A partitioned addressing dTOF ranging system

Abstract

The application discloses a kind of partition addressing dTOF ranging system, comprising: partition addressable light source, including N light source partitions in it, N≥2;Imaging chip, there is SPAD pixel array in, the SPAD pixel array is divided into N pixel partitions, N≥2;Memory, the mapping table relationship between the light source partition and pixel partition is stored in;Light source starting controller, according to the mapping table relationship, control light source partition and corresponding pixel partition are started simultaneously.The application uses addressable light source excitation, and the light projector light source is partitioned, and only one or more regions of laser light emitting point and the corresponding SPAD working pixel array are started at the same time, a plurality of SPAD pixels are used to form macro-pixel, and macro-pixel is used as the basic unit of laser detection, and the TDC between different macro-pixels can be multiplexed, to reduce the noise of imaging, improve signal-to-noise ratio, reduce the complexity of circuit design, reduce power consumption, also reduce design cost and chip area.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optoelectronics, in particular to a partition addressing dTOF ranging system. BACKGROUND

[0002] With the development of artificial intelligence and consumer electronics, more and more scenarios need to use machine vision. 2D vision has encountered many bottlenecks such as depth measurement, living body recognition, positioning, etc. 3D vision can solve these problems. At the current point in time, the transition of cameras from 2D to 3D will become the "fourth image revolution" after black and white to color, low resolution to high resolution, and static image to dynamic image.

[0003] The 3D imaging technologies currently used more mainly include: 3D structured light imaging, time-of-flight (TOF) imaging, and binocular stereo imaging. 3D structured light and binocular measurement are based on the principle of triangulation, and are limited by the baseline, and have certain limitations in measuring distance. TOF calculates the distance of the measured object by measuring the time difference between the emission of the emitted light and the reception. There are two kinds of TOF technologies: iTOF (indirect time-of-flight) and dTOF (direct time-of-flight). Among them, iTOF detects the phase difference between the reflected modulated light and the emitted modulated light by emitting modulated light of a specific frequency, converts it into time of flight, and calculates the depth information of the measured object. Since energy integration is used, the reflected light at different positions brings multi-path interference, and the power consumption is large. dToF directly measures the time of flight. The principle is to directly measure the time interval between the reflected light pulse and the emitted light pulse by directly emitting a light pulse to the measured object, to obtain the time of flight of the light. The algorithm is simple, the measurable distance is far, and high-frequency measurement can be achieved. It has great advantages in machine vision such as automatic driving, sweeping machines, and unmanned aerial vehicles.

[0004] The dTOF module mainly includes a laser projector and an infrared receiving camera. The existing mature scheme is that the laser light source (such as vcsel, LD, etc.) in the laser projector emits uniform infrared light (flood illumination) through a diffuser. The uniform infrared light is irradiated on the measured object. The reflected light of the measured object is focused on the pixel array of the infrared receiving camera (generally SPAD, APD) through the imaging lens of the infrared receiving camera. The pixel array analyzes the time between the emission of the light beam and the reception of the infrared light reflected from the object to obtain the depth information of the object.

[0005] For example, patent application CN213149250U discloses a DToF distance sensor system, including a receiver and a transmitter; the receiver includes a DToF sensor; the transmitter includes a driving circuit, a laser, a detector, and optical elements; the laser and detector are connected to the driving circuit; the laser emits light that passes through the optical elements to the surface of the object to be measured and is then reflected to the DToF sensor; and patent application CN113777583A discloses a DToF ranging device, including: a light source emitting device configured to emit pulsed laser; a controller configured to perform active detection within a first distance range; and a receiver configured to receive photons and read out detection signals based on the control of the controller.

[0006] In existing technologies, the light source emits a beam of light across the entire surface. However, due to limitations in manufacturing processes, actual SPAD arrays only support rolling shutters, meaning they can only process the depth resolution of a portion of the light emitted by the light source at any given time. This results in low utilization of the light beam emitted by the light source, significantly wasting the light-emitting energy. Furthermore, each SPAD pixel in the solution is equipped with a separate data processing circuit, greatly increasing the overall power consumption of the chip. Severe crosstalk between adjacent SPAD pixels and the significant impact of ambient light on image quality further limit the measurement accuracy and ranging range of the entire system. Summary of the Invention

[0007] To address the aforementioned problems, this invention proposes a partitioned addressable dTOF ranging system. It utilizes an addressable light source (such as in conjunction with patent CN202110460175.0), partitioning the laser projector light source. Simultaneously, only one or more regions' laser emission points and corresponding SPAD working pixel arrays are activated. Multiple SPAD pixels constitute macropixels, which serve as the basic unit for laser detection. Furthermore, the TDC (Time Direction of Detection) between different macropixels can be reused. This significantly reduces imaging noise, improves the signal-to-noise ratio, reduces circuit design complexity, lowers power consumption, and also reduces design costs and chip area.

[0008] A partition-addressable dTOF ranging system, comprising:

[0009] A partitioned addressable light source contains N light source partitions, where N≥2;

[0010] An imaging chip containing a SPAD pixel array, wherein the SPAD pixel array is divided into N pixel partitions, where N≥2;

[0011] The memory contains a mapping table between the light source partitions and the pixel partitions.

[0012] The light source activation controller, according to the aforementioned mapping table, controls the simultaneous activation of the light source partition and its corresponding pixel partition.

[0013] Several alternative methods are provided below, but they are not intended as additional limitations on the overall solution above. They are merely further additions or optimizations. Provided there are no technical or logical contradictions, each alternative method can be combined individually with respect to the overall solution above, or multiple alternative methods can be combined with each other.

[0014] In the above partitioned addressing dTOF ranging system, it is necessary to ensure that the position of the image point after the laser emission point is reflected by the object corresponds one-to-one with the position of the SAPD macro pixel point that is activated at the same time. Due to the aberrations of optical components, structural tolerances and assembly errors during production, some modules cannot be adjusted to match the position of the imaging light point with the position of the SPAD macro pixel point during production, resulting in a large defect rate.

[0015] Optionally, the SPAD pixel array includes a SPAD macropixel array, which comprises multiple macropixels. Each macropixel consists of M*N SPAD pixels, and each macropixel independently performs single-photon detection. The SPAD pixel units within each macropixel share the same TDC. In some cases, macropixels from different pixel partitions may also share the same TDC.

[0016] This application further improves the imaging chip by allowing different macropixels to work in parallel and independently perform single-photon detection, reducing the impact of crosstalk between individual SPADs on measurement accuracy. Furthermore, each macropixel shares a single TDC, and macropixels in different pixel partitions can also share a single TDC, greatly simplifying circuit design and reducing the overall chip power consumption.

[0017] Optionally, a photon concurrency detection circuit is provided between the macro-pixel and the TDC. When the time difference of photon pulses generated by the SPAD pixel in the activated macro-pixel does not meet the photon concurrency requirement, the photon concurrency detection circuit cannot output a valid avalanche signal. The macro-pixel and the photon concurrency detection circuit work together to complete the detection of concurrent photons, eliminating asynchronously generated photon avalanche pulse signals, thereby reducing the avalanche signal output caused by ambient light, afterpulse signals, and false triggering of dark counts, and outputting high-resolution 2D images and high signal-to-noise ratio depth images.

[0018] Optionally, the SPAD pixel array further includes reserved pixels outside the SPAD macropixel array, wherein the reserved pixels are column SPAD pixels and / or row SPAD pixels. Further, based on the position of the light spot falling on the imaging chip, the binning between the SPAD pixels is dynamically adjusted so that the position of the light spot corresponds to the position of the macropixels within the SPAD macropixel array.

[0019] The imaging chip in this application has reserved SPAD pixels, which allows for timely adjustment of the macro-pixel binning configuration of the sensor even under conditions of large assembly errors. This ensures that the light spots emitted by the light source can also be imaged in the pixel area, greatly improving the production yield of the dtof lidar module.

[0020] Optionally, within each SPAD pixel array, each SPAD pixel establishes a logical relationship of whether or not it is connected with the four surrounding pixels, and selects multiple pixels covered by the same light spot to be connected in parallel as a macro-pixel photosensitive image.

[0021] This invention records or identifies the position of light spots, reserves multiple rows or columns of pixels, dynamically adjusts the binning between pad pixels to ensure that all light spots fall on the imaging pixels, and dynamically adjusts the position of macro pixels, so that even defective products can be transformed into good products with normal imaging.

[0022] Optionally, the light source activation controller is used to control the operation of different light source partitions and pixel partitions. When a certain light source partition is activated, the pixel partition that images the light source of that partition will be activated at the same time. The light source partitions are lit up in sequence, and the corresponding imaging pixel partitions are also activated one by one. One cycle can complete the illumination and imaging of the entire scene under test and obtain the depth information of the entire scene under test.

[0023] This invention employs addressable light sources, partitions the light source of the laser projector, and activates only one or more laser emission points and corresponding SPAD working pixel arrays in one region at a time. Multiple SPAD pixels are used to form macro pixels, which serve as the basic unit for laser detection. Furthermore, the TDCs between different macro pixels can be reused. This greatly reduces imaging noise, improves the signal-to-noise ratio, reduces circuit design complexity, reduces power consumption, and also reduces design costs and chip area.

[0024] The imaging chip of this invention reserves some spare pixels on top of the original SPAD pixel array for alignment with the laser emission point, reducing the alignment difficulty of the laser projector and infrared receiving camera during production and greatly improving the production yield of the DTFOF module. Simultaneously, the dynamically binning SPAD chip design can dynamically adjust the number of individual SPAD pixels in the macropixel according to the actual size of the received light spot, allowing for a better correspondence between the actual working macropixel and the received light spot size. This balances chip power consumption, measurement speed, and accuracy, achieving better measurement results. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a partitioned addressing dTOF ranging system provided by the present invention;

[0026] Figure 2 This is a schematic diagram of the basic structure of a typical single SPAD pixel;

[0027] Figure 3 This is a schematic diagram of a SPAD macro-pixel distribution provided by the present invention;

[0028] Figure 4 This is a schematic diagram showing the distribution of corresponding light spots on the SPAD macropixel when the assembly error is large.

[0029] Figure 5 A novel SPAD pixel distribution diagram provided by the present invention;

[0030] Figure 6 This is a schematic diagram of a SPAD pixel dynamic binding provided by the present invention;

[0031] Figure 7 for Figure 5 A schematic diagram of the macro-pixel distribution of the SPAD array after dynamic binding;

[0032] Figure 8 This is a schematic diagram of the light spots formed on the SPAD pixel array under different distances in the test scene with the same emitted light point. Detailed Implementation

[0033] Many specific details are set forth in the following description to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore, the invention is not limited to the specific embodiments disclosed below. The directional terms “up,” “down,” “left,” and “right” used herein are based on the corresponding drawings, and it is understood that the use of these directional terms does not limit the scope of protection of the invention.

[0034] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0035] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0036] Figure 1This is a schematic diagram of a partition-addressable dTOF ranging system provided by the present invention. The diagram includes a partition-addressable light source 1, a memory 2, a light source activation controller 3, and an imaging chip 4. The partition-addressable light source 1 contains N light source partitions, where N≥2. The memory 2 stores a mapping table relationship between light source points and corresponding pixel points obtained during production testing. For example, when light source partition 1 is activated, the light points emitted by the light source are imaged within the system's working distance range, and all light spots fall correspondingly in pixel partition 1. This mapping table relationship is stored in the memory 2 by recording the corresponding registers (i.e., storing the register addresses of the driving light source and the register addresses of the driving related pixels). The light source activation controller 3 is used to control the operation of different light sources and pixel areas. When light source partition 1 is activated, pixel partition 1 that images the light source of that partition will be activated simultaneously. The light source partitions are lit sequentially, and the corresponding imaging pixel partitions are also activated one by one. One cycle can complete the illumination and imaging of the entire scene under test, and finally obtain the depth information of the entire scene under test. The imaging chip 4 of the infrared receiving camera consists of a SPAD pixel array and related processing circuits. The SPAD pixel array is divided into N pixel partitions, where N≥2. The processing circuit is used to convert the stop pulse signal output by the pixel into a time stop signal to be measured. When working, the chip 4 only activates the pixel corresponding to the addressable light source 1 of the partition at a time, which greatly reduces the power consumption of the system and reduces the impact of background noise on the system imaging.

[0037] Figure 2This is a schematic diagram of the basic structure of a typical single SPAD pixel. A single SPAD pixel includes a SPAD photosensitive area, a bias circuit, a quenching circuit, a signal processing circuit, a TDC converter, and a computing unit. The photosensitive area and the circuit part can be designed on a single wafer circuit and realized through the FSI manufacturing process, or they can be designed on two different wafer circuits. Finally, the photosensitive pixel and the circuit chip are bonded together through Direct Bonding Interface technology, i.e., the BSI manufacturing process. When the PN junction of the SPAD photosensitive area is under a high reverse bias voltage, the PN junction enters Geiger mode. After the photosensitive area receives photons reflected from the object, photogenerated carriers in the PN junction trigger the generation of an avalanche current. The avalanche current pulse is output to the signal processor for processing (the signal processor is mainly used for pulse signal identification, comparison, and shaping) and then to the TDC (time-to-digital converter). The TDC converts the received pulse signal into a time signal and outputs it to the computing unit for statistics. The computing unit counts multiple time measurement results and outputs a time probability histogram. Finally, the time period corresponding to the highest probability is taken as the time difference between emitted and received light to calculate the depth information of the object. At the same time, to prevent the photosensitive area from being burned out due to prolonged avalanche state, the quenching circuit reduces the voltage applied to the PN junction, allowing the photosensitive area to escape the avalanche state. For a traditional single SPAD array unit, since each pixel unit contains a TDC and counts separately, the entire circuit design is relatively complex, the photosensitive area is relatively small, and crosstalk between pixels is easily affected, resulting in low accuracy and a small measurement range for the final output depth information.

[0038] Figure 3This is a schematic diagram of a SPAD macropixel distribution provided by the present invention. The diagram shows the light spot 11(a) formed on the infrared receiving camera by the light source in the first light source partition, the SPAD macropixel array 4, a single macropixel 41, and a single SPAD pixel 411. In this schematic diagram, the SPAD macropixel array 4 consists of 4*4 macropixels, but the actual number is not limited; 4*4 is used as an example for ease of explanation. A single macropixel 41 consists of 3*3 411 pixels. In reality, the number of individual SPAD pixels in a macropixel array can be 2*2, 2*4, etc. Different macropixels work in parallel and independently perform single-photon detection, reducing the impact of crosstalk between individual SPADs on measurement accuracy. Furthermore, each macropixel shares one TDC, and the macropixels in different pixel partitions... Alternatively, a single TDC can be shared, greatly simplifying circuit design and reducing the overall power consumption of the chip. Previously, each SPAD unit required a TDC, totaling 144 TDCs. Now, only 4 TDCs are needed to complete the time signal conversion task, significantly simplifying circuit design and enabling better pixel fill rate. This greatly reduces the overall chip imaging power consumption while improving the chip's photoelectric conversion efficiency. In addition, there is a photon concurrency detection circuit between the macropixel and the TDC in this invention. When the photon pulse time difference generated by the SPAD pixel in the activated macropixel does not meet the photon concurrency requirement, the photon concurrency detection circuit cannot output a valid avalanche signal. Photon concurrency ensures that two or more SPAD pixels in the activated macropixel output avalanche pulse signals. When the pulse signal interval is less than the pulse width of the light source, it is considered a valid output. The valid pulse signals are then input to the TDC (Time-to-Digital Converter) circuit for time statistics, and finally stored and read out sequentially. The macropixel is connected to the photon concurrency detection circuit. The macropixel and the photon concurrency detection circuit work together to complete the detection of concurrent photons, eliminating asynchronously generated photon avalanche pulse signals, thereby reducing the avalanche signal output caused by ambient light, after-pulse signals, and dark count false triggering, and outputting high-resolution 2D images and high signal-to-noise ratio depth images.

[0039] Figure 3 The display shows that, under ideal conditions, the imaging spot of the light spot emitted by the laser projector at the working distance can correspond one-to-one with each point of the macropixel. Figure 4This diagram illustrates the distribution of light spots on SPAD macropixels when assembly errors are significant. Due to aberrations, structural tolerances, and assembly errors during production, some modules cannot achieve a one-to-one correspondence between the imaging light spot and the SPAD macropixel position, regardless of how the position is adjusted. For example, in 11(b), most of the light spot extends beyond the pixel area. In certain scenarios, the light spot may completely extend beyond the pixel area. The laser-emitted light spot is not imaged on the corresponding macropixel photosensitive unit, which directly affects the accuracy of depth calculation. In actual production, modules with this condition (dtof modules include laser projectors and infrared receiving cameras) are judged as defective, resulting in a high proportion of defective products and increasing product production costs.

[0040] Figure 5 This invention provides a novel schematic diagram of SPAD pixel distribution, namely in Figure 4 Two additional rows of SPAD pixels were reserved on top of the existing pixel count to solve the problem. Figure 5 The issues encountered during assembly allow for timely adjustments to the sensor's macro-pixel binning configuration, even with significant assembly errors. This ensures that the light emitted from the light source is imaged within the pixel area, greatly improving the production yield of the DTof LiDAR module. Of course, in actual pixel design, one or more rows and columns of pixels can be reserved. For simplicity, only two rows of reserved SPAD pixels are listed here. The actual number of reserved rows and columns should be minimized while maintaining module production yield.

[0041] Figure 6This is a schematic diagram of dynamic SPAD pixel binding provided by the present invention; 411(a) is a column of SPAD pixels reserved in the imaging chip, 411(b) is a row of SPAD pixels reserved in the imaging chip, 11(a) is a schematic diagram of the position of the emitted light spot on the imaging chip when the laser projector and the infrared receiving camera are ideally aligned; 11(b) is a schematic diagram of the position of the emitted light spot on the imaging chip when the laser projector and the infrared receiving camera are offset in the vertical direction relative to the ideal alignment state; 11(c) is a schematic diagram of the position of the emitted light spot on the imaging chip when the laser projector and the infrared receiving camera are offset in the vertical direction relative to the ideal alignment state. The diagram illustrates the position of the emitted light spot on the imaging chip when there is a certain offset to the right. For existing designs, if situations 11(b) and 11(c) occur, they are considered defective (of course, some DTFOF modules have offsets in both the vertical and horizontal directions relative to the ideal alignment of the laser projector and infrared receiving camera, which are not listed here). This invention records or identifies the position of the light spot, reserves multiple rows or columns of pixels, dynamically adjusts the binning between SPAD pixels, ensuring that the light spot falls entirely on the imaging pixel, and dynamically adjusts the position of the macropixel, so that even a defective product can become a good product with normal imaging. For example, in the original design, nine pixels (1,1), (1,2), (1,3), (2,1), (2,2), (2,3), (3,1), (3,2), (3,3) are connected in parallel as a macropixel for photosensitive imaging. Now, a logical relationship is established between a single SPAD pixel and all surrounding pixels, such as... Figure 7(1,1) establishes logical relationships with its four surrounding pixels. When the spot is at 11(a), (1,1) is not connected to (0,1) and (1,0), while (1,1) is connected to (1,2) and (2,1). Whether the connection is established can be controlled by the register address to control the related circuits connecting the pixels. Similarly, (1,1), (1,2), (1,3), (2,1), (2,2), (2,3), (3,1), (3,2), and (3,3) are connected in parallel as a macro-pixel photosensitive image. When the spot is at 11(b), (1,1) is not connected to (1,0), while (1,1) is connected to (0,1), (1,2), and (2,1). Similarly, (0,1), (0,2), (0,3), (1,1), (1,2), and (1,2), (1,1), ... Nine pixels (1,3), (2,1), (2,2), and (2,3) are connected in parallel to form a macro-pixel for photosensitive imaging. When the light spot is at 11(c), (1,1) and (0,1) are not turned on, while (1,1) and (1,0), (1,2), and (2,1) are turned on. Similarly, nine pixels (1,0), (1,1), (1,2), (2,0), (2,1), (2,2), (3,0), (3,1), and (3,2) are connected in parallel to form a macro-pixel for photosensitive imaging. Here, only the position confirmation diagram of one macro-pixel is shown as a schematic diagram, and the SPAD pixel unit of the macro-pixel is defined as 3*3. The actual macro-pixel can be composed of any number of pixels. In addition, the remaining pixels that are not configured as macro-pixels can also be used as calibration pixels for dtof ranging.

[0042] Figure 7 for Figure 5 A schematic diagram of the macro-pixel distribution of the SPAD array after dynamic binning; 11(b) is the spot corresponding to the emitted light point, and 41(b) is the new macro-pixel after adjustment. In this way, the spot that originally exceeded the pixel area can also be imaged on the corresponding macro-pixel and imaged normally, which greatly improves the production yield of the entire dtof module.

[0043] Figure 3 The number of individual SPAD pixels in a macro-pixel is determined by the size and position of the light spot on the imaging chip within the working distance range. For non-coaxial systems, the infrared receiving camera is offset laterally relative to the laser projector. The reflected light spots of the same beam emitted by the laser projector at different distances will illuminate different pixels of the SPAD (mainly due to the offset in the horizontal direction, which we define as parallax). Furthermore, due to the optical characteristics of the laser projector and the infrared receiving camera themselves, the size of the reflected light spots of the same beam at different distances will also differ on the SPAD (this can be defined as defocusing of the optical system). For details, please refer to [reference needed]. Figure 8 , Figure 8This diagram illustrates the light spots formed on the SPAD pixel array at different distances in the test scene, with the same emitted light point appearing as light spots. 41: SPAD pixel array. 10, 20, 30, and 40 represent the light spots formed on the SPAD pixel array at different distances in the test scene. From left to right, the corresponding test distance decreases. The farther the test distance, the closer the light spot is to the laser projector (assuming the laser projector is to the left of the infrared receiving camera). The size of the light spot corresponding to different test distances is related to the optical design of the projector. Generally, the closer the test distance, the larger the imaging light spot size on the chip. The distance between light spots 10 and 40 is the parallax caused by the lateral offset distance between the laser projector and the infrared receiving camera. When designing the size of a macropixel (composed of several SPAD pixels), the influence of parallax and the imaging characteristics of the optical lens on the actual imaging light spot size and position must be considered. This ensures that the light source emission point corresponds one-to-one with the SPAD macropixel when calculating depth information. A macropixel can be designed to encompass the imaging positions of all light spots within the working distance. However, for cases with a large baseline (lateral offset distance between the laser projector and the infrared camera) or a large defocused light spot on the imaging optics, such a macropixel design would result in a very large macropixel size. Furthermore, in most cases, multiple pixels within the macropixel fail to produce effective signal output, leading to significant waste and background noise. Therefore, in these situations, the number of macropixels can also be determined by the size of the light spot hitting a distant point. Since the light signal reflected onto the chip from a distant point is very weak, using multiple pixels to increase the light intensity minimizes the impact of background noise. At close range, due to the greater light intensity hitting the sensor, a relatively high measurement accuracy can be achieved using fewer macropixels. Additionally, when determining the macropixel size and boundaries, a pulse of light can be emitted from the emitting area first. After confirming the position of the corresponding light spot on the SPAD pixel, the boundaries and size of the macropixel can be dynamically adjusted based on the size of the light spot. Then, the beam from the emitting area can be measured. This allows for a better match between the macropixel and the light spot size, resulting in better measurement performance.

[0044] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A zoned addressing dTOF ranging system, characterized in that, The application relates to a depth imaging device, comprising: a partitioned addressable light source, which comprises N light source partitions, N>=2; an imaging chip, which comprises a SPAD pixel array, the SPAD pixel array being divided into N pixel partitions, N>=2; a memory, which stores a mapping table relationship between the light source partitions and the pixel partitions, the mapping table relationship being stored in the memory by means of recording corresponding registers; a light source starting controller, which controls the light source partitions and the corresponding pixel partitions to start simultaneously according to the mapping table relationship; the SPAD pixel array comprises a SPAD macro pixel array, the SPAD macro pixel array comprising a plurality of macro pixels, each macro pixel being composed of M*N SPAD pixels, and each macro pixel independently performing single-photon detection; the SPAD pixel array further comprises reserved pixel points outside the SPAD macro pixel array, the reserved pixel points being column SPAD pixel points or / and row SPAD pixel points; in the case of a large assembly error, the bining configuration of the macro pixel is adjusted, so that the light points formed by the light source are imaged on the pixel area; in each SPAD pixel array, each SPAD pixel establishes a logical relationship of whether to be turned on with four surrounding pixel points, and a plurality of pixel points covered by the same light spot are selected to be turned on in parallel as a macro pixel to perform light sensing and imaging.

2. The zoned addressing dTOF ranging system of claim 1, wherein, The SPAD pixel units in each macro pixel share the same TDC, or the macro pixels of different pixel partitions share the same TDC.

3. The zoned addressing dTOF ranging system of claim 2, wherein, A photon concurrency detection circuit is arranged between the macro pixel and the TDC, and when the time difference of photon pulses generated by the SPAD pixels in the opened macro pixel does not satisfy photon concurrency, the photon concurrency detection circuit cannot output an effective avalanche signal.

4. The zoned addressing dTOF ranging system of claim 1, wherein, The light source starting controller is used for controlling different light source partitions and pixel partitions to work, when a certain light source partition is started, the pixel partition for imaging the light source of the partition is also started, the light source partitions are sequentially lighted, the corresponding imaging pixel partitions are also started one by one, and illumination and imaging of the whole scene to be measured can be completed in a period, so that the depth information of the whole scene to be measured is obtained.

Images