Semiconductor structure clamping assembly and semiconductor structure fixture

Abstract

This invention relates to a semiconductor structure clamping assembly and a semiconductor structure fixing device. The semiconductor structure clamping assembly includes multiple frame edges, which are connected end-to-end to form a positioning frame capable of positioning a chip. Each frame edge includes a first reference block and a second reference block arranged along its length. The first reference block has an insert, and the second reference block has a socket corresponding to the position of the insert. By adjusting the fixing position of the insert on the second reference block along the insertion direction, the length of the frame edge can be adjusted accordingly. By adjusting the length of the frame edge, the size of the positioning frame can be adjusted, thereby enabling the clamping of chips of different sizes. Furthermore, the insert is fixed to the second reference block by being inserted into the socket, which positions the insert. This contributes to the stability and reliability of the frame edge structure formed by the combination of the first and second reference blocks, and the structural design is relatively compact.

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