Coil component
By using resin materials with different dielectric constants to cover the coil pattern and terminal electrodes in the coil components, the problem of insufficient self-resonant frequency was solved, mechanical strength and parasitic capacitance were reduced, and the self-resonant frequency was improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TDK CORP
- Filing Date
- 2021-10-22
- Publication Date
- 2026-07-03
AI Technical Summary
In the existing technology, it is difficult to sufficiently increase the self-resonant frequency of the coil component.
Resin insulating materials with different dielectric constants are incorporated into the resin matrix. Parasitic capacitance is reduced by covering different parts of the coil pattern with resin material with low dielectric constant. Furthermore, resin material with low dielectric constant is placed between the terminal electrodes and the coil pattern to reduce capacitance.
The self-resonant frequency of the coil components was increased, ensuring mechanical strength and reducing the impact of parasitic capacitance.
Smart Images
Figure CN114388244B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to coil components, and more particularly to coil components having a structure in which a spiral coil pattern is embedded in a resin body. Background Technology
[0002] As a coil component having a structure in which a spiral coil pattern is embedded in a resin body, the coil component described in Patent Document 1 is known.
[0003] Patent Document 1: Japanese Patent Application Publication No. 2006-324489 Summary of the Invention
[0004] The problem that the invention aims to solve
[0005] However, in the coil component described in Patent Document 1, it is difficult to sufficiently increase the self-resonant frequency (SRF).
[0006] Therefore, the object of the present invention is to increase the self-resonant frequency in a coil component with a spiral coil pattern embedded in a resin body.
[0007] Methods for solving problems
[0008] The coil component of the present invention comprises: a resin body comprising a first resin-based insulating material and a second resin-based insulating material having a dielectric constant lower than that of the first resin-based insulating material; a coil pattern embedded in the resin body and wound into a spiral shape over multiple turns; and a first terminal electrode and a second terminal electrode disposed on the surface of the resin body and respectively connected to one end and the other end of the coil pattern, the coil pattern having a portion covered by the first resin-based insulating material and a portion covered by the second resin-based insulating material.
[0009] According to the present invention, sufficient mechanical strength of the resin matrix can be ensured by using a first resin-based insulating material, and parasitic capacitance can be reduced by using a second resin-based insulating material with a low dielectric constant. This allows for an increase in the self-resonant frequency.
[0010] In this invention, a second resin-based insulating material may also be disposed between the first and second terminal electrodes and the coil pattern. This reduces the parasitic capacitance generated between the first and second terminal electrodes and the coil pattern.
[0011] In this invention, the second resin-based insulating material may also be disposed between adjacent turns of the coil pattern. This reduces the parasitic capacitance generated between adjacent turns of the coil pattern.
[0012] In this invention, the resin body may also include a first resin layer, a second resin layer, and a third resin layer located between the first and second resin layers. The coil pattern includes: a plurality of first horizontal sections disposed on the first resin layer and embedded in the third resin layer; a plurality of second horizontal sections disposed on the third resin layer and embedded in the second resin layer; a plurality of first vertical sections penetrating the third resin layer and connecting one end of the plurality of first horizontal sections and one end of the corresponding plurality of second horizontal sections; and a plurality of second vertical sections penetrating the third resin layer and connecting the other end of the plurality of first horizontal sections and the other end of the corresponding plurality of second horizontal sections. This allows the coil axis of the coil pattern to be perpendicular to the stacking direction of the resin layers.
[0013] In this case, the first and second terminal electrodes can be disposed on the second resin layer, which is made of a second resin-based insulating material. Alternatively, in the third resin layer, the portion in which the plurality of first horizontal sections are embedded can be made of a second resin-based insulating material, while the remaining portion can be made of a first resin-based insulating material. According to the former, the parasitic capacitance generated between the first and second terminal electrodes and the second horizontal sections of the coil pattern, as well as the parasitic capacitance generated between adjacent second horizontal sections, can be reduced. According to the latter, the parasitic capacitance generated between adjacent first horizontal sections can be reduced.
[0014] In this invention, the first and second terminal electrodes may also be arranged axially along the coil pattern. This further reduces parasitic capacitance by suppressing the potential difference between the first and second terminal electrodes and the coil pattern.
[0015] In this case, the first and second terminal electrodes may not be formed on the surface of the resin body perpendicular to the axial direction, but rather on the surface of the resin body along the axial direction. Therefore, since the magnetic flux is unlikely to interfere with the first and second terminal electrodes, the generation of eddy currents can be suppressed.
[0016] In this invention, filler may be added to the first resin-based insulating material, while no filler may be added to the second resin-based insulating material. This can further improve the strength of the first resin-based insulating material and further reduce the dielectric constant of the second resin-based insulating material.
[0017] Invention Effects
[0018] According to the present invention, in a coil component having a structure in which a spiral coil pattern is embedded in a resin body, the self-resonant frequency can be increased. Attached Figure Description
[0019] Figure 1These are general perspective views used to illustrate the structure of the coil component 1 according to the first embodiment of the present invention. (a) is a view seen from the top surface side, and (b) is a view seen from the mounting surface side.
[0020] Figure 2 It is along Figure 1 (b) shows a rough cross-sectional view of line AA.
[0021] Figure 3 This is a general three-dimensional diagram used to illustrate the structure of the coil pattern C embedded in the resin body 10.
[0022] Figure 4 It is a general perspective top view showing the state of the coil pattern C as viewed from the z-direction.
[0023] Figure 5 This is a process diagram used to illustrate the manufacturing method of coil component 1.
[0024] Figure 6 This is a process diagram used to illustrate the manufacturing method of coil component 1.
[0025] Figure 7 This is a process diagram used to illustrate the manufacturing method of coil component 1.
[0026] Figure 8 This is a process diagram used to illustrate the manufacturing method of coil component 1.
[0027] Figure 9 This is a process diagram used to illustrate the manufacturing method of coil component 1.
[0028] Figure 10 This is a process diagram used to illustrate the manufacturing method of coil component 1.
[0029] Figure 11 This is a process diagram used to illustrate the manufacturing method of coil component 1.
[0030] Figure 12 This is a general cross-sectional view used to illustrate the structure of the coil component 2 according to the second embodiment of the present invention.
[0031] Figure 13 This is a general cross-sectional view used to illustrate the structure of the coil component 3 according to the third embodiment of the present invention.
[0032] Figure 14 These are general perspective views used to illustrate the structure of the coil component 4 according to the fourth embodiment of the present invention. (a) is a view seen from the top surface side, and (b) is a view seen from the mounting surface side.
[0033] Figure 15These are general perspective views used to illustrate the structure of the coil component 5 according to the fifth embodiment of the present invention. (a) is a view seen from the top surface side, and (b) is a view seen from the mounting surface side. Detailed Implementation
[0034] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
[0035] <First Implementation>
[0036] Figure 1 These are general perspective views showing the structure of the coil component 1 used in the first embodiment of the present invention. (a) is a view seen from the top surface side, and (b) is a view seen from the mounting surface side. Figure 2 It is along Figure 1 (b) shows a rough cross-sectional view of line AA.
[0037] The coil component 1 in the first embodiment is a surface-mountable chip-type electronic component, such as... Figure 1 and Figure 2 As shown, the coil component 1 includes a resin body 10, a coil pattern C embedded in the resin body 10, and terminal electrodes E1 and E2 disposed on the surface of the resin body 10.
[0038] The resin matrix 10 has a structure in which four resin layers 11 to 14 are stacked sequentially in the z-direction. Resin layers 11 and 13 are composed of resin-based insulating materials containing fillers such as silica in epoxy or acrylic resin materials. The resin-based insulating materials constituting resin layer 11 and resin layer 13 may be the same or different from each other. In contrast, resin layers 12 and 14 are composed of filler-free resin materials such as bismaleimide or liquid crystal polymers. The resin-based insulating materials constituting resin layer 12 and resin layer 14 may be the same or different from each other.
[0039] Therefore, the strength of the resin insulating materials constituting resin layers 11 and 13 is higher than that of the resin insulating materials constituting resin layers 12 and 14, and their processability is excellent. On the other hand, the resin insulating materials constituting resin layers 12 and 14 are composed of resin materials with low dielectric constants, and since no fillers such as silica are added, their dielectric constants are lower than those of the resin insulating materials constituting resin layers 11 and 13. As an example, the dielectric constant ε of the resin insulating materials constituting resin layers 11 and 13 is approximately 3.3 at 1 GHz, while the dielectric constant ε of the resin insulating materials constituting resin layers 12 and 14 is approximately 2.4 at 1 GHz.
[0040] Figure 3This is a general three-dimensional diagram used to illustrate the structure of the coil pattern C embedded in the resin body 10. Figure 4 It is a general perspective top view showing the state of the coil pattern C as viewed from the z-direction.
[0041] like Figures 2-4 As shown, the coil pattern C is composed of a first horizontal interval 31-34 and a second horizontal interval 41-45 extending in the xy plane, and a first vertical interval 51-54 and a second vertical interval 61-64 extending in the z direction. Figure 2 As shown, the first horizontal sections 31-34 are disposed on the surface of resin layer 11, and resin layer 12 is embedded therein. The second horizontal sections 41-45 are disposed on the surface of resin layer 13, and resin layer 14 is embedded therein. The first vertical sections 51-54 and the second vertical sections 61-64 penetrate resin layers 12 and 13. The first vertical sections 51-54 connect one end of the first horizontal sections 31-34 to one end of the corresponding second horizontal sections 41-44. The second vertical sections 61-64 connect the other end of the first horizontal sections 31-34 to one end of the corresponding second horizontal sections 42-45.
[0042] This structure forms a coil pattern C that is wound into a spiral shape with multiple turns. The coil axis of the coil pattern C is in the x-direction. The other end of the second horizontal section 41 forms one end of the coil pattern C and is connected to the terminal electrode E1 via a through-hole conductor 71 that penetrates the resin layer 14. On the other hand, one end of the second horizontal section 45 forms the other end of the coil pattern C and is connected to the terminal electrode E2 via a through-hole conductor 72 that penetrates the resin layer 14. The terminal electrodes E1 and E2 are bottom-surface terminals formed only on the xy surfaces of the resin body 10. That is, the terminal electrodes E1 and E2 do not cover the yz surfaces of the resin body 10, so that when the resin body 10 is mounted on the circuit board using solder, the yz surfaces of the resin body 10 will not be covered by the rounded corners of the solder. As a result, the mounting density can be increased, and since the magnetic flux generated by the coil pattern C is unlikely to interfere with the terminal electrodes E1 and E2 and the solder, the generation of eddy currents can be suppressed.
[0043] like Figure 4As shown, terminal electrode E1 overlaps at least with the second horizontal section 41, and terminal electrode E2 overlaps at least with the second horizontal section 45. Therefore, parasitic capacitances are generated between terminal electrode E1 and the second horizontal section 41, and between terminal electrode E2 and the second horizontal section 45. However, in this embodiment, since the resin layer 14 located between them is made of a resin-based insulating material with a low dielectric constant, the parasitic capacitances generated between terminal electrodes E1, E2 and the second horizontal sections 41, 45 can be reduced. Furthermore, since the resin layer 14 is embedded in the second horizontal sections 41-45, the parasitic capacitances between adjacent second horizontal sections 41-45 in the x-direction can be reduced, i.e., the parasitic capacitances generated between adjacent turns of the coil pattern C. Thus, the reduction in self-resonant frequency due to parasitic capacitance can be prevented.
[0044] Furthermore, in this embodiment, terminal electrode E1 also overlaps with a portion of the second horizontal section 42, and terminal electrode E2 also overlaps with a portion of the second horizontal section 44. Therefore, parasitic capacitances are also generated between terminal electrode E1 and the second horizontal section 42, and between terminal electrode E2 and the second horizontal section 44. Here, since the second horizontal section 42 is farther from the wiring distance of terminal electrode E1 than the second horizontal section 41, the parasitic capacitance per unit area of terminal electrode E1 and the second horizontal section 42 is larger than that of terminal electrode E1 and the second horizontal section 41 due to voltage drop. Similarly, since the second horizontal section 44 is farther from the wiring distance of terminal electrode E2 than the second horizontal section 45, the parasitic capacitance per unit area of terminal electrode E2 and the second horizontal section 44 is larger than that of terminal electrode E2 and the second horizontal section 45 due to voltage drop. Thus, when the terminal electrodes E1 and E2 overlap with multiple second level intervals 41 to 45, it is better to use a resin-based insulating material with a low dielectric constant as the material for the resin layer 14.
[0045] Furthermore, in this embodiment, since the resin layer 12 is embedded in the first horizontal intervals 31 to 34, and the resin layer 12 is made of a resin-based insulating material with a low dielectric constant, the parasitic capacitance between adjacent first horizontal intervals 31 to 34 in the x direction can be reduced, that is, the parasitic capacitance generated between adjacent turns of the coil pattern C can be reduced.
[0046] On the other hand, since most of the first vertical sections 51-54 and the second vertical sections 61-64 are provided with resin layers 13 that have high penetration strength, the overall mechanical strength of the resin body 10 can be sufficiently ensured. To ensure the mechanical strength of the resin body 10, the thickness T13 of the resin layer 13 is preferably more than three times the thicknesses T12 and T14 of the resin layers 12 and 14. As an example, if T12 = approximately 20 μm, T13 = approximately 115 μm, and T14 = approximately 30 μm, the mechanical strength of the resin body 10 can be ensured, and parasitic capacitance can be reduced.
[0047] As described above, the coil component 1 of this embodiment has a structure in which the coil pattern C is embedded in the resin body 10. The coil pattern C has a portion covered by resin layers 11 and 13 made of high-strength resin insulating material and resin layers 12 and 14 made of resin insulating material with low dielectric constant. Therefore, the mechanical strength of the resin body 10 can be ensured and the reduction of the self-resonant frequency due to parasitic capacitance can be prevented.
[0048] Furthermore, in this embodiment, since terminal electrodes E1 and E2 are arranged along the axial direction (x-direction) of the coil pattern C, terminal electrode E1 does not overlap with the second horizontal interval (e.g., second horizontal interval 44 or 45) that is far from the wiring distance. Similarly, terminal electrode E2 does not overlap with the second horizontal interval (e.g., second horizontal interval 41 or 42) that is far from the wiring distance. As a result, the potential difference between terminal electrodes E1 and E2 and the second horizontal intervals 41, 42, 44, and 45 that overlap with them can be suppressed. Therefore, compared with the case where terminal electrodes E1 and E2 are arranged in the y-direction, parasitic capacitance can be further reduced.
[0049] The manufacturing method of the coil component 1 in this embodiment will now be described.
[0050] Figures 5-11 This is a process diagram illustrating the manufacturing method of the coil component 1 in this embodiment. Figures 6 to 11 In the diagram, (a) is a general three-dimensional view, (b) is a general top view, and (c) is a general cross-sectional view along line BB shown in (b).
[0051] First, such as Figure 5 As shown, a support substrate 80 made of a ceramic material such as alumina or non-magnetic ferrite is prepared, and a resin layer 11 is formed on its surface. Next, as... Figure 6As shown, first horizontal intervals 31 to 34 are formed on the surface of resin layer 11. The formation of the first horizontal intervals 31 to 34 can be performed by the following steps: after forming a thin power supply film on the entire surface of resin layer 11, a photosensitive film is adhered; openings are formed on the photosensitive film through exposure and development; and the first horizontal intervals 31 to 34 are grown at the openings through electroplating. Here, since resin layer 11 is made of a high-strength resin-based insulating material, the processing accuracy of the first horizontal intervals 31 to 34 formed on its surface can be maintained at a relatively high level.
[0052] Next, as Figure 7 As shown, a resin layer 12 is formed on the surface of the resin layer 11 such that the first horizontal intervals 31 to 34 are embedded therein. Thus, adjacent first horizontal intervals 31 to 34 in the x-direction are insulated by a resin-based insulating material with a low dielectric constant. Next, openings 31a to 34a and 31b to 34b are formed in the resin layer 12, exposing both ends of the first horizontal intervals 31 to 34.
[0053] Next, as Figure 8 As shown, a first vertical section 51-54 is formed, connected to one end of the first horizontal section 31-34 via openings 31a-34a, and a second vertical section 61-64 is formed, connected to the other end of the first horizontal section 31-34 via openings 31b-34b. The method for forming the first vertical section 51-54 and the second vertical section 61-64 can be performed according to the following steps: after forming a thin power supply film on the entire surface of the resin layer 12, a photosensitive film is adhered; openings are formed on the photosensitive film by exposure and development; and the first vertical section 51-54 and the second vertical section 61-64 are grown at the openings by electroplating.
[0054] Next, as Figure 9 As shown, a resin layer 13 is formed by embedding the first vertical sections 51-54 and the second vertical sections 61-64. The resin layer 13 can be formed by the following steps: after peeling off the photosensitive film used in the formation of the first vertical sections 51-54 and the second vertical sections 61-64, an uncured sheet constituting the resin layer 13 is laminated and cured, and then the surface is polished to expose the tops of the first vertical sections 51-54 and the second vertical sections 61-64. This process can be repeated multiple times, alternating between the heights of the first vertical sections 51-54 and the second vertical sections 61-64. Figure 8 The process shown and Figure 9 The process shown. Here, the resin layer 13 is made of a resin-based insulating material with high processability, thus, the processing accuracy of the first vertical section 51-54 and the second vertical section 61-64 can be maintained at a high level.
[0055] Next, as Figure 10 As shown, a second horizontal section 41 to 45 is formed on the surface of the resin layer 13. The method for forming the second horizontal section 41 to 45 can also be the same as the method for forming the first horizontal section 31 to 34 described above. Here, since the resin layer 13 is made of a high-strength resin-based insulating material, the processing accuracy of the second horizontal section 41 to 45 formed on its surface can be maintained at a high level.
[0056] Next, as Figure 11 As shown, a resin layer 14 is formed on the surface of the resin layer 13 such that the second horizontal sections 41 to 45 are embedded therein. Thus, adjacent second horizontal sections 41 to 45 in the x-direction are insulated by a resin-based insulating material with a low dielectric constant. Next, openings 71a and 72a are formed in the resin layer 14, exposing the other end of the second horizontal section 41 and one end of the second horizontal section 45. Furthermore, if terminal electrodes E1 and E2 are formed at positions overlapping with the openings 71a and 72a, respectively, the coil component 1 of this embodiment is completed.
[0057] As described above, according to the manufacturing method of the coil component 1 of this embodiment, since the first horizontal intervals 31 to 34 and the second horizontal intervals 41 to 45 are formed on the surfaces of the resin layers 11 and 13 with high strength and processability, and most of the first vertical intervals 51 to 54 and the second vertical intervals 61 to 64 are provided to penetrate the resin layer 13 with high strength and processability, high processing accuracy can be ensured, unlike the case where the entire resin body 10 is made of a resin-based insulating material with a low dielectric constant.
[0058] <Second Implementation Method>
[0059] Figure 12 This is a general cross-sectional view used to illustrate the structure of the coil component 2 according to the second embodiment of the present invention.
[0060] like Figure 12 As shown, the coil component 2 of the second embodiment differs from the coil component 1 of the first embodiment in that the resin layer 12 is made of the same resin-based insulating material as the resin layers 11 and 13. Since the other basic structures are the same as those of the coil component 1 of the first embodiment, the same reference numerals are used for the same components, and repeated descriptions are omitted. As illustrated in the coil component 2 of this embodiment, it is not necessary for the first horizontal interval 31 to 34 to be covered by a resin-based insulating material with a low dielectric constant in this invention.
[0061] <Third Implementation Method>
[0062] Figure 13This is a general cross-sectional view used to illustrate the structure of the coil component 3 according to the third embodiment of the present invention.
[0063] like Figure 13 As shown, the coil component 2 of the third embodiment differs from the coil component 1 of the first embodiment in that the resin layer 14 is made of the same resin-based insulating material as the resin layers 11 and 13. Since the other basic structures are the same as those of the coil component 1 of the first embodiment, the same reference numerals are used for the same components, and repeated descriptions are omitted. As shown in the coil component 3 of this embodiment, it is not necessary for the second horizontal interval 41 to 45 to be covered by a resin-based insulating material with a low dielectric constant in this invention.
[0064] <Fourth Implementation Method>
[0065] Figure 14 These are general perspective views illustrating the structure of the coil component 4 according to the fourth embodiment of the present invention. (a) is a view seen from the top surface side, and (b) is a view seen from the mounting surface side.
[0066] like Figure 14 As shown, the coil component 4 of the fourth embodiment differs from the coil component 1 of the first embodiment in that the axial direction of the coil pattern C embedded in the resin body 10 is the z-direction. One end of the coil pattern C is connected to the terminal electrode E1 via a lead wire Ca, and the other end of the coil pattern C is connected to the terminal electrode E2.
[0067] As the material for the resin layer 14 located between the terminal electrodes E1, E2 and the first turn of the coil pattern C starting from the terminal electrode E2, a resin-based insulating material with a low dielectric constant is used. Most of the coil pattern C is embedded in the high-strength resin layer 13. Furthermore, for the resin layer 12 located between specified adjacent turns of the coil pattern C, a resin-based insulating material with a lower dielectric constant than the resin layer 13 is also used. This reduces the parasitic capacitance generated between the terminal electrodes E1, E2 and the first turn of the coil pattern C, as well as the parasitic capacitance generated between specified adjacent turns of the coil pattern C.
[0068] As shown in coil component 4 of this embodiment, in this invention, the coil axis of coil pattern C may also be oriented toward the stacking direction (z direction).
[0069] <Fifth Implementation>
[0070] Figure 15 These are general perspective views illustrating the structure of the coil component 5 according to the fifth embodiment of the present invention. (a) is a view seen from the top surface side, and (b) is a view seen from the mounting surface side.
[0071] like Figure 15As shown, the coil component 5 of the fifth embodiment differs from the coil component 4 of the fourth embodiment in that the resin layer 12 is omitted. Since the other basic structures are the same as those of the coil component 4 of the fourth embodiment, the same reference numerals are used for the same components, and repeated descriptions are omitted. As shown in the coil component 5 of this embodiment, the coil pattern C may also be entirely embedded in the resin layer 13, with a resin layer 14 of low dielectric constant disposed only between the terminal electrodes E1, E2 and the first turn of the coil pattern C.
[0072] The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments. Various modifications can be made without departing from the spirit of the present invention, and these modifications are also included within the scope of the present invention.
[0073] For example, in the various embodiments described above, fillers are added to the resin-based insulating material constituting resin layers 11 and 13, while no fillers are added to the resin-based insulating material constituting resin layers 12 and 14. However, this is not necessary in the present invention. Furthermore, by using the same resin material in resin layers 11 and 13 and resin layers 12 and 14, and by adding fillers to resin layers 11 and 13, strength can be improved. On the other hand, to ensure that the dielectric constant does not increase compared to resin layers 12 and 14, fillers may not be added.
[0074] Symbol Explanation
[0075] Coil components 1-5
[0076] 10 Resin Body
[0077] 11-14 Resin layers
[0078] 31-34, Level 1
[0079] Openings 31a~34a, 31b~34b
[0080] 41-45, second level interval
[0081] 51-54, First Vertical Interval
[0082] 61-64, second vertical interval
[0083] 71, 72 Through-hole conductors
[0084] 71a, 72a openings
[0085] 80 Support substrate
[0086] C coil pattern
[0087] Ca leads out of the wiring
[0088] E1 and E2 terminal electrodes
Claims
1. A coil component, characterized in that, have: The resin matrix comprises a first resin-based insulating material and a second resin-based insulating material having a lower dielectric constant than the first resin-based insulating material. The coil pattern is embedded in the resin body and wound into a spiral shape in multiple turns. as well as The first terminal electrode and the second terminal electrode are disposed on the surface of the resin body and are respectively connected to one end and the other end of the coil pattern. The coil pattern has a portion covered by the first resin-based insulating material and a portion covered by the second resin-based insulating material. The resin matrix comprises a first resin layer, a second resin layer, and a third resin layer located between the first resin layer and the second resin layer. The coil pattern includes: Multiple first-level intervals are disposed on the first resin layer and embedded in the third resin layer; Multiple second horizontal intervals are disposed on the third resin layer and embedded in the second resin layer; A plurality of first vertical sections, extending through the third resin layer, connect one end of the plurality of first horizontal sections and one end of the corresponding plurality of second horizontal sections; and Multiple second vertical sections are provided, penetrating the third resin layer, and connecting the other ends of the multiple first horizontal sections and the other ends of the corresponding multiple second horizontal sections. The first terminal electrode and the second terminal electrode are disposed on the second resin layer. The second resin layer is disposed between the first terminal electrode, the second terminal electrode, and the coil pattern, and is composed of the second resin-based insulating material. In the third resin layer, the portion in which the plurality of first horizontal intervals are embedded is composed of the second resin-based insulating material, while the remaining portion is composed of the first resin-based insulating material. The first terminal electrode and the second terminal electrode are arranged axially in the coil pattern. Viewed from a direction perpendicular to the axial direction of the coil pattern, the first terminal electrode and the second terminal electrode overlap with the first vertical region and the second vertical region of the coil pattern. The first terminal electrode and the second terminal electrode are not formed on the surface of the resin body perpendicular to the axial direction, but are formed on the surface of the resin body along the axial direction.
2. The coil component as claimed in claim 1, characterized in that, The second resin-based insulating material is disposed between adjacent turns of the first horizontal section and the second horizontal section.
3. The coil component as described in claim 1 or 2, characterized in that, The first resin-based insulating material contains filler, while the second resin-based insulating material does not contain filler.
4. A coil component, characterized in that, have: First resin layer; Multiple first coil sections are formed on the first resin layer; A second resin layer is formed on the first resin layer to embed the plurality of first coil intervals; A third resin layer is formed on the second resin layer; Multiple second coil sections are formed on the third resin layer; A fourth resin layer is formed on the third resin layer to embed the plurality of second coil intervals; A terminal electrode is formed on the fourth resin layer and connected to a designated one of the plurality of second coil intervals; Multiple third coil intervals are respectively connected to one end of the multiple first coil intervals and one end of the multiple second coil intervals corresponding to them; as well as Multiple fourth coil sections are respectively connected to the other ends of the multiple first coil sections and the other ends of the corresponding multiple second coil sections. The relative permittivity of the second resin layer is lower than that of the third resin layer. The relative permittivity of the fourth resin layer is lower than that of the third resin layer. The terminal electrode is formed only on the upper surface of the fourth resin layer in the stacking direction of the first resin layer to the fourth resin layer. The terminal electrode has a portion that overlaps with the third coil section and the fourth coil section.
5. The coil component as described in claim 4, characterized in that, The relative permittivity of the second resin layer is lower than that of the first resin layer.
6. The coil component as claimed in claim 4, characterized in that, The third resin layer is thicker than the second resin layer.
7. The coil component as claimed in claim 6, characterized in that, The thickness of the third resin layer is more than three times the thickness of the second resin layer.