Apparatus for processing substrate and method for measuring the degree of wear of consumable parts

Abstract

An apparatus for processing a substrate, comprising: a processing chamber having a processing space; a supporting unit supporting the substrate in the processing space; a lift pin module having lift pins that move consumable parts on the supporting unit in an up / down direction; and a measuring unit that measures a degree of wear of the consumable parts and has a light receiving member that receives light emitted in a horizontal direction.

Description

Technical Field

[0001] Embodiments of the inventive concept described herein relate to an apparatus for processing a substrate and a method for measuring a degree of wear of a consumable part. Background Art

[0002] Plasma refers to an ionized gaseous state of matter containing ions, free radicals, and electrons. Plasma is generated by heating a neutral gas to a very high temperature or placing a neutral gas in a strong electric field or RF electromagnetic field. Semiconductor component manufacturing processes may include an erosion process that uses plasma to remove a thin film on a substrate such as a wafer. The erosion process is performed by collision or reaction of ions and / or free radicals contained in the plasma with a thin film on the substrate.

[0003] An apparatus for treating a substrate using plasma includes a processing chamber under a vacuum atmosphere, a support chuck for supporting the substrate in the processing chamber, and a focus ring surrounding the substrate placed on the support chuck. The focus ring is installed to evenly distribute plasma on the surface of the substrate and is eroded by the plasma together with the substrate. As the etching process is repeated on the substrate, the focus ring is also eroded together, so that the shape of the focus ring gradually changes. Due to the change in the shape of the focus ring, the direction in which ions and / or radicals are incident on the substrate changes, thereby changing the etching characteristics of the substrate. Therefore, when the etching process is performed on a predetermined number or more of substrates, or when the shape of the focus ring changes and deviates from the allowable range, the focus ring must be replaced.

[0004] In order to replace the focus ring at an appropriate time, it is important to identify the degree of wear (e.g., the amount of erosion) of the focus ring. Conventionally, an operator directly opens the process chamber and identifies the degree of wear of the focus ring, or directly contacts a measuring instrument, such as a measuring jig, to the focus ring and identifies the degree of wear of the focus ring. However, in the former case, it may be difficult to appropriately identify the degree of wear of the focus ring at a desired time, and in the latter case, the focus ring may be damaged (e.g., scratched) due to physical contact between the focus ring and the measuring instrument. Summary of the invention

[0005] Embodiments of the inventive concept provide a substrate processing apparatus for effectively measuring a wear degree of a consumable part and a consumable part wear measuring method.

[0006] Embodiments of the inventive concept provide a substrate processing apparatus for effectively measuring an erosion amount of a ring member, such as a focus ring, and a consumable part wear measuring method.

[0007] The technical problems to be solved by the inventive concept are not limited to the above problems, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art to which the inventive concept belongs from the following description.

[0008] According to one embodiment, an apparatus for processing a substrate includes a processing chamber having a processing space; a supporting unit that supports the substrate in the processing space; a lift pin module that has lift pins that move consumable parts on the supporting unit in an up / down direction; and a measuring unit that measures a degree of wear of the consumable parts and has a light receiving member that receives light emitted in a horizontal direction.

[0009] According to one embodiment, the apparatus may further include a controller, and when measuring the wear degree of the consumable part, the controller may control the lift pin module to move the consumable part to a position where the consumable part interferes with the light.

[0010] According to one embodiment, the controller may calculate the degree of wear of the consumable part based on a measured height, which is a height of the lift pin when an amount of light received by the light receiving member decreases.

[0011] According to one embodiment, the controller can control the lifting pin module so that the lifting pin moves a new consumable part to a position where the new consumable part interferes with the light, and can store a reference height, which is the height of the lifting pin when the new consumable part interferes with the light and the amount of light received by the light receiving component decreases, and can calculate the degree of wear of the consumable part based on the difference between the reference height and the measured height.

[0012] According to one embodiment, the process chamber may include an observation port on which the light receiving member is mounted, and the irradiation member emitting the light may be attached to a substrate type sensor that is transported into the process space and monitors a substrate processing process performed in the process chamber.

[0013] According to one embodiment, the process chamber may include a plurality of viewing ports. The light receiving member may be mounted on one of the viewing ports, and the irradiating member that emits the light may be mounted on another one of the viewing ports.

[0014] According to one embodiment, the apparatus may further include a transfer chamber including a transfer robot for transferring the substrate into the processing space. The processing chamber may include an observation port, and the light receiving member is installed on the observation port. An irradiation member for emitting the light may be installed in the transfer chamber.

[0015] According to one embodiment, the irradiating member and the light receiving member may be disposed at the same height.

[0016] According to one embodiment, the process chamber may have an inlet / outlet opening formed therein, through which the substrate enters and leaves the process chamber, and the inlet / outlet opening, the irradiation member and the light receiving member may be arranged along a virtual straight line when viewed from above.

[0017] According to one embodiment, the consumable part may have an annular shape.

[0018] According to one embodiment, an apparatus for processing a substrate includes a processing chamber having a processing space; a gas supply unit, which supplies a process gas into the processing space; a power supply unit, which excites the process gas into plasma; a support unit, which supports the substrate in the processing space; a lift pin module, which includes lift pins, which move the substrate or a ring member on the support unit in an up / down direction; and a lifting unit, which raises and lowers the lift pins; and a measuring unit, which measures an erosion amount of the ring member and has a light receiving member, which is configured to receive light emitted in a horizontal direction.

[0019] According to one embodiment, the apparatus may further include a controller, and when measuring the erosion amount of the ring member, the controller may control the lift pin module to move the ring member to a position where the ring member interferes with the light.

[0020] According to one embodiment, the controller may calculate the erosion amount of the ring member based on a measured height, which is a height of the lift pins when an amount of light received by the light receiving member decreases.

[0021] According to one embodiment, the controller can control the lifting pin to move the new ring member to a position where the new ring member interferes with the light, a reference height can be stored, which is the height of the lifting pin when the new ring member interferes with the light and the amount of light received by the light receiving member decreases, and the erosion amount of the ring member can be calculated based on the difference between the reference height and the measured height.

[0022] According to one embodiment, the process chamber may include an observation port on which the light receiving member is mounted, and the irradiation member emitting the light may be attached to a substrate type sensor that is transported into the process space and monitors a substrate processing process performed in the process chamber.

[0023] According to one embodiment, the process chamber may include a plurality of viewing ports. The light receiving member may be mounted on one of the viewing ports, and the irradiating member that emits the light may be mounted on another one of the viewing ports.

[0024] According to one embodiment, the apparatus may further include a transfer chamber including a transfer robot for transferring the substrate into the processing space. The processing chamber may include an observation port, and the light receiving member is installed on the observation port. An irradiation member for emitting the light may be installed in the transfer chamber.

[0025] According to one embodiment, a method for measuring the degree of wear of consumable parts provided in a substrate processing device for processing substrates using plasma includes: emitting a laser having a predetermined width in a horizontal direction, receiving the laser by a light receiving member installed in the substrate processing device; moving the consumable parts in an up / down direction by lift pins of a lift pin module of the substrate processing device so that the consumable parts interfere with the laser; deriving a measurement height, which is the height of the lift pins when the amount of laser light received by the light receiving member decreases; and moving a new consumable part to a position where the new consumable part interferes with the laser by the lift pin module, and calculating the degree of wear of the consumable part based on a difference between the measurement height and a reference height, which is the height of the lift pins when the new consumable part interferes with the laser light and the amount of laser light received by the light receiving member decreases.

[0026] According to one embodiment, the irradiation member emitting the laser light may be attached to a substrate-type sensor that is transferred into the processing chamber and monitors a substrate processing process, and the processing chamber may process the substrate using the plasma. The substrate-type sensor may be transferred into the processing chamber, and the irradiation member may emit the laser light toward the light receiving member.

[0027] According to one embodiment, an irradiation member that emits the laser light is installed in a transfer chamber that transports the substrate to a processing chamber that processes the substrate using the plasma. In a state where an inlet / outlet opening formed in the processing chamber is opened, the irradiation member can emit the laser light to the light receiving member, and the substrate can enter and leave the processing chamber through the inlet / outlet opening. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other objects and features will become apparent from the following description with reference to the following drawings, wherein like reference numerals refer to like parts throughout the various drawings unless otherwise specified, and wherein:

[0029] Figure 1 is a schematic plan view illustrating a substrate processing apparatus according to an embodiment of the present inventive concept;

[0030] Figure 2 The diagram shows Figure 1 a first container;

[0031] Figure 3 The diagram shows Figure 2 The door;

[0032] Figure 4 The diagram shows Figure 2 An example of a support slot and an alignment block;

[0033] Figure 5 The diagram shows the placement Figure 2 A ring member on the support portion;

[0034] Figure 6 Figure shows a carrier installed in a first container and a carrier support structure supporting the carrier;

[0035] Figure 7 The diagram shows Figure 6 a second container;

[0036] Figure 8 The figure shows the settings Figure 1 A substrate processing device in a processing chamber;

[0037] Fig. 9 Figure 1 shows where the substrate type sensor enters Figure 8 The state of the processing space;

[0038] Fig.10 The figure shows a substrate type sensor placed on Figure 8 The status of the support unit;

[0039] Fig.11 The figure shows a state in which an irradiation member attached to a substrate type sensor irradiates light to a light receiving member;

[0040] Fig.12 shows a ring member lifted by a ring lifting module and a substrate processing apparatus when the amount of light received by a light receiving member is reduced;

[0041] Fig.13 shows a new ring member lifted by the ring lifting module and the height of the ring lifting pins when the amount of light received by the light receiving member decreases;

[0042] Fig.14 shows a used ring member lifted by the ring lifting module and the height of the ring lifting pin when the amount of light received by the light receiving member decreases;

[0043] Fig.15 FIG. 2 illustrates a substrate processing apparatus according to another embodiment of the present inventive concept; and

[0044] Fig.16 FIG. 2 illustrates a substrate processing apparatus according to another embodiment of the present inventive concept. DETAILED DESCRIPTION

[0045] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings so that the technical personnel in the field to which the present invention belongs can easily implement the present invention. However, the present invention can be implemented in various forms and is not limited to the embodiments described herein. In addition, when describing the embodiments of the present invention, when the detailed description related to the well-known functions or configurations may make the subject matter of the present invention unnecessarily obscure, they will be omitted. In addition, in all the drawings, the parts that perform similar functions and operations have the same reference numerals.

[0046] The terms "comprising" and "including" in the specification are "open" expressions, which are only for the purpose of explaining the existence of the corresponding components, and unless there is a specific description to the contrary, other components are not excluded but may be included. Specifically, it should be understood that the terms "comprising", "including" and "having" when used in this document specify the existence of the features, wholes, steps, operations, components and / or parts, but do not exclude the existence or addition of one or more other features, wholes, steps, operations, components, parts and / or groups thereof.

[0047] Unless otherwise specified, terms in the singular form may include plural forms. Furthermore, in the drawings, the shapes and sizes of components may be exaggerated for clarity of illustration.

[0048] Terms such as first, second, etc. may be used to describe various components, but components should not be limited by the terms. These terms may only be used to distinguish one component from other components. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component.

[0049] It should be understood that when a component is referred to as being "connected" or "coupled" to another component, it can be directly connected or coupled to the other component, or there can be intermediate components. Conversely, when a component is referred to as being "directly connected" or "directly coupled" to another component, there are no intermediate components. Other words used to describe the relationship between components should be interpreted in a similar manner (i.e., "between" versus "directly between," "adjacent to" versus "directly adjacent to," etc.).

[0050] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as those commonly understood by those skilled in the art to which the inventive concept belongs. Such terms, such as those defined in general dictionaries, will be interpreted as having the same meaning as the contextual meaning in the relevant technical field, and should not be interpreted as having an ideal or overly formal meaning unless explicitly defined as having such meaning in this application.

[0051] In the following, reference will be made to Figures 1 to 15 Embodiments of the inventive concept are described.

[0052] Figure 1 is a schematic plan view showing a substrate processing apparatus according to an embodiment of the present inventive concept. Figure 1 , a substrate processing apparatus 1000 according to an embodiment of the inventive concept may include an indexing unit 100, a processing unit 300, and a controller 700. When viewed from above, the indexing unit 100 and the processing unit 300 may be arranged along a first direction X. Hereinafter, when viewed from above, a direction perpendicular to the first direction X is defined as a second direction Y. In addition, a direction perpendicular to the first direction X and the second direction Y is defined as a third direction Z. Here, the third direction Z may refer to a direction perpendicular to the ground.

[0053] The index unit 100 may include a load port 110 , an index chamber 130 , a first transfer robot 150 , and a side buffer 170 .

[0054] Containers 200a, 200b, and 200c may be disposed on the loading port 110. Various types of containers 200a, 200b, and 200c may be disposed on the loading port 110. For example, various types of containers 200a, 200b, and 200c in which different articles are contained may be disposed on the loading port 110. For example, a ring member R to be transported to a processing chamber 370 to be described below and / or a carrier C for transporting the ring member R may be contained in a first container 200a among the containers 200a, 200b, and 200c. In addition, a substrate type sensor WS to be described below may be contained in the second container 200b. In addition, a substrate W (e.g., a wafer) to be processed in the processing chamber 370 may be contained in a third container 200c.

[0055] However, not limited thereto, at least one of the ring member R, the carrier C, the substrate type sensor WS, or the substrate W may be accommodated in the first container 200a. Similarly, at least one of the ring member R, the carrier C, the substrate type sensor WS, or the substrate W may be accommodated in the second container 200b and the third container 200c.

[0056] The containers 200a, 200b, and 200c may be transported and loaded onto the loading port 110 by a container transport device, or may be unloaded from the loading port 110 and transported. The container transport device may be an overhead transport device (OHT). However, the inventive concept is not limited thereto, and the containers 200a, 200b, and 200c may be transported by various devices. In addition, an operator may directly load the containers 200a, 200b, and 200c onto the loading port 110, or may directly unload the containers 200a, 200b, and 200c from the loading port 110.

[0057] Figure 2 The diagram shows Figure 1 The first container. Figure 2 , the first container 200a may include a shell 210a, a flange 220a, a gripping portion 230a, a door 240a, a supporting portion 250a, and a carrier supporting structure 270a.

[0058] The housing 210a may have an internal space. At least one of the ring member R or the carrier C may be accommodated in the internal space of the housing 210a. The flange 220a may be mounted on the upper surface of the housing 210a. The flange 220a may be grasped by a grasping portion of a container transport device such as an overhead transport device (OHT).

[0059] The gripping portion 230a may be mounted on a side surface of the housing 210a. The gripping portion 230a may be mounted on an opposite side surface of the housing 210a. The gripping portion 230a may be a handle for an operator to grip the first container 200a. The operator may hold the gripping portion 230a and directly load the first container 200a onto the loading port 110 or unload the first container 200a from the loading port 110.

[0060] The door 240a can selectively open and close the inner space of the housing 210a. The door 240a can be combined with the housing 210a to form the inner space. The door 240a can be connected to the front side of the housing 210a, or can be detached from the front side of the housing 210a. Figure 3 As shown, the door 240a may have a retainer 242a on a surface facing the inner space of the housing 210a among the surfaces of the door 240a, and the retainer 242a clamps the ring member R accommodated in the inner space of the housing 210a. The retainer 242a may have a structure extending in the up / down direction. The retainer 242a may restrict the change of the position of the ring member R accommodated in the inner space of the housing 210a by clamping the side of the ring member R accommodated in the inner space of the housing 210a.

[0061] refer to Figure 2The support portion 250a may be disposed in the inner space of the housing 210a. The support portion 250a may support the ring member R in the inner space of the housing 210a. The support portion 250a may include a support groove 252a, a partition plate 256a, and an alignment block 260a.

[0062] Each supporting groove 252a may support a corresponding one of the ring members R. The supporting groove 252a may support a bottom surface of an edge region of the ring member R. For example, the supporting groove 252a may support at least a portion of the bottom surface of the edge region of the ring member R. In addition, the supporting groove 252a may support one side and an opposite side of the bottom surface of the edge region of the ring member R.

[0063] One or more support grooves 252a may be provided. For example, a plurality of support grooves 252a may be provided. In addition, the support grooves 252a may be arranged along a third direction Z as an up / down direction. Therefore, the ring member R supported by the support grooves 252a may be accommodated in the internal space of the housing 210a along the up / down direction.

[0064] The partition plate 256a can separate the internal space of the housing 210a. For example, the partition plate 256a can divide the internal space of the housing 210a into a space for accommodating the carrier C and a space for accommodating the ring member R. The partition plate 256a can be connected to the lowermost support groove 252a among the support grooves 252a. For example, the partition plate 256a can be connected to the lower surface of the lowermost support groove 252a among the support grooves 252a. The partition plate 256a divides the internal space of the housing 210a into a space for accommodating the carrier C and a space for accommodating the ring member R, and the risk of collision between the carrier C and the hand of the first conveying robot 150 when the hand enters the internal space of the housing 210a can be minimized. In addition, when the used ring member R enters the internal space of the housing 210a, the partition plate 256a can minimize the delivery of impurities attached to the ring member R to the carrier C.

[0065] Figure 4 The diagram shows Figure 2 An example of a support slot and alignment block. Figure 4 , the alignment block 260a can be installed to be detachable from the support groove 252a. The alignment block 260a can be inserted into the support groove 252a. The alignment block 260a inserted into the support groove 252a can be fixedly coupled to the support groove 252a by the coupling device 266a.

[0066] The protrusion 262a for guiding the insertion of the alignment block 260a may be formed on at least one of the surfaces of the alignment block 260a that contacts the support groove 252a. For example, the protrusion 262a may be formed on the left and right surfaces of the alignment block 260a relative to the insertion direction of the alignment block 260a. In addition, a guide groove 253a having a shape corresponding to the protrusion 262a may be formed on at least one of the surfaces of the support groove 252a that contacts the alignment block 260a. For example, the guide groove 253a may be formed at a position corresponding to the protrusion 262a of the alignment block 260a inserted into the support groove 252a.

[0067] Although it has been described as an example that the protrusion 262a is formed on the alignment block 260a and the guide groove 253a is formed on the support groove 252a, the inventive concept is not limited thereto. Alternatively, the guide groove may be formed on the alignment block 260a, and the protrusion may be formed on the support groove 252a.

[0068] The support portion 250a may include at least one guide pin 254a that guides the position of the alignment block 260a inserted into the support groove 252a. For example, the guide pin 254a may be arranged on one of the contact surfaces between the support groove 252a and the alignment block 260a. The guide pin 254a may be inserted into a hole (not shown) formed in the alignment block 260a. For example, the hole into which the guide pin 254a is inserted may be formed on the front surface of the alignment block 260a relative to the direction in which the alignment block 260a is inserted into the support groove 252a. The guide pin 254a may be arranged at a position corresponding to the hole formed in the alignment block 260a. The guide groove 253a, the guide pin 254a, the protrusion 262a and the hole (not shown) may help the alignment block 260a to be inserted into the support groove 252a and may prevent the position of the inserted alignment block 260a from changing and prevent the alignment block 260a from being loosely inserted into the support groove 252a.

[0069] The alignment block 260a may include an alignment pin 264a. The alignment pin 264a may be provided on the upper surface of the alignment block 260a. Therefore, when the alignment block 260a is inserted into the support groove 252a, the support groove 252a may align the position of the ring member R supported thereby.

[0070] Figure 5 The diagram shows the placement Figure 2 The ring member on the support portion. Figure 5, the ring member R may have an annular shape. The ring member R may be a processing kit disposed in the processing chamber 370. For example, the ring member R may be a ring member disposed in the processing chamber 370. The ring member R may be a consumable part disposed in the processing chamber 370 for processing the substrate W by using plasma. For example, the ring member R may be an ISO ring or a focus ring. An alignment recess G may be formed on the lower surface of the ring member R. A plurality of alignment recesses G may be formed on the lower surface of the ring member R. The alignment pin 264a of the alignment block 260a may be inserted into the alignment recess G to align the position of the ring member R.

[0071] That is, the alignment pin 264a according to the embodiment of the inventive concept may be inserted into the recess G formed on the ring member R accommodated in the first container 200a and may align the position of the ring member R. Therefore, when placing the ring member in the first container 200a, even when the operator's work proficiency is quite low, the operator may align the ring member R at the correct position R simply by matching the recess G of the ring member R with the position of the alignment pin 264a. Therefore, the problem that the ring member R transported to the processing chamber 370 is not properly positioned at the correct position in the processing chamber 370 due to the misalignment of the ring member R in the first container 200a may be solved. In addition, when the first container 200a is transported, the alignment pin 264a inserted into the recess G formed on the ring member R may restrict the change in the position of the ring member R. Therefore, the problem that the ring member R is not properly positioned at the correct position in the processing chamber 370 due to the change in the position of the ring member R during the transportation of the first container 200a may be solved.

[0072] Figure 6 The figure shows a carrier installed in a first container and a carrier support structure supporting the carrier. Figure 6 , the carrier C may be used to carry the ring member R. When viewed from above, the carrier C may have a substantially trapezoidal shape, and one of the surfaces of the carrier C may have a rounded shape. The carrier C may be stored in the inner space of the first container 200a by the carrier support structure 270a. In addition, the carrier C may be retrieved by the first transfer robot 150 having a hand.

[0073] The carrier support structure 270a may support the carrier C. The carrier support structure 270a may support the carrier C in the internal space of the housing 210a. The carrier support structure 270a may be disposed below the support portion 250a. The carrier support structure 270a may be installed in the lower space in the space separated from each other by the partition plate 256a. The carrier support structure 270a may include a first support structure 272a and a second support structure 274a. A pair of second support structures 274a may be provided. The first support structure 272a and the pair of second support structures 274a may support the lower surface of the carrier C in a three-point support manner.

[0074] The substrate processing apparatus 1000 according to an embodiment of the inventive concept may transfer an unused ring member R contained in the first container 200a to the process chamber 370 by using the first transfer robot 150 and the second transfer robot 350 to be described below. In addition, the substrate processing apparatus 1000 may transfer the ring member R used in the process chamber 370 to the first container 200a by using the first transfer robot 150 and the second transfer robot 350 to be described below. That is, the substrate processing apparatus 1000 may automatically perform replacement of the ring member R.

[0075] Figure 7 The diagram shows Figure 1 Second container. Figure 7 , the second container 200b according to an embodiment of the inventive concept may have a substrate type sensor WS accommodated therein. The substrate type sensor WS may be a wafer type sensor. Each of the substrate type sensors WS may be transported into a processing space 511 of a processing chamber 510 to be described below and may monitor a substrate processing process performed in the processing chamber 510. The substrate type sensor WS may have an image acquisition module that is transported into a processing chamber 510 to be described below and obtains an image of the processing space 511 of the processing chamber 510. In addition, the substrate type sensor WS may have a notch N formed therein, and the notch N may be used to ensure centering of the substrate type sensor WS.

[0076] The substrate processing apparatus 1000 according to an embodiment of the inventive concept may transfer the substrate type sensor WS accommodated in the second container 200a into the process chamber 370 by using the first transfer robot 150 and the second transfer robot 350 to be described below. In addition, the substrate processing apparatus 1000 may transfer the substrate type sensor WS for performing measurement in the process chamber 370 into the second container 200a by using the first transfer robot 150 and the second transfer robot 350 to be described below.

[0077] The indexing chamber 130 may be provided between the loading port 110 and the processing unit 300. That is, the loading port 110 may be connected to the indexing chamber 130. The interior of the indexing chamber 130 may be maintained in an atmospheric atmosphere. A side buffer 170 as a storage unit may be installed at one side of the indexing chamber 130. In addition, a first transfer robot 150 may be provided in the indexing chamber 130. The first transfer robot 150 may transfer the substrate W, the substrate type sensor WS, and the ring member R between containers 200a, 200b, and 200c disposed on the loading port 110, a load lock chamber 310 to be described below, and the side buffer 170. That is, the first transfer robot 150 may unload the substrate type sensor WS from the second container 200b.

[0078] The processing unit 300 may include a load lock chamber 310 , a transfer chamber 330 , a second transfer robot 350 , and a processing chamber 370 .

[0079] The load lock chamber 310 may be provided between the transfer chamber 330 and the index chamber 130. That is, the load lock chamber 310 may be connected to the index chamber 130 and the transfer chamber 330. The load lock chamber 310 may provide a space for temporarily storing the substrate W and / or the ring member R. The load lock chamber 310 may be equipped with a vacuum pump not shown and a valve not shown, and the atmosphere in the load lock chamber 310 may be switched between an atmospheric atmosphere and a vacuum atmosphere. Since the interior of the transfer chamber 330, which will be described below, is maintained in a vacuum atmosphere, the atmosphere in the load lock chamber 310 may be switched between an atmospheric atmosphere and a vacuum atmosphere to transport the substrate W and the ring member R between the transfer chamber 330 and the index chamber 130.

[0080] The transfer chamber 330 may be disposed between the load lock chamber 310 and the process chamber 370. As described above, the interior of the transfer chamber 330 may be maintained in a vacuum atmosphere. In addition, the second transfer robot 350 may be disposed in the transfer chamber 330. The second transfer robot 350 may transfer a substrate W or a ring member R between the load lock chamber 310 and the process chamber 370. The second transfer robot 350 may transfer a substrate W or a ring member R between the process space of the process chamber 370 and the transfer chamber 330. The second transfer robot 350 includes a hand 352. The second transfer robot 350 may be configured to move the hand 352 along a first direction X, a second direction Y, or a third direction Z. In addition, the second transfer robot 350 may be configured to rotate the hand 352 around an axis facing the third direction Z.

[0081] The processing chamber 370 may be connected to the transfer chamber 330. The processing chamber 370 may receive the substrate W from the second transfer robot 350 provided in the transfer chamber 330 and may process the substrate W. The processing chamber 370 may be a chamber that performs a process on the substrate. For example, the processing chamber 370 may be a liquid processing chamber that processes the substrate W by dispensing a processing liquid onto the substrate W. Alternatively, the processing chamber 370 may be a plasma chamber that processes the substrate W using plasma. In another case, some processing chambers 370 may be liquid processing chambers that process the substrate W by dispensing a processing liquid onto the substrate W, while other processing chambers 370 may be plasma chambers that process the substrate W using plasma. However, not limited thereto, the substrate processing process performed in the processing chamber 370 may be modified in various ways with a well-known substrate processing process. When the processing chamber 370 is a plasma chamber that processes the substrate W using plasma, the plasma chamber may be a chamber that performs an etching or ashing process that removes a thin film on the substrate W using plasma. However, not limited thereto, the plasma processing process performed in the processing chamber 370 may be modified in various ways with a well-known plasma processing process. A detailed structure of each process chamber 370 will be described below.

[0082] Although the picture Figure 1 An example is shown in which the transfer chamber 330 has a substantially hexagonal shape when viewed from above and four process chambers 370 are connected to the transfer chamber 330, but the inventive concept is not limited thereto. For example, the shape of the transfer chamber 330 and the number of process chambers 370 may be variously modified according to user needs and the number of substrates to be processed.

[0083] The controller 700 may control the substrate processing apparatus 1000. The controller 700 may control the index unit 100 and the processing unit 300. The controller 700 may control the first transfer robot 150 and the second transfer robot 350. In order to process a substrate using plasma in the processing chamber 370, the controller 700 may control the substrate processing apparatus provided in the processing chamber 370.

[0084] The controller 700 may include a process controller, a user interface, and a storage unit. The process controller may include a microprocessor (computer) that performs control of the substrate processing device 1000. The user interface may include a keyboard through which an operator inputs commands to control the substrate processing device 1000 or a display that visually displays the operating state of the substrate processing device 1000. The storage unit may store a process scheme, such as a control program for executing a process in the substrate processing device 1000 under the control of the process controller or a program for causing each component to perform a process according to various types of data and process conditions. In addition, the user interface and the storage unit may be connected to the process controller. The process scheme may be stored in a storage medium of the storage unit. The storage medium may be a hard disk, a portable disk such as a CD-ROM or a DVD, or a semiconductor memory such as a flash memory.

[0085] Figure 8 The figure shows the settings Figure 1 In the following, reference will be made to Figure 8 The substrate processing apparatus provided in the processing chamber 370 is described in detail. The substrate processing apparatus may process the substrate W by delivering plasma to the substrate W.

[0086] The substrate processing apparatus may include a processing chamber 510 , a gate valve 520 , an exhaust line 530 , a power supply unit 540 , a support unit, a ring elevating module 560 , a substrate elevating module 570 , a baffle 580 , and a gas supply unit 590 .

[0087] The process chamber 510 may have a process space 511. The process chamber 510 may be grounded. The process chamber 510 may provide a process space 511 in which a substrate W is processed. When the substrate W is processed, the process space 511 of the process chamber 510 may be maintained in a substantially vacuum atmosphere. The process chamber 510 may have an inlet / outlet opening 512 in a side wall thereof, through which a substrate W or a ring member R enters and leaves the process chamber 510. The gate valve 520 may selectively open and close the inlet / outlet opening 512.

[0088] The process chamber 510 may have an exhaust hole 514 formed at the bottom thereof. An exhaust line 530 may be connected to the exhaust hole 514. The exhaust line 530 may release the process gas and process byproducts supplied to the process space 511 of the process chamber 510 to the outside of the process chamber 510 through the exhaust hole 514. An exhaust plate 532 may be provided above the exhaust hole 514 to more uniformly evacuate the process space 511. The exhaust plate 532 may have a substantially annular shape when viewed from above. In addition, the exhaust plate 532 may have at least one exhaust hole formed therein. An operator may select an exhaust plate 532 capable of uniformly evacuating the process space 511 from among a plurality of exhaust plates 532 having various shapes and sizes, and the exhaust plate 532 may be installed above the exhaust hole 514.

[0089] The process chamber 510 may further include a support member 516. The support member 516 may support at least a portion of components of a support unit to be described below. For example, the support member 516 may be configured to support a lower portion of an insulating plate 554 of the support unit.

[0090] The processing chamber 510 may include an observation port 518. A light receiving member 610 of a measuring unit 600 that measures the degree of wear of the ring member R may be mounted on the observation port 518. The light receiving member 610 may receive light L (e.g., laser) emitted by an irradiation member 620 to be described below. The light receiving member 610 may receive light L emitted in a horizontal direction by the irradiation member 620 to be described below.

[0091] The power supply unit 540 may generate RF power for exciting a process gas supplied by a gas supply unit 590 to be described below into plasma. The power supply unit 540 may include a power supply 542 and a matcher 544. The power supply 542 and the matcher 544 may be arranged in series with a power transmission line. The power transmission line may be connected to the chuck 552.

[0092] The supporting unit may support the substrate W in the processing space 511 of the processing chamber 510 . The supporting unit may include a chuck 552 , an insulating plate 554 , a quartz ring 556 , and a sealing member 558 .

[0093] The chuck 552 may have a supporting surface that supports the substrate W. The chuck 552 may support the substrate W and may clamp the supported substrate W. For example, the chuck 552 may include an electrostatic plate (not shown) inside and may electrostatically clamp the substrate W. That is, the chuck 552 may be an electrostatic chuck. However, not limited thereto, the chuck 552 may clamp the substrate W by vacuum pressure.

[0094] The insulating plate 554 may have a circular plate shape when viewed from above. The chuck 552 described above and the quartz ring 556 to be described below may be placed on the insulating plate 554. The insulating plate 554 may be formed of a dielectric substance. For example, the insulating plate 554 may be formed of a material including ceramics.

[0095] The quartz ring 556 may be formed of a material including quartz. When viewed from above, the quartz ring 556 may have an annular shape. When viewed from above, the quartz ring 556 may have a shape surrounding the chuck 552. When viewed from above, the quartz ring 556 may have a shape surrounding the substrate W supported on the chuck 552.

[0096] The quartz ring 556 may have a stepped shape in which the height of the inner upper surface is different from the height of the outer upper surface. For example, the inner upper surface of the quartz ring 556 may be at a lower position than the outer upper surface of the quartz ring 556. The ring member R (eg, a focus ring) may be placed on the inner upper surface of the quartz ring 556.

[0097] A sealing member 558 may be disposed between the insulating plate 554 and the chuck 552 to prevent arcing in a gap formed between the insulating plate 554 and the pin hole in the chuck 552 .

[0098] The ring lifting module 560 may vertically move the ring member R placed on the inner upper surface of the quartz ring 556. The ring lifting module 560 may include a ring lifting pin 562 and a ring lifting pin actuator 564. The ring lifting pin 562 may vertically move along a pin hole formed in the insulating plate 554 and / or the quartz ring 556. The ring lifting pin 562 may vertically move by the ring lifting pin actuator 564. The ring lifting pin actuator 564 may be a pneumatic cylinder or a hydraulic cylinder or a motor.

[0099] The substrate lifting module 570 may vertically move the substrate W placed on the chuck 552. The substrate lifting module 570 may include substrate lifting pins 572, a substrate lifting pin actuator 574, a lifting plate 576, and a bellows 578. The substrate lifting pins 572 may vertically move along pin holes formed in the insulating plate 554 and / or the chuck 552. The substrate lifting pins 572 may be coupled to the lifting plate 576 receiving power from the substrate lifting pin actuator 574. The substrate lifting pins 572 may vertically move by vertical movement of the lifting plate 576. The bellows 578 for maintaining airtightness may surround a connection portion between the lifting plate 576 and the substrate lifting pins 572.

[0100] The baffle plate 580 may be disposed above the support unit. The baffle plate 580 may be formed of an electrode material. The baffle plate 580 may have at least one baffle hole 582 formed therein. For example, a plurality of baffle holes 582 may be formed in the baffle plate 580. When viewed from above, the baffle holes 582 may be uniformly formed in the entire region of the baffle plate 580. The baffle plate 580 may uniformly deliver a supply gas supplied by a gas supply unit 590 to be described below to the substrate W.

[0101] The gas supply unit 590 may supply process gas into the processing space 511 of the processing chamber 510. The process gas may be excited into plasma by the above-mentioned power supply unit 540. The gas supply unit 590 may include a gas supply source 592 and a gas supply line 594. One end of the gas supply line 594 may be connected to the gas supply source 592, and the opposite end of the gas supply line 594 may be connected to the top of the processing chamber 510. Therefore, the process gas delivered by the gas supply source 592 may be supplied into the upper region of the baffle 580 through the gas supply line 594. The process gas supplied into the upper region of the baffle 580 may be introduced into the processing space 511 of the processing chamber 510 through the baffle hole 582.

[0102] Hereinafter, a method for measuring the degree of wear of the ring member R according to an embodiment of the inventive concept will be described. In order to perform the method for measuring the degree of wear of the ring member R, the controller 700 may control the substrate processing apparatus 1000. For example, in order to perform the method for measuring the degree of wear of the ring member R, the controller 700 may control the measuring unit 600, the ring elevating module 560, and the substrate elevating module 570.

[0103] The hand 352 of the second transfer robot 350 may load the substrate type sensor WS into the processing space 511 of the processing chamber 510 (see Fig. 9 ). The substrate type sensor WS may have the above-mentioned irradiation member 620 attached thereto. The substrate type sensor WS may be loaded onto the substrate elevating pins 572 of the substrate elevating module 570 and may be placed on the chuck 552 of the supporting unit (refer to Fig.10 ).

[0104] The substrate elevating module 570 may move the substrate type sensor WS upward. The substrate elevating module 570 may elevate the substrate type sensor WS to a height corresponding to the observation port 518. When the substrate type sensor WS is elevated to a height corresponding to the observation port 518, the irradiation member 620 attached to the substrate type sensor WS may emit light L (e.g., laser) in a horizontal direction. For example, the irradiation member 620 may emit laser light having a set width to the light receiving member 610 in a horizontal direction (refer to Fig.11 ).

[0105] The ring lifting module 560 may slowly lift the ring member R. For example, the ring lifting module 560 may move the ring member R to a position where the ring member R interferes with the light L (see Fig.12 ). The controller 700 may calculate the degree of wear of the ring member R based on the height of the ring lift pin 562 at a point in time when the amount of light L received by the light receiving member 610 decreases (hereinafter, referred to as “measured height”).

[0106] More specifically, if Fig.13 As shown, the ring lifting module 560 can slowly lift the unused new ring member NR. The controller 700 can store the height of the ring lifting pin 562 at the time point when the amount of light L received by the light receiving member 610 decreases due to the interference of the new ring member NR (hereinafter, referred to as "reference height"). The reference height can be calculated based on the gap D1 between the end of the ring lifting pin 562 and the upper surface of the quartz ring 556.

[0107] In a state where the controller 700 stores the reference height, the ring lifting module 560 may slowly lift the used ring member UR. The controller 700 may measure the height of the ring lifting pin 562 (i.e., the measured height) at a time point when the amount of light L received by the light receiving member 610 decreases. The measured height may be calculated based on the gap D2 between the end of the ring lifting pin 562 and the upper surface of the quartz ring 556.

[0108] Although it has been described that the reference height and the measurement height are calculated based on the gap between the end of the ring lift pin 562 and the upper surface of the quartz ring 556, this is illustrative, and the height of the ring lift pin 562 may be calculated based on the number of revolutions per minute of the ring lift pin actuator 564 which is a motor, or may be calculated by various other methods.

[0109] The controller 700 may calculate the degree of wear (eg, erosion amount) of the ring member R based on the difference between the reference height and the measured height. For example, the controller 700 may calculate the degree of wear of the ring member R based on the fact that the degree of wear of the ring member R is proportional to the difference between the reference height and the measured height.

[0110] According to an embodiment of the inventive concept, the substrate processing apparatus 1000 can measure the degree of wear of the ring member R even if the operator does not directly open the processing chamber 510. In addition, the degree of wear of the ring member R can be measured based on the amount of light received by the light receiving member 610. That is, the method for measuring the degree of wear of a consumable part according to an embodiment of the inventive concept can be performed without physical contact. Therefore, the problem that the ring member R is damaged (for example, scratched) when measuring the degree of wear of the ring member R as a consumable part can be solved.

[0111] Although it has been described that the irradiation member 620 is attached to the substrate type sensor WS, the present inventive concept is not limited thereto. Fig.15 As shown, the process chamber 510 may include a first observation port 518a and a second observation port 518b. A light receiving member 610 may be installed on the first observation port 518a. An irradiation member 620 may be installed on the second observation port 518b.

[0112] Or, if Fig.16 As shown, the irradiation member 620 may be installed in the transfer chamber 330 that transfers the substrate W into the process chamber 510. In a state where the inlet / outlet opening 512 of the process chamber 510 is opened by the gate valve 520, the irradiation member 620 may emit light L toward the light receiving member 610. That is, the light receiving member 610 and the irradiation member 620 may be arranged at the same height. In addition, when viewed from above, the inlet / outlet opening 512 of the process chamber 510, the irradiation member 620, and the light receiving member 610 may be arranged along a virtual straight line. Therefore, when the irradiation member 620 emits light L in the horizontal direction, the light L emitted by the irradiation member 620 may reach the light receiving member 610 through the inlet / outlet opening 512.

[0113] According to an embodiment of the inventive concept, the degree of wear of consumable parts may be effectively measured.

[0114] Furthermore, according to embodiments of the inventive concept, the erosion amount of a ring member, such as a focus ring, may be effectively measured.

[0115] The effects of the inventive concept are not limited to the above-mentioned effects, and any other effects not mentioned herein may be clearly understood by those skilled in the art according to the present specification and the accompanying drawings.

[0116] The above description illustrates the inventive concept. In addition, the above content describes the embodiments of the inventive concept, and the inventive concept can be used in various other combinations, variations and environments. That is, the inventive concept can be changed or modified without departing from the scope of the inventive concept disclosed in this specification, the equivalent scope of the written disclosure and / or the technology or knowledge scope of those skilled in the art. The written implementation describes the best state of the technical spirit for realizing the inventive concept, and various changes required in the specific application and purpose of the inventive concept can be made. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept with the disclosed implementation state. In addition, it should be understood that the attached claims include other implementations.

[0117] Although the present invention has been described with reference to the embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention. Therefore, it should be understood that the above embodiments are not restrictive but illustrative.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: a processing chamber, wherein the processing chamber has a processing space; a supporting unit configured to support the substrate in the processing space; a lift pin module having lift pins configured to move the consumable part on the support unit in an up / down direction; and a measuring unit configured to measure a degree of wear of the consumable part, the measuring unit having a light receiving member configured to receive light emitted in a horizontal direction, The device further comprises a controller, wherein when measuring the degree of wear of the consumable component, the controller controls the lift pin module to move the consumable component to a position where the consumable component interferes with the light, wherein the controller calculates the degree of wear of the consumable part based on a measured height, the measured height being a height of the lift pin when the amount of light received by the light receiving member decreases, and The controller: controlling the lift pin module so that the lift pins move a new consumable part to a position where the new consumable part interferes with the light, wherein the controller stores a reference height, which is a height of the lift pins when the new consumable part interferes with the light and the amount of light received by the light receiving member decreases; and Based on the difference between the reference height and the measured height, the degree of wear of the consumable part is calculated.

2. The apparatus according to claim 1, wherein the processing chamber includes an observation port, the light receiving member is mounted on the observation port, and The irradiation member configured to emit the light is attached to a substrate-type sensor, which is carried into the processing space and configured to monitor a substrate processing process performed in the processing chamber.

3. The apparatus of claim 1, wherein the processing chamber comprises a plurality of viewing ports, and wherein the light receiving member is mounted on one of the observation ports, and an irradiating member configured to emit the light is mounted on the other of the observation ports.

4. The apparatus according to claim 1, wherein the apparatus further comprises a transfer chamber, the transfer chamber comprising a transfer robot configured to transfer the substrate into the processing space, wherein the processing chamber includes an observation port, the light receiving member is mounted on the observation port, and Wherein an illuminating member configured to emit the light is installed in the transfer chamber. The device according to claim 4 , wherein the irradiating member and the light receiving member are disposed at the same height.

6. The apparatus according to claim 5, wherein the processing chamber has an inlet / outlet opening formed therein, the substrate enters and leaves the processing chamber through the inlet / outlet opening, and when viewed from above, the inlet / outlet opening, the irradiation member and the light receiving member are arranged along a virtual straight line.

7. The device of claim 1, wherein the consumable part has a ring shape.

8. An apparatus for processing a substrate, the apparatus comprising: a processing chamber, wherein the processing chamber has a processing space; a gas supply unit configured to supply a process gas into the processing space; a power supply unit configured to excite the process gas into plasma; a supporting unit configured to support the substrate in the processing space; a lift pin module, the lift pin module comprising: lift pins configured to move the substrate or the ring member on the support unit in an up / down direction; and a lift unit configured to raise and lower the lift pins; and a measuring unit configured to measure an erosion amount of the ring member, the measuring unit having a light receiving member configured to receive light emitted in a horizontal direction, The device further comprises a controller, wherein when measuring the erosion amount of the ring member, the controller controls the lift pin module to move the ring member to a position where the ring member interferes with the light, wherein the controller calculates the erosion amount of the ring member based on a measured height, the measured height being a height of the lift pins when the amount of light received by the light receiving member decreases, and The controller: controlling the lift pins to move the new ring member to a position where the new ring member interferes with the light, wherein the controller stores a reference height which is a height of the lift pins when the new ring member interferes with the light and an amount of light received by the light receiving member decreases; and Based on the difference between the reference height and the measured height, the erosion amount of the ring member is calculated.

9. The apparatus according to claim 8, wherein the processing chamber includes an observation port, the light receiving member is mounted on the observation port, and The irradiation member configured to emit the light is attached to a substrate-type sensor, which is carried into the processing space and configured to monitor a substrate processing process performed in the processing chamber.

10. The apparatus of claim 8, wherein the process chamber comprises a plurality of viewing ports, and wherein the light receiving member is mounted on one of the observation ports, and an irradiating member configured to emit the light is mounted on the other of the observation ports.

11. The apparatus according to claim 8, wherein the apparatus further comprises a transfer chamber, the transfer chamber comprising a transfer robot configured to transfer the substrate into the processing space, wherein the processing chamber includes an observation port, the light receiving member is mounted on the observation port, and Wherein an illuminating member configured to emit the light is installed in the transfer chamber.

12. A method for measuring a degree of wear of a consumable part provided in a substrate processing apparatus for processing a substrate using plasma, the method comprising: emitting laser light having a predetermined width in a horizontal direction and receiving the laser light through a light receiving member installed in the substrate processing device; The consumable component is moved in an up / down direction by means of a lift pin of a lift pin module of the substrate processing device so that the consumable component interferes with the laser; deriving a measured height, the measured height being a height of the lift pin when the amount of laser light received by the light receiving member decreases; and The new consumable part is moved to a position where the new consumable part interferes with the laser through the lifting pin module, and the degree of wear of the consumable part is calculated based on the difference between the measured height and a reference height, wherein the reference height is the height of the lifting pin when the new consumable part interferes with the laser and the amount of laser received by the light receiving element decreases.

13. The method of claim 12, wherein an irradiation member configured to emit the laser light is attached to a substrate-type sensor, the substrate-type sensor being transferred into a processing chamber configured to process the substrate using the plasma and configured to monitor a substrate processing process, and The substrate type sensor is transferred into the processing chamber, and the irradiating member emits the laser light toward the light receiving member.

14. The method according to claim 12, wherein the irradiation member configured to emit the laser light is installed in a transfer chamber configured to transport the substrate to a processing chamber configured to process the substrate using the plasma, and The irradiation member emits the laser light toward the light receiving member in a state where an entrance / exit opening formed in the processing chamber is open, wherein the substrate enters and leaves the processing chamber through the entrance / exit opening.

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