a is shielded by the light-emitting unit 21c and is essentially free of light reflection during the photolithography process of the encapsulation layer 30. Therefore, the second minimum distance d2 between the main conductive pad unit 21a and the boundary of the encapsulation layer 30 can be reasonably designed, for example, d2 can be greater than or equal to 2μm.

[0047] Furthermore, if bonding misalignment occurs during bonding of the light-emitting unit 21c to the main conductive pad unit 21a, the main conductive pad unit 21a may be partially exposed. Therefore, a second minimum distance d2 from the main conductive pad unit 21a to the edge of the encapsulation layer 30 is designed to be greater than or equal to 2 μm. This reduces the problem of residual reflection from the exposed main conductive pad unit causing residual encapsulation layer boundaries, ensuring a clear encapsulation layer boundary and improving subsequent cutting yields.

[0048] The first minimum distance d1 between the optional spare conductive pad unit 21b and the boundary of the encapsulation layer 30 is greater than or equal to 27μm. If the spare conductive pad unit 21b is directly exposed during the manufacturing process, when the encapsulation layer 30 is formed on the pixel array 20 for encapsulation protection, the spare conductive pad unit 21b will generate lateral reflections during the photolithography process of the encapsulation layer 30, which can easily cause photolithography residues at the boundary of the encapsulation layer 30. Based on this, the value of the first minimum distance d1 between the spare conductive pad unit 21b and the boundary of the encapsulation layer 30 needs to be reasonably designed to reduce the impact of the lateral reflections of the spare conductive pad unit 21b on the photolithography boundary of the encapsulation layer 30.

[0049] It should be noted that 27 μm is the propagation distance of side reflections from the conductive pad. Therefore, by designing the first minimum distance d1 from the spare conductive pad unit 21b to the boundary of the encapsulation layer 30 to be greater than or equal to 27 μm, the side reflections from the spare conductive pad unit 21b will essentially not propagate to the boundary of the encapsulation layer 30, thus having no impact on the photolithography of the encapsulation layer boundary. This solves the problem of residual encapsulation layer boundary residue caused by the exposed spare conductive pad unit 21b, ensures a clear encapsulation layer boundary, and thus improves the subsequent cutting yield.

[0050] Optionally, the minimum distance d3 between two adjacent spare conductive pad units 21b in a direction parallel to the substrate 10 is greater than or equal to 5μm. That is, in the display panel, the distance between any two adjacent spare conductive pad units 21b is greater than or equal to 5μm. 5μm is the minimum process spacing between adjacent conductive pads in the display panel, that is, under the current process conditions, the spacing between the two nearest conductive pads is minimized to 5μm, and the sub-pixel structure can also maintain normal operation. If the process spacing between adjacent conductive pads is less than 5μm, then too small a spacing may cause electrical defects between adjacent conductive pads and thus affect the luminescence of the sub-pixel structure. For example, if the spacing between adjacent conductive pads is too small, short circuits, crosstalk, parasitic capacitance, etc. may occur.

[0051] refer to Figure 5 As shown in FIG, it is a schematic diagram of another display panel provided by an embodiment of the present invention. Figure 5 As shown, the optional spare conductive pad unit 21b includes a first spare conductive pad 211 and a second spare conductive pad 212, and the direction in which the first spare conductive pad 211 points to the second spare conductive pad 212 is the first direction; along the first direction, there are N sub-pixel structures 21, the sub-pixel structure close to the boundary of the encapsulation layer 30 is the first sub-pixel structure 22, and the sub-pixel structure away from the boundary of the encapsulation layer is the Nth sub-pixel structure 23, the Nth sub-pixel structure 23 includes the Nth main conductive pad unit, the Nth spare conductive pad unit and the Nth light-emitting unit bonded to the Nth main conductive pad unit, wherein the minimum distance d4 between the Nth spare conductive pad unit and the N-1th spare conductive pad unit is greater than or equal to 5μm, and N is an integer greater than 2.

[0052] In this embodiment, the backup conductive pad unit 21b includes a first backup conductive pad 211 and a second backup conductive pad 212. If the light-emitting unit bonded to the main conductive pad unit 21a fails, a new light-emitting unit must be bonded to the backup conductive pad unit 21b to ensure normal operation of the sub-pixel structure 21. For the light-emitting unit bonded to the backup conductive pad unit 21b, its N-pole is bonded to one backup conductive pad in the backup conductive pad unit 21b, and its P-pole is bonded to another backup conductive pad. For example, the N-pole of the light-emitting unit is bonded to the first backup conductive pad 211, and the P-pole is bonded to the second backup conductive pad 212. The direction from the first backup conductive pad 211 to the second backup conductive pad 212 in the backup conductive pad unit 21b is defined as the first direction. Furthermore, the inward-retracted backup conductive pad unit 21b in the edge pixel increases its first minimum distance d1 from the boundary of the encapsulation layer 30. The inward-retracted direction of the backup conductive pad unit 21b is defined as the first direction.

[0053] Along the first direction, a minimum distance d4 between the Nth spare conductive pad unit and the N-1th spare conductive pad unit is greater than or equal to 5 μm, that is, a spacing between adjacent spare conductive pad units is greater than or equal to a minimum process spacing.

[0054] Understandable, reference Figure 5 As shown, in the first row of sub-pixel structures, the spare conductive pad unit 21b is retracted to increase its distance from the boundary of the encapsulation layer 30, which can solve the problem of encapsulation layer lithography residue. However, the spare conductive pad unit 21b in the first row of sub-pixel structures 21 is retracted relative to the boundary of the encapsulation layer, so that the spacing between the spare conductive pad units 21b in the first row of sub-pixel structures and the second row of sub-pixel structures in the first direction is reduced. At this time, the minimum distance between the first spare conductive pad unit and the second spare conductive pad unit should be greater than or equal to 5μm. If the minimum distance between the first spare conductive pad unit and the second spare conductive pad unit after retraction is less than 5μm, the second spare conductive pad unit can be appropriately retracted until the minimum distance between the first spare conductive pad unit and the second spare conductive pad unit is greater than or equal to 5μm. Similarly, the minimum distance between the N-1th spare conductive pad unit and the Nth spare conductive pad unit is greater than or equal to 5μm. In the first direction, the interval between adjacent spare conductive pad units 21 b is greater than or equal to 5 μm, which makes the manufacturing process easy to implement and less likely to cause defects such as short circuits.

[0055] The spare conductive pad units in the first row of sub-pixel structures shrink in the column direction, which will inevitably reduce the spacing with the spare conductive pad units in the second row of sub-pixel structures. Therefore, the spare conductive pad units in the second row of sub-pixel structures may also need to shrink in order to avoid the spacing between adjacent spare conductive pad units being too small. Similarly, the spare conductive pad units in multiple rows of sub-pixel structures can be shrunk in order to avoid the problem of the spacing between adjacent spare conductive pad units being too small, thereby alleviating the impact of the shrinkage of the spare conductive pad units in the first row of sub-pixel structures. The shrinkage of multiple rows of spare conductive pad units can be performed in a variety of ways.

[0056] refer to Figure 6 As shown in FIG, it is a schematic diagram of another display panel provided by an embodiment of the present invention. Figure 6 As shown, optionally in the sub-pixel structure 21, along the first direction, the spare conductive pad unit 21b has a first side 213 and a second side 214 relative to each other, and the first side 213 is located on the side of the second side 214 close to the boundary of the encapsulation layer, and the light-emitting unit 21c has a third side 215 and a fourth side 216 relative to each other, and the third side 215 is located on the side of the fourth side 216 close to the boundary of the encapsulation layer. In the first direction, the distance between the first side 213 and the third side 215 is a first distance; in the direction from the first sub-pixel structure to the Nth sub-pixel structure, the first distance gradually decreases.

[0057] In this embodiment, along the first direction, the backup conductive pad unit 21b has a first side 213 close to the encapsulation layer boundary and a second side 214 away from the encapsulation layer boundary, and the light-emitting unit 21c has a third side 215 close to the encapsulation layer boundary and a fourth side 216 away from the encapsulation layer boundary. The distance between the first side 213 and the third side 215 in the sub-pixel structure 21 is designed to be a first distance. Assuming N=4, the distance between the first side 213 and the third side 215 in the first sub-pixel structure 21 is L11, the distance between the first side 213 and the third side 215 in the second sub-pixel structure 21 is L12, the distance between the first side 213 and the third side 215 in the third sub-pixel structure 21 is L13, and the distance between the first side 213 and the third side 215 in the fourth sub-pixel structure 21 is L14.

[0058] L11>L12>L13>L14 can be selected. The first sub-pixel structure 21 is relatively close to the boundary of the encapsulation layer, and its spare conductive pad unit 21b is retracted, so that the distance between the first side 213 and the boundary of the encapsulation layer is greater than the distance between the third side 215 of the light-emitting unit 21c and the boundary of the encapsulation layer. After the spare conductive pad unit 21b of the first sub-pixel structure 21 is retracted, the distance between the first side 213 and the third side 215 is L11. In order to alleviate the impact of the retraction of the spare conductive pad unit 21b of the first sub-pixel structure 21, the spare conductive pad units 21b of the sub-pixel structures 21 in other rows are successively retracted to avoid the spacing between the spare conductive pad units 21b of adjacent sub-pixel structures 21 being too small. In this sub-pixel structure 21, the spare conductive pad unit 21b is retracted relative to the light-emitting unit 21c to alleviate the impact of the retraction of the first sub-pixel structure 21.

[0059] It should be noted that if the distance between the first side 213 of a sub-pixel structure 21 and the encapsulation layer boundary is greater than the distance between the third side 215 of the light-emitting unit 21c and the encapsulation layer boundary, and the distance between the first side 213 and the third side 215 is greater than 0, it indicates that the spare conductive pad unit 21b in the sub-pixel structure 21 has retracted relative to the light-emitting unit 21c. Here, retraction refers to the movement of the spare conductive pad unit 21b in the same sub-pixel structure 21 in the direction from the first side 213 to the second side 214, so that the distance between the first side 213 of the spare conductive pad unit 21b and the third side 215 of the light-emitting unit 21c in the same sub-pixel structure 21 increases, specifically to be greater than 0. The retraction of the spare conductive pad unit 21b in the sub-pixel structure 21 can increase the distance between the spare conductive pad unit 21b and the encapsulation layer boundary.

[0060] On the basis of ensuring that the spacing between adjacent spare conductive pad units 21b is greater than or equal to the minimum process spacing, only the spare conductive pad units 21b in the first row of pixels 20a or the first multiple rows of pixels 20a can be retracted. Optionally, the spare conductive pad units 21 in the first row can be retracted slightly more relative to the light-emitting units 21c, while the spare conductive pad units 21 in the second row can be retracted slightly less relative to the light-emitting units 21c compared to the first row, and so on. Then, starting from the first row, the spare conductive pad units 21 need to be retracted, while the spare conductive pad units 21 in the other pixel rows do not need to be retracted. In this way, while ensuring the distance between the spare conductive pad units 21b and the boundary of the encapsulation layer 30, the number of pixel rows that need to be retracted can be minimized, reducing the difficulty of process manufacturing.

[0061] refer to Figure 7 As shown in FIG, it is a schematic diagram of another display panel provided by an embodiment of the present invention. Figure 7 As shown, optionally, in the direction from the first sub-pixel structure to the Nth sub-pixel structure, the minimum distance between two adjacent spare conductive pad units 21b gradually decreases.

[0062] The minimum distance between two adjacent spare conductive pad units 21b of the first sub-pixel structure 21 and the second sub-pixel structure 21 is L21, the minimum distance between two adjacent spare conductive pad units 21b of the second sub-pixel structure 21 and the third sub-pixel structure 21 is L22, and the minimum distance between two adjacent spare conductive pad units 21b of the third sub-pixel structure 21 and the fourth sub-pixel structure 21 is L23.

[0063] L21>L22>L232 can be selected. In this embodiment, to mitigate the impact of the retraction of the spare conductive pad unit 21b of the first sub-pixel structure 21, the other spare conductive pad units 21b are successively retracted in the direction from the first sub-pixel structure 21 to the Nth sub-pixel structure to avoid the spacing between the spare conductive pad units 21b of adjacent sub-pixel structures 21 being too small. The spacing between adjacent spare conductive pad units 21b in multiple rows of sub-pixel structures is reduced to mitigate the impact of the retraction of the first sub-pixel structure 21.

[0064] It should be noted that, while ensuring that the spacing between adjacent spare conductive pad units 21b is greater than or equal to the minimum process spacing, the spare conductive pad units 21b in the first row of sub-pixel structures 21 are retracted. Optionally, the retracted size of the first row of spare conductive pad units 21b relative to the light-emitting units 21c is slightly larger. Then, the spacing between the spare conductive pad units 21b in the first row of sub-pixel structures 21 and the second row of sub-pixel structures 21 is reduced. Sequentially, the spacing between the spare conductive pad units 21b in the second row of sub-pixel structures 21 and the third row of sub-pixel structures 21 is reduced, and so on. Along the direction from the first sub-pixel structure to the Nth sub-pixel structure, the minimum distance between two adjacent spare conductive pad units 21b gradually decreases. This minimizes the number of retracted pixel rows while ensuring the distance between the spare conductive pad units 21b and the boundary of the encapsulation layer 30, thereby reducing the difficulty of process manufacturing.

[0065] refer to Figure 8 As shown in FIG, it is a schematic diagram of another display panel provided by an embodiment of the present invention. Figure 8 As shown, the minimum distance between two adjacent spare conductive pad units 21b can be equal in the direction from the first sub-pixel structure to the Nth sub-pixel structure. In this embodiment, to mitigate the impact of the inward contraction of the spare conductive pad unit 21b of the first sub-pixel structure 21, the other spare conductive pad units 21b are successively contracted in the direction from the first sub-pixel structure 21 to the Nth sub-pixel structure to mitigate the impact of the inward contraction of the spare conductive pad unit 21b of the first sub-pixel structure 21. The spacing between adjacent spare conductive pad units 21b in multiple rows of sub-pixel structures is reduced, and the spacing between adjacent spare conductive pad units 21b after contraction is set to be constant to avoid the spacing between the spare conductive pad units 21b of adjacent sub-pixel structures 21 being too small.

[0066] Before retraction, the spacing between adjacent spare conductive pad units 21b is L32. Therefore, the spare conductive pad units 21b of the first sub-pixel structure 21 are retracted. After retraction, the spacing between adjacent spare conductive pad units 21b in the second and subsequent rows is reduced to mitigate the impact of the retraction of the first sub-pixel structure 21. For example, if the spare conductive pad units 21b of the first sub-pixel structure 21 are retracted by 12 microns relative to the light-emitting units 21c, L32 = 9 microns. The spare conductive pad units 21b in rows 1 through 5 can be retracted to reduce the spacing between adjacent spare conductive pad units 21b from L32 to L31, where L31 is 6 microns. By reducing the spacing between adjacent spare conductive pad units 21b, the retraction impact of the spare conductive pad units 21b in the first sub-pixel structure 21 can be mitigated.

[0067] It should be noted that for the retracted multi-row pixel structure 21, the spacing between adjacent spare conductive pad units 21b along the direction from the first sub-pixel structure to the Nth sub-pixel structure is constant, resulting in a regular arrangement of the spare conductive pad units 21b, which can reduce manufacturing complexity. Furthermore, the regular arrangement of the spare conductive pad units 21b in the retracted multi-row sub-pixel structure 21 makes it easier to bond the light-emitting unit 21c to the spare conductive pad unit 21b if a light-emitting unit 21c in a subsequent edge pixel 20a fails.

[0068] refer to Figure 1 As shown, the optional pixel array 20 includes multiple rows of pixels 20a; in the sub-pixel structure 21, the spare conductive pad unit 21b and the light-emitting unit 21c are arranged along the row direction of the array. The optional pixel array 20 includes X columns of pixels 20a; in the 1st column of pixels and the Xth column of pixels, the spare conductive pad unit 21b of each sub-pixel structure 21 is located on the side of the light-emitting unit 21c away from the boundary of the encapsulation layer. In this embodiment, in the 1st column of pixels and the Xth column of pixels, the spare conductive pad unit 21b of each sub-pixel structure 21 is located on the side of the light-emitting unit 21c away from the boundary of the encapsulation layer. Therefore, the distance between the spare conductive pad unit 21b of the sub-pixel structure 21 and the boundary of the encapsulation layer is large, and the problem of lateral reflection causing encapsulation layer lithography residue will not occur.

[0069] refer to Figure 9 As shown in FIG, it is a schematic diagram of another display panel provided by an embodiment of the present invention. Figure 9 As shown, the optional display panel also includes: a first blocking wall 40 located on the side of the substrate 10 facing the pixel array, the vertical projection of the first blocking wall 40 on the substrate 10 surrounds the pixel array, and the first blocking wall 40 is used to block the light reflected by the spare conductive pad unit 21b and / or the main conductive pad unit 21a.

[0070] In this embodiment, a first blocking wall 40 is set at the periphery of the pixel array, so that the lateral reflected light of the conductive pad unit in the edge pixel can be blocked by the first blocking wall 40, thereby preventing the lateral reflected light of the main conductive pad unit or the spare conductive pad unit in the edge pixel from irradiating the packaging layer and causing packaging residue problems. The boundary of the packaging layer is clear after photolithography, which is convenient for subsequent cutting.

[0071] like Figure 9As shown, the first retaining wall 40 optionally overlaps the encapsulation layer boundary in a direction perpendicular to the substrate 10. In this embodiment, the edge of the first retaining wall 40 facing the pixel array is located on the side of the encapsulation layer boundary close to the pixel array, and the edge of the first retaining wall 40 facing away from the pixel array is located on the side of the encapsulation layer boundary away from the pixel array. Therefore, the lateral reflection light from the conductive pad unit in the edge pixel will hit the first retaining wall 40 and will not hit the photolithography boundary of the encapsulation layer 30. Based on this, it can be seen that the first retaining wall 40 can block the lateral reflection light from the conductive pad unit in the edge pixel, preventing the encapsulation layer 30 from causing encapsulation residue during the photolithography process. The boundary of the encapsulation layer after photolithography is clear, facilitating subsequent cutting.

[0072] refer to Figure 10 As shown in FIG, it is a schematic diagram of another display panel provided by an embodiment of the present invention. Figure 10 As shown, the encapsulation layer boundary optionally overlaps with the outer edge of the first retaining wall 40 in a direction perpendicular to the substrate. In this embodiment, the edge of the first retaining wall 40 facing the pixel array is located on the side of the encapsulation layer boundary close to the pixel array, while the edge of the first retaining wall 40 facing away from the pixel array overlaps with the encapsulation layer boundary. Consequently, lateral reflections from the conductive pad units in edge pixels strike the first retaining wall 40 and avoid striking the photolithographic boundaries of the encapsulation layer 30. This allows the first retaining wall 40 to isolate lateral reflections from the conductive pad units in edge pixels, preventing encapsulation residue from forming in the encapsulation layer 30 during the photolithography process. The encapsulation layer maintains a clear boundary after photolithography, facilitating subsequent cutting.

[0073] Optionally, along a direction perpendicular to the substrate 10, an end surface of the first retaining wall 40 facing away from the substrate 10 is higher than an end surface of the backup conductive pad unit 21b facing away from the substrate 10. Optionally, along a direction perpendicular to the substrate 10, an end surface of the first retaining wall 40 facing away from the substrate 10 is lower than an end surface of the light emitting unit 21c facing away from the substrate 10.

[0074] In this embodiment, the end surface of the first retaining wall 40 facing away from the substrate 10 is the upper surface of the first retaining wall 40, the end surface of the light-emitting unit 21c facing away from the substrate 10 is the upper surface of the light-emitting unit 21c, and the end surface of the spare conductive pad unit 21b facing away from the substrate 10 is the upper surface of the spare conductive pad unit 21b. The upper surface of the first retaining wall 40 is higher than the upper surface of the spare conductive pad unit 21b. Therefore, lateral reflections from the conductive pad are completely blocked by the first retaining wall 40, preventing the lateral reflections from the conductive pad from entering the boundary of the encapsulation layer 30. This prevents encapsulation residue from occurring during the photolithography process, and the encapsulation layer has clear boundaries after photolithography, facilitating subsequent cutting.

[0075] In addition, the upper surface of the first blocking wall 40 is lower than the upper surface of the light emitting unit 21 c , so the first blocking wall 40 will not completely block the lateral light of the light emitting unit 21 c , thereby ensuring the display effect of the display panel.

[0076] Optionally, the width of the first retaining wall 40 is in the range of 2-20 μm in the direction parallel to the substrate 10. The first retaining wall 40 has a width of 2-20 μm, which can effectively block or absorb lateral reflections from the conductive pads while not occupying a large amount of frame area, thus achieving a narrow frame.

[0077] refer to Figure 11 As shown in FIG, it is a schematic diagram of another display panel provided by an embodiment of the present invention. Figure 11 As shown, the optional display panel also includes: a light-transmitting protective layer 50 located between the pixel array and the encapsulation layer 30, and the light-transmitting protective layer 50 covers the multiple sub-pixel structures 21 in the vertical projection on the substrate 10. It should be noted that the light-transmitting protective layer 50 is formed before the first retaining wall 40 is made, and then the first retaining wall 40 is formed. In the display panel, the first retaining wall 40 is mostly formed by a photolithography method. A developer is required during the photolithography process of the first retaining wall 40, and the developer will damage the light-emitting unit. Based on this, before the first retaining wall 40, a light-transmitting protective layer 50 is formed for the pixel array, so that the developer during the photolithography process of the first retaining wall 40 will not damage the pixel array, thereby improving the quality of the display panel.

[0078] refer to Figure 12 As shown in FIG, it is a schematic diagram of another display panel provided by an embodiment of the present invention. Figure 12 As shown, the optional light-transmitting protective layer includes a plurality of light-transmitting units 51, each of which is provided corresponding to a sub-pixel structure 21. The vertical projection of the light-transmitting unit 51 on the substrate 10 covers the light-emitting unit 21c of the corresponding sub-pixel structure 21. The material of the optional light-transmitting protective layer is transparent ink, which is a photoluminescent ink or a thermoluminescent ink.

[0079] In this embodiment, after the light-emitting unit 21c is bonded, one or two drops of ink are printed at the location of the light-emitting unit 21c in each sub-pixel structure 21 using an inkjet printing method. The ink droplets will wrap the light-emitting unit 21c, naturally forming a hemispherical shape. The ink droplets are then thermally or light-cured to ultimately form a hemispherical light-transmitting unit 51. The light-transmitting unit 51 protects the light-emitting unit 21c from external damage.

[0080] The refractive index of the light-transmitting unit 51 can be greater than that of the encapsulation layer 30. For example, the refractive index of the light-transmitting unit 51 is 1.6, and the refractive index of the encapsulation layer 30 is 1.5. The refractive index setting of the light-transmitting unit 51 and its hemispherical shape can enhance the light output of the light-emitting unit 21c, thereby improving the light output effect of the display panel.

[0081] Based on the same inventive concept, an embodiment of the present invention further provides a display device comprising a display panel according to any of the above embodiments. The display panel provided by this embodiment increases the distance between the spare conductive pad unit and the encapsulation layer boundary in the edge sub-pixel structure. This eliminates photoresist residue at the encapsulation layer boundary caused by reflection from the spare conductive pad unit, thereby resolving the issue of photolithographic residue at the encapsulation layer, ensuring a clear encapsulation layer boundary, and improving subsequent cutting yield.

[0082] In addition, based on the display device provided by the embodiment of the present invention, a design method for pixel ppi is also provided.

[0083] refer to Figure 13 As shown in FIG, there are two types of pixels with and without indentation in the display panel. Figure 13 As shown, the pixel 201 in the display panel is an edge pixel and its spare conductive pad unit 21 b is retracted, while the spare conductive pad unit 21 b of the pixel 202 is not retracted.

[0084] The minimum size of the pixel 201 along the Y direction is y+x+3x1+2c.

[0085] The minimum size of the pixel 201 along the X direction is 2x+2x2+c.

[0086] The minimum size of the pixel 202 along the Y direction is 2x+3x1+2c.

[0087] The minimum size of the pixel 202 along the X direction is 2x+2x2+c.

[0088] Among them, y is the minimum distance from the spare conductive pad unit 21b to the boundary of the packaging layer, x is the minimum distance of the light-emitting unit 21c that will not cause packaging residue, x1 is the length of the light-emitting unit 21c, c is the minimum process spacing between adjacent conductive pads, and x2 is the width of the light-emitting unit 21c.

[0089] If y is greater than x, then for the pixel arrangement, the size of pixel 201 along the Y direction is larger than the size of pixel 202, and the size of pixel 201 along the Y direction is larger than the size of pixel 201 along the X direction. Therefore, the ppi is set based on the size of pixel 201 along the Y direction. For example, if the display panel size is 25400, the ppi is 25400 / (y+x+3x1+2c).

[0090] The arrangement of sub-pixel structures in a pixel is not limited to Figure 13 Regardless of how the sub-pixel structure is arranged in a pixel, the ppi is set based on the largest size of the pixel.

[0091] refer to Figure 14As shown in FIG, it is a schematic diagram of two types of pixels with and without indentation in another display panel. Figure 14 As shown, pixel 203 in the display panel is an edge pixel and its light emitting units 21 c are arranged in a herringbone shape. The spare conductive pad unit 21 b in the edge pixel is retracted, while the spare conductive pad unit 21 b of pixel 204 is not retracted.

[0092] The minimum size of the pixel 203 along the Y direction is y+x+2x1+c.

[0093] The minimum size of the pixel 203 along the X direction is 2x+4x2+3c.

[0094] The minimum size of the pixel 204 along the Y direction is 2x+2x1+c.

[0095] The minimum size of the pixel 204 along the X direction is 2x+4x2+3c.

[0096] Among them, y is the minimum distance from the spare conductive pad unit 21b to the boundary of the packaging layer, x is the minimum distance of the light-emitting unit 21c that will not cause packaging residue, x1 is the length of the light-emitting unit 21c, c is the minimum process spacing between adjacent conductive pads, and x2 is the width of the light-emitting unit 21c.

[0097] If y is greater than x, then for the pixel arrangement, the size of pixel 203 along the Y direction is larger than the size of pixel 204. Typically, 2c + x is greater than y, so the size of pixel 203 along the Y direction is smaller than the size of pixel 203 along the X direction. Therefore, the ppi is set based on the size of pixel 203 along the X direction. For example, if the display panel size is 25400, the ppi is 25400 / (2x + 4x² + 3c).

[0098] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the specific embodiments herein, and that various obvious changes, readjustments, combinations, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the scope of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that: include: substrate; a pixel array located on the substrate, the pixel array comprising a plurality of pixels arranged in an array, the pixels comprising a plurality of sub-pixel structures of different colors, the sub-pixel structures comprising a main conductive pad unit, a spare conductive pad unit, and a light-emitting unit bonded to the main conductive pad unit; an encapsulation layer located on a side of the pixel array facing away from the substrate; In edge pixels adjacent to the encapsulation layer boundary along a direction parallel to the substrate, a first minimum distance from the spare conductive pad unit to the encapsulation layer boundary is greater than a second minimum distance from the main conductive pad unit to the encapsulation layer boundary; There are N sub-pixel structures along the first direction, the sub-pixel structure close to the boundary of the encapsulation layer is the first sub-pixel structure, and the sub-pixel structure far from the boundary of the encapsulation layer is the Nth sub-pixel structure; In the sub-pixel structure, along the first direction, the spare conductive pad unit has a first side and a second side opposite to each other, the first side is located on a side of the second side close to a boundary of the encapsulation layer, the light-emitting unit has a third side and a fourth side opposite to each other, the third side is located on a side of the fourth side close to the boundary of the encapsulation layer, and in the first direction, a distance between the first side and the third side is a first distance; In a direction from the first sub-pixel structure to the Nth sub-pixel structure, the first distance gradually decreases.

2. The display panel according to claim 1, wherein: A second minimum distance from the main conductive pad unit to the boundary of the packaging layer is greater than or equal to 2 μm.

3. The display panel according to claim 1, wherein: A first minimum distance from the spare conductive pad unit to the boundary of the packaging layer is greater than or equal to 27 μm.

4. The display panel according to claim 3, wherein: Along a direction parallel to the substrate, a minimum distance between two adjacent spare conductive pad units is greater than or equal to 5 μm.

5. The display panel according to claim 3, wherein: The spare conductive pad unit includes a first spare conductive pad and a second spare conductive pad, and the direction from the first spare conductive pad to the second spare conductive pad is a first direction; The Nth sub-pixel structure includes an Nth main conductive pad unit, an Nth spare conductive pad unit, and an Nth light-emitting unit bonded to the Nth main conductive pad unit, wherein: The minimum distance between the Nth spare conductive pad unit and the N-1th spare conductive pad unit is greater than or equal to 5 μm, and N is an integer greater than 2.

6. The display panel according to claim 5, wherein: In a direction from the first sub-pixel structure to the Nth sub-pixel structure, a minimum distance between two adjacent spare conductive pad units gradually decreases.

7. The display panel according to claim 5, wherein: In a direction from the first sub-pixel structure to the Nth sub-pixel structure, the minimum distances between two adjacent spare conductive pad units are equal.

8. The display panel according to claim 1, wherein: The pixel array includes a plurality of rows of pixels; In the sub-pixel structure, the spare conductive pad unit and the light-emitting unit are arranged along an array row direction.

9. The display panel according to claim 8, wherein: The pixel array includes X columns of pixels; In the pixels in the 1st column and the pixels in the Xth column, the spare conductive pad unit of each sub-pixel structure is located on a side of the light-emitting unit away from the boundary of the encapsulation layer.

10. The display panel according to claim 1, wherein Also includes: A first barrier wall is located on a side of the substrate facing the pixel array, wherein a vertical projection of the first barrier wall on the substrate surrounds the pixel array, and the first barrier wall is used to block light reflected by the spare conductive pad unit and / or the main conductive pad unit.

11. The display panel according to claim 10, wherein: Along a direction perpendicular to the substrate, the first barrier wall overlaps with a boundary of the encapsulation layer.

12. The display panel according to claim 11, wherein: Along a direction perpendicular to the substrate, a boundary of the encapsulation layer overlaps with an outer edge of the first barrier wall.

13. The display panel according to claim 1, wherein Also includes: A light-transmitting protective layer is located between the pixel array and the encapsulation layer, and the light-transmitting protective layer covers the plurality of sub-pixel structures in a vertical projection of the substrate.

14. The display panel according to claim 13, wherein: The light-transmitting protective layer includes a plurality of light-transmitting units, one of the light-transmitting units is arranged corresponding to one of the sub-pixel structures, and a vertical projection of the light-transmitting unit on the substrate covers a light-emitting unit of the corresponding sub-pixel structure.

15. The display panel according to claim 14, wherein: The refractive index of the light-transmitting unit is greater than the refractive index of the encapsulation layer.

16. The display panel according to claim 10, wherein: Along a direction perpendicular to the substrate, an end surface of the first retaining wall facing away from the substrate is higher than an end surface of the spare conductive pad unit facing away from the substrate.

17. The display panel according to claim 10, wherein: Along a direction perpendicular to the substrate, an end surface of the first retaining wall facing away from the substrate is lower than an end surface of the light emitting unit facing away from the substrate.

18. The display panel according to claim 10, wherein: Along a direction parallel to the substrate, a width of the first barrier wall ranges from 2 μm to 20 μm.

19. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 18.

Images