Elastic member and wafer transport carrier

Abstract

The embodiment of the present specification provides an elastic component applied to a carrier for transporting wafers, comprising: an inlay part for being inlaid in a mounting groove of the carrier; and a supporting part for supporting the wafer, the supporting part being fixedly connected with the inlay part, a side of the supporting part facing the wafer being provided in a planar shape, and a side of the supporting part facing the mounting groove being protruded out of the inlay part so that the supporting part is supported on a surface of the carrier. The elastic component contains a wafer supporting surface with a larger area, which can reduce wafer damage caused by changes in contact pressure and is less likely to slide sideways. The side of the supporting part facing the mounting groove is protruded out of the inlay part, which can inhibit torsion of the elastic component itself in the mounting groove and improve the stability of transportation. Using the above-mentioned elastic component, lossless transportation of wafer products can be achieved, and transportation efficiency can be improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more particularly to a flexible component and a wafer transport carrier. Background Technology

[0002] Chips are crucial components in the electronics industry, such as LCD panels and wafers. These products are fragile and valuable. Therefore, the shock-resistant requirements for transport vehicles are extremely high when transporting chip products in production workshops. Typically, rubber rings are installed on the transport vehicles in production workshops, and the upper surface of the rubber rings is used to support the chips.

[0003] Existing rubber rings have general, regular cross-sectional shapes (such as rectangles and circles). While these offer good versatility, in actual transportation, they cannot withstand the torsion of the ring itself caused by external forces or various circumstances, leading to vibrations that can damage the wafer. Furthermore, the torsional stress on the rubber ring significantly shortens its lifespan. Additionally, the small contact area between the wafer and the upper surface of the rubber ring makes it sensitive to changes in contact pressure. Sudden changes in contact pressure can easily damage the wafer. Moreover, the small contact area results in unstable wafer transport and a tendency for lateral slippage. Summary of the Invention

[0004] In view of this, embodiments of this specification provide a wafer-supporting elastic ring and a transport device, wherein the wafer-supporting elastic ring is used to achieve damage-free transport of wafer products and improve transport efficiency.

[0005] The embodiments in this specification provide the following technical solutions:

[0006] An elastic component is used in a carrier for transporting wafers, the elastic component comprising:

[0007] An inlay part used to be fitted into a mounting groove in a vehicle;

[0008] A support portion for supporting a wafer, the support portion being fixedly connected to the mounting portion, wherein the side of the support portion facing the wafer being supported is configured as a planar shape, and the side of the support portion facing the mounting groove protrudes outward from the mounting portion so that the support portion is supported on the surface of the carrier.

[0009] By increasing the area of ​​the support portion used to support the wafer, the contact pressure between the wafer and the support portion is reduced, making the wafer less susceptible to changes in contact pressure. The larger area of ​​the support portion makes the transportation process smoother and helps to suppress lateral slippage, thereby reducing the possibility of wafer damage. By providing a portion protruding from the mounting portion on the side of the support portion facing the mounting groove, the torsion of the elastic component in the mounting groove is suppressed, reducing vibration caused by torsion, and also extending the service life of the elastic component.

[0010] The present invention also provides a solution in which the support portion protrudes outward from the inlay portion on the side facing the mounting groove so that the support portion is supported on the surface of the carrier, comprising: a support leg is provided on the side of the support portion facing the mounting groove, the support leg protrudes outward from the inlay portion and is supported on the surface of the carrier.

[0011] The present invention also provides a solution in which the support leg includes a first support leg and a second support leg, the first support leg and the second support leg being located at opposite ends of the support portion facing the mounting groove.

[0012] The present invention also provides a solution in which the cross-sectional shape of the support portion includes a trapezoidal or trapezoidal shape.

[0013] The present invention also provides a solution in which the width of the support portion toward the side of the supported wafer is smaller than the width of the support portion toward the side of the carrier.

[0014] The present invention also provides a solution in which the inlay portion is located at the middle position of the support portion on the side facing the mounting groove.

[0015] The present invention also provides a solution in which the cross-sectional shape of the inlay portion includes an arc shape.

[0016] The present invention also provides a solution in which the width of the support portion toward the side of the supported wafer is not less than the width of the inlay portion.

[0017] The present invention also provides a solution in which the material of the elastic component includes a thermosetting elastomer or a thermoplastic elastomer.

[0018] The present invention also provides a wafer transport device, the transport carrier including a rolling member provided with mounting grooves, the rolling member being mounted with an elastic member as described in any of the preceding claims.

[0019] Compared with the prior art, the beneficial effects achieved by at least one of the above-mentioned technical solutions adopted in the embodiments of this specification include at least the following: by setting a planar support portion, a larger wafer bearing surface is formed, reducing the contact pressure between the wafer and the bearing surface, reducing wafer damage caused by changes in contact pressure, and enabling more stable transportation and ensuring that the wafer is less prone to lateral slippage; by embedding the inlay portion in the mounting groove of the carrier, and by having the side of the support portion protruding outward from the inlay portion facing the mounting groove so that the support portion rests on the surface of the carrier, the protruding portion of the support portion facing the mounting groove abuts against the outer surface of the carrier, limiting the twisting of the elastic component itself in the mounting groove, improving the stability of transportation, and reducing the impact of vibration on the wafer. Therefore, using the above-mentioned elastomer, damage-free transportation of wafer products can be achieved, improving transportation efficiency. In addition, this shape structure can improve the torsional resistance of the elastic component, extend the service life of the elastic component, and the inner and outer walls of this shape structure are clearly different, which is conducive to identification and avoids installation errors. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a three-dimensional schematic diagram of an embodiment of the elastic component proposed in this invention;

[0022] Figure 2 This is a three-dimensional cross-sectional schematic diagram of an embodiment of the elastic component proposed in this invention;

[0023] Figure 3 This is a three-dimensional schematic diagram of the installation state of an embodiment of the elastic component proposed in this invention;

[0024] Figure 4 This is a three-dimensional sectional view of an embodiment of the elastic component proposed in this invention, showing its installation state.

[0025] Figure 5 This is a cross-sectional schematic diagram of an embodiment of the elastic component proposed in this invention;

[0026] Figure 6 This is a cross-sectional view of an embodiment of the elastic component proposed in this invention in its installation state;

[0027] Figure 7 This is a cross-sectional view of the installation state of another embodiment of the elastic component proposed in this invention;

[0028] Among them, 10 is an elastic component, 1 is a support part, 2 is an inlay part, 3 is a carrier, 31 is a mounting groove, 32 is an irregular mounting groove, 41 is a first foot, 42 is a second foot, and 5 is a wafer. Detailed Implementation

[0029] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0030] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0032] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0033] In addition, it should be understood that the directional words such as "upper," "lower," "inner," and "outer," and the quantifiers such as "first," "second," and "third" described in the example embodiments of this specification are described from the perspective shown in the accompanying drawings and should not be construed as limiting the example embodiments of this specification.

[0034] In the electronics industry, LCD panels, wafers, and other chips are often transported in cleanrooms using automated conveyor belts. Chips are fragile and valuable components, placing extremely high demands on the shock resistance of the transport vehicles. Typically, transport vehicles are equipped with elastic components, such as rubber rings, to support the chips and provide shock protection. Existing shock-absorbing rubber rings are mostly of regular cross-section, such as circular O-rings. While these offer good versatility, they are prone to twisting in the mounting groove during transport, causing vibrations that damage the chips they support. Furthermore, the twisting of the O-rings shortens their lifespan. Additionally, the small contact area between the O-ring and the chip makes the contact surface sensitive to contact pressure. Sudden changes in contact pressure can easily damage the chip, and the small contact area is also prone to slippage or vibration during transport, further damaging the chip.

[0035] To address the aforementioned problems, the inventors redesigned the shape of the elastic component, dividing it into a support portion for carrying the wafer and an inlay portion for fixed installation, with the support portion and inlay portion fixedly connected. The inlay portion protrudes beyond the body of the elastic component and is used to match and install with the mounting groove of the carrier; one side of the support portion is flat for carrying the wafer, and the other side of the support portion, i.e., the side facing the mounting groove of the carrier, protrudes outward from the inlay portion and rests on the surface of the carrier to prevent the elastic component from twisting in the mounting groove.

[0036] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0037] like Figures 1 to 6 The elastic member 10 shown is used in the carrier 3 for transporting wafers, and includes a support portion 1 and an insert portion 2, wherein the insert portion 2 is used to be inserted into the mounting groove 31 in the carrier 3 (e.g., Figure 4 (as shown); the support part 1 is used to support the wafer 5 (as shown). Figure 6 As shown, the support portion 1 is fixedly connected to the inlay portion 2. The side of the support portion 1 facing the wafer 5 being supported is set to a planar shape, and the side of the support portion 1 facing the mounting groove 31 protrudes outward from the inlay portion 2 so that the support portion 1 is supported on the surface of the carrier 3.

[0038] By making one side of the support portion 1 planar, the bearing area is increased, thereby reducing the contact pressure between the wafer and the bearing surface. This reduces the possibility of wafer damage caused by changes in contact pressure. Furthermore, increasing the bearing area can effectively reduce the impact of vibration or lateral slippage. The support portion 1 has a portion protruding from the inlay portion 2 on the side facing the mounting groove 31 to support the surface of the carrier 3, which can effectively suppress the self-torsion of the elastic member 10. Using the above-mentioned elastic member 10 mounted on the carrier 3 can effectively reduce the impact of vibration and lateral slippage on the carried wafer, thereby achieving damage-free transportation. In addition, the different shapes of the inner and outer sides of the elastic member 10 facilitate identification during the installation process and avoid installation errors.

[0039] In some embodiments, a support leg is provided on the side of the support portion 1 facing the mounting groove 31. The support leg protrudes out of the insert portion 2 and rests on the surface of the carrier 3. By providing a support leg on the side of the support portion 1 facing the mounting groove 31, the elastic member 10 can be supported on the surface of the carrier 3 more stably, thereby more effectively suppressing the occurrence of torsion on the elastic member 10.

[0040] It should be noted that the position, shape, and size of the support legs can be flexibly set according to the requirements of the injection molding process of the elastic component and / or the required torsional resistance.

[0041] In some implementations, such as Figure 6 As shown, the support includes a first support 41 and a second support 42, which are located at opposite ends of the support portion 1 facing the mounting groove 31. By providing two mounting supports at both ends of the support portion 1, the torsion of the elastic component 10 is simultaneously restricted from two directions, forming a more stable anti-torsion structure.

[0042] In some implementations, reference Figure 5 and Figure 6 The elastic component 10 shown has a cross-sectional shape consisting of two parts: an upper part (support part 1) with a cross-sectional shape of a hexagon with parallel upper and lower bases, and symmetrical left and right; and a lower part (insertion part 2) with a cross-sectional shape of a segment of arc. The upper base of the hexagon is defined as c, the lower base as a, and the height as b. The sides of the hexagon include a hypotenuse and a straight side, with the straight side defined as e and perpendicular to the lower base a. The apex angle formed by the upper base c and the hypotenuse is defined as d°. The height of the insertion part 2 is defined as f, and the width as g. Furthermore, there are allowance portions on both sides at the connection between the hexagonal part and the arc portion, which are supported by the surface of the carrier 3.

[0043] It should be noted that the supporting part 1 is not limited to a symmetrical structure, and can also be adjusted to an asymmetrical structure according to the shape of the vehicle 3.

[0044] It should also be noted that the inlay part 2 is not limited to a symmetrical structure. In addition, the shape of the inlay part 2 is not limited to an arc shape. The shape of the inlay part 2 can be set to match the shape of the mounting groove 31. For example, the cross-sectional shape of the inlay part 2 can be set to be X-shaped or triangular.

[0045] It should also be noted that the angle of the apex d° can be set to an acute angle or an obtuse angle. When both apex angles are acute, the length of the upper base c is greater than the length of the lower base a, which can provide a larger bearing surface for the wafer; when both apex angles are obtuse, the length of the upper base c is less than the length of the lower base a, thus making the lower base a form a more stable support structure.

[0046] It should also be noted that the allowance is not limited to being parallel to the upper bottom c. The direction of the allowance can also be adjusted according to the requirements of bearing and support on the surface of the vehicle 3. For example, the allowance can be set as an inclined plane with the outer end of the allowance inclined towards the surface of the vehicle 3.

[0047] It should also be noted that the straight side e is not limited to being perpendicular to the lower base a, and the angle between the straight side e and the lower base a can also be an acute angle or an obtuse angle.

[0048] In some implementations, such as Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown, the cross-sectional shape of the support portion 1 includes a trapezoidal or trapezoidal shape. By using a trapezoidal or trapezoidal cross-sectional shape, the cross-sectional width of the elastic member 10 varies with the thickness, thereby causing the elastic restoring force of the elastic member 10 on the carrier wafer to vary with the thickness. The elastic restoring force is small in the narrower part and large in the wider part, thus better absorbing the vibration generated during transportation.

[0049] It should be noted that the trapezoidal shape of the cross section of the supporting part 1 is not limited to the specific shape shown in the figure. It can be a right trapezoid or a non-isosceles trapezoid. The specific shape of the trapezoidal part can also be similar to a right trapezoid or a non-isosceles trapezoid.

[0050] In some embodiments, the width of the support portion 1 facing the supported wafer 5 is smaller than the width of the support portion 1 facing the carrier 3.

[0051] In some implementations, such as Figure 2 ,、 Figure 4 , Figure 5 and Figure 6 As shown, the insert 2 is located at the middle position of the support 1 on the side facing the mounting groove 31. By placing the insert 2 at the middle position of the elastic member 10, the clockwise and / or counterclockwise torsion of the elastic member 10 is better suppressed.

[0052] In some embodiments, the cross-sectional shape of the inlay portion 2 includes an arc shape. By providing an arc-shaped inlay portion 2, the installation process becomes convenient.

[0053] It should be noted that the use of an arc-shaped inlay part provides good versatility and allows elastic components to be installed in irregularly shaped mounting slots.

[0054] like Figure 7 As shown, the cross-section of the irregular mounting groove 32 is trapezoidal. During installation, the two ends of the arc-shaped inlay part 2 abut against the two ends of the opening of the irregular mounting groove 32, thereby fixing the elastic member 10 in the irregular mounting groove, effectively avoiding the trouble of having to change the shape of the elastic member 10 due to the change of the shape of the mounting groove.

[0055] In some embodiments, the width of the support portion 1 facing the side of the supported wafer 5 is equal to the width of the inlay portion 2.

[0056] In some embodiments, the width of the support portion 1 facing the supported wafer 5 is greater than the width of the inlay portion 2.

[0057] In some embodiments, the material of the elastic component 10 includes a thermosetting elastomer, such as rubber, soft unsaturated polyurethane, etc.

[0058] In some embodiments, the material of the elastic component 10 includes a thermoplastic elastomer, such as polyester or polyamide.

[0059] It should be noted that an elastic material with a suitable elastic modulus can be selected based on the weight of the wafer.

[0060] It should also be noted that the wafer slippage can be better suppressed by coating the upper surface of the support part 1, covering it with an anti-slip surface, or setting anti-slip textures.

[0061] Based on the same inventive concept, embodiments of this specification also provide a wafer transport carrier, the transport carrier including a rolling member provided with mounting grooves, the rolling member being mounted with the elastic member described in any of the preceding claims.

[0062] It should be noted that the rolling component includes rollers, drums, and wheels, while the elastic component contracts inward and is fastened to the surface of the rolling component. The elastic component rotates due to friction between itself and the rolling device, and the object being carried moves due to friction between the elastic component and the object being carried.

[0063] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An elastic member used in a carrier for transporting wafers, said elastic member being supported on the surface of the carrier, characterized in that, include: An inlay part used to be fitted into a mounting groove in a vehicle; A support portion for supporting a wafer, the support portion being fixedly connected to the mounting portion, wherein the side of the support portion facing the wafer being supported is configured as a planar shape, and the side of the support portion facing the mounting groove protrudes outward from the mounting portion so that the support portion is supported on the surface of the carrier; The supporting portion protrudes outward from the inlay portion on the side facing the mounting groove so that the supporting portion is supported on the surface of the carrier, including: a support leg is provided on the side of the supporting portion facing the mounting groove, the support leg protrudes outward from the inlay portion and is supported on the surface of the carrier; The support leg includes a first support leg and a second support leg, which are respectively located at both ends of the support portion facing the mounting groove. The cross-sectional shape of the support portion includes trapezoidal or trapezoidal-like shapes.

2. The elastic component according to claim 1, characterized in that, The width of the support portion facing the wafer being supported is smaller than the width of the support portion facing the carrier.

3. The elastic component according to claim 1, characterized in that, The inlay portion is located in the middle of the side of the support portion facing the mounting groove.

4. The elastic member according to claim 1, characterized in that, The cross-sectional shape of the inlay portion includes an arc shape.

5. The elastic member according to claim 1, characterized in that, The width of the support portion facing the side of the supported wafer is not less than the width of the inlay portion.

6. The elastic member according to claim 1, characterized in that, The material of the elastic component includes thermosetting elastomers or thermoplastic elastomers.

7. A wafer transport carrier, characterized in that, The transport vehicle includes a rolling component with mounting grooves, the rolling component being fitted with an elastic component as described in any one of claims 1-6.

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